Adhesive tape and packaging

Abstract

To provide an adhesive tape that can be irradiated with microwaves and easily peeled from an adherend.SOLUTION: An adhesive tape has a substrate having heat shrinkability, and a heating part that absorbs microwaves to generate heat.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an adhesive tape and a package. [Background technology]

[0002] Generally, packages (also referred to as adherends) for boxed lunches, fried foods, and the like sold at convenience stores and the like are sealed with adhesive tape to prevent the food inside the package from spilling out (for example, see Patent Document 1 below). Such adhesive tapes have an adhesive layer on the surface. Sealing with adhesive tape can be done in two ways: sealing separate containers, such as boxed lunch containers, or by folding and sealing a single container, such as a container for fried foods. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-211247 Summary of the Invention [Problem to be solved by the invention]

[0004] When a package sealed with the adhesive tape disclosed in Patent Document 1 is heated with microwaves in a microwave oven or the like when eating food, the package becomes extremely hot and difficult to touch, making it difficult to peel off the adhesive tape.

[0005] The present invention has been made to solve the above problems, and has an object to provide a pressure-sensitive adhesive tape that can be easily peeled off from an adherend by irradiating it with microwaves. [Means for solving the problem]

[0006] To achieve the above object, the pressure-sensitive adhesive tape according to the present invention has a heat-shrinkable substrate and a heat-generating portion that generates heat by absorbing microwaves.The heat generating material constituting the heat generating portion is at least one selected from the group consisting of zinc oxide and an acrylic polymer obtained by copolymerizing a cyano group-containing unsaturated compound. [Effects of the Invention]

[0007] According to the pressure-sensitive adhesive tape of the present invention, the pressure-sensitive adhesive tape can be easily peeled off from an adherend by irradiating it with microwaves. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a cross-sectional view showing a pressure-sensitive adhesive tape according to a first embodiment of the present invention. [Figure 2] FIG. 10 is a schematic diagram showing a state in which adhesive tape is attached to a package. [Figure 3] 10 is a schematic diagram showing how the adhesive tape is peeled off from the package. FIG. [Figure 4] FIG. 2 is a cross-sectional view showing a pressure-sensitive adhesive tape according to Modified Example 1 of the present invention. [Figure 5] FIG. 4 is a cross-sectional view showing a pressure-sensitive adhesive tape according to Modified Example 2 of the present invention. [Figure 6] FIG. 10 is a schematic diagram showing a state in which adhesive tape is attached to a packaging body of a modified example. [Figure 7] 10A and 10B are schematic diagrams showing how the adhesive tape is peeled off from the packaging body of the modified example. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. In the description of the drawings, the same elements are given the same reference numerals, and duplicate explanations will be omitted. Furthermore, the dimensional proportions in the drawings are exaggerated for the convenience of explanation and may differ from the actual proportions.

[0010] In this specification, the range "X to Y" means "X or more and Y or less." Unless otherwise specified, operations and physical properties are measured under conditions of room temperature (20 to 25°C) and relative humidity of 45 to 55% RH. In this specification, "(meth)acrylic" refers to "acrylic or methacrylic."

[0011] The adhesive tape 1 is provided to seal the package 50 (see FIG. 2). The shape of the adhesive tape 1 is not particularly limited, and may be any shape such as a square, rectangle, oval, or circle when viewed from the stacking direction. Furthermore, the adhesive tape 1 may have a tab that does not include the adhesive layer 30 to facilitate peeling from the package 50.

[0012] Considering adhesion to the package 50, the adhesive strength of the adhesive tape 1 is preferably 1 N / 25 mm or more, more preferably 2 N / 25 mm or more. Considering peeling from the package 50, the adhesive strength of the adhesive tape 1 is preferably 15 N / 25 mm or less, more preferably 10 N / 25 mm or less. The adhesive strength to the adherend is measured by attaching the adhesive layer 30 side of the adhesive tape 1 to a polypropylene plate and measuring it after 24 hours in accordance with JIS Z0237:2009 using a tensile tester in a 180° direction at a test speed of 300 mm / min. More specifically, the adhesive strength to the adherend is measured by the following method: the adhesive tape 1 is left to stand for one day under standard conditions (23°C, 50% RH), the release liner 40 is peeled off, and the adhesive layer 30 side is attached to a polypropylene plate. After standing under standard conditions for 24 hours, the adhesive strength is measured according to JIS Z0237:2009. Specifically, the adhesive strength is measured by peeling the film in a 180° direction at a test speed of 300 mm / min using a tensile tester. The numerical value is converted into peel force per 25 mm of film width (N / 25 mm). The structure of the adhesive tape 1 will be described below with reference to FIG. 1.

[0013] Fig. 1 is a schematic cross-sectional view of a pressure-sensitive adhesive tape 1 according to the present embodiment. As shown in Fig. 1, the pressure-sensitive adhesive tape 1 according to the first embodiment of the present invention comprises a heat-shrinkable substrate 10, a heat-generating portion 20 that generates heat by absorbing microwaves, a pressure-sensitive adhesive layer 30 formed on the surface of the substrate 10 opposite to the surface on which the heat-generating portion 20 is provided, and a release liner 40 formed on the surface of the pressure-sensitive adhesive layer 30 opposite to the surface on which the substrate 10 is provided. The pressure-sensitive adhesive tape 1 may have other functional layers on the heat-generating portion 20 or between the respective layers. Examples of other functional layers include a printing layer and a primer layer.

[0014] When the pressure-sensitive adhesive tape 1 of this embodiment is irradiated with microwaves by heating in a microwave oven or the like, the heat generating portion 20 generates heat, and the generated heat is transferred to the substrate 10, causing the substrate 10 to shrink. As a result, the pressure-sensitive adhesive layer 30 is subjected to a shrinkage stress, which reduces the contact area at the interface between the pressure-sensitive adhesive layer 30 and the package 50, reducing the adhesive strength of the pressure-sensitive adhesive tape 1, and further causing the pressure-sensitive adhesive tape 1 to peel off from the package 50.

[0015] The release liner 40 prevents foreign matter such as dust from adhering to the pressure-sensitive adhesive layer 30 until the pressure-sensitive adhesive layer 30 is attached to the packaging body 50. Therefore, the release liner 40 is peeled off when the pressure-sensitive adhesive tape 1 is attached to the packaging body 50. For this reason, the pressure-sensitive adhesive tape 1 also includes those that do not have a release liner 40.

[0016] <Base material 10> The substrate 10 is not particularly limited, but a resin film that can shrink in a heated environment is preferably used.

[0017] The shrinkage percentage of the substrate 10 is preferably 10 to 90%, and more preferably 20 to 80%. The shrinkage percentage is calculated from the dimensions of the film before shrinkage and the dimensions after shrinkage when the film is heated to 70°C, based on the following formula:

[0018]

number

[0019] The substrate 10 as described above is not particularly limited, but specific examples include polyester films such as polyethylene terephthalate; polyolefin films such as polyethylene and polypropylene; uniaxially oriented films and biaxially oriented films such as polystyrene; polyamide; polyurethane; polyvinylidene chloride; and polyvinyl chloride. These heat-shrinkable substrates can also be used in combination of two or more types. Among these, it is preferable to use polyester films such as polyethylene terephthalate; or polyolefin films as the substrate 10.

[0020] Considering heat shrinkage and peeling due to heating, the thickness of the substrate 10 is preferably 20 to 100 μm, and more preferably 30 to 100 μm.

[0021] <Heat generating unit 20> Heat generating section 20 generates heat by absorbing microwaves and transfers the heat to substrate 10. This causes substrate 10 to contract and peel off adhesive tape 1. For this reason, heat generating section 20 is preferably disposed adjacent to substrate 10.

[0022] The heat generating unit 20 includes a microwave heat generating material. Examples of microwave heat generating materials include ferrites such as barium titanate, strontium titanate, spinel ferrite, hexagonal ferrite, and garnet ferrite; and inorganic materials containing water of crystallization, such as carbon black, silicon carbide (SiC), titanium carbide (TiC), zirconium carbide (ZrC), tungsten carbide (WC), aluminum oxide (Al2O3), zinc oxide (ZnO), calcium oxide (CaO), CaO·6Al2O3, zirconium boride (ZrB2), titanium boride (TiB2), molybdenum boride (MoB), calcium fluoride (CaF2), titanium oxide, potassium niobate, hydrated aluminum silicate, iron oxide, magnesium oxide, and hydrated aluminosilicates of alkali metals or alkaline earth metals. Among these, zinc oxide is preferred as the inorganic heat generating material from the viewpoint of heat generation.

[0023] The microwave heat generating material may be the above-mentioned microwave heat generating adhesive.

[0024] The heat-generating material may be used alone or in combination of two or more. From the viewpoint of heat generation, a combination of an inorganic heat-generating material and an acrylic polymer obtained by copolymerizing a cyano group-containing unsaturated compound is particularly preferred.

[0025] From the viewpoint of heat generation, the heat generating material that generates heat when exposed to microwaves is preferably at least one selected from the group consisting of zinc oxide and acrylic polymers obtained by copolymerizing a cyano group-containing unsaturated compound.

[0026] From the viewpoint of heat generation and adhesiveness, the heat-generating material is preferably contained in the adhesive layer at 5 to 80 mass %, more preferably 10 to 75 mass %, even more preferably 30 to 70 mass %, and particularly preferably 50 to 65 mass %.

[0027] The heat generating part 20 may contain a binder resin. By including a binder resin, the microwave heat generating material can be bound together. There are no particular restrictions on the binder resin, and thermoplastic resins and thermosetting resins can be used, but the binder used in the heat generating part is preferably a thermoplastic resin.

[0028] Examples of thermoplastic resins include acrylic resins; polyurethane resins; polyolefin resins such as polyethylene resins and polypropylene resins; polystyrene resins; polyvinyl chloride resins; chlorinated polyethylene resins; polyester resins such as polyethylene terephthalate resins, polyethylene naphthalate resins, and polybutylene terephthalate resins; polycarbonate resins; styrene-acrylic copolymers; polyamideimide resins; polyether ether ketone resins; polyetherimide resins; and silicone resins.

[0029] The binder resin may be used alone or in combination of two or more kinds.

[0030] The content of the binder resin in the heat generating part 20 is, for example, 10 to 95 mass %.

[0031] The heat generating portion 20 can be formed by applying a mixture containing the heat generating material and binder resin described above.

[0032] <Adhesive layer 30> In this embodiment, the pressure-sensitive adhesive layer 30 is disposed on the entire surface of the substrate 10. However, the pressure-sensitive adhesive layer is not limited to this configuration, and may be disposed, for example, only on the outer periphery of the substrate 10.

[0033] The adhesive layer 30 is formed from an adhesive composition containing an adhesive.

[0034] The method for forming the pressure-sensitive adhesive layer 30 is not particularly limited, but the pressure-sensitive adhesive layer 30 may be formed by directly applying a pressure-sensitive adhesive composition onto the substrate 10, or the pressure-sensitive adhesive layer 30 may be formed on a release liner 40, which is then attached to the substrate 10. Specifically, a method may be used in which the pressure-sensitive adhesive composition is applied onto the release liner 40, and the pressure-sensitive adhesive layer 30 made of the pressure-sensitive adhesive composition is transferred to the substrate 10.

[0035] The method for applying the pressure-sensitive adhesive composition to the substrate 10 or the release liner 40 is not particularly limited, and the composition can be applied using a known application device such as a roll coater, knife coater, air knife coater, bar coater, blade coater, slot die coater, lip coater, or gravure coater.

[0036] Considering heat generation and peelability, the thickness of the pressure-sensitive adhesive layer is preferably 10 to 150 μm, more preferably 20 to 120 μm, and even more preferably 30 to 100 μm.

[0037] [Adhesive] Examples of the pressure-sensitive adhesive include acrylic pressure-sensitive adhesives, rubber pressure-sensitive adhesives, silicone pressure-sensitive adhesives, urethane pressure-sensitive adhesives, polyester pressure-sensitive adhesives, styrene-diene block copolymer pressure-sensitive adhesives, vinyl alkyl ether pressure-sensitive adhesives, polyamide pressure-sensitive adhesives, fluorine-based pressure-sensitive adhesives, etc. Among these, acrylic pressure-sensitive adhesives are particularly preferred from the viewpoint of adhesive reliability.

[0038] The acrylic polymer constituting the acrylic pressure-sensitive adhesive is formed by using a monomer mixture containing an adhesive (meth)acrylic acid alkyl ester as the main monomer component, and optionally a monomer (copolymerizable monomer) that can be copolymerized with the (meth)acrylic acid alkyl ester.

[0039] Examples of (meth)acrylic acid alkyl esters include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, cyclohexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, decyl (meth)acrylate, dodecyl (meth)acrylate, myristyl (meth)acrylate, palmityl (meth)acrylate, and stearyl (meth)acrylate. These may be used alone or in combination of two or more. Among these, butyl (meth)acrylate and / or 2-ethylhexyl (meth)acrylate are preferred from the viewpoint of adhesive performance.

[0040] From the viewpoint of exhibiting adhesive performance, the content of the (meth)acrylic acid alkyl ester is preferably 70% by mass or more, more preferably 80% by mass or more, and even more preferably 90% by mass or more, based on the total amount of monomers in the monomer mixture. Also, from the viewpoint of peeling from the adherend, the content of the (meth)acrylic acid alkyl ester is preferably 99.5% by mass or less, more preferably 99% by mass or less, based on the total amount of monomers in the monomer mixture.

[0041] Examples of copolymerizable monomers copolymerizable with (meth)acrylic acid alkyl esters include carboxyl group-containing vinyl monomers such as (meth)acrylic acid, maleic acid, fumaric acid, crotonic acid, itaconic acid, myristoleic acid, palmitoleic acid, and oleic acid; carboxylic acid anhydride group-containing vinyl monomers such as maleic anhydride and itaconic anhydride; hydroxyl group-containing monomers such as hydroxyalkyl (meth)acrylates (2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate, and glycerin dimethacrylate; amide group-containing monomers such as acrylamide, methacrylamide, N-vinylpyrrolidone, and N,N-dimethylacrylamide; amino group-containing monomers such as aminoethyl (meth)acrylate and (meth)acryloylmorpholine; aromatic vinyl compounds such as styrene and substituted styrenes; cyano group-containing monomers such as acrylonitrile; and vinyl esters such as vinyl acetate. These may be used alone or in combination of two or more.

[0042] The content of the copolymerizable monomer in all the monomers is preferably 20% by mass or less, and more preferably 10% by mass or less (lower limit: 0% by mass).

[0043] The adhesive may be of any of a water-dispersion type, a solvent type, and a solventless type.

[0044] [Crosslinking agent] The pressure-sensitive adhesive composition may contain a crosslinking agent in addition to the acrylic polymer. Known crosslinking agents can be used as the crosslinking agent. Examples of crosslinking agents include, but are not limited to, isocyanate-based crosslinking agents, epoxy-based crosslinking agents, metal chelate-based crosslinking agents, aziridine-based crosslinking agents, oxazoline-based crosslinking agents, and carbodiimide-based crosslinking agents.

[0045] When a crosslinking agent is added, the amount of the crosslinking agent added is preferably 0.1 to 10 parts by mass, and more preferably 0.5 to 5 parts by mass, relative to 100 parts by mass of the acrylic polymer.

[0046] [Other additives] The pressure-sensitive adhesive composition may further contain other additives known in the art, such as tackifiers, fillers, pigments, UV absorbers, wetting agents, and preservatives.

[0047] <Release liner 40> The pressure-sensitive adhesive tape 1 of the present embodiment may have a release liner 40. The release liner is a member that has the function of protecting the pressure-sensitive adhesive layer 30 and preventing a decrease in adhesiveness. The release liner 40 is peeled off from the pressure-sensitive adhesive tape 1 when the tape is attached to a package 50.

[0048] Examples of the release liner 40 include, but are not limited to, plastic films such as polyester films such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, and polyolefin films such as polypropylene and polyethylene; and papers such as fine paper, glassine paper, and kraft paper.

[0049] The thickness of release liner 40 is typically about 10 to 400 μm. A layer made of a release agent such as silicone may be provided on the surface of release liner 40 to improve the releasability of pressure-sensitive adhesive layer 30. When such a layer is provided, the thickness of the layer is typically about 0.01 to 5 μm.

[0050] Next, a method of using the adhesive tape 1 will be described with reference to Figures 2 and 3. Figure 2 is a schematic diagram showing the adhesive tape 1 attached to a package 50. Figure 3 is a schematic diagram showing the adhesive tape 1 being peeled off from the package 50.

[0051] First, as shown in Fig. 2, adhesive tape 1 is applied to packaging body 50 so as to seal packaging body 50. In this embodiment, packaging body 50 is formed by folding a single container such as a container for deep-fried foods. With folded portion 51 of packaging body 50 overlapping main body portion 52, adhesive tape 1 is applied to folded portion 51 and main body portion 52.

[0052] When microwaves from a microwave oven or the like are irradiated onto the package 50, the heat generating portion 20 generates heat, causing the substrate 10 to contract, and a part of the adhesive tape 1 peels off from the package 50, as shown in FIG.

[0053] Examples of the packaging body 50 include bags and containers. Examples of materials for bags and containers include resin. The resin is not particularly limited, but examples include polyethylene resin, polypropylene resin, polystyrene resin, methacrylic resin, polyvinyl chloride resin, polyamide resin, polycarbonate resin, polyethylene terephthalate resin, polybutylene terephthalate resin, cellulose acetate resin, ethylene-vinyl alcohol copolymer resin (EVOH, etc.), etc.

[0054] <Variation 1> Next, the configuration of the adhesive tape 2 according to the first modification will be described with reference to Fig. 4. Fig. 4 is a cross-sectional view showing the adhesive tape 2 according to the first modification.

[0055] 4, the pressure-sensitive adhesive tape 2 according to the first modification includes, from top to bottom, a substrate 10, a heat-generating portion 20, a pressure-sensitive adhesive layer 30, and a release liner 40. The configuration of each layer is the same as that of the pressure-sensitive adhesive tape 1 according to the above-described embodiment.

[0056] <Variation 2> Next, the configuration of the adhesive tape 3 according to the second modification will be described with reference to Fig. 5. Fig. 5 is a cross-sectional view showing the adhesive tape 3 according to the second modification.

[0057] 5, the pressure-sensitive adhesive tape 3 according to Modification 2 has, from top to bottom, a substrate 10, a pressure-sensitive adhesive layer 130, and a release liner 40. The configurations of the substrate 10 and the release liner 40 are the same as those of the pressure-sensitive adhesive tape 1 according to the above-described embodiment.

[0058] The adhesive layer 130 of the adhesive tape 3 according to Modification 2 includes a heat-generating portion. Specific examples of the adhesive layer 130 include a form in which the adhesive layer includes a (non-heat-generating) adhesive and a (non-adhesive) microwave heat-generating material; a form in which the adhesive layer includes a microwave heat-generating adhesive (a form in which the adhesive is a microwave heat-generating material); and a form in which the adhesive layer includes a microwave heat-generating adhesive and a (non-adhesive) microwave heat-generating material.

[0059] Examples of microwave heat-generating adhesives include adhesives made of acrylic polymers obtained by copolymerizing a cyano group-containing unsaturated compound.

[0060] Examples of (meth)acrylic acid alkyl esters constituting the acrylic polymer obtained by copolymerizing a cyano group-containing unsaturated compound include those listed above. Among them, from the viewpoint of adhesive performance, butyl (meth)acrylate and / or 2-ethylhexyl (meth)acrylate are preferred. Butyl (meth)acrylate is even more preferred because of its high dielectric constant.

[0061] From the viewpoint of exhibiting adhesive properties, the content of the (meth)acrylic acid ester constituting the acrylic polymer obtained by copolymerizing a cyano group-containing unsaturated compound is preferably 70 mass% or more, more preferably 75 mass% or more, based on the total amount of monomers in the monomer mixture. Also, from the viewpoint of peeling from the adherend, the content of the (meth)acrylic acid ester is preferably 99 mass% or less, more preferably 97 mass% or less, based on the total amount of monomers in the monomer mixture.

[0062] Examples of cyano group-containing unsaturated compounds include acrylonitrile, methyl-2-cyanoacrylate, ethyl-2-cyanoacrylate, n-butyl cyanoacrylate, and 2-octyl cyanoacrylate. Among them, cyano group-containing unsaturated compounds are preferably cyanoacrylates such as methyl-2-cyanoacrylate, ethyl-2-cyanoacrylate, n-butyl cyanoacrylate, and 2-octyl cyanoacrylate. The content of the cyano group-containing unsaturated compound in all monomers constituting the acrylic polymer is preferably 1 to 30% by mass, and more preferably 3 to 20% by mass.

[0063] Other copolymerizable monomers copolymerizable with alkyl (meth)acrylates may also be used as monomers constituting acrylic polymers obtained by copolymerizing cyano-containing unsaturated compounds. Examples of such monomers include carboxyl-containing vinyl monomers such as (meth)acrylic acid, maleic acid, fumaric acid, crotonic acid, itaconic acid, myristoleic acid, palmitoleic acid, and oleic acid; carboxylic acid anhydride-containing vinyl monomers such as maleic anhydride and itaconic anhydride; hydroxyl-containing monomers such as hydroxyalkyl methacrylates (e.g., 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate; hydroxyl-containing monomers such as glycerin dimethacrylate; amide-containing monomers such as acrylamide, methacrylamide, N-vinylpyrrolidone, and N,N-dimethylacrylamide; amino-containing monomers such as aminoethyl (meth)acrylate and (meth)acryloylmorpholine; aromatic vinyl compounds such as styrene and substituted styrene; and vinyl esters such as vinyl acetate. These may be used alone or in combination of two or more. Among them, (meth)acrylic acid and hydroxyalkyl (meth)acrylate are preferred as the other monomer. Acrylic acid is more preferred due to its high dielectric constant. The content of the other monomer in the total monomers is preferably 10% by mass or less, more preferably 5% by mass or less, and even more preferably 1% by mass or less (lower limit: 0% by mass).

[0064] The (non-adhesive) microwave heat generating material preferably accounts for 5 to 80 mass % of the pressure-sensitive adhesive layer, and more preferably 10 to 60 mass %, from the viewpoints of heat generation and adhesiveness.

[0065] The present invention is not limited to the above-described embodiment, and various modifications can be made within the scope of the claims.

[0066] For example, in the above-described embodiment, the packaging body 50 is formed by folding a single container such as a container for deep-fried food. However, the packaging body 150 may be formed of separate containers 151 and 152, such as lunch box containers, as shown in Fig. 6. In this case, the adhesive tape 1 is attached to the containers 151 and 152 with the containers 151 and 152 in close contact with each other.

[0067] When the packaging body 150 is irradiated with microwaves from a microwave oven or the like, the adhesive layer 30 generates heat and the substrate 10 contracts, causing a part of the adhesive tape 1 to peel off from the packaging body 150, as shown in FIG.

[0068] In the above-described embodiment, the adherend to which the adhesive tape is adhered has been described as an example of a package of a lunch box, fried food, etc. However, the adherend to which the adhesive tape is adhered is not particularly limited, and may be, for example, an industrial product, etc. [Explanation of symbols]

[0069] 1, 2, 3 adhesive tape, 10 base material, 20 Heat generating part, 30 adhesive layer, 40 release liner, 50, 150 packages, 130 adhesive layer.

Claims

1. a heat-shrinkable substrate; a heat generating portion that generates heat by absorbing microwaves, In the pressure-sensitive adhesive tape, the heat-generating material constituting the heat-generating portion is at least one selected from the group consisting of zinc oxide and an acrylic polymer obtained by copolymerizing a cyano group-containing unsaturated compound.

2. The adhesive tape according to claim 1 , wherein an adhesive layer is formed on the surface of the substrate opposite to the surface on which the heat generating portion is provided.

3. The adhesive tape according to claim 1 , further comprising an adhesive layer formed on the surface of the heat generating portion opposite to the surface on which the substrate is provided.

4. The adhesive tape according to claim 1 , wherein the heat generating portion has adhesive properties.

5. A package to which the adhesive tape according to any one of claims 1 to 4 is attached.

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