Head Chip, Liquid Jetting Head, Liquid Jetting Recording Apparatus, and Method for Manufacturing Head Chip

Abstract

To provide a head chip that is suppressed from deteriorating in a printing quality.SOLUTION: The head chip comprises an intermediate plate 52 having, for each channel row, a plurality of rows of communication hole groups 136 and 137 in which communication holes 130 individually communicating with discharge channel 75 of an actuator plate 53 are arranged in line in an X-direction. The communication holes 130 made adjacent to each other in the X-direction are arranged to deviate from each other in a Y-direction. The intermediate plate 52 is provided with a non-penetration groove 150 blocked with a nozzle plate and a penetration hole 160 communicating with the non-penetration hole 150 and communicating with the outside of the head chip through a non-discharge channel 76. Portions of the non-penetration hole 150 are positioned at areas 138 and 139 between the communication holes. Minimum intervals G1 in the X-direction between opening edges 130a of the communication holes 130 and the non-penetration groove 150, in the areas 138 and 139 between the communication holes are larger than minimum intervals G2 in the X-direction between the opening edges 130a of the communication holes 130 and the non-discharge channel 76.SELECTED DRAWING: Figure 10

Description

Technical Field

[0001] The present disclosure relates to a head chip, a liquid ejection head, a liquid ejection recording apparatus, and a method for manufacturing a head chip.

Background Art

[0002] An inkjet head mounted on an inkjet printer ejects ink onto a recording medium through a head chip mounted on the inkjet head. The head chip includes an actuator plate in which ejection channels and non-ejection channels are alternately formed, and a nozzle plate joined to the actuator plate and having nozzle holes formed at positions corresponding to the ejection channels for ejecting the ink accommodated in the ejection channels.

[0003] In recent years, due to the progress of channel grooving, the allowable range of misalignment between the actuator plate and the nozzle plate has become smaller. Specifically, if the position of the nozzle plate with respect to the actuator plate is displaced in the width direction of the channel, a part of the opening of the nozzle hole on the channel side may be blocked by the wall between the channels. When a part of the opening of the nozzle hole on the channel side is blocked, the supply of ink to the nozzle hole is inhibited. As a result, the ejection characteristics of the ink may deteriorate.

[0004] Patent Document 1 below discloses a configuration in which an intermediate plate having through holes communicating with both the ejection channels and the nozzle holes is disposed between the actuator plate and the nozzle plate, and the through holes are formed larger than the ejection channels and the nozzle holes in the width direction of the ejection channels. According to this configuration, misalignment between the actuator plate and the nozzle plate is allowed within a range where the nozzle holes are not blocked by the intermediate plate, so that it is possible to suppress the supply of ink to the nozzle holes from being inhibited.

Prior Art Documents

Patent Documents

[0005] Japanese Patent Application Laid-Open No. 2019-42979 Japanese Patent Application Laid-Open No. 2019-42979 SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION

[0006] By the way, if there is a joint failure at the joint between the intermediate plate and the nozzle plate, the discharge channels may communicate with each other through the joint failure part. When the discharge channels communicate with each other, pressure may be propagated through the joint failure part during ink discharge, and deflection of the ink ejection direction may be induced. As a result, the print quality may deteriorate. However, when the nozzle plate is formed of an opaque material such as a metal material, it has been difficult to optically detect the joint failure between the nozzle plate and the intermediate plate.

[0007] Therefore, the present disclosure provides a head chip, a liquid ejection head, a liquid ejection recording apparatus, and a method for manufacturing a head chip in which a decrease in print quality due to a joint failure between an ejection hole plate and an intermediate plate is suppressed. MEANS FOR SOLVING THE PROBLEMS

[0008] In order to solve the above problems, the present disclosure adopts the following aspects. (1) The head chip according to one aspect of the present disclosure is a head chip that injects liquid, and includes an actuator plate having a channel array in which injection channels and non-injection channels extending in a first direction are alternately arranged in a second direction intersecting the first direction so as to overlap each other in the first direction, an intermediate plate that is superposed on the actuator plate and has a plurality of rows of communication hole groups in which communication holes individually communicating with the injection channels are arranged in a line in the second direction for each channel array, and an injection hole plate that is superposed on the intermediate plate on the side opposite to the actuator plate and has injection holes formed by individually communicating with the communication holes and injecting the liquid accommodated in the injection channels. Among the communication holes included in the plurality of rows of communication hole groups, the adjacent communication holes in the second direction are arranged so as to be displaced from each other in the first direction. In the intermediate plate, a non-through groove that opens on the surface on the injection hole plate side and is blocked by the injection hole plate, and a through hole that communicates with the non-through groove and communicates with the outside of the head chip through the non-injection channel are formed. When a region between the opening edges of a pair of adjacent communication holes in a predetermined communication hole group is defined as an inter-communication hole region among the surfaces of the intermediate plate on the injection hole plate side, a part of the non-through groove is located in the inter-communication hole region, and a minimum distance in the second direction between the opening edge of the communication hole and the non-through groove in the inter-communication hole region is larger than a minimum distance in the second direction between the opening edge of the communication hole and the non-injection channel.

[0009] According to this aspect, when a joint failure portion between the intermediate plate and the injection hole plate is connected to the communication hole and the non-penetrating groove of the intermediate plate, the communication hole and the non-penetrating groove communicate with each other through the joint failure portion. As a result, the injection channel and the through hole of the intermediate plate communicate with each other. Since the through hole communicates with the outside of the head chip through the non-injection channel, by detecting a leak when the injection hole is blocked and the injection channel is evacuated, the through hole and the non-penetrating groove can function as a leak detection flow path connecting the joint failure portion and the non-injection channel, and the presence of the joint failure portion can be detected. In particular, since the non-penetrating groove is located in the region between the communication holes, the joint failure portion in the region between the communication holes can be efficiently detected. Moreover, since the non-penetrating groove does not open to the actuator plate side, the degree of freedom in the shape of the leak detection flow path can be improved as compared with a configuration in which the leak detection flow path is formed only by the through hole. And since the communication holes adjacent to each other in the second direction are displaced in the first direction, when focusing on a pair of communication holes adjacent to each other in the second direction, unlike a configuration in which they are arranged in a line in the second direction, even if the minimum distance between the non-penetrating groove and the opening edge of one of the communication holes is made larger than the minimum distance from the non-injection channel, it is possible to suppress the non-penetrating groove from approaching the other communication hole. Thereby, since the width in the second direction at the joint portion between the intermediate plate and the injection hole plate can be expanded, the intermediate plate and the injection hole plate can be bonded more reliably. As described above, while suppressing a decrease in the bonding allowance of the intermediate plate and the injection hole plate due to the provision of the non-penetrating groove, it is possible to detect a joint failure between the intermediate plate and the injection hole plate and suppress a decrease in printing quality caused by the joint failure.

[0010] (2) In the head chip according to the aspect (1) above, the non-penetrating groove may extend over the entire length in the first direction in the region between the communication holes.

[0011] According to this aspect, the non-penetrating groove is provided on the shortest path connecting a pair of communication holes sandwiching the region between the communication holes. Thereby, at a location where hydraulic pressure is likely to be applied, it is possible to detect a joint failure that can induce an unintentional communication between the injection channels.

[0012] (3) In the head chip according to the aspect of (1) or (2) above, the non-penetrating groove may extend from one communication hole region corresponding to each of a pair of adjacent communication hole groups in the first direction to the other communication hole region.

[0013] According to this aspect, a non-penetrating groove is provided on the shortest path connecting a pair of adjacent communication holes in the second direction. Thereby, in a portion where hydraulic pressure is likely to be applied, it is possible to detect a bonding defect that can induce an unintended communication between the injection channels.

[0014] (4) In the head chip according to any one of the aspects (1) to (3) above, the non-penetrating groove may extend linearly over the entire length.

[0015] According to this aspect, since no bent portion is formed, the non-penetrating groove can be formed uniformly over the entire length, and it is possible to suppress the occurrence of unintended penetration or the like during the formation of the non-penetrating groove.

[0016] (5) In the head chip according to any one of the aspects (1) to (3) above, the non-penetrating groove may extend linearly in the first direction in the communication hole region.

[0017] According to this aspect, compared with the case where the non-penetrating groove extends in a direction inclined with respect to the first direction in the communication hole region, the minimum distance between the non-penetrating groove and both of a pair of communication holes sandwiching the communication hole region can be increased. Therefore, the width in the second direction at the joint between the intermediate plate and the injection hole plate can be expanded.

[0018] (6) A liquid injection head according to an aspect of the present disclosure includes a head chip according to any one of the aspects (1) to (5) above.

[0019] According to this aspect, since it includes a head chip according to any one of the above aspects, it is possible to provide a liquid injection head having excellent printing quality.

[0020] (7) The liquid ejection recording apparatus according to one aspect of the present disclosure includes the liquid ejection head according to the aspect (6) above.

[0021] According to this aspect, since the liquid ejection head according to the above aspect is provided, a liquid ejection recording apparatus excellent in printing quality can be provided.

[0022] (8) A method for manufacturing a head chip according to one aspect of the present disclosure includes an actuator plate having a channel array in which injection channels and non-injection channels extending in a first direction are alternately arranged in a second direction intersecting the first direction so as to overlap each other in the first direction, an intermediate plate that is superposed on the actuator plate and has a plurality of rows of communication hole groups in which communication holes individually communicating with the injection channels are arranged in a line in the second direction for each channel array, and an injection hole plate that is superposed on the intermediate plate on the side opposite to the actuator plate and has injection holes formed by individually communicating with the communication holes and ejecting the liquid accommodated in the injection channels. A method for manufacturing a head chip in which the adjacent communication holes in the second direction among the communication holes included in the plurality of rows of communication hole groups are arranged so as to be displaced from each other in the first direction, the method including a non-through groove forming step of forming a non-through groove that opens on the surface on the injection hole plate side of the intermediate plate and is blocked by the injection hole plate, and a through hole forming step of forming a through hole that communicates with the non-through groove and communicates with the outside of the head chip through the non-injection channel in the intermediate plate. When a region between the opening edges of a pair of adjacent communication holes in a predetermined communication hole group among the surfaces of the intermediate plate on the injection hole plate side is defined as an inter-communication hole region, in the non-through groove forming step, a part of the non-through groove is formed in the inter-communication hole region, and the minimum distance in the second direction between the opening edge of the communication hole and the non-through groove in the inter-communication hole region is set to be larger than the minimum distance in the second direction between the opening edge of the communication hole and the non-injection channel.

[0023] (9) In the method for manufacturing a head chip according to the aspect (8) above, further comprising an intermediate plate joining step of joining the intermediate plate to the actuator plate, the through-hole forming step may be performed after the intermediate plate joining step.

[0024] According to this aspect, regardless of the alignment accuracy between the actuator plate and the intermediate plate, a through-hole can be formed at a desired position with respect to the non-injection channel in the through-hole forming step. Therefore, in a head chip including an intermediate plate in which a through-hole communicating with the non-injection channel is formed, the yield during manufacturing can be improved. The positional accuracy between the non-injection channel and the through-hole can be improved.

[0025] (10) In the method for manufacturing a head chip according to the aspect (8) or (9) above, comprising an intermediate plate joining step of joining the intermediate plate to the actuator plate, the intermediate plate joining step may be performed after the non-through groove forming step.

[0026] According to this aspect, the step of forming a non-through groove in the intermediate plate can be performed in parallel with a step before the intermediate plate joining step in head chip manufacturing. Therefore, the manufacturing period of the head chip can be shortened.

Effect of the Invention

[0027] According to one aspect of the present disclosure, a decrease in printing quality can be suppressed.

Brief Description of the Drawings

[0028]

Figure 1

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Figure 8

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Figure 10

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Figure 14

Figure 15

[0029] Hereinafter, embodiments according to the present disclosure will be described with reference to the drawings. In the following description, the same reference numerals are given to configurations having the same or similar functions. And redundant descriptions of those configurations may be omitted.

[0030] [Embodiment] <Printer> The printer 1 common to each embodiment will be described. FIG. 1 is a schematic configuration diagram of the printer of the embodiment. As shown in FIG. 1, the printer (liquid ejection recording apparatus) 1 of the present embodiment includes a pair of conveyance mechanisms 2 and 3, an ink tank 4, an inkjet head (liquid ejection head) 5, an ink circulation mechanism 6, and a scanning mechanism 7.

[0031] In the following description, the orthogonal coordinate system of X, Y, and Z will be used as necessary. In this case, the X direction (second direction) coincides with the conveyance direction (sub-scanning direction) of the recording medium P (for example, paper or the like). The Y direction (first direction) coincides with the scanning direction (main scanning direction) of the scanning mechanism 7. The Z direction indicates the height direction (vertical direction) orthogonal to the X direction and the Y direction. In the following description, among the X direction, Y direction, and Z direction, the side of the arrow in the figure is defined as the plus (+) side, and the side opposite to the arrow is defined as the minus (-) side. In the present embodiment, the +Z side corresponds to the upper side in the vertical direction, and the -Z side corresponds to the lower side in the vertical direction.

[0032] The conveyance mechanisms 2 and 3 convey the recording medium P to the +X side. The conveyance mechanisms 2 and 3 each include, for example, a pair of rollers 11 and 12 extending in the Y direction. The ink tank 4 stores, for example, four colors of ink: yellow, magenta, cyan, and black separately. Each inkjet head 5 is configured to be able to eject the four colors of ink: yellow, magenta, cyan, and black, respectively, according to the connected ink tank 4. Note that the ink stored in the ink tank 4 may be conductive ink or non-conductive ink.

[0033] FIG. 2 is a schematic configuration diagram of the inkjet head and the ink circulation mechanism of the embodiment. As shown in FIGS. 1 and 2, the ink circulation mechanism 6 circulates ink between the ink tank 4 and the inkjet head 5. Specifically, the ink circulation mechanism 6 includes a circulation flow path 23 having an ink supply pipe 21 and an ink discharge pipe 22, a pressure pump 24 connected to the ink supply pipe 21, and a suction pump 25 connected to the ink discharge pipe 22.

[0034] The pressure pump 24 pressurizes the inside of the ink supply pipe 21 and sends the ink out to the inkjet head 5 through the ink supply pipe 21. As a result, the ink supply pipe 21 side is at a positive pressure with respect to the inkjet head 5.

[0035] The suction pump 25 reduces the pressure inside the ink discharge pipe 22 and sucks ink from the inkjet head 5 through the ink discharge pipe 22. As a result, the side of the ink discharge pipe 22 with respect to the inkjet head 5 is under negative pressure. The ink can circulate between the inkjet head 5 and the ink tank 4 through the circulation channel 23 by driving the pressure pump 24 and the suction pump 25.

[0036] The scanning mechanism 7 reciprocally scans the inkjet head 5 in the Y direction. The scanning mechanism 7 includes a guide rail 28 extending in the Y direction and a carriage 29 movably supported by the guide rail 28.

[0037] As shown in FIG. 1, the inkjet head 5 is mounted on the carriage 29. In the illustrated example, a plurality of inkjet heads 5 are mounted side by side in the Y direction on one carriage 29. The inkjet head 5 includes a head chip 50 (see FIG. 3), an ink supply unit (not shown) connecting the ink circulation mechanism 6 and the head chip 50, and a control unit (not shown) applying a driving voltage to the head chip 50.

[0038] [First Embodiment] <Head Chip> The head chip 50 of the first embodiment will be described. FIG. 3 is a perspective view of the head chip of the first embodiment as viewed from the -Z side with the nozzle plate and the intermediate plate removed. FIG. 4 is an exploded perspective view of the head chip of the first embodiment. The head chip 50 shown in FIGS. 3 and 4 is a so-called circulating side-shoot type head chip that circulates ink with the ink tank 4 and discharges ink from the central portion in the extending direction (Y direction) of the discharge channel 75 described later. The head chip 50 includes a nozzle plate (jet hole plate) 51 (see FIG. 4), an intermediate plate 52 (see FIG. 4), an actuator plate 53, and a cover plate 54. The head chip 50 has a configuration in which the nozzle plate 51, the intermediate plate 52, the actuator plate 53, and the cover plate 54 are laminated in the Z direction in this order. In the following description, in the Z direction, the direction from the nozzle plate 51 toward the cover plate 54 (+Z side) may be described as the back side, and the direction from the cover plate 54 toward the nozzle plate 51 (−Z side) may be described as the front side.

[0039] The actuator plate 53 is formed of a piezoelectric material such as PZT (lead zirconate titanate). The actuator plate 53 is, for example, a so-called Chevron substrate formed by laminating two piezoelectric plates having different polarization directions in the Z direction. However, the actuator plate 53 may be a so-called monopole substrate in which the polarization direction is unidirectional throughout the Z direction. A channel row 61 is formed in the actuator plate 53. The channel row 61 extends in the X direction.

[0040] FIG. 5 is a bottom view of the actuator plate of the first embodiment. As shown in FIG. 5, the channel row 61 has a discharge channel (injection channel) 75 filled with ink and a non-discharge channel (non-injection channel) 76 not filled with ink. Each of the channels 75 and 76 extends linearly in the Y direction in a plan view seen from the Z direction. The channels 75 and 76 are alternately arranged at intervals in the X direction so as to overlap each other in the Y direction. Among the actuator plates 53, the portion located between the discharge channel 75 and the non-discharge channel 76 constitutes a drive wall 70 (see FIG. 4) that partitions between the discharge channel 75 and the non-discharge channel 76 in the X direction. In the present embodiment, a configuration in which the channel extending direction coincides with the Y direction will be described, but the channel extending direction may intersect the Y direction.

[0041] FIG. 6 is a cross-sectional view of the head tip corresponding to the line VI-VI in FIG. 5. As shown in FIG. 6, the discharge channel 75 is formed in a convex curved shape toward the surface side in a side view seen from the X direction. The discharge channel 75 is formed, for example, by causing a disk-shaped dicing cutter to enter from the back side (+Z side) of the actuator plate 53. Specifically, the discharge channel 75 has rising portions 75a located at both ends in the Y direction and a discharge-side through portion 75b located between the rising portions 75a.

[0042] The rising portion 75a is, for example, in an arc shape with a uniform radius of curvature that extends following the radius of curvature of the dicing cutter when viewed from the X direction. The rising portion 75a extends while curving toward the back side as it moves away from the discharge-side through portion 75b in the Y direction. The discharge-side through portion 75b penetrates the actuator plate 53 in the Z direction.

[0043] FIG. 7 is a cross-sectional view of the head tip corresponding to the line VII-VII in FIG. 5. As shown in FIG. 7, the non-discharge channel 76 is adjacent to the discharge channel 75 in the X direction with the drive wall 70 interposed therebetween. The non-discharge channel 76 is formed, for example, by inserting a disk-shaped dicing saw from the back side (+Z side) of the actuator plate 53. The non-discharge channel 76 includes a non-discharge side through portion 76a and a rising portion 76b.

[0044] The non-discharge side through portion 76a penetrates the actuator plate 53 in the Z direction. That is, the non-discharge side through portion 76a is formed with a uniform groove depth in the Z direction. The non-discharge side through portion 76a constitutes a portion of the non-discharge channel 76 other than the +Y side end portion.

[0045] The rising portion 76b constitutes the +Y side end portion of the non-discharge channel 76. The rising portion 76b is, for example, an arc shape with a uniform radius of curvature that extends following the radius of curvature of the dicing saw when viewed in the X direction. The rising portion 76b extends while curving toward the back side as it moves away from the non-discharge side through portion 76a in the Y direction. The non-discharge side through portion 76a of the non-discharge channel 76 penetrates the actuator plate 53 in the Y direction and the Z direction and opens to the side surface facing the -Y side of the actuator plate 53. Thereby, the non-discharge channel 76 communicates with the outside of the head chip 50.

[0046] FIG. 8 is a cross-sectional view taken along line VIII-VIII of FIG. 4. As shown in FIG. 8, common electrodes 95 are respectively formed on the inner surfaces extending in the Y direction of the discharge channels 75 (the inner side surfaces of the drive wall 70 facing the respective discharge channels 75). The common electrodes 95 are formed over the entire Z direction on the inner side surfaces of the discharge channels 75. The length of the common electrodes 95 in the Y direction is made equal to that of the discharge side through portion 75b of the discharge channels 75 (equal to the opening length of the discharge channels 75 on the surface of the actuator plate 53).

[0047] On the inner surface 76c extending in the Y direction of the non-discharge channel 76 (the inner surface of the drive wall 70 facing each non-discharge channel 76), individual electrodes 97 are formed. The individual electrodes 97 are formed over the entire region in the Z direction on the inner surface of the non-discharge channel 76.

[0048] As shown in FIG. 5, a plurality of common terminals 96 are formed on the surface of the actuator plate 53. The common terminals 96 are in the form of strips extending parallel to each other along the Y direction. Each common terminal 96 is connected to a pair of common electrodes 95 at the opening edge of the corresponding discharge channel 75, respectively.

[0049] On the surface of the actuator plate 53, individual terminals 98 are formed in a portion located in the -Y direction from the common terminals 96. The individual terminals 98 are in the form of strips extending in the X direction. The individual terminals 98 connect the individual electrodes 97 facing each other in the X direction with the discharge channel 75 interposed therebetween at the opening edges of the non-discharge channels 76 facing each other in the X direction with the discharge channel 75 interposed therebetween. Note that a partition groove 99 is formed in the portion located between the common terminals 96 and the individual terminals 98. The partition groove 99 extends in the X direction. The partition groove 99 separates the common terminals 96 and the individual terminals 98.

[0050] As shown in FIG. 6, a flexible printed circuit board 100 is pressure-bonded to the surface of the actuator plate 53. The flexible printed circuit board 100 is connected to the common terminals 96 and the individual terminals 98 corresponding to the channel row 61. The flexible printed circuit board 100 is drawn out from the -Y side of the actuator plate 53 to the +Z side.

[0051] As shown in FIGS. 3 and 4, the cover plate 54 is adhered to the back surface of the actuator plate 53 so as to close the channel row 61. In the cover plate 54, an inlet common ink chamber 120 and an outlet common ink chamber 121 are formed at positions corresponding to the channel row 61.

[0052] The inlet common ink chamber 120 is formed at a position overlapping the +Y side end of the discharge channel 75 in the channel row 61 in plan view. The inlet common ink chamber 120 extends in the X direction with a length spanning the channel row 61 and opens on the back surface of the cover plate 54.

[0053] The outlet common ink chamber 121 is formed at a position overlapping the -Y side end of the discharge channel 75 in the channel row 61 in plan view. The inlet common ink chamber 120 extends in the X direction with a length spanning the channel row 61 and opens on the back surface of the cover plate 54.

[0054] In the inlet common ink chamber 120, an inlet slit 125 is formed at a position corresponding to the discharge channel 75 of the channel row 61. The inlet slit 125 separately communicates between the +Y side end of each discharge channel 75 and the inside of the inlet common ink chamber 120.

[0055] In the outlet common ink chamber 121, an outlet slit 126 is formed at a position corresponding to the discharge channel 75 of the channel row 61. The outlet slit 126 separately communicates between the -Y side end of each discharge channel 75 and the inside of the outlet common ink chamber 121. Therefore, the inlet slit 125 and the outlet slit 126 each communicate with each discharge channel 75, but do not communicate with the non-discharge channel 76.

[0056] The intermediate plate 52 is joined to the surface of the actuator plate 53 so as to block the channel row 61. The intermediate plate 52 is formed of a piezoelectric material such as PZT, similar to the actuator plate 53. For example, the intermediate plate 52 is thinner than the actuator plate 53 in the Z direction. The intermediate plate 52 has a shorter dimension in the Y direction than the actuator plate 53. Therefore, at the -Y direction with respect to the intermediate plate 52, the -Y direction end portion of the actuator plate 53 is exposed. At the -Y direction end portion of the actuator plate 53, the portion exposed from the intermediate plate 52 functions as a crimping region of the flexible printed circuit board 100. Note that the intermediate plate 52 may be formed of a material other than the piezoelectric material (for example, a non-conductive material such as polyimide or alumina).

[0057] FIG. 9 is a bottom view of the intermediate plate and the actuator plate of the first embodiment. As shown in FIG. 9, communication holes 130, non-through grooves 150, and through holes 160 are formed in the intermediate plate 52 corresponding to the channel row 61.

[0058] The communication holes 130 overlap the discharge-side through portions 75b of the respective discharge channels 75 in a plan view. The communication holes 130 communicate individually with the discharge-side through portions 75b of the corresponding discharge channels 75 on the surface side of the actuator plate 53. The communication holes 130 include a groove portion 133 and a through portion 134. The groove portion 133 is recessed from the surface of the intermediate plate 52 and extends in the Y direction. The through portion 134 penetrates the intermediate plate 52 and communicates with the groove portion 133. In the present embodiment, the dimension of the through portion 134 in the X direction is smaller than the dimension of the groove portion 133 in the X direction. The through portion 134 overlaps the center in the X direction of the groove portion 133 in a plan view and protrudes on both sides in the Y direction from the groove portion 133.

[0059] The communication holes 130 have two rows of communication hole groups 136 and 137 arranged in a line in the X direction. Among the two rows of communication hole groups 136 and 137, the communication hole group located on the +Y direction side is defined as the first communication hole group 136, and the communication holes 130 included in the first communication hole group 136 are referred to as the first communication holes 131. Among the two rows of communication hole groups 136 and 137, the communication hole group located on the -Y direction side is defined as the second communication hole group 137, and the communication holes 130 included in the second communication hole group 137 are referred to as the second communication holes 132. Among the communication holes 130 included in the two rows of communication hole groups 136 and 137, a pair of adjacent communication holes 130 in the X direction are arranged so as to be displaced from each other in the Y direction. Thereby, the communication holes 130 included in the two rows of communication hole groups 136 and 137 are arranged in a staggered pattern. Note that a pair of adjacent communication holes 130 in the X direction are communication holes 130 that are adjacent to each other in the X direction regardless of their positional relationship in the Y direction. That is, in the configuration in which the communication holes 130 of the present embodiment are arranged in a staggered pattern, a pair of adjacent communication holes 130 in the X direction are the first communication holes 131 and the second communication holes 132, and are adjacent to each other in the Y direction.

[0060] Here, communication hole regions 138 and 139 are defined on the surface of the intermediate plate 52. The communication hole regions 138 and 139 are regions between the opening edges 130a of a pair of adjacent communication holes 130 in each of the communication hole groups 136 and 137. That is, the communication hole regions 138 and 139 are the first communication hole region 138 between the opening edges 130a of a pair of adjacent first communication holes 131 and the second communication hole region 139 between the opening edges 130a of a pair of adjacent second communication holes 132.

[0061] The non-through groove 150 opens only on the surface of the intermediate plate 52. A part of the non-through groove 150 is located between a pair of adjacent communication holes 130 in the X direction. The non-through groove 150 overlaps the non-discharge channel 76 in a plan view. A part of the non-through groove 150 is located in the communication hole between regions 138 and 139. The non-through groove 150 extends from between a pair of adjacent communication holes 130 in the X direction to the first communication hole between region 138 and the second communication hole between region 139, respectively. The non-through groove 150 extends continuously from the first communication hole between region 138 to the second communication hole between region 139. The non-through groove 150 extends over the entire length in the Y direction in the communication hole between regions 138 and 139, respectively. The non-through groove 150 protrudes in the +Y direction more than the first communication hole between region 138 and protrudes in the -Y direction more than the second communication hole between region 139. The non-through groove 150 extends linearly with a constant width over the entire length. The non-through groove 150 extends inclined with respect to the Y direction in a plan view.

[0062] Figure 10 is a view showing an enlarged part of Figure 9. As shown in Figure 10, each non-through groove 150 is formed to satisfy the following conditions with respect to the surrounding communication holes 130. When paying attention to any non-through groove 150, the minimum distance G1 in the X direction between the non-through groove 150 and the opening edge 130a of the communication hole 130 in each of the communication hole between regions 138 and 139 is larger than the minimum distance G2 in the X direction between the opening edge 130a of the communication hole 130 and the non-discharge channel 76. Specifically, the minimum distance G11 in the X direction between the non-through groove 150 and the opening edge 130a of the first communication hole 131 in the first communication hole between region 138 is larger than the minimum distance G21 in the X direction between the opening edge 130a of the first communication hole 131 and the non-discharge channel 76. Also, the minimum distance G12 in the X direction between the non-through groove 150 and the opening edge 130a of the second communication hole 132 in the second communication hole between region 139 is larger than the minimum distance G22 in the X direction between the opening edge 130a of the second communication hole 132 and the non-discharge channel 76. The minimum distance in the X direction in the present embodiment is the distance between the two structures at the position in the Y direction where the distance in the X direction between the two target structures is the smallest.

[0063] As shown in FIG. 9, the through-hole 160 penetrates the intermediate plate 52 in the Z direction. The through-hole 160 does not overlap the regions 138 and 139 between the communication holes in a plan view. The through-hole 160 opens into the non-through groove 150 and communicates with the non-through groove 150. The through-hole 160 overlaps with the non-discharge side through portions 76a of the respective non-discharge channels 76 in a plan view. The through-hole 160 communicates with the non-discharge side through portions 76a of the corresponding non-discharge channels 76 on the surface side of the actuator plate 53. Thereby, the through-hole 160 communicates with the outside of the head chip 50 through the non-discharge channel 76. In the illustrated example, the through-hole 160 is formed in a circular shape in a plan view, but the shape of the through-hole 160 is not particularly limited, and it may be formed in a rectangular shape, an oval shape, or the like in a plan view, for example.

[0064] As shown in FIG. 4, the nozzle plate 51 is joined to the surface of the intermediate plate 52. The width of the nozzle plate 51 in the Y direction is the same as that of the intermediate plate 52. In the present embodiment, the nozzle plate 51 is formed of a metal material of stainless steel (such as stainless steel or Ni-Pd). However, the nozzle plate 51 may have a single-layer structure or a laminated structure made of a resin material such as polyimide, or glass, silicon, or the like, in addition to the metal material.

[0065] On the nozzle plate 51, two rows of nozzle arrays (nozzle A row 141 and nozzle B row 142) extending in the X direction are formed at intervals in the Y direction. The nozzle A row 141 corresponds to the first communication hole group 136. The nozzle B row 142 corresponds to the second communication hole group 137. Each nozzle array 141, 142 has a plurality of nozzle holes 145, 146 (injection holes) penetrating the nozzle plate 51 in the Z direction. The plurality of nozzle holes 145, 146 are the nozzle A holes 145 included in the nozzle A row 141 and the nozzle B holes 146 included in the nozzle B row 142. Each of the nozzle holes 145, 146 is arranged at intervals in the X direction. Each of the nozzle holes 145, 146 is formed in a tapered shape in which the inner diameter gradually decreases from the back side toward the front side, for example.

[0066] As shown in FIGS. 6 and 7, the nozzle A holes 145 communicate individually with the discharge channel 75 through the first communication holes 131. The nozzle B holes 146 communicate individually with the discharge channel 75 through the second communication holes 132. Since the communication holes 130 are arranged in a staggered pattern, the nozzle holes 145 and 146 are also arranged in a staggered pattern. The nozzle plate 51 does not have holes communicating with the non-through groove 150 of the intermediate plate 52, and closes the entire non-through groove 150 from the front side.

[0067] <Method for manufacturing a head chip> The method for manufacturing the head chip 50 of the present embodiment will be described. The method for manufacturing the head chip of the present embodiment includes a first bonding step (intermediate plate bonding step), a first inspection step, a non-through groove forming step, a through hole forming step, a second bonding step, and a second inspection step.

[0068] FIGS. 11 to 13 are diagrams for explaining the method for manufacturing the head chip of the first embodiment, and are cross-sectional views corresponding to FIG. 8. As shown in FIG. 11, in the first bonding step, the intermediate plate 52 is superposed and bonded to the actuator plate 53 in the Z direction. For example, the actuator plate 53 and the intermediate plate 52 are bonded with an adhesive. In the intermediate plate 52 bonded to the actuator plate 53 in the first bonding step, neither the communication holes 130 nor the through holes 160 are formed. In each of FIGS. 11 to 13, illustration of the common electrode 95 formed on the inner surface of the discharge channel 75 and the individual electrode 97 formed on the inner surface 76c of the non-discharge channel 76 is omitted.

[0069] Subsequently, in the first inspection step, a defective joint at the joint between the actuator plate 53 and the intermediate plate 52 is detected. The defective joint to be detected is a leak path that connects the discharge channel 75 and the non-discharge channel 76. In the first inspection step, each discharge channel 75 is evacuated, and the presence or absence of leakage at that time is determined. If there is a leak path connecting the discharge channel 75 and the non-discharge channel 76, gas flows into the discharge channel 75 through the leak path from the non-discharge channel 76 that opens to the side surface of the actuator plate 53, so that a defective joint can be detected.

[0070] Subsequently, as shown in FIG. 12, in the non-through groove forming step, non-through grooves 150 are formed in the intermediate plate 52. For example, in the non-through groove forming step, the non-through grooves 150 are formed in the intermediate plate 52 using a laser. In this case, it is desirable to continuously scan the laser beam to form the entire non-through groove 150 at once, rather than partially.

[0071] Subsequently, as shown in FIG. 13, in the through hole forming step, communication holes 130 and through holes 160 are formed in the intermediate plate 52. For example, in the through hole forming step, the communication holes 130 and the through holes 160 are formed in the intermediate plate 52 using a laser. The order of forming the communication holes 130 and the through holes 160 is not particularly limited. Also, the through hole forming step may be performed before the non-through groove forming step. Also, the through hole forming step may be performed simultaneously with the non-through groove forming step. In this case, the non-through grooves 150 and the through holes 160 may be formed by a series of scans of the laser beam. However, it is desirable to perform the through hole forming step after the first bonding step, and the positional accuracy between the discharge channel 75 and the communication hole 130, and the positional accuracy between the non-discharge channel 76 and the through hole 160 can be improved.

[0072] Subsequently, in the second joining step, the nozzle plate 51 having the nozzle holes 145 and 146 is superposed and joined to the intermediate plate 52 on the side opposite to the actuator plate 53. For example, the intermediate plate 52 and the nozzle plate 51 are joined by an adhesive. By joining the nozzle plate 51 to the intermediate plate 52, the nozzle holes 145 and 146 are communicated with the communication holes 130, and the entire non-through groove 150 is closed by the nozzle plate 51.

[0073] Subsequently, in the second inspection step, a defective joint at the joint between the intermediate plate 52 and the nozzle plate 51 is detected. The defective joint to be detected is a leak path that communicates the communication hole 130 and the non-through groove 150. In the second inspection step, each discharge channel 75 is evacuated with the nozzle holes 145 and 146 closed, and the presence or absence of leakage at that time is determined. The nozzle holes 145 and 146 are closed by superposing a jig or the like (not shown) on the side of the nozzle plate 51 opposite to the intermediate plate 52. If there is a leak path that communicates the communication hole 130 and the non-through groove 150, gas flows into the discharge channel 75 through the through hole 160, the non-through groove 150, the leak path, and the communication hole 130 from the non-discharge channel 76 opened on the side surface of the actuator plate 53, so that a defective joint can be detected.

[0074] Then, for the object that has passed the second inspection step, the head chip 50 is completed by pressing the flexible printed circuit board 100. In this embodiment, the intermediate plate 52 in which the communication hole 130 is not formed in the first joining step is used, but the present invention is not limited to this. That is, an intermediate plate 52 in which the communication hole 130 is formed in the first joining step may be used. In this case, in the first inspection step, a leak path that communicates the discharge channel 75 and the non-discharge channel 76 can be detected by closing the communication hole 130 using a jig in the same manner as in the second inspection step.

[0075] As described above, the head chip 50 of the present embodiment includes an intermediate plate 52 in which a communication hole 130 communicating with the discharge channel 75 and a non-penetrating groove 150 communicating with the non-discharge channel 76 through a through hole 160 are formed, and a nozzle plate 51 that is overlapped with the intermediate plate 52 in a state where the non-penetrating groove 150 is blocked and in which nozzle holes 145 and 146 through which the ink accommodated in the discharge channel 75 and communicating with the communication hole 130 is ejected are formed.

[0076] According to this configuration, the defective joint portion between the intermediate plate 52 and the nozzle plate 51 is connected to the communication hole 130 and the non-penetrating groove 150 of the intermediate plate 52, so that the communication hole 130 and the non-penetrating groove 150 communicate with each other through the defective joint portion. As a result, the discharge channel 75 and the nozzle holes 145 and 146 of the intermediate plate 52 communicate with each other. Since the through hole 160 communicates with the outside of the head chip 50 through the non-discharge channel 76, by detecting a leak when the nozzle holes 145 and 146 are blocked and the discharge channel 75 is evacuated, the through hole 160 and the non-penetrating groove 150 can be made to function as leak detection channels connecting the defective joint portion and the non-discharge channel 76, and the presence of the defective joint portion can be detected.

[0077] In particular, since the non-penetrating groove 150 is located in the region 138, 139 between the communication holes on the surface of the intermediate plate 52, the defective joint portion in the region 138, 139 between the communication holes can be efficiently detected. Moreover, since the non-penetrating groove 150 does not open to the actuator plate 53 side, the degree of freedom in the shape of the leak detection channel can be improved as compared with a configuration in which the leak detection channel is formed only by the through hole.

[0078] In this embodiment, the minimum distance G1 in the X direction between the non-through groove 150 and the opening edge 130a of the communication hole 130 in each region 138, 139 between the communication holes is set to be greater than the minimum distance G2 in the X direction between the opening edge 130a of the communication hole 130 and the non-discharge channel 76. Since the communication holes 130 adjacent to each other in the X direction are displaced in the Y direction, when focusing on a pair of communication holes 130 (the first communication hole 131 and the second communication hole 132) adjacent to each other in the X direction, unlike the configuration in which they are arranged in a row in the X direction, even if the minimum distance G1 between the non-through groove 150 and the opening edge 130a of one communication hole 130 (for example, the first communication hole 131) is made greater than the minimum distance G2 from the non-discharge channel 76, it is possible to suppress the non-through groove 150 from approaching the other communication hole (for example, the second communication hole 132). Thereby, the width in the X direction at the joint between the intermediate plate 52 and the nozzle plate 51 can be increased. That is, it is possible to secure the bonding margin between the intermediate plate 52 and the nozzle plate 51 between the non-through groove 150 and the communication hole 130. Therefore, the intermediate plate 52 and the nozzle plate 51 can be bonded more reliably. As described above, while suppressing a decrease in the bonding margin between the intermediate plate 52 and the nozzle plate 51 due to the provision of the non-through groove 150, it is possible to detect a bonding defect between the intermediate plate 52 and the nozzle plate 51 and suppress a decrease in printing quality caused by the bonding defect.

[0079] Further, the non-through groove 150 extends over the entire length in the Y direction in the first region 138 between the communication holes. According to this configuration, the non-through groove 150 is provided on the shortest path connecting the pair of first communication holes 131 sandwiching the first region 138 between the communication holes. The same applies to the point that the non-through groove 150 extends over the entire length in the Y direction in the second region 139 between the communication holes. Thereby, it is possible to detect a bonding defect that can induce an unintentional communication between the discharge channels 75 at a location where hydraulic pressure is likely to be applied.

[0080] Further, the non-through groove 150 extends from the first communication hole interval region 138 to the second communication hole interval region 139. According to this configuration, the non-through groove 150 is provided on the shortest path connecting a pair of adjacent communication holes 130 (the first communication hole 131 and the second communication hole 132) in the Y direction. Thereby, in a portion where hydraulic pressure is likely to be applied, it is possible to detect a bonding defect that can induce an unintentional communication between the discharge channels 75.

[0081] Here, when the non-through groove is formed by a laser, if a bent portion is formed in the non-through groove in plan view, the irradiation density of the laser light locally increases at the bent portion, and there is a possibility that unintentional penetration or generation of debris may occur. In the present embodiment, since the non-through groove 150 extends linearly over the entire length, a bent portion is not formed in the non-through groove 150 in plan view, and the non-through groove 150 can be formed uniformly over the entire length. Therefore, it is possible to suppress a decrease in reliability due to unintentional penetration or the like occurring during the formation of the non-through groove 150.

[0082] Also, in the first embodiment, the through hole forming step is performed after the intermediate plate bonding step. Thereby, regardless of the alignment accuracy of the actuator plate 53 and the intermediate plate 52, the through hole 160 can be formed at a desired position with respect to the non-discharge channel 76 in the through hole forming step. Therefore, in the head chip 50 including the intermediate plate 52 in which the through hole 160 communicating with the non-discharge channel 76 is formed, it is possible to improve the yield during manufacturing.

[0083] In the first embodiment, the first bonding step is performed before the non-through groove forming step, but the first bonding step may be performed after the non-through groove forming step. Thereby, the step of forming the non-through groove 150 in the intermediate plate 52 can be performed in parallel with a step before the first bonding step in the head chip manufacturing. Therefore, the manufacturing period of the head chip can be shortened.

[0084] [Second Embodiment] Next, with reference to FIG. 14, the second embodiment will be described. FIG. 14 is a bottom view of the intermediate plate and the actuator plate of the second embodiment. As shown in FIG. 14, the intermediate plate 52 of the present embodiment has non-through grooves 250 and through holes 260 instead of the non-through groove 150 and the through hole 160 of the first embodiment. The configuration other than that described below is the same as that of the first embodiment.

[0085] The non-through grooves 250 include transverse portions 251 and 252 that extend across the inter-communication hole regions 138 and 139 in the Y direction, and connecting portions 254 that connect the transverse portions 251 and 252 and the through holes 260 outside the inter-communication hole regions 138 and 139.

[0086] The transverse portions 251 and 252 extend in the Y direction at the center positions of the pair of communication holes 130 sandwiching each of the inter-communication hole regions 138 and 139. The transverse portions 251 and 252 extend linearly with a constant width. The transverse portions 251 and 252 extend in the Y direction such that the distances to the pair of communication holes 130 located on both sides in the X direction are equal at each position in the Y direction. The transverse portions 251 and 252 are formed one by one in each of the inter-communication hole regions 138 and 139. Specifically, the transverse portion 251 is a first transverse portion 251 that extends in the Y direction at the center position of the pair of first communication holes 131 sandwiching the first inter-communication hole region 138, and the transverse portion 252 is a second transverse portion 252 that extends in the Y direction at the center position of the pair of second communication holes 132 sandwiching the second inter-communication hole region 139. The transverse portions 251 and 252 extend over the entire length in the Y direction of the inter-communication hole regions 138 and 139, respectively, and protrude on both sides in the Y direction.

[0087] The connecting portion 254 is formed only between the communication hole regions 138 and 139 adjacent to each other in the Y direction. The connecting portion 254 connects the end portion on the second communication hole region 139 side in the first cross-sectional portion 251 and the end portion on the first communication hole region 138 side in the second cross-sectional portion 252. A part of the connecting portion 254 overlaps with the non-discharge channel 76 in a plan view. In the present embodiment, the connecting portion 254 includes an intermediate portion 255 extending along the Y direction at a position overlapping with the non-discharge channel 76 in a plan view, and a connecting portion 256 connecting the end portions of the intermediate portion 255 and the end portions of the cross-sectional portions 251 and 252. The intermediate portion 255 is formed only outside the communication hole regions 138 and 139. The intermediate portion 255 extends linearly with a constant width. The connecting portion 256 is connected to the intermediate portion 255 and the cross-sectional portions 251 and 252 adjacent to the intermediate portion 255 in the X direction via a bent portion. The connecting portion 256 extends along the X direction outside the communication hole regions 138 and 139. The connecting portion 256 extends linearly with a constant width.

[0088] FIG. 15 is a view showing an enlarged part of FIG. 14. As shown in FIG. 15, each non-through groove 250 is formed so as to satisfy the following conditions with respect to the surrounding communication holes 130. When paying attention to an arbitrary non-through groove 250, the minimum distance G1 in the X direction between the non-through groove 250 and the opening edge 130a of the communication hole 130 in each communication hole region 138 and 139 is larger than the minimum distance G2 in the X direction between the opening edge 130a of the communication hole 130 and the non-discharge channel 76. Specifically, the minimum distance G11 in the X direction between the non-through groove 250 and the opening edge 130a of the first communication hole 131 in the first communication hole region 138 is larger than the minimum distance G21 in the X direction between the opening edge 130a of the first communication hole 131 and the non-discharge channel 76. Also, the minimum distance G12 in the X direction between the non-through groove 250 and the opening edge 130a of the second communication hole 132 in the second communication hole region 139 is larger than the minimum distance G22 in the X direction between the opening edge 130a of the second communication hole 132 and the non-discharge channel 76.

[0089] As shown in FIG. 14, the through hole 260 opens into the connection portion 254 of the non-through groove 250 and communicates with the non-through groove 250. In the present embodiment, the through hole 260 opens into the intermediate portion 255 of the connection portion 254. The through hole 260 overlaps with the non-discharge side through portion 76a of each non-discharge channel 76 in a plan view. The through hole 260 communicates with the non-discharge side through portion 76a of the corresponding non-discharge channel 76 on the surface side of the actuator plate 53. Thereby, the through hole 260 communicates with the outside of the head chip 50 through the non-discharge channel 76. In the illustrated example, the through hole 260 is formed in a circular shape in a plan view, but the shape of the through hole 260 is not particularly limited, and for example, it may be formed in a rectangular shape or an oval shape in a plan view.

[0090] The method for forming the non-through groove 250 in the present embodiment is not particularly limited. For example, it can be formed all at once by a laser. In this case, each of the cross-sectional portions 251 and 252 of the non-through groove 250 can be formed all at once by scanning the laser beam back and forth in the Y direction, so that each of the cross-sectional portions 251 and 252 and the connection portion 254 connected to the cross-sectional portions 251 and 252 are formed all at once.

[0091] Thus, in the present embodiment, the minimum distance G1 in the X direction between the non-through groove 250 and the opening edge 130a of the communication hole 130 in each communication hole interval region 138 and 139 is set to be larger than the minimum distance G2 in the X direction between the opening edge 130a of the communication hole 130 and the non-discharge channel 76. Thereby, similar to the first embodiment, it is possible to secure the bonding allowance between the intermediate plate 52 and the nozzle plate 51 between the non-through groove 250 and the communication hole 130. Therefore, the intermediate plate 52 and the nozzle plate 51 can be bonded more reliably.

[0092] Further, the non-through groove 250 linearly extends in the Y direction as transverse portions 251 and 252 in each of the regions 138 and 139 between the communication holes. According to this configuration, the minimum distance G1 between the non-through groove 250 and both of the pair of communication holes 130 sandwiching the regions 138 and 139 between the communication holes can be increased as compared with the case where the non-through groove extends in a direction inclined with respect to the Y direction in the regions between the communication holes. Therefore, it is possible to secure the bonding margin between the intermediate plate 52 and the nozzle plate 51 between the non-through groove 250 and the communication hole 130.

[0093] In the second embodiment, one transverse portion 251 and 252 is provided in each of the regions 138 and 139 between the communication holes, but the present invention is not limited to this configuration. Two transverse portions may be provided in each of the regions 138 and 139 between the communication holes, and the ends may be formed to be connected outside the regions 138 and 139 between the communication holes.

[0094] In the second embodiment, the connecting portion 254 of the non-through groove 250 is formed in a shape having a bent portion, but the present invention is not limited to this configuration. For example, the connecting portion of the non-through groove may linearly extend so as to connect the ends of the transverse portions 251 and 252.

[0095] Note that the technical scope of the present disclosure is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present disclosure. For example, in the above embodiment, as an example of the liquid ejection recording apparatus, the inkjet printer 1 has been described as an example, but the present invention is not limited to printers. For example, a facsimile machine, an on-demand printer, or the like may be used.

[0096] In the above embodiment, the configuration in which the inkjet head moves with respect to the recording medium during printing (so-called shuttle mechanism) has been described as an example, but the present invention is not limited to this configuration. The configuration according to the present disclosure may be adopted in a configuration in which the recording medium is moved with respect to the inkjet head while the inkjet head is fixed (so-called fixed head mechanism). In the above-described embodiment, the configuration in which the Z direction coincides with the vertical direction has been described. However, the present disclosure is not limited to this configuration, and the Z direction may be along the horizontal direction.

[0097] In the above-described embodiment, the head chip of the side shoot has been described. However, the present disclosure is not limited thereto. For example, the present disclosure may be applied to a so-called edge shoot type head chip that discharges ink from an end portion in the extending direction of the discharge channel.

[0098] In the above-described embodiment, the configuration in which the actuator plate 53, the intermediate plate 52, and the nozzle plate 51 are sequentially joined has been described. However, the present disclosure is not limited to this configuration. Another member may be provided between the actuator plate 53 and the intermediate plate 52, or between the intermediate plate 52 and the nozzle plate 51.

[0099] In the above-described embodiment, the case where the recording medium P is paper has been described. However, the present disclosure is not limited to this configuration. The recording medium P is not limited to paper, and may be a metal material, a resin material, or food, etc.

[0100] In the above-described embodiment, the configuration in which the liquid ejection head is mounted on the liquid ejection recording apparatus has been described. However, the present disclosure is not limited to this configuration. That is, the liquid ejected from the liquid ejection head is not limited to that which lands on the recording medium. For example, it may be a chemical solution to be blended in a preparation, a food additive such as a seasoning or a fragrance to be added to food, an aromatic agent to be ejected into the air, etc.

[0101] In the above-described embodiment, one channel row is provided. However, a plurality of channel rows may be provided. In this case, the configuration of the above-described embodiment may be applied to each channel row. Further, the communication hole group and the nozzle row may be provided in three or more rows for each channel row.

[0102] In the above embodiment, the non-through grooves 150 and 250 continuously extend from the first through-hole between-region 138 to the second through-hole between-region 139, but the present invention is not limited to this configuration. The non-through groove may extend only from between a pair of through-hole between-regions toward one of the through-hole between-regions.

[0103] In the above embodiment, the non-through grooves 150 and 250 extend with a constant width, but the present invention is not limited to this configuration. For example, the non-through groove may be widened at the position where the through-hole opens.

[0104] In the above embodiment, the through-hole 130 of the intermediate plate 52 includes the groove portion 133 and the through portion 134, but the shape of the through-hole is not limited thereto. For example, the through-hole may not have a groove portion, or the groove portion may have the same length as the through portion in the Y direction. Further, the shape of the opening edge of the through-hole on the surface of the nozzle plate may be formed, for example, in a rectangular shape, a circular shape, an oval shape, or the like.

[0105] In addition, within a range not departing from the gist of the present invention, it is possible to appropriately replace the components in the above-described embodiments with well-known components, and the above-described embodiments may also be appropriately combined.

Description of Reference Numerals

[0106] 1... Printer (Liquid Jet Recording Apparatus) 5... Ink Jet Head (Liquid Jet Head) 50... Head Chip 51... Nozzle Plate (Jet Hole Plate) 52... Intermediate Plate 53... Actuator Plate 61... Channel Row 75... Discharge Channel (Jet Channel) 76... Non-discharge Channel (Non-jet Channel) 130... Through-hole 130a... Opening Edge 136, 137... Through-hole Group 138, 139... Through-hole between-region 145, 146... Nozzle Hole (Jet Hole) 150, 250... Non-through Groove 160, 260... Through-hole

Claims

1. A head chip for injecting a liquid, comprising: an actuator plate having a channel array in which injection channels and non-injection channels extending in a first direction are alternately arranged in a second direction intersecting the first direction so as to overlap each other in the first direction; an intermediate plate that is superposed on the actuator plate and has a plurality of rows of communication hole groups in which communication holes individually communicating with the injection channels are arranged in a line in the second direction for each channel array; an injection hole plate that is superposed on the intermediate plate on the side opposite to the actuator plate and has injection holes formed by individually communicating with the communication holes and injecting the liquid accommodated in the injection channels; wherein among the communication holes included in the plurality of rows of communication hole groups, the adjacent communication holes in the second direction are arranged so as to be displaced from each other in the first direction; in the intermediate plate, a non-through groove that opens on the surface on the injection hole plate side and is blocked by the injection hole plate; a through hole that communicates with the non-through groove and communicates with the outside of the head chip through the non-injection channel; are formed; when, among the surfaces of the intermediate plate on the injection hole plate side, a region between the opening edges of a pair of adjacent communication holes in a predetermined communication hole group is defined as an inter-communication hole region, a part of the non-through groove is located in the inter-communication hole region; the minimum distance in the second direction between the opening edge of the communication hole and the non-through groove in the inter-communication hole region is larger than the minimum distance in the second direction between the opening edge of the communication hole and the non-injection channel; a head chip.

2. The non-through groove extends over the entire length in the first direction in the inter-communication hole region. The head chip according to Claim 1.

3. The non-through groove extends from one inter-communication hole region corresponding to each of a pair of adjacent communication hole groups in the first direction to the other inter-communication hole region. The head chip according to Claim 1 or Claim 2.

4. The non-through groove extends linearly over the entire length. The head chip according to any one of Claims 1 to 3.

5. The non-through groove extends linearly in the first direction in the inter-communication hole region. The head chip according to any one of Claims 1 to 3.

6. A liquid injection head comprising the head chip according to any one of Claims 1 to 5.

7. A liquid jet recording apparatus including the liquid jet head according to claim 6.

8. An actuator plate having a channel array in which injection channels and non-injection channels extending in a first direction are alternately arranged in a second direction intersecting the first direction so as to overlap each other in the first direction, An intermediate plate that is superposed on the actuator plate and has a plurality of rows of communication hole groups in which communication holes individually communicating with the injection channels are arranged in a line in the second direction for each channel array, An injection hole plate that is superposed on the intermediate plate on the side opposite to the actuator plate and has injection holes formed by individually communicating with the communication holes and injecting the liquid accommodated in the injection channels, and A method for manufacturing a head chip in which the communication holes adjacent to each other in the second direction among the communication holes included in the plurality of rows of communication hole groups are arranged so as to be displaced from each other in the first direction, A non-through groove forming step of forming a non-through groove that opens on the surface of the intermediate plate on the injection hole plate side and is blocked by the injection hole plate, A through hole forming step of forming a through hole that communicates with the non-through groove and communicates with the outside of the head chip through the non-injection channel, and When a region between the opening edges of a pair of adjacent communication holes in a predetermined communication hole group is defined as an inter-communication hole region in the surface of the intermediate plate on the injection hole plate side, In the non-through groove forming step, a part of the non-through groove is formed in the inter-communication hole region, and the minimum distance in the second direction between the opening edge of the communication hole and the non-through groove in the inter-communication hole region is set to be larger than the minimum distance in the second direction between the opening edge of the communication hole and the non-injection channel. A method for manufacturing a head chip.

9. An intermediate plate joining step of joining the intermediate plate to the actuator plate, and further including Performing the through hole forming step after the intermediate plate joining step. The method for manufacturing a head chip according to claim 8.

10. An intermediate plate joining step of joining the intermediate plate to the actuator plate is provided, and the intermediate plate joining step is performed after the non-through groove forming step. The method for manufacturing a head chip according to claim 8 or claim 9.

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