Physical quantity sensor device and method for manufacturing the same

Abstract

To provide a physical quantity sensor device having high reliability.SOLUTION: A physical quantity sensor device includes a sensor element 1 having a semiconductor chip 11, a first terminal 15 disposed on the sensor element 1, and a first accommodation part 10 for accommodating the first terminal 15, having a second terminal 31 electrically connected to the first terminal 15. The second terminal 31 includes an open hole 3b in which one end of the first terminal 15 is inserted. The open hole 3b has an R surface formed on a surface through which the first terminal 15 is inserted.SELECTED DRAWING: Figure 1A

Description

[Technical Field]

[0001] The present invention relates to a physical quantity sensor device and a method for manufacturing a physical quantity sensor device. [Background technology]

[0002] Conventionally, numerous physical quantity sensors have been used in automobiles and industrial equipment. Physical quantity sensors, such as pressure sensors and acceleration sensors, are often used in harsh environments with high temperatures and humidity. For physical quantity sensor devices, a technology has been proposed in which a package is constructed with a nut portion (storage box) and a screw portion in which a sense element is placed in a recess, and a socket portion that serves as an interface for transmitting signals from the sense element to the outside. Another proposed configuration involves separating the socket portion into two parts: an inner housing portion and a socket housing portion. For example, the technology proposed in Patent Document 1 simplifies assembly by irradiating a through hole in the inner housing portion with laser light from above at a predetermined incident angle and welding the upper end of the first lead pin to one end of the connector pin. Furthermore, the technology proposed in Patent Document 2 prevents the occurrence of gaps due to the inner housing portion lifting up from the sensor element by shaping a hole in the inner housing portion that accommodates the lead pin so that the length of the opposite side of the hole is shorter than the diameter of the lead pin accommodated in the hole. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-037039 [Patent Document 2] Japanese Patent Application Publication No. 2018-136277 Summary of the Invention [Problem to be solved by the invention]

[0004] 19 is a cross-sectional view showing the insertion of a lead pin in a conventional manufacturing method for a physical quantity sensor device. Fig. 19 is a diagram showing an insertion step in which lead pin 115 of a sensor element is inserted into through hole 103b of inner housing portion 103 from below and assembled. At this time, inner housing portion 103 is provided with tapered portion 103g for guiding lead pin 115 to ensure ease of insertion, but the diameter of tapered portion 103g and the diameter of through hole 103b cannot be made the same, and the tip of lead pin 115 may interfere with the edge of inner housing portion 103.

[0005] The lead pin 115 of the sensor element is made by fine-cutting a rod-shaped material and plating it with copper (Cu) and nickel (Ni). As a result, the tip of the lead pin 115 has a sharp edge. Therefore, if the tip of the lead pin 115 interferes with the edge of the inner housing part 103, the tip of the lead pin 115 is scraped by the inner housing part 103, causing part of the metal to fall off, resulting in a short circuit between the lead pin 115 and the metal insulated from the lead pin 115, causing a malfunction.

[0006] 20 is a perspective view showing the welding of a lead pin in a conventional method for manufacturing a physical quantity sensor device. After inserting the lead pin 115, the tip of the lead pin 115 protrudes from the inner housing part 103, making it easy to perform laser welding. At this time, since the distance between the surface of the tip of the lead pin 115 and the surface of the inner housing part 103 is different, the laser focus of the laser light 153 is shifted, and the heat generation state on each irradiated surface is different. As such, the heat-generating parts are not at the same distance from the laser on each member, making welding difficult.

[0007] Furthermore, because lead pin 115 has a small heat capacity, it can be melted with a small amount of laser energy, but inner housing portion 103 has a large heat capacity, and the heat generated on the irradiated surface does not quickly transfer to the components as shown by arrow V in Figure 20, making it difficult for the heat to reach a temperature at which it can be melted. This requires increasing the power of the laser energy for welding, and even a slight deviation in the welding position can degrade the welding quality. As such, welding parts with a complex relationship between laser energy and welding requires strict adjustment of the laser irradiation conditions, making it a difficult process to manage.

[0008] An object of the present invention is to provide a highly reliable physical quantity sensor device. [Means for solving the problem]

[0009] To achieve the object of the present invention, a physical quantity sensor device according to the present invention includes a sensor element including a semiconductor chip, a first terminal arranged on the sensor element, and a first accommodating portion including a second terminal that accommodates the first terminal and is electrically connected to the first terminal. The second terminal has a through hole into which one end of the first terminal is inserted, and the through hole has an R-surface formed on the surface into which the first terminal is inserted. The first accommodating portion has an introduction hole for the first terminal on the side where the first terminal is inserted, the introduction hole having an opening width larger than the through hole of the second terminal, and the introduction hole has a tapered portion and a straight portion provided between the first accommodating portion and the tapered portion, the straight portion having a hole in approximately the same direction as the through hole.

[0010] In order to achieve the object of the present invention, a method for manufacturing a physical quantity sensor device according to the present invention includes: a measurement medium inlet having an inlet hole for introducing a measurement medium, which is a gas or liquid to be pressure-measured; a sensor element fixed to a base provided at one end of the inlet hole of the measurement medium inlet so as to close the inlet hole, and having a plurality of first terminals arranged thereon; and a sensor element sandwiched between the measurement medium inlet and the measurement medium inlet, and accommodating the plurality of first terminals. and a second terminal electrically connected to the first terminal. a first container portion; The second terminal ofWhen forming a through hole into which one end of the first terminal is inserted, an R-surface is formed on the surface into which the first terminal is inserted. An introduction hole for the first terminal having an opening width larger than that of the through hole of the second terminal is formed in the first housing portion on the side of the surface into which the first terminal is inserted, and the introduction hole is formed with a tapered portion and a straight portion provided between the first housing portion and the tapered portion and having a hole in approximately the same direction as the through hole. [Effects of the Invention]

[0011] According to the physical quantity sensor device of the present invention, reliability can be improved. [Brief explanation of the drawings]

[0012] [Figure 1A] 1 is a cross-sectional view showing a configuration of a physical quantity sensor device according to an embodiment. [Figure 1B] FIG. 1B is an enlarged perspective view of a portion A of FIG. 1A. [Figure 1C] FIG. 1C is an enlarged cross-sectional view of a portion B of FIG. 1B. [Figure 1D] 1C is another form of an enlarged cross-sectional view of portion B of FIG. 1B. [Figure 2A] 1B is an explanatory diagram showing the configuration of the pressure sensor chip of FIG. 1A. FIG. [Figure 2B] 1B is an explanatory diagram showing the configuration of the pressure sensor chip of FIG. 1A. FIG. [Figure 3A] FIG. 1 is an explanatory diagram (part 1) showing a state during manufacturing (during assembly) of the physical quantity sensor device according to the embodiment. [Figure 3B] FIG. 10 is an explanatory diagram (part 2) showing the state during manufacturing (during assembly) of the physical quantity sensor device according to the embodiment. [Figure 3C] FIG. 10 is an explanatory diagram (part 3) showing a state during manufacturing (during assembly) of the physical quantity sensor device according to the embodiment. [Figure 3D] FIG. 10 is an explanatory diagram (part 4) showing a state during manufacturing (during assembly) of the physical quantity sensor device according to the embodiment. [Figure 4]FIG. 5 is an explanatory diagram (part 5) showing a state during manufacturing (during assembly) of the physical quantity sensor device according to the embodiment. [Figure 5A] FIG. 6 is an explanatory diagram (part 6) showing a state during manufacturing (during assembly) of the physical quantity sensor device according to the embodiment. [Figure 5B] FIG. 7 is an explanatory diagram (part 7) showing the state of the physical quantity sensor device according to the embodiment during manufacturing (during assembly). [Figure 6] FIG. 10 is an explanatory diagram (part 8) showing the state during manufacturing (during assembly) of the physical quantity sensor device according to the embodiment. [Figure 7] FIG. 9 is an explanatory diagram (part 9) showing a state during manufacturing (during assembly) of the physical quantity sensor device according to the embodiment. [Figure 8] FIG. 10 is an explanatory diagram (part 10) showing a state during manufacturing (during assembly) of the physical quantity sensor device according to the embodiment. [Figure 9] FIG. 11 is an explanatory diagram (part 11) showing a state during manufacturing (during assembly) of the physical quantity sensor device according to the embodiment. [Figure 10] FIG. 12 is an explanatory diagram (part 12) showing the state during manufacturing (during assembly) of the physical quantity sensor device according to the embodiment. [Figure 11] FIG. 13 is an explanatory diagram (part 13) showing a state during manufacturing (during assembly) of the physical quantity sensor device according to the embodiment. [Figure 12A] FIG. 14 is an explanatory diagram (part 14) showing a state during manufacturing (during assembly) of the physical quantity sensor device according to the embodiment. [Figure 12B] FIG. 15 is an explanatory diagram (part 15) showing the state of the physical quantity sensor device according to the embodiment during manufacturing (during assembly). [Figure 13A] FIG. 16 is an explanatory diagram (part 16) showing the state of the physical quantity sensor device according to the embodiment during manufacturing (during assembly). [Figure 13B] FIG. 17 is an explanatory diagram (part 17) showing the state of the physical quantity sensor device according to the embodiment during manufacturing (during assembly). [Figure 14] FIG. 18 is an explanatory diagram (part 18) showing the state of the physical quantity sensor device according to the embodiment during manufacturing (during assembly). [Figure 15A] FIG. 19 is an explanatory diagram (part 19) showing a state during manufacturing (during assembly) of the physical quantity sensor device according to the embodiment. [Figure 15B] FIG. 20 is an explanatory diagram (part 20) showing the state of the physical quantity sensor device according to the embodiment during manufacturing (during assembly). [Figure 15C] FIG. 21 is an explanatory diagram showing a state during manufacturing (assembly) of the physical quantity sensor device according to the embodiment; [Figure 16] FIG. 22 is an explanatory diagram (part 22) showing the state during manufacturing (during assembly) of the physical quantity sensor device according to the embodiment. [Figure 17A] FIG. 23 is an explanatory diagram (part 23) showing the state during manufacturing (during assembly) of the physical quantity sensor device according to the embodiment. [Figure 17B] FIG. 24 is an explanatory diagram (part 24) showing the state of the physical quantity sensor device according to the embodiment during manufacturing (during assembly). [Figure 18] FIG. 25 is an explanatory diagram (part 25) showing the state of the physical quantity sensor device according to the embodiment during manufacturing (during assembly). [Figure 19] 10A and 10B are cross-sectional views showing insertion of a lead pin in a conventional method for manufacturing a physical quantity sensor device. [Figure 20] FIG. 10 is a perspective view showing welding of a lead pin in a conventional method for manufacturing a physical quantity sensor device. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, embodiments of a physical quantity sensor device and a method for manufacturing a physical quantity sensor device according to the present invention will be described in detail with reference to the accompanying drawings. In the following description of each embodiment, the same components as those in other embodiments will be denoted by the same reference numerals and will not be described again.

[0014] (Embodiment) The configuration of a physical quantity sensor device according to an embodiment will be described using a pressure sensor device as an example. FIG. 1A is a cross-sectional view showing the configuration of the physical quantity sensor device according to the embodiment. FIGS. 2A and 2B are explanatory diagrams showing the configuration of the pressure sensor chip of FIG. 1A. FIG. 2A shows a cross-sectional view of a pressure sensor chip 11, and FIG. 2B shows a bird's-eye view of the pressure sensor chip 11. As shown in FIG. 1A, the physical quantity sensor device 100 includes a sensor element 1, a threaded portion (a portion for introducing a medium to be measured) 2, an inner housing portion 3, and a socket housing portion (connector housing portion) 4. In this embodiment, the socket portion, which serves as an interface for transmitting a signal from the sense element to the outside, is configured to be separated into two portions: the inner housing portion 3 and the socket housing portion 4. The sensor element 1 includes a storage box 10, a pressure sensor chip (semiconductor chip) 11, a base member 12, and a diaphragm 13, all of which are housed in a recess 10a of the storage box 10. The cross section shown in FIG. 1A is taken along the line H-H' shown in FIG. 12B, which will be described later. The storage box 10 is made of metal such as stainless steel (SUS).

[0015] The pressure sensor chip 11 will now be described with reference to FIGS. 2A and 2B. The cross section shown in FIG. 2A is taken along the line Q-Q' in FIG. 2B. As shown in FIGS. 2A and 2B, the pressure sensor chip 11 includes, for example, a diaphragm 11a, four gauge resistors 63, and a pad portion 65. The diaphragm 11a is a pressure-receiving portion formed by recessing a first surface 61 of semiconductor silicon. The first surface 61 is the top surface in FIG. 1A. The diaphragm 11a receives pressure. The four gauge resistors 63 are formed on a second surface 62 of the semiconductor silicon at a location corresponding to the back side of the diaphragm 11a. The second surface 62 is the bottom surface in FIG. 1A. The four gauge resistors 63 are diffused resistors. These gauge resistors 63 convert strain generated on the second surface 62 when pressure is applied to the pressure sensor chip 11 into resistance values. The pressure sensor chip 11 may also be made of other semiconductor materials.

[0016] The pressure sensor chip 11 also includes a pressure sensor element, such as a Wheatstone bridge circuit formed with gauge resistors 63, and a control circuit. The control circuit is formed in a control circuit region 64 on the second surface 62. The control circuit includes a circuit for amplifying the output signal of the pressure sensor element, a circuit for correcting sensitivity, a circuit for correcting offset, and a circuit for correcting temperature characteristics of sensitivity and offset. The pressure sensor chip 11 also includes a surge protection element and a filter (not shown). A pad portion 65 is formed on the second surface 62 of the pressure sensor chip 11. Each electrode on the pad portion 65 is connected to each lead pin (first terminal) 15 (described later) by a bonding wire 14. Each electrode on the pad portion 65 is connected to each control circuit formed in the control circuit region 64 by wiring (not shown) made of metal or the like. That is, each lead pin 15 is connected to each control circuit formed in the control circuit region 64 via the bonding wire 14 and each electrode on the pad portion 65. The pad section 65 and the control circuit region 64 are arranged in a portion of the second surface 62 other than the region where the diaphragm 11a is provided. The pad section 65 may also be arranged in the control circuit region 64.

[0017] The first surface 61 of the pressure sensor chip 11 is fixed to the bottom surface of the recess 10a of the storage box 10 via a base member 12. The base member 12 is made of, but is not limited to, a glass material, such as Pyrex (registered trademark) glass or Tempax glass. The base member 12 and the pressure sensor chip 11 are joined by electrostatic bonding. The base member 12 and the storage box 10 are bonded with an adhesive (not shown). The lead pins 15 are terminal pins for extracting signals from the sensor element 1, and multiple lead pins 15 are arranged.

[0018] Each lead pin 15 penetrates the storage box 10 through a different through-hole 10b and is fixed to the storage box 10 by an insulating member 16, such as glass, that closes the through-hole 10b. One end of each lead pin 15 (hereinafter referred to as the lower end) protrudes downward (toward the screw portion 2) from the recess 10a of the storage box 10 and is connected to each electrode provided on the pad portion 65 on the second surface 62 of the pressure sensor chip 11 by bonding wires 14. The other end of each lead pin 15 (hereinafter referred to as the upper end) protrudes upward (toward the socket housing portion 4) from the side opposite the recess 10a of the storage box 10. A recess 27 is provided on the side opposite the recess 10a of the storage box 10. The recess 27 is provided to prevent stress from concentrating on the insulating member 16.

[0019] Specifically, of the plurality of lead pins 15, the lower ends of the lead pins 15a (hereinafter referred to as first lead pins) which serve as the power terminal, ground terminal, and output terminal are connected to the electrodes of the pressure sensor element by bonding wires 14. The upper ends of the first lead pins 15a pass through the through holes 3b of the inner housing portion 3.

[0020] On the other hand, among the plurality of lead pins 15, the lower end of each lead pin (hereinafter referred to as second lead pin) 15b for characteristic adjustment and trimming is connected to each electrode of a predetermined control circuit by a bonding wire 14. The second lead pin 15b is used for characteristic adjustment and trimming during assembly of the physical quantity sensor device 100, and is not used after the characteristic adjustment and trimming. The first lead pin 15a and the second lead pin 15b have the same length.

[0021] Here, the vertical direction is the axial direction of the lead pin 15. The horizontal direction is the direction perpendicular to the axial direction of the lead pin 15. The lead pin 15 is made of a metal such as 42 Alloy or an iron-nickel alloy (50Ni-Fe) containing about 50 wt% nickel (Ni) and the remainder iron (Fe).

[0022] FIG. 1B is an enlarged perspective view of part A of FIG. 1A. FIG. 1C is an enlarged cross-sectional view of part B of FIG. 1B. In the embodiment, the through-hole 3b of the inner housing portion 3 (Through holes 31e of connector pins 31, which will be described later) is subjected to burring. By burring, which is one of the press working techniques, an R surface is formed on the inner housing portion 3 on the side where the first lead pin 15a is inserted into the through-hole 3b. The R surface is a surface provided with a gentle curved surface (curve) at the corner (angle) portion. As will be described later, this R surface can prevent the tip of the first lead pin 15a from being scraped by the inner housing portion 3 and a part of the metal from falling off. Further, by burring, a pipe-shaped portion 3i is formed on the surface of the inner housing portion 3 opposite to the surface where the R surface is formed.

[0023] Here, the radius R of the R surface is preferably not less than half of the plate thickness T of the inner housing portion 3 and not more than the plate thickness T of the inner housing portion 3 (1 / 2T ≦ R ≦ T). The larger the radius R of the R surface, the smaller the load when one tip of the first lead pin 15a contacts the inner housing portion 3, so the larger the radius R is, the better. However, since it becomes difficult to create when the radius R is large, it is preferably not more than T.

[0024] Further, in order to reduce the difference in distance from the laser during welding, the relationship between the height H1 of the pipe-shaped portion 3i and the protruding height H2 of the first lead pin 15a is preferably H2 ≦ ±H1 / 2. Here, in the case of +, as shown in FIG. 1C, it is the case where the first lead pin 15a protrudes from the pipe-shaped portion 3i, and in the case of -, it is the case where the first lead pin 15a is retracted from the pipe-shaped portion 3i.

[0025] Further, the diameter of the first lead pin 15a is 0.45 mm ± 0.035 mm, and the distance L between the first lead pin 15a and the pipe-shaped portion 3i is preferably 0.07 mm or less. If it is wider than this, when laser welding the first lead pin 15a and the pipe-shaped portion 3i, heat escapes through the gap. Also, the width W of the pipe-shaped portion 3i is preferably W < T.

[0026] 1D is an enlarged cross-sectional view of part B in FIG. 1B in another embodiment. As shown in FIG. 1D, instead of the rounded surface, a chamfered shape may be formed on the through hole 3b of the inner housing portion 3. A chamfered shape is a shape in which the corner is chamfered to a flat surface, and the chamfering angle is not limited to 45°. In addition, it is preferable that the width W1 of the chamfered shape is approximately the same as the radius R of the rounded surface.

[0027] The threaded portion 2 is made of a metal such as stainless steel. A through-hole (inlet) 23 is provided vertically in the center of the threaded portion 2, through which the measurement medium, such as air (gas to be measured) or oil (liquid to be measured), passes. The opening of the through-hole 23 at one open end of the threaded portion 2 is a pressure inlet 24. The storage box 10 is placed on a base 21 provided at the other open end of the threaded portion 2, with the diaphragm 13 sandwiched between them, so that an opening 25 of the through-hole 23 at the other open end of the threaded portion 2 faces the recess 10a of the storage box 10. The periphery of the stacked portion of the base 21 of the threaded portion 2, the diaphragm 13, and the storage box 10 are joined by laser welding.

[0028] The diaphragm 13 is a corrugated thin metal plate made of a metal such as SUS. The diaphragm 13 is positioned so as to cover the opening of the recess 10a of the storage box 10 and the other open end of the screw portion 2. The space surrounded by the recess 10a of the storage box 10 and the diaphragm 13 is filled with a liquid (pressure medium) 20 such as silicone oil that transmits pressure to the pressure sensor chip 11. The reference numeral 22 around the layered portion (joint) of the base 21 of the screw portion 2, the diaphragm 13, and the storage box 10 is the welded portion between the base 21 of the screw portion 2 and the storage box 10. The reference numeral 26 is an O-ring.

[0029] The inner housing portion 3 is a resin member integrally molded with the connector pin (second terminal) 31, and forms a generally recessed portion surrounding the upper portion and periphery of the sensor element 1. Specifically, the inner housing portion 3 is adhered with an adhesive 28 to the outer periphery of the storage box 10 on the side opposite the recess 10a. The adhesive 28 is applied to almost the entire contact surface between the storage box 10 and the inner housing portion 3. One of the adhesive surfaces between the inner housing portion 3 and the storage box 10 may have a cross-sectional shape with alternating concave and convex portions (for example, a jagged shape like a saw blade) and the amount of adhesive applied to this adhesive surface may be increased to facilitate adhesion between the inner housing portion 3 and the storage box 10. The recess 32 of the inner housing portion 3 has a depth sufficient to accommodate the second lead pin 15b.

[0030] A through hole 3b for passing the first lead pin 15a through is provided in a portion 3a of the inner housing part 3 that covers the upper part of the sensor element 1 (hereinafter referred to as the upper part of the inner housing part 3). A connector pin 31 is integrally formed with the upper part 3a of the inner housing part 3. The connector pin 31 is a signal terminal for exchanging signals between the physical quantity sensor device 100 and the outside. One end 31a of the connector pin 31 (see FIGS. 3A to 3C described later) is inserted into the through hole 3b of the inner housing part 3. becomes The connector pins 31 each have a through hole 31e. A chip capacitor 18 is attached to a recess 31f provided in a vertical portion 31c of the connector pin 31 (see FIGS. 3A to 3C described later) with a bonding member 17. The chip capacitor 18 is attached between adjacent connector pins 31. The configuration of the connector pins 31 will be described later with reference to FIGS. 3A and 3B.

[0031] During assembly, the upper end of the first lead pin 15a and one end 31a of the connector pin 31 are irradiated with laser light from above at a predetermined angle of incidence (an angle of about 3 degrees with respect to the vertical direction). By this laser welding, the upper end of the first lead pin 15a is joined to one end 31a of the connector pin 31. The connector pin 31 is made of a metal such as phosphor bronze (an alloy containing copper (Cu) and tin (Sn)), 42 alloy, or 50Ni-Fe, and the connector pin 31 and the lead pin 15 are joined so as to melt together by the irradiation of the laser light.

[0032] The socket housing portion 4 is a connection portion for connecting to external wiring, accommodating the vertical portions 31c of the connector pins 31 (see FIGS. 3A to 3C described later). The socket housing portion 4 is, for example, substantially cylindrical and surrounds the periphery of the vertical portions 31c of the connector pins 31. For example, the connector pins 31 pass through through holes 4c in the bottom portion 4b of the socket housing portion 4 and protrude into a space 41 surrounded by the socket housing portion 4. The socket housing portion 4 is bonded to the outer periphery of the upper surface of the upper portion 3a of the inner housing portion 3 with an adhesive (not shown). The adhesive is applied to almost the entire contact surface between the inner housing portion 3 and the socket housing portion 4. The joint surfaces of the socket housing portion 4 and the inner housing portion 3 may be provided with recesses and protrusions 4a, 3d that fit together.

[0033] It is preferable that the maximum diameters of the base portion 21 of the screw portion 2, the storage box 10, the inner housing portion 3, and the socket housing portion 4 are approximately equal. The reason for this is as follows: As described above, the screw portion 2, the storage box 10, the inner housing portion 3, and the socket housing portion 4 are joined (or adhered) in that order. Therefore, by making the maximum diameters of the base portion 21 of the screw portion 2, the storage box 10, the inner housing portion 3, and the socket housing portion 4 approximately equal, it is possible to achieve a reduction in size in the diameter direction (horizontal direction).

[0034] In the physical quantity sensor device 100 configured as described above, when a pressure medium is introduced through the pressure inlet 24 and the diaphragm 11a of the pressure sensor chip 11 receives pressure, the diaphragm 11a is deformed. This changes the gauge resistance value on the diaphragm 11a, generating a corresponding voltage signal. This voltage signal is amplified by an amplifier circuit adjusted by adjustment circuits such as a sensitivity correction circuit, an offset correction circuit, and a temperature characteristic correction circuit, and is output from the pressure sensor chip 11. This output signal is then output to the first lead pin 15a via the bonding wire 14.

[0035] Next, a description will be given of a manufacturing method (assembly method) of the physical quantity sensor device 100. Figures 3A to 18 are explanatory views showing states of the physical quantity sensor device according to the embodiment during manufacturing (during assembly).

[0036] First, the connector pin 31 to which the chip capacitor 18 is connected and the inner housing part 3 will be described with reference to Figures 3A to 5B. Figures 3A to 3C show only the connector pin 31 and the chip capacitor 18, omitting the inner housing part 3.

[0037] 3A to 3C show the connector pins 31 as viewed from various directions. FIG. 3D shows an equivalent circuit of the chip capacitors 18 connecting the connector pins 31 to each other. The first connector pin 31о and the fourth connector pin 31r are signal terminal pins that supply a power supply signal for supplying a power supply voltage and are connected to the lead pin 15, which is a power supply terminal. The second connector pin 31p is a signal terminal pin for extracting a sensor signal and is connected to the lead pin 15, which is an output terminal. The third connector pin 31q is a signal terminal pin for connecting to ground (Gnd) and is connected to the lead pin 15, which is a ground terminal. Two signal terminal pins for supplying a power supply signal (Vcc) are provided at both ends, such as the first connector pin 31о and the fourth connector pin 31r, in order to attach chip capacitors 18 between the signal terminal pin for extracting a sensor signal (Vout) and the signal terminal pin for connecting to ground (Gnd).

[0038] The first to third connector pins 31o to 31q have a generally L-shaped cross section (in the example of FIG. 3C, the first connector pin 31o is shown) that is made up of a portion 31b (hereinafter referred to as a horizontal portion (first portion)) that is embedded in the upper portion 3a of the inner housing portion 3 by resin molding, and a portion 31c (hereinafter referred to as a vertical portion) that is connected to the horizontal portion 31b and protrudes upward perpendicular to the horizontal portion 31b. The fourth connector pin 31r (not shown) has a generally I-shaped cross section that includes only the vertical portion 31c.

[0039] One end portion 31a of each of the first to third connector pins 31o to 31q is formed so as to surround the periphery of the through hole 31e (FIG. 3B). Note that the end portions 31a of the first to third connector pins 31o to 31q may be formed in a substantially semicircular planar shape that surrounds part of the periphery of the through hole 31e, or may have a linear planar shape that reaches the side wall of the through hole 31e and be exposed at part of the side wall of the through hole 31e (not shown).

[0040] The horizontal portion 31b of the first connector pin 31o is provided to surround the end portion 31a of the first connector pin 31o, the horizontal portion 31b and end portion 31a of the second connector pin 31p, and the horizontal portion 31b and end portion 31a of the third connector pin 31q, and is integrally connected to the fourth connector pin 31r (FIG. 3B), so that the first connector pin 31o and the fourth connector pin 31r have the same potential.

[0041] First, chip capacitors 18 are attached to connector pins 31 using bonding materials 17 such as solder or conductive adhesive. For example, first connector pin 31o and second connector pin 31p are connected via chip capacitor 18a (FIGS. 3A and 3B). For example, second connector pin 31p and third connector pin 31q are connected via chip capacitor 18b (FIGS. 3A and 3B). For example, third connector pin 31q and fourth connector pin 31r are connected via chip capacitor 18c (FIGS. 3A and 3B). In this way, connector pins 31 are connected to each other via chip capacitors 18 (FIGS. 3A and 3B). As described above, end 31a of first connector pin 31o is connected to vertical portion 31c of fourth connector pin 31r. Therefore, chip capacitors 18 can be attached between each terminal (FIG. 3D).

[0042] 3A to 3D, chip capacitors 18 are attached between the terminals, but this is not limiting. For example, whether or not to attach chip capacitor 18c between fourth connector pin 31r and third connector pin 31q may be determined depending on surge requirements. For example, when chip capacitor 18c is attached, EMC (Electromagnetic Compatibility) resistance is improved compared to when chip capacitor 18c is not attached.

[0043] Next, the connector pins 31 are placed in a mold for molding the inner housing portion 3. Then, a resin material is poured into the mold, thereby integrally molding the inner housing portion 3 and the connector pins 31 (insert molding).

[0044] Fig. 4 shows a cross section of the inner housing part 3. Fig. 5A and Fig. 5B show the external appearance of the inner housing part. The inner housing part 3 is provided with a recess 3d that fits into the mating surface with the socket housing part 4 (Figs. 4, 5A, and 5B).

[0045] The upper portion 3a of the inner housing portion 3 is provided with through-holes 3b for passing the first lead pins 15a therethrough (FIG. 5B). The through-holes 3b are provided in the same positions as the through-holes 31e of the connector pins 31 (see FIGS. 3B and 3C). Therefore, the through-holes 3b on the front surface of the inner housing portion 3 as viewed from the side where the connector pins 31 are exposed are the same as the through-holes 31e. However, as shown in FIG. 12B (described later), the through-holes 3b on the back surface of the inner housing portion 3 as viewed from the side where the connector pins 31 are exposed are through-holes formed of resin. The connector pins 31 are integrally molded with the upper portion 3a of the inner housing portion 3 (FIGS. 4, 5A, and 5B). For example, a portion of the vertical portion 31c of the connector pins 31 is exposed from the inner housing portion 3 (FIG. 4). For example, the upper portion 3a of the inner housing portion 3 covers the horizontal portion 31b of the connector pins 31. One end 31a of the connector pins 31 is exposed from the upper portion 3a of the inner housing portion 3. The exposed portion of one end 31a of the connector pin 31 is welded to the first lead pin 15a.

[0046] Furthermore, the upper end portion 3e of the inner housing portion 3 covers the chip capacitor 18 and the joining member 17 attached to the connector pin 31.

[0047] Next, the process from attaching the lead pins 15 to the storage box 10 to injecting the pressure medium and sealing it will be described with reference to FIGS.

[0048] 6, lead pins 15 are passed through each of the through holes 10b of storage box 10. Here, an example will be described in which storage box 10 has a substantially circular planar shape and through holes 10b are provided on a circumference centered at the center of the bottom surface of recess 10a of storage box 10. Of the multiple holes, one hole is hole 10c for injecting oil, which is a pressure medium, and the remaining holes are through holes 10b for passing lead pins 15 through.

[0049] Next, an insulating material 16 such as glass is poured into the through-holes 10b of the storage box 10 to bond (hermetically seal) the lead pins 15 to the storage box 10. Next, an adhesive 51 is applied to the bottom of the recess 10a of the storage box 10, for example, in the center where the through-holes 10b are not formed. Next, as shown in FIG. 7, the pressure sensor chip 11 is mounted and bonded on the adhesive 51 on the bottom of the recess 10a of the storage box 10. Next, as shown in FIG. 8, the electrodes of the pressure sensor chip 11 and the lead pins 15 are electrically connected by bonding wires 14. Next, as shown in FIG. 9, the storage box 10 is placed on the base 21 of the screw portion 2 with the diaphragm 13 sandwiched between them, with the recess 10a side facing downwards (the screw portion 2 side), and the laminated portions of these members are bonded together by, for example, laser seam welding.

[0050] Next, as shown in Fig. 10, in a vacuum atmosphere, a liquid 20 such as silicone oil is poured through the hole 10c in the storage box 10 into the space surrounded by the recess 10a of the storage box 10 and the diaphragm 13. Next, as shown in Fig. 11, a metal ball 52 made of a metal such as SUS is pressed against the hole 10c into which the liquid 20 has been poured, and a voltage is applied. This causes the metal ball 52 to be welded (resistance welding) to the opening of the hole 10c, sealing in the liquid 20. Next, the characteristics of the sensor element 1 are adjusted and trimmed using a general method.

[0051] Next, the process of bonding the inner housing portion 3 and the storage box 10 together will be described with reference to FIGS. 12A to 16. FIG.

[0052] Fig. 12A shows the bottom surface of the inner housing portion 3 where the connector pins 31 are not exposed, and Fig. 12B shows the surface of the storage box 10 where the lead pins 15 are exposed.

[0053] In the example of FIG. 12A, the inner housing portion 3 has three through holes 3b and five grooves 3f. . KanThe first lead pin 15a passes through the through hole 3b and is connected to the connector pin 31. The groove 3f has a first groove 3fa and a second groove 3fb. The second lead pin 15b is fitted into the groove 3f. When the length of the lead pin 15 is about 8 mm, the length over which the second lead pin 15b is fitted into the groove 3f is about 2 mm or more and 3 mm or less.

[0054] Because the shape of the horizontal cross section of the lead pin 15 (a cross section obtained by cutting the lead pin 15 into a ring) is circular, the shapes of the through hole 3b and the first groove 3fa are also circular. The diameters of the through hole 3b and the first groove 3fa are φh. The diameter of the lead pin 15 is φp. The relationship φp ≒ φh holds.

[0055] The second groove 3fb is shaped so that the length of the opposite side of the second groove 3fb is shorter than the length φp, allowing the second lead pin 15b to fit into the second groove 3fb. The second groove 3fb is also shaped so that the force required to press the second lead pin 15b does not exceed its limit. In the example of FIG. 12A, the shape of the second groove 3fb is a combination of a chord and an arc. The shape of the second groove 3fb may also be a polygon, such as a substantially hexagonal or rectangular shape. For example, the arc length of the second groove 3fb is φh'. The relationship φh'<φp holds. For example, φh' is reduced by approximately 5% to 10% from φp, taking into account variations in the dimensional accuracy of the second groove 3fb and the second lead pin 15b. If φh'=φp, the second lead pin 15b may be scraped when fitting into the second groove 3fb, which may result in failure to fit with precision, so it is preferable to make φh'<φp.

[0056] Furthermore, if the number of second grooves 3fb is large, the force required to push the second lead pins 15b into the second grooves 3fb becomes large, which may make it difficult to push the second lead pins 15b into them. Therefore, it is preferable to have the number of second grooves 3fb be between one and three. Two second grooves 3fb is better than one, and three is better than two. When there are three second grooves 3fb, the inner housing portion 3 is fixed to the surface, preventing the inner housing portion 3 from lifting up. Furthermore, although it is preferable that the grooves 3f have the shape of the second grooves 3fb, the through holes 3b may also have the shape of the second grooves 3fb. For example, if all five second lead pins 15b are cut off, the second lead pins 15b cannot be fitted into the grooves 3f. Therefore, at least one of the three through holes 3b may have the shape of the second grooves 3fb. Also, for example, if it is desired to have three second grooves 3fb to achieve surface fixation, but three of the five second lead pins 15b are cut so that only two second lead pins 15b can be fitted into the grooves 3f, the shape of one of the three through holes 3b may be the shape of the second groove 3fb.

[0057] In this way, for example, by changing the shape of some of the grooves 3f from a circular shape to a shape in which the length of the opposite side is shorter than the diameter of the circle, a structure is created in which the lead pin 15 fits into the groove 3f. This makes it possible to prevent the inner housing portion 3 from floating up when the adhesive 28 (FIG. 1A) is thermally cured. In other words, it is possible to prevent a gap from being formed between the bottom surface 3c of the inner housing portion 3 and the storage box 10 when the adhesive 28 is thermally cured.

[0058] Next, a process of passing the first lead pin 15a through the through hole 3b of the inner housing part 3 integrally formed with the connector pin 31 will be described with reference to FIG. (Connector pin 31) Through holes 3 1e Therefore, as shown in FIG. 13A, the through hole 3 1e By inserting the first lead pin 15a from the R surface side of the through hole 3, the R surface1e The area of the inviting surface S is larger than that of the through hole 3. 1e Within the range of the guide surface S, the first lead pin 15a and the through hole 3 can be aligned with each other due to the positional accuracy of the first lead pin 15a. 1e Even if the positional deviation occurs, the first lead pin 15a is inserted into the through hole 3. 1e The first lead pin 15a comes into contact with the rounded surface of the through hole 3, and moves in the direction indicated by the arrow V. 1e The first lead pin 15a is guided toward the center of the through hole 3. 1e is inserted into

[0059] In addition, the tip of the first lead pin 15a Connector pin 3 1 Through holes 3 1e Even if the tip of the first lead pin 15a interferes with the edge of the connector, the contact between the R surface and the first lead pin 15a does not generate a large enough stress to destroy the material, and the first lead pin 15a can be inserted without being scraped off. Connector pin 31 Therefore, it is possible to prevent foreign matter from falling onto the sensor element 1 and causing a short circuit between the storage box 10 and the first lead pin 15a, thereby eliminating defects in the assembly process. 1e In the above, the case where a rounded surface is provided is explained, but the same applies when a chamfered shape is provided as shown in FIG. 1D.

[0060] The inner housing portion 3 may also be provided with a tapered portion 3g for guiding the first lead pin 15a. Furthermore, it is preferable to provide a straight portion 3h of the inner housing portion 3 between the tapered portion 3g of the inner housing portion 3 and the inner housing portion 3. The straight portion 3h is a portion having a hole that is approximately perpendicular to the through hole 3b. FIG. 13B shows the process of passing the first lead pin 15a through the through hole 3b of the inner housing portion 3 having the straight portion 3h. When passing the first lead pin 15a through the through hole 3b of the inner housing portion 3, the first lead pin 15a can be inserted smoothly by using the side wall of the straight portion 3h as a guide.

[0061] Furthermore, the diameter L and length D of the straight portion 3h are preferably set so that the angle θ when the first lead pin 15a contacts the sidewall of the straight portion 3h is 10° or less. If the angle exceeds 10°, the load on the first lead pin 15a in a direction perpendicular to the insertion direction increases, resulting in a load that exceeds the material strength of the first lead pin 15a and causes it to be chipped. On the other hand, if the angle is 10° or less, excessive load is not applied to the first lead pin 15a, allowing it to be inserted without being chipped. As a result, insertability is significantly improved and chipping of the first lead pin 15a due to snagging during insertion can be suppressed.

[0062] Next, as shown in FIG. 14, the first lead pin 15a is passed through the through-hole 3b of the inner housing portion 3, which is integrally molded with the connector pins 31, and at the same time, the second lead pin 15b is fitted into the groove 3f of the inner housing portion 3, thereby determining the position of the inner housing portion 3, and the inner housing portion 3 is fixed to the storage box 10 with a thermosetting adhesive 28 (FIG. 1A). For example, the inner housing portion 3 and the storage box 10 are left at a high temperature until the applied adhesive 28 hardens. At this time, because the second lead pin 15b is fitted into the groove 3f of the inner housing portion 3, the inner housing portion 3 is prevented from floating up when the adhesive 28 hardens, and there is no need to press down the inner housing portion 3 and the storage box 10. In this way, assembly is easy.

[0063] At this time, the first lead pin 15a comes into contact with the connector pin 31 exposed on the upper surface of the upper portion 3a of the inner housing portion 3 through the through hole 3b of the inner housing portion 3. Furthermore, at this stage, the socket housing portion 4 that covers the periphery of the connector pin 31 has not been joined, so no member that could become an obstacle on the path of the laser light 53 is placed above the inner housing portion 3. In other words, the contact portion between the upper end portion of the first lead pin 15a and one end portion 31a of the connector pin 31 can be seen from almost above.

[0064] Next, a description will be given of a process of irradiating the through hole 3b of the inner housing portion 3 with laser light 53 from above at a predetermined incident angle to weld (join) the contact portion between the upper end of the first lead pin 15a and one end 31a of the connector pin 31. Fig. 15A shows a perspective view of the welding process, Fig. 15B shows a top view of the welding process, and Fig. 15C shows a cross-sectional view of the welding process.

[0065] Here, the inner housing part 3 (Connector pin 31) The surface opposite to the rounded surface is machined into a pipe shape (pipe-shaped portion 3i), and the first lead pin 15a is located inside the pipe-shaped portion (see FIGS. 1B and 1C). Connector pin 31 When the pipe-shaped portion 3i is irradiated with a laser, the heat generated by the laser is Connector pin 31 However, because of the pipe shape, the cross-sectional area for transferring heat is small, and the heat is transferred to the first lead pin 15a. Connector pin 31 The pipe-shaped portion 3i is concentrated at the contact portion. Connector pin 31 The laser welded portion 3j is formed between the first lead pin 15a and the pipe-shaped portion 3i.

[0066] As a result, the laser energy required for welding can be reduced, and welding can be performed even with a low-power, inexpensive welding machine. Connector pin 31 By minimizing the misalignment of the surfaces and controlling the height of the laser irradiation surface, heat is generated at the irradiated surface of each component, and the melting of each component is also carried out on the same plane, making it possible to achieve high-quality welding.

[0067] FIG. 16 shows a cross section of the inner housing portion 3 and the storage box 10 after bonding. The cross section is taken along the line A-A' in FIG. 12B. Note that the screw portion 2, the pressure sensor chip 11, and the like are omitted from FIG. 16. The first lead pin 15a is welded to the connector pin 31. Specifically, for example, the upper end of the first lead pin 15a passes through the through hole 3b and is joined to one end 31a and the horizontal portion 31b of the connector pin 31. Meanwhile, the second lead pin 15b is fitted into the groove 3f. Furthermore, since the second lead pin 15b is not cut, the second lead pin 15b and the first lead pin 15a have the same length.

[0068] Next, the socket housing part 4 will be described with reference to FIGS. 17A and 17B.

[0069] Fig. 17A shows a perspective view of the socket housing part 4. Fig. 17B shows a cross-sectional view of the socket housing part 4. The socket housing part 4 accommodates the vertical part 31c of the connector pin 31. The socket housing part 4 has a protrusion 4a on the surface that joins with the inner housing part 3, which fits into the recess 3d of the inner housing part 3.

[0070] The socket housing 4 has a recessed interior. A through hole 4c and a groove 4d are provided in a bottom 4b of the recess of the socket housing 4. The groove 4d is provided in the bottom 4b near the inner wall of the socket housing 4, so the portion of the bottom 4b where the groove 4d is provided is thicker than the portion where the through hole 4c is provided. The first to third connector pins 31o to 31q pass through the through holes 4c. The fourth connector pin 31r is inserted into the groove 4d. The through holes 4c and the groove 4d are shaped to allow the connector pins 31 to pass through or be inserted into the bottom surface 3c of the inner housing 3 as well. The position of the groove 4d and the through hole 4c can be determined.

[0071] Next, the process of joining the socket housing portion 4 and the inner housing portion 3 will be described with reference to FIG.

[0072] 18, the socket housing portion 4 and the inner housing portion 3 are joined together with an adhesive. As a result, the socket housing portion 4 is joined to the upper surface of the upper portion 3a of the inner housing portion 3 so as to surround the periphery of the connector pins 31. At this time, for example, the first connector pin 31o to the third connector pin 31q pass through each of the through holes 4c. The inner housing portion 3 and the socket housing portion 4 are joined together by inserting the fourth connector pin 31r into the groove 4d and passing the first connector pin 31o to the third connector pin 31q through each of the through holes 4c.

[0073] Thereafter, an O-ring 26 (FIG. 1A) is attached to the underside of the base portion 21 of the screw portion 2, thereby completing the physical quantity sensor device 100 shown in FIG. 1A.

[0074] As described above, according to this embodiment, the inner housing portion Connector pin The through-hole has a rounded surface created by burring. This means that even if the tip of the lead pin interferes with the edge of the through-hole in the inner housing, it does not generate stress large enough to destroy the material, and the lead pin can be inserted without being scraped off. This prevents foreign matter from getting into the sensor element and causing a short circuit, eliminating defects in the assembly process.

[0075] Also, Connector pin There is a pipe-shaped section on the surface opposite the R surface. As a result, when a laser is irradiated onto the lead pin and pipe-shaped section, the cross-sectional area for transferring heat is small, and the heat is concentrated at the point where the lead pin and pipe-shaped section come into contact. This reduces the laser energy required for welding, making it possible to weld with an inexpensive, low-output welding machine.

[0076] As described above, the physical quantity sensor device and the manufacturing method for a physical quantity sensor device according to the present invention are useful for a physical quantity sensor device equipped with a sensor chip that applies pressure from the recess side (diaphragm side) of the storage box, and are particularly suitable for a pressure sensor device. [Explanation of symbols]

[0077] 1 sensor element 2. Threaded section (measurement medium introduction section) 3, 103 Inner housing part 3a Upper part of inner housing 3b, 103b Through holes in inner housing 3c Bottom surface of the upper end of the inner housing 3d Unevenness on the outer periphery of the upper part of the inner housing 3e Upper end of inner housing 3f, 3fa, 3fb Groove in inner housing 3g, 103g Tapered part of inner housing 3h Straight section of inner housing 3i Pipe-shaped part of the inner housing 3j Laser welded part of inner housing 4 Socket housing 4a Concave and convex at the bottom of the socket housing 4b Bottom of the socket housing 4c Through hole at the bottom of the socket housing 4d Groove at the bottom of the socket housing 10 Storage Box 10a Recessed portion of storage box 10b Through hole in storage box 10c Storage box hole 11 Pressure sensor chip 11a, 13 diaphragm 12 Base member 14 Bonding wire 15, 15a, 15b, 115 lead pins 16 Insulating material 17 Joint materials 18, 18a~18c Chip capacitors 20 liquid 21 Base 22 Welded section 23 Threaded through hole (introduction hole) 24 Pressure inlet at one open end of the threaded portion 25 Opening at the other open end of the threaded portion 26 O-ring 27 Recessed part 28, 51 Adhesives 31, 31o~31r connector pins 31a Connector pin end 31b Horizontal part of connector pin 31c Vertical part of connector pin 31e Connector pin through hole 31f Connector pin recess 32 Recessed portion of inner housing 41 Space surrounded by the socket housing 52 metal ball 53, 153 Laser light 61 First Side 62 Second Side 63 Gauge Resistor 64 Control Circuit Area 65 Pad section 100 Physical quantity sensor device

Claims

1. a sensor element having a semiconductor chip; a first terminal disposed on the sensor element; a first housing portion that houses the first terminal and includes a second terminal that is electrically connected to the first terminal; Equipped with the second terminal has a through hole into which one end of the first terminal is inserted; the through hole has an R-surface formed on a surface into which the first terminal is inserted; the first accommodating portion includes an introduction hole for the first terminal on a surface into which the first terminal is inserted, the introduction hole having an opening width larger than that of the through hole of the second terminal; a straight portion having a hole extending in substantially the same direction as the through hole, the straight portion being provided between the first accommodating portion and the tapered portion;

2. 2. The physical quantity sensor device according to claim 1, wherein a radius R of the rounded surface is equal to or greater than half the thickness T of the second terminal and is equal to or smaller than the thickness T of the second terminal.

3. 3. The physical quantity sensor device according to claim 1, wherein the second terminal has a pipe-shaped portion on a surface opposite to a surface into which the one end of the first terminal is inserted.

4. 4. The physical quantity sensor device according to claim 3, wherein the one end of the first terminal protrudes from or is recessed from the pipe-shaped portion by a length equal to or less than half the height of the pipe-shaped portion.

5. The physical quantity sensor device according to any one of claims 1 to 4, characterized in that the diameter and length of the straight portion are set so that the angle at which the first terminal and a side wall of the straight portion come into contact is 10° or less.

6. a medium introduction section having a medium introduction hole for introducing a medium to be measured, which is a gas or liquid to be pressure measured, and having a base section provided at one end of the medium introduction hole; the sensor element is fixed on the base portion so as to cover the medium introduction hole, 6. The physical quantity sensor device according to claim 1, wherein the first container holds the sensor element between itself and the measurement medium introduction portion.

7. A method for manufacturing a physical quantity sensor device comprising: a measurement medium inlet having an inlet hole for introducing a measurement medium, which is a gas or liquid to be pressure-measured; a sensor element having a plurality of first terminals arranged therein, the sensor element being fixed to a base provided at one end of the inlet hole of the measurement medium inlet so as to close the inlet hole; and a first accommodating portion sandwiching the sensor element between the measurement medium inlet and the first accommodating portion, accommodating the plurality of first terminals, and having a second terminal electrically connected to the first terminal, When forming a through hole in the second terminal of the first accommodating portion, into which one end of the first terminal is inserted, an R surface is formed on a surface into which the first terminal is inserted; an introduction hole for the first terminal that is larger in opening width than the through hole of the second terminal is formed in the first accommodating portion on a surface side into which the first terminal is inserted; A method for manufacturing a physical quantity sensor device, characterized in that a tapered portion and a straight portion having a hole in approximately the same direction as the through hole are formed in the introduction hole, the straight portion being provided between the first accommodating portion and the tapered portion.

8. 8. The method for manufacturing a physical quantity sensor device according to claim 7, wherein the rounded surface is formed by burring.

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