Lighting module, lighting device, and method for manufacturing the same

Abstract

To provide a backlight unit having a lighting module, a liquid crystal display device, or a vehicle lamp, related to the lighting module having a light emitting element, a lighting device and a manufacturing method thereof.SOLUTION: A lighting device includes: a substrate 401; a light source 100 including a plurality of light emitting elements 101, 103 arranged on the substrate; a resin layer 420 arranged on the substrate; and a first diffusion layer 430 arranged on the resin layer 420. The resin layer 420 includes: a first resin part 421 arranged on the light source; and a second resin part 423 arranged on the substrate 401 while adjoining the first resin part 421. An upper face of the first resin part 421 has an inclination, and is separated from the first diffusion layer 430, the second resin part 423 includes a material different from that of the first resin part 421, and a height of an upper face of the second resin layer 423 may be higher than a height of the lowest end PS1 of the upper face RS1 of the first resin part 421 with an upper face of the substrate 401 as a standard.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a lighting module having a light-emitting element, a lighting device, and a method for manufacturing the same. The present disclosure also relates to a backlight unit having a lighting module, a liquid crystal display device, or a vehicle lamp.

Background Art

[0002] Applications of lighting include not only vehicle lighting but also backlighting for displays and signboards. Light-emitting diodes (LEDs) have advantages such as low power consumption, semi-permanent lifespan, fast response speed, safety, and environmental friendliness compared to existing light sources such as fluorescent lamps and incandescent lamps. Such light-emitting diodes are applied to various lighting devices such as various display devices, indoor lights, or outdoor lights. Recently, lamps employing light-emitting diodes have been proposed as vehicle light sources. Compared with incandescent lamps, light-emitting diodes are advantageous in that they consume less power. However, since the emission angle of light emitted from a light-emitting diode is small, when using a light-emitting diode as a vehicle lamp, it is necessary to increase the light-emitting area of the lamp using the light-emitting diode. Since the size of the light-emitting diode is small, the degree of freedom in the design of the lamp can be increased, and there is also economic efficiency due to its semi-permanent lifespan.

Summary of the Invention

Problems to be Solved by the Invention

[0003] The present disclosure provides a lighting module or a lighting device having a resin layer having resin parts of different materials between a substrate and a diffusion layer, and a light source sealed with any one of the resin parts of the resin layer. ​​​​​​​​​​It is possible. The resin layer according to the present disclosure includes a first resin portion on the light source and a second resin portion spaced apart from the first resin portion, or a first resin portion made of a silicone material covering the light source and a second resin portion made of a UV resin material in front of the first resin portion. The present disclosure provides a lighting module and a lighting device that provide an air region between the first resin portion covering the light source and the diffusion layer and dispose an adhesive layer between the second resin portion and the diffusion layer. The present disclosure can provide a lighting module and a lighting device that dispose an air region and a light-shielding portion on the first resin portion covering the light source and dispose an adhesive layer on the second resin portion spaced apart from the first resin portion. The present disclosure provides a lighting module and a lighting device in which an adhesive layer and a light-shielding portion are disposed between a plurality of diffusion layers, and a resin layer and an air region having light-shielding portions made of different materials are disposed between the plurality of diffusion layers and the substrate. The present disclosure provides a lighting module and a lighting device in which a reflecting member is disposed between the resin layer and the substrate. The present disclosure provides a lighting module or a lighting device that irradiates a surface light source and a method for manufacturing the same. The present disclosure can provide a backlight unit, a liquid crystal display device, or a vehicle lamp having the lighting module. The resin layer according to the present disclosure includes a first resin portion on the light source and a second resin portion spaced apart from the first resin portion, or a first resin portion made of a silicone material covering the light source and a second resin portion made of a UV resin material in front of the first resin portion. The present disclosure provides a lighting module and a lighting device that provide an air region between the first resin portion covering the light source and the diffusion layer and dispose an adhesive layer between the second resin portion and the diffusion layer. The present disclosure can provide a lighting module and a lighting device that dispose an air region and a light-shielding portion on the first resin portion covering the light source and dispose an adhesive layer on the second resin portion spaced apart from the first resin portion. The present disclosure provides a lighting module and a lighting device in which an adhesive layer and a light-shielding portion are disposed between a plurality of diffusion layers, and a resin layer and an air region having light-shielding portions made of different materials are disposed between the plurality of diffusion layers and the substrate. The present disclosure provides a lighting module and a lighting device in which a reflecting member is disposed between the resin layer and the substrate. The present disclosure provides a lighting module or a lighting device that irradiates a surface light source and a method for manufacturing the same. The present disclosure can provide a backlight unit, a liquid crystal display device, or a vehicle lamp having the lighting module.

Means for Solving the Problems

Means for Solving the Problems

[0004] The lighting device according to the present disclosure includes a substrate, a light source including a plurality of light-emitting elements disposed on the substrate, a resin layer disposed on the substrate, and a first diffusion layer disposed on the resin layer. The resin layer includes a first resin portion disposed on the light source and a second resin portion disposed on the substrate adjacent to the first resin portion. The upper surface of the first resin portion has an inclination and is spaced apart from the first diffusion layer. The second resin portion includes a material different from that of the first resin portion. The resin layer includes a first resin portion disposed on the light source and a second resin portion disposed on the substrate adjacent to the first resin portion. The upper surface of the first resin portion has an inclination and is spaced apart from the first diffusion layer. The second resin portion includes a material different from that of the first resin portion. The resin layer includes a first resin portion disposed on the light source and a second resin portion disposed on the substrate adjacent to the first resin portion. The upper surface of the first resin portion has an inclination and is spaced apart from the first diffusion layer. The second resin portion includes a material different from that of the first resin portion. The upper surface of the first resin portion has an inclination and is spaced apart from the first diffusion layer. The second resin portion includes a material different from that of the first resin portion. The upper surface of the first resin portion has an inclination and is spaced apart from the first diffusion layer. The second resin portion includes a material different from that of the first resin portion. 、With reference to the upper surface of the substrate, the height of the upper surface of the second resin portion may be greater than the height of the lowermost end of the upper surface of the first resin portion. The lighting device according to the present disclosure includes a substrate, a light source disposed on the substrate, a resin layer disposed on the substrate, and a first diffusion layer disposed on the resin layer. The light source includes a first light emitting element and a second light emitting element spaced apart from the first light emitting element. The resin layer includes a plurality of first resin portions disposed on the first light emitting element and the second light emitting element, and a second resin portion disposed between the first light emitting element and the second light emitting element. The upper surfaces of the plurality of first resin portions are spaced apart from the first diffusion layer. With reference to the upper surface of the substrate, the height of the upper surface of the second resin portion may be greater than the height of the upper surface of the first resin portion that overlaps the first light emitting element in the vertical direction on the upper surface of the substrate. The manufacturing method of the lighting device according to the present disclosure includes steps of disposing a light source having a plurality of light emitting elements on a substrate, forming a first resin portion on the front surface of each of the plurality of light emitting elements, forming a second resin portion outside the first resin portion, disposing a first adhesive layer on the second resin portion, and adhering the second resin portion and the first diffusion layer by the first adhesive layer. The first resin portion and the second resin portion include different materials, and the first diffusion layer and the first resin portion may be disposed spaced apart from each other. According to the present disclosure, the light source includes a first light emitting element and a second light emitting element spaced apart from the first light emitting element, and the second resin portion may be disposed between the first light emitting element and the second light emitting element. A plurality of the first resin portions are arranged, and the second resin portion is disposed among the plurality of first resin portions. A light source disposed on the substrate, a resin layer disposed on the substrate, and a first diffusion layer disposed on the resin layer, the light source includes a first light emitting element and a second light emitting element spaced apart from the first light emitting element, the resin layer includes a plurality of first resin portions disposed on the first light emitting element and the second light emitting element, and a second resin portion disposed between the first light emitting element and the second light emitting element, the upper surfaces of the plurality of first resin portions are spaced apart from the first diffusion layer, and with reference to the upper surface of the substrate, the height of the upper surface of the second resin portion may be greater than the height of the upper surface of the first resin portion that overlaps the first light emitting element in the vertical direction on the upper surface of the substrate. The manufacturing method of the lighting device according to the present disclosure includes steps of disposing a light source having a plurality of light emitting elements on a substrate, forming a first resin portion on the front surface of each of the plurality of light emitting elements, forming a second resin portion outside the first resin portion, disposing a first adhesive layer on the second resin portion, and adhering the second resin portion and the first diffusion layer by the first adhesive layer. The first resin portion and the second resin portion include different materials, and the first diffusion layer and the first resin portion may be disposed spaced apart from each other. A light source disposed on the substrate, a resin layer disposed on the substrate, and a first diffusion layer disposed on the resin layer, the light source includes a first light emitting element and a second light emitting element spaced apart from the first light emitting element, the resin layer includes a plurality of first resin portions disposed on the first light emitting element and the second light emitting element, and a second resin portion disposed between the first light emitting element and the second light emitting element, the upper surfaces of the plurality of first resin portions are spaced apart from the first diffusion layer, and with reference to the upper surface of the substrate, the height of the upper surface of the second resin portion may be greater than the height of the upper surface of the first resin portion that overlaps the first light emitting element in the vertical direction on the upper surface of the substrate. The manufacturing method of the lighting device according to the present disclosure includes steps of disposing a light source having a plurality of light emitting elements on a substrate, forming a first resin portion on the front surface of each of the plurality of light emitting elements, forming a second resin portion outside the first resin portion, disposing a first adhesive layer on the second resin portion, and adhering the second resin portion and the first diffusion layer by the first adhesive layer. The first resin portion and the second resin portion include different materials, and the first diffusion layer and the first resin portion may be disposed spaced apart from each other. A light source disposed on the substrate, a resin layer disposed on the substrate, and a first diffusion layer disposed on the resin layer, the light source includes a first light emitting element and a second light emitting element spaced apart from the first light emitting element, the resin layer includes a plurality of first resin portions disposed on the first light emitting element and the second light emitting element, and a second resin portion disposed between the first light emitting element and the second light emitting element, the upper surfaces of the plurality of first resin portions are spaced apart from the first diffusion layer, and with reference to the upper surface of the substrate, the height of the upper surface of the second resin portion may be greater than the height of the upper surface of the first resin portion that overlaps the first light emitting element in the vertical direction on the upper surface of the substrate. The manufacturing method of the lighting device according to the present disclosure includes steps of disposing a light source having a plurality of light emitting elements on a substrate, forming a first resin portion on the front surface of each of the plurality of light emitting elements, forming a second resin portion outside the first resin portion, disposing a first adhesive layer on the second resin portion, and adhering the second resin portion and the first diffusion layer by the first adhesive layer. The first resin portion and the second resin portion include different materials, and the first diffusion layer and the first resin portion may be disposed spaced apart from each other. A light source disposed on the substrate, a resin layer disposed on the substrate, and a first diffusion layer disposed on the resin layer, the light source includes a first light emitting element and a second light emitting element spaced apart from the first light emitting element, the resin layer includes a plurality of first resin portions disposed on the first light emitting element and the second light emitting element, and a second resin portion disposed between the first light emitting element and the second light emitting element, the upper surfaces of the plurality of first resin portions are spaced apart from the first diffusion layer, and with reference to the upper surface of the substrate, the height of the upper surface of the second resin portion may be greater than the height of the upper surface of the first resin portion that overlaps the first light emitting element in the vertical direction on the upper surface of the substrate. The manufacturing method of the lighting device according to the present disclosure includes steps of disposing a light source having a plurality of light emitting elements on a substrate, forming a first resin portion on the front surface of each of the plurality of light emitting elements, forming a second resin portion outside the first resin portion, disposing a first adhesive layer on the second resin portion, and adhering the second resin portion and the first diffusion layer by the first adhesive layer. The first resin portion and the second resin portion include different materials, and the first diffusion layer and the first resin portion may be disposed spaced apart from each other. A light source disposed on the substrate, a resin layer disposed on the substrate, and a first diffusion layer disposed on the resin layer, the light source includes a first light emitting element and a second light emitting element spaced apart from the first light emitting element, the resin layer includes a plurality of first resin portions disposed on the first light emitting element and the second light emitting element, and a second resin portion disposed between the first light emitting element and the second light emitting element, the upper surfaces of the plurality of first resin portions are spaced apart from the first diffusion layer, and with reference to the upper surface of the substrate, the height of the upper surface of the second resin portion may be greater than the height of the upper surface of the first resin portion that overlaps the first light emitting element in the vertical direction on the upper surface of the substrate. The manufacturing method of the lighting device according to the present disclosure includes steps of disposing a light source having a plurality of light emitting elements on a substrate, forming a first resin portion on the front surface of each of the plurality of light emitting elements, forming a second resin portion outside the first resin portion, disposing a first adhesive layer on the second resin portion, and adhering the second resin portion and the first diffusion layer by the first adhesive layer. The first resin portion and the second resin portion include different materials, and the first diffusion layer and the first resin portion may be disposed spaced apart from each other. A light source disposed on the substrate, a resin layer disposed on the substrate, and a first diffusion layer disposed on the resin layer, the light source includes a first light emitting element and a second light emitting element spaced apart from the first light emitting element, the resin layer includes a plurality of first resin portions disposed on the first light emitting element and the second light emitting element, and a second resin portion disposed between the first light emitting element and the second light emitting element, the upper surfaces of the plurality of first resin portions are spaced apart from the first diffusion layer, and with reference to the upper surface of the substrate, the height of the upper surface of the second resin portion may be greater than the height of the upper surface of the first resin portion that overlaps the first light emitting element in the vertical direction on the upper surface of the substrate. The manufacturing method of the lighting device according to the present disclosure includes steps of disposing a light source having a plurality of light emitting elements on a substrate, forming a first resin portion on the front surface of each of the plurality of light emitting elements, forming a second resin portion outside the first resin portion, disposing a first adhesive layer on the second resin portion, and adhering the second resin portion and the first diffusion layer by the first adhesive layer. The first resin portion and the second resin portion include different materials, and the first diffusion layer and the first resin portion may be disposed spaced apart from each other. A light source disposed on the substrate, a resin layer disposed on the substrate, and a first diffusion layer disposed on the resin layer, the light source includes a first light emitting element and a second light emitting element spaced apart from the first light emitting element, the resin layer includes a plurality of first resin portions disposed on the first light emitting element and the second light emitting element, and a second resin portion disposed between the first light emitting element and the second light emitting element, the upper surfaces of the plurality of first resin portions are spaced apart from the first diffusion layer, and with reference to the upper surface of the substrate, the height of the upper surface of the second resin portion may be greater than the height of the upper surface of the first resin portion that overlaps the first light emitting element in the vertical direction on the upper surface of the substrate. The manufacturing method of the lighting device according to the present disclosure includes steps of disposing a light source having a plurality of light emitting elements on a substrate, forming a first resin portion on the front surface of each of the plurality of light emitting elements, forming a second resin portion outside the first resin portion, disposing a first adhesive layer on the second resin portion, and adhering the second resin portion and the first diffusion layer by the first adhesive layer. The first resin portion and the second resin portion include different materials, and the first diffusion layer and the first resin portion may be disposed spaced apart from each other. The manufacturing method of the lighting device according to the present disclosure includes steps of disposing a light source having a plurality of light emitting elements on a substrate, forming a first resin portion on the front surface of each of the plurality of light emitting elements, forming a second resin portion outside the first resin portion, disposing a first adhesive layer on the second resin portion, and adhering the second resin portion and the first diffusion layer by the first adhesive layer. The first resin portion and the second resin portion include different materials, and the first diffusion layer and the first resin portion may be disposed spaced apart from each other. The manufacturing method of the lighting device according to the present disclosure includes steps of disposing a light source having a plurality of light emitting elements on a substrate, forming a first resin portion on the front surface of each of the plurality of light emitting elements, forming a second resin portion outside the first resin portion, disposing a first adhesive layer on the second resin portion, and adhering the second resin portion and the first diffusion layer by the first adhesive layer. The first resin portion and the second resin portion include different materials, and the first diffusion layer and the first resin portion may be disposed spaced apart from each other. The manufacturing method of the lighting device according to the present disclosure includes steps of disposing a light source having a plurality of light emitting elements on a substrate, forming a first resin portion on the front surface of each of the plurality of light emitting elements, forming a second resin portion outside the first resin portion, disposing a first adhesive layer on the second resin portion, and adhering the second resin portion and the first diffusion layer by the first adhesive layer. The first resin portion and the second resin portion include different materials, and the first diffusion layer and the first resin portion may be disposed spaced apart from each other. The manufacturing method of the lighting device according to the present disclosure includes steps of disposing a light source having a plurality of light emitting elements on a substrate, forming a first resin portion on the front surface of each of the plurality of light emitting elements, forming a second resin portion outside the first resin portion, disposing a first adhesive layer on the second resin portion, and adhering the second resin portion and the first diffusion layer by the first adhesive layer. The first resin portion and the second resin portion include different materials, and the first diffusion layer and the first resin portion may be disposed spaced apart from each other. The manufacturing method of the lighting device according to the present disclosure includes steps of disposing a light source having a plurality of light emitting elements on a substrate, forming a first resin portion on the front surface of each of the plurality of light emitting elements, forming a second resin portion outside the first resin portion, disposing a first adhesive layer on the second resin portion, and adhering the second resin portion and the first diffusion layer by the first adhesive layer. The first resin portion and the second resin portion include different materials, and the first diffusion layer and the first resin portion may be disposed spaced apart from each other. The manufacturing method of the lighting device according to the present disclosure includes steps of disposing a light source having a plurality of light emitting elements on a substrate, forming a first resin portion on the front surface of each of the plurality of light emitting elements, forming a second resin portion outside the first resin portion, disposing a first adhesive layer on the second resin portion, and adhering the second resin portion and the first diffusion layer by the first adhesive layer. The first resin portion and the second resin portion include different materials, and the first diffusion layer and the first resin portion may be disposed spaced apart from each other.

[0005] According to the present disclosure, the light source includes a first light emitting element and a second light emitting element spaced apart from the first light emitting element, and the second resin portion may be disposed between the first light emitting element and the second light emitting element. According to the present disclosure, the light source includes a first light emitting element and a second light emitting element spaced apart from the first light emitting element, and the second resin portion may be disposed between the first light emitting element and the second light emitting element. According to the present disclosure, the light source includes a first light emitting element and a second light emitting element spaced apart from the first light emitting element, and the second resin portion may be disposed between the first light emitting element and the second light emitting element. It may be arranged between the parts. Each of the plurality of first resin parts can cover at least one light-emitting element. The light-emitting elements are arranged on the substrate in N rows and M columns, where M and N are integers greater than or equal to 1 and have a relationship of N≥M, and the first resin part and the second resin part may be arranged alternately in the row direction. The first resin parts may be spaced apart from each other or integrally formed in the column direction. The resin layer includes a first side surface and a second side surface arranged on opposite sides, the first light-emitting element is adjacent to the first side surface, the second light-emitting element is adjacent to the second side surface, and the second resin part may be arranged between the first light-emitting element adjacent to the first side surface of the resin layer and the second light-emitting element adjacent to the second side surface. The height of the uppermost end of the second resin part may be greater than or equal to the height of the uppermost end of the upper surface of the first resin part. The second resin part and the first diffusion layer may be adhered by a first adhesive layer. The first resin part includes a light-shielding part on it, and the upper surface of the second resin part may not be vertically offset from the light-shielding part. It includes a second diffusion layer arranged on the first diffusion layer and a second adhesive layer arranged between the first diffusion layer and the second diffusion layer. The light-shielding part is arranged between the first diffusion layer and the second diffusion layer and vertically overlaps with the first resin part. The second adhesive layer and the first adhesive layer may vertically overlap. The first adhesive layer may not vertically overlap with the first resin part. The plurality of first resin parts may be arranged spaced apart from each other. Based on the upper surface of the substrate, the upper surface of the first resin part can include a region that becomes higher as it is farther from the light source. The upper surface of the first resin part can include a plurality of concave portions and convex portions. The first resin part is made of silicon and the like. The first adhesive layer may not vertically overlap with the first resin part. The plurality of first resin parts may be arranged spaced apart from each other. Based on the upper surface of the substrate, the upper surface of the first resin part can include a region that becomes higher as it is farther from the light source. The upper surface of the first resin part can include a plurality of concave portions and convex portions. The first resin part is made of silicon It contains a cone resin or a thermosetting resin, and the second resin part can contain a UV resin. The region separated between the first resin part and the first diffusion layer may be an air region. The horizontal lengths of the first resin part and the second resin part arranged between the first light-emitting element and the second light-emitting element can have a ratio of 4:6 to 6:4.

Advantages of the Invention

[0006] According to the present disclosure, discoloration by the UV resin can be reduced in front of the light source. Also, since the second resin part of the UV (Ultra violet) resin is arranged between the first resin parts covering the respective light sources, the influence by the UV resin can be blocked on the light-emitting surface of the light source. Further, by providing a resin layer having a second resin part arranged between the first resin part covering the light source and the light source, a decrease in electrical characteristics and optical characteristics in a high-temperature and high-humidity environment can be prevented. By arranging an air region and a light-shielding part on the first resin part covering the light source, hot spots can be suppressed. Since the second resin part is arranged between the first resin parts covering the light source, the adhesive force of the adhesive layer adhered between the diffusion layer and the second resin part is improved. (Ultra violet)

[0007] According to the present disclosure, the luminous intensity and light uniformity of the surface light source can be improved. A reflecting member is arranged between the resin layer and the substrate, and the light reflection efficiency is improved. Therefore, the optical reliability of the lighting module and the lighting device having the same can be improved. Also, the reliability of the vehicle lighting device having the lighting module or the device can be improved, and the lighting module and the lighting device can be applied to a backlight unit, various display devices, a surface light source lighting device, or a vehicle lamp.

Brief Description of the Drawings

[0008]

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MODE FOR CARRYING OUT THE INVENTION

[0009] The technical idea of the present disclosure is not limited to some of the described embodiments, and can be embodied in various forms. Within the scope of the technical idea of the present disclosure, the components between the embodiments can be selectively combined or replaced and used. Also, the terms (including technical and scientific terms) used in the present disclosure, unless specifically specified and described clearly, are interpreted as having a meaning generally understood by those with ordinary knowledge in the technical field to which the present disclosure belongs, and terms generally used like those defined in a dictionary are interpreted in consideration of the meaning in the context of the relevant technology. Also, the terms used in the present disclosure are for explaining the embodiments and are not intended to limit the present disclosure. In this specification, the singular form can include the plural form unless otherwise specifically limited in the description, and when described as "at least one (or one or more) of A, B, and C", it means one or more of all the combinations that can be combined with A, B, and C. ​​​​​​It can include the above. Also, in the description of the components of the present disclosure, terms such as first, second, A, B, (a), (b), etc. can be used. Such terms are for distinguishing the components from other components, and the essence, order, etc. of the components are not limited by such terms. When a component is described as being "connected", "coupled" or "continued" to another component, the component can be directly connected or joined to the other component, and also includes all cases where there are further other components "connected", "coupled" or "connected" between the components. Also, when it is described that it is formed or arranged "above or below" each component, "above or below" includes not only the case where two components are in direct contact, but also the case where one or more further other components are formed or arranged between the two components. Also, when expressed as "above or below", taking one component as a reference, it can include not only the upper direction but also the meaning of the lower direction.

[0010] The lighting device according to the present disclosure is applicable to various lamp devices that require lighting, such as vehicle lamps, household lighting devices, and industrial lighting devices. For example, when applied to vehicle lamps, it is applicable to headlamps, side marker lamps, side mirror lamps, fog lamps, tail lamps, brake lamps, daytime running lamps, vehicle interior lighting, door scuff plates, rear combination lamps, backup lamps, etc. The lighting device of the present disclosure is also applicable to indoor and outdoor advertising devices, display devices and various train fields, and can also be applied to any lighting-related fields and advertising-related fields that are currently developed and commercialized or can be realized with future technological developments. .

[0011] ​​​​​​​ Referring to FIGS. 1 to 7, a lighting device 400 according to the present disclosure includes a substrate 401, a light source 100 disposed on the substrate 40 1, a resin layer 420 covering the light source 100, and a first diffusion layer 430 may be included on the resin layer 420. The lighting device 400 may include a reflecting member 410 disposed on the substrate 4 01. The lighting device 400 according to the present disclosure can emit the light emitted from the light source 100 as a surface light source. The lighting device 400 may include a plurality of light sources on at least one of the upper and lower surfaces of the substrate 401 .

[0012] The light source 100 includes a plurality of light emitting elements 101, 103, and the plurality of light emitting elements 101 , 103 may be arranged in N rows and M columns (N and M are integers of 1 or more, and N≧M) . The resin layer 420 may be disposed between the substrate 401 and the first diffusion layer 430. Between the substrate 401 and the first diffusion layer 430, the resin layer 420 and the light source 1 00 are disposed. The light emitting elements 101, 103 of the light source 100 can irradiate light in the same direction, different directions, or opposite directions. The resin layer 420 has different resin materials disposed between the respective light emitting elements 101, 103. The resin layer 420 guides and diffuses the light emitted from the light source 10 0 and emits a surface light source through the surface. The resin layer 420 alternately arranges resin parts 421, 423 of different materials horizontally, and any one of the resin parts can be disposed between the other resin parts covering the light emitting elements 101, 103 respectively . The resin layer 420 has different members disposed on the resin parts 421, 423 of different materials arranged thereon. The upper surfaces of the resin parts 421, 423 of different materials of the resin layer 420 are on different planes For the sake of explanation, in each drawing, the substrate 401 and the resin layer 420 are The outer surfaces are illustrated as first to fourth outer surfaces S1, S2, S3, and S4, and the first outer surface S1 is , which is one side surface of the substrate 401 and the resin layer 420, and the second outer side surface S2 is the first outer The third and fourth outer surfaces S3 and S4 are opposite to the first and second outer surfaces S1 and S2. The first and second surfaces may be disposed between both ends of the side surfaces S1 and S2 and may be opposed to each other. The second outer surfaces S1 and S2 extend in a long length in the second direction, and the third and fourth outer surfaces S 3, S4 may be extended in a long length in the first direction. The module to be irradiated may be 3.5 mm or less, for example 3 mm or less or 2.3 m The lighting device 400 may be provided with a thickness Z5 in the range of 100 mm to 3 mm. , and may be provided with a flat horizontal surface or a flexible curved surface.

[0013] 1 to 4, the substrate 401 is a printed circuit board (PCB) having a circuit pattern. The substrate 401 may include, for example, a resin-based printed circuit board. Circuit Board (PCB), Metal Core PCB, Flexible PCB, Ceramic The substrate 4 may include at least one of a mixed PCB or an FR-4 substrate. When the light source 100 is mounted on a metal core PCB with a metal layer on the bottom, the heat dissipation efficiency of the light source 100 is improved. The substrate 401 is electrically connected to the light source 100. 01 includes a wiring layer (not shown) having a circuit pattern thereon, and the wiring layer is It is electrically connected to the optical elements 101 and 103. When the plurality of light-emitting elements 101 and 103 are arranged on the substrate 4 01, the plurality of light-emitting elements 101 and 103 are connected in series, parallel, or series-parallel by the wiring layer . The substrate 401 can function as a base member or a support member disposed below the light-emitting elements 101 , 103 and the resin layer 420. The upper surface of the substrate 401 can have an X-Y plane. The upper surface of the substrate 401 can have a flat plane or a curved surface. The thickness of the substrate 401 may be a height in the vertical direction or the Z direction. Here, the X direction may be the first direction , the Y direction may be the second direction, and the Z direction may be a direction orthogonal to the first and second directions . The length of the substrate 401 in the first direction may be larger than the width in the second direction . The length of the substrate 401 in the first direction may be twice or more, for example, four times or more than the width Y1 (see FIG. 4) in the second direction . The plurality of light-emitting elements 101 and 103 may be arranged on the substrate 401 at a predetermined interval in the first direction . The substrate 401 can include a light-transmissive material through which light is transmitted through the upper and lower surfaces . The light-transmissive material can include at least one of PET (Polyethylene terephthalate), PS (Polystyrene), and PI (Polyimide) .

[0014] The light source 100 can include a plurality of light-emitting elements 101 and 103 arranged at least in the first direction X . The light source 100 can include at least one third light-emitting element arranged in the second direction Y . That is, the light source 100 includes light-emitting elements in N rows and M columns ​It is possible. For the sake of convenience in explanation, the light-emitting element will be described by taking the first light-emitting element 101 and the second light-emitting element 103 separated in the first direction as an example. The first light-emitting element 101 is arranged adjacent to the first outer surface S1 of the resin layer 420 and emits light in the direction of the second outer surface S2. The second light-emitting element 103 is adjacent to the second outer surface S2 within the resin layer 420 or is separated from the first light-emitting element 101 in the first direction X and emits light in the direction of the second outer surface S2. Each of the light-emitting elements 101 and 103 is arranged on the substrate 401 and emits light in the first direction or the direction of the second outer surface S2. The light-emitting elements 101 and 103 emit light with the highest intensity in the first direction. The light-emitting elements 101 and 103 can have an emission surface 81 from which light is emitted, and the emission surface 81 can be arranged, for example, in the third direction or the vertical direction with respect to the horizontal upper surface of the substrate 401. The emission surface 81 can be the surface of the molding member 80 inside the light-emitting elements 101 and 103, and can be a vertical plane, or can include a surface that is concave or protruding in one direction of the light-emitting diode chip 7. As shown in FIGS. 20 and 21, the light-emitting elements 101 and 103 are arranged on the substrate 401 and are electrically connected to the pads 403 and 405 of the substrate 401 by the conductive bonding members 203 , 205. The conductive bonding members 203 and 205 may be made of a solder material or a metal material. As another example, the light-emitting elements 101 and 103 may be arranged in one row or two or more rows in the second direction on the substrate 401, and the one row or two or more rows of light-emitting elements 101 and 103 can emit light in the second side surface direction of the substrate 401 or can emit light in the same direction or different directions. The light-emitting elements 101 and 103 are elements having light-emitting diode (LED) chips. The light-emitting elements 101 and 103 may be arranged in one row or two or more rows in the second direction on the substrate 401, and the one row or two or more rows of light-emitting elements 101 and 103 can emit light in the second side surface direction of the substrate 401 or can emit light in the same direction or different directions. The light-emitting elements 101 and 103 can emit light in the side surface direction of the substrate 401 or in the same direction or different directions. The light-emitting elements 101 and 103 are elements having light-emitting diode (LED) chips. The package can include an optical chip that is packaged. The light-emitting diode chip 71 can emit at least one of blue, red, green, ultraviolet (UV), and infrared light. The light-emitting diode chip can emit light with the highest intensity at a wavelength in the range of, for example, 400 nm to 500 nm or 400 nm to 470 nm of blue light. A molding member 80 is disposed inside the light-emitting elements 101 and 103, and the molding member 80 can include wavelength conversion means. The wavelength conversion means includes a phosphor or quantum dots and can emit light with the highest intensity at a blue, green, yellow, or red wavelength. Thereby, the light emitted from the light-emitting elements 101 and 103 has the highest intensity wavelength emitted and mixed. The light-emitting elements 101 and 103 can emit white, blue, yellow, green, or red light. As another example, the light-emitting elements 101 and 103 may be arranged with LED chips. The light-emitting elements 101 and 103 may be of a side-view type in which the bottom portion is electrically connected to the substrate 401. As another example, the light-emitting elements 101 and 103 may be arranged with LED chips. The emission surface 81 of the light-emitting elements 101 and 103 is arranged on one side surface, and the emission surface 81 may be a side surface adjacent to the upper surface of the substrate 401. The emission surface 81 is arranged on the side surface between the bottom surface and the upper surface of the light-emitting elements 101 and The light emitted through the light emitting surface 81 of the light emitting element 101 or 103 may be The light travels in a direction parallel to the upper surface of the substrate 401 or is reflected by the reflecting member 410. Alternatively, the thickness of the light emitting element 101 or 103 may advance toward the upper surface of the resin layer 420. The thickness may be, for example, 3 mm or less, for example, in the range of 0.8 mm to 2 mm. The length of the light emitting elements 101 and 103 in the second direction (D1 in FIG. 4) is Such light emitting elements 101 and 103 may have a thickness equal to or larger than 1.5 times the thickness in the ±Z direction. The light directional angle of the second light emitting element 101, 103 may be wider in the ±Y direction than the light directional angle of the second light emitting element 101, 103. The light directivity angle in the direction is 110 degrees or more, for example, 120 degrees to 160 degrees or 140 degrees or more. The light directivity angle of the light emitting elements 101 and 103 in the third direction may be 110 degrees or more, for example, 12 It can have a range of 0 degrees to 140 degrees.

[0015] The reflective member 410 may be disposed between the substrate 401 and the resin layer 420 . The reflective member 410 may be provided in the form of a film made of a metallic or non-metallic material. The reflecting member 410 may be attached to the upper surface of the substrate 401. The reflecting portion 410 may have an area smaller than the area of ​​the top surface of the substrate 401. The material 410 is spaced from the edge of the substrate 401, and a resin layer 420 is formed in the spaced area. At this time, the edge portion of the reflecting member 410 is peeled off. The reflecting member 410 is disposed on the lower part of the light emitting elements 101 and 103. The opening 417 of the reflecting member 410 includes a front opening 417. The upper surface of the substrate 401 is exposed, and the lower portions of the light emitting elements 101 and 103 are bonded. A portion is disposed. The size of the opening 417 may be the same as or larger than the size of the light-emitting elements 101 and 103. The reflecting member 410 may be in contact with the upper surface of the substrate 401 or may be adhered between the resin layer 420 and the substrate 401. Here, when a reflective layer of a highly reflective material is disposed on the upper surface of the substrate 401, the reflecting member 4 10 may be removed. The reflecting member 410 may be formed to have a thickness thinner than the thickness of the light-emitting elements 101 and 103. The thickness of the reflecting member 410 may be in the range of 0.2 mm ± 0.02 mm. Through the opening 417 of such a reflecting member 410, the lower portions of the light-emitting elements 101 and 103 can penetrate, and the upper portions of the light-emitting elements 101 and 103 can protrude. The light-emitting surfaces 81 of the light-emitting elements 101 and 103 may be provided in a direction perpendicular to the upper surface of the reflecting member 4 10. The reflecting member 410 may include a metallic material or a non-metallic material. The metallic material may include metals such as aluminum, silver, and gold. The non-metallic material may include a plastic material or a resin material. The plastic material may include polyethylene, polypropylene, polystyrene, polyvinyl chloride, polybiphenyl chloride, poly

[0016] ethylene terephthalate, polyvinyl alcohol, polycarbonate, polybutylene tere phthalate, polybutylene naphthalate, polyamide, polyacetal, polyphenylene ether, polyamideimide, polyetherimide, polyetheretherketone, poly imide, polytetrafluoroethylene, liquid crystal polymer, fluororesin, copolymers thereof, and so on. The resin material may include epoxy resin, phenolic resin, melamine resin, urea resin, unsaturated polyester resin, polyurethane resin, silicone resin, and so on. The resin material may include epoxy resin, phenolic resin, melamine resin, urea resin, unsaturated polyester resin, polyurethane resin, silicone resin, and their copolymers. It may be any one selected from the group consisting of these and their mixtures. The resin material may have a reflective material, such as metal oxides like TiO2, Al2O3, SiO2, added into silicone or epoxy. The reflective member 410 may be embodied as a single layer or multiple layers, and such a layer structure can improve the light reflection efficiency. The reflective member 410 according to the present disclosure can reflect the incident light and increase the amount of light so that the light is emitted in a uniform distribution.

[0017] Referring to FIG. 8, the reflective member 410 may include an adhesive layer L1, a reflective layer L2, and a dot portion L 3. The adhesive layer L1 can attach the reflective member 410 to the upper surface of the substrate 401. The adhesive layer L1 may be an adhesive such as a UV adhesive, silicone, or epoxy as a transparent material. The reflective layer L2 may include a large number of reflectors La inside the resin material. The reflector La may be a bubble such as air or a medium having the same refractive index as air. The resin material of the reflective layer L2 is a material such as silicone or epoxy, and the reflector La may be formed by injecting bubbles into the resin material. The reflective layer L2 can reflect or refract the incident light by the large number of reflectors La. The thickness of the reflective layer L2 may be 80% or more of the thickness of the reflective member 410. On the reflective layer L2, a dot portion L3 including a plurality of dots may be included. The dot portion L3 may be formed by printing on the reflective layer L2. The dot portion L3 may include reflective ink and can include, for example, TiO2, CaCO3, BaSO4, Al2O3, Silicon, PS ​​​​​​​ It can be printed with a material containing any one of them. Each dot of the dot portion L3 is , and the side cross-section may be hemispherical or polygonal. The dot pattern density of the dot portion L3 may be higher as it is farther from the emission surfaces 81 of the light-emitting elements 101 and 103. . The material of the dot portion L3 may be white. By arranging the dot portion L3 on the upper surface of the reflecting member 410 in the emission directions of the light-emitting elements 101 and 103, the light reflectance can be improved, the light loss can be reduced, and the luminance of the surface light source can be enhanced. The density of the dot portion L3 may be arranged at uniform intervals, or may be higher as it is farther from the emission surfaces 81 of the light-emitting elements 101 and 103.

[0018] Referring to FIGS. 2, 3, and 7, the reflecting member 410 can include a plurality of open regions H1 , H2. The plurality of open regions H1, H2 can include a plurality of first and second open regions H1, H2. The plurality of first open regions H1 are arranged in a first direction , and the plurality of second open regions H2 may be arranged in the first direction. The first and second open regions H1, H2 may be separated in a second direction. The first open region H 1 is adjacent to the third outer surface S3 of the substrate 401, and the second open region H2 can be adjacent to the fourth outer surface S4 of the substrate 4 01. Each of the first open regions H1 can overlap with each of the second open regions H2 in the second direction. The first and second open regions H1, H2 may not overlap with the light-emitting elements 101 and 103 in the first direction. The first and second open regions H1, H2 and the opening 417 are in the second direction ​​​The first and second open areas H1 and H2 may not overlap with each other. The shape may be an ellipse, a circle, or a polygon having a long shape in the first direction. and the second open area H1, H2 have a distance B4 in the first direction that is equal to or smaller than the first and second open areas H2, H3, H4, and The length B5 of the first open area H1 and the second open area H2 in the first direction may be smaller than the length B5 of the first open area H2 and the second open area H3 in the first direction. >B4, and the difference between the interval B4 and the length B5 is in the range of 0.1 mm to 1 mm. The first and second open areas H1 and H2 of the reflecting member 410 are Since the length B5 of the slit 401 is long in the first direction, the slit 401 is adjacent to the long side edge of the substrate 401. In other words, the adhesive strength of the third outer surface S3 of the substrate 401 and the front surface S4 of the substrate 401 can be prevented from decreasing. Between the first open area H1 and the fourth outer surface S4 of the substrate 401 and the second open area This can prevent the adhesive strength of the reflective member 410 disposed between the regions H2 from decreasing. Referring to FIG. 1, the distance C2 between the first and second open regions H1 and H2 is It may be greater than the length D1 of the elements 101 and 103 in the second direction, and may be 1.5 times the length D1. The width B6 in the second direction of the first and second open areas H1 and H2 may be The length B5 may be 1 / 5 or less, for example, in the range of 1 / 5 to 1 / 10. The width B6 may be 1.2 mm or less, for example, in the range of 0.8 mm to 1.2 mm. Each of the first and second open regions H1 and H2 has a reduced adhesive strength in the first direction. This can prevent a decrease in adhesive strength in the second direction. H1 and H2 are spaced apart from the third and fourth outer surfaces S3 and S4 of the substrate 401 at a predetermined distance B2. The interval B2 is 1.2 mm or less, for example, in the range of 0.5 mm to 1.2 mm. It is possible. If the interval B2 is smaller than the range, the adhesive force of the reflecting member 410 disposed outside the first and second open regions H1 and H2 decreases. If it is larger than the range, the reflection area decreases. The reflecting member 410 is disposed outside the first and second open regions H1 and H2 and is exposed on the third and fourth outer surfaces S1 and S2 of the substrate 401. The first and second open regions H1 and H2 and the reflecting member 410 are provided with the resin layer 420. The resin layer 420 is disposed. The resin layer 420 is adhered to the upper surface of the substrate 401 through the first and second open regions H1 and H2, and the outer portion of the reflecting member 410 can be fixed. Referring to FIGS. 1 to 4, the resin layer 420 may be disposed on the substrate 401. The lower surface of the resin layer 420 can face the upper surface of the substrate 401. The resin layer 420 may be disposed on the entire upper surface or a partial region of the substrate 401. The resin layer 420 may be disposed on the reflecting member 410. The resin layer 420 may be disposed on the entire upper surface or a partial region of the reflecting member 410. The lower

[0019] surface area of the resin layer 420 may be the same as or smaller than the upper surface area of the substrate 401. The resin layer 420 can be made of a transparent material. The resin layer 420 can include at least two types of resin materials such as silicone, UV resin, or epoxy. The resin layer 420 can include a thermosetting resin material and can selectively include, for example, PC, OPS, PMMA, and PVC. The resin layer 420 may be formed of glass. For example, the main material of the resin layer 420 is a resin material mainly composed of urethane acrylate oligomer. The resin layer 420 may be disposed on the reflecting member 410. The resin layer 420 may be disposed on the entire upper surface or a partial region of the reflecting member 410. The lower surface area of the resin layer 420 may be the same as or smaller than the upper surface area of the substrate 401. The resin layer 420 can be made of a transparent material. The resin layer 420 can include at least two types of resin materials such as silicone, UV resin, or epoxy. The resin layer 420 can include a thermosetting resin material and can selectively include, for example, PC, OPS, PMMA, and PVC. The resin layer 420 may be formed of glass. For example, 0 can be made of a transparent material. The resin layer 420 can include at least two types of resin materials such as silicone, UV resin, or epoxy. The resin layer 420 can include a thermosetting resin material and can selectively include, for example, PC, OPS, PMMA, and PVC. The resin layer 420 may be formed of glass. For example, the main material of the resin layer 420 is a resin material mainly composed of urethane acrylate oligomer. The resin layer 420 can include at least two types of resin materials such as silicone, UV resin, or epoxy. The resin layer 420 can include a thermosetting resin material and can selectively include, for example, PC, OPS, PMMA, and PVC. The resin layer 420 may be formed of glass. For example, the main material of the resin layer 420 is a resin material mainly composed of urethane acrylate oligomer. The resin layer 420 can include at least two types of resin materials such as silicone, UV resin, or epoxy. The resin layer 420 can include a thermosetting resin material and can selectively include, for example, PC, OPS, PMMA, and PVC. The resin layer 420 may be formed of glass. For example, the main material of the resin layer 420 is a resin material mainly composed of urethane acrylate oligomer. The resin layer 420 can include at least two types of resin materials such as silicone, UV resin, or epoxy. The resin layer 420 can include a thermosetting resin material and can selectively include, for example, PC, OPS, PMMA, and PVC. The resin layer 420 may be formed of glass. For example, the main material of the resin layer 420 is a resin material mainly composed of urethane acrylate oligomer. For example, a synthetic oligomer, urethane acrylate oligomer, can be used. A mixture of the mer with a polymer type that is polyacrylic can be used. Here, we introduce IBOA (isobornyl acrylate), HPA (HPA), which are low-boiling point dilutable reactive monomers. A mixture of 2-HEA (2-hydroxyethyl acrylate), 2-HEA (2-hydroxyethyl acrylate), etc. The polymer may further include a photoinitiator (e.g., 1-hydroxycyclohexyl ph The resin layer 420 may be mixed with a resin such as ethylenediaminetetraacetate (enyl-ketone, etc.) or an antioxidant. Because it is provided as a light-guiding layer of oil, it is provided in a thinner thickness than glass. The resin layer 420 may be provided as a flexible plate. The point light source emitted from the resin layer 3 can be emitted in the form of a line light source or a surface light source. The bead (not shown) may be included in 420, and the bead is configured to reflect the incident light. The beads can diffuse and reflect light from the resin layer 420 to increase the amount of light. The beads may be disposed in an amount of 0.01 to 0.3% by weight. licon), Silica, Glass bubble, PMMA (Polymethyl methacrylate late), urethane, Zn, Zr, Al2O3, and acrylic. The beads may be made of any one of the following materials: The resin layer 420 according to the present disclosure is made up of resin parts 421 and 423 made of different materials. The resin parts 421 and 423 may include at least two kinds of resin materials. and can be arranged in different regions of the resin layer 420. The resin layer 420 can include a first resin portion 421 and a second resin portion 423 made of different resin materials. The first resin portion and the second resin portions 421 and 423 may be alternately arranged at least in the first direction. The first resin portion and the second resin portions 421 and 423 may be alternately arranged in the first direction and repeatedly arranged one or more times in the second direction. A second resin portion 4 23 is arranged between a plurality of first resin portions 421. A first resin portion 421 is arranged between a plurality of second resin portions 423. The second resin portion 423 may be arranged on both side surfaces of the first resin portion 421 or may be arranged around the first resin portion 421. The second resin portion 423 can contact at least two or all of the side surfaces of the first resin portion 42 1. The first resin portion 421 can be arranged above the light source 100 to seal the light source 100. The first resin portion 421 can be arranged above each light emitting element 101, 103 to cover each light emitting element 101, 103. The first resin portion 421 can include an inclined upper surface RS1, and first and second side surfaces RS2 and RS3 facing each other in the first direction. The second resin portion 423 may be separated from each light emitting element 101, 103. The second resin portion 423 may be separated from the emission surface 81 of each light emitting element 101, 103. The first resin portion 421 is made of a silicone resin or a thermosetting resin material, and the second resin portion 423 can include a UV resin material. The resin layer 420 can include resin materials cured by different curing

[0020] methods. The resin layer 420 can include outgas It can include a resin material that induces outgassing and a resin material that does not induce outgassing. That is , between the resin layer 420, a substance that induces outgassing and the light-emitting elements 101, 103, an outgassing non-inducing substance can be arranged to remove problems caused by outgassing. For example, the UV resin material emits or induces outgassing in processes such as reflow or in a high-temperature and high-humidity environment. Here, when the UV resin material is adjacent to each light-emitting element 101, 103 or adjacent to each light-emitting diode chip 71, it will emit gas in a high-temperature and high-humidity environment. The emitted gas will cause phenomena such as discoloration of the emission surfaces 81 of the light-emitting elements 101, 103 or carbonization of the surfaces of the light-emitting diode chips 71. Due to such discoloration of the molding member 80 and the carbonization problem on the surface of the light-emitting diode chip, the optical reliability of the light flux or the light source decreases. Thus, the material of the resin covering the light-emitting elements 101, 103 can block problems caused by outgassing by being formed of a material that does not induce outgassing. When the resin layer 420 is formed of a silicone resin material, there is a problem that the silicone resin material does not adhere to some types of adhesives, for example, acrylic adhesives. On the other hand, the UV resin material has no adhesion problem with the above-mentioned adhesives and is more competitive than the silicone resin in terms of cost. Therefore, the present disclosure forms the resin layer 420 with a first resin portion 421 of silicone resin and a second resin portion 42 3 of UV resin to eliminate problems caused by outgassing and for adhesion to the adhesive layer. That is, it can be blocked. When the resin layer 420 is formed of a silicone resin material, the silicone resin material has a problem of not adhering to some types of adhesives, for example, acrylic adhesives. On the contrary, the UV resin material has no adhesion problem with the above-mentioned adhesives and is more competitive than the silicone resin in terms of cost. Therefore, the present disclosure forms the resin layer 420 with a first resin portion 421 of silicone resin and a second resin portion 42 3 of UV resin to eliminate problems caused by outgassing and for adhesion to the adhesive layer. That is, it can be formed. 3.

[0021] Among the upper surfaces RS1 of the first resin portion 421, the regions overlapping the light-emitting elements 101, 103 in the vertical direction may be horizontal or inclined. The light-emitting elements 101, 103 and the second resin portion The region overlapping vertically with the region between the portions 423 may include an inclined, recessed, or protruding curved surface. The upper surface RS1 of the first resin portion 421 may be an inclined plane and may have an inclination. When the virtual straight line connecting the lowermost end PS1 and the uppermost end PS2 of the upper surface RS1 of the first resin portion 421, it may have an inclination. The upper surface RS1 of the first resin portion 421 may be separated from the first diffusion layer 430. When a plurality of the light-emitting elements 101 and 103 are arranged in N rows and M columns, the first resin portions 421 may be arranged in N rows and M columns. Here, M and N are integers of 1 or more, and may have a relationship of N≧M. The second resin portions 423 may be respectively arranged between the first resin portions 421, and may be interconnected or separated. The second resin portions 423 may be integrally formed outside the plurality of first resin portions 421. The lowermost end PS1 of the upper surface RS1 of the first resin portion 421 may be arranged lower than the upper end or the upper surface of the second resin portion 423. The lowermost end PS1 of the upper surface RS1 of the first resin portion 421 may be arranged at the same level as or higher than the upper surfaces of the light-emitting elements 101 and 103. The lowermost end PS1 of the upper surface RS1 of the first resin portion 421 may be at the same level as or higher than the upper end of the front surface of the light-emitting elements 101 and 103, and may be the same as or different from the upper end of the rear surface. This is because when the first resin portion 421 covers at least the front surface among the side surfaces of the light-emitting elements 101 and 103, it can prevent a decrease in the light extraction efficiency and can protect from the second resin portion 423. The upper surface RS1 of the first resin portion 421 may be separated from the first diffusion layer 430. When a plurality of the light-emitting elements 101 and 103 are arranged in N rows and M columns, the first resin portions 421 may be arranged in N rows and M columns. Here, M and N are integers of 1 or more, and may have a relationship of N≧M. The second resin portions 423 may be respectively arranged between the first resin portions 421, and may be interconnected or separated. The second resin portions 423 may be integrally formed outside the plurality of first resin portions 421. The lowermost end PS1 of the upper surface RS1 of the first resin portion 421 may be arranged lower than the upper end or the upper surface of the second resin portion 423. The lowermost end PS1 of the upper surface RS1 of the first resin portion 421 may be arranged at the same level as or higher than the upper surfaces of the light-emitting elements 101 and 103. The lowermost end PS1 of the upper surface RS1 of the first resin portion 421 may be at the same level as or higher than the upper end of the front surface of the light-emitting elements 101 and 103, and may be the same as or different from the upper end of the rear surface. This is because when the first resin portion 421 covers at least the front surface among the side surfaces of the light-emitting elements 101 and 103, it can prevent a decrease in the light extraction efficiency and can protect from the second resin portion 423. The upper surface RS1 of the first resin portion 421 may be separated from the first diffusion layer 430. When a plurality of the light-emitting elements 101 and 103 are arranged in N rows and M columns, the first resin portions 421 may be arranged in N rows and M columns. Here, M and N are integers of 1 or more, and may have a relationship of N≧M. The second resin portions 423 may be respectively arranged between the first resin portions 421, and may be interconnected or separated. The second resin portions 423 may be integrally formed outside the plurality of first resin portions 421. When a plurality of the light-emitting elements 101 and 103 are arranged in N rows and M columns, the first resin portions 421 may be arranged in N rows and M columns. Here, M and N are integers of 1 or more, and may have a relationship of N≧M. The second resin portions 423 may be respectively arranged between the first resin portions 421, and may be interconnected or separated. The second resin portions 423 may be integrally formed outside the plurality of first resin portions 421. When a plurality of the light-emitting elements 101 and 103 are arranged in N rows and M columns, the first resin portions 421 may be arranged in N rows and M columns. Here, M and N are integers of 1 or more, and may have a relationship of N≧M. The second resin portions 423 may be respectively arranged between the first resin portions 421, and may be interconnected or separated. The second resin portions 423 may be integrally formed outside the plurality of first resin portions 421. The second resin portions 423 may be respectively arranged between the first resin portions 421, and may be interconnected or separated. The second resin portions 423 may be integrally formed outside the plurality of first resin portions 421. The second resin portions 423 may be respectively arranged between the first resin portions 421, and may be interconnected or separated. The second resin portions 423 may be integrally formed outside the plurality of first resin portions 421. The second resin portions 423 may be respectively arranged between the first resin portions 421, and may be interconnected or separated. The second resin portions 423 may be integrally formed outside the plurality of first resin portions 421.

[0022] The lowermost end PS1 of the upper surface RS1 of the first resin portion 421 may be arranged lower than the upper end or the upper surface of the second resin portion 423. The lowermost end PS1 of the upper surface RS1 of the first resin portion 421 may be arranged at the same level as or higher than the upper surfaces of the light-emitting elements 101 and 103. The lowermost end PS1 of the upper surface RS1 of the first resin portion 421 may be at the same level as or higher than the upper end of the front surface of the light-emitting elements 101 and 103, and may be the same as or different from the upper end of the rear surface. This is because when the first resin portion 421 covers at least the front surface among the side surfaces of the light-emitting elements 101 and 103, it can prevent a decrease in the light extraction efficiency and can protect from the second resin portion 423. The lowermost end PS1 of the upper surface RS1 of the first resin portion 421 may be arranged lower than the upper end or the upper surface of the second resin portion 423. The lowermost end PS1 of the upper surface RS1 of the first resin portion 421 may be arranged at the same level as or higher than the upper surfaces of the light-emitting elements 101 and 103. The lowermost end PS1 of the upper surface RS1 of the first resin portion 421 may be at the same level as or higher than the upper end of the front surface of the light-emitting elements 101 and 103, and may be the same as or different from the upper end of the rear surface. This is because when the first resin portion 421 covers at least the front surface among the side surfaces of the light-emitting elements 101 and 103, it can prevent a decrease in the light extraction efficiency and can protect from the second resin portion 423. The lowermost end PS1 of the upper surface RS1 of the first resin portion 421 may be arranged lower than the upper end or the upper surface of the second resin portion 423. The lowermost end PS1 of the upper surface RS1 of the first resin portion 421 may be arranged at the same level as or higher than the upper surfaces of the light-emitting elements 101 and 103. The lowermost end PS1 of the upper surface RS1 of the first resin portion 421 may be at the same level as or higher than the upper end of the front surface of the light-emitting elements 101 and 103, and may be the same as or different from the upper end of the rear surface. This is because when the first resin portion 421 covers at least the front surface among the side surfaces of the light-emitting elements 101 and 103, it can prevent a decrease in the light extraction efficiency and can protect from the second resin portion 423. The lowermost end PS1 of the upper surface RS1 of the first resin portion 421 may be arranged lower than the upper end or the upper surface of the second resin portion 423. The lowermost end PS1 of the upper surface RS1 of the first resin portion 421 may be arranged at the same level as or higher than the upper surfaces of the light-emitting elements 101 and 103. The lowermost end PS1 of the upper surface RS1 of the first resin portion 421 may be at the same level as or higher than the upper end of the front surface of the light-emitting elements 101 and 103, and may be the same as or different from the upper end of the rear surface. This is because when the first resin portion 421 covers at least the front surface among the side surfaces of the light-emitting elements 101 and 103, it can prevent a decrease in the light extraction efficiency and can protect from the second resin portion 423. The lowermost end PS1 of the upper surface RS1 of the first resin portion 421 may be at the same level as or higher than the upper end of the front surface of the light-emitting elements 101 and 103, and may be the same as or different from the upper end of the rear surface. This is because when the first resin portion 421 covers at least the front surface among the side surfaces of the light-emitting elements 101 and 103, it can prevent a decrease in the light extraction efficiency and can protect from the second resin portion 423. This is because when the first resin portion 421 covers at least the front surface among the side surfaces of the light-emitting elements 101 and 103, it can prevent a decrease in the light extraction efficiency and can protect from the second resin portion 423. This is because when the first resin portion 421 covers at least the front surface among the side surfaces of the light-emitting elements 101 and 103, it can prevent a decrease in the light extraction efficiency and can protect from the second resin portion 423.

[0023] The uppermost end PS2 of the first resin portion 421 may be the same as or different from the upper end of the second resin portion 423. It may become. When the uppermost end PS2 of the first resin portion 421 is the same as the upper end of the second resin portion 423, it is convenient to form and fix the second resin portion 423 after forming the first resin portion 421. When the uppermost end PS2 of the first resin portion 421 is higher than the upper end of the second resin portion 423, the inclination angle of the inclined upper surface increases, and various problems of the first adhesive layer on the upper surface of the first resin portion 421 can be suppressed. When the uppermost end PS2 of the first resin portion 421 is lower than the upper end of the second resin portion 423, the distance between the light-emitting elements 101 and 103 and the second resin portion 423 can be reduced, and the height of the air region 450 can be provided higher. As shown in FIG. 1, in the first direction or row direction, the length K1 of the first resin portion 421 and the length K2 of the second resin portion 423 may be the same or different. The ratio K1:K2 of the length K1 of the first resin portion 421 and the length K2 of the second resin portion 423 in the horizontal direction or the first direction may have a range of 6:4 to 4:6. The length K1 of the first resin portion 421 in the first direction is arranged in the range of 40% to 60% of the length K2 of the second resin portion 423, so that the emission surfaces 81 of the light-emitting elements 101 and 103 can be separated from the second resin portion 423 at a stable distance. The minimum distance E1 between the emission surfaces 81 of the light-emitting elements 101 and 103 and the second resin portion 423 may be 3 mm or more, for example, 5 mm or more. The upper surface area of the first resin portion 421 may be the same as or smaller than the upper surface area of the second resin portion 423. Referring to FIG. 2, the first resin portion 421 has an upper surface RS1 disposed on the light-emitting elements 101 and 103, and a first side surface R disposed in front of the emission surfaces 81 of the light-emitting elements 101 and 103.

[0024]

[0025] S2 and the second side surfaces RS3 disposed on the rear surfaces (i.e., the surfaces opposite to the emission surfaces) of the light emitting elements 101 and 103 can be included. As shown in FIG. 7, the third and fourth side surfaces RS4 and RS5 disposed in the second direction of the first resin portion 421 may be separated from the third and fourth outer side surfaces S3 and S4. The second resin portion 423 is disposed so as to surround the side surfaces RS2, RS3, RS4, and RS5 of the first resin portion 421, and the area of the first resin portion 421 can be reduced, and the problem that the outer portion of the first resin portion 421 floats can be prevented. Further, by disposing the first and second resin portions 421 and 423 outside the light emitting elements 101 and 103, the penetration of moisture through the third and fourth side surfaces RS4 and RS5 can be suppressed. The top view shape of the first resin portion 421 can include a polygonal shape, a circular shape, or an irregular shape. As shown in FIG. 5, in the resin layer 420, the first resin portion 421 and the second resin portion 423 are alternately arranged in the first direction, and the second resin portion 423 is separated by the first resin portion 421. The first and second resin portions 421 and 423 are respectively exposed on the third outer side surface S3 and the fourth outer side surface S4. That is, the lengths of the first and second resin portions 421 and 423 in the second direction may be the same. The sum of the upper surface areas of the second resin portion 423 may be larger than the sum of the upper surface areas of the first resin portion 421. As shown in FIG. 6, the first resin portion 421 of the resin layer 420 may be the same as the region of the light shielding portion 425. Thereby, the second resin portion 423 is disposed along the periphery of the first resin portion 421 and is exposed through the first to fourth outer side surfaces S1, S2, S3, and S4.

[0026]

[0027] ​​​​​​​​​​​​​​​

[0028] As shown in FIGS. 1 to 3, since the first resin portion 421 of the resin layer 420 is disposed on the light-emitting elements 101 and 103, the light-emitting elements 101 and 103 can be protected, and the loss of light emitted from the light-emitting elements 1 01 and 103 can be reduced. The upper surfaces of the light-emitting elements 101 and 10 3 are buried in the lower portion of the first resin portion 421. As shown in FIG. 2, the first resin portion 421 can contact the surfaces of the light-emitting elements 101 and 103, and can contact the emission surfaces 81 of the light-emitting elements 10 1 and 103. A part of the first resin portion 421 may be disposed in the opening 417 of the reflection member 410. A part of the first resin portion 421 may contact the upper surface of the substrate 401 through the opening 417 of the reflection member 410 . Thus, by a part of the first resin portion 421 contacting the substrate 401, the reflection member 410 can be fixed between the first resin portion 421 and the substrate 401. .

[0029] The upper surface RS1 of the first resin portion 421 includes a lowermost end PS1 and an uppermost end PS2, and the position of the lowermost end PS1 is adjacent to the upper surface or / and the rear surface of the first light-emitting element and the second light-emitting elements 101 and 103, and the position of the uppermost end PS2 is the first light-emitting element and the second light-emitting elements 101 and 103 or a position most distant from the lowermost end PS1 in the direction of the second outer surface S2 may be disposed. The height Z0 of the lowermost end PS1 may be the same as or higher than the upper surface height of the light-emitting elements 101 and 103 with reference to the upper surface of the substrate 401 or the upper surface of the reflection member 410. The height Z0 of the lowermost end PS1 can have a range of 1 mm or more, for example, 1.4 mm to 1.6 mm . The height Z1 of the uppermost end PS2 is that of the second resin portion 423 It may be arranged at the same level or higher than the above. The lowermost PS1 may be the upper end of the second side surface RS3 and the uppermost PS2 may be the upper end of the first side surface RS2. The upper surface RS1 of the first resin part 421 may have a height that increases gradually from the lowermost PS1 to the uppermost PS2 . The upper surface RS1 of the first resin part 421 may be arranged at a height that increases gradually as it moves away from each of the light emitting elements 101, 103 in the first direction. Here, the air region 450 may be provided as a region having a gap that decreases gradually as it moves away from each of the light emitting elements 101, 103 in the first direction. The upper surface RS1 of the region A2 where the first resin part 421 overlaps with each of the light emitting elements 101, 103 in a direction perpendicular to them may be arranged to be inclined or horizontal. The air region 450 may be a region without a resin substance. The second side surface RS3 of the first resin part 421 may be in contact with or separated from the rear surfaces of each of the light emitting elements 101, 103 . This is because when the second side surface RS3 of the first resin part 421 is arranged outside the rear surfaces of each of the light emitting elements 101, 103, the manufacturing process of the second resin part 423 is convenient. A part of the first resin part 421 may be arranged in the opening 417 of the reflecting member 410. The first side surface RS2 and the second side surface RS3 of the first resin part 421 may be in contact with the second resin part 423 . The distance between the second side surface RS3 in contact with the second resin part 423 and the light emitting elements 101, 103 in the first resin part 421 may be smaller than the distance between the first side surface RS2 in contact with the second resin part 423 and the light emitting elements 101, 103. As shown in FIG. 7, the first resin part 421 may include a third side surface RS4 adjacent to the third outer surface S3 and a fourth side surface RS5 adjacent to the fourth outer surface S4 . The upper surface RS1 of the region A2 where the first resin part 421 overlaps with each of the light emitting elements 101, 103 in a direction perpendicular to them may be arranged to be inclined or horizontal. The air region 450 may be a region without a resin substance. The second side surface RS3 of the first resin part 421 may be in contact with or separated from the rear surfaces of each of the light emitting elements 101, 103 . This is because when the second side surface RS3 of the first resin part 421 is arranged outside the rear surfaces of each of the light emitting elements 101, 103, the manufacturing process of the second resin part 423 is convenient. A part of the first resin part 421 may be arranged in the opening 417 of the reflecting member 410. The first side surface RS2 and the second side surface RS3 of the first resin part 421 may be in contact with the second resin part 423 . The second side surface RS3 of the first resin part 421 may be in contact with or separated from the rear surfaces of each of the light emitting elements 101, 103. This is because when the second side surface RS3 of the first resin part 421 is arranged outside the rear surfaces of each of the light emitting elements 101, 103, the manufacturing process of the second resin part 423 is convenient. A part of the first resin part 421 may be arranged in the opening 417 of the reflecting member 410. The first side surface RS2 and the second side surface RS3 of the first resin part 421 may be in contact with the second resin part 423 . A part of the first resin part 421 may be arranged in the opening 417 of the reflecting member 410. The first side surface RS2 and the second side surface RS3 of the first resin part 421 may be in contact with the second resin part 423. The distance between the second side surface RS3 in contact with the second resin part 423 and the light emitting elements 101, 103 in the first resin part 421 may be smaller than the distance between the first side surface RS2 in contact with the second resin part 423 and the light emitting elements 101, 103 . As shown in FIG. 7, the first resin part 421 may include a third side surface RS4 adjacent to the third outer surface S3 and a fourth side surface RS5 adjacent to the fourth outer surface S4. The upper surface RS1 of the first resin part 421 may have a height that increases gradually from the lowermost PS1 to the uppermost PS2 . A part of the first resin part 421 may be arranged in the opening 417 of the reflecting member 410. The first side surface RS2 and the second side surface RS3 of the first resin part 421 may be in contact with the second resin part 423. The distance between the second side surface RS3 in contact with the second resin part 423 and the light emitting elements 101, 103 in the first resin part 421 may be smaller than the distance between the first side surface RS2 in contact with the second resin part 423 and the light emitting elements 101, 103 . The first side surface RS2 and the second side surface RS3 of the first resin part 421 may be in contact with the second resin part 423. The distance between the second side surface RS3 in contact with the second resin part 423 and the light emitting elements 101, 103 in the first resin part 421 may be smaller than the distance between the first side surface RS2 in contact with the second resin part 423 and the light emitting elements 101, 103 . The distance between the second side surface RS3 in contact with the second resin part 423 and the light emitting elements 101, 103 in the first resin part 421 may be smaller than the distance between the first side surface RS2 in contact with the second resin part 423 and the light emitting elements 101, 103. As shown in FIG. 7, the first resin part 421 may include a third side surface RS4 adjacent to the third outer surface S3 and a fourth side surface RS5 adjacent to the fourth outer surface S4 . The distance between the second side surface RS3 in contact with the second resin part 423 and the light emitting elements 101, 103 in the first resin part 421 may be smaller than the distance between the first side surface RS2 in contact with the second resin part 423 and the light emitting elements 101, 103. As shown in FIG. 7, the first resin part 421 may include a third side surface RS4 adjacent to the third outer surface S3 and a fourth side surface RS5 adjacent to the fourth outer surface S4 . As shown in FIG. 7, the first resin part 421 may include a third side surface RS4 adjacent to the third outer surface S3 and a fourth side surface RS5 adjacent to the fourth outer surface S4. The upper surface RS1 of the first resin part 421 may have a height that increases gradually from the lowermost PS1 to the uppermost PS2 . As shown in FIG. 7, the first resin part 421 may include a third side surface RS4 adjacent to the third outer surface S3 and a fourth side surface RS5 adjacent to the fourth outer surface S4. The upper surface RS1 of the first resin part 421 may have a height that increases gradually from the lowermost PS1 to the uppermost PS2 . The first resin part 421 may include a third side surface RS4 adjacent to the third outer surface S3 and a fourth side surface RS5 adjacent to the fourth outer surface S4. The upper surface RS1 of the first resin part 421 may have a height that increases gradually from the lowermost PS1 to the uppermost PS2 A second resin portion 423 is disposed between the third side surface RS4 and the third outer side surface S3. Between the fourth side surface RS4 of the first resin portion 421 and the fourth outer side surface S4, a second resin portion 423 is disposed. The second resin portion 423 disposed outside the third and fourth side surfaces RS4 and RS5 of the first resin portion 421 can protect the first resin portion 421 and suppress the penetration of moisture in the directions of the light emitting elements 101 and 103. The boundary portion between the third and fourth side surfaces RS4 and RS5 and the first and second side surfaces RS2 and RS3 may be a chamfered surface or a protruding curved surface. Between both outer side surfaces S1 and S2 of the second resin portion 423, a plurality of light emitting elements 101, 103 and a plurality of first resin portions 421 are disposed. At least one second resin portion 423 is disposed between the plurality of first resin portions 421. As shown in FIGS. 3 and 7, the resin layer 420 may include a first protrusion P1 disposed in the first open region H1 and a second protrusion P2 disposed in the second open region H2. The first protrusion P1 is attached to the upper surface of the substrate 401 along the first open region H1. The first protrusion P1 is disposed in the first open region H1 and can prevent a decrease in the adhesive force in the outer edge region of the reflecting member 410 adjacent to the first outer side surface S1 of the substrate 401. The second protrusion P2 is attached to the upper surface of the substrate 401 along the second open region H2. The second protrusion P2 is disposed in the second open region H2 of the reflecting member 410 and can prevent a decrease in the adhesive force in the outer edge region of the reflecting member 410 adjacent to the second outer side surface S2 of the substrate 401. The first protrusion P1 is arranged in the first direction, and the second protrusion P2 is arranged in the first direction. A plurality of light emitting elements 101, 103 and a plurality of first resin portions 421 are disposed between both outer side surfaces S1 and S2 of the second resin portion 423. At least one second resin portion 423 is disposed between the plurality of first resin portions 421. As shown in FIGS. 3 and 7, the resin layer 420 may include a first protrusion P1 disposed in the first open region H1 and a second protrusion P2 disposed in the second open region H2. The first protrusion P1 is attached to the upper surface of the substrate 401 along the first open region H1. The first protrusion P1 is disposed in the first open region H1 and can prevent a decrease in the adhesive force in the outer edge region of the reflecting member 410 adjacent to the first outer side surface S1 of the substrate 401. The second protrusion P2 is attached to the upper surface of the substrate 401 along the second open region H2. The second protrusion P2 is disposed in the second open region H2 of the reflecting member 410 and can prevent a decrease in the adhesive force in the outer edge region of the reflecting member 410 adjacent to the second outer side surface S2 of the substrate 401. The first protrusion P1 is arranged in the first direction, and the second protrusion P2 is arranged in the first direction. The first protrusion P1 is attached to the upper surface of the substrate 401 along the first open region H1. The first protrusion P1 is disposed in the first open region H1 and can prevent a decrease in the adhesive force in the outer edge region of the reflecting member 410 adjacent to the first outer side surface S1 of the substrate 401. The second protrusion P2 is attached to the upper surface of the substrate 401 along the second open region H2. The second protrusion P2 is disposed in the second open region H2 of the reflecting member 410 and can prevent a decrease in the adhesive force in the outer edge region of the reflecting member 410 adjacent to the second outer side surface S2 of the substrate 401. The first protrusion P1 is arranged in the first direction, and the second protrusion P2 is arranged in the first direction. The first protrusion P1 is attached to the upper surface of the substrate 401 along the first open region H1. The first protrusion P1 is disposed in the first open region H1 and can prevent a decrease in the adhesive force in the outer edge region of the reflecting member 410 adjacent to the first outer side surface S1 of the substrate 401. The second protrusion P2 is attached to the upper surface of the substrate 401 along the second open region H2. The second protrusion P2 is disposed in the second open region H2 of the reflecting member 410 and can prevent a decrease in the adhesive force in the outer edge region of the reflecting member 410 adjacent to the second outer side surface S2 of the substrate 401. The first protrusion P1 is arranged in the first direction, and the second protrusion P2 is arranged in the first direction. The first protrusion P1 is attached to the upper surface of the substrate 401 along the first open region H1. The first protrusion P1 is disposed in the first open region H1 and can prevent a decrease in the adhesive force in the outer edge region of the reflecting member 410 adjacent to the first outer side surface S1 of the substrate 401. The second protrusion P2 is attached to the upper surface of the substrate 401 along the second open region H2. The second protrusion P2 is disposed in the second open region H2 of the reflecting member 410 and can prevent a decrease in the adhesive force in the outer edge region of the reflecting member 410 adjacent to the second outer side surface S2 of the substrate 401.

[0030] The first protrusion P1 is arranged in the first direction, and the second protrusion P2 is arranged in the first direction. are formed, and the first protrusions and the second protrusions P1 and P2 are spaced apart from each other in the second direction. This is possible. The first protrusion P1 and the second protrusion P2 can protrude lower than the upper surface of the reflecting member 410. The first protrusion P1 and the second protrusion P2 can protrude in the direction of the lower surface of the substrate 401. The first protrusion P1 and the second protrusion P2 prevent the problem that the edge region of the reflecting member 410 floats up, and may be disposed in the bezel region of the housing to which the lighting device is coupled. As shown in FIGS. 3 and 7, the first protrusion and the second protrusions P1 and P2 disposed in the first and second open regions H1 and H2 in the region of the first resin portion 421 can be made of the material of the first resin portion 421. The first protrusion and the second protrusions P1 and P2 disposed in the first open region and the second open regions H1 and H2 in the region of the second resin portion 423 can be made of the material of the second resin portion 423.

[0031] At least one of the first protrusion and the second protrusions P1 and P2 may be a region overlapping in the vertical direction with the first resin portion and the second resin portions 421 and 423, and may be disposed of the materials of the first resin portion and the second resin portions 421 and 423. As shown in FIG. 6, the region where the first protrusion and the second protrusions P1 and P2 overlap in the vertical direction with the first resin portion and the second resin portions 421 and 423 can be made of the materials of the first resin portion and the second resin portions 421 and 423. Referring to FIGS. 1 and 2, the thickness Z1 of the resin layer 420 can be 1.5 mm or more, for example, in the range of 1.5 to 2.5 mm. When the thickness Z1 of the resin layer 420 is within the above range, the first protrusion and the second protrusions P1 and P2 can protrude lower than the upper surface of the reflecting member 410. The first protrusion and the second protrusions P1 and P2 can protrude in the direction of the lower surface of the substrate 401. The first protrusion and the second protrusions P1 and P2 prevent the problem that the edge region of the reflecting member 410 floats up, and may be disposed in the bezel region of the housing to which the lighting device is coupled. As shown in FIGS. 3 and 7, the first protrusion and the second protrusions P1 and P2 disposed in the first and second open regions H1 and H2 in the region of the first resin portion 421 can be made of the material of the first resin portion 421. The first protrusion and the second protrusions P1 and P2 disposed in the first open region and the second open regions H1 and H2 in the region of the second resin portion 423 can be made of the material of the second resin portion 423. At least one of the first protrusion and the second protrusions P1 and P2 may be a region overlapping in the vertical direction with the first resin portion and the second resin portions 421 and 423, and may be disposed of the materials of the first resin portion and the second resin portions 421 and 423.

[0032] Referring to FIGS. 1 and 2, the thickness Z1 of the resin layer 420 can be 1.5 mm or more, for example, in the range of 1.5 to 2.5 mm. When the thickness Z1 of the resin layer 420 is within the above range, If it is thicker than the enclosure, the luminous intensity decreases, and it becomes difficult to provide a flexible device due to the increase in the thickness of the device. When the thickness Z1 of the resin layer 420 is smaller than the above range, it becomes difficult to provide a surface light source with uniform luminous intensity. When the thickness Z1 of the resin layer 420 is smaller than the above range, it becomes difficult to provide a surface light source with uniform luminous intensity.

[0033] The length of the resin layer 420 in the first direction may be the same as the length of the substrate 401 in the first direction, and the width of the resin layer 420 in the second direction may be the same as the width Y1 (see FIG. 4) of the substrate 401 in the second direction. Thereby, each side surface of the resin layer 420 is arranged on the same plane as each side surface of the substrate 401. For example, the third outer side surface and the fourth outer side surfaces S3 and S4 of the substrate 401 may be arranged on the same vertical plane as both side surfaces of the resin layer 420. The first resin portion 421 is provided in a size that covers each of the plurality of light emitting elements 101 and 103, and may be mutually separated or connected. The length of the resin layer 420 in the first direction may be the same as the length of the substrate 401 in the first direction, and the width of the resin layer 420 in the second direction may be the same as the width Y1 (see FIG. 4) of the substrate 401 in the second direction. Thereby, each side surface of the resin layer 420 is arranged on the same plane as each side surface of the substrate 401. For example, the third outer side surface and the fourth outer side surfaces S3 and S4 of the substrate 401 may be arranged on the same vertical plane as both side surfaces of the resin layer 420. The first resin portion 421 is provided in a size that covers each of the plurality of light emitting elements 101 and 103, and may be mutually separated or connected. The first resin portion 421 is provided in a size that covers each of the plurality of light emitting elements 101 and 103, and may be mutually separated or connected.

[0034] As shown in FIG. 2, the maximum thickness Z4 of the first resin portion 421 may be the same as or greater or smaller than the thickness of the second resin portion 423. This is because although the first resin portion and the second resin portions 421 and 423 are formed in different processes, the second resin portion 423 may be formed after the first resin portion 421 is formed, or conversely, the first resin portion 421 may be formed after the second resin portion 423 is formed. Thereby, when the maximum thickness Z4 of the first resin portion 421 is the same as the thickness of the second resin portion 423, the processes of the first resin portion and the second resin portions 421 and 423 are convenient. The minimum thickness Z0 of the first resin portion 421 may be greater than the thickness of the light emitting elements 101 and 103, and may be smaller than the thickness of the second resin portion 423. The thickness of the second resin portion 423 As shown in FIG. 2, the maximum thickness Z4 of the first resin portion 421 may be the same as or greater or smaller than the thickness of the second resin portion 423. This is because although the first resin portion and the second resin portions 421 and 423 are formed in different processes, the second resin portion 423 may be formed after the first resin portion 421 is formed, or conversely, the first resin portion 421 may be formed after the second resin portion 423 is formed. Thereby, when the maximum thickness Z4 of the first resin portion 421 is the same as the thickness of the second resin portion 423, the processes of the first resin portion and the second resin portions 421 and 423 are convenient. The minimum thickness Z0 of the first resin portion 421 may be greater than the thickness of the light emitting elements 101 and 103, and may be smaller than the thickness of the second resin portion 423. The minimum thickness Z0 of the first resin portion 421 may be greater than the thickness of the light emitting elements 101 and 103, and may be smaller than the thickness of the second resin portion 423. The minimum thickness Z0 of the first resin portion 421 may be greater than the thickness of the light emitting elements 101 and 103, and may be smaller than the thickness of the second resin portion 423. The minimum thickness Z0 of the first resin portion 421 may be greater than the thickness of the light emitting elements 101 and 103, and may be smaller than the thickness of the second resin portion 423. The thickness of the second resin portion 423 ​​The adhesion force above may be higher than the adhesion force on the upper surface of the first resin portion 421. The first resin portion 421's upper surface RS1 can include a light-shielding structure. The light-shielding structure can include at least one of an inclined surface, a concave curved surface, and a protruding curved surface. The light-shielding structure can include one or more concave portions and one or more convex portions, and may be arranged adjacent to each other in this way. The light-shielding structure is arranged on the region between the light-emitting elements 101, 103 and the second resin portion 423, and can reflect or refract the light emitted from the light-emitting elements 101, 103. Such a light-shielding structure can suppress hot spots caused by the light emitted from the light-emitting elements 101, 103. Since the light-shielding structure is such that the light-emitting elements 101, 103 emit light in the side direction, i.e., the first direction, it covers a region where the light shielding efficiency can be enhanced by the light emission angle distribution and light reflection characteristics of the light-emitting elements 101, 103. Referring to FIGS. 1 to 4, the light-shielding portion 425 can face the upper surface of the substrate 401. The light-shielding portion 425 can overlap with the light-emitting elements 101, 103 in the vertical direction. Each of the plurality of light-shielding portions 425 can overlap with each of the plurality of light-emitting elements 101, 103

[0035] in the vertical direction. As shown in FIGS. 1 and 3, the interval B1 between the light-shielding portions 425 may be smaller than the interval X1 between the light-emitting elements 101, 103. The light-shielding portion 425 may be separated from the first outer surface and the third outer surface S3, S4 of the resin layer 420. A plurality of light-shielding portions 42 5 may be arranged in the first direction. The plurality of light-shielding portions 42 5 can include the same shape. The light-shielding portion 425 is on top of the first light-emitting element 101 and the first portion 425 may be separated from the first outer surface and the third outer surface S3, S4 of the resin layer 420. A plurality of light-shielding portions 42 5 may be arranged in the first direction. The plurality of light-shielding portions 42 5 can include the same shape. The light-shielding portion 425 is on top of the first light-emitting element 101 and the first 1 The light-shielding portion is divided into a first light-shielding portion and a second light-shielding portion on the second light-emitting element 103. The first light-shielding portion and the second light-shielding portion may be disposed above the respective emission directions of the first light-emitting element and the second light-emitting elements 101 and 103. Referring to FIGS. 2 to 4, the light-shielding portion 425 may be disposed higher than the upper surface of the resin layer 420 or the upper surface of the second resin portion 423. The light-shielding portion 4 25 may have an area of 5 0% or more or in the range of 50% to 200% of the upper surface area of the light-emitting elements 101 and 103 on the light-emitting elements 101 and 103. The light-shielding portion 425 may be a region printed with a white material. The light-shielding portion 425 may be printed using a reflective ink containing, for example, any one of TiO2, Al2 O3, CaCO3, BaSO4, and Silicon. The light-shielding portion 425 reflects the light emitted through the emission surfaces of the light-emitting elements 101 and 103, and reduces the generation of hot spots on the light-emitting elements 101 and 103. The light-shielding portion 425 can be printed using a light-shielding ink to form a light-shielding pattern. The light-shielding portion 425 may be formed by printing on the lower surface of the first diffusion layer 430. Since the light-shielding portion 425 does not block 100% of the incident light and the transmittance is lower than the reflectance, it can function to shield and diffuse light. The light-shielding portion 425 can be formed in a single layer or multiple layers, and may have the same pattern shape or different pattern shapes. The thickness of the light-shielding portion 425 may be formed with the same thickness. The thickness of the light-shielding portion 425 may be formed with a thickness that gradually decreases in the emission direction with respect to the light-emitting elements 101 and 103. The thickness of the light-shielding portion 425 may become thinner in proportion to the incident light intensity. The size of the light-shielding portion 425 is 5 of the upper surface area of the light-emitting elements 101 and 103. The light-shielding portion 425 has a transmittance lower than the reflectance without completely blocking the incident light, so it can function to shield and diffuse light. The light-shielding portion 425 can be formed in a single layer or multiple layers, and may have the same pattern shape or different pattern shapes. The thickness of the light-shielding portion 425 may be formed with the same thickness. The thickness of the light-shielding portion 425 may be formed with a thickness that gradually decreases in the emission direction with respect to the light-emitting elements 101 and 103. The thickness of the light-shielding portion 425 may become thinner in proportion to the incident light intensity. The thickness of the light-shielding portion 425 may be formed with a thickness that gradually decreases in the emission direction with respect to the light-emitting elements 101 and 103. The thickness of the light-shielding portion 425 may become thinner in proportion to the incident light intensity. 0% or more or in the range of 50% to 200% of the upper surface area of the light-emitting elements 101 and 103. The size of the light-shielding portion 425 is 5 of the upper surface area of the light-emitting elements 101 and 103. It is arranged in the range of 0% or more, for example, 50% to 200%, and can block the incident light. This reduces the problem that the light-emitting elements 101 and 103 can be seen from the outside, and can reduce the hot spots in the regions of the light-emitting elements 101 , 103, and can provide a uniform light distribution over the entire region. As another example, the light-shielding portion 425 is an air region of a recess etched by an etching process on the lower surface of the first diffusion layer 430, or can include a light-shielding film in which the light-shielding substance is arranged in the recess region. The etching region can cover the light-emitting elements 101 and 103 in the range of 50% to 200% of the upper surface area, like the region of the light-shielding portion described above. The light-shielding portion 425 can be arranged in a hemispherical shape, an elliptical shape, or a circular shape with reference to the light-emitting elements 101 and 103. Referring to FIGS. 2 and 4, the width in the second direction of the region adjacent to the light-emitting elements 101 and 103 by the light-shielding portion 425 is small, and gradually increases toward the center of the light-shielding portion 425. At the center, the width in the second direction (for example, C3) is maximally large. The width in the second direction gradually decreases in the direction away from the light-emitting elements 101 and 103 at the center of the light-shielding portion 425. The maximum width C3 in the second direction is the largest at the center of the light-shielding portion 425, and the width in the second direction gradually decreases in the first direction at the center of the light-shielding portion 425. The region where the light-shielding portion 425 overlaps the light-emitting elements 101 and 103 in the vertical direction has a flat inner surface, and the width in the second direction may be larger than the length D1 in the second direction of the light-emitting elements 101 and 103.

[0036] Referring to FIGS. 2 and 4, the width in the second direction of the region adjacent to the light-emitting elements 101 and 103 by the light-shielding portion 425 is small, and gradually increases toward the center of the light-shielding portion 425. At the center, the width in the second direction (for example, C3) is maximally large. The width in the second direction gradually decreases in the direction away from the light-emitting elements 101 and 103 at the center of the light-shielding portion 425. The maximum width C3 in the second direction is the largest at the center of the light-shielding portion 425, and the width in the second direction gradually decreases in the first direction at the center of the light-shielding portion 425. The region where the light-shielding portion 425 overlaps the light-emitting elements 101 and 103 in the vertical direction has a flat inner surface, and the width in the second direction may be larger than the length D1 in the second direction of the light-emitting elements 101 and 103. The maximum width C3 in the second direction is the largest at the center of the light-shielding portion 425, and the width in the second direction gradually decreases in the first direction at the center of the light-shielding portion 425. The width in the second direction gradually decreases in the first direction at the center of the light-shielding portion 425. The region where the light-shielding portion 425 overlaps the light-emitting elements 101, 103 in the vertical direction has a flat inner surface, and the width in the second direction may be larger than the length D1 in the second direction of the light-emitting elements 101, 103. The width in the second direction of the light-shielding portion 425 The minimum width in the direction is the same as the length D1 of the light-emitting elements 101 and 103, or is arranged to be 0.8 mm or more larger than the length D1 of the light-emitting elements 1 01 and 103, and can cover both sides of the light-emitting elements 101 and 10 3, and can prevent hot spots caused by the light emitted from the light-emitting elements 101 and 103.

[0037] As shown in FIG. 4, the light-shielding portion 425 overlaps the light-emitting elements 101 and 103 in a direction perpendicular thereto and includes a first region g1, a second region g2 extending in a first direction in the first region g1, and a third region g 3 extending from the first and second regions g1 and g2 in the direction of the third outer surface S3 of the substrate 401, and a fourth region g 4 extending from the first region and the second region g1 and g2 in the direction of the fourth outer surface S4 of the substrate 401. The third region and the fourth region g3 and g4 may extend from the first region and the second region g1 and g2 in the directions of the third outer surface S3 and the fourth outer surface S4 of the substrate 401. The second region g2 to the fourth region g4 are arranged in the upper peripheral region of the light-emitting elements 101 and 103 and do not have to overlap the light-emitting elements 101 and 103 in a direction perpendicular thereto. The area of the first region g1 may be 50% or more of the upper surface area of the light-emitting elements 101 and 103. The light-shielding area in the second region g2 is the largest and may be larger than the light-shielding areas of the third region and the fourth region g3 and g4. The first to fourth regions g1, g2, g3, and g4 can block light through the upper part of the light-emitting elements 101 and 103 and the upper part of the emission region, thereby suppressing the generation of hot spots. The outer edge of the second region g2 may include a protruding curved surface. The outer edge of the second region g2 may be formed as a curved surface protruding from the central portion of the first light-shielding portion in the direction of the second light-shielding portion. The second ​​ The distance between the outer edge of the second region g2 and the first region g1 is the farthest at the center side and gradually decreases towards the side. The outer edges of the third and fourth regions g3 and g4 can include the protruding curved surface. The outer edges of the third and fourth regions g3 and g4 can include the curved surface protruding from the center of the light-shielding portion 425 in the directions of the third and fourth outer surfaces S3 and S4 of the substrate 401. The outer edge of the third region g3 protrudes the most at the center side and is connected to the outer edge of the first region g1 by the protruding curved surface and to the outer edge of the second region g2 by the protruding curved surface. The outer edge of the fourth region g4 protrudes the most at the center side and is connected to the outer edge of the first region g1 by the protruding curved surface and to the outer edge of the second region g2 by the protruding curved surface. The distance between the outer edge of the third region g3 and the outer edge of the fourth region g4 is the largest between the center sides passing through the center of the light-shielding portion 425, and the distance gradually decreases towards the side.

[0038] The third region g3 of the light-shielding portion 425 can overlap with any one of the first open regions H1 in the vertical direction. The fourth region g4 of the light-shielding portion 425 can overlap with any one of the second open regions H2 in the vertical direction. The third region g3 of the light-shielding portion 425 can overlap with any one of the first protrusions P1 in the vertical direction. The fourth region g4 of the light-shielding portion 425 can overlap with any one of the second protrusions P2 in the vertical direction. Among the first protrusion and the second protrusions P1 and P2, the protrusions that overlap with the light-shielding portion 425 in the vertical direction can be adjacent to both sides of the light-emitting surfaces 81 of the light-emitting elements 101 and 103. The maximum length B3 of the light-shielding portion 425 in the first direction is in the second direction ​​It may be the same as or smaller than the maximum width C3. The maximum width C3 may be 13 mm or more, for example It can have a range of 13 mm to 17 mm. The maximum width in the second direction of the light-shielding portion 425 C3 can be variable according to the length of the light-emitting elements 101 and 103 in the second direction. The maximum width in the second direction of the light-shielding portion 42 5, i.e., C3, may be arranged in a range of 50% or more of the length Y1 of the substrate 401 in the second direction, for example It may be arranged in a range of 50% to 90%. The maximum length B in the first direction of the light-shielding portion 425 3 is 0.3 times or more of the interval (X1 in FIG. 2) between the light-emitting elements 101 and 103, for example 0.3 times to 0.52 times. The maximum length B in the first direction of the light-shielding portion 425 3 may be arranged in a range of 6 times to 10 times or more of the width of the light-emitting elements 101 and 103 in the first direction. Here, the interval X1 between the light-emitting elements 101 and 103 is 25 mm or more and may be in a range of 25 mm to 30 mm, for example, and can be variable according to the characteristics of the light-emitting elements 101 and 103. By providing the maximum length B3 in the first direction and the maximum width C3 in the second direction passing through the center of the light-shielding portion 425 within the above ranges, the hot spots on the light-emitting elements 101 and 103 can be reduced, and the light uniformity can be improved. The center of the light-shielding portion 425 may be arranged in a range of 4.5 mm or more, for example 4.5 mm to 6.5 mm, above the first region g1 overlapping with the light-emitting elements 101 and 103. The thickness of the light-shielding portion 425 is 0.1 times or less of the thickness Z1 of the resin layer 420, for example in a range of 0.05 times to 0.1 times. The thickness of the light-shielding portion 425 may be 100 μm or more, for example in a range of 100 to 200 μm. When the thickness of the light-shielding portion 425 is smaller than the above range, there is a limit to reducing the hot spots. When it is larger than the above range, ... ... ... ... ... ... The light uniformity decreases. The distance between the upper surfaces of the light-emitting elements 101 and 103 and the lower surface of the light-shielding portion 425 can be 0.4 mm or more, for example, in the range of 0.4 mm to 0.6 mm. The distance Z0 between the upper surfaces of the light-emitting elements 101 and 103 and the upper surface of the reflection member 410 can be 0. 8 mm or more, for example, in the range of 0.8 mm to 1.4 mm. The region of the light-shielding portion 42 5 does not have to overlap the region of the first adhesive layer 435 in the vertical direction.

[0039] On the other hand, the air region 450 may be disposed between the resin layer 420 and the first diffusion layer 430. The air region 450 may be disposed between the first resin portion 421 and the first diffusion layer 430. The air region 450 may be disposed between the first resin portion 421 and the light-shielding portion 42 5. The air region 450 and the light-shielding portion 425 may be disposed between the resin layer 4 20 and the first diffusion layer 430. The air region 450 and the light-shielding portion 425 can overlap the first resin portion 421 in the vertical direction. The air region 4 50 may be disposed horizontally between the second resin portions 423. The lower surface of the air region 450 may be provided with the same area as the upper surface area of the first resin portion 421. The upper surface of the air region 450 may be the same as or larger than the lower surface area of the light-shielding portion 425, and may be the same as or smaller than the upper surface area of the first resin portion 421. The upper surface area of the air region 450 is equal to or larger than the lower surface area of the light-shielding portion 425 and may be equal to or smaller than the upper surface area of the first resin portion 421. The depth of the air region 450 is maximum in the region perpendicular to the light-emitting elements 101 and 103 with reference to the lower surface of the first diffusion layer 430, and the first resin portion 42 1. is maximum in the region perpendicular to the light-emitting elements 101 and 103 with reference to the lower surface of the first diffusion layer 430, and the first resin portion 42 It can have the minimum depth at the uppermost end PS2 of 1. The depth of the air region 450 is the smallest at the uppermost end PS2 of the first resin part 421 with reference to the lower surface of the light-shielding part 425, and can be the largest at the upper end of the rear surface of the light-emitting elements 101 and 103. The depth of the air region 450 becomes deeper as it is adjacent to the light-emitting elements 101 and 103, and becomes larger as it is farther from the emission surfaces of the light-emitting elements 101 and 103. Here, in the structure of the first resin part 421 as shown in FIG. 5, the air region 450 is arranged in the same region as the light-shielding part 425, and the outer side of the air region 450 is filled with the substances of the first resin part and the second resin parts 421 and 423. The upper surface of the resin layer 420 can include an adhesion region where the first adhesive layer 435 is arranged and a non-adhesion region where the first adhesive layer 435 is not present. The non-adhesion region may be the region of the light-shielding part 425. The adhesion region and the non-adhesion region may be arranged alternately. Referring to FIGS. 1 to 4, the first diffusion layer 430 may be arranged on the resin layer 420. The first diffusion layer 430 can include an adhesion region adhered to the upper surface of the resin layer 420 and a non-adhesion region on the light-shielding part 425. The first diffusion layer 430 may be adhered by the resin layer 420 and the first adhesive layer 435. The first adhesive layer 435 may be arranged and adhered between the first diffusion layer 430 and the second resin part 423. The first adhesive layer 435 can overlap with the second resin part 423 in the vertical direction. The first adhesive layer 435 may not overlap with the first resin part 421 in the vertical direction. The first adhesive layer 435 can include at least one of a UV adhesive, an acrylic adhesive, and a transparent adhesive.

[0040]

[0041] ​​​​​​​​​​​​​​​​ It is. The upper surface of the first resin portion 421 may be arranged to be separated from or lower than the upper surface of the second resin portion 4 23 with reference to the first diffusion layer 430. Thereby, in the region between the first resin portion 421 and the first diffusion layer 430, at least one or both of the air region 450 and the light-shielding portion 425 are arranged. Thereby, the light-shielding efficiency can be improved. As another example, the first diffusion layer 430 is adhered onto the second resin portion 423 by applying a predetermined pressure or pressure / heat. That is, the first diffusion layer 430 may be adhered to the second resin portion 423 by its own adhesive force without a separate adhesive. Thereby, the process of separately adhering an adhesive can be reduced, and it is not necessary to use an adhesive harmful to the human body, so that waste of processes and materials can be reduced. The first diffusion layer 430 is adhered to the entire upper surface of the second resin portion 423, and the non-adhesive region is where the light-shielding portion 425 is arranged or where the light-shielding portion 4 25 is formed. The first diffusion layer 430 diffuses the light emitted through the resin layer 420. The first diffusion layer 430 diffuses the light emitted through the resin layer 420. The first diffusion layer 430 diffuses the light emitted through the resin layer 420. diffuses the light.

[0042] In addition, when the light intensity of the light is high, the first diffusion layer 430 may not be able to mix specific colors either, so the light can be diffused and mixed. The material of the first diffusion layer 430 may be a light-transmitting material. The first diffusion layer 430 may include at least one of polyester (PET) film, PMMA (Poly Methyl Methacrylate) material, and PC (Poly Carbonate). The first diffusion layer 430 may be provided as a film of a resin material such as silicone or epoxy. The first diffusion layer 430 may be single-layer or multi-layer. The material of the first diffusion layer 430 may be a light-transmitting material. The first diffusion layer 430 may include at least one of polyester (PET) film, PMMA (Poly Methyl Methacrylate) material, and PC (Poly Carbonate). The first diffusion layer 430 may be provided as a film of a resin material such as silicone or epoxy. The first diffusion layer 430 may be single-layer or multi-layer. The material of the first diffusion layer 430 may be a light-transmitting material. The first diffusion layer 430 may include at least one of polyester (PET) film, PMMA (Poly Methyl Methacrylate) material, and PC (Poly Carbonate). The first diffusion layer 430 may be provided as a film of a resin material such as silicone or epoxy. The first diffusion layer 430 may be single-layer or multi-layer. The material of the first diffusion layer 430 may be a light-transmitting material. The first diffusion layer 430 may include at least one of polyester (PET) film, PMMA (Poly Methyl Methacrylate) material, and PC (Poly Carbonate). The first diffusion layer 430 may be provided as a film of a resin material such as silicone or epoxy. The first diffusion layer 430 may be single-layer or multi-layer. The material of the first diffusion layer 430 may be a light-transmitting material. The first diffusion layer 430 may include at least one of polyester (PET) film, PMMA (Poly Methyl Methacrylate) material, and PC (Poly Carbonate). The first diffusion layer 430 may be provided as a film of a resin material such as silicone or epoxy. The first diffusion layer 430 may be single-layer or multi-layer. It can include. The thickness of the first diffusion layer 430 is 25 μm or more, for example, it can have a range of 25 to 250 μm or a range of 100 to 250 μm. Such a first diffusion layer 430 has the above thickness range and can provide the incident light as a uniform surface light source. The first diffusion layer 430 can include at least one or two or more of a diffusing agent such as beads, a phosphor, and ink particles. The phosphor can include, for example, at least one of a red phosphor, an amber phosphor, a yellow phosphor, a green phosphor, or a white phosphor. The ink particles can include at least one of metal ink, UV ink, or curable ink. The size of the ink particles may be smaller than the size of the phosphor. The surface color of the ink particles may be any one of green, red, yellow, or blue. The type of the ink can be selectively applied from PVC (Polyvinyl chloride) ink, PC (Polycarbonate) ink, ABS (acrylonitrile butadiene styrene copolymer) ink, UV resin ink, epoxy ink, silicone ink, PP (polypropylene) ink, aqueous ink, plastic ink, PMMA (poly methyl methacrylate) ink, PS (Polystyrene) ink. The ink particles can include at least one of metal ink, UV ink, or curable ink. As shown in FIGS. 3, 5, and 6, the light shielding portion 425 can overlap with the region of the first resin portion 421 in a direction perpendicular thereto. As shown in FIGS. 3 and 5, the upper surface of the first resin portion 421 (Polystyrene) ink. The ink particles can include at least one of metal ink, UV ink, or curable ink.

[0043] As shown in FIGS. 3, 5, and 6, the light shielding portion 425 can overlap with the region of the first resin portion 421 in a direction perpendicular thereto. As shown in FIGS. 3 and 5, the upper surface of the first resin portion 421 in FIGS. 3 and 5 The area may be larger than the upper surface area of the light-shielding portion 425. As shown in FIG. 6, the upper surface area of the first resin portion 421 may be the same as the upper surface area of the light-shielding portion 425. As shown in FIG. 9 wherein when a plurality of light-emitting elements 101, 101A, 10 3, 103A are arranged in the first and second directions or row and column directions, the light-shielding portion 425 is provided in a size that covers the plurality of light-emitting elements 101, 101A, 103, 103A arranged in the column direction or the second direction, or may be provided in a size that covers each of the light-emitting elements 101, 101A, 103, 103A. Here the first resin portion 421 extended in the second direction is arranged singly or plurally, and one resin portion 421 may be respectively arranged on the plurality of first light-emitting elements 101, 101A, 103, 103 A separated in the second direction. The plurality of first resin portions 421 arranged in the first direction can be separated from each other. The plurality of first resin portions 421 arranged in the first direction may be respectively arranged between the second resin portions 423. The second resin portion 423 may be arranged around the plurality of first resin portions 421. The first open region and the second open region H1, H2 of the reflecting member 410 may be arranged along the third outer surface and the fourth outer surface as S3, S4. The protruding portions P1, P2 of the resin layer 42 0 are coupled to the first open region and the second open region H1, H2. The first open region and the second open region H1, H2 of the reflecting member 410 may be arranged along the third outer surface and the fourth outer surface as S3, S4. The protruding portions P1, P2 of the resin layer 420 are coupled to the first open region and the second open region H1, H2. The first open region and the second open region H1, H2 of the reflecting member 410 may be arranged along the third outer surface and the fourth outer surface as S3, S4. The protruding portions P1, P2 of the resin layer 420 are coupled to the first open region and the second open region H1, H2. The first open region and the second open region H1, H2 of the reflecting member 410 may be arranged along the third outer surface and the fourth outer surface as S3, S4. The protruding portions P1, P2 of the resin layer 420 are coupled to the first open region and the second open region H1, H2. The first open region and the second open region H1, H2 of the reflecting member 410 may be arranged along the third outer surface and the fourth outer surface as S3, S4. The protruding portions P1, P2 of the resin layer 420 are coupled to the first open region and the second open region H1, H2.

[0044] FIGS. 10 to 16 are modification examples of the lighting device according to the first embodiment of the present disclosure.

[0045] Referring to FIG. 10, the first resin portion 421 of the resin layer 420 may include a first sub-region A1 extended in the rear direction of the light-emitting elements 101, 10 3. The first resin portion 421 The first sub-region A1 is disposed at a predetermined distance from the rear surfaces of the light-emitting elements 101 and 103, The second side surface RS3 is separated from the light-emitting elements 101 and 103 and can protect the light-emitting elements 101 and 10 3. The upper surface of the first sub-region A1 may be arranged to be flat or inclined. The upper end PS3 of the first sub-region A1 may be arranged at the same height as the lowermost end PS1. The first sub-region A1 can overlap with the reflecting member 410 in the vertical direction. Since the air region 450 and the light-shielding portion 425 are arranged on the first resin portion 421 having such a first sub-region A1, the light-shielding efficiency on the light-emitting elements 101 and 103 is improved. The upper end PS3 of the first sub-region A1 may be arranged at the same height as the lowermost end PS1. The first sub-region A1 can overlap with the reflecting member 410 in the vertical direction. Since the air region 450 and the light-shielding portion 425 are arranged on the first resin portion 421 having such a first sub-region A1, the light-shielding efficiency on the light-emitting elements 101 and 103 is improved. The upper end PS3 of the first sub-region A1 may be arranged at the same height as the lowermost end PS1. The first sub-region A1 can overlap with the reflecting member 410 in the vertical direction. Since the air region 450 and the light-shielding portion 425 are arranged on the first resin portion 421 having such a first sub-region A1, the light-shielding efficiency on the light-emitting elements 101 and 103 is improved. Referring to FIG. 11, the first extension region 11 may extend on the first sub-region A1. The first extension region 11 extends in the upper surface direction of the first resin portion 421 by the second resin portion 423 and can contact the upper surface of the first sub-region A1. The inner surface of the first extension region 11 may be an inclined side surface or a vertical side surface. The first extension region 11 can reduce the reduction of the adhesion area of the first adhesive layer 435 disposed on the second resin portion 423. That is, the first extension region 11 and the first adhesive layer 435 can overlap with the first sub-region A1, which is a partial region of the first resin portion 421, in the vertical direction. Thereby, it is possible to minimize the reduction of the adhesion area of the first adhesive layer 435 compared to the first embodiment. Referring to FIG. 11, the first extension region 11 may extend on the first sub-region A1. The first extension region 11 extends in the upper surface direction of the first resin portion 421 by the second resin portion 423 and can contact the upper surface of the first sub-region A1. The inner surface of the first extension region 11 may be an inclined side surface or a vertical side surface. The first extension region 11 can reduce the reduction of the adhesion area of the first adhesive layer 435 disposed on the second resin portion 423. That is, the first extension region 11 and the first adhesive layer 435 can overlap with the first sub-region A1, which is a partial region of the first resin portion 421, in the vertical direction. Thereby, it is possible to minimize the reduction of the adhesion area of the first adhesive layer 435 compared to the first embodiment. Referring to FIG. 11, the first extension region 11 may extend on the first sub-region A1. The first extension region 11 extends in the upper surface direction of the first resin portion 421 by the second resin portion 423 and can contact the upper surface of the first sub-region A1. The inner surface of the first extension region 11 may be an inclined side surface or a vertical side surface. The first extension region 11 can reduce the reduction of the adhesion area of the first adhesive layer 435 disposed on the second resin portion 423. That is, the first extension region 11 and the first adhesive layer 435 can overlap with the first sub-region A1, which is a partial region of the first resin portion 421, in the vertical direction. Thereby, it is possible to minimize the reduction of the adhesion area of the first adhesive layer 435 compared to the first embodiment.

[0046] Referring to FIG. 11, the first extension region 11 may extend on the first sub-region A1. The first extension region 11 extends in the upper surface direction of the first resin portion 421 by the second resin portion 423 and can contact the upper surface of the first sub-region A1. The inner surface of the first extension region 11 may be an inclined side surface or a vertical side surface. The first extension region 11 can reduce the reduction of the adhesion area of the first adhesive layer 435 disposed on the second resin portion 423. That is, the first extension region 11 and the first adhesive layer 435 can overlap with the first sub-region A1, which is a partial region of the first resin portion 421, in the vertical direction. Thereby, it is possible to minimize the reduction of the adhesion area of the first adhesive layer 435 compared to the first embodiment. Referring to FIG. 11, the first extension region 11 may extend on the first sub-region A1. The first extension region 11 extends in the upper surface direction of the first resin portion 421 by the second resin portion 423 and can contact the upper surface of the first sub-region A1. The inner surface of the first extension region 11 may be an inclined side surface or a vertical side surface. The first extension region 11 can reduce the reduction of the adhesion area of the first adhesive layer 435 disposed on the second resin portion 423. That is, the first extension region 11 and the first adhesive layer 435 can overlap with the first sub-region A1, which is a partial region of the first resin portion 421, in the vertical direction. Thereby, it is possible to minimize the reduction of the adhesion area of the first adhesive layer 435 compared to the first embodiment. Referring to FIG. 11, the first extension region 11 may extend on the first sub-region A1. The first extension region 11 extends in the upper surface direction of the first resin portion 421 by the second resin portion 423 and can contact the upper surface of the first sub-region A1. The inner surface of the first extension region 11 may be an inclined side surface or a vertical side surface. The first extension region 11 can reduce the reduction of the adhesion area of the first adhesive layer 435 disposed on the second resin portion 423. That is, the first extension region 11 and the first adhesive layer 435 can overlap with the first sub-region A1, which is a partial region of the first resin portion 421, in the vertical direction. Thereby, it is possible to minimize the reduction of the adhesion area of the first adhesive layer 435 compared to the first embodiment. Referring to FIG. 11, the first extension region 11 may extend on the first sub-region A1. The first extension region 11 extends in the upper surface direction of the first resin portion 421 by the second resin portion 423 and can contact the upper surface of the first sub-region A1. The inner surface of the first extension region 11 may be an inclined side surface or a vertical side surface. The first extension region 11 can reduce the reduction of the adhesion area of the first adhesive layer 435 disposed on the second resin portion 423. That is, the first extension region 11 and the first adhesive layer 435 can overlap with the first sub-region A1, which is a partial region of the first resin portion 421, in the vertical direction. Thereby, it is possible to minimize the reduction of the adhesion area of the first adhesive layer 435 compared to the first embodiment. Referring to FIG. 11, the first extension region 11 may extend on the first sub-region A1. The first extension region 11 extends in the upper surface direction of the first resin portion 421 by the second resin portion 423 and can contact the upper surface of the first sub-region A1. The inner surface of the first extension region 11 may be an inclined side surface or a vertical side surface. The first extension region 11 can reduce the reduction of the adhesion area of the first adhesive layer 435 disposed on the second resin portion 423. That is, the first extension region 11 and the first adhesive layer 435 can overlap with the first sub-region A1, which is a partial region of the first resin portion 421, in the vertical direction. Thereby, it is possible to minimize the reduction of the adhesion area of the first adhesive layer 435 compared to the first embodiment. Referring to FIG. 11, the first extension region 11 may extend on the first sub-region A1. The first extension region 11 extends in the upper surface direction of the first resin portion 421 by the second resin portion 423 and can contact the upper surface of the first sub-region A1. The inner surface of the first extension region 11 may be an inclined side surface or a vertical side surface. The first extension region 11 can reduce the reduction of the adhesion area of the first adhesive layer 435 disposed on the second resin portion 423. That is, the first extension region 11 and the first adhesive layer 435 can overlap with the first sub-region A1, which is a partial region of the first resin portion 421, in the vertical direction. Thereby, it is possible to minimize the reduction of the adhesion area of the first adhesive layer 435 compared to the first embodiment. Referring to FIG. 11, the first extension region 11 may extend on the first sub-region A1. The first extension region 11 extends in the upper surface direction of the first resin portion 421 by the second resin portion 423 and can contact the upper surface of the first sub-region A1. The inner surface of the first extension region 11 may be an inclined side surface or a vertical side surface. The first extension region 11 can reduce the reduction of the adhesion area of the first adhesive layer 435 disposed on the second resin portion 423. That is, the first extension region 11 and the first adhesive layer 435 can overlap with the first sub-region A1, which is a partial region of the first resin portion 421, in the vertical direction. Thereby, it is possible to minimize the reduction of the adhesion area of the first adhesive layer 435 compared to the first embodiment. Referring to FIG. 11, the first extension region 11 may extend on the first sub-region A1. The first extension region 11 extends in the upper surface direction of the first resin portion 421 by the second resin portion 423 and can contact the upper surface of the first sub-region A1. The inner surface of the first extension region 11 may be an inclined side surface or a vertical side surface. The first extension region 11 can reduce the reduction of the adhesion area of the first adhesive layer 435 disposed on the second resin portion 423. That is, the first extension region 11 and the first adhesive layer 435 can overlap with the first sub-region A1, which is a partial region of the first resin portion 421, in the vertical direction. Thereby, it is possible to minimize the reduction of the adhesion area of the first adhesive layer 435 compared to the first embodiment. Referring to FIG. 11, the first extension region 11 may extend on the first sub-region A1. The first extension region 11 extends in the upper surface direction of the first resin portion 421 by the second resin portion 423 and can contact the upper surface of the first sub-region A1. The inner surface of the first extension region 11 may be an inclined side surface or a vertical side surface. The first extension region 11 can reduce the reduction of the adhesion area of the first adhesive layer 435 disposed on the second resin portion 423. That is, the first extension region 11 and the first adhesive layer 435 can overlap with the first sub-region A1, which is a partial region of the first resin portion 421, in the vertical direction. Thereby, it is possible to minimize the reduction of the adhesion area of the first adhesive layer 435 compared to the first embodiment.

[0047] As shown in FIG. 12, the upper surface RS1 of the first resin portion 421 in the resin layer 420 can include a concave curved surface. The concave upper surface RS1 is in the upper surface direction of the substrate 401 in the air region 450 As shown in FIG. 12, the upper surface RS1 of the first resin portion 421 in the resin layer 420 can include a concave curved surface. The concave upper surface RS1 is in the upper surface direction of the substrate 401 in the air region 450 It can be recessed. The recessed upper surface may be provided as a continuous curved surface from the lowermost end PS1 to the uppermost end PS2, or may be provided as a discontinuous curved surface. The uppermost end PS2 of the recessed curved surface may be arranged at the same level as or higher than the upper surface of the second resin portion 423. The upper surface RS1 of the first resin portion 421 can reflect the light incident through the recessed curved surface in the direction of the second outer surface S2. At this time, the recessed curved surface may be a total reflection surface. As shown in FIG. 13, in the resin layer 420, the upper surface RS1 of the first resin portion 421 includes a flat region A3, and the flat region A3 can overlap with the light emitting elements 101 and 103 in the vertical direction. The flat region A3 has a predetermined thickness from the upper surfaces of the light emitting elements 101 and 103 and can protect the surfaces of the light emitting elements 101 and 103. The lowermost end PS1 of the upper surface RS1 of the first resin portion 421 is located in the flat region A3, and it may have a surface inclined from the flat region A3 and extend to the uppermost end PS2. The structure of the flat region A3 can protect the upper surfaces of the light emitting elements 101 and 103 and reflect the light passing through the emission surfaces of the light emitting elements 101 and 103. The inclined upper surface of the first resin portion 421 can include a concave shape, a convex shape, or an uneven structure. Referring to FIG. 14, the upper surface RS1 of the first resin portion 421 can include a protruding curved surface between the lowermost end PS1 and the uppermost end PS2. The protruding curved surface may be a continuous curved surface or a discontinuous curved surface.

[0048] The protruding curved surface is arranged to protrude in the direction of the light shielding portion 425, and the position of the lowermost end PS1 is in front of or behind the light emitting elements 101 and 103. The protruding curved surface may be provided as a continuous curved surface or a discontinuous curved surface from the lowermost end PS1 to the uppermost end PS2. The uppermost end PS2 of the recessed curved surface may be arranged at the same level as or higher than the upper surface of the second resin portion 423. The upper surface RS1 of the first resin portion 421 can reflect the light incident through the recessed curved surface in the direction of the second outer surface S2. At this time, the recessed curved surface may be a total reflection surface. The upper surface RS1 of the first resin portion 421 includes a flat region A3, and the flat region A3 can overlap with the light emitting elements 101 and 103 in the vertical direction. The flat region A3 has a predetermined thickness from the upper surfaces of the light emitting elements 101 and 103 and can protect the surfaces of the light emitting elements 101 and 103. The lowermost end PS1 of the upper surface RS1 of the first resin portion 421 is located in the flat region A3, and it may have a surface inclined from the flat region A3 and extend to the uppermost end PS2. The structure of the flat region A3 can protect the upper surfaces of the light emitting elements 101 and 103 and reflect the light passing through the emission surfaces of the light emitting elements 101 and 103. The inclined upper surface of the first resin portion 421 can include a concave shape, a convex shape, or an uneven structure. Referring to FIG. 14, the upper surface RS1 of the first resin portion 421 can include a protruding curved surface between the lowermost end PS1 and the uppermost end PS2.

[0049] The protruding curved surface may be a continuous curved surface or a discontinuous curved surface. The protruding curved surface is arranged to protrude in the direction of the light shielding portion 425, and the position of the lowermost end PS1 is in front of or behind the light emitting elements 101 and 103. The protruding curved surface may be provided as a continuous curved surface or a discontinuous curved surface from the lowermost end PS1 to the uppermost end PS2. The uppermost end PS2 of the recessed curved surface may be arranged at the same level as or higher than the upper surface of the second resin portion 423. It may be disposed thereon. The upper surface RS1 of the first resin portion 421 is above each light-emitting element 101, 10 3 may have a flat area A3 or may include an inclined overlapping area. The lowermost end PS1 of the protruding curved surface may be disposed in an area overlapping with the upper surfaces of the light-emitting elements 101, 103.

[0050] Referring to FIG. 15, the upper surface RS1 of the first resin portion 421 may include a plurality of concave portions and a plurality of convex portions. The upper surface of the first resin portion 421 may have the convex portions and the concave portions alternately arranged from the lowermost end PS1 toward the uppermost end PS2. The interval between the concave portions may be larger than the interval between the convex portions. The concave portion is a curved surface recessed in the direction of the substrate 401, and the convex portion may be a curved surface protruding in the direction of the light-shielding portion 425 or an inflection point between the concave portions. The plurality of concave portions and convex portions can reflect the incident light to suppress hot spots. Each of the concave portion and the convex portion may be provided in a shape or stripe shape that is long in the second direction.

[0051]

[0051] Referring to FIG. 16, the upper surface RS1 of the first resin portion 421 may include an inclined surface, a recessed surface, and / or a protruding surface. A second extension region 12 is disposed on the upper surface RS1 of the first resin portion 421. The second extension region 12 may extend in the direction of the second side surface or the uppermost end PS2 from the second resin portion 423. Since the second extension region 12 is disposed on the first resin portion 421, the area of the air region 450 decreases. The second extension region 12 may be disposed between the first resin portion 421 and the light-shielding portion 425. The second extension region 12 may be disposed between the air region 450 and the first resin portion 421. ​​​​​​The second extension region 12 of the second resin portion 423 extends over the light-emitting elements 101 and 103 wherein the first adhesive layer 435 has an area different from the upper surface of the first resin portion 421 or an increased adhesive area .

[0052] FIG. 17 is another example of the lighting device of FIG. 1. Referring to FIG. 17, the lighting device includes a substrate 4 01, a light source, a resin layer 420, a first adhesive layer 435A, an air region 450, a first diffusion layer 430 A, a second adhesive layer 435B, a light-shielding portion 425A, and a second diffusion layer 430B . The first diffusion layer 430A is adhered through the first adhesive layer 435A, and the first adhesive layer 4 35A may be adhered onto the second resin portion 423 of the resin layer 420. The first resin portion 421 may include the embodiments or modified examples disclosed above. The second adhesive layer 435B and the light-shielding portion 425A are disposed between the first diffusion layer 430A and the second diffusion layer 430B. The light-shielding portion 425A may overlap with the first resin portion 421 in the vertical direction. The light-shielding portion 425A may overlap with the first resin portion 421 and the air region 450 in the vertical direction . The second adhesive layer 435B may overlap with the first adhesive layer 435A and the second resin portion 423 in the vertical direction . Here, the first and second adhesive layers 435A and 435B may include at least one of a UV adhesive, an acrylic adhesive, or a transparent adhesive . The first diffusion layer 430A may be thinner than the second diffusion layer 430B. The first diffusion layer 430A may be 100 μm or less, and the second diffusion layer 430B may be 100 μ m or more. The materials of the first and second diffusion layers 430A and 430B may be the same , and for example, may include a PET material. As another example, the light-shielding portion 4 25A may be disposed on the lower surface of the first diffusion layer 430A. The light-shielding portion 425A may be disposed on the upper or lower surface of the first diffusion layer 430A and on the lower surface of the second diffusion layer 430B.

[0053] Figures 18a to 18d are drawings for explaining the manufacturing process of the lighting device of FIG. 1.

[0054] Referring to FIG. 18a, a reflection member 410 is adhered onto a substrate 401, and each light-emitting element 101, 103 of a light source is mounted in an opening of the reflection member 410. Here, the reflection member 410 may be formed after mounting the light-emitting elements 101, 103, but is not limited thereto. A first resin portion 421 is formed on each of the light-emitting elements 101, 103. The first resin portion 421 can cover the light-emitting surfaces, upper surfaces, and respective side surfaces of the light-emitting elements 101, 103. The first resin portion 421 may be disposed so as to be spaced apart from the light-emitting surfaces 81 of the light-emitting elements 101, 103 by a predetermined distance. The upper surface RS1 of the first resin portion 421 is a surface inclined from the region where each of the light-emitting elements 101, 103 is disposed to the uppermost end PS2, a concave or a protruding curved surface. The first resin portion 421 can be injection-molded in a structure in which the light-emitting elements 101, 103 are embedded therein. When the first resin portion 4 21 is formed, it can be cured by a thermosetting method. The region SA1 between the first resin portions 421 can be used as a region where a second resin portion 423 is formed, and the first resin portions 421 arranged in the first direction can be separated from each other. The material of the first resin portion 421 can include a silicone material, a thermosetting resin, or a resin material that does not induce outgas. portion 421 can be injection-molded in a structure in which the light-emitting elements 101, 103 are embedded therein. When the first resin portion 421 is formed, it can be cured by a thermosetting method. The region SA1 between the first resin portions 421 can be used as a region where a second resin portion 423 is formed, and the first resin portions 421 arranged in the first direction can be separated from each other. The material of the first resin portion 421 can include a silicone material, a thermosetting resin, or a resin material that does not induce outgas. portion 421 can be injection-molded in a structure in which the light-emitting elements 101, 103 are embedded therein. When the first resin portion 421 is formed, it can be cured by a thermosetting method. The region SA1 between the first resin portions 421 can be used as a region where a second resin portion 423 is formed, and the first resin portions 421 arranged in the first direction can be separated from each other. The material of the first resin portion 421 can include a silicone material, a thermosetting resin, or a resin material that does not induce outgas. The region SA1 between the first resin portions 421 can be used as a region where a second resin portion 423 is formed, and the first resin portions 421 arranged in the first direction can be separated from each other. The material of the first resin portion 421 can include a silicone material, a thermosetting resin, or a resin material that does not induce outgas. material, a thermosetting resin, or a resin material that does not induce outgas. ​The first resin part 421 is made of a transparent resin material and is in contact with the emission surfaces of the light emitting elements 101 and 103. It can make contact.

[0055] Referring to FIG. 18b, a second resin part 423 is formed outside the first resin part 421. The second resin part 423 can be made of a UV resin material or include a resin material that induces outgassing. Once the second resin part 423 is formed, it can be cured by a UV curing method. The second resin parts 423 are respectively arranged between the first resin parts 421 and can be in contact with the outer surfaces of the first resin parts 421. The upper surface of the second resin part 423 may be arranged at the same height as the uppermost end PS2 of the first resin part 421, or may be arranged lower or higher. The upper surface of the second resin part 423 may be provided as a flat surface to prevent a decrease in adhesive force. The first and second resin parts 421 and 423 can be defined as a resin layer 420.

[0056] Referring to FIG. 18c, a first adhesive layer 435 is arranged on the upper surface of the second resin part 423. The first adhesive layer 435 may be a UV adhesive, an acrylic adhesive, or a transparent adhesive. The first adhesive layer 435 may be spaced apart from the upper surface of the first resin part 421. As another example, the first adhesive layer 435 may be adhered to the lower surface of the first diffusion layer 430. On the resin layer 420, a first diffusion layer 430 is arranged. The first diffusion layer 430 can be made of a transparent resin-based or transparent plastic-based material and can be selected from the materials disclosed in the first embodiment. A light-shielding part 425 is formed on the lower surface of the first diffusion layer 430. The light-shielding part 425 may be arranged on the region corresponding to the first resin part 421. ​​The light-shielding portion 425 may be a region printed with a white material. For example, the light-shielding portion 425 may contain any one of TiO2, Al2O3, CaCO3, BaSO4, and Silicon, and can be printed using a reflective ink. The light-shielding portion 425 reflects the light emitted through the emission surfaces of the light-emitting elements 101 and 103, and can reduce the generation of hot spots above the light-emitting elements 101 and 103. The light-shielding portion 425 can be formed in a single layer or multiple layers, and may have the same pattern shape or different pattern shapes.

[0057] As shown in FIG. 18d, the first diffusion layer 430 is adhered to the second resin portion 423 of the resin layer 420 by the first adhesive layer 435. At this time, an air region 450 is disposed between the first resin portion 421 and the first diffusion layer 430. The air region 450 may be the same as or different from the region of the light-shielding portion 425. The air region 450 may be the same as or different from the region of the first resin portion 421. The air region 450 may have the same refractive index as air, and may overlap with the first resin portion 421 and the light-shielding portion 425 in the vertical direction. In the described lighting device, after the light-emitting elements 101 and 103 are disposed on the substrate 401, the first resin portion and the second resin portions 421 and 423 are respectively formed. The first resin portion 421 covers each of the light-emitting elements 101 and 103, and the second resin portion 423 is separated from each of the light-emitting elements 101 and 103, so that the light-emitting elements 101 and 103 can be protected. Further, a reflective structure, for example, at least one of an inclined surface, a concave curved surface, and / or a protruding curved surface, is formed on the upper surface RS1 of the first resin portion 421 to reduce hot spots and improve the efficiency of the surface light source. ​​​​​​​​​​​​​​​

[0058] FIG. 19 is a drawing showing a lighting system having a lighting device according to an embodiment. In the lighting system according to the embodiment, the lighting device will refer to the above description. Referring to FIG. 19, the lighting system includes the lighting device 400 disclosed in the embodiment or the modified example, and may include, for example, a substrate 401, a light source 100 having a plurality of light emitting elements 101 and 103 on the substrate 401, a resin layer 420, a reflecting member 410, and a first diffusion layer 430. The resin layer 420 of the lighting device 400 may include a first resin portion and second resin portions 421 and 423, and may include an air region 450 and a light shielding portion 425 between the first resin portion 421 and the first diffusion layer 430. The second resin portion 423 of the resin layer 420 may be adhered to the first diffusion layer 430 with the first adhesive layer 435. An optical member 230 is disposed on the lighting device 400, and the optical member 230 can diffuse and transmit incident light. The optical member 230 uniformly diffuses the surface light source emitted through the first diffusion layer 430 and emits it. The optical member 230 may include an optical lens or an inner lens, and the optical lens can condense light in the target direction or change the optical path. The optical member 230 includes a plurality of lens portions 231 on at least one of the upper surface and the lower surface, and the lens portions 231 may have a shape protruding downward or upward from the optical member 230. Such an optical member 230 can adjust the light distribution characteristics of the lighting device. The optical member 230 may include a material having a refractive index of 2.0 or less, for example, a material having a refractive index of 1.7 or less. The material of the optical member 230 is acrylic.

[0059] Referring to FIG. 19, the lighting system includes the lighting device 400 disclosed in the embodiment or the modified example, and may include, for example, a substrate 401, a light source 100 having a plurality of light emitting elements 101 and 103 on the substrate 401, a resin layer 420, a reflecting member 410, and a first diffusion layer 430. 0, and may include, for example, a substrate 401, a light source 100 having a plurality of light emitting elements 101 and 103 on the substrate 401, a resin layer 420, a reflecting member 410, and a first diffusion layer 430. The resin layer 420 of the lighting device 400 may include a first resin portion and second resin portions 421 and 423, and may include an air region 450 and a light shielding portion 425 between the first resin portion 421 and the first diffusion layer 430. The second resin portion 423 of the resin layer 420 may be adhered to the first diffusion layer 430 with the first adhesive layer 435. An optical member 230 is disposed on the lighting device 400, and the optical member 230 can diffuse and transmit incident light. The optical member 230 uniformly diffuses the surface light source emitted through the first diffusion layer 430 and emits it. The optical member 230 may include an optical lens or an inner lens, and the optical lens can condense light in the target direction or change the optical path. The optical member 230 includes a plurality of lens portions 231 on at least one of the upper surface and the lower surface, and the lens portions 231 may have a shape protruding downward or upward from the optical member 230. Such an optical member 230 can adjust the light distribution characteristics of the lighting device. The optical member 230 may include an optical lens or an inner lens, and the optical lens can condense light in the target direction or change the optical path. The optical member 230 includes a plurality of lens portions 231 on at least one of the upper surface and the lower surface, and the lens portions 231 may have a shape protruding downward or upward from the optical member 230. Such an optical member 230 can adjust the light distribution characteristics of the lighting device. The optical member 230 includes a plurality of lens portions 231 on at least one of the upper surface and the lower surface, and the lens portions 231 may have a shape protruding downward or upward from the optical member 230. The optical member 230 may have a shape protruding downward or upward from the optical member 230. The optical member 230 may include a material having a refractive index of 2.0 or less, for example, a material having a refractive index of 1.7 or less. The material of the optical member 230 may include acrylic. Transparent resin materials such as polymethyl methacrylate (PMMA), polycarbonate (PC), and epoxy resin (EP), or transparent glass (Glass). The optical member 230 can be composed of the above-mentioned materials. The optical member 230 has a distance of, for example, 10 mm or more, for example, in the range of 15 mm to 100 mm from the lighting device such as the substrate 401. If the distance exceeds this range, the luminous intensity will decrease, and if it is smaller than this range the uniformity of the light may decrease. The lighting device can include a heat dissipation plate (not shown) on the bottom surface . The heat dissipation plate can be provided with a plurality of heat dissipation fins and can dissipate the heat conducted to the substrate 401 . The heat dissipation plate can include at least one of metals such as aluminum, copper, magnesium, nickel or a selective alloy thereof . The lighting device includes a housing 300 having a storage space 305, the lighting device according to the embodiment disposed on the bottom surface of the storage space of the housing 300 and the optical member 230 disposed on the lighting device. The outer surface of the storage space 305 of the housing 300 is provided as a surface inclined with respect to the bottom surface of the housing 300 . Such an inclined surface can improve the light extraction efficiency. The surface of the storage space 305 of the housing 300 is formed of a metallic substance of a reflective material . By such a metallic substance, the light extraction efficiency in the storage space 305 is improved. The depth of the storage space 305 is arranged to be larger than the highest point of the resin layer 420 and can emit the light emitted through the resin layer 420. The housing 300 includes a bottom portion 301 and a reflecting portion 302 . The bottom portion 301 is disposed under the substrate 401, and the reflecting portion 302 is outside the bottom portion 301 . Such an inclined surface can improve the light extraction efficiency. The surface of the storage space 305 of the housing 300 is formed of a metallic substance of a reflective material . By such a metallic substance, the light extraction efficiency in the storage space 305 is improved. The depth of the storage space 305 is arranged to be larger than the highest point of the resin layer 420 and can emit the light emitted through the resin layer 420. The housing 300 includes a bottom portion 301 and a reflecting portion 302 . The bottom portion 301 is disposed under the substrate 401, and the reflecting portion 302 is outside the bottom portion 301 . The housing 300 includes a bottom portion 301 and a reflecting portion 302, and the bottom portion 301 is disposed under the substrate 401, and the reflecting portion 302 is outside the bottom portion 301 . The bottom portion 301 is disposed under the substrate 401, and the reflecting portion 302 is outside the bottom portion 301 It may protrude upward from the side periphery and be disposed around the resin layer 420. The housing 300 can include a metal or plastic material, but is not limited thereto. An opening (not shown) through which a cable connected to the substrate 401 penetrates is formed in the bottom 301 or the reflecting portion 302 of the housing 300, but is not limited thereto. The substrate 401 may be adhered to the bottom 301 of the housing 300 by a screw-like mounting means or an adhesive member, or may be coupled by a hook-like structure. Accordingly, the substrate 401 is fixed to the bottom surface of the housing 300. The lighting device according to the embodiment can be applied to various vehicle lighting devices such as headlamps, width lamps, side mirror lamps, fog lamps, tail lamps, stop lamps, and daytime running lamps, display devices, and signal lamps. FIG. 20 is a front view showing a light-emitting element on a substrate in the lighting device according to the embodiment, and FIG. 21 is a side view of the light-emitting element of FIG. 20. Referring to FIGS. 20 and 21, the light-emitting elements 101 and 103 include a main body 10 having a cavity 20, a plurality of

[0060] frames 30 and 40 in the cavity 20, and a light-emitting diode chip 71 disposed on at least one of the plurality of frames 30 and 40. Such light-emitting elements 101 and 103 can be embodied as side-emitting type packages. The main body 10 may include a cavity 20 in which the frames 30 and 40 are exposed on the bottom surface. The plurality of frames 30 and 40 are separated, for example, into a first frame 30 and a second frame 40 and are coupled to the main body 10. The main body 10 may be made of an insulating material. The main body 10 may be made of a reflective material. 40 are exposed on the bottom surface. The plurality of frames 30 and 40 are separated, for example, into a first frame 30 and a second frame 40 and are coupled to the main body 10. For example, they are separated into a first frame 30 and a second frame 40 and are coupled to the main body 10. The main body 10 may be made of an insulating material. The main body 10 may be made of a reflective material. It can be formed. The main body 10 can be made of a material having a reflectance higher than the transmittance with respect to the wavelength emitted from the light emitting diode chip, for example, a material having a reflectance of 70% or more. When the reflectance of the main body 10 is 70% or more, it can be defined as a non-translucent material or a reflective material. The main body 10 can be made of a resin-based insulating material, for example, a resin material such as polyphthalamide (PPA: Polyphthalamide). The main body 10 can be made of a thermosetting resin containing a silicone-based or epoxy-based or plastic material, or a material with high heat resistance and high light resistance. The first frame 30 includes a first lead portion 31 disposed on the bottom surface of the cavity 20, a first bonding portion 32 extending outside the main body 10, and a first heat dissipation portion 33. The first bonding portion 32 is bent from the first lead portion 31 within the main body 10 and protrudes outside the main body. The first heat dissipation portion 33 is bent from the first bonding portion 32. The second frame 40 includes a second lead portion 41 disposed on the bottom surface of the cavity 20, a second bonding portion 42 disposed in an outer region of the main body 10, and a second heat dissipation portion 43. The second bonding portion 42 is bent from the second lead portion 41 within the main body 10, and the second heat dissipation portion 43 is bent from the second bonding portion 42. Here, the light emitting diode chip 71 is disposed, for example, on the first lead portion 31 of the first frame 30 and is connected to the first lead portion and the second lead portions 31 and 41 by wires, or is connected to the first lead portion 31 by an adhesive and is connected to the second lead portion 41 by a wire.

[0061] Such a light-emitting diode chip 71 may be a horizontal chip, a vertical chip, or a chip having a via structure. The light-emitting diode chip 71 may be mounted in a flip-chip manner. The light-emitting diode chip 71 can selectively emit light within the wavelength range of ultraviolet to visible light. The light-emitting diode chip 71 can emit, for example, blue, green, or red peak wavelengths. The light-emitting diode chip 71 can include at least one of II-VI group compounds and III-V group compounds. The light-emitting diode chip 71 can be made of a compound selected from the group consisting of, for example, GaN, AlGaN, InGaN, AlInGaN, GaP, AlN, GaAs, Al GaAs, InP, and mixtures thereof. The light-emitting diode chip 71 is arranged one or more in the cavity 20 and emits light with the highest intensity in the direction of the central axis Y0. The light-emitting diode chips arranged in the cavities 20 of the light-emitting elements 101 and 103 according to the embodiments may be arranged one or more. The light-emitting diode chip can be selected, for example, from a red LED chip, a blue LED chip, a green LED chip, and a yellow green LED chip. A molding member 80 is arranged in the cavity 20 of the main body 11. The molding member 80 includes a light-transmitting resin such as silicone or epoxy and can be formed in a single layer or multiple layers. On the molding member 80 or the light-emitting diode chip 71, means for converting the wavelength of the emitted light can be included. The wavelength conversion means includes quantum dots or phosphors and converts the light emitted from the light-emitting diode chip 71.

[0062] Excite a part of the light and emit it with light of other wavelengths. The phosphor can be selectively formed from quantum dots, YAG, TAG, Silicate, Nitride, Oxy-nitride-based substances. The phosphor can include at least one of a red phosphor, a yellow phosphor, and a green phosphor but is not limited thereto. The emission surface 81 of the molding member 80 can have a flat shape, a concave shape, a convex shape, etc., but is not limited thereto. Another example is that a translucent film having a phosphor is disposed on the cavity 20, but is not limited thereto. A lens is further formed on the upper portion of the main body 10, and the lens can include a structure of a concave lens or / and a convex lens, and can adjust the light distribution of the light emitted by the light emitting elements 101, 10 3. On any one of the frames of the main body 10, semiconductor elements such as a light receiving element and a protection element are mounted. The protection element can be embodied by a thyristor, a Zener diode or a TVS (Transient voltage suppr ession), and the Zener diode protects the light emitting diode chip from ESD (electro static discharge). At least one or a plurality of light emitting elements 101, 103 are disposed on the substrate 401, and a reflecting member 410 is disposed around the lower part of the light emitting elements 101, 103. The first and second lead parts 33, 43 of the light emitting elements 101, 103 are bonded to the pads 403, 405 of the substrate 401 with solder or a conductive tape which is a conductive adhesive member 203, 2 05.

[0063] The lighting device of the present invention is applicable to various lamp devices that require lighting, such as vehicle lamps, household lighting devices, and industrial lighting devices. For example, when applied to vehicle lamps , it is applicable to headlamps, side marker lamps, side mirror lamps, fog lamps, tail lamps, brake lamps, daytime running lamps, vehicle interior lighting, door scuff plates, rear combination lamps, backup lamps, etc. The lighting device of the present invention is applicable to indoor and outdoor advertising devices, display devices, and also applicable to various train fields. In addition, it will be applicable to all lighting-related fields and advertising-related fields that are currently being developed and commercialized or that can be realized with the future technological development.

Claims

1. A substrate, a first light-emitting element disposed on a first region of the substrate, a second light-emitting element disposed on a second region of the substrate, a reflective member disposed on an upper surface of the substrate excluding portions where the first and second light-emitting elements are placed, a resin layer disposed on an upper surface of the reflective member, a first diffusion layer disposed on the resin layer, a plurality of light-shielding portions disposed on the resin layer, comprising, the resin layer includes a plurality of first resin portions that seal at least the emission surfaces and upper surfaces of the first and second light-emitting elements respectively, and a second resin portion disposed between the first light-emitting element and the second light-emitting element, the second resin portion is disposed between one of the plurality of first resin portions and the second light-emitting element, each of the plurality of light-shielding portions overlaps in the vertical direction with each of the plurality of first resin portions, a lighting device.

2. including a second diffusion layer disposed on the first diffusion layer, the plurality of light-shielding portions are disposed between the first diffusion layer and the second diffusion layer, the lighting device according to Claim 1.

3. the plurality of light-shielding portions overlap in the vertical direction with the first and second light-emitting elements, the lighting device according to Claim 2.

4. either one of the first resin portion and the second resin portion is disposed between the first light-emitting element and the second light-emitting element, the plurality of first resin portions cover the light-emitting surfaces of the first and second light-emitting elements respectively, the second resin portion is spaced apart from the light-emitting surface of the first light-emitting element, the lighting device according to Claim 1.

5. including an air region disposed between the first diffusion layer and the plurality of first resin portions, the air region has different heights between the first diffusion layer and each of the plurality of first resin portions, the lighting device according to any one of Claims 1 to 4.

6. the second resin portion does not overlap in the vertical direction with the air region, the lighting device according to Claim 5.

7. including an air region disposed between the first diffusion layer and each of the plurality of first resin portions, a lower surface of the first diffusion layer is adhered to an upper surface of the second resin portion, the lighting device according to any one of Claims 1 to 4.

8. the second resin portion does not overlap in the vertical direction with the plurality of first resin portions, the lighting device according to any one of Claims 1 to 4.

9. the first and second light-emitting elements and the first and second resin portions overlap in the horizontal direction, the lighting device according to any one of Claims 1 to 4.

10. The lighting device according to any one of claims 1 to 4, wherein the plurality of light-shielding portions do not overlap in a direction perpendicular to the second resin portion.

11. The lighting device according to any one of claims 1 to 4, wherein the material of the first resin portion is made of a material different from the material of the second resin portion.

12. The first resin portion includes a silicone resin or a thermosetting resin, The lighting device according to any one of claims 1 to 4, wherein the second resin portion includes a UV resin.

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