Housing for an electronic device and a memory device

Abstract

To provide housings for memory devices and electronic devices, and processes for forming such housings.SOLUTION: An article 100 for housing at least a portion of an electronic device includes a first component 105 comprising a thermoplastic substance and a biodegradable filler or polymer, and a second component 120 disposed on at least a portion of the first component, the second component comprising a plurality of layers. The article has a scratch visibility load of about 200 gms or more, an electrostatic discharge static voltage of about 100 V or less, a thermal conductivity of about 0.28 W / mK or more, or a combination thereof.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to housings for, for example, memory devices and electronic devices, and processes for forming such housings. Description of Related Art

[0002] Disposable plastic materials such as polycarbonate (PC), acrylonitrile-butadiene styrene (ABS), and PC / ABS are generally used in solid state drive (SSD) enclosures, hard disk drive (HDD) products, and retail packaging (RPG) products such as USB flash drives, cables, and connectors. However, such plastic materials are poorly recyclable, lack biodegradable materials, and may be prone to scratching. Due to the low sustainability and regulatory frameworks for these and other disposable plastics, the industry's efforts are shifting towards the use of hybrid plastics with biodegradable content. In addition, in the electronics industry, particularly due to scratches, the rejection of PC, ABS, and PC / ABS packages and enclosures for SSDs, HDDs, and RPGs can, in some cases, be very high.

[0003] Currently, approaches for solving such problems of SSDs, HPDs, RPGs, other memory devices, and electronic devices are very limited. Generally, hybrid plastics are used in food packages, cutlery, door trims, and similar products, but are not utilized in the electronic packaging and semiconductor memory industries due to undesirable thermal properties such as low heat deflection temperature and low thermal conductivity. Coatings are used for cosmetic purposes on interior panels, motion sensors, and camera covers to reduce scratches and other defects, but are not used as scratch-resistant coatings for enclosure and package applications where surface properties may be important in determining whether a product is rejected.

[0004] For example, in the art, there is a need for new and improved packages and enclosures for memory devices and electronic devices that overcome one or more defects. SUMMARY OF THE INVENTION

[0005] Embodiments of the present disclosure generally relate to, for example, housings for memory devices and electronic devices, and processes for forming such housings.

[0006] In one embodiment, an article for housing at least a portion of an electronic device is provided. The article includes a first component including a thermoplastic material and a biodegradable filler or polymer, and a second component disposed on at least a portion of the first component, the second component including a plurality of layers. The article has a scratch visible load (ISO 4586-2) of about 200 gms or more, an electrostatic discharge (ESD) electrostatic voltage (ANSI / ESDS 20.20) of about 100 V or less, a thermal conductivity (ISO 22007-2) of about 0.28 W / mK or more, or a combination thereof.

[0007] In another embodiment, an article is provided. The article includes an electronic device and a coated substrate disposed on at least a portion of the electronic device. The coated substrate includes a polymeric substrate that includes a polyolefin and a biodegradable filler or polymer, and the amount of the biodegradable filler or polymer in the polymeric substrate is about 30 wt% to about 50 wt% based on the total weight of the polyolefin and the biodegradable filler or polymer. The coating includes a plurality of layers and is disposed on at least a portion of the polymeric substrate. The article has a scratch visible load (ISO 4586-2) of about 200 gms to about 400 gms, an electrostatic discharge (ESD) electrostatic voltage (ANSI / ESD S20.20) of about 50 V or less, a thermal conductivity (ISO 22007-2) of about 0.28 W / mK or more, or a combination thereof.

[0008] In another embodiment, a process for fabricating a housing for an electronic device is provided. The process includes introducing a first mixture into a polymeric substrate, where the polymeric substrate includes a thermoplastic material and a biodegradable filler or polymer, and drying or curing the first mixture to form a first layer on the polymeric substrate. The process further includes introducing a second mixture into the polymeric substrate and drying or curing the second mixture to form a second layer on the first layer. The process further includes introducing a third mixture into the polymeric substrate and drying or curing the third mixture to form a third layer on the second layer, and at least a portion of the housing has a scratch visible load (ISO 4586-2) of about 200 gms or more, an electrostatic discharge (ESD) electrostatic voltage (ANSI / ESD S20.20) of about 100 V or less, a thermal conductivity (ISO 22007-2) of about 0.28 W / mK or more, or a combination thereof.

Brief Description of the Drawings

[0009] To enable a more detailed understanding of the above features of the present disclosure, a more specific description of the present disclosure, briefly summarized above, may be made by reference to the embodiments, some of which are illustrated in the accompanying drawings. However, it should be noted that the accompanying drawings illustrate only typical embodiments of the present disclosure and should not be considered as limiting its scope, as the present disclosure may admit other equally effective embodiments.

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Figure 1

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Figure 2

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Figure 3

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Figure 4

[0014] For ease of understanding, the same reference numbers are used throughout the drawings to denote the same elements common to the figures. It is contemplated that elements disclosed in one embodiment may be beneficially utilized in other embodiments without particular recitation.

DETAILED DESCRIPTION OF THE INVENTION

[0015] Embodiments of the present disclosure generally relate to housings for memory devices and electronic devices, such as, for example, solid state drives (SSDs), hard disk drives (HDDs), and retail package (RPG) products, and processes for forming such housings. The inventors have found new and improved articles for housings, enclosures, and packages for memory devices and electronic devices, which are made of sustainable materials, and which, for example, have improved scratch resistance, mechanical and thermal properties, and reduced electrostatic discharge (ESD) properties, as compared to conventional housings, packages, and enclosures for memory devices and electronic devices. Briefly stated, in some embodiments, the article includes a plastic material (or composite material) and a coating disposed on at least a portion of the plastic material, which is, for example, scratch resistant. The composite material can be a mixture of a thermoplastic material and a biodegradable polymer, such as long cellulose fiber (LCF). The mixture of the thermoplastic material and the biodegradable polymer can be a blend and / or a natural fiber reinforced composite. The coating disposed on at least a portion of the composite material can include a primer, a base coat, and a top coat. The plastic and degradable materials can include recyclable polyolefins, such as PP, and biodegradable polymers, such as long cellulose fibers, and can thus help to address the need for recyclability and biodegradability. The coating can help to improve the scratch resistance, hardness, and surface roughness of the enclosure or package, as compared to conventional enclosures and packages for memory devices and electronic devices that utilize, for example, polycarbonate (PC), acrylonitrile-butadiene-styrene (ABS), and / or PC / ABS. Article

[0016] FIG. 1 is a cross-sectional view of an exemplary article 100 according to at least one embodiment. The article 100 can be, for example, a memory device, an electronic device, a component used with a memory device, a component used with an electronic device, and / or a structure used to enclose, cover, surround, and / or contain at least a portion of various other devices / products. That is, the article 100 can be an enclosure, case, housing, panel, base, cover, or any other suitable structure for enclosing, covering, surrounding, and / or containing at least a portion of a device or product. Generally, the article 100 includes at least two components.

[0017] Referring to FIG. 1, the first component 105 can be a polymer substrate and can include a thermoplastic polymer such as a hybrid plastic and a biodegradable polymer or filler. The first component 105 has a first surface 110 and a second surface 115. The second surface 115 is a surface on a memory device, an electronic device, or a component used with a memory device or an electronic device, or another device / product. The first component 105 can be of any suitable shape or size for enclosing, covering, surrounding, and / or containing at least a portion of, for example, a memory device, an electronic device, a component used with a memory device, a component used with an electronic device, and / or various other devices / products. The thickness of the first component 105 can be from about 250 μm to about 5000 μm, from about 1000 μm to about 2500 μm, from about 2500 μm to about 5000 μm, etc., from about 100 microns (μm) to about 10,000 μm. Thicknesses greater than or less than that of the first component 105 are contemplated.

[0018] The thermoplastic material of the first component 105 can be any suitable thermoplastic material such as a polymer composition, for example, a polyolefin composition (e.g., polypropylene, polyethylene, polyethylene terephthalate), a polyamide composition, a polyvinyl chloride composition, polyvinyl fluoride, polyoxymethylene, poly(methyl methacrylate), their polysulfone derivatives, or combinations thereof. Thermoplastic materials obtained by polymerizing at least one monomer having about 2 to about 20 carbon atoms, such as ethylene, propylene, butylene, pentene, hexene, heptene, octene, nonene, decene, combinations thereof, and their isomers, etc., having about 2 to about 10 carbon atoms can be used. However, the polyolefin and / or thermoplastic material is not limited thereto.

[0019] The density of the thermoplastic material used for the first component 105 is about 0.89 g / cm 3 ~ about 0.94 g / cm 3 、about 0.90 g / cm 3 ~ about 0.93 g / cm 3 など、about 0.88 g / cm 3 ~ about 0.95 g / cm 3 and can be set as such. The density is determined by ISO1183.

[0020] The biodegradable filler or polymer used for the first component 105 can be cellulose acetate, cellulose fibers (e.g., cellulose long fibers and / or cellulose short fibers), starch, or combinations thereof. The cellulose long fibers are characterized by having a fiber length of about 5 millimeters (mm) to about 9 mm, or more. The cellulose short fibers are characterized by having a fiber length of about 2 mm to about 3 mm.

[0021] The density of the biodegradable filler or polymer used for the first component 105 is about 1.1 g / cm 3 ~ about 1.75 g / cm 3 、about 1.2 g / cm 3 ~ about 1.5 g / cm 3 など、about 1 g / cm 3~ about 2 g / cm 3 can be. The density is determined by ISO1183. In at least one embodiment, the density of the biodegradable filler or polymer used for the first component 105 is about 1.45 g / cm 3 ~ about 1.5 g / cm 3 such as about 1.3 g / cm 3 ~ about 1.6 g / cm 3 is.

[0022] The first component 105 can be a blend, mixture, reinforcing material, extruded product, and / or a reaction product of a thermoplastic and a biodegradable polymer. The first component 105 of the article 100 can have one or more of the following characteristics.

[0023] The weight percentage of the thermoplastic component in the first component 105 can be about 45 wt% to about 75 wt%, about 50 wt% to about 70 wt%, 55 wt% to about 65 wt%, 55 wt% to about 60 wt%, or about 60 wt% to about 65 wt%, etc., based on the total weight of the first component 105 (i.e., the total weight of the thermoplastic and the biodegradable polymer), and can be about 75 weight percent (wt%) or less.

[0024] The weight percentage of the biodegradable polymer in the first component 105 can be about 25 wt% to about 55 wt%, about 30 wt% to about 50 wt%, about 35 wt% to about 45 wt%, about 35 wt% to about 40 wt%, or about 40 wt% to about 45 wt%, etc., based on the total weight of the first component 105 (i.e., the total weight of the thermoplastic and the biodegradable polymer), and can be about 25 wt% or more. The total weight percentage of the first component 105 does not exceed 100 wt%. It is contemplated to increase or decrease the biodegradable content of the first component 105.

[0025] The density of the first component 105 is about 0.9 g / cm 3 ~ about 1.4 g / cm 3 about 0.95 g / cm 3 ~ about 1.3 g / cm 3 about 1 g / cm 3 ~ about 1.2 g / cm3 such as about 1.5 g / cm 3 or less. Higher or lower densities of the first component 105 are contemplated. The density is measured in accordance with ISO 1183. In at least one embodiment, the density of the first component 105 is about 1.05 g / cm 3 to about 1.1 g / cm 3 such as about 1 g / cm 3 to about 1.15 g / cm 3 or the like.

[0026] The measured heat deflection temperature (HDT) of the first component 105 can be about 100 °C to about 180 °C, about 120 °C to about 170 °C, about 130 °C to about 165 °C, such as about 89 °C or higher. Higher or lower HDTs of the first component 105 are contemplated. HDT is a measure of the heat resistance of a given material. HDT is measured using an HDT tester in accordance with ISO 75 standard, using a specimen having dimensions (80 mm × 10 mm × 4 mm) at 1.8 megapascals (MPa).

[0027] The tensile strength of the first component 105 can be about 60 MPa to about 150 MPa, about 80 MPa to about 140 MPa, about 100 MPa to about 130 MPa, such as about 50 MPa or higher. Higher or lower tensile strengths of the first component 105 are contemplated. Tensile strength measures the stiffness and ability of a given material to withstand stress. Tensile strength is measured using a universal tensile machine (UTM) in accordance with ISO 527 standard, using a specimen having a 75 mm gauge length.

[0028] The flexural strength of the first component 105 can be, for example, about 90 MPa to about 190 MPa, about 120 MPa to about 180 MPa, about 140 MPa to about 175 MPa, etc., and can be about 75 MPa or more. Flexural strength measures the toughness and ability of a specified material to withstand flexural stress. Higher or lower flexural strengths of the first component 105 are contemplated. The flexural strength is measured in accordance with ISO 178 using a test piece having dimensions ((80 mm × 10 mm × 4 mm) ± 0.2 mm).

[0029] The notched impact strength of the first component 105 can be, per square meter, about 20 kJ / m 2 ~ about 80 kJ / m 2 、about 30 kJ / m 2 ~ about 70 kJ / m 2 、about 40 kJ / m 2 ~ about 60 kJ / m 2 etc., and can be about 15 kilojoules (kJ / m 2 ) or more. Higher or lower notched impact strengths of the first component 105 are contemplated. Notched impact strength measures the amount of energy absorbed by a specified material being measured during fracture. The notched impact strength is measured using a Charpy impact strength tester in accordance with ISO 179 / 1eA using a sample having dimensions of about 80 mm × 10 mm × 4 mm with a notch depth of 0.25 mm radius.

[0030] In at least one embodiment, the first component 105 of the article 100 is, based on the total weight of the first component 105, about 40 wt% etc., about 35 wt% to about 45 wt% of a biodegradable polymer, based on the total weight of the first component 105, about 60 wt% etc., about 55 wt% to about 65 wt% of a thermoplastic substance, about 1.05 g / cm 3 ~ about 1.10 g / cm 3 etc., about 1.05 g / cm 3 ~ about 1.25 g / cm 3Density, such as about 155 °C to about 165 °C, about 160 °C, etc., HDT of about 140 °C to about 180 °C, tensile strength of about 125 to about 140 MPa, etc., about 110 to about 200 MPa, flexural strength of about 165 MPa to about 175 MPa, etc., about 150 MPa to about 200 MPa, and / or about 50 kJ / m 2 ~ about 60 kJ / m 2 such as about 40 kJ / m 2 ~ about 70 kJ / m 2 and has a notched impact strength of.

[0031] Referring again to FIG. 1, the second component 120 can be disposed on at least a portion of the first surface 110 of the first component 105. The second component 120 can be a multilayer structure or a coating including a multilayer structure. In some embodiments, the second component 120 includes a first layer 130 disposed on at least a portion of the first component 105, a second layer 135 disposed on at least a portion of the first layer 130, and a third layer 140 disposed on at least a portion of the second layer 135.

[0032] The first layer 130 can be, for example, a coating or primer utilized to enhance adhesion between the first component 105 and the second layer 135. By way of example but not limitation, examples of components included in the primer used to form the first layer 130 include synthetic resins, solvents, additives such as silica and / or TiO2 particles, or combinations thereof. The thickness of the first layer 130 can be about 5 μm or less, about 1 μm to about 5 μm, about 2 μm to about 4 μm, about 3 μm, etc., about 10 μm or less. Thicknesses greater than or less than that of the first layer 130 are contemplated.

[0033] The second layer 135 can be a coating such as a base coating. The second layer 135 can be made from or include paint, thinner, and / or a curing agent. The thickness of the second layer 135 can be about 10 μm to about 30 μm, such as about 15 μm to about 25 μm, about 18 μm to about 22 μm, etc. Thicker or thinner thicknesses are contemplated for the second layer 135.

[0034] The third layer 140 can be a coating such as a top coating. The third layer 140 can be made from or include paint, thinner, and / or a curing agent. The thickness of the third layer 140 can be about 10 μm to about 30 μm, such as about 15 μm to about 25 μm, about 18 μm to about 22 μm, etc. Thicker or thinner thicknesses are contemplated for the third layer 140.

[0035] In some examples, and as further described below, each of the first layer 130, the second layer 135, and the third layer 140 is formed or deposited independently on the first component 105, for example, by spray coating and / or dip coating the first component 105 sequentially with a first mixture, a second mixture, and a third mixture, respectively. Drying and / or curing operations can be performed before, during, and / or after forming each of the first layer 130, the second layer 135, and / or the third layer 140.

[0036] The materials used to form the first layer 130, the second layer 135, and / or the third layer 140 can be any suitable materials. Exemplary, but non-limiting, examples of components included in paints include acrylic urethane resins, TiO2 particles, acetates, lactates, ketone-based materials, or combinations thereof. Exemplary, but non-limiting, examples of components included in thinners include acetates, lactates, xylene, methanol, ethanol, acetone, toluene, or combinations thereof. Exemplary, but non-limiting, examples of components included in curing agents include polyacrylates, isocyanate prepolymers, anhydrides, phenols, amines, or combinations thereof.

[0037] The article 100 described herein, including a polymeric substrate (e.g., a hybrid plastic material) and a coating disposed thereon, has improved properties over conventional enclosures, cases, and covers, as discussed below. The articles described herein (e.g., article 100) can have one or more of the following properties.

[0038] Article 100 can have an average surface roughness of from about 0.1 μm to about 3 μm, such as from about 0.2 μm to about 2 μm, from about 0.5 μm to about 1 μm. In at least one embodiment, the average surface roughness of article 100 can be at least about 0.4 μm, such as from about 0.5 μm to about 2 μm. Higher or lower average surface roughnesses of article 100 are contemplated. Average surface roughness is a measure of the surface profile or finely spaced micro-irregularities on the surface of a specified material at different locations and is commonly used to indicate the level of roughness. Average surface roughness is measured in accordance with ISO 4287:1997 using Mitutoyo surface profilometry. Article 100 can have a matte finish or a gloss finish.

[0039] Article 100 can have a visible scratch load of about 100 gms or more, such as about 150 gms or more, about 200 gms or more, about 225 gms or more, about 250 gms or more, about 275 gms or more, about 300 gms or more, and / or about 500 gms or less, about 450 gms or less, about 400 gms or less, about 375 gms or less, about 350 gms or less, about 325 gms or less, about 300 gms or less. In at least one embodiment, the visible scratch load of article 100 is about 200 to about 400 gms, such as about 225 gms to about 375 gms, about 250 gms to about 350 gms, about 275 gms to about 325 gms. Higher or lower visible scratch loads of article 100 are contemplated. The visible scratch load is the load at which a scratch mark is visible to the naked eye and is an indirect measure of scratch resistance. A higher visible scratch load value indicates higher scratch resistance of the specified material. The visible scratch load is determined using a Taber abrasion / scratch tester in accordance with ISO 4586-2 standard.

[0040] Article 100 can have a scratch hardness of about 1 gigapascal (GPa) or less, such as about 0.2 GPa to about 0.9 GPa, about 0.3 GPa to about 0.8 GPa, about 0.4 GPa to about 0.75 GPa, about 0.45 GPa to about 0.6 GPa. In at least one embodiment, the scratch hardness of article 100 is about 0.4 GPa to about 0.7 GPa. Higher or lower scratch hardnesses of article 100 are contemplated. Scratch hardness is a measure of scratch resistance, and a higher value indicates higher scratch resistance of the specified material. The scratch hardness is determined using a Taber abrasion / scratch tester in accordance with ISO 4586-2 standard.

[0041] Article 100 can have a Shore D hardness of about 75 or more, such as about 77 to about 100, about 78 to about 95, about 80 to about 90. Higher or lower Shore D hardnesses of article 100 are contemplated. Shore D hardness is a measure of hardness, and a higher value indicates higher strength, toughness, and rigidity of the specified material. The Shore D hardness is determined using a check line Shore D durometer in accordance with ISO 868 standard.

[0042] Article 100 can have a thermal conductivity of about 0.25 W / mK or more per meter Kelvin, such as about 0.28 W / mK or more and / or about 0.8 W / mK or less, about 0.29 W / mK to about 0.60 W / mK, about 0.30 W / mK to about 0.50 W / mK, about 0.31 W / mK to about 0.40 W / mK. Higher or lower thermal conductivities of Article 100 are contemplated. Thermal conductivity measures the degree to which a specified material conducts heat. Thermal conductivity is measured using a Hot Disk TPS2500S thermal constant analyzer in accordance with ISO22007-2.

[0043] Article 100 can have an electrostatic discharge (ESD) electrostatic voltage of less than about 500 volts (V), such as less than about 400 V, less than about 300 V, less than about 200 V, less than about 150 V, less than about 100 V, from about 1 V to about 100 V, from about 10 V to about 90 V, from about 20 V to about 80 V, from about 30 V to about 70 V, from about 40 V to about 60 V. In at least one embodiment, the ESD is less than about 50 V, such as less than about 10 V, from about 1 V to about 10 V, from about 2 V to about 9 V, from about 3 V to about 8 V, from about 4 V to about 7 V, from about 5 V to about 6 V. An electrostatic voltmeter is used to measure the actual potential (voltage) on the surface of a specified test material. The ESD electrostatic voltage is a measure of the flow of electricity between a specified material and another object caused by contact. The ESD electrostatic voltage is measured using a static sensor in accordance with ANSI / ESD s20.20 standard.

[0044] In at least one embodiment, Article 100 has an average surface roughness of about 0.5 μm or more, such as about 1 μm to about 2 μm, a scratch visible load of about 200 gms to about 400 gms, a scratch hardness of about 0.4 GPa to about 0.7 GPa, a Shore D hardness of about 80 to about 90, an ESD of about 50 V or less, such as about 10 V or less, and / or a thermal conductivity of about 0.3 W / mK to about 0.4 W / mK.

[0045] As described above, the article 100 can be a structure used to enclose, cover, surround, and / or contain at least a part of, for example, a memory device, an electronic device, a component used with a memory device, a component used with an electronic device, and / or various other devices / products. The article 100 can be, for example, an enclosure, a case, a housing, a panel, a base, a cover, or any other suitable structure for enclosing, covering, surrounding, and / or containing at least a part of a device or product.

[0046] By way of example and not limitation, examples of electronic devices, memory devices, and other devices that can be used with the article 100 include hard disk drives (HDDs), solid state drives (SSDs), universal serial bus (USB) flash drives, laptop housings, keyboards, mice, SSD packages, HDD packages, sensor covers, camera covers, wi-fi routers, automotive music systems, plastic casings for electrical and electronic goods, and their components. Also included are retail package (RPG) products such as USB cables and connectors, and their components.

[0047] FIG. 2 is an upper perspective exploded view of an exemplary hard disk drive cover and disk drive assembly 200 according to at least one embodiment. The hard disk drive cover and assembly include a cover 210 having an outer surface 215 and a base assembly. At least a part of the base assembly 205, the cover 210, and / or the outer surface 215 can include the above-described article 100. Other parts, such as the inner surface of the hard disk drive cover and disk drive assembly 200, can include the article 100.

[0048] Figure 3 is a perspective view of the top surface of an exemplary USB flash drive 300 incorporating the article described herein according to at least one embodiment. The USB flash drive 300 includes a cover 310 that encloses, covers, surrounds, and / or houses at least a portion of the USB device 305. At least a portion of the cover 310 can include the article 100 described above.

[0049] The memory devices shown in FIGS. 2 and 3 are non-limiting illustrations of the use of the articles described herein and are not intended to limit the scope of the embodiments of the present disclosure. Process for forming an article

[0050] Embodiments of the present disclosure also relate to a process for making an article, e.g., article 100. Generally, in some embodiments, at least a portion of the polymeric substrate (or first component 105) can be sequentially contacted with various mixtures or compositions. Before, during, and / or after contacting the polymeric substrate with the mixture or composition, drying and / or curing operations are performed to sequentially form the first layer 130, the second layer 135, and the third layer 140 of the article 100.

[0051] In the case of a process for forming an article as described herein, in some embodiments, the materials utilized to form the first layer 130, the second layer 135, and the third layer 140 are introduced into the first component 105 in the form of a mixture, e.g., in the form of a solution or a suspension. For example, the mixture utilized to form the first layer 130 can include a synthetic resin, a solvent, additives such as silica particles, TiO2 particles, or combinations thereof.

[0052] The mixtures used to form each of the first layer 130, the second layer 135, and the third layer 140 are independently disposed on a substrate. These mixtures can be in the form of compositions. For example, when a first composition is used to form the first layer 130, the first layer 130 formed after drying / curing contains the first composition or the reactive components of the first composition. When a second composition is used to form the second layer 135, the second layer 135 formed after drying / curing contains the second composition or the reactive components of the second composition, and / or when a third composition is used to form the third layer 140, the third layer 140 formed after drying / curing contains the third composition or the reactive components of the third composition. A method for introducing a mixture into the first component 105 (or polymer substrate) is described below.

[0053] FIG. 4 shows selected operations of an exemplary process 400 for forming a coated or at least partially coated polymer substrate of an article, such as article 100, according to at least one embodiment. Process 400 begins, in operation 410, by introducing a first mixture onto at least a portion of the first component 105 (or polymer substrate). The first component 105 (or polymer substrate) can be in the form of, for example, a memory device, an electronic device, a component used with a memory device, a component used with an electronic device, or a plate, panel, base assembly, finished product, or combination thereof used to enclose, encapsulate, cover, surround, and / or contain at least a portion of various other devices / products. Next, in operation 420, the first mixture is dried and / or cured to form a first layer 130 on at least a portion of the polymer substrate. The conditions for drying and / or curing are described below.

[0054] Next, in operation 430, a second mixture is introduced onto at least a portion of the resulting substrate on which the first layer 130 is formed. Next, in operation 440, the second mixture is dried and / or cured to form a second layer 135 on at least a portion of the first layer 130. Next, in operation 450, a third mixture is introduced onto at least a portion of the resulting substrate on which the first layer 130 and the second layer 135 are formed. Next, in operation 460, the third mixture is dried and / or cured to form a third layer 140 on at least a portion of the second layer 135. The resulting substrate having multiple layers formed thereon can be used as is for forming, shaping, cutting, etc. Process 400 describes depositing three layers on a polymeric substrate, but more or fewer layers are contemplated.

[0055] The paints, thinners, hardeners, and other materials used to form the mixtures or compositions have been discussed above. The first layer 130, for example, a primer, can be formed using a one-part or two-part primer that can include a paint, a solvent, or a combination thereof.

[0056] In some examples, the weight ratio of the primer in the first mixture / composition used to form the first layer 130 can be from about 80 wt% to about 100 wt%. The remainder of the first mixture / composition or at least a portion of the remainder can include acetone, water, or a combination thereof. The weight ratio of the primer in the first mixture used to form the first layer 130 is determined based on the starting materials used to make the first mixture.

[0057] The weight ratio of the paint to the thinner, the weight ratio of the paint to the hardener, and the weight ratio of the thinner to the hardener in the second mixture used to form the second layer 135 (or base coat) can be varied.

[0058] For example, in some embodiments, the weight ratio of paint to thinner in the second mixture used to form the second layer 135 can be about 4.0:3.8 to about 4.0:4.2, about 3.5:3.8 to about 4.5:3.8, about 3.8:4.0 to about 4.2:4.0, about 4:4, etc., about 3.8:3.5 to about 3.8:4.5. Larger or smaller weight ratios of paint to thinner in the second mixture are contemplated.

[0059] The weight ratio of paint to hardener in the second mixture used to form the second layer 135 can be about 3.0:0.6 to about 5.0:1.4, about 3.5:0.8 to about 4.5:1.2, etc., about 2.5:0.5 to about 5.5:1.5. Larger or smaller weight ratios of paint to hardener in the second mixture are contemplated.

[0060] The weight ratio of thinner to hardener in the second mixture used to form the second layer 135 can be about 3.0:0.6 to about 5.0:1.4, about 3.5:0.8 to about 4.5:1.2, etc., about 2.5:0.5 to about 5.5:1.5. Larger or smaller weight ratios of thinner to hardener in the second mixture are contemplated.

[0061] The weight ratio of paint to thinner to hardener in the second mixture used to form the second layer 135 can be about 4.0:3.8:0.8 to about 4.0:4.2:1.2, about 3.5:3.8:0.5 to about 4.5:3.8:1.5, about 3.8:4.0:0.8 to about 4.2:4.0:1.2, about 3.8:3.8:0.9 to about 4.5:4.5:1.2, etc., about 3.8:3.5:0.5 to about 3.8:4.5:1.5. Larger or smaller weight ratios of paint to thinner to hardener in the second mixture are contemplated.

[0062] The weight ratio of paint to thinner, paint to hardener, thinner to hardener, and paint to thinner to hardener in the second mixture used to form the second layer 135 is determined based on the weight ratios of the starting materials used to make the second mixture.

[0063] Similarly, the weight ratio of paint to thinner, the weight ratio of paint to hardener, and the weight ratio of thinner to hardener in the third mixture used to form the third layer 140 can be varied.

[0064] For example, in some embodiments, the weight ratio of paint to thinner in the third mixture used to form the third layer 140 can be from about 10.0:9.8 to about 10.0:10.2, from about 9.5:9.8 to about 10.5:9.8, from about 9.8:10.0 to about 10.2:10.0, about 10.0:10.0, etc., such as from about 9.8:9.5 to about 9.8:10.5. Larger or smaller weight ratios of paint to thinner in the third mixture are contemplated.

[0065] The weight ratio of paint to hardener in the third mixture used to form the third layer 140 can be from about 9.0:0.6 to about 11.0:1.4, from about 9.5:0.8 to about 10.5:1.2, etc., such as from about 8.5:0.5 to about 11.5:1.5. Larger or smaller weight ratios of paint to hardener in the third mixture are contemplated.

[0066] The weight ratio of thinner to hardener in the third mixture used to form the third layer 140 can be from about 9.0:0.6 to about 11.0:1.4, from about 9.5:0.8 to about 10.5:1.2, etc., such as from about 8.5:0.5 to about 11.5:1.5. Larger or smaller weight ratios of thinner to hardener in the third mixture are contemplated.

[0067] The weight ratio of paint to thinner to hardener in the third mixture used to form the third layer 140 can be from about 10.0:9.8:0.8 to about 10.0:10.2:1.2, from about 9.5:9.8:0.5 to about 10.5:9.8:1.5, from about 9.8:10.0:0.8 to about 10.2:10.0:1.2, about 10:10:1, etc., such as from about 9.8:9.5:0.5 to about 9.8:10.5:1.5. Larger or smaller weight ratios of paint to thinner to hardener in the third mixture are contemplated.

[0068] The weight ratio of paint to thinner, the weight ratio of paint to hardener, and the weight ratio of thinner to hardener in the third mixture used to form the third layer 140 are determined based on the weight ratios of the starting materials used to make the third mixture. Larger or smaller weight ratios of paint to thinner to hardener in the third mixture are contemplated.

[0069] The introduction of the first mixture in operation 410, the introduction of the second mixture in operation 430, and the introduction of the third mixture in operation 450 can be carried out by any suitable method including air spray coating, airless spray coating, dip coating, slot die coating, immersion, three-dimensional printing, roller coating, paint brush, electrostatic methods, high volume low pressure (HVLP) spray, or combinations thereof. Each introduction in operations 410, 430, and / or 450 can independently be in the form of a single introduction or multiple introductions. For example, each mixture can be introduced onto the substrate one or more times, such as about 2 or more times, about 3, 4, or 5 or more times. Drying and / or curing can be carried out at selected intervals, for example, before, during, and / or after each introduction, or after two or more introductions. Each mixture can be introduced onto one side or two or more sides of the substrate.

[0070] Operations 420, 440, and 460 include drying and / or curing the substrate. The substrate can be dried or cured before, during, and / or after each introduction of the mixture to the substrate. The temperature for drying / curing is selected, for example, to provide sufficient removal of the solvent. The drying / curing temperature can be less than about 150°C, such as about 50°C to about 150°C, about 60°C to about 100°C, about 70°C to about 90°C, about 75°C to about 85°C, etc. In at least one embodiment, the drying / curing temperature is about 70°C to about 90°C. In some embodiments, the duration of drying / curing for operations 420, 440, and 460 is at least about 30 seconds, such as at least about 2 minutes, about 5 minutes to about 10 hours, about 30 minutes to about 5 hours, about 1 hour to about 4 hours, about 2 hours to about 3 hours, etc. In at least one embodiment, drying / curing can be carried out over a duration of about 1 minute to about 1 hour.

[0071] One or more methods for drying / curing can be employed, and these methods include oven drying, hot air drying, hot air drying with directional assist, and / or shortwave drying. Depending on the desired thickness of the individual layers, e.g., the first layer 130, the second layer 135, and the third layer 140, the drying / curing operation can be carried out at the above temperatures and durations. Higher or lower temperatures, as well as longer or shorter durations, are contemplated for curing and / or drying. The drying / curing operation can be carried out in one or more oven / curing apparatuses.

[0072] The following examples are presented to provide a complete disclosure and description of how to make and use aspects of the present disclosure to those skilled in the art and are not intended to limit the scope of the embodiments of the present disclosure. Although efforts have been made to ensure accuracy with respect to the numbers used (e.g., amounts, dimensions, etc.), some experimental errors and deviations should be taken into account.

Examples

[0073] HDT is measured using an HDT tester in accordance with ISO75, using a test piece having dimensions of approximately 80 mm × 10 mm × 4 mm at 1.8 MPa. Tensile strength is measured using a universal tensile machine in accordance with ISO527, using a test piece having a 75 mm gauge length. Flexural strength is measured in accordance with the IS0178 standard, using a test piece having dimensions ((80 mm × 10 mm × 4 mm) ± 0.2 mm). Notched impact strength is measured using a Charpy impact strength tester in accordance with ISO179 / 1eA, using a sample having dimensions of approximately 80 mm × 10 mm × 4 mm and a notch depth of 0.25 mm radius.

[0074] Surface roughness is measured at five different locations using Mitutoyo surface profilometry (model: Surftest SJ-410) in accordance with ISO4287:1997. The scratch visible load and scratch width are obtained from a Taber shear / scratch tester (model: 551) at room temperature in accordance with the ISO4586-2 standard. The scratch hardness is calculated using the obtained scratch width. Shore D hardness is determined in accordance with ISO868 using a Checkline Shore D durometer (model: OS-1-E). Thermal conductivity is determined in accordance with ISO22007-2 using a Hot Disk® TPS2500S thermal constants analyzer. The electrostatic discharge (ESD) electrostatic voltage is determined in accordance with ANSI / ESD S20.20 using a static sensor (model: SCS718 static sensor). The static sensor is placed at a distance of 1 inch or 2.5 cm from the test material, and the electrostatic voltage is measured. All measurements are performed at room temperature, except for the HDT measurement.

[0075] Non-limiting examples of a first component 105 of a conventional housing (e.g., a thermoplastic + biodegradable filler or polymer) and a comparative example (C.Ex.) used to encapsulate at least a part of a memory device or an electronic product are shown in Table 1.

[0076] Example 1 (Ex.1) is a cellulose long fiber reinforced polypropylene plastic (Plastron PPRF40-02-(L7)) obtained from Daicel Miraizu Ltd., Japan. Comparative Example 1 includes the properties of various conventional PC resins, PC / ABS resins, and ABS resins. Examples of the PC resin include Panlite (registered trademark) L1225L commercially available from Teijin Ltd., Lupoy (registered trademark) PC1301EP-30 commercially available from LG Chem., and Makrolon (registered trademark) 2407 commercially available from Covestro AG. The PC / ABS resin is Cycoloy (registered trademark) C9250 commercially available from Sabic Innovative Plastics, and the ABS polymer is ABS Toyolac (registered trademark) 700UL94-HB commercially available from Toray Plastics.

Table 1

[0077] Table 1 shows that an exemplary hybrid plastic material (Example 1) used as the first component of an exemplary article for encapsulating a portion of a memory device has a higher biodegradability content and improved thermal and mechanical properties than conventional enclosures. The table also shows that the exemplary hybrid plastic material is suitable for SSDs, HDDs, RPG enclosure products, RPGs, SSD, HDD packages, laptop casings, keyboard casings, or other electrical and electronic goods.

[0078] Table 2 shows various non-limiting and exemplary formulations used, for example, in primers, exemplary base coats, and exemplary top coats. The exemplary primers, exemplary base coats, and exemplary top coats can be part of a second component 120 of an article for encapsulating at least a portion of a memory device or electronic product. The first layer 130 is an exemplary primer, the second layer 135 is an exemplary base coat, and the third layer 140 is an exemplary top coat. The number of layers of each exemplary primer (Examples 2 - 4), each exemplary base coat (Examples 5 - 8), and each exemplary top coat (Examples 9 - 12) was 1 layer, 1 layer, and 1 layer, respectively.

[0079] The mixtures used in each example of primer, base coat, and top coat were prepared according to the table, mixed using an industrial paint stirrer, then sprayed onto the first component for about 5 - 10 seconds using an automatic / robot spray gun, and then dried at about 80 °C for about 30 minutes. The mixtures used in each example of base coat were prepared according to the table, mixed, then sprayed onto the first component for about 5 - 10 seconds, and then dried at about 80 °C for about 30 minutes. The mixtures of each example of top coat were prepared according to the table, mixed, then sprayed onto the first component for about 5 - 10 seconds, and then dried at about 80 °C for about 30 minutes. The exemplary hybrid plastics are the examples shown in Table 1.

[0080] In Table 2, PC / ABS refers to polycarbonate / acrylonitrile - butadiene - styrene having a density of 1.14 g / cm 3 , POM refers to a polyoxymethylene - based material having a density of 1.83 g / cm 3 , PBT refers to a polybutylene terephthalate - based material having a density of 1.61 g / cm 3 , and nylon refers to a polyamide 66 / 6T - based material having a density of 1.42 g / cm 3-- .

[0081] PC / ABS, POM, PBT, and nylon-based resins are commercially available from Covestro and Otsuka Chemical Co., Ltd. under the trade names Bayblend T85 XF, Poticon AT68B, Poticon OB30, and Poticon NT863, respectively. Paint A is a one-component material containing synthetic resin, isobutyl alcohol, toluene or ketone, and additives such as silica or TiO2 particles. Paints C and D contain acrylic urethane-based resins, cellosolve, isopropyl alcohol, isobutyl alcohol, TiO2 particles, acetate, and / or ketone-based materials with different weight percentages of components. Thinner B contains acetates, lactates, xylene, methanol, ethanol, acetone, and / or toluene with different weight percentages of components, which is mixed with Paint C or D as provided in Table 2. Hardeners B and C contain polyacrylate, isocyanate prepolymer, anhydride, acetate, phenol, and / or amine with different weight percentages of components, which are mixed with Paint C or D and Thinner B respectively as provided in Table 2. Paint A is commercially available from Musashi Paint Corporation Sdn Bhd. as Multi primer EXC-3000. Paints C and D are available from Musashi Paint Corporation Sdn Bhd. under commercial codes EC-P79-J-01437 and EC-GPX79-J21-01737. Thinner B is available from Musashi Paint Corporation Sdn Bhd. under commercial code EC-K775. Hardeners B and C are available from Musashi Paint Corporation Sdn Bhd. under commercial codes EC-H-330UN and EC-H-250UN respectively.

Table 2

[0082] Table 3 shows a non-limiting and exemplary coating (e.g., the second component 120) that can be disposed on the surface of the first component 105 of an exemplary article that can be used, for example, to encapsulate at least a portion of a memory device or an electronic product. In the case of the exemplary coating (Example 13) shown in Table 3, the primer was made, mixed according to the ratios shown in the table, and sprayed onto an exemplary hybrid plastic substrate (e.g., Example 1 shown in Table 1) for about 4 - 5 seconds. Subsequently, the substrate was dried at about 80 °C for about 30 minutes. Then, the resulting substrate was sprayed with a base coat made according to the table for about 7 - 8 seconds, and then dried at about 80 °C for about 30 minutes. Then, the resulting substrate was sprayed with a top coat made according to the table for about 7 - 8 seconds, and then dried at about 80 °C for about 30 minutes.

Table 3

[0083] Table 4 shows various properties and characteristics of exemplary articles (Examples 14 and 15) that can be used, for example, to encapsulate a memory device. The exemplary article (Example 14) includes a hybrid plastic material (shown in Table 1 as Example 1) having an exemplary coating, as shown in Table 3. Example 15 is the hybrid plastic material shown in Table 1 as Example 1 without a coating. The properties of two conventional enclosures are also shown as Comparative Examples (C.Ex.) 2 and 3. The comparative examples are made of polycarbonate (PC) with different surface textures. Comparative Example 2 is Panlite® L1225L, and Comparative Example 3 is a polycarbonate resin commercially available under the trade name Kingfa® JH820 modified polycarbonate from Songhan Plastic Technology Co., Ltd.

Table 4

[0084] Table 4 shows that Example 14 has improved scratch visibility load and scratch hardness compared to the comparative examples. Here, the higher scratch visibility load and scratch hardness of Example 14 indicate higher scratch resistance than the comparative examples. The Shore D hardness is also improved, indicating that the exemplary article has better strength, toughness, and rigidity compared to the comparative examples.

[0085] Furthermore, the electrostatic discharge (ESD) voltage of Example 14 is significantly improved compared to the polycarbonate comparative examples, and the ESD is reduced from about 1900 V or more to less than about 10 V. In addition, Example 14 shows improved thermal conductivity, indicating that the exemplary article has better heat transfer capabilities.

[0086] The embodiments described herein generally relate to housings, enclosures, and packages for, for example, memory devices or electronic devices, and processes for forming such housings, enclosures, and packages. The housings, enclosures, and packages can be made of a scratch-resistant hybrid plastic material containing both recyclable and biodegradable content, and can be characterized as having improved scratch resistance, mechanical, thermal, and reduced ESD properties compared to conventional housings.

[0087] As used herein, "composition" can include the components of the composition and / or the reaction product of two or more components of the composition. The compositions of the present disclosure can be prepared by any suitable mixing process.

[0088] In the foregoing, embodiments of the present disclosure are referred to. However, it should be understood that the present disclosure is not limited to the specifically described embodiments. Instead, any combination of the following features and elements is intended to implement and practice the present disclosure, regardless of whether they are related to different embodiments. Furthermore, embodiments of the present disclosure may achieve advantages over other possible solutions and / or over the prior art, but whether a particular advantage is achieved by a given embodiment does not limit the present disclosure. Therefore, the foregoing embodiments, aspects, features, and advantages are merely illustrative and are not considered elements or limitations of the appended claims, except as explicitly recited in the claims. Similarly, references to "the present disclosure" are not to be construed as generalizations of the subject matter of any invention disclosed herein and should not be considered elements or limitations of the appended claims, except as explicitly recited in the claims.

[0089] For the purposes of the present disclosure, unless otherwise specified, all numerical values within the detailed description and the claims of this specification are modified by "about" or "approximately" of the indicated value, taking into account experimental errors and variations expected by those skilled in the art. For the sake of brevity, only certain ranges are explicitly disclosed herein. However, ranges from any lower limit may be combined with any upper limit to enumerate ranges not explicitly listed, and similarly, ranges from any lower limit may be combined with any other lower limit to enumerate ranges not explicitly listed, and in the same way, ranges from any upper limit may be combined with any other upper limit to enumerate ranges not explicitly listed. Additionally, within a range, all points or individual values between its endpoints are included, even if not explicitly listed. Therefore, all points or individual values can function as their own lower or upper limits in combination with any other point or individual value or any other lower or upper limit to enumerate ranges not explicitly listed.

[0090] As used herein, the indefinite article "a" or "an" shall mean "at least one" unless otherwise specified or clearly indicated otherwise by the context.

[0091] The foregoing is intended to be illustrative of embodiments of the present disclosure, but other and further embodiments of the present disclosure may be devised without departing from the basic scope thereof, which is determined by the following claims.

Claims

1. An article for housing at least a part of an electronic device, a first component comprising a thermoplastic material and a biodegradable filler or polymer, wherein the thermoplastic material is polypropylene and the biodegradable filler or polymer is cellulose long fibers, a second component disposed on at least a part of the first component, the second component comprising a plurality of layers, wherein the article has a visible scratch load of about 200 gms or more (ISO 4586-2), an electrostatic discharge (ESD) electrostatic voltage of about 100 V or less (ANSI / ESD S20.20), an average surface roughness of about 0.5 μm to about 2 μm (ISO 4287:1997), a scratch hardness of about 0.4 GPa to about 0.8 GPa (ISO 4586-2), a thermal conductivity of about 0.28 W / mK to about 0.5 W / mK (ISO 22007-2), a Shore D hardness of about 78 to about 88 (ISO 868).

2. The article according to claim 1, wherein the amount of the biodegradable polymer in the first component is about 30% by weight or more based on the total weight of the first component.

3. The article according to claim 1, wherein the amount of the biodegradable filler or polymer in the first component is about 30% by weight to about 50% by weight based on the total weight of the first component.

4. The article according to claim 1, wherein the electronic device includes a hard disk drive, a solid state drive, a universal serial bus (USB) flash drive, a laptop housing, a keyboard, a mouse, a USB package, an SSD package, an HDD package, a sensor cover, a camera cover, a wi-fi router, or an automotive music system.

5. wherein the plurality of layers include a first layer disposed on at least a part of the first component, a second layer disposed on at least a part of the first layer, a third layer disposed on at least a part of the second layer, and the first layer includes a primer for enhancing adhesion between the first component and the second layer.

6. The article according to claim 5, wherein the second layer includes a paint, a thinner, a hardener, or a reaction product thereof.

7. The ratio of the paint, the thinner, and the hardener used to form the second layer is from about 3.5:3.8:0.5 to about 4.5:3.8:1.5, the article according to claim 6.

8. The article according to claim 5, wherein the third layer comprises a paint, a thinner, a hardener, or a reaction product thereof.

9. The ratio of the paint, the thinner, and the hardener used to form the third layer is from about 9.5:9.8:0.5 to about 10.5:9.8:1.5, the article according to claim 8.

10. An article, an electronic device, and a coated substrate disposed on at least a portion of the electronic device, a polymeric substrate comprising a polyolefin and a biodegradable filler or polymer, wherein the polyolefin is polypropylene and the biodegradable filler or polymer is cellulose long fibers, and the amount of the biodegradable filler or polymer in the polymeric substrate is from about 30 wt% to about 50 wt% based on the total weight of the polyolefin and the biodegradable filler or polymer, the polymeric substrate, and a coating comprising a plurality of layers disposed on at least a portion of the polymeric substrate, the coated substrate comprising a coating. comprising the article having a scratch visible load (ISO 4586-2) of from about 200 gms to about 400 gms, an electrostatic discharge (ESD) electrostatic voltage (ANSI / ESD S20.20) of about 50 V or less, an average surface roughness (ISO 4287:1997) of from about 0.5 μm to about 2 μm, a scratch hardness (ISO 4586-2) of from about 0.4 GPa to about 0.8 GPa, a thermal conductivity (ISO 22007- ２）、 a Shore D hardness (ISO 868) of from about 78 to about 88.

11. The first layer of the plurality of layers has a thickness of from about 1 μm to about 5 μm, the second layer of the plurality of layers has a thickness of from about 15 μm to about 25 μm, the third layer of the plurality of layers has a thickness of from about 5 μm to about 15 μm, or combinations thereof, the article according to claim 10.

12. A process for fabricating a housing for an electronic device, Introducing a first mixture into a polymer substrate, wherein the polymer substrate comprises a thermoplastic material and a biodegradable filler or polymer, the thermoplastic material is polypropylene, and the biodegradable filler or polymer is cellulose long fibers, Drying or curing the first mixture to form a first layer on the polymer substrate, Introducing a second mixture into the polymer substrate, Drying or curing the second mixture to form a second layer on the first layer, Introducing a third mixture into the polymer substrate, Drying or curing the third mixture to form a third layer on the second layer, including, At least a part of the housing has, A scratch visible load (ISO 4586-2) of about 200 gms or more, An electrostatic discharge (ESD) electrostatic voltage (ANSI / ESD S20.20) of about 100 V or less, An average surface roughness (ISO 4287:1997) of about 0.5 μm to about 2 μm, A scratch hardness (ISO 4586-2) of about 0.4 GPa to about 0.8 GPa, A thermal conductivity (ISO 22007-2) of about 0.28 W / mK to about 0.5 W / mK, A process having a Shore D hardness (ISO 868) of about 78 to about 88.

13. The second mixture includes a paint, a thinner, and a curing agent, The ratio of the paint, the thinner, and the curing agent in the second mixture is about 3.5:3.8:0.5 to about 4.5:3.8:1.

5. The process according to claim 12.

14. The third mixture includes a paint, a thinner, and a curing agent, The ratio of the paint, the thinner, and the curing agent in the third mixture is about 9.5:9.8:0.5 to about 10.5:9.8:1.

5. The process according to claim 12.

15. The amount of the biodegradable polymer in the polymer substrate is 30% by weight or more based on the total weight of the polymer substrate. The process according to claim 12.

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