Array substrate, method for manufacturing the same, fingerprint recognition method, and display device

Abstract

To disclose an array substrate, its manufacturing method, a fingerprint recognition method and a display device.SOLUTION: The array substrate includes a base substrate (11), and a plurality of pixel units (01) and a plurality of fingerprint recognition units (02) located in a display area of the base substrate (11). The fingerprint recognition unit (02) includes a light-shielding layer (21) and a photosensitive image sensor (23) located on the base substrate (11). A via hole (22) for performing pinhole imaging is installed on the light-shielding layer (21). An orthographic projection of the via hole (22) in the base substrate (11) is not overlapped on an orthographic projection of the pixel units (01) in the base substrate (11). The photographic image sensor (23) receives an image formed by a fingerprint through the via hole (22).SELECTED DRAWING: Figure 2a

Description

Technical Field

[0001] This application claims the priority of a Chinese patent application with the application number 201711338861.0 and the disclosure title of "Array Substrate, Its Manufacturing Method, Fingerprint Recognition Method and Display Device", which was filed with the Chinese Patent Office on December 14, 2017, and the entire content thereof is incorporated herein by reference.

[0002] The present disclosure relates to the technical field of touch displays, and particularly to an array substrate, its manufacturing method, a fingerprint recognition method, and a display device.

Background Art

[0003] Fingerprints are unique and immutable features inherent to the human body that can distinguish an individual from others. They are composed of a series of ridges and valleys on the surface of the fingertip skin, and the uniqueness of the fingerprint pattern is determined by the details that make up these ridges and valleys. Based on this, a display panel with a fingerprint recognition function that has been developed is already used for personal identity authentication and improves the information security of the display device. Currently, in a display panel equipped with a fingerprint recognition function, the fingerprint recognition area is installed in the non-display area of the display panel. Such an arrangement increases the area of the non-display area of the display panel, which is disadvantageous for the narrow bezel display of the display panel.

Summary of the Invention

[0004] The array substrate according to an embodiment of the present disclosure is a base substrate, including a plurality of pixel units and a plurality of fingerprint recognition units located in the display area of the base substrate, the fingerprint recognition unit includes a light-shielding layer and a photosensitive image sensor located on the base substrate, the light-shielding layer is provided with via holes for pinhole imaging, the orthographic projection of the via hole on the base substrate does not overlap with all the orthographic projections of the pixel units on the base substrate, the photosensitive image sensor receives an image formed by a fingerprint passing through the via hole.

[0005] In an embodiment of the present disclosure, the distance between the centers of two adjacent via holes satisfies

[0006]

Number

[0007] wherein, d represents the distance between the centers of two adjacent via holes, D represents the diameter of the via hole, and h represents the distance from the lower surface of the light-shielding layer to the upper surface of the photosensitive image sensor, and h d represents the thickness of the light-shielding layer. t It may be set like this.

[0008] In an embodiment of the present disclosure, the value range of the diameter of the via hole may be 5 μm to 20 μm.

[0009] In an embodiment of the present disclosure, the via holes may be arranged in an array on the base substrate.

[0010] In an embodiment of the present disclosure, the orthographic projection of the light-shielding layer on the base substrate may cover the orthographic projection of the pixel unit on the base substrate.

[0011] In an embodiment of the present disclosure, the light-shielding layer may be located on one side of the base substrate where the pixel unit is installed.

[0012] In an embodiment of the present disclosure, the light-shielding layer may be located between the base substrate and the pixel unit.

[0013] In an embodiment of the present disclosure, the array substrate may further include a low-temperature dielectric layer located between the light-shielding layer and the pixel unit.

[0014] In an embodiment of the present disclosure, the array substrate further includes a lead wire connected to the pixel unit, The orthographic projection of the via hole on the base substrate may be arranged not to overlap with all of the orthographic projections of the lead wires on the base substrate.

[0015] In an embodiment of the present disclosure, the base substrate may include at least two flexible layers, and the light-shielding layer may be disposed between two adjacent flexible layers.

[0016] In an embodiment of the present disclosure, the photosensitive image sensor may be located on one side of the base substrate opposite to the light-shielding layer and at a position corresponding to the via hole.

[0017] In an embodiment of the present disclosure, the photosensitive image sensor may include a CCD photosensitive image sensor or a CMOS photosensitive image sensor.

[0018] The embodiment of the present disclosure further provides a method for manufacturing an array substrate according to the embodiment of the present disclosure. The manufacturing method includes: forming a plurality of pixel units and a plurality of fingerprint recognition units in a display area of a base substrate; The fingerprint recognition unit includes a light-shielding layer and a photosensitive image sensor located on the base substrate. The light-shielding layer is provided with a via hole for pinhole imaging. The orthographic projection of the via hole on the base substrate does not overlap with the orthographic projection of the pixel unit on the base substrate, and the photosensitive image sensor receives an image formed by a fingerprint through the via hole.

[0019] In an embodiment of the present disclosure, the manufacturing method specifically includes: forming the light-shielding layer on the base substrate; patterning the light-shielding layer to form the via hole in an area where the fingerprint recognition unit is located; forming the pixel unit on the light-shielding layer where the via hole is formed; The step of installing the photosensitive image sensor at a position corresponding to the via hole on one side of the base substrate opposite to the light-shielding layer may be included.

[0020] Embodiments of the present disclosure further provide a fingerprint recognition method for an array substrate according to the embodiments of the present disclosure. This fingerprint recognition method includes a step of obtaining an imaging image on the photosensitive image sensor, where the fingerprint reflects the light emitted from the pixel unit and is imaged on the photosensitive image sensor corresponding to the via hole through the via hole; a step of determining a complete fingerprint image of the fingerprint based on the image imaged on the obtained photosensitive image sensor.

[0021] Embodiments of the present disclosure further provide a display device including an array substrate according to the embodiments of the present disclosure.

Brief Description of the Drawings

[0022]

Figure 1

Figure 2a

Figure 2b

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Modes for Carrying Out the Invention

[0023] To make the objectives, technical solutions, and advantages of the present disclosure clearer, the present disclosure will be described in more detail below with reference to the drawings. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, not all of them. And, unless there is a contradiction, the embodiments in the present application and the features in the embodiments can be combined with each other. All other embodiments that can be conceived by those skilled in the art based on the embodiments of the present disclosure without creative efforts belong to the patent scope of the present disclosure.

[0024] Hereinafter, with reference to the drawings, specific embodiments of an array substrate, a manufacturing method thereof, a fingerprint recognition method, and a display device according to embodiments of the present disclosure will be described in detail. In the drawings, the thickness and shape of each film layer are not actual ratios, but only for schematically explaining the content of the present disclosure.

[0025] The array substrate according to an embodiment of the present disclosure is as shown in FIGS. 1 to 2b. The array substrate includes a base substrate 11, and a plurality of pixel units 01 and a plurality of fingerprint recognition units 02 located in the display area of the base substrate 11. The fingerprint recognition unit 02 may include a light-shielding layer 21 and a photosensitive image sensor 23 located on the base substrate 11. The light-shielding layer 21 is provided with via holes 22 for pinhole imaging, and the orthographic projection of the via holes 22 on the base substrate 11 does not overlap with the orthographic projection of the pixel units 01 on the base substrate 11. And, the photosensitive image sensor 23 receives an image formed by a fingerprint passing through the via holes 22.

[0026] In the above array substrate according to an embodiment of the present disclosure, by installing the fingerprint recognition unit in the display area of the array substrate, the area of the non-display area of the array substrate can be reduced, which is advantageous for the narrow bezel design of the array substrate. Furthermore, since the orthographic projection of the via holes of the fingerprint recognition unit on the base substrate does not overlap with all the orthographic projections of the pixel units on the base substrate, the blocking of the fingerprint recognition unit by each film layer of the pixel unit is avoided without affecting the aperture ratio of the array substrate, enabling the array substrate to realize the fingerprint recognition function.

[0027] Generally, lead lines for transmitting signals to pixel units are installed in the display area of the array substrate. When specifically implemented, as shown in FIG. 2b, the array substrate may further include lead lines 12 connected to pixel unit 01. Since the lead lines 12 are generally installed in the gaps between adjacent pixel units 01, the blocking of the fingerprint recognition unit by the lead lines 12 is avoided, and the orthographic projection of the via hole 22 on the base substrate 11 does not overlap with all the orthographic projections of the lead lines 12 on the base substrate 11, thereby avoiding the blocking of the fingerprint recognition unit by the lead lines 12.

[0028] Organic Light Emitting Diode (OLED) has advantages such as low energy consumption, low production cost, self-luminance, wide viewing angle, and high response speed. When specifically implemented, in the embodiments of the present disclosure, the pixel unit includes an OLED and a pixel circuit for driving the OLED to emit light. The above lead lines may be signal lines for inputting various signals to the pixel circuit, such as a gate line GT, a data line DT, a high voltage signal line, a reference voltage signal line, and the like.

[0029] Specifically, in the above array substrate according to the embodiments of the present disclosure, when performing fingerprint recognition, light is emitted from the pixel unit and irradiated onto the fingerprint, the light irradiated by the fingerprint is reflected, and imaging is performed on the photosensitive image sensor through the via hole installed on the light shielding layer, thereby obtaining an imaging image on the photosensitive image sensor. Based on the obtained image imaged on the photosensitive image sensor, a complete fingerprint image of the fingerprint is determined, and by processing the fingerprint information, the recognition of the fingerprint is realized. In order to avoid affecting the imaging effect of the via hole or being unable to perform imaging on the photosensitive image sensor, the via hole is a via hole manufactured in the light shielding layer on the base substrate. The via hole on the light shielding layer may be installed at a position not blocked by the pixel unit and the lead lines connected to the pixel unit.

[0030] In addition, the diameter of this via hole needs to meet the requirements for the diameter of the pinhole according to the pinhole imaging principle. When actually applied, specifically, the size of the diameter of the via hole may be designed according to the actual application environment, but it is not particularly limited here. In order to improve the resolution accuracy of fingerprint recognition by each fingerprint recognition unit, the diameter of the via hole should be made as small as possible, but it should not be too small. If the diameter of the via hole is too small, the illuminance on the surface of the photosensitive image sensor will be excessively low, and it is easy to occur that imaging data is difficult to extract. Therefore, when combined with the photosensitivity of the photosensitive image sensor according to the actual structure of the array substrate and the lamination method of the film layers used, specifically when implementing, in the above array substrate according to the embodiment of the present disclosure, the value range of the diameter of each via hole may be set to 5μm to 20μm.

[0031] Specifically when implementing, in the array substrate, the fingerprint recognition units may be evenly distributed throughout the array substrate, or may be distributed in a specific area of the array substrate, and it is not particularly limited here.

[0032] Specifically when implementing, the via holes may be evenly installed on the base substrate. Generally, when imaging using the pinhole imaging principle, the imaging at the center of the pinhole is clear, and the imaging becomes blurred towards the edge. Therefore, the via holes of the fingerprint recognition units can be installed in an array arrangement. By doing so, the fingerprint is divided, and when imaging the fingerprint, the imaging of each fingerprint recognition unit needs to include the imaging of the adjacent fingerprint recognition unit. As shown in FIGS. 3 and 4, there is a fingerprint overlap region A, that is, a co-imaging part, so that in subsequent image extraction and processing, the fingerprint images obtained by recognizing each fingerprint can be joined together to integrate a complete and clear image.

[0033] When specifically implemented, in the above array substrate according to the embodiments of the present disclosure, it includes a plurality of fingerprint recognition units, and there may be a certain interval for each fingerprint recognition unit. If there is no interval, an overlapping area will occur in the image formed on the photosensitive image sensor through the via holes of each fingerprint recognition unit. As shown in FIG. 3, there is an imaging overlapping area B, thereby making it difficult to separate fingerprint images when processing the imaging data in the photosensitive image sensor.

[0034] When specifically implemented, as shown in FIG. 4, when recognizing fingerprints, there is a fingerprint overlapping area A, but there is no imaging overlapping area B, that is, in the above array substrate according to the embodiments of the present disclosure, so that objects overlap but images do not overlap, the distance between the centers of any two adjacent via holes

[0035]

Number

[0036] may satisfy the following formula: In the formula, d represents the distance between the centers of two adjacent via holes 22, D represents the diameter of the via hole 22, and h d represents the distance from the lower surface of the light-shielding layer 21 to the upper surface of the photosensitive image sensor 23, and h t represents the thickness of the light-shielding layer 21. When the distance between the centers of each via hole 22 satisfies the requirements of the above formula in this way, the distance between the centers of each via hole 22 is not particularly large, and the existence of the fingerprint overlapping area A is possible. Therefore, a complete and clear image can be obtained by processing the imaging data. Furthermore, in order to ensure that there is no imaging overlapping area B in the image formed on the photosensitive image sensor 23, there is also a certain interval between each via hole 22, and fingerprints are recognized by extracting and processing the imaging data.

[0037] In addition, in order to meet the imaging requirements of the photosensitive image sensor, the size of the region of the image formed by the fingerprint details (for example, adjacent ridges and valleys) on the image sensor may correspond to at least the size of three pixel units, and in this case, the fingerprint can be accurately recognized.

[0038] Specifically, in the above array substrate according to the embodiments of the present disclosure, the light-shielding layer may be located only in the region where the fingerprint recognition unit is located, or may be deposited on the entire base substrate, and may be selected according to specific usage scenarios so as not to affect the display characteristics of the array substrate, and is not particularly limited here.

[0039] When specifically implemented, in the above array substrate according to the embodiments of the present disclosure, as shown in FIGS. 2a and 5, the light-shielding layer 21 may be located on one side of the base substrate 11 where the pixel unit 01 is installed. Further, in the above array substrate according to the embodiments of the present disclosure, since the pixel unit includes a pixel circuit, the pixel circuit may include a thin-film transistor, and the OLED is on one side of the thin-film transistor away from the base substrate. That is, the light-shielding layer 21 may be on one side of the base substrate 11 where the thin-film transistor is installed.

[0040] When specifically implemented, as shown in FIGS. 2a and 5, the light-shielding layer 21 may be located between the base substrate 11 and the pixel unit 01. Further, when specifically implemented, as shown in FIG. 2a, the orthographic projection of the light-shielding layer 21 on the base substrate 11 may not overlap with the orthographic projection of the pixel unit 01 on the base substrate 11. Alternatively, as shown in FIG. 5, the orthographic projection of the light-shielding layer 21 on the base substrate 11 may cover the orthographic projection of the pixel unit 01 on the base substrate 11.

[0041] When specifically implemented, in the above array substrate according to the embodiments of the present disclosure, the material of the light-shielding layer may be a metal material or a non-metal material capable of light shielding. When manufacturing the light-shielding layer, via holes penetrating the light-shielding layer are formed on the light-shielding layer through a mask plate.

[0042] When specifically implemented, in the above array substrate according to the embodiments of the present disclosure, as shown in FIG. 5, the array substrate may further include a low-temperature dielectric layer 31 located between the light-shielding layer 21 and the pixel unit 01. Further, the low-temperature dielectric layer 31 is located between the thin-film transistor and the light-shielding layer, thereby avoiding the influence on the process of the thin-film transistor in the pixel unit. Especially when the material of the light-shielding layer is a metal material, the installation of the low-temperature dielectric layer 31 can avoid the influence of the light-shielding layer on the process of the thin-film transistor in the pixel unit.

[0043] When specifically implemented, in the above array substrate according to the embodiments of the present disclosure, the array substrate may be a rigid array substrate. When the array substrate is a rigid array substrate, the base substrate may be a glass substrate, a sapphire substrate, a quartz substrate, a plastic substrate, etc.

[0044] When specifically implemented, in the above array substrate according to the embodiments of the present disclosure, the array substrate may be a flexible array substrate. When the array substrate may be a flexible array substrate, the base substrate is a flexible substrate. For example, a PI substrate can be used. Of course, other flexible material substrates may also be used, and it is not limited here.

[0045] In addition, when the base substrate is a flexible substrate, it may include one flexible layer or at least two flexible layers, which is not limited in the present disclosure. When the base substrate includes at least two flexible layers, the light-shielding layer can be installed between the two flexible layers, thereby eliminating the need to separately install a low-temperature dielectric layer and further reducing the thickness of the film layer in the array substrate.

[0046] When specifically implemented, in the above array substrate according to the embodiments of the present disclosure, as shown in FIG. 5, the photosensitive image sensor 23 may be located at a position corresponding to the via hole 22 on one side of the base substrate 11 opposite to the light-shielding layer 21.

[0047] Specifically, in the above array substrate according to the embodiment of the present disclosure, the photosensitive image sensor and the light-shielding layer are located on both sides of the base substrate, and the photosensitive image sensor is located at a position corresponding to the via hole, which is conducive to imaging in the photosensitive image sensor.

[0048] In addition, one photosensitive image sensor may be installed on the array substrate. Imaging is performed in each area of the photosensitive image sensor through each via hole, and then fingerprints are recognized by processing the images formed in each area of the photosensitive image sensor. Of course, a plurality of photosensitive image sensors may be installed on the array substrate. In this case, the photosensitive image sensors correspond to each via hole one-to-one, or one photosensitive image sensor corresponds to a plurality of via holes, and they may be installed according to specific applications, without particular limitation here.

[0049] When specifically implemented, in the above array substrate according to the embodiment of the present disclosure, the photosensitive image sensor may include a CCD photosensitive image sensor or a CMOS photosensitive image sensor. Of course, as the photosensitive image sensor, other photosensitive image sensors capable of recognizing fingerprints may also be used, without particular limitation here.

[0050] Based on the same inventive concept, the embodiment of the present disclosure further provides a manufacturing method of an array substrate. This manufacturing method of the array substrate includes a step of forming a plurality of pixel units and a plurality of fingerprint recognition units in the display area of the base substrate. The fingerprint recognition unit includes a light-shielding layer and a photosensitive image sensor located on the base substrate. The light-shielding layer is provided with via holes for pinhole imaging. The orthographic projection of the via hole on the base substrate does not overlap with the orthographic projection of the pixel unit on the base substrate. The photosensitive image sensor receives the image formed by the fingerprint passing through the via hole.

[0051] The principle by which the manufacturing method of the array substrate solves the problem is similar to that of the aforementioned array substrate. Therefore, for the implementation of the manufacturing method of the array substrate, reference may be made to the implementation of the aforementioned array substrate, and repeated descriptions are omitted.

[0052] When specifically implemented, the light-shielding layer may be installed between the pixel unit and the base substrate. As shown in FIG. 6, the manufacturing method according to the embodiment of the present disclosure may specifically include steps S601 to S604.

[0053] S601. Form a light-shielding layer on the base substrate.

[0054] S602. Pattern the light-shielding layer to form via holes in the region where the fingerprint recognition unit is located. The orthographic projection of the via hole in the base substrate does not overlap with the orthographic projection of the pixel unit in the base substrate.

[0055] S603. Form a pixel unit on the light-shielding layer where the via holes are formed. Of course, step S603 may include forming lead wires connected to the pixel unit. The orthographic projection of the via hole in the base substrate does not overlap with the orthographic projection of the lead wire in the base substrate.

[0056] S604. Install a photosensitive image sensor at a position corresponding to the via hole on one side of the base substrate opposite to the light-shielding layer.

[0057] Based on the same inventive concept, the embodiment of the present disclosure further provides a fingerprint recognition method using the above array substrate. As shown in FIG. 7, it may include steps S701 to S702.

[0058] S701. Obtain an imaging image on the photosensitive image sensor. The imaging image is an image in which the fingerprint reflects the light emitted from the pixel unit and is imaged on the photosensitive image sensor corresponding to the via hole through the via hole.

[0059] S702. Determine a complete fingerprint image based on the image imaged by the obtained photosensitive image sensor. Specifically, the images imaged by the photosensitive image sensor are joined together to align the complete fingerprint image.

[0060] The principle by which the fingerprint recognition method solves the problem is similar to that of the aforementioned array substrate. Therefore, for the implementation of the fingerprint recognition method, reference may be made to the implementation of the aforementioned array substrate, and repeated descriptions are omitted.

[0061] Based on the same inventive concept, an embodiment of the present disclosure further provides a display device including any one of the array substrates according to the embodiments of the present disclosure. The principle by which the display device solves the problem is similar to that of the aforementioned array substrate. Therefore, for the implementation of the display device, reference may be made to the embodiments of the above array substrate, and repeated descriptions are omitted.

[0062] When specifically implemented, the display device according to the embodiment of the present disclosure may be any product or component having a display function, such as a mobile phone, a tablet, a television, a display, a notebook computer, a digital photo frame, a navigator, etc. Other essential components of the display device are all understandable by those skilled in the art, and detailed descriptions are omitted here and should not be construed as limiting the present disclosure.

[0063] In the above array substrate, its manufacturing method, fingerprint recognition method, and display device according to the embodiments of the present disclosure, by installing the fingerprint recognition unit in the display area of the array substrate, the area of the non-display area of the array substrate can be reduced, which is beneficial for the narrow bezel design of the array substrate. Furthermore, by ensuring that the orthographic projection of the via hole of the fingerprint recognition unit on the base substrate does not overlap with the orthographic projection of the pixel unit on the base substrate, the blocking of the fingerprint recognition unit by each film layer of the pixel unit is avoided without affecting the aperture ratio of the array substrate, enabling the array substrate to realize the fingerprint recognition function.

[0064] Of course, those skilled in the art can make various changes and modifications to the present disclosure without departing from the spirit and scope of the present disclosure. Therefore, if such modifications and variations of the present disclosure fall within the scope of the claims of the present disclosure and the scope of equivalent technologies thereof, the present disclosure is intended to include these changes and modifications.

Claims

1. An array substrate, A base substrate; A plurality of pixel units are located in a display area of ​​the base substrate, and a plurality of fingerprint recognition units are included; The fingerprint recognition unit includes a light-shielding layer and a light-sensitive image sensor located on the base substrate; The pixel unit includes an OLED and a pixel circuit for driving the OLED to emit light; the light-shielding layer is provided with a via hole for performing pinhole imaging, and an orthogonal projection of the light-shielding layer on the base substrate covers an orthogonal projection of the pixel unit on the base substrate; an orthogonal projection of the via hole on the base substrate does not overlap with any orthogonal projection of the pixel unit on the base substrate; The photosensitive image sensor is an array substrate that receives an image formed by a fingerprint through the via holes.

2. The distance between the centers of two adjacent via holes is [0010] Fulfilling In the formula, d represents the distance between the centers of two adjacent via holes, D represents the diameter of the via hole, and h d represents the distance from the lower surface of the light-shielding layer to the upper surface of the light-sensitive image sensor, and h t The array substrate according to claim 1 , wherein: represents a thickness of the light-shielding layer.

3. 2. The array substrate according to claim 1, wherein the diameter of the via hole is in the range of 5 μm to 20 μm.

4. The array substrate according to claim 1 , wherein the via holes are arranged in an array on the base substrate.

5. The array substrate according to claim 1 , wherein an orthogonal projection of the light-shielding layer on the base substrate covers an orthogonal projection of the pixel unit on the base substrate.

6. The array substrate according to claim 1 , wherein the light-shielding layer is located on a side of the base substrate on which the pixel units are provided.

7. The array substrate according to claim 6 , wherein the light-shielding layer is located between the base substrate and the pixel unit.

8. The array substrate of claim 7 , further comprising a low-temperature dielectric layer located between the light-shielding layer and the pixel unit.

9. Further comprising a lead wire connected to the pixel unit; 6. The array substrate according to claim 1, wherein orthogonal projections of the via holes on the base substrate do not overlap with orthogonal projections of any of the lead lines on the base substrate.

10. The array substrate according to claim 1 , wherein the base substrate includes at least two flexible layers, and the light-shielding layer is disposed between two adjacent flexible layers.

11. 6. The array substrate according to claim 1, wherein the photosensitive image sensor is located at a position corresponding to the via hole on a rear surface side of the base substrate away from the light-shielding layer.

12. 12. The array substrate according to claim 11, wherein the light-sensitive image sensor comprises a CCD light-sensitive image sensor or a CMOS light-sensitive image sensor.

13. A method for manufacturing an array substrate according to any one of claims 1 to 12, comprising the steps of: forming a plurality of pixel units and a plurality of fingerprint recognition units in a display area of ​​a base substrate; The fingerprint recognition unit includes a light-shielding layer and a light-sensitive image sensor located on the base substrate; The pixel unit includes an OLED and a pixel circuit for driving the OLED to emit light; the light-shielding layer is provided with a via hole for performing pinhole imaging, and an orthogonal projection of the light-shielding layer on the base substrate covers an orthogonal projection of the pixel unit on the base substrate; A manufacturing method, wherein an orthogonal projection of the via hole on the base substrate does not overlap with an orthogonal projection of the pixel unit on the base substrate, and the photosensitive image sensor receives an image formed by a fingerprint through the via hole.

14. forming the light-shielding layer on the base substrate; patterning the light-shielding layer to form the via hole in an area where the fingerprint recognition unit is located; forming the pixel unit on the light-shielding layer in which the via hole is formed; and placing the light-sensitive image sensor at a position corresponding to the via hole on a side of the base substrate opposite the light-shielding layer.

15. A fingerprint recognition method for an array substrate according to any one of claims 1 to 12, comprising the steps of: acquiring an image on the photosensitive image sensor, the image being an image of a fingerprint reflected by light emitted from the pixel unit through a via hole and imaged on the photosensitive image sensor corresponding to the via hole; and determining a complete fingerprint image of the fingerprint based on the captured image imaged on the light-sensitive image sensor.

16. A display device, comprising: A display device comprising the array substrate according to claim 1 .

Images