Evaporation mask, method for manufacturing the deposition mask, and method for manufacturing the display device

Abstract

To provide a vapor deposition mask capable of facilitating a reconnection of a mask part to a mask frame, a manufacturing method of the vapor deposition mask, and a manufacturing method of a display device.SOLUTION: A vapor deposition mask comprises: a mask frame 11 including a main body part 11A including a front surface 11AF, a back surface 11AR and a first opening part 11AH and a frame part 11B including a front surface 11BF, a back surface 11BR, and a second opening part 11BH and configured to be capable of mounting the frame part 11B to the main body part 11A such that an opening of the front surface 11AF in the second opening part 11BH faces an opening of the front surface 11AF in the first opening part 11AH in the back surface 11AR side of the main body part 11A with respect to the front surface 11AF of the main body part 11A, and removing the frame part 11B from the main body part 11A; and a mask part 12 which has a plurality of mask holes 12H and is connected to the back surface 11BR of the frame part 11B so as to cover the second opening part 11BH.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a deposition mask, a method for manufacturing a deposition mask, and a method for manufacturing a display device. [Background technology]

[0002] In the manufacture of organic EL display devices, vacuum deposition is used to form an organic light-emitting layer included in a display element. When forming an organic light-emitting layer by vacuum deposition, a deposition mask is used to form an organic light-emitting layer having a predetermined shape at a predetermined position on a deposition target. The deposition mask includes multiple mask portions and a mask frame. Each mask portion is a metal foil having multiple mask holes formed therein. The multiple mask holes have a shape and arrangement corresponding to the shape and arrangement of the organic light-emitting layer. The mask frame has frame holes that allow a deposition material to reach the mask portions attached to the mask frame. Each mask portion is joined to the mask frame so as to cover a different frame hole (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2019 / 054462 Summary of the Invention [Problem to be solved by the invention]

[0004] The mask part is joined to the mask frame by welding, for example. When welding is used to join the mask part, a joining mark where the mask part was joined is formed on the mask frame. The joining mark is a depression formed in the part of the mask frame where the mask part was welded.

[0005] On the other hand, when deposition is performed multiple times using one deposition mask, a portion of the mask portion may be deformed or deposition material may accumulate on a portion of the mask portion. In this regard, with the above-described deposition mask, it is possible to remove only the mask portion that needs to be replaced from the mask frame and join a new mask portion to the mask frame. However, since the mask frame has a joining mark formed by joining the mask portion, it is necessary to process the joining mark to prevent the mask portion from being misaligned with the mask frame or from not being joined to the mask frame due to the joining mark. Therefore, the need to process the joining mark makes rejoining the mask portion to the mask frame complicated.

[0006] The above-mentioned problem is not limited to cases where welding is used to join the mask parts, but is also common to cases where adhesive is used to join the mask parts. When adhesive is used to join the mask parts, an adhesive layer is formed as a joining mark.

[0007] An object of the present invention is to provide a deposition mask that allows for easy re-bonding of a mask portion to a mask frame, a method for manufacturing a deposition mask, and a method for manufacturing a display device. [Means for solving the problem]

[0008] A vapor deposition mask for solving the above problems includes: a mask frame configured to attach the frame to the main body so that the opening in the second opening on the front surface faces the opening in the first opening on the back surface side of the main body relative to the front surface of the main body; a mask frame configured to allow the frame to be detached from the main body; and a mask frame having a plurality of mask holes, the mask frame being bonded to the back surface of the frame to cover the second opening.

[0009] A method for manufacturing a vapor deposition mask for solving the above problems includes joining a mask part to a frame part having a second opening penetrating between a front surface and a back surface, and attaching the frame part to a main body part having a first opening penetrating between the front surface and the back surface. Joining the mask part includes joining the mask part to the back surface of the frame part so as to cover the second opening. Attaching the frame part includes attaching the frame part to the back surface of the main body part relative to the front surface of the main body part so that an opening in the front surface of the second opening faces an opening in the front surface of the first opening, and so as to be detachable from the main body part.

[0010] A method for manufacturing a display device to solve the above problem includes forming a pattern on a deposition target using a deposition mask manufactured by the above deposition mask manufacturing method.

[0011] According to the vapor deposition mask, the vapor deposition mask manufacturing method, and the display device manufacturing method, when replacing the mask portion of the vapor deposition mask with a new mask portion, the mask portion can be removed from the main body portion together with the frame portion, which can be removed from the main body portion. This also removes any bonding marks formed on the frame portion by bonding the mask portion to the frame portion from the main body portion. Therefore, a vapor deposition mask can be obtained by attaching a new frame portion to the main body portion and bonding a new mask portion to the new frame portion. In this way, when re-bonding the mask portion to the mask frame, no processing of the bonding marks on the mask frame is required, which makes it easy to re-bond the mask portion to the mask frame.

[0012] The deposition mask may include a plurality of the mask portions, the main body portion may include a plurality of the first openings, the mask frame may include a plurality of the frame-shaped portions, each frame-shaped portion having the second opening facing the opening of a different one of the first openings, each mask portion being welded to the back surface of the different frame-shaped portions, each frame-shaped portion having a welding mark formed by welding the mask portion to the frame-shaped portion, and the welding mark may be a depression formed on the back surface.

[0013] The welding marks formed on the mask frame by welding the mask part are depressions formed on the surface of the mask frame where the mask part is welded. Therefore, in order to remove the welding marks from the mask frame, processing is required to remove the welding marks from the mask frame or to fill the welding marks. It is difficult to perform these processing steps when the mask part other than the mask part that requires processing is still joined to the mask frame.

[0014] In this regard, with the vapor deposition mask, the mask portion is joined to the frame-shaped portion of the mask frame, which more significantly achieves the effect of making it easier to rejoin the mask portion to the mask frame.

[0015] In the deposition mask described above, the frame-shaped portion is a frame member formed of a magnetic metal, and the mask frame may further include a fixing portion that fixes the frame-shaped portion to the main body portion by magnetic adsorption so as to be detachable from the main body portion.

[0016] According to the deposition mask, the frame-shaped portion is fixed to the main body portion by magnetic adsorption, and therefore the accuracy of the position of the frame-shaped portion relative to the main body portion is less likely to decrease compared to when the frame-shaped portion is fixed to the main body portion using fastening members such as screws.

[0017] In the deposition mask, the mask frame may include a first position adjustment portion configured to be able to change the position of the frame-shaped portion relative to the main body portion between a first position and a second position in the thickness direction of the main body portion.

[0018] According to the above deposition mask, the position of the frame-shaped portion in the thickness direction can be changed by the first position adjustment unit, and therefore, the first position adjustment unit can suppress misalignment of the mask portion due to variations in thickness among multiple frame-shaped portions.

[0019] In the deposition mask, the mask frame may include a second position adjustment unit configured to change the position of the frame portion relative to the main body portion between a third position and a fourth position in a plane in which the frame portion extends.

[0020] According to the above deposition mask, the second position adjustment unit can change the position of the frame-shaped portion on the plane in which the frame-shaped portion extends, and therefore the second position adjustment unit can suppress misalignment of the position of the second openings between multiple frame-shaped portions.

[0021] In the vapor deposition mask, the main body may have a stepped portion where the opening of the first opening on the back surface is widened, and the frame-shaped portion may be located at the stepped portion. With this vapor deposition mask, the frame-shaped portion is located at the stepped portion, so it is possible to reduce the gap between the back surface of the main body and the mask portion compared to when the main body does not have a stepped portion. Therefore, when the vapor deposition mask comes into contact with the vapor deposition target, it is possible to reduce the difference in force acting on the portion of the vapor deposition target that is in contact with the vapor deposition mask and the portion that is not in contact with the vapor deposition mask.

[0022] In the vapor deposition mask, the frame-shaped portion may have a thickness equal to or greater than the depth of the stepped portion of the main body portion in a cross section perpendicular to the back surface. With this configuration, when the frame-shaped portion is fitted into the stepped portion of the main body portion, the back surface of the frame-shaped portion is flush with the back surface of the main body portion, or the back surface of the frame-shaped portion protrudes from the back surface of the main body portion. This prevents the back surface of the main body portion from protruding from the back surface of the frame-shaped portion, thereby preventing a gap from being formed between the mask portion and the vapor deposition target. [Effects of the Invention]

[0023] According to the present invention, the mask can be easily re-attached to the mask frame. [Brief explanation of the drawings]

[0024] [Figure 1] FIG. 2 is a perspective view showing the structure of a deposition mask according to the first embodiment. [Figure 2] FIG. 2 is a cross-sectional view showing a part of the structure of the deposition mask shown in FIG. [Figure 3] FIG. 3 is a cross-sectional view showing a part of the structure of the deposition mask shown in FIG. 2. [Figure 4] 3 is a plan view showing the structure of a mask portion included in the deposition mask shown in FIG. 2. [Figure 5] 3 is an enlarged cross-sectional view showing the structure of a mask portion included in the deposition mask shown in FIG. 2. [Figure 6] 5A to 5C are process diagrams illustrating a method for manufacturing a deposition mask. [Figure 7] 5A to 5C are process diagrams illustrating a method for manufacturing a deposition mask. [Figure 8] 5A to 5C are process diagrams illustrating a method for manufacturing a deposition mask. [Figure 9] 5A to 5C are process diagrams illustrating a method for manufacturing a deposition mask. [Figure 10] 5A to 5C are process diagrams illustrating a method for manufacturing a deposition mask. [Figure 11] 5A to 5C are process diagrams illustrating a method for manufacturing a deposition mask. [Figure 12] 5A to 5C are process diagrams illustrating a method for manufacturing a deposition mask. [Figure 13] 13 is an enlarged cross-sectional view of an area A shown in FIG. 12. [Figure 14] 5A to 5C are process diagrams illustrating a method for manufacturing a deposition mask. [Figure 15] 5A to 5C are process diagrams illustrating a method for manufacturing a deposition mask. [Figure 16] FIG. 4 is a diagram illustrating the function of the deposition mask. [Figure 17] FIG. 2 is a diagram showing the configuration of a deposition apparatus, together with a deposition mask and a deposition target. [Figure 18] FIG. 10 is a plan view showing the structure of a deposition mask according to a second embodiment. [Figure 19] 19 is a cross-sectional view showing the structure taken along line XIX-XIX in FIG. 18. [Figure 20] FIG. 3 is a cross-sectional view showing a fixing portion and a structure surrounding the fixing portion. [Figure 21] 19 is a cross-sectional view showing the structure taken along line XIX-XIX in FIG. 18. [Figure 22] FIG. 3 is a cross-sectional view showing a fixing portion and a structure surrounding the fixing portion. [Figure 23] FIG. 10 is a plan view showing the structure of a deposition mask according to a third embodiment. [Figure 24] 24 is a cross-sectional view showing the structure taken along line XXIV-XXIV shown in FIG. 23. [Figure 25] FIG. 10 is a plan view showing the structure of a deposition mask according to a fourth embodiment. [Figure 26] 26 is a cross-sectional view showing the structure taken along line XXVI-XXVI shown in FIG. 25. [Figure 27] FIG. 11 is a plan view showing the structure of a deposition mask according to a fifth embodiment. [Figure 28] 28 is a cross-sectional view showing the structure taken along line XXVIII-XXVIII shown in FIG. 27. DETAILED DESCRIPTION OF THE INVENTION

[0025] [First embodiment] A first embodiment of a deposition mask, a method for manufacturing a deposition mask, and a method for manufacturing a display device will be described with reference to Fig. 1 to Fig. 17. The deposition mask, the method for manufacturing a deposition mask, and the method for manufacturing a display device will be described in this order below.

[0026] [Deposition mask] The deposition mask includes a mask frame and a mask portion. The mask frame includes a main body portion and a frame-shaped portion. The main body portion includes a front surface, a back surface opposite the front surface, and a first through-hole penetrating between the front surface and the back surface. The frame-shaped portion includes a front surface, a back surface opposite the front surface, and a second through-hole penetrating between the front surface and the back surface. The mask frame is configured so that the frame-shaped portion can be attached to the main body portion on the back surface side of the main body portion relative to the front surface of the main body portion so that the opening on the front surface of the second opening faces the opening on the front surface of the first opening, and the frame-shaped portion can be detached from the main body portion. The mask portion has a plurality of mask holes and is joined to the back surface of the frame-shaped portion so as to cover the second opening.

[0027] The deposition mask will be described below with reference to Fig. 1 to Fig. 5. Fig. 1 shows a perspective structure of the deposition mask as seen from a viewpoint corresponding to the rear surface of a main body portion of a mask frame of the deposition mask.

[0028] 1, the deposition mask 10 includes a mask frame 11 and a plurality of mask portions 12. The mask frame 11 has a plurality of frame holes 11H. Each mask portion 12 is joined to the mask frame 11 so as to cover a different one of the frame holes 11H.

[0029] The mask frame 11 has, for example, a rectangular outer shape. The mask frame 11 has a front surface 11F and a back surface 11R opposite to the front surface 11F. When the deposition mask 10 is mounted in a deposition apparatus, the back surface 11R of the mask frame 11 faces the deposition target S, and the front surface 11F of the mask frame 11 faces the deposition source. When viewed from a viewpoint facing the back surface 11R of the mask frame 11, the outer shape of the mask frame 11 is larger than the deposition target S. Note that, although the outer shape of the mask frame 11 is larger than the deposition target S in the example shown in FIG. 1 , the outer shape of the mask frame 11 may be smaller than the deposition target S.

[0030] Each frame hole 11H has a rectangular shape when viewed from a perspective facing the back surface 11R. The multiple frame holes 11H are arranged in a rectangular lattice pattern at equal intervals in a first direction D1 and a second direction D2 perpendicular to the first direction D1. The frame holes 11H do not have to have a rectangular shape. For example, the frame holes 11H may have a square, circular, elliptical, or other shape. The multiple frame holes 11H may include frame holes 11H having a first shape and frame holes 11H having a second shape. The multiple frame holes 11H do not have to be arranged in a rectangular lattice pattern. For example, the multiple frame holes 11H may be arranged in a houndstooth pattern. The multiple frame holes 11H may also be arranged irregularly in at least one of the first direction D1 and the second direction D2.

[0031] The mask portions 12 have a shape and size that allows them to cover the frame holes 11H when viewed from a perspective facing the rear surface 11R of the mask frame 11. In this embodiment, the mask portions 12 have a rectangular shape. One mask portion 12 is attached to each frame hole 11H. Therefore, the deposition mask 10 has the same number of mask portions 12 as the number of frame holes 11H.

[0032] The mask frame 11 and the mask portion 12 are made of metal. The metal forming the mask frame 11 and the metal forming the mask portion 12 are preferably the same. This reduces the difference between the linear expansion coefficient of the deposition mask 10 and the linear expansion coefficient of the mask portion 12, and therefore reduces deformation of the mask portion 12 even if the deposition mask 10 is heated during use. As a result, reduction in the positional accuracy of the pattern formed using the deposition mask 10 is reduced.

[0033] The material for forming the mask portion 12 can be an iron-nickel alloy, which is an alloy mainly composed of iron and nickel. The material for forming the mask portion 12 is, for example, an alloy containing 30 mass% or more of nickel and the remainder being iron. Among iron-nickel alloys, invar, which is an alloy containing 36 mass% of nickel, is preferable. The material for forming the mask portion 12 may also be 42 alloy, which is an alloy containing 42 mass% of nickel. In addition to iron and nickel, the mask portion 12 may contain additives such as chromium, manganese, carbon, and cobalt.

[0034] When the material forming the mask portion 12 is an iron-nickel-cobalt alloy, the material is an alloy primarily composed of iron, nickel, and cobalt, and contains, for example, 30% by mass or more of nickel, 3% by mass or more of cobalt, and the remainder being iron. Among iron-nickel-cobalt alloys, an alloy containing 32% by mass of nickel and 4% to 5% by mass of cobalt, i.e., Super Invar, is preferred as the material for forming the mask portion 12. In Super Invar, the remainder of the 32% by mass of nickel and 4% to 5% by mass of cobalt may contain additives other than the main component iron. Examples of additives include chromium, manganese, and carbon. The amount of additives contained in the iron-nickel-cobalt alloy is at most 0.5% by mass.

[0035] The deposition target S is preferably a glass substrate. When the deposition target S is made of glass, the mask portion 12 is made of Invar, which prevents the difference between the linear expansion coefficient of the deposition target S and the linear expansion coefficient of the mask portion 12 from becoming too large. The deposition target S may be a laminate of a glass substrate and a resin layer. In this case, a pattern may be formed in the resin layer of the deposition target S. The deposition target S may also be a resin film. The material forming the resin layer and resin film is preferably, for example, polyimide resin.

[0036] 2 shows a cross-sectional structure of the deposition mask 10 along a plane perpendicular to the rear surface 11R of the mask frame 11. Of the cross-sectional structure of the deposition mask 10, FIG. 2 shows only the structure of a portion including one frame hole 11H and one mask portion 12.

[0037] 2, the mask frame 11 includes a main body 11A and multiple frame-shaped portions 11B. The main body 11A includes a front surface 11AF, a back surface 11AR opposite the front surface 11AF, and multiple first openings 11AH. The first openings 11AH penetrate between the front surface 11AF and the back surface 11AR. The main body 11A includes a step portion AH1 where the opening of the first openings 11AH on the back surface 11AR of the main body 11A is widened.

[0038] Each frame portion 11B has a frame shape that is fitted into the step portion AH1 so as to separate the openings of the front surface 11AF of the different first openings 11AH and the opposing second openings 11BH. Each frame portion 11B has a front surface 11BF and a back surface 11BR. The back surface 11BR of the frame portion 11B is an example of an exposed surface that is exposed on the side opposite to the step portion AH1. Each frame portion 11B is configured to be detachable from the step portion AH1 of the main body portion 11A.

[0039] Each mask portion 12 has a plurality of mask holes 12H. Each mask portion 12 is joined to the rear surface 11BR of the frame portion 11B so as to cover the second opening portion 11BH of one of the frame portions 11B that are different from each other.

[0040] When replacing the mask portion 12 included in the deposition mask 10 with a new mask portion 12, the mask portion 12 can be removed from the main body portion 11A together with the frame portion 11B, which can be removed from the main body portion 11A. As a result, a bonding mark formed on the frame portion 11B by bonding the mask portion 12 to the frame portion 11B is also removed from the main body portion 11A. Therefore, the deposition mask 10 can be obtained by fitting a new frame portion 11B into the main body portion 11A and bonding the new mask portion 12 to the new frame portion 11B. In this way, when re-bonding the mask portion 12 to the mask frame 11, no processing of the bonding mark on the mask frame 11 is required, which makes it easy to re-bond the mask portion 12 to the mask frame 11.

[0041] Because the frame-shaped portion 11B is located at the step portion AH1, it is possible to reduce the gap between the rear surface 11AR of the main body portion 11A and the mask portion 12, compared to when the main body portion 11A does not have the step portion AH1. Therefore, when the deposition mask 10 comes into contact with the deposition target, it is possible to reduce the difference in force acting on the portion of the deposition target that is in contact with the deposition mask 10 and the portion that is not in contact with the deposition mask 10.

[0042] In a plan view facing the back surface 11AR of the main body 11A, the frame portion 11B has a rectangular outer shape, and the frame portion 11B defines a rectangular region. The frame portion 11B has a back surface 11BR to which the mask portion 12 is bonded, and a front surface 11BF opposite the back surface 11BR. The back surface 11BR is a surface located on the opposite side of the front surface 11BF from the front surface 11AF of the main body 11A.

[0043] In a cross section perpendicular to the rear surface 11AR of the main body 11A, the second opening 11BH of the frame-shaped portion 11B has a trapezoidal shape. On the other hand, in a cross section perpendicular to the rear surface 11AR of the main body 11A, each first opening 11AH of the main body 11A has a shape in which a portion that opens to the front surface 11AF and has a trapezoidal shape is connected to a portion that opens to the rear surface 11AR and has a rectangular shape. When the frame-shaped portion 11B is fitted into the step portion AH1 of the main body 11A, one frame opening 11H is formed by the first opening 11AH of the main body 11A and the second opening 11BH of the frame-shaped portion 11B. In a cross section perpendicular to the rear surface 11AR of the main body 11A, the frame opening 11H has a trapezoidal shape.

[0044] In a cross section perpendicular to the rear surface 11AR of the main body 11A, the frame hole 11H may have a shape other than a trapezoidal shape. For example, the frame hole 11H may have a semicircular arc shape tapering from the front surface 11AF to the rear surface 11AR, or may have a rectangular shape.

[0045] The frame hole 11H is a passage for the vaporized or sublimated deposition material from the deposition source. The frame hole 11H has a trapezoidal shape, in other words, a shape tapering from the front surface 11AF to the back surface 11AR of the main body 11A, which makes it possible to suppress the shadow effect caused by the mask frame 11.

[0046] In a cross section perpendicular to the back surface 11AR of the main body portion 11A, the frame-shaped portion 11B has a thickness TB that is equal to or greater than the depth D of the step portion AH1 of the main body portion 11A. In this embodiment, the depth D of the step portion AH1 of the main body portion 11A is equal to the thickness TB of the frame-shaped portion 11B. When the frame-shaped portion 11B is fitted into the step portion AH1 of the main body portion 11A, the back surface 11BR of the frame-shaped portion 11B is flush with the back surface 11AR of the main body portion 11A. This prevents the back surface 11AR of the main body portion 11A from protruding beyond the back surface 11BR of the frame-shaped portion 11B, thereby preventing a gap from being formed between the mask portion 12 and the deposition target S.

[0047] Note that, when the thickness TB of the frame-shaped portion 11B is larger than the depth D of the step portion AH1, the back surface 11BR of the frame-shaped portion 11B protrudes from the back surface 11AR of the main body portion 11A. Therefore, similar to the case where the back surface 11BR of the frame-shaped portion 11B and the back surface 11AR of the main body portion 11A are flush with each other, the back surface 11AR of the main body portion 11A is prevented from protruding from the back surface 11BR of the frame-shaped portion 11B, thereby preventing a gap from being formed between the mask portion 12 and the deposition target S.

[0048] In a cross section perpendicular to the rear surface 11AR of the main body 11A, the thickness TB of the frame-shaped portion 11B is thinner than the thickness TA of the main body 11A. The thickness TA of the main body 11A may be, for example, 5 mm or more and 50 mm or less. The thickness TB of the frame-shaped portion 11B may be, for example, 100 μm or more and 10 mm or less.

[0049] The above-mentioned front surface 11F of the mask frame 11 is the front surface 11AF of the main body portion 11A. On the other hand, the back surface 11R of the mask frame 11 is formed by the back surface 11AR of the main body portion 11A and the back surfaces 11BR of the frame-shaped portions 11B.

[0050] In a cross section perpendicular to the back surface 11AR of the main body 11A, the side surface of the frame-shaped portion 11B connecting the front surface 11BF and the back surface 11BR may have a curvature such that the center of curvature is located within the frame-shaped portion 11B or on the mask portion 12 side of the frame-shaped portion 11B in the thickness direction of the frame-shaped portion 11B. Also, when viewed from a viewpoint facing the back surface 11AR of the main body 11A, the corner of the opening of the back surface 11BR at the second opening 11BH may have a curvature such that the center of curvature is located within the opening. Also, when viewed from a viewpoint facing the back surface 11AR of the main body 11A, the corner of the outer edge of the frame-shaped portion 11B may have a curvature such that the center of curvature is located within the frame-shaped portion 11B.

[0051] Furthermore, when viewed from a viewpoint facing the rear surface 11AR of the main body 11A, a corner of the inner edge of the step portion AH1 may have a curvature such that the center of curvature is located within the area surrounded by the inner edge of the step portion AH1. Furthermore, when viewed from a viewpoint facing the front surface 11AF of the main body 11A, a corner of the opening of the front surface 11AF of the first opening 11AH may have a curvature such that the radius of curvature is located within the opening.

[0052] By having each corner have a curvature, damage caused by frame-shaped portion 11B coming into contact with the corners of main body portion 11A and damage caused by main body portion 11A coming into contact with the corners of frame-shaped portion 11B when fitting frame-shaped portion 11B into main body portion 11A is reduced compared to when each corner does not have a curvature.

[0053] The mask frame 11 may include a fixing portion that fixes the frame portion 11B to the main body portion 11A. Figure 3 shows an example of the fixing portion. The fixing portion fixes the frame portion 11B to the main body portion 11A so that the frame portion 11B can be removed from the main body portion 11A.

[0054] If frame-shaped portion 11B is a frame member made of a magnetic metal, main body portion 11A can be provided with a fixing portion that fixes frame-shaped portion 11B to main body portion 11A by magnetic attraction so that frame-shaped portion 11B can be removed from main body portion 11A. Since frame-shaped portion 11B is thereby magnetically attracted to main body portion 11A, the accuracy of the position of frame-shaped portion 11B relative to main body portion 11A is less likely to decrease compared to when frame-shaped portion 11B is fixed to main body portion 11A using a fastening member such as a screw.

[0055] For example, as shown in FIG. 3, the main body 11A can include a magnet 11AM therein. The magnet 11AM is, for example, a permanent magnet. The magnet 11AM can have a first state and a second state. In the first state, the magnet 11AM is positioned along the surface defining the step portion AH1, whereby the magnet 11AM fixes the frame-shaped portion 11B to the main body 11A by magnetic attraction. On the other hand, in the second state, the magnet 11AM is further away from the surface defining the step portion AH1 than in the first state. When the magnet 11AM has the second state, the magnet 11AM releases the fixation of the frame-shaped portion 11B to the main body 11A.

[0056] Therefore, when the magnet 11AM is in the first state, it is possible to fix the frame-shaped portion 11B to the main body portion 11A. Then, by changing the state of the magnet 11AM from the first state to the second state, it is possible to detach the frame-shaped portion 11B fixed to the main body portion 11A from the main body portion 11A.

[0057] Fig. 4 shows a schematic planar structure of the mask portion 12 joined to the frame portion 11B. Fig. 5 shows the structure of the mask portion 12 along a cross section perpendicular to the plane in which the mask portion 12 extends.

[0058] 4, the mask portion 12 includes a mask region 12A in which a plurality of mask holes 12H are formed, and a peripheral region 12B that does not have any mask holes 12H. The peripheral region 12B surrounds the mask region 12A. A portion of the peripheral region 12B is joined to the frame portion 11B.

[0059] 4, the mask portion 12 includes only one mask region 12A. The mask portion 12 may include multiple mask regions 12A. When the mask portion 12 includes multiple mask regions 12A, the adjacent mask regions 12A are separated from each other by peripheral regions 12B. All of the multiple mask portions 12 included in the deposition mask 10 may have the same number of mask regions 12A. Alternatively, the multiple mask portions 12 may include a mask portion 12 including a first number of mask regions 12A and a mask portion 12 including a second number of mask regions 12A.

[0060] 5, the mask part 12 has a front surface 12F and a back surface 12R opposite to the front surface 12F. The front surface 12F is exposed to an area defined by the frame holes 11H of the mask frame 11, and is a surface that faces a deposition source in a deposition device. The back surface 12R is a surface that comes into contact with a deposition target S in a deposition device.

[0061] The mask section 12 may be formed from a single metal plate or from multiple metal plates. When the mask section 12 is formed from multiple metal plates, the multiple metal plates are stacked in the thickness direction of the mask section 12. The hole side surfaces defining the mask holes 12H have a semicircular arc shape tapering from the front surface 12F to the back surface 12R in a cross section along the thickness direction of the mask section 12. Each mask hole 12H is spaced apart from adjacent mask holes 12H. Note that each mask hole 12H may be connected to adjacent mask holes 12H.

[0062] The front surface 12F is a surface that is bonded to the frame portion 11B of the mask frame 11. The front surface 12F includes a front surface opening H1, which is an opening of the mask hole 12H. The back surface 12R includes a back surface opening H2, which is an opening of the mask hole 12H. The size of the front surface opening H1 is larger than the back surface opening H2 when viewed from a viewpoint opposite the front surface 12F. Each mask hole 12H is a passage through which deposition particles vaporized or sublimated from the deposition source pass. The deposition particles vaporized or sublimated from the deposition source travel through the mask hole 12H from the front surface opening H1 to the back surface opening H2. In the mask hole 12H, the front surface opening H1 is larger than the back surface opening H2. This reduces the area shaded by the deposition mask 10 when the deposition target is viewed from the deposition particles flying toward the mask portion 12. In other words, it is possible to suppress the shadow effect.

[0063] The thickness of the mask portion 12 is, for example, 1 μm or more and 15 μm or less. Such a thin mask portion 12 can suppress the shadow effect on the vapor deposition particles entering through the surface opening H1.

[0064] [Method of manufacturing deposition masks] A method for manufacturing the deposition mask 10 will be described with reference to FIGS. The manufacturing method of the deposition mask 10 includes joining a mask portion 12 to a frame portion 11B having second openings 11BH penetrating between the front surface 11BF and the back surface 11BR, and attaching the frame portion 11B having the second openings 11BH to a main body portion 11A having first openings 11AH penetrating between the front surface 11AF and the back surface 11AR. Joining the mask portion 12 includes joining the mask portion 12 to the back surface 11BR of the frame portion 11B so as to cover the second openings 11BH. Attaching the frame portion 11B includes attaching the frame portion 11B to the back surface 11AR side of the main body portion 11A relative to the front surface 11AF of the main body portion 11A such that the openings of the second openings 11BH on the front surface 11BF face the openings of the first openings 11AH on the front surface 11AF, and such that the frame portion 11B can be removed from the main body portion 11A. The manufacturing method of the deposition mask 10 will be described in more detail below with reference to the drawings.

[0065] 6 to 11 show processes from preparing a base material for forming the mask portion 12 to forming the mask portion 12. Also, Fig. 12 to 15 show processes from joining the mask portion 12 to the mask frame 11 to removing the support from the mask portion 12. For convenience of illustration, Fig. 12 to 15 show a structure in which the mask frame 11 has only one frame hole 11H and the deposition mask 10 has one mask portion 12.

[0066] 6 to 11, in the method for manufacturing the deposition mask 10, first, a base material 20 for forming the mask portion 12 is prepared (see FIG. 6). The base material 20 of the mask portion 12 includes a metal plate 21 for forming the mask portion 12 and a support body 22 for supporting the metal plate 21. The support body 22 is formed of a resin layer 22a and a glass substrate 22b. In the base material 20, the resin layer 22a is sandwiched between the metal plate 21 and the glass substrate 22b.

[0067] As described above, the metal plate 21 may be made of an iron-nickel alloy. The glass substrate 22b may be made of any one selected from the group consisting of alkali-free glass, quartz glass, crystallized glass, borosilicate glass, high silicate glass, porous glass, and soda-lime glass.

[0068] Next, the metal plate 21 is etched from the surface 21F to reduce the thickness of the metal plate 21. For example, it is possible to reduce the thickness of the metal plate 21 to half or less of the thickness of the metal plate 21 before etching (see FIG. 7). Then, a resist layer PR is formed on the surface 21F of the metal plate 21 (see FIG. 8). The resist layer PR is exposed and developed, so that a resist mask RM is formed on the surface 21F (see FIG. 9).

[0069] Next, the metal plate 21 is wet-etched from the front surface 21F using the resist mask RM. As a result, a plurality of mask holes 12H are formed in the metal plate 21 (see FIG. 10). In the wet etching of the metal plate 21, a front surface opening H1 is formed in the front surface 21F, and then a back surface opening H2 smaller than the front surface opening H1 is formed in the back surface 21R. Next, the resist mask RM is removed from the front surface 21F to produce the mask portion 12 (see FIG. 11). Note that the front surface 21F of the metal plate 21 corresponds to the front surface 12F of the mask portion 12, and the back surface 21R of the metal plate 21 corresponds to the back surface 12R of the mask portion 12.

[0070] The process of preparing the substrate 20 (see FIG. 6 ) includes a process of sandwiching a resin layer 22a between a metal plate 21 and a glass substrate 22b and bonding the metal plate 21 and the glass substrate 22b via the resin layer 22a. When bonding the metal plate 21, the resin layer 22a, and the glass substrate 22b, first, a CB (Chemical Bonding) process is performed on at least the surfaces of the metal plate 21 and the glass substrate 22b that are in contact with the resin layer 22a. The surfaces of the metal plate 21 and the glass substrate 22b that are subjected to the CB process are the target surfaces. In the CB process, for example, a chemical solution is applied to the target surface, thereby providing functional groups or the like that are reactive with the resin layer 22a to the target surface. In the CB process, for example, a Si-based compound or the like is provided to the target surface.

[0071] Then, after the metal plate 21, resin layer 22a, and glass substrate 22b are stacked in the order described above, they are thermocompression bonded together. At this time, the target surface of the metal plate 21 and the target surface of the glass substrate 22b are brought into contact with the resin layer 22a. As a result, the functional groups attached to the target surface react with the functional groups located on the surface of the resin layer 22a, thereby bonding the metal plate 21 and the resin layer 22a together, and bonding the glass substrate 22b and the resin layer 22a together.

[0072] The resin layer 22a is preferably made of polyimide. In this case, the linear expansion coefficients of the metal plate 21, the resin layer 22a, and the glass substrate 22b are approximately the same. Therefore, even if a laminate formed of the metal plate 21, the resin layer 22a, and the glass substrate 22b is heated in the process of manufacturing the deposition mask 10, warping of the laminate caused by differences in the linear expansion coefficients between the layers forming the laminate is suppressed.

[0073] The metal plate 21 is manufactured by electrolysis or rolling. The metal plate 21 obtained by these methods is post-treated by polishing, annealing, or the like, as appropriate. When electrolysis is used to manufacture the metal plate 21, the metal plate 21 is formed on the surface of an electrode used for electrolysis. The metal plate 21 is then released from the surface of the electrode. In this manner, the metal plate 21 is manufactured. In the above-mentioned bonding step, it is preferable to bond the metal plate 21 having a thickness of 10 μm or more to the glass substrate 22b via the resin layer 22a. When the metal plate 21 is manufactured by rolling, it is preferable that the thickness of the metal plate 21 be 15 μm or more. When the metal plate 21 is manufactured by electrolysis, it is preferable that the thickness of the metal plate 21 be 10 μm or more.

[0074] Wet etching can be used in the thinning process (see FIG. 7 ) for reducing the thickness of the metal plate 21 before forming the resist mask RM on the metal plate 21. As described above, in the thinning process, the thickness of the metal plate 21 after thinning can be reduced to half or less of the thickness of the metal plate 21 before thinning. Therefore, the thickness of the metal plate 21 can be made twice or more the thickness of the mask portion 12. As a result, even if the thickness required for the mask portion 12 is 15 μm or less as described above, a metal plate 21 having higher rigidity than the mask portion 12 of the deposition mask 10 can be used before bonding the metal plate 21 to the glass substrate 22b. Therefore, bonding the metal plate 21 to the glass substrate 22b is easier than bonding a metal plate 21 having the same thickness as the mask portion 12 to the glass substrate 22b. The step of reducing the thickness of the metal plate 21 can be omitted.

[0075] An acidic etching solution can be used as the etching solution for thinning the metal plate 21 by wet etching. When the metal plate 21 is made of invar, any etching solution capable of etching invar can be used. The acidic etching solution can be, for example, a solution obtained by mixing either a ferric perchlorate solution or a mixture of a ferric perchlorate solution and a ferric chloride solution with either perchloric acid, hydrochloric acid, sulfuric acid, formic acid, or acetic acid. The surface 21F can be etched by any of a dip method, a spray method, and a spin method.

[0076] In the etching step (see FIG. 10) for forming the plurality of mask holes 12H in the metal plate 21, an acidic etching solution can be used as the etching solution. When the metal plate 21 is made of invar, any of the etching solutions that can be used in the thinning step described above can be used as the etching solution. Any of the etching methods that can be used in the thinning step can also be used for forming the mask holes 12H.

[0077] The step of preparing the base material 20 may include a step of thinning the metal plate 21 from one surface of the metal plate 21 before bonding the metal plate 21, the resin layer 22a, and the glass substrate 22b to one another. In this case, the thinning step included in the step of preparing the base material 20 is a first thinning step, and the thinning step performed after the step of preparing the base material 20 is a second thinning step.

[0078] In the first thinning step, the metal plate 21 is thinned by etching from a first surface. In contrast, in the second thinning step, the metal plate 21 is thinned by etching from a second surface different from the first surface. The surface obtained after etching the first surface is the surface of the metal plate 21 that is to be joined to the resin layer 22a and that is to be subjected to the CB treatment.

[0079] By etching both the first and second surfaces of the metal plate 21, it is possible to adjust the residual stress of the metal plate 21 from both the first and second surfaces. This reduces the occurrence of imbalance in the residual stress of the metal plate 21 after etching, compared to when only one surface is etched. Therefore, when the mask portion 12 obtained from the metal plate 21 is bonded to the mask frame 11, the occurrence of wrinkles in the mask portion 12 is reduced. In the metal plate 21, the surface obtained by etching the first surface corresponds to the back surface 12R of the mask plate, and the surface obtained by etching the second surface corresponds to the front surface 12F of the mask portion 12.

[0080] The etching amount when etching the metal plate 21 from the first surface is the first etching amount, and the etching amount when etching from the second surface is the second etching amount. The first etching amount and the second etching amount may be equal to or different from each other. When the first etching amount and the second etching amount are different from each other, the first etching amount may be greater than the second etching amount, or the second etching amount may be greater than the first etching amount. However, when the second etching amount is greater than the first etching amount, the etching amount is greater when the metal plate 21 is supported by the resin layer 22a and the glass substrate 22b. This makes the metal plate 21 easier to handle, and as a result, the metal plate 21 is easier to etch.

[0081] As shown in FIGS. 12 to 15, a part of the mask frame 11 and a part of the mask portion 12 are joined together (see FIG. 12). At this time, a plurality of mask portions 12 are joined to the single mask frame 11 so that each mask portion 12 covers a different frame hole 11H. Then, the glass substrate 22b is removed from the resin layer 22a (see FIG. 14). Next, the resin layer 22a is removed from each mask portion 12 (see FIG. 15). In this way, the deposition mask 10 described above is obtained.

[0082] As shown in FIG. 12, in the step of joining a portion of the mask frame 11 and a portion of the mask portion 12, the mask frame 11 is first prepared. At this time, the mask frame 11 is formed by fitting the frame portion 11B into the step portion AH1 of the main body portion 11A. The mask frame 11 may be made of Invar, or may be made of a metal other than Invar. The metal other than Invar may be, for example, stainless steel. The metal for forming the main body portion 11A and the metal for forming the frame portion 11B may be the same or different.

[0083] In the step of joining the mask portion 12 to the frame portion 11B of the mask frame 11 (see FIG. 12 ), laser welding can be used as a joining method. The first laser beam L1 is irradiated onto the portion of the mask portion 12 included in the peripheral region 12B through the glass substrate 22b and the resin layer 22a. Therefore, the glass substrate 22b and the resin layer 22a must be transparent to the first laser beam L1. In other words, the first laser beam L1 must have a wavelength that can transmit through the glass substrate 22b and the resin layer 22a. The first laser beam L1 is intermittently irradiated along the edge of the second opening 11BH to form an intermittent joint. On the other hand, the first laser beam L1 is continuously irradiated along the edge of the second opening 11BH to form a continuous joint. This welds the mask portion 12 to the frame portion 11B of the mask frame 11. The wavelength of the first laser beam L1 is preferably 355 nm.

[0084] Fig. 13 shows an enlarged view of region A shown in Fig. 12. Region A includes a bonding mark formed by welding the mask portion 12 to the frame-shaped portion 11B, and Fig. 13 shows the bonding mark schematically.

[0085] As shown in FIG. 13 , each frame-shaped portion 11B has a weld mark 11BW formed by welding the mask portion 12 to the frame-shaped portion 11B. When the mask portion 12 is laser-welded to the frame-shaped portion 11B, a first laser beam L1 is irradiated onto the mask portion 12 and the frame-shaped portion 11B. By irradiating the mask portion 12 with the first laser beam L1, the portion of the mask portion 12 irradiated with the first laser beam L1 deforms so as to bite into the frame-shaped portion 11B in a direction from the back surface 11BR toward the front surface 11BF of the frame-shaped portion 11B. As a result, a depression is formed in the frame-shaped portion 11B by the amount of the portion of the mask portion 12 that has bitten into it. In other words, the weld mark 11BW of the frame-shaped portion 11B is a depression formed on the back surface 11BR.

[0086] The process of removing the support 22 includes a first process (see FIG. 14) and a second process (see FIG. 15). In the first process, a second laser beam L2 is irradiated onto the interface between the resin layer 22a and the glass substrate 22b. The second laser beam L2 has a wavelength that is transmitted by the glass substrate 22b and absorbed by the resin layer 22a. This removes the glass substrate 22b from the resin layer 22a. The wavelength of the second laser beam L2 is preferably 308 nm or 355 nm.

[0087] In the first step, the interface between the resin layer 22a and the glass substrate 22b is irradiated with the second laser beam L2, causing the resin layer 22a to absorb the thermal energy of the second laser beam L2. This heats the resin layer 22a, thereby reducing the strength of the chemical bond between the resin layer 22a and the glass substrate 22b. Then, the glass substrate 22b is removed from the resin layer 22a. In the first step, it is preferable to irradiate the entire bonded portion with the second laser beam L2. However, if it is possible to reduce the strength of the bond between the glass substrate 22b and the resin layer 22a over the entire bonded portion, the second laser beam L2 may be irradiated only to a portion of the bonded portion.

[0088] It is preferable that the transmittance of the glass substrate 22b is higher than the transmittance of the resin layer 22a at the wavelength of the second laser beam L2, thereby increasing the efficiency of heating the portion of the resin layer 22a that forms the interface between the glass substrate 22b and the resin layer 22a, compared to when the transmittance of the glass substrate 22b is lower than the transmittance of the resin layer 22a.

[0089] As described above, the resin layer 22a is preferably made of polyimide. Of polyimides, the resin layer 22a is preferably made of colored polyimide. The glass substrate 22b is preferably transparent.

[0090] In the second step, after the first step, the resin layer 22a is removed from the mask portion 12 by dissolving the resin layer 22a using a chemical liquid LM. The chemical liquid LM can be a liquid that can dissolve the material that forms the resin layer 22a and that does not have reactivity with the material that forms the mask portion 12. For example, an alkaline solution can be used as the chemical liquid LM. The alkaline solution can be, for example, a sodium hydroxide aqueous solution. Note that while FIG. 15 illustrates a dipping method as an example of a method for contacting the resin layer 22a with the chemical liquid LM, a spray method or a spin method can also be used to contact the resin layer 22a with the chemical liquid LM.

[0091] Thus, in the process of removing the support 22 from the mask portion 12, the glass substrate 22b is removed from the resin layer 22a in a first process, and the resin layer 22a is removed from the mask portion 12 in a second process. Therefore, it is possible to reduce the external force acting on the mask portion 12 compared to when the support 22 is removed from the mask portion 12 by interfacial destruction due to an external force applied to the laminate of the glass substrate 22b, the resin layer 22a, and the mask portion 12. This suppresses deformation of the mask portion 12 caused by removal of the support 22, and therefore deformation of the mask holes 12H in the mask portion 12.

[0092] As described above, the mask portion 12 may be joined to the frame portion 11B after the frame portion 11B is fitted into the step portion AH1 of the main body portion 11A, or the mask portion 12 may be joined to the frame portion 11B before the frame portion 11B is fitted into the step portion AH1 of the main body portion 11A.

[0093] [Evaporation mask function] The operation of the deposition mask 10 in which the mask portion 12 is welded to the frame portion 11B will be described with reference to Fig. 16. Fig. 16 shows a process in which the mask portion 12 is removed from the main body portion 11A of the mask frame 11 together with the frame portion 11B.

[0094] 16, when replacing the mask part 12 joined to the mask frame 11 with a new mask part 12, the mask part 12 is removed from the main body part 11A together with the frame part 11B. Therefore, the weld marks 11BW formed by welding the mask part 12 to the mask frame 11 are removed from the main body part 11A together with the frame part 11B.

[0095] The weld marks 11BW formed on the mask frame 11 by welding the mask part 12 are depressions formed on the surface of the mask frame 11 to which the mask part 12 is joined. Therefore, in order to remove the weld marks 11BW from the mask frame 11, processing to remove the weld marks 11BW from the mask frame 11 or processing to fill the weld marks 11BW is required. It is difficult to perform these processing steps while the mask parts 12 other than the mask part 12 that requires processing are joined to the mask frame 11. Therefore, when the mask part 12 is welded to the frame part 11B, the effect of joining the mask part 12 to the frame part 11B of the mask frame 11 can be more significantly obtained.

[0096] In addition, when removing the portion of the mask frame 11 including the weld mark 11BW from the mask frame 11 in order to remove the weld mark 11BW from the mask frame 11, the second opening 11BH defined by the frame-shaped portion 11B may be enlarged. This changes the size of the second opening 11BH defined by the frame-shaped portion 11B when viewed from a viewpoint opposite the surface 11BF of the frame-shaped portion 11B.

[0097] When joining a new mask portion 12 to the mask frame 11, the frame portion 11B may be fitted into the main body portion 11A, and then the mask portion 12 may be joined to the frame portion 11B. In this case, the glass substrate 22b and the resin layer 22a are removed from the mask portion 12 attached to the main body portion 11A together with the frame portion 11B. Therefore, when removing the resin layer 22a from the mask portion 12, it is necessary to fix the mask frame 11 so that, for example, only the mask portion 12 and the resin layer 22a come into contact with the chemical solution LM.

[0098] Alternatively, the mask portion 12 may be joined to the frame portion 11B, and then the frame portion 11B may be fitted into the main body portion 11A. In this case, the glass substrate 22b and the resin layer 22a are removed from the mask portion 12 joined to the frame portion 11B. Therefore, when removing the resin layer 22a from the mask portion 12, it is necessary to fix the frame portion 11B so that only the mask portion 12 and the resin layer 22a come into contact with the chemical solution LM, for example.

[0099] In either case, welding the mask portion 12 to the frame portion 11B forms a weld mark 11BW on the frame portion 11B. However, since the weld mark 11BW on the frame portion 11B is removed from the main body portion 11A together with the mask portion 12 to be replaced, it is easy to re-join the mask portion 12 to the mask frame 11. Furthermore, by re-joining the mask portion 12 to the mask frame 11 in this way, it is possible to reuse one mask frame 11.

[0100] [Display device manufacturing method] A method for manufacturing the display device will be described with reference to FIG. The manufacturing method of the display device includes forming a pattern on a deposition target S using the deposition mask 10 manufactured by the manufacturing method of the deposition mask 10. Hereinafter, a process of forming a pattern will be described along with an example of a deposition apparatus.

[0101] As shown in FIG. 17 , the vapor deposition device 30 includes a storage tank 31 that stores the vapor deposition mask 10 and the vapor deposition target S. The storage tank 31 is configured to hold the vapor deposition target S and the vapor deposition mask 10 at predetermined positions within the storage tank 31. A holding unit 32 that holds the vapor deposition material Mvd and a heating unit 33 that heats the vapor deposition material Mvd are located within the storage tank 31. The vapor deposition material Mvd held by the holding unit 32 is, for example, an organic light-emitting material. The vapor deposition target S and the vapor deposition mask 10 are positioned within the storage tank 31 such that the vapor deposition mask 10 is located between the vapor deposition target S and the holding unit 32 and the vapor deposition mask 10 faces the holding unit 32. The vapor deposition mask 10 is placed within the storage tank 31 with the back surface 12R of the mask unit 12 in close contact with the vapor deposition target S.

[0102] In the pattern forming step, the deposition material Mvd is heated by the heating unit 33, whereby the deposition material Mvd is vaporized or sublimated. The vaporized or sublimated deposition material Mvd passes through the mask holes 12H of the mask unit 12 of the deposition mask 10 and adheres to the deposition target S. As a result, an organic layer having a shape corresponding to the shape and position of the mask holes 12H of the deposition mask 10 is formed at a predetermined position on the deposition target S. The deposition material Mvd may be a metal material for forming pixel electrodes included in pixel circuits of the display layer.

[0103] As described above, according to the first embodiment of the deposition mask, the method for manufacturing a deposition mask, and the method for manufacturing a display device, the following effects can be obtained. (1-1) When re-joining the mask part 12 to the mask frame 11, there is no need to process the joining marks on the mask frame 11, so that the re-joining of the mask part 12 to the mask frame 11 can be facilitated.

[0104] (1-2) Since the back surface 11BR of the frame-shaped portion 11B is flush with the back surface 11AR of the main body portion 11A, the back surface 11AR of the main body portion 11A is prevented from protruding relative to the back surface 11BR of the frame-shaped portion 11B, thereby preventing a gap from being formed between the mask portion 12 and the deposition target S.

[0105] (1-3) Since the frame-shaped portion 11B is magnetically attracted to the main body portion 11A, the accuracy of the position of the frame-shaped portion 11B relative to the main body portion 11A is less likely to decrease compared to when the frame-shaped portion 11B is fixed to the main body portion 11A using a fastening member such as a screw.

[0106] (1-4) When the mask portion is welded to the frame portion 11B, the effect of facilitating reconnection of the mask portion can be more significantly obtained by joining the mask portion to the frame portion 11B provided on the mask frame 11.

[0107] (1-5) Since the frame-shaped portion 11B is located at the step portion AH1, the gap between the rear surface 11AR of the main body portion 11A and the mask portion 12 can be reduced, thereby reducing the difference in force acting on the portion of the deposition target that is in contact with the deposition mask 10 and the portion that is not in contact with the deposition mask 10.

[0108] [Modification of the first embodiment] The above-described first embodiment can be modified and implemented as follows. [Fixed part] The fixing portion does not have to include a permanent magnet, and may include, for example, an electromagnet. Alternatively, the fixing portion may fix the frame portion 11B to the main body portion 11A by, for example, electrostatic force or vacuum suction, rather than magnetic attraction. Alternatively, the fixing portion may fix the frame portion 11B to the main body portion 11A by a fastening member. Alternatively, the fixing portion may be a bonding material containing indium.

[0109] The main body 11A does not have to have a fixing portion. Even in this case, the effect equivalent to that of (1-1) above can be obtained by joining the mask portion 12 to the frame portion 11B that is fitted into the step portion AH1 of the main body 11A.

[0110] [Frame-shaped part] In a cross section perpendicular to the rear surface 11AR of the main body 11A, the thickness TB of the frame portion 11B may be smaller than the depth D of the step portion AH1 of the main body 11A. Even in this case, the effect equivalent to that of (1-1) above can be obtained by joining the mask portion 12 to the frame portion 11B fitted into the step portion AH1 of the main body 11A.

[0111] In this case, it is preferable that the back surface 12R of the mask portion 12 protrudes from the back surface 11AR of the main body portion 11A in a cross section perpendicular to the back surface 11AR of the main body portion 11A. This prevents a gap from being formed between the mask portion 12 and the deposition target S, thereby improving the accuracy of the shape of the pattern formed on the deposition target S.

[0112] [Main body] The main body 11A may have only one first opening 11AH. In this case, the deposition mask 10 may have one frame portion 11B and one mask portion 12. Even in this case, the mask portion 12 is joined to the frame portion 11B fitted into the step portion AH1 of the main body 11A, thereby achieving the effect equivalent to (1-1) described above.

[0113] The main body 11A may not have the step AH1. In this case, the frame 11B may be located on the flat rear surface 11AR of the main body 11A. Even in this case, the mask frame 11 includes the main body 11A and the frame 11B, and therefore the same effect as in (1-1) above can be obtained.

[0114] Join The joining of the mask portion 12 to the frame portion 11B is not limited to laser welding, and may be performed by, for example, resistance welding, ultrasonic welding, etc. In any of these cases, the effect equivalent to that of (1-1) above can be obtained by joining the mask portion 12 to the frame portion 11B that is fitted into the step portion AH1 of the main body portion 11A.

[0115] The mask portion 12 may be joined to the frame portion 11B by adhesive rather than welding. In this case, an adhesive layer is formed as a joining mark where the mask portion 12 is joined to the frame portion 11B. By adhering the mask portion 12 to the frame portion 11B and fitting the frame portion 11B into the main body portion 11A, the frame portion 11B with the adhesive layer as a joining mark formed thereon can be replaced with a new frame portion 11B, thereby removing the adhesive layer from the main body portion 11A.

[0116] When adhesive is used to bond the frame-shaped portion 11B and the mask portion 12, it is preferable that the vapor deposition apparatus in which the vapor deposition mask 10 is mounted is equipped with a cooling unit that cools the vapor deposition mask 10. From the viewpoint of improving the strength and heat resistance of the bond between the frame-shaped portion 11B and the mask portion 12, it is preferable that the mask portion 12 be bonded to the frame-shaped portion 11B by welding.

[0117] [Second embodiment] 18 to 22, a deposition mask, a method for manufacturing a deposition mask, and a method for manufacturing a display device according to a second embodiment will be described. The second embodiment differs from the first embodiment in the structure for fixing the frame portion to the main body portion. Therefore, while these differences will be described in detail below, the same reference numerals as in the first embodiment will be used to designate the same structures in the second embodiment as in the first embodiment, and detailed descriptions of these structures will be omitted.

[0118] [Deposition mask] Fig. 18 shows the structure of the deposition mask as seen from a viewpoint opposite to the rear surface of the mask frame. Note that Fig. 18 shows only one first opening and the structure around the first opening in the deposition mask.

[0119] As shown in FIG. 18, the deposition mask 40 includes a mask frame 41 and a mask portion 12. Like the mask frame 11 of the first embodiment, the mask frame 41 includes a main body portion 41A and a frame-shaped portion 41B. The mask frame 41 also includes a fixing portion 41C. The fixing portion 41C fixes the frame-shaped portion 41B to the main body portion 41A. In the example shown in FIG. 18, the mask frame 41 includes three fixing portions 41C. Because the frame-shaped portion 41B is fixed to the main body portion 41A by the three fixing portions 41C, it is possible to determine the position of the frame-shaped portion 41B with high accuracy on the plane on which the mask portion 12 extends.

[0120] 18, the outer shape of frame-shaped portion 41B is rectangular. Fixing portions 41C are located at the end of one of a pair of opposing sides of frame-shaped portion 41B and at the center of the other side. The fixing portions are an example of a first position adjustment portion.

[0121] Fig. 19 shows a cross section taken along line XIX-XIX shown in Fig. 18. Line XIX-XIX is a line segment that passes through two fixing portions 41C. 19, the main body 41A has a first opening 41AH and a step portion AH1, similar to the main body 11A of the first embodiment. The first opening 41AH penetrates between the front surface 41AF and the back surface 41AR. In the main body 41A, the step portion AH1 is a recess located on the back surface 41AR, and surrounds the first opening 41AH in a plan view facing the back surface 41AR.

[0122] Similar to the frame-shaped portion 11B of the first embodiment, the frame-shaped portion 41B has a second opening 41BH. The second opening 41BH penetrates between the front surface 41BF and the back surface 41BR. When viewed from a perspective facing the front surface 41AF of the main body portion 41A, the second opening 41BH is located within the area defined by the first opening 41AH. The frame-shaped portion 41B further has fixing holes BH1. The frame-shaped portion 41B of this embodiment has the same number of fixing holes BH1 as the number of fixing portions 41C. Each fixing hole BH1 is configured to accommodate one fixing portion 41C. The fixing portions 41C fix the frame-shaped portion 41B to the main body portion 41A so that the frame-shaped portion 41B can be removed from the main body portion 41A.

[0123] The mask portion 12 is joined to the rear surface 41BR of the frame-shaped portion 41B. The mask portion 12 is joined to the frame-shaped portion 41B by any of the methods used to join the mask portion 12 to the frame-shaped portion 41B in the first embodiment and the modified example of the first embodiment.

[0124] FIG. 20 shows one fixing portion 41C of the mask frame 41 and the surrounding structure of the fixing portion 41C. As shown in FIG. 20, the fixing portion 41C has a threaded portion 41C1 and an adsorption portion 41C2. A groove (not shown) into which the threaded portion 41C1 screws is formed on the surface defining the fixing hole BH1. The outer peripheral surface of the threaded portion 41C1 has a shape that allows it to screw into the groove of the fixing hole BH1. The threaded portion 41C1 has a rod shape that extends in a direction from the back surface 41BR toward the front surface 41BF of the frame-shaped portion 41B. When the entire threaded portion 41C1 is located within the fixing hole BH1, the end of the threaded portion 41C1 that is closest to the back surface 41BR is the base end, and the end opposite the base end is the tip. The adsorption portion 41C2 is located at the tip of the threaded portion 41C1.

[0125] The attraction portion 41C2 is made of a magnet. The main body portion 41A is made of a ferromagnetic material. Alternatively, a portion of the main body portion 41A, including the area with which the attraction portion 41C2 contacts, is made of a ferromagnetic material. As a result, when the attraction portion 41C2 contacts the main body portion 41A, the attraction portion 41C2 is fixed to the main body portion 41A, and thereby the frame-shaped portion 41B is fixed to the main body portion 41A. Note that FIGS. 19 and 20 show a state in which the attraction portion 41C2 is separated from the main body portion 41A and the frame-shaped portion 41B is not fixed to the main body portion 41A.

[0126] [Fixing method] A method for fixing the frame-shaped portion 41B to the main body portion 41A will be described with reference to FIGS.

[0127] As shown in FIGS. 19 and 20, when the frame-shaped portion 41B is not fixed to the main body portion 41A, the fixing portion 41C is attached to the frame-shaped portion 41B so that the adhesive portion 41C2 does not contact the main body portion 41A. By rotating the fixing portion 41C along the first direction, the position of the fixing portion 41C relative to the frame-shaped portion 41B is changed so that the adhesive portion 41C2 approaches the surface 41BF of the frame-shaped portion 41B. By rotating the fixing portion 41C until the adhesive portion 41C2 is flush with the surface 41BF of the frame-shaped portion 41B, the adhesive portion 41C2 can be brought into contact with the main body portion 41A. This allows the magnetic force of the adhesive portion 41C2 to fix the frame-shaped portion 41B to the main body portion 41A.

[0128] As shown in FIG. 21, by further rotating the fixing portion 41C along the first direction, it is possible to make the tip of the threaded portion 41C1 protrude from the surface 41BF of the frame-shaped portion 41B.

[0129] As shown in FIG. 22, the distance between the surface 41BF of the frame portion 41B and the tip of the threaded portion 41C1 is the protrusion amount of the fixing portion 41C. The smaller the protrusion amount, the smaller the distance between the back surface 41BR of the frame portion 41B and the back surface 41AR of the main body portion 41A. In other words, the greater the protrusion amount, the greater the distance between the back surface 41BR of the frame portion 41B and the back surface 41AR of the main body portion 41A. In this way, the fixing portion 41C makes it possible to change the position of the frame portion 41B relative to the main body portion 41A between a first position and a second position in the thickness direction of the main body portion 41A. Therefore, the fixing portion 41C can prevent the position of the mask portion 12 from shifting due to thickness variations among the multiple frame portions 41B.

[0130] To remove the frame portion 41B from the main body 41A, the fixing portion 41C is rotated in the second direction. The second direction is opposite to the first direction. This allows the tip of the screw portion 41C1 to be positioned within the fixing hole BH1, thereby forming a gap between the suction portion 41C2 and the main body 41A. As a result, the frame portion 41B can be released from the main body 41A.

[0131] As described above, according to the deposition mask 40 of this embodiment, the frame-shaped portion 41B can be fixed to the main body portion 41A by the fixing portion 41C. Furthermore, the fixing portion 41C can change the distance between the rear surface 41BR of the frame-shaped portion 41B and the rear surface 41AR of the main body portion 41A. In other words, the fixing portion 41C can change the position of the frame-shaped portion 41B in the thickness direction of the mask portion 12.

[0132] As described above, according to the second embodiment of the deposition mask, the deposition mask manufacturing method, and the display device manufacturing method, in addition to the above-mentioned (1-1), (1-3), and (1-4), the following effects can be obtained.

[0133] (2-1) The frame-shaped portion 41B can be fixed to the main body portion 41A by the fixing portion 41C.

[0134] (2-2) The fixing portion 41C can change the position of the frame portion 41B in the thickness direction of the mask portion 12. Therefore, the fixing portion 41C can prevent the position of the mask portion 12 from shifting due to variations in thickness among the multiple frame portions 41B.

[0135] (2-3) By fixing the frame-shaped portion 41B to the main body portion 41A with the three fixing portions 41C, it is possible to determine the position of the frame-shaped portion 41B on the plane on which the mask portion 12 extends with high precision.

[0136] [Modification of the second embodiment] The second embodiment described above can be modified and implemented as follows. [Fixed part] The mask frame 41 may have four or more fixing portions 41C. For example, if the mask frame 41 has four fixing portions 41C, the fixing portions 41C may be located at the corners of the frame-shaped portion 51B.

[0137] The mask frame 41 may have only two fixing portions 41C. In this case, the fixing portions 41C may be located at corners of the frame-shaped portion 41B that are located on the same diagonal line.

[0138] [Third embodiment] 23 and 24, a deposition mask, a method for manufacturing a deposition mask, and a method for manufacturing a display device according to a third embodiment will be described. The third embodiment differs from the first embodiment in the structure for fixing the frame portion to the main body portion. Therefore, while these differences will be described in detail below, the same reference numerals as in the first embodiment will be used to designate the same structures in the third embodiment as in the first embodiment, and detailed descriptions of these structures will be omitted.

[0139] [Deposition mask] Fig. 23 shows the structure of the deposition mask as seen from a viewpoint opposite to the rear surface of the mask frame. Note that Fig. 23 shows only one first opening and the structure around the first opening in the deposition mask.

[0140] As shown in FIG. 23, the deposition mask 50 includes a mask frame 51 and a mask portion 12. The mask frame 51 includes a main body portion 51A and a frame-shaped portion 51B, similar to the mask frame 11 of the first embodiment. The main body portion 51A has a first opening 51AH. In the example shown in FIG. 23, the first opening 51AH has a rectangular outer shape. The main body portion 51A includes a plurality of support bases 51A1 that protrude into the first opening 51AH from the side surfaces that define the first opening 51AH. The support bases 51A1 protrude into the first opening 51AH from a position midway from the back surface 51AR to the front surface 51AF of the main body portion 51A.

[0141] In the example shown in FIG. 23, the main body 51A has multiple support bases 51A1 per first opening 51AH. In this example, the main body 51A has three support bases 51A1 per first opening 51AH. When viewed from a perspective facing the rear surface 51AR, the support bases 51A1 are located at two of the corners of the first opening 51AH that are adjacent to each other along the X axis. The remaining support bases 51A1 are located at the center of the side surfaces extending along the X axis that are opposite the side surfaces on which the two corners are located. When viewed from a perspective facing the rear surface 51AR, each support base 51A1 has a rectangular shape.

[0142] The main body 51A further includes a plurality of fixing pieces 51A2 protruding into the first opening 51AH from side surfaces defining the first opening 51AH. Each fixing piece 51A2 protrudes into the first opening 51AH from a portion of the main body 51A extending from the rear surface 51AR toward the front surface 51AF (see FIG. 24). In the example shown in FIG. 23, a pair of fixing pieces 51A2 protrudes into the first opening 51AH from each of the side surfaces that define the first opening 51AH and extend along the Y-axis. In addition, a pair of fixing pieces 51A2 protrudes into the first opening 51AH from the center of a side surface that defines the first opening 51AH and extends along the X-axis, where the support base 51A1 is not located.

[0143] The frame portion 51B is located on an XY plane defined by the X axis and the Y axis perpendicular to the X axis. The axis perpendicular to the XY plane is the Z axis. The frame portion 51B includes a frame main body 51B1 and multiple protruding pieces 51B2. The frame main body 51B1 has a rectangular frame shape. The frame portion 51B is located within the first opening 51AH. Each protruding piece 51B2 is located on the surface 51BF of the frame portion 51B (see FIG. 24). Each protruding piece 51B2 extends downward from the frame main body 51B1 toward the surface 51AF of the main body 51A. In the example shown in FIG. 23, the frame portion 51B includes three protruding pieces 51B2. When viewed from a perspective facing the back surface 51BR of the frame portion 51B, one protruding piece 51B2 is located between a pair of fixing pieces 51A2. In FIG. 23, the second opening defined by the frame-shaped portion 51B is covered with the mask portion 12.

[0144] FIG. 24 shows a cross section taken along line XXIV-XXIV shown in FIG. 24, the mask frame 51 further includes an X-axis adjustment screw 51C, a fixing screw 51E, and a Z-axis adjustment screw 51F. In the X-axis, the protruding piece 51B2 of the frame-shaped portion 51B is sandwiched between a pair of fixing pieces 51A2 and is also sandwiched between the X-axis adjustment screw 51C and the fixing screw 51E. The X-axis adjustment screw 51C attaches the protruding piece 51B2 to one of the pair of fixing pieces 51A2. The fixing screw 51E attaches the protruding piece 51B2 to the other of the pair of fixing pieces 51A2. The position of the frame-shaped portion 51B in the X-axis can be changed by changing the amount of tightening of the X-axis adjustment screw 51C relative to the protruding piece 51B2.

[0145] The mask frame 51 further includes two Y-axis adjustment screws 51D and two fixing screws 51E (see FIG. 23). The remaining protruding pieces 51B2 are sandwiched between a pair of fixing pieces 51A2 on the Y axis, and are also sandwiched between the Y-axis adjustment screws 51D and the fixing screws 51E. The Y-axis adjustment screws 51D attach the protruding pieces 51B2 to one of the pair of fixing pieces 51A2. The fixing screws 51E attach the protruding pieces 51B2 to the other of the pair of fixing pieces 51A2. The position of the frame portion 51B on the Y axis can be changed by changing the amount of tightening of the Y-axis adjustment screws 51D relative to the protruding pieces 51B2.

[0146] That is, in this embodiment, X-axis adjustment screw 51C, Y-axis adjustment screw 51D, and fixing screw 51E constitute an example of a second position adjustment unit. The second position adjustment unit can change the position of frame portion 51B relative to main body portion 51A between a third position and a fourth position in the plane in which frame portion 51B extends. Therefore, the second position adjustment unit can suppress misalignment of the positions of the second openings among multiple frame portions 51B.

[0147] The Z-axis adjustment screw 51F has a rod shape extending along the Z-axis. The Z-axis adjustment screw 51F is passed through a through-hole that penetrates the support base 51A1 along the Z-axis, thereby attaching the Z-axis adjustment screw 51F to the main body 51A. When the Z-axis adjustment screw 51F is in contact with the frame-shaped portion 51B, the end of the Z-axis adjustment screw 51F that is in contact with the frame-shaped portion 51B is the tip, and the end opposite to the tip is the base. An attraction portion (not shown) is located at the tip of the Z-axis adjustment screw 51F. The attraction portion is formed of a magnet. The frame main body 51B1 of the frame-shaped portion 51B is formed of a ferromagnetic material. Alternatively, a portion of the frame main body 51B1 that includes the area in contact with the Z-axis adjustment screw 51F is formed of a ferromagnetic material. As a result, when the Z-axis adjustment screw 51F comes into contact with the frame main body 51B1, the frame main body 51B1 is fixed to the Z-axis adjustment screw 51F. The position of the frame portion 51B on the Z axis can be changed by changing the amount that the tip of the Z-axis adjustment screw 51F protrudes from the support base 51A1. That is, in this embodiment, the Z-axis adjustment screw 51F is an example of a first position adjustment unit. The Z-axis adjustment screw 51F can suppress deviation in the position of the mask portion 12 caused by variations in thickness among the multiple frame portions 51B in the thickness direction of the main body 51A, i.e., along the Z axis.

[0148] [Fixing method] A method for fixing the frame portion 51B to the main body portion 51A will be described below. When fixing the frame portion 51B to the main body portion 51A, a holding base for holding the frame portion 51B can be used. The holding base can be located, for example, in an area of the first opening 51AH that is more inward than the support base 51A1 when viewed from a perspective facing the rear surface 51AR of the main body portion 51A. The holding base includes a placing portion and an elevating portion. The frame portion 51B is placed on the placing portion. The elevating portion is configured to be able to raise and lower the placing portion along the Z axis so as to change the position of the frame portion 51B relative to the main body portion 51A.

[0149] In the deposition mask 50 of this embodiment, when fixing the frame-shaped portion 51B to the main body portion 51A, first, the frame-shaped portion 51B is held on a holder, and the position of the frame-shaped portion 51B on the Z axis is determined using three Z-axis adjustment screws 51F. At this time, the amount by which each Z-axis adjustment screw 51F protrudes from the support base 51A1 is set to a predetermined size, and then the frame-shaped portion 51B is fixed to the Z-axis adjustment screws 51F. Then, each protruding piece 51B2 is fixed to the fixing piece 51A2 using the fixing screw 51E. Next, the protruding piece 51B2 of the frame-shaped portion 51B is fixed to the fixing piece 51A2 of the main body portion 51A using the X-axis adjustment screw 51C, and the position of the frame-shaped portion 51B on the X axis is determined. Furthermore, the protruding piece 51B2 is fixed to the fixing piece 51A2 using the Y-axis adjustment screw 51D, and the position of the frame-shaped portion 51B on the Y axis is determined. As a result, the frame-shaped portion 51B is fixed to the main body portion 51A at a predetermined position on the XY plane and on the Z axis.

[0150] It is possible to release the frame portion 51B from the main body portion 51A by removing the X-axis adjustment screw 51C, the Y-axis adjustment screw 51D, and the Z-axis adjustment screw 51F from the frame portion 51B.

[0151] As described above, the deposition mask, the method for manufacturing a deposition mask, and the method for manufacturing a display device can achieve the following effects in addition to the above-mentioned (1-1), (1-3), and (1-4).

[0152] (3-1) The position of frame portion 51B on the XY plane can be adjusted using X-axis adjustment screw 51C and Y-axis adjustment screw 51D, thereby preventing misalignment of the positions of the second openings between multiple frame portions 51B.

[0153] (3-2) The position of the frame portion 51B on the Z axis can be adjusted using the Z-axis adjustment screw 51F, which can prevent the position of the mask portion 12 from shifting due to variations in thickness between the multiple frame portions 51B.

[0154] [Modification of the third embodiment] The third embodiment described above can be modified and implemented as follows. [Support stand] The main body 51A may include four or more support bases 51A1. For example, if the main body 51A includes four support bases 51A1, each support base 51A1 may protrude from a corner of the first opening 51AH. Note that if the main body 51A includes four or more support bases 51A1, the mask frame 51 may include the same number of Z-axis adjustment screws 51F as the number of support bases 51A1.

[0155] The support base 51A1 of the main body 51A may have a shape that protrudes into the first opening 51AH around the entire periphery of the first opening 51AH. That is, the main body 51A may have a stepped portion where the opening of the back surface 51AR of the main body 51A at the first opening 51AH is widened.

[0156] [cover] The deposition mask 50 may include a cover that covers the support base 51A1, the fixing pieces 51A2, and the protruding pieces 51B2. When viewed from a viewpoint facing the surface 51AF of the main body 51A, the cover covers the support base 51A1, the fixing pieces 51A2, and the protruding pieces 51B2. When the deposition mask 50 is mounted in a deposition apparatus, the cover is positioned between the deposition source and the support base 51A1, the fixing pieces 51A2, and the protruding pieces 51B2. Therefore, the cover prevents the deposition material from adhering to the support base 51A1, the fixing pieces 51A2, and the protruding pieces 51B2. This also prevents the deposition material from adhering to the X-axis adjustment screw 51C, the Y-axis adjustment screw 51D, the fixing screw 51E, and the Z-axis adjustment screw 51F.

[0157] [Fourth embodiment] 25 and 26, a deposition mask, a method for manufacturing a deposition mask, and a method for manufacturing a display device according to a fourth embodiment will be described. The fourth embodiment differs from the first embodiment in the structure for fixing the frame portion to the main body portion. Therefore, while these differences will be described in detail below, structures in the fourth embodiment that are common to the first embodiment will be assigned the same reference numerals as in the first embodiment, and detailed descriptions of these structures will be omitted.

[0158] [Deposition mask] Fig. 25 shows the structure of the deposition mask as seen from a viewpoint opposite to the rear surface of the mask frame. Note that Fig. 25 shows only one first opening and the structure around the first opening in the deposition mask.

[0159] As shown in FIG. 25, the deposition mask 60 includes a mask frame 61 and a mask portion 12. The mask frame 61 includes a main body portion 61A and a frame-shaped portion 61B, similar to the mask frame 11 of the first embodiment. The frame-shaped portion 61B includes a frame main body 61B1 and a plurality of protruding pieces 61B2. The frame main body 61B1 has a rectangular frame shape and is configured to be able to support the mask portion 12. The frame main body 61B1 is located on an XY plane defined by an X axis and a Y axis perpendicular to the X axis. The axis perpendicular to the XY plane is the Z axis.

[0160] The protruding pieces 61B2 protrude outward from the edge of the frame main body 61B1. In the example shown in Fig. 25, the frame-shaped portion 61B has three protruding pieces 61B2. The frame-shaped portion 61B has protruding pieces 61B2 extending along the Y-axis from a side of the edge of the frame main body 61B1 that extends along the X-axis. The frame-shaped portion 61B has a protruding piece 61B2 extending along the X-axis from one side of the edge of the frame main body 61B1 that extends along the Y-axis, and a protruding piece 61B2 extending along the X-axis from the other side of the edge of the frame main body 61B1 that extends along the Y-axis.

[0161] The main body 61A includes a support portion 61A1 and a plurality of fixing pieces 61A2. The support portion 61A1 has a plurality of first openings 61AH. Each fixing piece 61A2 is supported by the support portion 61A1. The fixing pieces 61A2 are positioned around the first openings. One protruding piece 61B2 is fixed to each fixing piece 61A2. When viewed from a viewpoint facing the XY plane, with the frame-shaped portion 61B fixed to the main body 61A, each fixing piece 61A2 has a U-shape that surrounds the protruding piece 61B2 fixed to that fixing piece 61A2. The fixing of the protruding piece 61B2 to the fixing piece 61A2 allows the support portion 61A1 to support the frame main body 61B1.

[0162] The mask frame 61 further includes an X-axis adjustment screw 61C, a Y-axis adjustment screw 61D, and a fixing screw 61E. In the example shown in Fig. 25, the mask frame 61 includes one X-axis adjustment screw 61C, two Y-axis adjustment screws 61D, and three fixing screws 61E.

[0163] The X-axis adjustment screw 61C, together with one fixing screw 61E, fixes the protruding piece 61B2 extending along the Y-axis to the fixed piece 61A2 surrounding the protruding piece 61B2. The X-axis adjustment screw 61C and the fixing screw 61E sandwich the protruding piece 61B2 along the X-axis and fix the protruding piece 61B2 to the fixed piece 61A2. Both the X-axis adjustment screw 61C and the fixing screw 61E are shaped so that they can be screwed into the side surface that defines the through hole formed in the fixed piece 61A2. By changing the amount of tightening of the X-axis adjustment screw 61C, the position of the protruding piece 61B2 on the X-axis, and therefore the position of the frame-shaped portion 61B, can be changed.

[0164] Each Y-axis adjustment screw 61D, together with one fixing screw 61E, fixes a protruding piece 61B2 extending along the X-axis to the fixed piece 61A2 surrounding the protruding piece 61B2. The Y-axis adjustment screws 61D and the fixing screws 61E sandwich the protruding piece 61B2 on the Y-axis and fix the protruding piece 61B2 to the fixed piece 61A2. Both the Y-axis adjustment screws 61D and the fixing screws 61E are screws that can be threaded into the side surfaces that define the through-holes formed in the fixed piece 61A2. By changing the amount of tightening of the Y-axis adjustment screws 61D, the position of the protruding piece 61B2 on the Y-axis, and therefore the position of the frame-shaped portion 61B, can be changed.

[0165] That is, in this embodiment, the X-axis adjustment screw 61C, the Y-axis adjustment screw 61D, and the fixing screw 61E constitute an example of a second position adjustment section. The mask frame 61 further includes a plurality of Z-axis adjustment screws 61F. In the example shown in Fig. 25, three Z-axis adjustment screws 61F are provided. When viewed from a viewpoint facing the XY plane, one Z-axis adjustment screw 61F is located near a portion of the edge of the frame main body 61B1 where the fixing piece 61A2 extending along the Y-axis is located. The remaining Z-axis adjustment screws 61F are located at two of the corners of the frame main body 61B1 that are adjacent to each other in the X-axis direction, and which form a triangle together with the portion where the one Z-axis adjustment screw 61F is located.

[0166] FIG. 26 shows a cross section taken along line XXVI-XXVI shown in FIG. As shown in FIG. 26, each Z-axis adjustment screw 61F is attached to a through-hole formed in the support portion 61A1. Each Z-axis adjustment screw 61F includes a threaded portion 61F1 and an adhesive portion 61F2. The threaded portion 61F1 has a rod shape extending along the Z-axis. When the Z-axis adjustment screw 61F is attached to the support portion 61A1, the end of the threaded portion 61F1 that is closest to the frame-shaped portion 61B is the tip, and the end opposite the tip is the base. The adhesive portion 61F2 is located at the tip of the threaded portion 61F1.

[0167] The adsorption portion 61F2 is formed of a magnet. The frame main body 61B1 of the frame-shaped portion 61B is formed of a ferromagnetic material. Alternatively, a portion of the frame main body 61B1 including an area with which the adsorption portion 61F2 comes into contact is formed of a ferromagnetic material. This fixes the adsorption portion 61F2 to the frame main body 61B1 when the adsorption portion 61F2 comes into contact with the frame main body 61B1. By changing the amount that the Z-axis adjustment screw 61F protrudes from the support portion 61A1, it is possible to change the position of the frame-shaped portion 61B on the Z axis. That is, in this embodiment, the Z-axis adjustment screw 61F is an example of a first position adjustment portion.

[0168] [Fixing method] A method for fixing the frame portion 61B to the main body portion 61A will be described below. In the fourth embodiment, when fixing the frame portion 61B to the main body portion 61A, a holding base equivalent to the holding base described in the third embodiment can be used.

[0169] In the deposition mask 60 of this embodiment, when fixing the frame-shaped portion 61B to the main body 61A, first, with the frame-shaped portion 61B held on the holder, the amount by which the Z-axis adjustment screw 61F protrudes from the support portion 61A1 is adjusted, and the suction portion 61F2 located at the tip of the Z-axis adjustment screw 61F is attached to the frame-shaped portion 61B by suction. Thus, the position of the frame-shaped portion 61B on the Z axis is determined by the three Z-axis adjustment screws 61F. Then, each protruding piece 61B2 is fixed to the fixing piece 61A2 by the fixing screw 61E. Next, the position of the frame-shaped portion 61B on the XY plane is determined by one X-axis adjustment screw 61C and two Y-axis adjustment screws 61D. Thus, the frame-shaped portion 61B is fixed to the main body 61A at a predetermined position on the XY plane and the Z axis. It is possible to release the frame portion 61B from the main body portion 61A by removing the X-axis adjustment screw 61C, the Y-axis adjustment screw 61D, and the Z-axis adjustment screw 61F from the frame portion 61B.

[0170] As described above, according to the fourth embodiment of the deposition mask, the deposition mask manufacturing method, and the display device manufacturing method, in addition to the above-mentioned (1-1), (1-3), and (1-4), the following effects can be obtained.

[0171] (4-1) The position of frame portion 61B on the XY plane can be adjusted using X-axis adjustment screw 61C and Y-axis adjustment screw 61D, thereby making it possible to prevent misalignment of the second openings between multiple frame portions 61B.

[0172] (4-2) The position of the frame portion 61B on the Z axis can be adjusted using the Z-axis adjustment screw 61F, which can prevent the position of the mask portion 12 from shifting due to variations in thickness between the multiple frame portions 61B.

[0173] [Modification of the fourth embodiment] The fourth embodiment described above can be modified and implemented as follows. [Frame-shaped part] The frame-shaped portion 61B may include four or more protruding pieces 61B2. For example, if the frame-shaped portion 61B includes four protruding pieces 61B2, the frame-shaped portion 61B may include two protruding pieces 61B2 protruding from each of a pair of edges of the frame main body 61B1 extending along the X-axis. In this case, the main body 61A only needs to include the same number of fixing pieces 61A2 as the protruding pieces 61B2.

[0174] [Z-axis adjustment screw] The mask frame 61 may be provided with four or more Z-axis adjustment screws 61F. For example, when the mask frame 61 is provided with four Z-axis adjustment screws 61F, the Z-axis adjustment screws 61F may be located at positions overlapping with corners of the frame main body 61B1 when viewed from a viewpoint opposite to the XY plane.

[0175] [Fifth embodiment] 27 and 28, a deposition mask, a method for manufacturing a deposition mask, and a method for manufacturing a display device according to a fifth embodiment will be described. The fifth embodiment differs from the first embodiment in the structure for fixing the frame portion to the main body portion. Therefore, while these differences will be described in detail below, structures in the fifth embodiment that are common to the first embodiment will be assigned the same reference numerals as in the first embodiment, and detailed descriptions of these structures will be omitted.

[0176] [Deposition mask] Fig. 27 shows the structure of the deposition mask as seen from a viewpoint opposite to the rear surface of the mask frame. Note that Fig. 27 shows only one first opening and the structure around the first opening in the deposition mask.

[0177] As shown in FIG. 27, the deposition mask 70 includes a mask frame 71 and a mask portion 12. Similar to the mask frame 11 of the first embodiment, the mask frame 71 includes a main body portion 71A and a frame-shaped portion 71B. The frame-shaped portion 71B has a rectangular frame shape. The frame-shaped portion 71B is located on an XY plane defined by an X axis and a Y axis perpendicular to the X axis. The axis perpendicular to the XY plane is the Z axis.

[0178] The main body 71A has a first opening 71AH. When viewed from a perspective facing the rear surface 71AR of the main body 71A, the first opening 71AH has a rectangular outer shape. When viewed from a perspective facing the rear surface 71AR, the frame-shaped portion 71B described above is located within the first opening 71AH. The main body 71A has a plurality of recesses 71A1 per first opening 71AH. The plurality of recesses 71A1 includes two pairs of recesses 71A1 that sandwich the first opening 71AH along the X axis and two pairs of recesses 71A1 that sandwich the first opening 71AH along the Y axis. In the two pairs of recesses 71A1 that sandwich the first opening 71AH along the X axis, each recess 71A1 is adjacent to a different corner of the first opening 71AH. In the two pairs of recesses 71A1 sandwiching the first opening 71AH along the Y axis, each recess 71A1 is adjacent to a different corner of the first opening 71AH.

[0179] The mask frame 71 further includes a plurality of X-axis adjustment screws 71C, a plurality of Y-axis adjustment screws 71D, and a plurality of Z-axis adjustment parts 71E. In the example shown in Fig. 27, the mask frame 71 includes four X-axis adjustment screws 71C.

[0180] The X-axis adjustment screws 71C are attached to the corners of the frame-shaped portion 71B, one at a time. Each X-axis adjustment screw 71C has a rod shape extending from a corner of the frame-shaped portion 71B toward the outside of the frame-shaped portion 71B. The end of each X-axis adjustment screw 71C attached to the frame-shaped portion 71B is the tip, and the end opposite the tip is the base. The tip of each X-axis adjustment screw 71C (not shown) is spherical and held in a groove formed in the frame-shaped portion 71B. Therefore, the tip of each X-axis adjustment screw 71C is not fixed to the frame-shaped portion 71B. The X-axis adjustment screw 71C passes through a through-hole formed between the first opening 71AH and the recess 71A1, and is thereby supported by the main body portion 71A. The base end of each X-axis adjustment screw 71C is located within the recess 71A1. The position of frame portion 71B on the X-axis can be changed by changing the amount that X-axis adjustment screw 71C protrudes into recess 71A1. The amount that X-axis adjustment screw 71C protrudes can be changed by the amount that X-axis adjustment screw 71C is tightened.

[0181] The mask frame 71 has four Y-axis adjustment screws 71D. Each Y-axis adjustment screw 71D is attached to a corner of the frame portion 71B. Each Y-axis adjustment screw 71D has a rod shape extending from the corner of the frame portion 71B toward the outside of the frame portion 71B. The end of each Y-axis adjustment screw 71D attached to the frame portion 71B is its leading end, and the end opposite the leading end is its base end. The leading ends of the Y-axis adjustment screws 71D (not shown) are spherical and are held in grooves formed in the frame portion 71B. Therefore, the leading ends of the Y-axis adjustment screws 71D are not fixed to the frame portion 71B. The Y-axis adjustment screws 71D pass through through holes formed between the first opening 71AH and the recess 71A1, thereby supporting the Y-axis adjustment screws 71D on the main body portion 71A. The base ends of the Y-axis adjustment screws 71D are located within the recess 71A1. The position of frame portion 71B on the Y-axis can be changed by changing the amount that Y-axis adjustment screw 71D protrudes into recess 71A1. The amount that Y-axis adjustment screw 71D protrudes can be changed by the amount that Y-axis adjustment screw 71D is tightened.

[0182] That is, in this embodiment, the X-axis adjustment screw 71C and the Y-axis adjustment screw 71D constitute an example of a second position adjustment section. FIG. 28 shows a cross section taken along line XXVIII-XXVIII shown in FIG.

[0183] 28, the main body 71A has a stepped portion AH1 formed by widening the opening of the back surface 71AR of the main body 71A at the first opening 71AH. The mask frame 71 has four Z-axis adjusters 71E. One Z-axis adjuster 71E is located between a side surface defining the stepped portion AH1 and a corner of the frame portion 71B along the Z axis.

[0184] Each Z-axis adjustment unit 71E is an elastic body, such as a spring. When the frame-shaped unit 71B is placed on the Z-axis adjustment unit 71E, the Z-axis adjustment unit 71E contracts in response to the load applied by the frame-shaped unit 71B. Therefore, the position of the frame-shaped unit 71B on the Z axis is determined by the elastic force of the Z-axis adjustment unit 71E and the load applied to the Z-axis adjustment unit 71E by the frame-shaped unit 71B. The load applied to the Z-axis adjustment unit 71E may include not only the load due to the weight of the frame-shaped unit 71B but also the load due to the deposition target placed on the frame-shaped unit 71B. As described above, the deposition target is, for example, a glass substrate. A bank is formed on the surface of the glass substrate that contacts the frame-shaped unit 71B to separate pixels formed on the glass substrate from other pixels. Therefore, when a glass substrate is placed on the frame-shaped unit 71B, the load from the glass substrate is applied to the Z-axis adjustment unit 71E through the bank of the glass substrate.

[0185] [Fixing method] A method for fixing the frame portion 71B to the main body portion 71A will be described below. In the fifth embodiment, when fixing the frame portion 71B to the main body portion 71A, a holding base equivalent to the holding base described in the third embodiment can be used.

[0186] In the deposition mask 70 of this embodiment, when fixing the frame-shaped portion 71B to the main body portion 71A, first, the frame-shaped portion 71B is held on a holder, and the X-axis adjustment screw 71C and the Y-axis adjustment screw 71D attached to the main body portion 71A are held on the frame-shaped portion 71B. Next, at least one of the amount by which the X-axis adjustment screw 71C protrudes into the recess 71A1 and the amount by which the Y-axis adjustment screw 71D protrudes is adjusted. This fixes the frame-shaped portion 71B to the main body portion 71A at a predetermined position on the XY plane. Then, the holder is removed from the frame-shaped portion 71B, causing the load of the frame-shaped portion 71B to act on the Z-axis adjustment portion 71E. As a result, the frame-shaped portion 71B is supported by the Z-axis adjustment portion 71E at a predetermined position on the Z axis. It is possible to release the frame portion 71B from the main body portion 71A by removing the X-axis adjustment screw 71C and the Y-axis adjustment screw 71D from the frame portion 71B.

[0187] As described above, according to the fifth embodiment of the deposition mask, the deposition mask manufacturing method, and the display device manufacturing method, in addition to the above-mentioned (1-1) and (1-4), the following effects can be obtained.

[0188] (5-1) The position of frame portion 61B on the XY plane can be adjusted using X-axis adjustment screw 71C and Y-axis adjustment screw 71D, thereby preventing misalignment of the positions of the second openings between multiple frame portions 71B.

[0189] [Modification of the fifth embodiment] The above-described fifth embodiment can be modified and implemented as follows. [X-axis adjustment screw] The mask frame 71 may have only three X-axis adjustment screws 71C. In this case, any of the four X-axis adjustment screws 71C provided on the mask frame 71 described above may be omitted.

[0190] [Y-axis adjustment screw] The mask frame 71 may have only three Y-axis adjustment screws 71D. In this case, any of the four Y-axis adjustment screws 71D provided on the mask frame 71 described above may be omitted. [Explanation of symbols]

[0191] 10, 40, 50, 60, 70... Deposition mask 11, 41, 51, 61, 71...Mask frame 11A, 41A, 51A, 61A, 71A...Main body 11AF,11BF,11F,12F,41AF,41BF,51AF,51BF…Surface 11AH,41AH,51AH,61AH,71AH…1st opening 11AR,11BR,11R,12R,41AR,41BR,51AR,51BR,71AR…Back side 11B, 41B, 51B, 61B, 71B...Frame-shaped part 11BH,41BH…Second opening 12...Mask section 12H...Mask hole

Claims

1. a main body portion having a surface, a back surface opposite to the surface, and a first opening penetrating between the surface and the back surface; and a frame-shaped portion having a surface and a back surface opposite to the surface, the frame-shaped portion having a second opening penetrating between the surface of the frame-shaped portion and the back surface of the frame-shaped portion; a mask frame configured so that the frame-shaped portion can be attached to the main body portion on the back surface side of the main body portion relative to the front surface such that the opening of the second opening on the front surface faces the opening of the first opening on the front surface, and so that the frame-shaped portion can be detached from the main body portion; a mask portion having a plurality of mask holes, the mask portion being joined to the back surface of the frame portion so as to cover the second opening, the frame-shaped portion is a frame member formed of a magnetic metal, The mask frame further includes a fixing portion that fixes the frame-shaped portion to the main body portion by magnetic attraction so as to be detachable from the main body portion. Deposition mask.

2. A plurality of the mask portions are provided, the main body portion includes a plurality of the first openings, the mask frame includes a plurality of the frame-shaped portions, each frame-shaped portion has the second opening portion facing the opening of a different one of the first opening portions; the mask portions are welded to the back surfaces of the frame portions that are different from each other; Each frame-shaped portion has a welding mark formed by welding the mask portion to the frame-shaped portion, and the welding mark is a depression formed on the back surface. The deposition mask according to claim 1 .

3. The mask frame includes a first position adjustment portion configured to change the position of the frame portion relative to the main body portion between a first position and a second position in the thickness direction of the main body portion. The deposition mask according to claim 1 or 2.

4. The mask frame includes a second position adjustment portion configured to change the position of the frame portion relative to the main body portion between a third position and a fourth position in a plane in which the frame portion extends. The deposition mask according to claim 1 .

5. the main body portion has a step portion where the opening on the back surface of the first opening portion is widened, The frame-shaped portion is configured to be positioned at the step portion. The deposition mask according to claim 1 .

6. In a cross section perpendicular to the rear surface, the frame-shaped portion has a thickness equal to or greater than the depth of the stepped portion of the main body portion. The deposition mask according to claim 5 .

7. Joining the mask portion to a frame-shaped portion having a second opening penetrating between the front surface and the back surface; and attaching the frame-shaped portion to a body portion having a first opening extending therethrough between a front surface and a back surface; bonding the mask portion to the rear surface of the frame portion so as to cover the second opening; attaching the frame-shaped portion includes attaching the frame-shaped portion on the back surface side of the main body portion relative to the front surface of the main body portion so that an opening on the front surface of the second opening faces an opening on the front surface of the first opening, and so that the frame-shaped portion is detachable from the main body portion; attaching the frame-shaped portion includes forming a mask frame including the main body portion and the frame-shaped portion by attaching the frame-shaped portion to the main body portion; the frame-shaped portion is a frame member formed of a magnetic metal, The mask frame further includes a fixing portion that fixes the frame-shaped portion to the main body portion by magnetic attraction so as to be detachable from the main body portion. A method for manufacturing a deposition mask.

8. forming a pattern on a deposition target using a deposition mask manufactured by the deposition mask manufacturing method according to claim 7. A method for manufacturing a display device.

Images