Liquid ejection head and recording apparatus

Abstract

This liquid ejection head comprises a first flow passage member, a second flow passage member, a drive IC, and a heat dissipation plate. The first flow passage member ejects a liquid. The second flow passage member supplies the liquid to the first flow passage member. The drive IC controls the ejection of the liquid. The drive IC is in contact with the heat dissipation plate. The second flow passage member has a notch section which accommodates the heat dissipation plate.

Description

[Technical Field]

[0001] The disclosed embodiments relate to a liquid ejection head and a recording apparatus. [Background technology]

[0002] 2. Description of the Related Art Known printing devices include inkjet printers and inkjet plotters that use an inkjet recording method. Such inkjet printing devices are equipped with a liquid ejection head for ejecting liquid.

[0003] Among such liquid ejection heads, there is known one in which a heat sink is brought into contact with a drive IC, which is a heat source, and heat transferred from the drive IC is dissipated via the heat sink. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-97661 [Patent Document 2] Japanese Patent Application Laid-Open No. 2008-87231 Summary of the Invention

[0005] A liquid ejection head according to one aspect of the embodiment includes a first flow path member, a second flow path member, a driving IC, and a heat sink. The first flow path member ejects liquid. The second flow path member supplies the liquid to the first flow path member. The driving IC controls the ejection of the liquid. The driving IC contacts the heat sink. The second flow path member has a cutout portion that accommodates the heat sink. [Brief explanation of the drawings]

[0006] [Figure 1] FIG. 1 is a front view that schematically shows the front of a printer according to an embodiment. [Figure 2] FIG. 2 is a plan view that schematically shows a general plane of the printer according to the embodiment. [Figure 3] FIG. 3 is a perspective view showing an example of a schematic configuration of the liquid ejection head according to the first embodiment. [Figure 4] FIG. 4 is a perspective view showing an example of a schematic configuration of the second flow path member according to the first embodiment. [Figure 5] FIG. 5 is a partially enlarged perspective view of the liquid ejection head shown in FIG. [Figure 6] FIG. 6 is a cross-sectional view showing an example of a liquid ejection head according to the first embodiment. [Figure 7] FIG. 7 is a cross-sectional view showing another example of the liquid ejection head according to the first embodiment. [Figure 8] FIG. 8 is a plan view showing an example of a schematic configuration of a heat sink included in a liquid ejection head according to the second embodiment. [Figure 9] FIG. 9 is a perspective view showing an example of a schematic configuration of a partially enlarged liquid ejection head according to the second embodiment. [Figure 10] FIG. 10 is a plan view showing an example of a schematic configuration of a heat sink and a heat insulating member included in a liquid ejection head according to a third embodiment. [Figure 11] FIG. 11 is a perspective view showing an example of a schematic configuration of a partially enlarged liquid ejection head according to the third embodiment. [Figure 12] FIG. 12 is a perspective view showing an example of a heat insulating member included in the liquid ejection head according to the third embodiment. [Figure 13] FIG. 13 is a perspective view showing an example of a heat insulating member included in the liquid ejection head according to the third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0007] The liquid ejection head described above has room for further improvement, for example, in terms of improving heat dissipation.

[0008] Therefore, there is a need to provide a liquid ejection head and a recording apparatus with high heat dissipation properties.

[0009] Hereinafter, embodiments of a liquid ejection head and a recording apparatus disclosed in the present application will be described with reference to the accompanying drawings. Note that the present disclosure is not limited to the embodiments described below. It should be noted that the drawings are schematic, and the dimensional relationships and ratios of elements may differ from reality. Furthermore, the dimensional relationships and ratios may differ between the drawings.

[0010] Furthermore, in the following embodiments, expressions such as "constant," "orthogonal," "perpendicular," or "parallel" may be used, but these expressions do not necessarily mean "constant," "orthogonal," "perpendicular," or "parallel" in the strict sense. In other words, the above expressions allow for deviations due to, for example, manufacturing precision, installation precision, etc.

[0011] Furthermore, the embodiments can be combined as appropriate within the scope of not causing any contradiction in the processing content. Furthermore, the same components in the following embodiments are denoted by the same reference numerals, and redundant explanations will be omitted.

[0012] [Embodiment] <Printer configuration> First, an overview of a printer, which is an example of a recording apparatus according to an embodiment, will be described with reference to Figures 1 and 2. Figure 1 is a front view that schematically shows the front surface of the printer according to an embodiment. Figure 2 is a plan view that schematically shows the plane of the printer according to an embodiment. The printer according to an embodiment is, for example, a color inkjet printer.

[0013] 1, the printer 1 includes a paper feed roller 2, a guide roller 3, a coater 4, a head case 5, a plurality of transport rollers 6, a plurality of frames 7, a plurality of liquid ejection heads 8, a transport roller 9, a dryer 10, a transport roller 11, a sensor unit 12, and a recovery roller 13. The transport roller 6 is an example of a transport unit.

[0014] Furthermore, the printer 1 has a control unit 14 that controls each part of the printer 1. The control unit 14 controls the operations of the paper feed roller 2, the guide roller 3, the coater 4, the head case 5, the plurality of conveying rollers 6, the plurality of frames 7, the plurality of liquid ejection heads 8, the conveying roller 9, the dryer 10, the conveying roller 11, the sensor unit 12, and the recovery roller 13.

[0015] Printer 1 records images and characters on print paper P by causing droplets to land on print paper P. Print paper P is an example of a recording medium. Before use, print paper P is wound around paper feed roller 2. Printer 1 transports print paper P from paper feed roller 2 through guide roller 3 and coater 4 into head case 5.

[0016] The coater 4 applies the coating agent evenly to the printing paper P. This allows the surface of the printing paper P to be treated, thereby improving the printing quality of the printer 1.

[0017] The head case 5 houses a plurality of transport rollers 6, a plurality of frames 7, and a plurality of liquid ejection heads 8. Inside the head case 5, a space is formed that is isolated from the outside, except for some parts that are connected to the outside, such as the part where the printing paper P enters and leaves.

[0018] At least one of the control factors such as temperature, humidity, and air pressure of the internal space of the head case 5 is controlled by the control unit 14 as necessary. The transport rollers 6 transport the printing paper P inside the head case 5 to the vicinity of the liquid ejection head 8.

[0019] The frame 7 is a rectangular flat plate, and is positioned above and in close proximity to the print paper P being transported by the transport rollers 6. As shown in FIG. 2, the frame 7 is positioned so that its longitudinal direction is perpendicular to the transport direction of the print paper P. Inside the head case 5, multiple (for example, four) frames 7 are positioned at predetermined intervals along the transport direction of the print paper P.

[0020] A liquid, such as ink, is supplied from a liquid tank (not shown) to the liquid ejection head 8. The liquid ejection head 8 ejects the liquid supplied from the liquid tank.

[0021] The control unit 14 controls the liquid ejection head 8 based on data such as images and characters to eject liquid toward the printing paper P. The distance between the liquid ejection head 8 and the printing paper P is, for example, about 0.5 to 20 mm.

[0022] The liquid ejection head 8 is fixed to the frame 7. The liquid ejection head 8 is positioned so that its longitudinal direction is perpendicular to the direction in which the printing paper P is transported.

[0023] That is, the printer 1 according to this embodiment is a so-called line printer in which the liquid ejection head 8 is fixed inside the printer 1. Note that the printer 1 according to this embodiment is not limited to a line printer, and may also be a so-called serial printer.

[0024] A serial printer is a printer that alternates between recording by moving the liquid ejection head 8 back and forth in a direction that intersects the transport direction of the printing paper P, for example, in a direction that is approximately perpendicular to the direction, and transporting the printing paper P.

[0025] As shown in Fig. 2, a plurality of (for example, five) liquid ejection heads 8 are fixed to one frame 7. Fig. 2 shows an example in which three liquid ejection heads 8 are positioned in front and two in the rear in the transport direction of the printing paper P, and the liquid ejection heads 8 are positioned in the transport direction of the printing paper P so that the centers of the liquid ejection heads 8 do not overlap.

[0026] A head group 8A is made up of multiple liquid ejection heads 8 positioned on one frame 7. The four head groups 8A are positioned along the transport direction of the printing paper P. Four colors of ink are supplied to the liquid ejection heads 8 belonging to the same head group 8A. This allows the printer 1 to print using four colors of ink using the four head groups 8A.

[0027] The colors of ink ejected from each liquid ejection head 8 are, for example, magenta (M), yellow (Y), cyan (C), and black (K). The control unit 14 controls each liquid ejection head 8 to eject ink of multiple colors onto the printing paper P, thereby printing a color image on the printing paper P.

[0028] In order to treat the surface of the printing paper P, a coating agent may be ejected onto the printing paper P from the liquid ejection head 8.

[0029] Furthermore, the number of liquid ejection heads 8 included in one head group 8A and the number of head groups 8A mounted on the printer 1 can be changed as appropriate depending on the object to be printed and the printing conditions. For example, if printing is to be performed within the range that can be printed with one liquid ejection head 8, the number of liquid ejection heads 8 mounted on the printer 1 may be one.

[0030] The printing paper P that has been printed inside the head case 5 is transported to the outside of the head case 5 by transport rollers 9 and passes through the inside of the dryer 10. The dryer 10 dries the printing paper P that has been printed. The printing paper P that has been dried in the dryer 10 is transported by transport rollers 11 and collected by collection rollers 13.

[0031] In the printer 1, by drying the printing paper P in the dryer 10, it is possible to prevent the printing paper P that is wound up in a pile on the collection roller 13 from sticking together and preventing the undried liquid from rubbing against each other.

[0032] The sensor unit 12 is composed of a position sensor, a speed sensor, a temperature sensor, etc. The control unit 14 can determine the state of each part of the printer 1 based on information from the sensor unit 12 and control each part of the printer 1.

[0033] The printer 1 described so far has been shown to use printing paper P as the printing object (i.e., recording medium), but the printing object in the printer 1 is not limited to printing paper P, and the printing object may also be a roll of cloth or the like.

[0034] Furthermore, the printer 1 may transport the printing paper P on a conveyor belt instead of directly transporting the printing paper P. By using a conveyor belt, the printer 1 can print on sheets of paper, cut pieces of cloth, wood, tiles, and the like.

[0035] The printer 1 may also print wiring patterns for electronic devices by ejecting a liquid containing conductive particles from the liquid ejection head 8. The printer 1 may also produce chemicals by ejecting a predetermined amount of liquid chemicals or liquid containing chemicals from the liquid ejection head 8 toward a reaction vessel or the like.

[0036] The printer 1 may also include a cleaning unit that cleans the liquid ejection head 8. The cleaning unit cleans the liquid ejection head 8 by, for example, wiping or capping.

[0037] The wiping process is a process of removing the liquid adhering to the liquid ejection head 8 by wiping the surface of the portion onto which the liquid is ejected with a flexible wiper, for example.

[0038] The capping process is performed, for example, as follows: First, a cap is placed over the surface of the portion onto which the liquid is to be ejected (this is called capping). This forms a substantially sealed space between the surface of the portion onto which the liquid is to be ejected and the cap. Next, the liquid is repeatedly ejected into this sealed space. This makes it possible to remove liquid with a higher viscosity than the standard state, foreign matter, etc., that has clogged the nozzle 21A (see FIG. 3).

[0039] <Configuration of liquid ejection head> (First embodiment) Next, the configuration of the liquid ejection head 8 according to the first embodiment will be described with reference to Figures 3 to 6. Figure 3 is a perspective view showing an example of a schematic configuration of the liquid ejection head according to the first embodiment.

[0040] For ease of understanding, FIG. 3 illustrates a three-dimensional Cartesian coordinate system including a Z-axis with the vertically upward direction as the positive direction. This Cartesian coordinate system may also be shown in other drawings used in the following description. For convenience, in the following description, the direction in which the nozzle 21A (see FIG. 3) is located in the liquid ejection head 8, i.e., the negative Z-axis direction, may be referred to as "down" or "downward," and the positive Z-axis direction may be referred to as "up" or "upward." In addition, in FIGS. 3 to 6, various components may be omitted or simplified.

[0041] As shown in FIG. 3, the liquid ejection head 8 includes a first flow path member 21, a second flow path member 22, a pressure applying section 23, a connector section 26, a first flow path 27, a second flow path 28, a head cover 29, and heat sinks 31 and 32.

[0042] The first flow path member 21 is located on the bottom side of the liquid ejection head 8, facing the printing paper P (see FIG. 1). The first flow path member 21 has a nozzle 21A. The nozzle 21A opens to the bottom surface of the liquid ejection head 8, and ejects liquid supplied inside the first flow path member 21 to the outside.

[0043] The second flow path member 22 is located above the first flow path member 21. The second flow path member 22 supplies liquid to the first flow path member 21. The second flow path member 22 has a flow path 22A connected to the nozzle 21A. Liquid is supplied to the inside of the flow path 22A from the first flow path 27. The second flow path member 22 will be described in detail later.

[0044] The pressurizing unit 23 controls the ejection of liquid from the first flow path member 21 in response to a drive signal. The pressurizing unit 23 has a piezoelectric element that is displaced when energized, and a pressure chamber whose internal pressure changes in response to the displacement of the piezoelectric element. The pressurizing unit 23 controls the ejection of liquid from the nozzle 21A of the first flow path member 21 to the outside by changing the internal pressure of the pressure chamber.

[0045] Connector unit 26 has connector 24. Connector 24 is electrically connected to pressure unit 23. Connector unit 26 receives, from the outside, a drive signal for driving, for example, a piezoelectric element included in pressure unit 23, in response to a control signal output from control unit 14 (see FIG. 1). Connector unit 26 may also have connector cover 25 located between connector 24 and head cover 29.

[0046] The first flow path 27 supplies the liquid to the inside of the second flow path member 22. The second flow path 28 recovers the liquid from the inside of the second flow path member 22. The liquid recovered from the second flow path 28 is supplied to the first flow path 27, for example, through a filter (not shown).

[0047] The head cover 29 is plate-shaped and is arranged to cover a space located on the opposite side of the first flow path member 21 across the second flow path member 22. The head cover 29 has a top plate 290, first side plates 291 and 292, and second side plates 293, 294, and 295.

[0048] The top plate 290 is located at the end on the positive side of the Z axis along the XY plane. The first side plates 291, 292 are located at both ends in the Y axis direction along the ZX plane. The first side plate 291 is located at the end on the negative side of the Y axis. The first side plate 292 is located at the end on the positive side of the Y axis. One end of the first side plates 291, 292 is connected to the top plate 290, and the other end is located on the second flow path member 22.

[0049] The second side plates 293, 294, and 295 are located at both ends in the X-axis direction along the YZ plane. One end of the second side plate 293 is connected to the top plate 290. One end of the second side plate 294 is connected to the first side plate 291. One end of the second side plate 295 is connected to the first side plate 292.

[0050] The head cover 29 can be made of, for example, a conductive metal material such as aluminum. Alternatively, the head cover 29 may be made of, for example, a conductive or insulating resin material. This allows the liquid ejection head 8 to appropriately dissipate heat via the head cover 29. Furthermore, the head cover 29 may have a higher thermal conductivity than the second flow path member 22. This makes it difficult for heat to be conducted from the head cover 29 to the second flow path member 22. This can reduce the possibility of changes in the properties of the liquid flowing inside the second flow path member 22, causing problems with ejection performance, for example.

[0051] The head cover 29 may be in contact with the second flow path member 22 or may be spaced apart from the second flow path member 22. Positioning the head cover 29 spaced apart from the second flow path member 22 reduces the likelihood of heat conduction from the head cover 29 to the second flow path member 22 and promotes heat conduction to the heat sinks 31 and 32. This reduces the possibility that the properties of the liquid flowing inside the second flow path member 22 will change and cause problems with the discharge performance, for example.

[0052] The heat sinks 31 and 32 are plate-shaped members positioned along the YZ plane. The heat sinks 31 and 32 are positioned opposite each other in the X-axis direction, sandwiching the head cover 29 therebetween. The heat sinks 31 and 32 are connected to the second side plates 293, 294, and 295 of the head cover 29 via a fixing member 42. For example, if the driving ICs 61 and 62 generate little heat, the heat sinks 31 and 32 receive and dissipate heat generated inside the liquid ejection head 8 from the head cover 29. Alternatively, if the driving ICs 61 and 62 generate a lot of heat, the head cover 29 receives and dissipates heat generated inside the liquid ejection head 8 from the heat sinks 31 and 32. The fixing member 42 may be, for example, a metal screw member. Thus, by screwing the heat sinks 31 and 32 to the head cover 29, the liquid ejection head 8 can have a heat dissipation route. The fixing member 42 is an example of a second member that connects the heat sinks 31 and 32 and the head cover 29 together.

[0053] The heat sinks 31 and 32 may be made of, for example, the same material as the head cover 29. Alternatively, the heat sinks 31 and 32 may be made of, for example, a material having a higher thermal conductivity than the head cover 29.

[0054] Fig. 4 is a perspective view showing an example of a schematic configuration of a second flow path member according to the first embodiment. Fig. 5 is a partially enlarged perspective view of the liquid ejection head shown in Fig. 3. Fig. 6 is a cross-sectional view showing an example of the liquid ejection head according to the first embodiment.

[0055] 4, the second flow path member 22 has a first notch portion 221, a second notch portion 222, and a flow path portion 224. The first notch portion 221, the second notch portion 222, and the flow path portion 224 are provided on the upper surface of the second flow path member 22 (in the positive direction of the Z axis).

[0056] The first cutout portion 221 and the second cutout portion 222 are positioned so as to cut out the side surface 220 of the second flow path member 22. The side surface 220 is positioned at both ends in the width direction of the second flow path member 22 along the X axis.

[0057] 5 and 6, the first cutout portions 221 accommodate the heat sinks 31 and 32. This allows the lengths of the heat sinks 31 and 32 in the Z-axis direction to be greater than those of the head cover 29, thereby improving the heat dissipation performance of the liquid ejection head 8, for example. Also, by accommodating the heat sinks 31 and 32 in the first cutout portions 221, it is possible to avoid an increase in the size of the liquid ejection head 8 in the X-axis direction, for example. Also, by positioning the first cutout portions 221 on the side surface 220, it is possible to easily accommodate the heat sinks 31 and 32, for example.

[0058] 6, an adhesive 41 may be positioned between the heat sinks 31, 32 and the first notch 221. In other words, the heat sinks 31, 32 and the first notch 221 may be fixed to each other by the adhesive 41. The adhesive 41 is an example of a first member that connects the heat sinks 31, 32 to the second flow path member 22. The adhesive 41 may be, for example, a resin-based adhesive containing a thermosetting resin or a photocurable resin. The adhesive 41 may be made of, for example, a material with a higher thermal conductivity than the fixing member 42. This may reduce heat conduction from the heat sinks 31, 32 to the second flow path member 22 via the adhesive 41.

[0059] The second cutout portion 222 is located closer to the center of the second flow path member 22 than the first cutout portion 221, and is arranged to cut out the first cutout portion 221. The second cutout portion 222 also has an opening 223. As shown in FIG. 6, flexible substrates 51 and 52 are inserted into the opening 223. One end of the flexible substrates 51 and 52 is electrically connected to the pressure unit 23, and the other end is electrically connected to the connector 24. A driving IC (Integrated Circuit) 61 is mounted on the flexible substrate 51, and a driving IC 62 is mounted on the flexible substrate 52. The driving ICs 61 and 62 are so-called integrated circuits and are heat sources that generate heat when powered on. The driving ICs 61 and 62 control the pressure unit 23 in response to a drive signal sent from the connector 24, thereby controlling the ejection of liquid.

[0060] As shown in FIG. 6 , the driving ICs 61 and 62 are pressed against the heat sinks 31 and 32 by a pressing member 70 and elastic members 71 and 72. The pressing member 70 is made of, for example, a metal or resin member and has a predetermined rigidity. The pressing member 70 has a portion facing the driving ICs 61 and 62 across the flexible substrates 51 and 52. The elastic members 71 and 72 are located between the pressing member 70 and the driving ICs 61 and 62 (flexible substrates 51 and 52). In this way, the driving ICs 61 and 62 are pressed against the heat sinks 31 and 32 with an appropriate pressing force by the pressing member 70 and elastic members 71 and 72. The driving ICs 61 and 62 may be fixed to the heat sinks 31 and 32, for example, by an adhesive (not shown).

[0061] In this way, by having the second cutout portion 222 in the second flow path member 22, for example, it becomes easier to pull out the other end side of the flexible substrates 51, 52, one end of which is connected to the pressure unit 23. This improves the workability in assembling the liquid ejection head 8, for example.

[0062] Furthermore, since the second flow path member 22 has the first notch portion 221 and the second notch portion 222, for example, the contact area between the heat sinks 31, 32 and the second flow path member 22 is reduced. Therefore, for example, heat conduction from the heat sinks 31, 32 to the second flow path member 22 can be reduced.

[0063] The flow path section 224 is a recess located in the center of the second flow path member 22 and extending in the lengthwise direction along the Y-axis direction. As shown in Fig. 6, the flow path section 224 is sealed by a lid-like member 30 located on the second flow path member 22 to form a flow path 22A. The lid-like member 30 may be formed integrally with the second flow path member 22.

[0064] In the above embodiment, the heat sinks 31 and 32 are described as being in contact with the second flow path member 22, but they may be positioned away from the second flow path member 22. Figure 7 is a cross-sectional view showing another example of the liquid ejection head according to the first embodiment.

[0065] As shown in FIG. 7 , an intermediate member 43 may be further provided between the heat sinks 31 and 32 and the second flow path member 22. The intermediate member 43 may be an elastic member, such as a resin sponge, with lower thermal conductivity than the heat sinks 31 and 32 and the second flow path member 22. The intermediate member 43 can serve as a buffer and spacer between the heat sinks 31 and 32 and the second flow path member 22. This further reduces heat conduction from the heat sinks 31 and 32 to the second flow path member 22. This further reduces the possibility of changes in the properties of the liquid flowing through the second flow path member 22, resulting in poor discharge performance. Note that the heat sinks 31 and 32 being positioned away from the second flow path member 22 means that the heat sinks 31 and 32 are not in direct contact with the second flow path member 22. That is, as shown in FIG. 7 , another member may be interposed between the heat sinks 31 and 32 and the second flow path member 22, or they may be spaced apart without an interposition.

[0066] (Second embodiment) Next, the configuration of a liquid ejection head 8 according to a second embodiment will be described with reference to Figures 8 and 9. Figure 8 is a plan view showing an example of a schematic configuration of a heat sink included in the liquid ejection head according to the second embodiment.

[0067] 8, the heat sink 31 may have a first portion 311 and a second portion 312. The first portion 311 is located on the negative Z-axis side of the second portion 312. The first portion 311 has a greater length along the Y-axis direction than the second portion 312. In other words, the first portion 311 of the heat sink 31 is a first wide portion that is wider in the longitudinal direction of the liquid ejection head 8 than other portions.

[0068] In this way, by the heat sink 31 having the first portion 311, for example, the heat capacity of the heat sink 31 can be improved, and the heat dissipation performance of the liquid ejection head 8 can be improved.

[0069] 9 is a partially enlarged perspective view showing an example of the schematic configuration of a liquid ejection head according to the second embodiment. As shown in FIG. 9, a first portion 311, which is a first wide portion of the heat sink 31, may be housed in a first cutout portion 221.

[0070] In this way, by accommodating the first portion 311 in the first cutout portion 221, for example, it is possible to increase the heat capacity without increasing the size of the heat sink 31 and / or the liquid ejection head 8 in the height direction (Z-axis direction), thereby improving the heat dissipation performance of the liquid ejection head 8. Furthermore, for example, when the heat sink 31 is fixed to the second flow path member 22 with an adhesive, the adhesive can be attached to the upper surface of the protruding first portion 311, improving workability.

[0071] Although the shape and arrangement of heat sink 31 have been described with reference to FIGS. 8 and 9, heat sink 32 may also have the same configuration as heat sink 31.

[0072] (Third embodiment) Next, the configuration of a liquid ejection head 8 according to a third embodiment will be described with reference to Fig. 10 to Fig. 13. Fig. 10 is a plan view showing an example of a schematic configuration of a heat sink and a heat insulating member included in a liquid ejection head according to the third embodiment. Fig. 11 is a perspective view showing an example of a schematic configuration of a partially enlarged liquid ejection head according to the third embodiment.

[0073] The liquid ejection head 8 according to this embodiment differs from the liquid ejection head 8 according to the above-described embodiments in that it further includes a heat insulating member 80 located between the heat sink 31 and the first flow path member 21. This makes it possible to further reduce heat transfer from the heat sink 31 to the first flow path member 21.

[0074] The heat insulating member 80 is made of, for example, an epoxy resin. The thermal conductivity of the heat insulating member 80 may be lower than that of the heat sink 31. The thermal conductivity of the heat insulating member 80 is, for example, 0.19 (W / m°C). By providing the heat insulating member 80, the heat generated in the driving IC 61 is less likely to be transmitted to the first flow path member 21 via the heat sink 31.

[0075] 10, the heat sink 31 may have a third portion 313 and a fourth portion 314. The third portion 313 is located on the negative Z-axis direction side of the fourth portion 314. The third portion 313 has a shorter length along the Y-axis direction than the fourth portion 314.

[0076] The heat insulating member 80 may have a first portion 801, a second portion 802, and a third portion 803. The second portion 802 and the third portion 803 are located at opposite ends in the Y-axis direction. The third part 313 of the heat sink 31 is housed between the second portion 802 and the third portion 803.

[0077] The first portion 801 is located further in the negative Z-axis direction than the second portion 802 and the third portion 803. The first portion 801 has a greater length along the Y-axis direction than the second portion 802 and the third portion 803. In other words, the first portion 801 of the heat insulating member 80 is a second wide portion that is wider in the longitudinal direction of the liquid ejection head 8 than the other portions.

[0078] In this way, by the heat sink 31 having the first portion 801, for example, the bonding area between the heat sink 31 and the second flow path member 22 can be increased, and the bonding strength can be improved.

[0079] 11, a first portion 801 which is the second wide portion of the heat insulating member 80 may be housed in the first cutout portion 221. In the example shown in FIG.

[0080] In this way, the first portion 801 of the heat insulating member 80 is housed in the first cutout portion 221 and joined to the second flow path member 22, thereby making it possible to provide, for example, a liquid ejection head 8 that is compact in appearance. Furthermore, for example, when the heat insulating member 80 is fixed to the second flow path member 22 with an adhesive, the adhesive can be attached to the upper surface of the protruding first portion 801, improving workability.

[0081] Next, an example of the configuration of a heat insulating member included in the liquid ejection head according to this embodiment will be described with reference to Figures 12 and 13. Figures 12 and 13 are perspective views showing an example of a heat insulating member included in the liquid ejection head according to the third embodiment.

[0082] 12 and 13, the heat insulating member 80 is a member that extends long in the longitudinal direction (Y-axis direction) of the liquid ejection head 8. The heat insulating member 80 has a first portion 81, a second portion 82, and a third portion 83 that connects the first portion 81 and the second portion 82. The heat insulating member 80 has a generally S-shaped cross section. The first portion 81 and the second portion 82 are positioned with a deviation in the X-axis direction. The first portion 81 has a surface 811 that faces the inside of the liquid ejection head 8. The second portion 82 has a surface 821 that faces the outside of the liquid ejection head 8. The third portion 83 connects the lower portion of the first portion 81 and the upper portion of the second portion 82, and accommodates the third portion 313 of the heat sink 31.

[0083] The heat insulating member 80 may also have a protrusion 84 that protrudes from the first portion 81 toward the outside of the liquid ejection head 8. The protrusion 84 is accommodated in a through hole 315 (see FIG. 11) of the heat sink 31, thereby making it difficult for the relative positional deviation between the heat sink 31 and the heat insulating member 80 to occur. Note that the heat sink 31 may have a recess in place of the through hole 315 that can accommodate the protrusion 84.

[0084] 10 to 13, the shape and arrangement of the heat sink 31 and the insulating member 80 located near the heat sink 31 are described, but the heat sink 32 and the insulating member located near the heat sink 32 can also be configured in the same way as the heat sink 31 and the insulating member 80.

[0085] (Other embodiments) In the above-described embodiments, the heat sinks 31, 32 are connected to the second side plates 293, 294, 295 of the head cover 29 via the fixing members 42, but the heat sinks 31, 32 may be connected to the second side plates 293, 294, 295 by positioning an adhesive 41 between them and the second side plates 293, 294, 295, using the adhesive 41 and the fixing members 42. This allows the heat sinks 31, 32 and the head cover 29 to be fixed more firmly.

[0086] Furthermore, in the above embodiment, the second side plates 293, 294, 295 of the head cover 29 are described as being positioned independently of each other, but two or more of the second side plates 293 to 295 may be positioned consecutively.

[0087] Furthermore, in the above embodiment, the liquid ejection head 8 has been described as having the heat sinks 31 and 32, but it may have only one of the heat sinks 31 and 32. In such a case, the second flow path member 22 may have only the first notch 221 corresponding to the heat sink that the liquid ejection head 8 has.

[0088] As described above, the liquid ejection head 8 according to the embodiment includes the first flow path member 21, the second flow path member 22, the driving ICs 61 and 62, and the heat sinks 31 and 32. The first flow path member 21 ejects liquid. The second flow path member 22 supplies liquid to the first flow path member 21. The driving ICs 61 and 62 control the ejection of liquid. The driving ICs 61 and 62 come into contact with the heat sinks 31 and 32. The second flow path member 22 has cutouts (first cutouts 221) that accommodate the heat sinks 31 and 32. This allows the liquid ejection head 8 according to the embodiment to have high heat dissipation properties.

[0089] Further advantages and modifications will readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents. [Explanation of symbols]

[0090] 1. Printer 8 Liquid ejection head 14 Control Unit 21 first flow path member 21A Nozzle 22 second flow path member 23 Pressure unit 29 Headcover 31,32 Heat sink 41 Adhesive 42 Fixing member 51,52 Flexible substrate 61,62 Driver IC 80 Heat insulating material 220 Side 221 First notch 222 Second notch 223 Aperture

Claims

1. a first flow path member that discharges liquid; a second flow path member positioned above the first flow path member, supplying the liquid to the first flow path member, and having a notch on a side surface; a drive IC for controlling the ejection of the liquid; a heat sink that contacts the driving IC; Equipped with The lower end of the heat sink is located above the notch of the second flow path member. Liquid ejection head.

2. The liquid ejection head according to claim 1 , wherein the heat sink is located away from the second flow path member.

3. The liquid ejection head according to claim 1 , further comprising an adhesive material positioned between the heat sink and the second flow path member.

4. The liquid ejection head according to claim 1 , wherein the heat sink is connected to the second flow path member via a first member, and is connected to a head cover via the first member and a second member having a higher thermal conductivity than the first member.

5. The liquid ejection head according to claim 4 , wherein the head cover is positioned away from the second flow path member.

6. The liquid ejection head according to claim 4 , wherein the head cover has a higher thermal conductivity than the second flow path member.

7. The liquid ejection head according to claim 1 , wherein the second flow path member has a first notch portion that accommodates the heat sink plate and a second notch portion that is located closer to the center of the second flow path member than the first notch portion.

8. a flexible substrate on which the driving IC is mounted, The liquid ejection head according to claim 7 , wherein the second cutout portion has an opening through which the flexible substrate is inserted.

9. The liquid ejection head according to claim 1 , wherein the heat sink has a first wide portion that is wider in the longitudinal direction of the liquid ejection head than other portions.

10. The liquid ejection head according to claim 9 , wherein the first wide portion is accommodated in the notch.

11. a first flow path member that discharges liquid; a second flow path member that supplies the liquid to the first flow path member; a drive IC for controlling the ejection of the liquid; a heat sink that comes into contact with the driving IC; a heat insulating member positioned between the heat sink and the first flow path member; Equipped with The second flow path member has a notch that accommodates the heat insulating member. Liquid ejection head.

12. The liquid ejection head according to claim 11 , wherein the heat insulating member has a second wide portion that is wider in the longitudinal direction of the liquid ejection head than other portions.

13. The liquid ejection head according to claim 12 , wherein the second wide portion is housed in the notch.

14. A recording apparatus comprising the liquid ejection head according to any one of claims 1 to 13.

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