Substrate Processing Apparatus and Cleaning Method of Mist Guard

Abstract

To provide a substrate processing apparatus capable of effectively cleaning the whole inner peripheral surface of a mist guard, and a cleaning method of the mist guard.SOLUTION: A substrate processing apparatus comprises: a holding part that holds a substrate; a driving part that rotates and drives the holding part; an inner side cup body that is provided at the holding part in a manner to surround the substrate held by the holding part from an external side; a mist guard that surrounds the holding part and the inner side cup body so that they are positioned in an inner part from the external side, and is configured to rise and lower; a cleaning liquid supply part that supplies a cleaning liquid; and a control part. The control part executes a first treatment of supplying a treatment liquid from a treatment liquid supply part to the substrate in a state where the substrate is held by the holding part and the mist guard rises, and a second treatment of scattering the cleaning liquid supplied from the cleaning liquid supply part to the whole inner peripheral surface of the mist guard in a state where the substrate is conveyed out of the holding part and the mist guard rises after the first treatment.SELECTED DRAWING: Figure 7

Description

Technical Field

[0001] The present disclosure relates to a substrate processing apparatus and a method for cleaning a mist guard.

Background Art

[0002] Currently, when finely processing a substrate (for example, a semiconductor wafer, etc.), a process is performed in which a processing liquid is supplied to a rotating substrate to form a film of the processing liquid on the surface of the substrate, while centrifugal force is used to fling the processing liquid outward from the substrate. The processing liquid flung from the substrate scatters around the substrate, and a part of it becomes mist. Patent Documents 1 and 2 disclose a mist guard disposed in a processing chamber so as to surround the periphery of the substrate in order to prevent the mist from adhering to the inner wall of the processing chamber.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure describes a substrate processing apparatus and a method for cleaning a mist guard that can effectively clean the entire inner peripheral surface of the mist guard.

Means for Solving the Problems

[0005] An example of a substrate processing apparatus includes a holding unit configured to hold a substrate, a driving unit configured to rotationally drive the holding unit, an inner cup body provided on the holding unit so as to surround the substrate held by the holding unit from the outside, a mist guard configured to surround these from the outside so that the holding unit and the inner cup body are located inside and configured to be movable up and down, a processing liquid supply unit configured to supply a processing liquid to the substrate held by the holding unit, a cleaning liquid supply unit configured to supply a cleaning liquid, and a control unit. The control unit performs a first process of supplying the processing liquid from the processing liquid supply unit to the substrate in a state where the substrate is held by the holding unit and the mist guard is raised, and after the first process, in a state where the substrate is unloaded from the holding unit and the mist guard is raised, a second process of scattering the cleaning liquid supplied from the cleaning liquid supply unit over the entire inner peripheral surface of the mist guard.

Advantages of the Invention

[0006] According to the substrate processing apparatus and the method for cleaning the mist guard according to the present disclosure, it is possible to effectively clean the entire inner peripheral surface of the mist guard.

Brief Description of the Drawings

[0007]

Figure 1

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BEST MODE FOR CARRYING OUT THE INVENTION

[0008] In the following description, the same reference numerals are used for the same elements or elements having the same functions, and redundant descriptions are omitted. In this specification, when referring to up, down, right, and left in the drawings, the directions of the reference numerals in the drawings are used as the reference.

[0009] [Substrate Processing System] First, referring to FIG. 1, a substrate processing system 1 (substrate processing apparatus) configured to process a substrate W will be described. The substrate processing system 1 includes a loading / unloading station 2, a processing station 3, and a controller Ctr (control unit). The loading / unloading station 2 and the processing station 3 may be arranged in a row, for example, in the horizontal direction.

[0010] The substrate W may have a disc shape, or may have a plate shape other than circular such as a polygon. The substrate W may have a notch portion where a part is cut out. The notch portion may be, for example, a notch (a groove such as a U-shape or a V-shape), or a linear portion (so-called orientation flat) extending linearly. The substrate W may be, for example, a semiconductor substrate (silicon wafer), a glass substrate, a mask substrate, an FPD (Flat Panel Display) substrate, or other various substrates. The diameter of the substrate W may be, for example, about 200 mm to 450 mm.

[0011] The loading / unloading station 2 includes a placement unit 4, a loading / unloading unit 5, and a shelf unit 6. The placement unit 4 includes a plurality of placement tables (not shown) arranged in the width direction (the vertical direction in FIG. 1). Each placement table is configured to be able to place a carrier 7 (accommodation container). The carrier 7 is configured to accommodate at least one substrate W in a sealed state. The carrier 7 includes an opening / closing door (not shown) for taking in and out the substrate W.

[0012] The loading / unloading unit 5 is arranged adjacent to the placement unit 4 in the direction in which the loading / unloading station 2 and the processing station 3 are arranged (the left-right direction in FIG. 1). The loading / unloading unit 5 includes an opening / closing door (not shown) provided corresponding to the placement unit 4. With the opening / closing door of the carrier 7 and the opening / closing door of the loading / unloading unit 5 both opened in a state where the carrier 7 is placed on the placement unit 4, the inside of the loading / unloading unit 5 and the inside of the carrier 7 communicate with each other.

[0013] The loading / unloading unit 5 incorporates a transfer arm A1 and a shelf unit 6. The transfer arm A1 is configured to be capable of horizontal movement in the width direction (the vertical direction in FIG. 1) of the loading / unloading unit 5, vertical movement in the vertical direction, and turning movement around the vertical axis. The transfer arm A1 is configured to take out the substrate W from the carrier 7 and deliver it to the shelf unit 6, and also to receive the substrate W from the shelf unit 6 and return it into the carrier 7. The shelf unit 6 is located in the vicinity of the processing station 3 and is configured to mediate the transfer of the substrate W between the loading / unloading unit 5 and the processing station 3.

[0014] The processing station 3 includes a transfer unit 8 and a plurality of processing units U. The transfer unit 8 extends horizontally, for example, in the direction (the left-right direction in FIG. 1) in which the loading / unloading station 2 and the processing station 3 are arranged. The transfer unit 8 incorporates a transfer arm A2. The transfer arm A2 is configured to be capable of horizontal movement in the longitudinal direction (the left-right direction in FIG. 1) of the transfer unit 8, vertical movement in the vertical direction, and turning movement around the vertical axis. The transfer arm A2 is configured to take out the substrate W from the shelf unit 6 and deliver it to each processing unit U, and also to receive the substrate W from each processing unit U and return it into the shelf unit 6.

[0015] The plurality of processing units U are arranged in a row along the longitudinal direction (the left-right direction in FIG. 1) on each of both sides of the transfer unit 8. The processing unit U is configured to perform a predetermined process on the substrate W (for example, a cleaning process of the substrate W, an etching process of a film formed on the surface of the substrate W, etc.). Details of the processing unit U will be described later.

[0016] The controller Ctr is configured to control the substrate processing system 1 partially or entirely. Details of the controller Ctr will be described later.

[0017] [Processing Unit] Next, referring to FIG. 2, the processing unit U will be described in detail. The processing unit U includes a chamber 10, a blower unit 20, a rectifying unit 30, a rotation holding unit 40, a collection cup 50, a cleaning cup 60, a mist guard 70, an upper supply unit 80 (processing liquid supply unit, cleaning liquid supply unit), and a lower supply unit 90 (another cleaning liquid supply unit, gas supply unit).

[0018] The chamber 10 is configured such that the substrate W is processed by a processing liquid or the like inside thereof. An inlet / outlet (not shown) is formed in the side wall of the chamber 10. The substrate W is conveyed into the chamber 10 through the inlet / outlet by a transfer arm A2 and is also carried out from the chamber 10 to the outside.

[0019] The blower unit 20 is attached so as to cover an opening 10a formed in the top wall of the chamber 10. The blower unit 20 is configured to form a downward downdraft in the chamber 10 based on a signal from the controller Ctr.

[0020] The rectifying unit 30 is disposed in the upper part of the chamber 10 and extends horizontally so as to partition the internal space of the chamber 10 vertically. The rectifying unit 30 is a plate-like body formed with a large number of holes and may be, for example, punching metal, expanded metal, wire mesh, etc. The rectifying unit 30 is configured to rectify the downdraft formed by the blower unit 20 and adjust the distribution of the downdraft in the chamber 10 below the rectifying unit 30.

[0021] The rotation holding unit 40 includes a rotation shaft 41, a drive unit 42, a support plate 43 (holding unit), a plurality of support pins 44, an annular member 45, and an inner cup body 46. The rotation shaft 41 is a hollow tubular member extending along the vertical direction. The rotation shaft 41 is configured to be rotatable around the central axis Ax.

[0022] The drive unit 42 is connected to the rotary shaft 41. The drive unit 42 operates based on an operation signal from the controller Ctr and is configured to rotate the rotary shaft 41. The drive unit 42 may be a power source such as an electric motor, for example.

[0023] The support plate 43 is, for example, a flat plate having an annular shape and extends along the horizontal. That is, a through hole 43a is formed in the central portion of the support plate 43. The inner peripheral portion of the support plate 43 is connected to the tip of the rotary shaft 41. Therefore, the support plate 43 is configured to rotate around the central axis Ax of the rotary shaft 41 as the rotary shaft 41 rotates.

[0024] The plurality of support pins 44 are provided on the support plate 43 so as to project upward from the upper surface 43b of the support plate 43. The plurality of support pins 44 are configured to support the substrate W substantially horizontally by the contact of their tips with the back surface of the substrate W. The plurality of support pins 44 may have, for example, a cylindrical shape or a frustum shape. The plurality of support pins 44 may be arranged at substantially equal intervals in the vicinity of the outer peripheral portion of the support plate 43 so as to form a circular shape as a whole when viewed from above. For example, when there are 12 support pins 44, the plurality of support pins 44 may be arranged at intervals of approximately 30°.

[0025] The annular member 45 has an annular shape (for example, a circular ring shape) and is provided on the support plate 43 so as to project upward from the upper surface 43b of the support plate 43. The annular member 45 surrounds the through hole 43a of the support plate 43 from the outside and is located inside the plurality of support pins 44. Therefore, the space surrounded by the annular member 45 and the upper surface 43b of the support plate 43 constitutes a storage space V capable of storing a cleaning liquid (described later).

[0026] Of the annular member 45, the inner peripheral wall surface (inner peripheral surface) may be an inclined surface 45a that inclines upward as it goes radially outward, as illustrated in FIG. 2. The inclination angle of the inclined surface 45a with respect to the upper surface 43b of the support plate 43 may be set to an angle such that when the inclined surface 45a is virtually extended radially outward, it does not cross the inner cup body 46 (an angle that passes above the inner cup body 46). The inclination angle of the inclined surface 45a with respect to the upper surface 43b of the support plate 43 may be, for example, about 10° to 45°.

[0027] The inner cup body 46 has an annular shape (for example, a circular ring shape) and is connected to the support plate 43 by a plurality of connecting members 47 so as to be separated from the support plate 43 and located above the support plate 43. The inner cup body 46 is arranged so as to surround the substrate W supported by the plurality of support pins 44 from the outside. Therefore, the inner cup body 46 is configured to rotate around the central axis Ax of the rotating shaft 41 as the rotating shaft 41 rotates. Since there is a gap between the inner cup body 46 and the support plate 43, the liquid supplied to the substrate W flows out to the outside of the inner cup body 46 and the support plate 43 through the gap.

[0028] An annular groove 48 extending over the entire circumference of the inner cup body 46 is formed on the upper surface 46a of the inner cup body 46. The annular groove 48 is configured to be able to store the cleaning liquid. In order to allow the surface tension to act on the cleaning liquid and store more cleaning liquid in the annular groove 48, surface treatment (for example, fluorine treatment) may be applied to the surface of the annular groove 48. Of the annular groove 48, the inner wall surface on the outer peripheral side may be an inclined surface 48a that inclines upward as it goes radially outward, as illustrated in FIG. 2. The inclination angle of the inclined surface 48a with respect to the upper surface 46a of the inner cup body 46 may be, for example, about 10° to 45°.

[0029] The inclined surfaces 45a and 48a may each be a flat surface or a non-flat surface (e.g., a curved surface). For the purpose of enhancing the fluidity of the cleaning liquid, a large number of concavities and convexities may be formed on the inclined surfaces 45a and 48a by, for example, dimpling and / or embossing, or a plurality of grooves and / or a plurality of ridges extending radially along the radial direction may be formed. Alternatively, for the purpose of enhancing the fluidity of the cleaning liquid, the inclined surfaces 45a and 48a may be subjected to a surface treatment or a film may be formed thereon.

[0030] The recovery cup 50 is disposed so as to surround the rotation holding portion 40 from the outside. While the rotation holding portion 40 is configured to be rotatable, the recovery cup 50 remains stationary without rotating. The recovery cup 50 may be fixed to the drive unit 42 as illustrated in FIG. 2. The recovery cup 50 includes a drain cup 51 located inside and an exhaust cup 52 disposed so as to surround the drain cup 51 from the outside.

[0031] The drain cup 51 forms a cylindrical space communicating with the gap between the inner cup body 46 and the support plate 43, and is configured to collect the liquid flowing out from the gap. A pipe for draining the collected liquid to the outside of the processing unit U is connected to the lower end portion of the drain cup 51.

[0032] The exhaust cup 52 forms a cylindrical space between it and the drain cup 51, and the space is adjusted to a negative pressure. A pipe for sucking the atmosphere near the inner cup body 46 and exhausting it to the outside of the processing unit U is connected to the lower end portion of the exhaust cup 52.

[0033] The cleaning cup 60 is configured to be able to store the cleaning liquid inside. The cleaning cup 60 has a cylindrical shape that surrounds the exhaust cup 52 from the outside and extends to connect the lower end of the chamber 10 and the exhaust cup 52. For example, the internal space of the cleaning cup 60 (the storage space for the cleaning liquid) may be the space surrounded by the cleaning cup 60 and the upper end of the exhaust cup 52. As illustrated in FIG. 2, the cleaning cup 60 may include a cylindrical peripheral wall portion 61 extending in the vertical direction and an annular bottom wall portion 62 extending horizontally from the lower end of the peripheral wall portion 61 toward the radially inner side (the recovery cup 50 side). A pipe for draining the used cleaning liquid to the outside of the processing unit U is connected to the lower end of the cleaning cup 60.

[0034] The mist guard 70 is arranged to surround the recovery cup 50 from the outside. That is, the rotation holding portion 40 and the recovery cup 50 are located inside the mist guard 70. As illustrated in FIG. 2, the mist guard 70 may include a cylindrical portion 71 extending in the vertical direction and an annular overhanging portion 72 extending horizontally from the upper end of the cylindrical portion 71 toward the radially inner side (the recovery cup 50 side).

[0035] The mist guard 70 is connected to the drive unit 73 and is configured to be able to move up and down in the vertical direction. For example, the mist guard 70 can move up and down between a lowered position (see FIG. 2) where at least the lower part of the cylindrical portion 71 is located inside the cleaning cup 60 and a raised position (see FIG. 5 etc.) where the whole or almost the whole of the cylindrical portion 71 is exposed from the cleaning cup 60. In the lowered position, with the cleaning liquid stored in the storage space in the cleaning cup 60, at least the lower part of the cylindrical portion 71 is immersed in the cleaning liquid. In the raised position, mist generated by the scattering of the processing liquid (described later) supplied to the substrate W adheres to the inner peripheral surface 70a of the mist guard 70. Therefore, the mist guard 70 prevents the mist from adhering to the inner wall of the chamber 10.

[0036] The upper supply unit 80 is configured to supply liquid to the upper surface of the substrate W, the support plate 43, or the inner cup body 46. The upper supply unit 80 includes supply units 81 to 83, nozzles 84 to 86, an arm 87 (holding arm), and a drive unit 88.

[0037] The supply unit 81 includes a liquid source, valves, pumps, etc. (not shown), and is configured to supply the liquid L1 downward from the nozzle 84 based on a signal from the controller Ctr. The liquid L1 may be an alkaline liquid. The liquid L1 may be used, for example, as a chemical solution for processing the substrate W (e.g., cleaning treatment for removing dirt and foreign substances, etching treatment, etc.), or as a cleaning liquid for cleaning the inner peripheral surface 70a of the mist guard 70. The alkaline chemical solution may include, for example, SC-1 solution (a mixed solution of ammonia, hydrogen peroxide, and pure water).

[0038] The supply unit 82 includes a liquid source, valves, pumps, etc. (not shown), and is configured to supply the liquid L2 downward from the nozzle 85 based on a signal from the controller Ctr. The liquid L2 may be an acidic liquid. The liquid L2 may be used, for example, as a chemical solution for processing the substrate W (e.g., cleaning treatment for removing dirt and foreign substances, etching treatment, etc.), or as a cleaning liquid for cleaning the inner peripheral surface 70a of the mist guard 70. The acidic chemical solution may include, for example, SC-2 solution (a mixed solution of hydrochloric acid, hydrogen peroxide solution, and pure water), SPM (a mixed solution of sulfuric acid, hydrogen peroxide solution, and pure water), HF / HNO3 solution (a mixed solution of hydrofluoric acid and nitric acid), sulfuric acid, etc.

[0039] The supply unit 83 includes a liquid source, valves, pumps, etc. (not shown), and is configured to supply the liquid L3 downward from the nozzle 86 based on a signal from the controller Ctr. The liquid L3 may be used, for example, as a cleaning liquid for cleaning the substrate W or the inner peripheral surface 70a of the mist guard 70. The liquid L3 may be water. The water may include, for example, deionized water (DIW), ozone water, carbonated water (CO2 water), ammonia water, etc. The water may be cold water (e.g., about 10 °C or lower), normal temperature water (e.g., about 10 °C to 30 °C), or warm water (e.g., about 30 °C or higher).

[0040] The nozzles 84 to 86 are attached to the arm 87 at a predetermined interval. The arm 87 is located in the space above the rotation holding part 40. The drive unit 88 is connected to the arm 87 and is configured to move the arm 87 up and down in the vertical direction based on a signal from the controller Ctr, and is also configured to move the arm 87 horizontally above the rotation holding part 40.

[0041] The lower supply unit 90 includes supply units 91, 92 and a nozzle 93. The supply unit 91 includes a liquid source, valves, pumps, etc. (not shown), and is configured to supply the liquid L4 upward through the flow path 93a formed inside the nozzle 93 based on a signal from the controller Ctr. The liquid L4 may be any one of the above-described liquids L1 to L3. The supply unit 92 includes a gas source, valves, pumps, etc. (not shown), and is configured to supply the dry gas G upward through the flow path 93b formed inside the nozzle 93 based on a signal from the controller Ctr. The dry gas G may be, for example, an inert gas (e.g., nitrogen gas).

[0042] [Details of the Controller] As shown in FIG. 3, the controller Ctr has, as functional modules, a reading unit M1, a storage unit M2, a processing unit M3, and an instruction unit M4. These functional modules are merely a division of the functions of the controller Ctr into a plurality of modules for convenience, and do not necessarily mean that the hardware constituting the controller Ctr is divided into such modules. Each functional module is not limited to being realized by the execution of a program, and may be realized by a dedicated electric circuit (for example, a logic circuit) or an integrated circuit (ASIC: Application Specific Integrated Circuit) integrating the same.

[0043] The reading unit M1 is configured to read a program from a computer-readable recording medium RM. The recording medium RM stores a program for operating each part of the substrate processing system 1 including the processing unit U. The recording medium RM may be, for example, a semiconductor memory, an optical recording disk, a magnetic recording disk, or a magneto-optical recording disk. Hereinafter, each part of the substrate processing system 1 may include a blower unit 20, drive units 42, 73, and supply units 81 to 83, 91, 92.

[0044] The storage unit M2 is configured to store various data. The storage unit M2 may store, for example, a program read from the recording medium RM by the reading unit M1, setting data input from an operator via an external input device (not shown), and the like.

[0045] The processing unit M3 is configured to process various data. The processing unit M3 may generate, for example, a signal for operating each part of the substrate processing system 1 based on various data stored in the storage unit M2.

[0046] The instruction unit M4 is configured to transmit the operation signal generated by the processing unit M3 to each part of the substrate processing system 1.

[0047] The hardware of the controller Ctr may be constituted by, for example, one or more control computers. As shown in FIG. 4, the controller Ctr may include a circuit C1 as a hardware configuration. The circuit C1 may be constituted by electrical circuitry. The circuit C1 may include, for example, a processor C2, a memory C3, a storage C4, a driver C5, and an input / output port C6.

[0048] The processor C2 may be configured to execute a program in cooperation with at least one of the memory C3 and the storage C4 and to execute input / output of signals via the input / output port C6 so as to realize each of the above-described functional modules. The memory C3 and the storage C4 may function as a storage unit M2. The driver C5 may be a circuit configured to drive each part of the substrate processing system 1. The input / output port C6 may be configured to mediate input / output of signals between the driver C5 and each part of the substrate processing system 1.

[0049] The substrate processing system 1 may include one controller Ctr or may include a group of controllers (control units) constituted by a plurality of controllers Ctr. When the substrate processing system 1 includes a group of controllers, each of the above-described functional modules may be realized by one controller Ctr or may be realized by a combination of two or more controllers Ctr. When the controller Ctr is constituted by a plurality of computers (circuit C1), each of the above-described functional modules may be realized by one computer (circuit C1) or may be realized by a combination of two or more computers (circuit C1). The controller Ctr may have a plurality of processors C2. In this case, each of the above-described functional modules may be realized by one processor C2 or may be realized by a combination of two or more processors C2.

[0050] [Substrate Processing Method and Mist Guard Cleaning Method] Next, with reference to FIGS. 5 to 10, an example of a method for processing the substrate W and a method for cleaning the mist guard 70 will be described.

[0051] First, the controller Ctr controls the transfer arms A1 and A2 to take out one substrate W from the carrier 7 and transfer it into one of the processing units U (see step S1 in FIG. 10). The substrate W transferred into the processing unit U is placed on a plurality of support pins 44 with the mist guard 70 in the lowered position, as illustrated in FIG. 5. At this time, the blower unit 20 is controlled by the controller Ctr to form a downward flow in the chamber 10. As illustrated in FIG. 5, any one of the liquids L1 to L3 may be stored in the cleaning cup 60 as a cleaning liquid by the upper supply unit 80 (supply units 81 to 83). In this case, at least the lower part of the cylindrical portion 71 of the mist guard 70 is immersed in the cleaning liquid.

[0052] Next, the controller Ctr controls the drive unit 73 to move the mist guard 70 to the raised position (see arrow Ar1 in FIG. 5). In this state, the controller Ctr controls the drive unit 42 to rotate the rotary shaft 41, the support plate 43, the plurality of support pins 44, the annular member 45, the inner cup body 46, etc. (hereinafter referred to as the rotating part), thereby rotating the substrate W supported by the plurality of support pins 44. Further, the controller Ctr controls the drive unit 88 to horizontally move the arm 87 so that the nozzle 84 or the nozzle 85 is positioned above the central portion of the substrate W. In the example of FIG. 5, the nozzle 84 is positioned above the central portion of the substrate W.

[0053] Next, the controller Ctr controls the supply unit 81 or the supply unit 82 to supply the liquid L1 or the liquid L2 as a processing liquid from the nozzle 84 or the nozzle 85 toward the central portion of the substrate W (see step S2 in FIG. 10). In the example of FIG. 5, the liquid L1 is being supplied to the central portion of the substrate W. The liquid L1 or the liquid L2 supplied to the surface of the substrate W flows toward the outer peripheral edge of the substrate W due to the centrifugal force generated as the substrate W rotates, and processes the surface of the substrate W (see arrow Ar2 in FIG. 5). Most of the liquid L1 or the liquid L2 thrown off from the outer peripheral edge of the substrate W is collected in the drain cup 51 through the gap between the inner cup body 46 and the support plate 43. On the other hand, a part of the liquid L1 or the liquid L2 scatters around the substrate W to form a mist, which adheres to the inner peripheral surface 70a of the mist guard 70 at the raised position (see arrow Ar3 in FIG. 5).

[0054] Next, in the same procedure as in step S2, the liquid L3 as a cleaning liquid is supplied from the nozzle 86 toward the central portion of the substrate W (see step S3 in FIG. 10). Thereby, residues and the liquids L1 and L2 on the surface of the substrate W are washed away by the liquid L3. Thus, the processing of the substrate W is completed. Next, the controller Ctr controls the drive unit 73 to move the mist guard 70 to the lowered position. In this state, the controller Ctr controls the transfer arms A1 and A2 to transfer the processed substrate W from the processing unit U to the carrier 7 (see step S4 in FIG. 10). At this time, similar to step S1, at least the lower part of the cylindrical portion 71 of the mist guard 70 may be immersed in the cleaning liquid. Alternatively, in step S1, the cleaning liquid is not stored in the cleaning cup 60, and at the time of step S4, the cleaning liquid is stored in the cleaning cup 60 by the upper supply unit 80 (supply units 81 to 83), so that at least the lower part of the cylindrical portion 71 of the mist guard 70 may be immersed in the cleaning liquid.

[0055] Next, as illustrated in FIG. 6, the controller Ctr controls the drive unit 42 to stop the rotation of the rotating unit. Next, the controller Ctr controls the drive unit 88 to horizontally move the arm 87 so that any one of the nozzles 84 to 86 is positioned above the annular groove 48 of the inner cup body 46. In this state, the controller Ctr controls any one of the supply units 81 to 83 to supply any one of the liquids L1 to L3 as a cleaning liquid from any one of the nozzles 84 to 86 to the annular groove 48 (see step S5 in FIG. 10). In the example of FIG. 6, the liquid L2 is supplied to the annular groove 48. Thus, a cleaning liquid (any one of the liquids L1 to L3) is stored in the annular groove 48. When the cleaning liquid is stored in the annular groove 48, the controller Ctr controls any one of the supply units 81 to 83 to stop the supply of the cleaning liquid from any one of the nozzles 84 to 86.

[0056] Next, as illustrated in FIG. 7, the controller Ctr controls the drive unit 42 to rotate the rotating unit. The rotation speed at this time may be, for example, about 100 rpm to 1000 rpm. Thereby, the cleaning liquid stored in the annular groove 48 scatters all at once from the annular groove 48 to the entire inner peripheral surface 70a of the mist guard 70 (see step S6 in FIG. 10 and arrow Ar4 in FIG. 7). Note that steps S5 and S6 may be repeated a plurality of times (for example, about 5 to 10 times) according to the degree of mist adhering to the inner peripheral surface 70a of the mist guard 70.

[0057] Next, as illustrated in FIG. 8, the controller Ctr controls the drive unit 42 to stop the rotation of the rotating unit. Next, the controller Ctr controls the drive unit 88 to horizontally move the arm 87 so that any one of the nozzles 84 to 86 is positioned above the annular groove 48 of the inner cup body 46. In this state, the controller Ctr controls any one of the supply units 81 to 83 to supply any one of the liquids L1 to L3 as a cleaning liquid from any one of the nozzles 84 to 86 to the annular groove 48 (see step S7 in FIG. 10). Here, a liquid different from that in step S6 is selected as the cleaning liquid supplied to the annular groove 48. In the example of FIG. 8, a liquid L3 different from the liquid L2 supplied in the example of FIG. 6 is supplied to the annular groove 48. Thus, the cleaning liquid (any one of the liquids L1 to L3) is stored in the annular groove 48. When the cleaning liquid is stored in the annular groove 48, the controller Ctr controls any one of the supply units 81 to 83 to stop the supply of the cleaning liquid from any one of the nozzles 84 to 86.

[0058] Next, as illustrated in FIG. 9, the controller Ctr controls the drive unit 42 to rotate the rotating unit. The rotational speed at this time may be, for example, about 100 rpm to 1000 rpm. Thereby, the cleaning liquid stored in the annular groove 48 scatters all at once from the annular groove 48 to the entire inner peripheral surface 70a of the mist guard 70 (see step S8 in FIG. 10 and arrow Ar5 in FIG. 9). As described above, the cleaning of the inner peripheral surface 70a of the mist guard 70 is completed. Note that steps S7 and S8 may be repeated a plurality of times (for example, about 5 to 10 times) according to the degree of mist adhering to the inner peripheral surface 70a of the mist guard 70 and the cleaning liquid adhering to the inner peripheral surface 70a of the mist guard 70 in step S6.

[0059] [Function] According to the above example (the first example), the entire inner peripheral surface 70a of the mist guard 70 to which the mist of the processing liquid adheres is cleaned by the cleaning liquid. Therefore, it is possible to effectively clean the entire inner peripheral surface 70a of the mist guard 70.

[0060] According to the above example (the first example), as the inner cup body 46 rotates, the cleaning liquid stored in the annular groove 48 scatters all at once toward the entire inner peripheral surface 70a of the mist guard 70. Therefore, it becomes possible to effectively clean the entire inner peripheral surface 70a of the mist guard 70 in an extremely short time. Thus, it becomes possible to improve productivity.

[0061] According to the above example (the first example), as the inner cup body 46 rotates, the cleaning liquid stored in the annular groove 48 flows along the inclined surface 48a, so that the cleaning liquid easily reaches the mist guard 70. Therefore, it becomes possible to more effectively clean the entire inner peripheral surface 70a of the mist guard 70.

[0062] According to the above example (the first example), at least the lower part of the mist guard 70 can be cleaned by the cleaning liquid in the cleaning cup 60. Therefore, it becomes possible to more effectively clean the lower part of the mist guard 70 where mist is likely to adhere.

[0063] According to the above example (the first example), in step S1 and / or step S4, after at least the lower part of the mist guard 70 is immersed in the cleaning liquid in the cleaning cup 60, in steps S6 and S8, the cleaning liquid can be supplied toward the entire inner peripheral surface 70a of the mist guard 70. Usually, the cleaning liquid supplied in steps S6 and S8 has a higher cleanliness than the cleaning liquid in the cleaning cup 60. Therefore, by performing the processing in the above order, it becomes possible to more clean the inner peripheral surface 70a of the mist guard 70 after cleaning.

[0064] According to the above example (the first example), the mist guard 70 can be cleaned by a plurality of types of cleaning liquids. Therefore, it becomes possible to more clean the inner peripheral surface 70a of the mist guard 70 after cleaning.

[0065] According to the above example (the first example), water can be finally supplied to the mist guard 70. Therefore, the acidic or alkaline chemical solution supplied to the mist guard 70 before that is washed away with water. Accordingly, it becomes possible to further clean the inner peripheral surface 70a of the mist guard 70 after cleaning.

[0066] [Modified Example] The disclosure in this specification should be considered illustrative in all respects and not restrictive. Various omissions, substitutions, changes, etc. may be made to the above example without departing from the scope of the claims and their gist.

[0067] (1) In the example shown in FIGS. 11 and 12 (the second example), instead of steps S5 to S8 of the first example, the processes described below are executed. That is, with the rotation of the rotating part stopped, the controller Ctr controls the driving part 88 to horizontally move the arm 87 so that any one of the nozzles 84 to 86 is positioned above the storage space V (the space surrounded by the annular member 45 and the upper surface 43b of the support plate 43). In this state, the controller Ctr controls any one of the supply parts 81 to 83 to supply any one of the liquids L1 to L3 as a cleaning liquid from any one of the nozzles 84 to 86 to the storage space V. In the example of FIG. 11, the liquid L2 is supplied to the storage space V. Thus, a cleaning liquid (any one of the liquids L1 to L3) is stored in the storage space V. When the cleaning liquid is stored in the storage space V, the controller Ctr controls any one of the supply parts 81 to 83 to stop the supply of the cleaning liquid from any one of the nozzles 84 to 86.

[0068] Next, as illustrated in FIG. 12, the controller Ctr controls the drive unit 42 to rotate the rotating unit. The rotation speed at this time may be, for example, about 100 rpm to 1000 rpm. Thereby, the cleaning liquid stored in the storage space V scatters all at once from the storage space V to the entire inner peripheral surface 70a of the mist guard 70 (see arrow Ar6 in FIG. 12). Thereafter, although not shown, in the same manner as steps S7 and S8, different types of cleaning liquid are stored again in the storage space V, and the rotating unit is rotated, so that the cleaning liquid may be scattered all at once from the storage space V to the entire inner peripheral surface 70a of the mist guard 70.

[0069] According to the above example (the second example), as the inner cup body 46 rotates, the cleaning liquid stored in the storage space V scatters all at once toward the entire inner peripheral surface 70a of the mist guard 70. Therefore, it is possible to effectively clean the entire inner peripheral surface 70a of the mist guard 70 in an extremely short time. Accordingly, it is possible to improve productivity.

[0070] According to the above example (the second example), as the inner cup body 46 rotates, the cleaning liquid stored in the storage space V flows along the inclined surface 45a, so that the cleaning liquid easily reaches the mist guard 70. Therefore, it is possible to more effectively clean the entire inner peripheral surface 70a of the mist guard 70.

[0071] Note that the first example (cleaning the mist guard 70 with the cleaning liquid stored in the annular groove 48) and the second example (cleaning the mist guard 70 with the cleaning liquid stored in the storage space V) may be combined.

[0072] (2) The processing unit U of the example (the third example) shown in FIGS. 13 and 14 may further include a liquid diffusion unit 100 as compared with the first example. The liquid diffusion unit 100 includes a holder 101 (holding arm), a drive unit 102 (another drive unit), and a diffusion member 103.

[0073] The holder 101 is provided on the arm 87 and is configured to detachably hold the diffusion member 103. That is, the diffusion member 103 is detachable from the arm 87 via the holder 101. The holder 101 may be, for example, an air chuck using negative pressure, a magnetic chuck using an electromagnet or a permanent magnet, a mechanical chuck using mechanical force (holding force) such as gripping claws, and the like.

[0074] The drive unit 102 is configured to rotationally drive the holder 101 or the diffusion member 103 around a rotation axis extending along the vertical direction. The diffusion member 103 is configured to be movable above the rotation holding portion 40 by the drive unit 88 while being held by the holder 101. The diffusion member 103 can be positioned above the nozzle 93 as shown in FIGS. 13 and 14. The diffusion member 103 includes a base portion 103a that is detachable from the holder 101 and a diffusion portion 103b provided at an end of the base portion 103a.

[0075] The diffusion portion 103b includes a diffusion surface 103c that faces the nozzle 93 in a state where the diffusion member 103 is positioned above the nozzle 93. The diffusion surface 103c is configured to horizontally diffuse the liquid L4 supplied from the flow path 93a of the nozzle 93. The diffusion surface 103c may, for example, present a flat surface, or may present a concave curved surface that is recessed upward in a state where the diffusion member 103 is held by the holder 101. When the diffusion surface 103c is a concave curved surface, the diffusion surface 103c may present a spherical crown shape.

[0076] In the processing unit U of the third example, instead of steps S5 to S8 of the first example, the processes described below are executed. That is, the controller Ctr controls the drive unit 88 to hold the diffusion member 103 (see the dashed line in FIG. 13) disposed at a predetermined standby position in the chamber 10 by the holder 101. Next, the controller Ctr controls the drive unit 88 to move the diffusion member 103 above the rotation holding unit 40 so that the diffusion member 103 is positioned above the nozzle 93. At this time, the controller Ctr may control the drive unit 102 to rotate the diffusion member 103 held by the holder 101.

[0077] In this state, the controller Ctr controls the supply unit 91 to supply the liquid L4 from the flow path 93a of the nozzle 93 toward the diffusion surface 103c. As a result, the cleaning liquid supplied to the diffusion surface 103c is diffused in the horizontal direction and scattered all at once on the entire inner peripheral surface 70a of the mist guard 70 (see the arrow Ar7 in FIG. 13). Next, the controller Ctr may control the supply unit 92 to supply the drying gas G from the flow path 93b of the nozzle 93 toward the diffusion surface 103c. Thereby, the liquid L4 adhering to the diffusion member 103 dries. Thereafter, the controller Ctr controls the drive unit 88 to return the diffusion member 103 to a predetermined standby position in the chamber 10 (see the dashed line in FIG. 14).

[0078] According to the above example (the third example), the cleaning liquid that has collided with the diffusion member 103 is scattered all at once toward the entire inner peripheral surface 70a of the mist guard 70. Therefore, compared with the case where the cleaning liquid is supplied to the inner peripheral surface 70a of the mist guard 70 using a nozzle or the like, it is possible to effectively clean the entire inner peripheral surface 70a of the mist guard 70 in an extremely short time. Therefore, it is possible to improve productivity.

[0079] According to the above example (the third example), the liquid L4 can be supplied to the diffusion member 103 in a state where the diffusion member 103 is rotating. In this case, as the diffusion member 103 rotates, the cleaning liquid that has collided with the diffusion member 103 is likely to scatter around. Therefore, it is possible to more effectively clean the entire inner peripheral surface 70a of the mist guard 70.

[0080] According to the above example (the third example), the diffusion surface 103c of the diffusion member 103 can be a concave curved surface. In this case, since the cleaning liquid that has collided with the diffusion member 103 flows along the concave curved surface-shaped diffusion surface 103c, the cleaning liquid can easily reach the mist guard 70. Therefore, it becomes possible to more effectively clean the entire inner peripheral surface 70a of the mist guard 70.

[0081] According to the above example (the third example), the diffusion member 103 is detachably configured, and when the inner peripheral surface 70a of the mist guard 70 is not being cleaned, the diffusion member 103 can be arranged at a standby position within the chamber 10. In this case, by arranging the diffusion member at the standby position when not in use, it becomes possible to prevent a situation where the cleaning liquid adhering to the diffusion member 103 falls onto the substrate W subsequently carried into the processing unit U.

[0082] According to the above example (the third example), the diffusion member 103 can be dried by the drying gas G. In this case, it becomes possible to more reliably prevent a situation where the cleaning liquid adhering to the diffusion member 103 falls onto the substrate W subsequently carried into the processing unit U.

[0083] Note that in the above example (the third example), the diffusion member 103 may be fixed to the arm 87. The diffusion member 103 may be detachably attached or fixed to an arm different from the arm 87 provided with the nozzles 84 to 86. The diffusion member 103 may be fixed to the chamber 10 so as to always be positioned above the nozzle 93. At least one of the first example (cleaning the mist guard 70 with the cleaning liquid stored in the annular groove 48) and the second example (cleaning the mist guard 70 with the cleaning liquid stored in the storage space V) may be combined with the third example (cleaning the mist guard 70 by diffusion of the cleaning liquid by the diffusion member 103). The cleaning liquid that has collided with the diffusion member 103 and scattered around may be stored in the annular groove 48, and in the same manner as in the first example, the cleaning liquid in the annular groove 48 may be scattered all at once over the entire inner peripheral surface 70a of the mist guard 70 by rotating the rotating part.

[0084] (3) The processing unit U in the example shown in FIG. 15 (the fourth example) may further include a liquid supply unit 110 as compared with the first example. The liquid supply unit 110 includes a supply unit 111, a discharge nozzle 112, and a drive unit 113. The supply unit 111 includes a liquid source, valves, pumps, etc. (not shown), and is configured to supply the liquid L5 from the discharge nozzle 112 based on a signal from the controller Ctr. The liquid L5 may be any of the above-described liquids L1 to L3.

[0085] The discharge nozzle 112 includes a plurality of discharge ports opened on the circumferential surface, and is configured to radially discharge the cleaning liquid supplied from the supply unit 111 from the plurality of discharge ports to the surroundings. The discharge nozzle 112 is disposed above the rotation holding unit 40. As illustrated in FIG. 15, the discharge nozzle 112 may be fixed to the chamber 10 so as to always be positioned above the rotation holding unit 40. The discharge nozzle 112 may be fixed to the arm 87 or an arm different from the arm 87, or may be detachably attached.

[0086] The drive unit 113 may be configured to drive the discharge nozzle 112 so that the positions of the plurality of discharge ports of the discharge nozzle 112 are displaced in the vertical direction. For example, as illustrated in FIG. 15, the body of the discharge nozzle 112 has a nested structure, and the drive unit 113 may move the body forward and backward to change the height position of the plurality of discharge ports. Alternatively, the drive unit 113 may move the discharge nozzle 112 itself up and down to change the height position of the plurality of discharge ports.

[0087] According to the above example (the fourth example), the cleaning liquid radially discharged from the discharge nozzle 112 to the surroundings scatters all at once toward the entire inner peripheral surface 70a of the mist guard 70. Therefore, it is possible to effectively clean the entire inner peripheral surface 70a of the mist guard 70 in an extremely short time. Thus, it is possible to improve productivity.

[0088] According to the above example (the fourth example), the height position at which the cleaning liquid radially discharged from the discharge nozzle 112 reaches the inner peripheral surface 70a of the mist guard 70 can vary. Therefore, the cleaning liquid can be supplied to a wider range of the inner peripheral surface 70a of the mist guard 70. Accordingly, it becomes possible to more effectively clean the entire inner peripheral surface 70a of the mist guard 70.

[0089] In addition, at least one of the first example (cleaning the mist guard 70 with the cleaning liquid stored in the annular groove 48), the second example (cleaning the mist guard 70 with the cleaning liquid stored in the storage space V), and the third example (cleaning the mist guard 70 by diffusion of the cleaning liquid by the diffusion member 103) may be combined with the fourth example (discharging the cleaning liquid radially from the discharge nozzle 112 to clean the mist guard 70). Alternatively, as in the example of FIG. 16 (the fifth example), the cleaning liquid discharged from the discharge nozzle 112 may be stored in the annular groove 48, and by rotating the rotating part in the same manner as in the first example, the cleaning liquid in the annular groove 48 may be scattered all at once over the entire inner peripheral surface 70a of the mist guard 70.

[0090] (4) The processing unit U in the example shown in FIG. 17 (the sixth example) may include a plurality of discharge ports 93c in which the flow path 93a of the nozzle 93 is opened on the peripheral surface of the upper end portion of the nozzle 93 as compared with the first example. In this case, the cleaning liquid supplied from the supply unit 91 is radially discharged from the plurality of discharge ports 93c of the flow path 93a of the nozzle 93 and scattered all at once toward the entire inner peripheral surface 70a of the mist guard 70. Therefore, it becomes possible to effectively clean the entire inner peripheral surface 70a of the mist guard 70 in an extremely short time. Accordingly, it becomes possible to improve productivity.

[0091] In addition, at least one of the first to fifth examples may be combined with the sixth example. Also, a discharge nozzle provided with a plurality of discharge ports for discharging the cleaning liquid radially may be provided separately from the nozzle 93 on the rotation holding part 40 (for example, the support plate 43).

[0092] (5) In any of the above examples, a process of immersing the mist guard 70 in the cleaning liquid within the cleaning cup 60 may be combined. The timing at which the mist guard 70 is immersed in the cleaning liquid within the cleaning cup 60 is not particularly limited.

[0093] (6) In any of the above examples, when the cleaning liquid for cleaning the mist guard 70 is supplied, the rotating body may be rotating or may be stopped.

[0094] (7) In any of the above examples, the rotation holding part 40 may be rotated at least at the start and end of the discharge of the cleaning liquid from the discharge nozzle 112. In this case, it is possible to suppress the cleaning liquid supplied from the discharge nozzle 112 from remaining in the rotation holding part 40.

[0095] (8) In the first example, while rotating the rotating body, the cleaning liquid may be stored in the annular groove 48. Similarly, in the second example, while rotating the rotating body, the cleaning liquid may be stored in the storage space V1. The rotational speed at this time may be, for example, about 100 rpm to 1000 rpm.

[0096] (9) In the fourth and fifth examples, in order to radially discharge the cleaning liquid from the discharge nozzle 112 to the surroundings, the discharge nozzle 112 included a plurality of discharge ports opened on the circumferential surface, but a discharge nozzle including at least one discharge port on the circumferential surface may also be used. In this case, by discharging the cleaning liquid from at least one discharge port while rotating the discharge nozzle around the rotation axis extending along the vertical direction, the cleaning liquid can be scattered toward the entire inner circumferential surface 70a of the mist guard 70. Also, in this case, the discharge nozzle may be configured to swing (pivot) around a turning axis extending along the horizontal direction. In this case, it becomes possible to supply the cleaning liquid to a wider range of the inner circumferential surface 70a of the mist guard 70.

[0097] In any of the above examples, the inner peripheral surface 70a of the mist guard 70 may be cleaned using one type of cleaning liquid, or may be cleaned using a plurality of types of cleaning liquids. When using a plurality of types of cleaning liquids, the plurality of types of cleaning liquids may be supplied to the mist guard 70 simultaneously, or may be supplied to the mist guard 70 while switching in order.

[0098] [Another Example] Example 1. An example of a substrate processing apparatus includes a holding unit configured to hold a substrate, a driving unit configured to rotationally drive the holding unit, an inner cup body provided in the holding unit so as to surround the substrate held in the holding unit from the outside, a mist guard configured to surround these from the outside so that the holding unit and the inner cup body are located inside and configured to be movable up and down, a processing liquid supply unit configured to supply a processing liquid to the substrate held in the holding unit, a cleaning liquid supply unit configured to supply a cleaning liquid, and a control unit. The control unit is configured to execute a first process of supplying a processing liquid from the processing liquid supply unit to the substrate in a state where the substrate is held by the holding unit and the mist guard is raised, and after the first process, in a state where the substrate is unloaded from the holding unit and the mist guard is raised, a second process of scattering the cleaning liquid supplied from the cleaning liquid supply unit over the entire inner peripheral surface of the mist guard. By the way, if the mist of the processing liquid remains attached to the inner peripheral surface of the mist guard, there is a concern that the mist crystallizes and the crystal falls off the mist guard and adheres to the substrate. However, according to Example 1, the entire inner peripheral surface of the mist guard to which the mist of the processing liquid adheres is cleaned by the cleaning liquid supplied from the cleaning liquid supply unit. Therefore, it is possible to effectively clean the entire inner peripheral surface of the mist guard.

[0099] Example 2. In the apparatus of Example 1, the inner cup body is configured to be able to store the cleaning liquid supplied from the cleaning liquid supply unit, and includes an annular groove formed on the upper surface of the inner cup body so as to extend over the entire circumference of the inner cup body. The second process may include supplying the cleaning liquid from the cleaning liquid supply unit to the annular groove, and rotating the inner cup body together with the holding unit by the driving unit, so as to scatter the cleaning liquid stored in the annular groove over the entire inner circumferential surface of the mist guard. In this case, as the inner cup body rotates, the cleaning liquid stored in the annular groove scatters all at once toward the entire inner circumferential surface of the mist guard. Therefore, it is possible to effectively clean the entire inner circumferential surface of the mist guard in an extremely short time. Thus, it is possible to improve productivity.

[0100] Example 3. In the apparatus of Example 2, the inner wall surface on the outer peripheral side of the annular groove may be an inclined surface that inclines upward as it goes radially outward. In this case, as the inner cup body rotates, the cleaning liquid stored in the annular groove flows along the inclined surface, so that the cleaning liquid easily reaches the mist guard. Therefore, it is possible to more effectively clean the entire inner circumferential surface of the mist guard.

[0101] Example 4. In the apparatus of any one of Examples 1 to 3, the holding unit includes an annular member provided so as to protrude upward from the upper surface of the holding unit. The second process may include supplying the cleaning liquid from the cleaning liquid supply unit to the storage space surrounded by the annular member and the upper surface of the holding unit, and rotating the inner cup body together with the holding unit by the driving unit, so as to scatter the cleaning liquid stored in the storage space over the entire inner circumferential surface of the mist guard. In this case, as the inner cup body rotates, the cleaning liquid stored in the storage space scatters all at once toward the entire inner circumferential surface of the mist guard. Therefore, it is possible to effectively clean the entire inner circumferential surface of the mist guard in an extremely short time. Thus, it is possible to improve productivity.

[0102] Example 5. In the apparatus of Example 4, the inner circumferential wall surface of the annular member may be an inclined surface that slopes upward as it extends radially outward. In this case, as the inner cup body rotates, the cleaning liquid stored in the storage space flows along the inclined surface, making it easier for the cleaning liquid to reach the mist guard. Therefore, it becomes possible to more effectively clean the entire inner circumferential surface of the mist guard.

[0103] Example 6. The apparatus of Example 1 is configured to diffuse the cleaning liquid in the horizontal direction and further includes a diffusion member disposed above the holding portion. The cleaning liquid supply unit is configured to discharge the cleaning liquid upward through a through-hole provided in the holding portion. The second process may include spraying the cleaning liquid from the cleaning liquid supply unit through the through-hole toward the diffusion member, causing the cleaning liquid that collides with the diffusion member and diffuses in the horizontal direction to scatter over the entire inner circumferential surface of the mist guard. In this case, the cleaning liquid that collides with the diffusion member scatters all at once toward the entire inner circumferential surface of the mist guard. Therefore, compared with the case of supplying the cleaning liquid to the inner circumferential surface of the mist guard using a nozzle or the like, it becomes possible to effectively clean the entire inner circumferential surface of the mist guard in an extremely short time. Thus, it becomes possible to improve productivity.

[0104] Example 7. The apparatus of Example 6 further includes another drive unit configured to rotationally drive the diffusion member around a rotation axis extending in the vertical direction. The second process may include rotating the diffusion member by the other drive unit and spraying the cleaning liquid from the cleaning liquid supply unit through the through-hole toward the diffusion member, causing the cleaning liquid that collides with the diffusion member and diffuses in the horizontal direction to scatter over the entire inner circumferential surface of the mist guard. In this case, as the diffusion member rotates, the cleaning liquid that collides with the diffusion member is more likely to scatter around. Therefore, it becomes possible to more effectively clean the entire inner circumferential surface of the mist guard.

[0105] Example 8. Any of the apparatuses of Examples 1 to 5 further includes another cleaning liquid supply unit configured to discharge the cleaning liquid upward through a through-hole provided in the holding unit, and a diffusion member configured to diffuse the cleaning liquid supplied from the another cleaning liquid supply unit in the horizontal direction and configured to be disposed above the holding unit. The second process may include scattering the cleaning liquid supplied from the cleaning liquid supply unit over the entire inner peripheral surface of the mist guard in a state where the substrate is unloaded from the holding unit and the mist guard is raised, and ejecting the cleaning liquid from the another cleaning liquid supply unit through the through-hole toward the diffusion member, so that the cleaning liquid that collides with the diffusion member and diffuses in the horizontal direction is scattered over the entire inner peripheral surface of the mist guard. In this case, the same operational effects as in Example 1 and Example 6 can be obtained.

[0106] Example 9. The apparatus of Example 8 further includes another driving unit configured to rotationally drive the diffusion member around a rotation axis extending in the vertical direction. The second process may include scattering the cleaning liquid supplied from the cleaning liquid supply unit over the entire inner peripheral surface of the mist guard in a state where the substrate is unloaded from the holding unit and the mist guard is raised, and ejecting the cleaning liquid from the another cleaning liquid supply unit through the through-hole toward the diffusion member while rotating the diffusion member by the another driving unit, so that the cleaning liquid that collides with the diffusion member and diffuses in the horizontal direction is scattered over the entire inner peripheral surface of the mist guard. In this case, the same operational effects as in Example 7 can be obtained.

[0107] Example 10. In any of the apparatuses of Examples 6 to 9, the diffusion member may include a concave curved surface that is recessed upward in a state where it is disposed above the holding unit. In this case, since the cleaning liquid that collides with the diffusion member flows along the concave curved surface, the cleaning liquid easily reaches the mist guard. Therefore, it becomes possible to more effectively clean the entire inner peripheral surface of the mist guard.

[0108] Example 11. Any of the devices of Examples 6 to 10 may further include a holding arm configured to be movable above the holding part, the diffusion member may be detachable from the holding arm, and the control unit may be configured to further execute a third process of holding, by the holding arm, the diffusion member disposed at a standby position outside the mist guard before the second process and positioning the diffusion member above the holding part. In this case, by arranging the diffusion member at the standby position when not in use, it is possible to prevent a situation where the cleaning liquid adhering to the diffusion member drops onto the substrate.

[0109] Example 12. Any of the devices of Examples 6 to 10 may further include a gas supply unit configured to supply a drying gas to the diffusion member, and the control unit may be configured to further execute a fourth process of supplying the drying gas from the gas supply unit to the diffusion member after the second process. In this case, the cleaning liquid adhering to the diffusion member is dried by the drying gas. Therefore, it is possible to prevent a situation where the cleaning liquid adhering to the diffusion member drops onto the substrate.

[0110] Example 13. In any of the devices of Examples 1 to 12, the cleaning liquid supply unit may include a discharge nozzle configured to discharge the cleaning liquid radially outward from a plurality of discharge ports opened on the peripheral surface. In this case, the cleaning liquid discharged radially outward from the discharge nozzle scatters all at once toward the entire inner peripheral surface of the mist guard. Therefore, it is possible to effectively clean the entire inner peripheral surface of the mist guard in an extremely short time. Thus, it is possible to improve productivity.

[0111] Example 14. In the device according to Example 13, the discharge nozzle may be configured such that the positions of the plurality of discharge ports are displaceable in the vertical direction. In this case, the height position at which the cleaning liquid discharged radially outward from the discharge nozzle reaches the inner peripheral surface of the mist guard changes. Therefore, the cleaning liquid can be supplied to a wider range of the inner peripheral surface of the mist guard. Thus, it is possible to more effectively clean the entire inner peripheral surface of the mist guard.

[0112] Example 15. Any of the apparatuses of Examples 1 to 14 may further include a cleaning cup configured to surround at least the lower part of the mist guard from the outside and store a cleaning liquid therein, and the control unit may be further configured to execute a fifth process of immersing at least the lower part of the mist guard in the lowered state in the cleaning liquid in the cleaning cup. In this case, at least the lower part of the mist guard is cleaned by the cleaning liquid in the cleaning cup. Therefore, it is possible to more effectively clean the lower part of the mist guard where mist is likely to adhere.

[0113] Example 16. In the apparatus of Example 15, the fifth process may be performed before the second process. In this case, after at least the lower part of the mist guard is cleaned with the cleaning liquid in the cleaning cup, the entire inner peripheral surface of the mist guard is cleaned with the cleaning liquid supplied from the cleaning liquid supply unit. Usually, the cleaning liquid supplied from the cleaning liquid supply unit has a higher cleanliness than the cleaning liquid in the cleaning cup. Therefore, by performing the processes in the order as in Example 16, it is possible to more clean the inner peripheral surface of the mist guard after cleaning.

[0114] Example 17. In any of the apparatuses of Examples 1 to 16, the cleaning liquid supplied from the cleaning liquid supply unit includes a first liquid and a second liquid selected from an acidic chemical solution, an alkaline chemical solution, and water, and the second process may include spraying the first liquid and the second liquid onto the entire inner peripheral surface of the mist guard in order while switching between the first liquid and the second liquid supplied from the cleaning liquid supply unit. In this case, the mist guard is cleaned with a plurality of types of cleaning liquids. Therefore, it is possible to more clean the inner peripheral surface of the mist guard after cleaning.

[0115] Example 18. In the apparatus of Example 17, the first liquid is an acidic chemical solution or an alkaline chemical solution, the first liquid is water, and the second treatment may include spraying the first liquid and the second liquid onto the entire inner peripheral surface of the mist guard in this order while switching between the first liquid and the second liquid from the cleaning liquid supply unit. In this case, water is finally supplied to the mist guard. Therefore, the acidic chemical solution or the alkaline chemical solution supplied to the mist guard before that is washed away with water. Thus, it becomes possible to further clean the inner peripheral surface of the mist guard after cleaning.

[0116] Example 19. An example of the method for cleaning the mist guard is as follows: in a state where the substrate is held by the holding unit, and with the mist guard surrounding the holding unit and the inner cup body provided in the holding unit so as to surround the substrate held by the holding unit from the outside in an elevated state, a first step of supplying a processing liquid from the processing liquid supply unit to the substrate; after the first step, in a state where the substrate is unloaded from the holding unit and the mist guard is elevated, a second step of storing the cleaning liquid supplied from the cleaning liquid supply unit in an annular groove provided on the upper surface of the inner cup body extending over the entire circumference of the inner cup body, or in a storage space surrounded by an annular member provided so as to protrude upward from the upper surface of the holding unit and the upper surface of the holding unit; after the second step, in a state where the mist guard is elevated, a third step of rotating the inner cup body together with the holding unit to scatter the cleaning liquid stored in the annular groove or the storage space over the entire inner peripheral surface of the mist guard. In this case, the same operational effects as in Examples 1, 2, and 4 can be obtained.

[0117] Example 20. The method of Example 19 may further include a fourth step of immersing at least the lower part of the mist guard in the cleaning liquid stored in the cleaning cup. In this case, the same operational effects as in Example 15 can be obtained.

Explanation of Reference Numerals

[0118] 1… Substrate processing system (substrate processing apparatus), 40… Rotating holding unit, 42… Driving unit, 43… Support plate (holding unit), 43a… Through hole, 43b… Upper surface, 45… Annular member, 45a… Inclined surface, 46… Inner cup body, 46a… Upper surface, 48… Annular groove, 48a… Inclined surface, 60… Cleaning cup, 70… Mist guard, 70a… Inner peripheral surface, 73… Driving unit, 80… Upper supply unit (processing liquid supply unit, cleaning liquid supply unit), 81 - 83… Supply units, 87… Arm (holding arm), 90… Lower supply unit (another cleaning liquid supply unit, gas supply unit), 100… Liquid diffusion unit, 101… Holder (holding arm), 102… Driving unit (another driving unit), 103… Diffusion member, 103c… Diffusion surface, 110… Liquid supply unit, 111… Supply unit, 112… Discharge nozzle, Ctr… Controller (control unit), G… Drying gas, L1, L2… Liquid (processing liquid), L1 - L4… Liquid (cleaning liquid), U… Processing unit, V… Storage space, W… Substrate.

Claims

1. A holding part configured to hold a substrate; A driving part configured to rotationally drive the holding part; An inner cup body provided on the holding part so as to surround the substrate held by the holding part from the outside; A mist guard configured to surround the holding part and the inner cup body from the outside so that they are located inside, and configured to be movable up and down; A processing liquid supply part configured to supply a processing liquid to the substrate held by the holding part; A cleaning liquid supply part configured to supply a cleaning liquid; And a control part, The control part is In a state where the substrate is held by the holding part and the mist guard is raised, a first process of supplying a processing liquid from the processing liquid supply part to the substrate; After the first process, in a state where the substrate is carried out from the holding part and the mist guard is raised, a second process of scattering the cleaning liquid supplied from the cleaning liquid supply part over the entire inner peripheral surface of the mist guard is executed. The inner cup body is configured to be able to store the cleaning liquid supplied from the cleaning liquid supply part, and includes an annular groove formed on the upper surface of the inner cup body so as to extend over the entire circumference of the inner cup body. The second process includes supplying a cleaning liquid from the cleaning liquid supply part to the annular groove, and rotating the inner cup body together with the holding part by the driving part, so as to scatter the cleaning liquid stored in the annular groove over the entire inner peripheral surface of the mist guard. A substrate processing apparatus, wherein an inner wall surface on the outer peripheral side of the annular groove is an inclined surface that inclines upward as it goes radially outward.

2. The holding part includes an annular member provided so as to protrude upward from the upper surface of the holding part. The second process includes supplying a cleaning liquid from the cleaning liquid supply unit to a storage space surrounded by the annular member and the upper surface of the holding unit, and rotating the inner cup body together with the holding unit by the driving unit to scatter the cleaning liquid stored in the storage space over the entire inner circumferential surface of the mist guard. The apparatus according to claim 1.

3. The apparatus according to claim 2, wherein the inner circumferential side wall surface of the annular member is an inclined surface that inclines upward as it goes radially outward.

4. A holding unit configured to hold a substrate, A driving unit configured to rotationally drive the holding unit, An inner cup body provided in the holding unit so as to surround the substrate held by the holding unit from the outside, A mist guard configured to surround these from the outside so that the holding unit and the inner cup body are located inside and configured to be movable up and down, A processing liquid supply unit configured to supply a processing liquid to the substrate held by the holding unit, A cleaning liquid supply unit configured to supply a cleaning liquid, A diffusion member configured to diffuse the cleaning liquid in the horizontal direction and disposed above the holding unit, And a control unit, The cleaning liquid supply unit is configured to discharge the cleaning liquid upward through a through hole provided in the holding unit, The control unit, A first process of supplying a processing liquid from the processing liquid supply unit to the substrate in a state where the substrate is held by the holding unit and the mist guard is raised, After the first process, a second process of scattering the cleaning liquid supplied from the cleaning liquid supply unit over the entire inner circumferential surface of the mist guard in a state where the substrate is carried out from the holding unit and the mist guard is raised is executed. The substrate processing apparatus, wherein the second process includes spraying a cleaning liquid from the cleaning liquid supply unit through the through hole toward the diffusion member, so that the cleaning liquid that collides with the diffusion member and diffuses in the horizontal direction scatters over the entire inner peripheral surface of the mist guard.

5. The apparatus further comprises another drive unit configured to rotationally drive the diffusion member around a rotation axis extending in the vertical direction. The apparatus according to claim 4, wherein the second process includes rotating the diffusion member by the another drive unit and spraying a cleaning liquid from the cleaning liquid supply unit through the through hole toward the diffusion member, so that the cleaning liquid that collides with the diffusion member and diffuses in the horizontal direction scatters over the entire inner peripheral surface of the mist guard.

6. A holding unit configured to hold a substrate, a drive unit configured to rotationally drive the holding unit, an inner cup body provided on the holding unit so as to surround the substrate held by the holding unit from the outside, a mist guard configured to surround the holding unit and the inner cup body from the outside so that they are located inside and configured to be movable up and down, a processing liquid supply unit configured to supply a processing liquid to the substrate held by the holding unit, a cleaning liquid supply unit configured to supply a cleaning liquid, another cleaning liquid supply unit configured to discharge the cleaning liquid upward through a through hole provided in the holding unit, a diffusion member configured to diffuse the cleaning liquid supplied from the another cleaning liquid supply unit in the horizontal direction and configured to be disposed above the holding unit, and a control unit. The control unit, in a state where the substrate is held by the holding unit and the mist guard is raised, performs a first process of supplying a processing liquid from the processing liquid supply unit to the substrate, After the first process, in a state where the substrate is unloaded from the holding unit and the mist guard is raised, a second process is executed to scatter the cleaning liquid supplied from the cleaning liquid supply unit over the entire inner peripheral surface of the mist guard. The second process includes scattering the cleaning liquid supplied from the cleaning liquid supply unit over the entire inner peripheral surface of the mist guard in a state where the substrate is unloaded from the holding unit and the mist guard is raised, and spraying the cleaning liquid from the other cleaning liquid supply unit toward the diffusion member through the through hole, so that the cleaning liquid that collides with the diffusion member and diffuses in the horizontal direction is scattered over the entire inner peripheral surface of the mist guard. A substrate processing apparatus.

7. The apparatus further includes another drive unit configured to rotationally drive the diffusion member around a rotation axis extending in the vertical direction. The second process includes scattering the cleaning liquid supplied from the cleaning liquid supply unit over the entire inner peripheral surface of the mist guard in a state where the substrate is unloaded from the holding unit and the mist guard is raised, and while rotating the diffusion member by the other drive unit, spraying the cleaning liquid from the other cleaning liquid supply unit toward the diffusion member through the through hole, so that the cleaning liquid that collides with the diffusion member and diffuses in the horizontal direction is scattered over the entire inner peripheral surface of the mist guard. The apparatus according to claim 6.

8. The diffusion member includes a concave curved surface that is recessed upward in a state where it is disposed above the holding unit. The apparatus according to any one of claims 4 to 7.

9. The apparatus further includes a holding arm configured to be movable above the holding unit. The diffusion member is detachable from the holding arm. The control unit is further configured to execute a third process of holding the diffusion member disposed at a standby position outside the mist guard by the holding arm and positioning the diffusion member above the holding unit before the second process. The apparatus according to any one of claims 4 to 8.

10. further comprising a gas supply unit configured to supply a drying gas to the diffusion member, The control unit is configured to further execute a fourth process of supplying a drying gas from the gas supply unit to the diffusion member after the second process, according to any one of claims 4 to 8.

11. The cleaning liquid supply unit includes a discharge nozzle configured to discharge the cleaning liquid radially outward from a plurality of discharge ports opened on the peripheral surface, according to any one of claims 1 to 10.

12. The discharge nozzle is configured such that the positions of the plurality of discharge ports are displaceable in the vertical direction, according to claim 11.

13. further comprising a cleaning cup configured to surround at least the lower part of the mist guard from the outside and store the cleaning liquid inside, The control unit is configured to further execute a fifth process of immersing at least the lower part of the mist guard in the lowered state in the cleaning liquid in the cleaning cup, according to any one of claims 1 to 12.

14. The fifth process is performed before the second process, according to claim 13.

15. The cleaning liquid supplied from the cleaning liquid supply unit includes a first liquid and a second liquid selected from an acidic chemical solution, an alkaline chemical solution, and water, The second process includes scattering the first liquid and the second liquid in order over the entire inner peripheral surface of the mist guard by alternately supplying the first liquid and the second liquid from the cleaning liquid supply unit while switching between them, according to any one of claims 1 to 14.

16. A holding unit configured to hold a substrate, a driving unit configured to rotationally drive the holding unit, an inner cup body provided on the holding unit so as to surround the substrate held by the holding unit from the outside, A mist guard configured to surround these from the outside so that the holding part and the inner cup body are located inside and configured to be movable up and down; A processing liquid supply unit configured to supply a processing liquid to the substrate held by the holding part; A cleaning liquid supply unit configured to supply a cleaning liquid; And a control unit, The control unit, A first process of supplying a processing liquid from the processing liquid supply unit to the substrate in a state where the substrate is held by the holding part and the mist guard is raised; After the first process, in a state where the substrate is carried out from the holding part and the mist guard is raised, a second process of scattering the cleaning liquid supplied from the cleaning liquid supply unit over the entire inner peripheral surface of the mist guard is executed. Configured, The cleaning liquid supplied from the cleaning liquid supply unit includes a first liquid and a second liquid selected from an acidic chemical solution, an alkaline chemical solution, and water, The second process includes scattering the first liquid and the second liquid over the entire inner peripheral surface of the mist guard in order by switching and supplying the first liquid and the second liquid from the cleaning liquid supply unit. A substrate processing apparatus.

17. The first liquid is an acidic chemical solution or an alkaline chemical solution, The second liquid is water, The second process includes scattering the first liquid and the second liquid over the entire inner peripheral surface of the mist guard in this order by switching and supplying the first liquid and the second liquid from the cleaning liquid supply unit. The apparatus according to claim 15 or 16.

18. A first step of supplying a processing liquid from a processing liquid supply unit to the substrate in a state where the substrate is held by a holding part and the mist guard that surrounds the holding part and the inner cup body provided in the holding part so as to surround the substrate held by the holding part from the outside is raised; After the first step, with the substrate being unloaded from the holding part and the mist guard being raised, a second step of storing the cleaning liquid supplied from the cleaning liquid supply part in an annular groove provided on the upper surface of the inner cup body so as to extend over the entire circumference of the inner cup body, or in a storage space surrounded by an annular member provided so as to protrude upward from the upper surface of the holding part and the upper surface of the holding part. After the second step, with the mist guard being raised, a third step of rotating the inner cup body together with the holding part to scatter the cleaning liquid stored in the annular groove or the storage space over the entire inner circumferential surface of the mist guard. A method for cleaning a mist guard, wherein an inner wall surface on the outer peripheral side of the annular groove is an inclined surface that inclines upward as it goes radially outward.

19. A first step of supplying a processing liquid from a processing liquid supply part to a substrate in a state where the substrate is held by a holding part and with a mist guard that surrounds the holding part and an inner cup body provided on the holding part so as to surround the substrate held by the holding part from the outside being in a raised state. After the first step, with the substrate being unloaded from the holding part and the mist guard being raised, a second step of spraying the cleaning liquid from the cleaning liquid supply part through a through hole provided in the holding part toward a diffusion member located above the through hole, so that the cleaning liquid that collides with the diffusion member and diffuses horizontally is scattered over the entire inner circumferential surface of the mist guard.

20. A first step of supplying a processing liquid from a processing liquid supply part to a substrate in a state where the substrate is held by a holding part and with a mist guard that surrounds the holding part and an inner cup body provided on the holding part so as to surround the substrate held by the holding part from the outside being in a raised state. After the first step, with the substrate being unloaded from the holding part and the mist guard being raised, the cleaning liquid supplied from the cleaning liquid supply part is scattered over the entire inner peripheral surface of the mist guard, and through the through hole provided in the holding part, the cleaning liquid is jetted from another cleaning liquid supply part toward the diffusion member located above the through hole, so that the cleaning liquid that has collided with the diffusion member and diffused in the horizontal direction is scattered over the entire inner peripheral surface of the mist guard. A second step is included, which is a method for cleaning a mist guard.

21. The method according to any one of claims 18 to 20, further comprising a fourth step of immersing at least a lower portion of the mist guard in the cleaning liquid stored in the cleaning cup.

22. In a state where the substrate is held by the holding part, and with the inner cup body provided in the holding part so as to surround the substrate held by the holding part from the outside and the mist guard surrounding these from the outside so as to be located inside, a first step of supplying a processing liquid from a processing liquid supply part to the substrate, After the first step, with the substrate being unloaded from the holding part and the mist guard being raised, a first liquid and a second liquid selected from an acidic chemical solution, an alkaline chemical solution, and water are supplied from a cleaning liquid supply part while switching between them, so that the first liquid and the second liquid are sequentially scattered over the entire inner peripheral surface of the mist guard. A second step is included, which is a method for cleaning a mist guard.

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