Substrate peeling device, film forming device, substrate carrier, substrate peeling method, and film forming method

Abstract

To provide a substrate peeling device and a film deposition device, a substrate carrier, a substrate peeling method, and a film deposition method capable of peeling a substrate from a substrate carrier in a short time without adversely affecting a region of a display element on the substrate.SOLUTION: A substrate peeling device is for peeling a substrate from a substrate carrier 100 that holds the substrate using a plurality of sucking pads. The substrate carrier 100 is provided with the plurality of sucking pads and a plurality of peeling parts for peeling off a substrate. The plurality of sucking pads and the plurality of peeling parts are provided along the periphery of the substrate held and the boundary portions corresponding to portions between display element regions on the substrate held.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a substrate peeling device for peeling a substrate held by a substrate carrier, a film forming device, a substrate carrier, a substrate peeling method, and a film forming method.

Background Art

[0002] In recent years, in the FPD (Flat Panel Display) industry, there has been a tendency to use a large glass substrate called mother glass in consideration of production efficiency. A large glass substrate is used so that a plurality of image display portions can be divided from a single mother glass for individual displays. For example, a manufacturing process such as film formation is performed on a mother glass exceeding 2 meters on one side, and it is divided along a substrate cutting line that divides the image display portion to obtain final products of various desired sizes. Generally, the thickness of the mother glass is less than several millimeters. Minimizing the effects of bending and breakage is an important issue, and in the manufacturing process, the mother glass is subjected to a vacuum film forming process while being integrally conveyed with a substrate carrier.

[0003] In order to integrate the mother glass and the substrate carrier, an adhesive member is preferably used. In the adhesive member, an adhesive force for holding the mother glass and a peelability that allows the glass to be separated in a short time are required, and it is preferably reusable a plurality of times. For example, Patent Document 1 discloses a technique including a plurality of adhesive members for holding a substrate and peeling pins protruding from the side of each adhesive member to the substrate.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the technology disclosed in Patent Document 1, the adhesive member and the peeling pins are arranged over the entire substrate. Therefore, the adhesive member and the peeling pins also contact the substrate in the functional portion that requires post-processing such as film formation, in other words, the image display portion (display element region) of the final product. For example, local differences in heat conduction performance may occur due to contact of the adhesive member during vacuum film formation, and the uniformity of the film formation may be impaired. Or, a mark may remain in the image display portion when the peeling pin hits. These may affect high-definition image display.

[0006] In view of the above problems, some embodiments aim to peel the substrate from the substrate carrier while suppressing the influence on the display element region on the substrate.

Means for Solving the Problems

[0007] The substrate peeling device according to one aspect of the present invention is a substrate peeling device that peels the substrate from a substrate carrier that holds the substrate by a plurality of adhesive suction pads, wherein a plurality of the adhesive suction pads and a plurality of through holes are provided in the substrate carrier along the outer peripheral portion of the held substrate and a boundary portion corresponding to the display element region of the held substrate, respectively, and a plurality of peeling pins are provided so as to protrude from and retract into the substrate holding surface of the substrate carrier through the plurality of through holes. 、 The adhesive suction pad includes an adhesive member and metal balls that maintain the adhesive member in a flat plate shape when the lifting platform is in the lowered state and deform the adhesive member when the lifting platform rises. It is characterized by that.

Effects of the Invention

[0008] According to at least some embodiments, the substrate can be peeled from the substrate carrier while suppressing the influence on the display element region on the substrate.

Brief Description of the Drawings

[0009]

Figure 1

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Figure 11

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Figure 20

Mode for Carrying Out the Invention

[0010] Hereinafter, embodiments and examples of the present invention will be described based on the accompanying drawings. The dimensions, materials, shapes, relative arrangements, etc. of the components described in this specification are not limited to only those within the scope of the present invention unless otherwise specifically described. In this specification, "adhesion" refers to the property caused by the intermolecular force between an adhesive material having adhesiveness and the surface of an adherend such as a glass substrate when the adhesive material contacts the surface of the adherend. Also, "peeling" refers to the separation of the adhesive material from the adherend.

[0011] Hereinafter, a substrate peeling device, a film forming device, a substrate carrier, a substrate peeling method, and a film forming method according to an embodiment of the present invention will be described. In these devices and methods, they can be preferably applied to manufacturing devices for electronic devices and manufacturing methods for electronic devices. Also, various film forming methods such as evaporation and sputtering can be adopted for the film forming method, and various materials can be adopted for the film forming material. Note that the substrate peeling method and the film forming method of this embodiment can also be regarded as a program for causing a computer to execute them and a storage medium storing the program. The storage medium may be a non-temporary storage medium readable by a computer.

[0012] In the embodiments and examples described below, the traveling direction of the substrate carrier and the substrate is the X-axis direction, the direction orthogonal to the traveling direction in the plane of the substrate is the Y-axis direction, and the direction perpendicular to the plane of the substrate (in this embodiment and examples, the vertical direction) is the Z-axis direction.

[0013] (Embodiment) In this embodiment, the case where the substrate is a mother glass will be described as an example. However, the applicable substrate materials in the embodiment are not limited to glass. The applicable substrate materials in the embodiment are not limited to glass.

[0014] <Mother Glass> FIG. 1 is a plan view showing an example of a mother glass 10 as a substrate according to the present embodiment. As shown in the figure, let the vertices of the mother glass 10 be represented by O, P, Q, and R. This mother glass 10 is three-sided processed for the image display units 11, 12, and 13 in a subsequent process. These image display units 11, 12, and 13 correspond to the display element regions. A line JK connecting a point J on the side OR and a point K on the side PQ, and a line GH connecting a point G on the side OP and a point H on the line JK are cutting lines that are cut in a subsequent process. In FIG. 1, the region corresponding to the cutting line is referred to as an internal region 14 as a boundary part, and the peripheral part of the mother glass 10 is referred to as an external region 15 as an outer peripheral part. After being cut, the part excluding the internal region 14 and the external region 15 corresponds to the display element region.

[0015] Note that although FIG. 1 shows an example of three-sided processing of the image display unit from the mother glass 10, the embodiment is not limited to this, multi-sided processing of the image display size is possible, and the chamfering pattern is not limited to the illustrated example. The substrate size can also be appropriately selected.

[0016] <Substrate Carrier> The substrate carrier 100 according to the present embodiment will be described with reference to FIGS. 2 to 5. The scale may be different from the actual one in order to emphasize the characteristic configuration.

[0017] The substrate carrier 100 discretely arranges an adhesive member and a release pin, avoiding the image display unit, in the outer peripheral part 15 of the mother glass 10 or at the boundary part 14 corresponding to the between the display element regions. The boundary part 14 is a part corresponding to a substrate cutting line for cutting the mother glass in a subsequent process.

[0018] Figure 2 is a schematic plan view showing an example of the substrate carrier 100 according to the present embodiment. The mother glass 10 is placed on the substrate holding surface 110x of the substrate carrier 100, and the mother glass 10 is adsorbed by the adsorption pads 120, so that the mother glass 10 is held by the substrate carrier 100. In other words, the substrate carrier 100 and the mother glass 10 are configured to be integrated. In FIG. 2, the mother glass installation site 10x is shown by a dotted line. The substrate carrier 100 includes a flat plate member 110. A plurality of through holes 111 and 112 are provided in the flat plate member 110 along the inner region 14 and the outer region 15 of the mother glass 10, respectively. The through hole 111 is used for inserting the substrate placement pin 240 for placing the mother glass 10 and the peeling pin 341 used when peeling the substrate, and the through hole 112 is used for installing the adhesive type adsorption pad 120.

[0019] Further, the substrate carrier 100 includes a plurality of supports 130 for supporting the periphery of the mother glass 10 with respect to the flat plate member 110. As the support 130, various known techniques such as a general clamp can be used. The mother glass 10 placed on the substrate carrier 100 is fixed to the substrate holding surface 110x by the plurality of arranged adsorption pads 120 and the supports 130, so as to be integrated with the substrate carrier 100.

[0020] Next, the process of peeling the mother glass 10 from the substrate carrier 100 after a predetermined process such as a film forming process will be described. Here, the case of peeling the mother glass 10 using the peeling pin will be described with reference to FIGS. 3 to 5. FIG. 3(A) also shows the adhesive member 123 in the adsorption pad 120 attached to the substrate carrier 100 and the peeling pin 341. In addition, only the outer edge of the mother glass 10 is shown by a dotted line for easy understanding of the arrangement relationship. FIGS. 4 and 5 are partial cross-sectional views of the substrate carrier 100, which are the E-E' cross-sectional view and the F-F' cross-sectional view in FIG. 3(A), respectively.

[0021] The suction pad 120 is attached to the flat plate member 110 in a state of being inserted through the through hole 112 for the suction pad. The fixed portion 127 of the shaft 126 in the suction pad 120 is integrated with the fixing member 150 by a known method and fixed to the flat plate member 110. As the fixing means between the fixing member 150 and the flat plate member 110, a known technique such as bolts (not shown) may be adopted.

[0022] The peeling pin 341 can be moved in and out through the through hole 111 for the peeling pin from the substrate holding surface 110x, so that the mother glass 10 can be brought closer to or moved away from the substrate holding surface 110x. The peeling pins 341 may be moved independently one by one using a drive mechanism (not shown), or a plurality of them may be moved together using a peeling pin mount.

[0023] Also, it is possible to adopt a suction pad having a peeling function without using a peeling pin. FIG. 3(B) shows an example in which a suction pad having a peeling function is attached to the substrate carrier 100. In the case of this suction pad, it includes an adhesive member 123, a lifting table 125, and a plurality of metal balls 124 provided between them. When the lifting table 125 is lowered, the adhesive member 123 maintains a flat plate shape and can adsorb the substrate (mother glass 10). When the lifting table 125 rises, the adhesive member 123 is deformed by the metal balls 124, and the adhesive force with the substrate decreases. Thereby, the substrate can be peeled from the substrate carrier 100.

[0024] Note that the shape and dimensions of the flat plate member 110 are appropriately set according to the dimensions of the mother glass 10 and the dimensions of the chamfered image display portion. Also, the dimensions, number, and arrangement of the through holes 111, 112, the suction pad 120, and the support tool 130 are appropriately set according to the dimensions of the mother glass 10 and the chamfering dimensions.

[0025] <Suction Pad> Referring to FIG. 4, the suction pad 120 will be described in more detail. The suction pad 120 is provided with an adhesive member 123 on a metal shaft 126 via an adhesive layer (not shown). As the material of the adhesive member 123, it is preferable to employ a fluororubber that does not contain a siloxane bond in order to suppress the generation of outgassing that adversely affects the manufacturing process under vacuum. Similarly, as the material constituting the adhesive layer, it is desirable to use a known adhesive or double-sided tape that does not release outgassing components. In the present embodiment, a stainless-steel shaft 126 with a diameter of φ10 mm is used, and an adhesive member 123 made of fluororubber with a diameter of φ10 mm and a thickness of 0.5 mm is used. The adhesive member 123 is configured to be adjustable in the vertical direction in the drawing within a certain range using a spacer (not shown) or the like so that the amount of protrusion from the substrate holding surface 110x can be controlled. The above-mentioned amount of protrusion is less than the thickness of the mother glass 10, although it also depends on the size of the members constituting the suction pad 120 and the compression characteristics of the adhesive member 123. The diameter of the through-hole 112 for the suction pad is larger than the outer diameter of the shaft 126, and the suction pad 120 is allowed a certain degree of swing in addition to vertical movement in the vertical direction.

[0026] <Film Deposition Apparatus and Film Deposition Method> The film deposition apparatus according to the present embodiment includes various substrate processing apparatuses such as an apparatus for holding a substrate on a substrate carrier 100, an apparatus for forming a thin film on the substrate using a film deposition source, and a substrate peeling apparatus for peeling the substrate on which the thin film is formed from the substrate carrier 100. Then, various processes are performed on the substrate while it is being transported. Hereinafter, the substrate processing steps will be described with reference to the flowchart shown in FIG. 6.

[0027] The substrate processing steps are roughly divided into 1. Substrate holding step, 2. Inversion step, 3. Mask holding step, 4. Film deposition step, and 5. Substrate peeling step, and these series of steps are performed in a vacuum atmosphere. The 1. Substrate holding step further consists of (a) Preparation step, (b) Substrate placement step, and (c) Substrate adhesion step. Hereinafter, the steps will be described in order.

[0028] <<1. Substrate holding step>> This step is a step in which the mother glass 10 as a substrate is held by the substrate carrier 100, and it is performed by the substrate holding device shown in FIG. 7. This substrate holding device includes a substrate holding chamber R1, a substrate placement pin unit 200 (substrate moving mechanism) that moves the mother glass 10 up and down in the Z-axis direction, a pressing unit 400 that presses the mother glass 10, and a support base 500 that supports the substrate carrier 100. The substrate carrier 100 includes a flat plate member 110. This flat plate member 110 is supported by the support base 500 and is configured such that the substrate holding surface 110x is parallel to the horizontal plane. In FIG. 7, a case where a ball screw mechanism is adopted as a mechanism for moving the substrate placement pin 240 and the shaft portion 440 provided in the pressing unit 400 up and down is shown, but other known techniques such as a rack and pinion system can also be adopted. These mechanisms are controlled by a power supply 710 and a control unit 720.

[0029] The substrate placement pin unit 200 includes a motor 210, a screw shaft 220 that rotates by the motor 210, a nut portion 230 that moves up and down along the screw shaft 220 as the screw shaft 220 rotates, and a substrate placement pin 240 that is fixed to the nut portion 230 and moves up and down together with the nut portion 230. Between the inner peripheral surface of the nut portion 230 and the outer peripheral surface of the screw shaft 220, a plurality of balls are configured to circulate infinitely.

[0030] The pressing unit 400 includes a motor 410, a screw shaft 420 that rotates by the motor 410, a nut portion 430 that moves up and down along the screw shaft 420 as the screw shaft 420 rotates, a shaft portion 440 that is fixed to the nut portion 430 and moves up and down together with the nut portion 430, and a pressing portion 450 provided at the tip of the shaft portion 440. Between the inner peripheral surface of the nut portion 430 and the outer peripheral surface of the screw shaft 420, a plurality of balls are configured to circulate infinitely. A plurality of pressing portions 450 are provided so as to correspond to each of the plurality of suction pads 120.

[0031] The substrate holding chamber R1 is partitioned into a substrate processing region A1, a first drive source arrangement region A2, and a second drive source arrangement region A3. Through the substrate processing region A1, the first drive source arrangement region A2 is provided vertically below, and the second drive source arrangement region A3 is provided vertically above. In the substrate processing region A1, a substrate carrier 100 and the like are arranged. In the first drive source arrangement region A2, a motor 210 in the substrate mounting pin unit 200 and the like are arranged, and in the second drive source arrangement region A3, a motor 410 in the pressing unit 400 and the like are arranged.

[0032] With the above configuration, it is possible to suppress foreign matter generated by the rotation of the motors 210 and 410 and foreign matter generated at the sliding portions of the ball screws from entering the substrate processing region A1. Note that not all of the regions A1, A2, and A3 are arranged in the vacuum atmosphere of the substrate holding chamber R1. For example, the substrate processing region A1 may be arranged in the vacuum atmosphere of the substrate holding chamber R1, and the first drive source arrangement region A2 and the second drive source arrangement region A3 may be arranged in the atmospheric atmosphere.

[0033] <<<1(a). Preparation process>>> In the preparation state before the holding operation of the mother glass 10 is performed, both the substrate mounting pin 240 and the pressing portion 450 are waiting at the uppermost position in the vertical direction. The substrate mounting pin 240 protrudes upward in the vertical direction from the pin through-hole 111 of the flat plate member 110 in the substrate carrier 100 above the substrate holding surface 110x. The adhesive member 123 in the suction pad 120 slightly protrudes from the substrate holding surface 110x and is fixed to the flat plate member 110 (see FIG. 4). Also, the pressing portion 450 is separated from the substrate carrier 100. In this state, the mother glass 10 is carried into the substrate processing region A1 of the substrate holding chamber R1, and as shown in FIG. 7 the mother glass 10 is placed on a plurality of substrate mounting pins 240. The conveyance of the mother glass 10 into the substrate holding chamber R1 is performed by a conveyance robot (not shown) or the like. Since the conveyance robot is a known technique, its description is omitted.

[0034] <<<1(b) Substrate placement process>>> When the substrate placement pin 240 moves downward in the vertical direction by the motor 210, the tip of the substrate placement pin 240 moves downward from the surface opposite to the substrate holding surface 110x through the through hole 111 for the pin of the flat plate member 110. As a result, the mother glass 10 comes into contact with the adhesive member 123 of the suction pad 120.

[0035] Figure 8 shows a state where the substrate placement pin 240 moves downward and the mother glass 10 comes into contact with the adhesive member 123 of the suction pad 120. When taking multiple views of a plurality of image display portions from the mother glass 10, the adhesive member 123 does not exist on the glass surface corresponding to the image display portion (see Figure 1). As the substrate placement pin 240 moves downward, there may be undulations remaining in the mother glass 10, but the undulations of the mother glass 10 can also be reduced by adjusting the downward movement of the substrate placement pin 240.

[0036] <<<1(c) Substrate Adhesion Process>>> Next, the mother glass 10 is pressed using the pressing mechanism. When the pressing portion 450 moves downward in the vertical direction by the motor 410, a sufficient contact surface between the adhesive member 123 of the suction pad 120 and the mother glass 10 can be ensured. At this time, instead of pressing a plurality of pressing portions 450 against the mother glass simultaneously, it may be controlled such that the pressing region gradually changes from a specific starting point to a specific ending point. For example, it is preferable to control so that the pressing starts from the central portion in the longitudinal direction of the mother glass 10 and is sequentially pressed toward both ends. Figure 9 shows a state where the pressing portion 450 moves downward and the mother glass 10 comes into contact with and adheres (is adsorbed) to the adhesive member 123 that slightly protrudes from the flat plate member 110.

[0037] Thereafter, as shown in Figure 10, by the motor 410, the pressing portion 450 moves upward in the vertical direction, and the periphery of the mother glass 10 is fixed to the substrate carrier 100 by the support tool 130, and the mother glass 10 is integrated with the substrate carrier 100. In the above manner, the substrate holding process by the substrate holding chamber R1 is completed.

[0038] <<2. Inversion Process>> Figs. 11(A) and (B) are schematic cross-sectional views of an inversion device. The inversion device includes an inversion chamber R2. Inside this inversion chamber R2, a holding member 610 for holding a substrate carrier 100, a rotating shaft 620 fixed to the holding member 610, a motor 630 for rotating the rotating shaft 620, and a support member 640 for pivotally supporting the rotating shaft 620 are provided.

[0039] The substrate carrier 100 integrated with the mother glass 10 is transported from the substrate holding chamber R1 to the inversion chamber R2 by a known transfer robot (not shown) and held by the holding member 610 (see Fig. 11(A)). Thereafter, the substrate carrier 100 is rotated 180 degrees, and the mother glass 10 is in a state of facing (being suspended) vertically downward with respect to the substrate carrier 100 (see Fig. 11(B)).

[0040] <<3. Mask Holding Process>> The substrate carrier 100 holding the mother glass 10 is transported from the inversion chamber R2 to the alignment chamber. The mask 20 waiting in the alignment chamber and the mother glass 10 are aligned, and the substrate carrier 100 is placed in a state of being aligned above the mask 20. As means for fixing the substrate carrier 100 and the mask 20, appropriate known techniques may be adopted. For example, means using magnetism such as an electromagnet or a mechanical mechanism such as a clamp may be employed. Also, without fixing the substrate carrier 100 and the mask 20, the substrate carrier 100 can be placed on the mask 20 on a transport member such as a roller, and the substrate carrier 100 and the mask 20 can be integrally moved on the transport member.

[0041] <<4. Film Deposition Process>> In this embodiment, a case where a vacuum evaporation method is adopted as an example of a film formation method is shown. FIG. 12 is a schematic cross-sectional view of an evaporation apparatus. The evaporation apparatus includes a film formation chamber R3, and an evaporation source 30 as a film formation source is provided inside the film formation chamber R3. A substrate carrier 100 that integrally holds a mother glass 10 and a mask 20 is transported from an alignment chamber to the film formation chamber R3. A thin film is formed on the mother glass 10 by the substrate carrier 100 passing through a space where a film formation material is evaporating or sublimating from the evaporation source 30. Note that a configuration may be adopted in which a plurality of film formation chambers are provided, different film formation sources are arranged in each of them, the substrate carrier 100 is sequentially transported, and a plurality of types of thin films are sequentially formed on the mother glass 10. When the film formation is completed, the mask 20 combined with the mother glass 10 is removed. Alternatively, the film formation process may be repeated by combining another mask again.

[0042] <<5. Substrate peeling process>> After the film formation process is performed as described above, the mother glass 10 as a substrate is peeled from the substrate carrier 100. Note that the peeled mother glass 10 is then cut along a cutting line to obtain a plurality of image display portions as final products. In this embodiment, the mother glass 10 is configured to be peeled from the substrate carrier 100 without adversely affecting the image display portion (display element region) in the mother glass 10 and in a short time. Hereinafter, prior to the description of a specific substrate peeling apparatus, substrate peeling method, and substrate peeling process, an outline of substrate peeling according to this embodiment will be described.

[0043] <<<Outline of substrate peeling>>> The substrate (especially the mother glass) may crack at the bent portion of the substrate that occurs in the boundary region between the peeled area and the unpeeled area within the substrate plane when the substrate is peeled. This is presumably because the stress due to substrate bending and the stress due to substrate deformation caused by the peeling operation overlap, resulting in local stress concentration. In addition, when a configuration is adopted in which the adhesive member 123 or the peeling pin 341 in the suction pad 120 is abutted against the image display portion, there is a risk of adversely affecting high-definition image display. Further, when attempting to peel the substrate from the adhesive member 123 while keeping the surface of the adhesive member 123 parallel to the substrate surface, it has been found that a large force is required, making it difficult to peel the substrate and increasing the load on the substrate. Furthermore, through experiments and the like, it has been recognized that it is more difficult to peel the substrate from the adhesive member 123 in the vicinity of the center of gravity of the substrate than in a region away from the center of gravity.

[0044] Based on the above, in this embodiment, a method for peeling the substrate is devised. Hereinafter, the outline of the substrate peeling according to this embodiment will be described with reference to FIGS. 13 and 14. FIG. 13 is a plan view of the substrate carrier 100X, showing the substrate carrier 100X applied to the mother glass chamfering the image display portion. FIG. 14(A) is a graph showing the relationship between the position of the peeling pin and the protrusion amount (height) from the substrate holding surface at the tip of the peeling pin, and FIG. 14(B) is a graph showing the relationship between the elapsed time of the peeling operation and the moving speed of the peeling pin.

[0045] In this embodiment, a configuration is adopted in which the adhesive member 123 and the peeling pin 341 do not contact the display element region (image display portion) of the substrate. Specifically, the substrate carrier 100X is provided with a plurality of suction pads 120 and a plurality of peeling portions for peeling the substrate along the outer peripheral portion of the held substrate and the boundary portion corresponding to the display element region of the held substrate, respectively. When a suction pad 120 having a peeling function is adopted, the peeling portion corresponds to the suction pad 120. Also, peeling When the pin 341 is adopted, the peeling part corresponds to the through hole 111 through which the peeling pin 341 protrudes and retracts. Fig. 13 shows an example of the latter. In the present embodiment, the above-mentioned boundary part corresponds to the cutting line when the substrate is cut. That is, the boundary part includes the cutting line and is a region having a predetermined width with respect to the cutting line. However, the boundary part in the embodiment also includes the case where it is the boundary between display element regions in a final product provided with two or more display element regions (image display parts).

[0046] According to such a configuration, the substrate can be peeled from the substrate carrier while suppressing the influence on the display element region on the substrate.

[0047] Subsequently, an additional configuration in the embodiment will be described. In addition to the configuration (method) in which the adhesive member 123 and the peeling pin 341 do not contact the display element region of the substrate, it is desirable to appropriately combine and adopt one or more of the following configurations. Note that the following configurations are not essential, and even without the following configurations, it is possible to peel the substrate from the substrate carrier while suppressing the influence on the display element region on the substrate. Also, when combining the following configurations, as many configurations as possible can be appropriately combined. An appropriate combination may be adopted according to the dimensions and weight of the substrate.

[0048] (1) It is desirable to perform the peeling operation in order from the suction pad 120 arranged on the outside to the suction pad 120 arranged on the inside so that the substrate is peeled from the outside to the inside. When the suction pad 120 having a peeling function is adopted, the peeling operation from the suction pad 120 arranged on the outside may be performed prior to the peeling operation from the suction pad 120 arranged on the inside.

[0049] When the peeling pins 341 are adopted, during the peeling operation, when all the peeling pins 341 protrude from the substrate holding surface 110x, the peeling pins 341 arranged on the outer side may have a larger protruding amount from the substrate holding surface 110x than the peeling pins 341 arranged on the inner side. For example, due to the different moving speeds of the peeling pins 341, the protruding amount of the peeling pins 341 arranged on the outer side from the substrate holding surface 110x can be made larger than that of the peeling pins 341 arranged on the inner side. That is, the moving speed of the peeling pins 341 arranged on the outer side may be made faster than that of the peeling pins 341 arranged on the inner side. Also, due to the different moving start timings of the peeling pins 341, the protruding amount of the peeling pins 341 arranged on the outer side from the substrate holding surface 110x can be made larger than that of the peeling pins 341 arranged on the inner side. That is, the moving start timing of the peeling pins 341 arranged on the outer side may be made earlier than that of the peeling pins 341 arranged on the inner side. Furthermore, due to the different lengths of the peeling pins 341, the protruding amount of the peeling pins 341 arranged on the outer side from the substrate holding surface 110x can be made larger than that of the peeling pins 341 arranged on the inner side. That is, the length of the peeling pins 341 arranged on the outer side may be made longer than that of the peeling pins 341 arranged on the inner side. Note that these may be combined as appropriate.

[0050] Also, by adopting a configuration in which the suction pads 120 arranged on the outer side have a smaller suction force than the suction pads 120 arranged on the inner side, the substrate can be peeled from the outer side to the inner side of the substrate. In this case, a suction pad 120 having a peeling function can be adopted, or a configuration including the peeling pins 341 can be adopted. In the latter case, a configuration of changing the moving speed of the peeling pins 341, a configuration of changing the moving start timing of the peeling pins 341, and a configuration of changing the length of the peeling pins 341 may be appropriately combined on the inner and outer sides.

[0051] (2) During the peeling operation, when all the peeling pins 341 protrude from the substrate holding surface 110x, the peeling pin 341 with the smallest protruding amount from the substrate holding surface 110x may be provided so as to protrude from and retract into the substrate holding surface 110x through the through hole 111 provided at the boundary portion. And It is more preferable that the peeling pin 341 with the smallest protrusion amount is provided so as to protrude from and retract into the substrate holding surface 110x through a through hole (for example, the through hole shown at O in FIG. 13) arranged at a position that does not overlap with the center of gravity G0 of the substrate. Note that the position O is a boundary portion and corresponds to the position closest to the center of gravity G0. When peeling the substrate, peeling proceeds from the outside of the substrate toward the inside in a substantially concentric circle shape, and finally, peeling is performed by the peeling pin 341 that protrudes from and retracts into the through hole 111 at the position O. As described above, the vicinity of the center of gravity G0 of the substrate is more difficult to peel compared to the region away from the center of gravity G0. If the substrate is finally peeled in the vicinity of the center of gravity G0, the load on the substrate will increase. On the other hand, by using the peeling pin 341 that protrudes from and retracts into the through hole 111 provided at the position O that does not overlap with the center of gravity G0 of the substrate, peeling is finally performed, thereby suppressing the load on the substrate.

[0052] Here, in order to peel from the outside of the substrate toward the inside in a substantially concentric circle shape, it is necessary to make the protrusion amounts (heights) of the peeling pins 341 protruding from the through holes 111 equidistant from the position O the same. In FIG. 13, a plurality of concentric circles are shown by dotted lines. For example, during the peeling operation, when all the peeling pins 341 protrude from the substrate holding surface 110x, the tips of all the peeling pins 341 may be positioned on a virtual curved surface (such as a spherical surface or an ellipsoidal surface), a conical surface, etc. FIG. 14(A) is a graph showing the relationship between the positions of the peeling pins 341 and the protrusion amounts (heights) from the substrate holding surface 110x when the peeling pins 341 protrude from the plurality of through holes 111 arranged at the boundary portion L in FIG. 13. The graph L1 shows the case where the tips of all the peeling pins 341 are positioned on a virtual conical surface. The black circles in the graph L1 indicate the positions of the tips of some of the peeling pins 341. The graph L2 shows the case where the tips of all the peeling pins 341 are positioned on a virtual curved surface. The white circles in the graph L2 indicate the positions of the tips of some of the peeling pins 341. By adopting such a configuration, peeling proceeds from the outside of the substrate toward the inside in a substantially concentric circle shape, and finally, peeling is performed by the peeling pin 341 that protrudes from and retracts into the through hole 111 at the position O.

[0053] In addition, during peeling, the greater the inclination between the surface of the adhesive member 123 and the substrate surface, the easier it is for the substrate to be peeled off, and the load on the substrate can be reduced. That is, it is desirable that the height difference between the peeling pins 341 on both sides of the suction pad 120 be increased. It can be seen from the above graph L1 that the height difference between the peeling pins 341 on both sides of the suction pad 120 can be increased regardless of the position of the suction pad 120. On the other hand, it can be seen from the graph L2 that in the vicinity of the position O, the height difference between the peeling pins 341 on both sides of the suction pad 120 becomes small. Therefore, it can be understood that when all the peeling pins 341 protrude from the substrate holding surface 110x during the peeling operation, it is more preferable that the tips of all the peeling pins 341 be located on a virtual conical surface.

[0054] (3) In a state where the first peeling pin 341 and the second peeling pin 341 protruding from the through holes 111 on both sides of the suction pad 120 protrude from the substrate holding surface 110x, it is preferable that the protruding amount of the first peeling pin 341 from the substrate holding surface 110x is different from the protruding amount of the second peeling pin 341 from the substrate holding surface 110x. Thereby, during peeling, the surface of the adhesive member 123 and the substrate surface are not parallel but inclined, so that the substrate is easily peeled off and the load on the substrate can be reduced. Therefore, it is desirable to configure all the suction pads (adhesive members 123) provided on the substrate carrier 100X and the peeling pins 341 protruding from the through holes 111 on both sides thereof in this way. That is, when paying attention to an arbitrary suction pad 120 provided on the substrate carrier 100X, the first peeling pin 341 and the second peeling pin 341 protruding from the through holes 111 on both sides thereof are preferably configured as described above. For example, in the configuration shown in FIG. 13, during the peeling operation, when all the peeling pins 341 protrude from the substrate holding surface 110x, the tips of all the peeling pins 341 may be located on a virtual curved surface or a conical surface.

[0055] (4) During the peeling operation, it is preferable that the moving speed of the plurality of peeling pins 341 changes to be slower. In this case, when the substrate is peeled from the outside to the inside, the peeling speed in the vicinity near the center of gravity G0 of the substrate becomes slower. As described above, since it is difficult to peel the substrate from the adhesive member 123 near the center of gravity G0 of the substrate, the load on the substrate can be suppressed by slowing down the peeling speed. Note that FIG. 14(B) is a graph showing the relationship between the elapsed time and the moving speed of the peeling pins 341. In the present embodiment, for all the peeling pins 341, the moving speed is uniformly slowed down halfway. Further, in the present embodiment, although the speed is slowed down only once halfway, the speed may be slowed down in multiple steps or continuously.

[0056] (5) It is preferable that the suction pad 120 arranged on the outside has a greater suction force than the suction pad 120 arranged on the inside. For example, in the substrate carrier 100X, the plurality of suction pads 120 provided along the outer peripheral portion of the held substrate can have a greater suction force than the suction pads 120 provided along the boundary portion corresponding to the display element regions in the held substrate. Also, in FIG. 13, the suction force of the suction pad 120 arranged at a position closer to the position O can be made smaller, and the suction force of the suction pad 120 arranged at a position farther from the position O can be made greater. By configuring as described above, even in the vicinity of the center of gravity G0 where peeling is difficult, the substrate can be easily peeled off, and the load on the substrate can be suppressed.

[0057] Based on the above overview, a more specific substrate peeling apparatus, substrate peeling method, and substrate peeling process will be described below.

[0058] <<<Example 1 Regarding Substrate Peeling>>> After the film formation is completed and the mask is removed, the substrate carrier 100 is transported to the substrate peeling chamber R4 of the substrate peeling apparatus. FIG. 15 is a schematic cross-sectional view showing the schematic configuration of the substrate peeling apparatus according to Example 1, and shows a state in which the substrate carrier 100 having the suction pad 120 having the peeling function shown in FIG. 3(B) is transported to the substrate peeling chamber R4.

[0059] After the film forming process is performed and the mask is removed, the integrated mother glass 10 and the substrate carrier 100 are re-inverted by an inversion device and then transported to the substrate peeling chamber R4. After the substrate carrier 100 transported to the substrate peeling chamber R4 is placed on the support base 500, the support tool 130 is released (see FIG. 15(A)). Then, as the lifting table 125 provided on the suction pad 120 rises, the metal ball 124 rises, and the mother glass 10 is peeled from the substrate carrier 100. At this time, the peeling from the adhesive member 123 arranged in the outer region 15 of the mother glass 10 is performed prior to the peeling from the adhesive member 123 arranged in the inner region 14 (see FIG. 15(B)). Thereby, the bending of the mother glass 10 in the boundary region between the peeled outer region 15 and the unpeeled inner region 14 can be reduced, and the cycle time of peeling can be shortened without damaging the mother glass 10.

[0060] <<<Example 2 regarding substrate peeling>>> FIG. 16 is a plan view of the peeling pin unit 350 that constitutes the substrate peeling device according to Example 2. In the present example, a configuration is adopted in which the mother glass 10 supported and fixed on the substrate holding surface 110x by the suction pad 120 and the support tool 130 is peeled from the suction pad 120 by peeling pins after the support tool 130 is released.

[0061] In the peeling pin unit 350, 26 peeling pins 341 are installed on the peeling pin base 360. Specifications such as the number, outer diameter, and length of the peeling pins 341 can be appropriately changed according to the size of the adhesive member 123 and the mother glass 10, the chamfering pattern of the image display portion, etc. The peeling pins 341 are made of a material with few outgas components that can be used under vacuum. For example, the main body made of a metal such as stainless steel, and the tip portion in contact with the mother glass 10 is formed of a fluororesin or fluorine rubber, etc. rubber or the like.

[0062] For convenience of explanation, in FIG. 16, each peeling pin 341 is distinguished by coordinates. In the figure, the peeling pin at the lower left of the peeling pin mount 360 is denoted as (x1, y1), and the peeling pin at the upper right of the mount is denoted as (x7, y5), and they will be described in this way. In this substrate peeling device, the internal region 14 and the external region 15 of the mother glass 10, in other words, the periphery of each display element region (image display portion) is configured to be peeled by the peeling pins 341. There are no peeling pins 341 at the coordinates corresponding to the image display portions 11, 12, 13 shown in FIG. 1, for example, (x3, y4), (x3, y2), (x6, y3).

[0063] FIG. 17(A) is a schematic cross-sectional view of the substrate carrier 100 conveyed into the substrate peeling chamber R4 and the substrate peeling chamber R4 where the peeling pin unit 350 is installed, showing the state where the support tool 130 is released. Each peeling pin 341 is configured to be independently movable up and down in the figure by using a driving mechanism such as a motor or a ball screw. And, as shown in FIG. 17(B), in this embodiment, the moving speed of the peeling pins 341 in the external region 15 is configured to be faster than the moving speed of the peeling pins 341 in the internal region 14. Thereby, the peeling of the mother glass 10 is performed in advance in the external region 15, the bending of the mother glass 10 in the boundary region between the external region 15 and the internal region 14 is reduced, and the peeling cycle time can be shortened without damaging the mother glass 10.

[0064] Note that the moving speed of the peeling pins 341 may be made constant, and the moving start timing of the peeling pins 341 in the external region 15 may be made earlier than the moving start timing of the peeling pins 341 in the internal region 14. Even in this case, similarly, the peeling of the mother glass 10 can be performed in advance in the external region 15, and the same operational effects can be obtained.

[0065] <<<Example 3 Regarding Substrate Peeling>>> In this embodiment, a configuration is shown in which the lengths of the peeling pins 341 are different depending on the positions where they are arranged. In this embodiment, when all the peeling pins 341 protrude from the substrate holding surface 110x, with the intersection point of the two boundary portions (corresponding to the coordinates (x5, y3) in FIG. 16) as the center point, the protruding amount (height) of the peeling pins 341 is configured to gradually increase in a substantially concentric circle pattern toward the outer region.

[0066] FIG. 18(A) corresponds to a schematic cross-sectional view taken along A1 - A2 connecting the pins (x1, y1) and (x7, y1) and A3 - A4 connecting the pins (x1, y5) and (x7, y5) in FIG. 16. FIG. 18(B) corresponds to a schematic cross-sectional view taken along C1 - C2 connecting the pins (x1, y1) and (x1, y5) in FIG. 16. FIG. 18(C) corresponds to a schematic cross-sectional view taken along B1 - B2 connecting the pins (x1, y3) and (x7, y3) in FIG. 16. FIG. 18(D) corresponds to a schematic cross-sectional view taken along D1 - D2 connecting the pins (x5, y1) and (x5, y5) in FIG. 16. FIG. 18(E) corresponds to a schematic cross-sectional view taken along C3 - C4 connecting the pins (x7, y1) and (x7, y5) in FIG. 16.

[0067] The height of the peeling pin 341 is the lowest at the pin (x5, y3), and the pin heights on the concentric circle centered on the pin (x5, y3) are equal. The height of the peeling pin 341 gradually increases as it moves away from (x5, y3). The tips of all the peeling pins 341 are configured to be located on a virtual conical surface with (x5, y3) as the apex. Note that the height difference between adjacent peeling pins 341 is approximately 1 mm or more and 2 mm or less, and the maximum height difference between the peeling pins 341 is about 20 mm.

[0068] FIG. 19(A) is a schematic cross-sectional view of the substrate carrier 100 conveyed to the substrate peeling chamber R4 and the substrate peeling chamber R4 where the peeling pin unit 350 is installed, showing the state where the support tool 130 is released. state.

[0069] As described above, when attempting to peel the substrate from the adhesive member 123 while maintaining the state where the surface of the adhesive member 123 and the substrate surface are parallel, a large force is required, making it difficult to peel the substrate and increasing the load on the substrate. As a result, there is also a risk that the mother glass 10, which is the substrate, will crack. This is because when the substrate is adsorbed by the adhesive member 123 and the substrate is simultaneously pushed up by a set of peeling pins 341 on both sides of the adhesive member 123, the forces on both sides of the adhesive member 123 are balanced, resulting in an increase in the peeling resistance.

[0070] By adopting the configurations shown in the respective embodiments and making the heights of the peeling pins 341 on both sides of the adhesive member 123 (adsorption pad 120) different, the action line of the adhesive force and the action direction of the peeling pins 341 can be shifted, and the peeling resistance can be reduced by applying a moment force.

[0071] In the case of Example 3, by moving the peeling pin mount 360, while integrally moving all the peeling pins 341 with different heights in advance, the peeling timing of the mother glass 10 can be made different depending on the position. In the case of Example 3, as shown in FIG. 19(B), the peeling of the mother glass 10 starts from the outer region 15, proceeds toward the inner region 14, and is completed at the pin (x5, y3). Also in this embodiment, the bending of the mother glass 10 in the boundary region between the outer region 15 and the inner region 14 can be reduced, and the peeling cycle time can be shortened without damaging the mother glass 10.

[0072] <<<Other Embodiments Regarding Substrate Peeling>>> As described above, a configuration may be adopted in which an adsorption pad 120 (adhesive member 123) with a greater adhesive force than that in the outer region 15 is arranged in the inner region 14, so that the peeling from the adhesive member 123 in the outer region 15 occurs first. Also in this case, the bending of the mother glass 10 in the boundary region between the outer region 15 and the inner region 14 can be reduced, and the peeling cycle time can be shortened without damaging the mother glass 10.

[0073] Conversely, it is also possible to configure the suction pads 120 arranged in the outer region 15 to have a greater suction force than the suction pads 120 arranged inside. In this case, there is an advantage that it is possible to easily peel the substrate from the adhesive member 123 near the center of gravity of the substrate that is difficult to peel.

[0074] When adopting a configuration in which the adhesive force of the suction pads 120 is changed between the inside and the outside, depending on the dimensions and weight of the substrate and which of the various configurations shown in the above-described various embodiments are combined, it is possible to select which of the inside and the outside to increase the adhesive force. When changing the adhesive force, not only when changing the adhesive force between the suction pads 120 arranged in the internal region 14 and the suction pads 120 arranged in the external region 15, but also, for example, with the position O in FIG. 13 as the center, it is also possible to configure the adhesive force to gradually decrease or increase concentrically toward the outside.

[0075] Regarding the adhesive force of the suction pads 120, it can be appropriately set by changing the type, thickness, and contact area of the material constituting the adhesive member 123.

[0076] <Method for manufacturing an electronic device> Next, an example of a method for manufacturing an electronic device using the film forming apparatus according to the present embodiment will be described. Hereinafter, the configuration of an organic EL display device will be shown as an example of an electronic device, and a method for manufacturing the organic EL display device will be exemplified.

[0077] First, the organic EL display device to be manufactured will be described. FIG. 20(A) is an overall view of the organic EL display device 800, and FIG. 20(B) shows a cross-sectional structure of one pixel.

[0078] As shown in FIG. 20(A), in the display region 801 of the organic EL display device 800, a plurality of pixels 802 each including a plurality of light-emitting elements are arranged in a matrix. Although details will be described later, each of the light-emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. Here, the pixel refers to the minimum unit capable of displaying a desired color in the display region 801. In the case of the organic EL display device according to this embodiment, the pixel 802 is composed of a combination of a first light-emitting element 802R, a second light-emitting element 802G, and a third light-emitting element 802B that exhibit different emissions. The pixel 802 is often composed of a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but may also be composed of a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element, and is not particularly limited as long as it is at least one color or more.

[0079] FIG. 20(B) is a partial cross-sectional schematic view taken along the line S-S in FIG. 20(A). The pixel 802 is composed of a plurality of light-emitting elements, and each light-emitting element has, on a substrate 803, a first electrode (anode) 804, a hole transport layer 805, one of light-emitting layers 806R, 806G, 806B, an electron transport layer 807, and a second electrode (cathode) 808. Among these, the hole transport layer 805, the light-emitting layers 806R, 806G, 806B, and the electron transport layer 807 correspond to the organic layer. Also, in this embodiment, the light-emitting layer 806R is an organic EL layer that emits red light, the light-emitting layer 806G is an organic EL layer that emits green light, and the light-emitting layer 806B is an organic EL layer that emits blue light. The light-emitting layers 806R, 806G, 806B are formed in patterns corresponding to light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue light, respectively.

[0080] Further, the first electrode 804 is formed separately for each light-emitting element. The hole transport layer 805, the electron transport layer 807, and the second electrode 808 may be formed in common for the plurality of light-emitting elements 802R, 802G, and 802B, or may be formed for each light-emitting element. In addition, in order to prevent the first electrode 804 and the second electrode 808 from being short-circuited by foreign matter, an insulating layer 809 is provided between the first electrodes 804. Further, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer 810 for protecting the organic EL element from moisture and oxygen is provided.

[0081] In FIG. 20(B), the hole transport layer 805 and the electron transport layer 807 are shown as one layer, but depending on the structure of the organic EL display element, they may be formed of a plurality of layers including a hole blocking layer and an electron blocking layer. Also, a hole injection layer having an energy band structure that can smoothly inject holes from the first electrode 804 to the hole transport layer 805 can be formed between the first electrode 804 and the hole transport layer 805. Similarly, an electron injection layer can also be formed between the second electrode 808 and the electron transport layer 807.

[0082] Next, an example of a method for manufacturing an organic EL display device will be specifically described.

[0083] First, a substrate (mother glass) 803 on which a circuit (not shown) for driving the organic EL display device and the first electrode 804 are formed is prepared.

[0084] An acrylic resin is spin-coated on the substrate 803 on which the first electrode 804 is formed, and the acrylic resin is patterned by a lithography method so that an opening is formed in the portion where the first electrode 804 is formed to form the insulating layer 809. This opening corresponds to the light-emitting region where the light-emitting element actually emits light.

[0085] The substrate 803 with the patterned insulating layer 809 is placed on a substrate carrier on which an adhesive member is disposed. The substrate 803 is held by the adhesive member. It is carried into the first organic material film forming apparatus, and after inversion, the hole transport layer 805 is formed as a common layer on the first electrode 804 in the display region. The hole transport layer 805 is formed by vacuum evaporation. Actually, since the hole transport layer 805 is formed to have a size larger than the display region 801, a high-definition mask is not required. Since it is formed to have a size larger than the display region 801, a high-definition mask is not required.

[0086] Next, the substrate 803 on which the hole transport layer 805 has been formed is carried into the second organic material film forming apparatus. Alignment between the substrate and the mask is performed, the substrate is placed on the mask, and the light emitting layer 806R that emits red light is formed on the portion where the red light emitting element of the substrate 803 is disposed.

[0087] Similar to the film formation of the light emitting layer 806R, the light emitting layer 806G that emits green light is formed by the third organic material film forming apparatus, and further the light emitting layer 806B that emits blue light is formed by the fourth organic material film forming apparatus. After the film formation of the light emitting layers 806R, 806G, and 806B is completed, the electron transport layer 807 is formed over the entire display region 801 by the fifth film forming apparatus. The electron transport layer 807 is formed as a common layer for the three-color light emitting layers 806R, 806G, and 806B.

[0088] The substrate on which the electron transport layer 807 is formed is moved in a metallic vapor deposition material film forming apparatus to form the second electrode 808.

[0089] Thereafter, it is moved to a plasma CVD apparatus to form the protective layer 810, completing the film forming process on the substrate 803. After inversion, the substrate 803 is separated from the substrate carrier by peeling the adhesive member from the substrate 803 as described in the above-described embodiment or example. Thereafter, through cutting, the organic EL display device 800 is completed.

[0090] After the substrate 803 with the patterned insulating layer 809 is loaded into the film forming apparatus until the film formation of the protective layer 810 is completed, if it is exposed to an atmosphere containing moisture or oxygen, the light emitting layer made of the organic EL material may be deteriorated by moisture or oxygen. Therefore, in this embodiment, the loading and unloading of the substrate between the film forming apparatuses are performed under a vacuum atmosphere or an inert gas atmosphere.

Explanation of reference numerals

[0091] 10…Mother glass (substrate) 10x…Mother glass installation site 11, 12, 13…Image display section 14…Internal area 15…External area 100, 100X…Substrate carrier 110…Flat plate member 110x…Substrate holding surface 111, 112…Through hole 120…Suction pad 123…Adhesive member 341…Peeling pin

Claims

1. A substrate peeling device for peeling a substrate from a substrate carrier that holds the substrate by a plurality of adhesive suction pads, comprising: The substrate carrier is provided with a plurality of the adhesive suction pads and a plurality of through holes along the outer peripheral portion of the held substrate and a boundary portion corresponding to the display element region of the held substrate, respectively. A plurality of peeling pins provided so as to protrude from and retract into the substrate holding surface of the substrate carrier through the plurality of through holes; The adhesive suction pad includes an adhesive member and a metal ball that maintains a flat plate shape in a state where the lifting table has descended and deforms the adhesive member when the lifting table ascends. The substrate peeling device is characterized by this.

2. The substrate peeling device according to claim 1, wherein the boundary portion is a portion corresponding to a cutting line along which the substrate is cut in a subsequent process.

3. During the peeling operation, when all the peeling pins protrude from the substrate holding surface, the peeling pins arranged on the outer side have a larger protrusion amount from the substrate holding surface than the peeling pins arranged on the inner side. The substrate peeling device according to claim 1, characterized by this.

4. The substrate peeling device according to claim 3, wherein the different moving speeds of the peeling pins cause the peeling pins arranged on the outer side to have a larger protrusion amount from the substrate holding surface than the peeling pins arranged on the inner side.

5. The substrate peeling device according to claim 3, wherein the different moving start timings of the peeling pins cause the peeling pins arranged on the outer side to have a larger protrusion amount from the substrate holding surface than the peeling pins arranged on the inner side.

6. The substrate peeling device according to claim 3, wherein the different lengths of the peeling pins cause the peeling pins arranged on the outer side to have a larger protrusion amount from the substrate holding surface than the peeling pins arranged on the inner side. The substrate peeling device according to claim 3.

7. During the peeling operation, when all the peeling pins protrude from the substrate holding surface, the peeling pin having the smallest protrusion amount from the substrate holding surface is provided so as to protrude from and retract into the substrate holding surface through the through hole provided in the boundary portion. The substrate peeling device according to any one of claims 3 to 6, characterized by this.

8. The peeling pin with the smallest protruding amount from the substrate holding surface is provided so as to protrude from and retract into the substrate holding surface through the through hole arranged at a position not overlapping with the center of gravity of the substrate, according to the substrate peeling device described in claim 7.

9. During the peeling operation, when all the peeling pins protrude from the substrate holding surface, the tips of all the peeling pins are located on a virtual conical surface, according to the substrate peeling device described in any one of claims 1 to 6.

10. In a state where the first peeling pin and the second peeling pin protruding from the through holes adjacent to both sides of any of the adhesive suction pads protrude from the substrate holding surface, the protruding amount of the first peeling pin from the substrate holding surface is different from the protruding amount of the second peeling pin from the substrate holding surface, according to the substrate peeling device described in any one of claims 1 to 6.

11. The moving speed of the plurality of peeling pins changes to become slower, according to the substrate peeling device described in any one of claims 1 to 6.

12. The adhesive suction pad arranged on the outside has a smaller suction force than the adhesive suction pad arranged on the inside, according to the substrate peeling device described in any one of claims 1 to 11.

13. The adhesive suction pad arranged on the outside has a larger suction force than the adhesive suction pad arranged on the inside, according to the substrate peeling device described in any one of claims 1 to 11.

14. A film forming source for forming a thin film on the substrate held by the substrate carrier, The substrate peeling device described in any one of claims 1 to 13, A film forming apparatus characterized by comprising.

15. A substrate carrier having a plurality of adhesive suction pads for holding a substrate, A plurality of the adhesive suction pads are arranged along the outer peripheral portion of the held substrate and the boundary portion corresponding to the display element region of the held substrate, respectively. The adhesive suction pad also has the function of peeling the substrate. The adhesive suction pad includes an adhesive member and a metal ball that maintains the flat shape of the adhesive member when the lifting platform descends and deforms the adhesive member when the lifting platform ascends, according to the substrate carrier.

16. A substrate peeling method for peeling a substrate from a substrate carrier that holds the substrate by a plurality of arranged adhesive suction pads, A step of holding the substrate by a plurality of the adhesive suction pads provided on the substrate carrier so as to respectively follow an outer peripheral portion of the substrate and a boundary portion corresponding to a display element region on the substrate; A plurality of A step of peeling the substrate by protruding and retracting a plurality of peeling pins from a substrate holding surface of the substrate carrier through a plurality of through holes provided in the substrate carrier so as to respectively follow the outer peripheral portion and the boundary portion; comprising; The adhesive suction pad includes an adhesive member and a metal ball that maintains a flat plate shape in a state where the lifting table has descended and deforms the adhesive member when the lifting table ascends. A substrate peeling method characterized by that.

17. A film forming method for forming a thin film on a substrate held by a substrate carrier, A step of holding the substrate by a plurality of adhesive suction pads provided on the substrate carrier so as to respectively follow an outer peripheral portion of the substrate and a boundary portion corresponding to a display element region on the substrate; A step of forming a thin film by a film forming source on the substrate held by the substrate carrier; A step of peeling the substrate by protruding and retracting a plurality of peeling pins from a substrate holding surface of the substrate carrier through a plurality of through holes provided in the substrate carrier so as to respectively follow the outer peripheral portion and the boundary portion; comprising; The adhesive suction pad includes an adhesive member and a metal ball that maintains a flat plate shape in a state where the lifting table has descended and deforms the adhesive member when the lifting table ascends. A film forming method characterized by that.

18. A substrate peeling method for peeling a substrate from a substrate carrier that holds the substrate by a plurality of arranged adhesive suction pads, A step of holding the substrate by a plurality of the adhesive suction pads provided on the substrate carrier so as to respectively follow an outer peripheral portion of the substrate and a boundary portion corresponding to a display element region on the substrate; A step of peeling the substrate by the adhesive suction pad; comprising; The adhesive suction pad includes an adhesive member and a metal ball that maintains a flat plate shape in a state where the lifting table has descended and deforms the adhesive member when the lifting table ascends. A substrate peeling method characterized by that.

19. A film forming method for forming a thin film on a substrate held by a substrate carrier, A step of holding the substrate by a plurality of adhesive suction pads provided on the substrate carrier so as to respectively follow an outer peripheral portion of the substrate and a boundary portion corresponding to a display element region on the substrate; A step of forming a thin film by a film forming source on the substrate held by the substrate carrier; A step of peeling the substrate by the adhesive suction pad; Including; The adhesive suction pad includes an adhesive member and a metal ball that maintains a flat plate shape in a state where the lifting table has descended and deforms the adhesive member when the lifting table ascends. A film forming method characterized by that.

Images