Wafer determination method, determination program, determination device, wafer manufacturing method, and wafer

Abstract

To provide a wafer determination method which can improve quality of a product, a determination program, a determination device, a wafer manufacturing method and a wafer.SOLUTION: A determination method of a wafer 30 comprises the steps of: acquiring a photographed image 40 obtained by imaging at least a portion of the wafer 30 as a determination image used for determining quality of the wafer 30; excluding the photographed image 40 from the determination image when the photographed image 40 corresponds to an erroneous determination candidate image; and determining the quality of the wafer 30 on the basis of the determination image.SELECTED DRAWING: Figure 10

Description

Technical Field

[0001] The present disclosure relates to a method for determining a wafer, a determination program, a determination device, a method for manufacturing a wafer, and a wafer.

Background Art

[0002] Conventionally, a method for classifying wafer defects using a wafer defect image has been known (see Patent Document 1, etc.).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] For the purpose of eliminating visual inspection or reducing the man-hours of visual inspection, automatically determining wafer defects has been studied. In that case, when photographing a wafer to be inspected, an image that is difficult to distinguish from a defect may be generated due to an abnormality of the photographing device. Such an image may reduce the defect determination accuracy. By improving the defect determination accuracy, it is required to improve the quality of products such as wafers, or products using wafers as materials.

[0005] Therefore, an object of the present disclosure is to propose a determination method, a determination program, a determination device, a method for manufacturing a wafer, and a wafer that can improve the quality of products.

Means for Solving the Problems

[0006] One embodiment of the present disclosure for solving the above problems is as follows. [1] A step of obtaining a captured image obtained by photographing at least a part of a wafer as a determination image to be used for determining the pass / fail of the wafer, When the captured image corresponds to a false judgment candidate image, excluding the captured image from the judgment image; Judging whether the wafer is qualified or not based on the judgment image; A judgment method comprising: [2] The method according to [1] above, further comprising determining that the captured image corresponds to the false judgment candidate image when at least a part of the range in which the wafer appears in the captured image is missing, or when a predetermined part of the wafer appears in the captured image. [3] The method according to [1] above, further comprising generating a model for determining whether the captured image corresponds to the false judgment candidate image using teacher data including the false judgment candidate image. [4] A judgment program for causing a processor to execute the judgment method according to any one of [1] to [3] above. [5] A judgment device comprising a control unit that executes the judgment method according to any one of [1] to [3] above. [6] A method for manufacturing a wafer, comprising judging whether the wafer is qualified or not by executing the judgment method according to any one of [1] to [3] above. [7] A wafer judged to be qualified by executing the judgment method according to any one of [1] to [3] above. [Effect of the Invention]

[0007] According to the wafer judgment method, judgment program, judgment device, wafer manufacturing method and wafer according to the present disclosure, the quality of the product can be improved. [Brief Description of the Drawings]

[0008]

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Embodiments for Carrying Out the Invention

[0009] (Configuration Example of Determination System 1) As shown in FIG. 1, the determination system 1 includes a determination device 10 and a photographing device 20. The photographing device 20 photographs an image of a product such as a wafer, which is used to determine the pass / fail of the product, in the process of manufacturing a product such as a wafer. The determination device 10 acquires the image photographed by the photographing device 20 and determines the pass / fail of the product based on the acquired image.

[0010] The determination system 1 according to this embodiment may determine whether the appearance of a product meets the shipping standards based on an image of the appearance of the product. That is, the determination system 1 may determine whether the appearance of the product is acceptable or not. The determination system 1 is not limited to the appearance of the product, and may also determine whether the internal state of the product is acceptable or not based on an image representing the internal state of the product, such as an X-ray image. The determination system 1 according to this embodiment may acquire an image of the appearance or internal state of a wafer as a product, and determine whether the appearance or internal state of the wafer is acceptable or not.

[0011] <Determination device 10> The determination device 10 includes a control unit 12, a storage unit 14, and an interface 16.

[0012] The control unit 12 determines whether the product is acceptable or not based on an image of the product acquired from the imaging device 20 through the interface 16, and outputs the determination result through the interface 16. The control unit 12 may include at least one processor. The processor may execute a program for realizing various functions of the control unit 12. The processor may be realized as a single integrated circuit. The integrated circuit is also referred to as an IC (Integrated Circuit). The processor may be realized as a plurality of communicably connected integrated circuits and discrete circuits. The processor may be realized based on various other known technologies.

[0013] The storage unit 14 may include an electromagnetic storage medium such as a magnetic disk, or may include a memory such as a semiconductor memory or a magnetic memory. The storage unit 14 may include a non-transitory computer-readable medium. The storage unit 14 stores various information such as images acquired from the imaging device 20 and programs executed by the control unit 12. The storage unit 14 may function as a working memory of the control unit 12. At least a part of the storage unit 14 may be included in the control unit 12. At least a part of the storage unit 14 may be configured as a storage device separate from the determination device 10.

[0014] The interface 16 may be configured to include a communication module that is communicable with the imaging device 20 so as to be able to acquire an image from the imaging device 20. The communication module may be communicably connected to the imaging device 20 by wire or wirelessly. The communication module may be directly connected to the imaging device 20 or may be connected via a communication network. The communication module may include a communication interface such as a LAN (Local Area Network). The communication module may also include a communication interface for contactless communication such as infrared communication or NFC (Near Field Communication). The communication module may implement communication by various communication methods such as 4G (4th Generation) or LTE (Long Term Evolution) or 5G (5th Generation). The communication method implemented by the communication module is not limited to the above examples and may include various other methods. At least a part of the communication module may be included in the control unit 12.

[0015] The interface 16 may be configured to include an output device so as to be able to notify the user of the determination result by the control unit 12. The output device may include a display device that outputs visual information such as an image, characters, or graphics. The display device may be configured to include, for example, an LCD (Liquid Crystal Display), an organic EL (Electro-Luminescence) display, an inorganic EL display, or a PDP (Plasma Display Panel). The display device is not limited to these displays and may be configured to include various other types of displays. The display device may be configured to include a light-emitting device such as an LED (Light Emitting Diode) or an LD (Laser Diode). The display device may be configured to include various other devices. The output device may also include a speaker or the like that outputs sound. The output device is not limited to these examples and may include devices that can output information in various other forms.

[0016] The interface 16 may be configured to include an input device that receives operation inputs such as start or stop of product measurement by the determination device 10, or various other instruction inputs to the determination device 10. The interface 16 outputs the information input by the user to the control unit 12. The input device may be configured to include, for example, a touch panel or touch sensor, or a pointing device such as a mouse. The input device may include physical keys. The input device may be configured to include a voice input device such as a microphone.

[0017] <Imaging device 20> The imaging device 20 may be configured to include various cameras such as a visible light camera, an infrared camera, or an X-ray camera. The imaging device 20 may be configured to include a light source such as a visible light source or an X-ray source that irradiates when imaging a product such as a wafer.

[0018] The imaging device 20 is configured to image at least a part of a product such as a wafer. When imaging the wafer 30 illustrated in FIG. 2, for example, the imaging device 20 may image the end face 32 of the wafer 30 over one circumference and generate an image of the appearance of the end face 32 of the wafer 30 as a long image as illustrated in FIG. 3. The image of the end face 32 of the wafer 30 illustrated in FIG. 3 includes an overlapping section where the same location is imaged so as to include the entire circumference of the end face 32. The imaging device 20 may be configured such that the wafer 30 rotates with respect to a fixed camera, or the camera rotates around the outer circumference of the wafer 30, in order to image the end face 32 of the wafer 30 over one circumference.

[0019] The wafer 30 has a defect 36 on the end face 32. The defect 36 may include scratches or chipping occurring on the end face 32 or the surface 31 of the wafer 30. The defect 36 may include foreign matter such as dust attached to the end face 32 or the surface 31 of the wafer 30. The defect 36 shown in the image illustrated in FIG. 3 includes a defect 36A and a defect 36B representing scratches.

[0020] Wafer 30 has a notch 34 as a mark indicating the direction of the crystal axis of wafer 30. Notch 34 is formed as a notch from the end face 32 of wafer 30 inward. Notch 34 appears as a notch when viewed from the surface 31 of wafer 30. Notch 34 appears to be recessed when viewed from the end face 32 of wafer 30.

[0021] As illustrated in FIGS. 4A, 4B, 4C, and 4D, imaging device 20 may generate an image obtained by cutting out a part of end face 32. FIG. 4A corresponds to an enlarged image of the portion surrounded by the dashed line represented by A in FIG. 3. The enlarged image of FIG. 4A includes neither defect 36 nor notch 34. FIG. 4B corresponds to an enlarged image of the portion surrounded by the dashed line represented by B in FIG. 3. The enlarged image of FIG. 4B includes defect 36A. FIG. 4C corresponds to an enlarged image of the portion surrounded by the dashed line represented by C in FIG. 3. The enlarged image of FIG. 4C includes defect 36B. FIG. 4D corresponds to an enlarged image of the portion surrounded by the dashed line represented by D in FIG. 3. The enlarged image of FIG. 4D includes notch 34.

[0022] Imaging device 20 may generate an image obtained by cutting out a part of end face 32 from a long image generated by imaging end face 32 of wafer 30 over one full rotation. Imaging device 20 may image end face 32 of wafer 30 and generate an image of a portion where defect 36 may be captured.

[0023] When imaging device 20 images surface 31 of wafer 30, it may generate an image obtained by cutting out a part of surface 31 of wafer 30 from a full surface image generated by imaging surface 31 of wafer 30 while scanning it. Imaging device 20 may image surface 31 of wafer 30 while scanning it and generate an image of a portion where defect 36 may be captured.

[0024] As described above, imaging device 20 is configured to image at least a part of wafer 30. Imaging device 20 outputs an image obtained by imaging at least a part of wafer 30 to determination device 10.

[0025] (Operation Example of Determination System 1) In determination system 1, imaging device 20 generates an image of at least a part of wafer 30 and outputs it to determination device 10. The image obtained by imaging device 20 of at least a part of wafer 30 is also referred to as a captured image. Determination device 10 acquires, via interface 16, the captured image generated by imaging device 20 as an image to be determined. The image to be determined by determination device 10 is also referred to as a determination image. Control unit 12 of determination device 10 determines the pass / fail of wafer 30 based on the determination image.

[0026] The captured image may include an image containing defect 36. On the other hand, the captured image may include an image not containing defect 36. Even if the captured image does not contain defect 36, it may include an image that is erroneously determined by control unit 12 to be defect 36. If control unit 12 uses, for determination, an image that is erroneously determined to be defect 36 even though it is not defect 36, it is likely to erroneously determine the pass / fail of wafer 30.

[0027] Therefore, control unit 12 excludes, from the images to be determined, an image that can be erroneously determined to be defect 36 even though it is not defect 36. An image that can be erroneously determined to be defect 36 even though it is not defect 36 is also referred to as a false determination candidate image.

[0028] Control unit 12 determines whether the captured image acquired from imaging device 20 corresponds to a false determination candidate image. Control unit 12 uses, as a determination image, a captured image determined not to correspond to a false determination candidate image, and determines the pass / fail of wafer 30. Control unit 12 does not use, as a determination image, a captured image determined to correspond to a false determination candidate image. That is, control unit 12 excludes, from the determination images, a captured image determined to correspond to a false determination candidate image.

[0029] The control unit 12 may generate a model for determining whether a captured image corresponds to an erroneously determined candidate image. The model for determining whether a captured image corresponds to an erroneously determined candidate image is also referred to as the determination model for erroneously determined candidate images. The determination model for erroneously determined candidate images is configured to output a determination result as to whether the input captured image corresponds to an erroneously determined candidate image. The control unit 12 may generate a model for determining the pass / fail of the wafer 30 based on a determination image excluding the captured images corresponding to the erroneously determined candidate images. The model for determining the pass / fail of the wafer 30 based on a determination image excluding the captured images corresponding to the erroneously determined candidate images is also referred to as the determination model for defects 36. The determination model for defects 36 is configured to output a determination result as to whether the wafer 30 shown in the input determination image is qualified or unqualified based on the input determination image.

[0030] The control unit 12 may use the determination model for erroneously determined candidate images and the determination model for defects 36 in combination. The control unit 12 may input a captured image into the determination model for erroneously determined candidate images and exclude the erroneously determined candidate images from the determination image based on the determination result output from the determination model for erroneously determined candidate images. The control unit 12 may input the determination image excluding the erroneously determined candidate images into the determination model for defects 36 and determine the pass / fail of the wafer 30 shown in the captured image initially input into the determination model for erroneously determined candidate images based on the determination result output from the determination model for defects 36.

[0031] The control unit 12 may also implement the determination as to whether a captured image corresponds to an erroneously determined candidate image and the determination of the pass / fail of the wafer 30 based on a determination image excluding the captured images corresponding to the erroneously determined candidate images in one model. The one model that implements the determination of erroneously determined candidate images and the pass / fail determination is also referred to as the composite determination model. The control unit 12 may input a captured image into the composite determination model and determine the pass / fail of the wafer 30 shown in the captured image input into the composite determination model based on the determination result output from the composite determination model.

[0032] <Determination of Erroneously Determined Candidate Images> The determination model for misjudgment candidate images may be generated by training using teacher data including at least one of an image corresponding to a misjudgment candidate image or an image not corresponding to a misjudgment candidate image. The determination model for misjudgment candidate images may be generated as a pattern matching model that identifies at least one of a pattern corresponding to a misjudgment candidate image or a pattern not corresponding to a misjudgment candidate image. The determination model for misjudgment candidate images may be generated so as to be able to determine misjudgment candidate images by various algorithms not limited to these. The control unit 12 may generate the determination model for misjudgment candidate images by itself or may acquire it from an external device.

[0033] An image corresponding to a misjudgment candidate image is an image as exemplified below. For example, as shown in FIGS. 5A and 5B, a captured image 40 including a missing portion 44 corresponds to a misjudgment candidate image.

[0034] In the captured image 40 illustrated in FIG. 5A, the end face 32 of the wafer 30 and the background portion 42 without the wafer 30 are shown. Assume that the control unit 12 is configured to determine the pass / fail of the wafer 30 based on an image of the portion where the end face 32 is shown from the left end to the right end of the captured image 40, ignoring the background portion 42 in the captured image 40. However, in the captured image 40 illustrated in FIG. 5A, a part of the right-side image is a black image due to a cause such as an abnormality of the imaging device 20. That is, a part of the image of the end face 32 that should be shown up to the right end is missing. The missing portion of the image of the end face 32 is represented as the missing portion 44. When the control unit 12 uses the captured image 40 illustrated in FIG. 5A as a determination image, there is a possibility of misjudging the missing portion 44 as a defect 36.

[0035] Also, in the captured image 40 illustrated in FIG. 5B, the surface 31 of the wafer 30 and the defective portion 44 that appears as a black image are shown. That is, the image of the surface 31 of the wafer 30 is missing. It is assumed that the control unit 12 is configured to determine the pass / fail of the wafer 30 based on an image in which the surface 31 of the wafer 30 is shown across the entire captured image 40. However, a part of the image inside and at the edge of the captured image 40 illustrated in FIG. 5B is a black image due to a cause such as an abnormality in the imaging device 20. That is, a part of the image of the surface 31 is missing. The missing part of the image of the surface 31 is represented as the defective portion 44. When the control unit 12 uses the captured image 40 illustrated in FIG. 5B as a determination image, there is a possibility that the defective portion 44 may be erroneously determined as a defect 36.

[0036] Also, for example, in the captured image 40 shown in FIG. 6, a portion without the wafer 30 outside the surface 31 of the wafer 30 is shown as the background portion 42. When the control unit 12 determines the pass / fail of the wafer 30 on the premise that the surface 31 is shown across the entire captured image 40, there is a possibility that the background portion 42 shown in the captured image 40 illustrated in FIG. 6 may be erroneously determined as a defect 36.

[0037] Also, for example, in the captured image 40 shown in FIG. 7, the notch 34 is shown in the end face 32 of the wafer 30. When the control unit 12 uses the captured image 40 illustrated in FIG. 7 as a determination image, there is a possibility that the notch 34 may be erroneously determined as a defect 36.

[0038] Also, in FIG. 8, photographed images 40 of the end face 32 of the wafer 30 are classified and shown as an example corresponding to an erroneous determination candidate image and an example not corresponding to an erroneous determination candidate image. As an example corresponding to an erroneous determination candidate image, an image in which the notch 34 is shown is presented. As an example not corresponding to an erroneous determination candidate image, an image in which the chipping defect 36 is shown is presented. Further, in FIG. 9, photographed images 40 of the surface 31 of the wafer 30 are classified and shown as an example corresponding to an erroneous determination candidate image and an example not corresponding to an erroneous determination candidate image. As an example corresponding to an erroneous determination candidate image, an image in which dots 38 generated by a laser marker are shown on the surface 31 of the wafer 30 is presented. As an example not corresponding to an erroneous determination candidate image, an image in which a pinhole defect 36 is shown is presented.

[0039] As described above, the photographed image 40 can be classified according to whether it corresponds to an erroneous determination candidate image. When there is a defect in at least a part of the range in which the wafer 30 is shown in the photographed image 40, the control unit 12 may determine that the photographed image 40 corresponds to an erroneous determination candidate image. Alternatively, when a predetermined part such as the notch 34 of the wafer 30 or the dot 38 of the laser marker is shown in the photographed image 40, the control unit 12 may determine that the photographed image 40 corresponds to an erroneous determination candidate image.

[0040] The control unit 12 may first exclude images in which a predetermined part such as the notch 34 or the dot 38 is shown from the photographed image 40. The control unit 12 may further exclude images including the defective part 44 or the unnecessary background part 42 from the images in which the predetermined part is not shown in the photographed image 40. That is, the determination model for the erroneous determination candidate image may be divided into a determination model for images in which a predetermined part is shown and a determination model for images in which the defective part 44 or the like is shown.

[0041] <Determination of Erroneous Determination Candidate Image> The control unit 12 determines whether the wafer 30 is qualified based on the determination image of the wafer 30. When the determination image of the wafer 30 does not show the defect 36, the control unit 12 may determine that the wafer 30 is qualified. When the determination image of the wafer 30 shows the defect 36, the control unit 12 may determine that the wafer 30 is unqualified.

[0042] The determination model for the defect 36 may be generated by training using teacher data including at least one of an image including the defect 36 and an image not including the defect 36. The determination model for the defect 36 may be generated as a pattern matching model that identifies at least one of a pattern corresponding to the defect 36 and a pattern not corresponding to the defect 36. The determination model for the defect 36 may be generated so as to be able to determine the presence or absence of the defect 36 by various algorithms not limited to these. The control unit 12 may generate the determination model for the defect 36 by itself or may acquire it from an external device.

[0043] The defect 36 may include chipping on the end face 32 of the wafer 30, as shown as an example not corresponding to the false determination candidate image in FIG. 8. The defect 36 may include pinholes on the surface 31 of the wafer 30, as shown as an example not corresponding to the false determination candidate image in FIG. 9. The defect 36 is not limited to these examples and may include various other forms such as dust or dirt attached to the surface 31 or end face 32 of the wafer 30.

[0044] As described above, the control unit 12 determines whether the wafer 30 has the defect 36 based on the determination image, and determines that the wafer 30 is unqualified when the wafer 30 has the defect 36. That is, the control unit 12 determines whether the wafer 30 is qualified based on the determination image.

[0045] When the control unit 12 determines the pass / fail of the wafer 30 using a composite determination model that combines the determination model for misjudgment candidate images and the determination model for defects 36, the composite determination model may be generated by the control unit 12 itself or acquired from an external device. The composite determination model may be generated by training, as teacher data, images corresponding to misjudgment candidate images and images that do not correspond to misjudgment candidate images and include or do not include defects 36. The composite determination model may be generated as a pattern matching model that identifies at least one of a pattern corresponding to a misjudgment candidate image or a pattern that does not correspond to a misjudgment candidate image and includes or does not include a defect 36.

[0046] <Example of flowchart of determination method> The control unit 12 of the determination device 10 may determine the pass / fail of the wafer 30 by executing a determination method including the procedure of the flowchart illustrated in FIG. 10. The determination method may be realized as a determination program to be executed by the control unit 12.

[0047] The control unit 12 acquires a determination model for misjudgment candidate images (step S1). The control unit 12 acquires the captured image 40 as a determination image from the imaging device 20 (step S2). The control unit 12 determines whether the captured image 40 corresponds to a misjudgment candidate image (step S3). When the captured image 40 does not correspond to a misjudgment candidate image (step S3: NO), the control unit 12 proceeds to the procedure of step S5. When the captured image 40 corresponds to a misjudgment candidate image (step S3: YES), the control unit 12 excludes the captured image 40 from the determination images (step S4).

[0048] The control unit 12 acquires a determination model for the defect 36 (step S5). The control unit 12 determines the pass / fail of the determination image by applying the determination image acquired in the procedures from step S1 to S4 to the determination model for the defect 36 (step S6). When the determination image is qualified, the control unit 12 determines that the wafer 30 shown in the determination image is qualified, and when the determination image is unqualified, the control unit 12 determines that the wafer 30 shown in the determination image is unqualified. After executing the procedure of step S6, the control unit 12 ends the execution of the procedure of the flowchart in FIG. 10.

[0049] In the example of the flowchart in FIG. 10, the control unit 12 uses the determination model for the false determination candidate image and the determination model for the defect 36 separately, but a composite determination model may also be used.

[0050] <Example> In the determination system 1 according to the present embodiment, an example for verifying the effect of determining whether or not it corresponds to a false determination candidate image in order to determine the pass / fail of the wafer 30 is described. In the example, the result of a human determining the pass / fail of the wafer 30 by looking at the captured image 40 is compared with the result of the control unit 12 of the determination device 10 determining the pass / fail of the wafer 30 based on the captured image. The combinations of the pass / fail determination results by a human and the pass / fail determination results by the control unit 12 are classified into four types.

[0051] The combinations in which the determination by a human and the determination by the control unit 12 match are classified into the following two types. When the determination of unqualified by a human and the determination of unqualified by the control unit 12 match for a certain wafer 30, the determination of unqualified by the control unit 12 for that wafer 30 is classified as a true positive (TP). Also, when the determination of qualified by a human and the determination of qualified by the control unit 12 match for a certain wafer 30, the determination of qualified by the control unit 12 for that wafer 30 is classified as a true negative (TN).

[0052] Combinations where the human judgment and the judgment by the control unit 12 do not match are classified into the following two types. When a human determines that a certain wafer 30 is defective and the control unit 12 determines that it is qualified, the qualified judgment by the control unit 12 for that wafer 30 is classified as a false negative (FN). Conversely, when a human determines that a certain wafer 30 is qualified and the control unit 12 determines that it is defective, the defective judgment by the control unit 12 for that wafer 30 is classified as a false positive (FP).

[0053] The judgment accuracy is calculated based on the frequencies classified into each type. The value obtained by dividing the sum of the number classified as true positive and the number classified as true negative by the total number of samples ((TP + TN) / (TP + TN + FP + FN)) is calculated as the correct answer rate. The correct answer rate represents the proportion of correct judgments. It can be said that the higher the correct answer rate, the higher the judgment accuracy.

[0054] The value obtained by dividing the number classified as true positive by the sum of the number classified as true positive and the number classified as false positive (TP / (TP + FP)) is calculated as the precision rate. The precision rate represents the proportion of samples that are actually "defective" among the samples determined to be "defective". The higher the precision rate, the lower the possibility that products are discarded wastefully.

[0055] The value obtained by dividing the number classified as true positive by the sum of the number classified as true positive and the number classified as false negative (TP / (TP + FN)) is calculated as the recall rate. The recall rate represents the proportion of samples determined to be "defective" among the samples that are actually "defective". The higher the recall rate, the lower the possibility that "defective" products leak out.

[0056] Table 1 shows the results of classifying the combinations of the judgment results when the false judgment candidate images are excluded from the judgment images by the control unit 12 of the judgment device 10 and the judgment results by humans into the above four types.

Table 1

[0057] The accuracy rate calculated based on the results shown in Table 1 was (42437 + 27) / (42437 + 1093 + 27) = 97.5%. The precision rate was 27 / (1093 + 27) = 2.4%. The recall rate was 27 / 27 = 100%.

[0058] On the other hand, as a comparative example, Table 2 shows the classification results of the combination of the determination result when the pass / fail of the wafer 30 is determined with the captured image 40 as the determination image without determining whether the captured image 40 corresponds to a false determination candidate image, and the determination result by a human, into the above four types.

Table 2

[0059] The accuracy rate calculated based on the results of the comparative example shown in Table 2 was (42437 + 27) / (42437 + 2872 + 27) = 93.7%. The precision rate was 27 / (2872 + 27) = 0.9%. The recall rate was 27 / 27 = 100%.

[0060] In the comparison between Table 1 and Table 2, by excluding the false determination candidate images from the captured image 40 to determine the pass / fail of the wafer 30 in the determination system 1 according to the present embodiment, the accuracy rate and the precision rate are increased. Therefore, by excluding the false determination candidate images from the captured image 40, the determination accuracy of the pass / fail of the wafer 30 is improved.

[0061] (Summary) As described above, the determination system 1, the determination device 10, and the determination method according to the present embodiment exclude false determination candidate images from the captured image 40 obtained by capturing at least a part of a product in order to determine the pass / fail of a product such as the wafer 30. By doing so, it becomes difficult for the defective part 44 or the background part 42 that is not the defect 36 to be erroneously determined as the defect 36. As a result, the determination accuracy of the pass / fail of a product such as the wafer 30 can be improved.

[0062] A model such as a defect 36 determination model or a composite determination model may be configured to output, for example, a result of determining whether a product such as a wafer 30 meets the shipment standard. When the product is the wafer 30, the model may be configured to output a result of determining whether the wafer 30 meets the shipment standard. The classification in this case is the simplest classification of pass or fail. The model may classify the products into a plurality of quality grades, for example. When the product is the wafer 30, the model may be configured to output a result of determining, based on the quality of the wafer 30, for example, whether the wafer 30 is a grade for use in device applications or a grade for use in monitor applications. The quality grade may be determined based on the number or size of the defects 36, or the type of the defects 36.

[0063] (Other embodiments) A manufacturing method of the wafer 30 including steps of executing the method for determining pass or fail of the wafer 30 according to this embodiment can be realized. Further, a wafer 30 determined to be qualified by executing the determination method can be realized.

[0064] Although the embodiments according to the present disclosure have been described based on the drawings and examples, it should be noted that those skilled in the art can make various modifications or alterations based on the present disclosure. Therefore, it should be noted that these modifications or alterations are included in the scope of the present disclosure. For example, functions included in each component or each step can be rearranged so as not to be logically contradictory, and a plurality of components or steps can be combined into one or divided. Although the embodiments according to the present disclosure have been described centering on the device, the embodiments according to the present disclosure can also be realized as a method including steps executed by each component of the device. The embodiments according to the present disclosure can also be realized as a method, a program, or a storage medium recording the program executed by a processor included in the device. It should be understood that these are also included in the scope of the present disclosure.

Industrial applicability

[0065] According to an embodiment of the present disclosure, the quality of the product can be improved.

Explanation of Signs

[0066] 1 Determination system 10 Determination device (12: control unit, 14: storage unit, 16: interface) 20 Imaging device 30 Wafer (31: surface, 32: end face, 34: notch, 36, 36A, 36B: defect, 38: laser marking dot) 40 Captured image (42: background part, 44: missing part)

Claims

1. Obtaining, as a determination image, a captured image obtained by photographing at least a part of a wafer with a photographing device, and using the captured image for determining whether the wafer is acceptable or not; Excluding the captured image from the determination image when the captured image corresponds to an image in which a part is missing due to the photographing device; Determining whether the wafer is acceptable or not based on the determination image; A determination method comprising the above steps.

2. The determination method according to claim 1, further comprising the step of excluding the captured image from the determination image when the captured image corresponds to at least one of an image in which there is a defect in at least a part of the range where the wafer is shown, or an image in which a predetermined part of the wafer is shown in the captured image. The determination method according to claim 1, further comprising the step of generating a model for determining whether to exclude the captured image from the determination image using teacher data including an image to be excluded from the determination image.

4. A determination program for causing a processor to execute the determination method according to any one of claims 1 to 3.

5. A determination device comprising a control unit that executes the determination method according to any one of claims 1 to 3.

6. A method for manufacturing a wafer, comprising the step of determining whether the wafer is acceptable or not by executing the determination method according to any one of claims 1 to 3.

Images