Composition for forming a wavelength conversion member, color resist, color filter, method for producing a color resist, light-emitting device, and method for producing a light-emitting device

Abstract

The present invention addresses the problem of providing a wavelength conversion member molding composition that is used to produce a wavelength conversion member, is capable of increasing the wavelength conversion efficiency of light when the wavelength conversion member is irradiated with the light, and does not tend to impair preservation stability. This wavelength conversion member molding composition contains a reaction curable compound (A), a phosphor (B), and light scattering particles (C). The light scattering particles (C) include a core-shell particle (C0) having a core part and a shell covering the core part. The specific gravity of the core part is 2.0 or less. The refractive index of the shell is 1.9 or more.

Description

Technical Field

[0001] The present disclosure relates to a composition for forming a wavelength conversion member, a color resist, a color filter, a method for manufacturing a color resist, a light-emitting device, and a method for manufacturing a light-emitting device. Specifically, the present disclosure relates to a composition for forming a wavelength conversion member containing a phosphor, a color resist produced from the composition for forming a wavelength conversion member, a color filter including the color resist, a method for manufacturing the color resist, a light-emitting device including the color filter, and a method for manufacturing a light-emitting device using the composition for forming a wavelength conversion member.

Background Art

[0002] Patent Document 1 discloses an ink composition for forming an optical conversion layer used in an inkjet method, which contains luminescent nanocrystal particles, light-scattering particles, and a photopolymerizable compound and / or a thermosetting resin, and the light-scattering particles contain titanium oxide or the like. By scattering light with the light-scattering particles, the wavelength conversion efficiency by the luminescent nanocrystal particles is increased.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

[0004] When producing a wavelength conversion member such as a color filter, the inventor has been conducting research on increasing the wavelength conversion efficiency by scattering light in the wavelength conversion member by blending light-scattering particles in the molding material as in Patent Document 1.

[0005] However, according to the inventor's own investigation, when using high-refractive-index particles such as titanium oxide particles as in the case of Patent Document 1 as the light-scattering particles, although high light scattering can be obtained, the particles tend to sediment in the composition, and thus the storage stability of the composition is impaired.

[0006] An object of the present disclosure is to provide a composition for forming a wavelength conversion member that can be used for manufacturing a wavelength conversion member, can enhance the wavelength conversion efficiency of light when the wavelength conversion member is irradiated with light, and is less likely to have its storage stability impaired, a color resist produced from this composition for forming a wavelength conversion member, a color filter including this color resist, a method for manufacturing this color resist, a light-emitting device including this color filter, and a method for manufacturing a light-emitting device using the composition for forming a wavelength conversion member.

[0007] The composition for forming a wavelength conversion member according to the first aspect of the present disclosure contains a reaction curable compound (A), a phosphor (B), and light-scattering particles (C). The light-scattering particles (C) include core-shell type particles (C0) having a core portion and a shell covering the core portion. The specific gravity of the core portion is 2.0 or less. The refractive index of the shell is 1.9 or more.

[0008] The composition for forming a wavelength conversion member according to the second aspect of the present disclosure contains a reaction curable compound (A), a phosphor (B), and light-scattering particles (C). The light-scattering particles (C) contain titanium oxide particles (C1) and hollow particles (C2).

[0009] The color resist according to the present disclosure includes a cured product of the composition for forming a wavelength conversion member in the first or second aspect.

[0010] The color filter according to the present disclosure includes the color resist.

[0011] A method for manufacturing a color resist according to one aspect of the present disclosure is to form the composition for forming a wavelength conversion member by an inkjet method and then irradiate the composition for forming a wavelength conversion member with ultraviolet rays to cure it.

[0012] The light-emitting device according to the present disclosure includes the color filter and a light source that irradiates light onto the color filter.

[0013] A method for manufacturing a light-emitting device according to an aspect of the present disclosure is a method for manufacturing a light-emitting device including a color filter including a color resist and a light source that irradiates the color filter with light, and the color resist is manufactured by the method for manufacturing the color resist described above.

Brief Description of the Drawings

[0014]

Figure 1

Embodiments for Carrying Out the Invention

[0015] Hereinafter, preferred embodiments of the present disclosure will be described.

[0016] The composition for forming a wavelength conversion member according to the present embodiment (hereinafter, also referred to as composition (X)) contains a reaction curable compound (A), a phosphor (B), and light scattering particles (C).

[0017] In the first embodiment, the light scattering particles (C) include core-shell type particles (C0) having a core portion and a shell covering the core portion. The specific gravity of the core portion is 2.0 or less. The refractive index of the shell is 1.9 or more.

[0018] Note that the refractive index is the refractive index with respect to the sodium D line (wavelength 589.3 nm) at 25°C.

[0019] In the second embodiment, the light scattering particles (C) contain titanium oxide particles (C1) and hollow particles (C2).

[0020] According to the present embodiment, a wavelength conversion member (i.e., an optical component having a function of converting the wavelength of light) can be produced by molding and then curing the composition (X). This wavelength conversion member can be applied to, for example, the color resist 1 in the color filter 2 (see FIGS. 1A and 1B). That is, according to the present embodiment, a color filter 2 including a color resist 1 containing a phosphor (B) can be produced.

[0021] In the present embodiment, when the wavelength conversion member is irradiated with light, the light scattering particles (C) can scatter the light in the cured product. Therefore, the chance of light reaching the phosphor (B) in the cured product increases, and as a result, the efficiency of wavelength conversion increases. Therefore, the wavelength conversion member can exhibit a high wavelength conversion efficiency compared to its size.

[0022] In the second embodiment, particularly, since the titanium oxide particles (C1) have high light scattering properties in the resin, the chance of light reaching the phosphor (B) in the cured product increases, which is effective for enhancing the efficiency of wavelength conversion.

[0023] Further, in the second embodiment, although the composition (X) contains titanium oxide particles (C1) having a relatively high specific gravity, the light scattering particles (C) are less likely to settle during storage of the composition (X). That is, the titanium oxide particles (C1) are less likely to impair the storage stability of the composition (X). This is presumably because the light scattering particles (C) also contain hollow particles (C2) together with the titanium oxide particles (C1), and due to the interaction between the two, not only the hollow particles (C2) but also the titanium oxide particles (C1) are less likely to settle.

[0024] In a preferred embodiment of the present disclosure, when manufacturing a wavelength conversion member using the composition (X), it is preferably formed by an inkjet method. In this case, the wavelength conversion member can be manufactured with high positional accuracy. Furthermore, for this reason, the wavelength conversion member can be made high-definition, that is, minute wavelength conversion members can be manufactured at high density. For this reason, for example, high definition (high resolution) of a light-emitting device 11 including a color filter 2, particularly a display device, can be realized. Also, when the composition (X) is formed by an inkjet method as compared with a printing method involving contact such as a screen printing method, foreign matter is less likely to be mixed into the composition (X) and its cured product, and thus the yield in manufacturing the wavelength conversion member is less likely to deteriorate. Note that the composition (X) may be formed by a method other than an inkjet method such as a screen printing method.

[0025] When the composition (X) is formed by an inkjet method, it is difficult to increase the thickness dimension of the wavelength conversion member manufactured from the composition (X), and thus the thickness of the wavelength conversion member is, for example, 10 μm or less. However, in this embodiment, as described above, since the wavelength conversion member can exhibit high wavelength conversion efficiency compared to its size, high wavelength conversion efficiency can be exhibited even if the thickness of the wavelength conversion member is small.

[0026] The composition (X) preferably does not contain a solvent or has a solvent content (percentage of the solvent with respect to the entire composition (X)) of 1% by mass or less. In this case, outgas derived from the solvent is less likely to be generated from the composition (X) and the cured product of the composition (X). For this reason, a change in the viscosity of the composition (X) due to the evaporation of the solvent is less likely to occur, thereby enhancing the storage stability of the composition (X). Also, it is possible to less likely generate voids caused by outgas within the wavelength conversion member. For this reason, it is less likely for water to reach the wavelength conversion member through the voids, and the phosphor (B) in the wavelength conversion member can be less likely to deteriorate due to water. Further, a drying process for removing the solvent from the composition (X) and the cured product can be made unnecessary during the production of the wavelength conversion member. Even if there is a drying process for removing the solvent from at least one of the composition (X) and the cured product, in this case, at least one of a reduction in the heating temperature and a shortening of the heating time in the drying process can be enabled. For this reason, it is possible to less likely generate outgas from the wavelength conversion member without reducing the manufacturing efficiency of the wavelength conversion member. Furthermore, if the composition (X) does not contain a solvent or has a solvent content of 1% by mass or less, when the composition (X) is particularly molded by the inkjet method, a decrease in thickness due to the evaporation of the solvent from the molded composition (X) is less likely to occur, and thus a decrease in the thickness of the wavelength conversion member is less likely to occur. Therefore, while molding by the inkjet method, it is possible to ensure as large a thickness as possible for the wavelength conversion member and to ensure as large a wavelength conversion ability as possible by the wavelength conversion member. The solvent content is more preferably 0.5% by mass or less, still more preferably 0.3% by mass or less, and particularly preferably 0.1% by mass or less. It is particularly preferable that the composition (X) does not contain a solvent or contains only an unavoidably mixed solvent. Incidentally, the solvent content of the composition (X) may exceed 1% by mass.

[0027] The glass transition temperature of the cured product of the composition (X) is preferably 80°C or higher. That is, the composition (X) preferably has the property of becoming a cured product with a glass transition temperature of 80°C or higher upon curing. In this case, the wavelength conversion member can have good heat resistance. Therefore, for example, when the wavelength conversion member is subjected to a process accompanied by a temperature rise, the wavelength conversion member is less likely to deteriorate. For this reason, for example, when a protective layer is formed by a vapor deposition method such as plasma CVD so as to cover the wavelength conversion member made of the composition (X), even if the wavelength conversion member is heated, the wavelength conversion member is less likely to deteriorate. Also, by enhancing the heat resistance, the wavelength conversion member can be adapted to in-vehicle applications where strict requirements are imposed on heat resistance. The glass transition temperature of the cured product is more preferably 90°C or higher, and even more preferably 100°C or higher. The glass transition temperature of this cured product can be achieved by the composition of the composition (X) described in detail below.

[0028] The viscosity of the composition (X) at 25°C is preferably 30 mPa·s or less. In this case, the composition (X) can be molded by an inkjet method at room temperature. If this viscosity is 25 mPa·s or less, it is more preferable; if it is 20 mPa·s or less, it is even more preferable; and if it is 15 mPa·s or less, it is particularly preferable. It is also preferable that this viscosity is 1 mPa·s or more and 5 mPa·s or more.

[0029] It is also preferable that the viscosity of the composition (X) at 40°C is 30 mPa·s or less. In this case, regardless of the value of the viscosity of the composition (X) at room temperature, the composition (X) can be made to have a lower viscosity by slightly heating it. For this reason, by heating, the composition (X) can be molded by an inkjet method. Also, since the composition (X) can be made to have a lower viscosity without significantly heating it, it is possible to less likely cause a change in the composition of the composition (X) due to the volatilization of the components in the composition (X). If this viscosity is 25 mPa·s or less, it is more preferable; if it is 20 mPa·s or less, it is even more preferable; and if it is 15 mPa·s or less, it is particularly preferable. It is also preferable that this viscosity is 1 mPa·s or more and 5 mPa·s or more.

[0030] The low viscosity of such a composition (X) at 25°C or 40°C can be achieved by the composition of the composition (X) described in detail below.

[0031] When 20 mg of the composition (X) is heated under the conditions of 100°C for 30 minutes using a thermogravimetric analyzer, the volatility is preferably 40% or less. The volatility of the composition (X) is defined as the percentage of the weight reduction amount of the composition (X) after the treatment (the difference between the weight of the composition (X) before the treatment and the weight after the treatment) with respect to the weight of the composition (X) before the treatment. In this case, by the low volatility of the composition (X), the storage stability of the composition (X) can be enhanced. Also, it becomes less likely for outgassing to occur from the wavelength conversion member. Therefore, it becomes less likely for voids caused by outgassing to further occur inside the wavelength conversion member. The volatility of the composition (X) can be determined by heating 20 mg of the composition (X) under the conditions of 100°C for 30 minutes using a thermogravimetric analyzer and calculating the weight reduction amount of the weight after the treatment with respect to the weight before the treatment. When 20 mg of the composition (X) is heated under the conditions of 100°C for 30 minutes using a thermogravimetric analyzer, the volatility is more preferably 30% or less, and even more preferably 20% or less. The lower limit of the volatility of the composition (X) is not particularly limited, but for example, it may be 0.1% or more.

[0032] The components contained in the composition (X) will be described in more detail.

[0033] <Reactive curable compound (A)> First, the reactive curable compound (A) will be described. The reactive curable compound (A) contains at least one of, for example, a photocurable compound (A1) and a thermosetting compound (A2).

[0034] The photocurable compound (A1) is a component that can undergo a polymerization reaction upon irradiation with ultraviolet rays, for example, in the presence or absence of a photoinitiator (E). The photoinitiator (E) may contain a curing catalyst. The photocurable compound (A1) contains at least one component selected from the group consisting of, for example, monomers, oligomers, and prepolymers.

[0035] The photocurable compound (A1) contains at least one of, for example, a radically polymerizable compound (A11) and a cationically polymerizable compound (A12). When the photocurable compound (A1) contains the radically polymerizable compound (A11), the composition (X) preferably further contains a photo radical polymerization initiator (E1) as the photopolymerization initiator (E). When the photocurable compound (A1) contains the cationically polymerizable compound (A12), the composition (X) preferably further contains a photo cationic polymerization initiator (E2) (cationic curing catalyst) as the photopolymerization initiator (E).

[0036] Also, the thermosetting compound (A2) has at least one reactive functional group composed of, for example, an epoxy group, an oxetane group, an isocyanate group, an amino group, a carboxyl group, or a methylol group. The thermosetting compound (A2) contains at least one component selected from the group consisting of, for example, monomers, oligomers, and prepolymers.

[0037] The viscosity of the entire reaction curable compound (A) at 25°C is preferably 50 mPa·s or less. In this case, the reaction curable compound (A) can particularly reduce the viscosity of the composition (X). If the viscosity of the entire reaction curable compound (A) is 30 mPa·s or less, it is more preferable, and if it is 20 mPa·s or less, it is particularly preferable. Also, the viscosity of the entire reaction curable compound (A) is, for example, 3 mPa·s or more.

[0038] It is also preferable that the viscosity of the entire reaction curable compound (A) at 40°C is 50 mPa·s or less. In this case, the reaction curable compound (A) can particularly reduce the viscosity of the composition (X) when heated. If the viscosity of the entire reaction curable compound (A) is 30 mPa·s or less, it is more preferable, and if it is 20 mPa·s or less, it is particularly preferable. Also, the viscosity of the entire reaction curable compound (A) is, for example, 3 mPa·s or more.

[0039] The percentage of components with a boiling point of 270 °C or higher in the reaction-curable compound (A) is preferably 80% by mass or more. In this case, the storage stability of the composition (X) is particularly less likely to be impaired, and outgas is particularly less likely to be generated from the cured product. If the percentage of components with a boiling point of 280 °C or higher in the reaction-curable compound (A) is 80% by mass or more, it is more preferable.

[0040] The reaction-curable compound (A) preferably contains a component having a viscosity at 25 °C of 20 mPa·s or less. In this case, the viscosity of the composition (X) can be lowered.

[0041] The ratio of the component having a viscosity at 25 °C of 20 mPa·s or less to the total amount of the reaction-curable compound (A) is preferably 50% by mass or more and 100% by mass or less. In this case, the viscosity of the composition (X) can be particularly lowered, and the composition (X) can be particularly easily applied by an inkjet method. This ratio is more preferably 60% by mass or more, and even more preferably 70% by mass or more. Also, this ratio is more preferably 95% by mass or less, and even more preferably 90% by mass or less.

[0042] The component having a viscosity at 25 °C of 20 mPa·s or less preferably contains a compound having a glass transition temperature of 80 °C or higher. In this case, while lowering the viscosity of the composition (X), the glass transition temperature of the cured product can be increased. It is more preferable if this component contains a compound having a glass transition temperature of 90 °C or higher, and even more preferable if it contains a compound having a glass transition temperature of 100 °C or higher. There is no upper limit to the glass transition temperature of the compound contained in this component, but for example, it is 150 °C or less.

[0043] The reaction-curable compound (A) preferably contains a photocurable compound (A1) in particular. In this case, since it is not necessary to heat when curing the composition (X), particularly when producing the color resist 1 in the light-emitting device 11 as the wavelength conversion member, the light source etc. in the light-emitting device 11 can be less likely to be damaged by heat.

[0044] When the photocurable compound (A1) contains a radically polymerizable compound (A11), the radically polymerizable compound (A11) preferably contains an acrylic compound (Y). The acrylic compound (Y) has one or more (meth)acryloyl groups in one molecule.

[0045] The compounds that the acrylic compound (Y) may contain will be described.

[0046] The acrylic compound (Y) preferably contains a polyfunctional acrylic compound (Y1) having two or more radically polymerizable functional groups containing a (meth)acryloyl group in one molecule. In this case, the polyfunctional acrylic compound (Y1) can increase the glass transition temperature of the cured product, and thus can improve the heat resistance of the cured product. The proportion of the polyfunctional acrylic compound (Y1) is preferably 50% by mass or more and 100% by mass or less based on the total amount of the acrylic compound (Y). The acrylic compound (Y) may contain only the polyfunctional acrylic compound (Y1).

[0047] The polyfunctional acrylic compound (Y1) is, for example, 1,3-butylene glycol di(meth)acrylate, 1,4-butanediol oligoacrylate, diethylene glycol diacrylate, 1,6-hexanediol oligoacrylate, neopentyl glycol diacrylate, triethylene glycol diacrylate, tripropylene glycol diacrylate, dipropylene glycol diacrylate, cyclohexane dimethanol diacrylate, tricyclodecane dimethanol diacrylate, bisphenol A polyethoxydiacrylate, bisphenol F polyethoxydiacrylate, pentaerythritol tetraacrylate, propoxylated(2) neopentyl glycol diacrylate, trimethylolpropane triacrylate, tris(2-hydroxyethyl) isocyanurate triacrylate, pentaerythritol triacrylate, ethoxylated(3) trimethylolpropane triacrylate, propoxylated(3) glyceryl triacrylate, pentaerythritol tetraacrylate, ditrimethylolpropane tetraacrylate, ethoxylated(4) pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, 2-(2-ethoxyethoxy)ethyl acrylate, hexanediol diacrylate, polyethylene glycol diacrylate, polyethylene glycol dimethacrylate, tripropylene glycol triacrylate, bispentaerythritol hexaacrylate, ethylene glycol diacrylate, 1,6-hexanediol diacrylate, ethoxylated 1,6-hexanediol diacrylate, polypropylene glycol diacrylate, 1,4-butanediol diacrylate, 1,9-nonanediol diacrylate, tetraethylene glycol diacrylate, 2-n-butyl-2-ethyl-1,It contains at least one compound selected from the group consisting of 3-propanediol diacrylate, neopentyl glycol diacrylate hydroxy pivalate, trimethylolpropane triacrylate hydroxy pivalate, ethoxylated triacrylate phosphate, ethoxylated tripropylene glycol diacrylate, neopentyl glycol-modified trimethylolpropane diacrylate, stearic acid-modified pentaerythritol diacrylate, trimethylolpropane triacrylate, tetramethylolmethane triacrylate, caprolactone-modified trimethylolpropane triacrylate, propoxylated glyceryl triacrylate, tetramethylolmethane tetraacrylate, ethoxylated pentaerythritol tetraacrylate, dipentaerythritol hexaacrylate, caprolactone-modified dipentaerythritol hexaacrylate, dipentaerythritol hydroxy pentaacrylate, neopentyl glycol oligoacrylate, trimethylolpropane oligoacrylate, pentaerythritol oligoacrylate, ethoxylated neopentyl glycol di(meth)acrylate, propoxylated neopentyl glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, ethoxylated trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, and 2-(2-vinyloxyethoxy)ethyl acrylate.,

[0048] The acrylic equivalent of the polyfunctional acrylic compound (Y1) is preferably 150 g / eq or less, more preferably 90 g / eq or more and 150 g / eq or less. The weight average molecular weight of the polyfunctional acrylic compound (Y1) is, for example, 100 or more and 1000 or less, more preferably 200 or more and 800 or less.

[0049] The polyfunctional acrylic compound (Y1) preferably contains a compound (Y11) having a structure represented by the following formula (200).

[0050] CH2=CR 1 -COO-(R 3 -O) n-CO-CR 2 =CH2…(200) In formula (200), R 1 and R 2 each represents hydrogen or a methyl group, n represents an integer of 1 or more, R 3 is an alkylene group having 1 or more carbon atoms, and when n is 2 or more, a plurality of R 3 in one molecule may be the same as or different from each other.

[0051] Compound (Y11) has the structure represented by formula (200). In particular, since the number of carbon atoms of R 3 in formula (200) is 3 or more, it is difficult to enhance the affinity of the cured product with water. For this reason, the phosphor (B) is less likely to be deteriorated by water. The number of carbon atoms of R 3 is, for example, 1 or more and 15 or less, preferably 3 or more and 15 or less. Further, compound (Y11) has the structure represented by formula (200). In particular, since it has two (meth)acryloyl groups in one molecule, the glass transition temperature of the cured product can be increased, and thus the heat resistance of the cured product can be increased. Further, n in formula (200) is, for example, an integer of 1 or more and 12 or less.

[0052] The percentage of compound (Y11) with respect to acrylic compound (Y) is preferably 50% by mass or more. In this case, the affinity of the cured product with water is particularly difficult to increase. The percentage of compound (Y11) with respect to acrylic compound (Y) is, for example, 100% by mass or less, or 95% by mass or less, preferably 80% by mass or less.

[0053] The compound (Y11) preferably contains a component having a boiling point of 270 °C or higher. That is, the acrylic compound (Y) preferably has the structure represented by formula (200) and contains a component having a boiling point of 270 °C or higher. In this case, when the composition (X) is stored and when the composition (X) is heated, the acrylic compound (Y) is less likely to volatilize from the composition (X). Therefore, the storage stability of the composition (X) is less likely to be impaired. Further, even if the compound (Y11) remains unreacted in the cured product of the composition (X), outgas due to the compound (Y11) is less likely to be generated from the cured product. Therefore, voids due to outgas are less likely to occur in the color filter 2. If there are voids in the color filter 2, there is a risk that moisture may penetrate into the color resist 1 through the voids, but if voids are less likely to occur, moisture is less likely to penetrate into the color resist 1. The boiling point is the boiling point under normal pressure obtained by converting the boiling point under reduced pressure, and is determined by, for example, the method shown in Science of Petroleum, Vol.II. P.1281 (1938). It is more preferable that the compound (Y11) contains a component having a boiling point of 280 °C or higher.

[0054] The percentage of the compound (Y11) with respect to the acrylic compound (Y) is preferably 50% by mass or more. In this case, the storage stability of the composition (X) is effectively enhanced, the generation of outgas from the cured product is effectively reduced, and furthermore, the affinity of the cured product for water is not particularly enhanced. The percentage of the compound (Y11) with respect to the acrylic compound (Y) is, for example, 100% by mass or less, or 95% by mass or less, preferably 80% by mass or less.

[0055] The viscosity of the compound (Y11) at 25 °C is preferably 25 mPa·s or less. In this case, the compound (Y11) can lower the viscosity of the composition (X). The viscosity of the compound (Y11) at 25 °C is more preferably 25 mPa·s or less, still more preferably 20 mPa·s or less, and particularly preferably 15 mPa·s or less. Also, the viscosity of the compound (Y11) at 25 °C is, for example, 1 mPa·s or more, preferably 3 mPa·s or more, and still more preferably 5 mPa·s or more.

[0056] The compound (Y11) contains at least one compound selected from the group consisting of, for example, alkylene glycol di(meth)acrylate, polyalkylene glycol di(meth)acrylate, and alkylene oxide-modified alkylene glycol di(meth)acrylate.

[0057] Alkylene glycol di(meth)acrylate is a compound in which n is 1 in the formula (200). In this case, the carbon number of R 3 in the formula (200) is preferably 4 to 12. R 3It may be linear or may have a branch. In particular, alkylene glycol di(meth)acrylate preferably contains at least one compound selected from the group consisting of 1,4-butanediol diacrylate, 1,3-butylene glycol diacrylate, neopentyl glycol diacrylate, 1,6-hexanediol diacrylate, 1,9-nonanediol diacrylate, 1,10-decanediol diacrylate, 1,4-butanediol dimethacrylate, 1,3-butylene glycol dimethacrylate, neopentyl glycol dimethacrylate, 1,6-hexanediol dimethacrylate, 1,9-nonanediol dimethacrylate, 1,10-decanediol dimethacrylate, and 1,12-dodecanediol dimethacrylate. Further, alkylene glycol di(meth)acrylate preferably contains at least one compound selected from the group consisting of product number SR213 manufactured by Sartomer, product number V195 manufactured by Osaka Organic Chemical Industry Co., Ltd., product number SR212 manufactured by Sartomer, product number SR247 manufactured by Sartomer, product name Light Acrylate NP-A manufactured by Kyoei Chemical Industry Co., Ltd., product number SR238NS manufactured by Sartomer, product number V230 manufactured by Osaka Organic Chemical Industry Co., Ltd., product number HDDA manufactured by Daicel Corporation, product number 1,6HX-A manufactured by Kyoei Chemical Industry Co., Ltd., product number V260 manufactured by Osaka Organic Chemical Industry Co., Ltd., product number 1,9-ND-A manufactured by Kyoei Chemical Industry Co., Ltd., product number A-NOD-A manufactured by Shin-Nakamura Chemical Co., Ltd., product number CD595 manufactured by Sartomer, product number SR214NS manufactured by Sartomer, product number BD manufactured by Shin-Nakamura Chemical Co., Ltd., product number SR297 manufactured by Sartomer, product number SR248 manufactured by Sartomer, product name Light Ester NP manufactured by Kyoei Chemical Industry Co., Ltd., product number SR239NS manufactured by Sartomer, product name Light Ester 1,6HX manufactured by Kyoei Chemical Industry Co., Ltd., product number HD-N manufactured by Shin-Nakamura Chemical Co., Ltd., product name Light Ester 1,9ND manufactured by Kyoei Chemical Industry Co., Ltd., product number NOD-N manufactured by Shin-Nakamura Chemical Co., Ltd., product name Light Ester 1,10DC manufactured by Kyoei Chemical Industry Co., Ltd., product number DOD-N manufactured by Shin-Nakamura Chemical Co., Ltd., and product number SR262 manufactured by Sartomer.

[0058] The polyalkylene glycol di(meth)acrylate is a compound in which, for example, n is 2 or more in formula (200). n is, for example, from 2 to 10, preferably from 2 to 7, also preferably from 2 to 6, and also preferably from 2 to 3. The number of carbon atoms of R 3 is, for example, from 2 to 7, preferably from 2 to 5. The larger the number of carbon atoms, the higher the hydrophobicity of the cured product and the more difficult it is for the cured product to allow water to permeate. The polyalkylene glycol di(meth)acrylate preferably contains at least one compound selected from the group consisting of diethylene glycol diacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, hexaethylene glycol dimethacrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, tripropylene glycol dimethacrylate, tritetramethylene glycol diacrylate, polyethylene glycol 200 dimethacrylate, and polyethylene glycol 200 diacrylate. Further, the polyalkylene glycol di(meth)acrylate preferably contains at least one compound selected from the group consisting of Sartomer product number SR230, Sartomer product number SR508NS, Daicel product number DPGDA, Sartomer product number SR306NS, Daicel product number TPGDA, Osaka Organic Chemical Industry product number V310HP, Shin-Nakamura Chemical product number APG200, Kyoei Chemical Industry Co., Ltd. product name Light Acrylate PTMGA-250, Sartomer product number SR231NS, Kyoei Chemical Industry Co., Ltd. product name Light Ester 2EG, Sartomer product number SR205NS, Kyoei Chemical Industry Co., Ltd. product name Light Ester 3EG, Sartomer product number SR210NS, Kyoei Chemical Industry Co., Ltd. product name Light Ester 4EG, Mitsubishi Chemical product name Acrylate HX, and Shin-Nakamura Chemical product number 3PG.

[0059] The alkylene oxide-modified alkylene glycol di(meth)acrylate contains, for example, propylene oxide-modified neopentyl glycol. Further, the alkylene oxide-modified alkylene glycol di(meth)acrylate contains, for example, product number EBECRYL145 manufactured by Daicel Corporation.

[0060] When the acrylic compound (Y) contains the compound (Y11) having the structure represented by the formula (200), it is preferable that the compound (Y11) does not contain a compound in which the value of n in the formula (200) is 5 or more. (R 3 -O) n is a polyethylene glycol skeleton, it is particularly preferable that the compound (Y11) does not contain a compound in which the value of n in the formula (200) is greater than 5. Even when the compound (Y11) contains a compound in which the value of n in the formula (200) is greater than 5, the percentage of the compound in which the value of n in the formula (200) is greater than 5 with respect to the acrylic compound (Y) is preferably 20% by mass or less. Further, even when the compound (Y11) contains a compound in which the value of n in the formula (200) is greater than 5, it is preferable that the compound (Y11) does not contain a compound in which the value of n is greater than 9, and it is more preferable that the compound (Y11) does not contain a compound in which the value of n is greater than 7. In these cases, an increase in the viscosity of the composition (X) is particularly unlikely to occur.

[0061] It is particularly preferable that the polyfunctional acrylic compound (Y1) contains polyalkylene glycol di(meth)acrylate. Since polyalkylene glycol di(meth)acrylate has a low viscosity and is difficult to volatilize, it can contribute to reducing the viscosity of the composition (X), and can contribute to improving the storage stability of the composition (X) and reducing outgas from the cured product.

[0062] When the polyfunctional acrylic compound (Y1) contains a polyalkylene glycol di(meth)acrylate, the proportion of the polyalkylene glycol di(meth)acrylate in the acrylic compound (Y) is preferably 40% by mass or more and 80% by mass or less. When the proportion of the polyalkylene glycol di(meth)acrylate is 40% by mass or more, the viscosity of the composition (X) can be effectively reduced. When the proportion of the polyalkylene glycol di(meth)acrylate is 80% by mass or less, the proportion of the compound having three or more (meth)acryloyl groups in the molecule increases, and the reactivity of the composition (X) and the glass transition temperature of the cured product can be increased. This proportion is more preferably 42% by mass or more and 75% by mass or less, and even more preferably 45% by mass or more and 70% by mass or less.

[0063] The polyfunctional acrylic compound (Y1) may contain a compound having three or more radical polymerizable functional groups containing a (meth)acryloyl group in one molecule. In this case, the polyfunctional acrylic compound (Y1) can contain at least one selected from the group consisting of trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, and pentaerythritol tetra(meth)acrylate. In this case, the glass transition temperature of the cured product can be particularly increased, and thus the heat resistance of the cured product can be particularly increased.

[0064] The polyfunctional acrylic compound (Y1) preferably contains pentaerythritol tetra(meth)acrylate in particular. In this case, the glass transition temperature of the cured product can be particularly increased, and the reactivity of the composition (X) can be improved. When the reactivity of the composition (X) is improved, the composition (X) can be easily cured in an environment containing oxygen such as an air atmosphere.

[0065] When the polyfunctional acrylic compound (Y1) contains pentaerythritol tetra(meth)acrylate, the proportion of pentaerythritol tetra(meth)acrylate in the acrylic compound (Y) is preferably 0.5% by mass or more and 10% by mass or less. In this case, it is possible to achieve both high reactivity and low viscosity of the composition (X). If this proportion is 1% by mass or more and 9% by mass or less, it is more preferable, and if it is 2% by mass or more and 8% by mass or less, it is even more preferable.

[0066] The polyfunctional acrylic compound (Y1) may have at least one of a benzene ring, an alicyclic ring, and a polar group. The polar group is, for example, at least one of an OH group and an NHCO group. In this case, the shrinkage when the composition (X) cures can be particularly reduced. Furthermore, the adhesion between the cured product and an inorganic compound such as silicon nitride or silicon oxide can also be enhanced. The polyfunctional acrylic compound (Y1) preferably contains at least one compound selected from the group consisting of tricyclodecane dimethanol diacrylate, bisphenol A polyethoxydiacrylate, bisphenol F polyethoxydiacrylate, trimethylolpropane triacrylate, and pentaerythritol triacrylate. These compounds can particularly reduce the shrinkage when the composition (X) cures. Furthermore, these compounds can also enhance the adhesion between the cured product and an inorganic compound such as silicon nitride or silicon oxide.

[0067] When the adhesion between the cured product and the inorganic material is enhanced, when the color resist 1 is laminated with a film made of an inorganic material such as a SiN film (inorganic film), high adhesion between the color resist 1 and the inorganic film can be obtained. Also, strictly speaking, since the adhesion between the resin matrix cured from the photocurable compound (A1) and the inorganic compound is enhanced, when the phosphor (B) is an inorganic particle such as a quantum dot phosphor (B1), the adhesion between the resin matrix and the phosphor (B) in the cured product can be enhanced.

[0068] It is particularly preferable that the polyfunctional acrylic compound (Y1) contains a polyalkylene glycol di(meth)acrylate and a pentaerythritol tetra(meth)acrylate. In this case, the composition (X) has a low viscosity and excellent reactivity. Therefore, the composition (X) can be easily cured in an environment containing oxygen such as an air atmosphere.

[0069] The acrylic compound (Y) preferably contains a monofunctional acrylic compound (Y2) in which the radically polymerizable functional group in one molecule is only one (meth)acryloyl group. The monofunctional acrylic compound (Y2) can suppress the shrinkage during the curing of the composition (X).

[0070] The amount of the monofunctional acrylic compound (Y2) relative to the total amount of the acrylic compound (Y) is preferably more than 0% by mass and 50% by mass or less. If the amount of the monofunctional acrylic compound (Y2) is more than 0% by mass, the shrinkage during the curing of the composition (X) can be suppressed. Also, if the amount of the monofunctional acrylic compound (Y2) is 50% by mass or less, the amount of the polyfunctional acrylic compound (Y1) can be 50% by mass or more, thereby particularly improving the heat resistance of the cured product. It is more preferable that the amount of the monofunctional acrylic compound (Y2) is 5% by mass or more, and it is also more preferable that it is 30% by mass or less.

[0071] The monofunctional acrylic compound (Y2) is, for example, tetrahydrofurfuryl acrylate, isobornyl acrylate, 2-hydroxyethyl acrylate, 4-hydroxybutyl acrylate, isobutyl acrylate, t-butyl acrylate, isooctyl acrylate, 2-methoxyethyl acrylate, methoxytriethylene glycol acrylate, 2-ethoxyethyl acrylate, 3-methoxybutyl acrylate, ethoxyethyl acrylate, butoxyethyl acrylate, ethoxydiethylene glycol acrylate, methoxydiglycol ethyl acrylate, ethyldiglycol acrylate, cyclic trimethylolpropane formal monoacrylate, imide acrylate, isoamyl acrylate, ethoxylated succinic acid acrylate, trifluoroethyl acrylate, ω-carboxypolycaprolactone monoacrylate, cyclohexyl acrylate, 2-(2-ethoxyethoxy)ethyl acrylate, stearyl acrylate, diethylene glycol monobutyl ether acrylate, lauryl acrylate, isodecyl acrylate, 3,3,It contains at least one compound selected from the group consisting of 5-trimethylcyclohexanol acrylate, isooctyl acrylate, octyl / decyl acrylate, tridecyl acrylate, caprolactone acrylate, ethoxylated (4) nonylphenol acrylate, methoxypolyethylene glycol (350) monoacrylate, methoxypolyethylene glycol (550) monoacrylate, phenoxyethyl acrylate, cyclohexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, benzyl acrylate, methylphenoxyethyl acrylate, 4-t-butylcyclohexyl acrylate, caprolactone-modified tetrahydrofurfuryl acrylate, tribromophenyl acrylate, ethoxylated tribromophenyl acrylate, 2-phenoxyethyl acrylate, ethylene oxide adduct of 2-phenoxyethyl acrylate, propylene oxide adduct of 2-phenoxyethyl acrylate, acryloylmorpholine, morpholin-4-yl acrylate, dicyclopentanyl acrylate, phenoxydiethylene glycol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 1,4-cyclohexanedimethanol monoacrylate, 3-methacryloyloxymethyl cyclohexene oxide and 3-acryloyloxymethyl cyclohexene oxide.,

[0072] The monofunctional acrylic compound (Y2) may contain at least one compound selected from the group consisting of a compound having an alicyclic structure and a compound having a cyclic ether structure.,

[0073] The compound having an alicyclic structure contains at least one compound selected from the group consisting of, for example, phenoxyethyl acrylate, cyclohexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, benzyl acrylate, methylphenoxyethyl acrylate, 4-t-butylcyclohexyl acrylate, caprolactone-modified tetrahydrofurfuryl acrylate, tribromophenyl acrylate, ethoxylated tribromophenyl acrylate, 2-phenoxyethyl acrylate, an ethylene oxide adduct of 2-phenoxyethyl acrylate, a propylene oxide adduct of 2-phenoxyethyl acrylate, acryloylmorpholine, morpholin-4-yl acrylate, isobornyl acrylate, dicyclopentanyl acrylate, phenoxydiethylene glycol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, and 1,4-cyclohexanedimethanol monoacrylate.

[0074] In the compound having a cyclic ether structure, the number of ring members of the cyclic ether structure is preferably 3 or more, more preferably 3 or more and 4 or less. The number of carbon atoms contained in the cyclic ether structure is preferably 2 or more and 9 or less, more preferably 2 or more and 6 or less. The compound having a cyclic ether structure contains at least one compound selected from the group consisting of, for example, 3-methacryloyloxymethyl cyclohexene oxide and 3-acryloyloxymethyl cyclohexene oxide.

[0075] The acrylic compound (Y) may contain a compound having silicon in the molecular skeleton. In this case, the adhesion between the cured product and the inorganic material is improved. The compound having silicon in the molecular skeleton contains at least one compound selected from the group consisting of, for example, 3-(trimethoxysilyl)propyl acrylate (for example, product number KBM5103 manufactured by Shin-Etsu Chemical Co., Ltd.) and an (meth)acryl group-containing alkoxysilane oligomer (for example, product number KR-513 manufactured by Shin-Etsu Chemical Co., Ltd.).

[0076] The acrylic compound (Y) may contain a compound having phosphorus in its molecular skeleton. In this case, the adhesion between the cured product and the inorganic material is improved. The compound having phosphorus in its molecular skeleton includes acid phosphoxy (meth) acrylates such as acid phosphoxypolyoxypropylene glycol monomethacrylate.

[0077] The acrylic compound (Y) may contain a compound having nitrogen in its molecular skeleton. In this case, the adhesion between the cured product and the inorganic material is improved. Also, the reactivity of the acrylic compound (Y) is improved, and thus outgas is less likely to be generated from the cured product. The compound having nitrogen in its molecular skeleton includes at least one compound selected from the group consisting of compounds having a morpholine skeleton such as acryloylmorpholine and 4-morpholinyl acrylate, diethylacrylamide, dimethylaminopropylacrylamide, and pentamethylpiperidyl methacrylate.

[0078] It is particularly preferable that the acrylic compound (Y) contains a compound having a morpholine skeleton. In this case, the reactivity of the composition (X) can be further improved, and the curability of the composition (X) in an air atmosphere can be further enhanced. It is particularly preferable that the acrylic compound (Y) contains at least one of acryloylmorpholine and 4-morpholinyl acrylate. In this case, shrinkage during curing of the composition (X) can be suppressed. Also, the viscosities of acryloylmorpholine and 4-morpholinyl acrylate are low, and thus these compounds are less likely to increase the viscosity of the composition (X). Furthermore, since these compounds are less volatile, the storage stability of the composition (X) can be improved.

[0079] The proportion of the compound having a morpholine skeleton with respect to the acrylic compound (Y) is preferably 5% by mass or more and 50% by mass or less. In this case, there is an advantage that outgas is less likely to be generated from the cured product of the composition (X). This proportion is more preferably 7% by mass or more and 45% by mass or less, and even more preferably 10% by mass or more and 40% by mass or less.

[0080] The acrylic compound (Y) may contain a compound having an isobornyl skeleton. The compound having an isobornyl skeleton can contain, for example, one or more compounds selected from the group consisting of isobornyl acrylate and isobornyl methacrylate.

[0081] The acrylic compound (Y) may contain a component composed of a compound having at least one skeleton selected from the group consisting of a dicyclopentadiene skeleton, a dicyclopentanyl skeleton, a dicyclopentenyl skeleton, and a bisphenol skeleton. Specifically, the acrylic compound (Y) may contain, for example, at least one compound selected from the group consisting of tricyclodecane dimethanol diacrylate, bisphenol A polyethoxydiacrylate, and bisphenol F polyethoxydiacrylate. In this case, the adhesion between the cured product and the inorganic material can be enhanced.

[0082] The acrylic compound (Y) may contain the compound represented by the following formula (100). In this case, the reactivity of the composition (X) can be enhanced, and the adhesion between the cured product and the inorganic material can be improved.

[0083]

Chemical formula

[0084] In formula (100), R 0 is H or a methyl group. X is a single bond or a divalent hydrocarbon group. Each of R 1 to R 11 is H, an alkyl group, or -R 12 -OH, R 12 is an alkylene group and at least one of R 1 to R 11 is an alkyl group or -R 12 -OH. R 1 to R 11 are not chemically bonded to each other.

[0085] Specifically, for example, the acrylic compound (Y) may contain at least one compound selected from the group consisting of the compounds represented by the following formula (110), the compounds represented by the formula (120), and the compounds represented by the formula (130).

[0086]

Chemical formula

[0087] The radically polymerizable compound (A11) may contain a radically polymerizable compound (Z) other than the acrylic compound (Y). The amount of the radically polymerizable compound (Z) relative to the total amount of the acrylic compound (Y) and the radically polymerizable compound (Z) is, for example, 10% by mass or less. The radically polymerizable compound (Z) can contain either or both of a polyfunctional radically polymerizable compound (Z1) having two or more radically polymerizable functional groups in one molecule and a monofunctional radically polymerizable compound (Z2) having only one radically polymerizable functional group in one molecule. The polyfunctional radically polymerizable compound (Z1) may contain, for example, at least one compound selected from the group consisting of an aromatic urethane oligomer, an aliphatic urethane oligomer, an epoxy acrylate oligomer, a polyester acrylate oligomer, and other special oligomers having two or more ethylenic double bonds in one molecule. Note that the components that the polyfunctional radically polymerizable compound (Z1) can contain are not limited to the above. The monofunctional radically polymerizable compound (Z2) contains, for example, at least one compound selected from the group consisting of N-vinylformamide, vinylcaprolactam, vinylpyrrolidone, phenyl glycidyl ether, p-tert-butylphenyl glycidyl ether, butyl glycidyl ether, 2-ethylhexyl glycidyl ether, allyl glycidyl ether, 1,2-butylene oxide, 1,3-butadiene monooxide, 1,2-epoxydodecane, epichlorohydrin, 1,2-epoxydecane, styrene oxide, cyclohexene oxide, 3-vinylcyclohexene oxide, 4-vinylcyclohexene oxide, N-vinylpyrrolidone, and N-vinylcaprolactam. Note that the components that the monofunctional radically polymerizable compound (Z2) can contain are not limited to the above.

[0088] When the radically polymerizable compound (A11) contains the radically polymerizable compound (Z), the radically polymerizable compound (Z) may contain a compound having nitrogen in its molecular skeleton. The compound having nitrogen in its molecular skeleton includes, for example, at least one compound selected from the group consisting of N-vinylformamide, N-vinylpyrrolidone, and N-vinylcaprolactam. In this case, similar to the case where the acrylic compound (Y) contains a compound having nitrogen in its molecular skeleton, the adhesion between the cured product and the inorganic material is improved.

[0089] In other words, the radically polymerizable compound (A11) preferably contains a compound having nitrogen in its molecular skeleton. The compound having nitrogen in its molecular skeleton may contain a compound contained in the acrylic compound (Y) or a compound contained in the radically polymerizable compound (Z). In this case, the adhesion between the cured product and the inorganic material is improved. The ratio of the compound having nitrogen in its molecular skeleton to the whole radically polymerizable compound (A11) is preferably 5% by mass or more and 80% by mass or less. When this ratio is 5% by mass or more, the adhesion between the cured product and the inorganic material can be particularly improved. When this ratio is 80% by mass or less, the compound having nitrogen in its molecular skeleton hardly inhibits the storage stability of the composition (X), and it is difficult to generate satellites when the composition (X) is ejected by an inkjet method. Therefore, the inkjet property of the composition (X) is hardly inhibited. Furthermore, it is possible to hardly generate outgas caused by the compound having nitrogen in its molecular skeleton. This ratio is more preferably 10% by mass or more and 70% by mass or less, still more preferably 20% by mass or more and 60% by mass or less, and particularly preferably 25% by mass or more and 50% by mass.

[0090] The photo radical polymerization initiator (E1) is not particularly limited as long as it is a compound that generates radical species when irradiated with ultraviolet light. The photo radical polymerization initiator (E1) contains, for example, at least one compound selected from the group consisting of aromatic ketones, acylphosphine oxide compounds, aromatic onium salt compounds, organic peroxides, thio compounds (such as thioxanthone compounds and thiophenyl group-containing compounds), hexaarylbiimidazole compounds, oxime ester compounds, borate compounds, azinium compounds, metallocene compounds, active ester compounds, compounds having a carbon-halogen bond, and alkylamine compounds. The amount of the photo radical polymerization initiator (E1) with respect to 100 parts by mass of the composition (X) is, for example, 1 part by mass or more and 10 parts by mass or less.

[0091] The photo radical polymerization initiator (E1) preferably contains an initiator having photo bleaching properties. In this case, the light transmittance of the cured product can be increased.

[0092] The initiator having photo bleaching properties contains, for example, at least one of an oxime ester compound having photo bleaching properties and an acylphosphine oxide compound.

[0093] The oxime ester compound having photo bleaching properties contains, for example, at least one of the compound represented by the following formula (401) and the compound represented by the following formula (402). Among these, the compound represented by formula (402) is particularly highly sensitive, so the photocurability of the composition (X) can be particularly enhanced.

[0094]

Chemical formula

[0095]

Chemical formula

[0096] The acylphosphine oxide compound contains at least one selected from the group consisting of, for example, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide and bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide.

[0097] The photo radical polymerization initiator (E1) may contain a sensitizer as part of this photo radical polymerization initiator (E1). The sensitizer can promote the radical generation reaction of the photo radical polymerization initiator (E1), improve the reactivity of radical polymerization, and improve the crosslink density. The sensitizer is, for example, 9,10-dibutoxyanthracene, 9-hydroxymethylanthracene, thioxanthone, 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2-chlorothioxanthone, 2,4-diethylthioxanthone, anthraquinone, 1,2-dihydroxyanthraquinone, 2-ethylanthraquinone, 1,4-diethoxynaphthalene, p-dimethylaminoacetophenone, p-diethylaminoacetophenone, p-dimethylaminobenzophenone, p-diethylaminobenzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, p-dimethylaminobenzaldehyde, and p-diethylaminobenzaldehyde, and can contain at least one compound selected from the group consisting of. Note that the components that the sensitizer can contain are not limited to the above.

[0098] The content of the sensitizer in the composition (X) is, for example, 0.1 part by mass or more and 5 parts by mass or less, preferably 0.1 part by mass or more and 3 parts by mass or less, based on 100 parts by mass of the solid content of the composition (X). If the content of the sensitizer is within such a range, the composition (X) can be cured in air, and it is not necessary to cure the composition (X) under an inert atmosphere such as a nitrogen atmosphere.

[0099] The composition (X) may contain a polymerization accelerator in addition to the photo radical polymerization initiator (E1). The polymerization accelerator contains, for example, amine compounds such as ethyl p-dimethylaminobenzoate, 2-ethylhexyl p-dimethylaminobenzoate, methyl p-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, and butoxyethyl p-dimethylaminobenzoate. Note that the components that the polymerization accelerator may contain are not limited to the above.

[0100] When the photocurable compound (A1) contains a cationic polymerizable compound (A12), the cationic polymerizable compound (A12) contains at least one of, for example, a polyfunctional cationic polymerizable compound (W1) and a monofunctional cationic polymerizable compound (W2).

[0101] The polyfunctional cationic polymerizable compound (W1) can contain either one or both of a polyfunctional cationic polymerizable compound (W11) having no siloxane skeleton and a polyfunctional cationic polymerizable compound (W12) having a siloxane skeleton.

[0102] The polyfunctional cationic polymerizable compound (W11) has no siloxane skeleton and has two or more cationic polymerizable functional groups per molecule. The number of cationic polymerizable functional groups per molecule of the polyfunctional cationic polymerizable compound (W11) is preferably 2 to 4, and more preferably 2 to 3.

[0103] The cationic polymerizable functional group is at least one kind of group selected from the group consisting of, for example, an epoxy group, an oxetane group, and a vinyl ether group.

[0104] The polyfunctional cationic polymerizable compound (W11) contains at least one compound selected from the group consisting of, for example, polyfunctional alicyclic epoxy compounds, polyfunctional heterocyclic epoxy compounds, polyfunctional oxetane compounds, alkylene glycol diglycidyl ethers, and alkylene glycol monovinyl monoglycidyl ethers.

[0105] The polyfunctional alicyclic epoxy compound contains either one or both of, for example, the compound represented by the following formula (1) and the compound represented by the following formula (20).

[0106] [Chemical formula]

[0107] In formula (1), each of R 1 ~R 18 is independently a hydrogen atom, a halogen atom, or a hydrocarbon group. The number of carbon atoms in the hydrocarbon group is preferably in the range of 1 to 20. The hydrocarbon group is, for example, an alkyl group having 1 to 20 carbon atoms such as a methyl group, an ethyl group, or a propyl group; an alkenyl group having 2 to 20 carbon atoms such as a vinyl group or an allyl group; or an alkylidene group having 2 to 20 carbon atoms such as an ethylidene group or a propylidene group. The hydrocarbon group may contain an oxygen atom or a halogen atom. Each of R 1 ~R 18 is preferably independently a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms, more preferably a hydrogen atom or a methyl group, and most preferably a hydrogen atom.

[0108] In formula (1), X is a single bond or a divalent organic group, and the organic group is, for example, -CO-O-CH2-.

[0109] Examples of the compound represented by formula (1) include the compound represented by the following formula (1a) and the compound represented by the following formula (1b).

[0110] [Chemical formula]

[0111] [Chemical formula]

[0112] [Chemical formula]

[0113] In formula (20), each of R 1 ~R 12 is independently a hydrogen atom, a halogen atom, or a hydrocarbon group having 1 to 20 carbon atoms. The halogen atom is, for example, a fluorine atom, a chlorine atom, a bromine atom, or an iodine atom. The hydrocarbon group having 1 to 20 carbon atoms is, for example, an alkyl group having 1 to 20 carbon atoms such as a methyl group, an ethyl group, or a propyl group; an alkenyl group having 2 to 20 carbon atoms such as a vinyl group or an allyl group; or an alkylidene group having 2 to 20 carbon atoms such as an ethylidene group or a propylidene group. The hydrocarbon group having 1 to 20 carbon atoms may contain an oxygen atom or a halogen atom.

[0114] R 1 ~R 12 is preferably independently a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms, more preferably a hydrogen atom or a methyl group, and most preferably a hydrogen atom.

[0115] Examples of the compound represented by formula (20) include the tetrahydroindenepoxide represented by the following formula (20a).

[0116]

Chemical formula

[0117] The polyfunctional heterocyclic epoxy compound contains, for example, a trifunctional epoxy compound as represented by the following formula (2).

[0118]

Chemical formula

[0119] The polyfunctional oxetane compound contains, for example, a bifunctional oxetane compound as represented by the following formula (3).

[0120]

Chemical formula

[0121] The alkylene glycol diglycidyl ether contains at least one compound selected from the group consisting of, for example, the compounds represented by the following formulas (4) to (7).

[0122]

Chemical formula

[0123]

Chemical formula

[0124]

Chemical formula

[0125]

Chemical formula

[0126] The alkylene glycol monovinyl monoglycidyl ether contains, for example, the compound represented by the following formula (8).

[0127]

Chemical formula

[0128] More specifically, the polyfunctional cationic polymerizable compound (W11) can contain at least one component selected from the group consisting of, for example, Celloxide 2021P and Celloxide 8010 manufactured by Daicel, TEPIC-VL manufactured by Nissan Chemical Industries, Ltd., OXT-221 manufactured by Toagosei Co., Ltd., and 1,3-PD-DEP, 1,4-BG-DEP, 1,6-HD-DEP, NPG-DEP, and butylene glycol monovinyl monoglycidyl ether manufactured by Yokkaichi Gosei Co., Ltd.

[0129] The polyfunctional cationic polymerizable compound (W11) preferably contains a polyfunctional alicyclic epoxy compound. In this case, the composition (X) can have particularly high cationic polymerization reactivity.

[0130] The polyfunctional alicyclic epoxy compound preferably contains either one or both of the compounds represented by formula (1) and the compound represented by formula (20). In this case, the composition (X) can have higher cationic polymerization reactivity.

[0131] When the polyfunctional alicyclic epoxy compound contains the compound represented by formula (1), the compound represented by formula (1) preferably contains the compound represented by formula (1a). In this case, the composition (X) can have higher cationic polymerization reactivity and particularly low viscosity.

[0132] Also, particularly since the compound represented by formula (20) has low viscosity, when the composition (X) contains the compound represented by formula (20), the composition (X) can have good UV curability and particularly low viscosity. Furthermore, the compound represented by formula (20) has the property of being less volatile despite having low viscosity. Therefore, even when the composition (X) contains the compound represented by formula (20), the composition (X) is less likely to have a change in composition due to the volatilization of the compound represented by formula (20). For this reason, the composition (X) can be made to have a lower viscosity without impairing its storage stability by containing the compound represented by formula (20).

[0133] The compound represented by formula (20) can be synthesized, for example, by oxidizing a cyclic olefin compound having a tetrahydroindene skeleton using an oxidizing agent.

[0134] The compound represented by formula (20) may contain four stereoisomers based on the configuration of the two epoxy rings. The compound represented by formula (20) may contain any of the four stereoisomers. That is, the compound represented by formula (20) can contain at least one component selected from the group consisting of the four stereoisomers. The ratio of the total amount of the exo - endo form and the endo - endo form among the four stereoisomers in the compound represented by formula (20) is preferably 10% by mass or less, more preferably 5% by mass or less, based on the total amount of the epoxy compound (A1). In this case, the heat resistance of the cured product can be improved. The ratio of a specific stereoisomer in the compound represented by formula (20) can be determined based on the peak area ratio appearing in the chromatogram obtained by gas chromatography.

[0135] In order to reduce the amounts of the exo - endo form and the endo - endo form in the compound represented by formula (20), appropriate methods can be applied, such as a method of precision distillation of the compound represented by formula (20), or a method of applying column chromatography using silica gel or the like as a filler.

[0136] When the composition (X) contains a polyfunctional cationically polymerizable compound (W11), the proportion of the polyfunctional cationically polymerizable compound (W11) relative to the total amount of the resin components is preferably in the range of 5 to 95% by mass. The resin components refer to compounds having cationic polymerizability in the composition (X), and include a polyfunctional cationically polymerizable compound (W1) and a monofunctional cationically polymerizable compound (W2). If the proportion of the polyfunctional cationically polymerizable compound (W11) is 5% by mass or more, the composition (X) can have particularly excellent reactivity during the photocationic polymerization reaction, and thereby the cured product can have high strength (hardness). Also, if the proportion of the polyfunctional cationically polymerizable compound (W11) is 95% by mass or less, when the composition (X) contains a desiccant (F), the desiccant (F) can be dispersed in the composition (X) with particularly high uniformity. The proportion of this polyfunctional cationically polymerizable compound (W11) is more preferably 12% by mass or more, still more preferably 15% by mass or more, even more preferably 20% by mass or more, and particularly preferably 25% by mass or more. Also, the proportion of this polyfunctional cationically polymerizable compound (W11) is more preferably 85% by mass or less, and still more preferably 60% by mass or less. For example, the proportion of the polyfunctional cationically polymerizable compound (W11) is preferably in the range of 20 to 60% by mass.

[0137] When the polyfunctional cationically polymerizable compound (W11) contains a polyfunctional alicyclic epoxy compound, the polyfunctional alicyclic epoxy compound may be part or all of the polyfunctional cationically polymerizable compound (W11). The proportion of the polyfunctional alicyclic epoxy compound relative to the polyfunctional cationically polymerizable compound (W11) is preferably in the range of 15 to 100% by mass. When this proportion is 15% by mass or more, the polyfunctional alicyclic epoxy compound can particularly contribute to the improvement of the ultraviolet curability of the composition (X).

[0138] The polyfunctional cationically polymerizable compound (W12) has a siloxane skeleton and two or more cationically polymerizable functional groups per molecule. The number of cationically polymerizable functional groups per molecule of the polyfunctional cationically polymerizable compound (W12) is preferably 2 to 6, and more preferably 2 to 4. The polyfunctional cationically polymerizable compound (W12) can contribute to the improvement of the cationic polymerization reactivity of the composition (X), and can also contribute to the improvement of the heat discoloration resistance of the cured product and the optical component. The polyfunctional cationically polymerizable compound (W12) can also contribute to reducing the elastic modulus of the cured product and the optical component. When the composition (X) contains a moisture absorbent, the polyfunctional cationically polymerizable compound (W12) can also contribute to the improvement of the dispersibility of the moisture absorbent in the composition (X) and the cured product.

[0139] The polyfunctional cationically polymerizable compound (W12) is preferably a liquid at 25°C. In particular, the viscosity of the polyfunctional cationically polymerizable compound (W12) at 25°C is preferably in the range of 10 to 300 mPa·s. In this case, an increase in the viscosity of the composition (X) can be suppressed.

[0140] The cationically polymerizable functional group of the polyfunctional cationically polymerizable compound (W12) is at least one group selected from the group consisting of, for example, an epoxy group, an oxetane group, and a vinyl ether group.

[0141] The siloxane skeleton of the polyfunctional cationically polymerizable compound (W12) may be linear, branched, or cyclic. The number of Si atoms in the siloxane skeleton is preferably in the range of 2 to 14. In this case, the composition (X) can have a particularly low viscosity. The number of these Si atoms is more preferably in the range of 2 to 10, still more preferably in the range of 2 to 7, and particularly preferably in the range of 3 to 6.

[0142] The polyfunctional cationically polymerizable compound (W12) contains at least one of, for example, the compound represented by formula (10) and the compound represented by formula (11).

[0143]

Chemical formula

[0144]

Chem.

[0145] In each of formula (10) and formula (11), R is a single bond or a divalent organic group, preferably an alkylene group. Y is a siloxane skeleton, which may be linear, branched or cyclic, and the number of its Si atoms is preferably in the range of 2 to 14, more preferably in the range of 2 to 10, still more preferably in the range of 2 to 7, and particularly preferably in the range of 3 to 6. n is an integer of 2 or more, and preferably in the range of 2 to 4.

[0146] More specifically, for example, the polyfunctional cationic polymerizable compound (W12) contains a compound represented by the following formula (10a).

[0147]

Chem.

[0148] In formula (10a), R is a single bond or a divalent organic group, preferably an alkylene group having 1 to 4 carbon atoms. n in formula (10a) is an integer of 0 or more. n is preferably in the range of 0 to 12, more preferably in the range of 0 to 8, still more preferably in the range of 0 to 5, and particularly preferably in the range of 1 to 4.

[0149] The compound represented by formula (10a) preferably contains a compound represented by the following formula (30). That is, the polyfunctional cationic polymerizable compound (W12) preferably contains a compound represented by the following formula (30).

[0150] More specifically, the polyfunctional cationically polymerizable compound (W12) preferably contains at least one component selected from the group consisting of product numbers X-40-2669, X-40-2670, X-40-2715, X-40-2732, X-22-169AS, X-22-169B, X-22-2046, X-22-343, X-22-163, and X-22-163B, manufactured by Shin-Etsu Chemical Co., Ltd.

[0151] The polyfunctional cationically polymerizable compound (W12) preferably has an alicyclic epoxy structure, and it is particularly preferable if the polyfunctional cationically polymerizable compound (W12) contains the compound represented by formula (10a). The compound represented by formula (10a) can particularly contribute to improving the cationic polymerization reactivity and reducing the viscosity of the composition (X), and can also particularly contribute to improving the heat discoloration resistance and reducing the elastic modulus of the cured product and optical components. When the composition (X) contains the moisture absorbent (F), it can also particularly contribute to improving the dispersibility of the moisture absorbent (F) in the composition (X).

[0152] When the composition (X) contains the polyfunctional cationically polymerizable compound (W12), the proportion of the polyfunctional cationically polymerizable compound (W12) relative to the total amount of the resin components is preferably in the range of 5 to 95% by mass. In this case, particularly when the composition (X) contains the moisture absorbent (F), the dispersibility of the moisture absorbent (F) in the composition (X) and the cured product is particularly improved, and the composition (X) can have particularly high photo cationic polymerization reactivity.

[0153] The monofunctional cationically polymerizable compound (W2) has only one cationically polymerizable functional group per molecule. The cationically polymerizable functional group is at least one group selected from the group consisting of, for example, an epoxy group, an oxetane group, and a vinyl ether group.

[0154] The viscosity of the monofunctional cationic polymerizable compound (W2) at 25°C is preferably 8 mPa·s or less. In this case, even if the composition (X) does not contain a solvent, the monofunctional cationic polymerizable compound (W2) can reduce the viscosity of the composition (X). In particular, the viscosity of the monofunctional cationic polymerizable compound (W2) at 25°C is preferably in the range of 0.1 to 8 mPa·s.

[0155] The monofunctional cationic polymerizable compound (W2) can contain, for example, at least one compound selected from the group consisting of the compounds represented by the following formulas (12) to (17) and limonene oxide.

[0156]

Chemical formula

[0157]

Chemical formula

[0158]

Chemical formula

[0159]

Chemical formula

[0160]

Chemical formula

[0161]

Chemical formula

[0162] The proportion of the monofunctional cationic polymerizable compound (W2) relative to the total amount of the resin component is preferably in the range of 5 to 50% by mass. If the proportion of the monofunctional cationic polymerizable compound (W2) is 5% by mass or more, the viscosity of the composition (X) can be particularly reduced. Further, if the proportion of the monofunctional cationic polymerizable compound (W2) is 50% by mass or less, the composition (X) can have particularly excellent reactivity during the photocationic polymerization reaction, and thereby the cured product can have high strength (hardness). The proportion of this monofunctional cationic polymerizable compound (W2) is more preferably 10% by mass or more, and even more preferably 15% by mass or more. Further, the proportion of this monofunctional cationic polymerizable compound (W2) is more preferably 40% by mass or less, even more preferably 35% by mass or less, and particularly preferably 30% by mass or less. If the proportion of the monofunctional cationic polymerizable compound (W2) is particularly 35% by mass or less, the volatilization amount of the components in the composition (X) during storage of the composition (X) can be effectively reduced, and therefore the properties of the composition (X) are less likely to be impaired even when the composition (X) is stored for a long period. Further, the occurrence of tack in the cured product can be particularly suppressed. For example, the proportion of the monofunctional cationic polymerizable compound (W2) is preferably in the range of 10 to 35% by mass.

[0163] Further, particularly when the composition (X) contains a polyfunctional cationic polymerizable compound (W11) and a polyfunctional cationic polymerizable compound (W12), with respect to the total amount of the resin component, the proportion of the polyfunctional cationic polymerizable compound (W11) is in the range of 30 to 60% by mass, the proportion of the polyfunctional cationic polymerizable compound (W12) is in the range of 15 to 30% by mass, and the proportion of the monofunctional cationic polymerizable compound (W2) is preferably in the range of 15 to 40% by mass. In this case, good storage stability, low viscosity, and good cationic polymerization reactivity of the composition (X) can be achieved in a well-balanced manner, and further, excellent transparency and excellent hygroscopicity of the cured product can be achieved in a well-balanced manner.

[0164] When the cationically polymerizable compound (A12) contains the compound represented by the formula (3) and the compound represented by the formula (16), by adjusting the ratio of the two, while appropriately adjusting the ease of progress of the curing reaction when producing a photocured product from the composition (X), it is possible to achieve a decrease in the viscosity of the composition (X) and an improvement in storage stability.

[0165] The amount of the compound represented by the formula (16) is appropriately adjusted so that the composition (X) has the above characteristics. For example, the amount of the compound represented by the formula (16) is preferably 10% by mass or more and 40% by mass or less based on the total amount of the resin component.

[0166] The cationically polymerizable compound (A12) preferably contains a compound (f1) represented by the following formula (30) (hereinafter also referred to as an aromatic epoxy compound (f1)).

[0167]

Chemical formula

[0168] In the formula (30), X is at least one selected from the group consisting of a halogen, H, a hydrocarbon group, and an alkylene glycol group, and when there are a plurality of X in one molecule, they may be the same or different from each other. The hydrocarbon group is, for example, an alkyl group or an aryl group. The number of carbon atoms of X when X is a hydrocarbon group is, for example, in the range of 1 to 10. R is a single bond or a divalent organic group. When R is a divalent organic group, the divalent organic group is, for example, an alkylene group, an oxyalkylene group, a carbonyloxyalkylene group (for example, -CO-O-CH2-), or a -C(Ph)2-O-CH2- group. Y is H or a monovalent organic group. When Y is a monovalent organic group, the monovalent organic group is, for example, an alkyl group or an aryl group.

[0169] When the cationically polymerizable compound (A12) contains an aromatic epoxy compound (f1), since the aromatic epoxy compound (f1) has a low viscosity, the aromatic epoxy compound (f1) can lower the viscosity of the composition (X). Further, the aromatic epoxy compound (f1) is difficult to volatilize. Therefore, even when the composition (X) is stored, a change in the composition due to the volatilization of the aromatic epoxy compound (f1) hardly occurs in the composition (X). Therefore, the aromatic epoxy compound (f1) can enhance the storage stability of the composition (X). Further, since the aromatic epoxy compound (f1) has a high reactivity, unreacted components hardly remain in the cured product, and therefore it is difficult to generate outgas from the cured product. Furthermore, the aromatic epoxy compound (f1) can increase the glass transition temperature of the cured product, and therefore can enhance the heat resistance of the cured product.

[0170] In addition, when the aromatic epoxy compound (f1) is ejected by an inkjet method for the composition (X), it is difficult to generate defective droplets called satellites. A satellite is a droplet that separates from the original droplet when ejecting droplets by the inkjet method and adheres to a position different from the adhesion position of the original droplet on the application target. When satellites occur, it causes deterioration of the dimensional accuracy of the cured product produced from the composition (X).

[0171] It is preferable that R in formula (30) is a single bond or an alkylene group. When n in formula (30) is 2 or 3, it is preferable that at least one of the plurality of Rs in formula (30) is a single bond or an alkylene group. In these cases, the reactivity of the aromatic epoxy compound (f1) becomes high, and therefore the curability of the composition (X) when the composition (X) is irradiated with ultraviolet rays can be increased.

[0172] The aromatic epoxy compound (f1) preferably contains at least one compound selected from the group consisting of the compounds represented by the following formulas (301) to (318), respectively.

[0173]

Chemical formula

[0174] In particular, it is preferable that the aromatic epoxy compound (f1) contains at least one component selected from the group consisting of the compounds represented by formulas (301) to (305), (312), (314), and (318), respectively. Since at least one epoxy group (oxirane) in these compounds is bonded to the benzene ring by a single bond or an alkylene group, they have high reactivity, and thus can enhance the curability of the composition (X).

[0175] The ratio of the aromatic epoxy compound (f1) to the entire cationically polymerizable compound (A12) is preferably 5% by mass or more. In this case, the above-described action of the aromatic epoxy compound (f1) can be obtained particularly remarkably. This ratio is also preferably 95% by mass or less. In this case, the storage stability of the composition (X) can be good. More preferably, this ratio is 10% by mass or more and 90% by mass or less, and even more preferably 20% by mass or more and 85% by mass or less.

[0176] It is also preferable that the cationically polymerizable compound (A12) contains a compound (f2) having an oxyalkylene skeleton. The oxyalkylene skeleton is a linear skeleton composed of one or more linear oxyalkylene units.

[0177] When the cationically polymerizable compound (A12) contains the compound (f2), since the compound (f2) has a low viscosity, the compound (f2) can lower the viscosity of the composition (X). Further, the compound (f2) is difficult to volatilize, and therefore, even when the composition (X) is stored, the composition (X) is less likely to change in composition due to the volatilization of the aromatic epoxy compound (f1). Therefore, the compound (f2) can enhance the storage stability of the composition (X).

[0178] In addition, when the composition (X) is ejected by an inkjet method, the compound (f2) is less likely to generate defective droplets called satellites. Furthermore, even if the ejection speed of the droplets ejected by the inkjet method is increased, the compound (f2) can be less likely to generate satellites. Therefore, depending on the inkjet conditions, for example, it is possible to set the ejection speed of the droplets by the inkjet method to 4 m / s or more without generating satellites. If the droplet speed can be increased, the trajectory of the droplets is less likely to be affected by disturbances, so the dimensional accuracy of the cured product produced from the composition (X) can be improved. Furthermore, since the compound (f2) can enhance the storage stability of the composition (X) as described above, the characteristics of the composition (X) that satellites are less likely to occur can be maintained even when the composition (X) is stored for a long time.

[0179] The oxyalkylene skeleton preferably contains, in particular, a structure of “-C-C-O-”, that is, an oxymethylene unit. In this case, satellites are particularly less likely to occur, and for example, even if the driving frequency when ejecting the composition (X) by an inkjet method is varied, satellites are less likely to occur. Further, the compound (f2) is less volatile, has a lower viscosity, and the affinity (wettability) of the composition (X) for the inorganic material can be increased.

[0180] The number of oxyalkylene units in the oxyalkylene skeleton in the compound (f2) is preferably 1 or more and 8 or less. In this case, since the compound (f2) can have a lower viscosity, satellites are particularly less likely to occur, and the crosslink density of the cured product can be increased, so that the glass transition temperature of the cured product can be particularly high. It is more preferable that the number of the oxyalkylene units is 1 or more and 6 or less, and still more preferable that the number is 1 or more and 4 or less.

[0181] Note that a substituent other than hydrogen may be bonded to the oxyalkylene unit in the oxyalkylene skeleton in the compound (f2). For example, the oxymethylene unit contained in the oxyalkylene skeleton may have a structure of “-CH(CH3)-CH2-O-”.

[0182] The proportion of compound (f2) is preferably 10% by mass or more based on the cationically polymerizable compound (A12). In this case, the inkjet property becomes good and the wettability to the substrate improves. It is also preferable that this proportion is 70% by weight or less. In this case, the glass transition temperature can be sufficiently increased. More preferably, this proportion is 15% by mass or more and 60% by mass or less, and still more preferably 20% by mass or more and 50% by mass or less.

[0183] Compound (f2) contains at least one compound selected from, for example, a compound (f21) having an oxyalkylene skeleton and an epoxy group and a compound (f22) having an oxyalkylene group and an oxetane group.

[0184] Compound (f21) contains at least one compound selected from the group consisting of, for example, the compounds represented by the above formula (1b), the compounds represented by formula (4), the compounds represented by formula (5), the compounds represented by formula (6), the compounds represented by formula (7), the compounds represented by formula (8), the compounds represented by formula (13), the compounds represented by formula (14), etc. Note that the components that compound (f21) can contain are not limited to the above.

[0185] Compound (f22) contains at least one compound selected from the group consisting of, for example, the compounds represented by the above formula (3), the compounds represented by formula (12), the compounds represented by formula (16), and the compounds represented by formula (17). Note that the components that compound (f22) can contain are not limited to the above.

[0186] The sulfur-containing compound preferably has at least one ethylenically unsaturated group and at least one sulfur atom in one molecule. The ethylenically unsaturated group may be a (meth)acryloyl group or a group other than the (meth)acryloyl group. The sulfur-containing compound preferably contains a compound having a phenyl sulfide skeleton. The phenyl sulfide skeleton refers to a structure in which a phenyl group and a sulfur atom are directly bonded by a single bond. The compound having a phenyl sulfide skeleton preferably contains a polyarylene sulfide compound. The polyarylene sulfide compound is a compound having a repeating unit represented by [-Ar-S-] in the molecule. Ar is an arylene group, for example, a phenylene group. The sulfur-containing compound includes, for example, at least one selected from the group consisting of allyl phenyl sulfide, vinyl phenyl sulfide, and bis(4-methacryloylphenyl) sulfide. In particular, it is preferable that the sulfur-containing compound contains bis(4-methacryloylphenyl) sulfide which is less likely to generate odor. The ratio of the sulfur-containing compound to the photocurable compound (A1) is, for example, 10% by mass or more and 90% by mass or less, preferably 25% by mass or more and 80% by mass or less, and more preferably 40% by mass or more and 80% by mass or less.

[0187] The cationic polymerizable compound (A12) preferably contains an epoxy compound and the above-mentioned compound (f22). The epoxy compound contains at least one compound having an epoxy group among the compounds that can be contained in the above-mentioned cationic polymerizable compound (A12), for example. When the cationic polymerizable compound (A12) contains an epoxy compound and the compound (f22), the curability of the composition (X) when the composition (X) is irradiated with ultraviolet rays is enhanced, and at this time, the composition (X) is less likely to undergo overly rapid curing. Therefore, the cured product is less likely to deteriorate in transparency due to cloudiness or the like. The mechanism causing this effect is presumed to be as follows. Since the reactivity of the compound (f22) is lower than that of the epoxy compound, when the composition (X) is irradiated with ultraviolet rays, first, the epoxy compound reacts. The reaction of this epoxy compound can increase the curability of the composition (X). Subsequently, by the reaction of the compound (f22), a situation where the epoxy compound and the compound (f22) react at once can be made less likely to occur. Thus, it is considered that an overly rapid reaction is less likely to occur. In this case, the proportion of the compound (f22) with respect to the cationic polymerizable compound (A12) is preferably 20% by mass or more. In this case, the compound (f22) can particularly lower the viscosity of the composition (X) and particularly enhance the storage stability of the composition (X). Furthermore, the compound (f22) can particularly enhance the curability of the composition (X). The proportion of the compound (f22) is also preferably 90% by mass or less. In this case, the curability of the cured product can be sufficiently enhanced. The proportion of the compound (f22) is more preferably 10% by mass or more and 90% by mass or less, and even more preferably 20% by mass or more and 80% by mass or less. Also, in this case, the proportion of the epoxy compound is preferably 10% by mass or more and 90% by mass or less with respect to the total amount of the cationic polymerizable compound (A12), more preferably 20% by mass or more and 80% by mass or less, and even more preferably 25% by mass or more and 75% by mass or less. In these cases, the unreacted groups in the cured product can be sufficiently reduced, and the curability of the cured product can be sufficiently enhanced.

[0188] The epoxy compound preferably contains a compound having at least one oxirane ring that does not form a glycidyl ether group. In this case, the epoxy compound can particularly enhance the curability of the composition (X). It is more preferable if the epoxy compound contains a compound having two or more oxirane rings that do not form a glycidyl ether group. It is also preferable that the epoxy compound contains a compound having no glycidyl ether group. It is particularly preferable if the epoxy compound contains a compound having two or more oxirane rings that do not form a glycidyl ether group and also contains a compound having no glycidyl ether group.

[0189] It is particularly preferable that the cationic polymerizable compound (A12) contains the compound (f2) and the epoxy compound, and further that the epoxy compound contains the above-mentioned aromatic epoxy compound (f1). In this case, the composition (X) has particularly excellent storage stability, and when the composition (X) is discharged by an inkjet method, it is particularly difficult to generate defective droplets called satellites. Furthermore, even if the speed of the droplets discharged by the inkjet method is increased, satellites can be particularly difficult to generate. Moreover, even when the composition (X) is stored for a long time, the property of the composition (X) that satellites are difficult to generate can be particularly maintained. In this case, it is particularly preferable if the compound (f2) contains the compound (f22).

[0190] The total ratio of the aromatic epoxy compound (f1) and the compound (f22) to the cationic polymerizable compound (A12) is preferably 55% by mass or more. In this case, the action of the combination of the aromatic epoxy compound (f1) and the compound (f22) can be particularly remarkably obtained. This ratio is more preferably 60% by mass or more, and even more preferably 70% by mass or more. It is particularly preferable if the cationic polymerizable compound (A12) contains only the aromatic epoxy compound (f1) and the compound (f22).

[0191] When the composition (X) contains the cationically polymerizable compound (A12), the composition (X) preferably further contains a sensitizer. In this case, the composition (X) can have particularly high cationic polymerization reactivity. The sensitizer contains, for example, either one or both of 9,10-dibutoxyanthracene and 9,10-diethoxyanthracene. The ratio of the sensitizer to the cationically polymerizable compound (A12) is preferably more than 0% by mass and within the range of 1% by mass or less. In this case, the sensitizer is less likely to inhibit the transparency of the cured product, and therefore the cured product can have good transparency.

[0192] When the composition (X) contains the cationically polymerizable compound (A12), the composition (X) preferably further contains a photo cationic polymerization initiator (E2). The photo cationic polymerization initiator (E2) is not particularly limited as long as it is a catalyst that generates a protonic acid or a Lewis acid upon light irradiation. The photo cationic polymerization initiator (E2) can contain at least one of an ionic photoacid-generating type cationic curing catalyst and a non-ionic photoacid-generating type cationic curing catalyst.

[0193] The ionic photoacid-generating type cationic curing catalyst can contain at least one of onium salts and organometallic complexes. Examples of onium salts include aromatic diazonium salts, aromatic halonium salts, and aromatic sulfonium salts. Examples of organometallic complexes include iron-allyl complexes, titanocene complexes, and arylsilanol-aluminum complexes. The ionic photoacid-generating type cationic curing catalyst can contain at least one of these components.

[0194] The non-ionic photoacid-generating type cationic curing catalyst can contain at least one component selected from the group consisting of, for example, nitrobenzyl esters, sulfonic acid derivatives, phosphate esters, phenol sulfonic acid esters, diazonaphthoquinones, and N-hydroxyimide phosphonates. Note that the components that the non-ionic photoacid-generating type cationic curing catalyst can contain are not limited to the above.

[0195] More specific examples of compounds that can contain the photo cationic polymerization initiator (E2) include DPI series (such as 105, 106, 109, 201, etc.), BI-105, MPI series (such as 103, 105, 106, 109, etc.), BBI series (such as 101, 102, 103, 105, 106, 109, 110, 200, 210, 300, 301, etc.), TSP series (such as 102, 103, 105, 106, 109, 200, 300, 1000, etc.), HDS-109, MDS series (such as 103, 105, 109, 203, 205, 209, etc.), BDS-109, MNPS-109, DTS series (such as 102, 103, 105, 200, etc.), NDS series (such as 103, 105, 155, 165, etc.), DAM series (such as 101, 102, 103, 105, 201, etc.), SI series (such as 105, 106, etc.), PI-106, NDI series (such as 105, 106, 109, 1001, 1004, etc.), PAI series (such as 01, 101, 106, 1001, 1002, 1003, 1004, etc.), MBZ-101, PYR-100, NB series (such as 101, 201, etc.), NAI series (such as 100, 1002, 1003, 1004, 101, 105, 106, 109, etc.), TAZ series (such as 100, 101, 102, 103, 104, 107, 108, 109, 110, 113, 114, 118, 122, 123, 203, 204, etc.), NBC-101, ANC-101, TPS-Acetate, DTS-Acetate, Di-Boc Bisphinol A, tert-Butyl lithocholate, tert-Butyl deoxycholate, tert-Butyl cholate, BX, BC-2, MPI-103, BDS-105, TPS-103, NAT-103, BMS-105, and TMS-105; Silicyure UVI-6970, Silicyure UVI-6974, Silicyure UVI-6990, and Silicyure UVI-950 manufactured by Union Carbide Corporation of the United States; Irgacure 250, Irgacure 261, and Irgacure 264 manufactured by BASF; CG-24-61 manufactured by Ciba Geigy; ADEKA OPTOMER SP-150, ADEKA OPTOMER SP-151, ADEKA OPTOMER SP-170, and ADEKA OPTOMER SP-171 manufactured by ADEKA CORPORATION; DAICAT II manufactured by Daicel Corporation; UVAC1590 and UVAC1591 manufactured by Daicel Cytec Co., Ltd.; CI-2064, CI-2639, CI-2624, CI-2481, CI-2734, CI-2855, CI-2823, CI-2758, and CIT-1682 manufactured by Nippon Soda Co., Ltd.; PI-2074 which is tetrakis(pentafluorophenyl)borate toluic cumyliodonium salt manufactured by Rhodia; FFC509 manufactured by 3M Company; CD-1010, CD-1011, and CD-1012 manufactured by Sartomer Company, USA; CPI-100P, CPI-101A, CPI-110P, CPI-110A, and CPI-210S manufactured by San-Apro Ltd.; and UVI-6992 and UVI-6976 manufactured by The Dow Chemical Company are included. The photo cationic polymerization initiator (E2) can contain at least one compound selected from the group consisting of these compounds.

[0196] The ratio of the photo cationic polymerization initiator (E2) to the cationic polymerizable compound (A12) is preferably in the range of 1 to 4% by mass. When this ratio is 1% by mass or more, the composition (X) can have particularly good cationic polymerization reactivity. Also, when this ratio is 4% by mass or less, the composition (X) can have good storage stability, and the manufacturing cost can be reduced by not containing an excessive photo cationic polymerization initiator (E2).

[0197] <Phosphor (B)> Next, the phosphor (B) will be described. The phosphor (B) preferably contains a quantum dot phosphor (B1). When the phosphor (B) contains the quantum dot phosphor (B1), the color resist 1 produced from the composition (X) not only exhibits a wavelength conversion function similar to that of a normal color resist, but also can realize a wide color gamut of the light emitted from the color filter 2. Therefore, it is possible to realize a wide color gamut of the light emitted from the light-emitting device 11 provided with the color filter 2, particularly a display device. Further, since a wide color gamut can be realized by the color filter 2, it is not necessary to separately provide members such as a filter for wide color gamut in the light-emitting device 11, particularly a display device. For this reason, an increase in the number of parts of the light-emitting device 11 (display device) in achieving a wide color gamut can be suppressed. For this reason, the light-emitting device 11 (display device) can be thinned, and for example, a flexible light-emitting device 11 (display device) that can be bent can be realized.

[0198] A quantum dot is a semiconductor particle that exhibits a quantum size effect, and the quantum dot phosphor (B1) is a phosphor composed of quantum dots. The average particle diameter of the quantum dot phosphor (B1) is, for example, 1 nm or more and 10 nm or less. The average particle diameter of the quantum dot phosphor (B1) is preferably 2 nm or more and 6 nm or less. Note that even if the quantum dot phosphor (B1) has the same composition, if the particle diameter is different, the wavelength of the emitted fluorescence is different. Therefore, the quantum dot phosphor (B1) preferably has a particle diameter corresponding to the wavelength of the fluorescence emitted by the wavelength conversion member produced from the composition (X). The quantum dot phosphor (B1) contains at least one kind of semiconductor particle selected from the group consisting of, for example, semiconductor particles that emit red fluorescence, semiconductor particles that emit green fluorescence, and semiconductor particles that emit blue fluorescence. The quantum dot phosphor (B1) may contain semiconductor particles that emit fluorescence of other colors.

[0199] Note that the average particle diameter of the quantum dot phosphor (B1) is the median diameter, that is, the cumulative 50% diameter (D50), calculated from the measurement result by the dynamic light scattering method. As the measuring device, the Nanotrac Wave series of Microtrac Bell Co., Ltd. can be used.

[0200] The quantum dot phosphor (B1) may contain semiconductor particles having a core-shell structure. Specifically, the quantum dot phosphor (B1) contains, for example, semiconductor particles (CdSe / ZnS) having a core made of CdSe and a shell made of ZnS. The quantum dot phosphor (B1) may contain other appropriate semiconductor particles. For example, the quantum dot phosphor (B1) may contain semiconductor particles having at least one semiconductor selected from the group consisting of GaN, GaP, InN, InP, Ga2O3, Ga2S3, In2O3, In2S3, ZnO, ZnS, CdO, CdS, perovskite-type semiconductors, and graphene-type semiconductors. Note that the semiconductor particles that the quantum dot phosphor (B1) can contain are not limited to the above.

[0201] The amount of the quantum dot phosphor (B1) in the composition (X) is, for example, 0.1% by mass or more and 40% by mass or less with respect to the entire composition (X). When the amount of the quantum dot phosphor (B1) is 0.1% by mass or more, the cured product of the composition (X) can exhibit a wavelength conversion function. Further, when the amount of the quantum dot phosphor (B1) is 40% by mass or less, the composition (X) can be formed by an inkjet method. The amount of the quantum dot phosphor (B1) is more preferably 1% by mass or more, still more preferably 2% by mass or more, and particularly preferably 3% by mass or more. Also, the amount of the quantum dot phosphor (B1) is more preferably 35% by mass or less, still more preferably 30% by mass or less, and particularly preferably 25% by mass or less.

[0202] <Light scattering particles (C)> Next, the light scattering particles (C) will be described.

[0203] First, the light scattering particles (C) used in the first embodiment will be described. In the first embodiment, as described above, the light scattering particles (C) include core-shell type particles (C0) having a core portion with a specific gravity of 2.0 or less and a shell covering the core portion with a refractive index of 1.9 or more. Note that all of the light scattering particles (C) may be core-shell type particles (C0), or may partly include other types of particles having a light scattering function.

[0204] Since the specific gravity of the core part of the core-shell type particle (C0) is 2.0 or less, it is relatively difficult to sediment in the composition (X). Further, since the refractive index of the shell is 1.9 or more, the refractive index difference between the core-shell type particle (C0) and the cured product of the reaction curable compound (A) in the wavelength conversion member becomes large. Therefore, the light incident on the wavelength conversion member can be reflected at the interface between the core-shell type particle (C0) and the cured product of the reaction curable compound (A). Therefore, light can be scattered in the wavelength conversion member.

[0205] The specific gravity of the core part is more preferably 1.2 or less, and even more preferably 0.8 or less. Further, the specific gravity of the core part is, for example, 0.1 or more.

[0206] The core part may be composed of solid particles (core particles) or may be a hollow part in the form of voids.

[0207] The core particles may contain at least one of organic resin particles and inorganic particles. In particular, when the core particles contain organic resin particles, the specific gravity of the core part can be reduced. The organic resin particles contain at least one resin selected from the group consisting of, for example, acrylic resins, styrene resins and copolymers thereof, and urethane resins.

[0208] The core particles may contain hollow particles. The hollow particles are particles containing voids. When the core particles contain hollow particles, the specific gravity of the core part can be reduced. Further, when the core particles contain hollow particles, when the light incident on the wavelength conversion member enters the hollow particles, the light is reflected at the interface between the solid and the gas in the hollow particles. Therefore, the light scattering particles (C) can further scatter the light.

[0209] The hollow particles may contain at least one of organic resin particles (hollow resin particles) and inorganic particles (hollow inorganic particles). The hollow resin particles contain at least one selected from the group consisting of, for example, hollow acrylic resin particles and hollow styrene resin particles. The hollow inorganic particles contain at least one selected from the group consisting of, for example, hollow silica particles, hollow glass particles, hollow alumina particles, hollow alumina silicate particles, and hollow calcium carbonate particles.

[0210] As described above, the refractive index of the shell is 1.9 or more. The refractive index of the shell is more preferably 2.2 or more, and still more preferably 2.5 or more. The higher the refractive index of the shell, the more preferable, and the upper limit is not particularly limited. For example, the refractive index of the shell is 4.0 or less.

[0211] Also, the refractive index of the shell is preferably 0.4 or more higher than the refractive index of the cured product of the reaction curable compound (A). That is, the refractive index of the shell is higher than the refractive index of the reaction curable compound (A), and the refractive index difference between the shell and the cured product of the reaction curable compound (A) is preferably 0.4 or more. In this case, light can be particularly reflected at the interface between the light scattering particles (C) and the cured product of the reaction curable compound (A). The refractive index difference is more preferably 0.7 or more, and still more preferably 1.0 or more. The larger the refractive index difference, the more preferable, but the refractive index difference is, for example, 2.5 or less.

[0212] The material of the shell is appropriately selected according to the refractive index required for the shell. The shell contains at least one selected from the group consisting of, for example, titanium oxide, zinc oxide, zirconium oxide, aluminum oxide, and barium titanate. In this case, a high refractive index difference can be achieved.

[0213] The shell only needs to cover at least a part of the surface of the core particles. Preferably, the shell covers 50% or more of the surface of the core particles. In this case, the light scattering particles (C) can particularly scatter light. It is particularly preferable that the shell covers the entire surface of the core particles.

[0214] When the core part is a hollow part, the core-shell type particle (C0) is produced, for example, as follows. Raw material particles are produced by covering particles of an organic resin with a shell. The configuration of the shell may be the same as in the case where the core part is core particles. These raw material particles are heated at a temperature of, for example, 900 °C or higher. Then, by evaporation of the particles of the organic resin, core-shell type particles (C0) having the shell and a hollow part inside the shell are obtained. In this case, by heating the shell, the crystallinity of the shell can be increased, and thereby the refractive index of the shell can be increased. Further, by increasing the hollow ratio of the core-shell type particles (C0), the specific gravity of the light-scattering particles (C) can be lowered, and thus the light-scattering particles (C) can be made less likely to settle.

[0215] It is also preferable that the thickness of the shell is 5 nm or more and 60 nm or less. When the thickness is 5 nm or more, light can be particularly reflected at the interface between the core-shell type particles (C0) and the cured product. Further, when the thickness is 60 nm or less, the core-shell type particles (C0) are particularly unlikely to settle. The thickness is more preferably 10 nm or more from the viewpoint of light scattering, and even more preferably 20 nm or more. Also, the thickness is more preferably 40 nm or less from the viewpoint of sedimentation, and even more preferably 30 nm or less.

[0216] The core-shell type particles (C0) may further include at least one of a silica film and an alumina film covering the shell. In this case, particularly when the reactive curable compound (A) has photocationic polymerizability in the composition (X), the inhibition of the photocationic polymerization reaction of the reactive curable compound (A) by the shell can be suppressed by the silica film and the alumina film. For this reason, it is difficult for the light-scattering particles (C) to reduce the reactivity of the reactive curable compound (A). The thickness of each of the silica film and the alumina film is preferably small enough not to inhibit the action of scattering light by the light-scattering particles (C). The core-shell type particles (C0) may be provided with an appropriate film that does not inhibit the photocationic polymerization reaction in the same manner as the silica film and the alumina film instead of the silica film and the alumina film.

[0217] The specific gravity of the core-shell type particles (C0) is preferably 1.5 or less. In this case, the core-shell type particles (C0) are less likely to settle in the composition (X). This specific gravity is more preferably 1.3 or less, and even more preferably 1.2 or less. Also, this specific gravity is, for example, 0.9 or more.

[0218] The average particle size of the core-shell type particles (C0) is preferably 0.1 μm or more and 1 μm or less. When the average particle size is 0.1 nm or more, the core-shell type particles (C0) can effectively scatter light. When the average particle size is 1 μm or less, the core-shell type particles (C0) are particularly dispersed in the composition (X), and therefore the core-shell type particles (C0) are particularly less likely to settle. Also, when the average particle size is 1 μm or less, especially when the composition (X) is formed by an inkjet method, it is possible to less easily cause damage to the apparatus due to clogging or adhesion of the composition (X) in the inkjet apparatus. The average particle size is more preferably 0.15 μm or more, and even more preferably 0.2 μm or more. Also, the average particle size is more preferably 0.8 μm or less, and even more preferably 0.5 μm or less. Here, the average particle size referred to herein is the median diameter calculated from the particle size distribution measured by the dynamic light scattering method. As the measuring apparatus, the Nanotrac Wave series of Microtrac Bell Corporation can be used.

[0219] Next, the light-scattering particles (C) used in the second embodiment will be described.

[0220] In the second embodiment, the light-scattering particles (C) contain, as described above, titanium oxide particles (C1) and hollow particles (C2).

[0221] The titanium oxide particles (C1) have a high refractive index, and therefore light can be refracted or reflected at the interface between the titanium oxide particles (C1) and the resin. Therefore, the titanium oxide particles (C1) can reflect light.

[0222] The average particle size of the titanium oxide particles (C1) is preferably 300 nm or less. In this case, sedimentation of the light-scattering particles (C) is particularly unlikely to occur. This average particle size is more preferably 290 nm or less, still more preferably 260 nm or less, and particularly preferably 230 nm or less. It is also preferable that the average particle size of the titanium oxide particles (C1) is 50 nm or more. In this case, the light-scattering performance of the titanium oxide particles (C1) can be particularly exhibited. This average particle size is more preferably 80 nm or more, still more preferably 100 nm or more. The average particle size of the titanium oxide particles (C1) is the median diameter calculated from the particle size distribution obtained from the measurement results by the dynamic light scattering method. As the measuring device, for example, the Nanotrac Wave series of Microtrac Bell Co., Ltd. can be used.

[0223] The hollow particles (C2) have a shell portion and a hollow portion inside the shell portion. Therefore, at the interface between the shell portion and the hollow portion inside the hollow particles (C2), the refractive index changes discontinuously. For this reason, the hollow particles (C2) can scatter light. In addition, since the hollow particles (C2) have a hollow portion, their specific gravity is small, and therefore they are less likely to sediment in the composition (X). Therefore, the hollow particles (C2) are less likely to impair the storage stability of the composition (X). Also, as described above, the hollow particles (C2) can also suppress the sedimentation of the titanium oxide particles (C1).

[0224] The specific gravity of the hollow particles (C2) is preferably 0.2 or more and 1.2 or less. When the specific gravity is 1.2 or less, the hollow particles (C2) are particularly unlikely to sediment in the composition (X), and therefore are particularly unlikely to impair the storage stability of the composition (X). Also, when the specific gravity is 0.2 or more, the phenomenon that the hollow particles (C2) float to the surface during curing is suppressed, the composition of the cured product is homogenized, the physical strength is increased, and the damage to the hollow particles (C2) is also reduced. The specific gravity is more preferably 1.0 or less, still more preferably 0.8 or less. Also, the specific gravity is more preferably 0.3 or more, still more preferably 0.4 or more.

[0225] The hollow particles (C2) can contain at least one of hollow resin particles (C21) and hollow inorganic particles (C22). The shell portion of the hollow resin particles (C21) is made of resin, and the shell portion of the hollow inorganic particles (C22) is made of an inorganic material.

[0226] When the hollow particles (C2) contain the hollow resin particles (C21), the hollow resin particles (C21) are less likely to impair the light transmittance of the cured product of the composition (X). Therefore, the light transmittance of the wavelength conversion member can be maintained. Further, the hollow resin particles (C21) are less likely to be damaged even when a force is applied during the process of kneading or the like when preparing the composition (X) and during the process of producing a cured product from the composition (X). The hollow resin particles (C21) contain at least one selected from the group consisting of, for example, hollow acrylic resin particles and hollow styrene resin particles.

[0227] When the hollow particles (C2) contain the hollow inorganic particles (C22), the shell portion of the hollow inorganic particles (C22) contains at least one selected from the group consisting of, for example, silica, silicate glass, alumina, aluminosilicate, calcium carbonate, and titania (titanium oxide). When the shell portion contains at least one of silica and silicate glass, for example, when the hollow inorganic particles (C22) contain at least one of hollow silica particles and hollow glass particles, the hollow inorganic particles (C22) are less likely to impair the light transmittance of the cured product of the composition (X). When the hollow particles (C2) contain particles containing titania (for example, hollow titania particles), these particles containing titania do not correspond to the titanium oxide particles (C1).

[0228] The average particle size of the hollow particles (C2) is preferably 100 nm or more and 3 μm or less. When the average particle size is 100 nm or more, the hollow particles (C2) can effectively scatter light. When the average particle size is 3 μm or less, it is possible to less likely cause damage to the device due to clogging or adhesion of the composition (X) in the inkjet device. The average particle size is more preferably 150 nm or more, and even more preferably 1 μm or more. Further, the average particle size is more preferably 800 nm or less, and even more preferably 500 nm or less. The average particle size of the hollow particles (C2) is the median diameter calculated from the particle size distribution obtained from the measurement result by the dynamic light scattering method. As the measuring device, for example, the Nanotrac Wave series of Microtrac Bell Co., Ltd. can be used.

[0229] The average particle size of the hollow particles (C2) is preferably 1 time or more and 15 times or less the average particle size of the titanium oxide particles (C1). In this case, the sedimentation of the titanium oxide particles (C1) is particularly suppressed, and the storage stability of the composition (X) is further enhanced. This magnification is more preferably 1.5 times or more, and even more preferably 2.0 times or more. Further, this magnification is more preferably 10 times or less, and even more preferably 7 times or less.

[0230] In particular, the average particle size of the hollow resin particles (C21) is preferably 1.5 times or more the average particle size of the titanium oxide particles (C1). In this case, the sedimentation of the titanium oxide particles (C1) is particularly suppressed. This magnification is more preferably 1.8 times or more, and even more preferably 2.0 times or more. Further, this magnification is, for example, 10 times or less.

[0231] Further, the average particle size of the hollow inorganic particles (C22) is preferably 220 nm or more. Further, this average particle size is preferably 2 times or more the average particle size of the titanium oxide particles (C1). In this case, the sedimentation of the titanium oxide particles (C1) is particularly suppressed. The average particle size is more preferably 300 nm or more. Further, the average particle size is, for example, 1000 nm or less. Further, the magnification of the average particle size is more preferably 10 times or less, and even more preferably 7 times or less.

[0232] The percentage of the hollow particles (C2) with respect to the total of the titanium oxide particles (C1) and the hollow particles (C2) is preferably 10% by volume or more and less than 100% by volume. If this percentage is 10% by volume or more, sedimentation of the light-scattering particles (C) is particularly unlikely to occur. Also, if this percentage is less than 100% by volume, the light-scattering particles (C) can scatter light more effectively. It is more preferably 15% by volume or more, and even more preferably 30% by volume or more. Also, this percentage is more preferably 85% by volume or less, even more preferably 70% by volume or less, and still more preferably 50% by volume or less.

[0233] In a preferred embodiment of the present disclosure, the percentage of the light-scattering particles (C) with respect to the solid content in the composition (X) is preferably 1% by volume or more and 30% by volume or less. If this percentage is 1% by volume or more, the light-scattering particles (C) can scatter light more effectively. If this percentage is 30% by volume or less, the inkjet property of the composition (X) can be improved. The lower side of this percentage is more preferably 5% by volume or more, and even more preferably 10% by volume or more. Also, the upper side of this percentage is more preferably 25% by volume or less, and even more preferably 20% by volume or less. The percentage may be 18% by volume or less, and may further be 15% by volume or less.

[0234] In particular, in the first embodiment, the percentage of the core-shell type particles (C0) with respect to the solid content in the composition (X) is preferably 1% by volume or more and 20% by volume or less. The solid content is the component excluding the solvent in the composition (X). When the percentage is 1% by volume or more, the core-shell type particles (C0) can scatter light more effectively. When the percentage is 20% by volume or less, the inkjet property can be improved particularly when the composition (X) is formed by an inkjet method. This percentage is more preferably 5% by volume or more, and even more preferably 10% by volume or more. Also, this percentage is more preferably 18% by volume or less, and even more preferably 15% by volume or less.

[0235] In particular, in the second embodiment, the percentage of the titanium oxide particles (C1) with respect to the solid content in the composition (X) is preferably 1% by volume or more and 20% by volume or less. If this percentage is 1% by volume or more, the titanium oxide particles (C1) can scatter light more effectively. If this percentage is 20% by volume or less, the inkjet properties of the composition (X) are improved, and sedimentation of the light-scattering particles (C) is particularly unlikely to occur. This percentage is more preferably 5% by volume or more, and even more preferably 8% by volume or more. Also, this percentage is more preferably 15% by volume or less, and even more preferably 12% by volume or less.

[0236] Also, the percentage of the hollow particles (C2) with respect to the solid content in the composition (X) is preferably 0.1% by volume or more and 20% by volume or less. If this percentage is 0.1% by volume or more, sedimentation of the light-scattering particles (C) is particularly unlikely to occur. If this percentage is 20% by volume or less, the inkjet properties of the composition (X) can be improved. This percentage is more preferably 1% by volume or more, and even more preferably 10% by mass or more.

[0237] <Dispersant (D)> In a preferred embodiment of the present disclosure, the composition (X) preferably contains a dispersant (D). The dispersant (D) can improve the dispersibility of the phosphor (B) in the composition (X). Therefore, the dispersant (D) can make it less likely to cause an increase in the viscosity of the composition (X) and a decrease in storage stability due to the phosphor (B). Also, the dispersant (D) can enhance the dispersibility of the light-scattering particles (C) in the composition (X). For this reason, the light-scattering particles (C) are less likely to sediment.

[0238] In particular, when the light-scattering particles (C) contain titanium oxide particles (C1) and hollow particles (C2) as in the second embodiment, the dispersant (D) can greatly enhance the dispersibility of the light-scattering particles (C). This is presumably because the dispersant (D) enhances the interaction between the titanium oxide particles (C1) and the hollow particles (C2).

[0239] The dispersant (D) is a surfactant that can adsorb onto particles. The dispersant (D) generally has an adsorption group (also referred to as an anchor) that can be adsorbed onto particles and a molecular backbone (also referred to as a tail) that adheres to the particles when the adsorption group is adsorbed onto the particles. The dispersant (D) contains at least one component selected from the group consisting of, for example, an acrylic dispersant in which the tail is an acrylic molecular chain, a urethane dispersant in which the tail is a urethane molecular chain, and a polyester dispersant in which the tail is a polyester molecular chain. The adsorption group contains at least one of, for example, a basic polar functional group and an acidic polar functional group. The basic polar functional group contains at least one group selected from the group consisting of, for example, an amino group, an imino group, an amide group, an imide group, and a nitrogen-containing heterocyclic group. The acidic polar functional group contains at least one group selected from the group consisting of, for example, a carboxyl group and a phosphate group.

[0240] The dispersant (D) may contain a polymer. The weight average molecular weight of the polymer is, for example, 1000 or more. The polymer contains at least one component selected from the group consisting of, for example, a hydroxyl group-containing carboxylic acid ester, a salt of a long-chain polyaminoamide and a high molecular weight acid ester, a salt of a high molecular weight polycarboxylic acid, a salt of a long-chain polyaminoamide and a polar acid ester, a high molecular weight unsaturated acid ester, a modified polyurethane, a modified polyacrylate, a polyether ester type anionic surfactant, a salt of a naphthalene sulfonic acid formalin condensate, a polyoxyethylene alkyl phosphate ester, a polyoxyethylene nonylphenyl ether, a polyester polyamine, and stearylamine acetate. When the dispersant (D) contains a polymer, the dispersibility of the light-scattering particles (C) can be further enhanced. For example, in the case of the second embodiment, it is presumed that this is because the titanium oxide particles (C1) are less likely to settle due to the easier entanglement of the titanium oxide particles (C1) with the molecular chains of the polymer.

[0241] The dispersant (D) preferably contains a dispersant (D1) having two or more adsorption groups in one molecule. In this case, the dispersant (D) can disperse the light-scattering particles (C) more effectively. For example, in the case of the second embodiment, it is presumed that since the molecule of the dispersant (D1) has two or more adsorption groups, the dispersant (D1) easily mediates the interaction between the titanium oxide particles (C1) and the hollow particles (C2), and thus the titanium oxide particles (C1) are less likely to settle.

[0242] The dispersant (D1) can contain at least one selected from the group consisting of, for example, both-end type dispersants, comb type dispersants, side-chain end type dispersants, and hyperbranched type dispersants. The both-end type dispersant has a structure in which adsorption groups are bonded to both ends of the tail. The comb type dispersant has a structure in which a plurality of adsorption groups are present in the main chain of the comb-shaped tail having a main chain and a plurality of side chains. The side-chain end type dispersant has a structure in which an adsorption group is bonded to the end of the side chain of the tail having a main chain and a plurality of side chains, or an adsorption group is further bonded to one or both ends of the main chain. The hyperbranched type dispersant has a structure in which a core having an adsorption group is covered with a branched tail.

[0243] When the dispersant (D1) contains at least one selected from the group consisting of both-end type dispersants, comb type dispersants, and side-chain end type dispersants, the dispersant (D) is less likely to increase the viscosity of the composition (X). When the dispersant (D) contains a both-end type dispersant, the dispersant (D1) is particularly less likely to increase the viscosity of the composition (X). If the dispersant (D1) is less likely to increase the viscosity of the composition (X), the degree of freedom in selecting components other than the dispersant (D1) is increased. For example, even if the viscosity is slightly high, a component that can improve the function of the composition (X) can be blended into the composition (X), and the viscosity of the composition (X) can be maintained low.

[0244] The viscosity of the dispersant (D) is preferably 50000 mPa·s or less. In this case, the dispersant (D) is less likely to increase the viscosity of the composition (X). More preferably, the viscosity of the dispersant (D) is 20000 mPa·s or less, and particularly preferably 10000 mPa·s or less.

[0245] The boiling point of the dispersant (D) is preferably 200 °C or higher. In this case, since the dispersant (D) is less likely to volatilize from the composition (X), the storage stability of the composition (X) is further improved.

[0246] The weight average molecular weight of the dispersant (D) is preferably 200,000 or less. In this case, the dispersant (D) can have a low viscosity. The weight average molecular weight is more preferably 100,000 or less, and even more preferably 50,000 or less. In this specification, the weight average molecular weight is the relative weight average molecular weight in terms of polystyrene, obtained from the measurement results by gel permeation chromatography.

[0247] Examples of commercially available products of the dispersant (D) include the Solsperse series manufactured by Lubrizol Japan Co., Ltd., the DISPERBYK series manufactured by BYK-Chemie Japan Co., Ltd., and the ADEKA PERSE series manufactured by Ajinomoto Fine-Techno Co., Ltd., etc. which can be used.

[0248] More specifically, when using a dispersant (D1) having two or more adsorption groups in one molecule as the dispersant (D), the following are exemplified.

[0249] When the dispersant (D1) contains a two-terminal type dispersant, as the two-terminal type dispersant, for example, product number SOLSPERSE41000 manufactured by Lubrizol (a two-terminal type dispersant having a phosphate group as an adsorption group, acid value 50 mgKOH / g, amine value 0 mgKOH / g, viscosity 1500 mP·s, boiling point 200 °C or higher), product number SOLSPERSE45000 manufactured by Lubrizol (a two-terminal type dispersant having a phosphate group as an adsorption group, acid value 235 mgKOH / g, amine value 0 mgKOH / g, viscosity 1500 mP·s, boiling point 200 °C or higher), etc. can be used.

[0250] When the dispersant (D1) contains a comb-shaped dispersant, as the comb-shaped dispersant, for example, product number SOLSPERSE32000 manufactured by Lubrizol Corporation (a comb-shaped dispersant having an amino group as an adsorption group, acid value 15 mgKOH / g, amine value 31 mgKOH / g, viscosity 14000 mP·s, boiling point 200 °C or higher), product number SOLSPERSE36000 manufactured by Lubrizol Corporation (a comb-shaped dispersant having a phosphate group as an adsorption group, acid value 15 mgKOH / g, amine value 0 mgKOH / g, viscosity 15000 mP·s, boiling point 200 °C or higher), etc. can be used.

[0251] When the dispersant (D1) contains a side-chain terminal type dispersant, as the side-chain terminal type dispersant, for example, product name ActiFlow CBB3098 manufactured by Soken Chemical & Engineering Co., Ltd. (a side-chain terminal type dispersant having a carboxyl group as an adsorption group, acid value 98 mgKOH / g, amine value 0 mgKOH / g, viscosity 9000 mPa·s, boiling point 200 °C or higher), product name ActiFlow CB3060 manufactured by Soken Chemical & Engineering Co., Ltd. (a side-chain terminal type dispersant having a carboxyl group as an adsorption group, acid value 60 mgKOH / g, amine value 0 mgKOH / g, viscosity 1200 mPa·s, boiling point 200 °C or higher), etc. can be used.

[0252] When the dispersant (D1) contains a hyperbranched type dispersant, as the hyperbranched type dispersant, for example, product number DISPERBYK-2152 manufactured by BYK-Chemie GmbH (a hyperbranched type dispersant having a phosphate group protected by a protecting group as an adsorption group, acid value 0 mgKOH / g, amine value 0 mgKOH / g, viscosity 20000 mPa·s, boiling point 200 °C or higher), etc. can be used. In DISPERBYK-2152, since the phosphate group is protected by a protecting group, the acid value is not measured.

[0253] The amount of the dispersant (D) in the composition (X) can be set according to the purpose of improving the dispersibility of the phosphor (B) and the light-scattering particles (C).

[0254] For example, when improving the dispersibility of the phosphor (B), the amount of the dispersant (D) with respect to 100 parts by mass of the phosphor (B) is preferably 5 parts by mass or more and 60 parts by mass or less. When the amount of the dispersant (D) is 5 parts by mass or more, the function of the dispersant (D) can be effectively exhibited. When the amount is 60 parts by mass or less, it is possible to suppress the inhibition of the adhesion between the free molecules of the dispersant (D) in the color resist 1 and the member made of the inorganic material. Further, the amount of the dispersant (D) is more preferably 15 parts by mass or more, still more preferably 50 parts by mass or less, even more preferably 40 parts by mass or less, and particularly preferably 30 parts by mass or less. In addition, when the phosphor (B) is subjected to a surface treatment for improving dispersibility, etc., the phosphor (B) may be well dispersed even if the composition (X) does not contain the dispersant (D).

[0255] When improving the dispersibility of the light-scattering particles (C), the amount (percentage) of the dispersant (D) with respect to the light-scattering particles (C) is preferably 1% by mass or more and 60% by mass or less. When this percentage is 1% by mass or more, the dispersibility of the light-scattering particles (C) can be particularly enhanced. When this percentage is 60% by mass or less, there is an advantage that unadsorbed dispersant does not exist in the resin and discoloration due to light hardly occurs. This percentage is more preferably 3% by mass or more, and even more preferably 7% by mass or more. Also, this percentage is more preferably 40% by mass or less, and even more preferably 30% by mass or less.

[0256] <Other components> In a preferred embodiment of the present disclosure, the composition (X) preferably does not contain a solvent or the solvent content is 1% by mass or less. For this reason, outgas hardly occurs from the composition (X) and the cured product. Further, the storage stability of the composition (X) is further improved.

[0257] The composition (X) may further contain a moisture absorbent (F). When the composition (X) contains the moisture absorbent (F), even if the cured product of the composition (X) and the color resist 1 are exposed to moisture, the moisture absorbent (F) absorbs the moisture, making it difficult for the quantum dot phosphor (B1) in the cured product and the color resist 1 to deteriorate. The average particle size of the moisture absorbent (F) is preferably 200 nm or less. In this case, the cured product can have high transparency.

[0258] The moisture absorbent (F) is preferably inorganic particles having hygroscopicity, and preferably contains at least one component selected from the group consisting of zeolite particles, silica gel particles, calcium chloride particles, and titanium oxide nanotube particles. Note that the components that the moisture absorbent (F) can contain are not limited to the above. It is particularly preferable that the moisture absorbent (F) contains zeolite particles.

[0259] Zeolite particles with an average particle size of 200 nm or less can be produced, for example, by pulverizing general industrial zeolite. When producing zeolite particles, the zeolite can be pulverized and then crystallized by hydrothermal synthesis or the like. In this case, the zeolite particles can have particularly high hygroscopicity. Examples of such methods for producing zeolite particles are disclosed in JP-A-2016-69266 and JP-A-2013-049602.

[0260] The zeolite particles preferably contain sodium ions, and therefore it is preferable that the zeolite particles are produced from zeolite containing sodium ions as a raw material. Among zeolites containing sodium ions, it is more preferable to use at least one selected from the group consisting of type A zeolite, type X zeolite, and type Y zeolite as a raw material. It is particularly preferable that the zeolite particles are produced from 4A zeolite among type A zeolites as a raw material. In these cases, the zeolite particles have a crystal structure suitable for adsorbing moisture.

[0261] The average particle diameter of the moisture absorbent (F) is preferably 10 nm or more and 200 nm or less. If this average particle diameter is 200 nm or less, the cured product can have particularly high transparency. Further, if this average particle diameter is 10 nm or more, good moisture absorbency of the moisture absorbent (F) can be maintained. Note that this average particle diameter is the median diameter, that is, the cumulative 50% diameter (D50), calculated from the measurement results by the dynamic light scattering method. As the measuring device, the NanoTrac Wave series of Microtrac BEL Corporation can be used.

[0262] The average particle diameter of the moisture absorbent (F) is more preferably 150 nm or less, still more preferably 100 nm or less, and particularly preferably 70 nm or less. Further, the average particle diameter of the moisture absorbent (F) is preferably 20 nm or more, and more preferably 50 nm or more. In this case, the cured product can have particularly good transparency and moisture absorbency.

[0263] The cumulative 90% diameter (D90) of the moisture absorbent (F) is preferably 300 nm or less, and more preferably 100 nm or less. In this case, the cured product can have particularly high transparency.

[0264] When the composition (X) contains the moisture absorbent (F), the ratio of the moisture absorbent (F) to the total amount of the composition (X) is preferably 1% by mass or more and 20% by mass or less. If the ratio of the moisture absorbent (F) is 1% by mass or more, the cured product can have particularly high moisture absorbency. Further, if the ratio of the moisture absorbent (F) is 20% by mass or less, the viscosity of the composition (X) can be particularly reduced, and the composition (X) can also have a sufficiently low viscosity such that it can be applied by an inkjet method. The ratio of the moisture absorbent (F) is more preferably 3% by mass or more, and particularly preferably 5% by mass or more. Further, the ratio of the moisture absorbent (F) is more preferably 15% by mass or less, and particularly preferably 13% by mass or less.

[0265] The composition (X) can be prepared by mixing the above-described components. The composition (X) is preferably liquid at 25°C.

[0266] A color resist 1 made from a composition (X), a color filter 2 including the color resist 1, and a light-emitting device 11 including the color filter 2 will be described.

[0267] The color filter 2 includes, for example, a support substrate 4, a color resist 1 supported on the support substrate 4, and a protective layer 5 covering the color resist 1 (see FIGS. 1A and 1B).

[0268] The color resist 1 can be produced by forming the composition (X) by an inkjet method and then irradiating the composition (X) with ultraviolet rays for curing.

[0269] When forming the composition (X) by an inkjet method, if the composition (X) has a sufficiently low viscosity at room temperature, for example, when the viscosity at 25°C is 30 mPa·s or less, particularly 15 mPa·s or less, it can be formed by applying the composition (X) by an inkjet method without heating.

[0270] When the composition (X) has the property of reducing its viscosity when heated, the composition (X) may be heated and then applied by an inkjet method for forming. When the viscosity of the composition (X) at 40°C is 30 mPa·s or less, particularly 15 mPa·s or less, the composition (X) can be reduced in viscosity by only slightly heating, and this viscosity-reduced composition (X) can be ejected by an inkjet method. The heating temperature of the composition (X) is, for example, 20°C or higher and 50°C or lower.

[0271] Also, when curing the composition (X), if the phosphor (B) in the composition (X) absorbs ultraviolet rays, it is preferable to select the wavelength of the ultraviolet rays irradiated to the composition (X) so that a decrease in reaction efficiency due to the phosphor (B) absorbing ultraviolet rays is less likely to occur. For example, when a green quantum dot phosphor composed of CdSe / ZnS core-shell type semiconductor particles is used, the wavelength of the ultraviolet rays irradiated to the composition (X) is preferably 395 nm or more.

[0272] More specifically, for example, first, a transparent support substrate 4 is prepared. The support substrate 4 is made of, for example, a transparent resin or glass. A partition wall 3 is formed on one surface of the support substrate 4. The partition wall 3 is made of, for example, a polyimide resin. As a result, a plurality of recesses 14 partitioned by the partition wall 3 are formed on the support substrate 4. Next, the composition (X) is ejected into the recess 14 by an inkjet method. Subsequently, the composition (X) in the recess 14 is cured by irradiating ultraviolet rays to produce the color resist 1.

[0273] Next, a protective layer 5 is formed so as to cover the color resist 1. The protective layer 5 includes, for example, a layer made of a resin (referred to as a resin layer). The protective layer 5 may include a layer made of an inorganic material (referred to as an inorganic layer). The inorganic layer is made of, for example, silicon nitride or silicon oxide. The protective layer 5 may include either one of the resin layer and the inorganic layer, or both. When the protective layer 5 includes both the resin layer and the inorganic layer, the protective layer 5 may include a plurality of resin layers or a plurality of inorganic layers. When the protective layer 5 includes the resin layer and the inorganic layer, in the protective layer 5, the adjacent resin layer and inorganic layer are arranged in the direction in which the color resist 1 and the protective layer 5 are arranged. For example, the protective layer 5 may include two inorganic layers and one resin layer, and the inorganic layer, the resin layer, and the inorganic layer may be arranged in this order. The protective layer 5 may include one inorganic layer and two resin layers, and the resin layer, the inorganic layer, and the resin layer may be arranged in this order. The thickness of the protective layer 5 is, for example, 0.1 μm or more and 2 μm or less.

[0274] When the protective layer 5 includes an inorganic layer, the inorganic layer can be formed by a deposition method such as a plasma CVD method. In this case, the color resist 1 is exposed under vacuum or reduced pressure. However, as described above, in this embodiment, it is possible to make it difficult for outgassing to occur from the color resist 1 under vacuum or reduced pressure. Therefore, even when the color resist 1 is exposed under vacuum or reduced pressure in the manufacturing process of the color filter 2, it is possible to make it difficult for voids due to outgassing to occur in the color filter 2.

[0275] The step of producing the color resist 1 from the composition (X) preferably does not include a drying step of drying the composition (X) between the forming and curing of the composition (X). The drying step of drying the composition (X) is to remove at least a part of the solvent in the composition (X). In this case, since it is not necessary to dry the composition (X), the efficiency of producing the color resist 1 can be increased. In particular, if the composition (X) does not contain a solvent or the solvent content is 1% by mass or less, outgassing from the color resist 1 can be made less likely to occur without drying the composition (X).

[0276] When the composition (X) contains 1% by mass or less of a solvent, the step of producing the color resist 1 from the composition (X) may, if necessary, include a drying step of drying the composition (X). In this case, particularly if the solvent content of the composition (X) is 1% by mass or less, at least one of reducing the heating temperature and shortening the heating time of the composition (X) when drying the composition (X) can be achieved. For example, the heating temperature can be set to 120°C or lower, can be set to less than 100°C, and can also be set to less than 50°C. When the composition (X) is dried, outgassing from the color resist 1 can be made even less likely to occur.

[0277] When the method for manufacturing the color filter 2 includes producing the color resist 1 and producing the protective layer 5, this manufacturing method preferably does not include a drying step of drying the color resist 1 between producing the color resist 1 from the composition (X) and producing the protective layer 5. In this case, since it is not necessary to dry the color resist 1, the manufacturing efficiency of the color filter 2 can be increased. Also, in the present embodiment, since the composition (X) does not contain a solvent or the solvent content is 1% by mass or less, outgassing from the color resist 1 can be made less likely to occur without drying the color resist 1.

[0278] When the composition (X) contains 1% by mass or less of a solvent, if necessary, the method for manufacturing the color filter 2 may include a drying step of drying the color resist 1 from the composition (X) until the protective layer 5 is formed. In this case, since the solvent content of the composition (X) is 1% by mass or less, at least one of reducing the heating temperature and shortening the heating time of the color resist 1 when drying the color resist 1 can be achieved. For example, the heating temperature can be 120°C or lower, can be less than 100°C, and can also be less than 50°C. When the color resist 1 is dried, it is possible to further reduce the generation of outgas from the color resist 1.

[0279] It is particularly preferable that the method for manufacturing the color filter 2 does not include either a drying step of drying the composition (X) or a drying step of drying the color resist 1 from the time the composition (X) is formed until the protective layer 5 is formed. However, when the composition (X) contains 1% by mass or less of a solvent, if necessary, the method for manufacturing the color filter 2 may include a drying step of drying at least one of the composition (X) and the color resist 1. Also in this case, as described above, at least one of reducing the heating temperature and shortening the heating time for drying can be achieved.

[0280] The drying step of drying the composition (X) may include heating the composition (X) under a reduced pressure atmosphere or under vacuum. The drying step of drying the color resist 1 may include heating the color resist 1 under a reduced pressure atmosphere or under vacuum. Also in these cases, for example, the heating temperature can be 120°C or lower, can be less than 100°C, and can also be less than 50°C.

[0281] Note that heating the color resist for purposes other than drying the color resist 1 after the color resist 1 is formed is not included in the drying step of drying the color resist 1. For example, heating the color resist 1 under vacuum or under reduced pressure in a chamber for forming the above-described inorganic layer on the color resist 1 by a vapor deposition method such as plasma CVD is not included in the drying step.

[0282] Next, the light-emitting device 11 including the color filter 2 will be described. The light-emitting device 11 includes, for example, a color filter 2 including a color resist 1 and a light source that irradiates the color filter 2 with light. The light-emitting device 11 may be a display device (display) that visibly displays information such as an image by light.

[0283] The light-emitting device 11 shown in FIG. 1A is a display device, and more specifically, a liquid crystal display device 12. The liquid crystal display device 12 includes a backlight unit 7 including a light source, a liquid crystal panel 6, and a color filter 2, which are laminated in this order. The light source in the backlight unit 7 is, for example, a cold cathode tube or a light-emitting diode.

[0284] The color resist 1 of the color filter 2 in this liquid crystal display device 12 includes, for example, a color resist 1r that emits red fluorescence (hereinafter also referred to as a red color resist 1r), a color resist 1g that emits green fluorescence (hereinafter also referred to as a green color resist 1g), and a resist 1b that does not emit fluorescence (hereinafter also referred to as a transparent resist 1b). In this case, if the light source emits blue light, full-color display using the three primary colors is possible. The red color resist 1r and the composition (X) for producing the same contain a quantum dot phosphor (B1) that emits red fluorescence. The green color resist 1g and the composition (X) for producing the same contain a quantum dot phosphor (B1) that emits green fluorescence. The composition for producing the transparent resist 1b may be any composition as long as it can produce a transparent cured product. For example, it has a composition obtained by removing the phosphor (B) from the composition (X).

[0285] Note that the colors of the fluorescence emitted by the color resist 1 in the color filter 2 and the fluorescence emitted by the quantum dot phosphor (B1) are not limited to those described above. For example, when the light source emits white light, the color resist 1 may include a color resist that emits blue fluorescence (hereinafter also referred to as a blue color resist) instead of the transparent resist 1b. The blue color resist and the composition (X) for producing the same contain a quantum dot phosphor (B1) that emits blue fluorescence. Also in this case, full-color display using the three primary colors is possible.

[0286] When manufacturing the liquid crystal display device 12, after manufacturing the color filter 2, the color filter 2 may be overlaid on the liquid crystal panel 6. After overlaying the support substrate 4 on the liquid crystal panel 6, the color filter 2 may be manufactured by manufacturing the partition wall 3, the color resist 1, and the protective layer 5 on this support substrate 4 by the above method. The color filter 2 may be manufactured by directly manufacturing the partition wall 3, the color resist 1, and the protective layer 5 on the liquid crystal panel 6 by the above method.

[0287] The liquid crystal display device 12 may further include elements other than those described above. For example, the liquid crystal display device 12 may further include a transparent substrate that overlays the color filter 2. The liquid crystal display device 12 may further include a touch panel that overlays the color filter 2.

[0288] The light-emitting device 11 shown in FIG. 1B is a display device, and more specifically, an LED (light-emitting diode) display device. The LED display device 13 includes a light-emitting unit 8 including a plurality of light-emitting diodes 9 that are light sources, and a color filter 2. The light-emitting diodes 9 are, for example, micro light-emitting diodes or organic light-emitting diodes (organic electroluminescence elements).

[0289] The light-emitting unit 8 includes a substrate 10, a plurality of light-emitting diodes 9 mounted on the substrate 10, and a protective layer 15 that covers the light-emitting diodes 9. The protective layer 15 in the light-emitting unit 8 includes, for example, either one of a resin layer and an inorganic layer, or both a resin layer and an inorganic layer, similar to the protective layer 5 in the color filter 2.

[0290] The color resist 1 of the color filter 2 in this LED display device 13 includes, for example, a red color resist 1r, a green color resist 1g, and a transparent resist 1b, similar to the case of the liquid crystal display device 12 described above. The plurality of color resists 1 in the color filter 2 are paired with each of the plurality of light-emitting diodes 9. The light emitted by the light-emitting diode 9 is irradiated onto the paired color resist 1, thereby causing fluorescence to be emitted from the color resist 1. Therefore, when the light-emitting diode 9 emits blue light, the light emitted from the LED display device 13 to the outside includes red fluorescence emitted from the red color resist 1r, green fluorescence emitted from the green color resist 1g, and blue light passing through the transparent resist 1b. Therefore, full-color display using the three primary colors is possible.

[0291] In addition, when the light-emitting diode 9 emits white light, it may include a blue color resist that emits blue fluorescence instead of the transparent resist 1b. In this case, the light-emitting diode 9 may include a light-emitting diode (first light-emitting diode) paired with the red color resist 1r, a light-emitting diode (second light-emitting diode) paired with the green color resist 1g, and a light-emitting diode (third light-emitting diode) paired with the blue color resist. In other words, the light-emitting diode 9 may include a first light-emitting diode that irradiates the red color resist 1r with light, a second light-emitting diode that irradiates the green color resist 1g with light, and a third light-emitting diode that irradiates the blue color resist with light. In this case, the light emitted from the LED display device 13 to the outside includes red fluorescence emitted from the red color resist 1r, green fluorescence emitted from the green color resist 1g, and blue fluorescence emitted from the blue color resist. Therefore, full-color display using the three primary colors is possible.

Example

[0292] 1. Preparation of the composition The compositions of the examples and comparative examples were prepared by mixing the components shown in the following table. In the table, the blending amounts of the components other than the light-scattering particles are shown in parts by mass, and the blending amount of the light-scattering particles is shown as a volume percentage based on the whole composition.

[0293] Among the components shown in the table, the details of the components other than the light-scattering particles are as follows. Also, the viscosity of each of the following components was measured using a rheometer (manufactured by Anton Paar Japan, model number DHR-2) under the conditions of a temperature of 25°C and a shear rate of 1000 s -1 and is the value measured under these conditions.

[0294] <Reactive curing compound> - Acryloylmorpholine: boiling point 265°C, viscosity 12 mPa·s. - Dipropylene glycol diacrylate: boiling point 120°C, viscosity 10 mPa·s. - Triethylene glycol dimethacrylate: boiling point 290°C. Viscosity 8 mPa·s. - 1,9-Nonanediol diacrylate: boiling point 342°C. Viscosity 8 mPa·s. - Pentaerythritol tetraacrylate: boiling point 450°C, viscosity 350 mPa·s.

[0295] <Photoinitiator> - Irgacure907: manufactured by BASF, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one. - IrgacureTPO: manufactured by BASF, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide.

[0296] <Quantum dot phosphor> - Green quantum dot phosphor: CdSe / ZnS core-shell type semiconductor particles, median diameter 3.3 nm, manufactured by SIGMA-ALDRICH, product name CdSe / ZnS530. - Red quantum dot phosphor: CdSe / ZnS core-shell type semiconductor particles, median size 5.2 nm, manufactured by SIGMA-ALDRICH, product name CdSe / ZnS610.

[0297] <Dispersant> -CBB3098: A side-chain terminal type dispersant having a carboxyl group as an adsorption group, acid value 98 mgKOH / g, viscosity 9000 mP·s, weight average molecular weight 3000, manufactured by Soken Chemical & Engineering Co., Ltd., product number CBB3098. -DISPERBYK-2155: A dispersant with a polyurethane structure having a plurality of tertiary amino groups as adsorption groups in one molecule, amine value 48 mgKOH / g, viscosity 13000 mP·s, weight average molecular weight 20000, manufactured by BYK Chemie GmbH, product number DISPERBYK-2155.

[0298] Among the components shown in the table, the details of the light-scattering particles are as follows. The refractive index of the hollow particles is the refractive index of the part other than the hollow part in the hollow particles.

[0299] Tables 1 and 2 show the details of the light-scattering particles used in Example A and Comparative Example A. Note that Example A is an example corresponding to the first embodiment.

[0300]

Table 1

[0301]

Table 2

[0302] Table 3 shows the details of the light-scattering particles used in Example B and Comparative Example B. Note that Example B is an example corresponding to the second embodiment.

[0303]

Table 3

[0304] 2. Measurement of the refractive index of the cured product of the reaction-curable compound The compositions obtained by mixing only the photocurable compound and the photopolymerizable compound in each of the examples and comparative examples were applied to form a coating film. This coating film was irradiated with ultraviolet light for 20 seconds under the conditions of 500 mW / cm 2 using an LED-UV irradiator (peak wavelength 385 nm) manufactured by Panasonic Electric Works Co., Ltd. in an air atmosphere to be photocured, thereby producing a film with a thickness of 300 μm. The refractive index of this sample for light with a wavelength of 589 nm at 25°C was measured using a multi-wavelength Abbe refractometer DR-M4 manufactured by Atago Co., Ltd.

[0305] 3. Evaluation Test The following evaluation tests were carried out for the examples and comparative examples. The results of Example A and Comparative Example A are shown in Tables 4 to 6. Also, the results of Example B and Comparative Example B are shown in Tables 7 and 8.

[0306] (1) Viscosity at 25°C The viscosity of the composition was measured using a rheometer (manufactured by Anton Paar Japan, model number DHR-2) at a temperature of 25°C and a shear rate of 1000 s -1 under the conditions.

[0307] (2) Viscosity at 40°C The viscosity of the composition was measured using a rheometer (manufactured by Anton Paar Japan, model number DHR-2) at a temperature of 40°C and a shear rate of 1000 s -1 under the conditions.

[0308] (3) Inkjet Property The composition was put into the cartridge of an inkjet printer (manufactured by Ricoh, model MH2420). After confirming that the composition in the cartridge could be ejected from the nozzles in the inkjet printer, the composition was ejected from the nozzles to continuously print a test pattern. As a result, when the composition could be ejected for 1 hour and the ejection operation was stable, it was evaluated as "A"; when the composition could be ejected for 1 hour but the ejection operation became intermittently unstable, it was evaluated as "B"; when the nozzles were clogged before 1 hour elapsed from the start of ejection and the composition could not be ejected, it was evaluated as "C".

[0309] (4) Sedimentation stability The following tests were conducted on the composition. The composition was placed up to a height of 41 mm in a transparent dedicated test container with a volume of 20 cm 3 . Using a high-performance in-liquid dispersion stability evaluation apparatus Turbiscan Lab manufactured by Sanyo Trading Co., Ltd., the peak of the scattering intensity of the composition in the portion within 3 mm from the bottom of the test container when irradiating the composition with light of a wavelength of 880 nm was measured (initial value). Subsequently, the test container containing the composition was allowed to stand in a high-temperature bath at 40 °C for 14 days, and then the same test was conducted.

[0310] In the evaluation, when the increase amount of the peak of the scattering intensity was 1% or less of the initial value, it was evaluated as "A"; when the increase in the peak of the scattering intensity was more than 1% and 3% or less of the initial value, it was evaluated as "B"; when the increase in the peak of the scattering intensity was more than 3% and 5% or less of the initial value, it was evaluated as "C"; when the increase in the peak of the scattering intensity was more than 5% of the initial value, it was evaluated as "D". In the case of "D", sedimentation was not eliminated even when the composition in the test container was gently shaken.

[0311] (5) Light scattering evaluation The following tests were conducted on the composition. The composition was applied onto a quartz glass with a thickness of 1 mm to prepare a coating film. Using an LED-UV irradiator (peak wavelength 385 nm) manufactured by Panasonic Electric Works Sankus, ultraviolet rays were irradiated onto this coating film under an air atmosphere at a condition of 500 mW / cm 2 for 3 seconds (integrated light amount 1500 mJ / cm 2 ) to cure the coating film. As a result, a film with a thickness of 10 μm was prepared on the quartz glass. The transmittance of light with a wavelength of 450 nm of this film was measured. For the measurement, a spectrophotometer (U-4100 manufactured by Hitachi, Ltd.) was used.

[0312] As a result, when the transmittance was 60% or less, it was evaluated as "A"; when the transmittance was higher than 60% and 75% or less, it was evaluated as "B"; when the transmittance was higher than 75%, it was evaluated as "C".

[0313]

Table 4

[0314]

Table 5

[0315]

Table 6

[0316]

Table 7

[0317]

Table 8

Claims

1. A reaction-curable compound (A), a phosphor (B), and light-scattering particles (C), wherein the light-scattering particles (C) include core-shell type particles (C0) having a core part and a shell covering the core part, the core part includes hollow particles, the specific gravity of the core part is 2.0 or less, and the refractive index of the shell is 1.9 or more, a composition for forming a wavelength conversion member.

2. The core part includes organic resin particles, The composition for forming a wavelength conversion member according to Claim 1.

3. The average particle diameter of the core-shell type particles (C0) is 50 nm or more and 3000 nm or less, The composition for forming a wavelength conversion member according to Claim 1 or 2.

4. The thickness of the shell is 5 nm or more and 60 nm or less, The composition for forming a wavelength conversion member according to any one of Claims 1 to 3.

5. The percentage of the core-shell type particles (C0) with respect to the solid content in the composition for forming a wavelength conversion member is 1% by volume or more and 20% by volume or less, The composition for forming a wavelength conversion member according to any one of Claims 1 to 4.

6. A reaction-curable compound (A), a phosphor (B), and light-scattering particles (C), wherein the light-scattering particles (C) contain titanium oxide particles (C1) and hollow particles (C2), the average particle diameter of the titanium oxide particles (C1) is 100 nm or more, and the average particle diameter of the hollow particles (C2) is 2.8 times or more the average particle diameter of the titanium oxide particles (C1), a composition for forming a wavelength conversion member.

7. The average particle diameter of the titanium oxide particles (C1) is 300 nm or less, The composition for forming a wavelength conversion member according to Claim 6.

8. The percentage of the titanium oxide particles (C1) with respect to the solid content in the composition for forming a wavelength conversion member is 1% by volume or more and 20% by volume or less, The composition for forming a wavelength conversion member according to Claim 6 or 7.

9. The hollow particles (C2) contain hollow resin particles (C21), The composition for forming a wavelength conversion member according to any one of Claims 6 to 8.

10. The hollow particles (C2) contain hollow inorganic particles (C22), and the average particle diameter of the hollow inorganic particles (C22) is 220 nm or more, The composition for forming a wavelength conversion member according to any one of Claims 6 to 9.

11. The percentage of the hollow particles (C2) with respect to the solid content in the composition for forming a wavelength conversion member is 0.1% by volume or more and 20% by volume or less, The composition for forming a wavelength conversion member according to any one of claims 6 to 10.

12. Further containing a dispersant (D), The composition for forming a wavelength conversion member according to any one of claims 1 to 11.

13. Further containing a dispersant (D), The dispersant (D) includes a dispersant (D1) having two or more adsorption groups in one molecule. The composition for forming a wavelength conversion member according to any one of claims 6 to 11.

14. The reaction curable compound (A) contains a photocurable compound. The composition for forming a wavelength conversion member according to any one of claims 1 to 13.

15. The phosphor (B) contains a quantum dot phosphor (B1). The composition for forming a wavelength conversion member according to any one of claims 1 to 14.

16. Satisfying at least one of the viscosity at 25 °C being 30 mPa·s or less and the viscosity at 40 °C being 30 mPa·s or less. The composition for forming a wavelength conversion member according to any one of claims 1 to 15.

17. Including a cured product of the composition for forming a wavelength conversion member according to any one of claims 1 to 16. Color resist.

18. A color filter including the color resist according to claim 17. Color filter.

19. A light-emitting device including the color filter according to claim 18 and a light source for irradiating light to the color filter. Light-emitting device.

20. A display device. The light-emitting device according to claim 19.

21. After forming the composition for forming a wavelength conversion member according to any one of claims 1 to 16 by an inkjet method, irradiating ultraviolet rays to the composition for forming a wavelength conversion member to cure it. Method for manufacturing a color resist.

22. A method for manufacturing a light-emitting device including a color filter having a color resist and a light source for irradiating light to the color filter. The method including manufacturing the color resist by the method according to claim 21. Method for manufacturing a light-emitting device.

Images