Pattern fuse and its manufacturing method

Abstract

The present invention relates to a pattern fuse and a manufacturing method thereof, and more particularly to a pattern fuse including a lower film layer, an adhesive layer laminated on an upper portion of the lower film layer, a circuit pattern formed of a conductive material and provided on an upper portion of the adhesive layer, an upper film layer laminated on the adhesive layer and on an upper portion of the circuit pattern, the upper film layer having an opening formed therein so that a part or all of the circuit pattern is exposed, and a coating layer covering the opening of the upper film layer, the coating layer including a flame retardant material.

Description

[Technical Field]

[0001] This application claims the benefit of priority based on Korean Patent Application No. 2021-0145980 filed on October 28, 2021, Korean Patent Application No. 2021-0149435 filed on November 3, 2021, Korean Patent Application No. 2021-0150061 filed on November 3, 2021, and Korean Patent Application No. 2022-0125697 filed on September 30, 2022, and all contents disclosed in the documents of those Korean patent applications are incorporated herein by reference.

[0002] The present invention relates to a pattern fuse and a manufacturing method thereof, and more particularly to a pattern fuse that can prevent ignition due to heat generated during operation of a circuit pattern and can induce disconnection at a specific position of the circuit pattern, and a manufacturing method thereof. [Background technology]

[0003] As technological developments and demand for mobile devices such as smartphones, notebook PCs, and digital cameras increase, research into rechargeable secondary battery technology is gaining momentum. Secondary batteries are an alternative energy source to fossil fuels, which generate air pollutants, and are used in electric vehicles (EVs), hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (P-HEVs), and energy storage devices (ESSs).

[0004] Currently widely used types of secondary batteries include lithium-ion batteries, lithium polymer batteries, nickel-cadmium batteries, nickel-metal hydride batteries, and nickel-zinc batteries. A battery module can be constructed by connecting a plurality of such unit secondary battery cells in series or parallel depending on the required output voltage or charge / discharge capacity. It is common to manufacture a battery pack by adding additional components using at least one battery module.

[0005] Various circuit boards may be applied to such a battery pack as needed, such as a protection circuit module (PCM) board that can control charging and discharging of battery cells or protect the battery cells, and a sensing board for sensing voltage, etc.

[0006] Such circuit boards generally include fuse elements to prevent fires or explosions of the battery pack due to overcurrent or short-circuit current, and the fuse elements include SMD fuses and pattern fuses.

[0007] FIG. 1 is an exploded perspective view of a battery pack including a circuit board on which a pattern fuse is formed according to the prior art.

[0008] According to FIG. 1 of Patent Document 1 (Korean Patent Publication No. 2020-0129461), a fuse pattern having the function of interrupting overcurrent or short-circuit current is formed on a circuit board instead of a fuse element.

[0009] That is, in a battery pack including a plurality of battery cells C1, C2, and C3, a connection circuit board 20 is interposed between a main circuit board 30 and the battery cells C, and the connection circuit board 20 is provided with a conductive pattern L including a fuse pattern F and a connection pattern N.

[0010] The fuse pattern F is located between the electrode tab 22 and the main circuit board 30, which has the advantage of eliminating the need for a separate fuse element or space for a fuse element. However, the conductive pattern is generally made of a metal such as copper, which has a very high melting point (the melting point of copper is approximately 1085°C), and can generate very high heat and sparks momentarily when the fuse pattern is activated.

[0011] However, the pattern fuse of Patent Document 1 has a conductive pattern embedded in an insulating film, and there is a risk that the insulating film may catch fire at temperatures high enough to activate the pattern fuse.

[0012] On the other hand, a typical pattern fuse is manufactured by applying an adhesive to a lower film, laminating a thermally conductive metal layer on the adhesive, laminating an upper film on the metal layer, and then applying a coating agent to the upper film.

[0013] Therefore, when the temperature reaches a level high enough to activate the pattern fuse, the circuit pattern will break, but it is difficult to accurately predict the location of the break in the circuit pattern, making it difficult to ensure operational reliability. [Prior art documents] [Patent documents]

[0014] [Patent Document 1] Korean Patent Publication No. 2020-0129461 Summary of the Invention [Problem to be solved by the invention]

[0015] SUMMARY OF THE INVENTION In order to solve the above problems, an object of the present invention is to provide a pattern fuse that can prevent ignition due to heat generated during operation of a circuit pattern, and a method for manufacturing the same.

[0016] Another object of the present invention is to provide a pattern fuse that can induce disconnection at a desired position on a circuit pattern when an overcurrent occurs, and a method for manufacturing the same. [Means for solving the problem]

[0017] To achieve this object, the pattern fuse according to the present invention comprises a lower film layer (100), an adhesive layer (200) laminated on the upper side of the lower film layer (100), a circuit pattern (300) formed of a conductive material and provided on the upper side of the adhesive layer (200), an upper film layer (400) laminated on the upper side of the adhesive layer (200) and the circuit pattern (300), and having an opening (410) formed therein so that part or all of the circuit pattern (300) is exposed, and a coating layer (500) covering the opening (410) of the upper film layer (400), wherein the coating layer (500) contains a flame retardant material.

[0018] In the pattern fuse of the present invention, the flame-retardant material is a flame-retardant material having a flame-retardant rating of V-0 based on the UL94 standard.

[0019] In the pattern fuse of the present invention, the flame-retardant material contains an inorganic filler.

[0020] In addition, in the pattern fuse of the present invention, the coating layer (500) is made of a material having a lower thermal conductivity than the upper film layer (400).

[0021] In the pattern fuse of the present invention, the coating layer (500) is made of polyurethane or urethane-based material.

[0022] In addition, in the pattern fuse of the present invention, the lower film layer (100) or the upper film layer (400) is characterized by including at least one of polyimide (PI), polyethylene naphthalate (PEN), and polyethylene terephthalate (PET).

[0023] In addition, in the pattern fuse of the present invention, the circuit pattern (300) is characterized by comprising a pair of first metal wires (310) facing each other, one side of which is located under the upper film layer (400) and the other side of which is located in the opening (410), and a second metal wire (320) electrically connecting the pair of first metal wires (310).

[0024] In the pattern fuse of the present invention, the first metal wire (310) is made of copper, and the second metal wire (320) is made of a metal having a melting point lower than that of copper.

[0025] In the pattern fuse of the present invention, the first metal wire (310) is made of copper, and the second metal wire (320) is made of a metal having a higher resistivity than copper.

[0026] In the pattern fuse of the present invention, the first metal wire (310) is made of copper, and the second metal wire (320) is made of aluminum, tin, or indium.

[0027] The present invention is also characterized by a circuit board including the above-mentioned pattern fuse.

[0028] The present invention is also characterized by a battery module including the circuit board described above.

[0029] The present invention is also characterized by a battery pack including the above-mentioned battery module.

[0030] In addition, the method for manufacturing a pattern fuse according to the present invention includes a first step of preparing a lower film layer (100), a second step of forming an adhesive layer (200) on top of the lower film layer (100), a third step of placing a circuit pattern (300) on top of the adhesive layer (200), a fourth step of laminating an upper film layer (400) having an opening (410), and a fifth step of forming a coating layer (500) to cover the opening (410), wherein the coating layer (500) contains a flame-retardant material.

[0031] In addition, in the method for manufacturing a pattern fuse according to the present invention, the coating layer (500) is made of a material having a lower thermal conductivity than the upper film layer (400).

[0032] In addition, in the method for manufacturing a pattern fuse according to the present invention, the coating layer (500) is made of polyurethane or a urethane-based material, and the lower film layer (100) or the upper film layer (400) includes at least one of polyimide (PI), polyethylene naphthalate (PEN), and polyethylene terephthalate (PET).

[0033] In the method for manufacturing a pattern fuse according to the present invention, the flame-retardant material is polyurethane or a urethane-based material. [Effects of the Invention]

[0034] According to the pattern fuse and its manufacturing method of the present invention, a coating layer containing a flame-retardant material is provided on the circuit pattern, which has the advantage of preventing fire even when heated to a high temperature by the operation of the pattern fuse.

[0035] Furthermore, according to the pattern fuse and the manufacturing method thereof of the present invention, by providing a coating layer containing a low heat-absorbing material on a predetermined region of the circuit pattern, when the pattern fuse is activated, the circuit pattern in the area in contact with the low heat-absorbing coating layer can be selectively disconnected, thereby providing the advantage of improving operational reliability.

[0036] Furthermore, according to the pattern fuse and its manufacturing method of the present invention, since the circuit pattern is made of different metals with different melting points or resistivities, there is an advantage in that the location of the disconnection can be controlled more accurately when the pattern fuse is activated.

[0037] Furthermore, when the pattern fuse of the present invention is mounted on a circuit board, the process of mounting a fuse blowout indicator can be omitted, which contributes to improving the efficiency of the circuit board manufacturing process. [Brief explanation of the drawings]

[0038] [Figure 1] 1 is an exploded perspective view of a battery pack including a circuit board on which a fuse pattern is formed according to the prior art; [Figure 2] 1 is an exploded perspective view schematically showing a pattern fuse according to a first preferred embodiment of the present invention; [Figure 3] FIG. 3 is a cross-sectional view taken along line AA' in FIG. 2. [Figure 4] FIG. 4 is a diagram illustrating a configuration in which a coating layer is provided in the cross-sectional view of FIG. [Figure 5] FIG. 10 is an exploded perspective view schematically showing a pattern fuse according to a second preferred embodiment of the present invention. [Figure 6] FIG. 10 is an exploded perspective view schematically showing a pattern fuse according to a third preferred embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0039] In this application, the terms "comprises," "has," or "has" are intended to specify the presence of features, numbers, steps, components, parts, or combinations thereof described in the specification, but should be understood as not precluding the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0040] Furthermore, the same reference numerals are used throughout the drawings for parts having similar functions and actions. Throughout the specification, when a part is said to be connected to another part, this includes not only a direct connection but also an indirect connection via another element therebetween. Furthermore, unless otherwise specified, "including a certain element" does not mean that other elements are excluded, but that other elements may also be included.

[0041] The patterned juice according to the present invention will now be described with reference to the accompanying drawings.

[0042] FIG. 2 is an exploded perspective view showing a pattern fuse according to a first preferred embodiment of the present invention, FIG. 3 is a cross-sectional view taken along line A-A' in FIG. 2, and FIG. 4 is a view for explaining a configuration in which a coating layer is provided in the cross-sectional view of FIG. 3.

[0043] Referring to FIGS. 2 to 4, the pattern fuse of the present invention may include a lower film layer 100 , an adhesive layer 200 , a circuit pattern 300 , an upper film layer 400 , and a coating layer 500 .

[0044] First, the lower film layer 100 is a layer that serves to insulate the conductive circuit pattern 300 from the outside, and may be made of various known insulating polymer materials.

[0045] In particular, materials such as polyimide (PI), polyethylene naphthalate (PEN), and polyethylene terephthalate (PET), which have excellent thermal properties, are preferred as materials for the lower film layer 100, and among these, polyimide (PI) is the most preferred in terms of thermal properties.

[0046] The adhesive layer 200 located on the upper side of the lower film layer 100 is a layer for attaching the circuit pattern 300 to the lower film layer 100, and the material thereof is not particularly limited as long as the circuit pattern 300 can be attached thereto.

[0047] Here, the circuit pattern 300 is fixed to the upper surface of the lower film layer 100 via the adhesive layer 200, and a portion of the circuit pattern 300 may be slightly recessed into the adhesive layer 200.

[0048] The circuit pattern 300 is made of a conductive material such as copper and is designed to be advantageous for heat generation, and is not limited to the meandering waveform shown in FIG. 2, but can be formed in various known shapes.

[0049] The circuit pattern 300 may be made of the same material as a pair of conductive wires (not shown) connected to both sides of the circuit pattern 300, or may be made of a different material having a lower melting point than the conductive wires on both sides.

[0050] Of course, the thickness of the circuit pattern 300 and the conductors on both sides, the length of the circuit pattern 300, etc. can be appropriately designed depending on the operating conditions of the pattern fuse.

[0051] Next, we will explain the upper film layer 400. Like the lower film layer 100 described above, the upper film layer 400 performs an insulating function against the outside, and therefore may be made of the same material as the lower film layer 100, but is not limited thereto and may be made of various insulating polymer materials.

[0052] 2, an opening 410 is formed in the center of the upper film layer 400 so that the entire circuit pattern 300 is exposed. Of course, it is clear that only a portion of the circuit pattern 300 can be exposed.

[0053] The opening 410 is covered with a coating layer 500, more specifically, a coating layer containing a flame-retardant material, in order to prevent fires caused by heat generation or sparks from the circuit pattern 300.

[0054] As mentioned above, when a pattern fuse is activated, the temperature rises enough to melt the material that makes up the circuit pattern 300. However, the film layer that covers the circuit pattern 300 generally has poor flame retardancy, which often leads to fires.

[0055] Of course, it is possible to use a material with excellent flame retardancy as the film layer covering the circuit pattern, but this would increase costs since it would have to be applied to areas where there are no circuit patterns.

[0056] Here, it is preferable to use a material for the coating layer that has electrical insulation properties and is flame-retardant with a V-0 rating according to the UL94V test standard, which is one of the flame-retardant tests for plastic materials.

[0057] The UL94V test evaluates the burning behavior of a plastic product and the degree of flame radiation to the surrounding area when a spark is applied vertically to the product. Depending on factors such as burning time, the product can be classified into V-0, V-1, and V-2 grades, with V-0 being the most flame-retardant grade.

[0058] Here, the flame-retardant material refers to a material in which flame retardancy is enhanced by adding a flame retardant and various additives to a polymer resin composition.

[0059] Polymer resins that can serve as such flame retardant materials include various known materials such as polyurethane, urethane, epoxy, and acrylic.

[0060] Of course, the flame retardant material forming the coating layer may further contain various additives that are commonly contained, for example, inorganic fillers such as glass fiber or spherical silica, either alone or in combination, to improve flame retardancy.

[0061] On the other hand, if the area of ​​the coating layer 500 is smaller than the opening 410, it will not be possible to completely block the underlying circuit pattern 300 from the outside. Therefore, it is preferable that the area of ​​the coating layer 500 be the same as that of the opening 410 so as to cover only the opening 410, and more preferably, it is slightly larger than the opening 410 so as to overlap with part of the edge of the opening 410, including the opening 410.

[0062] 5 is an exploded perspective view showing a pattern fuse according to a second preferred embodiment of the present invention. Since the remaining structure, excluding the circuit pattern and coating layer, is the same as that of the first embodiment, only these different structures will be described below.

[0063] In the second embodiment of the present invention, it is possible to artificially control a specific portion of the circuit pattern 300, i.e., the position where the circuit pattern 300 is to be broken. That is, as shown in Fig. 5, it is possible to induce a break in the circuit pattern 300 located in a portion of the upper film layer 400, more specifically, in an opening 410 in the upper film layer 400, which is an area covered by the coating layer 500.

[0064] When the pattern fuse is activated, the temperature rises enough to melt the material that makes up the circuit pattern 300. In this case, by appropriately adjusting the material of the coating layer 500, the circuit pattern 300 located in the opening 410 can melt first and break.

[0065] In other words, the circuit pattern 300 generates heat during operation. In this case, by reducing the heat absorption and thermal conductivity of the coating layer 500 covering the circuit pattern 300, the circuit pattern 300 can be quickly disconnected, thereby quickly interrupting the overcurrent.

[0066] The coating layer 500 that performs the above functions is preferably made of an electrically insulating material having low heat absorption and low thermal conductivity.

[0067] The low heat absorption material means a material with low heat absorption. Various known low heat absorption materials can be used as such a low heat absorption material, but it is preferable that the low heat absorption material has lower heat absorption and thermal conductivity than polyimide (PI), polyethylene naphthalate (PEN), or polyethylene terephthalate (PET), which are suitable materials for the lower film layer 100 or the upper film layer 400.

[0068] Specifically, it may be polyurethane, urethane, epoxy, acrylic, etc. In particular, materials that mainly contain urethane, polyurethane, or a mixture of polyurethane and polyacrylic, which have low heat absorption and thermal conductivity, are preferred, and the thermal conductivity is more preferably 0.10 W / mK or less, and most preferably 0.05 W / mK or less.

[0069] According to the second embodiment, the disconnection location can be adjusted to a constant value, which has the advantage of improving the operational reliability of the fuse. That is, the thermal conductivity characteristics may differ depending on the location of the pattern fuse, such as the left, middle, or right side. Therefore, the cutoff operation time in the event of an overcurrent may vary depending on the location of the disconnection.

[0070] This ultimately means that the operating characteristics are inconsistent, which inevitably reduces the reliability of the fuse, but the pattern fuse of the present invention can be induced to always open at the same position, which can contribute to improving operational reliability.

[0071] Meanwhile, when the coating layer 500 is pre-fabricated in the form of a film, it is preferable to incorporate air into the film. For example, the air can be formed by a foaming method such as a melt foaming method, a mold foaming method, or a solid phase foaming method.

[0072] 6 is an exploded perspective view showing a pattern fuse according to a third preferred embodiment of the present invention. Since the remaining configuration, excluding the circuit pattern, is the same as that of the second embodiment described above, only the different configurations will be described below.

[0073] The circuit pattern 300 according to the third embodiment of the present invention may include a first metal line 310 and a second metal line 320. Specifically, the pair of first metal lines 310 face each other, with one side of the first metal line 310 positioned under the upper film layer 400 and the other side positioned in the opening 410. The second metal line 320 electrically connects the pair of first metal lines 310.

[0074] Here, the first metal wire 310 may be made of copper, and the second metal wire 320 may be made of a metal having a lower melting point than copper. Alternatively, the first metal wire 310 may be made of copper, and the second metal wire 320 may be made of a metal having a higher resistivity than copper. More specifically, the first metal wire 310 may be made of copper, and the second metal wire 320 may be made of aluminum, tin, or indium.

[0075] If the first metal wire 310 and the second metal wire 320 correspond to any one of the above, when the pattern fuse is activated, the second metal wire 320 melts first or the connection between the first metal wire 310 and the second metal wire 320 breaks, thereby cutting off the current.

[0076] Of course, by adjusting the length or thickness of the first metal wire 310 and the second metal wire 320, the melting point or the time point at which the wire breaks can be further adjusted.

[0077] Next, a method for manufacturing the pattern fuse of the present invention will be described.

[0078] The method for manufacturing the above-mentioned pattern fuse includes a first step of preparing a lower film layer 100, a second step of forming an adhesive layer 200 on top of the lower film layer 100, a third step of placing a circuit pattern 300 on top of the adhesive layer 200, a fourth step of laminating an upper film layer 400 having an opening 410, and a fifth step of forming a coating layer 500.

[0079] Meanwhile, the circuit pattern 300 can be prepared in advance in a desired shape and placed on the adhesive layer 200, or can be directly formed in a desired shape on the adhesive layer 200.

[0080] In addition, in the fourth step of laminating the upper film layer 400, it is possible to laminate the upper film layer 400 on top of the adhesive layer 200 on which the circuit pattern 300 is seated, and then remove the area corresponding to the opening 410 so that part of the circuit pattern 300 is exposed, but it is more preferable to laminate the upper film layer 400 with the opening 410 already formed in it.

[0081] In the fifth step of forming the coating layer 500 on the opening 410, a flame-retardant material, a low heat-absorbing material, or a material having low heat-absorbing properties and low thermal conductivity may be applied to the opening 410 and cured to form the coating layer 500. Of course, it is also possible to prepare a thin-film coating layer 500 containing these materials and then laminate it to cover the opening 410.

[0082] Here, as described above, the material constituting the coating layer 500 may be polyurethane, urethane, epoxy, acrylic, a mixture of polyurethane and polyacrylic, etc. Also, the lower film layer 100 and the upper film layer 400 may be made of polyimide, polyethylene naphthalate, or polyethylene terephthalate.

[0083] The above-mentioned pattern fuse can be formed at a predetermined position on a circuit board such as a PCB (Printed Circuit Board) or an FPCB (Flexible PCB) by the above-mentioned process.

[0084] Of course, when forming a pattern fuse on a circuit board, in some cases, the circuit pattern 300 can be formed directly on the board without forming part or all of the lower film layer 100 or adhesive layer 200.

[0085] Meanwhile, the present invention can provide a circuit board having the above-described pattern fuse formed thereon, and a battery module or battery pack having the above-described circuit board mounted thereon, and these battery modules or battery packs can be used in various devices.

[0086] Although specific portions of the contents of the present invention have been described in detail above, it will be apparent to those skilled in the art that such specific techniques are merely preferred embodiments and do not limit the scope of the present invention. It is obvious to those skilled in the art that various changes and modifications are possible within the scope and technical idea of ​​the present invention, and it goes without saying that such changes and modifications also fall within the scope of the accompanying claims. [Explanation of symbols]

[0087] 100 Bottom Film Layer 200 Adhesive layer 300 Circuit Patterns 310 First Metal Wire 320 Second metal wire 400 Top Film Layer 410 Opening 500 coating layers

Claims

1. a lower film layer; an adhesive layer laminated on the upper part of the lower film layer; a circuit pattern formed on the adhesive layer and made of a conductive material; an upper film layer laminated on the adhesive layer and the circuit pattern, the upper film layer having an opening formed therein so that a portion of the circuit pattern is exposed; a coating layer covering the opening of the upper film layer, the coating layer includes a low heat absorption material having a lower heat absorption property than the lower film layer and the upper film layer, and includes a protrusion extending toward the opening, When the circuit pattern generates heat during operation and the pattern fuse is activated, the portion of the circuit pattern opens earlier than the other portions.

2. A pattern fuse as described in claim 1, wherein the coating layer includes a flame-retardant material.

3. 3. The pattern fuse according to claim 2, wherein the flame retardant material is a flame retardant material with a flame retardancy rating of V-0 based on the UL94 standard.

4. The pattern fuse of claim 3 , wherein the flame-retardant material includes an inorganic filler.

5. The pattern fuse according to claim 1 , wherein the coating layer is made of a material having a lower thermal conductivity than the upper film layer.

6. The pattern fuse according to claim 5 , wherein the coating layer is made of polyurethane or a urethane-based material.

7. 7. The pattern fuse of claim 6, wherein the lower film layer or the upper film layer includes at least one of polyimide (PI), polyethylene naphthalate (PEN), and polyethylene terephthalate (PET).

8. 2. The pattern fuse of claim 1, wherein the circuit pattern includes a pair of first metal lines facing each other, one side of which is located under the upper film layer and the other side of which is located in the opening, and a second metal line electrically connecting the pair of first metal lines.

9. 9. The pattern fuse according to claim 8, wherein the first metal wire is made of copper, and the second metal wire is made of a metal having a melting point lower than that of copper.

10. 9. The pattern fuse according to claim 8, wherein the first metal wire is made of copper, and the second metal wire is made of a metal having a resistivity higher than that of copper.

11. 9. The pattern fuse of claim 8, wherein the first metal wire is made of copper, and the second metal wire is made of aluminum, tin, or indium.

12. The pattern fuse according to claim 1 , wherein the protrusion directly abuts the circuit pattern.

13. A lower film layer; an adhesive layer laminated on the upper part of the lower film layer; a circuit pattern formed on the adhesive layer and made of a conductive material; an upper film layer laminated on the adhesive layer and the circuit pattern, the upper film layer having an opening formed therein so that a portion of the circuit pattern is exposed; a coating layer covering the opening of the upper film layer, the coating layer includes a low heat absorption material having a lower heat absorption property than the lower film layer and the upper film layer, and includes a protrusion extending toward the opening, the circuit pattern includes a pair of first metal lines facing each other, one side of which is located under the upper film layer and the other side of which is located in the opening, and a second metal line electrically connecting the pair of first metal lines and included in the portion of the circuit pattern, the first metal wire is made of copper and the second metal wire is made of a metal having a lower melting point than copper, or the first metal wire is made of copper and the second metal wire is made of a metal having a higher resistivity than copper, A pattern fuse in which, when the circuit pattern generates heat during operation and the pattern fuse operates, the second metal wire or the connecting part between the first metal wire and the second metal wire opens earlier than other parts.

14. A circuit board comprising the pattern fuse of any one of claims 1 to 13.

15. A battery module comprising the circuit board of claim 14.

16. A battery pack comprising the battery module according to claim 15.

17. A method for manufacturing the pattern fuse of any one of claims 1 to 13, comprising the steps of: a first step of providing a bottom film layer; a second step of forming an adhesive layer on the upper surface of the lower film layer; a third step of placing a circuit pattern on top of the adhesive layer; a fourth step of laminating an apertured top film layer; and a fifth step of forming a coating layer to cover the opening. The method for manufacturing a pattern fuse, wherein the coating layer includes a flame retardant material.

18. The method for manufacturing a pattern fuse according to claim 17 , wherein the coating layer is made of a material having a lower thermal conductivity than the upper film layer.

19. 18. The method for manufacturing a pattern fuse according to claim 17, wherein the coating layer is made of a polyurethane or urethane-based material, and the lower film layer or the upper film layer includes at least one of polyimide (PI), polyethylene naphthalate (PEN), and polyethylene terephthalate (PET).

20. The method for manufacturing a pattern fuse according to claim 17, wherein the flame-retardant material is a polyurethane or urethane-based material.

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