Transparent electronic device, laminated glass, and method for manufacturing transparent electronic device

Abstract

A transparent electronic device equipped with a transparent insulating substrate, an electronic element having an area of 250,000 μm2 or less formed on a main surface of the transparent insulating substrate, and an opaque current distributor that distributes current to the electronic element. The electronic element is a light emitting diode element or a sensor. The transparent insulating substrate includes a first transparent insulating substrate (10a) having an electronic element and a first wiring (40) connected to the electronic element formed on one main surface and a second transparent insulating substrate (10b) having a second wiring (40) formed on one main surface. No electronic element is formed on the second transparent insulating substrate. One end of the first wiring (40) and one end of the second wiring (40) are electrically connected, and the opaque current distributor (60) is connected to other end of the second wiring at the edge of the second transparent insulating substrate (10b).

Description

[Technical Field]

[0001] The present invention relates to a transparent electronic device, a laminated glass, and a method for manufacturing a transparent electronic device. [Background technology]

[0002] As disclosed in Patent Document 1, the inventors have developed a transparent display device that uses fine light-emitting diode (LED) elements formed on a transparent insulating substrate as pixels. Such a transparent display device allows the rear side to be viewed through the transparent display device, and is therefore installed on transparent members such as windows or partitions of vehicles or buildings. A related technique is known, which is a transparent sensing device in which a microsensor is installed on a transparent insulating substrate. In this specification, an electronic device in which electronic elements are formed on a transparent insulating substrate and the rear side is visible, such as a transparent display device or a transparent sensing device, is referred to as a "transparent electronic device." [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2019 / 146634 Summary of the Invention [Problem to be solved by the invention]

[0004] The inventors have found the following problems with such transparent electronic devices. Because a power supply (e.g., a flexible wiring board) for supplying power to a transparent electronic device is opaque, it is connected to the edge of the transparent electronic device. Therefore, depending on the position of the electronic element in a transparent member such as a window, the routing distance of the fine wiring connecting the electronic element and the power supply increases (i.e., the area of the transparent electronic device increases), which causes a problem of reduced yield of the transparent electronic device. [Means for solving the problem]

[0005] The present invention provides a transparent electronic device having the following configuration [1]. [1] A transparent insulating substrate; A 250,000 μm thick film is formed on the main surface of the transparent insulating substrate. 2 an electronic element having an area of: an opaque power supply body that supplies power to the electronic element; the electronic element is a light-emitting diode element or a sensor; The transparent insulating substrate is a first transparent insulating substrate having the electronic element and a first wiring connected to the electronic element formed on one main surface thereof; a second transparent insulating substrate having a second wiring formed on one main surface thereof; the second transparent insulating substrate does not have the electronic element formed thereon, one end of the first wiring and one end of the second wiring are electrically connected, and the other end of the second wiring is connected to the opaque power supply body at an edge of the second transparent insulating substrate; Transparent electronic devices.

[0006] In one aspect of the present invention, [2] The transparent electronic device described in [1], wherein the first transparent insulating substrate and the second transparent insulating substrate overlap in a planar view, and one end of the first wiring and one end of the second wiring are electrically connected in the overlapping portion between the first transparent insulating substrate and the second transparent insulating substrate.

[0007] [3] The transparent electronic device according to [2], wherein the first transparent insulating substrate entirely overlaps the second transparent insulating substrate in a plan view.

[0008] [4] The transparent electronic device according to [2] or [3], wherein the one main surface of the first transparent insulating substrate and the one main surface of the second transparent insulating substrate face each other and overlap in a planar view.

[0009] [5] The transparent electronic device according to any one of [1] to [4], wherein the region of the first transparent insulating substrate where the electronic elements are arranged does not overlap with the second wiring.

[0010] [6] The transparent electronic device according to any one of [1] to [5], wherein the electronic element is a light-emitting diode element, and the light-emitting diode element constitutes a transparent display device.

[0011] [7] The transparent electronic device according to any one of [1] to [6], wherein the second transparent insulating substrate has flexibility.

[0012] [8] The transparent electronic device according to any one of [1] to [7], wherein one end of the first wiring and one end of the second wiring are electrically connected via a conductive bonding layer.

[0013] [9] A pair of glass plates arranged opposite each other; first and second interlayer films provided between the pair of glass plates; The transparent electronic device according to any one of [1] to [8] is sandwiched between the first and second interlayer films. Laminated glass.

[0014]

[10] The laminated glass according to [9], wherein a shielding layer is formed on the periphery of at least one of the pair of glass plates.

[0015]

[11] The laminated glass according to

[10] , wherein at least one of the first and second wirings is formed to have a large width to form an opaque wiring area around the periphery of the transparent electronic device, and the opaque wiring area is arranged to overlap the shielding layer in a planar view.

[0016]

[12] The laminated glass according to

[10] or

[11] , wherein the opaque power supply body is arranged to overlap the shielding layer in a planar view.

[0017]

[13] The laminated glass according to any one of

[10] to

[12] , wherein the peripheral edge of at least one of the first and second transparent insulating substrates is arranged to overlap with the shielding layer in a planar view.

[0018]

[14] The laminated glass according to any one of [9] to

[13] , wherein a protective layer covering the first transparent insulating substrate is formed between the first and second interlayer films.

[0019]

[15] The laminated glass according to

[14] , wherein the protective layer includes an interlayer film different from the first and second interlayer films.

[0020]

[16] The laminated glass according to any one of [9] to

[15] , wherein the pair of glass plates is curved.

[0021]

[17] The laminated glass according to any one of [9] to

[16] , wherein the laminated glass is for a vehicle, and the glass plate of the pair of glass plates located on the vehicle exterior side has a thickness of 1.5 mm to 3.0 mm.

[0022]

[18] The laminated glass according to any one of [9] to

[17] , wherein the peripheral edge of the first transparent insulating substrate does not overlap, in plan view, with the “test area A” specified in the appendix “Test area for optical properties and light resistance of safety glass” of JIS Standard R3212:2015 (Test methods for automotive safety glass).

[0023]

[19] The laminated glass according to any one of [9] to

[18] , wherein the peripheral edge of the second transparent insulating substrate does not overlap, in plan view, with the "test area A" specified in the "Test area for optical properties and light resistance of safety glass" appendix of JIS Standard R3212:2015 (Test methods for automotive safety glass).

[0024] The present invention provides a method for producing a transparent electronic device having the following configuration

[20] .

[20] On one main surface of the first transparent insulating substrate, 2forming an electronic element having an area of: forming a second wiring on one main surface of a second transparent insulating substrate without forming the electronic element; one end of the first wiring and one end of the second wiring are electrically connected, and an opaque power supply body that supplies power to the electronic element is connected to the other end of the second wiring at an edge of the second transparent insulating substrate. Method for manufacturing transparent electronic devices. [Effects of the Invention]

[0025] According to the present invention, a transparent electronic device with excellent yield can be provided. [Brief explanation of the drawings]

[0026] [Figure 1] FIG. 1 is a schematic plan view showing an example of a transparent display device according to a first embodiment. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3] FIG. 2 is a schematic partial plan view showing an example of a display area 101. [Figure 4] FIG. 4 is a cross-sectional view taken along the line IV-IV in FIG. [Figure 5] 3A to 3C are cross-sectional views showing an example of a method for manufacturing the transparent display device according to the first embodiment. [Figure 6] 3A to 3C are cross-sectional views showing an example of a method for manufacturing the transparent display device according to the first embodiment. [Figure 7] 3A to 3C are cross-sectional views showing an example of a method for manufacturing the transparent display device according to the first embodiment. [Figure 8] 3A to 3C are cross-sectional views showing an example of a method for manufacturing the transparent display device according to the first embodiment. [Figure 9] 3A to 3C are cross-sectional views showing an example of a method for manufacturing the transparent display device according to the first embodiment. [Figure 10] 3A to 3C are cross-sectional views showing an example of a method for manufacturing the transparent display device according to the first embodiment. [Figure 11]3A to 3C are cross-sectional views showing an example of a method for manufacturing the transparent display device according to the first embodiment. [Figure 12] 3A to 3C are cross-sectional views showing an example of a method for manufacturing the transparent display device according to the first embodiment. [Figure 13] FIG. 10 is a schematic cross-sectional view showing a transparent display device according to Modification 1 of the first embodiment. [Figure 14] FIG. 10 is a schematic cross-sectional view showing a transparent display device according to Modification 2 of the first embodiment. [Figure 15] FIG. 10 is a schematic cross-sectional view showing a transparent display device according to a third modification of the first embodiment. [Figure 16] FIG. 10 is a schematic cross-sectional view showing a transparent display device according to a fourth modified example of the first embodiment. [Figure 17] FIG. 2 is a schematic plan view showing an example of laminated glass according to a second embodiment. [Figure 18] FIG. 18 is a cross-sectional view taken along the line XVIII-XVIII in FIG. [Figure 19] FIG. 3 is a schematic cross-sectional view showing another example of the laminated glass according to the second embodiment. [Figure 20] FIG. 10 is a schematic partial plan view showing an example of a transparent display device according to a third embodiment. [Figure 21] FIG. 10 is a schematic partial plan view showing an example of a transparent sensing device according to a fourth embodiment. [Figure 22] FIG. 2 is a schematic cross-sectional view of a sensor 70. DETAILED DESCRIPTION OF THE INVENTION

[0027] Hereinafter, specific embodiments to which the present invention is applied will be described in detail with reference to the drawings. However, the present invention is not limited to the following embodiments. In addition, the following description and drawings have been simplified as appropriate for clarity of explanation.

[0028] In this specification, the term "transparent display device" refers to a display device that allows visual information such as people and backgrounds located behind the display device to be visible under a desired usage environment. Note that "visible" is determined at least when the display device is in a non-display state, i.e., when not energized.

[0029] Similarly, in this specification, a "transparent sensing device" refers to a sensing member that allows visual information such as a person or background located behind the sensing device to be seen in a desired usage environment. A "sensing device" refers to a device that can acquire various types of information using a sensor.

[0030] In this specification, "transparent" refers to a visible light transmittance of 40% or more, preferably 60% or more, and more preferably 70% or more. It may also refer to a transmittance of 5% or more and a haze value of 10 or less. If the transmittance is 5% or more, when looking outdoors from indoors during the day, the outdoors can be seen with brightness at least as high as that from indoors, ensuring sufficient visibility.

[0031] Furthermore, if the transmittance is 40% or more, the rear side of the transparent display device can be seen without any problems even if the brightness of the front side and the rear side of the transparent display device is approximately the same. Furthermore, if the haze value is 10 or less, sufficient contrast with the background can be ensured. The term "transparent" does not matter whether a color is imparted or not, that is, it may be colorless and transparent, or colored and transparent. The transmittance refers to a value (%) measured by a method conforming to ISO 9050. The haze value refers to a value measured by a method conforming to ISO 14782.

[0032] (First embodiment) <Configuration of transparent display device> First, the configuration of a transparent display device according to a first embodiment will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a schematic plan view showing an example of a transparent display device according to the first embodiment. Fig. 2 is a cross-sectional view taken along the II-II cutting line in Fig. 1. The transparent display device is one aspect of a transparent electronic device. Naturally, the right-handed xyz Cartesian coordinate system shown in Figure 1 and other figures is for the convenience of explaining the positional relationships of the components. Normally, the positive direction of the z axis is vertically upward, and the xy plane is the horizontal plane, which is common among the figures.

[0033] As shown in FIGS. 1 and 2, a transparent display device 100 according to the first embodiment includes transparent insulating substrates 10a and 10b and a flexible wiring board 60. The transparent display device 100 includes transparent insulating substrates 10a and 10b and a flexible wiring board 60. The flexible wiring board 60 includes: a transparent insulating substrate 10b; As shown in FIG. 1, the transparent display device 100 includes a display area 101. The display area 101 is made up of a plurality of pixels PIX, and is an area where an image is displayed. The image includes characters. As will be described in detail later, each pixel PIX includes at least one light-emitting diode element (hereinafter, referred to as an LED element). That is, the transparent display device according to this embodiment is a display device that uses minute LED elements in each pixel, and is called an LED display or the like. No LED elements are formed in the non-display area other than the display area 101. In addition, organic EL (organic electro-luminescence) displays and inorganic EL (inorganic electro-luminescence) displays are also included in LED displays equipped with LED elements.

[0034] The transparent insulating substrate 10a (first transparent insulating substrate) includes a display region 101, and wiring 40 and LED elements connected to the wiring 40 are formed on one main surface of the transparent insulating substrate 10a. 2 This is an example of a microelectronic device having the following dimensions: The transparent insulating substrate (second transparent insulating substrate) 10b does not include the display region 101, and has wiring 40 formed on one main surface of the transparent insulating substrate 10b, but no LED elements formed on it. Also, no LED elements are formed on the other main surface of the transparent insulating substrate 10b. In other words, the transparent insulating substrate 10a includes the entire display region 101, and the transparent insulating substrate 10b does not include the display region 101. Furthermore, the transparent insulating substrate 10b is formed with only the wiring 40. However, the transparent insulating substrate 10b may be formed with only electronic elements other than the LED elements and the sensors described below, in addition to the wiring 40.

[0035] Here, the wiring 40 shown linearly in FIG. 1 extends in the x-axis and y-axis directions. The wiring 40 extending in the x-axis direction becomes wider at the end portions of the transparent insulating substrates 10a and 10b on the positive x-axis direction, and extends in the negative y-axis direction and is connected to the flexible wiring board 60. That is, at least a portion of the portion of the wiring 40 extending in the negative y-axis direction is wider than the portion of the wiring 40 extending in the x-axis direction. Furthermore, the wiring 40 extending in the y-axis direction becomes wider at the end portion of the transparent insulating substrate 10b on the negative y-axis direction, and is connected to the flexible wiring board 60. That is, in the portion of the wiring 40 extending in the y-axis direction, the width at one end in the negative y-axis direction is wider than that at one end in the positive y-axis direction.

[0036] In FIG. 1, an opaque region where the wiring 40 is formed with a large width is schematically shown as the opaque wiring region 40a. In reality, the opaque wiring region 40a is provided with a group of densely packed large-width wirings. Therefore, it can be said that at least a portion of the wiring 40 extending into the opaque wiring region 40a is thicker than the portion extending into the display region 101. The wiring 40 may have approximately the same line width in the x-axis direction (display region) and the y-direction (opaque wiring region 40a), or may form a mesh-like group of wirings in the opaque wiring region 40a. A driver IC (Integrated Circuit) for driving LED elements and an element for preventing electrostatic discharge may be provided in the opaque wiring region 40a. Each of the wires 40 depicted as a single line in FIG. 1 is actually made up of a plurality of fine wires, as will be described later.

[0037] As will be described in detail later, the width of the fine wiring 40 is, for example, 1 μm to 100 μm, and preferably 3 μm to 20 μm. Because the width of the wiring 40 is 100 μm or less, the wiring 40 is barely visible even when the transparent display device is observed from a short distance of, for example, several tens of cm to 2 m, and visibility of the back side is excellent.

[0038] On the other hand, the width of the wiring 40 in the opaque wiring region 40a is, for example, 100 μm to 10,000 μm, preferably 100 μm to 5,000 μm. The spacing between the wirings is, for example, 3 μm to 5,000 μm, preferably 50 μm to 1,500 μm. The wiring 40 in the opaque wiring region 40a is visible. Therefore, the opaque wiring region 40a, which is formed in a substantially L-shape in the xy plane along the periphery of the transparent display device 100, is covered by some means, for example.

[0039] The flexible wiring board 60 is a strip-shaped opaque power supply body for supplying power to the display area 101. Because it is opaque, the flexible wiring board 60 is connected to the ends of the wiring 40 formed on the edge of the transparent insulating substrate 10b. In the example shown in FIGS. 1 and 2, the flexible wiring board 60 is connected to the ends of the wiring 40 in the opaque wiring area 40a formed on the end of the transparent insulating substrate 10b on the negative y-axis direction side. Like the opaque wiring area 40a, the flexible wiring board 60 is also covered by some means, for example.

[0040] As shown in FIGS. 1 and 2, the edges of the transparent insulating substrates 10a and 10b overlap. At the overlapping portion between the transparent insulating substrates 10a and 10b, one end of a wiring (first wiring) 40 formed on the transparent insulating substrate 10a is electrically connected to one end of a wiring (second wiring) 40 formed on the transparent insulating substrate 10b. At the edge of the transparent insulating substrate 10b, the other end of the wiring 40 formed on the transparent insulating substrate 10b is connected to a flexible wiring board 60. With this configuration, power can be supplied from the flexible wiring board 60 to drive electronic elements in the display region 101. Note that the display region 101 does not overlap with the second wiring 40 formed on the transparent insulating substrate 10b. Therefore, the transparent display device 100 can suppress a decrease in transmittance in the display region 101, thereby providing excellent visibility from the rear side.

[0041] In addition, in the overlapping portion of the transparent insulating substrates 10a and 10b, at least one of the transparent insulating substrates 10a and 10b may have one or more cutouts. The cutouts improve the adhesion between the transparent display device 100 and an interlayer film (described later), making it easier for the transparent display device 100 to be firmly held in the laminated glass.

[0042] In the example shown in Figures 1 and 2, the negative y-axis side end of the wiring 40 extending in the y-axis direction in the transparent insulating substrate 10a faces the positive y-axis side end of the wiring 40 extending in the y-axis direction in the transparent insulating substrate 10b, and they are connected via the conductive bonding layer 40b. The conductive bonding layer 40b can be made of, for example, a conductive adhesive such as an anisotropic conductive film (ACF), solder, or the like. By using a conductive adhesive or solder, the pad size can be reduced. Furthermore, burrs that occur when forming through-holes in a transparent insulating substrate are not generated, and good contact can be obtained. As a result, a decrease in yield can be suppressed.

[0043] In the example shown in Fig. 1, both transparent insulating substrates 10a and 10b have a rectangular planar shape. The transparent insulating substrates 10a and 10b have equal widths, and their ends overlap and are connected to each other, so that the transparent insulating substrates 10a and 10b as a whole also have a rectangular planar shape. As shown in Fig. 1, the overlapping ratio of the ends of the transparent insulating substrates 10a and 10b is, for example, 20% or less, preferably 10% or less, and more preferably 5% or less of the area of the transparent insulating substrate 10a.

[0044] Furthermore, two alignment marks AM are provided on each of the transparent insulating substrates 10a and 10b for alignment. There are no limitations on the shape or number of the alignment marks AM, but in the example shown in Fig. 1, a square mark is provided on one of the transparent insulating substrates 10a and 10b, and a cross-shaped mark is provided on the other. The number of alignment marks AM may be one, or may be three or more.

[0045] In conventional transparent display devices, the display area 101 and the wiring 40 are all formed on a single transparent insulating substrate, which causes the transparent display device to become larger and reduces yield. For example, even if no defects occur in the display area 101, if a defect occurs in the non-display area, the entire device is judged to be defective. Also, even if no defects occur in the non-display area, if a defect occurs in the display area 101, the entire device is judged to be defective.

[0046] In contrast, the transparent display device according to this embodiment is divided into a transparent insulating substrate 10a including the display region 101 and a transparent insulating substrate 10b not including the display region 101. Therefore, defects in the transparent insulating substrate 10a including the display region 101 can be distinguished from defects in the transparent insulating substrate 10b not including the display region 101, improving the overall yield.

[0047] Furthermore, if a defect occurs in one of the connected transparent insulating substrates 10a, 10b, it is easy to replace that one. Furthermore, when designing transparent display devices 100 of different sizes, it is possible to change the design of only the transparent insulating substrate 10b without changing the design of the transparent insulating substrate 10a including the display region 101. In other words, by standardizing the transparent insulating substrate 10a, the design can be simplified and manufacturing productivity can be improved.

[0048] 1, the opaque wiring region 40a is divided into transparent insulating substrates 10a and 10b. However, for example, the opaque wiring region 40a may be divided into a rectangular transparent insulating substrate 10a that includes the entire display region 101 and a transparent insulating substrate 10b that is L-shaped in the xy plane and includes the entire opaque wiring region 40a. Other modified examples will be described later.

[0049] <Detailed configuration of display area 101> Next, a detailed configuration of the display region 101 in the transparent display device 100 according to the first embodiment will be described with reference to Fig. 3 and Fig. 4. Fig. 3 is a schematic partial plan view showing an example of the display region 101. Fig. 4 is a cross-sectional view taken along the IV-IV line in Fig. 3.

[0050] As described with reference to FIGS. 1 and 2, the display region 101 is formed on a transparent insulating substrate 10a. As shown in FIGS. 3 and 4, in the display region 101, a light-emitting section 20, an IC (Integrated Circuit) chip 30, wiring 40, and a protective layer 50 are formed on the transparent insulating substrate 10a. As shown in FIG. 3, the display region 101 is composed of a plurality of pixels PIX arranged in the row direction (x-axis direction) and column direction (y-axis direction). FIG. 3 shows a portion of the display region 101, with two pixels in each of the row and column directions, for a total of four pixels. Here, one pixel PIX is shown surrounded by a dashed line. Furthermore, in FIG. 3, the transparent insulating substrate 10a and protective layer 50 shown in FIG. 4 are omitted. Furthermore, although FIG. 3 is a plan view, the light-emitting section 20 and the IC chip 30 are displayed as dots to facilitate understanding.

[0051] <Plane Arrangement of the Light Emitting Unit 20, the IC Chip 30, and the Wiring 40> First, the planar arrangement of the light emitting section 20, the IC chip 30, and the wiring 40 will be described with reference to FIG. As shown in Fig. 3, pixels PIX surrounded by dashed dotted lines are arranged in a matrix with a pixel pitch Px in the row direction (x-axis direction) and a pixel pitch Py in the column direction (y-axis direction). Here, as shown in Fig. 3, each pixel PIX includes a light-emitting unit 20 and an IC chip 30. That is, the light-emitting units 20 and the IC chip 30 are arranged in a matrix with a pixel pitch Px in the row direction (x-axis direction) and a pixel pitch Py in the column direction (y-axis direction). It should be noted that the arrangement of the pixels PIX, that is, the light-emitting sections 20 is not limited to a matrix, as long as they are arranged at a predetermined pixel pitch in a predetermined direction.

[0052] As shown in FIG. 3, the light-emitting section 20 in each pixel PIX includes at least one LED element. 3, each light-emitting section 20 includes a red LED element 21, a green LED element 22, and a blue LED element 23. The LED elements 21 to 23 correspond to sub-pixels that make up one pixel. As such, since each light-emitting section 20 includes LED elements 21 to 23 that emit light in the three primary colors of light, red, green, and blue, the transparent display device according to this embodiment can display a full-color image. Each light-emitting section 20 may include two or more LED elements of the same color, thereby expanding the dynamic range of the image.

[0053] The LED elements 21 to 23 are minute in size and are so-called micro LED elements. Specifically, the width (length in the x-axis direction) and length (length in the y-axis direction) of the LED element 21 on the transparent insulating substrate 10a are, for example, 100 μm or less, preferably 50 μm or less, and more preferably 20 μm or less. The same applies to the LED elements 22 and 23. The lower limits of the width and length of the LED elements are, for example, 3 μm or more, depending on various manufacturing conditions and the like. Although the LED elements 21 to 23 in FIG. 3 have the same dimensions, ie, width and length, they may be different from one another.

[0054] The area occupied by each of the LED elements 21 to 23 on the transparent insulating substrate 10a is, for example, 10,000 μm 2 Less than 3000 μm, preferably 2 Less than or equal to 500 μm, preferably 2 The lower limit of the area occupied by one LED element is, for example, 10 μm due to various manufacturing conditions. 2 In this specification, the area occupied by components such as LED elements and wiring refers to the area in the xy plane view in FIG. The LED elements 21 to 23 shown in FIG. 3 are rectangular (including square) in shape, but are not particularly limited thereto.

[0055] Here, the LED elements 21 to 23 have, for example, a mirror structure for efficiently extracting light to the viewing side, and therefore the transmittance of the LED elements 21 to 23 is low, for example, about 10% or less. However, in the transparent display device according to this embodiment, as described above, 2 The LED elements 21 to 23 are of the following minute size. Therefore, even when the transparent display device is observed from a short distance of, for example, several tens of centimeters to 2 meters, the LED elements 21 to 23 are hardly visible. Furthermore, the area of low transmittance in the display area 101 is narrow, providing excellent visibility on the rear side. Furthermore, there is a high degree of freedom in arranging the wiring 40, etc. It should be noted that the "area with low transmittance in the display area 101" is, for example, an area with transmittance of 20% or less.

[0056] Furthermore, because the LED elements 21 to 23 are minute in size, the LED elements are unlikely to be damaged even when the transparent display device is bent. Therefore, the transparent display device of this embodiment can be attached to a curved transparent plate such as an automobile windowpane, or enclosed between two curved transparent plates. Here, if a flexible material is used for the transparent insulating substrate 10a, the transparent display device of this embodiment can be bent.

[0057] The LED elements 21 to 23 are not particularly limited and may be made of inorganic materials, for example. The red LED element 21 may be made of AlGaAs, GaAsP, GaP, etc. The green LED element 22 may be made of InGaN, GaN, AlGaN, GaP, AlGaInP, ZnSe, etc. The blue LED element 23 may be made of InGaN, GaN, AlGaN, ZnSe, etc.

[0058] The luminous efficiency, i.e., energy conversion efficiency, of the LED elements 21-23 is, for example, 1% or more, preferably 5% or more, and more preferably 15% or more. If the luminous efficiency of the LED elements 21-23 is 1% or more, as described above, even the minute-sized LED elements 21-23 can obtain sufficient brightness, allowing them to be used as display devices even during the day. Furthermore, if the luminous efficiency of the LED elements is 15% or more, heat generation is suppressed, making it easier to encapsulate them inside laminated glass using a resin adhesive layer.

[0059] The pixel pitches Px and Py are each, for example, 100 μm to 3000 μm, preferably 180 μm to 1000 μm, and more preferably 250 μm to 400 μm. By setting the pixel pitches Px and Py within the above ranges, high transparency can be achieved while ensuring sufficient display performance. In addition, diffraction that can occur due to light from the back side of the transparent display device can be suppressed. The pixel density in the display region 101 of the transparent display device according to this embodiment is, for example, 10 ppi or more, preferably 30 ppi or more, and more preferably 60 ppi or more.

[0060] The area of one pixel PIX is Px×Py, and this area is, for example, 1×10 4 μm 2 ~9×10 6 μm 2 , preferably 3 x 10 4 ~1×10 6 μm 2 , more preferably 6 × 10 4 ~2×10 5 μm 2 The area of one pixel is 1×10 4 μm 2 ~9×106 μm 2 This makes it possible to improve the transparency of the display device while ensuring appropriate display performance. The area of one pixel may be appropriately selected depending on the size of the display region 101, the purpose, the viewing distance, and the like.

[0061] The ratio of the area occupied by the LED elements 21 to 23 to the area of one pixel is, for example, 30% or less, preferably 10% or less, more preferably 5% or less, and even more preferably 1% or less. By making the ratio of the area occupied by the LED elements 21 to 23 to the area of one pixel 30% or less, transparency and rear visibility are improved.

[0062] 3, in each pixel, the three LED elements 21 to 23 are arranged in a line in the positive direction of the x-axis in this order, but this is not limiting. For example, the arrangement order of the three LED elements 21 to 23 may be changed. The three LED elements 21 to 23 may also be arranged in the y-axis direction. Alternatively, the three LED elements 21 to 23 may be arranged at the vertices of a triangle.

[0063] 3, when each light-emitting section 20 includes a plurality of LED elements 21 to 23, the distance between the LED elements 21 to 23 in the light-emitting section 20 is, for example, 100 μm or less, and preferably 10 μm or less. The LED elements 21 to 23 may be arranged so as to be in contact with one another. This makes it easier to share the first power branch line 41a, improving the aperture ratio.

[0064] 3, the order and direction of arrangement of the LED elements in each light-emitting section 20 are the same, but they may be different. Also, if each light-emitting section 20 includes three LED elements that emit light of different wavelengths, the LED elements in some light-emitting sections 20 may be arranged side by side in the x-axis direction or y-axis direction, and in other light-emitting sections 20, the LED elements of each color may be arranged at the vertices of a triangle.

[0065] 3, an IC chip 30 is provided for each pixel PIX and drives the light-emitting unit 20. Specifically, the IC chip 30 is connected to each of the LED elements 21 to 23 via drive lines 45, and can drive the LED elements 21 to 23 individually. The IC chip 30 is, for example, a hybrid IC having an analog area and a logic area. The analog area includes, for example, a current control circuit and a transformer circuit.

[0066] It is also possible to arrange an IC chip 30 for each of a plurality of pixels, and drive a plurality of pixels connected to each IC chip 30. For example, if one IC chip 30 is arranged for every four pixels, the number of IC chips 30 can be reduced to one-fourth of the example in Figure 3, thereby reducing the area occupied by the IC chips 30. Also, the IC chip 30 is not essential.

[0067] The area of each IC chip 30 is, for example, 100,000 μm 2 Less than 10,000 μm, preferably 10,000 μm 2 Less than or equal to 5000 μm, more preferably 2 Although the transmittance of the IC chip 30 is low at about 20% or less, by using an IC chip 30 of the above size, the area of low transmittance in the display area 101 becomes narrower, improving visibility on the rear side.

[0068] As shown in FIG. 3, the wiring 40 includes a plurality of power supply lines 41, ground lines 42, row data lines 43, column data lines 44, and drive lines 45. 3, the power supply lines 41, the ground lines 42, and the column data lines 44 extend in the y-axis direction, while the row data lines 43 extend in the x-axis direction.

[0069] In each pixel PIX, the power supply line 41 and the column data line 44 are provided on the negative x-axis side of the light-emitting section 20 and the IC chip 30, and the ground line 42 is provided on the positive x-axis side of the light-emitting section 20 and the IC chip 30. Here, the power supply line 41 is provided on the negative x-axis side of the column data line 44. In each pixel PIX, the row data line 43 is provided on the negative y-axis side of the light-emitting section 20 and the IC chip 30.

[0070] 3, the power supply line 41 includes a first power supply branch line 41a and a second power supply branch line 41b. The ground line 42 includes a ground branch line 42a. The row data line 43 includes a row data branch line 43a. The column data line 44 includes a column data branch line 44a. These branch lines are included in the wiring 40.

[0071] 3, each power supply line 41 extending in the y-axis direction is connected to the light-emitting unit 20 and IC chip 30 of each pixel PIX arranged in the y-axis direction. More specifically, in each pixel PIX, the LED elements 21 to 23 are arranged in this order in the positive x-axis direction on the positive x-axis side of the power supply line 41. Therefore, a first power supply branch line 41a branching in the positive x-axis direction from the power supply line 41 is connected to the ends of the LED elements 21 to 23 on the positive y-axis side.

[0072] In each pixel PIX, the IC chip 30 is disposed on the negative y-axis side of the LED elements 21 to 23. Therefore, a second power supply branch line 41b branching in the negative y-axis direction from the first power supply branch line 41a extends linearly between the LED element 21 and the column data line 44 and is connected to the negative x-axis side of the end of the IC chip 30 on the positive y-axis side.

[0073] 3, each ground line 42 extending in the y-axis direction is connected to the IC chip 30 of each pixel PIX arranged in parallel in the y-axis direction. Specifically, a ground branch line 42a branching off from the ground line 42 in the negative x-axis direction extends linearly and is connected to the end of the IC chip 30 on the positive x-axis side. Here, the ground line 42 is connected to the LED elements 21 to 23 via the ground branch line 42 a, the IC chip 30 , and the drive line 45 .

[0074] 3, each row data line 43 extending in the x-axis direction is connected to the IC chip 30 of each pixel PIX arranged in parallel in the x-axis direction (row direction). Specifically, a branch row data line 43a branching in the positive y-axis direction from each row data line 43 extends linearly and is connected to the end of the IC chip 30 on the negative y-axis direction side. Here, the row data line 43 is connected to the LED elements 21 to 23 via the branch row data line 43 a, the IC chip 30 and the drive line 45 .

[0075] 3, each column data line 44 extending in the y-axis direction is connected to the IC chip 30 of each pixel PIX arranged in parallel in the y-axis direction (column direction). Specifically, a branch column data line 44a branching in the positive x-axis direction from the column data line 44 extends linearly and is connected to the end of the IC chip 30 on the negative x-axis direction side. Here, the column data line 44 is connected to the LED elements 21 to 23 via the branch column data line 44 a, the IC chip 30 and the drive line 45 .

[0076] In each pixel PIX, the drive lines 45 connect the LED elements 21 to 23 to the IC chip 30. Specifically, in each pixel PIX, three drive lines 45 extend in the y-axis direction, and each connects the end of the LED elements 21 to 23 on the negative y-axis side to the end of the IC chip 30 on the positive y-axis side.

[0077] 3 is merely an example and can be modified as appropriate. For example, at least one of the power supply line 41 and the ground line 42 may extend in the x-axis direction instead of the y-axis direction. Also, the power supply line 41 and the column data line 44 may be interchanged.

[0078] Furthermore, the entire configuration shown in FIG. 3 may be inverted vertically or horizontally. Furthermore, the row data lines 43, the column data lines 44 and their branches, and the drive lines 45 are not essential.

[0079] The wiring 40 is made of a metal such as copper (Cu), aluminum (Al), silver (Ag), or gold (Au). Of these, metals containing copper or aluminum as a main component are preferred due to their low resistivity and cost. The wiring 40 may also be coated with a material such as titanium (Ti), molybdenum (Mo), copper oxide, or carbon in order to reduce reflectivity. The surface of the coated material may also be uneven.

[0080] The width of the wiring 40 in the display region 101 shown in FIG. 3 is, for example, 1 μm to 100 μm, and preferably 3 μm to 20 μm. If the width of the wiring 40 is 100 μm or less, the wiring 40 is barely visible even when the transparent display device is observed from a close distance of, for example, several tens of centimeters to 2 meters, and visibility of the rear side is excellent. On the other hand, in the thickness range described below, if the width of the wiring 40 is 1 μm or more, an excessive increase in the resistance of the wiring 40 can be suppressed, and a voltage drop and a decrease in signal strength can be suppressed. Furthermore, a decrease in thermal conductivity due to the wiring 40 can also be suppressed.

[0081] 3, when the wiring 40 extends mainly in the x-axis and y-axis directions, light irradiated from outside the transparent display device may generate cross-shaped diffraction patterns extending in the x-axis and y-axis directions, reducing the visibility of the rear side of the transparent display device. By reducing the width of each wiring, this diffraction can be suppressed, further improving the visibility of the rear side. From the viewpoint of suppressing diffraction, the width of the wiring 40 is 50 μm or less, preferably 10 μm or less, and more preferably 5 μm or less.

[0082] The electrical resistivity of the wiring 40 is, for example, 1.0×10 -6 Ωm or less, preferably 2.0×10 -8 The thermal conductivity of the wiring 40 is, for example, 150 W / (m·K) to 5500 W / (m·K), and preferably 350 W / (m·K) to 450 W / (m·K).

[0083] The distance between adjacent wirings 40 in the display region 101 shown in FIG. 3 is, for example, 3 μm to 100 μm, and preferably 5 μm to 30 μm. If there are areas where the wirings 40 are densely packed, visibility of the rear side may be hindered. If the distance between adjacent wirings 40 is 3 μm or more, such visibility hindrance can be suppressed. On the other hand, if the distance between adjacent wirings 40 is 100 μm or less, sufficient display performance can be ensured. It should be noted that if the spacing between the wirings 40 is not constant due to the wirings 40 being curved or the like, the spacing between the adjacent wirings 40 mentioned above refers to the minimum value.

[0084] The ratio of the area occupied by the wiring 40 to the area of one pixel is, for example, 30% or less, preferably 10% or less, more preferably 5% or less, and even more preferably 3% or less. The transmittance of the wiring 40 is low, for example, 20% or less or 10% or less. However, by setting the ratio of the area occupied by the wiring 40 to one pixel to 30% or less, the area with low transmittance in the display region 101 is narrowed, and visibility on the back side is improved. Furthermore, the total area occupied by the light emitting section 20, IC chip 30, and wiring 40 relative to the area of one pixel is, for example, 30% or less, preferably 20% or less, and more preferably 10% or less.

[0085] <Cross-sectional configuration of the display region 101 (transparent insulating base material 10a)> Next, with reference to FIG. 4, a cross-sectional configuration of the display region 101 formed on the transparent insulating substrate 10a in the transparent display device according to this embodiment will be described. 4, the transparent insulating substrate 10a has a two-layer structure consisting of a main substrate 11 and an adhesive layer 12. The transparent insulating substrate 10a is made of a transparent material having insulating properties. The main substrate 11 is made of, for example, a transparent resin, as will be described in detail later. The adhesive layer 12 is a transparent resin adhesive such as an epoxy-based, acrylic-based, silicone-based, olefin-based, polyimide-based, or novolac-based adhesive. The main substrate 11 may be a thin glass plate having a thickness of, for example, 200 μm or less, preferably 100 μm or less, etc. The adhesive layer 12 is not essential.

[0086] Examples of transparent resins that can be used to form the main substrate 11 include polyester-based resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), olefin-based resins such as cycloolefin polymer (COP) and cycloolefin copolymer (COC), cellulose-based resins such as cellulose, acetyl cellulose, and triacetyl cellulose (TAC), imide-based resins such as polyimide (PI), amide-based resins such as polyamide (PA), amide-imide-based resins such as polyamideimide (PAI), carbonate-based resins such as polycarbonate (PC), sulfone-based resins such as polyethersulfone (PES), paraxylene silicon-based resins such as polyparaxylene, vinyl-based resins such as polyethylene (PE), polyvinyl chloride (PVC), polystyrene (PS), polyvinyl acetate (PVAc), polyvinyl alcohol (PVA), and polyvinyl butyral (PVB), acrylic-based resins such as polymethyl methacrylate (PMMA), urethane-based resins such as ethylene-vinyl acetate copolymer (EVA) and thermoplastic polyurethane (TPU), and epoxy-based resins.

[0087] Among the materials used for the main substrate 11, polyethylene naphthalate and polyimide are preferable from the viewpoint of improving heat resistance. Furthermore, cycloolefin polymer, cycloolefin copolymer, polyvinyl butyral, etc. are preferable because they have low birefringence and can reduce distortion and blurring of images viewed through a transparent insulating substrate. The above materials may be used alone or in combination of two or more materials.Furthermore, main substrate 11 may be formed by laminating flat plates made of different materials.

[0088] The total thickness of the transparent insulating substrate 10a is, for example, 3 μm to 1000 μm, preferably 5 μm to 200 μm. The internal transmittance of the transparent insulating substrate 10a for visible light is, for example, 50% or more, preferably 70% or more, and more preferably 90% or more. The transparent insulating substrate 10a may be flexible, allowing the transparent display device to be attached to a curved transparent plate or sandwiched between two curved transparent plates. The transparent insulating substrate 10a may also be made of a material that shrinks when heated to 100°C or higher.

[0089] 4, the LED elements 21-23 and the IC chip 30 are provided on the transparent insulating base material 10a, i.e., the adhesive layer 12, and are connected to wiring 40 arranged on the transparent insulating base material 10a. In the example of FIG. 4, the wiring 40 is composed of a first metal layer M1 formed on the main substrate 11 and a second metal layer M2 formed on the adhesive layer 12.

[0090] The thickness of the wiring 40, i.e., the sum of the thickness of the first metal layer M1 and the thickness of the second metal layer M2, is, for example, 0.1 μm to 10 μm, preferably 0.5 μm to 5 μm. The thickness of the first metal layer M1 is, for example, about 0.5 μm, and the thickness of the second metal layer M2 is, for example, about 3 μm.

[0091] 4, the ground line 42 extending in the y-axis direction has a two-layer structure including a first metal layer M1 and a second metal layer M2 because it carries a large amount of current. That is, in the area where the ground line 42 is provided, the adhesive layer 12 is removed, and the second metal layer M2 is formed on the first metal layer M1. Although not shown in FIG. 4, the power supply line 41, row data line 43, and column data line 44 shown in FIG. 3 also have a two-layer structure including a first metal layer M1 and a second metal layer M2.

[0092] 3, the power supply lines 41, ground lines 42, and column data lines 44 extending in the y-axis direction intersect with the row data lines 43 extending in the x-axis direction. Although not shown in FIG. 4, at this intersection, the row data lines 43 are made up of only the first metal layer M1, and the power supply lines 41, ground lines 42, and column data lines 44 are made up of only the second metal layer M2. At this intersection, an adhesive layer 12 is provided between the first metal layer M1 and the second metal layer M2, insulating the first metal layer M1 from the second metal layer M2. Similarly, at the intersection of the column data line 44 and the first power supply branch line 41a shown in Figure 3, the first power supply branch line 41a is made up of only the first metal layer M1, and the column data line 44 is made up of only the second metal layer M2.

[0093] 4, the ground branch line 42a, the drive line 45, and the first power supply branch line 41a are made only of the second metal layer M2, and are formed so as to cover the ends of the LED elements 21 to 23 and the IC chip 30. Although not shown in FIG. 4, the second power supply branch line 41b, the row data branch line 43a, and the column data branch line 44a are also made only of the second metal layer M2.

[0094] As described above, the first power supply branch line 41a is made up of only the first metal layer M1 at the intersection with the column data line 44, and is made up of only the second metal layer M2 in other areas. Furthermore, a metal pad made of copper, silver, gold, or the like may be disposed on the wiring 40 formed on the transparent insulating base material 10a, and at least one of the LED elements 21-23 and the IC chip 30 may be disposed thereon.

[0095] The protective layer 50 is a transparent resin formed on substantially the entire surface of the transparent insulating substrate 10a so as to cover and protect the light-emitting section 20, the IC chip 30, and the wiring 40. Here, "substantially the entire surface" means the entire surface of the transparent insulating substrate 10a excluding, for example, the portions electrically connected to the transparent insulating substrate 10b and the flexible wiring board 60. The thickness of the protective layer 50 is, for example, 3 μm to 1000 μm, and preferably 5 to 200 μm. The thickness of the protective layer 50 does not have to be uniform as long as it is within the above range. The modulus of elasticity of the protective layer 50 is, for example, 10 GPa or less. A lower modulus of elasticity allows the protective layer 50 to absorb the impact during peeling and suppress damage to the protective layer 50. The internal transmittance of the protective layer 50 for visible light is, for example, 50% or more, preferably 70% or more, and more preferably 90% or more. The protective layer 50 is not essential.

[0096] Examples of transparent resins that can be used to form the protective layer 50 include vinyl resins such as polyethylene (PE), polyvinyl chloride (PVC), polystyrene (PS), polyvinyl acetate (PVAc), polyvinyl alcohol (PVA), and polyvinyl butyral (PVB); olefin resins such as cycloolefin polymer (COP) and cycloolefin copolymer (COC); urethane resins such as thermoplastic polyurethane (TPU); polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN); acrylic resins such as polymethyl methacrylate (PMMA); and thermoplastic resins such as ethylene-vinyl acetate copolymer (EVA). The transparent resin adhesive that forms the adhesive layer 12 can also be used as the transparent resin that forms the protective layer 50. The protective layer 50 can be formed of one type of transparent resin or multiple types of transparent resins.

[0097] <Cross-sectional configuration of non-display area (transparent insulating substrate 10b)> Next, with reference to FIG. 2, a cross-sectional configuration of the non-display area formed on the transparent insulating substrate 10b in the transparent display device according to this embodiment will be described. As shown in FIG. 2, the transparent insulating substrate 10b does not have a display region 101 formed thereon, but has wiring 40 formed thereon. For example, wiring 40 formed only from the first metal layer M1 described above is formed on the transparent insulating substrate 10b, which is made up only of the main substrate 11 described above. As with the display region 101, a protective layer 50 covering the wiring 40 may be formed on the transparent insulating substrate 10b. The main substrate 11 forming the transparent insulating substrate 10b may be made of the same material as the main substrate 11 forming the transparent insulating substrate 10a. The material of the main substrate 11 forming the transparent insulating substrate 10b may be different from the material of the main substrate 11 forming the transparent insulating substrate 10a.

[0098] <Method of manufacturing a transparent display device> Next, an example of a method for manufacturing the transparent display device according to the first embodiment will be described with reference to Fig. 2 and Fig. 5 to Fig. 12. Fig. 5 to Fig. 12 are cross-sectional views showing an example of a method for manufacturing the transparent display device according to the first embodiment. Fig. 5 to Fig. 12 are cross-sectional views corresponding to Fig. 4, and show how the display region 101 is formed on the transparent insulating substrate 10a.

[0099] 5, a first metal layer M1 is formed on substantially the entire surface of the main substrate 11, and then the first metal layer M1 is patterned by photolithography to form lower layer wiring. Specifically, the lower layer wiring is formed from the first metal layer M1 at positions where the power supply line 41, the ground line 42, the row data line 43, the column data line 44, etc. shown in FIG. 3 are to be formed. Note that no lower layer wiring is formed at the intersections of the power supply lines 41, the ground lines 42, and the column data lines 44 with the row data lines 43.

[0100] Next, as shown in FIG. 6, an adhesive layer 12 is formed on substantially the entire surface of the main substrate 11, and then the LED elements 21 to 23 and the IC chip 30 are mounted on the adhesive layer 12 having tackiness (i.e., on the transparent insulating base material 10a).

[0101] Here, the LED elements 21-23 are obtained by growing crystals on a wafer using, for example, liquid phase epitaxy, HVPE (hydride vapor phase epitaxy), or MOCVD (metal organic chemical vapor deposition), followed by patterning. The LED elements 21-23 patterned on the wafer are then transferred onto the transparent insulating substrate 10a using, for example, microtransfer printing. Similarly to the LED elements 21-23, the IC chip 30 is patterned on, for example, a Si wafer and then transferred onto the transparent insulating substrate 10a using microtransfer printing.

[0102] 7, a photoresist FR1 is formed on substantially the entire surface of the transparent insulating base material 10a including the main substrate 11 and the adhesive layer 12, and then the photoresist FR1 on the first metal layer M1 is removed by patterning. Here, the photoresist FR1 at the intersections of the row data line 43 with the power line 41, the ground line 42, and the column data line 44 shown in FIG. 3 is not removed.

[0103] Next, as shown in FIG. 8, the adhesive layer 12 is removed by dry etching from the area where the photoresist FR1 has been removed, thereby exposing the first metal layer M1, ie, the lower layer wiring. Next, the photoresist FR1 on the transparent insulating base material 10a is completely removed, as shown in Fig. 9. After that, a plating seed layer (not shown) is formed on substantially the entire surface of the transparent insulating base material 10a.

[0104] Next, as shown in FIG. 10, a photoresist FR2 is formed on substantially the entire surface of the transparent insulating base material 10a, and then the photoresist FR2 in the area where the upper layer wiring is to be formed is removed by patterning to expose the seed layer. 11, a second metal layer M2 is formed by plating on the portion from which the photoresist FR2 has been removed, that is, on the seed layer, thereby forming upper layer wiring by the second metal layer M2.

[0105] Next, the photoresist FR2 is removed as shown in Fig. 12. Furthermore, the seed layer exposed by removing the photoresist FR2 is removed by etching. In this way, the display region 101 is formed on the transparent insulating base material 10a.

[0106] On the other hand, although not shown separately, the wiring 40 is formed on the transparent insulating base material 10b as described above. For example, as shown in Fig. 5, the wiring 40 made up of only the above-mentioned first metal layer M1 is patterned on the transparent insulating base material 10b made up of only the main substrate 11.

[0107] 2, one end of the wiring 40 formed on the transparent insulating substrate 10a and one end of the wiring 40 formed on the transparent insulating substrate 10b are joined and electrically connected via a conductive bonding layer 40b. Furthermore, the other end of the wiring 40 is connected to a flexible wiring board 60 at the edge of the transparent insulating substrate 10b. Thereafter, a protective layer 50 may be formed on the transparent insulating substrates 10a and 10b. In this manner, the transparent display device 100 according to this embodiment can be manufactured.

[0108] (Modification of the first embodiment) Next, a transparent display device according to a modified example of the first embodiment will be described with reference to FIGS. 13 to 16 are schematic cross-sectional views showing transparent display devices according to Modifications 1 to 4 of the first embodiment, respectively, and correspond to FIG.

[0109] The transparent display device 100 according to Modification 1 shown in FIG. 13 has an upside-down configuration. That is, the transparent insulating substrate 10a may be formed on the transparent insulating substrate 10b. In the transparent display device 100 according to Modification 1, the display region 101 does not overlap with the second wiring 40 formed on the transparent insulating substrate 10b. Therefore, the transparent display device 100 according to Modification 1 can suppress a decrease in transmittance in the display region 101, and has excellent visibility on the rear side. The same applies to the transparent display devices 100 according to Modifications 2 to 4 described below. 14, the transparent display device 100 according to Modification 2 has a configuration in which the transparent insulating substrate 10b extends over the entire underside of the transparent insulating substrate 10a in the transparent display device 100 according to Modification 1 shown in FIG. 13. That is, the entire transparent insulating substrate 10a (100% of the area of the transparent insulating substrate 10a) overlaps with the transparent insulating substrate 10b. Therefore, when the transparent display device 100 is sealed in laminated glass as described below, the shape of the transparent insulating substrate 10a (i.e., the display region 101) can be stabilized compared to the configurations shown in FIGS. 2 and 13.

[0110] The transparent display device 100 according to Modification 3 shown in Fig. 15 has a configuration in which only the transparent insulating substrate 10a in the transparent display device 100 according to Modification 2 shown in Fig. 14 is inverted upside down. That is, wiring 40 is formed on the upper surface of the transparent insulating substrate 10a. Therefore, the wiring 40 formed on the upper surface of the transparent insulating substrate 10a and the wiring 40 formed on the upper surface of the transparent insulating substrate 10b are connected through vias 40c that penetrate the transparent insulating substrate 10a.

[0111] 16, a transparent display device 100 according to Modification 4 has a configuration in which a transparent insulating substrate 10a including a display region 101 and a transparent insulating substrate 10b connected to a flexible wiring board 60 are connected via a transparent insulating substrate (third transparent insulating substrate) 10c. In this manner, the transparent insulating substrate may be divided into three or more substrates. The transparent insulating substrate 10a and the transparent insulating substrate 10b do not overlap, and wiring 40 is formed on the upper surface of both the transparent insulating substrates 10a and 10b.

[0112] In Modification 4, the negative y-axis side end of the wiring 40 extending in the y-axis direction in the transparent insulating substrate 10a faces the positive y-axis side end of the wiring 40 extending in the y-axis direction in the transparent insulating substrate 10c, and they are connected via the conductive bonding layer 40b. Similarly, the positive y-axis side end of the wiring 40 in the opaque wiring region 40a formed in the transparent insulating substrate 10b faces the negative y-axis side end of the wiring 40 in the opaque wiring region 40a formed in the transparent insulating substrate 10c, and they are connected via the conductive bonding layer 40b.

[0113] Here, the wiring 40 in the opaque wiring region 40a is formed on the transparent insulating base material 10b, but no LED elements are formed on the transparent insulating base material 10b. Therefore, the wiring 40 can be easily formed on the transparent insulating base material 10b by using print patterning instead of patterning by photolithography. On the lower surface of the transparent insulating substrate 10c, both the wiring 40 in the opaque wiring region 40a and the fine wiring 40 are formed.

[0114] (Second embodiment) <Configuration of laminated glass equipped with a transparent display device> Next, the configuration of the laminated glass according to the second embodiment will be described with reference to Figs. 17 and 18. Fig. 17 is a schematic plan view showing an example of the laminated glass according to the second embodiment. Fig. 18 is a cross-sectional view taken along the XVIII-XVIII cutting line in Fig. 17. The laminated glass 200 shown in Figs. 17 and 18 is used as a windshield among window panes of automobiles, but is not particularly limited thereto. For example, the laminated glass according to the embodiment can be used as window panes of moving bodies, i.e., vehicles in general, including trains, ships, and aircraft. Window panes include, in addition to windshields, rear windows, side windows, roof windows, and the like.

[0115] 18, the laminated glass 200 is configured by bonding together a pair of glass plates 220a and 220b that are arranged facing each other with an interlayer film 210 interposed therebetween. In the laminated glass 200, the transparent display device 100 according to the first embodiment shown in FIG. 2 is sandwiched between the pair of glass plates 220a and 220b by the interlayer films 210a and 210b.

[0116] When the laminated glass 200 is installed in a vehicle, for example, the glass sheet 220a is disposed on the vehicle interior side (viewing side) and the glass sheet 220b is disposed on the vehicle exterior side (background side). The interlayer film (first interlayer film) 210a and the interlayer film (second interlayer film) 210b are integrated to form the interlayer film 210. 17 and 18, the transparent display device 100 is provided at the edge of the laminated glass 200, and the flexible wiring board 60 extends from the glass plates 220a and 220b. Note that a plurality of transparent display devices 100 may be arranged inside the laminated glass 200.

[0117] Although FIG. 17 shows the laminated glass 200 in a plan view, the laminated glass 200 may have a curved shape. The curved shape may be a single curved shape curved in one direction, or a compound curved shape curved in two perpendicular directions. When the laminated glass 200 is curved, the radius of curvature is preferably 1,000 mm to 100,000 mm. The radii of curvature of the glass plates 220a and 220b may be the same or different. When the radii of curvature of the glass plates 220a and 220b are different, the radius of curvature of the glass plate 220b is larger than the radius of curvature of the glass plate 220a. In addition, in FIG. 17, the planar shape of the laminated glass 200 is rectangular, but it is not limited to a rectangular shape and may be any shape including a trapezoid, a parallelogram, a triangle, or the like.

[0118] 2 is installed so that the edges of the transparent insulating substrates 10a and 10b do not overlap with predetermined test areas on the glass plates 220a and 220b. The predetermined test areas are "test area A" defined in the "Test Area for Optical Properties and Light Fastness of Safety Glass" appendix of JIS Standard R3212:2015 (Test Methods for Automotive Safety Glass). If the edges of the transparent insulating substrates 10a and 10b overlap with "test area A," there is a risk that the driver's field of vision may be adversely affected by reflection or scattering, or that tests for perspective distortion, etc. may not be passed.

[0119] Here, in FIG. 17, a "test area A" is shown schematically. 17, in other words, when the transparent insulating substrate 10a is located outside the test area A, it includes the case where the transparent insulating substrate 10a overlaps with and encompasses the entire test area A. The same applies to the transparent insulating substrate 10b.

[0120] 17, a strip-shaped shielding layer 201 is provided around the entire periphery of the laminated glass 200. The shielding layer 201 blocks sunlight, thereby preventing ultraviolet light from deteriorating the adhesive (e.g., urethane resin) used to attach the laminated glass 200 to the automobile. Although FIG. 17 is a plan view, the shielding layer 201 and the opaque wiring area 40a are shown as dots to facilitate understanding.

[0121] In the example shown in FIG. 18, when the laminated glass 200 is installed in a vehicle, the shielding layer 201 is formed on the interior side of the glass plate 220a and the interior side of the glass plate 220b. The shielding layer 201 may be formed only on either the surface of the glass plate 220a facing the interior of the vehicle or the surface of the glass plate 220b facing the interior of the vehicle. 17 and 18, the shielding layer 201 is formed so as to overlap the flexible wiring board 60 and the opaque wiring area 40a. This makes it difficult for the flexible wiring board 60 and the opaque wiring area 40a to be seen from the inside and outside of the vehicle, thereby improving the design of the laminated glass 200.

[0122] 17 and 18, part of the periphery of the transparent insulating substrates 10a and 10b of the transparent display device 100 overlaps with the shielding layer 201, making it difficult to see. For example, when the transparent display device 100 is enlarged, the entire periphery of the transparent insulating substrates 10a and 10b may overlap with the shielding layer 201.

[0123] Furthermore, the portion where the flexible wiring board 60 and the opaque wiring region 40a are provided is preferably within 20 mm, and more preferably within 15 mm, from the edge of the glass plate 220a or 220b, since this can be easily concealed by the body frame or interior materials of the vehicle. Furthermore, if the laminated glass 200 is a door glass that is slidably assembled to a vehicle, the portion where the opaque wiring region 40a is provided is preferably within 15 mm, and more preferably within 10 mm, from the edge of the glass plate 220a or 220b, since this can be easily concealed by the door sash.

[0124] The shielding layer 201 is not particularly limited, and can be formed, for example, by applying a ceramic color paste containing a fusible glass frit containing a pigment and firing it. For example, the shielding layer 201 may be formed by applying an organic ink containing a pigment and drying it. The shielding layer 201 may also be formed from a colored film. The color of the pigment and the colored film may be any color as long as they can block visible light to an extent that can be concealed at least in the area that needs to be concealed, but a dark color is preferable, and black is more preferable. The shielding layer 201 is preferably opaque.

[0125] Here, the glass plates 220a and 220b and the interlayer film 210 will be described in detail. The glass plates 220a and 220b may be inorganic glass or organic glass. Examples of inorganic glass that can be used include, without particular limitation, soda-lime glass, aluminosilicate glass, borosilicate glass, alkali-free glass, and quartz glass. The glass plate 220b located on the vehicle exterior is preferably inorganic glass from the viewpoint of scratch resistance, and soda-lime glass from the viewpoint of formability. The glass plates 220a and 220b may be glass that absorbs ultraviolet or infrared light. Transparent glass is preferred, but colored glass may also be used as long as transparency is not impaired. When the glass plates 220a and 220b are soda-lime glass, clear glass, green glass containing a predetermined amount or more of iron, and UV-cut green glass are suitable.

[0126] The inorganic glass may be either untempered glass or tempered glass. Untempered glass is produced by forming molten glass into a plate shape and slowly cooling it. Tempered glass is produced by forming a compressive stress layer on the surface of untempered glass.

[0127] The tempered glass may be either physically tempered glass such as air-cooled tempered glass or chemically tempered glass. Physically tempered glass can be tempered by generating a compressive stress layer on the glass surface due to the temperature difference between the glass surface and the interior of the glass through an operation other than slow cooling, such as rapidly cooling a glass sheet uniformly heated during bending from a temperature near its softening point.

[0128] For example, chemically strengthened glass can be strengthened by bending and then applying compressive stress to the glass surface by an ion exchange method or the like.

[0129] On the other hand, examples of materials for organic glass include transparent resins such as polycarbonate, acrylic resins such as polymethyl methacrylate, polyvinyl chloride, and polystyrene.

[0130] The shape of the glass plates 220a, 220b is not particularly limited to a rectangular shape, and may be processed into various shapes and curvatures. Gravity forming, press forming, roller forming, etc. are used to bend the glass plates 220a, 220b. The forming method of the glass plates 220a, 220b is also not particularly limited, but for example, in the case of inorganic glass, glass plates formed by a float method or the like are preferred.

[0131] When the laminated glass 200 is installed in a vehicle, the thickness of the glass plate 220b located on the vehicle exterior side is preferably 1.5 mm to 3.0 mm at its thinnest part. A thickness of 1.5 mm or more of the glass plate 220b provides sufficient strength for resistance to flying stones, while a thickness of 3.0 mm or less prevents the weight of the laminated glass from becoming too large, which is preferable in terms of vehicle fuel economy. The thickness of the glass plate 220b at its thinnest part is more preferably 1.5 to 2.8 mm, and even more preferably 1.5 to 2.6 mm.

[0132] When the laminated glass 200 is installed in a vehicle, the thickness of the glass sheet 220a located on the interior side of the vehicle is preferably 0.3 mm to 2.3 mm. If the thickness of the glass sheet 220a is 0.3 mm or more, it is easy to handle, and if it is 2.3 mm or less, the weight does not become too large.

[0133] Each of the glass sheets 220a, 220b does not have to have a constant thickness, but may have a thickness that varies from location to location as necessary. For example, if the laminated glass 200 is a windshield, each of the glass sheets 220a, 220b may have a wedge shape that increases in thickness from the bottom edge to the top edge of the windshield when the windshield is installed in a vehicle. In this case, if the film thickness of the interlayer film 210 is constant, the total wedge angle of the glass sheets 220a, 220b varies, for example, within a range of more than 0 mrad to 1.0 mrad.

[0134] The laminated glass 200 may be provided on the outer surfaces of the glass plates 220a and 220b with coatings that have water-repellent properties, UV-blocking properties, and / or infrared-blocking properties, or coatings that have low reflectivity and / or low radiation properties. The laminated glass 200 may also be provided on the inner surfaces (the sides in contact with the interlayer 210) of the glass plates 220a and 220b with coatings that block UV rays, block infrared rays, have low radiation properties, absorb visible light, or are colored.

[0135] When the glass plates 220a and 220b are inorganic glass, they are bent after being formed by a float method or the like and before being bonded with the interlayer film 210. The bending is performed by heating the glass to soften it. The heating temperature of the glass during bending is about 550°C to 700°C.

[0136] Thermoplastic resins are often used for the intermediate film 210. Examples include plasticized polyvinyl acetal resins, plasticized polyvinyl chloride resins, saturated polyester resins, plasticized saturated polyester resins, polyurethane resins, plasticized polyurethane resins, ethylene-vinyl acetate copolymer resins, ethylene-ethyl acrylate copolymer resins, cycloolefin polymer resins, and ionomer resins. Furthermore, resin compositions containing modified hydrogenated block copolymers, as described in Japanese Patent No. 6065221, can also be suitably used.

[0137] Among these, plasticized polyvinyl acetal resins are preferably used because they have an excellent balance of properties such as transparency, weather resistance, strength, adhesive strength, penetration resistance, impact energy absorption, moisture resistance, heat insulation, and sound insulation. These thermoplastic resins may be used alone or in combination of two or more. The term "plasticized" in the plasticized polyvinyl acetal resin means that the resin has been plasticized by adding a plasticizer. The same applies to other plasticized resins.

[0138] However, depending on the type of transparent display device, degradation may occur due to a specific plasticizer, and in such cases, it is preferable to use a resin that does not substantially contain that plasticizer as the intermediate film 210. Examples of resins that do not contain plasticizers include ethylene-vinyl acetate copolymer resins.

[0139] Examples of the polyvinyl acetal resin include polyvinyl formal resin obtained by reacting polyvinyl alcohol (PVA) with formaldehyde, polyvinyl acetal resin in the narrow sense obtained by reacting PVA with acetaldehyde, and polyvinyl butyral resin (PVB) obtained by reacting PVA with n-butylaldehyde. PVB is particularly preferred because of its excellent balance of properties such as transparency, weather resistance, strength, adhesive strength, penetration resistance, impact energy absorption, moisture resistance, heat insulation, and sound insulation. These polyvinyl acetal resins may be used alone or in combination of two or more.

[0140] However, the material of the interlayer film 210 is not limited to thermoplastic resin. The interlayer film 210 may also contain functional particles such as an infrared absorbing agent, an ultraviolet absorbing agent, or a luminescent agent. The interlayer film 210 may also have a colored portion called a shade band.

[0141] Furthermore, the interlayer films 210a and 210b included in the interlayer film 210 are preferably made of the same material, but may be made of different materials. The interlayer film 210 may have three or more layers. For example, the sound insulation of the laminated glass 200 can be improved by forming an additional interlayer film between the interlayer films 210a and 210b and making the shear modulus of that interlayer film smaller than the shear modulus of the interlayer films 210a and 210b by adjusting the plasticizer or the like. In this case, the shear modulus of the interlayer films 210a and 210b may be the same or different. Furthermore, at least one of the interlayer films 210a and 210b may have three or more layers.

[0142] The thickness of the interlayer film 210 is preferably 0.5 mm or more at its thinnest part. When the thickness of the interlayer film 210 is 0.5 mm or more, the necessary penetration resistance for laminated glass is sufficient. The minimum thickness of the interlayer film 210 is more preferably 0.7 mm or more, and even more preferably 1.0 mm or more. Furthermore, the thickness of the interlayer film 210 is preferably 3.5 mm or less at its thickest part. When the maximum thickness of the interlayer film 210 is 3.5 mm or less, the weight of the laminated glass does not become too large. The maximum thickness of the interlayer film 210 is more preferably 3.4 mm or less, even more preferably 2.8 mm or less, and particularly preferably 2.6 mm or less.

[0143] Next, a method for manufacturing the laminated glass 200 will be described. First, the intermediate films 210a and 210b and the transparent display device 100 are sandwiched between the glass plates 220a and 220b to form a laminate. Next, for example, this laminate is placed in a rubber bag and bonded at a temperature of 70°C to 110°C in a vacuum with a gauge pressure of -65 kPa to -100 kPa. The heating conditions, temperature conditions, and lamination method are appropriately selected so that the transparent display device 100 does not deteriorate during manufacturing.

[0144] Furthermore, by performing the pressure bonding treatment under conditions of, for example, a temperature of 100°C to 150°C and an absolute pressure of 0.6 MPa to 1.3 MPa, a more durable laminated glass 200 can be obtained. However, in some cases, this pressure bonding treatment is not performed in consideration of simplification of the process or the properties of the material to be sealed in the laminated glass 200.

[0145] The total thickness of the laminated glass 200 is preferably 2.8 mm to 10 mm. If the total thickness of the laminated glass 200 is 2.8 mm or more, sufficient rigidity can be ensured. If the total thickness of the laminated glass 200 is 10 mm or less, sufficient transmittance can be obtained and haze can be reduced.

[0146] Fig. 19 is a schematic cross-sectional view showing another example of laminated glass according to Embodiment 2. The laminated glass 200 in Fig. 19 includes the transparent display device 100 according to Modification 2 in Fig. 14 instead of the transparent display device 100 according to Embodiment 1 shown in Fig. 2.

[0147] Furthermore, the laminated glass 200 has a protective layer 50 formed to cover the transparent display device 100. That is, the protective layer 50 is formed to cover the transparent insulating substrate 10a and surround the periphery of the transparent insulating substrate 10a. This makes it difficult to see the periphery of the transparent insulating substrate 10a, which is preferable. The protective layer 50 may also be an intermediate film (third intermediate film). The protective layer 50 may have different types of transparent resin in the portion including the space between the transparent insulating substrates 10a and 10b and in the other portions.

[0148] The vehicle window glass may be a double-glazed glass in which the laminated glass 200 and at least one or more glass sheets are spaced apart via a spacer. When the vehicle window glass is a double-glazed glass, a hollow layer is provided between the laminated glass 200 and the glass sheets. The hollow layer may be filled with dry air or a rare gas such as krypton or argon. The hollow layer may also be a vacuum. When the hollow layer is a vacuum, a plurality of gap-retaining members made of a metal material such as stainless steel or a resin material may be placed between the laminated glass 200 and the glass sheets in the hollow layer region to maintain a gap between the laminated glass 200 and the glass sheets. The spacers may be made of a metal such as aluminum, or a resin such as polyamide or polypropylene. When the vehicle window glass is a double-glazed glass, the laminated glass 200 may be placed on either the exterior or interior side of the vehicle.

[0149] Furthermore, since there are no legal restrictions on the visible light transmittance of window glass other than the windshield, any visible light transmittance can be set. Therefore, in the laminated glass 200, the total visible light transmittance of the members located on the inside or outside of the vehicle relative to the transparent display device 100 may be set to, for example, 50% or less. This makes it difficult to see the transparent insulating substrate 10a, the periphery of the transparent insulating substrate 10b, the wiring 40, the light-emitting unit 20, etc. from the inside or outside of the vehicle.

[0150] For example, the glass sheet 220a located on the vehicle interior side may be privacy glass. Alternatively, the interlayer film 210a located on the vehicle interior side may be a tinted interlayer film. Furthermore, the laminated glass 200 may be provided with a tinted film (including a smoked film) or a light control element separately. The same applies to the glass sheet 220b located on the vehicle exterior side and the interlayer film 210b located on the vehicle exterior side.

[0151] Privacy glass is glass with lower transparency than green glass and clear glass, and is also called dark gray glass. Privacy glass can be realized by adjusting the total iron content converted to Fe2O3. The visible light transmittance of privacy glass can be adjusted to approximately 40% to 50% when the plate thickness is 1.8 mm, and approximately 30% to 45% when the plate thickness is 2.0 mm, for example. Privacy glass is described in detail in, for example, International Publication No. 2015 / 088026, the contents of which are incorporated herein by reference.

[0152] A colored interlayer film is an interlayer film with lower transparency than a clear interlayer film. Here, the visible light transmittance of a clear interlayer film is, for example, approximately 90% to 95% when the film thickness is 0.76 mm. A colored interlayer film is obtained by coloring the materials listed above for the interlayer film 210. Specifically, a colorant is added to a composition containing mainly a thermoplastic resin to obtain a colored interlayer film. The colored interlayer film may contain a plasticizer to adjust the glass transition temperature.

[0153] The laminated glass 200 may also have a reduced total visible light transmittance of the members located on the vehicle exterior side of the transparent display device 100. This makes it even more difficult to see the transparent insulating substrate 10a, the peripheries of the transparent insulating substrate 10b, the wiring 40, the light-emitting section 20, etc. from the vehicle exterior side and also from the vehicle interior side. The laminated glass 200 may also have a reduced total visible light transmittance of the members located on the vehicle interior side of the transparent display device 100. This makes it even more difficult to see the transparent insulating substrate 10a, the peripheries of the transparent insulating substrate 10b, the wiring 40, the light-emitting section 20, etc. from the vehicle interior side and also from the vehicle exterior side.

[0154] (Third embodiment) <Configuration of transparent display device> Next, the configuration of a transparent display device according to the third embodiment will be described with reference to Fig. 20. Fig. 20 is a schematic partial plan view showing an example of a transparent display device according to the third embodiment. As shown in Fig. 20, the transparent display device according to this embodiment includes a sensor 70 in the display region 101 in addition to the configuration of the transparent display device according to the first embodiment shown in Fig. 3. In other words, it has a function as a transparent sensing device.

[0155] 20, the sensor 70 is provided between predetermined pixels PIX and is connected to a power supply line 41 and a ground line 42. Detection data by the sensor 70 is output via a data output line 46 extending from the sensor 70 in the y-axis direction. On the other hand, a control signal is input to the sensor 70 via a control signal line 47 extending to the sensor 70 in the y-axis direction, thereby controlling the sensor 70. There may be one or more sensors 70. Multiple sensors 70 may be arranged at predetermined intervals, for example, in the x-axis or y-axis direction.

[0156] In the following description, the transparent display device according to this embodiment is mounted on the windshield of an automobile window glass, which means that the transparent display device according to this embodiment can also be applied to the laminated glass according to the second embodiment.

[0157] The sensor 70 is, for example, an illuminance sensor (e.g., a light receiving element) for detecting the illuminance inside and outside the vehicle. For example, the luminance of the display area 101 formed by the LED elements 21-23 is controlled according to the illuminance detected by the sensor 70. For example, the luminance of the display area 101 formed by the LED elements 21-23 is increased as the illuminance outside the vehicle increases relative to the illuminance inside the vehicle. This configuration further improves the visibility of the transparent display device.

[0158] Furthermore, the sensor 70 may be an infrared sensor (e.g., a light-receiving element) or an image sensor (e.g., a CMOS (Complementary Metal-Oxide-Semiconductor) image sensor) for detecting the line of sight of an observer (e.g., a driver). For example, the transparent display device is driven only when the sensor 70 detects the line of sight. For example, when the transparent display device is used in the laminated glass shown in FIG. 17, the transparent display device does not obstruct the view of the observer unless the observer directs his or her line of sight toward the transparent display device, which is preferable. Alternatively, the sensor 70, which is an image sensor, may have a function of detecting the observer's movement and, based on the movement, for example, turning the transparent display device on or off or switching the display screen. The other configurations are the same as those of the transparent display device according to the first embodiment.

[0159] (Fourth embodiment) <Configuration of transparent sensing device> Next, the configuration of a transparent sensing device according to the fourth embodiment will be described with reference to FIG. 21. FIG. 21 is a schematic partial plan view showing an example of a transparent sensing device according to the fourth embodiment. As shown in FIG. 21, the transparent sensing device according to this embodiment has a configuration in which each pixel PIX has a sensor 70 instead of the light-emitting unit 20 and the IC chip 30 in the configuration of the transparent display device according to the first embodiment shown in FIG. 3. In other words, the transparent sensing device shown in FIG. 21 does not have a light-emitting unit 20 and does not have a display function. The transparent sensing device is one aspect of a transparent electronic device. Note that the sensing region in the transparent sensing device may correspond to the display region 101 in the transparent display device 100.

[0160] The sensor 70 is not particularly limited, but in the transparent sensing device shown in FIG. 21, it is a CMOS image sensor. That is, the transparent sensing device shown in FIG. 21 has an imaging area 301 composed of a plurality of pixels PIX arranged in the row direction (x-axis direction) and column direction (y-axis direction), and has an imaging function. FIG. 21 shows a part of the imaging area 301, showing two pixels in each of the row and column directions, for a total of four pixels. Here, one pixel PIX is shown surrounded by a dashed dot line. Also, in FIG. 21, as in FIG. 3, the transparent insulating substrate 10a and the protective layer 50 are omitted. Also, although FIG. 21 is a plan view, the sensor 70 is shown as dots to facilitate understanding.

[0161] 21, one sensor 70 is provided for each pixel PIX, and is disposed between and connected to a power supply line 41 and a ground line 42 extending in the y-axis direction. Detected data by the sensor 70 is output via a data output line 46 extending from the sensor 70 in the y-axis direction. Meanwhile, a control signal is input to the sensor 70 via a control signal line 47 extending to the sensor 70 in the y-axis direction, thereby controlling the sensor 70. The control signal is, for example, a synchronization signal or a reset signal. The power supply line 41 may be connected to a battery (not shown).

[0162] Here, Fig. 22 is a schematic cross-sectional view of the sensor 70. The sensor 70 shown in Fig. 22 is a back-illuminated CMOS image sensor. Note that the image sensor used for the sensor 70 is not particularly limited, and may be a front-illuminated CMOS image sensor or a CCD (Charge-Coupled Device) image sensor.

[0163] 22, each sensor 70 includes a wiring layer, a semiconductor substrate, color filters CF1 to CF3, and microlenses ML1 to ML3. Internal wiring IW is formed inside the wiring layer. Photodiodes PD1 to PD3 are formed inside the semiconductor substrate.

[0164] A semiconductor substrate (e.g., a silicon substrate) is formed on the wiring layer. Internal wiring IW formed inside the wiring layer connects wiring 40 (power supply line 41, ground line 42, data output line 46, and control signal line 47) to photodiodes PD1 to PD3. When light is irradiated onto the photodiodes PD1 to PD3, a current is output from the photodiodes PD1 to PD3. The currents output from the photodiodes PD1 to PD3 are each amplified by an amplifier circuit (not shown) and output via the internal wiring IW and the data output line 46.

[0165] The color filters CF1 to CF3 are formed on the photodiodes PD1 to PD3 formed inside the semiconductor substrate, respectively. The color filters CF1 to CF3 are, for example, a red filter, a green filter, and a blue filter, respectively. The microlenses ML1 to ML3 are placed on the color filters CF1 to CF3, respectively. Light collected by the microlenses ML1 to ML3, which are convex lenses, is incident on the photodiodes PD1 to PD3 via the color filters CF1 to CF3, respectively.

[0166] The sensor 70 according to this embodiment occupies an area of 250,000 μm on the transparent insulating substrate 10 a. 2 In other words, in this specification, a microsensor is a microsensor having an area of 250,000 μm in plan view. 2 The sensor 70 has a small size of, for example, 25,000 μm 2 Less than or equal to 2500 μm, preferably 2 The lower limit of the area occupied by the sensor 70 is, for example, 10 μm 2 due to various manufacturing conditions. 2 That's all. The shape of the sensor 70 shown in FIG. 21 is rectangular, but is not particularly limited to this.

[0167] The transparent sensing device according to this embodiment can also be applied to the laminated glass according to the second embodiment. When the transparent sensing device according to this embodiment is mounted on the windshield of a vehicle (for example, an automobile), the sensor 70 can capture, for example, images of at least one of the interior and exterior of the vehicle. That is, the transparent sensing device according to this embodiment functions as a drive recorder.

[0168] The sensor 70 in the transparent sensing device according to the fourth embodiment may be a single sensor. The sensor 70 in the transparent sensing device according to the fourth embodiment is not limited to an image sensor, and may be an illuminance sensor, an infrared sensor, or the like, as exemplified in the third embodiment. Furthermore, the sensor 70 may be a radar sensor, a lidar sensor, or the like. A vehicle window glass equipped with a transparent sensing device using these sensors 70 can be used to monitor, for example, the inside or outside of a vehicle.

[0169] That is, the sensor 70 according to the fourth embodiment occupies an area of 250,000 μm on the transparent insulating substrate 10 a. 2 There are no particular limitations on the sensor 70 as long as it is a microsensor having the following minute size: For example, the sensor 70 may be a temperature sensor, an ultraviolet sensor, a radio wave sensor, a pressure sensor, a sound sensor, a speed / acceleration sensor, or the like. The other configurations are the same as those of the transparent display device according to the first embodiment.

[0170] The present invention is not limited to the above-described embodiment, and can be modified as appropriate within the scope of the invention. For example, the transparent display device may have a touch panel function.

[0171] This application claims priority based on Japanese Patent Application No. 2020-180421, filed on October 28, 2020, the disclosure of which is incorporated herein in its entirety. [Explanation of symbols]

[0172] 10a, 10b, 10c Transparent insulating substrate 11 Main board 12 Adhesive layer 20 Light-emitting part 21~23 LED elements 30 IC chips 40 Wiring 40a Opaque wiring area 40b Conductive bonding layer 40c via 41 Power line 41a First power branch line 41b Second power branch line 42 Ground Line 42a Grand Branch Line 43 data lines 43a Data branch line 44 column data lines 44a Column data branch line 45 Drive line 46 Data output line 47 Control signal line 50 protective layer 60 Flexible wiring board 70 sensors 100 Transparent display device 101 Display area 200 Laminated Glass 201 Shielding layer 210, 210a, 210b interlayer 220a, 220b Glass plates 301 Imaging area AM alignment mark CF1~CF3 color filters FR1, FR2 photoresist IW Internal wiring M1 First metal layer M2 Second metal layer ML1~ML3 Micro Lenses PD1~PD3 photodiodes PIX

Claims

1. A transparent insulating substrate; A 250,000 μm thick film is formed on the main surface of the transparent insulating substrate. ２ an electronic element having an area of: an opaque power supply body that supplies power to the electronic element; the electronic element is a light-emitting diode element or a sensor; The transparent insulating substrate is a first transparent insulating substrate having the electronic element and a first wiring connected to the electronic element formed on one main surface thereof; a second transparent insulating substrate having a second wiring formed on one main surface thereof; the second transparent insulating substrate does not have the electronic element formed thereon; one end of the first wiring and one end of the second wiring are electrically connected, and the opaque power supply body is connected to the other end of the second wiring at an edge of the second transparent insulating substrate; Transparent electronic devices.

2. the first transparent insulating substrate and the second transparent insulating substrate overlap each other in a plan view; one end of the first wiring and one end of the second wiring are electrically connected in an overlapping portion between the first transparent insulating substrate and the second transparent insulating substrate; The transparent electronic device of claim 1 .

3. the first transparent insulating substrate entirely overlaps the second transparent insulating substrate in a plan view; The transparent electronic device of claim 2 .

4. the one main surface of the first transparent insulating substrate and the one main surface of the second transparent insulating substrate face each other and overlap each other in a plan view; The transparent electronic device according to claim 2 or 3.

5. a region of the first transparent insulating substrate in which the electronic elements are arranged does not overlap with the second wiring; The transparent electronic device according to any one of claims 1 to 4.

6. the electronic element is a light-emitting diode element, The light-emitting diode elements constitute a transparent display device. The transparent electronic device according to any one of claims 1 to 5.

7. the second transparent insulating substrate is flexible; The transparent electronic device according to any one of claims 1 to 6.

8. one end of the first wiring and one end of the second wiring are electrically connected via a conductive bonding layer; The transparent electronic device according to any one of claims 1 to 7.

9. A pair of glass plates arranged opposite each other; first and second interlayer films provided between the pair of glass plates; The transparent electronic device according to any one of claims 1 to 8 is sandwiched between the first and second intermediate films. Laminated glass.

10. A shielding layer is formed on the peripheral edge of at least one of the pair of glass plates. The laminated glass according to claim 9.

11. an opaque wiring region is formed at the periphery of the transparent electronic device, in which at least one of the first and second wirings is formed to have a large width; the opaque wiring region is disposed so as to overlap the shielding layer in a plan view; The laminated glass according to claim 10.

12. The opaque power feeder is disposed so as to overlap the shielding layer in a plan view. The laminated glass according to claim 10 or 11.

13. a peripheral edge of at least one of the first and second transparent insulating substrates is disposed so as to overlap with the shielding layer in a plan view; The laminated glass according to any one of claims 10 to 12.

14. a protective layer covering the first transparent insulating substrate is formed between the first and second intermediate films; The laminated glass according to any one of claims 9 to 13.

15. the protective layer includes an interlayer film separate from the first and second interlayer films; The laminated glass according to claim 14.

16. The pair of glass plates are curved. The laminated glass according to any one of claims 9 to 15.

17. The laminated glass is for a vehicle, The thickness of the glass plate located on the vehicle exterior side of the pair of glass plates is 1.5 mm to 3.0 mm. The laminated glass according to any one of claims 9 to 16.

18. The periphery of the first transparent insulating substrate does not overlap, in plan view, with "test area A" defined in the appendix "Test area for optical properties and light resistance of safety glass" of JIS standard R3212:2015 (Test methods for automotive safety glass). The laminated glass according to any one of claims 9 to 17.

19. The periphery of the second transparent insulating substrate does not overlap, in plan view, with the "test area A" defined in the appendix "Test area for optical properties and light resistance of safety glass" of JIS standard R3212:2015 (Test methods for automotive safety glass). The laminated glass according to any one of claims 9 to 18.

20. On one main surface of the first transparent insulating substrate, ２ forming an electronic element having an area of: forming a second wiring on one main surface of a second transparent insulating substrate without forming the electronic element; one end of the first wiring and one end of the second wiring are electrically connected, and an opaque power supply body that supplies power to the electronic element is connected to the other end of the second wiring at an edge of the second transparent insulating substrate. Method for manufacturing transparent electronic devices.

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