Antenna

Abstract

To provide an antenna with which worsening of manufacturing cost can is made to be easily suppressible, and the degradation of radio wave characteristic is easily suppressible.SOLUTION: The antenna comprises: a baseplate board 10 in which a baseplate combining part 14 is provided; a riser board 20 in which is provided a riser combining part 24 that is combined with the baseplate combining part; a baseplate strip line 11 that is provided to a first baseplate plane 10A; a riser strip line 21 that is provided to a first riser plane 20A; a baseplate ground 16 that is provided to a second baseplate plane 10B on the side opposite the first baseplate plane 10A and provided in a range that at least includes a counter region 16A that faces the baseplate strip line 11 and an extension region 16B that is extended in a direction in which the baseplate strip line 11 extends; a riser ground 22 that is provided to the second riser plane 20B; and a land 12 that is provided to the first baseplate plane 10A and is provided so as to be electrically conductive to a baseplate ground 16 via a through-hole 13.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an antenna.

Background Art

[0002] As a microstrip antenna (hereinafter also referred to as an antenna) used in the microwave band, antennas having various structures have been proposed (see, for example, Patent Document 1). In the antenna described in Patent Document 1, a cut is made in a part of a dielectric substrate having a microstrip line and a ground conductor, and has a structure that rises substantially at a right angle so as to draw an arc.

[0003] The antenna having the above-described structure has a problem in that it is likely to be costly to manufacture the antenna because a cut is made in a part of the dielectric substrate and the cut part is formed to rise substantially at a right angle.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In order to solve the above problems, an antenna having a floor substrate and a rising substrate disposed upright with respect to the floor substrate can be considered. This rising substrate is disposed so as to penetrate the floor substrate.

[0006] In the above-described antenna, a floor strip line provided on the floor substrate and a rising strip line provided on the rising substrate are connected by soldering. Further, a floor ground provided on the floor substrate and a rising ground provided on the rising substrate are connected by soldering at a portion where the rising substrate penetrates the floor substrate.

[0007] That is, in the above-described antenna, the surface for soldering the floor strip line and the rising strip line is different from the surface for soldering the floor ground and the rising ground. Therefore, there has been a problem that it is difficult to suppress the deterioration of the manufacturing cost of the antenna.

[0008] In addition, the above-described antenna has a problem that the radio wave characteristics of the antenna are likely to deteriorate, such as the deterioration of the passing characteristics of the high-frequency current.

[0009] The present invention has been made to solve the above problems, and an object thereof is to provide an antenna that can easily suppress the deterioration of the manufacturing cost and can easily suppress the deterioration of the radio wave characteristics.

Means for Solving the Problems

[0010] In order to achieve the above object, the present invention provides the following means. The antenna of the present invention is formed in a plate shape, and includes a floor substrate provided with a floor combination portion on a first floor plane, and a plate-shaped substrate arranged to intersect the floor substrate, and a rising combination portion combined with the floor combination portion is provided on a side surface of an end portion. The rising substrate, a floor strip line having conductivity provided on the first floor plane and extending toward the rising substrate, and a strip line having conductivity provided on a first rising plane facing the floor strip line on the rising substrate, and a rising strip line conductively connected to the floor strip line, and a floor ground having conductivity provided in a range including at least a facing region facing the floor strip line and an extension region extended in a direction in which the floor strip line extends on a second floor plane opposite to the first floor plane on the floor substrate, and a rising ground having conductivity provided on a second rising plane opposite to the first rising plane on the rising substrate, and a land provided on the first floor plane, conductively connected to the rising ground, and conductively connected to the floor ground through a through hole.

[0011] According to the antenna of the present invention, since the floor ground is provided in a range including at least an extension region extending in the direction in which the floor strip line extends, it is easy to suppress deterioration in the passing characteristics of high-frequency currents in the floor strip line and the rising strip line.

[0012] Also, a floor strip line and lands are provided on the first floor plane of the floor substrate. Therefore, the operations of electrically connecting the floor strip line and the rising strip line, and the operations of electrically connecting the floor ground and the lands to the rising lands can be performed from the same first floor plane side.

Effect of the Invention

[0013] According to the antenna of the present invention, since the floor ground is provided in a range including at least the extension region, there is an effect that it is easy to suppress deterioration in the passing characteristics of high-frequency currents in the floor strip line and the rising strip line. Also, since lands that conduct electricity with the floor ground are provided on the first floor plane where the floor strip line is provided, there is an effect that it is easy to suppress deterioration in manufacturing costs.

Brief Description of the Drawings

[0014]

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Mode for Carrying Out the Invention

[0015] Antenna 1 according to an embodiment of the present invention will be described with reference to FIGS. 1 to 14(b). In this embodiment, it will be described by applying it to an example in which antenna 1 is a microstrip antenna used in the microwave band.

[0016] FIG. 1 is a perspective view for explaining the configuration of antenna 1. FIG. 2 is another perspective view for explaining the configuration of antenna 1. As shown in FIGS. 1 and 2, antenna 1 is provided with a floor substrate 10 and a rising substrate 20.

[0017] The floor substrate 10 is a substrate formed in a plate shape that constitutes antenna 1 together with the rising substrate 20, and is the substrate on which the rising substrate 20 is arranged. The floor substrate 10 is formed using a material corresponding to the wavelength of the radio wave used by antenna 1 and has a thickness corresponding to the wavelength.

[0018] FIG. 3 is a plan view of the floor substrate 10 as viewed from the side of the first floor plane 10A. FIG. 4 is a cross-sectional view taken along the line X-X' for explaining the configuration of the antenna 1. As shown in FIG. 3, on the first floor plane 10A, which is one of the two planes of the floor substrate 10, one floor strip line 11 and two lands 12 are provided. As shown in FIG. 4, the floor substrate 10 is provided with two floor combination portions 14.

[0019] The floor strip line 11 is a member that constitutes the power feeding circuit in the antenna 1. As shown in FIG. 3, the floor strip line 11 is a layered line formed of a material having conductivity on the first floor plane 10A. Examples of the material constituting the floor strip line 11 include known materials (for example, copper) used for the antenna 1.

[0020] The floor strip line 11 is provided in a region on the side of the first rising plane 20A of the rising substrate 20 on the first floor plane 10A. The floor strip line 11 is a line formed in a strip shape extending toward the arrangement position of the rising substrate 20. In the present embodiment, an example in which the floor strip line 11 extends in a direction orthogonal to the rising substrate 20 disposed on the floor substrate 10 will be described.

[0021] As the thickness of the layer and the strip width 11W in the floor strip line 11, the thickness of the layer corresponding to the wavelength of the radio wave used by the antenna 1 and the strip width can be used.

[0022] The end portion of the floor strip line 11 on the side of the rising substrate 20 extends up to the rising substrate 20. Specifically, it extends up to a position above the rising strip line 21 and below the rising ground 22 of the rising substrate 20, which will be described later. It is preferable that insulation is ensured between the end portion of the floor strip line 11 and the rising ground 22. For example, it is preferable that a desired interval is provided between the end portion of the floor strip line 11 and the rising ground 22.

[0023] The land 12 is a member used for conducting electricity between the floor ground 16 of the floor substrate 10, which will be described later, and the rising ground 22 of the rising substrate 20. The land 12 is provided at a position where it can conduct electricity with the rising ground 22 on the first floor plane 10A. In other words, it is provided in the region on the second rising plane 20B side of the rising substrate 20 on the first floor plane 10A.

[0024] The land 12 and the floor ground 16 are conductively connected via the through hole 13. The through hole 13 is a member in which a conductive material (for example, copper, solder) is provided on the inner surface of the through hole provided in the floor substrate 10. The through hole 13 is provided in the region where the land 12 is provided. One through hole 13 may be provided for one land 12, or two or more through holes 13 may be provided for one land 12. The material forming the through hole 13 may be the same as or different from the materials forming the land 12 and the floor ground 16.

[0025] The land 12 is a layered member formed from a conductive material (for example, copper) and formed in a rectangular shape. The thickness of the layer and the dimensions of the rectangular shape in the land 12 have the thickness of the layer corresponding to the wavelength of the radio wave used by the antenna 1 and the dimensions of the rectangular shape.

[0026] The land 12 may protrude from the region on the second rising plane 20B side of the rising substrate 20 on the first floor plane 10A to the region on the first rising plane 20A side, or may be provided only in the region on the second rising plane 20B side.

[0027] Two lands 12 are arranged at an interval 12S in a direction intersecting the direction in which the floor strip line 11 extends. A gap 11S with a desired width is provided between the land 12 and the floor strip line 11 so as to ensure insulation.

[0028] FIG. 5 is a plan view for explaining another embodiment of the land 12. FIG. 6 is a plan view for explaining still another embodiment of the land 12. The number of lands 12 may be two as shown in FIG. 3, or may be one as shown in FIGS. 5 and 6.

[0029] One land 12 shown in FIG. 5 has the same shape as the two lands 12 shown in FIG. 3. In other words, only one of the two lands 12 shown in FIG. 3 is used. The land 12 shown in FIG. 6 has a shape in which the two lands 12 shown in FIG. 3 are integrated. In other words, the two lands 12 shown in FIG. 3 are replaced with one land 12 having a rectangular shape with the long side being the same as the width of the rising substrate 20.

[0030] As shown in FIG. 4, the floor combination portion 14 is used together with the rising combination portion 24 to determine the arrangement position and posture of the rising substrate 20 with respect to the floor substrate 10. The floor combination portion 14 is a through hole that penetrates the floor substrate 10 and the floor ground 16 and has a rectangular cross section. The two floor combination portions 14 are provided at intervals corresponding to the rising combination portion 24 of the rising substrate 20.

[0031] FIG. 7 is an X-X' cross-sectional view for explaining another embodiment in which one set of the floor combination portion 14 and the rising combination portion 24 is provided. FIG. 8 is an X-X' cross-sectional view for explaining another embodiment in which the rising combination portion 24 is not exposed. FIG. 9 is an X-X' cross-sectional view for explaining still another embodiment in which the rising combination portion 24 is not exposed.

[0032] As shown in FIG. 4, two floor combination portions 14 may be provided, or one floor combination portion 14 may be provided as shown in FIG. 7. In the example shown in FIG. 7, one of the two floor combination portions 14 shown in FIG. 4 is provided and the other is not provided.

[0033] The floor combination part 14 may be a hole that penetrates up to the floor ground 16 as shown in FIG. 4, or may be a recess that penetrates only the floor substrate 10 and does not penetrate the floor ground 16 as shown in FIG. 8. Further, as shown in FIG. 9, it may also be a recess that does not penetrate the floor substrate 10 either.

[0034] FIG. 10 is a plan view of the floor substrate 10 as viewed from the second floor plane 10B side. On the second floor plane 10B, which is the other of the two planes of the floor substrate 10, a floor ground 16 is provided as shown in FIG. 10. The second floor plane 10B is a plane on the side of the floor substrate 10 opposite to the first floor plane 10A.

[0035] The floor ground 16 is a member that constitutes the ground in the antenna 1. The floor ground 16 is a layered member formed of a conductive material that covers the second floor plane 10B. Examples of the material constituting the floor ground 16 can include known materials (for example, copper) used for the antenna 1.

[0036] The floor ground 16 at least includes an opposing region 16A that faces the floor strip line 11 of the first floor plane 10A, and an extended region 16B that extends in the direction in which the floor strip line 11 extends. Further, through holes of the two floor combination parts 14 are open in the floor ground 16.

[0037] The opposing region 16A is a region that extends on the second floor plane 10B in the same manner as the floor strip line 11. The opposing region 16A has the same length in the longitudinal direction of the floor strip line 11. In the direction (preferably the orthogonal direction) that intersects the longitudinal direction of the floor strip line 11, it is a region that extends with a width of 16L or more in the intersecting direction (preferably the orthogonal direction) from the end 11W of the floor strip line 11.

[0038] The extended region 16B is a region that extends on the second floor plane 10B beyond the longitudinal end of the floor strip line 11. The extended region 16B has a shape that extends between the through holes of the two floor combination parts 14.

[0039] The extension region 16B also includes a region where two through-holes 13 are provided. In the present embodiment, an example will be described in which the extension region 16B extends between the through-holes of the two floor combination portions 14 and has a T-shape extending toward the two through-holes 13.

[0040] FIG. 11 is a plan view for explaining another embodiment of the floor ground 16. The floor ground 16 may be formed on the entire surface of the second floor plane 10B as shown in FIG. 10, or may be formed in a shape having an opposing region 16A and an extension region 16B as shown in FIG. 11.

[0041] The rising substrate 20 is a substrate formed in a rectangular plate shape that constitutes the antenna 1 together with the floor substrate 10 as shown in FIGS. 1 and 2. More preferably, it is a substrate formed in a rectangular plate shape. The rising substrate 20 is formed using a material (for example, glass epoxy) corresponding to the wavelength of the radio wave used by the antenna 1, similar to the floor substrate 10, and has a thickness corresponding to the wavelength.

[0042] The rising substrate 20 is disposed at a position adjacent to the floor strip line 11 and the land 12 on the first floor plane 10A of the floor substrate 10. Further, the rising substrate 20 is disposed in a posture extending in a direction intersecting the first floor plane 10A of the floor substrate 10. More preferably, it is disposed in a posture perpendicular to the first floor plane 10A.

[0043] As shown in FIG. 1, one rising strip line 21 is provided on the first rising plane 20A, which is one of the two planes of the rising substrate 20. The rising strip line 21 is a member that constitutes a power feeding circuit in the antenna 1 together with the floor strip line 11. The rising strip line 21 is a layered line formed from a conductive material. As the material constituting the rising strip line 21, a known material (for example, copper) used for the antenna 1 can be exemplified, similar to the floor strip line 11.

[0044] The rising strip line 21 is a strip-shaped line extending in the longitudinal direction of the rising substrate 20. The end portion of the rising strip line 21 on the side of the floor substrate 10 is conductively connected to the floor strip line 11. For example, it is soldered to the floor strip line 11.

[0045] Regarding the thickness of the layer and the strip-shaped width 21W in the rising strip line 21, similar to the floor strip line 11, a layer thickness corresponding to the wavelength of the radio wave used by the antenna 1 and a strip-shaped width can be used.

[0046] As shown in FIG. 2, a rising ground 22 is provided on the second rising plane 20B, which is the other of the two planes of the rising substrate 20. The second rising plane 20B is a plane on the opposite side of the first rising plane 20A in the rising substrate 20.

[0047] The rising ground 22 is a member that constitutes the ground in the antenna 1 together with the floor ground 16. The end portion of the rising ground 22 on the side of the floor substrate 10 is conductively connected to the two lands 12. The rising ground 22 is, for example, soldered to and conductively connected to each of the two lands 12.

[0048] The rising ground 22 is a layered member formed of a conductive material covering the second rising plane 20B. Examples of the material constituting the rising ground 22 include known materials (e.g., copper) used for the antenna 1, similar to the floor ground 16.

[0049] As shown in FIG. 4, two rising combination portions 24 are provided on the end side surface of the rising substrate 20 on the side of the floor substrate 10. The rising combination portions 24 are used together with the floor combination portions 14 to determine the arrangement position and posture of the rising substrate 20.

[0050] The standing-up combination part 24 is a convex part formed in a quadrangular prism shape that protrudes from the end side surface of the standing-up substrate 20 and is inserted into the through hole of the floor combination part 14. The two standing-up combination parts 24 are provided at both ends of the end side surface of the standing-up substrate 20, respectively.

[0051] The dimension of the height protruding from the end side surface on the floor substrate 10 side in the standing-up combination part 24 is equal to the dimension of the thickness of the floor substrate 10. In other words, the tip surface of the standing-up combination part 24 constitutes the same plane as the surface of the floor ground 16 of the floor substrate 10.

[0052] In at least the region of the standing-up combination part 24 facing the floor ground 16, the standing-up ground 22 is not provided. Note that the standing-up ground 22 may not be provided on the entire surface of the standing-up combination part 24.

[0053] As shown in FIG. 4, two standing-up combination parts 24 may be provided, or as shown in FIG. 7, one standing-up combination part 24 may be provided. In the example shown in FIG. 7, one of the two standing-up combination parts 24 shown in FIG. 4 is provided, and the other is not provided.

[0054] The standing-up combination part 24 may be a convex part having a height that reaches the floor ground 16 as shown in FIG. 4, or may be a convex part having a height that penetrates only the floor substrate 10 and does not penetrate the floor ground 16 as shown in FIG. 8.

[0055] Furthermore, as shown in FIG. 9, the standing-up combination part 24 may be a convex part having a height that does not penetrate the floor substrate 10 either. In other words, the dimension of the height protruding from the end side surface on the floor substrate 10 side in the standing-up combination part 24 may be smaller than the dimension of the thickness of the floor substrate 10.

[0056] Next, the radio wave characteristics of the antenna 1 having the above configuration will be described with reference to FIGS. 12(a) to 14(b). FIG. 12(a) is a plan view of the antenna 101 to be compared as viewed from the standing-up substrate side, and FIG. 12(b) is a plan view as viewed from the opposite side of the standing-up substrate.

[0057] First, the configuration of the antenna 101 to be compared will be described with reference to FIGS. 12(a) and 12(b). Note that the same components as those of the antenna 1 in the present embodiment are denoted by the same reference numerals, and the description thereof will be omitted. As shown in FIGS. 12(a) and 12(b), the antenna 101 includes a floor substrate 110 and a rising substrate 120 disposed through the floor substrate.

[0058] The floor substrate 110 is provided with a floor strip line 11, a land 12, a floor ground 116, and a through hole 114. The floor ground 116 includes a facing region 16A and does not include an extension region 16B. The floor ground 16 is different in the presence or absence of the extension region 16B. The through hole 114 has a rectangular shape sized to allow the end of the rising substrate 120 to be inserted therethrough, and is disposed at a position that blocks the extension line of the floor strip line 11.

[0059] The rising substrate 120 is provided with a rising strip line 21 and a rising ground 22. The rising ground 22 is not provided at the end portion of the rising substrate 120 that is inserted into the through hole 114.

[0060] The floor strip line 11 and the rising strip line 21 are soldered on the surface of the floor substrate 110 where the floor strip line 11 is provided. The rising ground 22 is soldered to the land 12 that is electrically connected to the floor ground 116 via a through hole 13.

[0061] Next, the radio wave characteristics of the antenna 1 will be described with reference to FIGS. 13(a) to 14(b) based on the S parameters. Here, the radio wave characteristics based on the calculation results using an electromagnetic field simulator will be described. Note that it has been confirmed that the radio wave characteristics, which are the calculation results of the electromagnetic field simulator, are the same as the radio wave characteristics measured using the antenna 1.

[0062] FIG. 13(a) is a graph explaining the relationship between the S-parameters and the frequency in Antenna 1, and FIG. 13(b) is a Smith chart regarding Antenna 1. FIG. 14(a) is a graph explaining the relationship between the S-parameters and the frequency in Comparative Antenna 101, and FIG. 14(b) is a Smith chart regarding Antenna 101.

[0063] The input reflection coefficient (also denoted as S11) in the S-parameters of Antenna 1 will be described with reference to the graph shown in FIG. 13(a). The vertical axis in the graph of FIG. 13(a) is the voltage standing wave ratio (also denoted as VSWR) of the reflection coefficient, and the horizontal axis is the frequency.

[0064] In Antenna 1, as shown in FIG. 13(a), in the frequency band of 3.0 GHz or higher and 5.5 GHz or lower, the VSWR of S11 is less than 1.10. In Comparative Antenna 101, as shown in FIG. 14(a), the VSWR of S11 greatly exceeds 1.10. That is, it is shown that Antenna 1 has less reflection of signals at the input end and better radio wave characteristics than Comparative Antenna 101.

[0065] Next, the input reflection coefficient (also denoted as S11) and the output reflection coefficient (also denoted as S22) in the S-parameters of Antenna 1 will be described with reference to the Smith chart shown in FIG. 13(b).

[0066] In the frequency band of 3.0 GHz or higher and 5.5 GHz or lower, S11 and S22 of Antenna 1 are plotted in a region closer to the center (50 Ω in this embodiment) of the Smith chart than Comparative Antenna 101, as shown in FIGS. 13(b) and 14(b). That is, it is shown that Antenna 1 is more easily matched with a coaxial cable or the like to which it is connected and has better radio wave characteristics than Comparative Antenna 101.

[0067] According to the antenna 1 configured as described above, since the floor ground 16 is provided in a range including at least an extension region 16B extended in the direction in which the floor strip line 11 extends, it is easy to suppress deterioration of the passing characteristics of high-frequency currents in the floor strip line 11 and the rising strip line 21.

[0068] Also, the floor strip line 11 and the land 12 are provided on the first floor plane 10A of the floor substrate 10. Therefore, operations of conductively connecting the floor strip line 11 and the rising strip line 21, and operations of conductively connecting the floor ground 16 and the land 12 and the rising ground 22 can be performed from the same first floor plane 10A side.

[0069] By setting the opposing region 16A and the extension region 16B to regions that spread in a direction intersecting the floor strip line 11, it is easier to further suppress deterioration of the passing characteristics of high-frequency currents in the floor strip line 11 and the rising strip line 21.

[0070] By providing a predetermined gap 11S between the land 12 and the floor strip line 11, it is easy to ensure insulation between the floor ground 16 including the land 12 and the rising ground 22, and the floor strip line 11 and the rising strip line 21.

[0071] By setting the height at which the rising combination part 24 protrudes to be equal to or less than the thickness of the floor substrate 10, the rising combination part 24 does not protrude from the floor substrate 10 to the opposite side. Therefore, the antenna 1 is less likely to become large, and it is easy to save space in the space where the antenna 1 is installed.

[0072] Note that the technical scope of the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present invention. For example, the present invention is not limited to being applied to the above-described embodiments, and may be applied to embodiments in which these embodiments are appropriately combined, and is not particularly limited.

Explanation of reference numerals

[0073] 1... Antenna, 10... Floor substrate, 10A... First floor plane, 10B... Second floor plane, 11... Floor strip line, 12... Land, 13... Through hole, 14... Floor combination part, 16... Floor ground, 16A... Opposing region, 16B... Extension region, 20... Upright substrate, 20A... First upright plane, 20B... Second upright plane, 21... Upright strip line, 22... Upright ground, 24... Upright combination part

Claims

1. A floor substrate formed in a plate shape and provided with a floor combination portion on the first floor plane, A plate-shaped substrate arranged to intersect the floor substrate, the riser substrate being provided with a rising combination portion combined with the floor combination portion on the side surface of the end, A conductive floor strip line provided on the first floor plane and extending toward the riser substrate, A strip line having conductivity provided on the first rising plane of the riser substrate facing the floor strip line, the rising strip line being conductively connected to the floor strip line, A floor ground having conductivity provided on the second floor plane on the opposite side of the first floor plane of the floor substrate, including at least a facing region facing the floor strip line and an extended region extended in the extending direction of the floor strip line, Provided on the second rising plane on the opposite side of the first rising plane of the riser substrate, having conductivity A rising ground, A land provided on the first floor plane, conductively connected to the rising ground, and conductively connected to the floor ground via a through hole, An antenna having, The facing region and the extended region are regions that extend in the intersecting direction further than the end in the intersecting direction with respect to the extending direction of the floor strip line in the floor strip line, An antenna in which a predetermined interval is provided in the intersecting direction between the land and the floor strip line.

2. The floor combination portion is a through hole formed in the floor substrate, The rising combination portion is a convex portion protruding from the riser substrate and inserted into the through hole, The antenna according to claim 1, wherein the height at which the rising combination portion protrudes is equal to or less than the thickness of the floor substrate.

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