Silicone Adsorption Film

Abstract

Provided is a silicone adsorption film that excels in both adsorption to a smooth surface and the suppression of remnants of glue on the smooth surface after detachment. The silicone adsorption film comprises a base material layer and a silicone adsorption layer laminated on the base material layer. The silicone adsorption layer is a cured product of a crosslinkable composition containing (a) a crosslinkable organopolysiloxane , (b) a crosslinking agent, (c) a non-reactive MQ resin and (d) a reactive MQ resin. The silicone adsorption film excels in both adsorption to a smooth surface and the suppression of remnants of glue on the smooth surface after detachment.

Description

[Technical Field]

[0001] The present invention relates to a silicone adsorption film. Specifically, the present invention relates to a silicone adsorption film that is attached to and peeled off from a smooth surface, and that has excellent adsorption to the smooth surface and excellent resistance to adhesive residue on the smooth surface after peeling. Preferably, the present invention relates to a silicone adsorption film that is used to fix a polishing pad by being interposed between the platen and polishing pad of a polishing machine, and that has excellent adsorption to the platen of the polishing machine and excellent resistance to adhesive residue on the platen after peeling. [Background technology]

[0002] In the manufacturing process of semiconductor and electronic components, such as semiconductor wafers, hard disk substrates, and display glass substrates, polishing is performed to flatten or mirror-finish the substrate surface. In these polishing processes, a polishing pad is fixed to the platen of a polishing machine, and a polishing slurry is supplied to the polishing layer surface of the polishing pad while the polishing pad slides against the workpiece to be polished under pressure. To improve the efficiency of replacing and fixing polishing pads, a self-adhesive material made of silicone resin has been used as the material for the adsorption layer in polishing pads in which an adsorption layer, a substrate, and an abrasive layer are stacked in this order, as disclosed in Patent Document 1 and elsewhere.

[0003] A silicone adsorption layer made of a self-adhesive silicone resin generally does not easily slip in a direction parallel to the adherend surface, and exhibits strong adhesion in a direction perpendicular to the adherend surface, while also being easily peeled off from the edge of the silicone adsorption layer. Furthermore, when a silicone adsorption layer is peeled off from a adherend surface and then reattached to the adherend surface, it again strongly adheres to the adherend surface. This property of being easily peeled off from a adherend surface and again strongly adhering to the adherend surface is called reworkability.

[0004] Due to this reworkability, when the silicone adsorption layer is used to fix a polishing pad, it can be easily peeled off from the platen of the polishing machine when the polishing pad is replaced, and even if the polishing pad is attached in the wrong position, it can be easily reattached. Furthermore, even after being peeled off from the platen, if it is attached again to the platen, it will adhere strongly and continue to fix the polishing pad during polishing. For this reason, the silicone adsorption layer greatly contributes to the efficiency of the polishing pad replacement and fixing work. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-108498 Summary of the Invention [Problem to be solved by the invention]

[0006] In recent years, in order to improve the efficiency of polishing operations, there has been a demand for increasing the speed of the polishing operation itself. When the polishing operation is performed at a high speed, the load on the adsorption layer that fixes the polishing pad increases, and as a result, the load on the silicone adsorption layer in a direction parallel to the adherend surface during polishing increases, making the silicone adsorption layer more likely to partially peel off. If the silicone adsorption layer peels off even partially during polishing, the polishing pad cannot be stably fixed, and the desired polishing of the non-abrasive member cannot be performed, or abrasive powder may enter the peeled portion, impairing reworkability.

[0007] The present inventors attempted to incorporate a non-reactive MQ resin into the curable (crosslinkable) composition forming the silicone adsorption layer in order to prevent partial peeling of the polishing pad, which occurs when polishing is performed at high speed, by increasing the adhesive strength of the silicone adsorption layer. However, increasing the adhesive strength of the silicone adsorption layer in this way presented the problem of silicone remaining on the surface (platen) when the silicone adsorption layer was peeled off to replace the polishing pad (so-called adhesive residue). When adhesive residue remains on the platen, the silicone adsorption layer of the next polishing pad cannot be adhered to the platen, making the polishing pad more likely to peel off. Furthermore, the polishing pad may be fixed at an angle relative to the polished member, preventing the polishing pad from applying uniform pressure to the polished member, resulting in failure to achieve the desired polishing of the polished member. Thus, a silicone adsorption layer that is adhered to a smooth surface such as a platen cannot essentially achieve both improved adhesive strength to the smooth surface and reduced adhesive residue on the smooth surface after peeling, making it impossible to fully meet the demand for faster polishing operations.

[0008] Therefore, an object of the present invention is to provide a silicone adsorption film that is excellent in both its adsorption to smooth surfaces and its ability to suppress adhesive residue on smooth surfaces after peeling. [Means for solving the problem]

[0009] After extensive research, the inventors discovered that by using a crosslinkable polyorganosiloxane and a crosslinking agent in combination with a non-reactive MQ resin and a reactive MQ resin as the crosslinkable composition for forming the silicone adsorption layer, a silicone adsorption film can be obtained that is excellent in both its adsorption to smooth surfaces and its ability to suppress adhesive residue on smooth surfaces after peeling.The present invention was completed through further research based on these findings.

[0010] That is, the present invention provides the following aspects. Item 1. A substrate layer and a silicone adsorption layer laminated on the substrate layer, A silicone adsorption film, wherein the silicone adsorption layer is a cured product of a crosslinkable composition containing (a) a crosslinkable organopolysiloxane, (b) a crosslinking agent, (c) a non-reactive MQ resin, and (d) a reactive MQ resin. Item 2. The silicone-adsorbent film according to Item 1, wherein the component (c) is contained in an amount of 43 to 100 parts by weight and the component (d) is contained in an amount of 1.1 to 10.6 parts by weight per 100 parts by weight of the total amount of the component (a) and the component (b). Item 3. The silicone-adsorbent film according to Item 1 or 2, wherein component (a) is a diorganopolysiloxane containing two or more alkenyl groups per molecule. Item 4. The silicone-adsorbent film according to any one of Items 1 to 3, wherein the component (b) is an organohydrogenpolysiloxane. Item 5. The silicone adsorption film according to any one of Items 1 to 4, wherein the silicone adsorption layer has a thickness of 15 to 30 μm. Item 6. The storage modulus of the silicone adsorption layer is 5 × 10 4 ~15×10 4 Item 6. The silicone-adsorbed film according to any one of Items 1 to 5, wherein Pa. Item 7. The silicone-adsorption film according to any one of Items 1 to 6, further comprising an anchor layer between the base layer and the silicone-adsorption layer, the anchor layer being selected from the group consisting of polyester-based resins, acrylic-based resins, and urethane-based resins. Item 8. The silicone adsorption film according to any one of Items 1 to 7, wherein the silicone adsorption layer is fixed to a platen of a polishing apparatus and a polishing pad is fixed to the substrate layer side. [Effects of the Invention]

[0011] According to the present invention, a silicone adsorption film is provided that is excellent in both its adsorption to smooth surfaces and its ability to inhibit adhesive residue on smooth surfaces after peeling. [Brief explanation of the drawings]

[0012] [Figure 1] An example of the layer structure of a silicone adsorption film is shown below. [Figure 2] An example of the layer structure of a silicone adsorption film is shown below. [Figure 3] An example of the layer structure of a silicone adsorption film is shown below. [Figure 4] 1 shows an example of a silicone adsorbent film before use. [Figure 5] 1 shows an example of a silicone adsorbent film before use. [Figure 6] An example of the silicone adsorption film in use is shown below. DETAILED DESCRIPTION OF THE INVENTION

[0013] The silicone-adsorbent film of the present invention comprises a substrate layer and a silicone-adsorbent layer laminated on the substrate layer, wherein the silicone-adsorbent layer is a cured product of a crosslinkable composition containing (a) a crosslinkable organopolysiloxane, (b) a crosslinking agent, (c) a non-reactive MQ resin, and (d) a reactive MQ resin. The silicone-adsorbent film of the present invention is described in detail below.

[0014] Layer structure and usage Examples of the layer structure of a silicone-adsorbent film are shown in Figures 1 to 3. The silicone-adsorbent film of the present invention is a laminate comprising a base layer 1 and a silicone-adsorbent layer 2 laminated directly on the base layer 1, as in the silicone-adsorbent film 10 shown in Figure 1. The silicone-adsorbent film of the present invention may further comprise a pressure-sensitive adhesive layer 3 on the base layer 1 side of the silicone-adsorbent film 10 of Figure 1, as in the silicone-adsorbent film 10a shown in Figure 2. The silicone-adsorbent film of the present invention may also be a laminate comprising a base layer 1 and a silicone-adsorbent layer 2 laminated on the base layer 1 via an anchor layer 4, as in the silicone-adsorbent film 10b shown in Figure 3. Although not shown, the silicone-adsorbent film 10b shown in Figure 3 may further comprise an adhesive layer 3 on the base layer 1 side, as in the silicone-adsorbent film 10a of Figure 2.

[0015] The silicone-adsorbent film of the present invention may be laminated with another layer to protect the adhesive layer until it is used. For example, in the case of the silicone-adsorbent film 10a shown in Fig. 2, as shown in Fig. 4, a separator 20 having a substrate layer 5 may be laminated on the silicone adsorption layer 2, and a cover film 30 having a substrate layer 7 and a release layer 8 may be laminated on the pressure-sensitive adhesive layer 3. Furthermore, as shown in Fig. 5, a separator 20a having a substrate layer 5 and a release layer 6 may be laminated on the silicone adsorption layer 2, and a cover film 30 having a substrate layer 7 and a release layer 8 may be laminated on the pressure-sensitive adhesive layer 3. The separators 20, 20a and the cover film 30 are peeled off when the silicone-adsorbent film 10a is used.

[0016] The silicone-adsorbent film of the present invention is used by adsorbing the silicone-adsorbent layer 2 side to a smooth surface. For example, in the case of the silicone-adsorbent film 10a shown in Fig. 2, preferably, the silicone-adsorbent layer 2 side is adsorbed to a surface plate S, and the abrasive member P is adhered to the pressure-sensitive adhesive layer 3 side, thereby fixing the abrasive member P to the surface plate S, as shown in Fig. 6.

[0017] Base material layer Various plastics can be used as the material for the substrate layer without particular limitation, and examples thereof include polyolefins (polyethylene, polypropylene, etc.), polyesters (polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polybutylene naphthalate, copolymer polyester, etc.), polyamides (nylon 6, nylon 66, copolymers of nylon 6 and nylon 66, nylon 6,10, polymetaxylylene adipamide (MXD6), etc.), polycarbonate, triacetyl cellulose, fluororesin, polyphenylene oxide, polyimide, polyamideimide, acrylic resin, polyvinyl chloride, polyvinylidene chloride, polyacrylonitrile, etc. Among these, polyester and polycarbonate are preferred from the viewpoints of cost and ease of handling during thermal crosslinking of the crosslinkable composition that forms the silicone adsorption layer, and polyester is more preferred from the viewpoint of transparency, and polyethylene terephthalate is even more preferred.

[0018] The thickness of the substrate layer is not particularly limited, but is usually 5 to 400 μm, preferably 20 to 250 μm, more preferably 30 to 150 μm, and even more preferably 40 to 80 μm.

[0019] Specific examples of the substrate layer include films formed from the above-mentioned materials.

[0020] The surface of the substrate layer may be modified by plasma treatment or flame treatment, preferably plasma treatment, for the purpose of improving adhesion to the silicone adsorption layer or the anchor layer provided as needed and / or imparting antistatic properties.

[0021] Silicone adsorption layer The silicone adsorption layer is a cured product of a crosslinkable composition containing (a) a crosslinkable organopolysiloxane (hereinafter also referred to as component (a)), (b) a crosslinking agent (hereinafter also referred to as component (b)), (c) a non-reactive MQ resin (hereinafter also referred to as component (C)), and (d) a reactive MQ resin (hereinafter also referred to as component (d)).

[0022] The silicone adsorption layer has rubber-like flexibility and self-adhesiveness, and because it is composed of the cured product of the above-mentioned crosslinkable composition, it exhibits excellent effects in both its adsorption to smooth surfaces and its ability to prevent adhesive residue from remaining on smooth surfaces after peeling.

[0023] ((a) Crosslinkable Organopolysiloxane) The crosslinkable organopolysiloxane that is component (a) is not particularly limited as long as it is an organopolysiloxane that has a crosslinkable group, and preferably includes a diorganopolysiloxane that has two or more alkenyl groups in one molecule.

[0024] In diorganopolysiloxanes having two or more alkenyl groups per molecule, the structure of the diorganosiloxane moiety can be a straight chain having a main chain consisting of repeating diorganosiloxane units, or a branched structure optionally having a branched chain consisting of repeating diorganosiloxane or diorganosiloxane units.Furthermore, in diorganopolysiloxanes having two or more alkenyl groups per molecule, the bonding positions of the alkenyl groups are not particularly limited, but can include the terminals of the diorganosiloxane moiety, more specifically, only both terminals of the straight-chain diorganopolysiloxane; only both terminals of the main chain of the branched diorganopolysiloxane; or both terminals of the main chain and the terminals of the side chain of the branched diorganopolysiloxane.

[0025] Specific examples of diorganopolysiloxanes having two or more alkenyl groups per molecule used in the present invention are represented by the following formulas (1-1) to (1-3) and (2): Formulas (1-1) to (1-3) are examples of linear diorganopolysiloxanes having two alkenyl groups per molecule, and formula (2) is an example of a branched diorganopolysiloxane having two or more alkenyl groups per molecule.

[0026] [ka]

[0027] In formulas (1-1) to (1-3) and (2), R 1 represent organic groups which may be the same or different from each other, X represents an alkenyl group, and n, m, and l represent integers.

[0028] R 1Preferred examples of R include alkyl groups having 1 to 10 carbon atoms, preferably 1 to 6 carbon atoms, more preferably methyl, ethyl, propyl, etc.; cycloalkyl groups; cycloalkyl groups such as cyclopentyl, cyclohexyl, cycloheptyl, etc.; aryl groups such as phenyl, tolyl, xylyl, naphthyl, biphenylyl, etc.; aralkyl groups such as benzyl, phenylethyl, phenylpropyl, methylbenzyl, etc.; and groups in which at least a portion of the hydrogen atoms bonded to the carbon atoms of these groups have been substituted with halogen atoms such as fluorine, chlorine, bromine, etc., or with cyano, etc., preferably alkyl groups, more preferably methyl groups. In particular, the compounds of formulas (1-1) to (1-3) and (2) are preferably such that at least 50% of R 1 is preferably occupied by a methyl group.

[0029] Preferred examples of X include alkenyl groups having 2 to 8 carbon atoms, preferably vinyl, allyl, propenyl, isopropenyl, butenyl, hexenyl, and cyclohexenyl groups, and more preferably vinyl. The compound of formula (2) is similar to the linear formula (1-1) in that it has one alkenyl group per terminal, except that the polyorganosiloxane portion is branched. However, similar to formulas (1-2) and (1-3), it may be modified to have two or three alkenyl groups per terminal.

[0030] n is an integer of 0 or greater (in the case of formulas (1-1) to (1-3)) or an integer of 1 or greater (in the case of formula (2)), m is an integer of 0 or greater, and 1 is an integer of 1 or greater. Preferably, n and m satisfy 10≦n+m≦10,000, more preferably 50≦n+m≦2,000.

[0031] These crosslinkable organopolysiloxanes may be used alone or in combination of two or more.

[0032] The weight average molecular weight (Mw) of the crosslinkable organopolysiloxane is, from the viewpoint of preferably obtaining curability and adhesiveness, 20,000 or more, preferably 50,000 or more, more preferably 70,000 or more, and from the viewpoint of ensuring a viscosity that is not too high to facilitate stirring during production, for example, 600,000 or less, preferably 300,000 or less, more preferably 100,000 or less. The weight average molecular weight Mw is the polystyrene-equivalent molecular weight measured by gel permeation chromatography (GPC). The definitions of Mn and Mw are described in "Fundamentals of Polymer Chemistry" (edited by the Polymer Society, Tokyo Kagaku Dojin, 1978), etc., and can be calculated from the molecular weight distribution curve by GPC (the same applies hereinafter).

[0033] ((b) Crosslinking Agent) The crosslinking agent as the component (b) is not particularly limited as long as it has a hydrosilyl group (SiH group) for crosslinking the component (a). By crosslinking, the silicone adsorption layer has flexibility like rubber, and this flexibility exhibits excellent adhesion between the silicone adsorption layer and the adherend.

[0034] Preferably, the crosslinking agent is an organohydrogenpolysiloxane. The organohydrogenpolysiloxane contains two or more, preferably three or more, hydrosilyl groups in one molecule, and may be any of a linear, branched, cyclic, or three-dimensional network-structured resinous substance. Specific examples of such organohydrogenpolysiloxanes are represented by the following average composition formula (3).

[0035]

Chemical formula

[0036] In formula (3), R 2 is an unsubstituted or substituted monovalent hydrocarbon group that may be the same or different and does not contain an aliphatic unsaturated bond, and a and b are numbers satisfying 0 < a < 2, 0.8 ≤ b ≤ 2, and 0.8 < a + b ≤ 3, respectively.

[0037] The unsubstituted or substituted monovalent hydrocarbon group not containing an aliphatic unsaturated bond includes R 1 Examples include the following.

[0038] These organohydrogenpolysiloxanes may be used alone or in combination. Preferably, component (b) contains, per 100% by weight of the total amount, 50% by weight or less of an organohydrogenpolysiloxane having two hydrosilyl groups, with the remainder being an organohydrogenpolysiloxane having at least three hydrosilyl groups.

[0039] The weight average molecular weight (Mw) of the crosslinking agent is, from the viewpoint of facilitating the addition reaction, for example, 200 or more, preferably 500 or more, and more preferably 1,000 or more, and from the viewpoint of preventing the silicone adsorption layer from becoming too soft, for example, 15,000 or less, preferably 5,000 or less, and more preferably 1,500 or less.

[0040] The amount of component (b) used is, for example, an amount such that the number of hydrogen atoms in component (b) is 0.5 to 4 moles, and preferably 1 to 2.5 moles, per mole of component (a).

[0041] ((c) Non-reactive MQ resin) The non-reactive MQ resin, component (c), is composed of M units (R 3 3SiO 1 / 2 ) and Q units (SiO4· 1 / 2 ) and is a silicone resin that does not contain reactive functional groups such as vinyl groups or hydroxyl groups in the molecule. The incorporation of component (c) improves the adsorption properties of the silicone adsorption layer, but inhibits the reaction between the crosslinkable groups of component (a) and the hydrosilyl groups of component (b) during curing of the crosslinkable composition, leaving unreacted hydrosilyl groups that cause adhesive residue. However, in the present invention, the silicone adsorption layer exhibits excellent adhesive residue suppression properties even when it contains component (c).

[0042] In the M units that make up non-reactive MQ resin, R 3 are the same or different, unsubstituted or substituted hydrocarbon groups having 1 to 10 carbon atoms, and specific examples thereof include alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, pentyl, neopentyl, hexyl, heptyl, and octyl; cycloalkyl groups such as cyclopentyl, cyclohexyl, and cycloheptyl; and aryl groups such as phenyl, tolyl, xylyl, and naphthyl, preferably alkyl groups, and more preferably methyl groups.

[0043] In non-reactive MQ resins, the molar ratio of M units to Q units (M units / Q units) is 0.6 or more to improve the adsorption properties of the silicone adsorption layer, and 1.8 or less to improve adhesive residue suppression.

[0044] These non-reactive MQ resins may be used singly or in combination of two or more types.

[0045] The weight average molecular weight (Mw) of the non-reactive MQ resin is, from the viewpoint of improving the adsorption properties of the silicone adsorption layer, for example, 100,000 or more, preferably 150,000 or more, more preferably 170,000 or more, and from the viewpoint of preventing plastic deformation of the silicone adsorption layer, for example, 300,000 or less, preferably 250,000 or less, more preferably 200,000 or less.

[0046] The content of component (c) in the crosslinkable composition is, for example, 43 to 100 parts by weight per 100 parts by weight of the total amount of components (a) and (b). A content of component (c) of 43 parts by weight or more is preferred from the viewpoint of improving the adsorption properties of the silicone adsorption layer, and a content of 100 parts by weight or less is preferred from the viewpoint of improving the ability to suppress adhesive transfer. From the viewpoint of further enhancing these effects or further improving ease of peeling, the content is preferably 61 to 100 parts by weight, more preferably 78 to 100 parts by weight, and even more preferably 90 to 100 parts by weight.

[0047] ((d) Reactive MQ resin) The reactive MQ resin, component (d), is an MQ resin composed of M and Q units and containing silanol groups within the molecule. By incorporating component (d) into the crosslinkable composition, the unreacted hydrosilyl groups remaining due to the presence of component (c) during curing of the crosslinkable composition react with the silanol groups of component (d) to reduce them. This prevents adhesive residue without reducing the adsorption strength of the silicone adsorption layer improved by component (c). Component (d) also improves the adsorption strength of the silicone adsorption layer, although not as effectively as component (c).

[0048] Reactive MQ resin is M 1 Units ((OH) c R 4 (3-c) SiO 1 / 2 ) and sometimes M 2 Units (R 5 3SiO 1 / 2 ) and Q units (SiO4· 1 / 2 ) is a silicone resin consisting of M 1 In units, R 4 are the same or different unsubstituted or substituted hydrocarbon groups having 1 to 10 carbon atoms, M 2 In units, R 5 are the same or different unsubstituted or substituted hydrocarbon groups having 1 to 10 carbon atoms, and R 4 and R 5 Specific examples of the above are R in the non-reactive resin, which is component (c).3 In addition, c is an integer of 1 to 3, preferably 1 or 2, and more preferably 1.

[0049] In reactive MQ resin, M 1 OH group and R 4 Motoi and M 2 Unit R 5 The ratio of OH groups to the total amount of groups is 0.5 mol% or more, preferably 1 mol% or more, from the viewpoint of obtaining a more preferable effect of preventing adhesive transfer, and 10 mol% or less, preferably 5 mol% or less, from the viewpoint of obtaining a more preferable adsorption property of the silicone adsorption layer.

[0050] In reactive MQ resins, the ratio of M to Q units 1 Unit and M 2 Total molar ratio of units ((M 1 Unit + M 2 From the viewpoint of obtaining a more preferable adhesive transfer prevention effect, the ratio (Q unit) / Q unit) is 0.5 or more, preferably 0.6 or more, and from the viewpoint of obtaining a more preferable adsorption property of the silicone adsorption layer, is 1.2 or less, preferably 0.9 or less.

[0051] These reactive MQ resins may be used singly or in combination of two or more.

[0052] The weight average molecular weight (Mw) of the reactive MQ resin is, for example, 100 to 30,000, preferably 3,000 to 20,000, and more preferably 6,000 to 10,000, from the viewpoint of obtaining favorable adsorption properties and adhesive transfer suppression properties.

[0053] The content of component (d) in the crosslinkable composition is, for example, 1.1 to 10.6 parts by weight per 100 parts by weight of the total amount of components (a) and (b). A content of component (d) of 1.1 parts by weight or more is preferred from the viewpoint of improving adhesive transfer suppression, and a content of 10.6 parts by weight or less is preferred from the viewpoint of improving the adsorption properties of the silicone adsorption layer. To obtain these effects more favorably, the content is preferably 1.1 to 1.5 parts by weight or 6 to 10.6 parts by weight, more preferably 1.1 to 1.3 parts by weight or 9 to 10.6 parts by weight.

[0054] Furthermore, the content of component (d) in the crosslinkable composition per 100 parts by weight of component (c) is 1 part by weight or more from the viewpoint of improving adhesive transfer suppression, and 11 parts by weight or less from the viewpoint of improving the adsorption properties of the silicone adsorption layer. From the viewpoint of obtaining these effects more favorably, the content of component (d) per 100 parts by weight of component (c) is preferably 1 to 2 parts by weight or 8 to 11 parts by weight, and more preferably 1 to 1.5 parts by weight or 9 to 11 parts by weight.

[0055] (Other ingredients) The crosslinkable composition may contain, in addition to the above components (a) to (d), an addition reaction catalyst, a solvent, and the like, as needed.

[0056] Examples of the addition reaction catalyst include platinum-based catalysts. Specific examples of platinum-based catalysts include chloroplatinic acids such as chloroplatinic acid and chloroplatinic acid, alcohol compounds of chloroplatinic acid, aldehyde compounds, and chain salts of chloroplatinic acid with various olefins. These addition reaction catalysts may be used alone or in combination. The amount of the addition reaction catalyst used is, for example, 1.5 to 2.5 parts by weight per 100 parts by weight of the total amount of component (a) and component (b).

[0057] The solvent can be used to adjust the viscosity of the crosslinkable composition. Specific examples include aromatic hydrocarbon solvents such as toluene and xylene; aliphatic hydrocarbon solvents such as hexane, heptane, octane, and isoparaffin; ketone solvents such as methyl ethyl ketone and methyl isobutyl ketone; ester solvents such as ethyl acetate and isobutyl acetate; and ether solvents such as diisopropyl ether and 1,4-dioxane. These solvents may be used alone or in combination. The amount of solvent used is, for example, 25 to 40% by weight, preferably 30 to 40% by weight, of the crosslinkable composition. The crosslinkable composition may be solventless, solvent-based, or emulsion-based, and therefore may be solvent-free.

[0058] (Thickness) The thickness of the silicone adsorption layer can be appropriately set by those skilled in the art to a thickness that ensures shear force in the direction of the adhesive surface of the silicone adsorption layer against the adherend. From the viewpoint of improving the adsorption properties of the silicone adsorption layer, the thickness is preferably 10 μm or more, more preferably 15 μm or more, even more preferably 20 μm or more, and even more preferably 25 μm or more. From the viewpoint of improving adhesive transfer suppression, the thickness is preferably 50 μm or less, more preferably 30 μm or less, even more preferably 25 μm or less, and even more preferably 20 μm or less.

[0059] (Formation method) The silicone adsorption layer can be formed by forming a coating layer of the above-mentioned crosslinkable composition on the substrate film constituting the substrate layer, and then carrying out a crosslinking reaction.

[0060] Examples of methods for applying the crosslinkable composition include a roll coater, a bar coater, a floating knife coater, a die coater, a gravure coater, a curtain coater, and a blade coater.

[0061] The crosslinking reaction conditions are not particularly limited as long as they allow thermal crosslinking of component (a) and component (b) by an addition reaction. For example, the crosslinking conditions include a temperature of 160°C or less, preferably 100 to 160°C, and more preferably 130 to 150°C.

[0062] (storage modulus) The storage modulus (G') of the silicone adsorption layer at 23°C is set to 5 × 10 4 ~15×10 4 From the viewpoint of obtaining more preferable adsorption properties, the storage modulus (G') of the silicone adsorption layer at 23°C is preferably 6.5 × 10 4 ~15×10 4 Pa, more preferably 7×10 4 ~15×10 4 Pa, more preferably 7.5 × 10 4 ~15×10 4 Examples of storage modulus control include Pa. For example, when the storage modulus is increased, it can be controlled by increasing the blending ratio of the (c) component and the (d) component, preferably by increasing the blending ratio of the (d) component, and when the storage modulus is decreased, it can be controlled by decreasing the blending ratio of the (c) component and the (d) component, preferably by decreasing the blending ratio of the (d) component. The storage modulus is a value measured by the method described in the examples.

[0063] (adsorption and easy peeling) The silicone adsorption layer not only exhibits excellent adhesion to smooth surfaces, but also excels in its ability to be easily peeled off after adhering to a smooth surface (easy peelability). To achieve even better adhesion and easy peelability, the release force of the silicone adsorption layer is, for example, 350 to 7500 mN / 25 mm, preferably 500 to 6500 mN / 25 mm, and more preferably 800 to 5000 mN / 25 mm. With such a peel force, when the silicone adsorption layer is used to secure a polishing member P (polishing pad) to a surface plate S, as shown in FIG. 6, it is possible to simultaneously achieve the following: the ability to prevent partial peeling between the silicone adsorption layer 2 and the surface plate S, even when the polishing operation is accelerated; the ability to easily peel the silicone adsorption film 10a from the surface plate S; and the ability to prevent adhesive residue on the surface plate S after peeling. The peel strength of the silicone adsorption layer is the peel strength against a stainless steel surface, specifically measured using the method described in the examples.

[0064] Adhesive layer The adhesive layer is provided for the purpose of adhering and fixing the polishing member.

[0065] The material for the pressure-sensitive adhesive layer may be a pressure-sensitive adhesive composition containing a (meth)acrylic resin and an isocyanate-based crosslinking agent.

[0066] Examples of the (meth)acrylic resin include copolymers of alkyl (meth)acrylates having no hydroxyl groups and monomers having hydroxyl groups.

[0067] The alkyl group in the alkyl(meth)acrylate having no hydroxyl group includes a linear or branched alkyl group having 1 to 18 carbon atoms, preferably 1 to 8, and more preferably 1 to 4 carbon atoms. Specific examples of the alkyl(meth)acrylate having no hydroxyl group include methyl(meth)acrylate, ethyl(meth)acrylate, n-butyl(meth)acrylate, isobutyl(meth)acrylate, sec-butyl(meth)acrylate, tert-butyl(meth)acrylate, n-octyl(meth)acrylate, isooctyl(meth)acrylate, 2-ethylhexyl(meth)acrylate, n-nonyl(meth)acrylate, isononyl(meth)acrylate, n-decyl(meth)acrylate, n-dodecyl(meth)acrylate, and stearyl(meth)acrylate.

[0068] Examples of the monomer having a hydroxyl group include hydroxyalkyl (meth)acrylates and other monomers having a hydroxyl group. The alkyl group in the hydroxyalkyl (meth)acrylate is a linear or branched alkyl group having 1 to 18 carbon atoms, preferably 1 to 8, and more preferably 1 to 4 carbon atoms. Specific examples of the (meth)acrylate having a hydroxyl group include hydroxyalkyl (meth)acrylates such as 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 3-methyl-3-hydroxybutyl (meth)acrylate, 1,1-dimethyl-3-hydroxybutyl (meth)acrylate, 1,3-dimethyl-3-hydroxybutyl (meth)acrylate, 2,2,4-trimethyl-3-hydroxypentyl (meth)acrylate, and 2-ethyl-3-hydroxyhexyl (meth)acrylate. Other monomers having a hydroxyl group include glycerin mono(meth)acrylate, polypropylene glycol mono(meth)acrylate, polyethylene glycol mono(meth)acrylate, poly(ethylene glycol-propylene glycol) mono(meth)acrylate, and N-methylolacrylamide.

[0069] The weight average molecular weight (Mw) of the (meth)acrylic resin is, for example, 100,000 to 1,000,000, preferably 300,000 to 800,000, and more preferably 400,000 to 600,000.

[0070] Examples of the isocyanate crosslinking agent include diisocyanates such as hexamethylene diisocyanate, toluene diisocyanate, and isophorone diisocyanate, triisocyanates such as tris(phenylisocyanate)thiophosphate, and polyisocyanates having isocyanurates.

[0071] The thickness of the pressure-sensitive adhesive layer is, for example, 30 to 150 μm, and preferably 40 to 80 μm.

[0072] In a method for laminating a pressure-sensitive adhesive layer, a pressure-sensitive adhesive composition may be applied to a substrate layer laminated with a silicone adsorption layer and dried to form a coating layer, or a silicone adsorption laminate of a substrate layer and a silicone adsorption layer may be prepared, a cover film may be prepared separately, a pressure-sensitive adhesive composition may be applied to a release layer of the cover film and dried to form a coating layer, and the substrate layer side of the silicone adsorption laminate may be laminated opposite the coating layer.

[0073] Anchor Layer The anchor layer, which is provided as needed, can be provided for the purpose of improving the adhesive strength between the substrate layer and the silicone adsorption layer, or for the purpose of allowing the silicone adsorption film to be smoothly peeled off from the smooth surface after being attached to the smooth surface without causing peeling between the substrate layer and the silicone adsorption layer when peeled off. The anchor layer is particularly useful when the combination of the silicone adsorption layer and the substrate layer is difficult to directly adhere to. On the other hand, when the combination of the silicone adsorption layer and the substrate layer is easy to directly adhere to, the anchor layer may or may not be provided.

[0074] Examples of materials for the anchor layer include polyester resins, acrylic resins, urethane resins, etc. From the viewpoint of antistatic properties and / or film properties, the material for the anchor layer is preferably an acrylic resin, more preferably an acrylic polyol resin.

[0075] The anchor layer material may also contain an antistatic agent to further impart antistatic properties. Examples of antistatic agents include nonionic antistatic agents such as polyoxyethylene alkyl ethers, polyoxyethylene alkylphenols, polyoxyethylene alkylamines, polyoxyethylene alkylamides, fatty acid polyethylene glycol esters, fatty acid sorbitan esters, polyoxyethylene fatty acid sorbitan esters, fatty acid glycerin esters, and alkyl polyethyleneimines; acrylate antistatic agents such as acrylate compounds containing ethylene oxide; conductive polymers such as polyaniline, polypyrrole, polythiophene, poly3,4-ethylenedioxythiophene, and derivatives thereof; and conductive metal oxides such as antimony-doped tin oxide (ATO), tin-doped indium oxide (ITO), aluminum-doped zinc oxide, and antimony oxide. Conductive polymers are preferred, and polythiophenes are even more preferred. An anchor layer containing an antistatic agent is particularly useful when using a substrate layer that does not have antistatic properties. On the other hand, when the base layer itself has antistatic properties (for example, when the surface is antistatically treated), an anchor layer containing an antistatic agent may or may not be provided.

[0076] The thickness of the anchor layer is, for example, 0.1 μm or more, preferably 1.0 μm or more, from the viewpoint of improving adhesion between the base layer and the silicone adsorption layer, and from the viewpoint of obtaining antistatic properties more effectively if antistatic properties are also imparted, and is, for example, 5.0 μm or less, preferably 3.0 μm or less, from the viewpoint of maintaining the flexibility of the entire silicone adsorption film and making it easy to apply and remove the silicone adsorption film from a smooth surface.

[0077] The anchor layer can be formed by forming a coating layer of a resin composition for an anchor layer containing the above-mentioned materials and drying it. Examples of methods for applying the resin composition for an anchor layer include a roll coater, a bar coater, a floating knife coater, a die coater, a gravure coater, a curtain coater, and a blade coater.

[0078] Examples of the method for laminating the anchor layer include an in-line method in which the formation and lamination of the anchor layer are carried out simultaneously, and an off-line method in which the anchor layer is formed as a separate film and then laminated.

[0079] Separator The separator is attached to the silicone adsorption layer side for the purposes of preventing contamination of the surface of the silicone adsorption layer and adhesion of foreign matter, and improving the handling of the silicone adsorption film. The separator may be a film composed of a substrate layer 5, such as separator 20 shown in Fig. 4, or a laminated film including a substrate layer 5 and a release layer 6 laminated on the substrate layer 5, such as separator 20a shown in Fig. 5.

[0080] The material for the substrate layer in the separator includes a silicone-based release agent, a fluorine-based release agent, etc., and preferably a release agent containing fluorosilicone. The thickness of the substrate layer is also the same as that of the substrate layer in the silicone-adsorbed film.

[0081] Examples of materials for the release layer of the separator include silicone-based release agents and fluorine-based release agents, and preferably fluorine-based release agents. Examples of fluorine-based release agents include a resin composition for a release layer containing a copolymer of a fluoroolefin, a cyclohexyl group-containing acrylic ester, and a hydroxyl group-containing vinyl ether, and an isocyanate-based crosslinking agent (a diisocyanate such as hexamethylene diisocyanate, toluene diisocyanate, or isophorone diisocyanate, a triisocyanate such as tris(phenylisocyanate)thiophosphate, or a polyvalent isocyanate having an isocyanurate).

[0082] The release layer can be formed by forming a coating layer of the resin composition for the release layer on the substrate film constituting the substrate layer and then carrying out a crosslinking reaction. Examples of methods for applying the resin composition for the release layer include a roll coater, a bar coater, a floating knife coater, a die coater, a gravure coater, a curtain coater, and a blade coater.

[0083] The thickness of the release layer is, for example, 0.05 to 0.5 μm, and preferably 0.1 to 0.3 μm.

[0084] Cover film The cover film is used by laminating the adhesive layer 3 to the adhesive layer side of the silicone-containing adsorbent film, such as the silicone-adsorbent film 10a shown in Fig. 2, for the purpose of protecting the adhesive layer until the polishing member is attached. The cover film is preferably a laminated film including a base layer 7 and a release layer 8 laminated on the base layer 7, such as the cover film 30 exemplified in Figs. 4 and 5.

[0085] The material of the base layer in the cover film is the same as that of the base layer in the silicone-adsorbed film. The thickness of the base layer is also the same as that of the base layer in the silicone-adsorbed film. The material of the release layer in the cover film includes a silicone-based release agent, a fluorine-based release agent, etc., and preferably a silicone-based release agent. The thickness of the release layer is, for example, 0.05 to 0.5 μm, preferably 0.1 to 0.3 μm.

[0086] How to use The silicone adsorbent film of the present invention is used to fix a polishing pad by being interposed between the platen S and the polishing member P (polishing pad) of a polishing machine, as shown in FIG. 6, for example. Examples of objects to be polished with the polishing member P include substrate surfaces such as semiconductor wafers, hard disk substrates, and display glass substrates, which are polished in the manufacturing process of semiconductor and electronic components. Because the silicone adsorbent film of the present invention has excellent adsorption properties, it is particularly preferred for use in high-speed polishing. The rotation speed of the polishing platen to which the polishing member is fixed is, for example, 80 to 100 rpm, preferably 85 to 95 rpm, and the rotation speed of the head to which the object to be polished is fixed is, for example, 80 to 100 rpm, preferably 85 to 95 rpm. The polishing platen to which the polishing member is fixed and the head to which the object to be polished are fixed are rotated in the same direction. [Example]

[0087] The present invention will be described in detail below with reference to examples and comparative examples, but the present invention is not limited to the following examples. In each example, "parts" refers to parts by weight unless otherwise specified. The weight-average molecular weight is a polystyrene-equivalent value calculated by measurement using a GPC measuring instrument manufactured by Waters (model number: Waters 410).

[0088] 1. Silicone adsorption film material 1-1. Film for base layer A 50 μm thick polyethylene terephthalate film with plasma treatment on both sides was used. The surface resistance of this polyethylene terephthalate film was 5.1 × 10 11 It was Ω / □.

[0089] 1-2. Crosslinkable composition for silicone adsorption layer A crosslinkable composition for a silicone adsorption layer was prepared with the composition shown in Table 1. The component (a) "crosslinkable organopolysiloxane" was a diorganopolysiloxane with a weight-average molecular weight of 77,844 and containing two or more alkenyl groups per molecule, the component (b) "crosslinking agent" was an organohydrogenpolysiloxane with a weight-average molecular weight of 1,240, the component (c) "non-reactive MQ resin" was a non-reactive MQ resin with a weight-average molecular weight of 175,000, the component (d) "reactive MQ resin" was a reactive MQ resin with a weight-average molecular weight of 6,610, toluene was used as the solvent, and CAT.PL-56 (Shin-Etsu Silicones) was used as the platinum catalyst.

[0090] 1-3. Resin composition for anchor layer A resin composition for an anchor layer having the following composition was prepared. Acrylic polyol resin 20 parts (Toray Fine Chemicals, Cotax (registered trademark) LH455, solid content 50%) Polythiophene 27 parts (Shin-Etsu Polymer, Sepulgida (registered trademark) OC-SC100, solids content 3%) ·MEK 40 copies Toluene 13 parts

[0091] 1-4. Pressure-sensitive adhesive composition A pressure-sensitive adhesive composition having the following composition was prepared. Acrylic copolymer 100.0 parts (Hydroxybutyl acrylate, butyl acrylate copolymer, weight average molecular weight Mw: approx. 500,000, solid content 37%) Hexamethylene diisocyanate 0.05 parts (solids 37.5%)

[0092] 2. Separator material 2-1. Film for base layer A polyethylene terephthalate film with a thickness of 50 μm was used.

[0093] 2-2. Resin composition for release layer A resin composition for a release layer having the following composition was prepared. Fluorosilicone 3.23 parts (Shin-Etsu Chemical Co., Ltd. X-70-201S, solid content 15.00%) Hydrofluoroether (75%) and metaxylene hexafloyd (25%) A total of 10.50 copies 10.50 parts isooctane ·Platinum catalyst CAT.PL-56 0.02 part

[0094] 3.Cover film material 3-1. Film for base layer A polyethylene terephthalate film with a thickness of 50 μm was used.

[0095] 3-2. Resin composition for release layer A silicone-based mold release agent was used.

[0096] 4. Creating a separator The resin composition for the release layer (separator material) was applied to one side of the base layer film (separator material) using a die coater under an environment of 23°C and 50% RH, and then crosslinked at a dryer temperature of 150°C with a residence time of 100 seconds to form a 0.15 μm release layer, producing a separator. This separator corresponds to separator 20a shown in Figure 5.

[0097] 5. Creating the cover film A silicone-based release agent was applied to one side of the base layer film (cover film material) to form a 0.15 μm release layer, producing a cover film. This cover film corresponds to cover film 30 shown in Figures 4 and 5.

[0098] 6. Preparation of silicone adsorption film Example 5 The crosslinkable composition for the silicone adsorption layer was applied to one side of the film for the base layer (material for the silicone adsorption film) using a die coater in an environment of 23°C and 50% RH, and then crosslinked in an oven at 150°C for 100 seconds to form a silicone adsorption layer with the thickness shown in Table 1. In this way, a silicone adsorption film was produced in which a silicone adsorption layer was laminated on a base layer. This silicone adsorption film corresponds to silicone adsorption film 10 shown in Figure 1.

[0099] The two silicone adsorption layer surfaces of silicone adsorption film 10 were faced with the six release layer surfaces of separator 20a, and the films were sandwiched between two rolls (a rubber roll and a metal roll) and bonded together while allowing air to escape, thereby obtaining silicone adsorption film 10 with separator 20a attached.

[0100] The adhesive composition was applied onto the release layer 8 of the cover film 30 using a die coater, and then heated and dried at 100° C. for 2 minutes to form an adhesive layer 3 having a thickness of 50 μm.

[0101] The pressure-sensitive adhesive layer 3 formed on the cover film 30 was placed facing the base layer 1 surface of the separator-attached silicone adsorption film 10, and the films were sandwiched between two rolls (a rubber roll and a metal roll) and laminated together while allowing air to escape. This resulted in a silicone adsorption film 10a further laminated with the pressure-sensitive adhesive layer 3. This silicone adsorption film 10a has a separator 20a laminated on the silicone adsorption layer 2 side and a cover film 30 laminated on the pressure-sensitive adhesive layer 3 side (see FIG. 5).

[0102] (Examples 1 to 4 and 6 to 9, and Comparative Examples 1 to 3) A resin composition for the anchor layer was applied to one side of a film for the base layer (a material for the silicone adsorption film) using a gravure coater and dried to form an anchor layer with a thickness of 2 μm. A crosslinkable composition for the silicone adsorption layer was applied to the formed anchor layer using a die coater in an environment of 23°C and 50% RH, and then crosslinked in an oven at 150°C for 100 seconds to form a silicone adsorption layer with the thickness shown in Table 1. This produced a silicone adsorption film in which the silicone adsorption layer was laminated on the base layer via the anchor layer. This silicone adsorption film corresponds to silicone adsorption film 10b shown in FIG. 3.

[0103] The two silicone adsorption layer surfaces of silicone adsorption film 10b were faced to the six release layer surfaces of separator 20a, and the films were sandwiched between two rolls (a rubber roll and a metal roll) and bonded together while allowing air to escape, thereby obtaining silicone adsorption film 10b with separator 20a.

[0104] The adhesive composition was applied onto the release layer 8 of the cover film 30 using a die coater, and then heated and dried at 100° C. for 2 minutes to form an adhesive layer 3 having a thickness of 50 μm.

[0105] The pressure-sensitive adhesive layer 3 formed on the cover film 30 was placed facing the base layer 1 surface of the silicone-adsorbing film 10b with separator 20a, and the films were sandwiched between two rolls (a rubber roll and a metal roll) and bonded together while allowing air to escape. This resulted in a silicone-adsorbing film in which the pressure-sensitive adhesive layer 3 was further laminated on the silicone-adsorbing film 10b. This silicone-adsorbing film has separator 20a laminated on the silicone-adsorbing layer 2 side and cover film 30 laminated on the pressure-sensitive adhesive layer 3 side.

[0106] 7. Measurement of storage modulus of silicone adsorption layer The crosslinkable composition for the silicone adsorption layer was applied to one side of a 50 μm-thick fluororesin sheet using a die coater at 23°C and 50% RH, followed by crosslinking in an oven at 150°C for 100 seconds to form a 50 μm-thick silicone adsorption layer. The resulting silicone adsorption layer was peeled off from the fluororesin sheet to prepare a test piece for viscoelasticity measurement. Using a viscoelasticity tester (manufactured by Rheology Inc., product name: MR-300), the test piece was sandwiched between parallel disks in the measuring section of the tester, and the storage modulus (G') was measured at a frequency of 1 Hz and 23°C. The measurement results are shown in Table 1.

[0107] 8. Evaluation of silicone adsorption film 8-1.Adsorption property The cover film was peeled off to expose the adhesive layer of the silicone adsorption film, and the separator was peeled off to expose the silicone adsorption layer of the silicone adsorption film.As illustrated in Figure 6, the silicone adsorption film was interposed between the polishing pad and the platen of the polishing apparatus so that the adhesive layer 3 side faced the polishing pad P and the silicone adsorption layer 2 side faced the platen S of the polishing apparatus, and the polishing pad was fixed to the platen of the polishing apparatus.

[0108] Using the polishing apparatus equipped with the polishing pad described above, 10 workpieces were polished at high speed under the following polishing conditions. Polishing equipment: Ebara Corporation FREX 300E Polishing pad: IC1000 / SUBA400 (Nitta Haas) Polishing pressure: 2.0 psi (1 psi = 6894.76 Pa, same below) Polishing platen rotation speed: 90 rpm Head rotation speed: 91 rpm Supply of polishing composition: free-flowing Polishing composition: Silica slurry 5% aqueous solution Polished object: silicon wafer (φ300mm) Polishing composition supply amount: 300ml / min Polishing time: 10 minutes

[0109] After polishing, the silicone adsorption layer of the silicone adsorption film used to secure the polishing pad was visually inspected for peeling, and the adsorptive properties were evaluated according to the following criteria. The results are shown in Table 1. ◎: The silicone adsorption layer does not peel off and has excellent adsorption properties suitable for high-speed polishing. ○: There is some peeling at the edge of the silicone adsorption layer, but this does not pose a problem in practical use for high-speed polishing. ×: The silicone adsorption layer peels off, and the product is not suitable for practical use in high-speed polishing.

[0110] 8-2. Residual adhesive suppression The silicone adsorption film 10 with separator 20a and the silicone adsorption film 10b with separator 20a were cut into a shape of 100 mm long x 25 mm wide to prepare evaluation samples. The separator 20a was peeled off from the sample in a 23°C, 50% RH environment, and the exposed surface of the silicone adsorption layer 2 was attached to a polished stainless steel plate (SUS plate). The plate was pressed against the surface with a 2 kg roller, and the plate was left for 24 hours in a 23°C atmosphere. The film was then peeled off at a peel angle of 180° and a peel speed of 300 mm / min using a tensile tester. The presence or absence of adhesive residue on the SUS plate surface was visually inspected and evaluated according to the following criteria. The evaluation results are shown in Table 1. ◎: No adhesive residue was observed on the SUS plate, demonstrating excellent reworkability. ○: There is only a small amount of adhesive remaining on the SUS plate, and the reworkability itself is good and there are no practical problems. ×: Significant adhesive residue on the SUS plate, not suitable for practical use

[0111] 8-3.Easy peelability A silicone adsorption film was prepared by laminating a silicone adsorption layer on a 100 μm-thick polyester film via the anchor layer. This silicone adsorption film was then cut into a 100 mm long x 25 mm wide shape to serve as an evaluation sample. The silicone adsorption layer of the evaluation sample was attached to a 2 mm-thick polished stainless steel plate (SUS plate), pressed with a 2 kg roller back and forth once, and left for 24 hours in a 23°C atmosphere. Next, using a tensile tester, the sample was peeled at a peel angle of 180° and a peel speed of 1200 mm / min, and the peel strength (mN / 25 mm) from the stainless steel plate was measured. The measurement results are shown in Table 1. Based on the measurement results, the adhesives were classified into three categories, in order of ease of peeling: "++++" (less than 100mN / 25mm), "+++" (100mN / 25mm or more but less than 800mN / 25mm), "++" (800mN / 25mm or more but less than 2200mN / 25mm), "+" (2200mN / 25mm or more but less than 5000mN / 25mm), and "-" (5000mN / 25mm or more). The evaluation results are shown in Table 1.

[0112] [Table 1]

[0113] As shown in Table 1, in a silicone adsorption film comprising a base layer and a silicone adsorption layer laminated on the base layer, wherein the silicone adsorption layer is a cured product of a crosslinkable composition comprising (a) a crosslinkable organopolysiloxane and (b) a crosslinking agent, when the crosslinkable composition does not contain either or both of (c) a non-reactive MQ resin and (d) a reactive MQ resin (Comparative Examples 1 to 3), the silicone adsorption layer in the silicone adsorption film cannot achieve both adsorption properties and adhesive transfer suppression properties. However, when the crosslinkable composition contains both (c) a non-reactive MQ resin and (d) a reactive MQ resin (Examples 1 to 9), the silicone adsorption layer in the silicone adsorption film can achieve both adsorption properties and adhesive transfer suppression properties. [Explanation of symbols]

[0114] 10, 10a, 10b...Silicone adsorption film 1...Base material layer 2...Silicone adsorption layer 3...Adhesive layer 4...Anchor layer 20, 20a...Separator 5...Base material layer 6…Release layer 30...Cover film 7…Base material layer 8…Release layer S...Surface plate P... Polishing material (polishing pad)

Claims

1. A substrate layer and a silicone adsorption layer laminated on the substrate layer, the silicone adsorption layer is a cured product of a crosslinkable composition containing (a) a crosslinkable organopolysiloxane, (b) a crosslinking agent, (c) a non-reactive MQ resin, and (d) a reactive MQ resin; the component (c) is contained in an amount of 43 to 100 parts by weight and the component (d) is contained in an amount of 1.1 to 10.6 parts by weight per 100 parts by weight of the total amount of the component (a) and the component (b); The content of the component (b) is an amount such that the amount of hydrogen atoms in the component (b) is 0.5 to 4 moles per mole of the component (a), The thickness of the silicone adsorption layer is 10 to 50 μm, A silicone adsorption film is used to fix the silicone adsorption layer to the platen of a polishing apparatus and to fix a polishing pad to the substrate layer side.

2. The silicone-adsorbent film according to claim 1 , wherein the material of the substrate layer is polyethylene terephthalate.

3. 3. The silicone-adsorbent film according to claim 1, wherein said component (a) is a diorganopolysiloxane containing two or more alkenyl groups in one molecule.

4. The silicone-adsorbent film according to any one of claims 1 to 3, wherein the component (b) is an organohydrogenpolysiloxane.

5. 5. The silicone adsorption film according to claim 1, wherein the silicone adsorption layer has a thickness of 15 to 30 μm.

6. The storage modulus of the silicone adsorption layer at a frequency of 1 Hz is 5×10 4 ~15 x 10 4 The silicone-adsorbent film according to any one of claims 1 to 5, wherein Pa.

7. The silicone-adsorption film according to any one of claims 1 to 6, which comprises an anchor layer between the base material layer and the silicone adsorption layer, and the anchor layer is selected from the group consisting of polyester-based resins, acrylic-based resins, and urethane-based resins.

Images