Transfer machine, substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device, and program

Abstract

Provided is a technique capable of detecting a substrate even if the substrate is a transparent substrate. 【Solution means】(a) An end effector configured to be able to hold a corresponding substrate, and (b) (b1) A light projecting unit having a first end that emits reference light from a first optical fiber, (b2) A light receiving unit having a second end that receives the reference light reflected by the back surface or the front surface of the corresponding transparent substrate substantially opposite to the first end and guides the received reference light to a second optical fiber, (b3) A plate that spreads between the vicinity of the first end and the vicinity of the second end on the side opposite to the corresponding substrate as viewed from the light projecting unit and the light receiving unit, and (b4) A wall that prevents direct incidence of the reference light from the first end to the second end, and in at least one of a state where it is inserted into the holder and a state where it is holding the corresponding substrate, a substrate detector configured to be able to optically detect the corresponding substrate.

Description

Technical Field

[0001] The present disclosure relates to a transfer machine, a substrate processing apparatus, a substrate processing method, a method for manufacturing a semiconductor device, and a program.

Background Art

[0002] The transfer of a substrate to be processed inside a semiconductor manufacturing apparatus is performed by a substrate transfer machine. The substrate transfer machine is provided with a plurality of substrate transfer plates in multiple stages so that a plurality of substrates to be processed can be transferred at once, and a substrate detection sensor may be provided for each substrate transfer plate for the purpose of detecting the presence or absence of the substrate to be processed on the substrate transfer plate. (For example, Japanese Patent Application Laid-Open No. 2000-138280)

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When the substrate detection sensor is a transmissive fiber sensor, when the substrate is visually transparent, it may not be able to block light and may cause false detection.

[0005] The present disclosure provides a technique capable of detecting a substrate even if it is a transparent substrate.

Means for Solving the Problems

[0006] According to one aspect of the present disclosure, (a) An end effector configured to be able to grip a corresponding substrate after being inserted into a holder that houses a plurality of substrates in multiple stages without contacting the substrate, and (b) being disposed at a specific relative position with respect to the end effector, (b1) A light projecting unit formed in a rod shape and having a first end that emits reference light from a first optical fiber; (b2) A light receiving unit formed in a rod shape, substantially opposed to the first end, and having a second end that receives the reference light reflected by the back surface or the front surface of the corresponding transparent substrate and guides it to a second optical fiber; (b3) A plate that extends between the vicinity of the first end and the vicinity of the second end on the side opposite to the corresponding substrate as viewed from the light projecting unit and the light receiving unit; (b4) A wall that prevents direct incidence of the reference light from the first end to the second end; and A substrate detector configured to optically detect the corresponding substrate in at least one of a state where it is inserted into the holder and a state where it holds the corresponding substrate is provided.

Advantages of the Invention

[0007] According to the present disclosure, even a transparent substrate can be detected.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

[0009] Hereinafter, one aspect of the present disclosure will be described mainly with reference to FIGS. 1 to 6. Note that the drawings used in the following description are all schematic, and the dimensional relationships and ratios of the respective elements shown in the drawings do not necessarily match the actual ones. Also, the dimensional relationships and ratios of the respective elements do not necessarily match among the plurality of drawings. Unless otherwise specified in the specification, each element is not limited to one, and a plurality of elements may exist.

[0010] (Overview of Substrate Processing Apparatus) The substrate processing apparatus described in this embodiment is used in the manufacturing process of semiconductor devices, and heats and processes (heat-treats) the substrate by a heater in a state where the substrate to be processed is housed in a processing chamber. More specifically, it is a vertical substrate processing apparatus that simultaneously processes a plurality of substrates stacked at a predetermined interval in the vertical direction.

[0011] Examples of the substrate to be processed by the substrate processing apparatus include a semiconductor wafer substrate (hereinafter simply referred to as "wafer") on which a semiconductor device (semiconductor device) is fabricated. Examples of the heat treatment performed by the substrate processing apparatus include oxidation, diffusion, annealing, reflow, baking, film formation by a thermal CVD (Chemical Vapor Deposition) reaction, film quality improvement (treatment) processing, and the like.

[0012] (1) Configuration of Substrate Processing Apparatus The entire apparatus will be described with reference to FIG. 1. The main part of the substrate processing apparatus is shown in FIG. 1.

[0013] The substrate processing apparatus 1 includes a housing 13. By means of a within-process transfer device (not shown), a pod (holder) 21, which is a sealed substrate container, is carried into and out of the substrate processing apparatus 1.

[0014] At the lower part of the housing 13, near the rear in the front-rear direction, a sub-housing 28 is provided across the rear end. On the front wall 29 of the sub-housing 28, a pair of wafer loading / unloading ports 32 for loading and unloading the wafer 31 into and out of the sub-housing 28 are opened side by side in two vertical stages in the vertical direction. Pod openers 26 are respectively provided for the upper and lower wafer loading / unloading ports 32.

[0015] The pod opener 26 includes a mounting table 33 on which the pod 21 is placed, and an opening / closing mechanism 34 for opening and closing the lid of the pod 21. The pod opener 26 is configured to open and close the wafer inlet / outlet of the pod 21 by opening and closing the lid of the pod 21 placed on the mounting table 33 with the opening / closing mechanism 34.

[0016] The sub-housing 28 forms a transfer chamber (loading chamber, loading area) 35 that is airtight from the space where the pod opener 26 is arranged. A transfer machine 36 is installed in the front area of the transfer chamber 35. The transfer machine 36 includes a plurality of end effectors 37 that hold the wafer 31. The end effector 37 is capable of linear movement, rotation, and vertical movement in the horizontal direction. The transfer machine 36 is configured to load and unload the wafer 31 with respect to a boat 38 as a substrate holder. The end effector 37 is also called a substrate gripping part, a wafer placement plate, a hand, a chuck, a fork, or tweezers, and is arranged in five in a direction perpendicular to the surface of the wafer 31 to be gripped.

[0017] Above the transfer chamber 35, a vertical processing furnace 12 is installed. The processing furnace 12 forms a processing chamber 14 inside, and the lower end of the lower part of the furnace mouth of the processing chamber 14 is open and is configured to be opened and closed by a furnace mouth shutter (not shown). The processing chamber 14 heat-treats the wafer 31 held by the boat 38.

[0018] On the side of the sub-housing 28, a boat elevator 42 for raising and lowering the boat 38 is installed. A seal cap 44 as a lid is horizontally attached to the lifting platform of the boat elevator 42. The seal cap 44 vertically supports the boat 38 and can airtightly close the furnace opening in a state where the boat 38 is loaded into the processing furnace 12. The transfer chamber 35 is adjacent to the processing chamber 14, and the boat 38 together with the wafers 31 is carried in and out between the transfer chamber 35 and the processing chamber 14. The boat 38 is configured to hold a plurality of (for example, about 50 or more and 175 or less) wafers 31 aligned at its center in a horizontal posture at predetermined intervals in multiple stages. As shown in FIG. 2, the boat 38 includes support columns 38a to 38c as columns for holding the wafers 31. Grooves (slots) for holding the wafers 31 are provided in the support columns 38a to 38c. The interval between the slots, that is, the interval between the wafers 31 held by the boat, can usually be 6 mm or less, which is different from the interval between the wafers 31 held by the pod 21.

[0019] On the side of the seal cap 44 opposite to the processing chamber 14, a rotation mechanism 46 for rotating the boat 38 around the central axis corresponding to the center of the wafer 31 is installed. The rotation axis of the rotation mechanism 46 passes through the seal cap 44 and is connected to the boat 38. The rotation mechanism 46 is configured to rotate the wafer 31 by rotating the boat 38.

[0020] An example of the configuration of the transfer machine will be described with reference to FIG. 2. FIG. 2 shows a state when the wafer 31 is transferred to the boat 38 by the transfer machine 36. That is, the end effector 37 of the transfer machine 36 faces the support columns 38a and 38c sides of the boat 38.

[0021] The transfer machine 36 includes a guide 360 provided along the vertical direction (Z-axis direction), a Z-axis direction drive unit 361, a Y-axis rotation drive unit 362, an X-axis direction drive unit 363, and a V-axis direction drive unit 364. Each of the drive units 361 to 364 can be referred to as a drive system.

[0022] The Z-axis drive unit 361 is provided at the lower end or the upper end of the guide 360 to move the mount 360a up and down (in the Z-axis direction, the vertical direction) along the guide 360.

[0023] The Y-axis rotation drive unit 362 is installed on the upper surface of the mount 360a so as to be rotatable in the Y-axis direction while supporting the X-axis and Y-axis of the X-axis drive unit 363 to be orthogonal to each other, and to rotate horizontally clockwise or counterclockwise (rotate around the Y-axis). Since the rotation range is such that the pod 21 is arranged between the direction of the boat 38 and the opposite direction as seen from the normal Y-axis, about 180 degrees is sufficient.

[0024] The X-axis drive unit 363 is provided integrally with or inside the Y-axis rotation drive unit 362 to support the V-axis drive unit 364 and move it back and forth in the horizontal direction (X-axis direction). The X-axis is defined as "forward" in the direction that protrudes from the Y-axis rotation drive unit 362 in order to allow the end effector 37 to enter the boat 38 or the pod 21.

[0025] The V-axis drive unit 364 is provided on the X-axis drive unit 363 and is configured to horizontally support five end effectors 37 and adjust (change) their intervals in the Z-axis direction. Each end effector 37 is attached to the V-axis drive unit 364 by a corresponding attachment unit 39. The V-axis drive unit 364 and the attachment unit 39 constitute a pitch variable mechanism.

[0026] After the end effector 37 is inserted without contacting the wafer 31, it can grip the corresponding wafer 31. Thereby, the transfer machine 36 can take out the wafer 31 from the pod 21 by the end effector 37 and load (charge) it into the boat 38. And after an arbitrary process is performed on the wafer 31 in the processing furnace 12, the transfer machine 36 can take out (discharge) the wafer 31 from the boat 38 by the end effector 37 and load it into the pod 21.

[0027] The transfer device 36 further includes a pair of sensor rods 50 provided on both side surfaces of the Y-axis rotation drive unit 362, and a forward and backward drive unit 365 that moves the sensor rods 50 in the X-axis direction.

[0028] The sensor rods 50 extend upward along both side surfaces of the Y-axis rotation drive unit 362 to approximately the same height as either of the end effectors 37, and are configured to bend at a substantially right angle in the direction opposite to the mounting direction of the end effector 37 with respect to the X-axis direction drive unit 363, that is, in the rearward X-axis direction. The sensor rods 50 hold a fiber sensor 51 as a mapping sensor.

[0029] At the tips of the pair of sensor rods 50, a light transmitting part or a light receiving part of the fiber sensor 51 is mounted. The fiber sensor 51 is a pair of transmissive sensors where one transmits light and the other receives it, and can be arranged such that the optical path (optical axis) formed between the light transmitting part and the light receiving part is parallel to the tangent of the wafer 31. The fiber sensor 51 performs mapping by detecting the interruption of the optical path to count the number of wafers 31 loaded in the pod 21 or the boat 38, or to detect normality or abnormality such as the wafers popping out.

[0030] The forward and backward drive unit 365 is arranged on both side surfaces of the Y-axis rotation drive unit 362, and supports the sensor rods 50 so as to be movable in the X-axis direction between a protruding position and a retracted position.

[0031] The transfer device 36 is provided with five substrate detectors 60 corresponding to the five end effectors 37. Each substrate detector 60 is arranged at a specific relative position with respect to the corresponding end effector 37. Each substrate detector 60 is configured to be able to optically detect the corresponding wafer 31 in at least one of the state where the corresponding end effector 37 is inserted between the wafers 31 held in the boat 38 or the pod 21, and the state where the end effector 37 is gripping the corresponding wafer 31.

[0032] The substrate detector 60 will be described with reference to FIGS. 3 and 4. FIG. 3 shows a state in which the end effector 37 is gripping the corresponding wafer 31.

[0033] The substrate detector 60 includes a support arm 61 as a fixing member, a light projecting part 62, a light receiving part 63, and a partition 64. The substrate detector 60 is a pair of reflection type sensors of the light projecting part 62 and the light receiving part 63 configured by fiber sensors. The substrate detector 60 is provided separately from the end effector 37 for each end effector 37.

[0034] The support arm 61 is screwed to one side surface of the mounting part 39 of the end effector 37. The support arm 61 extends parallel to the longitudinal direction of the end effector 37, bends and extends in the tangential direction of the wafer 31 to be placed, and constitutes a tip portion 611.

[0035] A rod-shaped light projecting part 62 and a light receiving part 63 are provided at the tip portion 611 of the support arm 61. Each of the light projecting part 62 and the light receiving part 63 is inserted into a through hole provided at the tip portion 611 and fixed (screwed) by screws 612 and 613 (see FIG. 8). Further, the light projecting part 62 and the light receiving part 63 are arranged substantially in parallel. The axial centers (central axes) of the light projecting part 62 and the light receiving part 63 point in the substantially central direction of the wafer 31 mounted on the end effector 37 (substantially coincide with the radial direction). The tips of the light projecting part 62 and the light receiving part 63 are located laterally away from the side edges of the end effector 37. Further, the optical axes of the light projecting part 62 and the light receiving part 63 are located inside the outer contour line of the wafer 31 mounted on the end effector 37.

[0036] The first end 621 of the light projecting unit 62 emits reference light from the first optical fiber 623. The first end 621 has a reflector 622 that reflects the reference light from the first optical fiber 623 in a direction orthogonal to the longitudinal direction of the light projecting unit 62. Thereby, the reference light from the optical fiber 623 can irradiate the wafer 31. The second end 631 of the light receiving unit 63 receives the reference light reflected by the back surface or the front surface of the wafer 31 and guides it to the second fiber 633. The second end 631 has a reflector 632 that reflects the reference light from a direction orthogonal to the longitudinal direction of the light receiving unit 63 and guides it to the second optical fiber 633. Thereby, the reference light reflected by the wafer 31 can be received by the optical fiber 623. Small holes (for example, about 0.5 mm in diameter) are opened on the side surfaces of the first end 621 and the second end 631, and light enters and exits through them.

[0037] The light projecting unit 62 has a sheath tube 624 that houses a part of the reflector 622 and the optical fiber 623, and a fixing portion 625 that houses the other part of the optical fiber 623. The fixing portion 625 is connected to the sheath tube 624 and has a larger diameter than the sheath tube 624. The light receiving unit 63 has a sheath tube 634 (see FIG. 8) that houses a part of the reflector 632 and the optical fiber 633, and a fixing portion 635 (see FIG. 8) that houses the other part of the optical fiber 633. The fixing portion 635 is connected to the sheath tube 634 and has a larger diameter than the sheath tube 634.

[0038] The sheath tubes 624, 634 and the fixing portions 625, 635 are, for example, metal tubes, and the optical fibers 623, 633 are sealed therein with an adhesive. The fixing portions 625, 635 have a strength that can withstand screwing. Since they have a larger diameter, fixing and positioning are facilitated.

[0039] The partition 64 is fitted into the recess at the tip 611 of the support arm 61 and fixed (screwed) by screws 614, 615 (see Fig. 8). The partition 64 extends from the tip 611 in the direction of the center of the wafer 31 received on the end effector 37. The partition 64 is preferably formed, for example, by black anodizing or black painting. For example, the reflectance in this case is about 0.1%. This can reduce the reflection of the reference light.

[0040] The partition 64 has a plate 641 disposed below the light projecting unit 62 and the light receiving unit 63, a wall 642 disposed between the light projecting unit 62 and the light receiving unit 63, and a fixing portion 643 fixed to the arm 61. The plate 641 is on the side opposite to the wafer 31 to be detected (here, below) as viewed from the light projecting unit 62 and the light receiving unit 63, and is configured to extend between the vicinity of the first end 621 and the vicinity of the second end 631. The wall 642 is provided on the surface of the plate 641 on the side of the wafer 31 to be detected, and blocks (shields) the reference light from the first end 621 from directly entering the second end 631. Therefore, the wall 642 has a predetermined height higher than the heights of the axes of the light projecting unit 62 and the light receiving unit 63. Also, the wall 642 has a predetermined width.

[0041] The support arm 61 fixes the positions of the first end 621 of the light projecting unit 62 and the second end 631 of the light receiving unit 63 with respect to the plate 641 or the wall 642. Thereby, the optimization of the interval (sensor pitch) between the light projecting unit 62b and the light receiving unit 63b can be performed.

[0042] The functions of the plate 641 and the wall 642 and the arrangement range of the light receiving unit 63 will be described with reference to Fig. 4. Fig. 4 shows the arrangement of the plate 641a, the wall 642a, the light projecting unit 62a and the light receiving unit 63a at the uppermost stage of the substrate detector 60, and the plate 641b, the wall 642b, the light projecting unit 62b and the light receiving unit 63b at the lower stage thereof. The arrangement range of the light receiving unit 63 when the position of the light projecting unit 62 with respect to the wall 642 is fixed will be described.

[0043] In the uppermost stage, there is no plate 641 on the wafer 31a. Therefore, the reference light from the light projecting unit 62a can be reflected only by the wafer 31a and then enter the light receiving unit 63a. Among the reference light from the light projecting unit 62a, the light that exceeds the wall 642a can enter the light receiving unit 63a. The light receiving unit 63a can be arranged up to the position P3.

[0044] The upper plate 641a blocks the reference light from the lower light projecting unit 62b. The upper wall 642a blocks the direct incidence of the reference light from the upper light projecting unit 62a to the light receiving unit 63a. The reference light from the lower light projecting unit 62b is reflected on the lower surface of the wafer 31a and the lower surface of the upper plate 641a.

[0045] In a stage below the uppermost stage, for example, in the stage immediately below the uppermost stage, there is a plate 641a on the wafer 31b. Therefore, the reference light from the light projecting unit 62b can be reflected by the plate 641a in addition to the wafer 31b and then enter the light receiving unit 63a.

[0046] Let the distance (height) from the axis of the lower light projecting unit 62b and the light receiving unit 63b to the lower surface of the wafer 31b located above them be Y. Let the distance (height) from the axis of the light projecting unit 62b and the light receiving unit 63b to the lower surface of the upper plate 641a be H. Let the distance from the axis of the light projecting unit 62b and the light receiving unit 63b to the side surface of the lower wall 642b be X. Let half of the length (width) of the wall 642 in the direction perpendicular to the axes of the light projecting unit 62 and the light receiving unit 63 be V, and let the height from the axes of the light projecting unit 62 and the light receiving unit 63 to the upper surface of the wall 642 be h.

[0047] Let the angle at which the reference light from the light projecting unit 62b exceeds the wall 642b be α with respect to the line connecting the axes of the light projecting unit 62b and the light receiving unit 63b. Let the angle at which the reference light from the light projecting unit 62b is reflected by the lower surface of the wafer 31b and exceeds the wall 642b be β. Let the angle at which the reference light from the light projecting unit 62b is reflected by the lower surface of the upper plate 641a at the center of the width of the wall 642b be θ. Here, the relationships of α, β, and θ are as follows. 0° < α < β < θ < 90°

[0048] If it detects the wafer 31b but the upper plate 641a does not detect it within a range (effective range: the distance between position P1 and position P2) denoted as A, then A is as follows. Y / tanβ < A < H / tanθ tanθ = Y / (X + V) tanβ = h / (X - A) ∴ YX / (Y + h) < A < H(X + V) / Y

[0049] Note that between position P2 and position P3 is the range where both the wafer 31b and the upper plate 641a are detected, and between position P3 and position P4 is the range where only the upper plate 641a is detected.

[0050] The light emitted from the first end portion 621 spreads at a certain angle (the same applies to light reception). The opening angle (half-value angle) representing the spreading angle is preferably 2 to 60 degrees. A wider opening angle is more desirable so that the angle accuracy during the assembly of the substrate detector 60 is not strict. Note that the notation of a numerical range such as "2 to 60 degrees" in this specification means that the lower limit value and the upper limit value are included in that range. Therefore, for example, "2 to 60 degrees" means "2 degrees or more and 60 degrees or less". The same applies to other numerical ranges.

[0051] The light projecting unit 62 and the light receiving unit 63 (the base end portions of the pair of optical fibers 623, 633) are connected to the amplifier unit 40 (see FIG. 5). The amplifier unit 40 incorporates a light source (for example, a light-emitting diode), a light detector (for example, a photodiode), and a detection circuit.

[0052] The light emitted from the light source built in the amplifier unit 40 enters the base end of the optical fiber 623, propagates through the optical fiber 623, enters the reflector 622 from its tip surface, and exits from the first end 621. When the emitted light (reference light) is reflected by the wafer 31 to be detected, the reflected light enters the second end 631 and enters the tip surface of the optical fiber 633. Therefore, the light projecting unit 62 and the light receiving unit 63 are fixed to the tip 611 of the support arm 61 so that the emission surface (hole) of the first end 621 and the incident surface (hole) of the second end 631 face substantially the same direction. The incident light propagates through the optical fiber 633 and reaches the photodetector built in the amplifier unit 40.

[0053] The detection circuit built in the amplifier unit 40 determines the presence or absence of a substrate including (a transparent substrate) by threshold processing of the received light level. The threshold may be common for all substrate detectors. In other words, since the risk of false detection is low, adjustment for each substrate detector is unnecessary.

[0054] As shown in FIG. 5, the controller 210, which is a control unit (control means), is configured as a computer including a CPU (Central Processing Unit) 212, a RAM (Random Access Memory) 214, a storage device 216, and an I / O port 218. The RAM 214, the storage device 216, and the I / O port 218 are configured to be able to exchange data with the CPU 212 via an internal bus 220. An input / output device 222 configured as, for example, a touch panel is connected to the controller 210.

[0055] The memory device 216 is composed of, for example, a flash memory, an HDD (Hard Disk Drive), etc. In the memory device 216, a control program for controlling the operation of the substrate processing apparatus, a process recipe in which procedures and conditions for substrate processing described later, etc. are stored in a readable manner. The process recipe is a combination that enables the controller 210 to execute each procedure in the substrate processing step described later and obtain a predetermined result, and functions as a program. Hereinafter, this process recipe, control program, etc. are collectively referred to simply as a program. When the term "program" is used in this specification, it may include only the process recipe alone, only the control program alone, or both of them. The RAM 214 is configured as a memory area (work area) that temporarily holds programs, data, etc. read by the CPU 212.

[0056] The I / O port 218 is connected to the above-described transfer machine 36, rotation mechanism 46, boat elevator 42, amplifier unit 40, etc.

[0057] The CPU 212 is configured to read and execute the control program from the memory device 216, and to read the process recipe from the memory device 216 in response to the input of an operation command from the input / output device 222, etc. The CPU 212 is configured to control the wafer transfer operation by the transfer machine 36, the rotation and rotation speed adjustment operation of the boat 38 by the rotation mechanism 46, the lifting and lowering operation of the boat 38 by the boat elevator 42, and the substrate detection operation by the amplifier unit 40 in accordance with the content of the read process recipe.

[0058] The controller 210 can be configured by installing the above-described program stored in the external storage device 224 on a computer. The external storage device 224 is, for example, a magnetic tape, a magnetic disk such as a flexible disk or a hard disk, an optical disk such as a CD or a DVD, a magneto-optical disk such as an MO, or a semiconductor memory such as a USB memory or a memory card. The storage device 216 and the external storage device 224 are configured as computer-readable recording media. Hereinafter, these are collectively referred to simply as recording media. When the term "recording medium" is used in this specification, it may include only the storage device 216 alone, only the external storage device 224 alone, or both of them. Note that the program may be provided to the computer without using the external storage device 224 by using communication means such as the Internet or a dedicated line.

[0059] (2) Substrate Processing Step The outline of the substrate processing step of processing a substrate using the substrate processing apparatus 1 as a semiconductor manufacturing apparatus will be described. This substrate processing step is, for example, one step for manufacturing a semiconductor device. In the following description, the operations and processes of each part constituting the substrate processing apparatus 1 are controlled by the controller 210.

[0060] (Substrate Loading Step: S10) When the pod 21 is supplied to the substrate processing apparatus 1, it is transferred to the mounting table 33.

[0061] The pod 21 placed on the mounting table 33 has its opening-side end face pressed against the opening edge portion of the wafer loading / unloading port 32 on the front wall 29 of the sub-housing 28, and the lid is removed by the opening / closing mechanism 34, thereby opening the wafer entrance / exit.

[0062] When the pod 21 is opened by the pod opener 26, the sensor rod 50 of the transfer device 36 moves to the protruding position (the direction approaching the pod 21) by the forward and backward drive unit 365. Then, the sensor rod 50 moves up and down at a constant speed by the Z-axis direction drive unit 361, and the fiber sensor 51 maps the wafer 31 to sequentially detect the wafers 31 in the pod 21. After the mapping operation is completed, the sensor rod 50 is returned to the retracted position.

[0063] Then, the forward movement, upward movement, and backward movement of the end effector 37, the turning and pitch change of the Y-axis rotation drive unit 362, the forward movement, downward movement, and backward movement of the end effector 37, and the turning and pitch change of the Y-axis rotation drive unit 362 are sequentially repeated. As a result, the wafer 31 is picked up from the pod 21 through the wafer loading and unloading port 32 and loaded (charged) into the boat 38. The output (state) of the substrate detector 60 when the end effector 37 is inserted into the pod 21 is stored. During the transfer, if the output of the substrate detector 60 is monitored and the output changes, it is determined as abnormal, the transfer is stopped, and an alarm is issued. This makes it possible to detect the dropping or displacement of the substrate during transfer.

[0064] After the loading is completed, the lower end of the processing furnace 12 that was closed by the furnace port shutter is opened by the furnace port shutter. Subsequently, the boat 38 holding the wafers 31 is lifted (boat up) by the seal cap 44 by the boat elevator 42 and carried into (loaded into) the processing furnace 12 from the transfer chamber 35.

[0065] (Film formation process: S20) After the loading, heat treatment is performed on the wafers 31 in the processing chamber 14 in the processing furnace 12.

[0066] (Substrate unloading process: S30) Next, the boat 38 on which the heat-treated wafers 31 are placed is unloaded (boat unload) from the processing chamber 14 to the transfer chamber 35. Then, the boat 38 cools the wafers 31 on which the heat treatment has ended.

[0067] After cooling, the sensor rod 50 of the transfer machine 36 is moved to the protruding position by the forward and backward drive unit 365. Then, the sensor rod 50 is moved up and down by the Z-axis direction drive unit 361, and the wafer 31 is mapped by the fiber sensor 51. When the mapping is completed, the sensor rod 50 is returned to the storage position.

[0068] Subsequently, the forward movement, upward movement, and backward movement of the end effector 37, the turning and pitch change of the Y-axis rotation drive unit 362, the forward movement, downward movement, and backward movement of the end effector 37, and the turning and pitch change of the Y-axis rotation drive unit 362 are sequentially repeated. As a result, the wafer 31 is picked up from the boat 38 and carried out to the pod 21 through the wafer loading / unloading port 32. Then, the pod 21 is carried out to the outside of the housing 13. During this period, the output of the substrate detector 60 is monitored in the same manner as in the substrate loading process 10.

[0069] According to this aspect, one or more of the following effects can be obtained.

[0070] (a) The height of the substrate detector can be suppressed, and it is possible to cope with conveyance to a narrow pitch boat.

[0071] (b) It is possible to surely shield reflected light (stray light) from sources other than the target wafer, and the detection accuracy can be increased.

[0072] (c) Since the substrate detector is a reflection type sensor in which the light projecting unit is arranged so as to have an incident angle close to 90°, the reflectance becomes high as per the Fresnel formula, and high sensitivity (high S / N) is possible compared to a transmission type sensor with an orthogonal optical axis or an oblique optical axis.

[0073] (d) The wafer 31 can be detected even if it is a visually transparent (substantially passing visible light) wafer, for example, a silicon carbide (SiC) wafer.

[0074] (e) Since changing the pitch of the end effector does not change the optical arrangement such as the distance between the light projecting unit and the light receiving unit, it is possible to eliminate the influence on the operation of the sensor.

[0075] The substrate detector 60 in another aspect will be described with reference to FIGS. 7 and 8. FIG. 7 shows a state in which the substrate detector 60 is inserted between the wafers 31 placed on the pod 21 or the boat 38.

[0076] The configuration of the plate 641 of the partition 64 in this aspect is different from the plate 641 in the embodiment shown in FIG. 4. Other configurations of the substrate detector 60 in this aspect are the same as those in the embodiment.

[0077] The width of the plate 641 is smaller than the distance between the central axis of the light projecting unit 62 and the central axis of the light receiving unit 63. Both side ends of the plate 641 close to the first end 621 and the second end 631 respectively have first and second tapered surfaces 644, 645 that taper towards the point (lower end) furthest from the corresponding wafer 31 (the wafer 31 to be detected) of the first end 621 and the second end 631. Thereby, the incident of the reference light from the lower stage can be prevented. The tapered surfaces 644, 645 are formed, for example, with a chamfer of 30 degrees with respect to the horizontal plane. The points (lower ends) of the first end 621 and the second end 631 furthest from the corresponding wafer 31 are arranged substantially flush with the surface of the plate 641 on the side opposite to the corresponding wafer 31 (the lower surface of the plate 641). The lower surface of the plate 641 is arranged substantially flush with the lower surface of the corresponding end effector 37.

[0078] The maximum thickness of the portion (tip) inserted between the wafers of the substrate detector 60, that is, the sum of the height of the plate 641 and the wall 642, is substantially the same as the outer diameter of the sheath tubes 624 and 634, and this is denoted as H1. When the end effector 37 receives the wafer 31, the end effector 37 and the substrate detector 60 rise toward the wafer 31. The distance between the lower end of the substrate detector 60 and the lower surface of the wafer 31 at this time (wafer placement height) is denoted as H2. In addition, the maximum thickness height (height) of the portion of the end effector 37 inserted between the wafers is denoted as H3. Here, H1 < H2 < H3. H1 is, for example, 0.5 to 2 mm, H2 is, for example, 1 mm to 3 mm or H1 + 0.2 mm to H1 + 1.5 mm, and H3 is, for example, 11.3 to 4 mm or H2 + 0.3 mm to H2 + 2 mm.

[0079] Also in this embodiment, the same effects as those of the above-described embodiment can be obtained. Further, in this embodiment, the position of the lower surface of the plate 641 is arranged closer to the light projecting unit 62 and the light receiving unit 63 than the position of the lower surface of the plate 641 in the embodiment shown in FIG. 4, and the portion (tip) of the substrate detector 60 inserted between the wafers is thinned. Thereby, the upper end of the tip of the substrate detector 60 can be made lower than the lower surface of the wafer 31 to avoid contact with the wafer 31. Also, the lower end of the tip of the substrate detector 60 can be made higher than the lower end of the end effector 37 to avoid reducing the conveyance clearance.

[0080] As described above, the embodiments of the present disclosure have been specifically described, but the present disclosure is not limited to the above-described embodiments, and various modifications can be made without departing from the gist thereof. For example, a groove can be provided along the radial direction of the wafer on the lower surface of the plate 641 directly below the wall 642 to further reduce the back surface reflection of the plate 641.

[0081] In the above-described aspect, an example of heat treatment using a batch-type substrate processing apparatus that processes a plurality of substrates at once has been described. The present disclosure is not limited to the above-described aspect, and for example, it can also be suitably applied when performing heat treatment using a single-wafer type substrate processing apparatus that processes one or several substrates at once. Further, in the above-described aspect, an example of forming a film using a substrate processing apparatus having a hot-wall type processing furnace has been described. The present disclosure is not limited to the above-described aspect, and it can also be suitably applied when performing heat treatment using a substrate processing apparatus having a cold-wall type processing furnace.

[0082] Even when using these substrate processing apparatuses, each process can be performed with the same processing procedures and processing conditions as in the above-described aspect, and the same effects as in the above-described aspect can be obtained.

Explanation of Reference Numerals

[0083] 36: Transfer machine 37: End effector 60: Substrate detector 62: Light projecting unit 621: First end 63: Light receiving unit 631: Second end 641: Plate 642: Wall

Claims

1. (a) An end effector configured to be able to grip a corresponding substrate after being inserted into a holder that houses a plurality of substrates in multiple stages without contacting the substrate; (b) Separated from the end effector and arranged at a specific relative position with respect to the end effector, (b1) A light projecting portion formed in a rod shape and having a first end that emits reference light from a first optical fiber; (b2) A light receiving portion formed in a rod shape, substantially opposed to the first end, and having a second end that receives the reference light reflected by the back surface or front surface of the corresponding substrate, which is transparent, and guides it to a second optical fiber; (b3) A plate that extends between the vicinity of the first end and the vicinity of the second end on the side opposite to the corresponding substrate as viewed from the light projecting portion and the light receiving portion; (b4) A wall provided on the surface of the plate on the corresponding substrate side to prevent direct incidence of the reference light from the first end to the second end; and A substrate detector configured to optically detect the corresponding substrate in at least one of the state of being inserted into the holder and the state of gripping the corresponding substrate; The plate is arranged substantially parallel to the corresponding substrate gripped by the end effector, and the points of the first end and the second end that are farthest from the corresponding substrate are arranged substantially flush with the surface of the plate on the side opposite to the corresponding substrate; The substrate detector is a transfer machine in which the lower end of the portion inserted between the substrates has a height above the lower end of the end effector.

2. The transfer machine according to claim 1, wherein the light projecting portion and the light receiving portion are arranged substantially parallel to each other, and the width of the plate is smaller than the distance between the central axes of the light projecting portion and the light receiving portion.

3. The transfer machine according to claim 2, wherein both side ends of the plate close to the first end and the second end respectively have first and second tapered surfaces that taper toward the points of the first end and the second end that are farthest from the corresponding substrate.

4. The transfer machine according to claim 1, wherein the sum of the heights of the plate and the wall is substantially the same as the outer diameters of the light projecting portion and the light receiving portion.

5. A plurality of the end effectors are provided in a direction perpendicular to the surface of the substrate to be gripped; The substrate detector is provided separately from each end effector for each end effector, according to any one of claims 1 to 4.

6. The transfer device according to claim 5, further comprising a pitch variable mechanism configured to be able to change the intervals between the plurality of end effectors.

7. The transfer device according to claim 5, wherein the substrate detector further has a fixing member that fixes and holds the positions of the first end portion and the second end portion with respect to the plate or the wall.

8. The first end portion has a first reflector that reflects the reference light from the first optical fiber in a direction orthogonal to the longitudinal direction of the light projecting portion. The transfer device according to claim 5, wherein the second end portion has a second reflector that reflects the reference light from a direction orthogonal to the longitudinal direction of the light receiving portion and guides the reflected light to the second optical fiber.

9. The light projecting portion includes a first sheath tube that houses a part of the first optical fiber and the first end portion, and a first fixing portion that is connected to the first sheath tube and houses the other part of the first optical fiber and has a larger diameter than the first sheath tube. The transfer device according to claim 8, wherein the light receiving portion includes a second sheath tube that houses a part of the second optical fiber and the second end portion, and a second fixing portion that is connected to the second sheath tube and houses the other part of the second optical fiber and has a larger diameter than the second sheath tube.

10. The light projecting portion and the light receiving portion are arranged substantially in parallel, and the longitudinal direction of the light projecting portion or the light receiving portion substantially coincides with the radial direction of the corresponding substrate. The light projecting portion includes a first sheath tube that houses a part of the first optical fiber and the first end portion, and a first fixing portion that is connected to the first sheath tube and houses the other part of the first optical fiber and has a larger diameter than the first sheath tube. The transfer device according to claim 5, wherein the light receiving portion includes a second sheath tube that houses a part of the second optical fiber and the second end portion, and a second fixing portion that is connected to the second sheath tube and houses the other part of the second optical fiber and has a larger diameter than the second sheath tube.

11. (a) An end effector configured to be able to grip a corresponding substrate after being inserted into a holder that houses a plurality of substrates in multiple stages without contacting the substrates. (b) Separately arranged at a specific relative position with respect to the end effector. (b1) A light projecting portion formed in a rod shape and having a first end portion that emits reference light from a first optical fiber. A light receiving portion formed in a rod shape, substantially facing the first end portion, having a second end portion that receives the reference light reflected by the back surface or the front surface of the corresponding substrate that is transparent and guides the received light to a second optical fiber; A plate that extends between the vicinity of the first end portion and the vicinity of the second end portion on the side opposite to the corresponding substrate as viewed from the light projecting portion and the light receiving portion; A wall provided on the surface of the plate on the corresponding substrate side, which prevents direct incidence of the reference light from the first end portion to the second end portion; and A substrate detector configured to optically detect the corresponding substrate in at least one of a state where the substrate is inserted into the holder and a state where the corresponding substrate is being gripped; The plate is disposed substantially parallel to the corresponding substrate gripped by the end effector, and the points of the first end portion and the second end portion that are farthest from the corresponding substrate are disposed substantially flush with the surface of the plate on the side opposite to the corresponding substrate; The substrate detector has a lower end of a portion inserted between substrates at a height higher than the lower end of the end effector.

12. (a) An end effector configured to be able to grip a corresponding substrate after being inserted into a holder that houses a plurality of substrates in multiple stages without contacting the substrate; and (b) Separated from the end effector and arranged at a specific relative position with respect to the end effector, (b1) A light projecting portion formed in a rod shape and having a first end that emits reference light from a first optical fiber; (b2) Formed in a rod shape, substantially opposed to the first end, and having a second end that receives the reference light reflected by the back surface or the front surface of the corresponding transparent substrate and guides it to a second optical fiber; (b3) A plate that extends between the vicinity of the first end and the vicinity of the second end on the side opposite to the corresponding substrate as viewed from the light projecting portion and the light receiving portion; (b4) A wall provided on the surface of the plate on the corresponding substrate side to prevent direct incidence of the reference light from the first end to the second end, and having a substrate detector configured to be able to optically detect the corresponding substrate in at least one of the state of being inserted into the holder and the state of gripping the corresponding substrate, the plate is arranged substantially parallel to the corresponding substrate gripped by the end effector, and the points of the first end and the second end that are farthest from the corresponding substrate are arranged substantially flush with the surface of the plate on the side opposite to the corresponding substrate, and the substrate detector, a step of transporting the substrate by a transfer machine in which the lower end of the portion inserted between the substrates has a height higher than the lower end of the end effector, A substrate processing method including a step of processing the substrate.

13. The substrate processing method according to claim 12, wherein in the step of transporting the substrate, the output of the substrate detector is monitored to detect a substrate drop or displacement during transportation.

14. (a) An end effector configured to be able to grip a corresponding substrate after being inserted into a holder that houses a plurality of substrates in multiple stages without contacting the substrate; and (b) separated from the end effector at a specific relative position with respect to the end effector, (b1) a light projecting part formed in a rod shape and having a first end that emits reference light from a first optical fiber; (b2) a light receiving part formed in a rod shape, substantially opposed to the first end, and having a second end that receives the reference light reflected by the back surface or front surface of the corresponding substrate, which is transparent, and guides it to a second optical fiber; (b3) a plate that extends between the vicinity of the first end and the vicinity of the second end on the side opposite to the corresponding substrate as seen from the light projecting part and the light receiving part; and (b4) a wall provided on the surface of the plate on the corresponding substrate side to prevent direct incidence of the reference light from the first end to the second end, and having a substrate detector configured to be able to optically detect the corresponding substrate in at least one of a state of being inserted into the holder and a state of gripping the corresponding substrate, the plate is arranged substantially parallel to the corresponding substrate gripped by the end effector, and the points of the first end and the second end that are farthest from the corresponding substrate are arranged substantially flush with the surface of the plate on the side opposite to the corresponding substrate, and the substrate detector, a step of transporting the substrate by a transfer machine in which the lower end of the portion inserted between the substrates has a height higher than the lower end of the end effector, a step of processing the substrate, a method for manufacturing a semiconductor device including the steps.

15. (a) A holder that accommodates a plurality of substrates in multiple stages, and an end effector configured to be able to grip the corresponding substrate after being inserted without contacting the substrate; (b) Separated from the end effector at a specific relative position with respect to the end effector and arranged, (b1) A light projecting portion formed in a rod shape and having a first end that emits reference light from a first optical fiber; (b2) Formed in a rod shape, substantially opposed to the first end, and having a second end that receives the reference light reflected by the back surface or front surface of the corresponding transparent substrate and guides it to a second optical fiber; (b3) A plate that extends between the vicinity of the first end and the vicinity of the second end on the side opposite to the corresponding substrate as viewed from the light projecting portion and the light receiving portion; (b4) A wall provided on the surface of the plate on the corresponding substrate side that blocks direct incidence of the reference light from the first end to the second end, and having a substrate detector configured to be able to optically detect the corresponding substrate in at least one of a state of being inserted into the holder and a state of gripping the corresponding substrate, the plate is arranged substantially parallel to the corresponding substrate gripped by the end effector, and the points of the first end and the second end that are farthest from the corresponding substrate are arranged substantially flush with the surface of the plate on the side opposite to the corresponding substrate, and the substrate detector has a procedure for transporting the substrate by a transfer machine in which the lower end of the portion inserted between the substrates has a height higher than the lower end of the end effector, A program for causing a computer to execute a procedure for processing the substrate in a substrate processing apparatus.

16. The transfer machine according to claim 1, wherein the surface of the plate on the side opposite to the corresponding substrate is black.

Images