Display device, method for manufacturing the same, and electronic apparatus using the display device

Abstract

Provided are: a display device in which light leakage between adjacent pixels can be suppressed; a manufacturing method of the display device; and an electronic apparatus using the display device.　The display device comprises: a plurality of light-emitting elements each having a lower electrode, an organic layer, and an upper electrode which are laminated in this order on a substrate; an upper surface protective layer which is laminated on the upper surface side of the light-emitting element and which covers the upper electrode; and an element separating wall which is disposed between adjacent light-emitting elements and which covers lateral end surfaces of the light-emitting elements. The element separating wall extends along the thickness direction of the light-emitting element, in the direction from the light-emitting element towards the upper surface protective layer.

Description

Technical Field

[0001] The present disclosure relates to a display device, a method of manufacturing a display device, and an electronic device using the display device. In particular, the present disclosure relates to a display device including a light-emitting element having an organic layer, a method of manufacturing the display device, and an electronic device using the display device.

Background Art

[0002] In a display device in which a plurality of light-emitting elements each including an organic layer serving as a light-emitting layer and an electrode are formed, it is desired to suppress light leakage between adjacent pixels.

[0003] In the technology of Patent Document 1, a display device including a plurality of light-emitting elements and a protective layer for protecting the plurality of light-emitting elements is disclosed. In this display device, each light-emitting element has a plurality of lower electrodes separated by insulating portions, an organic layer disposed on the lower electrodes, and an upper electrode covering the organic layer. Further, a separation portion having a refractive index different from that of the protective layer is provided in a portion corresponding to the upper side between adjacent lower electrodes.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the technology of Patent Document 1, there is room for further improvement in suppressing light leakage between adjacent pixels.

[0006] In view of the above, one object of the present disclosure is to provide a display device capable of suppressing light leakage between adjacent pixels, a method of manufacturing the display device, and an electronic device using the display device.

Means for Solving the Problems

[0007] The present disclosure relates to, for example, (1 -1 ) a plurality of light-emitting elements in which a lower electrode, an organic layer, and an upper electrode are laminated in this order on a substrate, an upper surface protective layer laminated on the upper surface side of the light-emitting element and covering the upper electrode, an inter-element separation wall disposed between adjacent light-emitting elements and covering the side end face side of the light-emitting element, and includes, the inter-element separation wall extends in a direction from the light-emitting element toward the upper surface protective layer along the thickness direction of the light-emitting element and , The upper electrode is a first upper electrode separated from each other facing the organic layer, A second upper electrode connecting between adjacent first upper electrodes is provided, The second upper electrode is arranged along the surface of the element isolation wall, The reflectivity of the second upper electrode is larger than the reflectivity of the first upper electrode, a display device. The present disclosure includes, for example, (1-2) a plurality of light-emitting elements in which a lower electrode, an organic layer, and an upper electrode are laminated in this order on a substrate, An upper surface protection layer laminated on the upper surface side of the light-emitting element and covering the upper electrode, An element isolation wall arranged between adjacent light-emitting elements and covering the side end surface side of the light-emitting element, Comprising, The element isolation wall extends along the thickness direction of the light-emitting element in a direction from the light-emitting element toward the upper surface protection layer, The upper electrode is a first upper electrode separated from each other facing the organic layer, A second upper electrode connecting between adjacent first upper electrodes is provided, The second upper electrode is arranged along the surface of the element isolation wall, A side wall protection film is interposed between the side end surface of the organic layer and the element isolation wall, A display device.

[0008] The present disclosure may also be the display device according to the above (1 -1 ) or (1-2) in which a low refractive index portion is formed in the inter-element separation wall.

[0009] The present disclosure may also be (3) the upper electrode is a first upper electrode separated from each other facing the organic layer, a second upper electrode connecting between adjacent first upper electrodes is provided, and the second upper electrode is disposed along the surface of the inter-element separation wall in the above (1 -1 ) or (1-2)It may be the display device described in

[0010] Further, this disclosure includes, for example, (4) a step of forming a first laminate in which a lower electrode, an organic layer, a first upper electrode, and an upper surface protective layer are laminated in this order on a substrate; a step of forming a first groove to a predetermined depth from the upper surface protective layer at a predetermined position in the first laminate; a step of forming a second laminate by forming an element isolation wall in the first groove; a step of forming a second groove from the upper surface protective layer to the position of the first upper electrode in a predetermined region around the element isolation wall in the second laminate; and a step of forming a second upper electrode in the second groove. This is a method for manufacturing a display device.

[0011] This disclosure includes, for example, (5) a step of forming a first laminate provided with a laminate in which a lower electrode, an organic layer, a first upper electrode, and an upper surface protective layer are laminated in this order on a substrate and an auxiliary layer; a step of forming a first groove to a predetermined depth by etching at a position determined according to the pattern of pixels in the first laminate, and forming a sidewall protective film having the auxiliary layer as a base end along the inner wall of the first groove along with the etching; a step of forming a second laminate by forming an element isolation wall in the first groove; a step of forming a second groove from the upper surface protective layer to the position of the first upper electrode in a predetermined region around the element isolation wall in the second laminate; and a step of forming a second upper electrode in the second groove. This is a method for manufacturing a display device.

[0012] This disclosure may be (6) an electronic device including the display device described in (1 -1 ) or (1-2) .

Brief Description of the Drawings

[0013]

FIG. 1

FIG. 2A

FIG. 2B

FIG. 2C

FIG. 2D

FIG. 2E

FIG. 3A

FIG. 3B

FIG. 3C

FIG. 3D

FIG. 3E

FIG. 4A

FIG. 4B

FIG. 5

FIG. 6A

FIG. 6B

FIG. 7

FIG. 8

FIG. 9

FIG. 10

FIG. 11

FIG. 12

FIG. 13

FIG. 14

FIG. 15

FIG. 16

FIG. 17

FIG. 18

FIG. 19

FIG. 20

FIG. 21

FIG. 22

FIG. 23

FIG. 24

FIG. 25

FIG. 26

FIG. 27

MODE FOR CARRYING OUT THE INVENTION

[0014] Hereinafter, an example and the like according to the present disclosure will be described with reference to the drawings. The description will be made in the following order. In the present specification and the drawings, components having substantially the same functional configuration are denoted by the same reference numerals, and redundant description is omitted.

[0015] The description is assumed to be made in the following order. 1. First Embodiment 2. Second Embodiment 3. Third Embodiment 4. Fourth Embodiment 5. Application Examples

[0016] The following description is a preferred specific example of the present disclosure, and the content of the present disclosure is not limited to these embodiments and the like. Also, in the following description, for convenience of explanation, directions such as front-back, left-right, up-down, etc. are indicated, but the content of the present disclosure is not limited to these directions. In the examples of FIGS. 1, 2A to 2E, the Z-axis direction is the up-down direction (the upper side is the +Z direction, and the lower side is the -Z direction), the X-axis direction is the front-back direction (the front side is the +X direction, and the back side is the -X direction), and the Y-axis direction is the left-right direction (the right side is the +Y direction, and the left side is the -Y direction), and the explanation will be made based on this. This is the same for FIGS. 3A to 3E and FIGS. 4 to 24. The relative size ratios of the sizes and thicknesses of the respective layers shown in each of FIGS. 1 and the like are descriptions for convenience and do not limit the actual size ratios. The same applies to the definitions and size ratios regarding these directions for each of FIGS. 3 to 24.

[0017] [1. First Embodiment] Regarding the display device according to the first embodiment of the present disclosure, the case where the display device is an organic EL (Electro luminescence) display device will be described below as an example.

[0018] [1-1. Configuration of the Display Device] FIG. 1 is a cross-sectional view showing a configuration example of an organic EL display device (hereinafter simply referred to as "display device 10A") according to the first to fourth embodiments of the present disclosure. The display device 10A includes a substrate 11, an insulating layer 12, a plurality of light-emitting elements 13, an insulating layer 14, a protective layer 15, a protective layer 16, a color filter 17, a filling resin layer 18, and a counter substrate 19.

[0019] The display device 10A is a top emission type display device. The substrate 11 constitutes the back side of the display device 10A, and the counter substrate 19 constitutes the display surface side of the display device 10A. The counter substrate 19 side is the top side, and the substrate 11 side is the bottom side. In the following description, in each layer constituting the display device 10A, the surface on the display surface side of the display device 10A is referred to as the first surface, and the surface on the back side of the display device 10A is referred to as the second surface. In the example of FIG. 1, the surface facing the +Z direction is called the first surface, and the surface facing the -Z direction is called the second surface.

[0020] The display device 10A may be a microdisplay. The display device 10A may be used in various electronic devices. Examples of the electronic devices in which the display device 10A is used include, for example, display devices for VR (Virtual Reality), MR (Mixed Reality), or AR (Augmented Reality), electronic view finders (Electronic View Finder: EVF), or small projectors. Note that this also applies to the display devices 10B to 10D described later.

[0021] (Substrate 11) The substrate 11 is a so-called backplane and drives a plurality of light emitting elements 13. On the first surface of the substrate 11, a drive circuit including a sampling transistor and a drive transistor for controlling the drive of the plurality of light emitting elements 13 and a power supply circuit (both not shown) for supplying power to the plurality of light emitting elements 13 are provided.

[0022] The substrate 11 may be made of, for example, glass or resin with low permeability to moisture and oxygen, or may be made of a semiconductor that is easy to form transistors and the like. Specifically, the substrate 11 may be a glass substrate, a semiconductor substrate, a resin substrate, or the like. The glass substrate includes, for example, high-strain-point glass, soda glass, borosilicate glass, forsterite, lead glass, or quartz glass. The semiconductor substrate includes, for example, amorphous silicon, polycrystalline silicon, or single-crystalline silicon. The resin substrate includes at least one selected from the group consisting of, for example, polymethyl methacrylate, polyvinyl alcohol, polyvinyl phenol, polyethersulfone, polyimide, polycarbonate, polyethylene terephthalate, and polyethylene naphthalate.

[0023] (Insulating layer 12) The insulating layer 12 is provided on the first surface of the substrate 11 and covers the driving circuit, the power supply circuit, and the like. The insulating layer 12 includes a plurality of contact plugs 12A and a plurality of wirings (not shown). The contact plug 12A connects the lower electrode 13A constituting the light-emitting element 13 and the driving circuit. In addition, the plurality of wirings are arranged adjacent to each other in the in-plane direction (XY plane direction) of the substrate 11, and each wiring is electrically connected to the lower electrode 13A and the light-emitting element 13 by a contact plug 12A or the like.

[0024] The insulating layer 12 is made of, for example, an organic material or an inorganic material. The organic material includes at least one of, for example, polyimide and acrylic resin. The inorganic material includes at least one of, for example, silicon oxide, silicon nitride, silicon oxynitride, and aluminum oxide.

[0025] (Light-emitting element 13) The plurality of light-emitting elements 13 are provided on the first surface side of the substrate 11. The plurality of light-emitting elements 13 are two-dimensionally arranged in a prescribed arrangement pattern such as a matrix pattern. The light-emitting element 13 is configured to be able to emit white light. The light-emitting element 13 is, for example, a white OLED or a white Micro-OLED (MOLED). In the present embodiment, as a colorization method in the display device 10A, a method using the light-emitting element 13 and the color filter 17 is used. However, the colorization method is not limited to this, and an RGB painting method or the like may be used. Also, instead of the color filter 17, a single-color filter may be used. The colorization method is the same for the display devices 10B to 10D described later.

[0026] The light-emitting element 13 includes a lower electrode 13A, an organic layer 13B, and an upper electrode 13C. The lower electrode 13A, the organic layer 13B, and the upper electrode 13C are laminated in this order from the substrate 11 side toward the counter substrate 19.

[0027] (Lower electrode 13A) The lower electrode 13A is provided on the first surface of the insulating layer 12. As shown in FIG. 2A, the lower electrode 13A is electrically separated for each sub-pixel. The lower electrode 13A is an anode. The lower electrode 13A also serves as a reflective layer, and it is preferable to be made of a material having as high a reflectance as possible and a large work function in order to enhance the light emission efficiency. A sub-pixel indicates the smallest display section unit composed of one kind of color obtained by further dividing a pixel that is a section unit constituting the screen. For example, one pixel (picture element) is constituted by a combination of adjacent red sub-pixels, green sub-pixels, and blue sub-pixels.

[0028] The lower electrode 13A is composed of at least one layer of a metal layer and a metal oxide layer. More specifically, the lower electrode 13A is composed of a single-layer film of a metal layer or a metal oxide layer, or a laminated film of a metal layer and a metal oxide layer. When the lower electrode 13A is composed of a laminated film, the metal oxide layer may be provided on the organic layer 13B side, or the metal layer may be provided on the organic layer 13B side. However, from the viewpoint of adjacent the layer having a high work function to the organic layer 13B, it is preferable that the metal oxide layer is provided on the organic layer 13B side.

[0029] The metal layer contains, for example, at least one metal element selected from the group consisting of chromium (Cr), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), molybdenum (Mo), titanium (Ti), tantalum (Ta), aluminum (Al), magnesium (Mg), iron (Fe), tungsten (W), and silver (Ag). The metal layer may contain the at least one metal element as a constituent element of an alloy. Specific examples of the alloy include an aluminum alloy or a silver alloy. Specific examples of the aluminum alloy include, for example, AlNd or AlCu.

[0030] The metal oxide layer contains, for example, at least one of a mixture of indium oxide and tin oxide (ITO), a mixture of indium oxide and zinc oxide (IZO), and titanium oxide (TiO).

[0031] (Upper electrode 13C) The upper electrode 13C is provided to face the lower electrode 13A. The upper electrode 13C is formed directly above the individual organic layers 13B described later, and adjacent upper electrodes 13C are formed in a spatially separated state for each sub-pixel, and are electrically connected to each other at an electrode connection portion (not shown). The electrode connection portion may be integral with or separate from the upper electrode 13C. The upper electrode 13C is a cathode. The upper electrode 13C is a transparent electrode having permeability to the light generated in the organic layer 13B. Here, the transparent electrode is assumed to include a semi-transmissive reflective layer. It is preferable that the upper electrode 13C is composed of a material with as high permeability as possible and a small work function in order to improve the utilization efficiency of the light generated in the light-emitting element 13.

[0032] The upper electrode 13C is composed of at least one of a metal layer and a metal oxide layer. More specifically, the upper electrode 13C is composed of a single-layer film of a metal layer or a metal oxide layer, or a laminated film of a metal layer and a metal oxide layer. When the upper electrode 13C is composed of a laminated film, the metal layer may be provided on the organic layer 13B side, or the metal oxide layer may be provided on the organic layer 13B side. From the viewpoint of adjacent the layer with a low work function to the organic layer 13B, it is preferable that the metal layer is provided on the organic layer 13B side.

[0033] The metal layer contains, for example, at least one metal element selected from the group consisting of magnesium (Mg), aluminum (Al), silver (Ag), calcium (Ca), and sodium (Na). The metal layer may contain the at least one metal element as a constituent element of an alloy. Specific examples of the alloy include MgAg alloy, MgAl alloy, or AlLi alloy. The metal oxide contains, for example, at least one of a mixture of indium oxide and tin oxide (ITO), a mixture of indium oxide and zinc oxide (IZO), and zinc oxide (ZnO).

[0034] (Organic layer 13B) The organic layer 13B is provided between the lower electrode 13A and the upper electrode 13C. The organic layer 13B is patterned according to the arrangement of sub-pixels. As shown in FIG. 2B, the organic layer 13B is formed in a separated state for each sub-pixel. The organic layer 13B is configured to be capable of emitting white light.

[0035] The organic layer 13B has a structure in which a hole injection layer, a hole transport layer, a light-emitting layer, and an electron transport layer are laminated in this order from the lower electrode 13A toward the upper electrode 13C. Note that the structure of the organic layer 13B is not limited to this, and layers other than the light-emitting layer are provided as necessary.

[0036] The hole injection layer is for enhancing the hole injection efficiency into the light-emitting layer and is a buffer layer for suppressing leakage. The hole transport layer is for enhancing the hole transport efficiency to the light-emitting layer. The light-emitting layer causes recombination of electrons and holes by applying an electric field and generates light. The light-emitting layer is an organic light-emitting layer containing an organic light-emitting material. The electron transport layer is for enhancing the electron transport efficiency to the light-emitting layer. An electron injection layer may be provided between the electron transport layer and the upper electrode 13C. This electron injection layer is for enhancing the electron injection efficiency.

[0037] (Insulating layer 14) The insulating layer 14 is provided on the first surface of the insulating layer 12. The insulating layer 14 electrically separates each lower electrode 13A for each light-emitting element 13 (that is, for each sub-pixel). The insulating layer 14 has a plurality of openings 14A, and the first surface (the surface facing the upper electrode 13C) of the separated lower electrode 13A is exposed from the openings 14A. The insulating layer 14 may cover from the peripheral portion of the first surface of the separated lower electrode 13A to the side surface (end face). In this specification, the peripheral portion of the first surface refers to a region having a predetermined width inward from the periphery of the first surface.

[0038] (Protective layer) The protective layer 15 is an upper surface protective layer that protects the main surface on the upper surface side of the light-emitting element 13 (the surface on the +Z side). The protective layer 15 is provided on the first surface of the upper electrode 13C and covers the light-emitting element 13 by covering the upper electrode 13C. The protective layer 15 suppresses the contact between the light-emitting element 13 and the outside air from the upper surface side of the light-emitting element 13, and suppresses the intrusion of moisture from the external environment into the light-emitting element 13. Further, when the upper electrode 13C is composed of a metal layer, the protective layer 15 may have a function of suppressing the oxidation of this metal layer.

[0039] The protective layer 15 is composed of, for example, an inorganic material. As the inorganic material constituting the protective layer 15, those having low hygroscopicity are preferable. Specifically, the inorganic material constituting the protective layer 15 preferably contains at least one selected from the group consisting of silicon oxide (SiO), silicon nitride (SiN), silicon oxynitride (SiNO), titanium oxide (TiO), and aluminum oxide (AlO). The protective layer 15 may have a single-layer structure, but may have a multi-layer structure when increasing the thickness. This is for relaxing the internal stress in the protective layer 15.

[0040] (Protective layer 16) The protective layer 16 has a first protective portion 16A located directly above the protective layer 15 and a second protective portion 16B composed of the portion excluding the first protective portion 16A. The first protective portion 16A and the second protective portion 16B are formed continuously and integrally of the same material. The first protective portion covers the surface of the protective layer 15 that serves as the upper surface protective layer, and together with the second protective portion 16B, it provides a smoothed surface of the surface (+Z side surface), and also suppresses the deterioration of the light-emitting element 13. The second protective portion 16B is formed between adjacent first protective portions 16A and is formed so as to enter between adjacent light-emitting elements 13 from adjacent protective layers 15. In this example, the second protective portion 16B also enters into the insulating layer 12. The second protective portion 16B serves as an inter-element separation wall that covers the side end surface 130 of the light-emitting element 13. Different from the insulating layer 14, the inter-element separation wall is a wall structure portion that extends in a direction different from the direction of rising onto any of the first surfaces of each layer (lower electrode 13A, organic layer 13B, upper electrode 13C) of the light-emitting element 13. By covering the side end surface 130 of the light-emitting element 13, the second protective portion 16B can suppress the deterioration of the light-emitting element 13 due to the outside air. When taking the position facing the side end surface 130 of the light-emitting element 13 as a reference, the second protective portion 16B extends in the direction from the light-emitting element 13 toward the protective layer 15 (+Z direction) along the thickness direction (Z-axis direction) of the light-emitting element 13. And in the example of FIG. 1, the upper end (extended end) of the second protective portion 16B coincides with the upper surface side of the first protective portion 16A, and the surface of the first protective portion 16A and the upper end surface of the second protective portion 16B are flush. As shown in the example of FIG. 1, it is preferable that the lower end of the second protective portion 16B is located further below the lower electrode 13A of the light-emitting element 13 from the viewpoint that a low refractive index portion (void portion 20 in the example of FIG. 1) can be formed even further below the light-emitting element 13.

[0041] The material for forming the protective layer 16 (the material for forming the first protective portion 16A and the second protective portion 16B) preferably has a refractive index value lower than that of the protective layer 15 forming the upper surface protective layer in the state of the protective layer 16. Further, by making the refractive index of the protective layer 16 smaller than that of the protective layer 15, it is possible to more effectively prevent the light generated in the light-emitting element from leaking to the adjacent sub-pixel side. Therefore, by using a material for forming the protective layer 16 that satisfies the refractive index as described above, it is possible to more effectively prevent the light generated in the light-emitting element from leaking to the adjacent sub-pixel side.

[0042] Also, the material for forming the protective layer 16 is preferably formed from a material having a step coverage value of less than 1. Further, the material for forming the protective layer 16 is preferably formed from a material having a lower moisture permeability than the protective layer 15 serving as the upper surface protective layer. By forming the protective layer 16 with such a material, the void portion 20 can be formed more efficiently.

[0043] Examples of the material for forming the protective layer 16 include SiN, Al2O3, TiO2, etc. formed by methods such as PECVD (plasma-enhanced chemical vapor deposition) method and sputtering method.

[0044] (Low refractive index portion) Inside the second protective part 16B forming the element separation wall, a low refractive index part having a refractive index lower than that of the second protective part 16B is formed. In the example of FIG. 1, the low refractive index part is formed in a shape extending in the thickness direction (Z-axis direction) of the light emitting element. The low refractive index part is a part having a refractive index lower than that of the second protective part 16B. Examples of the low refractive index part include a gas space part filled with a specific gas such as nitrogen, a liquid part filled with a specific liquid, and the like. Examples of the gas space part include a void part filled with air. Note that the refractive index of the low refractive index part and the refractive index of the second protective part are the refractive index of the low refractive index part and the refractive index of the second protective part in the display device. When the refractive index of the void part 20 is smaller than the refractive index of the second protective part 16B, it becomes easy to cause total reflection of light at the interface between the part made of the material forming the protective layer 16 and the void part 20.

[0045] (Void part) In the example of the display device 10A of FIG. 1, the void part 20 is formed as the low refractive index part. Hereinafter, the case where the void part 20 is formed as the low refractive index part will be continued as an example.

[0046] The length and position of the gap portion 20 in the vertical direction are not limited. The gap portion 20 may be formed at least at one or more positions of the lower electrode 13A, the organic layer 13B, the upper electrode 13C, and the protective layer 15, and may have a length corresponding to the position. In the examples of FIGS. 1, 2A to 2E, the gap portion 20 exists at any position of the lower electrode 13A, the organic layer 13B, the upper electrode 13C, and the protective layer 15 in the vertical direction (Z-axis direction), and further exists up to the height position near the center of the first protective portion 16A in the Z-axis direction. The example of the gap portion 20 is not limited to this. For example, it may be formed at the position of the organic layer 13B with a length corresponding to the thickness of the organic layer 13B. However, from the viewpoint of more accurately suppressing light leakage to adjacent sub-pixels at the gap portion 20, it is preferable that the upper end of the gap portion 20 is on the upper side (+Z direction side) of the interface between the light-emitting element 13 and the protective layer 15. It is more preferable that the gap portion 20 is formed from the position near the first surface of the substrate 11 to the position near the second surface of the color filter 17 from the viewpoint of more reliably preventing the light generated in the organic layer 13B from leaking to the adjacent sub-pixel side. When wiring is formed in the insulating layer 12 below the lower electrode 13A, it is preferable that the lower end of the gap portion 20 is located below the lower electrode 13A, similar to the lower end of the second protective portion 16B, and it is more preferable that it is at the position between adjacent wirings or at a position lower than the position between adjacent wirings in the insulating layer 12. In this case, since the gap portion 20 is arranged between adjacent wirings in the XY plane direction, it is possible to reduce the capacitance (parasitic capacitance) of the capacitor formed by the adjacent wirings compared to the case where the gap portion 20 does not exist.

[0047] In the example of FIG. 1, the cross-sectional shape of the gap portion 20 has a bottom surface portion 20A and the bottom surface portion 20A and a side wall portion 20B. From the viewpoint of enhancing the light extraction efficiency, it is preferable that the taper angle (angle α in FIG. 1) formed between the bottom surface portion 20A and the side wall portion 20B is 90° or less. Further, from the viewpoint of facilitating total reflection of light and suppressing light leakage, it is more preferable that the gap portion 20 is formed in a forward taper shape with a taper angle α of 30° or less. However, this does not prohibit the shape of the gap portion 20 from being an inverse taper shape, and the shape of the gap portion 20 may be an inverse taper shape.

[0048] In the example of FIG. 1, the cross-sectional shape of the gap portion 20 was trapezoidal in cross-section, but it is not limited to this, and it may be triangular, a polygon with four or more sides, or may have a curved surface portion.

[0049] Note that if only the effect of suppressing reflection of light generated from the organic layer 13B of the light-emitting element 13 and traveling obliquely upward with respect to the vertical direction is emphasized, the gap portion 20 may be formed only between adjacent protective layers 15. In that case, the second protective portion 16B in the protective layer 16 may be formed only in the portion between adjacent protective layers 15, or may be formed over both the portion between adjacent protective layers 15 and the portion between adjacent light-emitting elements 13. When the second protective portion 16B is formed only in the portion between adjacent protective layers 15, the organic layer 13B and the upper electrode 13C are not separated for each sub-pixel and are shared between sub-pixels.

[0050] (Color filter) The color filter 17 is provided on the protective layer 16. The color filter 17 is, for example, an On Chip Color Filter (OCCF). The color filter 17 includes, for example, a red filter, a green filter, and a blue filter. The red filter, the green filter, and the blue filter are respectively provided to face the light-emitting elements 13 for red sub-pixels, the light-emitting elements 13 for green sub-pixels, and the light-emitting elements 13 for blue sub-pixels. As a result, the white light emitted from each of the light-emitting elements 13 in the red sub-pixel, the green sub-pixel, and the blue sub-pixel passes through the above-mentioned red filter, green filter, and blue filter, respectively, so that red light, green light, and blue light are emitted from the display surface. Further, a light-shielding layer (not shown) may be provided in the region between the color filters of each color, that is, between the sub-pixels. Note that the color filter 17 is not limited to an on-chip color filter, and may be provided on one main surface of the counter substrate 19.

[0051] (Filling resin layer) The filling resin layer 18 is provided between the color filter 17 and the counter substrate 19. The filling resin layer 18 has a function as an adhesive layer that adheres the color filter 17 and the counter substrate 19. The filling resin layer 18 contains, for example, at least one of a thermosetting resin and an ultraviolet curable resin.

[0052] (Counter substrate) The counter substrate 19 is provided to face the substrate 11. More specifically, the counter substrate 19 is provided such that the second surface of the counter substrate 19 faces the first surface of the substrate 11. The counter substrate 19 and the filling resin layer 18 seal the light-emitting element 13, the color filter 17, and the like. The counter substrate 19 is made of a material such as glass that is transparent to the light of each color emitted from the color filter 17.

[0053] [1-2 Manufacturing method of display device] Hereinafter, an example of a manufacturing method of the display device 10A according to the first embodiment of the present disclosure will be described.

[0054] First, for example, using thin film formation technology, photolithography technology, and etching technology, a drive circuit, a power supply circuit, etc. are formed on the first surface of the substrate 11. Next, for example, by the CVD method, after forming the insulating layer 12 on the first surface of the substrate 11 so as to cover the drive circuit and the power supply circuit, a plurality of contact plugs 12A are formed in the insulating layer 12.

[0055] Next, for example, by the sputtering method, after forming a laminated film of a metal layer and a metal oxide layer on the first surface of the substrate 11, the laminated film is patterned using, for example, photolithography technology and etching technology, thereby forming the lower electrodes 13A separated for each light-emitting element 13 (that is, for each sub-pixel).

[0056] Next, for example, by the CVD method, after forming the insulating layer 14 on the first surface of the insulating layer 12 so as to cover the plurality of lower electrodes 13A, the insulating layer 14 is patterned using photolithography technology and etching technology. Thereby, a plurality of openings 14A are formed in the insulating layer 14. When the lower electrodes 13A are not easily damaged by the processing for forming the grooves (grooving) described later, the insulating layer 14 may be omitted.

[0057] Next, for example, by the vapor deposition method, a hole injection layer, a hole transport layer, a light-emitting layer, and an electron transport layer are laminated in this order on the first surface of the first surface of the lower electrode 13A, thereby forming the organic layer 13B. Next, for example, by the vapor deposition method or the sputtering method, the upper electrode 13C is formed on the first surface of the organic layer 13B. Thereby, a plurality of light-emitting elements 13 are formed on the first surface of the insulating layer 12.

[0058] Next, for example, by a CVD method or a vapor deposition method, a protective layer 15 is formed on the first surface of the upper electrode 13C. Then, grooves are formed along the layout of the sub-pixels for the light-emitting element and the protective layer, for example, by photolithography technology and etching technology. In the display device of FIG. 1, grooves are formed up to the inside of the insulating layer 12. Further, a protective layer 16 is formed on the surface of the protective layer 15 and inside the grooves by a method such as a PECVD method or a sputtering method. At this time, by adjusting the aspect ratio of the grooves, the taper angles of the bottom surface and the side surfaces of the grooves, the thickness and coverage of the second protective portion 16B as an element isolation wall, a void portion 20 is formed in the second protective portion 16B.

[0059] After the protective layer 16 is formed, a color filter 17 is formed on the first surface of the protective layer 15, for example, by photolithography. Next, for example, using an ODF (One Drop Fill) method, after covering the color filter 17 with a filling resin layer 18, the counter substrate 19 is placed on the filling resin layer 18. Next, for example, heat is applied to the filling resin layer 18 or ultraviolet rays are irradiated to the filling resin layer 18 to cure the filling resin layer 18, thereby bonding the substrate 11 and the counter substrate 19 via the filling resin layer 18. Thereby, the display device 10A is sealed. As described above, the display device 10A shown in FIG. 1 is obtained.

[0060] [1-3 Effects] In the display device according to the first embodiment, as shown in FIG. 1, a second protective portion 16B serving as an element isolation wall is formed between adjacent sub-pixels so as to face the side end surface 130 of the light-emitting element 13, and a low refractive index portion is formed inside the second protective portion 16B. As a result, the light U generated by the light-emitting element 13 is reflected by the low refractive index portion, and the light generated in the organic layer 13B can be suppressed from leaking to the adjacent sub-pixel side.

[0061] In the display device according to the first embodiment, when the low refractive index portion is the void portion 20 and the void portion 20 is formed to a depth at a position between adjacent wirings of the insulating layer 12 below the lower electrode 13A, the inter-wiring capacitance (parasitic capacitance) can be reduced.

[0062] [1-4 Modification Example] In the description of the above display device 10A, the shape of the sub-pixel was rectangular, but it is not limited to this, and it may be formed in a hexagonal shape as shown in FIGS. 3A to 3E. Further, the arrangement of the sub-pixels is not limited to a matrix shape, and may be a honeycomb shape as shown in FIGS. 3A to 3E. Even in such a case, it is possible to suppress light leakage to adjacent sub-pixels in the same manner as described in the above effects.

[0063] [2 Second Embodiment] The display device according to the second embodiment of the present disclosure will be described below by taking as an example the case where the display device is an organic EL display device as in the first embodiment.

[0064] [2-1 Configuration of Display Device] FIG. 4A is a cross-sectional view showing a configuration example of an organic EL display device (display device 10B) according to an example of the second embodiment. FIG. 4B is a diagram for explaining the state of the cross-section taken along line IVB-IVB in FIG. 4A. The display device 10B is a top emission type display device. The display device 10B includes a substrate 11, an insulating layer 12, a plurality of light-emitting elements 13, a protective layer 15 as an upper surface protective layer, a separation film 21 as an element separation wall, a color filter 17, a filling resin layer 18, and a counter substrate 19.

[0065] The substrate 11, the insulating layer 12, the protective layer 15, the color filter 17, the filling resin layer 18, and the counter substrate 19 are the same as those in the first embodiment. In the display device 10B of the second embodiment, the configuration of the insulating layer 14 in the first embodiment may not be provided.

[0066] (Light-emitting Element 13) A plurality of light-emitting elements 13 are provided on the first surface of the substrate 11, similarly to the first embodiment, and include a lower electrode 13A and an organic layer 13B, and include a first upper electrode 13D as an upper electrode laminated on the organic layer 13B. The lower electrode 13A and the organic layer 13B are the same as those in the first embodiment, and are formed separately from each other for each sub-pixel.

[0067] (Upper electrode (first upper electrode)) The upper electrode laminated on the organic layer 13B is the first upper electrode 13D, and is formed separately from each other for each sub-pixel. The first upper electrode 13D faces the lower electrode 13A, and the first upper electrode 13D faces the protective layer 15.

[0068] (Second upper electrode) The second upper electrode 13E electrically connects the adjacent first upper electrodes 13D to each other. The second upper electrode 13E extends along the surface of the separation film 21 from the facing position of the separation film 21 and the first upper electrode 13D to the extending end 21A of the separation film 21. In the example of FIG. 4A, the position of the upper end portion of the second upper electrode 13E and the position of the surface of the protective layer 15 are aligned in a state where the second upper electrode 13E is formed on the surface of the separation film 21.

[0069] Also, in the examples of FIGS. 4A and 4B, the second upper electrode 13E is formed so as to cover the entire portion of the separation film 21 that extends above the first upper electrode 13D. In this case, if the second upper electrode 13E is further formed of a reflective material as described later, the light traveling obliquely among the light generated by the light-emitting element 13 can be effectively reflected by the second upper electrode 13E, and the light utilization efficiency can be improved. In the example of FIG. 4B, the second upper electrode 13E is formed in a lattice shape according to the layout of the sub-pixels, and each first upper electrode 13D is formed in a rectangular shape and arranged in a matrix.

[0070] The first upper electrode 13D and the second upper electrode 13E are cathodes. The first upper electrode 13D is a transparent electrode having transparency to the light generated in the organic layer 13B. Here, the transparent electrode is assumed to include a semi-transmissive reflective layer. It is preferable that the first upper electrode 13D be formed of a material having as high a transparency as possible and a small work function in order to enhance the light emission efficiency.

[0071] Preferably, the reflectance of the second upper electrode 13E is larger than the reflectance of the first upper electrode 13D. The reflectance of the second upper electrode 13E and the reflectance of the first upper electrode 13D are the reflectances of the second upper electrode 13E and the first upper electrode 13D in the state of the display device 10B. Also, from this viewpoint, as the material of the second upper electrode 13E, not only the same material as the first upper electrode 13D can be used, but also a reflective material can be used in addition. Examples of the reflective material include silver (Ag), aluminum (Al), tungsten (W), and the like.

[0072] (Separation film) In the display device 10B, a separation film 21 that covers the side end face 130 side of the light-emitting element 13 is formed as an element separation wall. The separation film 21 is disposed between adjacent light-emitting elements 13 and separates the lower electrode 13A, the organic layer 13B, and the first upper electrode 13D forming the light-emitting element 13 for each sub-pixel.

[0073] The upper end side portion of the separation film 21 extends in the direction from the light-emitting element 13 toward the protective layer 15 along the thickness direction (Z-axis direction) of the light-emitting element 13. Since the separation film 21 has a shape extending in the direction from the light-emitting element 13 toward the protective layer 15 (Z-axis direction) instead of in the plane direction (XY plane direction) of the light-emitting element 13, it becomes difficult for the separation film 21 to cover the light-emitting region of the light-emitting element, and a wider light-emitting region can be secured.

[0074] The separation film 21 is formed of an insulator. Examples of the separation film 21 include an inorganic insulating film and an organic insulating film. Examples of the inorganic insulating film include SiO2, SiN, SiON, etc. Examples of the organic insulating film include polyimide, etc.

[0075] From the viewpoint of facilitating the formation of a portion of the separation film 21 that extends upward beyond the first upper electrode 13D, it is preferable that the length of the separation film 21 in the vertical direction (Z-axis direction) is greater than the sum of the thickness of the lower electrode 13A, the thickness of the organic layer 13B, and the thickness of the first upper electrode 13D.

[0076] In the example of FIG. 4A, the lower end of the separation film 21 is located in the vicinity of the insulating layer 12 below the lower end of the lower electrode 13A, and the separation film 21 separates the lower electrode 13A for each sub-pixel. Note that the separation film 21 may be located at the lower end of the lower electrode 13A. The separation film 21 only needs to separate the lower electrode 13A for each sub-pixel.

[0077] In the example of FIG. 4A, the upper end of the separation film 21 is located slightly below the position of the surface of the protective layer 15, and in a state where the second upper electrode 13E is formed on the surface of the separation film 21, the position of the extending end portion of the second upper electrode 13E and the position of the surface of the protective layer 15 are aligned.

[0078] (Refractive index) It is preferable that the refractive index of the separation film 21 is smaller than the refractive index of the second upper electrode 13E. In this case, among the light generated by the light-emitting element 13, the light traveling obliquely can be totally reflected at the interface between the second upper electrode 13E and the separation film 21, and the light utilization efficiency can be improved. Note that the refractive index of the separation film 21 and the refractive index of the second upper electrode 13E are the refractive index of the separation film 21 and the refractive index of the second upper electrode 13E in the state of the display device 10B.

[0079] [2-2 Manufacturing method of display device] The manufacturing method of the display device according to the second embodiment can be implemented as described below, for example, with reference to FIGS. 9A to 9D and FIGS. 10A to 10D. FIGS. 9A to 9D and FIGS. 10A to 10D are diagrams for explaining the manufacturing method of the display device 10B according to the second embodiment.

[0080] Next, a step of forming a first laminate in which a lower electrode 13A, an organic layer 13B, a first upper electrode 13D, and a protective layer 15 are laminated in this order on a substrate 11 on which an insulating layer 12 is formed is implemented as follows.

[0081] For example, using thin film formation technology, photolithography technology, and etching technology, a drive circuit, a power supply circuit, etc. are formed on the first surface of the substrate 11. Next, for example, by a CVD method, after forming an insulating layer 12 on the first surface of the substrate 11 so as to cover the drive circuit and the power supply circuit, a plurality of contact plugs 12A are formed in the insulating layer 12.

[0082] For example, by a sputtering method, a laminated film (lower electrode) of a metal layer and a metal oxide layer is formed on the first surface of the substrate 11. Next, for example, by a vapor deposition method, a hole injection layer, a hole transport layer, a light emitting layer, and an electron transport layer are laminated in this order on the first surface of the first surface of the lower electrode 13A to form the organic layer 13B. Further, for example, by a vapor deposition method or a sputtering method, a first upper electrode 13D is formed on the first surface of the organic layer 13B. As a result, a plurality of light emitting elements 13 are formed on the substrate 11 (on the first surface of the insulating layer 12). Thereafter, for example, by a CVD method or a vapor deposition method, a protective layer 15 is formed on the first surface of the first upper electrode 13D. Thereby, as shown in FIG. 9A, a first laminate 40 is formed.

[0083] Next, in the first laminate 40, a step of forming a first groove to a predetermined depth from the protective layer 15 at a position predetermined according to the layout of the sub-pixels (first groove processing step) is performed as shown in FIG. 9B. The first groove processing step is a step of performing groove processing on the light-emitting element 13 and the protective layer 15 along the layout of the sub-pixels by, for example, photolithography technology and etching technology. In the display device of FIG. 4A, the first groove 22 is formed by performing groove processing on the protective layer 15, the first upper electrode 13D, the organic layer 13B, the lower electrode 13A, and the insulating layer 12 all at once.

[0084] Then, a step of forming a separation film 21 in the first groove 22 by a method such as CVD (Chemical Vapor Deposition) method or coating method is performed. At this time, a material for forming the separation film 21 is laminated also outside the first groove 22 such as on the surface of the protective layer 15, so that an outer laminated portion of the first groove 22 is formed as shown in FIG. 9C. However, the outer laminated portion of the first groove 22 is removed by a method such as CMP (chemical mechanical polishing) method or etch-back method. Thereby, as shown in FIG. 9D, a second laminate 41 is formed. In the CVD method, for example, an inorganic insulating film such as SiO2, SiN, or SiON can be formed. In the coating method, for example, an organic insulating film such as polyimide can be formed.

[0085] In the second laminate 41, a step of forming a second groove 23 from the protective layer 15 to the position of the first upper electrode 13D in a predetermined region around the separation film 21 (second groove processing step) is performed. The second groove processing step is a step of performing groove processing by, for example, photolithography technology and etching technology in the same manner as the above-described first groove as shown in FIGS. 10A and 10B. The depth of the second groove 23 is such that it reaches the first upper electrode 13D, and the first upper electrode 13D is exposed on the bottom surface of the second groove 23. Note that reference numeral 50 in FIG. 10A is a resist for forming the second groove 23.

[0086] Then, a step of forming the second upper electrode 13E in the second groove 23 is performed. At this time, a material for forming the second upper electrode is also laminated outside the second groove such as on the surface of the protective film, and as shown in FIG. 10C, an outer laminated portion of the second groove 23 is formed. Similar to the case of the outer laminated portion of the first groove, the outer laminated portion of the second groove is removed by a CMP method, an etch-back method, or the like. Thereby, as shown in FIG. 10D, the third laminate 42 is formed. Note that the outer laminated portion of the second groove 23 is left without being removed in the case of Modification 3 described later in the second embodiment.

[0087] After the second upper electrode 13E is formed, for example, by photolithography, a color filter 17 is formed on the first surface of the third laminate 42. Next, for example, using the ODF (One Drop Fill) method, after covering the color filter 17 with the filling resin layer 18, the counter substrate 19 is placed on the filling resin layer 18. Next, for example, heat is applied to the filling resin layer 18 or ultraviolet rays are irradiated to the filling resin layer 18 to cure the filling resin layer 18, whereby the substrate 11 and the counter substrate 19 are bonded together via the filling resin layer 18. Thereby, the display device 10B is sealed. As described above, the display device 10B is obtained.

[0088] [2-3 Effects] According to the display device according to the second embodiment, the lower electrode 13A, the organic layer 13B, and the first upper electrode 13D for forming the light-emitting element 13 are separated for each sub-pixel by the separation film 21. Thereby, unintended light emission due to current leakage at the peripheral portion of the sub-pixel can be suppressed. Further, as shown in FIG. 4B, since the periphery of the organic layer 13B is surrounded by the separation film 21 and separated for each sub-pixel, leakage of lateral light to adjacent sub-pixels can be suppressed. Further, since the separation film 21 extends in the vertical direction, compared with the case where an insulating film is formed so as to ride on the peripheral edge of the first electrode patterned for each sub-pixel and separated for each sub-pixel, the light-emitting region of the light-emitting element is more easily secured to be wider.

[0089] According to the display device according to the second embodiment, since the reflectance of the second upper electrode 13E is higher than that of the first upper electrode 13D, the light generated by the light-emitting element 13 is reflected by the second upper electrode 13E, and it is possible to suppress the light generated by the light-emitting element 13 from leaking to the adjacent sub-pixel side.

[0090] According to the display device according to the second embodiment, since the refractive index of the separation film 21 is smaller than that of the second upper electrode 13E, the light generated by the light-emitting element 13 is likely to be totally reflected at the interface between the second upper electrode 13E and the separation film 21, and it is possible to suppress the light generated by the light-emitting element 13 from leaking to the adjacent sub-pixel side (suppress light leakage between adjacent pixels).

[0091] And according to the display device according to the second embodiment, since the light generated by the light-emitting element 13 is suppressed from leaking to the adjacent sub-pixels in this way, color mixing can be suppressed, and deterioration of the viewing angle can be suppressed.

[0092] [2-4 Modification Example] (Modification Example 1) In the description of the above display device 10B, the shape of the sub-pixel is formed in a rectangular shape as shown in FIGS. 4B and 5A, and a plurality of sub-pixels are arranged separately from each other in a matrix. In the display device 10B according to the second embodiment, the shape of the sub-pixel is not limited to this, and may be a hexagonal shape or a stripe shape as shown in FIGS. 5B and 5C. Further, the arrangement of the sub-pixels is not limited to a matrix, and may be a honeycomb shape as shown in FIG. 5B. Even in such a case, similar to that described in the above operation and effect, unintended light emission due to current leakage is suppressed. Also, it is possible to suppress light from leaking to adjacent sub-pixels.

[0093] (Modification Example 2) Regarding the display device 10B according to the second embodiment, in the above, the case where the position of the extended end portion of the second upper electrode 13E and the position of the surface of the protective layer 15 are aligned with the second upper electrode 13E formed on the surface of the separation film 21 was taken as an example. The display device 10B according to the second embodiment is not limited to this example. As shown in FIG. 6A, the extended end portion of the second upper electrode 13E may be located further upward (+Z direction) beyond the position of the surface of the protective layer 15 and enter the color filter 17, or as shown in FIG. 6B, it may not reach the position of the surface of the protective layer 15.

[0094] (Modification Example 3) Regarding the display device 10B according to the second embodiment, in the above, the second upper electrode 13E is formed along the surface of the separation film 21 so as to cover the surface of the separation film 21. The display device 10B according to the second embodiment is not limited to this example. As shown in the example of FIG. 7, not only is the second upper electrode 13E formed along the surface of the separation film 21 up to the extended end of the separation film 21, but it may also extend along the surface of the protective layer 15 from the extended end of the separation film 21. The portion of the second upper electrode 13E that extends along the surface of the protective layer 15 is called the extended electrode portion 24. The extended electrode portion 24 preferably covers the entire surface of the protective layer 15. Also, in this case, from the viewpoint of allowing the light generated from the light-emitting element 13 to pass through the extended electrode portion 24 and be efficiently extracted to the outside, the second upper electrode 13E is preferably formed of a transparent electrode or a semi-transparent electrode.

[0095] When the second upper electrode 13E is formed of a semi-transparent electrode, the second upper electrode 13E has an extended electrode portion, and by adjusting the separation distance between the light-emitting surface of the organic layer 13B and the extended electrode portion 24, it is possible to improve the light extraction effect due to the light resonance effect, and it becomes possible to obtain a display device 10B with excellent luminance.

[0096] (Modification Example 4) The second upper electrode 13E was formed to cover the entire surface of the portion of the separation film 21 that extended upward from the first upper electrode 13D. However, the display device 10B according to the second embodiment is not limited to this example. As shown in FIGS. 8A and 8B, it may be formed to cover a part of the portion of the separation film 21 that extends upward from the first upper electrode.

[0097] For example, as shown in the example of FIG. 8A, the second upper electrode 13E may be formed to cover the portion of the portion of the separation film 21 that extends upward from the first upper electrode 13D and corresponds to the vertex portion of the adjacent sub-pixels. Also, as shown in the example of FIG. 8B, the second upper electrode 13E may be formed to cover the portion of the portion of the separation film 21 that extends upward from the first upper electrode 13D and corresponds to the side portion of the adjacent sub-pixels.

[0098] [3 Third Embodiment] In the display device 10B according to the second embodiment, a sidewall protection film may be interposed between the side end surface of the organic layer 13B and the separation film 21 (third embodiment).

[0099] Regarding the display device according to the third embodiment of the present disclosure, taking the case where the display device is an organic EL display device as an example similar to the second embodiment, it will be described below with reference to FIGS. 11 and the like. FIG. 11 is a cross-sectional view showing a configuration example of an organic EL display device (display device 10C) according to an example of the third embodiment.

[0100] [3-1 Configuration of the Display Device] The display device 10C has a sidewall protection film in addition to each configuration of the display device 10B according to the second embodiment. As shown in the example of FIG. 11, the display device 10C includes a substrate 11, an insulating layer 12, a plurality of light-emitting elements 13, a protective layer 15, a sidewall protection film 25, a separation film 21 as an element separation wall, a color filter 17, a filling resin layer 18, and a counter substrate 19.

[0101] (Sidewall Protection Film) The sidewall protective film 25 is interposed between the side end surface of the organic layer 13B and the separation film 21. As shown in FIG. 11, it is preferable that the sidewall protective film 25 covers the entire side end of the organic layer 13B while being in contact with the side end surface of the organic layer 13B.

[0102] The sidewall protective film 25 is an insulating film and is a process by-product film containing by-products (deposits) generated by etching. The sidewall protective film 25 assists in forming the separation film 21 while restricting the exposure of the organic layer 13B to the external environment. Here, the etching process refers to the processing by the etching method in the first groove processing step described in the manufacturing method of the display device 10C according to the third embodiment described later. As the etching process, either a dry etching method or a wet etching method can be implemented, but from the viewpoint of more reliably realizing the deposit, the etching process is preferably a dry etching method.

[0103] Although the sidewall protective film 25 shown in FIG. 11 is formed to have a uniform thickness, this is not limited to the case where the thickness of the sidewall protective film 25 is uniform. For example, as shown in FIG. 16A, the sidewall protective film 25 may be formed such that its thickness gradually decreases as it moves away from the vicinity of the auxiliary layer 26 described later.

[0104] (Auxiliary layer) From the viewpoint of more reliably and easily forming the deposit during the etching process, it is preferable that an auxiliary layer 26 is interposed between the lower electrode 13A and the substrate 11 or between the first upper electrode 13D and the protective layer 15. In the example of FIG. 11, the auxiliary layer 26 is formed between the lower electrode 13A and the substrate 11 below the lower electrode 13A. In the example of FIG. 11, a contact plug 12A is also formed in the auxiliary layer 26, and an electrical connection with the drive circuit on the substrate 11 side is ensured.

[0105] The auxiliary layer 26 is a deposition generation film formed of a material that is likely to cause deposition during etching. As a material that is likely to form a by-product (deposition) during etching and serves as the material of the auxiliary layer 26, for example, a difficult-to-etch material with lower volatility of a metal halogen compound and a stronger metal-oxygen bond is preferably used. Specifically, as the material of the auxiliary layer 26, it is preferable to use a transition metal oxide such as Al2O3. However, this does not limit the material of the auxiliary layer 26 to transition metal oxides. The material of the auxiliary layer 26 may be any material that can form an insulating film on the side end surface of the organic layer 13B.

[0106] When the auxiliary layer 26 is provided, the sidewall protective film 25 is formed so as to extend from the auxiliary layer 26 along the side end surface 130 of the light-emitting element 13 with the auxiliary layer 26 as the base end. And in this case, the sidewall protective film 25 contains at least one element that forms the auxiliary layer 26. And the film composition of the sidewall protective film 25 is different from the film composition of the separation film 21.

[0107] [3-2 Manufacturing Method of Display Device] The manufacturing method of the display device according to the third embodiment can be implemented as described below with reference to FIGS. 12A to 12D, for example.

[0108] As shown in FIG. 12A, an auxiliary layer 26, a lower electrode 13A, an organic layer 13B, a first upper electrode 13D, and a protective layer 15 are laminated in this order on a substrate 11 on which an insulating layer 12 is formed to form a first laminate 43. Further, as shown in FIG. 12B, a resist 51 is provided on the first laminate 43, and as shown in FIG. 12C, a first groove 27 is formed in the protective layer 15 at a predetermined position. Using the protective layer 15 having such a first groove 27 as a hard mask, etching of each layer for forming the light-emitting element 13 is performed (grooving step). During the grooving step, the first groove 27 is further formed downward, and the auxiliary layer 26 is also etched together with the lower electrode 13A, the organic layer 13B, and the first upper electrode 13D for forming the light-emitting element 13. During the etching of the auxiliary layer 26, deposition occurs and adheres to the side end surfaces of the lower electrode 13A, the organic layer 13B, and the first upper electrode 13D, forming a sidewall protective film 25 (FIG. 12D). In this way, a state is formed in which the sidewall protective film 25 is formed along the inner wall of the first groove 27.

[0109] After the grooving step, the same steps as those in the manufacturing method of the display device according to the second embodiment are performed. That is, a step of forming a separation film 21 in the first groove 27, a step of forming a second groove 23 from the protective layer 15 to the position of the first upper electrode 13D in a predetermined region around the separation film 21, and a step of forming a second upper electrode 13E in the second groove 23 are performed. After the second upper electrode 13E is formed, a color filter 17, a filling resin layer 18, and a counter substrate 19 are laminated. Thereby, a display device 10C according to the third embodiment is obtained.

[0110] [3-3 Effects] According to the display device according to the third embodiment, a sidewall protective film is formed so as to cover the side end surface of the organic layer. The sidewall protective film is a deposition-generated film formed during the etching process in the process (the first grooving process) before the formation of the separation film. Therefore, even when the separation film is formed after the first grooving process, the side end surface of the organic layer is suppressed from being exposed to the external environment (low vacuum environment), and the characteristics of the organic layer can be improved.

[0111] [3-4 Modifications] (Modification Example 1) In the examples of FIGS. 12A to 12D, a display device is shown in which the auxiliary layer 26 does not remain inside the first groove 27 during the groove processing step. That is, in the display device 10C shown in FIG. 11 obtained in this case, the sidewall protective film 25 is not provided on the lower end surface of the separation film 21. The display device according to the third embodiment is not limited to this, and as shown in FIG. 14A, the sidewall protective film 25 may be provided on the lower end surface of the separation film 21. This can be realized by leaving the auxiliary layer 26 in the first groove 27 during the first groove processing step.

[0112] (Modification Example 2) In the example of FIG. 11, the case where the auxiliary layer 26 is formed on one surface below the lower electrode 13A has been described. However, as shown in the example of FIG. 13A, the auxiliary layer 26 may be formed limited to a predetermined region between sub-pixels. In the example of FIG. 13A, the auxiliary layer 26 is formed at a position corresponding to the side end surface 130 of the light-emitting element 13 when the thickness direction of the light-emitting element 13 is the line-of-sight direction, and at a position below the lower electrode 13A. Further, the sidewall protective film 25 extends upward from the auxiliary layer 26.

[0113] (Modification Example 3) In the example of FIG. 11, the case where the auxiliary layer 26 is formed below the lower electrode 13A has been described. However, as shown in the example of FIG. 13B, the auxiliary layer 26 may be formed at the same position as the lower electrode 13A in the vertical direction. In this case, in the example of FIG. 13B, the side end surface of the lower electrode 13A faces the end surface of the auxiliary layer 26, the sidewall protective film 25 extends upward from the edge portion of the auxiliary layer 26, and the side end surface of the organic layer 13B is covered with the sidewall protective film 25.

[0114] (Modification Example 4) In the display device 10C according to the third embodiment, as shown in FIG. 14B, the auxiliary layer 26 may be interposed between the first upper electrode 13D and the protective layer 15.

[0115] Such a display device 10C can be manufactured, for example, as follows.

[0116] First, in the same manner as the manufacturing method of the display device according to the second embodiment, a lower electrode 13A, an organic layer 13B, and a first upper electrode 13D are formed on the surface of the substrate 11. Next, an auxiliary layer 26 is formed on the first upper electrode 13D (FIG. 15A). Further, a resist 52 is provided on the auxiliary layer 26 (FIG. 15B), and using photolithography technology and etching technology, a first groove 27 is formed at a predetermined position in the auxiliary layer 26 corresponding to the pixel layout such as sub-pixels. At this time, deposits are attached to the inner wall portion of the first groove 27 (FIG. 15C). Using the auxiliary layer 26 having the first groove 27 formed therein as a hard mask, a groove processing step using photolithography technology, etching technology, and the like is performed. In this groove processing step, the lower electrode 13A, the organic layer 13B, and the first upper electrode 13D forming the light-emitting element 13 are etched, and the first groove 27 is further formed downward. As the depth of the first groove 27 increases, the deposits derived from the auxiliary layer 26 also adhere to the respective side end faces of the lower electrode 13A, the organic layer 13B, and the first upper electrode 13D, and a sidewall protection film 25 is formed (FIG. 15D). In this way, a state in which the sidewall protection film 25 is formed in the first groove 27 is formed.

[0117] Next, a separation film 21 is formed inside the first groove 27 by a method such as CVD method or coating method. When the material for forming the separation film is laminated outside the first groove 27, the material laminated outside the first groove 27 is removed by CMP method or etch-back method.

[0118] Furthermore, a protective layer 15 is formed on one surface side of the auxiliary layer 26. A step of forming a groove in the protective layer 15 is performed at a position corresponding to the first groove 27 with respect to the protective layer 15. Then, a separation film 21 is formed inside the groove formed in the protective layer 15 by a method such as a CVD method or a coating method. As a result, the separation film 21 is formed from the surface position of the protective layer 15 to the position of the lower electrode 13A along the thickness direction of the light-emitting element 13. Thereafter, a display device can be obtained in the same manner as the manufacturing method of the display device according to the second embodiment described above. That is, a step of forming a second groove 23 from the protective layer 15 to the position of the first upper electrode 13D in a predetermined region around the separation film 21 and a step of forming a second upper electrode 13E in the second groove 23 are performed. After the second upper electrode 13E is formed, a color filter 17, a filling resin layer 18, and a counter substrate 19 are laminated. Thereby, the display device 10C is obtained.

[0119] Note that the sidewall protective film 25 shown in FIG. 14B is formed so as to have a uniform thickness, but this is not limited to the case where the sidewall protective film 25 has a uniform thickness. For example, as shown in FIG. 16B, the sidewall protective film 25 may be formed so that its thickness gradually decreases as it moves away from the vicinity of the auxiliary layer 26 described later.

[0120] [4 Fourth Embodiment] Regarding the display device according to the fourth embodiment of the present disclosure, a case where the display device is an organic EL display device as in the first embodiment will be described below as an example.

[0121] [4-1 Configuration of Display Device] FIG. 17A and FIG. 17B are cross-sectional views showing a configuration example of an organic EL display device (display device 10D) according to an example of the fourth embodiment. The display device 10D is a top emission type display device. The display device 10D includes a substrate 11, an insulating layer 12, a plurality of light-emitting elements 13, a protective layer 15, a light absorption layer 28, and a color filter 17. In the example of the display device according to the fourth embodiment shown in FIG. 17, for convenience of explanation, the description of the insulating layer corresponding to the insulating layer 14 in the first embodiment is omitted. This also applies to FIGS. 18A, 18B, 19A, 19B, 20, 21A, 21B, 23A, 23B, 23B, 24A, and 24B. As shown in FIG. 18B, when the light absorption layer 28 separates adjacent light-emitting elements 13, the insulating layer corresponding to the insulating layer 14 may be omitted in the same manner as the insulating layer 14 in the first embodiment.

[0122] The substrate 11, the insulating layer 12, the protective layer 15 serving as an upper surface protective layer, and the color filter 17 are the same as those in the first embodiment. As described in the first embodiment, a plurality of color filters 17 are provided according to the types of sub-pixels. In the following description of an example of the display device according to the fourth embodiment, as shown in FIG. 17 and the like, the case where the display device 10D includes a red filter 17R, a green filter 17G, and a blue filter 17B as the color filter 17 will be described. The red filter 17R, the green filter 17G, and the blue filter 17B are respectively provided opposite to the light-emitting elements 13 for red sub-pixels, the light-emitting elements 13 for green sub-pixels, and the light-emitting elements 13 for blue sub-pixels. In a plan view of the display device 10D (in a plan view of the light-emitting elements), the gaps or boundaries between adjacent color filters 17 are located in the gaps between adjacent light-emitting elements 13.

[0123] (Light absorption layer) As shown in FIG. 17B, the light absorption layer 28 is formed at the position of the gap or boundary between adjacent color filters 17 in a plan view of the display device 10D (in a plan view of the light-emitting element 13). FIG. 17B is a diagram for explaining the positional relationship between the color filter 17 and the light absorption layer 28. Further, the light absorption layer 28 is formed at a position between the color filter 17 and the lower electrode 13A in the thickness direction of the light-emitting element 13. The light absorption layer 28 has a shape extending in the direction from the color filter 17 toward the substrate 11 (downward), and the length H in the direction along the depth direction of the color filter 17 is longer than the width length W (width W) in the direction along the in-plane direction (XY plane direction) of the color filter 17 (H>W).

[0124] In the example of FIG. 17A, the lower end of the light absorption layer 28 is located above the light-emitting element 13. In this case, it is possible to suppress the incident light L of the obliquely incident external light from propagating across the sub-pixels.

[0125] As the light absorption layer 28, a black color filter, a complementary color filter, a non-adjacent color filter, an absorption film, or the like can be used. Examples of the black color filter include color filters using carbon, titanium black, or the like as a coloring material. Examples of the complementary color filter include color filters using a coloring material of a complementary color to the color of the color filter that is the base end of the light absorption layer 28. Examples of the non-adjacent color filter include color filters corresponding to color types other than the color types of the adjacent color filters that are the base end of the light absorption layer 28 when the color types of the adjacent color filters are different. Specifically, for example, when the color filter 17 includes a red filter 17R, a green filter 17G, and a blue filter 17B, and the light absorption layer 28 is located at the boundary between the green filter 17G and the red filter 17R, a blue filter 17B may be used as the light absorption layer 28.

[0126] Examples of the absorption film include an organic material film and an inorganic material film. As the organic material film, a resin film containing a black pigment (e.g., carbon black) is preferable. As the inorganic material film, a metal oxide film, a single metal film, etc. are preferable, and from the viewpoint of excellent light absorption, a metal oxide film is particularly preferable.

[0127] [4-2 Manufacturing method of display device] The manufacturing method of the display device according to the fourth embodiment can be implemented as described below, for example. Note that the case of manufacturing the display device shown in FIGS. 17A and 17B will be described as an example.

[0128] First, in the same manner as the manufacturing method of the display device according to the first embodiment, an insulating layer 12, a lower electrode 13A, an organic layer 13B, an upper electrode 13C, and a protective layer 15 are laminated on the first surface of a substrate 11 on which the insulating layer 12 is formed to form a first laminate 44 (FIG. 23A). When an insulating layer for separating the lower electrode 13A for each sub-pixel is provided, that insulating layer is also formed.

[0129] Next, the first laminate 44 is grooved, for example, by photolithography and etching techniques along the layout of the sub-pixels to form grooves 29 with a predetermined depth (FIG. 23B). In the example shown in FIG. 23B, the grooves 29 are formed to a depth up to a predetermined position within the protective layer 15.

[0130] Then, a step of forming a light absorption layer 28 in the grooves 29 is carried out by a method such as CVD method or coating method.

[0131] After the light absorption layer 28 is formed, a color filter 17 is formed on the surface side of the protective layer 15 by, for example, photolithography (FIG. 24A). For this reason, the color filter 17 is an on-chip type. A lens 30 may be formed on the surface of the color filter 17 (FIG. 24B). The lens 30 can be formed by applying an on-chip microlens (OCL) forming method using a melting method, an etch-back method, or the like. As described above, the display device 10D shown in FIGS. 17A and 17B is obtained.

[0132] [4-3 Effects] In the display device, external light may enter obliquely, be reflected by the lower electrode to form reflected light, and the reflected light may be output to the outside. In this case, if the incident light or reflected light of the obliquely incident external light propagates across sub-pixels and the sub-pixels passed through at the time of incidence are different from the sub-pixels passed through after reflection by the electrode layer, color mixing or mixing of light may occur in the sub-pixels through which the incident light or reflected light passes, resulting in a decrease in the contrast of the display device.

[0133] In this regard, according to the display device 10D according to the fourth embodiment, as shown in FIG. 17A, since the light absorption layer 28 extends from the color filter 17 toward the protective layer 15 side, the incident light L of the obliquely incident external light is absorbed by the light absorption layer 28, and light leakage to adjacent sub-pixels can be suppressed. Therefore, it becomes difficult for the incident light or reflected light of the obliquely incident external light to propagate across sub-pixels, and a display device with excellent contrast can be obtained.

[0134] Further, according to the display device according to the fourth embodiment, regarding the light U from the light-emitting element, light leakage to adjacent sub-pixels can also be suppressed in the same manner as the incident light L of the obliquely incident external light, and color mixing or mixing of light between sub-pixels can be suppressed.

[0135] [4-4 Modifications] (Modification 1) The vertical length of the light absorption layer 28 is not limited to the example of FIG. 17A. As shown in FIG. 18B, the light absorption layer 28 may extend from the boundary position between adjacent color filters 17 to between adjacent light-emitting elements 13. Also, in that case, the tip of the light absorption layer 28 may enter up to the insulating layer 12. In the example of FIG. 18B, since the light absorption layer 28 separates adjacent light-emitting elements 13, it can function as an inter-element separation wall.

[0136] (Modification 2) The light absorption layer 28 is not limited to the example of FIG. 17A. For example, as shown in FIG. 18A, it may be formed such that the upper end of the light absorption layer 28 enters the inside of the color filter 17. In this case, since the light absorption layer 28 extends into the color filter 17, leakage of light from the light emitting element 13 to adjacent sub-pixels at the position of the color filter 17 is suppressed, and color mixing and mixing of light can be suppressed.

[0137] (Modification Example 3) As shown in FIG. 19B, an adhesion layer 31 may be formed on the surface of the light absorption layer 28. Further, as shown in FIG. 20, the adhesion layer 31 may be formed between the protective layer 15 and the color filter 17. Furthermore, as shown in FIG. 19A, the adhesion layer 31 may be formed between the protective layer 15 and the color filter 17 and on the surface of the light absorption layer 28.

[0138] Examples of the adhesion layer 31 can include organic resins and the like. Examples of the organic resin can include acrylic resins and the like. By forming the adhesion layer 31 in the display device according to the fourth embodiment, incident light and reflected light of external light incident obliquely can also be absorbed by the adhesion layer 31, and the amount of light propagating across sub-pixels can be reduced.

[0139] (Modification Example 4) Regarding the width W of the light absorption layer 28 formed at different positions when the thickness direction of the color filter 17 is the line-of-sight direction, at least one set of combinations of light absorption layers 28 with different widths W may exist. For example, regarding the combination of adjacent light absorption layers 28 as shown in FIG. 21A, the width W of the light absorption layer 28 may be different. By diversifying the width of the light absorption layer 28, the absorption efficiency of incident light and reflected light of external light incident obliquely can be set to a value corresponding to the sub-pixels.

[0140] (Modification Example 5) Regarding the length H of the light absorption layer 28 formed at different positions when the thickness direction of the color filter 17 is the line-of-sight direction, there may be at least one combination of light absorption layers 28 with different lengths. For example, regarding the combination of adjacent light absorption layers 28 as shown in FIG. 21B, the lengths of the light absorption layers 28 may be different. By diversifying the lengths of the light absorption layers 28, the absorption efficiency of incident light and reflected light of obliquely incident external light can be set to values corresponding to sub-pixels.

[0141] (Modification Example 6) Regarding the arrangement region of the light absorption layer when the thickness direction of the color filter 17 is the line-of-sight direction, in the example of FIG. 17B, the light absorption layer 28 was arranged in the region between adjacent color filters 17 or over the entire boundary of adjacent color filters 17. The display device according to the fourth embodiment is not limited to this, and as shown in FIGS. 22A, 22B, and 22C, the light absorption layer 28 may be arranged in the region between adjacent color filters 17 or in a part of the boundary of adjacent color filters 17. FIGS. 22A, 22B, and 22C are diagrams for explaining the positional relationship between the color filter 17 and the light absorption layer 28. FIG. 22A shows an example in which a light absorption layer is arranged between color filters 17 adjacent in the X direction (between the blue filter 17B and the green filter 17G, and between the red filter 17R and the blue filter 17B). FIG. 22B shows an example in which a light absorption layer is arranged between color filters 17 adjacent in the Y direction (between the red filter 17R and the blue filter 17B, and between the blue filter 17B and the green filter 17G). FIG. 22C shows an example in which the light absorption layer 28 is arranged in an area that is half of the area where the light absorption layer 28 is arranged in FIG. 22A.

[0142] Next, as an application example of the display device, an example of an electronic device using the display device according to any one of the first to fourth embodiments will be described.

[0143] [5 Application Example] (Electronic Device) The display devices 10A, 10B, 10C, and 10D according to the above-described embodiments may be provided in various electronic devices. In particular, it is preferably provided in those that require high resolution, such as an electronic viewfinder of a video camera or a single-lens reflex camera, or a head-mounted display, and are used by being enlarged near the eyes.

[0144] (Specific Example 1) FIG. 25A is a front view showing an example of the appearance of a digital still camera 310. FIG. 25B is a rear view showing an example of the appearance of the digital still camera 310. This digital still camera 310 is of a lens-exchangeable single-lens reflex type, and has an exchangeable photographing lens unit (exchange lens) 312 at substantially the center of the front of the camera body portion (camera body) 311, and a grip portion 313 for the photographer to hold on the left side of the front.

[0145] A monitor 314 is provided at a position shifted from the center to the left side on the back of the camera body portion 311. An electronic viewfinder (eyepiece window) 315 is provided above the monitor 314. The photographer can view the optical image of the subject guided from the photographing lens unit 312 through the electronic viewfinder 315 and determine the composition. As the electronic viewfinder 315, any one of the display devices 10A, 10B, 10C, and 10D according to the first to fourth embodiments and the modified examples described above can be used.

[0146] (Specific Example 2) FIG. 26 is a perspective view showing an example of the appearance of a head-mounted display 320. The head-mounted display 320 has, for example, ear-hanging portions 322 for mounting on the user's head on both sides of a glasses-shaped display portion 321. As the display portion 321, any one of the display devices 10A, 10B, 10C, and 10D according to the first to fourth embodiments and the modified examples described above can be used.

[0147] (Specific Example 3) FIG. 27 is a perspective view showing an example of the appearance of the television apparatus 330. This television apparatus 330 has a video display screen portion 331 including, for example, a front panel 332 and a filter glass 333, and this video display screen portion 331 is configured by any one of the display devices 10A, 10B, 10C, and 10D according to the above-described first to fourth embodiments and modified examples.

[0148] As described above, the first to fourth embodiments of the present disclosure and their modified examples have been specifically described. However, the present disclosure is not limited to the above-described first to fourth embodiments and their modified examples, and various modifications based on the technical idea of the present disclosure are possible.

[0149] For example, the configurations, methods, steps, shapes, materials, numerical values, etc. cited in the above-described first to fourth embodiments and their modified examples are merely examples, and different configurations, methods, steps, shapes, materials, numerical values, etc. may be used as necessary.

[0150] The configurations, methods, steps, shapes, materials, numerical values, etc. of the above-described first to fourth embodiments and their modified examples can be combined with each other as long as they do not deviate from the gist of the present disclosure.

[0151] The materials exemplified in the above-described first to fourth embodiments and their modified examples can be used alone or in combination of two or more without particular notice.

[0152] Further, the present disclosure can also adopt the following configuration. (1) A plurality of light-emitting elements in which a lower electrode, an organic layer, and an upper electrode are laminated in this order on a substrate, An upper surface protective layer laminated on the upper surface side of the light-emitting element and covering the upper electrode, An inter-element separation wall disposed between adjacent light-emitting elements and covering the side end face side of the light-emitting element, Comprising The inter-element separation wall extends in a direction from the light-emitting element toward the upper surface protective layer along the thickness direction of the light-emitting element. A display device. (2) A low refractive index portion having a refractive index value lower than that of the element isolation wall is formed within the element isolation wall. The display device according to (1) above. (3) An insulating layer including a plurality of wirings is provided between the substrate and the plurality of light emitting elements. The plurality of wirings are arranged adjacent to each other in the in-plane direction of the substrate. The lower end of the low refractive index portion is located between adjacent ones of the wirings or below adjacent ones of the wirings. The upper end of the low refractive index portion is located above the interface between the light emitting element and the upper surface protective layer. The display device according to (2) above. (4) The element isolation wall is formed from a material having a step coverage value of less than 1. The display device according to (2) or (3) above. (5) The element isolation wall has a refractive index value lower than that of the upper surface protective layer. The display device according to any one of (2) to (4) above. (6) The cross-sectional shape of the low refractive index portion is polygonal. The display device according to any one of (2) to (5) above. (7) The low refractive index portion has a bottom surface portion and side wall portions rising from the bottom surface portion. The taper angle formed between the bottom surface portion and the side wall portions is 90° or less. The display device according to any one of (2) to (6) above. (8) The upper electrode is a first upper electrode separated from each other facing the organic layer. A second upper electrode connecting between adjacent ones of the first upper electrodes is provided. The second upper electrode is arranged along the surface of the element isolation wall. The display device according to (1) above. (9) The element isolation wall extends upward beyond the first upper electrode. The display device according to (8) above. (10) The second upper electrode extends from the facing position between the first upper electrode and the element isolation wall to the extending end of the element isolation wall, and extends along the surface of the upper surface protection layer from the extending end of the element isolation wall. The display device according to (9) above. (11) The lower end of the element isolation wall is located at the lower end of the lower electrode or below the lower electrode. The display device according to any one of (8) to (10) above. (12) The length of the element isolation wall along the thickness direction of the light-emitting element is thicker than the sum of the thickness of the lower electrode, the thickness of the organic layer, and the thickness of the first upper electrode. The display device according to any one of (8) to (11) above. (13) The reflectivity of the second upper electrode is greater than the reflectivity of the first upper electrode. The display device according to any one of (8) to (12) above. (14) The refractive index of the element isolation wall is smaller than the refractive index of the second upper electrode. The display device according to any one of (8) to (13) above. (15) A sidewall protection film is interposed between the side end surface of the organic layer and the element isolation wall. The display device according to any one of (8) to (14) above. (16) The sidewall protection film contains by-products generated by etching. The display device according to (15) above. (17) An auxiliary layer is interposed between the lower electrode and the substrate or between the upper electrode and the upper surface protection layer. The sidewall protection film extends from the auxiliary layer as a base end. The sidewall protection film contains at least one element forming the auxiliary layer. The display device according to (15) or (16) above. (18) A plurality of light-emitting elements in which a lower electrode, an organic layer, and an upper electrode are laminated on a substrate in this order are provided. On the upper surface side of the light-emitting element, an upper surface protection layer covering the upper electrode is laminated. An element separation wall is formed in at least one of the spaces between adjacent light-emitting elements and between adjacent upper surface protective layers. A low refractive index portion is formed in the element separation wall. Display device. (19) A plurality of light-emitting elements in which a lower electrode, an organic layer, and a first upper electrode are laminated on a substrate in this order are provided in a separated state for each sub-pixel. An element separation wall covering the side end face side of the light-emitting element is formed between adjacent light-emitting elements. The element separation wall extends upward from the first upper electrode in a direction from the light-emitting element toward the upper surface protective layer along the thickness direction of the light-emitting element. A second upper electrode connecting adjacent first upper electrodes is formed along the surface of the element separation wall. Display device. (20) The surface of the portion of the element separation wall that extends upward from the first upper electrode is covered with the second upper electrode. The display device according to (19) above. (21) A side wall protective film is interposed between the side end face of the organic layer and the element separation wall. The display device according to (19) or (20) above. (22) A plurality of light-emitting elements in which a lower electrode, an organic layer, and an upper electrode are laminated on a substrate in this order are provided. Each of the light-emitting elements has a color filter on the upper surface side. A light absorption layer is provided between the color filter and the lower electrode. In the light absorption layer, the length of the light absorption layer in the direction along the thickness direction of the color filter is longer than the width of the light absorption layer in the direction along the in-plane direction of the color filter. Display device. (23) The light absorption layer is a black color filter. The display device according to (22) above. (24) The light absorption layer is a complementary color filter corresponding to the complementary color of the color filter located at the base end of the light absorption layer. The display device according to (22) or (23) above. (25) The light absorption layer is a non - adjacent color filter corresponding to a color different from the color filter located at the proximal end of the light absorption layer. The display device according to the above (22) or (23). (26) The light absorption layer is an inorganic material film. The display device according to the above (22) or (23). (27) A part of the light absorption layer penetrates into the color filter. The display device according to any one of the above (22) to (26). (28) At least one of the light absorption layer and the color filter is provided with an adhesion layer formed of a resin material. The display device according to any one of the above (22) to (27). (29) When comparing the widths of the light absorption layers formed at different positions with the thickness direction of the color filter as the line - of - sight direction, there is at least one set of combinations of light absorption layers with different widths. The display device according to any one of the above (22) to (28). (30) When comparing the lengths of the light absorption layers formed at different positions with the thickness direction of the color filter as the line - of - sight direction, there is at least one set of combinations of light absorption layers with different lengths. The display device according to any one of the above (22) to (29). (31) An electronic device including the display device according to any one of the above (1) to (30). (32) A step of forming a first laminate by laminating a lower electrode, an organic layer, a first upper electrode, and an upper surface protection layer on a substrate in this order; A step of forming a first groove to a predetermined depth from the upper surface protection layer at a predetermined position in the first laminate; A step of forming a second laminate by forming an inter - element separation wall in the first groove; A step of forming a second groove from the upper surface protection layer to the position of the first upper electrode in a predetermined region around the inter - element separation wall in the second laminate; A step of forming a second upper electrode in the second groove. Method for manufacturing a display device (33) A step of forming a first laminate provided on a substrate with a laminate in which a lower electrode, an organic layer, a first upper electrode, and an upper surface protective layer are laminated in this order, and an auxiliary layer; A step of forming a first groove to a predetermined depth by etching at a predetermined position in the first laminate, and forming a sidewall protective film having the auxiliary layer as a base end along the inner wall of the first groove along with the etching process; A step of forming a second laminate by forming an element isolation wall in the first groove; A step of forming a second groove from the upper surface protective layer to the position of the first upper electrode in a predetermined region around the element isolation wall in the second laminate; And a step of forming a second upper electrode in the second groove. Method for manufacturing a display device

Explanation of reference numerals

[0153] 10A, 10B, 10C, 10D Display device 11 Substrate 12 Insulating layer 13A Lower electrode 13B Organic layer 13C Upper electrode 13D First upper electrode 13E Second upper electrode 14 Insulating layer 15 Protective layer 16 Protective layer 16A First protection part 16B Second protection part 17 Color filter 18 Filling resin layer 19 Counter substrate 20 Void part 21 Separation film 25 Sidewall protective film 28 Light absorption layer 310 Digital still camera (electronic device) 320 Head-mounted display (electronic device) 330 Television device (electronic device)

Claims

1. A plurality of light-emitting elements in which a lower electrode, an organic layer, and an upper electrode are laminated in this order on a substrate, An upper surface protection layer laminated on the upper surface side of the light-emitting element and covering the upper electrode, An inter-element separation wall disposed between adjacent light-emitting elements and covering the side end face side of the light-emitting element, Comprising, The inter-element separation wall extends in a direction from the light-emitting element toward the upper surface protection layer along the thickness direction of the light-emitting element, The upper electrode is a first upper electrode separated from each other facing the organic layer, A second upper electrode connecting between adjacent first upper electrodes is provided, The second upper electrode is disposed along the surface of the inter-element separation wall, The reflectance of the second upper electrode is larger than the reflectance of the first upper electrode, A display device.

2. A plurality of light-emitting elements in which a lower electrode, an organic layer, and an upper electrode are laminated in this order on a substrate, An upper surface protection layer laminated on the upper surface side of the light-emitting element and covering the upper electrode, An inter-element separation wall disposed between adjacent light-emitting elements and covering the side end face side of the light-emitting element, Comprising, The inter-element separation wall extends in a direction from the light-emitting element toward the upper surface protection layer along the thickness direction of the light-emitting element, The upper electrode is a first upper electrode separated from each other facing the organic layer, A second upper electrode connecting between adjacent first upper electrodes is provided, The second upper electrode is disposed along the surface of the inter-element separation wall, A side wall protection film is interposed between the side end face of the organic layer and the inter-element separation wall, A display device.

3. A low refractive index portion having a refractive index value lower than that of the inter-element separation wall is formed in the inter-element separation wall, The display device according to claim 1 or 2.

4. An insulating layer including a plurality of wirings is provided between the substrate and the plurality of light-emitting elements, The plurality of wirings are disposed adjacent to each other in the in-plane direction of the substrate, The lower end of the low refractive index portion is located between adjacent wirings or below adjacent wirings, The upper end of the low refractive index portion is located above the interface between the light-emitting element and the upper surface protection layer, The display device according to claim 3.

5. The inter-element separation wall is formed of a material having a step coverage value of less than 1, The display device according to claim 3.

6. The inter-element separation wall has a refractive index value lower than that of the upper surface protection layer, The display device according to claim 3.

7. The cross-sectional shape of the low refractive index portion is a polygon, The display device according to claim 3.

8. The low refractive index portion has a bottom surface portion and a side wall portion rising from the bottom surface portion, wherein a taper angle formed by the bottom surface portion and the side wall portion is 90° or less, The display device according to claim 3.

9. The element separation wall extends upward from above the first upper electrode, The display device according to claim 1 or 2.

10. The second upper electrode extends from the facing position of the first upper electrode and the element separation wall to the extending end of the element separation wall, and extends along the surface of the upper surface protection layer from the extending end of the element separation wall, The display device according to claim 9.

11. The lower end of the element separation wall is located at the lower end of the lower electrode or below the lower electrode, The display device according to claim 1 or 2.

12. The length of the element separation wall along the thickness direction of the light emitting element is thicker than the sum of the thickness of the lower electrode, the thickness of the organic layer, and the thickness of the first upper electrode, The display device according to claim 1 or 2.

13. The refractive index of the element separation wall is smaller than the refractive index of the second upper electrode, The display device according to claim 1 or 2.

14. The side wall protective film contains by-products generated by etching, The display device according to claim 2.

15. An auxiliary layer is interposed between the lower electrode and the substrate or between the upper electrode and the upper surface protective layer, The side wall protective film extends from the auxiliary layer as a base end, The side wall protective film contains at least one element forming the auxiliary layer, The display device according to claim 2.

16. An electronic device comprising the display device according to claim 1 or 2, Electronic device.

17. A step of forming a first laminate in which a lower electrode, an organic layer, a first upper electrode, and an upper surface protective layer are laminated in this order on a substrate, A step of forming a first groove to a predetermined depth from the upper surface protective layer at a predetermined position in the first laminate, A step of forming an element separation wall in the first groove to form a second laminate, A step of forming a second groove from the upper surface protective layer to the position of the first upper electrode in a predetermined region around the element separation wall in the second laminate, A step of forming a second upper electrode in the second groove, A method for manufacturing a display device.

18. A step of forming a first laminate provided with a laminate in which a lower electrode, an organic layer, a first upper electrode, and an upper surface protective layer are laminated in this order and an auxiliary layer on a substrate, In the first laminate, a first groove is formed to a predetermined depth by etching at a position determined according to the pattern of pixels, and a sidewall protective film having the auxiliary layer as a base end is formed along the inner wall of the first groove as the etching progresses; forming a second laminate by forming an element isolation wall in the first groove; forming a second groove from the upper surface protective layer to the position of the first upper electrode in a predetermined region around the element isolation wall in the second laminate; forming a second upper electrode in the second groove; A method for manufacturing a display device.

Images