Electronic devices including displays

Abstract

To provide an electronic device including a display on which a printing layer is arranged so that it is possible to inspect whether cracks or chipping have occurred on the periphery of the glass. [Solution] An electronic device is disclosed that includes a display panel having a folded state and an unfolded state, glass arranged in a first direction toward which the front of the display panel faces, a protective layer arranged in the first direction of the glass, a first printed layer arranged between the glass and the protective layer, and a second printed layer arranged in a second direction toward which the rear of the glass faces, wherein the first printed layer is arranged at a distance in a third direction that is a direction from the periphery of the glass toward an active area of ​​the display panel, and one end of the second printed layer is arranged to correspond to the periphery of the display panel.

Description

[Technical Field]

[0001] The present invention relates to electronic devices that include displays. [Background technology]

[0002] The electronic device includes a display that displays a screen. The display includes an active area where the screen is displayed and a non-display area surrounding the active area. When the display is viewed from the front side, a printed layer is disposed along the periphery of the active area to reduce visibility of the interior of the periphery of the active area. The printed layer is made of a light-blocking material.

[0003] A display is composed of multiple layers, including a display panel on which pixels are arranged. Recently, electronic devices that can change the electronic device and display between a folded state and an unfolded state, such as foldable electronic devices, have appeared. Multiple layers can be implemented so that the display can be folded and unfolded multiple times. For example, the multiple layers can be made of flexible materials. Another example is to reduce the thickness of the multiple layers. Summary of the Invention [Problem to be solved by the invention]

[0004] The multiple layers that make up the display include glass. The glass is disposed between the display panel and a protective layer that protects the front surface of the display panel. The glass improves the visibility, aesthetics, and tactile feel of the front surface of the display. The thickness of the glass disposed in the foldable electronic device is reduced to enable the display to be folded and unfolded multiple times. As the glass thickness is reduced, cracks or chipping may occur around the periphery of the glass.

[0005] It is necessary to inspect the periphery of the glass from the front of the display for cracks or chips. If a printing layer is disposed along the periphery of the active area, it may not be easy to inspect the periphery of the glass for cracks or chips.

[0006] Various embodiments disclosed herein aim to provide an electronic device including a display in which a printing layer is disposed so that the peripheral edge of the glass can be inspected for cracks or chips. [Means for solving the problem]

[0007] An electronic device according to one aspect of the present invention disclosed in this specification includes a display panel having a folded state and an unfolded state, a glass arranged in a first direction toward which the front surface of the display panel faces, a protective layer arranged in the first direction of the glass, a first printed layer arranged between the glass and the protective layer, and a second printed layer arranged in a second direction toward which the rear surface of the glass faces, wherein the first printed layer is arranged spaced apart in a third direction, which is a direction from the periphery of the glass toward an active area of the display panel, and one end of the second printed layer is arranged to correspond to the periphery of the display panel.

[0008] Furthermore, an electronic device according to another aspect of the present invention disclosed in this specification includes a display panel having a folded state and an unfolded state, glass arranged in a first direction of the display panel, a protective layer arranged in the first direction of the glass, a first printed layer arranged between the glass and the protective layer, and a second printed layer arranged in a second direction toward which the rear surface of the glass faces, wherein the first printed layer is arranged a first distance away in a third direction that is a direction from the periphery of the glass toward the active area of the display panel, one end of the second printed layer is arranged to correspond to the periphery of the display panel, and when viewed from the first direction, the first printed layer and the second printed layer overlap by a second distance. [Effects of the Invention]

[0009] According to the embodiments of the present invention disclosed herein, the first printed layer placed on top of the glass is positioned away from the periphery of the glass, making it possible to inspect whether cracks or chips have occurred on the periphery of the glass.

[0010] Furthermore, according to the embodiments of the present invention disclosed in this specification, by placing a second printed layer below the glass so as to at least partially overlap the first printed layer, the phenomenon of the peripheral structure of the display being visible can be reduced.

[0011] In addition, the present specification provides various other effects that can be directly or indirectly grasped. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a block diagram of an electronic device in a network environment in accordance with various embodiments. [Figure 2] FIG. 1 is a block diagram of a display module according to various embodiments. [Figure 3] 1 illustrates an electronic device in an expanded state according to one embodiment. [Figure 4] 1A and 1B illustrate an electronic device in a folded state according to an embodiment. [Figure 5] FIG. 1 is an exploded perspective view of an electronic device according to one embodiment. [Figure 6] FIG. 2 is a side view of a display of an electronic device according to one embodiment. [Figure 7] FIG. 2 is a side view of a display of an electronic device according to one embodiment. [Figure 8] FIG. 2 is a side view of a display of an electronic device according to one embodiment. [Figure 9] FIG. 2 is a side view of a display of an electronic device according to one embodiment. [Figure 10] FIG. 2 is a side view of a display of an electronic device according to one embodiment. [Figure 11]FIG. 1 is a front view of an electronic device according to one embodiment. [Figure 12] FIG. 1 is a cross-sectional view of an electronic device taken along line BB' according to an embodiment. [Figure 13] FIG. 1 is a front view of an electronic device according to one embodiment. [Figure 14] FIG. 2 is a cross-sectional view of an electronic device taken along line CC' in accordance with an embodiment. [Figure 15] FIG. 1 is a cross-sectional view of an electronic device taken along line BB' according to an embodiment. [Figure 16a] FIG. 1 is a front view of an electronic device according to one embodiment. [Figure 16b] FIG. 1 is a front view of an electronic device according to one embodiment. [Figure 17] FIG. 2 is a front view of a first inspection area of an electronic device according to one embodiment. [Figure 18] FIG. 18 is a cross-sectional view taken along line DD' in FIG. [Figure 19a] FIG. 2 is a front view of a mechanism portion of an electronic device according to an embodiment. [Figure 19b] FIG. 19b is a cross-sectional view taken along line EE' in FIG. 19a. [Figure 20a] FIG. 10 is a front view of a second printed layer of an electronic device according to one embodiment. [Figure 20b] FIG. 20b is a cross-sectional view taken along line FF' in FIG. 20a. [Figure 21] FIG. 1 is a front view of an electronic device according to one embodiment. [Figure 22] 22 is a cross-sectional view taken along line GG' in FIG. 21. [Figure 23] FIG. 1 is a front view of an electronic device according to one embodiment. [Figure 24] FIG. 2 is a front view of a first mechanism portion of an electronic device according to one embodiment. [Figure 25] FIG. 2 is a front view of a second mechanism portion of the electronic device according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0013] Various embodiments of the present invention will now be described with reference to the drawings, but it should be understood that this is not intended to limit the present invention to the particular embodiments, but rather to encompass various modifications, equivalents, and / or alternatives to the embodiments of the present invention.

[0014] With respect to the description of the drawings, the same or similar reference numerals are used for the same or similar components.

[0015] 1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments. Referring to FIG. 1 , in the network environment 100, the electronic device 101 communicates with an electronic device 102 via a first network 198 (e.g., a short-range wireless communication network) or with an electronic device 104 or a server 108 via a second network 199 (e.g., a long-range wireless communication network). In one embodiment, the electronic device 101 communicates with the electronic device 104 via the server 108. In one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an acoustic output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connecting terminal 178, a haptic module 179, a camera module 180, a drive unit 181, a rotating unit 183, a power management module 188, a battery 189, a communication module 190, a subscriber identity module 196, or an antenna module 197. In some embodiments, electronic device 101 may omit at least one of these components (e.g., connection terminal 178) or may include one or more other components. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) may be integrated into a single component (e.g., display module 160).

[0016] Processor 120 executes software (e.g., program 140), for example, to control at least one other component (e.g., a hardware or software component) of electronic device 101 coupled to processor 120 and perform various data processing or computations. According to one embodiment, as at least part of the data processing or computations, processor 120 stores instructions or data received from other components (e.g., sensor module 176 or communications module 190) in volatile memory 132, processes the instructions or data stored in volatile memory 132, and stores the resulting data in non-volatile memory 134. According to one embodiment, processor 120 includes a main processor 121 (e.g., a central processing unit or application processor) or an auxiliary processor 123 (e.g., a graphics processing unit, a neural network processing unit (NPU), an image signal processor, a sensor hub processor, or a communications processor), which may operate independently or in conjunction with main processor 121. For example, if electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be configured to use less power or to specialize in designated functions than the main processor 121. The auxiliary processor 123 may be embodied separately from or as part of the main processor 121.

[0017] The auxiliary processor 123 controls at least a portion of the functions or states of at least one component of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) in place of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or together with the main processor 121 while the main processor 121 is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) is embodied as part of another functionally related component (e.g., the camera module 180 or the communication module 190). In one embodiment, the auxiliary processor 123 (e.g., a neural network processing unit) includes a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models are generated by machine learning. Such learning occurs, for example, within the electronic device 101 itself where the artificial intelligence is performed, or via a separate server (e.g., the server 108). The learning algorithm may be, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the above examples. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be, for example, a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the above examples.The artificial intelligence model may include software structures in addition to or instead of hardware structures.

[0018] The memory 130 stores various data used by at least one component (e.g., the processor 120 or the sensor module 176) of the electronic device 101. The data includes, for example, input data or output data for software (e.g., the program 140) and instructions related thereto. The memory 130 includes a volatile memory 132 or a non-volatile memory 134.

[0019] The programs 140 are stored as software in the memory 130 and include, for example, an operating system 142 , middleware 144 , or applications 146 .

[0020] Input module 150 receives instructions or data from outside (e.g., a user) electronic device 101 for use by components (e.g., processor 120) of electronic device 101. Input module 150 includes, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus pen).

[0021] The audio output module 155 outputs audio signals external to the electronic device 101. The audio output module 155 may include, for example, a speaker or a receiver. The speaker is used for general purposes such as multimedia playback or recording playback. The receiver is used to receive incoming phone calls. In one embodiment, the receiver is embodied separately from or as part of the speaker.

[0022] Display module 160 visually presents information to an external (e.g., user) of electronic device 101. Display module 160 may include, for example, a display, a holographic device, or a projector and control circuitry for controlling the device. In one embodiment, display module 160 includes a touch sensor configured to sense a touch or a pressure sensor configured to measure the strength of a force generated by a touch.

[0023] Audio module 170 converts sound into electrical signals and vice versa. In one embodiment, audio module 170 receives sound via input module 150 or outputs sound via acoustic output module 155 or an external electronic device (e.g., electronic device 102) (e.g., a speaker or headphones) directly or wirelessly coupled to electronic device 101.

[0024] The sensor module 176 senses an operating state (e.g., power or temperature) of the electronic device 101 or an external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the sensed state. In one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0025] Interface 177 supports one or more specified protocols used for electronic device 101 to directly or wirelessly interface with external electronic devices (e.g., electronic device 102). In one embodiment, interface 177 includes, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0026] The connection terminal 178 includes a connector through which the electronic device 101 is physically connected to an external electronic device (e.g., the electronic device 102). According to one embodiment, the connection terminal 178 includes, for example, an HDMI (registered trademark) connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0027] Haptic module 179 converts electrical signals into mechanical (e.g., vibration or movement) or electrical stimuli that can be perceived by the user through a tactile or kinesthetic sense. In one embodiment, haptic module 179 includes, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0028] Camera module 180 captures still and video images and, according to one embodiment, includes one or more lenses, an image sensor, an image signal processor, or a flash.

[0029] The driver 181 moves the display module 160 inside and / or outside the electronic device 101. The driver 181 controls the display module 160 to be converted between a normal mode in which the display module 160 is disposed inside the electronic device 101 and an expanded mode in which the display module 160 is expanded outside the electronic device 101. The driver 181 may be, but is not limited to, a slide-type rail structure and / or a motor disposed inside the electronic device 101.

[0030] The rotating unit 183 serves as a support that moves the display module 160 inside and / or outside the electronic device 101 or supports the display device 160 when the display module 160 moves inside and / or outside the electronic device 101. The rotating unit 183 rolls up the rollable display module 160 and inserts it into the interior, or unrolls the display module 160 and extends it outside the electronic device 101. The rotating unit 183 is a cylindrical rotating body disposed on the side of the electronic device 101.

[0031] The power management module 188 manages the power supplied to the electronic device 101. In one embodiment, the power management module 188 is embodied, for example, as at least part of a power management integrated circuit (PMIC).

[0032] Battery 189 provides power to at least one component of electronic device 101. According to one embodiment, battery 189 includes, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0033] Communications module 190 facilitates establishing a direct (e.g., wired) or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108) and conducting communication over the established communication channel. Communications module 190 may include one or more communications processors that operate independently of processor 120 (e.g., an application processor) and facilitate direct (e.g., wired) or wireless communication. In one embodiment, communications module 190 includes wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or wired communication module 194 (e.g., a local area network (LAN) communication module, or a power line communication module). The appropriate one of these communication modules communicates with an external electronic device 104 via a first network 198 (e.g., a short-range communication network such as Bluetooth®, WiFi® (wireless fidelity) direct, or IrDA (infrared data association)) or a second network 199 (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various communication modules may be integrated into a single component (e.g., a single chip) or embodied as multiple separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in a subscriber identity module 196 to identify or authenticate the electronic device 101 within a communication network such as the first network 198 or the second network 199.

[0034] The wireless communication module 192 supports 5G networks and next-generation communication technologies, such as new radio access technology (NR). NR access technology supports high-speed transmission of large amounts of data (eMBB (enhanced mobile broadband)), minimizing terminal power and connecting multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module 192 supports, for example, high-frequency bands (e.g., mmWave bands) to achieve high data rates. The wireless communication module 192 supports various technologies to ensure performance in high-frequency bands, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, and large-scale antennas. The wireless communication module 192 supports various requirements defined by the electronic device 101, an external electronic device (e.g., the electronic device 104), or a network system (e.g., the second network 199). According to one embodiment, the wireless communication module 192 supports a peak data rate (e.g., 20 Gbps or more) for implementing eMBB, a loss coverage (e.g., 164 dB or less) for implementing mMTC, or a U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less for a round trip) for implementing URLLC.

[0035] The antenna module 197 transmits or receives signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module 197 includes an antenna including a radiator made of a conductor or conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module 197 may include multiple antennas (e.g., an array antenna). In such a case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the multiple antennas by, for example, the communication module 190. Signals or power are transmitted or received between the communication module 190 and an external electronic device via the selected at least one antenna. In one embodiment, other components (e.g., a radio frequency integrated circuit (RFIC)) besides the radiator are further formed as part of the antenna module 197.

[0036] According to various embodiments, antenna module 197 forms an mmWave antenna module. According to one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC supporting a designated high frequency band (e.g., the mmWave band) disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board, and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second side (e.g., top or side) of the printed circuit board that transmit or receive signals in the designated high frequency band.

[0037] At least some of the above components are connected to each other via a peripheral communication method (e.g., a bus, a general purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and exchange signals (e.g., commands or data) with each other.

[0038] In one embodiment, commands or data are transmitted or received between the electronic device 101 and the external electronic devices 104 via a server 108 coupled to a second network 199. Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device 101. In one embodiment, all or part of the operations performed by the electronic device 101 are performed by one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device 101 requests one or more external electronic devices to perform the function or service or at least part of the function or service instead of or in addition to performing the function or service itself. The one or more external electronic devices that receive the request perform at least part of the requested function or service or additional functions or services related to the request and communicate the results of the execution to the electronic device 101. The electronic device 101 provides the result as at least part of a response to the request, either directly or after further processing. For example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used for this purpose. The electronic device 101 provides ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 includes an Internet of Things (IoT) device. The server 108 is an intelligent server using machine learning and / or neural networks. In one embodiment, the external electronic device 104 or the server 108 is included in a second network 199. The electronic device 101 is applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technologies.

[0039] FIG. 2 is a block diagram 200 of display module 160 according to various embodiments. Referring to FIG. 2, display module 160 includes display 210 and a display driver IC (DDI) 230 for controlling the display 210. DDI 230 includes an interface module 231, memory 233 (e.g., buffer memory), image processing module 235, or mapping module 237. DDI 230 receives video information, including, for example, video data or video control signals corresponding to instructions for controlling the video data, from other components of electronic device 101 via interface module 231. For example, in one embodiment, video information is received from processor 120 (e.g., main processor 121 (e.g., application processor)) or auxiliary processor 123 (e.g., graphics processing unit) that operates independently of the functions of main processor 121. DDI 230 communicates with touch circuitry 250, sensor module 176, or the like via interface module 231. The DDI 230 also stores at least a portion of the received video information in the memory 233, for example, on a frame-by-frame basis. The image processing module 235, for example, pre-processes or post-processes (e.g., adjusts resolution, brightness, or size) at least a portion of the video data based at least on characteristics of the video data or characteristics of the display 210. The mapping module 237 generates voltage or current values corresponding to the video data pre-processed or post-processed by the image processing module 135. According to one embodiment, the generation of the voltage or current values is based at least in part on attributes of the pixels of the display 210 (e.g., the pixel arrangement (RGB stripe or pentile structure) or the size of each subpixel). At least a portion of the pixels of the display 210 are driven based at least in part on the voltage or current values, thereby displaying visual information (e.g., text, images, or icons) corresponding to the video data on the display 210.

[0040] In one embodiment, display module 160 further includes touch circuitry 250. Touch circuitry 250 includes touch sensor 251 and a touch sensor IC 253 for controlling the touch sensor 251. Touch sensor IC 253 controls touch sensor 251 to sense touch or hover input, for example, relative to a specified location on display 210. For example, touch sensor IC 253 senses touch or hover input by measuring a change in a signal (e.g., voltage, light intensity, resistance, or charge amount) relative to the specified location on display 210. Touch sensor IC 253 provides information (e.g., position, area, pressure, or duration) related to the sensed touch or hover input to processor 120. In one embodiment, at least a portion of touch circuitry 250 (e.g., touch sensor IC 253) is included in display driver IC 230, or as part of display 210, or as part of another component (e.g., auxiliary processor 123) located outside display module 160.

[0041] In one embodiment, the display module 160 further includes at least one sensor (e.g., a fingerprint sensor, an iris sensor, a pressure sensor, or an illuminance sensor) of the sensor module 176, or control circuitry therefor. In this case, the at least one sensor or control circuitry therefor is embedded in a portion of the display module 160 (e.g., the display 210 or the DDI 230) or in a portion of the touch circuit 250. For example, if the sensor module 176 embedded in the display module 160 includes a biometric sensor (e.g., a fingerprint sensor), the biometric sensor acquires biometric information (e.g., a fingerprint image) associated with a touch input via a portion of the display 210. As another example, if the sensor module 176 embedded in the display module 160 includes a pressure sensor, the pressure sensor acquires pressure information associated with a touch input via a portion or the entire area of the display 210. In one embodiment, the touch sensor 251 or the sensor module 176 is disposed between pixels in a pixel layer of the display 210, or above or below the pixel layer.

[0042] 3 is a diagram illustrating an unfolded state of the electronic device 101 according to one embodiment. The electronic device 101 according to one embodiment is a foldable electronic device 101 in which the electronic device 101 and the display 210 can be changed between a folded state and an unfolded state.

[0043] In one embodiment, the electronic device 101 includes a housing 300, a hinge cover 330 that covers a folding portion of the housing 300, and a display 210 disposed within a space formed by the housing 300. In this specification, the surface on which the display 210 is disposed is defined as a first surface or the front side of the electronic device 101. In addition, in this specification, the surface opposite the front surface is defined as a second surface or the rear surface of the electronic device 101. In addition, a surface that surrounds the space between the front and rear surfaces is defined as a third surface or the side surface of the electronic device 101.

[0044] In one embodiment, the housing 300 includes a first front housing 310, a second front housing 320, a first rear cover 380, and a second rear cover 390. The housing 300 is not limited to the shapes and combinations illustrated in Figures 3 and 4. The housing 300 may be realized using other shapes, combinations, and / or combinations of parts. For example, in another embodiment, the first front housing 310 and the first rear cover 380 are integrally formed. In another embodiment, the second front housing 320 and the second rear cover 390 are integrally formed.

[0045] In one embodiment, the first front housing 310 and the second front housing 320 are disposed on either side of a folding axis (A axis), which is the boundary along which the electronic device 101 and the display 210 are folded. The first front housing 310 and the second front housing 320 have shapes that are generally symmetrical with respect to the folding axis (A axis). The angle and distance between the first front housing 310 and the second front housing 320 change depending on whether the electronic device 101 and the display 210 are in an unfolded state, a folded state, or an intermediate state.

[0046] In one embodiment, the first front housing 310 and the second front housing 320 together form a recess that accommodates the display 210. At least a portion of the first front housing 310 and the second front housing 320 is formed of a metallic or non-metallic material having rigidity equal to or greater than a specified critical value for supporting the display 210.

[0047] In one embodiment, the display 210 is disposed in a space formed by the housing 300. For example, the display 210 is placed in a recess formed by the housing 300. The display 210 makes up most of the front surface of the electronic device 101.

[0048] In one embodiment, at least a portion of the display 210 is deformed into a flat or curved surface. The display 210 includes a folding region 213, which is a region that is folded or unfolded, a first region 211 disposed on one side of the folding region 213 (e.g., the left side of the folding region 213 as illustrated in FIG. 3), and a second region 212 disposed on the other side of the folding region 213 (e.g., the right side of the folding region 213 as illustrated in FIG. 3). The division of the regions of the display 210 illustrated in FIG. 3 is merely exemplary, and the display 210 may be divided into multiple regions based on structure or function. For example, as in the display 210 illustrated in FIG. 3, the regions of the display 210 are divided by the folding region 213 extending vertically or a folding axis (A axis) of the display 210. As another example, the regions of the display 210 are divided based on the folding region extending horizontally or another folding axis. The first region 211 and the second region 212 have shapes that are symmetrical overall with respect to the folding region 213. However, if the display 210 includes a sensor region 524, the first region 211 and the second region 212 have asymmetric shapes.

[0049] In one embodiment, the display 210 further includes a sensor region 214. The sensor region 214 is formed to occupy a predetermined area within the second region 212 of the display 210. However, without being limited thereto, the sensor region 214 may be formed within the first region 211 or may be divided into the first region 211 and the second region 212.

[0050] In one embodiment, the sensor area 214 is adjacent to one side edge of the first front housing 310 and / or the second front housing 320. For example, the sensor area 214 is adjacent to the top corner of the second front housing 320. The arrangement, shape, and size of the sensor area 214 are not limited to the illustrated example. For example, the sensor area 214 may be formed in the bottom corner of the second front housing 320 or in any area between the top and bottom corners. The sensor area 214 is disposed at the bottom end of the first area 211 and / or the second area 212 of the display 210. The display 210 of FIG. 3 is an Infinity-O Display in which the entire display area except for the front camera and sensor holes is embodied as a display area, and the sensor area 214 including the front camera is embodied integrally with the first area 211 and / or the second area 212 of the display 210.

[0051] In one embodiment, the pixel structure of the first region 211 and / or the second region 212 disposed at the top of the sensor region 214 is different from the pixel structure of the remaining first region 211 and / or the second region 212. For example, the first region 211 and / or the second region 212 disposed at the top of the sensor region 214 has a lower pixel density than the remaining first region 211 and / or the second region 212. As another example, the pixels disposed in the first region 211 and / or the second region 212 disposed at the top of the sensor region 214 have a smaller size than the pixels disposed in the remaining first region 211 and / or the second region 212. As another example, the shape and / or configuration of the pixels disposed in the first region 211 and / or the second region 212 disposed at the top of the sensor region 214 is narrower or longer than the pixels disposed in the remaining first region 211 and / or the second region 212.

[0052] In one embodiment, components for performing various functions within electronic device 101 are visually exposed on the front surface of electronic device 101 through sensor area 214 or through one or more openings in sensor area 214. In various embodiments, the components include various sensors (e.g., sensor module 176 of FIG. 1 ). The sensors may include, for example, at least one of a front-facing camera, a receiver, or a proximity sensor.

[0053] In one embodiment, the first rear cover 380 is disposed on the rear of the electronic device 101. The first rear cover 380 is disposed on one side of the folding axis (axis A). The first rear cover 380 has a substantially rectangular periphery. The periphery of the first rear cover 380 is enclosed by the first front housing 310.

[0054] In one embodiment, the second rear cover 390 is disposed on the rear of the electronic device 101. The second rear cover 390 is disposed on the opposite side of the first rear cover 380 around the folding axis (axis A). The second rear cover 390 has a substantially rectangular periphery. The periphery of the second rear cover 390 is enclosed by the second front housing 320.

[0055] In one embodiment, the first rear cover 380 and the second rear cover 390 have shapes that are substantially symmetrical about the folding axis (axis A). However, the first rear cover 380 and the second rear cover 390 do not necessarily have shapes that are symmetrical to each other, and in other embodiments, the electronic device 101 includes first rear covers 380 and second rear covers 390 with various shapes. In yet other embodiments, the first rear cover 380 is formed integrally with the first front housing 310, and the second rear cover 390 is formed integrally with the second front housing 320.

[0056] In one embodiment, the front surface of electronic device 101 includes display 210, a portion of first front housing 310 adjacent to display 210, and a portion of second front housing 320. The rear surface of electronic device 101 includes first rear cover 380, a portion of first front housing structure 310 adjacent to first rear cover 380, second rear cover 390, and a portion of second front housing 320 adjacent to second rear cover 390.

[0057] In one embodiment, the first front housing 310, the second front housing 320, the first rear cover 380, and the second rear cover 390 form a space in which various components of the electronic device 101 (e.g., a printed circuit board (PCB) or a battery) may be placed.

[0058] In one embodiment, one or more components are disposed or visually exposed on the rear of electronic device 101. For example, at least a portion of sub-display 382 is visually exposed through first rear cover 380. As another example, at least a portion of rear sensor module 392 (e.g., sensor module 176 in FIG. 1 ) is visually exposed through second rear cover 390. Rear sensor module 392 includes a proximity sensor and / or a rear camera.

[0059] In one embodiment, when the electronic device 101 is in the unfolded state, the first front housing 310 and the second front housing 320 are arranged to face the same direction at an angle of approximately 180 degrees. When the display 210 is in the unfolded state, the surfaces of the first region 211 and the second region 212 of the display 210 form an angle of approximately 180 degrees with each other. When the display 210 is in the unfolded state, the first region 211 and the second region 212 of the display 210 face the same direction (e.g., toward the front of the electronic device 101). When the display 210 is in the unfolded state, the folding region 213 forms the same plane as the first region 211 and the second region 212.

[0060] FIG. 4 is a diagram illustrating the electronic device 101 in a folded state according to one embodiment.

[0061] In one embodiment, the hinge cover 330 is disposed between the first front housing 310 and the second front housing 320. The hinge cover 330 covers the space between the first front housing 310 and the second front housing 320. The hinge cover 330 covers the hinge structure between the first front housing 310 and the second front housing 320. When the electronic device 101 is in the unfolded state, the hinge cover 330 is covered by a portion of the first front housing 310 and the second front housing 320. When the electronic device 101 is in the folded state, the hinge cover 330 is exposed to the outside. The hinge cover 330 includes a curved surface.

[0062] In one embodiment, when electronic device 101 is in the folded state, first front housing 310 and second front housing 320 are disposed opposite each other. When display 210 is in the folded state, the surfaces of first region 211 and second region 212 of display 210 form a narrow angle (e.g., between 0 degrees and approximately 10 degrees) with each other. When display 210 is in the folded state, first region 211 and second region 212 of display 210 face each other. When display 210 is in the folded state, at least a portion of folding region 213 changes into a curved surface having a first curvature.

[0063] In one embodiment, when the electronic device 101 is in an intermediate state between the unfolded state and the folded state, the first front housing 310 and the second front housing 320 are disposed at an angle between 0 degrees and 180 degrees. When the display 210 is in the intermediate state, the surfaces of the first region 211 and the second region 212 of the display 210 form an angle that is greater than in the folded state and smaller than in the unfolded state. When the display 210 is in the intermediate state, at least a portion of the folding region 213 changes into a curved surface having a second curvature. The second curvature is smaller than the first curvature.

[0064] 5 is an exploded perspective view of an electronic device 101 according to an embodiment. The electronic device 101 according to an embodiment includes a display 210, a bracket assembly 400, a base unit 500, a first front housing 310, a second front housing 320, a first rear cover 380, and a second rear cover 390.

[0065] In one embodiment, the display 210 includes a first region 211 , a second region 212 , a folding region 213 , a sensing region 214 , and a layer structure 215 .

[0066] In one embodiment, the layer structure 215 mounts the display 210 in a recess in the housing 330. The layer structure 215 is made up of one or more plates. The layer structure 215 is placed on the bracket assembly 400.

[0067] In one embodiment, the bracket assembly 400 is disposed between the layer structure 215 and the substrate portion 500. The bracket assembly 400 includes a first bracket 410, a second bracket 420, a hinge cover 330 disposed between the first bracket 410 and the second bracket 420, and a wiring member 430 that crosses the first bracket 410 and the second bracket 420.

[0068] In one embodiment, the first bracket 410 is disposed between the first region 211 of the display 210 and the first substrate 510 of the substrate unit 500. The second bracket 420 is disposed between the second region 212 of the display 210 and the second substrate 520 of the substrate unit 500.

[0069] In one embodiment, the wiring member 430 is disposed in a direction (e.g., the X-axis direction) that intersects the first bracket 410 and the second bracket 420. The wiring member 430 is disposed in a direction (e.g., the X-axis direction) that is perpendicular to the folding axis (e.g., the y-axis or the folding axis (A-axis) in FIG. 3) of the folding region 213 of the electronic device 101. The wiring member 430 is a flexible printed circuit board (FPCB).

[0070] In one embodiment, the board unit 500 includes a first board 510 disposed on the first bracket 410 side and a second board 520 disposed on the second bracket 420 side. The first board 510 and the second board 520 are disposed inside a space formed by the bracket assembly 400, the first front housing 310, the second front housing 320, the first rear cover 380, and the second rear cover 390. Components for realizing various functions of the electronic device 101 are disposed on the first board 510 and the second board 520.

[0071] In one embodiment, the first front housing 310 and the second front housing 320 are assembled to each other so as to be coupled to either side of the bracket assembly 400 with the display 210 coupled to the bracket assembly 400. The first front housing 310 and the second front housing 320 slide onto either side of the bracket assembly 400 to couple with the bracket assembly 400.

[0072] In one embodiment, the first front housing 310 includes a first rotation support surface 312. The second front housing 320 includes a second rotation support surface 322 that corresponds to the first rotation support surface 312. The first rotation support surface 312 and the second rotation support surface 322 include curved surfaces that correspond to the curved surfaces included in the hinge cover 330.

[0073] In one embodiment, the first rotation support surface 312 and the second rotation support surface 322 cover the hinge cover 330 when the electronic device 101 is in the unfolded state (e.g., the electronic device 101 in FIG. 3 ), so that the hinge cover 330 is not exposed or is only minimally exposed on the rear surface of the electronic device 101 when the electronic device 101 is in the unfolded state.

[0074] In one embodiment, when the electronic device 101 is in a folded state (e.g., the electronic device 101 in FIG. 4), the first rotating support surface 312 and the second rotating support surface 322 rotate along a curved surface included in the hinge cover 330. This allows the hinge cover 530 to be maximally exposed to the rear surface of the electronic device 101 when the electronic device 101 is in a folded state.

[0075] 6 is a side view 600 of a display (e.g., display 210 of FIGS. 2-5) of an electronic device (e.g., electronic device 101 of FIGS. 1 and 3-5) according to one embodiment. Display 210 of electronic device 101 according to one embodiment includes a metal layer 610, a lower panel protective layer 620, a display panel 630, an adhesive layer 640, glass 650, a protective layer 660, a first printed layer 601, and a second printed layer 602.

[0076] In one embodiment, the metal layer 610 forms the rearmost layer based on a first direction (+Z-axis direction) that is a direction toward the front of the display 210. When the first direction (+Z-axis direction) is upward, the metal layer 610 is disposed at the bottom end of the display 210. The metal layer 610 is disposed in a second direction (-Z-axis direction) of the panel lower protection layer 620. The bottom surface of the metal layer 610 is visible in a second direction (-Z-axis direction) that is opposite to the first direction (+Z-axis direction). The second direction (-Z-axis direction) is a direction toward the rear of the display 210. The metal layer 610 contacts a bracket assembly (e.g., bracket assembly 400 of FIG. 5) disposed in the second direction (-Z-axis direction) of the display 210. The metal layer 610 is electrically connected to a substrate unit (e.g., substrate unit 500 of FIG. 5). The metal layer 610 has a lattice structure. The metal layer 610 applies a driving voltage to drive pixels included in the display 210. The thickness of the metal layer 610 is greater than the thickness of the display panel 630. The thickness of the metal layer 610 is about 150 μm to about 200 μm. As another example, the metal layer 610 is electrically connected to a ground layer (not shown) of a substrate unit (e.g., substrate unit 500 in FIG. 5).

[0077] In one embodiment, the lower panel protection layer 620 is disposed in a first direction (+Z-axis direction) of the metal layer 610. When the first direction (+Z-axis direction) is upward, the lower panel protection layer 620 is disposed on top of the metal layer 610. The lower panel protection layer 620 is disposed in a second direction (-Z-axis direction) of the display panel 630. The lower panel protection layer 620 is disposed between the metal layer 610 and the display panel 630. The periphery of the lower panel protection layer 620 is spaced apart from the periphery of the metal layer 610 in a third direction (-X-axis direction) perpendicular to the first direction (+Z-axis direction). The third direction (-X-axis direction) is a direction toward an active area of the display 210 where a screen is displayed. The lower panel protection layer 620 connects the metal layer 610 and the display panel 630. The lower panel protection layer 620 is commonly referred to as a C-panel. The thickness of the panel lower protection layer 620 is not less than about 60 μm and not more than about 100 μm.

[0078] In one embodiment, the panel lower protection layer 620 includes an emboss layer, a cushion layer, a PET (Polyethylene Terephthalate) layer, and / or a composite sheet. The PET layer is a colored layer, such as a black layer.

[0079] In one embodiment, the display panel 630 is disposed in the first direction (+Z-axis direction) of the panel lower protection layer 620. When the first direction (+Z-axis direction) is upward, the display panel 630 is disposed on top of the panel lower protection layer 620. The periphery of the display panel 630 is formed to be spaced apart from the periphery of the panel lower protection layer 620 in the +X-axis direction, which is the opposite direction to the third direction (-X-axis direction). The periphery of the display panel 630 is formed to correspond to the periphery of the metal layer 610. The thickness of the display panel 630 in the first direction (+Z-axis direction) is thicker than the thickness of the panel lower protection layer 620 in the first direction (+Z-axis direction). The thickness of the display panel 630 is between approximately 800 μm and approximately 120 μm. The display panel 630 includes an active area that displays a screen in the first direction (+Z-axis direction) and a non-display area surrounding the active area. The display panel 630 includes one or more layers for displaying a screen.

[0080] In one embodiment, one or more layers included in the display panel 630 are manufactured using a 1:1 cutting method, whereby the edges of one or more layers included in the display panel 630 are cut at the same time, so that the edges of the one or more layers included in the display panel 630 correspond to each other.

[0081] In one embodiment, the display panel 630 includes a film layer 631 , a light-emitting layer 632 , a panel adhesive layer 633 , and a polarizing layer 634 .

[0082] In one embodiment, the film layer 631 forms the bottom of the display panel 630. The film layer 631 allows the display panel 630 to be flexible and foldable. The film layer 631 is made of polyimide and / or PET (Polyethylene Terephthalate).

[0083] In one embodiment, the light-emitting layer 632 is disposed in the first direction (+Z-axis direction) of the film layer 631. The light-emitting layer 632 emits light in response to a driving voltage to display a screen.

[0084] In one embodiment, the panel adhesive layer 633 is disposed in the first direction (+Z axis direction) of the light emitting layer 632. The panel adhesive layer 633 bonds the polarizing layer 634 to the top of the light emitting layer 632. The panel adhesive layer 633 is made of a pressure-sensitive adhesive.

[0085] In one embodiment, the polarizing layer 634 is disposed in the first direction (+Z-axis direction) of the panel adhesive layer 633. The polarizing layer 634 blocks at least a portion of externally incident light from being reflected from the display panel 630. The polarizing layer 634 increases the visibility of the screen displayed by the light-emitting layer 632.

[0086] In one embodiment, the polarizing layer 634 is included in the light-emitting layer 632. If the light-emitting layer 632 also functions as the polarizing layer 634, the polarizing layer 634 and the panel adhesive layer 633 are omitted. However, if the black adhesive layer 635 of FIG. 8 is included, the polarizing layer 634 and the panel adhesive layer 633 are required.

[0087] In one embodiment, the adhesive layer 640 is disposed in the first direction (+Z-axis direction) of the display panel 630. When the first direction (+Z-axis direction) is upward, the adhesive layer 640 is disposed on the top of the display panel 630. The adhesive layer 640 is disposed between the display panel 630 and the glass 650. The periphery of the adhesive layer 640 is formed to be spaced apart in the third direction (-X-axis direction) from the periphery of the display panel 630. The thickness of the adhesive layer 640 in the first direction (+Z-axis direction) is thinner than the thickness of the display panel 630 in the first direction (+Z-axis direction). The thickness of the adhesive layer 640 is between about 40 μm and about 60 μm. The adhesive layer 640 attaches the glass 650 to the top surface of the display panel 630. The adhesive layer 640 is a pressure-sensitive adhesive (PSA). For example, the adhesive layer 640 includes an optically clear adhesive (OCA).

[0088] In one embodiment, the glass 650 is disposed in the first direction (+Z-axis direction) of the adhesive layer 640. When the first direction (+Z-axis direction) is upward, the glass 650 is disposed on top of the adhesive layer 640. The periphery of the glass 650 is formed to be spaced apart from the periphery of the display panel 630 in the third direction (-X-axis direction). The periphery of the glass 650 is formed to be spaced apart from the periphery of the adhesive layer 640 in the direction opposite to the third direction (-X-axis direction). The thickness of the glass 650 in the first direction (+Z-axis direction) is thinner than the thickness of the adhesive layer 640 in the first direction (+Z-axis direction). The thickness of the glass 650 is approximately 25 μm or more and approximately 40 μm or less. The glass 650 improves the visibility and / or aesthetics of the screen displayed on the display panel 630 when viewed from the first direction (+Z-axis direction). The glass 650 improves the tactile sensation when a user performs a touch input on the display panel 630 in a first direction (+Z-axis direction). The glass 650 is ultra-thin tempered glass (UTG). The glass 650 has a first strength.

[0089] In one embodiment, the protective layer 660 is disposed in a first direction (+Z-axis direction) of the glass 650. When the first direction (+Z-axis direction) is upward, the protective layer 660 is disposed on top of the glass 650. The periphery of the protective layer 660 is formed to correspond to the periphery of the display panel 630. The periphery of the protective layer 660 is formed to be spaced apart from the periphery of the glass 650 in the direction (+X-axis direction) opposite to the third direction (-X-axis direction). The thickness of the protective layer 660 in the first direction (+Z-axis direction) is thicker than the thickness of the glass 650 in the first direction (+Z-axis direction). The thickness of the protective layer 660 is approximately 40 μm or more and approximately 80 μm or less. The protective layer 660 protects the glass 650 from impacts from the first direction (+Z-axis direction). The protective layer 660 has a second strength. The second strength is lower than the first strength. The protective layer 660 is made of a flexible non-metallic, plastic, and / or polymeric material, for example, polyimide.

[0090] In one embodiment, the thickness of the glass 650 in the first direction (+Z-axis direction) is set so that the display 210 can be folded or unfolded multiple times. As the thickness of the glass 650 in the first direction (+Z-axis direction) decreases, cracks or chipping may occur at the edge of the glass. Whether cracks or chips have occurred at the edge of the glass 650 is inspected from the first direction (+Z-axis direction), which is the front side of the display 210.

[0091] In one embodiment, the first printed layer 601 is disposed in a first direction (+Z-axis direction) of the glass 650. When the first direction (+Z-axis direction) is upward, the first printed layer 601 is disposed on top of the glass 650. The first printed layer 601 is disposed between the glass 650 and the protective layer 660. The first printed layer 601 is printed on the bottom of the protective layer 660. Alternatively, the first printed layer 601 is printed on the top of the glass 650. The first printed layer 601 is made of a light-blocking material. The first printed layer 601 is formed by applying a light-blocking black or colored material to the bottom of the protective layer 660 or the top of the glass 650 using an ink-jet method. The first printed layer 601 may also be formed by curing the light-blocking material on the bottom of the protective layer 660 or the top of the glass 650 using an ultraviolet (UV) curing method.

[0092] In one embodiment, the first printed layer 601 reduces a phenomenon in which at least a portion of the non-display area of the display panel 630 is viewed from a first direction (+Z-axis direction). For example, the first printed layer 601 reduces a phenomenon in which color leakage is visible below an area adjacent to an active area in the non-display area of the display panel 630. For example, the first printed layer 601 includes a black matrix.

[0093] In one embodiment, the first printed layer 601 is spaced apart from the periphery of the glass 650 in a third direction (negative X-axis direction). The third direction (negative X-axis direction) is toward the active area of the display panel 630. The first printed layer 601 is spaced apart from the periphery of the glass 650 in the third direction (negative X-axis direction) by a first distance D1.

[0094] In one embodiment, the first distance D1 is set to inspect in a first direction (+Z-axis direction) whether cracks or chips have occurred on the periphery of the glass 650. The first distance D1 is set to ensure an inspection area in which cracks or chips occurring on the periphery of the glass 650 can be inspected using an inspection device arranged in the first direction (+Z-axis direction). For example, the first distance D1 is within 2 mm.

[0095] In one embodiment, the first distance D1 is set to be longer than the distance by which the periphery of the adhesive layer 640 is spaced from the periphery of the display panel 630 in the third direction (-X-axis direction). The first printed layer 601 is disposed at a greater distance from the adhesive layer 640 in the third direction (-X-axis direction). When the first printed layer 601 is disposed at a greater distance from the adhesive layer 640 in the third direction (-X-axis direction), the periphery of the adhesive layer 640 can be inspected from the first direction (+Z-axis direction). This makes it possible to inspect whether defects such as air bubbles have occurred at the periphery of the adhesive layer 640.

[0096] In one embodiment, the second printed layer 602 is disposed in the second direction (-Z axis direction) of the glass 650. When the first direction (+Z axis direction) is directed upward, the second printed layer 602 is disposed at the bottom of the glass 650.

[0097] In one embodiment, the second printed layer 602 is disposed on top of the display panel 630. The second printed layer 602 is disposed between the display panel 630 and the adhesive layer 640. The second printed layer 602 is made of a material that blocks light.

[0098] In one embodiment, one end of the second printed layer 602 is positioned to correspond to the periphery of the display panel 630. The second printed layer 602 is positioned in an area of the non-display area of the display panel 630 other than the area where the first printed layer 601 is arranged. The second printed layer 602 reduces a phenomenon in which an area of the non-display area of the display panel 630 other than the area where the first printed layer 601 is arranged is viewed from the first direction (+Z-axis direction). For example, the second printed layer 602 reduces a phenomenon in which an outermost area of the non-display area of the display panel 630 where no wiring exists is viewed as a color (e.g., yellow) different from the color of the first printed layer 601.

[0099] In one embodiment, when viewed from the first direction (+Z-axis direction), the first printed layer 601 and the second printed layer 602 at least partially overlap. This further reduces the phenomenon of the non-display area of the display panel 630 being visible. When viewed from the first direction (+Z-axis direction), the first printed layer 601 and the second printed layer 602 overlap by a second distance D2. The second distance D2 is set in consideration of the degree to which the internal structure of the non-display area of the display panel 630 on the first printed layer 601 and the second printed layer 602 and / or light leakage are visible. The second distance D2 is set in consideration of the layout design error of the first printed layer 601 and the second printed layer 602.

[0100] 7 is a side view 700 of a display (e.g., display 210 of FIGS. 2-5) of an electronic device (e.g., electronic device 101 of FIGS. 1 and 3-5) according to one embodiment. Metal layer 610, lower panel protective layer 620, display panel 630, adhesive layer 640, glass 650, protective layer 660, and first printed layer 601 of display 210 of FIG. 7 are substantially identical to metal layer 610, lower panel protective layer 620, display panel 630, adhesive layer 640, glass 650, protective layer 660, and first printed layer 601 of display 210 of FIG. 6.

[0101] In one embodiment, the second printed layer 602 is disposed in the second direction (-Z axis direction) of the display panel 630. When the first direction (+Z axis direction) is directed upward, the second printed layer 602 is disposed below the display panel 630. The second printed layer 602 is disposed between the display panel 630 and the panel lower protection layer 620.

[0102] 8 is a side view 800 of a display (e.g., display 210 of FIGS. 2-5) of an electronic device (e.g., electronic device 101 of FIGS. 1 and 3-5) according to one embodiment. Metal layer 610, lower panel protective layer 620, adhesive layer 640, glass 650, protective layer 660, and first printed layer 601 of display 210 of FIG. 6 are substantially identical to metal layer 610, lower panel protective layer 620, adhesive layer 640, glass 650, protective layer 660, and first printed layer 601 of display 210 of FIG. 6.

[0103] In one embodiment, the panel adhesive layer 633 includes a black adhesive layer 635. The periphery of the black adhesive layer 635 is positioned to correspond to the peripheries of the film layer 631, the light-emitting layer 632, and the polarizing layer 634. The black adhesive layer 635 includes a light-blocking material. The black adhesive layer 635 bonds the light-emitting layer 632 and the polarizing layer 634 to each other.

[0104] In one embodiment, the black adhesive layer 635 is disposed in an area of the non-display area of the display panel 630 other than the area where the first printed layer 601 is disposed. The black adhesive layer 635 reduces the phenomenon in which areas of the non-display area of the display panel 630 other than the area where the first printed layer 601 is disposed are visible in the first direction (+Z-axis direction). For example, the black adhesive layer 635 reduces the phenomenon in which the outermost area of the non-display area of the display panel 630 where no wiring is present is perceived as a color (e.g., yellow) different from the color of the first printed layer 601. The black adhesive layer 635 performs substantially the same function as the second printed layer 602 of FIG. 6. Therefore, the black adhesive layer 635 disposed inside the display panel 630 is used instead of the second printed layer 602. When the black adhesive layer 635 disposed inside the display panel 630 is used instead of the second printed layer 602, the process of separately printing the second printed layer 602 is omitted.

[0105] In one embodiment, when viewed from the first direction (+Z-axis direction), the first printed layer 601 and the black adhesive layer 635 at least partially overlap. This further reduces the phenomenon of the non-display area of the display panel 630 being visible. When viewed from the first direction (+Z-axis direction), the first printed layer 601 and the black adhesive layer 635 overlap by a second distance D2. The second distance D2 is set taking into consideration design errors of the first printed layer 601 and the black adhesive layer 635 and / or the degree to which the non-display area of the display panel 630 is visible.

[0106] 9 is a side view 900 of a display (e.g., display 210 of FIGS. 2-5) of an electronic device (e.g., electronic device 101 of FIGS. 1 and 3-5) according to one embodiment. Metal layer 610, lower panel protective layer 620, display panel 630, adhesive layer 640, glass 650, protective layer 660, and first printed layer 601 of display 210 of FIG. 9 are substantially identical to metal layer 610, lower panel protective layer 620, display panel 630, adhesive layer 640, glass 650, protective layer 660, and first printed layer 601 of display 210 of FIG. 6.

[0107] In one embodiment, the second printed layer 602 is disposed between the metal layer 610 and the panel lower protective layer 620. The second printed layer 602 is disposed in the first direction (+Z axis direction) of the metal layer 610. One end of the second printed layer 602 is disposed to correspond to the periphery of the metal layer 610.

[0108] 10 is a side view 1000 of a display (e.g., display 210 of FIGS. 2-5) of an electronic device (e.g., electronic device 101 of FIGS. 1 and 3-5) according to one embodiment. Metal layer 610, display panel 630, adhesive layer 640, glass 650, protective layer 660, and first printed layer 601 of display 210 of FIG. 10 are substantially identical to metal layer 610, display panel 630, adhesive layer 640, glass 650, protective layer 660, and first printed layer 601 of display 210 of FIG. 6.

[0109] In one embodiment, the black panel lower protective layer 1010 is disposed in a first direction (+Z-axis direction) of the metal layer 610. The black panel lower protective layer 1010 is disposed in a second direction (-Z-axis direction) of the display panel 630. The black panel lower protective layer 1010 is disposed between the metal layer 610 and the display panel 630. The black panel lower protective layer 1010 includes a light-blocking material. The black panel lower protective layer 1010 performs substantially the same function as the second printed layer 602 of FIG. 6. Therefore, the black panel lower protective layer 1010 disposed below the display panel 630 is used instead of the second printed layer 602. When the black panel lower protective layer 1010 disposed inside the display panel 630 is used instead of the second printed layer 602, the process of separately printing the second printed layer 602 can be omitted.

[0110] In one embodiment, the periphery of the black panel lower protective layer 1010 is formed to correspond to the periphery of the display panel 630. The black panel lower protective layer 1010 and the display panel 630 are manufactured using a 1:1 cutting method. The peripheries of the black panel lower protective layer 1010 and the display panel 630 are cut at the same time. This allows the black panel lower protective layer 1010 to be positioned so that the periphery of the black panel lower protective layer 1010 and the periphery of the display panel 630 correspond to each other.

[0111] 11 is a front view 1100 of an electronic device (e.g., electronic device 101 of FIGS. 1 and 3-5) according to one embodiment. FIG. 12 is a cross-sectional view 1200 taken along line B-B' of an electronic device (e.g., electronic device 101 of FIGS. 1 and 3-5) according to one embodiment. Metal layer 610, lower panel protective layer 620, display panel 630, adhesive layer 640, glass 650, and protective layer 660 in FIG. 12 are substantially identical to metal layer 610, lower panel protective layer 620, display panel 630, adhesive layer 640, glass 650, and protective layer 660 of display 210 of FIG. 6.

[0112] In one embodiment, display 210 of electronic device 101 includes first area 211, second area 212, folding area 213, and sensor area 214. Display 210 is surrounded by a first front housing (e.g., first front housing 310 in FIG. 3) and a second front housing (e.g., second front housing 320 in FIG. 3).

[0113] In one embodiment, a first printed layer (e.g., first printed layer 601 in Figures 6-10) and a second printed layer (e.g., second printed layer 602 in Figures 6, 7, and / or 9) are disposed in the area of the display 210 adjacent to the first front housing 310 and the second front housing 320.

[0114] In one embodiment, a first perimeter 1110 and a second perimeter 1120 are formed on a folding region 213 in a display 210 adjacent to a first front housing 310 and a second front housing 320. The first perimeter 1110 and the second perimeter 1120 are repeatedly folded and unfolded. This may increase the likelihood of cracks or chips occurring on the first perimeter 1110 and the second perimeter 1120. The first perimeter 1110 and the second perimeter 1120 are inspected to determine whether cracks or chips have occurred.

[0115] In one embodiment, the first printed layer 601 and the second printed layer 602 may not be disposed on the first periphery 1110 and the second periphery 1120. The first printed layer 601 and the second printed layer 602 are disposed on the periphery of the display panel 630 in an area other than the first periphery 1110 and the second periphery 1120 that overlaps with the folding region 213 where the display panel 630 is folded or unfolded. If the first printed layer 601 and the second printed layer 602 are not disposed on the first periphery 1110 and the second periphery 1120, it may be easier to inspect the first periphery 1110 and the second periphery 1120 for cracks or chipping.

[0116] FIG. 13 is a front view 1300 of an electronic device (eg, electronic device 101 of FIGS. 1 and 3-5) according to one embodiment.

[0117] In one embodiment, the display 210 of the electronic device 101 includes a sensor area 214. The display 210 is surrounded by a first front housing 310 and a second front housing 320.

[0118] In one embodiment, an opening is provided in the sensor area 214. For example, the sensor area 214 is provided with a hole such as a front camera hole and / or a sensor hole in the first direction (+Z axis direction). The sensor area 214 remains fixed without being folded or unfolded. The opening provided in the sensor area 214 reduces the possibility of cracking or chipping of the glass 650.

[0119] 14 is a cross-sectional view taken along CC' of an electronic device (e.g., electronic device 101 of FIGS. 1 and 3-5) according to one embodiment. Metal layer 610, lower panel protective layer 620, display panel 630, adhesive layer 640, glass 650, protective layer 660, and first printed layer 601 in FIG. 14 are substantially identical to metal layer 610, lower panel protective layer 620, display panel 630, adhesive layer 640, glass 650, protective layer 660, and first printed layer 601 of display 210 of FIG. 6.

[0120] In one embodiment, the second printed layer (e.g., the second printed layer 602 in FIGS. 6, 7, and / or 9) is not disposed in the sensor region 214. The first printed layer 601 and the second printed layer 602 are disposed in areas of the periphery of the display panel 630 other than the sensor region 214. If the second printed layer 602 is not disposed in the sensor region 214, the separate step of disposing the second printed layer 602 in the sensor region 214 can be omitted.

[0121] 15 is a cross-sectional view taken along line B-B' of an electronic device (e.g., electronic device 101 of FIGS. 1 and 3-5) according to one embodiment. Metal layer 610, lower panel protective layer 620, display panel 630, adhesive layer 640, glass 650, and protective layer 660 in FIG. 15 are substantially identical to metal layer 610, lower panel protective layer 620, display panel 630, adhesive layer 640, glass 650, and protective layer 660 of display 210 of FIG. 6.

[0122] In one embodiment, a shielding member 1510 is disposed on the first periphery (e.g., first periphery 1110 in FIG. 11 ) and the second periphery (e.g., second periphery 1120 in FIG. 11 ). The shielding member 1510 is disposed to integrally surround the peripheries of the metal layer 610, the lower panel protective layer 620, the display panel 630, the adhesive layer 640, the glass 650, and the protective layer 660. The shielding member 1510 is a deco. The shielding member 1510 is made of a material that blocks light. The shielding member 1510 reduces the phenomenon of the inside of the first periphery 1110 and the second periphery 1120 being visible.

[0123] FIG. 16a is a front view 1600 of the electronic device 101 according to one embodiment. FIG. 16b is a front view 1650 of the electronic device 101 according to one embodiment. FIG. 17 is a front view of a first inspection area 1621 of the electronic device 101 according to one embodiment. FIG. 18 is a cross-sectional view 1800 taken along line D-D' of FIG. 17. The metal layer 610, the panel bottom protection layer 620, the display panel 630, the adhesive layer 640, the glass 650, and the protective layer 660 of FIG. 18 are substantially identical to the metal layer 610, the panel bottom protection layer 620, the display panel 630, the adhesive layer 640, the glass 650, and the protective layer 660 of the display 210 of FIG. 6. The deco 1510 of FIG. 18 is substantially identical to the deco 1510 of FIG. 15.

[0124] In one embodiment, the printed layer 1610 is disposed to surround the display 210 of the electronic device 101. The printed layer includes a first printed layer 601 and a second printed layer 602.

[0125] In one embodiment, an inspection area 1620 is formed in an outer portion of printed layer 1610 that is disposed on the outside of display 210 and that contacts a folding area (e.g., folding area 213 in FIG. 11 ). Inspection area 1620 includes a first inspection area 1621 and a second inspection area 1622.

[0126] In one embodiment, as shown in Figure 16a, the printing layer 1610 is not printed in the inspection area 1620. The printing layer 1610 is removed in the inspection area 1620. The inspection area 1620 is an inspection area for glass such as UTG (e.g., glass 650 in Figure 6). This removes the printing in the folding portion where cracks are concentrated.

[0127] 16b, the printed layer 1610 disposed in the inspection area 1620 has a narrower width than the remaining printed layer 1610. At least a portion of the printed layer 1610 disposed in the inspection area 1620 is cut. For example, at least a portion of the printed layer 1610 is cut so that the printed layer 1610 disposed in the inspection area 1620 does not overlap with features disposed in the upper center and lower center of the display 210. At least a portion of the printed layer 1610 is cut to offset the printing only in the folding area. This realizes a structure that allows inspection of the glass 650, such as the UTG at the edge.

[0128] In one embodiment, the printed layer 1610 is disposed on the exterior of the display 210 so that different regions have different printed features. The inspection region 1620 is an area where the printed layer is printed to have an offset at a folding portion (e.g., folding region 213) where cracks are concentrated. The inspection region 1620 is an area where the glass 650, such as UTG, is inspected.

[0129] In one embodiment, the inspection area 1620 is an area that includes a folding portion. The inspection area 1620 is positioned closer to the active area (AA) than an area where no offset is applied to the printed layer 1610. The inspection area 1620 has a cutoff portion 1710 where the printed layer 1610 is removed.

[0130] In one embodiment, a first edge 1810 of the display panel 630 is visible as a carbon fiber reinforced plastic (CFRP).

[0131] Figure 19a is a front view 1900 of the mechanical portion of the electronic device 101 according to one embodiment. Figure 19b is a cross-sectional view 1950 of Figure 19a taken along line EE'.

[0132] In one embodiment, the upper and lower central regions of the electronic device 101 include mechanical parts. The mechanical parts are areas in the upper and lower central regions of the electronic device where mechanical parts of the electronic device 101 are located. For example, the mechanical parts are areas in which the receiver and microphone of the electronic device 101 are located.

[0133] In one embodiment, the mechanism portion includes a capacitor area 1910 and a cover member 1920. The capacitor area 1910 includes a projected capacitive (P-CAP) element. The cover member 1920 includes a dust cover that blocks foreign matter such as dust.

[0134] In one embodiment, the feature portion includes an inspection area (e.g., inspection area 1620 in FIG. 16). A cross section DD' of the feature portion including inspection area 1620 is substantially identical to the cross section shown in FIG.

[0135] In one embodiment, the mechanism portion includes a grid pattern region 1960. As shown in the E-E' cross section in Figure 19b, the grid pattern region 1960 includes a plurality of grid patterns 1961. The plurality of grid patterns 1961 included in the grid pattern region 1960 are patterns made of the first printed layer 601.

[0136] In one embodiment, the mechanism portion includes an area where the first printed layer 601 is offset. The mechanism portion has a grid pattern 2011 disposed along the area where the folding axis extends. The grid pattern area 1960 of the mechanism portion is formed at a position corresponding to the capacitor area 1910 and the cover member 1920.

[0137] In one embodiment, an offset width 1970 by which the first printed layer 601 is offset in the mechanism portion is greater than the width of the grid pattern region 1960. The first printed layer 601 is removed in the mechanism portion by an amount wider than the grid pattern region 1960. As a result, the first printed layer 601 does not overlap the grid pattern region 1960 in the mechanism portion.

[0138] In one embodiment, the second printed layer (e.g., the second printed layer 602 in FIG. 18) is disposed on top of the display panel 630, for example, the polarizing layer 634. The second printed layer 602 is perceived as black when viewed by a user in the +Z-axis direction. The second printed layer 602 is disposed in a non-active area (e.g., the non-active area NA in FIG. 18) outside the active area (e.g., the active area AA in FIG. 18). The second printed layer 602 does not have a dividing point such as a folding portion or an offset of other areas.

[0139] Figure 20a is a front view 2000 of a second printed layer (e.g., second printed layer 602 of Figure 17) of electronic device 101 according to one embodiment. Figure 20b is a cross-sectional view 2050 of Figure 20a taken along line F-F'.

[0140] In one embodiment, a plurality of pixels 2010 are arranged in the portion of the electronic device 101 where the second printed layer 602 is arranged. The plurality of pixels 2010 includes a red subpixel 2011, a green subpixel 2012, and a blue subpixel 2013.

[0141] In one embodiment, a first black matrix (BM) 2020 is disposed in a portion where the plurality of pixels 2010 are disposed. The first black matrix 2020 is disposed between the plurality of pixels 2010. The plurality of pixels 2010 are disposed and separated from each other by the first black matrix 2020.

[0142] In one embodiment, a second black matrix 2030 is disposed in a portion other than the portion where the plurality of pixels 2010 are disposed. The second black matrix 2030 blocks light from entering the portion other than the portion where the plurality of pixels 2010 are disposed.

[0143] In one embodiment, the bottom layer in portion F-F' of Figure 20a is transistor layer 2051. Transistor layer 2051 is Low-Temperature Polycrystalline Silicon (LTPS).

[0144] In one embodiment, an anode 2053 and a black pixel defining layer (black PDL) 2055 are disposed on the transistor layer 2051. The anode 2053 constitutes a first electrode of a pixel (e.g., pixel 2010 in FIG. 20a). The black pixel defining layer 2055 defines each of the plurality of pixels 2010.

[0145] In one embodiment, an organic light-emitting layer 2060 is disposed on the anode 2053. The organic light-emitting layer 2060 includes a first organic light-emitting layer 2061 that emits light of a first hue and a second organic light-emitting layer 2062 that emits light of the first hue.

[0146] In one embodiment, a cathode 2065 overlies the black pixel defining layer 2055 and the organic light-emitting layer 2060. The cathode 2065 constitutes the second electrode of the pixel 2010.

[0147] In one embodiment, a thin film encapsulation layer 2070 covers the cathode 2065. The thin film encapsulation layer 2070 blocks foreign matter from penetrating into the pixel 2010.

[0148] In one embodiment, a color filter layer 2080 is formed on the thin film encapsulation layer 2070. The color filter layer 2080 includes a first color filter 2081 that transmits light of a first hue and blocks light other than the first hue, a second color filter 2082 that transmits light of a second hue and blocks light other than the second hue, and a black matrix 2083.

[0149] In one embodiment, a top cover 2090 is disposed on the color filter layer 2080. The top cover 2090 is a transparent and flexible polyimide window (PI window).

[0150] In one embodiment, the second printed layer 602 is configured as a black area in a panel (e.g., the display panel 630 in FIG. 18) by a black matrix 2083 of a color filter layer 2080 and a black pixel defining layer 2055. The second printed layer 602 has a poll-less structure.

[0151] Figure 21 is a front view 2100 of electronic device 101 according to one embodiment. Figure 22 is a cross-sectional view 2200 taken along line G-G' of Figure 21. The metal layer 610, lower panel protective layer 620, display panel 630, adhesive layer 640, glass 650, and protective layer 660 of Figure 20 are substantially identical to the metal layer 610, lower panel protective layer 620, display panel 630, adhesive layer 640, glass 650, and protective layer 660 of display 210 of Figure 6.

[0152] In one embodiment, the second printed layer 602 is disposed along three edges of the display 210. For example, the second printed layer 602 is disposed along the top edge, bottom edge, and right edge of the display 210.

[0153] In one embodiment, the first printed layer 601 and the second printed layer 602 are arranged along one edge portion of the display 210. For example, the first printed layer 601 and the second printed layer 602 are arranged along the left edge portion of the display 210. The width of the second printed layer 602 arranged along one edge portion of the display 210 is narrower than the width of the second printed layer 602 arranged along three edge portions of the display 210. A display driver IC (e.g., display driver IC 230 in FIG. 2) is arranged along one edge portion of the display 210.

[0154] In one embodiment, the second printed layer 602 under the UTG-like glass 650 is disposed along three edges other than the edge where the display driver IC 230 is disposed. The second printed layer 602 is disposed with a narrower width at the edge where the display driver IC 230 is disposed than at the remaining edge, thereby ensuring a physical size in which the display driver IC 230 can be disposed.

[0155] In one embodiment, a first printed layer 601 is further disposed along one edge of the display 210. The first printed layer 601 is further disposed to prevent the display panel 630 from being exposed and visible to the outside when a second printed layer 602 is disposed with a narrow width along the edge where the display driver IC 230 is disposed. To inspect cracks in the glass 650 only in the folding section, the printed layer is disposed up to the edge where polyimide (PL) is disposed on the display panel 630 in the folding section.

[0156] In one embodiment, when the size of the area where the display driver IC 230 is arranged is small, the second printed layer 602 is arranged only on three edge portions of the display 210. The first printed layer 601 is arranged on the edge portion where the display driver IC 230 is arranged. The first printed layer 601 is printed so that it at least partially overlaps the glass 650.

[0157] In one embodiment, the second printed layer 602 is disposed on a shock-absorbing damping layer 2211 disposed on the adhesive layer 640. The damping layer 2211 is made of a material capable of absorbing shock, such as PET.

[0158] In one embodiment, an adhesive layer 2213, a metal layer 2215, and a cushion layer 2217 are further disposed below the metal layer 610. A sensor hole 2219 is formed to penetrate the panel lower protection layer 620, the metal layer 610, the adhesive layer 2213, the metal layer 2215, and the cushion layer 2217.

[0159] In one embodiment, a bending protection layer (BPL) 2220 is disposed on one side of the display panel 630. A bending portion 2225 is connected to the bending protection layer 2220.

[0160] In one embodiment, the bending portion 2225 is fixed to the lower surface of the display panel 630 while maintaining a predetermined distance therebetween via the film layer 2231, the first column spacer 2233, the graphene layer 2235, and the second column spacer 2237.

[0161] In one embodiment, one side of the bending portion 2225 is connected to the FPCB 2240. The FPCB 2240 is connected to the bottom of the display panel 630 by a conductive tape 2245.

[0162] Figure 23 is a front view 2300 of the electronic device 101 according to one embodiment. Figure 24 is a front view of a first mechanism portion 2321 of the electronic device 101 according to one embodiment. Figure 25 is a front view of a second mechanism portion 2322 of the electronic device 101 according to an embodiment.

[0163] In one embodiment, the exterior of the display 210 of the electronic device 101 is surrounded by a single printed layer 2310. The single printed layer 2310 is disposed on the exterior portion of the display 210 other than the mechanism portion 2320. The mechanism portion 2320 includes a first mechanism portion 2321 and a second mechanism portion 2322. Multiple printed layers (e.g., the first printed layer 601 and the second printed layer 602 in FIG. 6 ) are disposed on the first mechanism portion 2321 and the second mechanism portion 2322.

[0164] In one embodiment, the printed structure varies by region depending on the mechanical structure at the top of the display 210. For example, in the case of the first mechanical portion 2321 having the cover member 1920, even if the deco (e.g., deco 1510 in FIG. 15) and the printed layers 601 and 602 are designed to correspond one-to-one, tension reduces the amount of light that is covered by the display 210. This causes a problem of the unprinted portion 2410 being visible, as shown in FIG. 24. In the case of the second mechanical portion 2322, if the printed layers 601 and 602 are designed to protrude compared to the deco 1510, the problem of the unprinted portion being visible as shown in FIG. 25 is solved, but this affects folding and creates a step in appearance, which is disadvantageous in terms of design.

[0165] In one embodiment, a multi-print structure is applied only to the cover member 1920 area. The multi-print structure is realized using a first print layer 601 and a second print layer 602. The second print layer 602 is located in various layers as described in the detailed description of the present invention. For example, the second print layer 602 is disposed on the top of a panel (e.g., the display panel 630 in FIG. 6), inside the panel 630, or under the panel 630.

[0166] Electronic devices according to various embodiments disclosed herein may take various forms, including, for example, a portable communication device (e.g., a smartphone), a computing device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronic device. Electronic devices according to embodiments herein are not limited to the above-mentioned devices.

[0167] The various embodiments and terms used herein should not be understood to limit the technical features of the present invention to a specific embodiment, but should be understood to include various modifications, equivalents, or alternatives of the embodiment. In describing the drawings, similar reference numerals are used to refer to similar or related components. The singular form of a noun corresponding to an item includes one or more of the item, unless the relevant context clearly dictates otherwise. In this specification, each of phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" includes any one of the items listed with the phrase, or all possible combinations thereof. Terms such as "first," "second," "first," or "second" are used simply to distinguish a component from other components and do not limit the component in other respects (e.g., importance or order). When one (e.g., first) component is referred to as "coupled" or "connected" to another (e.g., second) component, with or without the terms "functionally" or "communicatively," it means that the component can be coupled to the other component directly (e.g., by wire), wirelessly, or through a third component.

[0168] The term "module" used in various embodiments herein includes a unit implemented in hardware, software, or firmware, and is used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integrated component or the smallest unit or portion of a component that performs one or more functions. For example, in one embodiment, a module is implemented in the form of an application-specific integrated circuit (ASIC).

[0169] Various embodiments herein may be embodied as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory or external memory 138) readable by a machine (e.g., electronic device 101). For example, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) retrieves and executes at least one instruction from the one or more stored instructions. This enables the machine to operate to perform at least one function according to the retrieved at least one instruction. The one or more instructions may include code generated by a compiler or code executed by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, "non-transitory" simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic wave), and this term does not distinguish between data being stored semi-permanently and data being stored temporarily on the storage medium.

[0170] According to one embodiment, a method according to various embodiments disclosed herein may be provided in a computer program product. The computer program product is traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disc read-only memory (CD-ROM)) or distributed online (e.g., downloaded or uploaded) via an application store (e.g., the Play Store) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored in or temporarily generated on a machine-readable storage medium, such as the memory of a manufacturer's server, an application store server, or an intermediary server.

[0171] According to various embodiments, each of the above-described components (e.g., modules or programs) may include one or more entities, and some of the entities may be located separately in other components. According to various embodiments, one or more of the above-described components or operations may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In such cases, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as performed by that component of the multiple components prior to integration. According to various embodiments, operations performed by modules, programs, or other components may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be performed in a different order, omitted, or one or more other operations may be added. [Explanation of symbols]

[0172] 100 Network Environment 101, 102, 104 Electronic equipment 108 servers 120 processors 121 Main Processor 123 Auxiliary Processor 130, 233 memory 132 Volatile Memory 134 Non-volatile memory 136 internal memory 138 External Memory 140 Programs 142 Management Structure 144 Middleware 146 Applications 150 Input Module 155 Acoustic Output Module 160 Display Module 170 Audio Module 176 Sensor Module 177 Interface 178 Connecting terminal 179 Haptic Module 180 camera module 188 Power Management Module 189 Battery 190 Communication Module 192 Wireless Communication Module 194 Wired Communication Module 196 Subscriber Identity Module 197 Antenna Module 198 Network 1 199 Second Network 210 Display 211 First area 212 Second area 213 folding regions 214 Sensor Area 215 layer structure 230 Display Driver IC 231 Interface Module 235 Image Processing Module 237 Mapping Module 250 Touch Circuit 251 Touch Sensor 253 Touch Sensor IC 300 Housing 310 1st front housing 312 First rotation support surface 320 Second front housing 322 Second rotating support surface 330 Hinge cover 380 1st rear cover 382 Sub-display 390 Second rear cover 392 Rear Sensor Module 400 Bracket Assembly 410 First Bracket 420 Second Bracket 430 Wiring materials 500 Board section 510 First board 520 Second board 601 1st printing layer 602 2nd printing layer 610, 2215 metal layer 620 Lower panel protective layer 630 Display Panel 631, 2231 film layer 632 Light-emitting layer 633 Panel adhesive layer 634 Polarizing Layer 635 Black adhesive layer 640, 2213 Adhesive layer 650 Glass 660 protective layer 1010 Black panel bottom protection layer 1110 First Periphery 1120 Second Periphery 1510 Shielding material (deco) 1610 Printing layer 1620 Inspection Area 1710 Cut-off part 1810 First Edge 1910 Capacitor Area 1920 Cover material 1960 grid pattern area 1961 Grid Pattern 2010 pixels 2011 Red subpixel 2012 Green subpixel 2013 Blue subpixel 2020 1st Black Matrix 2030 2nd Black Matrix 2051 transistor layer 2053 Anode 2055 Black Pixel Definition Layer 2060 Organic light-emitting layer 2061 First organic light-emitting layer 2062 Second organic light-emitting layer 2065 cathode 2070 Thin film sealing layer 2080 color filter layer 2081 1st color filter 2082 2nd color filter 2083 Black Matrix 2090 Top cover 2211 Damping Layer 2217 Cushion layer 2219 Sensor hole 2220 Bending Protection Layer 2225 Bending Department 2233 1st column spacer 2235 graphene layer 2237 Second column spacer 2240 FPCB 2245 Conductive tape 2321 1st mechanism part 2322 Second mechanism part

Claims

1. 1. An electronic device, comprising: a display panel having a folded state and an unfolded state; a glass disposed in a first direction toward the front surface of the display panel; a protective layer disposed in the first direction of the glass; a first printed layer disposed between the glass and the protective layer; a second printed layer disposed in a second direction toward the rear surface of the glass; the first print layer is disposed at a distance from the periphery of the glass in a third direction perpendicular to the first direction toward an active area of the display panel; one end of the second printed layer is disposed to correspond to a periphery of the display panel; an inspection area is formed in an outer portion of the first printed layer and the second printed layer disposed outside the display panel, the outer portion being in contact with a folding area where the display panel is folded; An electronic device characterized in that the first printed layer and the second printed layer arranged in the inspection area have a narrower width than the first printed layer and the second printed layer arranged in the remaining portion.

2. The electronic device according to claim 1 , wherein the first printed layer and the second printed layer at least partially overlap each other when viewed from the first direction.

3. The electronic device according to claim 1 , wherein the second printed layer is disposed on top of the display panel.

4. The electronic device of claim 1 , further comprising an adhesive layer disposed between the display panel and the glass.

5. The electronic device according to claim 4 , wherein the second printed layer is disposed between the display panel and the adhesive layer.

6. The electronic device of claim 1 , further comprising a panel lower protection layer disposed in the second direction of the display panel.

7. The electronic device according to claim 6 , wherein the second printed layer is disposed between the display panel and the panel lower protection layer.

8. 2. The electronic device according to claim 1, wherein a black adhesive layer disposed inside the display panel is used instead of the second printed layer.

9. the panel lower protection layer further includes a metal layer disposed in the second direction, The electronic device according to claim 6 , wherein the second printed layer is disposed between the metal layer and the panel lower protection layer.

10. The electronic device according to claim 1 , wherein the second printed layer is a black printed layer disposed inside the display panel.

11. The electronic device according to claim 1 , wherein at least a portion of the first printed layer and the second printed layer disposed in the inspection area is cut away.

12. The electronic device further includes a mechanism portion in which a mechanism of the electronic device is disposed in an upper central region and a lower central region, The electronic device according to claim 1 , wherein the mechanism portion includes a grid pattern area including a plurality of grid patterns made of the first print layer.

13. 13. The electronic device according to claim 12, wherein an offset width along the third direction by which the first printed layer is offset in the mechanism portion is larger than a width along the third direction of the grid pattern region.

14. 2. The electronic device according to claim 1, wherein the second printed layer is arranged along three edge portions of the display panel other than the edge portion where a display driver IC that drives the display panel is arranged.

Images