Information Processing Apparatus, Transfer Position Teaching Method, and Substrate Processing Apparatus

Abstract

To provide a technology with which it is possible to automatize teaching of a movement operation to a conveyance device that conveys the substrate to be processed.SOLUTION: There is provided, an information processing device for teaching a substrate transfer position to a conveyance device of a substrate processing device that conveys a substrate between a conveyance source object and a conveyance destination object on which a substrate can be mounted. The information processing device comprises: means for acquiring, from an imaging device, image data of mounting positions of the conveyance source and conveyance destination objects; means for quantifying a positional relation of the conveyance source object, the conveyance device and the substrate, on the basis of image data in which the movement operation of the conveyance device that acquires the substrate to be processed is filmed; means for quantifying a positional relation of the conveyance destination object, the conveyance device and the substrate, on the basis of image data in which the movement operation of the conveyance device that mounts a substrate is filmed; means for outputting correction data for the movement operation of the conveyance device that acquires a substrate from the conveyance source object on the basis of the quantified positional relation; and means for outputting correction data for the movement operation of the conveyance device that mounts a substrate on the conveyance destination device on the basis of the quatified positional relation.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present disclosure relates to an information processing apparatus, a transfer position teaching method, and a substrate processing apparatus.

Background Art

[0002] There is known a vertical heat treatment apparatus that has a vertically long heat treatment furnace, accommodates a plurality of wafers placed on a wafer boat in the heat treatment furnace, and performs a heat treatment for heating the wafers. In this vertical heat treatment apparatus, a wafer transfer device having a plurality of forks simultaneously transfers a plurality of wafers stored in a carrier to the wafer boat at the same time (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a technique capable of automating teaching of a movement operation for a transfer device that transfers a substrate to be processed.

Means for Solving the Problems

[0005] One aspect of the present disclosure is between a transfer source object and a transfer destination object on which a substrate to be processed can be placed A plurality of the substrate to be processed By the moving operations of a plurality of forksAn information processing device that teaches the transfer position of a substrate to be processed to a transfer device of a substrate processing device that transfers the substrate, the image data acquisition means being installed so as to be able to photograph the placement positions of the substrate to be processed on the transfer source object and the transfer destination object, and acquiring the image data of the placement positions of the transfer source object and the transfer destination object from the imaging device, and based on the image data obtained by photographing the movement operation of the transfer device that acquires the substrate to be processed from the placement position of the transfer source object, the first image processing means for quantifying the positional relationship between the transfer source object, the transfer device, and the substrate to be processed, and based on the image data obtained by photographing the movement operation of the transfer device that places the substrate to be processed on the placement position of the transfer destination object, the second image processing means for quantifying the positional relationship between the transfer destination object, the transfer device, and the substrate to be processed, and the first transfer teaching means for outputting correction data for the movement operation of the transfer device that acquires the substrate to be processed from the transfer source object based on the quantified placement position of the transfer source object, the transfer device, and the positional relationship of the substrate to be processed, and the second transfer teaching means for outputting correction data for the movement operation of the transfer device that places the substrate to be processed on the transfer destination object based on the quantified placement position of the transfer destination object, the transfer device, and the positional relationship of the substrate to be processed, and having wherein the object at the transfer source and the object at the transfer destination are boats that support a plurality of the substrates to be processed conveyed by the transfer device in a horizontal state at a predetermined interval in the vertical direction. Do.

Effect of the Invention

[0006] According to the present disclosure, the teaching of the movement operation for the transfer device that transfers the substrate to be processed can be automated.

Brief Description of the Drawings

[0007]

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Mode for Carrying Out the Invention

[0008] Hereinafter, embodiments which are non-limiting examples of the present disclosure will be described with reference to the accompanying drawings. In the accompanying drawings, the same or corresponding members or components are denoted by the same or corresponding reference numerals, and redundant descriptions are omitted as appropriate. Further, in this embodiment, a heat treatment apparatus which is an example of a substrate processing apparatus will be described as an example, but the present invention is not limited to the heat treatment apparatus.

[0009] [First Embodiment] FIG. 1 is a longitudinal sectional view of an example schematically showing a substrate processing system according to the present embodiment. FIG. 2 is a perspective view of an example schematically showing a loading area. As shown in FIG. 1, the substrate processing system includes a heat treatment apparatus 10 and a control apparatus 100. Note that the control apparatus 100 may be provided inside the housing of the heat treatment apparatus 10 as a part of the configuration of the heat treatment apparatus 10, or may be provided outside the housing of the heat treatment apparatus 10 separately from the configuration of the heat treatment apparatus 10. For example, the control apparatus 100 may be realized by using a server apparatus connected to be capable of data communication via a network, a cloud service available via a network, or the like.

[0010] The heat treatment apparatus 10 includes a vertical heat treatment furnace 60, which will be described later, and holds and accommodates a plurality of wafers W at predetermined intervals along the vertical direction in a boat, and can perform various heat treatments such as oxidation, diffusion, and reduced pressure CVD on the wafer W. Hereinafter, an example applied to the heat treatment apparatus 10 that oxidizes the surface of the wafer W by supplying a processing gas to the wafer W installed in a processing container 65, which will be described later, will be described. The wafer W is an example of a substrate to be processed. The substrate to be processed is not limited to the circular wafer W.

[0011] The heat treatment apparatus 10 in FIG. 1 includes a mounting table (load port) 20, a housing 30, and a control apparatus 100. The mounting table (load port) 20 is provided at the front part of the housing 30. The housing 30 includes a loading area (working area) 40 and a heat treatment furnace 60.

[0012] The loading area 40 is provided below the inside of the housing 30. The heat treatment furnace 60 is provided inside the housing 30 and above the loading area 40. A base plate 31 is provided between the loading area 40 and the heat treatment furnace 60.

[0013] The loading platform (load port) 20 is for loading and unloading the wafer W into and out of the housing 30. The loading platform (load port) 20 has the storage containers 21 and 22 placed thereon. The storage containers 21 and 22 are sealed storage containers (FOUP) that can detachably have lids on the front and can store a plurality of wafers W (for example, about 25 wafers) at predetermined intervals. Note that the storage containers 21 and 22 are an example of an object to be transferred at the source or an object to be transferred at the destination on which the wafer W can be placed.

[0014] Also, below the loading platform 20, an aligner 23 for aligning notches (for example, notches) provided on the outer periphery of the wafer W transferred by a transfer mechanism 47 described later in one direction may be provided.

[0015] The loading area (working area) 40 is for transferring the wafer W between the storage containers 21 and 22 and a boat 44 described later, loading the boat 44 into the processing container 65, and unloading the boat 44 from the processing container 65. The loading area 40 is provided with a door mechanism 41, a shutter mechanism 42, a lid 43, a boat 44, a base 45a, a base 45b, a lifting mechanism 46, and a transfer mechanism 47.

[0016] The door mechanism 41 is for removing the lids of the storage containers 21 and 22 and communicating and opening the storage containers 21, 22 and the loading area 40. The shutter mechanism 42 is provided above the loading area 40. The shutter mechanism 42 is provided so as to cover (or block) the furnace opening 68a in order to suppress or prevent the heat in the high-temperature furnace from being released to the loading area 40 from the furnace opening 68a when the lid 43 is open.

[0017] The lid 43 has a heat-insulating cylinder 48 and a rotating mechanism 49. The heat-insulating cylinder 48 is provided on the lid 43. The heat-insulating cylinder 48 is for preventing the boat 44 from being cooled by heat transfer to the lid 43 side and for keeping the boat 44 warm. The rotating mechanism 49 is attached to the lower part of the lid 43. The rotating mechanism 49 is for rotating the boat 44. The rotating shaft of the rotating mechanism 49 penetrates the lid 43 airtightly and is provided so as to rotate a rotating table (not shown) disposed on the lid 43.

[0018] The lifting mechanism 46 drives the lid 43 to move up and down when loading and unloading the boat 44 from the loading area 40 to the processing container 65. When the lid 43 lifted by the lifting mechanism 46 is being carried into the processing container 65, the lid 43 is provided so as to abut against a furnace opening 68a (to be described later) and seal the furnace opening 68a. The boat 44 placed on the lid 43 can hold the wafer W rotatably in a horizontal plane within the processing container 65.

[0019] Note that the heat treatment apparatus 10 may have a plurality of boats 44. In the present embodiment, with reference to FIG. 2, an example having two boats 44 will be described.

[0020] The loading area 40 is provided with boats 44a and 44b. The loading area 40 is provided with a base 45a, a base 45b, and a boat transfer mechanism 45c. The bases 45a and 45b are placement tables on which the boats 44a and 44b are transferred from the lid 43, respectively. The boat transfer mechanism 45c is for transferring the boat 44a or 44b from the lid 43 to the base 45a or 45b.

[0021] Boats 44a and 44b are made of, for example, quartz, and are configured to horizontally mount wafers W with a large diameter, for example, 300 mm in diameter, at a predetermined interval (pitch width) in the vertical direction. Boats 44a and 44b are provided, for example, with a plurality of (for example, three) support columns 52 between the top plate and the bottom plate. The support columns 52 are each provided with a support portion such as a groove or a claw for supporting (holding) the wafer W. Further, auxiliary columns may be appropriately provided for boats 44a and 44b together with the support columns 52. Note that boats 44a and 44b are an example of a transfer source object or a transfer destination object on which the wafer W can be placed.

[0022] The transfer mechanism 47 is for transferring the wafer W between the storage containers 21 or 22 and the boats 44a or 44b. Note that the transfer mechanism 47 is an example of a transfer device for transferring the wafer W.

[0023] The transfer mechanism 47 includes a base 57, a lifting arm 58, and a plurality of forks 59. The base 57 is provided so as to be movable up and down and swiveling. The lifting arm 58 is provided so as to be movable (liftable) in the vertical direction by a ball screw or the like. The base 57 is provided on the lifting arm 58 so as to be horizontally swiveling. Further, the plurality of forks is an example of a transfer plate (transfer portion) for supporting the wafer W.

[0024] In addition, cameras 80a and 80b are installed in the loading area 40. Cameras 80a and 80b are an example of a photographing device. The camera 80a is installed so as to be able to photograph the direction from the transfer mechanism 47 to the storage containers 21 or 22 and the direction from the transfer mechanism 47 to the boats 44a or 44b. The cameras 80a in FIGS. 1 and 2 show an example of being installed on the movable part of the transfer mechanism 47.

[0025] For example, the camera 80a captures the moving operation in which the transfer mechanism 47 acquires (Get) the wafer W from the storage container 21 or 22, and the moving operation in which the transfer mechanism 47 places (Put) the wafer W on the boat 44a or 44b. Also, the camera 80a captures the moving operation in which the transfer mechanism 47 acquires the wafer W from the boat 44a or 44b, and the moving operation in which the transfer mechanism 47 places the wafer W on the storage container 21 or 22.

[0026] Also, the cameras 80b in FIGS. 1 and 2 are installed so as to be able to capture the back side of the boat 44a or 44b when viewed from the transfer mechanism 47 side. An example in which the cameras 80b in FIGS. 1 and 2 are installed on the side wall of the housing 30 is shown.

[0027] For example, the camera 80b captures the moving operation in which the transfer mechanism 47 places the wafer W on the boat 44a or 44b. Also, the camera 80b captures the moving operation in which the transfer mechanism 47 acquires the wafer W from the boat 44a or 44b.

[0028] The control device 100 is a device that controls the entire heat treatment device 10. The control device 100 controls the operation of the heat treatment device 10 so that heat treatment is performed under various processing conditions shown in the recipe. Also, as will be described later, the control device 100 executes an automatic teaching process that automates the teaching of the transfer position of the wafer W to the transfer mechanism 47, an autonomous automatic transfer process that autonomously controls the transfer of the wafer W by the transfer mechanism 47, an abnormal sign detection process that supports the preventive maintenance activities of the transfer mechanism 47, and the like.

[0029] The control device 100 is realized by a computer having a hardware configuration as shown in FIG. 3, for example. FIG. 3 is a hardware configuration diagram of an example of a computer.

[0030] The computer 500 in FIG. 3 includes an input device 501, an output device 502, an external I / F (interface) 503, a RAM (Random Access Memory) 504, a ROM (Read Only Memory) 505, a CPU (Central Processing Unit) 506, a communication I / F 507, and an HDD (Hard Disk Drive) 508, etc., and each is interconnected by a bus B. Note that the input device 501 and the output device 502 may be connected and used when necessary.

[0031] The input device 501 is a keyboard, a mouse, a touch panel, etc., and is used for an operator or the like to input each operation signal. The output device 502 is a display or the like, and displays the processing result by the computer 500. The communication I / F 507 is an interface for connecting the computer 500 to a network. The HDD 508 is an example of a non-volatile storage device that stores programs and data.

[0032] The external I / F 503 is an interface with an external device. The computer 500 can read and / or write a recording medium 503a such as an SD (Secure Digital) memory card via the external I / F 503. The ROM 505 is an example of a non-volatile semiconductor memory (storage device) in which programs and data are stored. The RAM 504 is an example of a volatile semiconductor memory (storage device) that temporarily holds programs and data.

[0033] The CPU 506 is an arithmetic unit that realizes the control and functions of the entire computer 500 by reading programs and data from storage devices such as the ROM 505 and the HDD 508 onto the RAM 504 and executing processing.

[0034] The control device 100 can realize various functions described later by the computer 500 having the hardware configuration in FIG. 3 executing processing according to a program.

[0035] <Functional Configuration> An example of the functional configuration of the control device 100 will be described with reference to FIG. 4. FIG. 4 is a diagram showing an example of the functional configuration of the control device. The control device 100 includes an image data acquisition unit 110, an image processing unit 120, an autonomous control unit 130, a camera control unit 140, a transport device control unit 150, a database 160, a recipe execution unit 170, and a wafer transfer control unit 180.

[0036] The image processing unit 120 includes a wafer acquisition image processing unit 122 and a wafer placement image processing unit 124. The autonomous control unit 130 includes a wafer acquisition instruction unit 132 and a wafer placement instruction unit 134. Note that the functional configuration in FIG. 4 appropriately omits functional configurations that are unnecessary for the description of the present embodiment.

[0037] The image data acquisition unit 110 acquires image data captured by cameras 80a and 80b (hereinafter, cameras 80a and 80b are collectively referred to as camera 80 as appropriate). For example, the image data acquisition unit 110 acquires image data of the moving operation in which the transfer mechanism 47 acquires the wafer W from the storage container 21 or 22 and the moving operation in which the transfer mechanism 47 places the wafer W on the boat 44a or 44b. Also, for example, the image data acquisition unit 110 acquires image data of the moving operation in which the transfer mechanism 47 acquires the wafer W from the boat 44a or 44b and the moving operation in which the transfer mechanism 47 places the wafer W on the boat 44a or 44b.

[0038] The image processing unit 120 analyzes (measures) the necessary distances (dimensions) from the positions of the support portions such as the grooves and claws of the storage container 21 or 22, the position of the fork 59 of the transfer mechanism 47, and the position of the wafer W by performing image processing on the image data acquired by the image data acquisition unit 110, and quantifies the positional relationship. Hereinafter, an example in which the support portion of the storage container 21 or 22 is a groove will be described.

[0039] Further, the image processing unit 120 analyzes (measures) the necessary distances (dimensions) from the positions of the support portions such as the grooves and claws of the boat 44a or 44b, the position of the fork 59 of the transfer mechanism 47, and the position of the wafer W by performing image processing on the image data acquired by the image data acquisition unit 110, and quantifies the positional relationship. Hereinafter, an example in which the support portion of the boat 44a or 44b is a groove will be described.

[0040] The wafer acquisition image processing unit 122 of the image processing unit 120 analyzes the necessary distances from the positions of the grooves of the storage container 21 or 22, the position of the fork 59 of the transfer mechanism 47, and the position of the wafer W by performing image processing on the image data of the moving operation for acquiring the wafer W from the storage container 21 or 22, and quantifies the positional relationship.

[0041] Also, the wafer acquisition image processing unit 122 of the image processing unit 120 analyzes the necessary distances from the positions of the grooves of the boat 44a or 44b, the position of the fork 59 of the transfer mechanism 47, and the position of the wafer W by performing image processing on the image data of the moving operation for acquiring the wafer W from the boat 44a or 44b, and quantifies the positional relationship.

[0042] The wafer placement image processing unit 124 of the image processing unit 120 analyzes the necessary distances from the positions of the grooves of the boat 44a or 44b, the position of the fork 59 of the transfer mechanism 47, and the position of the wafer W by performing image processing on the image data of the moving operation for placing the wafer W on the boat 44a or 44b, and quantifies the positional relationship.

[0043] Further, the wafer placement image processing unit 124 of the image processing unit 120 analyzes the necessary distances from the positions of the grooves of the storage container 21 or 22, the position of the fork 59 of the transfer mechanism 47, and the position of the wafer W by performing image processing on the image data of the moving operation for placing the wafer W on the storage container 21 or 22, and quantifies the positional relationship.

[0044] Based on the digitized position of the groove of the storage container 21 or 22, the position of the fork 59 of the transfer mechanism 47, and the positional relationship of the wafer W, the self-control unit 130 calculates correction data for the placement position of the wafer W in the storage container 21 or 22, and gives instructions on the transfer position of the wafer W to the transfer mechanism 47. For example, the correction data for the placement position of the wafer W in the storage container 21 or 22 is used to correct the moving operation in which the fork 59 of the transfer mechanism 47 acquires the wafer W from the storage container 21 or 22 or the moving operation of placing the wafer W in the storage container 21 or 22.

[0045] Also, based on the digitized position of the groove of the boat 44a or 44b, the position of the fork 59 of the transfer mechanism 47, and the positional relationship of the wafer W, the self-control unit 130 calculates correction data for the placement position of the wafer W in the boat 44a or 44b, and gives instructions on the transfer position of the wafer W to the transfer mechanism 47. For example, the correction data for the placement position of the wafer W in the boat 44a or 44b is used to correct the moving operation in which the fork 59 of the transfer mechanism 47 acquires the wafer W from the boat 44a or 44b or the moving operation of placing the wafer W in the boat 44a or 44b.

[0046] The wafer acquisition instruction unit 132 of the self-control unit 130 calculates correction data for the placement position of the wafer W in the storage container 21 or 22 based on the digitized position of the groove of the storage container 21 or 22, the position of the fork 59 of the transfer mechanism 47, and the positional relationship of the wafer W, which is obtained by image processing of the image data of the moving operation of acquiring the wafer W from the storage container 21 or 22.

[0047] Also, the wafer acquisition instruction unit 132 of the self-control unit 130 calculates correction data for the placement position of the wafer W in the boat 44a or 44b based on the digitized position of the groove of the boat 44a or 44b, the position of the fork 59 of the transfer mechanism 47, and the positional relationship of the wafer W, which is obtained by image processing of the image data of the moving operation of acquiring the wafer W from the boat 44a or 44b.

[0048] The wafer placement instruction unit 134 of the autonomous control unit 130 calculates correction data for the placement position of the wafer W in the boat 44a or 44b based on the position of the groove in the boat 44a or 44b, the position of the fork 59 of the transfer mechanism 47, and the positional relationship of the wafer W, which are digitized by performing image processing on the image data of the moving operation of placing the wafer W on the boat 44a or 44b.

[0049] Also, the wafer placement instruction unit 134 of the autonomous control unit 130 calculates correction data for the placement position of the wafer W in the storage container 21 or 22 based on the position of the groove in the storage container 21 or 22, the position of the fork 59 of the transfer mechanism 47, and the positional relationship of the wafer W, which are digitized by performing image processing on the image data of the moving operation of placing the wafer W on the storage container 21 or 22.

[0050] The camera control unit 140 controls the imaging timing of the camera 80 in accordance with an instruction from the autonomous control unit 130. The database 160 stores initial instruction data and correction instruction data for instructing the placement position of the wafer W to the transfer mechanism 47 of the heat treatment apparatus 10. For example, the initial instruction data is instruction data preset in the heat treatment apparatus 10 and is set for each model of the heat treatment apparatus 10. The correction instruction data is instruction data obtained by correcting the displacement of the placement position of the wafer W due to machine differences or adjustment variations by the operator in the heat treatment apparatus 10.

[0051] The transfer device control unit 150 controls the moving operation of the transfer mechanism 47 in accordance with control from the autonomous control unit 130 or the wafer transfer control unit 180. The transfer device control unit 150 controls the moving operation of the transfer mechanism 47 using the initial instruction data and the correction instruction data stored in the database 160.

[0052] The recipe execution unit 170 controls the operation of the heat treatment apparatus 10 so that heat treatment is performed under the processing conditions indicated in the recipe. The wafer transfer control unit 180 instructs the transfer device control unit 150 to transfer the wafer W between the storage container 21 or 22 and the boat 44a or 44b in accordance with control from the recipe execution unit 170.

[0053] <Processing> The following describes an example of a fully automatic teaching process for automating the teaching of the transfer mechanism 47 that transfers the wafer W between the storage containers 21 or 22 and the boats 44a or 44b. The control device 100 performs the fully automatic teaching process of the transfer mechanism 47 according to the procedure of FIG. 5, for example. FIG. 5 is a flowchart of an example of the fully automatic teaching process of the transfer mechanism according to the present embodiment.

[0054] In step S10, the control device 100 performs a pre-transfer operation confirmation process. The pre-transfer operation confirmation process in step S10 is a confirmation process before the transfer operation. Without transferring the wafer W, it moves the fork 59 of the transfer mechanism 47 based on the initial teaching data and confirms the transfer positions between the storage containers 21 or 22 and the boats 44a or 44b.

[0055] In step S12, the control device 100 performs a storage container side automatic teaching process. The storage container side automatic teaching process in step S12 moves the fork 59 of the transfer mechanism 47 based on the corrected teaching data obtained by correcting the initial teaching data through the pre-transfer operation confirmation process in step S10. As a result, the fork 59 of the transfer mechanism 47 acquires the wafer W from the storage container 21 or 22.

[0056] The control device 100 acquires image data of the movement operation in which the fork 59 of the transfer mechanism 47 acquires the wafer W from the storage container 21 or 22, and quantifies the positional relationship between the grooves of the storage container 21 or 22, the fork 59, and the wafer W through image processing. Based on the quantified positional relationship between the grooves of the storage container 21 or 22, the fork 59, and the wafer W, the control device 100 outputs corrected teaching data for correcting the placement position of the wafer W in the storage container 21 or 22 (correcting the movement operation of the fork 59).

[0057] In step S14, the control device 100 performs boat-side automatic teaching processing. The boat-side automatic teaching processing in step S14 performs the movement operation of the fork 59 of the transfer mechanism 47 based on the corrected teaching data. Thereby, the fork 59 of the transfer mechanism 47 places the wafer W on the boat 44a or 44b.

[0058] The control device 100 acquires image data of the movement operation in which the fork 59 of the transfer mechanism 47 places the wafer W on the boat 44a or 44b, and numerically quantifies the positional relationship among the groove of the boat 44a or 44b, the fork 59, and the wafer W by image processing. Then, the control device 100 outputs corrected teaching data for correcting the placement position of the wafer W in the boat 44a or 44b (correcting the movement operation of the fork 59) based on the numerically quantified positional relationship among the groove of the boat 44a or 44b, the fork 59, and the wafer W.

[0059] Hereinafter, the details of the pre-transfer operation confirmation process shown in step S10, the storage container-side automatic teaching process shown in step S12, and the boat-side automatic teaching process shown in step S14 will be described. In the present embodiment, the change in the position (location) in the movement operation of the fork 59 when the wafer W is acquired from or placed at the placement position, and the position where the camera 80 performs imaging are defined as shown in FIG. 6, for example.

[0060] FIG. 6 is an explanatory diagram showing an example of the position change in the movement operation of the fork when the wafer W is acquired or placed. FIG. 6(A) shows an example of the position change in the movement operation of the fork 59 when the wafer W is acquired. FIG. 6(B) shows an example of the position change in the movement operation of the fork 59 when the wafer W is placed.

[0061] For example, FIG. 6(A) shows an example of a moving operation in which the fork 59 is sequentially moved to positions P4 → P3 → P2 → P5 → P1. Position P3 in FIG. 6(A) is an example of the first position, and is, for example, the position immediately before the fork 59 acquires the wafer W from the storage container 21 or 22. Position TCH is an example of the second position, and is, for example, the position where the fork 59 acquires the wafer W from the storage container 21 or 22. Position P2 is an example of the third position, and is, for example, the position after the fork 59 has acquired the wafer W from the storage container 21 or 22.

[0062] For example, FIG. 6(B) shows an example of a moving operation in which the fork 59 is sequentially moved to positions P1 → P5 → P3 → P4. Position P5 in FIG. 6(B) is an example of the fourth position, and is, for example, the position immediately before the fork 59 places the wafer W on the boat 44a or 44b. Position TCH is an example of the fifth position, and is, for example, the position where the fork 59 places the wafer W on the boat 44a or 44b. Position P3 is an example of the sixth position, and is, for example, the position after the fork 59 has placed the wafer W on the boat 44a or 44b.

[0063] In the following description, a fully automatic teaching process for automating the teaching (instruction) of the transfer mechanism 47 that transfers the wafer W between the storage container 21 and the boat 44a will be described.

[0064] FIG. 7 is a flowchart showing an example of a pre-transfer operation confirmation process on the boat side according to the present embodiment. In step S20, the autonomous control unit 130 of the control device 100 reads initial teaching data from the database 160. In step S22, based on the initial teaching data, the autonomous control unit 130 controls the transfer device control unit 150 to insert the fork 59 into position P3 of the boat 44a. The transfer device control unit 150 controls the movement operation of the transfer mechanism 47 to insert the fork 59 into position P3 of the boat 44a according to the initial teaching data.

[0065] In step S24, the autonomous control unit 130 performs control so that the camera 80 takes pictures at positions P3 and P5 of the boat 44a. The image data captured by the camera 80 is as shown in, for example, FIG. 8.

[0066] FIG. 8 is an image diagram of an example of the image data captured by the camera. Note that FIG. 8(A) is an image diagram of an example of the image data captured at position P3, and FIG. 8(B) is an image diagram of an example of the image data captured at position P5.

[0067] The image data acquisition unit 110 acquires the image data captured by the camera 80 at positions P3 and P5 of the boat 44a. The image processing unit 120 measures the distance a between the upper part of the groove of the support column 52 of the boat 44a (hereinafter referred to as the boat groove) and the wafer installation surface of the fork 59 by performing image processing on the image data captured at positions P3 and P5 of the boat 44a. The image processing unit 120 measures the distance b between the edge of the boat groove and the edge of the fork 59.

[0068] In step S26, the autonomous control unit 130 determines whether or not the measured distance a between the upper part of the boat groove and the wafer installation surface of the fork 59, and the distance b between the edge of the boat groove and the edge of the fork 59 at positions P3 and P5 of the boat 44a satisfy the design reference values. If the design reference values are not satisfied, the autonomous control unit 130 performs an error correction operation in step S28 and repeatedly performs position correction of the movement operation of the fork 59 until the design reference values are satisfied.

[0069] In step S30, the autonomous control unit 130 performs feedback by storing the correction instruction data in the database 160 according to the result of the position correction of the movement operation of the fork 59 that satisfies the design reference values.

[0070] After the pre-transfer operation confirmation process on the boat side in FIG. 7, the control device 100 performs a pre-transfer operation confirmation process on the storage container side as shown in FIG. 9. FIG. 9 is a flowchart showing an example of the pre-transfer operation confirmation process on the storage container side according to the present embodiment. In step S40, the autonomous control unit 130 of the control device 100 reads initial teaching data from the database 160.

[0071] In step S42, based on the initial teaching data, the autonomous control unit 130 controls the transfer device control unit 150 to insert the fork 59 into the position P3 of the storage container 21. The transfer device control unit 150 controls the movement operation of the transfer mechanism 47 to insert the fork 59 into the position P3 of the storage container 21 according to the initial teaching data.

[0072] In step S44, the autonomous control unit 130 controls the camera 80 to take pictures at positions P3 and P5 of the storage container 21.

[0073] The image data acquisition unit 110 acquires the image data taken by the camera 80 at positions P3 and P5 of the storage container 21. The image processing unit 120 measures the distance between the upper part of the groove of the storage container 21 (hereinafter referred to as the storage container groove) and the wafer installation surface of the fork 59 by performing image processing on the image data taken at positions P3 and P5 of the storage container 21. The image processing unit 120 measures the distance between the edge of the storage container groove and the edge of the fork 59.

[0074] In step S46, the autonomous control unit 130 determines whether the measured distances between the upper part of the storage container groove and the wafer installation surface of the fork 59, and between the edge of the storage container groove and the edge of the fork 59 at positions P3 and P5 of the storage container 21 satisfy the design reference values. If they do not satisfy the design reference values, the autonomous control unit 130 performs an error difference correction operation in step S48 and repeatedly corrects the position of the movement operation of the fork 59 until the design reference values are satisfied.

[0075] In step S50, the autonomous control unit 130 performs feedback by storing correction instruction data in the database 160 according to the result of position correction of the movement operation of the fork 59 that satisfies the design reference value.

[0076] Note that since the size of the storage container groove is sufficiently larger than the boat groove, the pre-transfer operation confirmation process on the storage container side shown in FIG. 9 may be omitted.

[0077] FIG. 10 is a flowchart of an example of the storage container side automatic teaching process according to the present embodiment. In step S60, the autonomous control unit 130 of the control device 100 reads correction instruction data from the database 160. The correction instruction data read in step S60 is the correction instruction data stored in the database 160 according to the flowchart shown in FIG. 9.

[0078] In step S62, the autonomous control unit 130 controls the transfer device control unit 150 to insert the fork 59 into the position P3 of the storage container 21 based on the correction instruction data. The transfer device control unit 150 controls the movement operation of the transfer mechanism 47 to insert the fork 59 into the position P3 of the storage container 21, for example, as shown in FIG. 11, according to the correction instruction data.

[0079] FIG. 11 is an image diagram of an example of a storage container into which a fork is inserted. The camera 80a in FIG. 11 can photograph the direction of the storage container 21 or 22 from the transfer mechanism 47 side. In step S64, the autonomous control unit 130 controls the camera 80a to take pictures at the positions P3, TCH, and P5 of the storage container 21. The image data acquisition unit 110 acquires the image data photographed by the camera 80a at the positions P3, TCH, and P5 of the storage container 21. In step S66, the image processing unit 120 numerically analyzes the positional relationship between the storage container groove, the fork 59, and the wafer W by performing image processing on the image data photographed at the positions P3, TCH, and P5 of the storage container 21.

[0080] For example, the image processing unit 120 measures the distance between the lower surface of the wafer W held by the storage container 21 and the wafer placement surface of the fork 59, the distance between the edge of the storage container groove and the edge of the fork 59, etc. by performing image processing on the image data captured at the position P3. The image processing unit 120 measures the distance between the lower surface of the wafer W held by the storage container 21 and the wafer placement surface of the fork 59, the distance between the edge of the storage container groove and the edge of the fork 59, etc. by performing image processing on the image data captured at the position TCH. Also, the image processing unit 120 measures the distance between the lower surface of the wafer W held by the fork 59 and the upper surface of the storage container groove, the distance between the edge of the storage container groove and the edge of the wafer W held by the fork 59, etc. by performing image processing on the image data captured at the position P5.

[0081] In step S68, the autonomous control unit 130 determines whether the measured distance satisfies the design reference value. If it does not satisfy the design reference value, the autonomous control unit 130 performs an error difference correction operation in step S70 and repeatedly performs position correction of the movement operation of the fork 59 until the design reference value is satisfied.

[0082] In step S72, the autonomous control unit 130 feeds back by storing the correction instruction data in the database 160 according to the result of the position correction of the movement operation of the fork 59 that satisfies the design reference value.

[0083] FIG. 12 is a flowchart of an example of the boat-side automatic teaching process according to the present embodiment. The autonomous control unit 130 of the control device 100 reads out the correction instruction data from the database 160 in step S80. The correction instruction data read out in step S80 is the correction instruction data stored in the database 160 according to the flowchart shown in FIG. 7.

[0084] In step S82, the autonomous control unit 130 controls the transfer device control unit 150 to insert the fork 59 into the position P5 of the boat 44a based on the corrected teaching data. The transfer device control unit 150 controls the movement operation of the transfer mechanism 47 to insert the fork 59 into the position P5 of the boat 44a according to the corrected teaching data, as shown in FIG. 13 for example.

[0085] FIG. 13 is an image diagram of an example of a boat into which a fork is inserted. As shown in FIG. 13, the cameras 80a and 80b are installed so as to be able to photograph three boat grooves of the boat 44a.

[0086] In step S84, the autonomous control unit 130 performs control to cause the camera 80a to take a photograph at the position P5 of the boat 44a. The image data acquisition unit 110 acquires the image data photographed by the camera 80a at the position P5 of the boat 44a.

[0087] In step S86, the image processing unit 120 numerically values the positional relationship among the boat groove, the fork 59, and the wafer W by performing image processing on the image data photographed by the camera 80a at the position P5 of the boat 44a.

[0088] For example, the image processing unit 120 measures the distance c between the lower surface of the wafer W held by the fork 59 and the upper surface of the boat groove, the distance d between the support column 52 and the edge of the wafer W, etc. by performing image processing on the image data photographed by the camera 80a at the position P5.

[0089] In step S88, the autonomous control unit 130 determines whether the measured distance satisfies the design reference value. If it does not satisfy the design reference value, the autonomous control unit 130 performs an error difference correction operation in step S90 and repeatedly performs position correction of the movement operation of the fork 59 until the design reference value is satisfied.

[0090] If the design reference value is satisfied, the autonomous control unit 130 proceeds to the process of step S92. The autonomous control unit 130 controls the camera 80b to perform imaging at the position P5 of the boat 44a. The image data acquisition unit 110 acquires the image data captured by the camera 80b at the position P5 of the boat 44a.

[0091] In step S94, the image processing unit 120 numerically values the positional relationship among the boat groove, the fork 59, and the wafer W by performing image processing on the image data captured by the camera 80b at the position P5 of the boat 44a.

[0092] For example, the image processing unit 120 measures the distance c between the lower surface of the wafer W held by the fork 59 and the upper surface of the boat groove, the distance d between the support column 52 and the edge of the wafer W, etc. by performing image processing on the image data captured by the camera 80b at the position P5.

[0093] In step S96, the autonomous control unit 130 determines whether the measured distance satisfies the design reference value. If it does not satisfy the design reference value, the autonomous control unit 130 performs an error difference correction operation in step S98 and repeatedly performs position correction of the movement operation of the fork 59 until the design reference value is satisfied.

[0094] In step S100, the autonomous control unit 130 feeds back by storing the correction instruction data in the database 160 according to the result of the position correction of the movement operation of the fork 59 that satisfies the design reference value.

[0095] FIG. 14 is a flowchart of an example of the boat-side automatic teaching process according to the present embodiment. The autonomous control unit 130 of the control device 100 reads out the correction instruction data from the database 160 in step S110. The correction instruction data read out in step S110 is the correction instruction data stored in the database 160 according to the flowchart shown in FIG. 12.

[0096] In step S112, the autonomous control unit 130 controls the transfer device control unit 150 to move the fork 59 to the position TCH of the boat 44a based on the corrected teaching data. The transfer device control unit 150 controls the movement operation of the transfer mechanism 47 to move the fork 59 to the position TCH of the boat 44a according to the corrected teaching data, as shown in FIG. 15 for example.

[0097] FIG. 15 is an image diagram of an example of a boat into which a fork is inserted. As shown in FIG. 15, the cameras 80a and 80b are installed so as to be able to photograph three boat grooves of the boat 44a in a state where the transfer mechanism 47 is moved to the positions TCH and P3.

[0098] In step S114, the autonomous control unit 130 controls the cameras 80a and 80b to perform photographing at the position TCH of the boat 44a. The image data acquisition unit 110 acquires the image data photographed by the cameras 80a and 80b at the position TCH of the boat 44a.

[0099] In step S116, the image processing unit 120 performs image processing on the image data photographed by the cameras 80a and 80b at the position TCH of the boat 44a, and quantifies the positional relationship among the boat grooves, the fork 59, and the wafer W at the three boat grooves.

[0100] For example, the image processing unit 120 measures the distance between the lower surface of the wafer W held by the fork 59 and the upper surface of the boat groove, the distance between the support column 52 and the edge of the wafer W, etc. by performing image processing on the image data photographed by the cameras 80a and 80b at the position TCH.

[0101] In step S118, the autonomous control unit 130 determines whether the measured distance satisfies the design reference value. If it does not satisfy the design reference value, the autonomous control unit 130 performs an error difference correction operation in step S120, and repeatedly performs position correction of the movement operation of the fork 59 until the design reference value is satisfied.

[0102] If the design reference values are satisfied, the autonomous control unit 130 proceeds to the process of step S124. The autonomous control unit 130 controls the cameras 80a and 80b to perform imaging at the position P3 of the boat 44a. The image data acquisition unit 110 acquires the image data captured by the cameras 80a and 80b at the position P3 of the boat 44a.

[0103] In step S126, the image processing unit 120 performs image processing on the image data captured by the cameras 80a and 80b at the position P3 of the boat 44a, and quantifies the positional relationship among the boat groove, the fork 59, and the wafer W at three boat grooves.

[0104] For example, the image processing unit 120 measures the distance between the lower surface of the wafer W held by the boat groove and the wafer installation surface of the fork 59, the distance between the support column 52 and the edge of the wafer W, etc. by performing image processing on the image data captured by the cameras 80a and 80b at the position P3.

[0105] In step S128, the autonomous control unit 130 determines whether the measured distance satisfies the design reference values. If the design reference values are not satisfied, the autonomous control unit 130 performs an error difference correction operation in step S130, and repeatedly performs position correction of the movement operation of the fork 59 until the design reference values are satisfied.

[0106] In step S132, the autonomous control unit 130 performs feedback by storing the correction instruction data in the database 160 according to the result of the position correction of the movement operation of the fork 59 that satisfies the design reference values.

[0107] Note that the processes of the flowcharts shown in FIGS. 12 and 14 can be further improved in accuracy by dividing the boat 44a into two upper and lower areas or three or more areas by height and performing the processes for each area.

[0108] According to this embodiment, for example, the time required for adjustment work during startup (installation of the device) or after replacement of the quartz jig can be shortened compared to the adjustment work by an operator, and the transfer margin due to high-precision adjustment can be increased. Further, according to this embodiment, it can be expected that the MTTF (Mean Time To Failure) is extended due to the increase in the transfer margin, and the added value of the heat treatment apparatus 10 can be improved.

[0109] Further, in this embodiment, the positional relationship between the support portions such as the grooves and claws of the storage containers 21 or 22, the support portions such as the grooves and claws of the boats 44a or 44b, the position of the fork 59 of the transfer mechanism 47, and the wafer W is digitized by image processing. However, an optical sensor or the like may be used in combination. Further, in this embodiment, centering of the wafer W on the boat 44a or 44b can be realized, and the inclination of the boat 44a or 44b can be analyzed from the calculation based on the transfer mechanism 47. Furthermore, in this embodiment, the displacement of the wafer W held by the fork 59 may be analyzed from the image data captured by the camera 80b, and the transfer of the wafer W may be continued by correcting the deviation of the displacement.

[0110] In the above embodiment, a so-called ladder boat in which a plurality of columns are provided between a top plate and a bottom plate arranged to face each other vertically, a plurality of groove portions are formed on the inner surface of each column, and the peripheral edge portion of the wafer W is inserted into and supported by the groove portions has been described as an example. However, the shape of the ladder boat is not limited.

[0111] For example, it can also be applied to a so-called ring boat in which a plurality of columns are provided between a top plate and a bottom plate arranged to face each other vertically, a ring member having a flat support surface is provided on the plurality of columns, and the wafer W is supported by the support surface of the ring member. Further, it can also be applied to other boats having special shapes.

[0112] The embodiments of the present disclosure should be considered to be illustrative in all respects and not restrictive. Further, the above embodiments may be omitted, replaced, or changed in various forms without departing from the scope of the appended claims and their gist.

Description of Reference Numerals

[0113] 10 Heat treatment apparatus 21, 22 Storage containers 44, 44a, 44b Boats 47 Transfer mechanism 52 Support columns 59 Forks 80a, 80b Cameras 100 Control device 110 Image data acquisition unit 120 Image processing unit 122 Wafer acquisition image processing unit 124 Wafer placement image processing unit 130 Autonomous control unit 132 Wafer acquisition instruction unit 134 Wafer placement instruction unit 140 Camera control unit 150 Conveyor device control unit 160 Database 170 Recipe execution unit 180 Wafer transfer control unit W Wafer

Claims

1. An information processing apparatus for instructing a transfer position of a substrate to be processed with respect to a transfer apparatus of a substrate processing apparatus that transfers a plurality of substrates to be processed between a transfer source object and a transfer destination object on which the substrate to be processed can be placed, by a moving operation of a plurality of forks, comprising: image data acquisition means for acquiring image data of the placement positions of the transfer source object and the transfer destination object from an imaging device installed so as to be able to image the placement positions of the substrate to be processed in the transfer source object and the transfer destination object; first image processing means for quantifying the positional relationship among the transfer source object, the transfer apparatus, and the substrate to be processed based on the image data obtained by imaging the moving operation of the transfer apparatus for acquiring the substrate to be processed from the placement position of the transfer source object; second image processing means for quantifying the positional relationship among the transfer destination object, the transfer apparatus, and the substrate to be processed based on the image data obtained by imaging the moving operation of the transfer apparatus for placing the substrate to be processed on the placement position of the transfer destination object; first transfer instruction means for outputting correction data for the moving operation of the transfer apparatus for acquiring the substrate to be processed from the transfer source object based on the quantified positional relationship among the placement position of the transfer source object, the transfer apparatus, and the substrate to be processed; second transfer instruction means for outputting correction data for the moving operation of the transfer apparatus for placing the substrate to be processed on the transfer destination object based on the quantified positional relationship among the placement position of the transfer destination object, the transfer apparatus, and the substrate to be processed; and the transfer source object and the transfer destination object are boats (Boat) that support a plurality of substrates to be processed conveyed by the transfer apparatus in a horizontal state at a predetermined interval in the vertical direction characterized information processing apparatus.

2. The information processing apparatus according to claim 1, wherein the image data acquisition means acquires image data capable of quantifying, by image processing, the positional relationship among the substrate to be processed, a support portion that supports the substrate to be processed in the substrate to be processed, the transfer source object, and the transfer destination object, and the fork that supports the substrate to be processed in the transfer apparatus.

3. The image data acquisition means acquires image data capable of quantifying, by image processing, the positional relationship among the substrate to be processed, a support portion that supports the substrate to be processed in the transfer source object or the transfer destination object on which the substrate to be processed is mounted, and the fork that supports the substrate to be processed in the transfer apparatus, ​ The first image processing means and the second image processing means numerically quantify the positional relationship between the substrate to be processed, the support portion of the transfer source object or the transfer destination object on which the substrate to be processed is mounted, and the fork that supports the substrate to be processed in the transfer device, for each of the support portions. The information processing apparatus according to claim 2, characterized in that.

4. Among the movement operations of the transfer device that acquires the substrate to be processed from the placement position of the transfer source object, the first image processing means captures the first image data when the transfer device moves to a first position before acquiring the substrate to be processed, the second image data when the transfer device moves to a second position where it acquires the substrate to be processed, and the third image data when the transfer device moves to a third position after acquiring the substrate to be processed. Based on these, the first image processing means numerically quantifies the positional relationship among the transfer source object, the transfer device, and the substrate to be processed at the first position, the second position, and the third position. Based on the numerically quantified positional relationship among the placement position of the substrate to be processed on the transfer source object, the transfer device, and the substrate to be processed at the first position, the second position, and the third position, the first transfer instruction means outputs correction data for the placement position of the substrate to be processed on the transfer source object. The information processing apparatus according to any one of claims 1 to 3, characterized in that.

5. Among the movement operations of the transfer device that places the substrate to be processed at the placement position of the transfer destination object, the second image processing means captures the fourth image data when the transfer device moves to a fourth position before placing the substrate to be processed, the fifth image data when the transfer device moves to a fifth position where it places the substrate to be processed, and the sixth image data when the transfer device moves to a sixth position after placing the substrate to be processed. Based on these, the second image processing means numerically quantifies the positional relationship among the transfer destination object, the transfer device, and the substrate to be processed at the fourth position, the fifth position, and the sixth position. Based on the numerically quantified positional relationship among the placement position of the substrate to be processed on the transfer destination object, the transfer device, and the substrate to be processed at the fourth position, the fifth position, and the sixth position, the second transfer instruction means outputs correction data for the placement position of the substrate to be processed on the transfer destination object. The information processing apparatus according to any one of claims 1 to 4, characterized in that...

6. Based on the image data obtained by photographing the movement operation of the transfer device based on the initial teaching data preset in the substrate processing apparatus, the first image processing means and the second image processing means quantify the placement positions of the transfer source object and the transfer destination object, the transfer device, and the positional relationship of the substrate to be processed. Based on the quantified positional relationship of the transfer source object and the transfer destination object, the transfer device, and the substrate to be processed, and the design reference value of the positional relationship, the first transfer teaching means and the second transfer teaching means output correction data for the movement operation of the transfer device for acquiring or placing the substrate to be processed. The information processing apparatus according to any one of claims 1 to 5, characterized in that...

7. The imaging device includes a plurality of imaging units capable of imaging the vertical and horizontal errors of the placement positions of the transfer source object and the transfer destination object in the vertical, horizontal, and front-rear directions in which the transfer device can move, and at least one imaging unit capable of imaging the front-rear error of the placement positions of the transfer source object and the transfer destination object. The information processing apparatus according to any one of claims 1 to 6.

8. The transfer source object and the transfer destination object are storage containers (FOUP). The information processing apparatus according to any one of claims 1 to 7, characterized in that...

9. A transfer position teaching method of an information processing apparatus for teaching the transfer position of a substrate to be processed to a transfer device of a substrate processing apparatus that transfers a plurality of substrates to be processed between a transfer source object and a transfer destination object capable of placing the substrate to be processed by the movement operation of a plurality of forks, An image data acquisition step of acquiring image data of the placement positions of the transfer source object and the transfer destination object from an imaging device installed so as to be able to image the placement positions of the substrate to be processed in the transfer source object and the transfer destination object, A first image processing step of quantifying the positional relationship of the transfer source object, the transfer device, and the substrate to be processed based on the image data obtained by photographing the movement operation of the transfer device for acquiring the substrate to be processed from the placement position of the transfer source object. A second image processing step of quantifying the positional relationship among the transfer destination object, the transfer device, and the substrate to be processed based on the image data obtained by photographing the movement operation of the transfer device for placing the substrate to be processed at the placement position of the transfer destination object; A first transfer instruction step of outputting correction data for the movement operation of the transfer device to acquire the substrate to be processed from the transfer source object based on the quantified positional relationship among the placement position of the transfer source object, the transfer device, and the substrate to be processed; A second transfer instruction step of outputting correction data for the movement operation of the transfer device to place the substrate to be processed on the transfer destination object based on the quantified positional relationship among the placement position of the transfer destination object, the transfer device, and the substrate to be processed; which comprises; wherein the transfer source object and the transfer destination object are boats (Boat) that support a plurality of the substrates to be processed in a horizontal state at a predetermined interval in the vertical direction by the transfer device characterizes a transfer position teaching method.

10. A substrate processing apparatus for processing a substrate to be processed, comprising: transfer means for transferring a plurality of the substrates to be processed between a transfer source object and a transfer destination object on which the substrate to be processed can be placed by the movement operation of a plurality of forks; imaging means installed so as to be able to image the placement positions of the substrate to be processed on the transfer source object and the transfer destination object; image data acquisition means for acquiring image data of the placement positions of the transfer source object and the transfer destination object from the imaging means; first image processing means for quantifying the positional relationship among the transfer source object, the transfer means, and the substrate to be processed based on the image data obtained by photographing the movement operation of the transfer means for acquiring the substrate to be processed from the placement position of the transfer source object; second image processing means for quantifying the positional relationship among the transfer destination object, the transfer means, and the substrate to be processed based on the image data obtained by photographing the movement operation of the transfer means for placing the substrate to be processed at the placement position of the transfer destination object; first transfer instruction means for outputting correction data for the movement operation of the transfer means to acquire the substrate to be processed from the transfer source object based on the quantified positional relationship among the placement position of the transfer source object, the transfer means, and the substrate to be processed; Based on the positional relationship among the placement position of the transported destination object that has been digitized, the transport means, and the position of the substrate to be processed, a second transfer instruction means that outputs correction data for the movement operation of the transport means for placing the substrate to be processed on the transported destination object; having; wherein the transported source object and the transported destination object are boats (Boats) that support a plurality of the substrates to be processed transported by the transport means in a horizontal state at a predetermined interval in the vertical direction; A substrate processing apparatus characterized by the above.

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