End state confirmation device

Abstract

To provide an end state confirmation device capable of determining whether or not a protective member formed on an outer peripheral edge of a substrate has an internal defect.SOLUTION: An end state confirmation device 1 includes a rotation holding device 40, a light emitting part 70, and an imaging part 80. A substrate W, at least a part of which is circular and an outer peripheral edge of which is formed with a protective member is conveyed into the edge state confirmation device 1. The conveyed substrate W is held by the rotation holding device 40. The imaging part 80 has an imaging area and is configured to be able to receive infrared light transmitted through the substrate W and the protective member. The light emitting part 70 emits infrared light to the imaging area of the imaging part 80. At least part of the outer peripheral edge of the substrate W is disposed in a predetermined posture at a predetermined position RP in the imaging area of the imaging unit 80.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an end confirmation device for confirming the end state of a substrate having a coating film formed on its outer peripheral end.

Background Art

[0002] A substrate processing apparatus is used to perform various processes on substrates such as semiconductor substrates, substrates for flat panel displays (FPDs) such as liquid crystal display devices or organic EL (Electro Luminescence) display devices, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, or substrates for solar cells.

[0003] Depending on the process performed on the substrate, high strength may be required for the substrate. Therefore, as a substrate to be processed, a substrate in which two substrates are bonded together with an adhesive (hereinafter referred to as a bonded substrate) may be used in some cases.

[0004] In a bonded substrate, if there are defects (for example, voids) between the two substrates, sufficient strength cannot be obtained. Therefore, an inspection device for inspecting the presence or absence of defective portions generated between the two substrates has been proposed for the bonded substrate.

[0005] In the inspection device described in Patent Document 1, the loaded bonded substrate (polymerized wafer) is adsorbed and held by a chuck. Further, the bonded substrate held by the chuck is irradiated with infrared rays, and the entire surface of the bonded substrate is imaged. Based on the image obtained by this imaging, the bonded substrate is inspected.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] In a bonded substrate, for example, a protective member may be provided at the outer peripheral end of the bonded substrate so that the boundary of the bonding portion of two substrates having bevel portions is not exposed to the outside. The protective member is formed, for example, by filling a coating liquid for the protective member into the space between adjacent bevel portions in the stacking direction of the two bonded substrates and curing the filled coating liquid.

[0008] However, when a part of the protective member formed at the outer peripheral end of the bonded substrate peels off, it becomes a cause of particle generation. The peeling of the protective member can occur due to defects (for example, voids) generated inside the protective member. Further, the defects generated inside the protective member also reduce the strength of the bonded substrate. The defects generated inside the protective member cannot be directly visually recognized. For a bonded substrate provided with a protective member at the outer peripheral end, in addition to determining the defects generated during the bonding of the two substrates, it is also desired to determine the presence or absence of defects generated inside the protective member.

[0009] An object of the present invention is to provide an end state confirmation device capable of determining the presence or absence of internal defects in a protective member formed at the outer peripheral end of a substrate.

Means for Solving the Problems

[0010] (1) The end state confirmation device according to the present invention is an end confirmation device for confirming the end state of a substrate having at least a part circular shape and provided with a protective member at the outer peripheral end, The substrate is a bonded substrate in which a plurality of single substrates are bonded together. Each of the plurality of single substrates constituting the bonded substrate has a bevel portion at the outer peripheral end of the single substrate. The protective member is provided at the outer peripheral end of the bonded substrate so as to fill the space between two adjacent bevels in the stacking direction of the plurality of single substrates. The end confirmation device a substrate holding part for holding the substrate, a light emitting part for emitting light having a wavelength capable of passing through the substrate and the protective member toward the outer peripheral end of the substrate held by the substrate holding part, and an imaging part for imaging the outer peripheral end of the substrate by receiving the light emitted from the light emitting part and passing through the outer peripheral end of the substrate and the protective member. , the imaging unit is arranged to receive light that passes through the outer peripheral end of the substrate and the protective member and is specularly reflected by one of the two bevel portions It is provided with.

[0011] In the end state confirmation device, light is emitted toward the outer peripheral end of the substrate held by the substrate holding part. The emitted light is incident on at least a part of the substrate and the protective member. Depending on the presence or absence of a defect at the outer peripheral end of the substrate, the light emitted from the light emitting part and transmitted through the outer peripheral end of the substrate and the protective member is received by the imaging part. By imaging the outer peripheral end of the substrate using the imaging part, image data indicating the state inside the outer peripheral end of the substrate and the protective member can be acquired. As a result, internal defects in the protective member formed at the outer peripheral end of the substrate can be determined based on the acquired image data. The substrate is a bonded substrate in which a plurality of single substrates are bonded together. Thereby, it is possible to determine whether there is a defect in the boundary portion between the plurality of single substrates bonded to each other. Each of the plurality of single substrates constituting the bonded substrate has a bevel portion at the outer peripheral end of the substrate. The protective member is provided at the outer peripheral end of the bonded substrate so as to fill the space between two adjacent bevels in the stacking direction of the plurality of single substrates. The imaging unit is arranged to receive light that passes through the outer peripheral end of the substrate and the protective member and is specularly reflected by one of the two bevel portions. When the protective member is embedded in the space between the two bevel portions without a gap, the light emitted toward the outer peripheral end of the bonded substrate passes through each bevel portion without being reflected. On the other hand, when the protective member is not sufficiently embedded in the space between the two bevel portions and there is a void on one of the bevel portions, the light emitted toward the outer peripheral end of the bonded substrate is reflected on the bevel portion where the void exists. Therefore, according to the above configuration, the presence of voids inside the protective member can be easily determined based on the amount of light received by the imaging unit from the outer peripheral end of the bonded substrate.

[0012] (2) The imaging part has an imaging area in the shape of a cross-section strip extending in the first direction, and the light emitting part and the imaging part are arranged in a predetermined positional relationship such that the light emitted by the emission of light from the light emitting part travels toward the imaging area of the imaging part. The substrate holding part is configured to be able to rotate while holding the substrate. The end state confirmation device may further include a position and attitude adjustment part that adjusts the position and attitude of the substrate holding part so that, when imaging the outer peripheral end of the substrate by the imaging part, a plurality of portions in the circumferential direction of the outer peripheral end of the substrate sequentially pass through a predetermined reference position in the imaging area in a predetermined reference attitude in a second direction intersecting the first direction.

[0013] In this case, it becomes possible to image the entire circumference of the outer peripheral end of the substrate without increasing the size of the imaging area. Thereby, miniaturization of the light emitting part and the imaging part becomes possible, and enlargement of the end state confirmation device is suppressed.

[0014] (3) Before imaging the outer peripheral edge of the substrate by the imaging unit, the end state confirmation device further includes an eccentric shape information acquisition unit that acquires eccentricity information including the amount and direction of eccentricity of the center of the substrate with respect to the rotation center of the substrate held by the substrate holding unit, and shape information indicating the shape of the outer peripheral portion of the substrate. The position and orientation adjustment unit may adjust the position and orientation of the substrate holding unit based on the eccentricity information and the shape information acquired by the eccentric shape information acquisition unit when imaging the outer peripheral edge of the substrate by the imaging unit.

[0015] In this case, according to the holding state of the substrate by the substrate holding unit and the shape of the substrate, the position and orientation of the outer peripheral edge of the substrate with respect to the light emitting unit and the imaging unit can be adjusted to the reference position and reference orientation more accurately.

[0016] (4) The end state confirmation device may further include an image data generation unit that generates image data based on an output signal from the imaging unit, and a defect determination unit that determines whether or not there is a defect in the outer peripheral edge of the substrate based on whether or not the image data generated by the image data generation unit satisfies a predetermined determination condition.

[0017] In this case, it is uniformly determined whether or not there are defects in the outer peripheral edge of the substrate and inside the protective member without requiring the user's proficiency in defect determination.

[0021] ( 5 ) The end state confirmation device may further include a protective member forming unit that produces a substrate by forming a protective member on the outer peripheral edge of an untreated substrate in a state where the untreated substrate on which the protective member is not formed is held by the substrate holding unit.

[0022] In this case, it becomes possible to form a protective member on the outer peripheral edge of the substrate in the end state confirmation device. Therefore, the efficiency of substrate processing is improved.

Advantages of the Invention

[0023] According to the present invention, it becomes possible to determine the presence or absence of internal defects in the coating film formed on the outer peripheral edge of the substrate.

Brief Description of the Drawings

[0024]

Figure 1

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Embodiments for Carrying Out the Invention

[0025] Hereinafter, an end state confirmation device according to an embodiment of the present invention will be described with reference to the drawings. In the following description, the substrate refers to a substrate for a flat panel display (FPD) used in a liquid crystal display device, an organic EL (Electro Luminescence) display device, etc., a semiconductor substrate, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, a substrate for a solar cell, or the like. Further, the substrate described below has a circular shape in plan view except for the notch forming portion.

[0026] Furthermore, the substrate described below includes a substrate produced by bonding a plurality of substrates using an adhesive. In the following description, when distinguishing between a single substrate and a substrate produced by bonding a plurality of substrates, the single substrate is called a single substrate, and the substrate produced by bonding a plurality of substrates is called a bonded substrate. At the outer peripheral end of the bonded substrate, a protective member is provided to protect the boundary of the bonding portion of each two adjacent single substrates in the stacking direction (the direction in which the substrates overlap). The specific configuration of the protective member will be described later. According to the end state confirmation device described below, the state of the outer peripheral end of the substrate is confirmed. Thereby, the presence or absence of internal defects in the protective member can be determined.

[0027] 1. First Embodiment [1] Configuration of End State Confirmation Device FIG. 1 is a schematic side view of an end state confirmation device according to the first embodiment, and FIG. 2 is a schematic plan view of the end state confirmation device 1 of FIG. 1. As shown in FIG. 1, the end state confirmation device 1 mainly has a configuration in which a tilt device 20, a moving device 30, a rotation holding device 40, an eccentricity detector 50, a height detector 60, a light emitting unit 70, an imaging unit 80, and a control device 90 are housed in a housing 10. Note that the control device 90 may be provided outside the housing 10. The control device 90 includes a CPU (Central Processing Unit) 91 and a storage unit 99 (FIG. 8) described later, and controls the operations of the tilt device 20, the moving device 30, the rotation holding device 40, the eccentricity detector 50, the height detector 60, the light emitting unit 70, and the imaging unit 80. Note that the control device 90 may be configured by a microcomputer instead of the CPU 91 and the storage unit 99.

[0028] In FIGS. 1 and 2 and predetermined figures described later, arrows indicating the X direction, Y direction, and Z direction orthogonal to each other are attached to clarify the positional relationship. The X direction and the Y direction are orthogonal to each other in the horizontal plane, and the Z direction corresponds to the vertical direction.

[0029] The housing 10 has a substantially rectangular parallelepiped shape including a top surface, a bottom surface, and four side wall surfaces. In FIG. 1, the illustration of one side wall surface is omitted to show the configuration of the end state confirmation device 1 inside the housing 10. Also, in FIG. 2, the illustration of the top surface is omitted. A transport opening for carrying the substrate W into or out of the housing 10 is formed in at least one of the four side wall surfaces.

[0030] The tilt device 20 is provided on the bottom surface of the housing 10. The tilt device 20 includes a tilt stage 21, two support members 22, a rotation shaft 22s, and a tilt drive unit 23. As shown in FIG. 2, the two support members 22 are provided in the vicinity of two side wall surfaces facing each other in the X direction and are arranged in the X direction.

[0031] A rotation shaft 22s is provided so as to connect two support members 22. The rotation shaft 22s is supported by the two support members 22 so as to be rotatable about its central axis ax1. A tilt drive unit 23 is provided in the vicinity of one of the two support members 22. The tilt drive unit 23 includes a motor and is configured to be able to rotate the rotation shaft 22s about its central axis ax1 and hold the rotation shaft 22s at an arbitrary rotation angle about the central axis ax1. An encoder is built in the motor of the tilt drive unit 23. The encoder outputs a signal corresponding to the rotation angle of the motor or the change in the rotation angle to a control device 90.

[0032] The tilt stage 21 is composed of, for example, a rectangular plate-like member, and a part of it is attached to the rotation shaft 22s. The tilt stage 21 is fixed to the rotation shaft 22s in the direction around the central axis ax1. Thereby, the tilt stage 21 rotates around the central axis ax1 as the rotation shaft 22s rotates by the tilt drive unit 23. Further, the tilt stage 21 is held in a fixed posture together with the rotation shaft 22s in a state where the rotation shaft 22s is held at an arbitrary rotation angle around the central axis ax1 by the tilt drive unit 23. In this way, the tilt stage 21 is maintained in a state parallel to the horizontal plane and a state inclined from the horizontal plane according to the holding state of the rotation shaft 22s by the tilt drive unit 23. The Y direction and the Z direction shown below respectively indicate the Y direction and the Z direction in a state where the tilt stage 21 is parallel to the horizontal plane.

[0033] A moving device 30 is provided on the upper surface of the tilt stage 21. The moving device 30 includes a moving stage 31 and a moving drive unit 32. The moving stage 31 has a mounting surface on which a rotation holding device 40 to be described later is placed, and is configured to be movable in the X direction and the Y direction on the tilt stage 21. The moving drive unit 32 includes a plurality of motors and is configured to be able to move the mounting surface of the moving stage 31 in the X direction and the Y direction on the tilt stage 21 and to hold the mounting surface at an arbitrary position on the tilt stage 21. Encoders are built in the plurality of motors of the moving drive unit 32. The encoder outputs a signal according to the rotation angle of the motor or the change in the rotation angle to the control device 90.

[0034] A rotation holding device 40 is provided on the mounting surface of the moving stage 31. The rotation holding device 40 includes a suction holding part 41 and a rotation suction drive part 42. The rotation holding device 40 includes a motor. The motor is attached to the mounting surface. Also, the rotation axis of the motor extends upward. The suction holding part 41 is attached to the upper end of the rotation axis. The suction holding part 41 is connected to an air intake system (not shown) and is configured to be able to suction and hold the central part of the lower surface of the substrate W.

[0035] The rotation suction drive part 42 switches the air intake path between the suction holding part 41 and the air intake system (not shown) between a communicating state and a blocking state. Thereby, the rotation suction drive part 42 can suction and hold the central part of the lower surface of the substrate W by the suction holding part 41. Also, the rotation suction drive part 42 can rotate the substrate W suction-held by the suction holding part 41 around the rotation axis of the motor.

[0036] In the rotation holding device 40, the center of the substrate W held by the adsorption holding portion 41 does not necessarily coincide with the center of the rotation axis of the motor of the rotation adsorption drive portion 42, that is, the rotation center of the adsorption holding portion 41. Therefore, in the end state confirmation device 1, the amount of eccentricity and the direction of eccentricity of the substrate W held on the adsorption holding portion 41 are detected. In order to detect the amount of eccentricity and the direction of eccentricity of the substrate W, an eccentricity detector 50 is used. In the following description, the information indicating the amount of eccentricity and the direction of eccentricity is referred to as eccentricity information.

[0037] On the upper surface of the tilt stage 21, a support post 59 is provided near one end of the tilt stage 21 in the Y direction. The support post 59 extends upward from the upper surface of the tilt stage 21. An eccentricity detector 50 is attached to the upper end of the support post 59. The eccentricity detector 50 includes, for example, a line sensor, and in a state fixed to the upper end of the support post 59, it is possible to detect the position of the outer peripheral end of the substrate W rotated by the rotation holding device 40.

[0038] The motor of the rotation holding device 40 incorporates an encoder (not shown) for detecting the rotation angle of the adsorption holding portion 41. When detecting the eccentricity information, the substrate W is rotated with the substrate W held on the adsorption holding portion 41. At this time, each time the substrate W rotates by a small angle, a signal generated along with the small angle rotation of the motor is output from the encoder incorporated in the motor of the rotation holding device 40. Also, a signal indicating the position of the outer peripheral end of the substrate W on the tilt stage 21 is output by the eccentricity detector 50. Thereby, based on the detection results of the encoder of the motor of the rotation holding device 40 and the eccentricity detector 50, a plurality of rotation angles of the substrate W corresponding to a plurality of portions of the outer peripheral end of the substrate W are detected with reference to the notch. Also, at each of the detected plurality of rotation angles, the difference between the distance from the rotation center of the adsorption holding portion 41 to the position of the outer peripheral end of the substrate W detected by the eccentricity detector 50 and the radius of the substrate W is detected as the amount of eccentricity corresponding to the rotation angle.

[0039] Incidentally, the shape of the outer peripheral portion of the substrate W held by the adsorption holding portion 41 is not necessarily flat. Therefore, in the end state confirmation device 1, the shape of the outer peripheral portion of the substrate W held on the adsorption holding portion 41 is detected. In order to detect the shape of the outer peripheral portion of the substrate W, a height detector 60 is used.

[0040] The height detector 60 includes, for example, a laser displacement meter, and as shown in FIG. 2, is fixed on the upper surface of the tilt stage 21 so as to overlap the outer peripheral portion of the substrate W held by the rotation holding device 40 in plan view. As shown by the dashed-dotted arrow in FIG. 1, the height detector 60 emits laser light upward toward the tilt stage 21 and receives the laser light reflected by the lower surface of the substrate W. Thereby, the height detector 60 can detect the distance from the upper surface of the tilt stage 21 to the portion of the lower surface of the substrate W irradiated with the laser light (hereinafter referred to as the substrate stage distance) based on, for example, the amount of received laser light of the reflected laser light.

[0041] When detecting the shape of the substrate W, the substrate W is rotated while being held on the adsorption holding portion 41. At this time, similar to the detection of the eccentricity information, the rotation angle of the substrate W is detected every time the substrate W rotates by a minute angle. Further, the substrate stage distance is detected by the height detector 60. In this way, a plurality of substrate stage distances corresponding to a plurality of eccentricity directions are detected as shape information indicating the shape of the outer peripheral portion of the substrate W.

[0042] As shown in Fig. 1, a light emitting unit 70 is provided on the top surface of the housing 10 via a support piece 79. The light emitting unit 70 is located above the substrate W held by the rotation holding device 40. The light emitting unit 70 includes a light source and an emitting part. The light source generates infrared light as light having a wavelength capable of passing through the substrate W and the above-described protection member. The emitting part emits the infrared light generated by the light source obliquely downward toward the imaging area of an imaging unit 80 described later. In the present embodiment, the infrared light emitted from the light emitting unit 70 has a wavelength of about 1000 nm to 2500 nm. Note that the light source of the light emitting unit 70 may be provided outside the housing 10. In this case, the infrared light generated from the light source outside the housing 10 is guided to the emitting part of the light emitting unit 70 through a light guide such as an optical fiber.

[0043] Support columns 89 extending upward from the bottom surface are provided on the bottom surface of the housing 10. As shown in Fig. 1, the height of the upper end portions of the support columns 89 in the Z direction is substantially the same as or slightly higher than that of the substrate W held by the rotation holding device 40. The imaging unit 80 is attached to the upper end portions of the support columns 89.

[0044] The imaging unit 80 includes an image sensor in which a plurality of pixels are arranged linearly, one or more condenser lenses, and a shutter. In this example, a CCD (charge coupled device) line sensor capable of detecting light having the wavelength of infrared light is used as the image sensor of the imaging unit 80. In this case, the imaging unit 80 has an imaging area with a strip-shaped cross section extending parallel to the direction in which the plurality of pixels are arranged. Note that a CMOS (complementary metal oxide semiconductor) line sensor capable of detecting light having the wavelength of infrared light can also be used as the image sensor of the imaging unit 80.

[0045] As shown in Fig. 2, the light emitting unit 70 and the imaging unit 80 are arranged side by side in the Y direction in plan view, and their positional relationship is fixed by the housing 10. The cross section of the imaging area of the imaging unit 80 extends in a strip shape parallel to the Y direction in plan view.

[0046] [2] Basic operation of the end state confirmation device In the end state confirmation device 1 according to the present embodiment, the substrate W carried into the housing 10 is adsorbed and held by the rotation holding device 40, and the substrate W is rotated at least 360°. At this time, the eccentricity detector 50 calculates eccentricity information about the substrate W. Further, the shape information about the substrate W is detected by the height detector 60.

[0047] Next, infrared light is emitted from the light emitting unit 70 toward the imaging area of the imaging unit 80, and the substrate W is further rotated at least 360°. At this time, the operations of the tilt device 20 and the moving device 30 are controlled so that a plurality of portions of the outer peripheral end of the substrate W sequentially pass through a predetermined position (hereinafter referred to as the specified position) RP in the imaging area of the imaging unit 80 in a predetermined posture (hereinafter referred to as the specified posture). Specifically, based on the eccentricity information and the shape information acquired immediately before, the angle of the tilt stage 21 with respect to the horizontal plane and the position of the mounting surface of the moving device 30 are adjusted so that a plurality of portions of the outer peripheral end of the substrate W sequentially pass through the specified position RP in the specified posture.

[0048] Further, each time the substrate W rotates by a small angle, the outer peripheral end of the substrate W irradiated with infrared light from the light emitting unit 70 is imaged by the imaging unit 80. In the end state confirmation device 1, a three-dimensional coordinate system unique to the device is defined in advance. The above-mentioned specified position RP is defined as a fixed position on the predefined three-dimensional coordinate system.

[0049] According to the eccentricity information, the position of the notch of the substrate W can be grasped. Therefore, when the imaging of the outer peripheral end of the substrate W is started, the control device 90 controls the rotation holding device 40 based on the eccentricity information so that the notch of the substrate W is directed in a predetermined direction.

[0050] Finally, based on the light reception amount distribution of the imaging element of the imaging unit 80 obtained by imaging at each minute angle as the substrate W makes one rotation, image data corresponding to the entire outer peripheral end portion of the substrate W is generated. Based on the generated image data, it is determined whether there are defects in the outer peripheral end portion of the substrate W. In the following description, the image data obtained by imaging using the imaging unit 80 while the substrate W makes one rotation is referred to as end portion image data, and the image represented by the end portion image data is referred to as an end portion image.

[0051] [3] Defects that may occur in the outer peripheral end portion of the bonded substrate W FIG. 3 is a diagram showing an example of a protective member provided at the outer peripheral end portion of the bonded substrate W, and FIG. 4 is a diagram showing an example of a defect that may occur inside the protective member of FIG. 3. In FIGS. 3 and 4, an enlarged cross-sectional view of the outer peripheral end portion of the bonded substrate W is shown.

[0052] As shown in FIG. 3, the bonded substrate W according to the present embodiment has a configuration in which two single substrates w1 and w2 are bonded via an adhesive w3. Each of the single substrates w1 and w2 has an outer peripheral end portion including a bevel portion.

[0053] Each bevel portion includes a first inclined surface e1, an end surface e2, and a second inclined surface e3. The first inclined surface e1 is a surface that inclines from the upper surface of the outer peripheral portion of the single substrates w1 and w2 toward the outermost peripheral portion of the single substrates w1 and w2 in a state where the single substrates w1 and w2 are held in a horizontal posture. The second inclined surface e3 is a surface that inclines from the lower surface of the outer peripheral portion of the single substrates w1 and w2 toward the outermost peripheral portion of the single substrates w1 and w2 in a state where the single substrates w1 and w2 are held in a horizontal posture. The end surface e2 is a surface that connects the lowermost end portion of the first inclined surface e1 and the uppermost end portion of the second inclined surface e3 in a state where the single substrates w1 and w2 are held in a horizontal posture.

[0054] The protective member w4 is formed so as to fill the space between the second inclined surface e3 of the single substrate w1 and the first inclined surface e1 of the single substrate w2. Thereby, since the boundary between the single substrate w1 and the single substrate w2 is not exposed, the peeling of the two single substrates w1 and w2 from the outer peripheral end portion is reduced. As the material of the protective member w4, for example, the same material as the adhesive w3 is used. The material of the protective member w4 is not limited to the same material as the adhesive w3, and a material used for forming a SOG (Spin On Glass) film or a SOC (Spin On Carbon) film may be used.

[0055] When forming the protective member w4 at the outer peripheral end portion of the bonded substrate W, the space between the second inclined surface e3 of the single substrate w1 and the first inclined surface e1 of the single substrate w2 is filled with a coating liquid for the protective member. The protective member w4 is formed by curing the filled coating liquid.

[0056] However, if a sufficient amount of the coating liquid is not filled in the space between the adjacent second inclined surface e3 and the first inclined surface e1 in the stacking direction of the substrates, as shown in FIG. 4, voids vi may be formed inside the protective member w4. The presence of defects such as voids inside the protective member w4 causes peeling of the protective member w4. Further, the bonding strength between the single substrates w1 and w2 is reduced. According to the end state confirmation device 1 according to the present embodiment, it is possible to easily and accurately determine the defects generated inside the protective member w4 as shown in FIG. 4.

[0057] [4] Example of image data acquired by the imaging unit 80 FIG. 5 is a diagram showing an example of an end image obtained by the imaging unit 80 of FIG. 1 for the bonded substrate W on which the protective member w4 is not formed. FIG. 6 is a diagram showing an example of an end image obtained by the imaging unit 80 of FIG. 1 for the bonded substrate W in which no defect exists inside the protective member w4. FIG. 7 is a diagram showing an example of an end image obtained by the imaging unit 80 of FIG. 1 for the bonded substrate W in which a defect exists inside the protective member w4.

[0058] In FIGS. 5 to 7, in the upper part, a schematic cross-sectional view shows a state in which the outer peripheral end portion of the bonded substrate W is irradiated with infrared light. In the middle part, a schematic perspective view shows a state in which the outer peripheral end portion of the rotating bonded substrate W is imaged by the imaging unit 80. In the lower part, an example of an end image obtained by imaging in the upper and middle parts is shown.

[0059] In the end image in the lower part of FIGS. 5 to 7, the horizontal axis corresponds to the rotation angle of the bonded substrate W, and the vertical axis corresponds to the position of each pixel of the imaging element of the imaging unit 80. In this case, the distribution of the brightness of the reflected light at the outer peripheral end portion in the circumferential direction of the bonded substrate W is represented in the direction of the horizontal axis of the end image. Also, the distribution of the brightness of the reflected light at the outer peripheral end portion in the substantially radial direction of the bonded substrate W is represented in the direction of the vertical axis of the end image.

[0060] Furthermore, in the end image in the lower part of FIGS. 5 to 7, a portion where the amount of infrared light received by the imaging element of the imaging unit 80 is large is shown in white, and a portion where the amount of infrared light received by the imaging element of the imaging unit 80 is small or no infrared light is incident is shown in a dot pattern.

[0061] As shown by the thick solid arrow in the upper part of FIG. 5, the specified position RP and the specified posture are determined such that, for example, in a state where the protective member w4 does not exist, only the reflected light that is specularly reflected by the first inclined surface e1 of the single substrate w2 among the infrared light emitted from the light emitting unit 70 enters the imaging unit 80. Thereby, as shown in the lower part of FIG. 5, in the end image of the bonded substrate W where the protective member w4 is not formed, the brightness of the image portion i2 corresponding to the first inclined surface e1 of the single substrate w2 is significantly greater than the brightness of the other image portions i1 and i3. Note that the other image portion i1 corresponds to an annular portion having a certain width located closer to the center of the bonded substrate W than the first inclined surface e1 of the single substrate w2 in the bonded substrate W. Also, the other image portion i3 corresponds to the space outside the bonded substrate W.

[0062] As described above, the specified position RP and the specified posture are determined. In this case, in the end image of the bonded substrate W in which there are no defects inside the protection member w4, as shown in the lower part of FIG. 6, the brightness of the image portion i2 is substantially equal to the brightness of the other image portions i1 and i3. This is because, as shown in the upper part of FIG. 6, the entire first inclined surface e1 of the single substrate w2 is covered with the protection member w4, so that most of the infrared light passes through the first inclined surface e1. Further, even if a part of the infrared light is reflected by the first inclined surface e1 of the single substrate w2, the reflected light is attenuated by the protection member w4 or travels in a direction different from that of the imaging unit 80.

[0063] For the example of FIG. 6, in the end image of the bonded substrate W in which there is a defect (a void in this example) inside the protection member w4, the defect appears prominently. Specifically, as shown by the thick dotted ellipse in the lower part of FIG. 7, the brightness of the portion of the image portion i2 corresponding to the void vi inside the protection member w4 is significantly greater than the brightness of the other portions. This is because, as shown in the upper part of FIG. 7, only the infrared light incident on the generation portion of the void vi on the first inclined surface e1 of the single substrate w2 is specularly reflected by the first inclined surface e1 and enters the imaging unit 80.

[0064] From these, it can be seen that based on the end image data, it is possible to detect a defect inside the protection member w4 based on whether the light reception amount corresponding to a specific portion of the bonded substrate W satisfies a predetermined condition (defect determination condition). In the examples of FIGS. 6 and 7, the specific portion of the bonded substrate W is the portion of the first inclined surface e1 of the single substrate w2.

[0065] The defect determination conditions include, for example, whether the detected light reception amount is greater than a predetermined light reception amount. In this case, when a light reception amount greater than the predetermined light reception amount is detected, a determination is made that a defect exists. Alternatively, the defect determination conditions include, for example, whether a light reception amount greater than the predetermined light reception amount is detected within a range larger than a predetermined area. In this case, when a light reception amount greater than the predetermined light reception amount is detected within a range larger than the predetermined area, a determination is made that a defect exists.

[0066] [5] Control system of the end state confirmation device 1 FIG. 8 is a block diagram showing the configuration of the control system of the end state confirmation device 1 in FIG. 1. As shown in FIG. 8, the control device 90 includes a CPU 91 and a storage unit 99. The CPU 91 includes, as functional units, a rotation adsorption control unit 92, a movement control unit 93, a tilt control unit 94, an eccentric shape information acquisition unit 95, an imaging control unit 96, an image data generation unit 97, and a defect determination unit 98. In the storage unit 99, an end state confirmation program for confirming the state of the outer peripheral end of the substrate W in the end state confirmation device 1 is stored. In addition, various information input from an operation unit (not shown) is stored in the storage unit 99. This various information includes the above-mentioned specified position RP, specified posture, and defect determination conditions.

[0067] Each functional unit of the CPU 91 is realized by the CPU 91 executing the end state confirmation program stored in the storage unit 99. Note that a part or all of the plurality of functional units of the CPU 91 may be realized by hardware such as an electronic circuit.

[0068] The operations of each functional unit of the CPU 91 will be described. The rotation adsorption control unit 92 controls the rotation adsorption drive unit 42 when acquiring the eccentricity information and shape information of the substrate W and when confirming the state of the outer peripheral end of the substrate W. Thereby, the substrate W to be confirmed is adsorbed and held on the adsorption holding unit 41. In addition, the adsorbed and held substrate W is rotated.

[0069] The movement control unit 93 controls the movement drive unit 32 based on a movement command input from an operation unit (not shown). Further, the movement control unit 93 controls the movement drive unit 32 such that the outer peripheral end of the substrate W passes through the specified position RP in the specified posture based on the eccentricity information and the shape information acquired by the eccentricity shape information acquisition unit 95 described later. Thereby, the mounting surface of the movement stage 31 moves on the tilt stage 21.

[0070] The tilt control unit 94 controls the tilt drive unit 23 based on a tilt command input from an operation unit (not shown). Further, the tilt control unit 94 controls the tilt drive unit 23 such that the outer peripheral end of the substrate W passes through the specified position RP in the specified posture based on the eccentricity information and the shape information acquired by the eccentricity shape information acquisition unit 95 described later. Thereby, the inclination of the tilt stage 21 with respect to the horizontal plane is adjusted.

[0071] The eccentricity shape information acquisition unit 95 calculates the eccentricity information of the substrate W adsorbed and held on the adsorption holding unit 41 based on the signals output from the encoders of the motors provided in each of the movement drive unit 32 and the rotation adsorption drive unit 42, and the signals output from the eccentricity detector 50. Further, the eccentricity shape information acquisition unit 95 calculates the shape information of the substrate W adsorbed and held on the adsorption holding unit 41 based on the signals output from the encoders of the motors provided in each of the movement drive unit 32 and the rotation adsorption drive unit 42, and the signals output from the height detector 60.

[0072] When checking the state of the outer peripheral end of the substrate W, the imaging control unit 96 controls the light emitting unit 70 and the imaging unit 80 such that infrared light is emitted to the imaging area of the imaging unit 80 and the outer peripheral end of the substrate W is imaged. The image data generation unit 97 generates end portion image data based on the signal (pixel data) output from the imaging unit 80. The defect determination unit 98 determines whether or not there is a defect in the outer peripheral end of the substrate W based on the end portion image data generated by the image data generation unit 97 and the defect determination conditions stored in advance in the storage unit 99.

[0073] [6] End state confirmation process FIG. 9 is a flowchart showing an example of the end state confirmation process executed in the end state confirmation device 1. The end state confirmation process is started when the substrate W is carried into the end state confirmation device 1 and the CPU 91 executes the end state confirmation program stored in the storage unit 99.

[0074] When the end state confirmation process is started, the rotary adsorption control unit 92 controls the rotary adsorption drive unit 42 to adsorb and hold the substrate W carried into the end state confirmation device 1 and placed on the adsorption and holding unit 41 (step S11).

[0075] Next, the eccentricity information of the substrate W is acquired (step S12). Specifically, when acquiring the eccentricity information, the rotary adsorption control unit 92 rotates the substrate W 360° by controlling the rotary adsorption drive unit 42. Therefore, the eccentricity information acquisition unit 95 calculates the eccentricity information based on the output signal from the encoder of the rotary adsorption drive unit 42 and the output signal from the eccentricity detector 50.

[0076] Next, the shape information of the substrate W is acquired (step S13). Specifically, when acquiring the shape information, the rotary adsorption control unit 92 rotates the substrate W 360° by controlling the rotary adsorption drive unit 42. Therefore, the eccentricity information acquisition unit 95 detects the shape information based on the output signal from the encoder of the rotary adsorption drive unit 42 and the output signal from the height detector 60. Note that the processes of steps S12 and S13 may be performed in the reverse order or simultaneously.

[0077] Next, the outer peripheral end of the substrate W is imaged (step S14). Specifically, when imaging the outer peripheral end of the substrate W, the rotational adsorption control unit 92 controls the rotational adsorption drive unit 42 to rotate the substrate W by 360°. At this time, the movement control unit 93 and the tilt control unit 94 control the movement drive unit 32 and the tilt drive unit 23 based on the specified position RP and the specified posture stored in the storage unit 99, and the acquired eccentricity information and shape information. Thereby, the outer peripheral end of the substrate W passes through the specified position RP in the specified posture. Further, the imaging control unit 96 controls the light emitting unit 70 and the imaging unit 80 to image the entire circumference of the outer peripheral end of the substrate W. Furthermore, the image data generation unit 97 generates end portion image data based on the output signal from the encoder of the rotational adsorption drive unit 42 and the output signal from the imaging unit 80.

[0078] Finally, the defect determination unit 98 determines whether or not there is a defect in the outer peripheral end of the substrate W based on the end portion image data generated in the immediately preceding step S14 and the defect determination conditions previously stored in the storage unit 99 (step S15). In step S15, together with the determination of the defect, the rotation of the substrate W is stopped, and the adsorption and holding state of the substrate W by the adsorption and holding unit 41 is released. Thereafter, a series of processes of the end state confirmation process is completed.

[0079] In the above-described end state confirmation process, instead of determining the presence or absence of a defect in step S15, the defect determination unit 98 may output the end portion image data to the outside of the end state confirmation device 1. In this case, the user can evaluate the presence of a defect in the outer peripheral end of the substrate W by analyzing the end portion image data output from the end state confirmation device 1.

[0080] Also, in the above-described end state confirmation process, when it is determined in step S15 that there is a defect in the outer peripheral end of the substrate W, the defect determination unit 98 may output an alarm signal indicating the presence of the defect to the outside of the end state confirmation device 1.

[0081] [7] Effects (1) In the above-described end state confirmation device 1, infrared light is emitted from the light emitting unit 70 toward the outer peripheral end of the substrate W held by the suction holding unit 41. The emitted infrared light enters at least a part of the substrate W and the protective member w4. Depending on the presence or absence of a defect at the outer peripheral end of the substrate W, the light transmitted through the outer peripheral end of the substrate W and the protective member w4 is received by the imaging unit 80.

[0082] By imaging the outer peripheral end of the substrate W using the imaging unit 80, end image data indicating the state inside the outer peripheral end of the substrate W and the protective member w4 is generated. As a result, internal defects in the protective member w4 formed at the outer peripheral end of the substrate W can be determined based on the generated end image data.

[0083] (2) In the above-described end state confirmation device 1, the imaging unit 80 has an imaging region in the shape of a cross-sectional band. Further, by a plurality of portions of the outer peripheral end of the substrate W passing through the imaging region of the imaging unit 80, the outer peripheral end of the substrate W is imaged over the entire circumference. With such a configuration, miniaturization of the light emitting unit 70 and the imaging unit 80 is achieved, and enlargement of the end state confirmation device 1 is suppressed.

[0084] (3) In the end state confirmation device 1, it is determined whether or not a defect exists in the outer peripheral end of the substrate W based on the end image data obtained by imaging by the imaging unit 80 and a predetermined defect determination condition. Thereby, it is uniformly determined whether or not there is a defect in the outer peripheral end of the substrate W without requiring the user's proficiency in defect determination.

[0085] (4) In the end state confirmation device 1 according to the first embodiment, as shown in FIG. 2, the central axis ax1 of the rotation axis 22s of the tilt stage 21 overlaps with the specified position RP in a plan view. In this case, compared with the case where the central axis ax1 is largely separated from the specified position RP in a plan view, when the tilt device 20 operates, the outer peripheral end of the substrate W adsorbed and held by the suction holding unit 41 is less likely to vary greatly in the vertical direction. Thereby, when imaging the outer peripheral end of the substrate W, control of the movement drive unit 32 and the tilt drive unit 23 for passing the outer peripheral end of the substrate W through the specified position RP in the specified posture becomes easy.

[0086] 2. Second Embodiment FIG. 10 is a schematic side view of the end state confirmation device 1 according to the second embodiment, and FIG. 11 is a schematic plan view of the end state confirmation device 1 of FIG. 10. Regarding the end state confirmation device 1 according to the second embodiment, differences from the end state confirmation devices 1 of FIGS. 1 and 2 according to the first embodiment will be described. In the end state confirmation device 1 according to the present embodiment, a bonding substrate W on which a protective member w4 is not formed is carried in and held by the suction holding unit 41.

[0087] As shown in FIGS. 10 and 11, the end state confirmation device 1 according to the second embodiment includes, in addition to the configuration of the end state confirmation device 1 according to the first embodiment, a protective member forming unit LN for forming a protective member w4 at the outer peripheral end of the bonding substrate W. The protective member forming unit LN is connected to a supply system (not shown) that supplies a coating liquid for the protective member and includes a nozzle member capable of discharging the coating liquid supplied from the supply system.

[0088] The tip of the nozzle member of the protective member forming unit LN is disposed at a position upstream of the imaging region of the imaging unit 80 in the rotational direction of the bonding substrate W and near the outer peripheral end of the bonding substrate W.

[0089] The control device 90 controls a supply system (not shown) connected to the protective member forming unit LN. Thereby, before imaging the outer peripheral end of the bonding substrate W by the imaging unit 80, as shown in the blowout in FIG. 10, the space between the bevel portion of the single substrate w1 and the bevel portion of the single substrate w2 of the rotating bonding substrate W is filled with the coating liquid for the protective member. When the filled coating liquid hardens, the protective member w4 is formed.

[0090] According to the above configuration, the formation of the protective member w4 and the confirmation of the state of the outer peripheral end of the bonding substrate W can be performed within the end state confirmation device 1. Therefore, the processing efficiency of the bonding substrate W is improved.

[0091] 3. Other Embodiments (1) In the above-described embodiment, the specified position RP and the specified posture are determined such that, in a state where the protection member w4 does not exist, only the reflected light that is specularly reflected by the first inclined surface e1 of the single substrate w2 in FIG. 5 among the infrared light emitted from the light emitting unit 70 enters the imaging unit 80. However, the present invention is not limited to this.

[0092] The specified position RP and the specified posture may be determined such that, in a state where the protection member w4 does not exist, only the reflected light that is specularly reflected by the second inclined surface e3 of the single substrate w1 in FIG. 5 among the infrared light emitted from the light emitting unit 70 enters the imaging unit 80. When the specified position RP and the specified posture are determined in this way, the detection accuracy of the void vi generated mainly on the second inclined surface e3 of the single substrate w1 of the bonding substrate W is improved.

[0093] The positions of the light emitting unit 70 and the imaging unit 80 in the end state confirmation device 1 may be appropriately changed according to the specified position RP and the specified posture. For example, when the specified position RP and the specified posture are determined such that only the reflected light that is specularly reflected by the second inclined surface e3 of the single substrate w1 in FIG. 5 enters the imaging unit 80, the positions of the light emitting unit 70 and the imaging unit 80 may be changed so as to be inverted in the Z direction with respect to the example in FIG. 1.

[0094] Note that a plurality of light emitting units 70 and a plurality of imaging units 80 may be provided in the end state confirmation device 1 so as to respectively correspond to a plurality of portions of the outer peripheral end of the bonding substrate W (such as the second inclined surface e3 of the single substrate w1 and the first inclined surface e1 of the single substrate w2). In this case, it becomes possible to detect internal defects existing at the outer peripheral end of the bonding substrate W with higher accuracy based on a plurality of end image data acquired by the plurality of imaging units 80.

[0095] When using a plurality of light emitting units 70 and a plurality of imaging units 80, it is desirable to synchronize the infrared light emission timing in the light emitting unit 70 and the shutter release timing in the imaging unit 80 for each corresponding light emitting unit 70 and imaging unit 80. Thereby, it is possible to prevent infrared light emitted from the light emitting unit 70 corresponding to another imaging unit 80 from entering one imaging unit 80, and to prevent erroneous detection of defects.

[0096] (2) Depending on the wavelength of the infrared light, the material of the substrate W, the thickness of the substrate W, the material of the protective member w4, etc., a distinguishable difference may occur between the attenuation amount of the infrared light transmitted through the portion where the defect exists and the attenuation amount of the infrared light passing through the portion where no defect exists. Therefore, defect determination may be performed based on the end image data obtained by directly receiving the infrared light transmitted through the outer peripheral end of the substrate W with the imaging unit 80.

[0097] In this case, the light emitting unit 70 and the imaging unit 80 may be arranged to face each other, for example. According to the above-described defect determination, it is not necessary to limit the infrared light for determining the defect to the infrared light reflected by a specific portion of the substrate W. Therefore, it becomes possible to determine the state of the outer peripheral end of the substrate W with high accuracy without considering the posture of the outer peripheral end of the substrate W.

[0098] (3) The bonded substrate W is not limited to a configuration in which two single substrates w1 and w2 are bonded together, and may have a laminated structure in which three or more single substrates are bonded together. In this case, a protective member w4 is formed between each two adjacent bevel portions in the lamination direction.

[0099] (4) In the above embodiment, the height detector 60 includes a laser displacement meter, but the present invention is not limited to this. In order to acquire shape information, the height detector 60 may include a detector (such as an ultrasonic displacement sensor) capable of detecting the distance between the non-contact tilt stage 21 and the outer peripheral portion of the substrate W instead of the laser displacement meter.

[0100] (5) In the above-described embodiment, the protection member w4 is formed at the outer peripheral end portion of the bonded substrate W, but the present invention is not limited thereto. When the substrate W held by the suction holding portion 41 is a single substrate, the protection member w4 may be provided so as to cover the outer peripheral end portion (bevel portion) of the single substrate.

[0101] (6) In the above-described embodiment, the eccentricity information and the shape information are calculated and detected based on the outputs from the eccentricity detector 50 and the height detector 60, respectively, but the present invention is not limited thereto. The eccentricity shape information acquisition unit 95 may acquire at least one of the eccentricity information and the shape information by an input from outside the end state confirmation device 1.

[0102] (7) In the end state confirmation device 1 according to the above-described embodiment, the imaging element of the imaging unit 80 includes an imaging element arranged such that the imaging elements are arranged linearly, but the present invention is not limited thereto. The imaging unit 80 may include an imaging element arranged such that a plurality of pixels are arranged in a matrix instead of the imaging elements arranged linearly. That is, the imaging unit 80 may include an imaging element in which a plurality of pixels are two-dimensionally arranged.

[0103] (8) In the end state confirmation device 1 according to the above-described embodiment, it is determined whether or not there is a defect in the outer peripheral end portion of the substrate W based on the end image data obtained by imaging of the imaging unit 80, but the present invention is not limited thereto. The determination as to whether or not there is a defect may not be performed.

[0104] (9) The end state confirmation device 1 according to the above-described embodiment may be provided with a display device that displays an end image based on the generated end image data. In this case, the user can easily grasp the shape and size of the defect existing in the outer peripheral end portion of the substrate W from the end image.

[0105] (10) In the end state confirmation device 1 according to the above-described embodiment, a multispectral camera or a hyperspectral camera may be used as the imaging unit 80.

[0106] In the end state confirmation device 1 according to the above-described embodiment, the light emitting unit 70 and the imaging unit 80 are fixed to the housing 10, and the tilt device 20, the moving device 30, and the rotation holding device 40 operate so that the outer peripheral end of the substrate W passes through the specified position RP of the imaging region of the imaging unit 80 in a specified posture. However, the present invention is not limited to this.

[0107] For example, with the tilt device 20, the moving device 30, and the rotation holding device 40 all fixed within the housing 10, the light emitting unit 70 and the imaging unit 80 may operate within the housing 10 so that the outer peripheral end of the substrate W passes through the specified position RP of the imaging region of the imaging unit 80 in a specified posture.

[0108] 4. Corresponding relationship between each component of the claims and each element of the embodiment Hereinafter, examples of the correspondence between each component of the claims and each element of the embodiment will be described. However, the present invention is not limited to the following examples. As each component of the claims, various other elements having the configurations or functions described in the claims can also be used.

[0109] In the above-described embodiment, the end state confirmation device 1 is an example of an end state confirmation device, the rotation holding device 40 is an example of a substrate holding unit, the light emitting unit 70 is an example of a light emitting unit, infrared light is an example of light having a wavelength capable of passing through the substrate and the protective member, and the imaging unit 80 is an example of an imaging unit.

[0110] Also, the tilt device 20, the moving device 30, the movement control unit 93, and the tilt control unit 94 are examples of a position and attitude adjustment unit, the eccentricity detector 50, the height detector 60, and the eccentricity shape information acquisition unit 95 are examples of an eccentricity shape information acquisition unit, the image data generation unit 97 is an example of an image data generation unit, the defect determination unit 98 is an example of a defect determination unit, the single substrates w1, w2 are examples of single substrates, the bonded substrate W is an example of a bonded substrate, and the protective member forming unit LN is an example of a protective member forming unit. 5. Reference Embodiment (1) The end state confirmation device according to the reference embodiment is an end confirmation device for confirming the end state of a substrate having at least a part thereof circular and provided with a protective member at the outer peripheral end. The end state confirmation device includes a substrate holding portion for holding the substrate, a light emitting portion for emitting light having a wavelength that can pass through the substrate and the protective member toward the outer peripheral end of the substrate held by the substrate holding portion, and an imaging portion for imaging the outer peripheral end of the substrate by receiving the light emitted from the light emitting portion and passing through the outer peripheral end of the substrate and the protective member. In the end state confirmation device, light is emitted toward the outer peripheral end of the substrate held by the substrate holding unit. The emitted light is incident on at least a part of the substrate and the protective member. Depending on the presence or absence of defects at the outer peripheral end of the substrate, the light emitted from the light emitting unit and transmitted through the outer peripheral end of the substrate and the protective member is received by the imaging unit. By imaging the outer peripheral end of the substrate using the imaging unit, image data indicating the state inside the outer peripheral end of the substrate and the protective member can be obtained. As a result, internal defects in the protective member formed at the outer peripheral end of the substrate can be determined based on the acquired image data. (2) The imaging unit has an imaging region in the shape of a cross-sectional strip extending in the first direction, and the light emitting unit and the imaging unit are arranged in a predetermined positional relationship such that the light emitted by the emission of light from the light emitting unit travels toward the imaging region of the imaging unit. The substrate holding unit is configured to be able to rotate while holding the substrate. The end state confirmation device adjusts the position and posture of the substrate holding unit so that, when imaging the outer peripheral end of the substrate by the imaging unit, a plurality of portions in the circumferential direction of the outer peripheral end of the substrate pass sequentially in a second direction intersecting the first direction at a predetermined reference position in the imaging region in a predetermined reference posture due to the rotation of the substrate held by the substrate holding unit. It may further include a position and posture adjustment unit. In this case, it becomes possible to image the entire circumference of the outer peripheral end of the substrate without increasing the size of the imaging region. Thereby, the light emitting unit and the imaging unit can be miniaturized, and the enlargement of the end state confirmation device is suppressed. (3) The end state confirmation device further includes an eccentricity and shape information acquisition unit that acquires eccentricity information including the amount and direction of eccentricity of the center of the substrate with respect to the rotation center of the substrate held by the substrate holding unit and shape information indicating the shape of the outer peripheral portion of the substrate before imaging the outer peripheral end of the substrate by the imaging unit. The position and posture adjustment unit may adjust the position and posture of the substrate holding unit based on the eccentricity information and shape information acquired by the eccentricity and shape information acquisition unit when imaging the outer peripheral end of the substrate by the imaging unit. In this case, according to the holding state of the substrate by the substrate holding unit and the shape of the substrate, the position and posture of the outer peripheral end of the substrate with respect to the light emitting unit and the imaging unit can be adjusted more accurately to the reference position and reference posture. (4) The end state confirmation device may further include an image data generation unit that generates image data based on the output signal from the imaging unit, and a defect determination unit that determines whether or not there is a defect in the outer peripheral end portion of the substrate based on whether or not the image data generated by the image data generation unit satisfies a predetermined determination condition. In this case, it is uniformly determined whether or not there are defects in the outer peripheral end portion of the substrate and inside the protective member without requiring the user's proficiency in defect determination. (5) The substrate may be a bonded substrate in which a plurality of single substrates are bonded together. Thereby, it is possible to determine whether or not there are defects in the boundary portions of the plurality of single substrates bonded to each other. (6) Each of the plurality of single substrates constituting the bonded substrate has a bevel portion at the outer peripheral end portion of the substrate, the protective member is provided at the outer peripheral end portion of the bonded substrate so as to fill the space between two adjacent bevels in the stacking direction of the plurality of single substrates, and the imaging unit may be arranged to receive light that passes through the outer peripheral end portion of the substrate and the protective member and is reflected by one of the two bevel portions. When the protective member is embedded in the space between the two bevel portions without a gap, the light emitted toward the outer peripheral end portion of the bonded substrate passes through each bevel portion without being reflected. On the other hand, when a void exists on one bevel portion due to the protective member not being sufficiently embedded in the space between the two bevel portions, the light emitted toward the outer peripheral end portion of the bonded substrate is reflected on the one bevel portion where the void exists. Therefore, according to the above configuration, it is possible to easily determine the presence of a void inside the protective member based on the amount of light received by the imaging unit from the outer peripheral end portion of the bonded substrate. (7) The end state confirmation device may further include a protective member forming unit that produces a substrate by forming a protective member at the outer peripheral end portion of an untreated substrate while the untreated substrate on which the protective member is not formed is held by the substrate holding unit. In this case, it becomes possible to form the protective member at the outer peripheral end portion of the substrate in the end state confirmation device. Therefore, the efficiency of substrate processing is improved.

Explanation of Symbols

[0111] 1... End state confirmation device, 10... Housing, 20... Tilt device, 21... Tilt stage, 22... Support member, 22s... Rotation axis, 23... Tilt drive unit, 30... Moving device, 31... Moving stage, 32... Moving drive unit, 40... Rotation holding device, 41... Suction holding part, 42... Rotation suction drive unit, 50... Eccentric detector, 59... Support column, 60... Height detector, 70... Light emitting part, 79... Support piece, 80... Imaging part, 89... Support column, 90... Control device, 91... CPU, 92... Rotation suction control part, 93... Movement control part, 94... Tilt control part, 95... Eccentric shape information acquisition part, 96... Imaging control part, 97... Image data generation part, 98... Defect determination part, 99... Memory part, LN... Protective member forming part, RP... Specified position, W... Substrate, bonded substrate, ax1... Central axis, e1... First inclined surface, e2... End face, e3... Second inclined surface, i1, i2, i3... Image part, vi... Void, w1, w2... Single substrate, w3... Adhesive, w4... Protective member

Claims

1. An end state confirmation device for confirming the end state of a substrate having at least a part thereof in a circular shape and having a protective member provided at an outer peripheral end, wherein the substrate is a bonded substrate in which a plurality of single substrates are bonded together, each of the plurality of single substrates constituting the bonded substrate has a bevel portion at an outer peripheral end of the single substrate, the protective member is provided at an outer peripheral end of the bonded substrate so as to fill a space between two adjacent bevels in a stacking direction of the plurality of single substrates, the end state confirmation device includes, a substrate holding portion for holding the substrate, a light emitting portion that emits light having a wavelength capable of passing through the substrate and the protective member toward an outer peripheral end of the substrate held by the substrate holding portion, and an imaging portion that images the outer peripheral end of the substrate by receiving light emitted from the light emitting portion and passing through the outer peripheral end of the substrate and the protective member, wherein the imaging portion is arranged to receive light that passes through the outer peripheral end of the substrate and the protective member and is specularly reflected by one of the two bevel portions, the end state confirmation device.

2. The imaging portion has an imaging region in a strip shape in cross section extending in a first direction, the light emitting portion and the imaging portion are arranged in a predetermined positional relationship such that light emitted by the emission of light from the light emitting portion travels toward the imaging region of the imaging portion, the substrate holding portion is configured to be able to rotate while holding the substrate, the end state confirmation device further includes a position and attitude adjustment portion that adjusts the position and attitude of the substrate holding portion so that, when the outer peripheral end of the substrate is imaged by the imaging portion, a plurality of portions in the circumferential direction of the outer peripheral end of the substrate sequentially pass through a predetermined position in the imaging region in a second direction intersecting the first direction in a predetermined attitude due to the rotation of the substrate held by the substrate holding portion, the end state confirmation device according to Claim 1.

3. The end state confirmation device further includes an eccentricity and shape information acquisition portion that acquires eccentricity information including an eccentricity amount and an eccentricity direction of the center of the substrate with respect to the rotation center of the substrate held by the substrate holding portion and shape information indicating the shape of the outer peripheral portion of the substrate before imaging of the outer peripheral end of the substrate by the imaging portion. ​ The position and orientation adjustment unit adjusts the position and orientation of the substrate holding unit based on the eccentricity information and the shape information acquired by the eccentricity shape information acquisition unit when imaging the outer peripheral end of the substrate by the imaging unit. The end state confirmation device according to claim 2.

4. An image data generation unit that generates image data based on an output signal from the imaging unit; The end state confirmation device according to any one of claims 1 to 3, further comprising a defect determination unit that determines whether or not there is a defect in the outer peripheral end of the substrate based on whether or not the image data generated by the image data generation unit satisfies a predetermined determination condition.

5. The end state confirmation device according to any one of claims 1 to 4, further including a protective member forming unit that produces the substrate by forming the protective member on the outer peripheral end of the untreated substrate in a state where the untreated substrate on which the protective member is not formed is held by the substrate holding unit.

Images