Inductor Components

Abstract

To provide an inductor component which can reduce electrical resistance in inductor wiring.SOLUTION: An inductor component comprises: an element assembly; inductor wiring which is provided in the element assembly and is wound around on a plane surface; and insulation walls, perpendicular to an extension direction of the inductor wiring, which are provided on both lateral surfaces of the inductor wiring that are parallel to the plane surface. The insulation walls each have: a first portion provided on an inner peripheral surface on the innermost periphery of the inductor wiring; and a second portion provided on an outer peripheral surface on the outermost periphery of the inductor wiring. On a cross section perpendicular to the extension direction of the inductor wiring, at least one of the first portion and the second portion is inclined to a first direction perpendicular to the plane surface.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to inductor components. [Background technology]

[0002] A conventional inductor component is described in Japanese Patent No. 6879355 (Patent Document 1). The inductor component comprises an element body, an inductor wiring provided within the element body and wound on a plane, and a resin wall provided on the side of the inductor wiring. The width of the resin wall located at the innermost periphery of the inductor wiring is greater than the width of the resin wall located between the resin wall located at the innermost periphery and the resin wall located at the outermost periphery. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6879355 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in conventional inductor components, the width of the resin wall located at the innermost periphery of the inductor wiring is relatively large, which may result in a small line width of the inductor wiring and an increase in the electrical resistance of the inductor wiring.

[0005] Therefore, an object of the present disclosure is to provide an inductor component that can reduce the electrical resistance of inductor wiring. [Means for solving the problem]

[0006] In order to solve the above problems, an inductor component according to one aspect of the present disclosure comprises: The base body and an inductor wiring provided within the element body and wound on a plane; an insulating wall provided on each side of the inductor wiring in a direction perpendicular to the extending direction of the inductor wiring and parallel to the plane; the insulating wall has a first portion provided on an inner peripheral surface of the innermost periphery of the inductor wiring and a second portion provided on an outer peripheral surface of the outermost periphery of the inductor wiring, In a cross section perpendicular to the extending direction of the inductor wiring, at least one of the first portion and the second portion is inclined with respect to a first direction perpendicular to the plane.

[0007] According to this aspect, the cross-sectional area of ​​the inductor wiring can be increased compared to when at least one of the first portion and the second portion is not inclined with respect to the first direction, thereby reducing the electrical resistance of the inductor wiring. [Effects of the Invention]

[0008] According to an inductor component according to one aspect of the present disclosure, the electrical resistance of the inductor wiring can be reduced. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic plan view showing a first embodiment of an inductor component. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II of FIG. [Figure 3] FIG. 3 is a cross-sectional view taken along the line III-III in FIG. [Figure 4] FIG. 10 is a schematic cross-sectional view showing a modified example of the inductor component. [Figure 5A] 1A to 1C are explanatory diagrams illustrating a method for manufacturing an inductor component. [Figure 5B] 1A to 1C are explanatory diagrams illustrating a method for manufacturing an inductor component. [Figure 5C] 1A to 1C are explanatory diagrams illustrating a method for manufacturing an inductor component. [Figure 5D] 1A to 1C are explanatory diagrams illustrating a method for manufacturing an inductor component. [Figure 5E] 1A to 1C are explanatory diagrams illustrating a method for manufacturing an inductor component. [Figure 5F]1A to 1C are explanatory diagrams illustrating a method for manufacturing an inductor component. [Figure 5G] 1A to 1C are explanatory diagrams illustrating a method for manufacturing an inductor component. [Figure 5H] 1A to 1C are explanatory diagrams illustrating a method for manufacturing an inductor component. [Figure 5I] 1A to 1C are explanatory diagrams illustrating a method for manufacturing an inductor component. [Figure 5J] 1A to 1C are explanatory diagrams illustrating a method for manufacturing an inductor component. [Figure 5K] 1A to 1C are explanatory diagrams illustrating a method for manufacturing an inductor component. [Figure 5L] 1A to 1C are explanatory diagrams illustrating a method for manufacturing an inductor component. [Figure 5M] 1A to 1C are explanatory diagrams illustrating a method for manufacturing an inductor component. [Figure 6] FIG. 4 is a schematic plan view showing a second embodiment of the inductor component. [Figure 7] FIG. 7 is a cross-sectional view taken along the line VII-VII in FIG. 6. [Figure 8] FIG. 8 is an enlarged view of part A in FIG. 7. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, an inductor component according to one aspect of the present disclosure will be described in detail with reference to the illustrated embodiments. Note that the drawings include some schematic views and may not reflect actual dimensions or proportions.

[0011] First Embodiment (composition) Fig. 1 is a schematic plan view showing a first embodiment of an inductor component. Fig. 2 is a cross-sectional view taken along line II-II in Fig. 1. Fig. 3 is a cross-sectional view taken along line III-III in Fig. 1. For convenience, seed layers are omitted from Figs. 2 and 3. Fig. 3 corresponds to an example of a "cross-section perpendicular to the extending direction of the inductor wiring" as defined in the claims.

[0012] The inductor component 1 is mounted in electronic devices such as personal computers, DVD players, digital cameras, TVs, mobile phones, car electronics, etc., and is, for example, a component having an overall rectangular parallelepiped shape. However, the shape of the inductor component 1 is not particularly limited, and may be a cylindrical shape, a polygonal cylindrical shape, a truncated conical shape, or a truncated polygonal conical shape.

[0013] As shown in Figures 1 to 3, the inductor component 1 comprises an element body 10, an inductor wiring 150 provided within the element body 10 and wound on a plane, an insulating layer 30 covering the outer surface of the inductor wiring 150, a first escape wiring 21 and a second escape wiring 22 provided within the element body 10 so that their end faces are exposed from the first main surface 10a of the element body 10, a first external terminal 51 and a second external terminal 52 exposed on the first main surface 10a of the element body 10, and a coating film 60 provided on the first main surface 10a of the element body 10.

[0014] The shape of the element body 10 is not particularly limited, but in this embodiment it is a rectangular parallelepiped. The outer surfaces of the element body 10 include a first main surface 10a and a second main surface 10b, and a first side surface 10c, a second side surface 10d, a third side surface 10e, and a fourth side surface 10f located between the first main surface 10a and the second main surface 10b and connecting the first main surface 10a and the second main surface 10b. The first main surface 10a and the second main surface 10b face each other. The first side surface 10c and the second side surface 10d face each other. The third side surface 10e and the fourth side surface 10f face each other.

[0015] In the drawings, the thickness direction of the element body 10 is the Z direction, the direction from the second main surface 10b toward the first main surface 10a is the forward Z direction, and the direction opposite to the forward Z direction is the reverse Z direction. In this specification, the main surface side of the first main surface 10a or the second main surface 10b on which the external terminals 51 and 52 are provided is referred to as the upper side. In this embodiment, the forward Z direction is the upper side. In a plane of the element body 10 perpendicular to the Z direction, the longitudinal direction of the element body 10, in which the first external terminals 51 and the second external terminals 52 are aligned, is referred to as the X direction, and the width direction of the element body 10, which is perpendicular to the longitudinal direction, is referred to as the Y direction. In addition, the X direction, from the first side surface 10c toward the second side surface 10d, is referred to as the forward X direction, and the reverse direction of the forward X direction is referred to as the reverse X direction. In the Y direction, from the third side surface 10e toward the fourth side surface 10f is referred to as the forward Y direction, and the reverse direction of the forward Y direction is referred to as the reverse Y direction. The Z direction corresponds to an example of the "first direction" described in the claims.

[0016] The element body 10 includes a first magnetic layer 11 and a second magnetic layer 12 arranged in this order along the forward Z direction. This "order" simply indicates the positional relationship between the first magnetic layer 11 and the second magnetic layer 12, and is not related to the order in which the first magnetic layer 11 and the second magnetic layer 12 are formed.

[0017] The first magnetic layer 11 and the second magnetic layer 12 each contain magnetic powder and a resin containing the magnetic powder. The resin is, for example, an organic insulating material such as epoxy, a mixture of epoxy and acrylic, or a mixture of epoxy, acrylic, and other materials. The magnetic powder is, for example, an FeSi-based alloy such as FeSiCr, an FeCo-based alloy, an Fe-based alloy such as NiFe, or an amorphous alloy thereof. The magnetic powder may be ferrite. The average particle size of the magnetic powder is preferably 5 μm or less. The first magnetic layer 11 and the second magnetic layer 12 may not contain organic resin, such as a sintered body of ferrite or magnetic powder.

[0018] The inductor wiring 150 is wound on the XY plane between the first magnetic layer 11 and the second magnetic layer 12. Specifically, the first magnetic layer 11 is located in the reverse Z direction relative to the inductor wiring 150, and the second magnetic layer 12 is located in the forward Z direction relative to the inductor wiring 150 and in a direction perpendicular to the forward Z direction. The XY plane corresponds to an example of a "plane" described in the claims.

[0019] The inductor wiring 150 extends in a spiral shape. Specifically, the inductor wiring 150 is spirally wound clockwise from the outer circumferential end to the inner circumferential end when viewed from the Z direction. The inductor wiring 150 has a central axis AX. In this embodiment, the axis AX direction is parallel to the Z direction. Note that "parallel" here does not necessarily mean a completely parallel state, but also includes a substantially parallel state.

[0020] The number of turns of the inductor wiring 150 is preferably one or more. This can improve the inductance value. "One or more turns" refers to a state in which, in a cross section perpendicular to the axis of the inductor wiring, the inductor wiring has portions that are adjacent in the radial direction as viewed from the axial direction and run parallel to the winding direction, while "less than one turn" refers to a state in which, in a cross section perpendicular to the axis, the inductor wiring does not have portions that are adjacent in the radial direction as viewed from the axial direction and run parallel to the winding direction. In this embodiment, the number of turns of the inductor wiring 150 is 2.5 turns.

[0021] The inductor wiring 150 has a wiring portion 153 wound on the XY plane, and a first pad portion 151 and a second pad portion 152 provided at the ends of the wiring portion 153 in the extending direction. The wiring portion is the wound portion of the inductor wiring, and is the portion of the inductor wiring excluding the pad portion. The pad portion is a portion to which other wiring such as an outgoing wiring is connected, and is formed wider than the wiring portion. Specifically, the first pad portion 151 is provided at the inner peripheral end of the inductor wiring 150, and the second pad portion 152 is provided at the outer peripheral end of the inductor wiring 150.

[0022] The inductor wiring 150 has a top surface 150a and a bottom surface 150b that face each other in the Z direction. Specifically, the inductor wiring 150 has the top surface 150a facing the forward Z direction (i.e., upward) and the bottom surface 150b facing the reverse Z direction. The inductor wiring 150 has both side surfaces 150c and 150d that connect the top surface 150a and the bottom surface 150b. In other words, the inductor wiring 150 has both side surfaces 150c and 150d in a direction perpendicular to the extension direction of the inductor wiring 150 and parallel to the XY plane (hereinafter, this direction will be referred to as the "wiring width direction"). Specifically, the inductor wiring 150 has a first side surface 150c facing radially outward and a second side surface 150d facing radially inward.

[0023] The second pad 152 of the inductor wiring 150 is connected to the first external terminal 51 via the first escape wiring 21 that contacts the top surface of the second pad 152. The first pad 151 of the inductor wiring 150 is connected to the second external terminal 52 via the second escape wiring 22 that contacts the top surface of the first pad 151. With the above configuration, the inductor wiring 150 is electrically connected to the first external terminal 51 and the second external terminal 52.

[0024] The inductor wiring 150 is preferably made of Au, Pt, Pd, Ag, Cu, Al, Co, Cr, Zn, Ni, Ti, W, Fe, Sn, In, or a compound thereof. The inductor wiring 150 is formed by, for example, electrolytic plating. The inductor wiring 150 may also be formed by electroless plating, sputtering, vapor deposition, coating, or the like.

[0025] The first escape wiring 21 extends in the forward Z direction from the top surface of the second pad portion 152 of the inductor wiring 150 and penetrates the insulating layer 30 and the second magnetic layer 12. The first escape wiring 21 is preferably made of Cu, Ag, Au, Fe, or a compound thereof. The first escape wiring 21 includes a first via wiring 212 provided on the top surface of the second pad portion 152 of the inductor wiring 150 and penetrating the insulating layer 30, and a first columnar wiring 211 extending in the forward Z direction from the top surface of the first via wiring 212 and penetrating the second magnetic layer 12, with its end face exposed on the first main surface 10a of the element body 10. The via wiring is a conductor having a smaller line width (diameter, cross-sectional area) than the columnar wiring.

[0026] The second escape wiring 22 extends in the forward Z direction from the top surface of the first pad portion 151 of the inductor wiring 150 and penetrates the insulating layer 30 and the second magnetic layer 12. The second escape wiring 22 is preferably made of Cu, Ag, Au, Fe, or a compound thereof. The second escape wiring 22 includes a second via wiring 222 provided on the top surface of the first pad portion 151 of the inductor wiring 150 and penetrating the insulating layer 30, and a second columnar wiring 221 extending in the forward Z direction from the top surface of the second via wiring 222, penetrating the second magnetic layer 12, and having an end face exposed on the first main surface 10a of the element body 10. The first and second escape wirings 21 and 22 are preferably made of the same material as the inductor wiring 150.

[0027] The first and second external terminals 51, 52 are provided on the first main surface 10a of the element body 10. The first and second external terminals 51, 52 are made of a conductive material, and have a three-layer structure in which, from the inside to the outside, Cu, which has low electrical resistance and excellent stress resistance, Ni, which has excellent corrosion resistance, and Au, which has excellent solder wettability and reliability, are arranged in this order.

[0028] The first external terminal 51 contacts an end face of the first escape wiring 21 exposed from the first main surface 10a of the element body 10, and is electrically connected to the first escape wiring 21. As a result, the first external terminal 51 is electrically connected to the second pad portion 152 of the inductor wiring 150. The second external terminal 52 contacts an end face of the second escape wiring 22 exposed from the first main surface 10a of the element body 10, and is electrically connected to the second escape wiring 22. As a result, the second external terminal 52 is electrically connected to the first pad portion 151 of the inductor wiring 150. Note that in FIG. 1, the first and second external terminals 51 and 52 are shown by two-dot chain lines for convenience.

[0029] The insulating layer 30 is made of an insulating material that does not contain magnetic material. The insulating material is preferably made of, for example, epoxy, acrylic, phenol, polyimide, or a mixture thereof. The insulating layer 30 has a base insulating layer 70 that covers the bottom surface 150b of the inductor wiring 150, an interlayer insulating layer 31 that covers the top surface 150a of the inductor wiring 150, and insulating walls 32 that cover both side surfaces 150c, 150d of the inductor wiring 150. The materials of the base insulating layer 70, the interlayer insulating layer 31, and the insulating walls 32 may be the same or different.

[0030] The base insulating layer 70 is stacked on the first magnetic layer 11 so as to cover the entire upper surface of the first magnetic layer 11. The inductor wiring 150 is stacked on the base insulating layer 70. The entire bottom surface 150b of the inductor wiring 150 is in contact with the upper surface of the base insulating layer 70. This ensures electrical insulation between the bottom surface 150b of the inductor wiring 150 and other conductive members.

[0031] The interlayer insulating layer 31 is provided on the top surface 150a of the inductor wiring 150 except for the connection areas with the first and second escape wirings 21 and 22. This ensures electrical insulation between the top surface 150a of the inductor wiring 150 and other conductive members.

[0032] 3, the insulating wall 32 is provided on each of the first side surface 150c and the second side surface 150d. The insulating wall 32 is in contact with the entire surface of the first side surface 150c and the entire surface of the second side surface 150d. The lower surface of the insulating wall 32 is in contact with the upper surface of the base insulating layer 70. In other words, the insulating wall 32 is provided on the innermost inner surface 150d1 of the inductor wiring 150, the outermost outer surface 150c1 of the inductor wiring 150, and between the turns of the inductor wiring 150.

[0033] The innermost circumference of the inductor wiring refers to the radially inner circumference of the inductor wiring if the inductor wiring has less than one turn, and refers to the radially inner circumference of the part of the inductor wiring that makes up one turn, including the inner peripheral end, if the inductor wiring has one or more turns. The outermost circumference of the inductor wiring refers to the radially outer circumference of the inductor wiring if the inductor wiring has less than one turn, and refers to the radially outer circumference of the part of the inductor wiring that makes up one turn, including the outer peripheral end, if the inductor wiring has one or more turns.

[0034] The insulating wall 32 has a first portion P1 provided on the inner peripheral surface 150d1 of the innermost periphery of the inductor wiring 150, a second portion P2 provided on the outer peripheral surface 150c1 of the outermost periphery of the inductor wiring 150, and a third portion P3 other than the first portion P1 and the second portion P2. The third portion P3 is an insulating wall 32 located between turns of the inductor wiring 150. Therefore, if the number of turns of the inductor wiring 150 is less than one, the third portion P3 does not exist. In this embodiment, in a cross section perpendicular to the extension direction of the inductor wiring 150 (i.e., the cross section shown in FIG. 3), each of the first to third portions P1 to P3 is formed in a straight line. However, without being limited thereto, each of the first to third portions P1 to P3 may have a curved line shape or a shape that combines a curved line and a straight line.

[0035] In a cross section perpendicular to the extension direction of the inductor wiring 150, at least one of the first portion P1 and the second portion P2 is inclined with respect to a first direction (Z direction) perpendicular to the XY plane. Preferably, in a cross section perpendicular to the extension direction of the inductor wiring 150, at least one of the first portion P1 and the second portion P2 is inclined so that the width of the inductor wiring 150 in a direction parallel to the XY plane increases toward the forward or reverse direction of the first direction. In this embodiment, both the first portion P1 and the second portion P2 are inclined with respect to the first direction (Z direction) perpendicular to the XY plane.

[0036] Specifically, the first portion P1 is formed so as to approach the axis AX of the inductor wiring 150 (so as to tilt radially inward of the inductor wiring 150) as it moves toward the forward Z direction. The second portion P2 is formed so as to move away from the axis AX of the inductor wiring 150 (so as to tilt radially outward of the inductor wiring 150) as it moves toward the forward Z direction. The tilt directions of the first portion P1 and the second portion P2 are not particularly limited. The first portion P1 may be formed so as to move away from the axis AX of the inductor wiring 150 as it moves toward the forward Z direction. The second portion P2 may be formed so as to approach the axis AX of the inductor wiring 150 as it moves toward the forward Z direction.

[0037] In this embodiment, in the cross section shown in FIG. 2, the first portion P1 and the second portion P2 are arranged parallel to the Z direction. That is, the first portion P1 and the second portion P2 are not inclined with respect to the Z direction. Here, "parallel" means that the angle between the first portion P1 and the Z direction is less than 5°, and the angle between the second portion P2 and the Z direction is less than 5°. In this manner, it is sufficient that at least one of the first portion P1 and the second portion P2 is inclined with respect to the Z direction in any of multiple cross sections perpendicular to the extension direction of the inductor wiring 150. In other words, the first portion P1 may be inclined with respect to the Z direction in at least a part of the innermost periphery of the inductor wiring 150, and the second portion P2 may be inclined with respect to the Z direction in at least a part of the outermost periphery of the inductor wiring 150.

[0038] According to the inductor component 1, in a cross section perpendicular to the extension direction of the inductor wiring 150, the cross-sectional area of ​​the inductor wiring 150 can be increased compared to when at least one of the first portion P1 and the second portion P2 is not inclined with respect to the Z direction, thereby reducing the electrical resistance of the inductor wiring 150.

[0039] 3, in a cross section perpendicular to the extending direction of the inductor wiring 150, the angle formed by at least one of the first portion P1 and the second portion P2 and the XY plane (in other words, the upper surface of the base insulating layer 70) is preferably 45° or more and 85° or less. Here, the angle formed by the first portion P1 and the XY plane refers to the angle (i.e., the two angles, acute angle and obtuse angle) formed by the first portion P1 and the XY plane that is closer to the inner magnetic path. Furthermore, the angle formed by the second portion P2 and the XY plane refers to the angle (i.e., the two angles, acute angle and obtuse angle) formed by the second portion P2 and the XY plane that is closer to the outer magnetic path.

[0040] Specifically, the angle θ1 between the first portion P1 and the XY plane is 45° or more and 85° or less. The angle θ2 between the second portion P2 and the XY plane is 45° or more and 85° or less. If the first portion P1 is not linear but, for example, curved, the angle θ1 may be the angle closer to the inner magnetic path between the XY plane and a line passing through the corner C1 on the forward Z direction side of the first portion P1 and the corner C2 on the reverse Z direction side of the first portion P1. Similarly, if the second portion P2 is not linear but, for example, curved, the angle θ2 may be the angle closer to the outer magnetic path between the XY plane and a line passing through the corner C3 on the forward Z direction side of the second portion P2 and the corner C4 on the reverse Z direction side of the second portion P2.

[0041] According to the above configuration, the angle θ1 is 45° or more, thereby ensuring the filling efficiency of the second magnetic layer 12. If the angle θ1 is less than 45°, it becomes difficult to fill the space between the first portion P1 and the insulating base layer 70 with magnetic powder, especially magnetic powder with a particle size of several μm or more, and the filling efficiency of the second magnetic layer 12 may deteriorate. If the angle θ1 is 85° or less, the electrical resistance of the inductor wiring 150 can be effectively reduced. The same effect can be achieved by the angle θ2 being 45° or more and 85° or less.

[0042] 3, the number of turns of the inductor wiring 150 is preferably one or more, the insulating wall 32 has a third portion P3 other than the first portion P1 and the second portion P2, and in a cross section perpendicular to the extending direction of the inductor wiring 150, the third portion P3, which is arranged adjacent to at least one of the first portion P1 and the second portion P2 in a direction parallel to the XY plane (Y direction), is arranged parallel to the Z direction. This "parallel" means that the angle formed between the adjacent third portion P3 and the Z direction is less than 5°.

[0043] Specifically, the third portion P3 (the third portion P3 on the right side of the paper in FIG. 3) arranged adjacent to the first portion P1 in the Y direction is arranged parallel to the Z direction. The third portion P3 (the third portion P3 on the left side of the paper in FIG. 3) arranged adjacent to the second portion P2 in the Y direction is arranged parallel to the Z direction.

[0044] According to the above configuration, the cross-sectional area of ​​at least one of the portions of the inductor wiring 150 located at the innermost periphery and the outermost periphery can be more reliably increased, and the cross-sectional area of ​​the portion located between the innermost and outermost peripheries can also be secured.

[0045] Preferably, in a cross section perpendicular to the extending direction of the inductor wiring 150, when the width of at least one of the first portion P1 and the second portion P2 is W1 and the width of the third portion P3 arranged adjacent to at least one of the first portion P1 and the second portion P2 in a direction parallel to the XY plane (Y direction) is W2, the following relationship is satisfied: 0.8<(W1 / W2) / <1. Here, the width of the first portion P1 refers to the length of the lower surface of the first portion P1 in the wiring width direction. The width of the second portion P2 refers to the length of the lower surface of the second portion P2 in the wiring width direction. The width of the third portion P3 refers to the length of the lower surface of the third portion P3 in the wiring width direction.

[0046] Specifically, when the width of the first portion P1 is W1a and the width of the third portion P3 (the third portion P3 on the right side of the paper in FIG. 3) arranged adjacent to the first portion P1 in the Y direction is W2a, the relationship 0.8<(W1a / W2a) / <1 is satisfied. Furthermore, when the width of the second portion P2 is W1b and the width of the third portion P3 (the third portion P3 on the left side of the paper in FIG. 3) arranged adjacent to the second portion P2 in the Y direction is W2b, the relationship 0.8<(W1b / W2b) / <1 is satisfied. Each of the widths W1a, W1b, W2a, and W2b is, for example, approximately 5 μm or more and 15 μm or less.

[0047] According to the above configuration, by satisfying (W1 / W2) / <1, the width W1 of at least one of the first portion P1 and the second portion P2 can be made smaller than the width W2 of the third portion P3 adjacent to the first portion P1 and the second portion P2 in the Y direction. This allows at least one of the first portion P1 and the second portion P2 to be selectively tilted during development, as described below, making it easy to obtain an inductor component 1 having a tilted insulating wall 32. Furthermore, the volume of at least one of the first portion P1 and the second portion P2 is reduced, thereby increasing the volume of the second magnetic layer 12 and improving the inductance value. Furthermore, by satisfying 0.8<(W1 / W2), the contact area between the lower surface of at least one of the first portion P1 and the second portion P2 and the upper surface of the underlying insulating layer 70 can be ensured, thereby ensuring the adhesive strength between at least one of the first portion P1 and the second portion P2 and the underlying insulating layer 70.

[0048] (Variation) 4 is a schematic cross-sectional view showing an inductor component 1A according to a modified example, and corresponds to FIG.

[0049] As shown in FIG. 4, the number of turns of the inductor wiring 150 is one or more, the insulating wall 32 has a third portion P3 other than the first portion P1 and the second portion P2, and in a cross section perpendicular to the extension direction of the inductor wiring 150, the third portion P3 arranged adjacent to at least one of the first portion P1 and the second portion P2 in a direction parallel to the XY plane (Y direction) is inclined with respect to the Z direction, and the angle formed by at least one of the first portion P1 and the second portion P2 and the XY plane (in other words, the upper surface of the base insulating layer 70) is smaller than the angle formed by the third portion P3 arranged adjacent to the XY plane.

[0050] Specifically, in the inductor component 1A, the third portion P3 (the third portion P3 on the right side of the paper in FIG. 4) arranged adjacent to the first portion P1 in the Y direction is inclined with respect to the Z direction. More specifically, the third portion P3 arranged adjacent to the first portion P1 in the Y direction is formed so as to approach the axis AX of the inductor wiring 150 as it moves toward the forward Z direction.

[0051] The third portion P3 (the third portion P3 on the left side of the paper in FIG. 4) arranged adjacent to the second portion P2 in the Y direction is inclined with respect to the Z direction. More specifically, the third portion P3 arranged adjacent to the second portion P2 in the Y direction is formed so as to move away from the axis AX of the inductor wiring 150 as it moves toward the forward Z direction.

[0052] The angle θ1 formed between the first portion P1 and the XY plane is smaller than the angle θ3 formed between the XY plane and a third portion P3 arranged adjacent to the first portion P1 in the Y direction. This angle θ3 refers to the angle on the first portion P1 side of the angles (i.e., the two angles, acute angle and obtuse angle) formed between the XY plane and the third portion P3 arranged adjacent to the first portion P1 in the Y direction. The angle θ2 formed between the second portion P2 and the XY plane is smaller than the angle θ4 formed between the XY plane and the third portion P3 arranged adjacent to the second portion P2 in the Y direction. This angle θ4 refers to the angle on the second portion P2 side of the angles (i.e., the two angles, acute angle and obtuse angle) formed between the XY plane and the third portion P3 arranged adjacent to the second portion P2 in the Y direction.

[0053] According to the above configuration, the cross-sectional area of ​​the inductor wiring 150 can be made uniform along the extension direction of the inductor wiring 150. This allows current to flow efficiently through the inductor wiring 150. On the other hand, if at least one of the angle θ1 and the angle θ2 is larger than the angle between the adjacent third portion P3 and the XY plane, there will be portions of the inductor wiring 150 where the cross-sectional area is small, which may increase the electrical resistance of the inductor wiring 150.

[0054] (Manufacturing method) Next, a method for manufacturing the inductor component 1 will be described with reference to Figures 5A to 5M. Figures 5A to 5G correspond to the cross section taken along line III-III in Figure 1 (Figure 3). Figures 5H to 5M correspond to the cross section taken along line II-II in Figure 1 (Figure 2). For convenience, the second escape wiring side is omitted from Figures 5H to 5M.

[0055] As shown in Fig. 5A, an insulating base layer 70 that does not contain a magnetic material is formed on a substrate 90. The substrate 90 is made of, for example, sintered ferrite and has a flat plate shape.

[0056] The insulating base layer 70 is made of, for example, a polyimide resin that does not contain a magnetic material. The insulating base layer 70 is formed by coating the polyimide resin on the substrate 90 by printing, painting, or the like. After the insulating base layer 70 is coated, it may be patterned using photolithography to leave only the polyimide resin in the region where the inductor wiring 150 is to be formed. Note that before forming the insulating base layer 70, an insulating material that will serve as a grinding protection layer may be formed on the substrate 90.

[0057] 5B, a seed layer 81 is formed on the underlying insulating layer 70. Specifically, a material for the seed layer 81 (for example, a titanium / copper alloy) is deposited on the upper surface of the underlying insulating layer 70 by sputtering, and then patterned by photolithography to form the seed layer 81.

[0058] 5C, an insulating wall material 320 is deposited on the underlying insulating layer 70. Specifically, for example, a photosensitive permanent photoresist is laminated on the underlying insulating layer 70. The photosensitive permanent photoresist is a photoresist that is not removed after processing.

[0059] As shown in FIG. 5D, a photomask M is placed on the insulating wall material 320, and ultraviolet light is irradiated onto the insulating wall material 320 from above the photomask M, thereby exposing the insulating wall material 320. The photomask M has openings Ma formed in a shape corresponding to the shape of the insulating wall 32. Therefore, after the ultraviolet light irradiation, exposed portions 321 having a shape corresponding to the shape of the insulating wall 32 are formed in the insulating wall material 320. At this time, as shown in FIG. 5D, the seed layer 81 is arranged between adjacent exposed portions 321.

[0060] 5E, the insulating wall material 320 is developed to remove the insulating wall material 320 other than the exposed portion 312, thereby forming the insulating wall 32. At this time, as will be described in detail later, at least a part of the insulating wall 32 is tilted. Thereafter, heat is applied as necessary to harden the insulating wall 32.

[0061] Here, an example of a method for tilting at least a portion of the insulating wall 32 will be described. For example, by using a spray developer or the like and adjusting the flow rate (e.g., 100 to 300 mL / min) of the developer and rinse solution and the water pressure (e.g., 0.1 to 0.3 MPa) during development of the insulating wall material 320, stress can be applied to at least a portion of the insulating wall 32 to tilt it. In particular, one example of a method for selectively tilting only the insulating wall 32 to be tilted is to set the width of the other insulating wall 32 somewhat wider to increase its mechanical strength. Specifically, as described above, for example, when the width of the first portion P1 is W1 and the width of the third portion P3 is W2, the relationship 0.8<(W1 / W2) / <1 may be satisfied. The first portion P1 is an example of the insulating wall 32 to be tilted, and the third portion P3 is an example of the other insulating wall 32.

[0062] 5F, electrolytic plating is performed while supplying power to the seed layer 81. As a result, an inductor wiring 150 is formed between the insulating walls 32.

[0063] As shown in FIGS. 5G and 5H, an interlayer insulating layer 31 is formed on a portion of the top surface 150a of the inductor wiring 150. Specifically, a dry film resist (DFR) is laminated on the top surface 150a of the inductor wiring 150, exposed to light, and developed. As a result, the material in the unexposed portion is removed to form the interlayer insulating layer 31. At this time, the dry film resist located in the portion where the top surface 150a of the inductor wiring 150 contacts the first and second escape wirings 21 and 22 is removed.

[0064] As shown in FIG. 5I, a seed layer 82 is formed by sputtering so as to cover the exposed portion of the top surface 150a of the inductor wiring 150, the interlayer insulating layer 31, and the insulating wall 32.

[0065] As shown in FIG. 5J, a first via wiring 212 and a first columnar wiring 211 are formed on the second pad portion 152 of the inductor wiring 150. Specifically, a resist film 330 is formed on the seed layer 82, and an opening is provided in the resist film 330 at a position corresponding to the first via wiring 212. Thereafter, electrolytic plating is performed while supplying power to the seed layer 82, and a plating layer is formed in the opening. As a result, the first via wiring 212 and the first columnar wiring 211 are formed in the opening. At this time, a second via wiring 222 and a second columnar wiring 221 (not shown) are also formed.

[0066] As shown in FIG. 5K, the resist film 330 is peeled off, the exposed seed layer 82 is removed, and the second magnetic layer 12 is pressure-bonded from above the substrate 90 toward the inductor wiring 150.

[0067] 5L, the top surface of the second magnetic layer 12 is ground to expose the top surface of the first columnar wire 211. At this time, the top surface of the second columnar wire 221 (not shown) is also exposed.

[0068] As shown in FIG. 5M, a coating film 60 is formed on the upper surface of the second magnetic layer 12. The coating film 60 is formed of, for example, solder resist. The substrate 90 is then ground to expose the lower surface of the base insulating layer 70. The first magnetic layer 11 is then pressure-bonded from below the base insulating layer 70 toward the inductor wiring 150. This covers the lower surface of the base insulating layer 70 with the first magnetic layer 11. The lower surface of the first magnetic layer 11 is then ground to adjust the thickness of the first magnetic layer 11. The first external terminal 51 is then formed to cover the upper surface of the first columnar wiring 211. At this time, the second external terminal 52 is also formed to cover the upper surface of the second columnar wiring 221 (not shown). The first and second external terminals 51 and 52 have a three-layer structure of Cu / Ni / Au formed by, for example, electroless plating. The substrate is then singulated using a dicer or the like to manufacture the inductor component 1.

[0069] Second Embodiment Fig. 6 is a schematic plan view showing a second embodiment of the inductor component. Fig. 7 corresponds to a cross-sectional view taken along line VII-VII in Fig. 6. Fig. 8 is an enlarged view of part A in Fig. 7. The second embodiment differs from the first embodiment mainly in that the inductor wiring has two layers and that the insulating walls provided on the first and second pad portions are also inclined. These different configurations will be explained below. The other configurations are the same as those of the first embodiment, and the same reference numerals as those of the first embodiment will be used, and their explanation will be omitted.

[0070] 6 and 7, the inductor component 1B includes a first inductor wiring 161 and a second inductor wiring 162 disposed within the element body 10. The second inductor wiring 162 corresponds to an example of the "inductor wiring" set forth in the claims. The cross section shown in FIG. 7 corresponds to an example of the "cross section perpendicular to the extending direction of the inductor wiring" set forth in the claims.

[0071] Each of the first inductor wiring 161 and the second inductor wiring 162 is wound on the XY plane between the first magnetic layer 11 and the second magnetic layer 12. Specifically, the first magnetic layer 11 is located on the reverse Z direction side of the first inductor wiring 161 and the second inductor wiring 162, and the second magnetic layer 12 is located in the forward Z direction and in a direction perpendicular to the forward Z direction of the first inductor wiring 161 and the second inductor wiring 162.

[0072] The first inductor wiring 161 is a wiring that extends in a spiral shape and is wound on the XY plane. In this embodiment, the number of turns of the first inductor wiring 161 is two. When viewed from the Z direction, the first inductor wiring 161 is wound in a spiral shape in a clockwise direction from the inner peripheral end to the outer peripheral end. The first inductor wiring 161 has an innermost inner peripheral surface 161d1 and an outermost outer peripheral surface 161c1.

[0073] The first inductor wiring 161 has a wiring portion 1613 wound on the XY plane, and a first pad portion 1611 and a second pad portion 1612 provided at ends in the extending direction of the wiring portion 1613. Specifically, the first pad portion 1611 is provided at the inner peripheral end of the first inductor wiring 161, and the second pad portion 1612 is provided at the outer peripheral end of the first inductor wiring 161. Each of the first pad portion 1611 and the second pad portion 1612 is formed wider than the wiring portion 1613.

[0074] The second inductor wiring 162 is disposed on the reverse Z direction side of the first inductor wiring 161, and is a wiring that extends in a spiral shape wound on the XY plane. The second inductor wiring 162 is electrically connected to the first inductor wiring 161. In this embodiment, the number of turns of the second inductor wiring 162 is 2.5 turns.

[0075] The second inductor wiring 162 is spirally wound clockwise from the outer circumferential end toward the inner circumferential end when viewed from the Z direction. The second inductor wiring 162 is disposed between the first inductor wiring 161 and the first magnetic layer 11. As a result, each of the first inductor wiring 161 and the second inductor wiring 162 is disposed along the Z direction. The second inductor wiring 162 has an inner circumferential surface 162d1 at the innermost periphery and an outer circumferential surface 162c1 at the outermost periphery.

[0076] The second inductor wiring 162 has a wiring portion 1623 wound on the XY plane, and a first pad portion 1621 and a second pad portion 1622 provided at ends in the extending direction of the wiring portion 1623. Specifically, the first pad portion 1621 is provided at the inner peripheral end of the second inductor wiring 162, and the second pad portion 1622 is provided at the outer peripheral end of the second inductor wiring 162. Each of the first pad portion 1621 and the second pad portion 1622 is formed wider than the wiring portion 1623. The first and second pad portions 1621 and 1622 correspond to an example of a "pad portion" recited in the claims.

[0077] The second pad 1612 of the first inductor wiring 161 is connected to the second external terminal 52 via the second escape wiring 22 in contact with the top surface of the second pad 1612. The second pad 1622 of the second inductor wiring 162 is connected to the first external terminal 51 via the first escape wiring 21 in contact with the top surface of the second pad 1622. The first pad 1621 of the second inductor wiring 162 is connected to the first pad 1611 of the first inductor wiring 161 via the via wiring 25 in contact with the top surface of the first pad 1621. With the above configuration, the first inductor wiring 161 and the second inductor wiring 162 are connected in series and electrically connected to the first external terminal 51 and the second external terminal 52.

[0078] The first escape wiring 21 is made of a conductive material, extends in the forward Z direction from the top surface of the second inductor wiring 162, and penetrates the insulating layer 30 and the second magnetic layer 12. The first escape wiring 21 includes: a via wiring 25 provided on the top surface of the second pad portion 1622 of the second inductor wiring 162 and penetrating the inside of the interlayer insulating layer 31; a first columnar wiring 41 extending from the top surface of the via wiring 25 in the forward Z direction and penetrating the inside of the second magnetic layer 12; a via wiring 25 provided on the top surface of the first columnar wiring 41 and penetrating the inside of the interlayer insulating layer 31; and a second columnar wiring 42 extending from the top surface of the via wiring 25 in the forward Z direction and penetrating the inside of the second magnetic layer 12, the end surface of which is exposed on the first main surface 10a of the element body 10.

[0079] The second escape wiring 22 is made of a conductive material, extends in the forward Z direction from the top surface of the first inductor wiring 161, and penetrates the inside of the second magnetic layer 12. The second escape wiring 22 is provided on the top surface of the second pad portion 1612 of the first inductor wiring 161, and includes a via wiring 25 that penetrates the inside of the interlayer insulating layer 31, and a third columnar wiring 43 that extends in the forward Z direction from the top surface of the via wiring 25, penetrates the inside of the second magnetic layer 12, and has an end face exposed on the first main surface 10a of the element body 10.

[0080] The insulating layer 30 covers the outer surface of the first inductor wiring 161 and the outer surface of the second inductor wiring 162. In this embodiment, the interlayer insulating layer 31 of the insulating layer 30 is also disposed between the first inductor wiring 161 and the second inductor wiring 162. This ensures insulation between the first inductor wiring 161 and the second inductor wiring 162.

[0081] The insulating wall 32 provided in the first inductor wiring 161 is arranged parallel to the Z direction. Specifically, a first portion of the insulating wall 32 provided on the innermost inner circumferential surface 161d1 of the first inductor wiring 161, a second portion of the insulating wall 32 provided on the outermost outer circumferential surface 161c1 of the first inductor wiring 161, and a third portion of the insulating wall 32 provided between the turns of the first inductor wiring 161 are each arranged parallel to the Z direction.

[0082] A first portion of the insulating wall 32 provided on the inner peripheral surface 162d1 of the innermost periphery of the second inductor wiring 162 and a second portion of the insulating wall 32 provided on the outer peripheral surface 162c1 of the outermost periphery of the second inductor wiring 162 are inclined with respect to the Z direction. Specifically, the first portion of the insulating wall 32 provided on the inner peripheral surface 162d1 is formed so as to approach the central axis of the second inductor wiring 162 toward the forward Z direction. The second portion of the insulating wall 32 provided on the outer peripheral surface 162c1 is formed so as to move away from the central axis of the second inductor wiring 162 toward the forward Z direction. A third portion of the insulating wall 32 provided between the turns of the second inductor wiring 162 is disposed parallel to the Z direction.

[0083] As shown in FIG. 8, the first pad portion 1621 of the second inductor wiring 162 includes at least one of a portion of the innermost inner surface 162d1 of the second inductor wiring 162 and a portion of the outermost outer surface 162c1, and in a cross section perpendicular to the extension direction of the second inductor wiring 162, the insulating wall 32 provided on at least one of the above is inclined with respect to the Z direction.

[0084] Specifically, the first pad portion 1621 of the second inductor wiring 162 includes a part of the inner circumferential surface 162d1 of the second inductor wiring 162. The insulating wall 32 provided on a part of this inner circumferential surface 162d1 is inclined with respect to the Z direction. More specifically, the insulating wall 32 provided on a part of this inner circumferential surface 162d1 is formed so as to approach the central axis of the second inductor wiring 162 as it moves toward the forward Z direction. Note that the insulating wall 32 provided on a part of this inner circumferential surface 162d1 may be formed so as to move away from the central axis of the second inductor wiring 162 as it moves toward the forward Z direction.

[0085] According to the above configuration, the insulating wall 32 provided on the first pad portion 1621 is inclined, which increases the cross-sectional area of ​​the first pad portion 1621 and further reduces the electrical resistance of the second inductor wiring 162. In particular, when the insulating wall 32 provided on a part of the inner circumferential surface 162d1 is formed so as to approach the central axis of the second inductor wiring 162 as it moves toward the forward Z direction, as in this embodiment, the area of ​​the upper surface of the first pad portion 1621 can be increased, which increases the via diameter d of the via wiring 25 connected to the first pad portion 1621. This improves the adhesion between the via wiring 25 and the first and second inductor wirings 161 and 162. Furthermore, because the area of ​​the upper surface of the first pad portion 1621 can be increased, it is possible to ensure a margin for exposure alignment of the second-layer insulating wall 32 (the insulating wall 32 designated by symbol Z1 in FIG. 8 ) without narrowing the wiring width of the second-layer first inductor wiring 161. This makes it possible to prevent the second insulating wall 32 from being formed outside the interlayer insulating layer 31 even if a deviation occurs in the exposure alignment of the second insulating wall 32.

[0086] Preferably, as shown in FIG. 8, in a cross section perpendicular to the extension direction of the second inductor wiring 162, the insulating wall 32 provided on the wiring portion 1623 is arranged parallel to the Z direction, and when the width of the insulating wall 32 provided on the wiring portion 1623 is W3 and the width of the insulating wall 32 provided on at least one of the wiring portions 1623 is W4, the relationship 0.5<(W4 / W3)<0.8 is satisfied.

[0087] Here, the term "parallel" means that the angle formed between the insulating wall 32 provided on the wiring portion 1623 and the Z direction is less than 5°. The width W3 refers to the length in the wiring width direction of the lower surface of the insulating wall 32 provided on the wiring portion 1623 arranged parallel to the Z direction. Similarly, the width W4 refers to the length in the wiring width direction of the lower surface of the insulating wall 32 provided on the first pad portion 1621 that is inclined with respect to the Z direction.

[0088] According to the above configuration, by satisfying (W4 / W3)<0.8, the width W4 of the insulating wall 32 provided on the first pad portion 1621 can be made smaller than 0.8 times the width W3 of the insulating wall 32 provided on the wiring portion 1623. This allows even the insulating wall 32 provided on the first pad portion 1621 to be inclined during development. Furthermore, by satisfying 0.5<(W4 / W3), the contact area between the lower surface of the insulating wall 32 provided on the first pad portion 1621 and the upper surface of the underlying insulating layer 70 can be ensured, and the adhesive strength between the insulating wall 32 provided on the first pad portion 1621 and the underlying insulating layer 70 can be ensured.

[0089] Specifically, when viewed from the Z direction, the outer shape of the wiring portion 1623 has many linear portions. Therefore, many of the insulating walls 32 provided on the wiring portion 1623 also have linear portions when viewed from the Z direction. In contrast, when viewed from the Z direction, the outer shape of the first pad portion 1621 is often curved (approximately circular in this embodiment). Therefore, the shape of the insulating walls 32 provided on the first pad portion 1621 is also often curved when viewed from the Z direction. An insulating wall 32 that is curved when viewed from the Z direction is more resistant to a force applied in a direction perpendicular to the Z direction than an insulating wall 32 that is linear, and is therefore less likely to tilt. By satisfying (W4 / W3)<0.8, even an insulating wall 32 provided on the first pad portion 1621 that is curved when viewed from the Z direction can be tilted because its width is relatively small. The method of inclining the insulating wall 32 provided on the first pad portion 1621 is not limited to the above method, and for example, a method using a spray developer or a two-fluid developer that can spray chemicals more strongly than the spray developer described in the first embodiment may be adopted.

[0090] Preferably, as shown in FIG. 7, the second pad portion 1622 of the second inductor wiring 162 includes at least one of a portion of the innermost inner surface 162d1 of the second inductor wiring 162 and a portion of the outermost outer surface 162c1, and in a cross section perpendicular to the extension direction of the second inductor wiring 162, the insulating wall 32 provided on at least one of the above is inclined with respect to the Z direction.

[0091] Specifically, the second pad portion 1622 of the second inductor wiring 162 includes a part of the outer peripheral surface 162c1 of the outermost periphery of the second inductor wiring 162. The insulating wall 32 provided on a part of this outer peripheral surface 162c1 is inclined with respect to the Z direction. More specifically, the insulating wall 32 provided on a part of this outer peripheral surface 162c1 is formed so as to become more distant from the central axis of the second inductor wiring 162 as it moves toward the forward Z direction. Note that the insulating wall 32 provided on a part of this outer peripheral surface 162c1 may be formed so as to become closer to the central axis of the second inductor wiring 162 as it moves toward the forward Z direction.

[0092] According to the above configuration, the insulating wall 32 provided on the second pad portion 1622 of the second inductor wiring 162 is inclined, thereby increasing the cross-sectional area of ​​the second pad portion 1622 and further reducing the electrical resistance of the second inductor wiring 162. In particular, when the insulating wall 32 provided on a part of the outer peripheral surface 162c1 is formed so as to become more distant from the central axis of the second inductor wiring 162 as it moves toward the forward Z direction, the area of ​​the upper surface of the second pad portion 1622 can be increased, thereby further increasing the via diameter of the via wiring 25 connected to the second pad portion 1622. This improves the adhesion between the first escape wiring 21, the via wiring 25, and the second inductor wiring 162. Furthermore, because the area of ​​the upper surface of the second pad portion 1622 can be increased, a margin for exposure alignment of the second-layer insulating wall 32 (the insulating wall 32 designated by symbol Z2 in FIG. 7) can be secured without narrowing the wiring width of the first escape wiring 21. This makes it possible to prevent the second insulating wall 32 from being formed outside the interlayer insulating layer 31 even if a deviation occurs in the exposure alignment of the second insulating wall 32.

[0093] The present disclosure is not limited to the above-described embodiments, and design modifications are possible without departing from the spirit and scope of the present disclosure. For example, various combinations of the features of the first and second embodiments may be used. In the above-described embodiments, the widths W1 and W2 are compared at the same cross section, but they may be at different cross sections as long as they are perpendicular to the extension direction of the inductor wiring 150. The same applies to the widths W3 and W4.

[0094] In the above embodiment, first and second lead-out wiring, first and second external terminals, an interlayer insulating layer, a base insulating layer, and a coating film were provided, but these components are not essential and may not be provided or may be replaced with other components.

[0095] In the above embodiment, the inductor wiring has one or two layers, but it may have three or more layers.

[0096] In the above embodiment, an insulating wall is provided in the entire region between adjacent turns of the inductor wiring, but a second magnetic layer may be provided between adjacent turns. Specifically, in a cross section perpendicular to the extending direction of the inductor wiring, insulating walls may be provided on both side surfaces of the inductor wiring, and a second magnetic layer may be provided between adjacent turns.

[0097] In the first embodiment, in a cross section perpendicular to the extension direction of the inductor wiring, there were two third portions of the insulating wall, but when there are three or more third portions, i.e., when the number of turns of the inductor wiring exceeds 2.5 turns, these third portions, excluding the third portion arranged adjacent to the first portion and the third portion arranged adjacent to the second portion, may be parallel to or inclined with respect to the Z direction.

[0098] In the second embodiment, both the insulating wall provided on the inner peripheral surface of the innermost periphery of the first inductor wiring and the insulating wall provided on the outer peripheral surface of the outermost periphery of the first inductor wiring are arranged parallel to the Z direction, but at least one of the insulating walls may be inclined with respect to the Z direction. In this case, the first inductor wiring corresponds to an example of the "inductor wiring" recited in the claims.

[0099] The present disclosure includes the following aspects. <1> The base body and an inductor wiring provided within the element body and wound on a plane; an insulating wall provided on each side of the inductor wiring in a direction perpendicular to the extending direction of the inductor wiring and parallel to the plane; the insulating wall has a first portion provided on an inner peripheral surface of the innermost periphery of the inductor wiring and a second portion provided on an outer peripheral surface of the outermost periphery of the inductor wiring, In a cross section perpendicular to the extending direction of the inductor wiring, at least one of the first portion and the second portion is inclined with respect to a first direction perpendicular to the plane. <2> In a cross section perpendicular to the extending direction of the inductor wiring, At least one of the first portion and the second portion is inclined so that the width of the inductor wiring in a direction parallel to the plane increases toward the forward direction or the reverse direction of the first direction. <1> The inductor component according to claim 1. <3> In a cross section perpendicular to the extending direction of the inductor wiring, The angle between the at least one portion and the plane is 45° or more and 85° or less. <1> or <2> The inductor component according to claim 1. <4> the inductor wiring has a wiring portion wound on the plane and a pad portion provided at an end of the wiring portion in an extending direction, the pad portion includes at least one of a part of an inner circumferential surface of the innermost periphery and a part of an outer circumferential surface of the outermost periphery, In a cross section perpendicular to the extending direction of the inductor wiring, the insulating wall provided on at least one of the first and second sides is inclined with respect to the first direction. <1> from <3> 10. An inductor component according to any one of the preceding claims. <5> In a cross section perpendicular to the extending direction of the inductor wiring, the insulating wall provided on the wiring portion is arranged parallel to the first direction, where W3 is the width of the insulating wall provided on the wiring portion in a direction parallel to the plane, and W4 is the width of the insulating wall provided on at least one of the wiring portions in a direction parallel to the plane, the relationship 0.5<(W4 / W3)<0.8 is satisfied. <4> The inductor component according to claim 1. <6> The number of turns of the inductor wiring is one or more, the insulating wall has a third portion other than the first portion and the second portion, In a cross section perpendicular to the extending direction of the inductor wiring, the third portion, which is disposed adjacent to the at least one portion in a direction parallel to the plane, is disposed parallel to the first direction; <1> from <5> 10. An inductor component according to any one of the preceding claims. <7> In a cross section perpendicular to the extending direction of the inductor wiring, When the width of the at least one portion in a direction parallel to the plane is defined as W1 and the width of the adjacently disposed third portion in a direction parallel to the plane is defined as W2, the relationship 0.8<(W1 / W2) / <1 is satisfied. <6> The inductor component according to claim 1. <8> The number of turns of the inductor wiring is one or more, the insulating wall has a third portion other than the first portion and the second portion, In a cross section perpendicular to the extending direction of the inductor wiring, the third portion disposed adjacent to the at least one portion in a direction parallel to the plane is inclined with respect to the first direction, an angle formed between the at least one portion and the plane is smaller than an angle formed between the adjacently disposed third portion and the plane; <1> from <5> 10. An inductor component according to any one of the preceding claims. [Explanation of symbols]

[0100] 1, 1A, 1B inductor components 10 Base 10a First principal surface 10b Second principal surface 10c~10f 1st to 4th sides 11 First magnetic layer 12 Second magnetic layer 21 1st lead-out wiring 211 1st pillar wiring 212 First via wiring 22 2nd lead-out wiring 221 2nd pillar wiring 222 Second via wiring 30 insulating layer 31 Interlayer insulating layer 32 Insulating wall 51 First external terminal 52 Second external terminal 60 Coating membrane 70 Undercoat insulation layer 81, 82 seed layer 150 Inductor wiring 161 First inductor wiring 162 Second inductor wiring 150a Top of inductor wiring 150b Bottom of inductor wiring 150c First side of inductor trace 150d Second side of inductor trace 150c1, 161c1, 162c1 Outer surface of the outermost periphery of the inductor wiring 150d1, 161d1, 162d1 Innermost surface of inductor wiring 151, 1611, 1621 First pad section 152, 1612, 1622 Second pad section 153, 1613, 1623 wiring section AX Axis of inductor wiring d via diameter P1~P3 1st to 3rd parts W1a, W1b, W2a, W2b, W3, W4 width Angles between θ1 and θ4

Claims

1. The base body and an inductor wiring provided within the element body and wound on a plane; an insulating wall provided on each side of the inductor wiring in a direction perpendicular to the extending direction of the inductor wiring and parallel to the plane; the insulating wall has a first portion provided on an inner peripheral surface of the innermost periphery of the inductor wiring and a second portion provided on an outer peripheral surface of the outermost periphery of the inductor wiring, the inductor wiring has a wiring portion wound on the plane and a pad portion provided at an end of the wiring portion in an extending direction, the pad portion includes at least one of a part of an inner circumferential surface of the innermost periphery and a part of an outer circumferential surface of the outermost periphery, In a cross section perpendicular to the extending direction of the inductor wiring, At least one of the first portion and the second portion of the insulating wall is inclined with respect to a first direction perpendicular to the plane so that a cross-sectional area of ​​the pad portion increases with increasing distance from the plane, the insulating wall provided on the wiring portion is arranged parallel to the first direction, the insulating wall provided on the pad portion is disposed at an angle with respect to the first direction, where W3 is the width of the insulating wall provided on the wiring portion in a direction parallel to the plane, and W4 is the width of the insulating wall provided on the pad portion in a direction parallel to the plane, the relationship 0.5<(W4 / W3)<0.8 is satisfied. Inductor components.

2. An inductor component as described in claim 1, further comprising via wiring provided on the top surface of the pad portion away from the plane.

3. In a cross section perpendicular to the extending direction of the inductor wiring, 3. The inductor component according to claim 1, wherein at least one of the first portion and the second portion is inclined so that the width of the inductor wiring in a direction parallel to the plane increases as the width increases toward the forward or reverse direction of the first direction.

4. In a cross section perpendicular to the extending direction of the inductor wiring, the angle between the at least one portion and the plane is greater than or equal to 45° and less than or equal to 85°; The inductor component according to claim 1 or 2.

5. the number of turns of the inductor wiring is one or more; the insulating wall has a third portion other than the first portion and the second portion, In a cross section perpendicular to the extending direction of the inductor wiring, 3 . The inductor component according to claim 1 , wherein the third portion, which is disposed adjacent to the at least one portion in a direction parallel to the plane, is disposed parallel to the first direction.

6. In a cross section perpendicular to the extending direction of the inductor wiring, 6. The inductor component according to claim 5, wherein, when W1 is the width of at least one of the portions in a direction parallel to the plane, and W2 is the width of the adjacently arranged third portion in a direction parallel to the plane, the relationship 0.8<(W1 / W2) / <1 is satisfied.

7. the number of turns of the inductor wiring is one or more; the insulating wall has a third portion other than the first portion and the second portion, In a cross section perpendicular to the extending direction of the inductor wiring, the third portion disposed adjacent to the at least one portion in a direction parallel to the plane is inclined with respect to the first direction, 3 . The inductor component according to claim 1 , wherein an angle formed between the at least one portion and the plane is smaller than an angle formed between the adjacent third portion and the plane.

Images