Inspection device and inspection method

Abstract

To provide an inspection device and an inspection method for accurately aligning the positions of a substrate electrode and a probe.SOLUTION: A plurality of first targets 103 are provided to a probe card 100 and the same number of second targets 71 as the number of the first targets 103 are provided to a placement member. A detection unit is further provided. A control unit executes steps of: acquiring, using a first acquisition unit, the representative position of a probe 102 relative to a reference probe position; moving the placement member to a region below a second acquisition unit located in a region that does not overlap in a plan view with the probe card held by a holding unit and acquiring, using the second acquisition unit, the representative position of an electrode relative to a reference electrode position; acquiring a matching position where all of the first targets simultaneously come to have a prescribed positional relationship in a plan view with the second target 71 that corresponds to the first target; and acquiring a contact position at which the probe and the electrode are brought into contact with each other on the basis of the representative position of the probe 102 and the representative position of the electrode, and correcting the contact position on the basis of the matching position.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present disclosure relates to an inspection device and an inspection method. [Background technology]

[0002] Patent Document 1 discloses a probe card detection device that is formed in accordance with an inspection chamber for testing the electrical characteristics of semiconductor wafers and includes a probe detection chamber having a support to which a probe card is removably attached and positioned at a predetermined position. The device further includes a probe card that is positioned and attached relative to the predetermined position of the support via a first holder, and a first imaging device that is movably provided within the probe detection chamber and detects the tips of at least two probes of the probe card. The probe card detection device also includes a probe correction card that is removably attached and positioned relative to the predetermined position of the support via a second holder in place of the probe card, and has at least two targets corresponding to the at least two probes. In the probe detection chamber, the first imaging device detects differences between the horizontal positions of the tips of the at least two probes and the horizontal positions of the at least two targets. The differences are detected as correction values ​​for aligning the at least two probes of the probe card with at least two electrode pads on the semiconductor wafer in the inspection chamber. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-204695 Summary of the Invention [Problem to be solved by the invention]

[0004] The technology according to the present disclosure enables more accurate alignment of electrodes provided on a substrate with probes of a probe card in an inspection device that inspects a substrate. [Means for solving the problem]

[0005] One aspect of the present disclosure is an inspection device for inspecting a substrate, comprising: a mounting member on which the substrate is placed; a holding unit that holds a probe card having probes that contact electrodes on the substrate; a movement mechanism that holds the mounting member and moves it horizontally and up and down; a first acquisition unit fixed to the movement mechanism for acquiring positions of the probes; a second acquisition unit that acquires positions of the electrodes on the substrate placed on the mounting member; and a control unit, wherein a plurality of first targets are provided on at least one of the probe card or the holding unit, and the same number of second targets as the first targets are provided on the mounting member, and the inspection device further comprises a detection unit for simultaneously detecting the first targets and the second targets corresponding to the first targets, and the control unit The method is configured to execute the steps of: acquiring a representative position of the probe relative to a probe reference position using the first acquisition unit; moving the mounting member to an area below the second acquisition unit, which is located in an area that does not overlap with the probe card held in the holding unit in a planar view, and acquiring a representative position of the electrode relative to an electrode reference position using the second acquisition unit; acquiring a matched position using the detection unit, where all of the first targets simultaneously have a predetermined positional relationship in a planar view with the second targets corresponding to the first targets; and acquiring a contact position, which is the position of the mounting member when the probe and the electrode are brought into contact, based on the representative position of the probe and the representative position of the electrode, and correcting the contact position based on the matched position. [Effects of the Invention]

[0006] According to the present disclosure, in an inspection device that inspects a substrate, it is possible to more accurately align electrodes provided on the substrate with probes of a probe card. [Brief explanation of the drawings]

[0007] [Figure 1]1 is a cross-sectional view showing an outline of the configuration of an inspection device according to the present embodiment. [Figure 2] 1 is a longitudinal sectional view showing an outline of the configuration of an inspection device according to the present embodiment. [Figure 3] FIG. [Figure 4] FIG. 2 is a cross-sectional view of the periphery of the pogo frame. [Figure 5] FIG. 2 is a bottom view of the probe card. [Figure 6] FIG. 2 is a top view of the chuck top 70. [Figure 7] 10A and 10B are diagrams for explaining a method for determining a contact position according to a comparative example. [Figure 8] 10A and 10B are diagrams for explaining an inspection process involving a contact position determination process according to the present embodiment; [Figure 9] 10A and 10B are diagrams for explaining an inspection process involving a contact position determination process according to the present embodiment; [Figure 10] 10A and 10B are diagrams for explaining an inspection process involving a contact position determination process according to the present embodiment; [Figure 11] 10A and 10B are diagrams for explaining an inspection process involving a contact position determination process according to the present embodiment; DETAILED DESCRIPTION OF THE INVENTION

[0008] In the semiconductor manufacturing process, a large number of semiconductor devices with predetermined circuit patterns are formed on a semiconductor wafer (hereinafter referred to as "wafer"). The formed semiconductor devices are inspected for electrical characteristics and sorted into good and bad products. The inspection of semiconductor devices is performed, for example, using an inspection device while the wafer is in the state before it is divided into individual semiconductor devices.

[0009] The testing device is equipped with a probe card having a large number of probes, which are needle-shaped contact terminals. When testing electrical characteristics, the wafer and the probe card are first brought close to each other, and the probes of the probe card come into contact with each electrode of a semiconductor device formed on the wafer. In this state, an electrical signal is supplied to the semiconductor device via each probe from a tester installed above the probe card. Then, based on the electrical signals received by the tester from the semiconductor device via each probe, it is determined whether the semiconductor device is defective or not.

[0010] To ensure that such electrical property testing is performed properly, the testing device aligns the probe card with the wafer, specifically, aligns the probe with the electrodes on the wafer. In recent years, as electronic devices have become increasingly integrated, resulting in smaller electrodes, there has been a demand for more accurate alignment.

[0011] The technology according to the present disclosure provides a substrate inspection device that can more accurately align electrodes on a substrate with probes of a probe card.

[0012] Hereinafter, an inspection device and an inspection method according to the present embodiment will be described with reference to the drawings. In this specification and the drawings, elements having substantially the same functional configurations are designated by the same reference numerals, and redundant description will be omitted.

[0013] <Inspection equipment> 1 and 2 are a cross-sectional view and a longitudinal-sectional view, respectively, showing the outline of the configuration of an inspection device according to this embodiment, in which only a part of an aligner, which will be described later, is shown.

[0014] 1 and 2 inspects a wafer W as a substrate, and more specifically, inspects the electrical characteristics of semiconductor devices as devices to be inspected formed on the wafer W. The inspection apparatus 1 has a housing 10, which is provided with a loading / unloading area 11, a transfer area 12, and an inspection area 13. The loading / unloading area 11 is an area where the wafer W is loaded and unloaded into the inspection apparatus 1. The transfer area 12 is an area connecting the loading / unloading area 11 and the inspection area 13. The inspection area 13 is an area where the electrical characteristics of the semiconductor devices formed on the wafer W are inspected.

[0015] The loading / unloading area 11 is provided with a port 20 for receiving a cassette C containing multiple wafers W, a loader 21 for accommodating a probe card (described later), and a control unit 22 for controlling the various components of the inspection apparatus 1. The control unit 22 is configured, for example, by a computer equipped with a CPU, memory, etc., and has a storage unit (not shown) for storing various information. The storage unit stores, for example, a program for implementing the inspection process. The program may be recorded on a computer-readable storage medium and installed from the storage medium to the control unit 22. The storage medium may be temporary or non-temporary. Some or all of the program may be implemented by dedicated hardware (circuit board). The storage unit may be, for example, a storage device such as a hard disk drive (HDD), a memory such as a RAM for storing temporarily required information related to the program's calculations, or a combination of these.

[0016] A transfer device 30 that can move freely while holding a wafer W or the like is disposed in the transfer area 12. This transfer device 30 transfers the wafer W between a cassette C in a port 20 in the carry-in / out area 11 and the inspection area 13. The transfer device 30 also transfers probe cards that require maintenance among those fixed to a pogo frame (described later) in the inspection area 13 to a loader 21 in the carry-in / out area 11. Furthermore, the transfer device 30 transfers a new or maintained probe card from the loader 21 into the inspection area 13.

[0017] The inspection area 13 is provided with a plurality of testers 40. Specifically, the inspection area 13 is divided into three areas in the vertical direction, for example, as shown in Fig. 2, and each divided area 13a is provided with a tester row consisting of four testers 40 arranged in the horizontal direction (X direction in the figure). Each divided area 13a is also provided with an aligner 50 as a moving mechanism and one upper camera 60. The number and arrangement of the testers 40, aligners 50, and upper cameras 60 can be selected arbitrarily.

[0018] The tester 40 transmits and receives electrical signals to and from the wafer W for testing electrical characteristics. The aligner 50 is configured to hold a chuck top 70 (described later) and to be movable in the horizontal direction (X direction and Y direction in FIG. 1, θ direction centered on the Z axis in the figure) and the vertical direction (Z direction in the figure). The aligner 50 is also used to align the wafer W placed on the chuck top 70 with the probes of a probe card (described later).

[0019] The upper camera 60 is provided to capture an image of a downward direction. In one embodiment, the upper camera 60 is configured to be freely movable horizontally. The upper camera 60 is located, for example, in an area in front of each tester 40 in the test area where the upper camera 60 is provided, in an area that does not overlap in plan view with a probe card held by a pogo frame (described later), and captures an image of the wafer W placed on a chuck top 70 on the aligner 50. The upper camera 60 is controlled by the control unit 22. The imaging results of the upper camera 60 are output to the control unit 22.

[0020] The chuck top 70 is an example of a mounting member, and is configured to mount a wafer W. The chuck top 70 can hold the mounted wafer W by, for example, suction or the like.

[0021] In this inspection apparatus 1, while the transport device 30 is transporting a wafer W toward one tester 40, another tester 40 can inspect the electrical characteristics of electronic devices formed on another wafer W.

[0022] <Inspection area> Next, the configuration of the inspection area 13 will be described in more detail with reference to Figs. 3 to 6. Fig. 3 is a side cross-sectional view of the inspection area 13. Fig. 4 is a cross-sectional view of the periphery of a pogo frame, which will be described later. Fig. 5 is a bottom view of a probe card, which will be described later. Probes, which will be described later, are not shown in Fig. 5. Fig. 6 is a top view of the chuck top 70.

[0023] As described above, an aligner 50 and an upper camera 60 are provided in each divided area 13a of the inspection area 13. Also, as shown in Fig. 3, a lower camera 80, a pogo frame 90, and a probe card 100, which will be described later, are provided in each divided area 13a.

[0024] The aligner 50 includes, for example, an X stage 51 , a Y stage 52 , and a Z stage 53 .

[0025] The X stage 51 moves along guide rails 51a in the X-axis direction, which constitutes a coordinate system of the movement plane (XY plane) of the aligner 50. A position detection mechanism (not shown) is provided for the X stage 51 to detect the position of the X stage 51 in the X-axis direction, i.e., the position of the chuck top 70 in the X-axis direction. The position detection mechanism is, for example, a linear encoder.

[0026] The Y stage 52 moves on the X stage 51. Specifically, it moves along guide rails 52a in the Y-axis direction, which constitutes a coordinate system of the plane of movement (XY plane) of the aligner 50. A position detection mechanism (not shown) is provided for the Y stage 52 to detect the position of the Y stage 52 in the Y-axis direction, i.e., the position of the chuck top 70 in the Y-axis direction. The position detection mechanism is, for example, a linear encoder.

[0027] The Z stage 53 moves in the height direction (Z direction) perpendicular to the movement plane (XY plane) of the aligner 50 by an extension shaft 53a that is extendable in the height direction (Z direction). A position detection mechanism (not shown) is provided for the Z stage 53 to detect the position of the Z stage 53 in the Z direction, i.e., the position of the chuck top 70 in the Z direction. The position detection mechanism is, for example, a linear encoder. Furthermore, the chuck top 70 is detachably held by suction on the Z stage 53. The chuck top 70 is held by suction on the Z stage 53 by vacuum suction or the like using a suction holding mechanism (not shown).

[0028] The lower camera 80 is an example of a first acquisition unit, and is used to acquire a representative position of a probe (described later) provided on the probe card 100. The lower camera 80 is also an example of a first imaging unit, and captures an image of the upper side. The upper camera 60 described above is an example of a second acquisition unit, and is used to acquire a representative position of the wafer W placed on the chuck top 70 on the aligner 50. The upper camera 60 is also an example of a second imaging unit, and captures an image of the lower side as described above.

[0029] The lower camera 80 is fixed to the aligner 50. Specifically, the lower camera 80 is fixed to the Z stage 53 of the aligner 50. Because the lower camera 80 is fixed in this manner, the lower camera 80 can be moved together with the chuck top 70 by the aligner 50. The lower camera 80 is positioned, for example, in a region below the probe card 100 fixed to the pogo frame 90 and captures an image of the probe card 100 .

[0030] The aligner 50 and the lower camera 80 are controlled by the control unit 22. The imaging results by the lower camera 80 and the position detection results by the position detection mechanisms provided on the X stage 51, the Y stage 52, and the Z stage 53 are output to the control unit 22.

[0031] 4, the tester 40 has a tester motherboard 41 on the bottom. A plurality of test circuit boards (not shown) are mounted in an upright state on the tester motherboard 41. In addition, a plurality of electrodes (not shown) are provided on the bottom surface of the tester motherboard 41. Furthermore, a pogo frame 90 is provided below the tester 40 .

[0032] The pogo frame 90 is an example of a holder, and holds the probe card 100. The pogo frame 90 also electrically connects the probe card 100 to the tester 40. For the electrical connection, the pogo frame 90 has pogo pins 91, and more specifically, has a pogo block 92 that holds a large number of pogo pins 91. A probe card 100 is fixed to the underside of the pogo frame 90 while being aligned at a predetermined position.

[0033] An exhaust mechanism (not shown) vacuum-adsorbs the tester motherboard 41 to the pogo frame 90, and the probe card 100 to the pogo frame 90. Due to the vacuum suction force for this vacuum adsorption, the lower end of each pogo pin 91 of the pogo frame 90 comes into contact with a corresponding electrode on the upper surface of a card body 101 (described later) of the probe card 100, and the upper end of each pogo pin 91 is pressed against a corresponding electrode on the lower surface of the tester motherboard 41.

[0034] The probe card 100 has a disk-shaped card body 101 with a plurality of electrodes provided on the upper surface thereof. The lower surface of the card body 101 is provided with a plurality of probes 102, which are needle-shaped contact terminals extending downward. The above-mentioned plurality of electrodes provided on the upper surface of the card body 101 are electrically connected to the corresponding probes 102. During testing, the probes 102 each come into contact with an electrode P (see FIG. 6) of a semiconductor device formed on the wafer W. Therefore, during electrical characteristic testing, electrical signals related to the test are transmitted and received between the tester motherboard 41 and the semiconductor device on the wafer W via the pogo pins 91, the electrodes provided on the upper surface of the card body 101, and the probes 102.

[0035] In order for the inspection device 1 to simultaneously inspect the electrical characteristics of a plurality of semiconductor devices formed on the wafer W, a large number of probes 102 are provided so as to cover substantially the entire lower surface of the card body 101 .

[0036] In addition, a bellows 93 is attached to the underside of the pogo frame 90. The bellows 93 is a cylindrical, expandable member that hangs down to surround the probe card 100. In addition, the bellows 93 suction-holds the chuck top 70 at a position below the probe card 100, as shown by the dotted line in FIG.

[0037] The bellows 93 also suction-holds the chuck top 70, thereby forming a sealed space S surrounded by the pogo frame 90 including the probe card 100, the bellows 93, and the chuck top 70. The sealed space S can be depressurized by a depressurization mechanism (not shown), thereby maintaining contact between the wafer W and the probes 102.

[0038] Furthermore, in this embodiment, in addition to the probes 102, a plurality of first targets 103 are provided on the underside of the card body 101 of the probe card 100, as shown in FIGS. 4 and 5. The first targets 103 are marks for aligning the wafer W with the probe card 100. Each of the first targets 103 has, for example, a circular shape in a plan view. Furthermore, the first targets 103 are provided at equal intervals on the same circumference centered on the center of the probe card 100, for example, in an area R2 that surrounds the outside of an area R1 in which the probes 102 are formed. The number, shape and arrangement of the first targets 103 are arbitrary as long as the purpose of providing the first targets 103 can be achieved.

[0039] 6, in this embodiment, the same number of second targets 71 as the first targets 103 are provided on the upper surface of the chuck top 70. Like the first targets 103, the second targets 71 are marks for aligning the wafer W with the probe card 100. Each second target 71 has, for example, a circular shape in a plan view. The second targets 71 are provided at equal intervals on the same circumference centered on the center of the chuck top 70, for example, in an area R12 that surrounds the outside of an area R11 on which the wafer W is placed. The number, shape and arrangement of the second targets are arbitrary as long as the purpose of providing the second targets can be achieved.

[0040] The first targets 103 and the second targets 71 are provided as follows: That is, the first targets 103 and the second targets 71 are provided so that all of the first targets 103 can simultaneously have a predetermined positional relationship in a planar view with the second targets 71 corresponding to the first targets 103. Specifically, for example, the first targets 103 and the second targets 71 are provided so that all of the first targets 103 can simultaneously overlap with the second targets 71 corresponding to the first targets 103 in a planar view (more specifically, so that their centers can coincide with each other).

[0041] Furthermore, in this embodiment, as shown in FIG. 4, a reference alignment camera 110 is provided for each second target 71, that is, for each first target 103. The reference alignment camera 110 is an example of a detection unit, and is used to simultaneously detect the corresponding first target 103 and the second target 71 corresponding to the first target 103. The reference alignment camera 110 is also an example of a third imaging unit, and is provided in the aligner 50 at a position below the second target 71, and captures an image above.

[0042] In order to enable the reference alignment camera 110 to simultaneously photograph the first target 103 and the second target 71 and to maintain the airtightness of the enclosed space S, the first target 103 and the reference alignment camera 110 are arranged as follows.

[0043] That is, a through-hole 72 penetrating in the vertical direction is formed in the chuck top 70. The through-hole 72 is closed by a window member 73 formed of a material transparent to the light used for imaging by the reference alignment camera 110. The second target 71 is provided in this window member 73, and the reference alignment camera 110 images the second target 71 and the first target 103 through the through-hole 72. In one embodiment, the second target 71 is formed smaller than the first target 103 so that the reference alignment camera 110 can image the first target 103 through the second target 71. In another embodiment, the second target 71 may be formed in a ring shape having a hole in the center in a plan view, and the reference alignment camera 110 may image the first target 103 through the hole.

[0044] <Method of determining contact position according to the comparative example> Next, before describing the method for determining the contact position according to this embodiment, a method for determining the contact position according to a different embodiment (hereinafter referred to as a "comparative embodiment") from this embodiment will be described with reference to Fig. 7. The contact position is the position of the chuck top 70 when the electrode P of the wafer W supported by the chuck top 70 is brought into contact with the probe 102.

[0045] In the comparative contact position correction method, a representative position of the probe 102 relative to the probe reference position is acquired using the lower camera 80. In other words, the representative position of the probe 102 relative to the probe reference position is the representative position of the probe 102 in a coordinate system based on the image captured by the lower camera 80.

[0046] In addition, the upper camera 60, which is positioned in an area that does not overlap with the probe card 100 held by the pogo frame 90 in a plan view, is used to acquire the representative position of the electrode P on the wafer W placed on the chuck top 70 relative to the electrode reference position. In other words, the representative position of the electrode P relative to the electrode reference position is the representative position of the electrode P in a coordinate system based on the image captured by the upper camera 60.

[0047] Furthermore, information for associating the probe reference position with the electrode reference position, i.e., information for associating the coordinate system based on the image captured by the lower camera 80 with the coordinate system based on the image captured by the upper camera 60, is acquired. Specifically, as shown in Fig. 7, the lower camera 80 is moved to an area (hereinafter referred to as "alignment area") A below the upper camera 60, which is located in an area that does not overlap with the probe card 100 held by the pogo frame 90 in a plan view. Furthermore, the upper camera 60 and the lower camera 80 capture images of the same target 500, and information on the position of the Z stage 53 at that time is acquired as information for associating the probe reference position with the electrode reference position.

[0048] Then, the contact position is determined based on the acquired representative position of the probe 102 relative to the probe reference position, the representative position of the electrode P relative to the electrode reference position, and information for associating the probe reference position with the electrode reference position.

[0049] However, the housing 10 in which the aligners 50 are installed is subject to distortion on the order of μm due to expansion or contraction of the housing 10 caused by temperature changes, changes in the center of gravity of the multiple aligners 50 within the housing 10, etc. Furthermore, there is a distance between the chuck top 70 when the information for correlating the probe reference position with the electrode reference position is acquired, i.e., when the lower camera 80 is positioned in the alignment area A, and the chuck top 70 directly below the probe card 100 held by the pogo frame 90. Therefore, if such distortion occurs, the probe 102 may not be able to properly contact the electrode P at the contact position determined by the method according to the comparative example.

[0050] <Inspection process using inspection device 1> Next, an inspection process using the inspection device 1, which involves a process for determining a contact position, will be described with reference to FIGS.

[0051] (S1: Delivery) First, the wafer W to be inspected is carried into the desired division area 13a. Specifically, the transport device 30 and the like are controlled by the control unit 22, and the wafer W is removed from the cassette C in the port 20 of the loading / unloading area 11, and is loaded, for example, into the middle dividing area 13a, and placed on the chuck top 70 held by suction on the aligner 50.

[0052] (S2: Determining the contact position) Next, the control unit 22 determines the contact position.

[0053] (S2a: Obtaining the representative position of the probe) When determining the contact position, the control unit 22 acquires a representative position of the probe 102 relative to the probe reference position using the lower camera 80. Specifically, under the control of the control unit 22, the chuck top 70 is moved by the aligner 50 so that the lower camera 80 is positioned in the area below the probe card 100, as shown in Fig. 8, and the representative position of the probe 102 relative to the probe reference position is acquired based on the imaging result of the lower camera 80 and the detection result of the position detection mechanism of the aligner 50.

[0054] The representative position of the probe 102 is, for example, the center of gravity of a plurality of predetermined positions of the probe 102. The position (specifically, position coordinates) of each probe 102 can be acquired based on the output from the position detection mechanism of the aligner 50 when the tip of the probe 102 is located at the center of the image obtained by the lower camera 80.

[0055] The probe reference position may be predetermined, for example, a design position at the center of the probe card 100 . In one embodiment, in step S2a, the control unit 22 uses the lower camera 80 to acquire a representative position of the first target 103 of the probe card 100 as a probe reference position. The representative position of the first targets 103 is, for example, the center of gravity of the multiple first targets 103. The position of each first target 103 can be acquired based on the output from the position detection mechanism of the aligner 50 when the center of the first target 103 is located at the center of the image obtained by the lower camera 80, for example.

[0056] In the above, it is stated that "XX position is acquired", but it is not necessary that the "XX position" is actually acquired, as long as the information necessary to acquire the "XX" position is acquired. The same applies hereinafter.

[0057] (S2b: Obtaining representative electrode positions) 9, the control unit 22 moves the chuck top 70 to the alignment area A, and acquires a representative position of the electrode P relative to the electrode reference position using the upper camera 60. Specifically, the representative position of the electrode P relative to the electrode reference position is acquired based on the imaging result of the upper camera 60 and the detection result of the position detection mechanism of the aligner 50.

[0058] The representative position of the electrode P is, for example, the center of gravity of multiple predetermined locations of the electrode P. The position of each electrode P (specifically, the position coordinates) can be acquired based on the output from the position detection mechanism of the aligner 50 when the center of the electrode P is located at the center of the image obtained by the upper camera 60.

[0059] The electrode reference position may be predetermined, for example, the design position of the center of the chuck top 70. In one embodiment, in step S2b, the control unit 22 uses the upper camera 60 to acquire a representative position of the second target 71 on the chuck top 70 as the electrode reference position. The representative position of the second targets 71 is, for example, the center of gravity of the multiple second targets 71. The position of each second target 71 can be acquired based on the output from the position detection mechanism of the aligner 50 when the center of the second target 71 is located at the center of the image obtained by the upper camera 60, for example.

[0060] (S2c: Obtaining the matching position) When determining the contact position, the control unit 22 acquires a matching position using the reference alignment camera 110. The matching position is the position of the chuck top 70 when all of the first targets 103 simultaneously have a predetermined positional relationship in a planar view with the second targets 71 corresponding to the first targets 103. The "predetermined positional relationship in a planar view" refers to, for example, a positional relationship in which the center of a first target 103 overlaps with the center of a second target 71 corresponding to the first target 103 in a planar view. In this step S2c, under the control of the control unit 22, the chuck top 70 is moved by the aligner 50 so as to be positioned in the area below the probe card 100, as shown in Figure 10, and the matching position is obtained based on the imaging results of the reference alignment camera 110 and the detection results of the position detection mechanism of the aligner 50.

[0061] (S2d: Acquisition and correction of temporary contact position) Then, the control unit 22 acquires a contact position based on the representative position of the probe 102 relative to the probe reference position and the representative position of the electrode P relative to the electrode reference position, and corrects the contact position based on the matched position acquired in step S2c. That is, the control unit 22 acquires a tentative contact position based on the representative position of the probe 102 relative to the probe reference position and the representative position of the electrode P relative to the electrode reference position, corrects the tentative contact position based on the matched position acquired in step S2c, and determines the corrected tentative contact position as the contact position. Correcting the tentative contact position based on the matched position means, in other words, associating the probe reference position with the electrode reference position. Furthermore, information on the matched position is information for associating the probe reference position with the electrode reference position.

[0062] Specifically, in this step S2d, the control unit 22 corrects the provisional contact position B3 based on the positional deviation D of the matching position B2 from the contact reference position B1, as shown in FIG. 11, and determines the corrected provisional contact position as contact position B4.

[0063] The contact reference position B1 is determined in advance, for example. The contact reference position B1 is determined by the control unit 22 as follows: (1) It may be acquired based on the representative position of the first target 103 of the probe card 100 as the probe reference position and a predetermined electrode reference position, (2) It may be acquired based on a predetermined probe reference position and a representative position of the second target 71 on the chuck top 70 as the electrode reference position; (3) The position may be acquired based on the representative position of the first target 103 of the probe card 100 as the probe reference position and the representative position of the second target 71 of the chuck top 70 as the electrode reference position.

[0064] (S3: Movement and lifting of chuck top 70) When the contact position is determined, the control unit 22 moves the chuck top 70 to the contact position, and then raises the chuck top 70. The raising is continued until the probe 102 and the electrode P come into contact with each other.

[0065] In one embodiment, during the ascent, the control unit 22 acquires a horizontal positional change of the second target 71 relative to the probe card 100 using the reference alignment camera 110, and corrects the position of the chuck top 70 based on the acquired result. Specifically, during the ascent, the control unit 22 acquires the horizontal positional change using the reference alignment camera 110, and corrects the position of the chuck top 70 from the contact position so as to cancel the positional change. To make it possible to easily obtain the horizontal positional change of the second target 71 relative to the probe card 100, for example, a pattern such as a grid pattern may be provided around the first target 103 on the probe card 100.

[0066] (Step S4: Adsorption of the chuck top 70) Thereafter, under the control of the control unit 22, the chuck top 70 is sucked onto the pogo frame 90. Specifically, with the electrode P and the probe 102 in contact, a pressure reduction mechanism (not shown) is controlled and the Z stage 53 of the aligner 50 is lowered, thereby separating the chuck top 70 from the aligner 50 and adsorbing it to the pogo frame 90.

[0067] (Step S5: Inspection) After the chuck top 70 and the aligner 50 are separated, an electrical characteristic test of the electronic devices formed on the wafer W is performed. An electrical signal for testing electrical characteristics is input from the tester 40 to the electronic device via the pogo pins 91, probes 102, and the like.

[0068] (S6. Export) Thereafter, the inspected wafer W is carried out. Specifically, the chuck top 70 that has been adsorbed to the pogo frame 90 is transferred to and held by the aligner 50. Furthermore, the inspected wafer W on the chuck top 70 held by the aligner 50 is carried out of the inspection area 13 by the transfer device 30 and returned to the cassette C in the port 20 of the carry-in / out area 11. During the inspection in one tester 40, the aligner 50 transports the wafer W to be inspected to another tester 40 and collects the wafer W from the other tester 40 after inspection.

[0069] <Major Effects of This Embodiment> In this embodiment, the distance traveled from the position where the information for associating the probe reference position with the electrode reference position is acquired to the contact position is shorter than in the comparative embodiment. Therefore, even if the housing 10 is distorted as described above, the probe 102 can be brought into more appropriate contact with the electrode P.

[0070] Furthermore, as described above, the representative position of the first target 103 may be set as the probe reference position. This allows the probe 102 to be brought into more appropriate contact with the electrode P regardless of the state of the probe card 100. For example, even if the probe card 100 expands or contracts due to a temperature change in the probe card 100, the probe 102 can be brought into appropriate contact with the electrode P.

[0071] Furthermore, as described above, the representative position of the second target 71 may be set as the electrode reference position. This allows the probe 102 to be in more appropriate contact with the electrode P regardless of the state of the chuck top 70. For example, even if the chuck top 70 expands or contracts due to a temperature change in the chuck top 70, the probe 102 can be in appropriate contact with the electrode P.

[0072] As described above, while the chuck top 70 is being raised, the reference camera 110 may be used to acquire a horizontal positional change of the second target 71 relative to the probe card 100, and the position of the chuck top 70 may be corrected based on the acquired result. This allows the probes 102 to be in appropriate contact with the electrodes P even if the positional change occurs while the chuck top 70 is being raised.

[0073] <Modification> In the above example, the first target 103 is provided on the probe card 100, but the first target may be provided on the pogo frame 90. Specifically, the first target may be provided in an area surrounded by the bellows 93 on the lower surface of the pogo frame 90.

[0074] In the above example, the reference alignment camera 110 for simultaneously detecting the first target 103 and the second target 71 is provided on the aligner 50, and an image of the first target 103 is taken through the second target 71. However, the reference alignment camera for the simultaneous detection may be provided on the pogo frame 90. In this case, in step S3, while the chuck top 70 is rising, the control unit 22 may use the reference alignment camera 110 to acquire the horizontal positional change of the first target 103 relative to the chuck top 70, and based on the acquired results, the position of the chuck top 70 may be corrected.

[0075] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive, and the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0076] 1. Inspection equipment 22 Control Unit 50 Aligner 60 Upper Camera 70 Zipper Top 71 Second Target 80 Lower Camera 90 Pogo Frame 100 probe cards 102 Probe 103 First Target 110 Reference Camera B2 Mating Position B3 Contact position B4 Contact position P electrode W wafer

Claims

1. An inspection device for inspecting a substrate, a mounting member on which a substrate is placed; a holder for holding a probe card having probes that contact electrodes on a substrate; a moving mechanism that holds the mounting member and moves it horizontally and vertically; a first acquisition unit fixed to the moving mechanism for acquiring a position of the probe; a second acquisition unit for acquiring the positions of the electrodes on the substrate placed on the placement member; a control unit, a plurality of first targets are provided on at least one of the probe card and the holder; the mounting member is provided with second targets in the same number as the first targets, further comprising a detection unit for simultaneously detecting the first target and the second target corresponding to the first target; The control unit acquiring a representative position of the probe relative to a probe reference position using the first acquisition unit; a step of moving the mounting member to a region below the second acquisition unit, the region being located in a region not overlapping in plan view with the probe card held by the holding unit, and acquiring a representative position of the electrode relative to an electrode reference position using the second acquisition unit; acquiring, using the detection unit, matched positions at which all of the first targets simultaneously have a predetermined positional relationship with the second targets corresponding to the first targets in a plan view; and acquiring a contact position, which is the position of the mounting member when the probe and the electrode are brought into contact, based on the representative position of the probe and the representative position of the electrode, and correcting the contact position based on the matched position.

2. The inspection apparatus according to claim 1 , wherein the step of acquiring the representative position of the probe includes the step of acquiring, using the first acquisition unit, a representative position of the first target as the probe reference position.

3. 3 . The inspection device according to claim 1 , wherein the step of acquiring the representative position of the substrate includes the step of acquiring, using the second acquisition unit, the representative position of the second target as the electrode reference position.

4. 4. The inspection device according to claim 1, wherein the correcting step corrects the contact position based on a positional deviation of the matched position from a contact reference position.

5. the correcting step corrects the contact position based on a positional deviation of the matched position from a contact reference position; The inspection device according to claim 2 , wherein the contact reference position is acquired based on the probe reference position and the electrode reference position.

6. The control unit 6. The inspection device according to claim 1, further comprising the step of lifting the mounting member after moving the mounting member to the corrected contact position.

7. 7. The inspection apparatus according to claim 6, wherein the step of raising the mounting member includes a step of using the detection unit to acquire a horizontal position change of the second target relative to the probe card during the raising, or a horizontal position change of the first target relative to the substrate during the raising, and correcting the contact position based on the acquired results.

8. 8. The inspection device according to claim 1, wherein the first acquisition unit is a first imaging unit that captures an image of an upward direction.

9. 9. The inspection device according to claim 1, wherein the second acquisition unit is a second imaging unit that images a downward direction.

10. 10. The inspection device according to claim 1, wherein the detection unit is a third imaging unit provided below the second target in the moving mechanism and capturing an image above.

11. The mounting member is a through hole penetrating in the vertical direction; a window member made of a transparent material that closes the through hole, the second target is provided on the window member, The inspection device according to claim 10 , wherein the third imaging unit captures images of the first target and the second target through the through-hole.

12. 10. The inspection device according to claim 1, wherein the detection unit is a third imaging unit that is provided above the first target and captures an image below.

13. 1. A method for inspecting a substrate using an inspection device, comprising: The inspection device includes: a mounting member on which a substrate is placed; a holder for holding a probe card having probes that contact electrodes on a substrate; a moving mechanism that holds the mounting member and moves it horizontally and vertically; a first acquisition unit fixed to the moving mechanism for acquiring a position of the probe card; a second acquisition unit for acquiring the position of the electrode on the substrate placed on the mounting member, a plurality of first targets are provided on at least one of the probe card and the holder; a plurality of second targets corresponding to the first targets are provided on the mounting member; further comprising a detection unit for simultaneously detecting the first target and the second target corresponding to the first target; a step of acquiring a representative position of the probe relative to a probe reference position using the first acquisition unit; and a step of moving the mounting member to a region below the second acquisition unit, the region being located in a region not overlapping in a plan view with the probe card held by the holder, and acquiring a representative position of the electrode relative to an electrode reference position using the second acquisition unit. acquiring, using the detection unit, matched positions at which all of the first targets simultaneously have a predetermined positional relationship with the second targets corresponding to the first targets in a plan view; and acquiring a contact position, which is the position of the mounting member when the probe and the electrode are brought into contact, based on a representative position of the probe and a representative position of the electrode, and correcting the contact position based on the matched position.

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