RFID Package for Tire

The RFID package for tires addresses surface-mounting issues by using laminate layers with varying dimensions or a tapered configuration, reducing seam formation and tire cracks, ensuring secure and crack-free mounting.

JP7713587B2Active Publication Date: 2025-07-25BRIDGESTONE AMERICAS TIRE OPERATIONS LLC
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Patent Information

Application Number
JP2024508652
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2021-08-30
Filing Date
2022-08-08
Publication Date
2025-07-25
Estimated Expiration
2042-08-08

AI Technical Summary

Technical Problem

Existing RFID packages for tires face issues when surface-mounted, leading to tire structure cracks during manufacturing, while embedded configurations complicate the manufacturing process and affect structural integrity.

Method used

Designing an RFID package with laminate layers having varying dimensions, such as different lengths, widths, or thicknesses, or employing a tapered configuration, to minimize seam formation and reduce the risk of tire cracks during manufacturing.

Benefits of technology

The proposed RFID package design reduces the likelihood of tire cracks and ensures secure mounting by minimizing seam formation between laminate layers and the inner liner, maintaining structural integrity during tire manufacturing.

✦ Generated by Eureka AI based on patent content.

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Abstract

The RFID package for a tire includes a first laminate layer having a first length, a first width, and a first thickness. The RFID package further includes a second laminate layer having a second length, a second width, and a second thickness. The RFID chip is disposed between the first laminate layer and the second laminate layer. At least one of the second length, the second width, and the second thickness is different from the first length, the first width, and the first thickness, respectively.
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Description

Technical Field

[0001] The present disclosure relates to tires. More particularly, the present disclosure relates to RFID packages for implementation on tires.

Background Art

[0002] Known tires and tire systems incorporate electronic devices. These devices are used for various purposes such as product identification, memory retention, and tire analysis. The electronic devices are incorporated into the tire and tire system at various locations on the tire, vehicle, or associated proximity reader device. Examples of known electronic devices include RFID chips and antennas.

[0003] In the tire industry, RFID chips can be provided within a tire as part of an RFID package. Prior art FIGS. 12 and 13 show a side view and an end view, respectively, of an RFID package 1005 generally including a first laminate layer 1010 and a second laminate layer 1015 sandwiching an RFID chip 1020. The first laminate layer 1010 and the second laminate layer 1015 are substantially identical to each other and have the same length, width, and an uninform thickness. The RFID package 1005 can be implemented on a tire using an embedded configuration or a surface mount configuration. In the embedded configuration, the RFID package 1005 is disposed between the layers of the tire. In the surface mount configuration, the RFID package 1005 is disposed on the innermost or outermost part of the tire.

[0004] The method of embedding RFID in a tire can hold the RFID package more securely compared to a surface mount configuration. However, the embedding configuration may complicate the tire manufacturing process because the RFID package is added to the tire when the tire is being constructed. To add the RFID package, it is possible to cut the manufactured tire after its manufacture, but such a process may have an adverse effect on the structural integrity of the tire and is therefore undesirable. In comparison, a surface mount RFID package can be added at any point during the tire manufacturing process or even at any point after the tire has been manufactured. However, a surface mount RFID package can cause problems during manufacture because the presence of the RFID package may cause cracks in the tire structure during a particular step in the tire manufacturing process.

Summary of the Invention

Problems to be Solved by the Invention

[0005] Therefore, there is a need for an RFID package that can be surface-mounted while avoiding the above-mentioned problems related to crack formation.

[0006] In one embodiment, an RFID package for a tire includes a first laminate layer having a first length, a first width, and a first thickness. The RFID package further includes a second laminate layer having a second length, a second width, and a second thickness. The RFID chip is disposed between the first laminate layer and the second laminate layer. At least one of the second length, the second width, and the second thickness is different from the first length, the first width, and the first thickness, respectively.

[0007] In another embodiment, the RFID package for a tire includes a first laminate layer having a first central portion and a first peripheral portion. The RFID package further includes a second laminate layer having a second central portion and a second peripheral portion. The RFID chip is disposed between the first laminate layer and the second laminate layer. The first laminate layer is tapered such that the thickness of the first central portion is greater than the thickness of the first peripheral portion.

[0008] In yet another embodiment, a method of manufacturing an RFID package includes forming a first laminate layer having a first taper and forming a second laminate layer having a second taper. The method further includes providing an RFID chip between the first laminate layer and the second laminate layer. The first laminate layer is fixed to the second laminate layer.

Brief Description of the Drawings

[0009] In the accompanying drawings, structures that illustrate representative embodiments of the claimed invention are illustrated, along with the detailed description provided below. Like elements are identified by the same reference numerals. It should be understood that elements shown as a single component may be replaced by a number of components, and elements shown as a number of components may be replaced by a single component. The drawings are not to scale, and the ratios of particular elements may be exaggerated for illustration.

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DETAILED DESCRIPTION OF THE INVENTION

[0010] The following includes definitions of selected terms used in this specification. The definitions include the scope of the terms and various examples or forms of components that can be used for implementation. The examples are not intended to be limiting. Both the singular and plural forms of the terms can be within the scope of the definition.

[0011] "Axial" and "axially" refer to a direction parallel to the rotational axis of the tire.

[0012] "Circumferential" and "circumferentially" refer to a direction extending along the outer periphery of the surface of the tread that is perpendicular to the axial direction.

[0013] "Radial" and "radially" refer to a direction perpendicular to the rotational axis of the tire.

[0014] As used in this specification, "tread" refers to the portion of the tire that contacts the road or ground at normal inflation and normal load.

[0015] General tire components are described by similar terms used in the following description. However, it should be understood that, of course, since the terms have slightly different implications, those skilled in the art will not consider that any one of the following terms can simply be exchanged with another term used in the description of general tire components.

[0016] In this specification, directions are described with reference to the rotational axis of the tire. The terms "upward" and "upwardly" refer to the general direction toward the tread of the tire, and "downward" and "downwardly" refer to the general direction toward the rotational axis of the tire. Thus, when relative direction terms such as "upper" and "lower" or "top" and "bottom" are used in relation to an element, the "upper" or "top" element is spaced closer to the tread than the "lower" or "bottom" element. Additionally, when relative direction terms such as "above" or "below" are used in relation to an element, an element "above" another element is closer to the tread than the other element.

[0017] The terms "inner" and "inward" refer to the general direction towards the equatorial plane of the tire, and the terms "outer" and "outward" refer to the general direction away from the equatorial plane of the tire and towards the sidewalls of the tire. Thus, when relative directional terms such as "inner" and "outer" are used in relation to an element, the "inner" element is disposed closer to the equatorial plane of the tire than the "outer" element.

[0018] FIG. 1 is a cross-sectional view of a tire 100 having an RFID package 180 disposed therein. It is to be understood that tire 100 is merely exemplary and that RFID package 180 can be installed in any desired tire having any type of construction.

[0019] Tire 100 is mounted on a wheel 110. Tire 105 includes a circumferential tread 115 within the crown region of the tire. In the illustrated embodiment, tread 115 includes a plurality of circumferential grooves 120. Although four grooves 120 are shown, it is to be understood that any number of grooves may be used. Tread 115 may further include ribs, blocks, lugs, lateral grooves, sipes, or any other desired tread elements. The crown region of tire 105 further includes a pair of belts 125. In alternative embodiments (not shown), any number of belts or cap plies may be used.

[0020] In the illustrated embodiment, tire 105 further includes a first bead portion 130a and a second bead portion 130b. Bead portions 130a, b each include a first bead 135a and a second bead 135b, which are schematically shown in FIG. 1. Bead portions 130a, b may also include one or more bead fillers (not shown), and other known components such as abrasions, chafers, and reinforcements.

[0021] The first sidewall 140a extends between the tread 115 and the first bead portion 130a. Similarly, the second sidewall 140b extends between the tread 115 and the second bead portion 130b. The sidewalls 140a, b may include any number of reinforcements (not shown). The carcass ply 145 extends from the first bead portion 130a, through the first and second sidewalls 140a and the crown portion, to the second bead portion 130b. The inner liner 150b is disposed radially below the carcass ply 145. In alternative embodiments, any number of carcass plies may be used. In other alternative embodiments, the inner liner may be omitted.

[0022] The RFID package 180 is attached to the inner liner 150b adjacent to the second sidewall 140b. In alternative embodiments, the RFID package may be attached to the inner liner at any location on the tire. In other alternative embodiments, when the inner liner is omitted, the RFID package may be attached to the innermost surface of the tire. In another alternative embodiment, the RFID package may be attached to the outer surface of the tire. In yet another alternative embodiment, the RFID package may be attached to any desired surface of the tire, or to any desired layer of the tire, or may be located between any desired layers of the tire.

[0023] Figures 2-4 show one embodiment of an RFID package 200 that can be installed on a tire. The RFID package 200 includes a first laminate layer 205 and a second laminate layer 210. As used herein, the second laminate layer 210 refers to the layer that engages the surface of the tire. The RFID chip 215 is sandwiched between the first laminate layer 205 and the second laminate layer 210.

[0024] The first laminate layer 205 includes a first surface 220 and a second surface 225 facing opposite the first surface 220. The first and second surfaces 220, 225 each extend between a first end 230 and a second end 235 and between a first side 237 and a second side 240. The first laminate layer 205 has a length l1 measured as the distance between the first end 230 and the second end 235, a width w1 measured as the distance between the first side 237 and the second side 240, and a thickness t1 measured as the distance between the first surface 220 and the second surface 225. It should be understood that the identifiers for the length l1, width w1, and thickness t1 are provided only to facilitate the description of the RFID package 200 and in no way limit the disclosure of the laminate layer to a particular orientation. In other words, the length does not, for example, mean limiting the relevant considerations to only the longest extent of the first laminate layer. In the illustrated embodiment, the first laminate layer 205 is provided as a substantially rectangular sheet of material. In alternative embodiments, the first laminate layer may be provided in any desired shape.

[0025] The second laminate layer 210 includes a first surface 245 and a second surface 250 facing the opposite side of the first surface 245. The first and second surfaces 245, 250 each extend between a first end 255 and a second end 260 and between a first side 265 and a second side 270. The second laminate layer 210 has a length l2 measured as the distance between the first end 255 and the second end 260, a width w2 measured as the distance between the first side 265 and the second side 270, and a thickness t2 measured as the distance between the first surface 245 and the second surface 250. It should be understood that the identifiers for the length l2, width w2, and thickness t2 are provided only to facilitate the description of the RFID package 200 and in no way limit the disclosure of the laminate layer to a particular orientation. In other words, the length, for example, does not mean limiting the relevant considerations to only the longest extent of the second laminate layer. In the illustrated embodiment, the second laminate layer 210 is provided as a substantially rectangular sheet of material. In alternative embodiments, the second laminate layer may be provided in any desired shape.

[0026] As shown in FIG. 4, a portion of the first surface 220 of the first laminate layer 205 is attached to a portion of the first surface of the second laminate layer 210 to secure the RFID chip 215 therebetween. The laminate layer surfaces may be secured together using, for example, an adhesive, fusion (e.g., welding), mechanical fasteners, or any other material or process. According to one exemplary process, the laminate layer is made from uncured rubber. In this example, the uncured rubber laminate layers are pressed together mechanically and adhere by the natural tackiness of the uncured rubber.

[0027] The second laminate layer 210 is attached to the tire inner liner TI, thereby attaching the RFID package 200 to the tire. According to one embodiment, the laminate layers 205, 210, and the RFID chip 215 may be attached to the inner liner TI during the tire molding process. The laminate layers 205, 210, and the RFID chip 215 may be positioned, for example, on the inner liner TI, and when the curing bladder expands during vulcanization and the laminate and the inner liner cure together, the laminate layers 205, 210, and the RFID chip 215 are pressed against the tire inner liner TI. In an alternative embodiment, the laminate and the RFID chip may be attached to the inner liner using any desired process or at any point during the tire manufacturing process.

[0028] The length l2 and width w2 of the second laminate layer 210 are smaller than the length l1 and width w1 of the first laminate layer 205. Preferably, the length l2 of the second laminate layer 210 is in the range of 70% to 90% of the length l1 of the first laminate layer 205, and the width w2 of the second laminate layer is in the range of 50% to 70% of the width w1 of the first laminate layer 205. More preferably, the length l2 of the second laminate layer 210 is in the range of 70% to 85% of the length l1 of the first laminate layer 205, and the width w2 of the second laminate layer is in the range of 50% to 65% of the width w1 of the first laminate layer 205. Even more preferably, the length l2 of the second laminate layer 210 is in the range of 73% to 83% of the length l1 of the first laminate layer 205, and the width w2 of the second laminate layer is in the range of 53% to 65% of the width w1 of the first laminate layer 205. The thickness t1 of the first laminate layer 205 is substantially the same as the thickness t2 of the second laminate layer 210.

[0029] According to one example, the first laminate layer 205 has a length l1 of 80 mm, a width w1 of 20 mm, and a thickness t1 of 1.2 mm, while the second laminate layer 210 has a length l2 of 70 mm, a width w2 of 10 mm, and a thickness t2 of 1.2 mm. Thus, in this example, the length l2 of the second laminate layer 210 is 85% of the length l1 of the first laminate layer 205, and the width w2 of the second laminate layer 210 is 50% of the width w1 of the first laminate layer 205. In alternative embodiments, the second laminate layer may have a length or width that is any desired percentage of the length and width of the first laminate layer, respectively. This may include, for example, configurations where the length of the second laminate layer is equal to the length of the first laminate layer, or where the width of the second laminate layer is equal to the width of the first laminate layer. In other alternative embodiments, the first laminate layer and the second laminate layer may have different thicknesses.

[0030] In the RFID package 200 of FIGS. 2-4, it has been found that the use of laminate layers having different lengths or widths reduces the likelihood of cracks forming within the tire structure during the manufacturing process. In prior applications where the first laminate layer and the second laminate layer have the same dimensions, it has been found that the laminate layer cures completely before the seam between the laminate layer and the inner liner disappears because the laminate layer and the inner liner cure at different rates. In contrast, it has been found that by providing the RFID package 200 described above in which the first laminate layer 205 and the second laminate layer 210 have the relative lengths and widths described above, the seam between the laminate layer and the inner liner can be reduced. By reducing the seam, a robust mounting configuration is still provided that minimizes the risk of the RFID package 200 separating from the tire structure, while reducing the occurrence of cracks formed within the tire structure during manufacturing.

[0031] Figures 5 to 7 show alternative embodiments of an RFID package 400 that can be installed on a tire. The RFID package 400 includes a first laminate layer 405 and a second laminate layer 410. As used herein, the second laminate layer 410 refers to the layer that engages the surface of the tire. The RFID chip 415 is sandwiched between the first laminate layer 405 and the second laminate layer 410.

[0032] The first laminate layer 405 includes a first surface 420 and a second surface 425 facing the opposite side of the first surface 420. The first and second surfaces 420, 425 each extend between a first end 430 and a second end 435, and between a first side 437 and a second side 440. The first laminate layer 405 has a length l3 measured as the distance between the first end 430 and the second end 435, a width w3 measured as the distance between the first side 437 and the second side 440, and a thickness t3 measured as the distance between the first surface 420 and the second surface 425. The identifiers of the length l3, width w3, and thickness t3 are provided only to facilitate the description of the RFID package 400, and it should be understood that they in no way limit the disclosure of the laminate layer 405 to a particular orientation. In other words, the length does not mean, for example, limiting the relevant considerations to only the longest extent of the first laminate layer. In the illustrated embodiment, the first laminate layer 405 is provided as a substantially rectangular sheet of material. In alternative embodiments, the first laminate layer may be provided in any desired shape.

[0033] The second laminate layer 410 includes a first surface 445 and a second surface 450 facing opposite the first surface 445. The first and second surfaces 445, 450 each extend between a first end 455 and a second end 460 and between a first side 465 and a second side 470. The second laminate layer 410 has a length l4 measured as the distance between the first end 455 and the second end 460, a width w4 measured as the distance between the first side 465 and the second side 470, and a thickness t4 measured as the distance between the first surface 445 and the second surface 450. It should be understood that the identifiers for the length l4, width w4, and thickness t4 are provided only to facilitate the description of the RFID package 400 and in no way limit the disclosure of the laminate layer to a particular orientation. In other words, the length does not, for example, mean limiting the relevant considerations to only the longest extent of the second laminate layer. In the illustrated embodiment, the second laminate layer 410 is provided as a substantially rectangular sheet of material. In alternative embodiments, the second laminate layer may be provided in any desired shape.

[0034] As shown in FIG. 7, a portion of the first surface 420 of the first laminate layer 405 is attached to a portion of the first surface of the second laminate layer 410 to secure the RFID chip 415 therebetween. The laminate layer surfaces may be secured together using, for example, adhesives, fusing (e.g., welding), mechanical fasteners, or any other material or process. According to one exemplary process, the laminate layers are made from uncured rubber. In this example, the uncured rubber laminate layers are pressed together mechanically and adhere due to the natural tackiness of the uncured rubber. The second laminate layer 410 is attached to the tire inner liner TI, thereby attaching the RFID package 400 to the tire. According to one embodiment, the laminate layers 405, 410, and the RFID chip 415 may be attached to the inner liner TI during the tire molding process. The laminate layers 405, 410, and the RFID chip 415 may be positioned, for example, on the inner liner TI, and when the curing bladder expands during vulcanization and the laminate and the inner liner cure together, the laminate layers 405, 410, and the RFID chip 415 are pressed against the tire inner liner TI. In an alternative embodiment, the laminate and the RFID chip may be attached to the inner liner using any desired process or at any point during the tire manufacturing process.

[0035] The thickness t4 of the second laminate layer 410 is smaller than the thickness t3 of the first laminate layer 405. Preferably, the thickness t4 of the second laminate 410 layer is 50-75% of the thickness t3 of the first laminate layer 405. More preferably, the thickness t4 of the second laminate layer 410 is 55-70% of the thickness t3 of the first laminate layer 405. Even more preferably, the thickness t4 of the second laminate 410 layer is 60-67% of the thickness t3 of the first laminate layer 405. The length l3 and width w3 of the first laminate layer 405 are substantially the same as the length l4 and width w4 of the second laminate layer 410.

[0036] According to one example, the first laminate layer 405 has a length l3 of 80 mm, a width w3 of 20 mm, and a thickness t3 of 1.2 mm, while the second laminate layer 410 has a length l4 of 80 mm, a width w4 of 20 mm, and a thickness t4 of 0.6 mm. Thus, the thickness t4 of the second laminate layer 410 is 50% of the thickness t3 of the first laminate layer 405. In an alternative embodiment, the second laminate layer may have a thickness that is any desired percentage of the thickness of the first laminate layer. In other alternative embodiments, the first laminate layer and the second laminate layer may have different lengths or widths.

[0037] In the RFID package 400 of FIGS. 5-7, it has been found that the use of laminate layers having different thicknesses reduces the likelihood of cracks forming within the tire structure during the manufacturing process. In prior applications where the first laminate layer and the second laminate layer have the same dimensions, it has been found that the laminate layer cures completely before the seam between the laminate layer and the inner liner disappears because the laminate layer and the inner liner cure at different rates. In contrast, by providing the RFID package 400 described above in which the first laminate layer 405 and the second laminate layer 410 have the relative thicknesses described above, it has been found that the seam between the laminate layer and the inner liner can be reduced. The reduction of the seam still provides a robust mounting configuration that minimizes the risk of the RFID package 400 separating from the tire structure while reducing the occurrence of cracks formed within the tire structure during manufacturing.

[0038] FIGS. 8-10 show another alternative embodiment of an RFID package 600 that can be installed on a tire. The RFID package 600 includes a first laminate layer 605 and a second laminate layer 610. As used herein, the second laminate layer 610 refers to the layer that engages the surface of the tire. The RFID chip 615 is sandwiched between the first laminate layer 605 and the second laminate layer 610.

[0039] The first laminate layer 605 includes a first surface 620 and a second surface 625 facing opposite the first surface 620. The first and second surfaces 620, 625 each extend between a first end 630 and a second end 635 and between a first side 637 and a second side 640. The first laminate layer 605 has a length l5 measured as the distance between the first end 630 and the second end 635, a width w5 measured as the distance between the first side 637 and the second side 640, and a thickness t5 measured as the distance between the first surface 620 and the second surface 625. It should be understood that the identifiers for the length l5, width w5, and thickness t5 are provided only to facilitate the description of the RFID package 600 and in no way limit the disclosure of the laminate layer to a particular orientation. In other words, the length does not, for example, mean limiting the relevant considerations to only the longest extent of the first laminate layer. In the illustrated embodiment, the first laminate layer 605 is provided as a substantially rectangular sheet of material. In alternative embodiments, the first laminate layer may be provided in any desired shape.

[0040] The second laminate layer 610 includes a first surface 645 and a second surface 650 facing opposite the first surface 645. The first and second surfaces 645, 650 each extend between a first end 655 and a second end 660 and between a first side 665 and a second side 670. The second laminate layer 610 has a length l6 measured as the distance between the first end 655 and the second end 660, a width w6 measured as the distance between the first side 665 and the second side 670, and a thickness t6 measured as the distance between the first surface 645 and the second surface 650. It should be understood that the identifiers for the length l6, width w6, and thickness t6 are provided only to facilitate the description of the RFID package 600 and in no way limit the disclosure of the laminate layer to a particular orientation. In other words, the length does not, for example, mean limiting the relevant considerations to only the longest extent of the second laminate layer. In the illustrated embodiment, the second laminate layer 210 is provided as a substantially rectangular sheet of material. In alternative embodiments, the second laminate layer may be provided in any desired shape.

[0041] As shown in FIG. 10, a portion of the first surface 620 of the first laminate layer 605 is attached to a portion of the first surface 645 of the second laminate layer 610 to secure the RFID chip 615 therebetween. The laminate layer surfaces may be secured together using, for example, adhesives, fusing (e.g., welding), mechanical fasteners, or any other material or process. According to one exemplary process, the laminate layers are made from uncured rubber. In this example, the uncured rubber laminate layers are pressed together mechanically and adhere by the natural tackiness of the uncured rubber. The second laminate layer 610 is attached to the tire innerliner TI, thereby attaching the RFID package 600 to the tire. According to one embodiment, the laminate layers 605, 610, and the RFID chip 615 may be affixed to the innerliner TI during the tire molding process. The laminate layers 605, 610, and the RFID chip 615 may be positioned, for example, on the innerliner TI, and when the curing bladder expands during vulcanization and the laminate and the innerliner cure together, the laminate layers 605, 610, and the RFID chip 615 are pressed against the tire innerliner TI. In an alternative embodiment, the laminate and the RFID chip may be affixed to the innerliner using any desired process or at any point during the tire manufacturing process.

[0042] The dimensions of the first laminate layer 605 and the second laminate layer 610 are substantially equal to each other. The first laminate layer 605 and the second laminate layer 610 each have a tapered thickness. As used herein, tapered means that starting from the central portion C on the laminate layer and moving outwardly towards the peripheral portion P (i.e., the first and second ends, and the first and second edges), the thickness of the laminate layer gradually decreases. The taper may be formed by a roller die or a skive knife.

[0043] In the illustrated embodiment, the taper is arranged such that the first surface 625 of the first laminate layer 605 and the first surface 650 of the second laminate layer 610 are arcuate, and each of the laminate layers 605, 610 is configured to have a substantially semi-circular cross-section. Additionally, in the illustrated embodiment, the taper is arranged to extend along both the length and width of each of the laminate layers 605, 610. Further, in the illustrated embodiment, the taper is arranged to extend continuously from the central portion C to both the ends and sides of each of the laminate layers 605, 610.

[0044] In an alternative embodiment, the taper may be arranged to provide any desired cross-section to the laminate layer. For example, the taper may be arranged such that each laminate layer has a substantially triangular cross-section. In other alternative embodiments, the first laminate layer may have a taper different from the taper of the second laminate layer. Still in other alternative embodiments, the taper may be arranged such that the laminate layer is tapered only along its length but not along its width, or the laminate layer is tapered only along its width but not along its length. Still further in other alternative embodiments, the taper may be arranged not to extend continuously from the center point to the end or side of the laminate layer. For example, the taper may be arranged to start from an intermediate point between the center point and the edge or side. As another example, the taper may be arranged to extend only along a portion of the distance between the center point and the edge or side.

[0045] In the RFID packages 600 of FIGS. 8-10, it has been found that the use of a laminate layer having a tapered configuration reduces the possibility of cracks forming within the tire structure during the manufacturing process. In prior applications where the first and second laminate layers have the same dimensions, it has been found that the laminate layer cures completely before the seam between the laminate layer and the inner liner disappears because the laminate layer and the inner liner cure at different rates. In contrast, by providing the RFID package 600 described above in which the laminate layers 605, 610 are tapered as described above, it has been found that the seam between the laminate layer and the inner liner can be reduced. By reducing the seam, a robust mounting configuration is still provided that minimizes the risk of the RFID package 600 separating from the tire structure while reducing the occurrence of cracks formed within the tire structure during manufacturing.

[0046] Individual embodiments and variations are shown and described in FIGS. 2-10, but the disclosed features are not limited to each embodiment. Instead, various features can be combined within the RFID package as desired. For example, a single laminate layer of the RFID package (i.e., one of the first or second laminate layers) may include both a tapered feature as shown in FIGS. 8-10 and a reduced thickness feature as shown in FIGS. 5-7. As another example, one laminate layer may have only the reduced thickness feature as shown in FIGS. 5-7, and another laminate layer of the same RFID package may have only the tapered feature as shown in FIGS. 8-10.

[0047] FIG. 11 shows an exemplary method of manufacturing an RFID package. At 1100, a first laminate layer is provided. At 1110, a second laminate layer is provided. According to one example, forming the first laminate layer or the second laminate layer includes pressing a laminate layer of a desired size from a raw piece of material. In an alternative embodiment, the first laminate layer or the second laminate layer may be formed by any desired process. At 1120, a taper is provided on the first laminate layer. At 1130, a taper is provided on the second laminate layer. The taper may be provided by any desired process, including, for example, extrusion with a fixed or rotating die, or skiving with an angled knife. At 1140, an RFID chip is provided between the first laminate layer and the second laminate layer. At 1150, the first laminate layer and the second laminate layer are attached to each other to secure the RFID chip therein. The first laminate layer and the second laminate layer may be attached using, for example, an adhesive, fusion (e.g., welding), or mechanical fasteners, or any other material or process. According to one exemplary process, the laminate layer is made from uncured rubber. In this example, the uncured rubber laminate layers are mechanically pressed together and adhered by the natural tackiness of the uncured rubber.

[0048] In alternative embodiments, the foregoing steps may be performed in an order other than that specifically described. In other alternative embodiments, the method may include more or fewer steps. For example, an extrusion process may be used to combine the step of forming the laminate layer and the step of providing a taper on the laminate layer, whereby the material is extruded through a die having a tapered shape.

[0049] Figures 14 and 15 show still another embodiment of the RFID package 200'. The RFID package 200' of FIGS. 14 and 15, and the RFID package 200 of FIGS. 2-4 are substantially identical except for any differences described herein. For this reason, like features will be identified by like numerals with a dash (' ) appended.

[0050] The RFID package 200' includes a first laminate layer 205' and a second laminate layer 210'. The RFID chip 215' is sandwiched between the first laminate layer 205' and the second laminate layer 210'. The length l 1’ and width w 1’ of the first laminate layer 205' are 2’ less than the length l 2’ and width w of the second laminate layer 210'.

[0051] Similar to the configuration of the RFID package 200 of FIGS. 2-4, the configuration of the RFID package 200' of FIGS. 14 and 15 can reduce the seam between the laminate layers 205', 210' and the inner liner of the tire in which the RFID package 200' is used. As explained above, this reduces the occurrence of cracks formed within the tire structure during manufacture.

[0052] Similar to the embodiment shown in FIGS. 2-4, the bottom surface of the first laminate layer 205 is attached to the top surface of the second laminate layer 210' to secure the RFID chip 215' therebetween. The second laminate layer 210' is attached to the tire inner liner, thereby attaching the RFID package 200' to the tire.

[0053] Figures 16 and 17 show alternative embodiments of an RFID package 700 that can be installed on a tire. The RFID package 700 includes a first laminate layer 705 and a second laminate layer 710. As used herein, the second laminate layer 710 refers to the layer that engages the surface of the tire. The RFID chip 715 is sandwiched between the first laminate layer 705 and the second laminate layer 710.

[0054] The first laminate layer 705 includes a first surface 720 and a second surface 725 facing the opposite side of the first surface 720. The first and second surfaces 720, 725 each extend between a first end 730 and a second end 735, and between a first side 737 and a second side 740. The first laminate layer 705 has a length l7 measured as the distance between the first end 730 and the second end 735, a width w7 measured as the distance between the first side 737 and the second side 740, and a thickness t7 measured as the distance between the first surface 720 and the second surface 725. It should be understood that the identifiers for the length l7, width w7, and thickness t7 are provided only to facilitate the description of the RFID package 700 and in no way limit the disclosure of the laminate layer 705 to a particular orientation. In other words, the length does not mean, for example, limiting the relevant considerations to only the longest extent of the first laminate layer. In the illustrated embodiment, the first laminate layer 705 is provided as a substantially rectangular sheet of material. In alternative embodiments, the first laminate layer may be provided in any desired shape.

[0055] The second laminate layer 710 includes a first surface 745 and a second surface 750 facing opposite the first surface 745. The first and second surfaces 745, 750 each extend between a first end 755 and a second end 760 and between a first side 765 and a second side 770. The second laminate layer 710 has a length l8 measured as the distance between the first end 755 and the second end 760, a width w8 measured as the distance between the first side 765 and the second side 770, and a thickness t8 measured as the distance between the first surface 745 and the second surface 750. It should be understood that the identifiers for the length l8, width w8, and thickness t8 are provided only to facilitate the description of the RFID package 700 and in no way limit the disclosure of the laminate layer to a particular orientation. In other words, the length does not, for example, mean limiting the relevant considerations to only the longest extent of the second laminate layer. In the illustrated embodiment, the second laminate layer 710 is provided as a substantially rectangular sheet of material. In alternative embodiments, the second laminate layer may be provided in any desired shape.

[0056] The dimensions of the first laminate layer 705 are substantially the same as the dimensions of the second laminate layer 710. In other words, the length l7, width w7, and thickness t7 of the first laminate layer 700 are substantially the same as the length l8, width w8, and thickness t8 of the second laminate layer 710, respectively. As shown in FIG. 16, the first laminate layer 705 is offset from the second laminate layer 710 by a distance d1 along the length of the RFID package 700. In the illustrated embodiment, the first and second laminate layers 705, 710 are offset from each other along the length of the RFID package 700 but not along the width of the RFID package 700 as seen in FIG. 17. In alternative embodiments, the first and second laminate layers are offset from each other along the width of the RFID package but not along the length of the RFID package. In other alternative embodiments, the first and second laminate layers are offset from each other along both the length and width of the RFID package.

[0057] In the RFID package 700 of FIGS. 16 and 17, it has been found that by shifting the laminate layers relative to each other, the possibility of cracks forming in the tire structure during the manufacturing process can be reduced. Specifically, this configuration has been found to be able to reduce the seam between the laminate layer and the inner liner of the tire. As described above, this reduction in the seam reduces the occurrence of cracks formed in the tire structure during manufacturing while still providing a robust mounting configuration that minimizes the risk of the RFID package 700 separating from the tire structure.

[0058] As used in this specification or the claims, the terms "includes" or "including" are intended to be inclusive, in the same sense as the term "comprising" when used as a transitional phrase in a claim. Further, where the term "or" is used (e.g., A or B), it is intended to mean "A or B, or both." Where the Applicants intend to indicate "only A or B but not both," the term "only A or B but not both" is used. Accordingly, the use of the term "or" in this specification is inclusive and not exclusive. See Bryan A. Garner, A Dictionary of Modern Legal Usage 624 (2d Ed. 1995). Also, the terms "in" or "into" are intended to additionally mean "on" or "onto" as used in this specification or the claims. Further, the term "connect" as used in this specification or the claims is intended to mean not only "directly connected to" but also "indirectly connected to" such as through another component.

[0059] While this application has been illustrated by the description of its embodiments and those embodiments have been described in considerable detail, it is not the intention of the applicants to limit the scope of the appended claims to such detail or to any form of limitation. Additional advantages and improvements will be readily apparent to those skilled in the art. Accordingly, the application in its broader aspects is not limited to the specific details, representative apparatus and methods, and illustrative examples shown and described. For this reason, departures may be made from such details without departing from the spirit or scope of the general inventive concept of the applicant.

Claims

**Claim 1** An RFID package for a tire, comprising: a first laminate layer having a first length, a first width, and a first thickness; a second laminate layer having a second length, a second width, and a second thickness; an RFID chip disposed between the first laminate layer and the second laminate layer; wherein the first laminate layer is offset from the second laminate layer along at least one of the length and the width of the RFID package; wherein the second thickness is equal to the first thickness. An RFID package. **Claim 2** The RFID package according to claim 1, wherein the second length and the second width are respectively equal to the first length and the first width. **Claim 3** The RFID package according to claim 1, wherein the first laminate layer is offset from the second laminate layer only along the length of the RFID package. **Claim 4** The RFID package according to claim 1, wherein the first laminate layer is offset from the second laminate layer only along the width of the RFID package.

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