Sensor element and image display device including the same

Abstract

To provide a sensor device having improved reliability and efficiency of signal transmission and reception, and an image display device including the sensor device.SOLUTION: A sensor device and an image display device including the same are provided. The sensor device includes touch sensing electrodes, traces extending from the touch sensing electrodes, touch sensor pads connected to the traces, an antenna unit disposed adjacent to the touch sensing electrodes and including a radiator, a transmission line connected to the radiator, and ground lines extending around the transmission line, and antenna pads forming a pad row together with the touch sensor pads, and including a signal pad connected to the transmission line and ground pads connected to the ground lines.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a sensor element and an image display device including the same, and more particularly, to a sensor element including sensing electrodes and pads, and an image display device including the same.

Background Art

[0002] In recent years, with the progress of the information society, wireless communication technologies such as Wi-Fi and Bluetooth (registered trademark) have been combined with image display devices and realized, for example, in the form of smartphones. In this case, an antenna is combined with the image display device, and a communication function can be executed.

[0003] In addition, with the development of mobile communication technologies, for example, an antenna for performing communication in a high-frequency or ultra-high-frequency band corresponding to 3G to 5G or higher can be combined with the image display device.

[0004] On the other hand, an electronic device that realizes both an image display function and an information input function has been developed by combining a touch panel or a touch sensor, which is an input device for selecting the instruction content displayed on the screen with a human hand or object and inputting a user's command, with an image display device. For example, as shown in Patent Document 1, a touch screen panel in which a touch sensor is combined with various image display devices has been developed.

[0005] When an antenna structure is arranged together with a touch sensor, signal interference may occur between the antenna and the touch sensing electrode. In addition, a separated circuit connection structure (for example, a plurality of circuit boards) is required to supply power to the antenna structure and the touch sensor, respectively.

[0006] For example, Patent Document 2 discloses an antenna structure incorporated in a portable terminal, but does not consider compatibility with other electrical elements such as a touch sensor.

Prior Art Documents

Patent Document

[0007]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0008] One problem of the present invention is to provide a sensor element having improved reliability and efficiency in signal transmission and reception.

[0009] One problem of the present invention is to provide an image display device including a sensor element having improved reliability and efficiency in signal transmission and reception.

Means for Solving the Problems

[0010] 1. A sensor element including a touch sensing electrode, a trace extending from the touch sensing electrode, a touch sensor pad connected to the trace, an antenna unit disposed adjacent to the touch sensing electrode and including a radiator, a transmission line connected to the radiator, and a ground line extending around the transmission line, and an antenna pad forming a pad row together with the touch sensor pad and including a signal pad connected to the transmission line and a ground pad connected to the ground line.

[0011] 2. The sensor element according to item 1, wherein a pair of the ground lines face each other with the transmission line therebetween.

[0012] 3. The sensor element according to item 1, wherein the transmission line and the ground line each have a polygonal line shape.

[0013] 4. The sensor element according to item 1, wherein the transmission line includes an extended line portion having an increased width at an end adjacent to the radiator.

[0014] 5. In the above item 1, the ground line includes an extended ground portion with an increased width at an end adjacent to the radiator, and the sensor element.

[0015] 6. In the above item 1, the ground pad is disposed between the signal pad and the touch sensor pad, and the sensor element.

[0016] 7. In the above item 1, a plurality of the antenna units are arranged along the row direction, and the signal pad and the ground pad are independently connected to each of the plurality of the antenna units via the transmission line and the ground line, and the sensor element.

[0017] 8. In the above item 7, at least one touch sensor pad among the touch sensor pads is disposed between the antenna pads connected to the adjacent antenna units among the plurality of the antenna units, and the sensor element.

[0018] 9. In the above item 7, the transmission line connected to each of the plurality of the antenna units has a zigzag shape and has the same length, and the sensor element.

[0019] 10. In the above item 1, the antenna pad and the touch sensor pad form a single pad row on the same layer, and the sensor element.

[0020] 11. In the above item 1, the transmission line of the antenna unit includes a first transmission line and a second transmission line that extend and are connected to the radiator in different directions from each other, and the signal pad is connected to each of the first transmission line and the second transmission line, and the sensor element.

[0021] 12. The sensor element according to item 1, further comprising an antenna driving integrated circuit that is electrically connected to the antenna unit, applies a reference potential to the ground pad, and applies a power supply signal having a potential higher than the reference potential to the signal pad.

[0022] 13. The sensor element according to item 12, further comprising a blocking pad inserted between adjacent touch sensor pads among the touch sensor pads, or a guard pad disposed at an end of the pad row.

[0023] 14. The sensor element according to item 13, further comprising a touch sensor driving integrated circuit that is electrically connected to the touch sensor pad, applies a reference potential to the blocking pad or the guard pad, and applies a touch driving signal having a potential higher than the reference potential to the touch sensor pad.

[0024] 15. The sensor element according to item 14, wherein the reference potential applied to the blocking pad or the guard pad is the same as the reference potential applied to the ground pad.

[0025] 16. The sensor element according to item 13, further comprising a blocking line extending between adjacent traces among the traces from the blocking pad.

[0026] 17. The sensor element according to item 13, further comprising a loop-shaped guard line extending from the guard pad and surrounding the periphery of the touch sensing electrode.

[0027] 18. An image display device including a display panel and the sensor element according to any one of the foregoing embodiments.

Advantages of the Invention

[0028] According to an embodiment of the present invention, by arranging both a radiator and a sensing electrode in the active region of the sensor element, the space efficiency can be improved. Further, by arranging both a touch sensor pad and an antenna pad in the bonding region, power supply / signal transmission can be performed by one circuit board.

[0029] In an exemplary embodiment, the antenna unit includes a transmission line and a ground line, and the antenna pad can include an antenna signal pad connected to the antenna unit via the transmission line and an antenna ground pad connected to the ground line. By arranging the antenna ground pad adjacent to the touch sensor pad, interference / noise between the touch sensing signal and the antenna signal can be blocked.

[0030] Thereby, the bonding region can independently perform both driving of the touch sensor and antenna power supply using a single circuit board.

Brief Description of the Drawings

[0031]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

[0032] Embodiments of the present invention provide a sensor element including an antenna unit and a sensing electrode. Further, an image display device including the sensor element is provided.

[0033] The antenna unit may be, for example, a microstrip patch antenna fabricated in the form of a transparent film. The sensor element including the antenna unit can be applied to, for example, communication devices for mobile communication of high frequency or ultra-high frequency (e.g., 3G, 4G, 5G or higher). However, the application of the sensor element is not limited to an image display device, and it can also be applied to various structures such as vehicles, home appliances, and buildings.

[0034] Hereinafter, embodiments of the present invention will be described more specifically with reference to the drawings. However, the drawings attached to this specification illustrate preferred embodiments of the present invention and serve to further assist in understanding the technical idea of the present invention together with the detailed description of the invention. Therefore, the present invention is not construed as being limited only to the matters described in the drawings.

[0035] Terms such as "first", "second", "one side", "the other side", "one end", "the other end", "upper surface", "bottom surface", "upper part", "lower part", "column direction", "row direction", etc. used in this specification do not limit absolute positions or orders, but are used as relative meanings to distinguish different components or parts.

[0036] As used herein, the term "row direction" may correspond to the width direction parallel to the active surface or display surface of the sensor element or the image display device. The "column direction" is the longitudinal direction parallel to the active surface or display surface and may be a direction perpendicular to the row direction.

[0037] FIG. 1 is a schematic plan view showing a sensor element according to an exemplary embodiment. FIG. 2 is a schematic cross-sectional view showing the structure of a touch sensing electrode of the sensor element according to an exemplary embodiment. FIG. 2 is a cross-sectional view taken along "I-I'" of FIG. 1 in the thickness direction.

[0038] For the sake of illustration, in FIG. 1, the detailed connection form of the trace 140 is not shown.

[0039] Referring to FIGS. 1 and 2, the sensor element can include a substrate layer 100, and touch sensing electrodes 110 and 130 (hereinafter abbreviated as "sensing electrodes") and an antenna unit 200 disposed on the substrate layer 100.

[0040] The substrate layer 100 can include a support layer, an interlayer insulating layer, or a film-type substrate for forming the sensing electrodes 110 and 130 and the antenna unit 200. For example, the substrate layer 100 can also be provided as a dielectric layer of the antenna unit 200.

[0041] For example, the base material layer 100 may include a transparent resin film containing polyester resins such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, and polybutylene terephthalate; cellulose resins such as diacetyl cellulose and triacetyl cellulose; polycarbonate resins; acrylic resins such as polymethyl (meth) acrylate and polyethyl (meth) acrylate; styrene resins such as polystyrene and acrylonitrile-styrene copolymer; polyolefin resins such as polyethylene, polypropylene, polyolefins having a cyclo or norbornene structure, and ethylene-propylene copolymer; vinyl chloride resins; amide resins such as nylon and aromatic polyamide; imide resins; polyethersulfone resins; sulfone resins; polyetheretherketone resins; vulcanized polyphenylene resins; vinyl alcohol resins; vinylidene chloride resins; vinyl butyral resins; allylate resins; polyoxymethylene resins; epoxy resins; urethane or acrylic urethane resins; silicone resins, etc. These can be used alone or in combination of two or more.

[0042] In some embodiments, the base material layer 100 may include an adhesive film such as an Optically Clear Adhesive (OCA) or an Optically Clear Resin (OCR).

[0043] In some embodiments, the base material layer 100 may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, and glass.

[0044] In one embodiment, the base material layer 100 can be provided as substantially a single layer.

[0045] In one embodiment, the base material layer 100 can also include a multi-layer structure of at least two layers or more respectively. For example, the base material layer 100 can include a lower base material and a dielectric layer, and can also include an adhesive layer between the lower base material and the dielectric layer.

[0046] The base material layer 100 forms the impedance or inductance for the antenna unit 200, and can adjust the frequency band in which the antenna unit 200 can be driven or sensed. In some embodiments, the dielectric constant of the base material layer 100 can be adjusted in the range of about 1.5 to 12. When the dielectric constant exceeds about 12, the driving frequency may decrease too much, and it may not be possible to realize driving in the high-frequency band.

[0047] In one embodiment, a ground layer (not shown) can be disposed under the bottom surface of the base material layer 100.

[0048] In one embodiment, the conductive member of the image display device or display panel to which the sensor element is applied can be provided by the ground layer.

[0049] For example, the conductive member can include electrodes or wirings such as gate electrodes, source / drain electrodes, pixel electrodes, common electrodes, data lines, scan lines, etc. included in a thin film transistor (TFT) array panel.

[0050] In one embodiment, sensor members such as SUS plates and digitizers disposed on the back surface of the image display device, and metallic members such as heat dissipation sheets can also be provided by the ground layer.

[0051] The upper surface of the base material layer 100 can include an active area (AA) and a peripheral area (PA) around the active area (AA). The sensing electrodes 110, 130 and the antenna unit 200 can be arranged on the active area (AA) of the base material layer 100. According to an exemplary embodiment, the sensing electrodes 110, 130 and the antenna unit 200 can be disposed at the same level on the upper surface of the base material layer 100.

[0052] The sensing electrodes 110 and 130 can be disposed on the upper surface of the base layer 100 in the active region (AA) portion. When a user's touch is input on the active region (AA), a change in capacitance can occur due to the sensing electrodes 110 and 130. Thereby, a physical touch can be converted into an electrical signal to perform a predetermined sensing function.

[0053] The sensing electrodes 110 and 130 can include a first sensing electrode 110 and a second sensing electrode 130. The first sensing electrode 110 and the second sensing electrode 130 can be arranged in a direction intersecting each other. The first sensing electrode 110 and the second sensing electrode 130 can be located on the same layer or at the same level on the upper surface of the base layer 100.

[0054] For example, the first sensing electrode 110 can be arranged along the column direction (e.g., the Y direction). The first sensing electrode 110 can be connected along the column direction via the merging portion 115. The merging portion 115 is integrally connected to the first sensing electrode 110 and can be provided as a substantially single member.

[0055] By connecting a plurality of the first sensing electrodes 110 by the merging portion 115, a sensing channel column extending in the column direction can be defined. Also, a plurality of the sensing channel columns can be arranged in the row direction (e.g., the X direction).

[0056] The second sensing electrode 130 can be arranged along the row direction. Each of the second sensing electrodes 130 can have a pattern shape of separated islands. The second sensing electrodes 130 adjacent to each other in the row direction can be electrically connected to each other by the bridge electrode 135.

[0057] For example, a pair of second sensing electrodes 130 adjacent to each other with a merging portion 115 included in the sensing channel column therebetween can be electrically connected to each other by a bridge electrode 135. Thereby, a sensing channel row can be defined by a plurality of the second sensing electrodes 130 and bridge electrodes 135 connected in the row direction. Further, a plurality of the sensing channel rows can be arranged along the column direction.

[0058] As shown in FIG. 2, an interlayer insulating layer 120 covering the first and second sensing electrodes 110 and 130 is formed, and the bridge electrode 135 can penetrate the interlayer insulating layer 120 to connect adjacent second sensing electrodes 130.

[0059] In some embodiments, a protective layer 190 covering the bridge electrode 135 can be formed on the interlayer insulating layer 120. The interlayer insulating layer 120 and the protective layer 190 include the resinous material or inorganic insulating material described above and can cover both the sensing electrodes 110 and 130 and the antenna unit 200. The interlayer insulating layer 120 and the protective layer 190 can be removed in the bonding region (BA) to expose the pads.

[0060] In FIG. 1, each of the sensing electrodes 110 and 130 is shown as having a rhombic pattern shape, but the shape of the sensing electrodes 110 and 130 can be appropriately changed in consideration of the pattern density, the compatibility with the optical characteristics of the image display device, the arrangement of the antenna unit 200, and the like. For example, the sensing electrodes 110 and 130 may be formed to have a wavy frame.

[0061] In FIG. 1, it is shown that the sensing electrodes in the column direction are integrally connected by a merging portion and the sensing electrodes in the row direction are connected by a bridge electrode, but the column direction and the row direction described above are used relatively to indicate two different intersecting directions and do not limit a specific direction.

[0062] Also, in FIG. 1, for the sake of explanation, only a part of the number of sensing channel rows and sensing channel columns, and the number of sensing electrodes included therein is shown, and it can be extended according to the area of the active region (AA).

[0063] The region excluding the active region (AA) on the upper surface of the base material layer 100 can be defined as a peripheral region (PA). The peripheral region (PA) can be defined as a region that at least partially surrounds the active region (AA). The peripheral region (PA) can include the bezel region of the image display device and can include a bonding region (BA) where pads are arranged. The active region (AA) can overlap with the display region of the image display device.

[0064] The sensor element can further include traces 140 and touch sensor pads 150.

[0065] The traces 140 can branch from each sensing channel row and sensing channel column and extend on the peripheral region (PA). The trace 140 can include a first trace 142 branching from the sensing channel column and a second trace 144 branching from the sensing channel row. The trace 140 can include a conductive material and / or a stacked structure substantially the same as or similar to the sensing electrodes 110 and 130.

[0066] In some embodiments, the second trace 144 can be arranged in a double-routing manner. The second trace 144 can be alternately distributed on both sides of the peripheral region (PA) in the row direction.

[0067] For example, the second trace 144 can be alternately arranged on both sides along the column direction. The second trace 144 can branch from one end of one of the sensing channel rows among the sensing channel rows, and the second trace 144 can branch from the other end of the sensing channel row adjacent to the one sensing channel row.

[0068] With the double-routing array described above, it is possible to sufficiently secure the area of the active region (AA) while reducing the area of the peripheral region (PA) on both sides. In addition, the variation in the length of the second trace 144 can be reduced to improve the resistance / sensing uniformity. Furthermore, the conductive lines can be distributed on both sides to uniformly disperse the stress caused by the folding of the sensor element.

[0069] In some embodiments, the first traces 142 can branch from one end of the sensing channel row adjacent to the bonding region (BA) respectively. Thereby, the length of the first trace 142 can be shortened to improve the sensing / signal transmission speed.

[0070] In one embodiment, a part of the first trace 142 can also branch from the other end of the sensing channel row and extend to the bonding region (BA).

[0071] As shown in FIGS. 1 and 2, the sensing electrodes 110 and 130 can be arranged by the mutual capacitance method.

[0072] In some embodiments, the sensing electrodes 110 and 130 can also be arranged by the self-capacitance method. In this case, each of the sensing electrodes 110 and 130 can have an independent island pattern shape, and the traces 140 can branch from the sensing electrodes 110 and 130 having the island pattern shape respectively. Also, the merging portion 115 and the bridge electrode 135 may be omitted.

[0073] The traces 140 can extend on the peripheral region (PA) and converge in the bonding region (BA). A touch sensor pad 150 connected to the end portion of the trace 140 can be arranged in the bonding region (BA).

[0074] The touch sensor pad 150 can include a first touch sensor pad 152 electrically connected to each of the sensing channel columns via a first trace 142, and a second touch sensor pad 154 electrically connected to each of the sensing channel rows via a second trace 144.

[0075] In an exemplary embodiment, the touch sensor pad 150 can further include a blocking pad 151 and a guard pad 153. The blocking pad 151 and the guard pad 153 may not be electrically / physically connected to the trace 140.

[0076] For the sake of illustration, in FIG. 1, it is shown that the blocking pad 151 and the guard pad 153 are both included in the touch sensor pad 150. However, the blocking pad 151 and the guard pad 153 are arranged independently without being connected to the touch sensing electrodes 110, 130 and the first and second touch sensor pads 152, 154, and can be included as a configuration to enhance the reliability of touch sensing / driving.

[0077] The blocking pad 151 can be disposed between adjacent first touch sensor pads 152 and second touch sensor pads 154. For example, a plurality of first touch sensor pads 152 can be arranged in the row direction to form a first touch pad row, and a plurality of second touch sensor pads 154 can be arranged in the row direction to form a second touch pad row. The blocking pad 151 can be inserted between the first touch pad row and the second touch pad row.

[0078] The blocking pad 151 improves the independence of current and signals to the sensing channel rows and columns, and can prevent the mutual interference between the driving current and the received current.

[0079] The guard pad 153 can be arranged at the end of the pad row arranged in the bonding region (BA). For example, the guard pad 153 can be the outermost pad included in the pad row.

[0080] In some embodiments, the guard pad 153 can be arranged at both ends of the pad row.

[0081] According to an exemplary embodiment, a blocking line 141 and a guard line 143 can be connected to each of the blocking pad 151 and the guard pad 153. The blocking line 141 and the guard line 143 can each extend from the blocking pad 151 and the guard pad 153 within the peripheral region (PA).

[0082] As shown in FIG. 1, the blocking line 141 can divide a first region (I) where the first trace 142 extends in the row direction and a second region (II) where the second trace 144 extends in the row direction. The blocking line 141 prevents signal collision between the first trace 142 and the second trace 144 and can prevent mutual interference between the drive current and the reception current.

[0083] The guard line 143 can extend so as to at least partially surround the active region (AA). For example, the guard line 143 can continuously extend between the guard pads 153 arranged at both ends of the pad row to form a loop. Thereby, the mutual interference between the touch signal and the external noise in the active region (AA) can be overall reduced / blocked.

[0084] The antenna unit 200 can include a radiator 210, a transmission line 220, and a ground line 230.

[0085] For example, the radiator 210 can have a polygonal plate shape.

[0086] For example, the transmission line 220 can have a width smaller than the width of the radiator 210 and can be connected to one end or one side of the radiator 210. The radiator 210 and the transmission line 220 can be formed as a single member integrally connected to each other.

[0087] The target resonance frequency of the antenna unit 200 can be adjusted according to the shape and size of the radiator 210. For example, the radiator 210 can be designed to be radiable in the 3G, 4G, 5G or higher frequency / ultra-high frequency bands. For example, the radiator 210 can realize radiation bands in frequency bands of about 0.5 GHz or higher, about 1 GHz or higher, about 10 GHz or higher, about 20 GHz or higher, about 30 GHz or higher, about 40 GHz or higher.

[0088] The ground line 230 can be arranged around the transmission line 220. For example, a pair of ground lines 230 can be arranged facing each other with the transmission line 220 in between. The ground line 230 can be physically and electrically separated from the radiator 210 and the transmission line 220.

[0089] The antenna pad 250 can be arranged together with the touch sensor pad 150 within the bonding area (BA). An antenna feeding / driving signal for the antenna unit 200 or the radiator 210 can be transmitted from the antenna pad 250 to the transmission line 220.

[0090] According to an exemplary embodiment, the touch sensor pad 150 and the antenna pad 250 can form a single pad row at one end of the sensor element. The antenna pad 250 can include a signal pad 252 and a ground pad 254.

[0091] The connection / arrangement structure of the antenna pad 250 and the antenna unit 200 will be described in more detail in FIGS. 3 to 5.

[0092] The sensing electrodes 110, 130, the trace 140, and / or the antenna unit 200 can include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), or an alloy containing at least one of these. These can be used alone or in combination of two or more.

[0093] In one embodiment, the sensing electrodes 110, 130, the trace 140, and / or the antenna unit 200 can include silver (Ag) or a silver alloy (e.g., silver-palladium-copper (APC) alloy), or copper (Cu) or a copper alloy (e.g., copper-calcium (CuCa) alloy) in order to achieve low resistance and a fine line width.

[0094] In some embodiments, the sensing electrodes 110, 130, the trace 140, and / or the antenna unit 200 can also include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (ITZO), zinc oxide (ZnOx).

[0095] In some embodiments, the sensing electrodes 110, 130, the trace 140, and / or the antenna unit 200 can include a laminated structure of a transparent conductive oxide layer and a metal layer, for example, can have a two-layer structure of a transparent conductive oxide layer - metal layer, or a three-layer structure of a transparent conductive oxide layer - metal layer - transparent conductive oxide layer. In this case, the metal layer can improve the flexible characteristics while reducing the resistance and improving the signal transmission speed, and the transparent conductive oxide layer can improve the corrosion resistance and transparency.

[0096] The sensing electrodes 110, 130 and / or the antenna unit 200 (radiator 210) can include a blackening treatment section. Thereby, the reflectance on the surface of the sensing electrodes 110, 130 and / or the antenna unit 200 can be decreased, and the pattern visual recognition due to light reflection can be reduced.

[0097] In one embodiment, the surface of the metal layer included in the sensing electrodes 110, 130 and / or the antenna unit 200 can be converted into a metal oxide or a metal sulfide to form a blackening layer. In one embodiment, a blackening layer such as a black material coating layer or a plating layer can be formed on the sensing electrodes 110, 130 and / or the antenna unit 200 or the metal layer. The black material or the plating layer can include oxides, sulfides, alloys, etc. containing silicon, carbon, copper, molybdenum, tin, chromium, molybdenum, nickel, cobalt or at least one of these.

[0098] The composition and thickness of the blackening layer can be adjusted in consideration of the reflectance reduction effect and the radiation characteristics of the antenna.

[0099] In one embodiment, the sensing electrodes 110, 130 and the radiator 210 can include a mesh structure. Thereby, in the active region (AA), it is possible to suppress the visual recognition of the sensing electrodes 110, 130 and the radiator 210 by the user.

[0100] In one embodiment, at least a part of the transmission line 220 can include a solid structure filled with the aforementioned metal or alloy. Thereby, an increase in resistance between the antenna unit 200 and the antenna pad 250 can be suppressed, and the power supply efficiency can be improved.

[0101] The antenna unit 200 can be disposed in the active area (AA) and partially in the peripheral area (PA). For example, the transmission line 220 can be disposed in the peripheral area (PA). In one embodiment, the transmission line 220 can extend across the active area (AA) and the peripheral area (PA).

[0102] In one embodiment, the transmission line 220 can also share the mesh structure. The transmission line 220 can also have a partially filled structure.

[0103] In one embodiment, the sensing electrodes 110, 130 and / or the radiator 210 can include a thin-film transparent metal structure with a filled interior. Thereby, the sensing sensitivity and radiation performance can be further improved.

[0104] The touch sensor pad 150 and the antenna pad 250 can have a filled structure formed of the aforementioned metal or alloy. Thereby, the bonding resistance with the circuit board 300 can be reduced.

[0105] In an exemplary embodiment, the sensing electrodes 110, 130 and the antenna unit 200 can be disposed in the same layer or at the same level. For example, the sensing electrodes 110, 130 and the radiator 210 can be formed together in the same layer by the same patterning process so as to have a mesh structure.

[0106] In some embodiments, the antenna unit 200 and the trace 140 can be formed in the same layer or at the same level.

[0107] According to an exemplary embodiment, the touch sensor pad 150 and the antenna pad 250 can be arranged together in the same layer or at the same level in the bonding area (BA). Thereby, as will be described later, one circuit board 300 can realize both antenna bonding and touch sensor bonding.

[0108] In some embodiments, the antenna unit 200 and the antenna pad 250 can be directly connected to each other in the same layer. Thereby, it is possible to suppress the signal loss of the antenna while reducing the feeding resistance of the antenna.

[0109] In some embodiments, the sensing electrodes 110, 130, the trace 140, and the touch sensor pad 150 can be directly connected to each other in the same layer. Thereby, it is possible to improve the sensitivity of touch sensing while reducing the resistance of the sensing channel.

[0110] As shown in FIG. 1, a plurality of antenna units 200 can be arranged in an array at one end adjacent to the bonding area (BA) of the active area (AA).

[0111] The sensing electrodes 110, 130 adjacent to the radiator 210 of the antenna unit 200 can have a smaller area than the other sensing electrodes 110, 130. Thereby, while securing the arrangement space of the antenna unit 200, it is possible to maintain the mutual independence of touch sensing and antenna radiation. For example, the sensing electrodes 110, 130 adjacent to the radiator 210 can include a recess that is etched so that the radiator 210 is partially inserted.

[0112] FIGS. 3 and 4 are partial enlarged plan views showing a sensor element according to an exemplary embodiment.

[0113] Referring to FIGS. 3 and 4, as described above, the antenna pad 250 and the touch sensor pad 150 can be arranged together in the bonding area (BA) assigned to one end of the peripheral area (PA) to form a pad row.

[0114] The antenna pad 250 can include a signal pad 252 and a ground pad 254. The transmission line 220 of the antenna unit 200 can be connected to the signal pad 252. The ground line 230 of the antenna unit 200 can be connected to the ground pad 254 of the antenna pad 250.

[0115] Each of the first traces 142 branching from the sensing channel column can be connected to the first touch sensor pad 152. Each of the second traces 144 branching from the sensing channel row can be connected to the second touch sensor pad 154.

[0116] The antenna pad 250 connected to one antenna unit 200 can define an antenna pad unit. For example, the antenna pad unit can be defined by the signal pad 252 and a pair of ground pads 254 facing each other with the signal pad 252 therebetween.

[0117] Touch sensor pads 150 (e.g., the first touch sensor pads 152) can be arranged on both sides of the antenna unit in the row direction. According to an exemplary embodiment, the ground pads 254 of the antenna pad 250 can be arranged between the touch sensor pads 150 and the signal pads 252 of the antenna pad 250.

[0118] In some embodiments, touch sensor pads 150 (e.g., the first touch sensor pads 152) can be arranged between adjacent antenna pad units. For example, a plurality of antenna pad units can be repeatedly arranged along the row direction with the touch sensor pads 150 therebetween.

[0119] With the above-described pad arrangement, it is possible to improve the mutual independence and reliability of antenna power supply / radiation by the antenna unit 200 and touch sensing by the sensing electrodes 110 and 130. For example, the ground pad 254 can block the interference between the antenna power supply / drive signal and the touch sensing signal, and can absorb / shield mutual noise.

[0120] In one embodiment, a reference potential or a ground potential is applied to the ground pad 254, which can enhance the mutual independence between the antenna power supply / drive signal and the touch sensing signal. The reference potential or the ground potential may be smaller than the potential of the touch drive signal to the touch sensor pad 150 and the power supply potential to the signal pad 252, respectively.

[0121] In one embodiment, the reference potential or the ground potential applied to the ground pad 254 may be substantially 0V. For example, the power supply potential can be applied to the signal pad 252 via the antenna drive IC chip 350b (see FIG. 8), and the reference potential or the ground potential can be applied to the ground pad 254.

[0122] In some embodiments, the reference potential or the ground potential can also be applied to the blocking pad 151 and / or the guard pad 153. For example, the touch drive signal potential can be applied to the touch sensor pads 152 and 154 via the touch sensor drive IC chip 370b (see FIG. 8), and the reference potential or the ground potential can be applied to the blocking pad 151 and / or the guard pad 153.

[0123] The reference potential or the ground potential applied to the blocking pad 151 and / or the guard pad 153 may be substantially the same as the reference potential or the ground potential applied to the ground pad 254. In one embodiment, a reference potential of substantially 0V can be applied to the block pad 151, the guard pad 153, and the ground pad 254 together.

[0124] In some embodiments, a plurality of touch sensor pads 150 can be arranged between adjacent antenna pad units. For example, a plurality of first touch sensor pads 152 can be arranged between adjacent antenna pad units. In this case, a plurality of first traces 142 can be arranged between adjacent antenna units 200.

[0125] In some embodiments, one touch sensor pad 150 can be arranged between adjacent antenna pad units. For example, one first touch sensor pad 152 can be arranged between adjacent antenna pad units. Thereby, while reducing the number of touch sensor pads 150 sandwiched between the antenna pad units, the pad density in the pad row can be increased.

[0126] According to the foregoing exemplary embodiments, the antenna pad 250 can be arranged together with the touch sensor pad 150 in the bonding area (BA) using the ground line 230 and the transmission line 220. Therefore, while increasing the pad density in the bonding area (BA), as will be described later, a single circuit board 300 can be used to realize both the connection between the antenna drive integrated circuit (IC) chip and the antenna unit 200 and the connection between the touch sensor IC chip and the sensing electrodes 110, 130.

[0127] Also, by inserting the ground pad 254, the independence between the antenna power supply / drive signal and the touch sensing signal can be enhanced. The ground pad 254 is connected to the ground line 230 of the antenna unit 200, and the shielding / absorption efficiency of mutual noise can be further improved.

[0128] In some embodiments, the ground pad 254 applies the reference potential or ground potential as described above, and can supply a ground current through the ground line 230. Thereby, the ground line 230 can improve the independence from the touch sensing signal and also enhance the independence from the adjacent antenna unit 200.

[0129] The ground line 230 can extend adjacent to the radiator 210 together with the transmission line 220 and be provided as a guard line of the antenna unit 200 with respect to the trace 140 around the antenna unit 200. The ground line 230 can function as a coplanar waveguide (CPW) line that extends together around the transmission line 220 to facilitate the supply of an electric field to the radiator 210.

[0130] Also, the ground line 230 can be provided as a blocking line for the parasitic capacitance generated by the potential difference between the antenna power supply signal applied through the transmission line 220 and the channel signal of the touch sensor.

[0131] The transmission line 220 and the ground line 230 each have a polygonal line shape and can efficiently gather the antenna pads 250 within the bonding area (BA). For example, the transmission line 220 and the ground line 230 can each include two bends.

[0132] In some embodiments, the transmission line 220 can have a variable width. As shown in FIG. 3, the transmission line 220 can include an extended line portion 225 with an increased width at the end adjacent to the radiator 210.

[0133] In some embodiments, the ground line 230 can also have a variable width. The ground line 230 can include an extended ground portion 235 with an increased width at the end adjacent to the radiator 210. For example, a pair of extended ground portions 235 can face each other in the row direction with the extended line portion 225 in between.

[0134] At an end adjacent to the radiator 210, an extended line portion 225 and an extended ground portion 235 are formed, which can promote the supply of power and signals to the radiator 210 and suppress the signal loss of the antenna.

[0135] According to the embodiment shown in FIG. 3, the lengths of the transmission lines 220 of the antenna unit 200 may be substantially the same. In this case, the signal phases applied to each antenna unit 200 can be equalized. Thereby, phase interference can be suppressed, and radiation in a desired frequency band can be realized with high reliability.

[0136] According to the embodiment shown in FIG. 4, the transmission lines 220 of the antenna unit 200 can include transmission lines with different lengths from each other. In this case, the phase is corrected from the antenna driving integrated circuit (IC) chip, and the overall phase of the transmission lines can be equalized.

[0137] FIG. 5 is a schematic partial enlarged plan view showing sensor elements according to some exemplary embodiments.

[0138] Referring to FIG. 5, the antenna unit 200 can include a plurality of transmission lines 220. For example, two transmission lines 220 can be connected to one radiator 210.

[0139] According to an exemplary embodiment, a first transmission line 220a can be connected to the first corner portion of the radiator 210, and a second transmission line 220b can be connected to the second corner portion of the radiator 210. In some embodiments, the first corner portion and the second corner portion can include the vertices of the radiator 210 adjacent to the bonding area (BA). The first corner portion and the second corner portion can be symmetric with respect to the virtual center line of the radiator 210 extending in the column direction.

[0140] Thereby, the first transmission line 220a and the second transmission line 220b can be substantially symmetric with respect to the virtual center line.

[0141] In some embodiments, the first transmission line 220a can extend in a direction from the first corner portion toward the center of the radiator 210. The second transmission line 220b can extend in a direction from the second corner portion toward the center of the radiator 210.

[0142] In one embodiment, the extending directions of the first transmission line 220a and the second transmission line 220b may be substantially perpendicular to each other.

[0143] With the above-described designs of the first transmission line 220a and the second transmission line 220b, substantially dual-polarization characteristics can be realized from the radiator 210.

[0144] In some embodiments, a merging line 220c can be formed on the lower side of the radiator 210 connected to the transmission line 220. The merging line 220c may be a solid metal line, and the first transmission line 220a and the second transmission line 220b can be connected to both ends of the merging line 220c. The first transmission line 220a and the second transmission line 220b can also be formed of solid metal lines.

[0145] In one embodiment, the first transmission line 220a, the second transmission line 220b, and the merging line 220c can be formed of a substantially integral single member.

[0146] The merging line 220c can reduce the feeding resistance from the transmission lines 220a, 220b to the radiator 210 and prevent impedance mismatch.

[0147] FIG. 6 is a schematic partial enlarged plan view showing a sensor element package according to an exemplary embodiment.

[0148] Referring to FIG. 6, an antenna driving circuit / antenna connection structure 350 can be electrically connected to an antenna pad 250, and a touch sensor driving circuit / touch sensor connection structure 370 can be electrically connected to a touch sensor pad 150 using a single circuit board 300.

[0149] The circuit board 300 can include a core insulating layer and conductive wiring formed on the core insulating layer. The conductive wiring can include antenna conductive wiring 310 (see FIG. 7) connected to the antenna pad 250 and touch sensor conductive wiring 320 (see FIG. 7) connected to the touch sensor pad 150. For the sake of illustration, the illustration of the conductive wiring included in the circuit board 300 is omitted in FIG. 6.

[0150] The core insulating layer can include flexible resins such as polyimide resin, MPI (Modified Polyimide), epoxy resin, polyester, cycloolefin polymer (COP), and liquid crystal polymer (LCP). In a preferred embodiment, the core insulating layer can include polyimide resin or MPI.

[0151] The conductive wiring of the circuit board 300 can include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), tin (Sn), zinc (Zn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these metals. In some embodiments, the conductive wiring can include copper or a copper alloy in consideration of signal efficiency.

[0152] In one embodiment, the circuit board 300 can be manufactured from a copper clad laminate (CCL). The circuit board 300 can be provided as a flexible printed circuit board (FPCB).

[0153] The antenna conductive wiring 310 can be electrically connected to the antenna drive circuit / antenna connection structure 350. In one embodiment, the antenna drive circuit / antenna connection structure 350 can include an antenna connector. The antenna connector may be, for example, a board-to-board (B2B) connector. In this case, the circuit board 300 can be coupled to the chip mounting board via the antenna connector.

[0154] For example, the antenna drive circuit / antenna connection structure 350 can include an antenna drive integrated circuit (IC) chip. In this case, the antenna drive IC chip 350b can be directly mounted on the circuit board 300 via an intermediate conductive structure such as solder, conductive balls, or conductive wires.

[0155] The touch sensor conductive wiring 320 can be electrically connected to the touch sensor drive circuit / touch sensor connection structure 370. In one embodiment, the touch sensor drive circuit / touch sensor connection structure 370 can include a touch sensor connector. The touch sensor connector may be, for example, a board-to-board (B2B) connector. In this case, the circuit board 300 can be coupled to the chip mounting board via the touch sensor connector.

[0156] For example, the touch sensor drive circuit / touch sensor connection structure 370 can include a touch sensor drive IC chip. In this case, the touch sensor drive IC chip 370b can be directly mounted on the circuit board 300 via a conductive intermediate structure such as solder, conductive balls, or conductive wires.

[0157] FIG. 7 and FIG. 8 are a schematic plan view and a cross-sectional view, respectively, showing an image display device according to an exemplary embodiment.

[0158] FIG. 7 shows, for example, the front surface or the window surface of the image display device 400 manufactured in the form of a smartphone. The front surface of the image display device 400 may include a display area (DA) 430 and a non-display area (NDA) 440. The non-display area 440 may correspond to, for example, a light-shielding portion or a bezel portion of the image display device 400.

[0159] Referring to FIGS. 7 and 8, the image display device 400 may include a display panel 410 and the aforementioned sensor element disposed on the display panel 410.

[0160] The sensor element according to the foregoing exemplary embodiment may be disposed facing the front surface of the image display device 400, and may be disposed, for example, on the display panel. Thereby, the antenna unit 200 included in the sensor element can be provided as an antenna-on-display (AOD) antenna.

[0161] In some embodiments, the sensor element can be attached on the display panel in the form of a film. In some embodiments, the sensor element can be disposed across the display area 430 and the non-display area 440 of the image display device 400.

[0162] In some embodiments, the active area (AA) of the sensor element can overlap with the display area 430. In one embodiment, the sensing electrodes 110, 130 and / or the radiator 210 can at least partially overlap with the display area 430.

[0163] In some embodiments, the peripheral area (PA) of the sensor element can overlap with the non-display area 440. The trace 140 and / or the transmission lines 220 and the ground line 230 of the antenna unit 200 can at least partially overlap with the non-display area 440. For example, the portion having a structure with a clogged interior in the sensor element can overlap with the non-display area 440.

[0164] The sensor element can be powered or driven via the circuit board 300. As described with reference to FIG. 6, the circuit board 300 is electrically connected to the antenna drive circuit / antenna connection structure 350, and the antenna drive circuit / antenna connection structure 350 can include an antenna connector 350a and an antenna drive IC chip 350b. The touch sensor drive circuit / touch sensor connection structure 370 can include a touch sensor connector 370a and a touch sensor drive IC chip 370b.

[0165] For the sake of illustration, in FIG. 8, the antenna connector 350a and the touch sensor connector 370a are shown as one connector, but as described above, the antenna connector 350a and the touch sensor connector 370a can be mounted as independent separate members on the circuit board 300. The antenna drive IC chip 350b and the touch sensor drive IC chip 370b can also be mounted on the chip mount substrate 450 as independent and separate chips.

[0166] The circuit board 300 can be electrically connected to the sensor element via the bonding intermediate structure 180. The bonding intermediate structure 180 can include an anisotropic conductive film (ACF).

[0167] For example, the bonding intermediate structure 180 can be attached so as to entirely cover the pad rows on the bonding region (BA). The circuit board 300 can be disposed on the bonding intermediate structure 180 such that the conductive wirings 310, 320 included in the circuit board 300 are aligned with the pads included in the pad rows, respectively. Thereafter, the circuit board 300 can be bonded to the sensor element via the bonding intermediate structure 180 by thermocompression bonding.

[0168] The circuit board 300 can be bent to the back surface portion of the image display device 400 and connected to the drive IC chips 350b, 370b mounted on the chip mount substrate 450.

[0169] For example, the antenna unit 200 and the circuit board 300 can be electrically connected to the antenna driving IC chip 350b via the antenna connector 350a. The sensing electrodes 110 and 130 of the touch sensor and the circuit board 300 can be electrically connected to the touch sensor driving IC chip 370b via the touch sensor connector 370a.

[0170] The chip mount substrate 450 may be a rigid printed circuit board, for example, it may be the main board of the image display device 400.

[0171] As described with reference to FIG. 6, the antenna driving IC chip 350b and the touch sensor driving IC chip 370b can also be directly mounted on the circuit board 300.

[0172] According to an exemplary embodiment, the display panel 410 may further include an optical layer 420. For example, the optical layer 420 may be a polarizing layer including a polarizer or a polarizing plate. In some embodiments, the sensor element can be disposed on the optical layer 420.

Claims

1. A touch sensing electrode, a trace extending from the touch sensing electrode, a touch sensor pad connected to the trace, an antenna unit disposed adjacent to the touch sensing electrode and including a radiator, a transmission line connected to the radiator, and a ground line extending around the transmission line, a sensor element including an antenna pad that forms a pad row together with the touch sensor pad, a signal pad connected to the transmission line, and a ground pad connected to the ground line.

2. The sensor element according to claim 1, wherein a pair of the ground lines face each other with the transmission line therebetween.

3. The sensor element according to claim 1, wherein the transmission line and the ground line each have a polygonal line shape.

4. The sensor element according to claim 1, wherein the transmission line includes an extended line portion having an increased width at an end adjacent to the radiator.

5. The sensor element according to claim 1, wherein the ground line includes an extended ground portion having an increased width at an end adjacent to the radiator.

6. The sensor element according to claim 1, wherein the ground pad is disposed between the signal pad and the touch sensor pad.

7. The sensor element according to claim 1, wherein a plurality of the antenna units are arranged along a row direction, and the signal pad and the ground pad are independently connected to each of the plurality of antenna units via the transmission line and the ground line.

8. The sensor element according to claim 7, wherein at least one touch sensor pad among the touch sensor pads is disposed between the antenna pads connected to adjacent ones of the plurality of antenna units.

9. The sensor element according to claim 7, wherein the transmission lines connected to each of the plurality of antenna units have a polygonal line shape and have the same length.

10. The sensor element according to claim 1, wherein the antenna pad and the touch sensor pad form a single pad row on the same layer.

11. The transmission line of the antenna unit includes a first transmission line and a second transmission line that extend and are connected to the radiator in different directions from each other, The sensor element according to claim 1, wherein the signal pad is connected to each of the first transmission line and the second transmission line.

12. The sensor element according to claim 1, further comprising an antenna driving integrated circuit that is electrically connected to the antenna unit, applies a reference potential to the ground pad, and applies a power supply signal having a potential higher than the reference potential to the signal pad.

13. The sensor element according to claim 12, further comprising a blocking pad inserted between adjacent touch sensor pads among the touch sensor pads, or a guard pad disposed at an end of the pad row.

14. The sensor element according to claim 13, further comprising a touch sensor driving integrated circuit that is electrically connected to the touch sensor pad, applies a reference potential to the blocking pad or the guard pad, and applies a touch driving signal having a potential higher than the reference potential to the touch sensor pad.

15. The sensor element according to claim 14, wherein the reference potential applied to the blocking pad or the guard pad is the same as the reference potential applied to the ground pad.

16. The sensor element according to claim 13, further comprising a blocking line extending between adjacent traces among the traces from the blocking pad.

17. The sensor element according to claim 13, further comprising a loop-shaped guard line extending from the guard pad and surrounding the periphery of the touch sensing electrode.

18. An image display device, comprising: a display panel; and the sensor element according to claim 1. ​

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