Electronic device including a speaker structure

Abstract

According to an aspect of the present invention, an electronic device includes a first housing, a display module disposed on a front surface of the first housing, a camera module disposed on an upper end of the first housing, a speaker module disposed in the first housing adjacent to the camera module, an acoustic hole formed on a side surface of the first housing for discharging sound generated in the speaker module to an outside of the electronic device, a first conduit formed in the first housing to extend from the speaker module in a direction toward the acoustic hole, and a second conduit formed in the first housing to extend in a direction perpendicular to the extension direction of the first conduit, and an extension portion formed in at least a portion of the conduit for expanding a volume of the conduit. Various other embodiments are possible.

Description

Technical Field

[0001] Embodiments according to the present invention relate to an electronic device including a speaker structure.

Background Art

[0002] The popularity of electronic devices is constantly increasing. In addition to existing bar-type electronic devices, various forms of electronic devices such as foldable electronic devices and rollable electronic devices are commercially available. In an electronic device, it is possible to provide dual speakers installed on both the upper and lower ends of a portable electronic device. In an electronic device, in addition to a rear camera, a front camera may also exist. For the aesthetics of the electronic device, acoustic holes for radiating the sound output from the speaker to the outside of the electronic device may be symmetrically formed in the housing of the electronic device.

[0003] For example, the upper acoustic hole and the lower acoustic hole may be respectively arranged at the central portions of the upper and lower ends of the electronic device to be symmetric with each other, and the speaker module connected to the upper acoustic hole and the speaker module connected to the lower acoustic hole may also be respectively arranged at the central portions of the upper and lower ends of the housing. On the other hand, for aesthetics, the camera module may also be arranged at the upper center so that a camera hole can be located at the central portion of the upper end of the display.

[0004] In this case, an overlap between the camera module and the upper speaker module may occur. In addition, when the volume of the pipeline guiding the sound of the speaker module becomes small, the sound quality may deteriorate.

Summary of the Invention

Problems to be Solved by the Invention

[0005] Embodiments according to the present invention provide an electronic device including a speaker module that solves or improves the above problems.

Means for Solving the Problem

[0006] An electronic device according to an aspect of the present invention includes a first housing, a display module disposed on the front surface of the first housing, a camera module disposed at the upper end of the first housing, an upper speaker module disposed at the upper end of the first housing so as to be adjacent to the camera module, an upper acoustic hole formed on a side surface of the upper end of the first housing so that sound generated by the upper speaker module is emitted to the outside of the electronic device, an upper pipeline including a first pipeline extending in the direction of the upper acoustic hole from the upper speaker module and a second pipeline extending in a direction perpendicular to the extending direction of the first pipeline, and an expansion portion formed on at least a part of the upper pipeline for volume expansion of the upper pipeline. Moreover, the upper speaker module is disposed on a first direction side perpendicular to a straight line extending in the longitudinal direction of the display module through the upper acoustic hole of the first housing, the camera module is disposed on a second direction side opposite to the first direction of the straight line extending in the longitudinal direction of the display module through the upper acoustic hole of the first housing, the first pipeline of the upper pipeline is located in the first direction with respect to the straight line, and the second pipeline of the upper pipeline is located in the second direction with respect to the straight line. It is characterized by the above.

[0007] Further, an electronic device according to an aspect of the present invention includes a first housing, a display module disposed on the front surface of the first housing, a camera module disposed at the upper end of the first housing, an upper speaker module disposed at the upper end of the first housing so as to be adjacent to the camera module, a lower speaker module disposed at the lower end of the first housing, an upper acoustic hole formed on a side surface of the upper end of the first housing, a lower acoustic hole formed on a side surface of the lower end of the first housing, an upper pipeline including a first pipeline extending in the direction of the upper acoustic hole from the upper speaker module and a second pipeline extending in a direction perpendicular to the extending direction of the first pipeline, a lower pipeline extending in the direction of the lower acoustic hole from the lower speaker module, and an expansion portion formed on at least a part of the upper pipeline for volume expansion of the upper pipeline. It is characterized by having the above.

Effect of the Invention

[0008] According to an aspect of the present invention, an electronic device can present a structure in which a speaker module and a camera module are located in the central portion of the electronic device in consideration of the aesthetics of the electronic device. In addition, by changing the pipe shape of the speaker module, it is possible to solve the sound quality problem caused by the adjacent arrangement of the speaker module and the camera module.

Brief Description of the Drawings

[0009] In connection with the description of the drawings, the same or similar reference numerals are used for the same or similar components.

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Embodiments for Carrying Out the Invention

[0010] The embodiments described in this specification and the terms used therein are not intended to limit the technical features described in this specification to specific examples, but should be understood to include various modifications, equivalents, or alternatives of the embodiments. In connection with the description of the drawings, similar or related components are assigned similar reference numerals. The singular form of a noun corresponding to an item may include one or more items unless otherwise specified in the relevant context.

[0011] In this specification, phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B, or C" each may include any one of the corresponding phrases listed together in the phrase, or all possible combinations of those items. Terms such as "first", "second", or "first", "second" are merely used to distinguish the component from other corresponding components, and do not limit the component in other aspects (e.g., importance or order). When it is mentioned that a certain (e.g., first) component is "coupled" or "connected" to another (e.g., second) component, with or without the terms "functionally" or "communicatively", this means that a certain component can be directly (e.g., wired), wirelessly, or connected via a third component to another component.

[0012] FIG. 1 is a block diagram of an electronic device 101 within a network environment 100 according to an embodiment of the present invention. Referring to FIG. 1, in a network environment 100, an electronic device 101 communicates with an electronic device 102 through a first network 198 (e.g., a short-range wireless communication network), or communicates with at least one of an electronic device 104 or a server 108 through a second network 199 (e.g., a long-range wireless communication network).

[0013] According to an embodiment, the electronic device 101 communicates with the electronic device 104 through the server 108. According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an acoustic output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module 196, or an antenna module 197. In an embodiment, at least one of these components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added. In an embodiment, some of these components (e.g., the sensor module 176, the camera module 180, or the antenna module 197) may be integrated as one component (e.g., the display module 160).

[0014] The processor 120 executes software (e.g., a program 140), for example, and can control at least one other component of the electronic device 101 connected to the processor 120, and performs various data processing or operations. According to an embodiment, as at least a part of data processing or operations, the processor 120 stores instructions or data received from other components (e.g., the sensor module 176 or the communication module 190) in the volatile memory 132, processes the instructions or data stored in the volatile memory 132, and stores the resulting data in the non-volatile memory 134.

[0015] According to one embodiment, the processor 120 includes a main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor 121. For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 can be set to use less power than the main processor 121 or to be specialized for a specified function. The auxiliary processor 123 may be implemented separately from or as part of the main processor 121.

[0016] The auxiliary processor 123 controls at least a part of the functions or states related to at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), for example, instead of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state or together with the main processor 121 while the main processor 121 is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of other functionally related components (e.g., the camera module 180 or the communication module 190). According to one embodiment, the auxiliary processor 123 (e.g., a neural processing unit) includes a hardware structure specialized for processing an artificial intelligence model.

[0017] The artificial intelligence model is generated by machine learning. Such learning may be performed, for example, by the electronic device 101 itself on which the artificial intelligence model is executed, or may be performed by a separate server (e.g., server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers. The artificial neural network may be any one of a deep neural network (DNN), CNN (convolutional neural network), RNN (recurrent neural network), RBM (restricted boltzmann machine), DBN (deep belief network), BRDNN (bidirectional recurrent deep neural network), deep Q-networks, or a combination of two or more of these, but is not limited to the examples described above. The artificial intelligence model may include a software structure in addition to or instead of the hardware structure.

[0018] The memory 130 stores various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The data includes, for example, software (e.g., the program 140) and input data or output data for the instructions related thereto. The memory 130 includes a volatile memory 132 or a non-volatile memory 134.

[0019] The program 140 may be stored as software in the memory 130 and includes, for example, an operating system 142, middleware 144, or an application 146.

[0020] The input module 150 receives instructions or data used for components (e.g., the processor 120) of the electronic device 101 from outside the electronic device 101 (e.g., a user). The input module 150 includes, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus pen).

[0021] The audio output module 155 outputs an audio signal to the outside of the electronic device 101. The audio output module 155 includes, for example, a speaker or a receiver. The speaker is used for general purposes such as multimedia playback or recording playback. The receiver is used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

[0022] The display module 160 visually provides information to the outside of the electronic device 101 (e.g., a user). The display module 160 includes, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor set to sense touch, or a pressure sensor set to measure the intensity of the force generated by touch.

[0023] The audio module 170 converts sound into an electrical signal or, conversely, converts an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound from the input module 150 or outputs sound from the audio output module 155 or an external electronic device (e.g., the electronic device 102) (e.g., a speaker or headphones) directly or wirelessly connected to the electronic device 101.

[0024] The sensor module 176 senses the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state), and generates an electrical signal or data value corresponding to the sensed state. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0025] The interface 177 supports one or more specified protocols available for the electronic device 101 to be directly or wirelessly connected to an external electronic device (e.g., the electronic device 102). According to one embodiment, the interface 177 may include, for example, an HDMI (registered trademark) (high definition multimedia interface), a USB (universal serial bus) interface, an SD card interface, or an audio interface.

[0026] The connection terminal 178 includes a connector through which the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI (registered trademark) connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0027] The haptic module 179 converts an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through touch or kinesthesia. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0028] The camera module 180 captures still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0029] The power management module 188 manages the power supplied to the electronic device 101. According to one embodiment, the power management module 188 is implemented, for example, as at least a part of a PMIC (power management integrated circuit).

[0030] The battery 189 supplies power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0031] The communication module 190 supports the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108), and communication via the established communication channel. The communication module 190 operates independently of the processor 120 (e.g., an application processor) and includes one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a GNSS (global navigation satellite system) communication module) or a wired communication module 194 (e.g., a LAN (local area network) communication module, or a power line communication module).

[0032] The corresponding communication module among these communication modules communicates with an external electronic device 104 through a first network 198 (e.g., a short-range communication network such as Bluetooth (registered trademark), WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network 199 (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN)). These various communication modules can be integrated as one component (e.g., a single chip) or implemented as a plurality of separate components (e.g., multiple chips) from each other. The wireless communication module 192 identifies or authenticates the electronic device 101 within a communication network such as the first network 198 or the second network 199 using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196.

[0033] The wireless communication module 192 supports 5G networks and next-generation communication technologies after the 4G network, such as NR connection technology (new radio access technology). The NR connection technology supports high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), terminal power minimization and connection of multiple terminals (mMTC (massive machine type communications)), or ultra-reliable and low-latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module 192 supports a high-frequency band (e.g., mmWave band) for achieving, for example, a high data transmission rate.

[0034] The wireless communication module 192 supports various technologies for ensuring performance in the high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module 192 supports various requirements defined by the electronic device 101, an external electronic device (e.g., the electronic device 104), or a network system (e.g., the second network 199). According to one embodiment, the wireless communication module 192 supports a peak data rate (e.g., 20 Gbps or more) for realizing enhanced mobile broadband (eMBB), a coverage (e.g., 164 dB or less) for realizing massive machine type communication (mMTC), or a processing delay of data (U-plane latency) (e.g., 0.5 ms or less for each of downlink (DL) and uplink (UL), or 1 ms or less for round trip) for realizing ultra-reliable low-latency communication (URLLC).

[0035] The antenna module 197 transmits a signal or power to the outside (e.g., an external electronic device) or receives the same from the outside. According to one embodiment, the antenna module 197 includes an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a printed circuit board (PCB)). According to one embodiment, the antenna module 197 includes a plurality of antennas (e.g., an array antenna). In this case, at least one antenna compatible with a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the plurality of antennas by, for example, the communication module 190. Signals or power are transmitted or received between the communication module 190 and an external electronic device through at least one selected antenna. According to one embodiment, other components (e.g., RFIC (radio frequency integrated circuit)) besides the radiator can be further formed as part of the antenna module 197.

[0036] According to one embodiment, the antenna module 197 forms a mmWave antenna module. According to one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to the first surface (e.g., the bottom surface) of the printed circuit board and capable of supporting a specified high-frequency band (e.g., the mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to the second surface (e.g., the top surface or side surface) of the printed circuit board and capable of transmitting or receiving signals in the specified high-frequency band.

[0037] At least some of the above components are connected to each other by a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) to exchange signals (e.g., instructions or data) with each other.

[0038] According to one embodiment, instructions or data are transmitted or received between the electronic device 101 and an external electronic device 104 via a server 108 connected to the second network 199. The external electronic devices (102 or 104) can be devices of the same or different types as the electronic device 101, respectively. According to one embodiment, all or part of the operations executed by the electronic device 101 are executed by one or more external electronic devices among the external electronic devices (102, 104, or 108). For example, when the electronic device 101 must perform a certain function or service automatically or in response to a request from the user or another device, instead of or in addition to performing the function or service by itself, the electronic device 101 can request one or more external electronic devices to perform at least a part of the function or the service. One or more external electronic devices that receive the request execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101.

[0039] The electronic device 101 provides the above result as is or after further processing as at least a part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology is used. The electronic device 101 provides an ultra-low latency service using, for example, distributed computing or mobile edge computing. In other embodiments, the external electronic device 104 includes IoT (Internet of Things) devices. The server 108 can be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device 104 or the server 108 can be included in the second network 199. The electronic device 101 is applied to intelligent services (such as smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0040]

[0041] ​Referring to FIGS. 2A and 2B, the electronic device 200 includes a pair of housings (210, 220) (e.g., foldable housings) that are rotatably coupled to each other about a folding axis A1 by a hinge device (e.g., hinge device 264 of FIG. 3) so as to be folded with respect to each other, a first display 230 (e.g., a flexible display, a foldable display, or a main display) and / or a second display 400 (e.g., a sub-display) disposed by the pair of housings (210, 220). According to one embodiment, the hinge device (e.g., hinge device 264 of FIG. 3) is disposed so as not to be visible from the outside by the first housing 210 and the second housing 220 in the folded state, and is disposed so as not to be visible from the outside by a hinge cover 265 that protects the hinge device and covers the foldable portion in the unfolded state. In this specification, the surface on which the first display 230 is disposed is defined as the front surface of the electronic device 200, and the opposite surface of the front surface is defined as the back surface of the electronic device 200. Also, the surface surrounding the space between the front surface and the back surface is defined as the side surface of the electronic device 200.

[0042] According to one embodiment, the pair of housings (210, 220) includes a first housing 210 and a second housing 220 that are foldably disposed with respect to each other by a hinge device (e.g., hinge device 264 of FIG. 3). According to one embodiment, the pair of housings (210, 220) is not limited to the forms and couplings shown in FIGS. 2A and 2B, and may be implemented by other shapes, combinations of components, and / or couplings. According to one embodiment, the first housing 210 and the second housing 220 are disposed on both sides about the folding axis A1 and have an overall symmetric shape with respect to the folding axis A1. According to one embodiment, the first housing 210 and the second housing 220 are folded asymmetrically with respect to the folding axis A1. According to one embodiment, the first housing 210 and the second housing 220 have a changing angle and distance relative to each other depending on whether the electronic device 200 is in an unfolded stage, a folded state, or an intermediate state.

[0043] According to one embodiment, in the unfolded state of the electronic device 200, the first housing 210 is connected to a hinge device (e.g., the hinge device 264 in FIG. 3) and includes a first surface 211 disposed to face the front surface of the electronic device 200, a second surface 212 facing in the opposite direction of the first surface 211, and / or a first side member 213 surrounding at least a part of the first space between the first surface 211 and the second surface 212. According to one embodiment, in the unfolded state of the electronic device 200, the second housing 220 is connected to a hinge device (e.g., the hinge device 264 in FIG. 3) and includes a third surface 221 disposed to face the front surface of the electronic device 200, a fourth surface 222 facing in the opposite direction of the third surface 221, and / or a second side member 223 surrounding at least a part of the second space between the third surface 221 and the fourth surface 222. According to one embodiment, the first surface 211 faces in substantially the same direction as the third surface 221 in the unfolded state and faces the third surface 221 in the folded state. According to one embodiment, the electronic device 200 includes a first housing 210 and a recess 201 formed by a structural coupling of the second housing 220 to accommodate the first display 230. According to one embodiment, the recess 201 has substantially the same size as the first display 230.

[0044] According to one embodiment, the hinge cover 265 is disposed between the first housing 210 and the second housing 220 and is arranged to cover the hinge device (e.g., the hinge device 264 in FIG. 3). According to one embodiment, the hinge cover 265 is covered by a part of the first housing 210 and the second housing 220 or is exposed to the outside depending on whether the electronic device 200 is in an unfolded state, a folded state, or an intermediate state. For example, when the electronic device 200 is in the unfolded state, the hinge cover 265 is covered by the first housing 210 and the second housing 220 and is not substantially exposed. According to one embodiment, when the electronic device 200 is in the folded state, the hinge cover 265 is exposed to the outside between the first housing 210 and the second housing 220. According to one embodiment, when the first housing 210 and the second housing 220 are in an intermediate state at a predetermined angle (folded with a certain angle), the hinge cover 265 is at least partially exposed to the outside of the electronic device 200 between the first housing 210 and the second housing 220. For example, the area where the hinge cover 265 is exposed to the outside is smaller than when it is in the fully folded state. According to one embodiment, the hinge cover 265 includes a curved surface.

[0045] According to one embodiment, when the electronic device 200 is in the unfolded state (for example, the state in FIG. 2a), the first housing 210 and the second housing 220 form an angle of about 180°, and the first region 230a, the folding region 230c, and the second region 230b of the first display 230 are in the same plane and are arranged to face substantially in the same direction. As another embodiment, when the electronic device 200 is in the unfolded state, the first housing 210 rotates at an angle of about 360° with respect to the second housing 220 and is folded oppositely (out folding method) so that the second surface 212 and the fourth surface 222 face each other.

[0046] According to one embodiment, when the electronic device 200 is in the folded state (for example, the state in FIG. 2b), the first surface 211 of the first housing 210 and the third surface 221 of the second housing 220 are arranged to face each other. In this case, the first region 230a and the second region 230b of the first display 230 form a narrow angle (for example, in the range of 0° to about 10°) with each other by the folding region 230c and are arranged to face each other. According to an embodiment, the folding region 230c is formed of a curved surface having at least a part with a predetermined radius of curvature. According to an embodiment, when the electronic device 200 is in an intermediate state, the first housing 210 and the second housing 220 are arranged at a certain angle with respect to each other.

[0047] In this case, the first region 230a and the second region 230b of the first display 230 form an angle that is larger than in the folded state and smaller than in the unfolded state, and the radius of curvature of the folding region 230c is larger than in the folded state. In one embodiment, the first housing 210 and the second housing 220 can form an angle that can be stopped at a specified folding angle between the folded state and the unfolded state by a hinge device (e.g., the hinge device 264 in FIG. 3) (free stop function). In one embodiment, the first housing 210 and the second housing 220 can also operate while being pressed in the direction of being unfolded or folded with respect to a specified bending angle by a hinge device (e.g., the hinge device 264 in FIG. 3).

[0048] According to an embodiment, the electronic device 200 includes at least one of at least one display (230, 400), an input device 215, an acoustic output device (227, 228), a sensor module (217a, 217b, 226), a camera module (216a, 216b, 225), a key input device 219, an indicator (not shown), or a connector port 229 disposed in the first housing 210 and / or the second housing 220. In one embodiment, the electronic device 200 may omit at least one of the components and may further include at least one other component.

[0049] According to one embodiment, at least one display (230, 400) includes a first display 230 (e.g., a flexible display) arranged to receive support from a first surface 211 of a first housing 210 through a hinge device (e.g., the hinge device 264 of FIG. 3) to a third surface 221 of a second housing 220, and a second display 400 arranged to be visible from the outside through a fourth surface 222 in an internal space of the second housing 220. As yet another example, the second display 400 may be arranged to be visible from the outside through a second surface 212 in an internal space of the first housing 210. According to one embodiment, the first display 230 is mainly used in an unfolded state of the electronic device 200, and the second display 400 is mainly used in a folded state of the electronic device 200. According to one embodiment, in an intermediate state, the electronic device 200 uses the first display 230 and / or the second display 400 based on a folding angle between the first housing 210 and the second housing 220.

[0050] According to one embodiment, the first display 230 is disposed in a space formed by a pair of housings (210, 220). For example, the first display 200 is disposed in a recess 201 formed by a pair of housings (210, 220) and is disposed to substantially occupy most of the front surface of the electronic device 200. According to one embodiment, the first display 230 includes a flexible display at least a partial region of which is deformed into a flat surface or a curved surface. According to one embodiment, the first display 230 includes a first region 230a facing the first housing 210, a second region 230b facing the second housing 220, and a folding region 230c connecting the first region 230a and the second region 230b and facing a hinge device (e.g., the hinge device 264 of FIG. 3). According to one embodiment, the area division of the first display 230 is only an exemplary physical division by a pair of housings (210, 220) and a hinge device (for example, the hinge device 264 in FIG. 3), and substantially by the pair of housings (210, 220) and the hinge device (for example, the hinge device 264 in FIG. 3), the first display 230 is displayed as a seamless, single overall screen. According to one embodiment, the first region 230a and the second region 230b may have an overall symmetric shape or a partially asymmetric shape with respect to the folding region 230c.

[0051] According to one embodiment, the electronic device 200 includes a first rear cover 240 disposed on the second surface 212 of the first housing 210 and a second rear cover 250 disposed on the fourth surface 222 of the second housing 220. In one embodiment, at least a part of the first rear cover 240 is integrally formed with the first side member 213. In one embodiment, at least a part of the second rear cover 250 is integrally formed with the second side member 223. According to one embodiment, at least one of the first rear cover 240 and the second rear cover 250 is formed of a substantially transparent plate (for example, a glass plate including various coating layers or a polymer plate) or an opaque plate.

[0052] According to one embodiment, the first rear cover 240 is formed of an opaque plate such as, for example, coated or colored glass, ceramic, polymer, metal (for example, aluminum, stainless steel (STS), or magnesium), or at least a combination of two of these substances. According to one embodiment, the second rear cover 250 is formed of a substantially transparent plate such as, for example, glass or polymer. Therefore, the second display 400 is disposed in the internal space of the second housing 220 so as to be visible from the outside through the second rear cover 250. In one embodiment, the second back cover 250 may be included in the second display 400.

[0053] According to one embodiment, the input device 215 includes a microphone. In one embodiment, the input device 215 includes a plurality of microphones arranged to sense the direction of sound. According to one embodiment, the acoustic output devices (227, 228) include speakers. According to one embodiment, the acoustic output devices (227, 228) include a call receiver 227 arranged through the fourth surface 222 of the second housing 220 and an external speaker 228 arranged through the side member of the second housing 220. In one embodiment, the input device 215, the acoustic output devices (227, 228), and the connector 229 are arranged in the space of the first housing 210 and / or the second housing 220 and are exposed to the external environment through at least one hole formed in the first housing 210 and / or the second housing 220. In one embodiment, the holes formed in the first housing 210 and / or the second housing 220 are shared for the input device 215 and the acoustic output devices (227, 228). In one embodiment, the acoustic output devices (227, 228) may include a speaker (e.g., a piezoelectric speaker) that operates with the holes formed in the first housing 210 and / or the second housing 220 excluded.

[0054] According to one embodiment, the camera modules (216a, 216b, 225) include a first camera module 216a arranged on the first surface 211 of the first housing 210, a second camera module 216b arranged on the second surface 212 of the first housing 210, and / or a third camera module 225 arranged on the fourth surface 222 of the second housing 220. According to one embodiment, the electronic device 200 includes a flash 218 arranged near the second camera module 216b. According to one embodiment, the flash 218 includes, for example, a light emitting diode or a xenon lamp. According to one embodiment, the camera modules (216a, 216b, 225) may include one or more lenses, an image sensor, and / or an image signal processor. In one embodiment, at least one of the camera modules (216a, 216b, 225) includes two or more lenses (a wide-angle lens and a telephoto lens) and an image sensor, and may be disposed together on one surface of either the first housing 210 and / or the second housing 220.

[0055] According to one embodiment, the sensor modules (217a, 217b, 226) generate electrical signals or data values corresponding to the internal operating state or external environmental state of the electronic device 200. According to one embodiment, the sensor modules (217a, 217b, 226) include a first sensor module 217a disposed on the first surface 211 of the first housing 210, a second sensor module 217b disposed on the second surface 212 of the first housing 210, and / or a third sensor module 226 disposed on the fourth surface 222 of the second housing 220. In one embodiment, the sensor modules (217a, 217b, 226) may include at least one of a gesture sensor, a grip sensor, a color sensor, an IR (infrared) sensor, an illuminance sensor, an ultrasonic sensor, an iris recognition sensor, or a distance detection sensor (a TOF sensor or a RiDAR scanner).

[0056] According to one embodiment, the electronic device 200 may further include at least one of a sensor module not shown in the figure, for example, a barometric pressure sensor, a magnetic sensor, a biometric sensor, a temperature sensor, a humidity sensor, or a fingerprint recognition sensor. In one embodiment, the fingerprint recognition sensor is disposed through at least one of the side members of the first side member 213 of the first housing 210 and / or the second side member 223 of the second housing 220.

[0057] According to one embodiment, the key input device 219 is disposed so as to be exposed to the outside through the first side member 213 of the first housing 210. In one embodiment, the key input device 219 is disposed so as to be exposed to the outside through the second side member 223 of the second housing 220. In one embodiment, the electronic device 200 may not include some or all of the key input device 219, and the non-included key input device 219 may be embodied in another form such as soft keys on at least one display (230, 400). As another embodiment, the key input device 219 may be embodied by a pressure sensor included in at least one display (230, 400).

[0058] According to one embodiment, the connector port 229 includes a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device. In one embodiment, the connector port 229 either shares a function for transmitting and receiving audio signals with an external electronic device or further includes another connector port (e.g., an earphone jack) for performing the function of transmitting and receiving audio signals.

[0059] According to one embodiment, at least one camera module (216a, 225) among the camera modules (216a, 216b, 225), at least one sensor module (217a, 226) among the sensor modules (217a, 217b, 226), and / or the indicator are disposed so as to be exposed through at least one display (230, 400). For example, at least one camera module (216a, 225), at least one sensor module (217a, 226), and / or an indicator are disposed in the internal space of at least one housing (210, 220) under the activation area of the display (230, 240), and are arranged to be in contact with the external environment through an opening or a transparent area that is perforated up to a cover member (e.g., a window layer (not shown) of the first display 230 and / or the second back cover 250).

[0060] According to one embodiment, the area where the display (230, 240) faces the at least one camera module (216a, 225) is a part of the area for displaying content, and is formed as a transmissive area having a certain transmittance. According to one embodiment, the transmissive area is formed to have a transmittance in the range of about 5% to about 20%. Such a transmissive area includes an area that overlaps with the effective area (e.g., the angle-of-view area) of at least one camera module (216a, 225) through which light for imaging with an image sensor to generate an image passes. For example, the transmissive area of the display (230, 240) includes an area where the pixel density is lower than that of the periphery. For example, the transmissive area may replace an opening (aperture). For example, the at least one camera module (216a, 225) includes an under-display camera (UDC). As another embodiment, some camera modules or sensor modules 204 are arranged to perform their functions without being visually exposed through the display. For example, in the area of the display 201 (e.g., a display panel) that faces the camera module and / or the sensor module, a perforated opening may not be necessary.

[0061] According to one embodiment, the electronic device 200 includes at least one antenna configured using at least a part of the first conductive side member 213 of the first housing 210. According to one embodiment, at least one antenna is disposed in the upper region (e.g., region A) and / or the lower region (e.g., region B) of the first housing 210. According to an embodiment of the present invention, at least one antenna is further implemented using the second conductive side member 223 of the second housing 220 including the second display 400. According to one embodiment, at least one antenna is further disposed in the upper region (region C) and / or the lower region (region D) of the second conductive side member 223. In this case, a peripheral conductive structure (e.g., a substrate or a conductive electrical structure) used as a common ground with the conductive sheet (e.g., the conductive sheet 444 in FIG. 4a) of the second display 400 is electrically connected (grounded) at at least one specified position near the power feeding point of the antenna, which may help prevent a decrease in the radiation performance of the antenna using the second side member 223.

[0062] FIG. 3 is an exploded perspective view of an electronic device 200 according to an embodiment of the present invention. Referring to FIG. 3, the electronic device 200 includes a first display 230, a second display 400, a support member assembly 260, at least one printed circuit board 270, a first housing 210, a second housing 220, a first back cover 240, and / or a second back cover 250.

[0063] According to one embodiment, the first display 230 includes a display panel 231 (e.g., a flexible display panel) and one or more plates 232 or layers on which the display panel 231 (e.g., a flexible display panel) is seated. According to one embodiment, one or more plates 232 include a conductive plate (e.g., a Cu sheet or a SUS sheet) disposed between the display panel 231 and the support member assembly 260. According to one embodiment, one or more plates 232 are formed to have substantially the same area as the first display 230, and a region facing the folding region 230c of the first display 230c is formed to be bendable. According to one embodiment, one or more plates 232 include at least one auxiliary material layer (e.g., a graphite member) disposed on the back surface of the display panel 231. According to one embodiment, one or more plates 232 are formed in a shape corresponding to the display panel 231.

[0064] According to one embodiment, the second display 400 is disposed in the space between the second housing 220 and the second back cover 250. According to one embodiment, the second display 400 is disposed in the space between the second housing 220 and the second back cover 250 so as to be visible from the outside through substantially the entire area of the second back cover 250.

[0065] According to one embodiment, the support member assembly 260 includes a first support member 261 (e.g., a first support plate), a second support member 262 (e.g., a second support plate), a hinge device 264 disposed between the first support member 261 and the second support member 262, a hinge cover 265 that covers the hinge device 264 when viewed from the outside, and / or at least one wiring member 263 (e.g., a flexible printed circuit board (FPCB)) that crosses the first support member 261 and the second support member 262. According to one embodiment, the support member assembly 260 is disposed between one or more plates 232 and at least one printed circuit board 270.

[0066] According to one embodiment, the first support member 261 is disposed between the first region 231a of the first display 230 and the first printed circuit board 271. According to one embodiment, the second support member 262 is disposed between the second region 231b of the first display 230 and the second printed circuit board 272. According to one embodiment, at least one wiring member 263 and at least a part of the hinge device 264 are disposed inside the support member assembly 260. At least one wiring member 263 is disposed in a direction (e.g., the x-axis direction) crossing the first support member 261 and the second support member 262. According to one embodiment, at least one wiring member 263 is disposed in a direction (e.g., the x-axis direction) perpendicular to the folding axis (e.g., the y-axis or the folding axis A in FIG. 2a) of the folding region 230c.

[0067] According to one embodiment, at least one printed circuit board 270 includes a first printed circuit board 271 disposed to face the first support member 261 or a second printed circuit board 272 disposed to face the second support member 262. According to one embodiment, the first printed circuit board 271 and the second printed circuit board 272 are disposed in the internal space formed by the support member assembly 260, the first housing 210, the second housing 220, the first back cover 240, and / or the second back cover 250. According to one embodiment, the first printed circuit board 271 and the second printed circuit board 272 may include a plurality of electronic components disposed to implement various functions of the electronic device 200.

[0068] According to one embodiment, the electronic device includes, in the first space of the first housing 210, a first printed circuit board 271 disposed in the space formed by the first support member 261, a first battery 291 disposed at a position facing the first swelling hole 2611 of the first support member 261, at least one camera module 282 (e.g., the first camera module 216a and / or the second camera module 216b in FIG. 1) or at least one sensor module 281 (e.g., the first sensor module 217a and / or the second sensor module 217b in FIG. 1). According to one embodiment, the second space of the second housing 220 includes a second printed circuit board 272 disposed in the second space formed by the second support member 262, or a second battery 292 disposed at a position facing the second swelling hole 2621 of the second support member 262. According to one embodiment, the first housing 210 and the first support member 261 are integrally formed. According to one embodiment, the second housing 220 and the second support member 262 are also integrally formed.

[0069] According to one embodiment, the first housing 210 includes a first rotation support surface 214, and the second housing 220 includes a second rotation support surface 224 corresponding to the first rotation support surface 214. According to one embodiment, the first rotation support surface 214 and the second rotation support surface 224 include curved surfaces corresponding to (naturally connected to) the curved surface included in the hinge cover 265. According to one embodiment, when the electronic device 200 is in the unfolded state, the first rotation support surface 214 and the second rotation support surface 224 cover the hinge cover 265 so as not to expose the hinge cover 265 on the back surface of the electronic device 200, or only a part thereof is exposed. According to one embodiment, when the electronic device 200 is in the folded state, the first rotation support surface 214 and the second rotation support surface 224 rotate along the curved surface included in the hinge cover 265 to expose the hinge cover 265 on the back surface of the electronic device 200.

[0070] FIG. 4a is a schematic diagram of the front surface of the housing and its peripheral components according to an embodiment of the present invention, FIG. 4b is a plan view showing the upper end of the front surface of the housing according to an embodiment of the present invention, FIG. 4c is a cross-sectional view taken along the line B-B of FIG. 4b, and FIG. 4d is a cross-sectional view taken along the line C-C of FIG. 4b. Hereinafter, for the components to be described, detailed descriptions of the same or similar components described above are omitted, and the same member numbers are used in common.

[0071] According to one embodiment, as shown in FIG. 4a, a housing 220 (e.g., the second housing 220 in FIG. 2a), which is the body of an electronic device 200 (e.g., the electronic device 101 in FIG. 1 or the electronic device 200 in FIG. 2a), has an upper speaker module 301 (e.g., the acoustic output module 155 in FIG. 1, the acoustic output device 228 in FIG. 2a), a lower speaker module 302 (e.g., the acoustic output module 155 in FIG. 1, the acoustic output device 228 in FIG. 2a), an upper duct 305, a lower duct 306, a camera module 225 (e.g., the camera module 180 in FIG. 1, the third camera module 225 in FIG. 2a), a printed circuit board 272 (e.g., the second printed circuit board 272 in FIG. 3), a battery 292 (e.g., the battery 189 in FIG. 1 or the second battery 292 in FIG. 3), and a display module 160 (e.g., the display module 160 in FIG. 1, the first display 230 in FIG. 2a or the second display 400 in FIG. 2a) disposed or formed thereon at the front surface 222 (e.g., the fourth surface 222 in FIG. 2a). The housing 220 described below is a concept including a support member 262 (e.g., the second support member 262 in FIG. 3).

[0072] According to one embodiment, various electronic components included in the electronic device 200 are disposed in the housing 220 of the electronic device 200, and a structure that at least partially forms the appearance of the electronic device 200 is collectively referred to as such. According to one embodiment, a printed circuit board 272, a camera module 225, and speaker modules (301, 302) are disposed in the housing 220. In addition, various other electronic components may be disposed in the housing 220. According to one embodiment, at least one of the electronic components included in the electronic device 200 is electrically connected to the printed circuit board 272. For example, speaker modules (301, 302) and the camera module 225 are electrically connected to the printed circuit board 272.

[0073] According to one embodiment, the upper speaker module 301 and the lower speaker module 302 are devices disposed in the electronic device 200 to output sound. The upper speaker module 301 and the lower speaker module 302 output sound by executing an application or a function. For example, it receives an audio signal processed by an audio module (e.g., the audio module 170 in FIG. 1) and outputs the signal as sound.

[0074] According to one embodiment, referring to FIG. 2b, the upper speaker module 301 is used as a receiver 227 for a call. During a call operation, the call sound of an incoming call is transmitted from the upper speaker module 301 to the user. In the foldable electronic device 200, the user can fold the electronic device 200 so that the electronic device 200 can be easily held during a call operation. When the user holds the folded electronic device 200 to make a call, the user's ear is close to the upper center of the electronic device 200. Thus, the portion where the call sound is emitted is located at the upper center of the electronic device 200. For example, a receiver hole (not shown) through which the call sound generated by the upper speaker module 301 is emitted is formed at the upper center of the second back cover 250. Therefore, the upper speaker module 301 connected to the receiver hole is disposed at the upper center of the front surface 222 of the housing 220. According to another embodiment, the receiver 227 and the upper speaker module 301 may be separate components.

[0075] According to one embodiment, as shown in FIG. 4a, the acoustic holes (303, 304) are formed at the upper end and / or the lower end of the housing 220 of the electronic device 200. The acoustic holes (303, 304) include an upper acoustic hole 303 formed on the side surface of the upper end (e.g., the +Y direction in FIG. 4a) of the housing 220 and a lower acoustic hole 304 formed on the side surface of the lower end (e.g., the -Y direction in FIG. 4a) of the housing 220. The upper acoustic hole 303 and the lower acoustic hole 304 are respectively arranged at the central portions of the upper side surface and the lower side surface of the housing 220, and are symmetric with respect to each other with respect to the X axis in FIG. 4a. From the acoustic holes (303, 304), the sound generated by the speaker modules (301, 302) is radiated to the outside of the electronic device 200.

[0076] According to an embodiment, the upper pipeline 305 is connected to the upper speaker module 301 and the upper acoustic hole 303, and is a part of the upper speaker module 301. The upper pipeline 305 guides the sound output from the upper speaker module 301 to the upper acoustic hole 303. According to an embodiment, the lower pipeline 306 is connected to the lower speaker module 302 and the lower acoustic hole 304, and is a part of the lower speaker module 302. The lower pipeline 306 guides the sound output from the lower speaker module 302 to the lower acoustic hole 304. As shown in FIG. 4a, the lower pipeline 306 extends from the lower speaker module 302 in the direction of the lower acoustic hole 304 (for example, the -Y direction in FIG. 4a).

[0077] According to an embodiment, the user can take a self - portrait using the camera module 225. The foldable electronic device 200 can be folded so that it is easy to take a self - portrait using a specific camera. For example, referring to FIG. 2b, when taking a self - portrait using the camera module 225, the user folds the electronic device 200. So that the user can confirm the user's posture previewed on the display module 160 using the camera module 225 and easily adjust the shooting composition, the lens of the camera module 225 is arranged at the upper center of the display module 160.

[0078] In one embodiment, the display module 160 has a transparent region through which light can enter the lens of the camera module 225, and the lens faces this transparent region. Placing the lens at the center of the upper end of the display module 160 means that the transparent region of the display module 160 is located at the center of the upper end of the display module 160. In addition, the lens can be positioned at the center of the upper end with respect to the display module 160 in various other ways. On the other hand, by arranging the lens of the camera module 225 at the center of the display module 160, a symmetric design can be realized.

[0079] According to one embodiment, as shown in FIGS. 4a and 4b, when the upper speaker module 301 and the camera module 225 are arranged at the center of the upper end of the front surface 222 of the housing 220, an overlap may occur between the upper speaker module 301 and the camera module 225 in the Z-axis direction shown in FIG. 4b. To solve this, the shape of the upper pipe 305 connected to the upper speaker module 301 is changed. Details regarding this will be described later.

[0080] According to one embodiment, as shown in FIG. 4b, the camera module 225 and the upper speaker module 301 are arranged adjacent to each other at the center of the upper end of the housing 220. When arranged adjacent to each other, the upper speaker module 301 is arranged in a first direction (for example, the first direction in FIG. 4b) with respect to a line 310 extending in the longitudinal direction of the housing 220. The camera module 225 is arranged in a second direction (for example, the second direction in FIG. 4b) with respect to the line 310 extending in the longitudinal direction of the housing 220.

[0081] According to one embodiment, as shown in FIG. 4b, the first pipe (305-1) and the second pipe (305-2) inside the upper pipe 305 are connected. The first pipeline (305-1) inside the upper pipeline 305 is arranged in a first direction (for example, the first direction in FIG. 4b) with respect to a line 310 extending in the longitudinal direction of the housing 220. The second pipeline (305-2) inside the upper pipeline 305 is arranged in a second direction (for example, the second direction in FIG. 4b) with respect to a line 310 extending in the longitudinal direction of the housing 220. The first pipeline (305-1) extends from the upper speaker module 301 in the direction of the upper acoustic hole 303 (for example, the +Y direction in FIG. 4b). At least a part of the second pipeline (305-2) extends in a direction perpendicular to the extension direction of the first pipeline (305-1) (for example, the X-axis direction or the second direction in FIG. 4b).

[0082] According to an embodiment, as shown in FIG. 4b, the width W1 of the first pipeline (305-1) and the width W2 of the second pipeline (305-2) are different from each other. For example, the width W2 of the second pipeline (305-2) is smaller than the width W1 of the first pipeline (305-1). Here, the width W1 of the first pipeline (305-1) means the length in the Y-axis direction of the first pipeline (305-1) shown in FIG. 4b. Also, the width W2 of the second pipeline (305-2) means the length in the Y-axis direction of the second pipeline (305-2) shown in FIG. 4b. In the housing 220, at least a part of the camera module 225 is arranged at a portion corresponding to the difference between the width W1 of the first pipeline (305-1) and the width W2 of the second pipeline (305-2).

[0083] With such a shape of the upper pipeline 305, the upper pipeline 305 of the upper speaker module 301 and the camera module 225 are arranged at the upper center of the front surface 222 of the housing 220 without overlap. For example, as shown in FIGS. 4c and 4d, a part of the camera module 225 is arranged at a portion corresponding to the difference between the width W1 of the first pipeline (305-1) and the width W2 of the second pipeline (305-2). Therefore, when cutting along the C-C line in FIG. 4b, a part of the upper acoustic hole 303 may be hidden by a part of the camera module 225.

[0084] According to one embodiment, as shown in FIGS. 4a and 4c, the upper acoustic hole 303 and the lower acoustic hole 304 include at least one hole (303-1, 304-1). From the holes (303-1, 304-1), the sound generated by the speaker modules (301, 302) is radiated to the outside of the electronic device 200. The holes (303-1, 304-1) are arranged in a direction parallel to the direction in which the second pipeline (305-2) extends (for example, the X-axis direction in FIG. 4b).

[0085] The form, structure, and position of the housing 220, upper speaker module 301, upper pipeline 305, lower speaker module 302, lower pipeline 306, camera module 225, upper acoustic hole 303, and lower acoustic hole 304 shown in FIG. 4a are merely illustrative, and the housing 220, upper speaker module 301, upper pipeline 305, lower speaker module 302, lower pipeline 306, camera module 225, upper acoustic hole 303, and lower acoustic hole 304 described below are not limited to the form, structure, and position shown in FIG. 4a. The width W1 of the first pipeline (305-1) and the width W2 of the second pipeline (305-2) shown in FIG. 4b are merely illustrative and may be variously changed. Also, the form and number of the holes (303-1, 304-1) shown in FIGS. 4a to 4d are merely illustrative and may be variously changed.

[0086] FIG. 5a is a rear perspective view of a housing according to an embodiment of the present invention, FIG. 5b is a cross-sectional view of the housing cut along the A-A line in FIG. 4a, FIG. 5c is a plan view of a state in which a soundproof material is attached to an extension part according to an embodiment of the present invention, and FIG. 5d is a cross-sectional view of the soundproof material cut along the D-D line in FIG. 5c.

[0087] Here, the front surface 222 (e.g., the fourth surface 222 in FIG. 2a) of the housing 220 (e.g., the second housing 220 in FIG. 2a), which is the body of the electronic device 200 (e.g., the electronic device 101 in FIG. 1 or the electronic device 200 in FIG. 2a), is in the +Z direction of FIG. 5a, and the back surface 221 (e.g., the third surface 221 in FIG. 2a) is in the -Z direction of FIG. 5a. Also, hereinafter, the display module 160 is a concept including the display module 160 in FIG. 1, the first display 230 in FIG. 2a, or the second display 400 in FIG. 2a.

[0088] According to one embodiment, the extension portion 307 is formed at the upper end of the housing 220. An opening (307-1), which is a part of the extension portion 307, is formed at the upper end of the back surface 221 of the housing 220. The extension portion 307 means a space formed in the housing 220 from the back surface 221 to the front surface 222 of the housing 220 (e.g., the +Z direction in FIGS. 5a and 5b) through the opening (307-1). According to one embodiment, the upper end pipe 305 is formed through an opening (307-1), which is a part of the extension portion 307. The extension portion 307 means a space connecting the opening (307-1) and the upper end pipe 305.

[0089] According to one embodiment, as shown in FIGS. 5a and 5b, the extension portion 307 is formed in the upper end pipe 305. The smaller the volume of the upper end pipe 305, the lower the sound quality radiated from the upper end sound hole 303. According to one embodiment, the upper end pipe 305 is formed through the extension portion 307. Also, when the extension portion 307 is connected to the upper end pipe 305, the volume of the upper end pipe 305 increases by the volume of the space in which the extension portion 307 is formed, and the sound quality of the upper end pipe 305 is improved.

[0090] According to one embodiment, as shown in FIG. 5b, the guide surfaces (312-1, 312-2) are inclined so as to have a cross-sectional area that expands along the sound propagation direction (for example, the +Y direction in FIG. 5b) from the outlet 311 through which the sound generated by the upper speaker module 301 escapes. The first conduit (305-1) can secure additional space while expanding the cross-sectional area along the sound propagation direction.

[0091] According to one embodiment, as shown in FIG. 5b, the waterproof member 309 is attached to a partial end of the guide surfaces (312-1, 312-2). The waterproof member 309 protects the upper speaker module 301 from the liquid flowing in from the upper acoustic hole 303.

[0092] According to one embodiment, as shown in FIG. 5b, the soundproof material 309 is disposed in the opening (307-1). The soundproof material 309 closes the opening (307-1). The expansion part 307 is partitioned by the soundproof material 309. For example, the soundproof material 309 is attached to the opening (307-1) to close the opening (307-1). It is possible to prevent the sound generated by the speaker module 301 from being emitted from the opening (307-1). In addition, the soundproof material 309 can be disposed in the opening (307-1) in various ways. For example, the soundproof material 309 can be disposed in the opening (307-1) by a method such as soldering or bolt connection.

[0093] According to one embodiment, as shown in FIG. 5c, the soundproof material 309 has a form similar to that of the upper conduit 305 in FIG. 4a and is manufactured to have a larger area than the upper conduit 305. According to one embodiment, as shown in FIG. 5d, the soundproof material 309 can include two or more types of materials. For example, as shown in FIG. 5d, it can include a structure laminated in the order of an adhesive member 401 - an intermediate member 402 - a buffer member 403. One surface 404 of the intermediate member 402 of the soundproof material 309 closes the opening (307-1) by the adhesive member 401.

[0094] According to one embodiment, the adhesive member 401 is also attached to the other surface 405 of the buffer member 403. The other surface 405 of the buffer member 403 is attached to the display module 160 by the adhesive member 401. The buffer member 403 can mitigate the impact applied to the display module 160. According to one embodiment, the other surface 405 of the buffer member 403 is a rough surface. The adhesive member 401 is attached to the other surface 405 of the buffer member 403. When the adhesive member 401 is a thin film, the surface roughness of the surface attached to the display module 160 also increases. Therefore, the display module 160 can be held in a state where its position is fixed on the other surface 405 of the buffer member 403.

[0095] The extension part 307, the opening (307-1), and the soundproof material 309 shown in FIGS. 5a, 5b, and 5c are merely examples, and hereinafter, the extension part 307, the opening (307-1), and the soundproof material 309 are not limited to the forms and structures shown in FIGS. 5a, 5b, and 5c. The degree of inclination of the guide surfaces (312-1, 321-2) shown in FIG. 5b is an example, and the degree of inclination can be changed variously. The number and types of members constituting the soundproof material 309 shown in FIG. 5d are examples, and the adhesive member 401, the intermediate member 402, and the buffer member 403 can be changed variously.

[0096] FIG. 6 is a plan view of an electronic device in the form of a bar according to an embodiment of the present invention. According to one embodiment, the arrangement structure of the electronic device and the configuration of the electronic components shown in FIGS. 4a to 6 can also be applied to the electronic device in the form of a bar.

[0097] According to an embodiment of the present invention, as shown in FIG. 6, in an electronic device 200 (e.g., the electronic device 101 in FIG. 1, the electronic device 200 in FIG. 2a), on the front surface 222 (e.g., the fourth surface 222 in FIG. 2a) of a housing 220 (e.g., the second housing 220 in FIG. 2a), an upper speaker module 301 (e.g., the acoustic output module 155 in FIG. 1, the acoustic output device 228 in FIG. 2a), a lower speaker module 302 (e.g., the acoustic output module 155 in FIG. 1, the acoustic output device 228 in FIG. 2a), an upper pipeline 305, a lower pipeline 306, a camera module 225 (e.g., the camera module 180 in FIG. 1, the third camera module 225 in FIG. 2a), a printed circuit board 272 (e.g., the first printed circuit board 271 or the second printed circuit board 272 in FIG. 3), a battery 292 (e.g., the battery 189 in FIG. 1, the first battery 291 or the second battery 292 in FIG. 3), and a display module 160 (e.g., the display module 160 in FIG. 1, the first display 230 or the second display 400 in FIG. 2a) (not shown) are arranged. The housing 220 described below is a concept including a support member 262 (e.g., the second support member 262 in FIG. 3).

[0098] According to one embodiment, referring to FIG. 2b, the upper speaker module 301 is used as a receiver 227 for calls. During a call operation, the call sound of an incoming call is transmitted to the user through the upper speaker module 301. When the user holds the electronic device 200 to make a call, the user's ear is close to the upper central part of the electronic device 200. Therefore, the part where the call sound is emitted is located at the upper central part of the electronic device 200. For example, a receiver hole (not shown) through which the call sound generated by the upper speaker module 301 is emitted is formed at the upper center of the second back cover 250. Therefore, the upper speaker module 301 connected to the receiver hole is arranged at the upper center of the front surface 222 of the housing 220. According to other embodiments, the receiver 227 and the upper speaker module 301 may be separate components.

[0099] According to an embodiment, as shown in FIG. 6, the acoustic holes (303, 304) are formed at the upper end and / or the lower end of the housing 220 of the electronic device 200. The acoustic holes (303, 304) include an upper acoustic hole 303 formed on the side surface of the upper end of the housing 220 (for example, in the +Y direction in FIG. 6), and a lower acoustic hole 304 formed on the side surface of the lower end of the housing 220 (for example, in the -Y direction in FIG. 6). The upper acoustic hole 303 and the lower acoustic hole 304 are respectively disposed at the central portions of the side surfaces of the upper end and the lower end of the housing 220, and are symmetric with respect to the X axis in FIG. 6. Sound generated by the speaker modules (301, 302) is radiated to the outside of the electronic device 200 from the acoustic holes (303, 304).

[0100] According to an embodiment, the user can take a self-portrait using the camera module 225. The lens of the camera module 225 is disposed at the center of the upper end of the display module 160 so that the user can easily check the user's posture previewed on the display module 160 using the camera module 225 and adjust the shooting composition. In an embodiment, there is a transparent region on the display module 160 where light can enter the lens of the camera module 225, and the lens faces this transparent region. Placing the lens at the center of the upper end of the display module 160 means that the transparent region of the display module 160 is located at the center of the upper end of the display module 160. In addition, the lens can be positioned at the center of the upper end with respect to the display module 160 in various other ways. On the other hand, by disposing the lens of the camera module 225 at the center of the display module 160, a symmetric design can be realized.

[0101] According to an embodiment, as shown in FIG. 6, when the upper speaker module 301 and the camera module 225 are arranged at the center of the upper end of the front surface 222 of the housing 220, an overlap may occur between the upper speaker module 301 and the camera module 225 in the Z-axis direction shown in FIG. 4b. To solve this, the shape of the upper pipe 305 connected to the upper speaker module 301 is changed. Details regarding this will be described later.

[0102] According to an embodiment, as shown in FIG. 6, the width W2 of the second pipe (305-2) is smaller than the width W1 of the first pipe (305-1). Here, the width W1 of the first pipe (305-1) means the length in the Y-axis direction of the first pipe (305-1) shown in FIG. 6. Also, the width W2 of the second pipe (305-2) means the length in the Y-axis direction of the second pipe (305-2) shown in FIG. 6. At least a part of the camera module 225 is arranged in a portion corresponding to the difference between the width W1 of the first pipe (305-1) and the width W2 of the second pipe (305-2) in the housing 220. With such a shape of the upper pipe 305, the upper pipe 305 and the camera module 225 are arranged at the central portion of the upper end of the housing 220 without overlap.

[0103] According to an embodiment, the extension part 307 is formed at the upper end of the housing 220. An opening (307-1), which is a part of the extension part 307, is formed at the upper end of the back surface 221 of the housing 220 as shown in FIG. 5a. The extension part 307 means a space formed in the housing 220 from the back surface 221 to the front surface 222 of the housing 220 (for example, the +Z direction in FIGS. 5a and 5b) through the opening (307-1). In another embodiment, the opening (307-1) is formed at the upper end of the front surface 222 of the housing 220. The extension part 307 is formed in the housing 220 in the direction from the front surface 222 to the back surface 221 of the housing 220 (for example, the -Z direction in FIG. 5a) through the opening (307-1). The upper end pipe 305 is formed by the opening (307-1) which is a part of the extension part 307. The extension part 307 means a space connecting the opening (307-1) and the upper end pipe 305.

[0104] As shown in FIGS. 5a and 5b, the extension part 307 is formed in the upper end pipe 305. The smaller the volume of the upper end pipe 305 is, the more the sound quality radiated from the upper end acoustic hole 303 may deteriorate. According to one embodiment, the upper end pipe 305 is formed through the extension part 307. In addition, when the extension part 307 is connected to the upper end pipe 305, the volume of the upper end pipe 305 increases by the volume of the space in which the extension part 307 is formed, and the sound quality of the upper end pipe 305 is improved.

[0105] According to one embodiment, as shown in FIG. 5b, the guide surfaces (312-1, 312-2) are inclined so as to have a cross-sectional area expanded along the sound traveling direction (for example, the +Y direction in FIG. 5b) from the outlet 311 through which the sound generated by the upper end speaker module 301 escapes. The first pipe (305-1) can secure an additional space while the cross-sectional area is expanded along the sound traveling direction.

[0106] According to one embodiment, as shown in FIG. 5b, the waterproof member 309 is attached to a part of the end of the guide surfaces (312-1, 312-2). The waterproof member 309 protects the upper end speaker module 301 from the liquid flowing in from the upper end acoustic hole 303.

[0107] According to one embodiment, the opening (307-1) in FIG. 5b is formed in the back surface 221 of the housing 220 in FIG. 5a and is connected to the extension part 307. In other embodiments, the opening (307-1) is formed in the front surface 222 of the housing 220 and is connected to the extension part 307. The opening (307-1) is closed by the sound insulation material 309 in FIG. 5a. Therefore, it is possible to prevent the sound generated by the upper speaker module 301 from being emitted from the opening (307-1).

[0108] According to one embodiment, as shown in FIG. 5d, the sound insulation material 309 may include two or more kinds of materials. For example, as shown in FIG. 5d, it may include a structure laminated in the order of the adhesive member 401 - the intermediate member 402 - the buffer member 403. One surface 404 of the intermediate member 402 of the sound insulation material 309 closes the opening (307-1) by the adhesive member 401. According to one embodiment, the adhesive member 401 shown in FIG. 5d is also attached to the other surface 405 of the buffer member 403. The other surface 405 of the buffer member 403 is attached to the display module 160 by the adhesive member 401. The buffer member 403 can mitigate the impact applied to the display module 160.

[0109] According to one embodiment, the other surface 405 of the buffer member 403 may be a rough surface. The adhesive member 401 is attached to the other surface 405 of the buffer member 403. When the adhesive member 401 is a thin film, the surface roughness of the surface attached to the display module 160 also increases. Therefore, the display module 160 is held in a state where its position is fixed on the other surface 405 of the buffer member 403.

[0110] An electronic device according to an embodiment of the present invention (e.g., the electronic device 200 in FIG. 2a) includes a first housing (e.g., the second housing 220 in FIG. 2a), a display module (e.g., the first display 230 in FIG. 2a or the second display 400 in FIG. 2a) disposed on the front surface of the first housing (e.g., the front surface 222 in FIG. 4a), a camera module (e.g., the camera module 225 in FIG. 4a) disposed at the upper end of the first housing, a speaker module (e.g., the upper speaker module 301 in FIG. 4a) disposed on the first housing so as to be adjacent to the camera module, an acoustic hole (e.g., the upper acoustic hole 303 in FIG. 4a) formed on the side surface of the first housing so that the sound generated by the speaker module is emitted to the outside of the electronic device, a first pipe (e.g., the first pipe (305-1) in FIG. 4b) extending from the speaker module in the direction of the acoustic hole, and a second pipe (e.g., the second pipe (305-2) in FIG. 4b) extending in a direction perpendicular to the extending direction of the first pipe, and an expansion part (e.g., the expansion part 307 in FIG. 5a) formed in at least a part of the pipe for volume expansion of the pipe.

[0111] In addition, the speaker module may be disposed on the first housing in a first direction (e.g., the first direction in FIG. 4b) with respect to a straight line extending in the longitudinal direction of the display module through the acoustic hole, and the camera module may be disposed on the first housing in a second direction (e.g., the second direction in FIG. 4b) which is the opposite direction of the first direction with respect to the straight line.

[0112] In addition, the first pipe of the pipe may be located in the first direction with respect to the straight line, and the second pipe of the pipe may be located in the second direction with respect to the straight line. In addition, the second pipe may include a pipe that is relatively narrower than the first pipe. In addition, the acoustic hole may include at least one hole (e.g., the hole (303-1) in FIG. 4a), and at least one hole of the acoustic hole may be arranged in a direction parallel to the direction in which the second pipe extends. In addition, the first pipe may include a structure (e.g., the guide surfaces (312-1, 312-2) in FIG. 5b) inclined with respect to the radial direction of the acoustic hole. It further includes a second housing (e.g., the first housing 210 in FIG. 2a), and the first housing can be foldably connected to the second housing.

[0113] The display module also includes a first area (e.g., the second area 231b in FIG. 3) disposed in the first housing, a second area (e.g., the first area 231a in FIG. 3) disposed in the second housing, and a third area (e.g., the third area 231c in FIG. 3) connecting the first area and the second area. The third area of the display module can be formed such that at least a part thereof can be folded by folding the first housing with respect to the second housing.

[0114] The extension is connected to an opening (e.g., the opening (307-1) in FIG. 5b) formed in the back surface (e.g., the back surface 221 in FIG. 5a) of the first housing, and the electronic device may further include a soundproof material (e.g., the soundproof material 309 in FIG. 5b) disposed to close the opening. The soundproof material may include a buffer member (e.g., the buffer member 403 in FIG. 5d) at least in part.

[0115] An electronic device according to an embodiment of the present invention (e.g., the electronic device 200 in FIG. 2a) includes a first housing (e.g., the second housing 220 in FIG. 2a), a display module disposed on the front surface of the first housing (e.g., the front surface 222 in FIG. 4a) (e.g., the first display 230 in FIG. 2a or the second display 400 in FIG. 2a), a camera module disposed at the upper end of the first housing (e.g., the camera module 225 in FIG. 4a), an upper speaker module disposed at the upper end of the first housing adjacent to the camera module (e.g., the upper speaker module 301 in FIG. 4a), a lower speaker module disposed at the lower end of the first housing (e.g., the lower speaker module 302 in FIG. 4a), an upper acoustic hole formed on the side surface of the upper end of the first housing (e.g., the upper acoustic hole 303 in FIG. 4a), a lower acoustic hole formed on the side surface of the lower end of the first housing (e.g., the lower acoustic hole 304 in FIG. 4a), an upper pipeline including a first pipeline extending from the upper speaker module in the direction of the upper acoustic hole (e.g., the first pipeline (305-1) in FIG. 4b) and a second pipeline extending in a direction perpendicular to the extending direction of the first pipeline (e.g., the second pipeline (305-2) in FIG. 4b), a lower pipeline extending from the lower speaker module in the direction of the lower acoustic hole (e.g., the lower pipeline 306 in FIG. 4a), and an expansion part formed on at least a part of the upper pipeline for volume expansion of the upper pipeline (e.g., the expansion part 307 in FIG. 5a).

[0116] Further, the upper speaker module is disposed in the first housing in a first direction (e.g., the first direction in FIG. 4b) with respect to a straight line extending in the longitudinal direction of the display module through the upper acoustic hole, and the camera module may be disposed in the first housing in a second direction (e.g., the second direction in FIG. 4b), which is the opposite direction of the first direction, with respect to the straight line.

[0117] Also, the first pipeline of the upper pipeline is located in the first direction with respect to the straight line, and the second pipeline of the upper pipeline may be located in the second direction with respect to the straight line. Also, the second pipeline may be a relatively narrow pipeline compared to the first pipeline. Further, the upper acoustic hole and the lower acoustic hole each include at least one hole, and at least one hole of the upper acoustic hole and the lower acoustic hole (e.g., the holes (303-1, 304-1) in FIG. 4a) can be arranged in a direction parallel to the direction in which the second pipeline extends.

[0118] Further, the first pipeline may include a structure inclined with respect to the radiation direction of the upper acoustic hole (e.g., the guide surfaces (312-1, 312-2) in FIG. 5b). Further, it further includes a second housing (e.g., the first housing 210 in FIG. 2a), and the first housing may be foldably connected to the second housing.

[0119] Further, the display module includes a first area arranged in the first housing (e.g., the second area 231b in FIG. 3), a second area arranged in the second housing (e.g., the first area 231a in FIG. 3), and a third area connecting the first area and the second area (e.g., the third area 231c in FIG. 3). The third area of the display module may be formed such that at least a part thereof can be folded by folding the first housing with respect to the second housing.

[0120] Further, the extension part is connected to an opening formed on the back surface of the first housing (e.g., the opening (307-1) in FIG. 5b), and the electronic device may further include a soundproof material (e.g., the soundproof material 309 in FIG. 5b) arranged to close the opening. Further, the soundproof material may include a buffer member (e.g., the buffer member 403 in FIG. 5d) at least in part.

[0121] As described above, the embodiments of the present invention disclosed in this specification and the drawings are only specific examples presented to easily explain the technical content of the embodiments disclosed in this specification and to assist in understanding the embodiments disclosed in this specification, and are not intended to limit the scope of the embodiments of the present invention. Therefore, the scope of the embodiments disclosed in this specification should be construed to include, in addition to the embodiments disclosed herein, all changes or modified forms derived based on the technical idea of the embodiments disclosed herein within the scope of the embodiments disclosed herein.

Explanation of Signs

[0122] 100 Network environment 101, 102, 104, 200 Electronic device 108 Server 120 Processor 121 Main processor 123 Auxiliary processor 130 Memory 132 Volatile memory 134 Non-volatile memory 140 Program 142 Operating system 144 Middleware 146 Application 150 Input module 155 Acoustic output module 160 Display module 170 Audio module 176 Sensor module 177 Interface 178 Connection terminal 179 Haptic module 180 Camera module 188 Power management module 189 Battery 190 Communication module 192 Wireless communication module 194 Wired communication module 196 Subscriber identification module 197 Antenna module 198 First network 199 Second network 201 Recess 210 First housing 213 First side member 215 Input device 216a, 216b, 225, 282 Camera module 217a, 217b, 226, 281 Sensor module 218 Flash 219 Key input device 220 Second housing 223 Second side member 227, 228 Acoustic output device 229 Connector 230, 400 Display 230a First region 230b Second region 230c Folding region 240 First back cover 250 Second back cover 260 Support member assembly 261 First support member 262 Second support member 263 Wiring member 264 Hinge device 265 Hinge cover 270 Printed circuit board 271 First printed circuit board 272 Second printed circuit board 291 First battery 292 Second battery 301 Upper speaker module 302 Lower speaker module 303, 304 Acoustic holes 303-1, 304-1 Hole 305 Upper pipeline 305-1 First pipeline 305-2 Second pipeline 306 Lower pipeline 2611 First swelling hole 2621 Second swelling hole

Claims

1. An electronic device, comprising: a first housing; a display module disposed on the front surface of the first housing; a camera module disposed at the upper end of the first housing; an upper speaker module disposed at the upper end of the first housing adjacent to the camera module; an upper acoustic hole formed on a side surface of the upper end of the first housing so that sound generated by the upper speaker module is emitted to the outside of the electronic device; an upper pipeline including a first pipeline extending from the upper speaker module in the direction of the upper acoustic hole and a second pipeline extending in a direction perpendicular to the extending direction of the first pipeline; an expansion part formed on at least a part of the upper pipeline for expanding the volume of the upper pipeline; wherein the upper speaker module is disposed on a first direction side perpendicular to a straight line extending in the longitudinal direction of the display module through the upper acoustic hole of the first housing; wherein the camera module is disposed on a second direction side opposite to the first direction of a straight line extending in the longitudinal direction of the display module through the upper acoustic hole of the first housing; wherein the first pipeline of the upper pipeline is located in the first direction with respect to the straight line; wherein the second pipeline of the upper pipeline is located in the second direction with respect to the straight line. An electronic device characterized by this.

2. The electronic device according to claim 1, wherein the second pipeline is a pipeline having a relatively smaller inner diameter than the first pipeline.

3. The upper acoustic hole includes at least one hole, The electronic device according to claim 1, wherein at least one hole of the upper acoustic hole is arranged in a direction parallel to the direction in which the second pipeline extends.

4. The electronic device according to claim 1, wherein the first pipeline includes a structure inclined with respect to the radial direction of the upper acoustic hole.

5. further comprising a second housing, The electronic device according to claim 1, wherein the first housing is foldably connected to the second housing.

6. The display module includes a first area disposed in the first housing, a second area disposed in the second housing, and a third area connecting the first area and the second area. The electronic device according to claim 5, wherein at least a part of the third region of the display module is formed to be foldable by folding the first housing with respect to the second housing.

7. The extension part is connected to an opening formed on the back surface of the first housing, The electronic device according to claim 1, further comprising a soundproof material disposed to close the opening.

8. The electronic device according to claim 7, wherein the soundproof material includes a buffer member at least in part.

9. A lower speaker module disposed at a lower end of the first housing, A lower acoustic hole formed on a side surface of the lower end of the first housing, The electronic device according to claim 1, further comprising a lower pipe extending from the lower speaker module in a direction of the lower acoustic hole.

10. The lower acoustic hole includes at least one hole, The electronic device according to claim 9, wherein at least one hole of the lower acoustic hole is arranged in a direction parallel to a direction in which the second pipe extends.

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