Resin composition

Abstract

To provide a resin composition that can be used for efficient production of a vapor chamber having high flexibility and durability.SOLUTION: The inventive resin composition is used for the production of a deformation preventive member of a vapor chamber. The vapor chamber includes, besides the deformation preventive member, a container and a hydraulic fluid. The container has a cavity part inside. The deformation preventive member is disposed in the cavity part and prevents the deformation of the container in the thickness direction. The hydraulic fluid is disposed in the cavity part. The resin composition expresses adhesion by heat treatment after photolithography.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a resin composition. [Background technology]

[0002] For example, heat-generating components such as central processing units (CPUs), light-emitting diodes (LEDs), and power semiconductors used in mobile devices such as handheld devices and tablet devices are cooled by heat pipes and vapor chambers.

[0003] A working fluid is sealed inside the vapor chamber (container), and pillars and other components that prevent unintended deformation of the vapor chamber are fixed to the container by brazing (see, for example, Patent Document 1). The working fluid absorbs heat from the heat-generating components and releases it to the outside, thereby cooling the heat-generating components.

[0004] More specifically, the working fluid in the vapor chamber receives heat from the heat-generating component in the part (evaporation part) close to the heat-generating component and evaporates into vapor, and the vapor then moves to a position away from the evaporation part, where it is cooled and condenses into liquid.

[0005] A liquid flow path section with a capillary structure (wick) is provided within the vapor chamber, and the liquefied working fluid passes through this liquid flow path section and is transported toward the evaporation section, where it is again exposed to heat and evaporated.

[0006] In this way, the working fluid circulates within the vapor chamber while undergoing repeated phase changes, i.e., evaporation and condensation, thereby transferring heat from the device and improving heat dissipation efficiency.

[0007] However, conventional vapor chambers lack flexibility, and depending on the shape of the heat-generating component, they may not be able to adhere well to the heat-generating component. Furthermore, conventional vapor chamber manufacturing processes require a step of brazing components such as pillars, which results in poor productivity. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] WO2017 / 104819 Summary of the Invention [Problem to be solved by the invention]

[0009] An object of the present invention is to provide a resin composition that can be used for the efficient production of a vapor chamber that is excellent in flexibility and durability. [Means for solving the problem]

[0010] These objects can be achieved by the present invention as set forth in (1) to (7) below. (1) A resin composition used in the manufacture of a deformation prevention member of a vapor chamber having a container with a hollow portion therein, a deformation prevention member disposed in the hollow portion and having a function of preventing deformation of the container in the thickness direction, and a working fluid disposed in the hollow portion, A resin composition characterized in that it exhibits adhesive properties by heat treatment after photolithography.

[0011] (2) The resin composition according to (1) above, wherein the heating temperature of the heat treatment is 80°C or higher and 250°C or lower.

[0012] (3) The resin composition according to (1) or (2) above, which contains an alkali-soluble resin, a photopolymerizable resin, and a thermosetting resin different from the alkali-soluble resin.

[0013] (4) The resin composition according to (3), wherein the alkali-soluble resin contains a (meth)acrylic group and a phenolic hydroxyl group, or a (meth)acrylic group and a carboxyl group.

[0014] (5) The resin composition according to any one of (1) to (4) above, wherein the deformation prevention member is formed integrally with the fibers that function as the wick.

[0015] (6) The resin composition according to (5) above, wherein the fibers are glass fibers.

[0016] (7) The resin composition according to any one of (1) to (6) above, wherein at least a portion of the container that comes into contact with the deformation prevention member is made of Cu or a Cu alloy. [Effects of the Invention]

[0017] According to the present invention, it is possible to provide a resin composition that can be used for the efficient production of a vapor chamber that is excellent in flexibility (pliability) and durability. [Brief explanation of the drawings]

[0018] [Figure 1] FIG. 2 is a vertical cross-sectional view schematically showing an example of a vapor chamber. [Figure 2] FIG. 10 is a vertical cross-sectional view schematically showing another example of a vapor chamber. [Figure 3] FIG. 10 is a vertical cross-sectional view schematically showing another example of a vapor chamber. [Figure 4] FIG. 10 is a vertical cross-sectional view schematically showing another example of a vapor chamber. [Figure 5] FIG. 2 is a plan view schematically showing a wick structure provided in the vapor chamber. [Figure 6] FIG. 1 is a perspective view schematically illustrating an example of a member for manufacturing a vapor chamber. [Figure 7] FIG. 1 is a longitudinal cross-sectional view schematically showing an example of a member for manufacturing a vapor chamber. [Figure 8] FIG. 10 is a longitudinal cross-sectional view schematically showing another example of a member for manufacturing a vapor chamber. [Figure 9] FIG. 10 is a longitudinal cross-sectional view schematically showing another example of a member for manufacturing a vapor chamber. [Figure 10] 1 is a vertical cross-sectional view schematically showing an example of a method for manufacturing a vapor chamber. [Figure 11] 1 is a vertical cross-sectional view schematically showing an example of a method for manufacturing a vapor chamber. DETAILED DESCRIPTION OF THE INVENTION

[0019] The present invention will now be described in detail with reference to the accompanying drawings. [1] Vapor chamber First, a vapor chamber manufactured using the resin composition of the present invention will be described. FIG. 1 is a vertical cross-sectional view schematically illustrating an example of a vapor chamber. FIGS. 2 to 4 are vertical cross-sectional views respectively illustrating another example of a vapor chamber. FIG. 5 is a plan view schematically illustrating a wick structure included in the vapor chamber. Note that fibers 131 are not illustrated in FIG. 5. In the following description, the vapor chamber 100 will be described mainly in the case where the lower surface (surface of the first sheet material 21) in FIGS. 1 to 4 contacts the member (heat-generating member) to which the vapor chamber 100 is applied. However, the upper surface in FIGS. 1 to 4 may also contact the member (heat-generating member) to which the vapor chamber 100 is applied. Furthermore, although FIGS. 1 to 4 show a state in which the first sheet material 21 faces downward, the orientation of the vapor chamber 100 during use is not particularly limited. For example, the vapor chamber 100 may be used with the first sheet material 21 facing upward.

[0020] The vapor chamber 100 has a container 20 having a hollow portion inside, a deformation prevention member 10 that is placed in the hollow portion and has the function of preventing deformation of the container 20 in the thickness direction, and a working liquid (working fluid) 30 that is placed in the hollow portion.

[0021] The deformation prevention member 10 is manufactured using the resin composition of the present invention, which will be described in detail later.

[0022] This results in excellent adhesion between the deformation prevention member 10 and the container 20, and the vapor chamber 100 has excellent flexibility (pliability) and durability. Furthermore, because the vapor chamber 100 can have excellent flexibility (pliability), the vapor chamber 100 can have a good adhesion state with the member to which the vapor chamber 100 is applied, regardless of the member or arrangement, etc., and the substantial heat transport capacity can be more reliably improved.

[0023] [1-1] Container The container 20 stores the deformation prevention member 10 and the working fluid 30, and mainly functions in the evaporation section to come into contact with a component to be cooled, such as a heat-generating component, and to transfer heat to the working fluid 30 stored inside the container 20, while in the condensation section it has the function of dissipating heat received from the working fluid 30 undergoing a phase transition from a gas state to a liquid state.

[0024] The container 20 is made of a material with high thermal conductivity, and is particularly preferably made of a metal material.

[0025] Metallic materials generally have high thermal conductivity and are also excellent in strength, ductility, etc. Therefore, for example, the vapor chamber 100 can be made to have particularly excellent shape conformability and adhesion to the component to which it is applied (for example, a component to be cooled, such as a heat-generating component), and the vapor chamber 100 can be made to have particularly excellent substantial heat transport capacity and particularly excellent durability. In particular, since the container 20 can be suitably formed using a relatively thin metal sheet material, this is advantageous from the standpoint of thinning the vapor chamber 100, reducing the cost of raw materials for the vapor chamber 100, etc.

[0026] Examples of the metal material that constitutes the container 20 include Cu, Al, Mg, Zn, and alloys containing at least one of these.

[0027] Among these, the metal material constituting the container 20 is preferably Cu or a Cu alloy.

[0028] This allows the effect of providing a container 20 made of a metal material to be more pronounced. That is, among various metal materials, Cu or a Cu alloy is relatively inexpensive and has particularly excellent thermal conductivity and ductility, so that the vapor chamber 100 can have particularly excellent shape conformability and adhesion to the member to which it is applied (for example, a member to be cooled, such as a heat-generating member), and the vapor chamber 100 can have an even better substantial heat transport capacity. In addition, the durability of the vapor chamber 100 can be further improved.

[0029] Furthermore, if at least the portion of the container 20 that comes into contact with the deformation prevention member 10 is made of Cu or a Cu alloy, the adhesion between the deformation prevention member 10 and the container 20, and the durability and reliability of the vapor chamber 100 can be improved.

[0030] When the container 20 is made of metal sheet materials joined together, the thickness of the sheet materials is preferably 12 μm or more and 70 μm or less, and more preferably 18 μm or more and 35 μm or less.

[0031] This is particularly advantageous from the standpoint of making the vapor chamber 100 thinner, further improving its flexibility and heat transport capacity, and reducing the raw material costs of the vapor chamber 100, and also makes the vapor chamber 100 more durable and reliable.

[0032] In the illustrated configuration, the container 20 is formed using a first sheet material 21 and a second sheet material 22 .

[0033] The first sheet material 21 and the second sheet material 22 may be made of the same material, or may be made of different materials.

[0034] Furthermore, the first sheet material 21 and the second sheet material 22 may have the same thickness or may have different thicknesses.

[0035] The first sheet material 21 and the second sheet material 22 are sealed at their outer peripheries by a sealing portion 23. This seals the cavity that houses the deformation prevention member 10 and the working fluid 30, maintaining a liquid-tight and airtight state.

[0036] The sealing portion 23 may be made of, for example, the same material as the first sheet material 21 or the second sheet material 22, or may be made of a material different from the first sheet material 21 and the second sheet material 22.

[0037] The sealing portion 23 can be formed by, for example, plating up, laser welding, seam welding, cold pressure welding, diffusion bonding, brazing, or adhesive bonding.

[0038] [1-2] Deformation prevention member The deformation prevention member 10 is a member having a function of preventing deformation in the thickness direction of the container 20 (for example, deformation when the cavity is decompressed to lower the boiling point of the working fluid 30).

[0039] By arranging such a deformation prevention member 10 in the hollow portion of the container 20, a flow path for the working fluid 30 can be suitably secured in the hollow portion of the container 20, and the flow of the working fluid 30 in the hollow portion can be effectively prevented from being obstructed due to deformation of the container 20.

[0040] The deformation prevention member 10 is manufactured using the resin composition of the present invention, which will be described in detail later, and contains a cured resin.

[0041] The deformation prevention member 10 has a portion that functions as a flow path wall 16 for the working fluid 30, and the portion of the deformation prevention member 10 where the flow path wall 16 is not arranged becomes the flow path portion 15 for the working fluid 30.

[0042] The width of the flow path wall 16 (the width in a cross section perpendicular to the longitudinal direction of the flow path wall 16) is not particularly limited, but is preferably 10 μm or more and 1000 μm or less, and more preferably 20 μm or more and 500 μm or less.

[0043] This makes it possible to sufficiently prevent undesired deformation of the container 20 in the thickness direction, while making the vapor chamber 100 particularly flexible.

[0044] In the illustrated configuration, the deformation prevention member 10 has a plurality of portions that function as flow path walls 16 extending in the longitudinal direction thereof.

[0045] The distance S between adjacent flow path walls 16 (i.e., the width of the flow path portion 15) is not particularly limited, but is preferably 100 μm or more and 1000 μm or less, more preferably 200 μm or more and 800 μm or less, and even more preferably 300 μm or more and 700 μm or less.

[0046] This allows the working fluid 30 (gaseous working fluid 30 and liquid working fluid 30) to move more smoothly while preventing the deformation prevention member 10 and vapor chamber 100 from becoming larger. Also, it is possible to sufficiently prevent unintended deformation of the container 20 in the thickness direction while providing the vapor chamber 100 with particularly excellent flexibility.

[0047] The ratio (L / S) of the width L [μm] of the flow path wall 16 to the width S [μm] of the flow path portion 15 is not particularly limited, but is preferably 0.05 or more and 0.50 or less, more preferably 0.08 or more and 0.40 or less, and even more preferably 0.10 or more and 0.35 or less.

[0048] This makes it possible to sufficiently prevent undesired deformation in the thickness direction of the container 20 while providing particularly excellent flexibility (pliability) of the vapor chamber 100. Furthermore, it is possible to further improve the heat transport capacity and durability of the vapor chamber 100 while suppressing increases in size of the deformation prevention member 10 and the vapor chamber 100. On the other hand, if the value of L / S is less than the lower limit, deformation in the thickness direction of the container 20 is likely to occur depending on the thickness of the sheet material constituting the container 20, the constituent materials, etc. Furthermore, if the value of L / S exceeds the upper limit, the heat transport efficiency decreases.

[0049] In the illustrated configuration, the channel portion 15 and the channel wall 16 have a constant width, but they may have portions with different widths.

[0050] In the illustrated configuration, the flow path portion 15 and the flow path wall 16 are provided linearly in one direction, but they may also have curved or bent portions.

[0051] The height (thickness) of the deformation prevention member 10 is preferably 10 μm or more and 2000 μm or less, more preferably 20 μm or more and 1000 μm or less, and even more preferably 30 μm or more and 500 μm or less.

[0052] This prevents the vapor chamber 100 from becoming unnecessarily thick, while more suitably securing the flow path portion of the working fluid 30 (particularly, the flow path portion of the gaseous working fluid 30 and the flow path portion of the liquid working fluid 30).

[0053] The deformation prevention member 10 may contain components other than the cured resin of the resin composition of the present invention, which will be described later. Examples of such components include fillers, ultraviolet absorbers, leveling agents, coupling agents, flame retardants, and antioxidants.

[0054] However, the content of components other than the cured resin in the deformation prevention member 10 (if multiple types of components are contained, the total content of these components) is preferably 10.0 mass% or less, more preferably 7.0 mass% or less, and even more preferably 5.0 mass% or less.

[0055] In the illustrated configuration, the deformation prevention member 10 is in contact with the inner surface of the container 20 on both sides (more specifically, one side, the first side 11, is in contact with the first sheet material 21, and the other side, the second side 12, is in contact with the second sheet material 22), but another member may be interposed between the deformation prevention member 10 and the container 20. In other words, the deformation prevention member 10 may be fixed to the inner surface of the container 20 via, for example, another member.

[0056] [1-3] Fiber In this embodiment, the deformation prevention member 10 is formed integrally with the fibers 131 that function as a wick. In other words, the integrally molded product of the deformation prevention member 10 and the fibers 131 is a member that has the function of preventing deformation in the thickness direction of the container, and also serves as a wick structure that allows the flow of the working fluid 30 associated with heat transport, in particular the flow of the working fluid 30 vaporized by receiving heat in the evaporator section of the container 20 and the flow of the working fluid 30 condensed by receiving heat in the condenser section of the container 20.

[0057] In particular, the wick structure includes a deformation prevention member 10 and fibers 131, and the fibers 131 are arranged in a part of the flow path portion 15 for the working fluid 30 where the deformation prevention member 10 is not arranged.

[0058] In this way, since the deformation prevention member 10 is integrally formed with the fibers 131 that function as a wick, for example, the flow path portion 15 can have a flow path portion for the gaseous working fluid 30 (a portion of the flow path portion 15 where the fibers 131 are not present or where the density of the fibers 131 is low) and a flow path portion for the liquid working fluid 30 (a portion of the flow path portion 15 where the fibers 131 are present or where the density of the fibers 131 is high), and the flow path for the liquid working fluid 30 and the flow path for the gaseous working fluid 30 can be functionally separated. As a result, the heat transport capacity of the vapor chamber 100 can be particularly excellent. Furthermore, the durability and the like of the vapor chamber 100 can be further improved. In particular, by using the resin composition of the present invention, which will be described in detail later, during the manufacture of the vapor chamber 100, the resin composition can be suitably permeated into the gaps between the fibers 131, and the durability and the like of the vapor chamber 100 can be further improved.

[0059] Fiber 131 may be made of any material, and examples of materials constituting fiber 131 include cotton, linen, wool, polyester resin, polyamide resin, acrylic resin, aromatic resin containing a heterocycle in the molecule, glass, carbon, iron, silver, copper, etc., and one or more selected from these may be used in combination.

[0060] In particular, when the fibers 131 are glass fibers, the durability of the vapor chamber 100 can be improved. Furthermore, since glass fibers generally have excellent transmittance for light including ultraviolet light, in the manufacturing method of the vapor chamber 100 described in detail below, the curing reaction of the resin composition of the present invention in the exposure step can be effectively prevented from being unintentionally inhibited, thereby making it possible to particularly improve the productivity and yield of the vapor chamber 100. Furthermore, glass fibers also have excellent adhesion to the cured resin product of the resin composition of the present invention described in detail below.

[0061] The thickness of the fibers 131 is not particularly limited, but is preferably 1 μm to 100 μm, more preferably 4 μm to 30 μm, and even more preferably 5 μm to 15 μm.

[0062] This prevents the wick structure from becoming thicker than necessary, while ensuring more suitable gaps between the fibers 131, thereby improving the transport capacity of the liquid working fluid 30 by capillary action in the vapor chamber 100. As a result, the heat transport capacity of the vapor chamber 100 can be improved.

[0063] In the wick structure and the vapor chamber 100, the fibers 131 may be included in a state where a plurality of fibers 131 are gathered in a bundle, that is, as a fiber bundle. Examples of the fiber bundle include a ply-twisted yarn, a single-twisted yarn, a lang-twisted yarn, and a braided cord.

[0064] This prevents the wick structure from becoming thicker than necessary, while ensuring more suitable gaps between the fibers 131, thereby improving the transport capacity of the liquid working fluid 30 by capillary action in the vapor chamber 100. As a result, the heat transport capacity of the vapor chamber 100 can be improved.

[0065] In the illustrated configuration, the fibers 131 form a sheet-like fiber base material (fiber sheet) 13.

[0066] This allows the wick structure to contain not only the fibers 131 in an independent state but also the fiber substrate 13 in which multiple fibers 131 are entangled. This makes it easier to adjust the gaps between the fibers 131 in the wick structure to facilitate capillary action in the liquid working fluid 30, and also makes it easier to adjust the location of the fibers 131 in the wick structure. This allows for more optimal coexistence of flow path portions for the gaseous working fluid 30 and the liquid working fluid 30, thereby more reliably achieving the aforementioned effects. This also simplifies the manufacture of the wick structure, making it easier to adjust the location and distribution of the fibers 131 in the wick structure. This effectively prevents, for example, undesired uneven distribution of the fibers 131 in each portion of the wick structure (e.g., insufficient fibers 131 in portions that should become flow path portions 15). Furthermore, since the fiber base material 13 is sheet-shaped, it is possible to effectively prevent the wick structure from becoming thicker than necessary, and it is possible to more effectively prevent unintended deformation of the fiber base material 13 during the manufacture of the vapor chamber 100 (wick structure) and unintended movement of the fibers 131 within the wick structure.

[0067] The fiber base material 13 may be, for example, a nonwoven fabric or a woven fabric. When the fiber base material 13 is a woven fabric, examples of the woven fabric include plain weave, twill weave, satin weave, leno weave, imitation weave, twill weave, double weave, and the like.

[0068] In this embodiment, the fiber base material 13 made of fibers 131 is disposed so as to penetrate the flow path wall 16 of the deformation prevention member 10 .

[0069] This more effectively prevents unintended movement of the fibers 131 in the vapor chamber 100, and the effects described above are more pronounced. Also, the stability of the shapes of the deformation prevention member 10 and the wick structure is improved, making it possible to further improve the durability and reliability of the vapor chamber 100. Furthermore, the ease of handling of the vapor chamber manufacturing member 10', the deformation prevention member 10, and the wick structure during the manufacture of the vapor chamber 100, as will be described in detail later, is improved.

[0070] The thickness of the fiber base material 13 is preferably 10 μm or more and 1000 μm or less, more preferably 20 μm or more and 500 μm or less, and even more preferably 30 μm or more and 200 μm or less.

[0071] This prevents the wick structure from becoming thicker than necessary, while ensuring more suitable gaps between the fibers 131, and further improving the transport capacity of the liquid working fluid 30 by capillary action in the vapor chamber 100. As a result, the heat transport capacity of the vapor chamber 100 can be further improved.

[0072] The fiber base material 13 may have regions with different fiber densities. For example, the fiber base material 13 may have regions with different fiber densities in the thickness direction thereof.

[0073] The wick structure may include multiple fiber substrates 13. In this case, these fiber substrates 13 may be of the same condition or different conditions. When the wick structure includes multiple fiber substrates 13, the multiple fiber substrates 13 may be stacked in the thickness direction of the wick structure, for example.

[0074] The wick structure may include a fiber substrate 13 or may further include fibers 131 independent of the fiber substrate 13.

[0075] The content of the fibers 131 in the wick structure is preferably 1% by mass or more and 80% by mass or less, more preferably 3% by mass or more and 75% by mass or less, and even more preferably 5% by mass or more and 70% by mass or less.

[0076] In particular, when the fibers 131 are made of an inorganic material, the content of the fibers 131 in the wick structure is preferably 40% by mass or more and 80% by mass or less, more preferably 45% by mass or more and 75% by mass or less, and even more preferably 50% by mass or more and 70% by mass or less.

[0077] Furthermore, when the fibers 131 are made of an organic material, the content of the fibers 131 in the wick structure is preferably 1% by mass or more and 40% by mass or less, more preferably 3% by mass or more and 35% by mass or less, and even more preferably 5% by mass or more and 30% by mass or less.

[0078] By satisfying the above content conditions, the ratio between the flow path portion of the gaseous working liquid 30 and the flow path portion of the liquid working liquid 30 in the vapor chamber 100 (wick structure) can be made more suitable.

[0079] The above-mentioned wick structure may be formed by any method, but is preferably formed using a vapor chamber manufacturing member 10' as described below.

[0080] This allows the vapor chamber 100 to be manufactured with high productivity and high yield, for example, by a method described below, and the reliability of the vapor chamber 100 can be improved.

[0081] When the wick structure is formed using a vapor chamber manufacturing member 10' as described below, the wick structure may be manufactured using one vapor chamber manufacturing member 10' or multiple vapor chamber manufacturing members 10'. When multiple vapor chamber manufacturing members 10' are used, these vapor chamber manufacturing members 10' may be arranged in the plane direction of the wick structure or may be arranged (stacked) in the thickness direction of the wick structure.

[0082] The sheet-like fiber substrate 13 (fibers 131) may be present throughout almost the entire thickness of the wick structure as shown in Fig. 1, or may be unevenly distributed near the center of the thickness of the wick structure as shown in Fig. 2, or may be unevenly distributed on the second surface 12 side of the wick structure as shown in Fig. 3, or may be unevenly distributed on the first surface 11 side of the wick structure as shown in Fig. 4. Furthermore, the sheet-like fiber substrate 13 (fibers 131) may be unevenly distributed on both sides of the wick structure (the first surface 11 side and the second surface 12 side), and the content of fibers 131 near the center of the thickness of the wick structure may be lower than in these areas.

[0083] [1-4] Hydraulic fluid In the hollow portion of the container 20, a working fluid 30 is placed together with a deformation prevention member 10 (wick structure).

[0084] The working fluid 30 mainly functions to transport heat in the cavity inside the container 20 .

[0085] Examples of the working fluid 30 include water, hydrochlorofluorocarbons such as HCFC-22, hydrofluorocarbons such as HFCR134a, HFCR407C, HFCR410A, and HFC32, hydrofluoroolefins such as HFO1234yf, hydrofluoroethers, alcohols such as ethanol and methanol, acetone, carbon dioxide gas, ammonia, and propane.

[0086] [1-5] Overall structure of the vapor chamber The thickness of the vapor chamber 100 is preferably 50 μm or more and 2100 μm or less, more preferably 80 μm or more and 1070 μm or less, and even more preferably 100 μm or more and 570 μm or less.

[0087] This allows the working fluid 30 (gaseous working fluid 30 and liquid working fluid 30) to move more smoothly while preventing the vapor chamber 100 from becoming thicker. As a result, the heat transport capacity of the vapor chamber 100 can be made particularly excellent. In addition, the durability of the vapor chamber 100 can be made even better.

[0088] [1-6] How to use the vapor chamber Next, an example of how the vapor chamber is used will be described.

[0089] The vapor chamber may be used, for example, to transfer heat from a heat-generating component to a predetermined location, or to equalize the heat from a localized high-temperature portion of the heat-generating component.

[0090] The following description will focus on the case where the vapor chamber is used for the purpose of transferring heat from a specific component (heat-generating component).

[0091] When used to cool a heat-generating component (such as a CPU), the vapor chamber is used with part of its surface (evaporation portion) in contact with the heat-generating component itself or a component made of a highly thermally conductive material (such as a thermally conductive sheet) that comes into contact with it (hereinafter, these are collectively referred to as "heat-generating component, etc.").

[0092] In this case, the vapor chamber may be in a state where the condensation section, which is a different section from the evaporation section, i.e., the section that dissipates heat received from the heat-generating component, is in contact with a heat dissipation component (e.g., a heat sink, etc.) or a component made of a highly thermally conductive material that is in contact with it (e.g., a thermally conductive sheet, etc.) (hereinafter, these will be collectively referred to as "heat dissipation components, etc.").

[0093] As described above, the vapor chamber of the present invention (a vapor chamber equipped with a deformation prevention member formed using the resin composition of the present invention) has excellent flexibility (pliability) and excellent adhesion between the deformation prevention member and the container.

[0094] Therefore, if there is a step between the location where the heat-generating component is installed and the location where the heat-dissipating component should be installed, using a conventional heat pipe or vapor chamber that is less flexible requires the installation of a spacer (e.g., a metal spacer) to eliminate or reduce the step, resulting in problems such as increased costs due to the increased number of parts and an increase in the weight of the entire device. In contrast, the vapor chamber of the present invention is highly flexible and can be easily bent, for example. Therefore, even if the spacer is omitted, it is possible to maintain close contact between the deformation prevention component and the container in the vapor chamber while ensuring good contact with other components (heat-generating components, heat-dissipating components, etc.) in the condensation section and evaporation section. Therefore, the above-mentioned problems can be effectively resolved and good heat-dissipating performance can be stably exhibited over a long period of time.

[0095] Furthermore, when using the vapor chamber according to the present invention, interference with other components can be suitably avoided by curving or bending the vapor chamber, thereby increasing the degree of freedom in the layout of each component in a device equipped with a heat-generating component.

[0096] Furthermore, in the present invention, the shape of the flow path portion and flow path wall of the vapor chamber (wick structure) can be suitably adjusted, so that vapor chambers having not only simple shapes such as rectangles but also complex shapes such as shapes with cutouts, and having flow path portions and flow path walls corresponding to those shapes can be suitably manufactured. Therefore, for example, it is possible to increase the contact area with heat-generating components, heat-dissipating components, etc., while suitably eliminating interference with other components. This allows for better heat dissipation performance.

[0097] Furthermore, for example, in a housing that houses a motor as a heat-generating component (such as the joints of an articulated robot), an aluminum molded body and a heat-conducting sheet are sometimes used in combination inside the housing to dissipate heat from the motor to the outside through the housing, but this poses a problem of increasing the size of the housing.In contrast, when using the vapor chamber according to the present invention, there is no need to use an aluminum molded body, which is advantageous from the perspective of miniaturizing the housing and reducing the number of parts.

[0098] [2] Resin composition (resin composition for manufacturing vapor chambers) Next, the resin composition of the present invention (resin composition for producing a vapor chamber) will be described.

[0099] The resin composition of the present invention is used to manufacture the deformation prevention member 10 described above, and exhibits adhesive properties through heat treatment after photolithography (e.g., the exposure step and development step described in detail below).

[0100] This makes it possible to provide a resin composition that can be suitably used to manufacture a vapor chamber that is excellent in flexibility (pliability) and durability. In particular, joining the deformation prevention member 10 to the container 20 does not require additional bonding using an adhesive, welding, brazing, or the like, thereby making the vapor chamber particularly productive. Furthermore, because the flexibility (pliability) of the vapor chamber 100 can be made excellent, the vapor chamber 100 can be made to have a good adhesion state with the member to which the vapor chamber 100 is applied, regardless of the member or arrangement, etc., and the substantial heat transport capacity can be more reliably improved.

[0101] The resin composition of the present invention may contain a curable resin in an uncured state, and may exhibit adhesive properties by heat treatment after photolithography. It may be a resin in which the curing reaction has progressed partially (for example, a B-stage resin), or it may contain a thermoplastic resin in addition to a curable resin in an uncured state.

[0102] In particular, the resin composition of the present invention preferably contains an alkali-soluble resin, a photopolymerizable resin, and a thermosetting resin different from the alkali-soluble resin.

[0103] This allows a predetermined pattern to be suitably formed through the exposure and development steps in the method described below, and in the development step, an alkaline aqueous solution with a lower environmental impact can be suitably used as a developer, rather than the organic solvents that are widely used. Furthermore, more suitable adhesiveness can be exhibited in the manufacturing process of the vapor chamber 100 described below, improving the bonding strength and adhesion between the deformation prevention member 10 (wick structure) and the container 20 (first sheet material 21, second sheet material 22), and improving the strength and heat resistance of the deformation prevention member 10 (wick structure).

[0104] The alkali-soluble resin will be described below. Examples of alkali-soluble resins include novolak resins such as cresol-type, phenol-type, bisphenol A-type, bisphenol F-type, catechol-type, resorcinol-type, and pyrogallol-type resins; acrylic resins such as phenol aralkyl resins, hydroxystyrene resins, methacrylic acid resins, and methacrylic acid ester resins; cyclic olefin-based resins containing hydroxyl groups, carboxyl groups, and the like; polyamide-based resins (specifically, resins having at least one of a polybenzoxazole structure and a polyimide structure and having a hydroxyl group, carboxyl group, ether group, or ester group in the main chain or side chain, resins having a polybenzoxazole precursor structure, resins having a polyimide precursor structure, and resins having a polyamic acid ester structure), phenol-modified silicone-based resins, and carboxyl-modified silicone-based resins.

[0105] As the alkali-soluble resin, for example, a resin having an alkali-soluble group and a double bond can be suitably used.

[0106] As a result, when removing resin whose double bond moieties have not reacted during development, an alkaline aqueous solution, which has a lower environmental impact, can be used instead of an organic solvent that is normally used as a developer.In addition, since the double bond moieties contribute to the curing reaction, the heat resistance of the cured resin 14 made from the resin composition of the present invention is particularly excellent.

[0107] Examples of resins having an alkali-soluble group and a double bond include curable resins that can be cured by both light and heat.

[0108] Examples of the alkali-soluble group include a hydroxyl group, a carboxyl group, etc. The alkali-soluble group can also contribute to the thermosetting reaction.

[0109] Examples of such resins include thermosetting resins having a photoreactive group such as an acryloyl group, a methacryloyl group, or a vinyl group, and photocurable resins having a thermally reactive group such as a phenolic hydroxyl group, an alcoholic hydroxyl group, a carboxyl group, or an acid anhydride group. The photocurable resin may further have a thermally reactive group such as an epoxy group, an amino group, or a cyanate group. Specific examples include (meth)acrylic-modified phenolic resins, (meth)acryloyl-group-containing acrylic acid polymers, and carboxyl-group-containing (epoxy)acrylates.

[0110] Among these, the alkali-soluble resin is preferably one containing a (meth)acrylic group and a phenolic hydroxyl group, or one containing a (meth)acrylic group and a carboxyl group, more preferably one containing a (meth)acrylic group and a phenolic hydroxyl group, and even more preferably a (meth)acrylic-modified phenolic resin.

[0111] This allows for more efficient removal of unreacted resin during development using an alkaline aqueous solution, improving the productivity of the vapor chamber 100 and the reliability of the vapor chamber 100 produced.

[0112] In particular, if the alkali-soluble resin contains a (meth)acrylic group and a phenolic hydroxyl group, the above-mentioned effects can be obtained, and the resolution of the resin material 14', i.e., the reproducibility of the pattern in the exposure step, can be improved in the manufacturing method of the vapor chamber 100 described below. Such effects are more pronounced when a (meth)acrylic-modified phenolic resin is used among alkali-soluble resins containing a (meth)acrylic group and a phenolic hydroxyl group.

[0113] (Meth)acrylic-modified phenolic resins can be obtained, for example, by reacting a phenolic hydroxyl group of a novolac resin such as a phenol novolac resin, a cresol novolac resin, or a bisphenol A novolac resin with a compound having a glycidyl group and a (meth)acrylic group, such as glycidyl acrylate or glycidyl methacrylate. Among these, methacrylic-modified phenolic resins obtained by reacting phenol novolac with glycidyl methacrylate and bisphenol A novolac resin with glycidyl methacrylate are preferred.

[0114] This makes it possible to more effectively remove unreacted resin during development using an alkaline aqueous solution, thereby improving the productivity of the vapor chamber 100 and the reliability of the manufactured vapor chamber 100, and also improving the reproducibility of the pattern in the exposure step.

[0115] When a thermosetting resin having a photoreactive group is used as the alkali-soluble resin, the modification rate (substitution rate) of the photoreactive group is not particularly limited, but is preferably 20 mol % or more and 80 mol % or less, and more preferably 30 mol % or more and 70 mol % or less, of the total reactive groups of the resin having the alkali-soluble group and the double bond.

[0116] This makes it possible to improve the resolution of the resin composition (resin material 14') of the present invention in the manufacturing method of the vapor chamber 100 described below, i.e., the reproducibility of the pattern in the exposure step. As a result, it can be more suitably applied to the manufacture of a vapor chamber 100 equipped with a deformation prevention member 10 (wick structure) having a fine pattern.

[0117] On the other hand, when a photocurable resin having a thermally reactive group is used, the modification rate (substitution rate) of the thermally reactive group is not particularly limited, but is preferably 20 mol % or more and 80 mol % or less, and more preferably 30 mol % or more and 70 mol % or less, of the total reactive groups of the resin having an alkali-soluble group and a double bond.

[0118] This makes it possible to improve the resolution of the resin composition (resin material 14') of the present invention in the manufacturing method of the vapor chamber 100 described below, i.e., the reproducibility of the pattern in the exposure step. As a result, it can be more suitably applied to the manufacture of a vapor chamber 100 equipped with a deformation prevention member 10 (wick structure) having a fine pattern.

[0119] The weight average molecular weight of the resin having an alkali-soluble group and a double bond is not particularly limited, but is preferably 300,000 or less, and more preferably 5,000 or more and 150,000 or less.

[0120] This allows the resin material 14' to be more suitably removed in the development step while ensuring sufficient stability of the shape of the resin material 14' in the vapor chamber manufacturing member 10', which will be described in detail later.

[0121] The weight-average molecular weight can be evaluated, for example, using GPC, and can be calculated from a calibration curve prepared in advance using a styrene standard substance. In particular, the weight-average molecular weight can be measured using tetrahydrofuran (THF) as a measurement solvent at a temperature of 40°C. In the examples described below, the value obtained by measurement under these conditions is also shown as the weight-average molecular weight.

[0122] The content of the alkali-soluble resin in the resin composition of the present invention is not particularly limited, but is preferably from 10% to 80% by mass, and more preferably from 15% to 70% by mass.

[0123] This allows for sufficiently excellent shape stability of the resin material 14' in the vapor chamber manufacturing member 10' (described in detail later), while also improving resolution in the exposure process and developability in the development process. Furthermore, the heat treatment in the manufacturing process of the vapor chamber 100 allows for excellent bonding strength and adhesion between the deformation prevention member 10 (wick structure) and the container 20 (first sheet material 21, second sheet material 22).

[0124] Next, the photopolymerizable resin will be described. When the resin composition of the present invention contains a photopolymerizable resin in addition to the alkali-soluble resin, patterning properties can be improved.

[0125] Examples of photopolymerizable resins include unsaturated polyesters, acrylic compounds such as acrylic monomers and oligomers having at least one acryloyl group or methacryloyl group in each molecule, and vinyl compounds such as styrene. One or more of these may be used in combination.

[0126] Among these, ultraviolet-curable resins containing an acrylic compound as a main component are preferred. Acrylic compounds cure quickly when irradiated with light (exposure light), and can be suitably patterned with a relatively small amount of exposure light to form the resin composition of the present invention (the resin material 14′ in the vapor chamber manufacturing member 10′ described in detail below).

[0127] Examples of acrylic compounds include acrylic acid ester and methacrylic acid ester monomers, and more specific examples include bifunctional acrylates such as ethylene glycol diacrylate, ethylene glycol dimethacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, glycerin diacrylate, glycerin dimethacrylate, 1,10-decanediol diacrylate, and 1,10-decanediol dimethacrylate, and polyfunctional acrylates such as trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, dipentaerythritol hexaacrylate, and dipentaerythritol hexamethacrylate.

[0128] Among these, (meth)acrylic acid esters are preferred, and acrylic acid esters and methacrylic acid alkyl esters having 1 to 15 carbon atoms in the ester moiety are more preferred. This can improve the reactivity and the sensitivity in the exposure step.

[0129] The photopolymerizable resin is not particularly limited, but is preferably one that is liquid at room temperature (23° C.).

[0130] This improves the curing reactivity with exposure light (especially ultraviolet light). It also facilitates the mixing process with other components (e.g., alkali-soluble resins). Examples of photopolymerizable resins that are liquid at room temperature include the aforementioned ultraviolet-curable resins containing an acrylic compound as a main component.

[0131] The weight average molecular weight of the photopolymerizable resin is not particularly limited, but is preferably 5,000 or less, and more preferably 150 or more and 3,000 or less.

[0132] This improves the reactivity of the resin composition of the present invention (resin material 14' in the vapor chamber manufacturing component 10' described in detail later), improves the sensitivity in the exposure process, and improves the resolution of the resin composition of the present invention (resin material 14' in the vapor chamber manufacturing component 10' described in detail later).

[0133] The content of the photopolymerizable resin in the resin composition of the present invention is not particularly limited, but is preferably from 9% to 40% by mass, and more preferably from 13% to 30% by mass.

[0134] This allows the cured resin 14 obtained by curing the resin material 14' (the resin material 14' being the resin composition of the present invention) in the vapor chamber manufacturing member 10' described in detail below to have both high levels of heat resistance and flexibility. Furthermore, the resolution of the resin material 14' in the vapor chamber 100 manufacturing method described below, i.e., the reproducibility of the pattern in the exposure process, can be improved. As a result, this method can be more suitably applied to the manufacture of a vapor chamber 100 equipped with a deformation prevention member 10 (wick structure) having a fine pattern.

[0135] When the content of the alkali-soluble resin in the resin composition of the present invention is XA [mass%] and the content of the photopolymerizable resin in the resin composition of the present invention is XP [mass%], it is preferable to satisfy the relationship 0.15≦XP / XA≦0.90, it is more preferable to satisfy the relationship 0.19≦XP / XA≦0.87, and it is even more preferable to satisfy the relationship 0.22≦XP / XA≦0.33.

[0136] This allows the shape stability of the resin material 14' in the vapor chamber manufacturing component 10', which will be described in detail later, to be further improved in terms of the balance of the resolution in the exposure process, the developability in the development process, the bonding strength and adhesion between the deformation prevention component 10 (wick structure) and the container 20 (first sheet material 21, second sheet material 22), the heat resistance and flexibility of the cured resin 14 formed by curing the resin material 14', etc.

[0137] Examples of the thermosetting resin (thermosetting resin different from alkali-soluble resin) include novolac-type phenolic resins such as phenol novolac resin, cresol novolac resin, and bisphenol A novolac resin; phenolic resins such as resol phenolic resin; bisphenols such as bisphenol F, bisphenol A, 4,4'-ethylidene-bisphenol, 4,4'-cyclohexylidenebisphenol, and 4,4',4''-ethylidinetrisphenol; bisphenol-type epoxy resins such as bisphenol A epoxy resin and bisphenol F epoxy resin; novolac epoxy resin; and cresol novolac epoxy resin. Examples of suitable thermosetting resins include novolac-type epoxy resins such as biphenyl-type epoxy resins, stilbene-type epoxy resins, triphenolmethane-type epoxy resins, alkyl-modified triphenolmethane-type epoxy resins, triazine-nucleus-containing epoxy resins, and dicyclopentadiene-modified phenol-type epoxy resins; resins having a triazine ring such as urea resins and melamine resins; unsaturated polyester resins, bismaleimide resins, polyurethane resins, diallyl phthalate resins, silicone resins, resins having a benzoxazine ring, and cyanate ester resins. One or more selected from these may be used in combination. Among these, epoxy resins and bisphenols are particularly preferred as the thermosetting resin. This improves the heat resistance of the cured resin 14 obtained by curing the resin material 14' (the resin material 14' being the resin composition of the present invention) in the vapor chamber manufacturing member 10' described in detail below, as well as the adhesion of the cured resin 14 obtained by curing the resin material 14' to the fibers 131, the first sheet material 21, and the second sheet material 22.

[0138] The content of the thermosetting resin in the resin composition of the present invention is not particularly limited, but is preferably 10% by mass or more and 60% by mass or less, and more preferably 15% by mass or more and 55% by mass or less.

[0139] This allows the resin material 14 (resin material 14' which is the resin composition of the present invention) in the vapor chamber manufacturing component 10' described in detail below to be cured, thereby achieving a higher level of both heat resistance and toughness.

[0140] When the content of the alkali-soluble resin in the resin composition of the present invention is XA [mass%] and the content of the thermosetting resin in the resin composition of the present invention is XT [mass%], it is preferable to satisfy the relationship 0.20≦XT / XA≦1.5, more preferably the relationship 0.30≦XT / XA≦1.2, and even more preferably the relationship 0.55≦XT / XA≦0.80.

[0141] This makes it possible to further improve the balance of the shape stability of the resin material 14' (the resin material 14' which is the resin composition of the present invention) in the vapor chamber manufacturing component 10' described in detail below, the resolution in the exposure process, the developability in the development process, the heat resistance and toughness of the cured resin 14 obtained by curing the resin material 14', and the bonding strength and adhesion between the deformation prevention component 10 (wick structure) and the container 20 (first sheet material 21, second sheet material 22).

[0142] [3] Vapor chamber manufacturing materials Next, a vapor chamber manufacturing member that can be suitably used for manufacturing the vapor chamber according to the present invention, in particular for manufacturing the deformation prevention member (wick structure) provided in the vapor chamber, will be described.

[0143] Fig. 6 is a perspective view schematically showing an example of a vapor chamber manufacturing member. Fig. 7 is a longitudinal sectional view schematically showing an example of a vapor chamber manufacturing member. Fig. 8 and Fig. 9 are longitudinal sectional views respectively schematically showing other examples of a vapor chamber manufacturing member.

[0144] The member 10' for manufacturing a vapor chamber includes an uncured resin material 14'. The resin material 14' is made of the resin composition of the present invention described above.

[0145] This makes it possible to provide a vapor chamber manufacturing member 10' that can be suitably used to manufacture a vapor chamber 100 that has excellent flexibility (pliability) and durability. In particular, joining the deformation prevention member to the container does not require additional bonding using an adhesive, welding, brazing, or the like, thereby making it possible to particularly improve the productivity of the vapor chamber 100. Furthermore, because the vapor chamber 100 can have excellent flexibility (pliability), it is possible to ensure good adhesion between the vapor chamber 100 and the member regardless of the member or arrangement to which the vapor chamber 100 is applied, and it is possible to more reliably improve the substantial heat transport capacity.

[0146] Furthermore, for example, by irradiating light (exposure light) in a predetermined pattern in a method as described below, the shape of the flow path portion 15 and flow path wall 16 of the vapor chamber 100 (wick structure, deformation prevention member 10) manufactured using the vapor chamber manufacturing member 10' can be suitably adjusted depending on the purpose, application site, etc. of the vapor chamber 100. In other words, it has excellent on-demand capabilities. Furthermore, the vapor chamber 100 (wick structure, deformation prevention member 10) can be suitably manufactured by general processes such as light irradiation and heat treatment, and a vapor chamber 100 with the above-mentioned excellent characteristics can be manufactured without performing complicated metal processing, etc.

[0147] Furthermore, the vapor chamber manufacturing member 10' of this embodiment includes fibers 131 in addition to the uncured resin material 14'.

[0148] As a result, for example, by irradiating light (exposure light) in a predetermined pattern in a method described below, the flow path portion 15 for the working liquid 30 in the vapor chamber 100, particularly the flow path portion for the gaseous working liquid 30 (a portion of the flow path portion 15 where the fibers 131 are not present or where the density of the fibers 131 is low) and the flow path portion for the liquid working liquid 30 (a portion of the flow path portion 15 where the fibers 131 are present or where the density of the fibers 131 is high) can be suitably formed. More specifically, a structure for moving the gaseous working liquid 30 and a structure for moving the liquid working liquid 30 by capillary action can be suitably arranged. As a result, the evaporation-condensation cycle of the working liquid 30 can be accelerated, and the heat transport capacity of the vapor chamber 100 as a whole can be particularly excellent. Furthermore, the flow path portion for the gaseous working liquid 30 and the flow path portion for the liquid working liquid 30 can be formed in a common process, and alignment of these portions is not required, thereby achieving high productivity and high yield in the manufacture of the vapor chamber 100. However, a portion of the liquid working liquid 30 may flow in the flow path portion for the gaseous working liquid 30 (a portion of the flow path portion 15 where the fibers 131 are not present or where the density of the fibers 131 is low), or a portion of the gaseous working liquid 30 may flow in the flow path portion for the liquid working liquid 30 (a portion of the flow path portion 15 where the fibers 131 are present or where the density of the fibers 131 is high).

[0149] In particular, in the illustrated configuration, the vapor chamber manufacturing component 10' includes a fiber base material 13 made of fibers 131 and an uncured resin material 14' impregnated in the fiber base material 13.

[0150] This allows the above-mentioned effects to be more pronounced. For example, by including a fiber substrate 13 in which a plurality of fibers 131 are entangled rather than only including independent fibers 131, it is easier to adjust the gaps between the fibers 131 in the vapor chamber manufacturing member 10' so that the liquid working liquid 30 is likely to undergo capillary action, and it is also easier to adjust the placement locations of the fibers 131 in the vapor chamber manufacturing member 10'. Therefore, in a wick structure formed using the vapor chamber manufacturing member 10', the flow path portion for the gaseous working liquid 30 and the flow path portion for the liquid working liquid 30 can be more suitably formed, and the above-mentioned effects can be more reliably achieved. In addition, the manufacturing of the vapor chamber manufacturing member 10' is also facilitated, and the arrangement and distribution of the fibers 131 in the vapor chamber manufacturing member 10' can be easily adjusted, and, for example, undesired uneven distribution of the fibers 131 in each part of the vapor chamber manufacturing member 10' (for example, insufficient presence of fibers 131 in the part that should become the flow path portion 15) can be preferably prevented.

[0151] In the illustrated configuration, the fiber base material 13 is in the form of a sheet, but the shape of the fiber base material 13 is not particularly limited.

[0152] Furthermore, in the illustrated configuration, the vapor chamber manufacturing member 10' is sheet-shaped, and in particular has a shape corresponding to the sheet-shaped fiber base material 13, but the shape of the vapor chamber manufacturing member 10' is not particularly limited.

[0153] [3-1] Resin materials The member 10' for manufacturing a vapor chamber contains the resin composition of the present invention as an uncured resin material 14'.

[0154] The content of the resin material 14' in the vapor chamber manufacturing component 10' is preferably 10% by mass or more and 95% by mass or less, more preferably 15% by mass or more and 90% by mass or less, and even more preferably 20% by mass or more and 85% by mass or less.

[0155] In particular, when the fiber 131 is made of an inorganic material, the content of the resin material 14' in the vapor chamber manufacturing component 10' is preferably 10% by mass or more and 50% by mass or less, more preferably 15% by mass or more and 45% by mass or less, and even more preferably 20% by mass or more and 40% by mass or less.

[0156] Furthermore, when the fiber 131 is made of an organic material, the content of the resin material 14' in the vapor chamber manufacturing component 10' is preferably 50% by mass or more and 95% by mass or less, more preferably 55% by mass or more and 90% by mass or less, and even more preferably 60% by mass or more and 85% by mass or less.

[0157] By satisfying the above content conditions, the ratio between the flow path portion of the gaseous working liquid 30 and the flow path portion of the liquid working liquid 30 in the vapor chamber 100 (wick structure) manufactured using the vapor chamber manufacturing component 10' can be made more suitable.

[0158] When the content of fiber 131 in the vapor chamber manufacturing component 10' is Xf [mass %] and the content of resin material 14' is Xr [mass %], it is preferable to satisfy the relationship 0.01≦Xf / Xr≦8.0, it is more preferable to satisfy the relationship 0.1≦Xf / Xr≦5.0, and it is even more preferable to satisfy the relationship 0.3≦Xf / Xr≦3.0.

[0159] In particular, when the fibers 131 are made of an inorganic material, it is preferable that the relationship be 0.8≦Xf / Xr≦8.0, it is more preferable that the relationship be 1.0≦Xf / Xr≦7.0, and it is even more preferable that the relationship be 2.0≦Xf / Xr≦6.0.

[0160] Furthermore, when the fiber 131 is made of an organic material, it is preferable that the relationship 0.01≦Xf / Xr≦0.8 is satisfied, it is more preferable that the relationship 0.05≦Xf / Xr≦0.6 is satisfied, and it is even more preferable that the relationship 0.10≦Xf / Xr≦0.4 is satisfied.

[0161] By satisfying the above-mentioned content relationship, the ratio between the flow path portion of the gaseous working liquid 30 and the flow path portion of the liquid working liquid 30 in the vapor chamber 100 (wick structure) manufactured using the vapor chamber manufacturing component 10' can be made more suitable.

[0162] [3-2] Fiber The vapor chamber manufacturing member 10 ′ of this embodiment includes fibers 131 . The fibers 131 contained in the vapor chamber manufacturing member 10' preferably satisfy the same conditions as those of the fibers 131 described above as a constituent material of the wick structure (vapor chamber 100). This provides the same effect as described above.

[0163] [3-3] Hardener (photosensitive agent) The member 10' for manufacturing a vapor chamber may further contain a curing agent.

[0164] The curing agent (photosensitive agent) is not particularly limited as long as it hardens the resin material 14', and examples thereof include benzophenone, acetophenone, benzoin, benzoin isobutyl ether, benzoin methyl benzoate, benzoin benzoic acid, benzoin methyl ether, benzyl phenyl sulfide, benzyl, dibenzyl, diacetyl, etc., and one or more selected from these may be used in combination.

[0165] The content of the curing agent (photosensitive agent) in the vapor chamber manufacturing component 10' is not particularly limited, but is preferably 0.1% by mass or more and 50% by mass or less, more preferably 0.5% by mass or more and 40% by mass or less, and even more preferably 1.0% by mass or more and 30% by mass or less.

[0166] This allows the storage stability of the vapor chamber manufacturing member 10' to be sufficiently excellent, and also allows the photopolymerization reaction to be initiated and progressed more suitably when manufacturing the vapor chamber 100, which will be described later.

[0167] [3-4] Curing catalyst for thermosetting resin The vapor chamber manufacturing member 10' may further contain a curing catalyst for the thermosetting resin.

[0168] The curing catalyst for the thermosetting resin is not particularly limited as long as it catalyzes the curing reaction of the thermosetting resin that constitutes the resin material 14′, and examples thereof include tertiary amines such as triethylamine, tributylamine, and diazabicyclo[2,2,2]octane, 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-ethyl-4-methylimidazole, 2-ethyl-4-ethylimidazole, 2-phenyl-4-ethylimidazole, and 2- Examples include imidazoles such as phenyl-4-methyl-5-hydroxyimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxyimidazole, 1-benzyl-2-phenylimidazole, 2-phenyl-1H-imidazole-4,5-dimethanol, and 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, and one or more selected from these can be used in combination.

[0169] The content of the curing catalyst for the thermosetting resin in the vapor chamber manufacturing component 10' is not particularly limited, but is preferably 0.01% by mass or more and 10% by mass or less, more preferably 0.04% by mass or more and 5.0% by mass or less, and even more preferably 0.1% by mass or more and 3.0% by mass or less.

[0170] This allows the vapor chamber manufacturing member 10' to have sufficiently excellent storage stability, and also allows the thermosetting reaction to be initiated and progressed more suitably when manufacturing the vapor chamber 100, which will be described later.

[0171] [3-5] Other ingredients The vapor chamber manufacturing member 10' may contain components other than those described above (hereinafter also referred to as "other components"). Examples of such components include fillers, UV absorbers, leveling agents, coupling agents, flame retardants, and antioxidants. One or more selected from these may be used in combination.

[0172] However, the content of other components in the vapor chamber manufacturing member 10' is preferably 7.0 mass % or less, more preferably 5.0 mass % or less, and even more preferably 3.0 mass % or less.

[0173] [3-6] Overall structure of vapor chamber manufacturing components The shape of the vapor chamber manufacturing member 10' is not particularly limited, but in the illustrated configuration, it is in the form of a sheet.

[0174] This makes it possible to suitably manufacture the sheet-shaped vapor chamber 100 (wick structure). Also, it is possible to more suitably prevent unintended deformation of the vapor chamber manufacturing member 10' during the manufacture of the vapor chamber 100 (wick structure) and unintended movement of the fibers 131 in the vapor chamber manufacturing member 10' (wick structure).

[0175] When the vapor chamber-manufacturing member 10' is in a sheet shape, the sheet-like fiber base material 13 (fibers 131) may be present across almost the entire thickness of the vapor chamber-manufacturing member 10' as shown in Fig. 7, or may be unevenly distributed near the center of the thickness of the vapor chamber-manufacturing member 10' as shown in Fig. 8, or may be unevenly distributed on one side of the vapor chamber-manufacturing member 10' as shown in Fig. 9. Furthermore, the sheet-like fiber base material 13 (fibers 131) may be unevenly distributed on both sides of the vapor chamber-manufacturing member 10', and the content of fibers 131 near the center of the thickness of the vapor chamber-manufacturing member 10' may be lower than in these areas.

[0176] The thickness of the vapor chamber manufacturing member 10' is preferably 10 μm or more and 2000 μm or less, more preferably 20 μm or more and 1000 μm or less, and even more preferably 30 μm or more and 500 μm or less.

[0177] This prevents the vapor chamber 100 manufactured using the vapor chamber manufacturing component 10' from becoming unnecessarily thick, while more suitably forming the flow path portion for the gaseous working fluid 30 and the flow path portion for the liquid working fluid 30.

[0178] [4] Vapor chamber manufacturing method Next, a method for manufacturing a vapor chamber according to the present invention will be described. 10 and 11 are vertical cross-sectional views schematically showing an example of a method for manufacturing a vapor chamber.

[0179] The method for manufacturing the vapor chamber 100 of this embodiment includes a vapor chamber manufacturing member preparation step (1a) of preparing a vapor chamber manufacturing member 10' made of a material containing an uncured resin material 14' (the resin composition of the present invention), a first bonding step (1b) of bonding the vapor chamber manufacturing member 10' to a first sheet material 21 on one side, that is, a first surface 11, and a step (1c) of applying light in a predetermined pattern to the vapor chamber manufacturing member 10' bonded to the first sheet material 21. The method includes an exposure process (1c) of irradiating (exposure light) E, a development process (1d) of removing uncured resin material 14' from areas not irradiated with light E in the exposure process, a second joining process (1e) of joining the vapor chamber manufacturing component 10' that has undergone the development process to a second sheet material 22 on a second surface 12 opposite to the first surface 11, and a working liquid supply and sealing process (1f) of injecting working liquid 30 into the space between the first sheet material 21 and the second sheet material 22 and sealing the space.

[0180] This allows for the efficient manufacture of a vapor chamber 100 with excellent flexibility and durability. Furthermore, because the manufactured vapor chamber 100 has excellent flexibility, the vapor chamber 100 can be in good contact with the member to which the vapor chamber 100 is applied, regardless of the member or arrangement, etc., and the vapor chamber 100 can more reliably exhibit excellent heat transport capacity.

[0181] [4-1] Vapor chamber manufacturing component preparation process In the vapor chamber manufacturing component preparation process, a vapor chamber manufacturing component 10' made of a material containing uncured resin material 14', in particular a vapor chamber manufacturing component 10' containing fibers 131 together with the uncured resin material 14' as described above, is prepared (1a).

[0182] The vapor chamber manufacturing member 10' can be obtained, for example, by impregnating a fiber base material 13 with a composition containing an uncured resin material 14' (the resin composition of the present invention).

[0183] The composition may contain, for example, the resin material 14' as well as the other components described above. The composition may also contain a solvent. When the composition contains a solvent, the fiber substrate 13 is impregnated with the composition and then the solvent is evaporated, thereby obtaining a vapor chamber manufacturing member 10'.

[0184] The composition may be applied, for example, from the side corresponding to the first surface 11 of the fiber substrate 13, from the side corresponding to the second surface 12 of the fiber substrate 13, or from both the side corresponding to the first surface 11 and the side corresponding to the second surface 12 of the fiber substrate 13.

[0185] Examples of methods for applying the composition to the fiber substrate 13 include coating, spraying, and dipping.

[0186] [4-2] First joining process In the first bonding step, the vapor chamber manufacturing member 10' is bonded to a first sheet material 21 on one of its surfaces, that is, a first surface 11 (1b).

[0187] The uncured resin material 14' constituting the vapor chamber manufacturing member 10' is brought into contact with the first sheet material 21, and by applying pressure, the two can be bonded together properly. By applying heat in addition to pressure, the two can be bonded even more properly.

[0188] [4-3] Exposure process In the exposure step, the vapor chamber manufacturing member 10' bonded to the first sheet material 21 is irradiated with light E in a predetermined pattern (1c).

[0189] As a result, the portions of the resin material 14' irradiated with the light E are selectively cured to become the cured resin material 14. That is, in a pattern corresponding to the irradiation pattern of the light E, it is possible to form cured portions corresponding to the portions that will become the flow path walls 16 made of the cured resin material 14.

[0190] The curing reaction in this step need only proceed to an extent that allows the uncured resin material 14' to be removed in the subsequent development step while leaving the cured resin 14, and does not have to proceed completely.

[0191] The type of light E irradiated in this step is determined depending on the type of resin material 14', but is preferably ultraviolet light.

[0192] This allows the resin material 14' to be cured appropriately with a relatively short exposure process, thereby improving the productivity of the vapor chamber 100.

[0193] The exposure step may be carried out by scanning light such as laser light in a predetermined pattern, but can be preferably carried out by using a photomask M.

[0194] [4-4]Developing process In the development step, the uncured resin material 14' in the area not irradiated with the light E in the exposure step is removed (1d).

[0195] This allows the resin material 14' to be removed while leaving behind the cured resin 14 and the fibers 131. This allows portions that will become the flow path walls 16 to appear in a predetermined pattern, i.e., a pattern that corresponds to the irradiation pattern of the light E.

[0196] The developing step can be suitably carried out by using a developer that selectively dissolves the resin material 14' but does not dissolve the cured resin 14.

[0197] The composition of the developer varies depending on the resin material 14′, the cured resin 14, etc., but for example, when the resin material 14′ contains an alkali-soluble resin as described above, an alkaline aqueous solution such as sodium hydroxide or tetramethylammonium hydroxide can be suitably used.

[0198] [4-5] Second joining process In the second bonding step, the vapor chamber manufacturing member 10' that has undergone the developing step is bonded to a second sheet material 22 on the second surface 12, which is the surface opposite to the first surface 11 (1e).

[0199] In this process, the second sheet material 22 and the vapor chamber manufacturing component 10' are bonded together by first contacting the vapor chamber manufacturing component 10' with the second sheet material 22 and then heating the components. This first develops adhesiveness (tackiness) during the thermosetting process of the thermosetting resin. Further heating then accelerates the curing reaction of the thermosetting resin, increasing the hardness and shape stability of the cured resin 14. By the end of this process, the adhesiveness of the cured resin 14 is usually lost. By bonding the second sheet material 22 and the vapor chamber manufacturing component 10' through the above-described adhesive (tackiness) development step, the adhesion and bond strength between the second sheet material 22 and the vapor chamber manufacturing component 10' (wick structure) can be particularly excellent. Similarly, the adhesion and bond strength between the first sheet material 21 and the vapor chamber manufacturing component 10' (wick structure) can also be particularly excellent. In addition, the strength and heat resistance of the deformation prevention member 10 (wick structure) that constitutes the vapor chamber manufacturing member 10' can be made particularly excellent, and the durability and reliability of the vapor chamber 100 as a whole can be made particularly excellent.

[0200] After the exposure and development processes, the thermosetting resin in the resin material remains almost unreacted, so heating the resin material reduces the viscosity of the thermosetting resin in the resin material. This improves the wettability of the resin material to the surface of the second sheet material 22. Furthermore, heating hardens the thermosetting resin in the resin material, thereby improving the adhesion between the resin material and the surface of the second sheet material 22.

[0201] The heating temperature in this step is preferably 80°C or higher and 250°C or lower, more preferably 90°C or higher and 220°C or lower, and even more preferably 100°C or higher and 200°C or lower.

[0202] This more effectively prevents undesired deterioration of the materials constituting the vapor chamber 100, and more significantly exhibits the effects described above. Also, the productivity of the vapor chamber 100 can be improved.

[0203] This step may also be performed by combining heating under different conditions. Specifically, for example, a heat treatment under pressure (thermocompression bonding) and a subsequent heat treatment after the pressure is released (post-cure) may be performed in combination.

[0204] The heating time in this step is preferably 0.1 minutes or more and 600 minutes or less. This more effectively prevents undesired deterioration of the materials constituting the vapor chamber 100, and more significantly exhibits the effects described above. Also, the productivity of the vapor chamber 100 can be improved.

[0205] As described above, when a combination of a heat treatment under pressure (thermocompression bonding) and a subsequent heat treatment after the pressure is released (post-cure) is performed, the treatment time for the heat treatment under pressure (thermocompression bonding) is preferably 0.1 minutes or more and 10 minutes or less, and the treatment time for the heat treatment after the pressure is released (post-cure) is preferably 20 minutes or more and 480 minutes or less.

[0206] [4-6] Hydraulic fluid supply and sealing process In the hydraulic fluid supply and sealing step, hydraulic fluid 30 is injected into the space between the first sheet material 21 and the second sheet material 22, and the space is sealed (1f).

[0207] The hydraulic fluid 30 can be suitably injected, for example, in a state where the space between the first sheet material 21 and the second sheet material 22 is depressurized by vacuuming.

[0208] By reducing the pressure in the space between the first sheet material 21 and the second sheet material 22, the boiling point of the working liquid 30 can be lowered, and the evaporation and condensation cycle of the working liquid 30 can be carried out more efficiently, thereby further enhancing the heat transport effect and the heat uniformity effect.

[0209] After the hydraulic fluid 30 is poured, the pouring portion for the hydraulic fluid 30 is sealed, and the deformation prevention member 10 (wick structure) and the space containing the hydraulic fluid 30 are sealed liquid-tight and air-tight.

[0210] The deformation prevention member 10 (wick structure) and the space containing the working fluid 30 are sealed by forming a sealing portion 23.

[0211] Examples of methods for forming the sealing portion 23 include plating up, laser welding, seam welding, cold pressure welding, diffusion bonding, brazing, and adhesion.

[0212] The above describes a preferred embodiment of the present invention, but the present invention is not limited to the above, and modifications and improvements within the scope of achieving the object of the present invention are included in the present invention.

[0213] For example, the resin composition of the present invention may be used to manufacture a vapor chamber, and may be applied to a method other than the vapor chamber manufacturing method described above, or to a vapor chamber other than the vapor chamber having the configuration described above.

[0214] More specifically, for example, the method for producing a vapor chamber using the resin composition of the present invention may further include other steps in addition to the steps described above.

[0215] Furthermore, for example, in the above-described embodiment, a container is formed using two sheets of sheet material (a first sheet material and a second sheet material), but the container may be formed using one sheet material, or may be formed using three or more sheet materials.

[0216] In the above-described embodiment, the wick structure constituting the vapor chamber is typically described as containing fibers together with the resin composition of the present invention, but the wick structure may not contain fibers. In other words, the deformation prevention member does not have to be formed integrally with the fibers.

[0217] Furthermore, in the above-described embodiment, the vapor chamber has been mainly described as being used for the purpose of transferring heat from a heat-generating component to a predetermined location, but the vapor chamber may also be used, for example, for the purpose of equalizing the heat of a localized high-temperature portion of a heat-generating component. [Example]

[0218] The present invention will be described in detail below based on examples, but the present invention is not limited to these examples.

[0219] [5] Preparation of resin composition Example 1 1. Synthesis of alkali-soluble resin (resin with alkali-soluble groups and double bonds (curable resin that can be cured by both light and heat: methacrylic-modified bisphenol A novolac resin: MPN))

[0220] 500 g of a 60% solids solution of phenol novolac resin (Phenolite LF-4871, manufactured by DIC Corporation) in methyl ethyl ketone (MEK) was placed in a 2 L flask, to which 1.5 g of tributylamine as a catalyst and 0.15 g of hydroquinone as a polymerization inhibitor were added, and the mixture was heated to 100°C.

[0221] Subsequently, 162.6 g of glycidyl methacrylate was added dropwise to the mixture over 30 minutes, and the mixture was stirred at 100°C for 5 hours to allow the reaction to proceed, yielding a methacrylic-modified phenolic novolac resin with a non-volatile content of 69.9%. The methacrylic-modified phenolic novolac resin thus obtained as an alkali-soluble resin contained a (meth)acrylic group and a phenolic hydroxyl group in the molecule. The modification rate of the methacrylic-modified phenolic novolac resin thus obtained (alkali-soluble resin) was 45%.

[0222] 2. Preparation of Resin Varnish (Resin Composition) The following components were weighed: 45 parts by weight of the methacrylic-modified phenol novolac resin (MPN) synthesized as described above as an alkali-soluble resin (curable resin that can be cured both by light and heat); 13 parts by weight of a methacrylic monomer (NK Ester 3G, manufactured by Shin-Nakamura Chemical Co., Ltd.) that is liquid at room temperature as a photopolymerizable resin; 30 parts by weight of a phenol novolac epoxy resin (Epicron N-770, manufactured by DIC Corporation) as a thermosetting resin; and 10 parts by weight of bisphenol F (Bis-F, manufactured by Honshu Chemical Industry Co., Ltd.) as a thermosetting resin. Methyl ethyl ketone (MEK) was added to adjust the resin component concentration to 71% by weight. The mixture was then stirred until the phenol novolac epoxy resin (N-770) was dissolved.

[0223] Then, 1.7 parts by mass of a curing agent (photosensitizer) (Irgacure 651, manufactured by IGM Resins BV) and 0.3 parts by mass of 2-phenyl-4,5-dihydroxyimidazole (2PHZ-PW, manufactured by Shikoku Chemical Industry Co., Ltd.) were added, and the mixture was stirred for 1 hour with a stirring blade (450 rpm) to obtain a resin varnish as a resin composition.

[0224] Examples 2 to 8 A resin varnish was obtained as a resin composition in the same manner as in Example 1, except that the types and contents of the alkali-soluble resin, photopolymerizable resin, and thermosetting resin were changed as shown in Table 1.

[0225] Example 9 1. Synthesis of alkali-soluble resin (resin with alkali-soluble groups and double bonds (curable resin curable by both light and heat: methacrylic-modified phenolic novolac resin MPN2))

[0226] 600 g (approximately 4 OH equivalents) of a 70% nonvolatile MEK solution of phenol novolac (Phenolite TD-2090-60M, manufactured by Dainippon Ink and Chemicals, Inc.) was placed in a 2-L flask, to which 1 g of tributylamine and 0.2 g of hydroquinone were added, and the mixture was heated to 110°C. 284 g (2 moles) of glycidyl methacrylate was added dropwise over 30 minutes, and the mixture was stirred and reacted at 110°C for 5 hours to obtain a methacryloyl group-containing phenol novolac resin with an 80% nonvolatile content (methacryloyl group modification rate: 50%).

[0227] 2. Preparation of Resin Varnish (Resin Composition) The following components were weighed: 45 parts by weight of the methacrylic-modified phenol novolac resin synthesized above as an alkali-soluble resin (curable resin curable by both light and heat); 13 parts by weight of a methacrylic monomer (NK Ester 3G, manufactured by Shin-Nakamura Chemical Co., Ltd.) that is liquid at room temperature as a photopolymerizable resin; 30 parts by weight of a phenol novolac epoxy resin (Epiclon N-770, manufactured by DIC Corporation) as a thermosetting resin; and 10 parts by weight of bisphenol F (Bis-F, manufactured by Honshu Chemical Industry Co., Ltd.) as a thermosetting resin. Methyl ethyl ketone (MEK) was then added to adjust the resin component concentration to 71% by weight. The mixture was then stirred until the phenol novolac epoxy resin (N-770) was dissolved.

[0228] Then, 1.7 parts by mass of a curing agent (photosensitizer) (Irgacure 651, manufactured by IGM Resins BV) and 0.3 parts by mass of 2-phenyl-4,5-dihydroxyimidazole (2PHZ-PW, manufactured by Shikoku Chemical Industry Co., Ltd.) were added, and the mixture was stirred for 1 hour with a stirring blade (450 rpm) to obtain a resin varnish as a resin composition.

[0229] Example 10 1. Preparation of Resin Varnish (Resin Composition) Weighed out 45 parts by weight of Cyclomer P (ACA) Z250 as an alkali-soluble resin (a curable resin that can be cured both by light and heat), 13 parts by weight of a methacrylic monomer (NK Ester 3G, manufactured by Shin-Nakamura Chemical Co., Ltd.) that is liquid at room temperature as a photopolymerizable resin, 30 parts by weight of a phenol novolac epoxy resin (Epiclon N-770, manufactured by DIC Corporation) as a thermosetting resin, and 10 parts by weight of bisphenol F (Bis-F, manufactured by Honshu Chemical Industry Co., Ltd.) as a thermosetting resin, and then added methyl ethyl ketone (MEK) to adjust the resin component concentration to 71% by weight. The mixture was then stirred until the phenol novolac epoxy resin (N-770) was dissolved.

[0230] Then, 1.7 parts by mass of a curing agent (photosensitizer) (Irgacure 651, manufactured by IGM Resins BV) and 0.3 parts by mass of 2-phenyl-4,5-dihydroxyimidazole (2PHZ-PW, manufactured by Shikoku Chemical Industry Co., Ltd.) were added, and the mixture was stirred for 1 hour with a stirring blade (450 rpm) to obtain a resin varnish as a resin composition.

[0231] (Comparative Example 1) A resin varnish as a resin composition was obtained in the same manner as in Example 1, except that the thermosetting resin was not used and the content of the alkali-soluble resin and the type and content of the photopolymerizable resin were changed as shown in Table 1.

[0232] The constitutions of the resin compositions of the respective Examples and Comparative Examples are summarized in Table 1. In Table 1, the methacrylic-modified bisphenol A novolak resin as the alkali-soluble resin (resin having a (meth)acrylic group and a phenolic hydroxyl group) synthesized in Example 1 is designated "MPN," the methacrylic-modified phenol novolak resin as the alkali-soluble resin (resin having a (meth)acrylic group and a phenolic hydroxyl group) synthesized in Example 9 is designated "MPN2," the cresol novolak (PHENOLITEKA-1160, manufactured by DIC Corporation) as the alkali-soluble resin having a phenolic hydroxyl group but not a (meth)acrylic group is designated "K1160," the cyclohexane-coated ... 3G) as "NKE-3G", methacrylic monomer (trimethylolpropane triacrylate, Shin-Nakamura Chemical Co., Ltd., NK Ester A-TMP) as photopolymerizable resin as "A-TMP", aliphatic acid-modified epoxy acrylate (Daicel-Allnex Corporation, EBECRYL3702) as photopolymerizable resin as "E3702", modified epoxy acrylate (Daicel-Allnex Corporation, EBECRYL3708) as photopolymerizable resin as "E3708", phenol novolac epoxy resin (DIC Corporation, EPICRON The thermosetting resins are listed as follows: cresol novolac epoxy resin (manufactured by DIC, Epicron N-665) as "N-665", bisphenol F (manufactured by Honshu Chemical Industry Co., Ltd., Bis-F) as "Bis-F", bisphenol A (manufactured by Nippon Steel Chemical & Material Co., Ltd., Bisphenol A) as "Bis-A", Irgacure 651 (manufactured by IGB Resin BV) as a curing agent (photosensitive agent) as "I651", and 2-phenyl-4,5-dihydroxyimidazole (manufactured by Shikoku Chemicals Corporation, 2PHZ-PW) as "2PHZ-PW".Table 1 also shows the XP / XA and XT / XA values when the content of alkali-soluble resin in the resin composition is XA [mass %], the content of photopolymerizable resin in the resin composition is XP [mass %], and the content of thermosetting resin in the resin composition is XT [mass %].

[0233] [Table 1]

[0234] [6] Manufacturing of components for manufacturing vapor chambers Using the resin compositions (resin varnishes) of the respective Examples and Comparative Examples, members for manufacturing vapor chambers were manufactured as follows.

[0235] The fiber substrate was immersed in the resin varnish obtained as described above, so that the resin varnish was impregnated into the gaps between the fibers constituting the fiber substrate.

[0236] Here, the fiber substrate used was a woven glass cloth (manufactured by Unitika Ltd., #2116) with a thickness of 95 μm.

[0237] Thereafter, the material was heated and dried at 80°C for 15 minutes to obtain a member for manufacturing a vapor chamber.

[0238] The vapor chamber manufacturing component obtained in this manner was in the form of a sheet with a thickness of 150 μm, and as shown in Figure 8, the fiber substrate was present near the center of the thickness direction, and no fibers were present on either side of the vapor chamber manufacturing component.

[0239] [7] Vapor chamber manufacturing First, a vapor chamber manufacturing component according to Example 1 obtained as described above was prepared (vapor chamber manufacturing component preparation process), and one of its surfaces, the first surface, was bonded to a copper sheet material (thickness: 35 μm) as a first sheet material by utilizing the adhesiveness of the uncured resin material (resin composition) that constitutes the vapor chamber manufacturing component (first bonding process).

[0240] Next, the vapor chamber manufacturing member bonded to the first sheet material was irradiated (exposed) with light using a photomask having openings (light-transmitting portions) in a pattern corresponding to the flow path walls to be formed (exposure step). The exposure was performed using a mercury lamp with a main wavelength of 365 nm, with an exposure dose of 700 mJ / cm. 2 This was done under the following conditions.

[0241] Next, a 3% by mass aqueous solution of tetramethylammonium hydroxide (TMAH), an alkaline aqueous solution, was used as the developer, and processing was carried out under the conditions of developer pressure: 0.2 MPa, and development time: 150 seconds, to remove the uncured resin material from the areas that were not irradiated with light during the exposure process (development process).

[0242] Next, the second surface of the vapor chamber manufacturing member that had undergone the development process, which was the surface opposite to the first surface, was brought into contact with a copper sheet material (thickness: 35 μm) as a second sheet material, and pressed with a pressure of 1 MPa. In this state, thermocompression bonding was performed at 170 °C for 1 minute, and then heat treatment (post-cure) was performed in an oven at 180 °C for 90 minutes to firmly bond the vapor chamber manufacturing member and the second sheet material. After that, the curing reaction was completed, and a bonded body was obtained in which the wick structure formed using the vapor chamber manufacturing member was firmly bonded to the first sheet material on the first surface and firmly bonded to the second sheet material on the second surface (second bonding process). That is, in the second bonding process, the vapor chamber manufacturing component and the second sheet material are heated while in contact with each other, and adhesive properties (stickiness) are first exhibited during the thermal curing process of the thermosetting resin, and then, by further heating, the curing reaction of the thermosetting resin is completed.

[0243] After that, the peripheral edges of the first and second sheet materials were joined by copper plating to seal the space between the first and second sheet materials, and then pure water was poured into the space between the first and second sheet materials as a working fluid. Furthermore, the inlet for pouring pure water was sealed with solder (working fluid supply and sealing process). This resulted in the vapor chamber shown in Figure 6.

[0244] The wick structure of the vapor chamber obtained in this manner was 200 μm thick and had the structure shown in Figure 5, extending in its longitudinal direction, made of a material including a cured resin, and having multiple portions that functioned as flow path walls for the working fluid, with the spacing between adjacent flow path walls (i.e., the width of the flow path portion) being 500 μm and the width of the flow path wall being 100 μm.

[0245] We also attempted to manufacture a vapor chamber by subjecting the vapor chamber manufacturing members according to each of the examples and comparative examples other than Example 1 to the same treatment as described above. In each example, a vapor chamber could be manufactured, but in the comparative example, adhesiveness (stickiness) did not appear even when the vapor chamber manufacturing member and the second sheet material were heated in contact with each other, and the second sheet material and the vapor chamber manufacturing member (wick structure) could not be joined, and a vapor chamber could not be manufactured.

[0246] [8] Evaluation [8-1] Developability After developing the vapor chamber manufacturing members using the resin compositions of the above-mentioned Examples and Comparative Examples, the flow path walls were observed and judged according to the following criteria: That is, the flow path walls of the vapor chamber manufacturing members that had undergone the development step in [7] above and before contacting with the second sheet material were observed and judged according to the following criteria.

[0247] ⊚: The flow path walls on both sides of the glass cloth were formed in the desired shape. ◯: The flow path wall on the first sheet material side of the glass cloth was formed thinner than the desired size. ×: No flow path wall was formed on the first sheet material side of the glass cloth.

[0248] [8-2] Bendability The vapor chamber manufacturing members manufactured in the above [6] using the resin compositions of each of the Examples and Comparative Examples were placed on a releasable substrate, and irradiated (exposed) with light using a photomask provided with openings (light-transmitting portions) in a pattern corresponding to the flow path walls to be formed (exposure step). Exposure was performed using a mercury lamp with a dominant wavelength of 365 nm, with an exposure dose of 700 mJ / cm. 2 This was done under the following conditions.

[0249] Next, a 3% by mass aqueous solution of tetramethylammonium hydroxide (TMAH), an alkaline aqueous solution, was used as the developer, and processing was carried out under the conditions of developer pressure: 0.2 MPa, and development time: 150 seconds, to remove the uncured resin material from the areas that were not irradiated with light during the exposure process (development process).

[0250] The vapor chamber manufacturing components that had been subjected to the development process in this manner were subjected to a bending test at R10 using a tabletop bending tester (manufactured by Yuasa System Co., Ltd.), and the flow path walls of the vapor chamber manufacturing components were then observed and evaluated according to the following criteria.

[0251] ◎: No cracks on the channel wall. △: The surface of the channel wall is whitened. ×: Cracks occurred in the channel wall.

[0252] [8-3]Re-adhesion After bonding a second sheet material to the wick structure using the resin composition of each of the examples and comparative examples, the die shear strength was measured using a die shear measuring device (manufactured by Rhesca Co., Ltd.) and judged according to the following criteria: That is, for the vapor chamber manufacturing component that had undergone the second bonding step in [7] above, in which the peripheral edges of the first and second sheet materials had not been bonded and pure water had not been injected as the working fluid, the die shear strength was measured using a die shear measuring device (manufactured by Rhesca Co., Ltd.) and judged according to the following criteria.

[0253] ◎: Die shear strength is 25 MPa or more. Good: Adhesion was observed, but the die shear strength was 25 MPa or less. ×: Cannot be adhered. These results are summarized in Table 2.

[0254] [Table 2]

[0255] As is clear from Table 2, the vapor chambers according to each of the examples were confirmed to be excellent in flexibility (pliability) and durability. Furthermore, when each of the vapor chambers obtained in [7] above was manually bent, the vapor chambers according to each of the examples all exhibited excellent flexibility (pliability). Furthermore, repeated bending did not cause any damage, confirming their excellent durability. In contrast, the comparative examples did not produce satisfactory results.

[0256] In addition, using the resin compositions of each of the above examples and comparative examples, vapor chambers were manufactured in the same manner as in [7] above, except that a second sheet material with a thickness of 1 mm was used and the conditions were as follows: thermocompression bonding at 80°C for 1 minute and post-cure at 80°C for 12 hours (condition 1), thermocompression bonding at 150°C for 1 minute and post-cure at 150°C for 2 hours (condition 2), and thermocompression bonding at 250°C for 1 minute and post-cure at 250°C for 10 minutes (condition 3).Then, evaluations were performed in the same manner as in [8-3] above. However, the evaluation criteria were as follows:

[0257] A: Die shear strength is 40 MPa or more. B: Die shear strength is 30 MPa or more and less than 40 MPa. C: Die shear strength is 20 MPa or more and less than 30 MPa. D: Die shear strength is 10 MPa or more and less than 20 MPa. E: Die shear strength is less than 10 MPa or adhesion is not possible. The results are shown in Table 3.

[0258] [Table 3]

[0259] In addition, the thickness of the fiber substrate constituting the vapor chamber manufacturing component was variously changed within a range of 10 μm or more and 1000 μm or less, the thickness of the vapor chamber manufacturing component was variously changed within a range of 10 μm or more and 2000 μm or less, and the value of Xf / Xr, where Xf [mass%] is the fiber content in the vapor chamber manufacturing component and Xr [mass%] is the resin material (resin composition) content, was variously changed within a range of 0.01 or more and 8.0 or less. Vapor chambers were manufactured in the same manner as in the above examples and evaluated in the same manner as above, and the same excellent effects as above were obtained.

[0260] In addition, by changing the method of applying resin varnish to the fiber substrate, vapor chamber manufacturing components were manufactured as shown in Figures 7 and 9. Vapor chambers were manufactured in the same manner as in the above examples, except that these vapor chamber manufacturing components were used to form the cross-sectional structures shown in Figures 1, 3, and 4, and evaluations were performed in the same manner as above, and the same excellent effects as above were obtained. [Explanation of symbols]

[0261] 100: Vapor chamber 10: Deformation prevention member 10': Vapor chamber manufacturing components 11: First side 12: Second side 13: Fiber base material (fiber sheet) 131: Fiber 14': Resin material 14: Cured resin material 15: Flow path part 16: Channel wall 20: Container 21: First sheet material 22: Second sheet material 23: Sealing part 30: Hydraulic fluid (working fluid) S: Spacing L: Width E: Light (exposure light) M: Photomask

Claims

1. A resin composition used in manufacturing a deformation prevention member of a vapor chamber having a container with a hollow portion therein, a deformation prevention member disposed in the hollow portion and having a function of preventing deformation of the container in a thickness direction, and a working fluid disposed in the hollow portion, A resin composition characterized in that it exhibits adhesive properties by heat treatment after photolithography.

2. The resin composition according to claim 1 , wherein the heating temperature of the heat treatment is 80° C. or higher and 250° C. or lower.

3. 3. The resin composition according to claim 1, which comprises an alkali-soluble resin, a photopolymerizable resin, and a thermosetting resin different from the alkali-soluble resin.

4. 4. The resin composition according to claim 3, wherein the alkali-soluble resin contains a (meth)acrylic group and a phenolic hydroxyl group, or a (meth)acrylic group and a carboxyl group.

5. The resin composition according to claim 1 , wherein the deformation prevention member is formed integrally with the fibers that function as the wick.

6. The resin composition according to claim 5 , wherein the fibers are glass fibers.

7. 7. The resin composition according to claim 1, wherein at least a portion of the container that comes into contact with the deformation prevention member is made of Cu or a Cu alloy.

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