Resin composition, film, polarizing sheet, and sunglasses

Abstract

To provide a resin composition which enables provision of a film that is excellent in transparency, is low in a YI value (Yellow Index) and is excellent in impact resistance, and a film, a polarization sheet and sunglasses.SOLUTION: A resin composition contains a polyamide resin containing an alicyclic diamine unit and an aliphatic dicarboxylic acid unit having 7 to 20 carbon atoms, and a polyetheramide elastomer.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a resin composition, a film, a polarizing sheet, and sunglasses, and more particularly to a resin composition containing a polyamide resin as a main component. [Background technology]

[0002] Polyamide resins have excellent mechanical properties such as rigidity and strength, as well as heat resistance, and are therefore used in a wide range of applications, including electrical and electronic applications, automobiles, machinery, and building materials (Patent Documents 1 to 3). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-129271 [Patent Document 2] Japanese Patent Application Laid-Open No. 2013-001906 [Patent Document 3] Japanese Patent Application Laid-Open No. 2012-131977 Summary of the Invention [Problem to be solved by the invention]

[0004] As mentioned above, polyamide resins are used in a wide variety of fields, but they are generally poor in transparency and have not been used in applications where transparency is required. Under these circumstances, the present inventors have investigated the use of polyamide resins for transparent applications such as protective films for polarizing films. However, they have found that when polyamide resins are molded into films, the films tend to be yellowish and have poor impact resistance. In particular, polyamide resin films are prone to chipping during post-processing. The present invention aims to solve these problems, and to provide a resin composition capable of providing a film that has excellent transparency, a low YI (Yellow Index) value, and excellent impact resistance, as well as a film, a polarizing sheet, and sunglasses. [Means for solving the problem]

[0005] In light of the above problems, it has been discovered that the above problems can be solved by using a specific polyamide resin and a polyetheramide elastomer. Specifically, the above problems were solved by the following means. <1> A resin composition comprising a polyamide resin containing an alicyclic diamine unit and an aliphatic dicarboxylic acid unit having 7 to 20 carbon atoms, and a polyetheramide elastomer. <2> The aliphatic dicarboxylic acid unit having 7 to 20 carbon atoms includes a sebacic acid unit and / or a dodecanedioic acid unit. <1> The resin composition according to claim 1. <3> the alicyclic diamine constituting the alicyclic diamine unit contains two substituted or unsubstituted cyclohexane rings; <1> or <2> The resin composition according to claim 1. <4> The alicyclic diamine unit includes a unit represented by formula (PA-1): <1> or <2> The resin composition according to claim 1. [ka] (In formula (PA-1), R 1 are each independently an alkyl group having 1 to 5 carbon atoms, and each n1 is independently an integer of 0 to 3. * is a bonding site to another unit or a terminal group. <5> The polyetheramide elastomer comprises a polyalkylene glycol block and a polyamide block. <1> ~ <4> The resin composition according to any one of the above. <6> the polyalkylene glycol block comprises a polypropylene glycol (PPG) block and / or a polytetramethylene ether glycol (PTMG) block; <5> The resin composition according to claim 1. <7> The content of the polyamide resin in the resin composition is 80 to 99% by mass, and the content of the polyetheramide elastomer is 20 to 1% by mass. <1> ~ <6> The resin composition according to any one of the above. <8> the aliphatic dicarboxylic acid unit having 7 to 20 carbon atoms contains a sebacic acid unit and / or a dodecanedioic acid unit, The alicyclic diamine unit is represented by formula (PA-1), the polyetheramide elastomer comprises a polyalkylene glycol block and a polyamide block; the polyalkylene glycol block comprises a polypropylene glycol (PPG) block and / or a polytetramethylene ether glycol (PTMG) block; The content of the polyamide resin in the resin composition is 80 to 99% by mass, and the content of the polyetheramide elastomer is 20 to 1% by mass. <1> ~ <7> The resin composition according to any one of the above. [ka] (In formula (PA-1), R 1 are each independently an alkyl group having 1 to 5 carbon atoms, and each n1 is independently an integer of 0 to 3. * is a bonding site to another unit or a terminal group. <9> The polyamide resin (A) is an amorphous resin. <1> ~ <8> The resin composition according to any one of the above. <10> The haze of the resin composition when molded into a film with a thickness of 300 μm is 3.0% or less. <1> ~ <9> The resin composition according to any one of the above. <11> When the resin composition is molded into a film having a thickness of 300 μm, the total light transmittance is 80% or more. <1> ~ <10> The resin composition according to any one of the above. <12> It is used as a protective film for polarizing sheets. <1> ~ <11> The resin composition according to any one of the above. <13> <1> ~ <12> A film formed from the resin composition according to any one of the above. <14> <13> A polarizing sheet comprising the film according to claim 1 and a polarizing film. <15> <14> Sunglasses comprising the polarizing sheet according to claim 1. [Effects of the Invention]

[0006] The present invention makes it possible to provide a resin composition capable of providing a film having excellent transparency, a low YI (Yellow Index) value, and excellent impact resistance, as well as a film, a polarizing sheet, and sunglasses. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 2 is a schematic diagram illustrating an example of a layer structure of the heat-bent molded body of the present embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, an embodiment for carrying out the present invention (hereinafter simply referred to as "the present embodiment") will be described in detail. Note that the present embodiment is an example for explaining the present invention, and the present invention is not limited to only this embodiment. In this specification, the symbol "to" is used to mean that the numerical values ​​before and after it are included as the lower limit and upper limit. In this specification, various physical properties and characteristic values ​​are those at 23°C unless otherwise specified. In the description of groups (atomic groups) in this specification, when a notation does not specify whether they are substituted or unsubstituted, it includes both groups (atomic groups) that have no substituents and groups (atomic groups) that have substituents. For example, the term "alkyl group" includes not only alkyl groups that have no substituents (unsubstituted alkyl groups) but also alkyl groups that have substituents (substituted alkyl groups). In this specification, when a notation does not specify whether they are substituted or unsubstituted, it is preferable that they be unsubstituted. Examples of the substituent herein include, preferably, a halogen atom, a cyano group, a nitro group, a hydroxy group, an alkyl group, an alkoxy group, an aryl group, an aryloxy group, a heterocyclic group, a heterocyclic oxy group, an alkenyl group, an alkylsulfanyl group, an arylsulfanyl group, an acyl group, or an amino group; more preferably, a halogen atom, an alkyl group, an alkoxy group, an aryl group, an aryloxy group, an alkenyl group, or an acyl group; even more preferably, an alkyl group, an aryl group, an aryloxy group, or an alkenyl group; and even more preferably, an alkyl group. The formula weight of these substituents is preferably 15 or more and preferably 200 or less. For example, the formula weight of a methyl group (-CH3) is 15. These substituents may further have a substituent, but it is preferable that they have no substituent.

[0009] The term "film" as used herein refers to a generally flat molded body that is thin relative to its length and width, and includes sheets. The term "film" as used herein may be either a single layer or a multilayer, with a single layer being preferred. If the measurement methods, etc. described in the standards shown in this specification differ from year to year, they will be based on the standards in effect as of January 1, 2023, unless otherwise stated. The scale of Figure 1 may not be consistent with reality.

[0010] The resin composition of the present embodiment is characterized by containing a polyamide resin containing an alicyclic diamine unit and an aliphatic dicarboxylic acid unit having 7 to 20 carbon atoms, and a polyetheramide elastomer. By adopting such a configuration, a resin composition can be obtained that can provide a film having excellent transparency, a low YI value (Yellow Index), and excellent impact resistance. The polyamide resin containing an alicyclic diamine unit provides a resin composition with excellent transparency. Furthermore, the compatibility of the aliphatic dicarboxylic acid unit having 7 to 20 carbon atoms in the polyamide resin with the polyetheramide elastomer (particularly the polyalkylene glycol block) further improves the transparency. On the other hand, in general, if a polyamide resin, which is a neat resin, is miscible with an elastomer, the impact resistance of the resulting film is not improved. However, in the present embodiment, the impact resistance can be improved even though the elastomer is miscible with the neat resin, which is highly valuable.

[0011] <Polyamide resin containing alicyclic diamine units and aliphatic dicarboxylic acid units having 7 to 20 carbon atoms> The resin composition of the present embodiment contains a polyamide resin containing an alicyclic diamine unit and an aliphatic dicarboxylic acid unit having 7 to 20 carbon atoms (sometimes referred to as "polyamide resin (A)" in this specification). The alicyclic structure of the polyamide resin (A) improves the transparency of the polyamide resin itself, and the aliphatic dicarboxylic acid unit having 7 to 20 carbon atoms increases the compatibility with the polyetheramide elastomer, improving the transparency of the resin composition.

[0012] In this embodiment, the alicyclic diamine constituting the alicyclic diamine unit is preferably a diamine containing a 5-membered alicyclic ring and / or a 6-membered alicyclic ring. The 5-membered ring and / or the 6-membered ring may or may not have a substituent. The alicyclic diamine more preferably contains two substituted or unsubstituted cyclohexane rings. The alicyclic diamine unit preferably does not contain a carbon-carbon double bond or a carbon-carbon triple bond. Furthermore, the alicyclic diamine is preferably composed only of aliphatic hydrocarbon groups containing an alicyclic structure, except for the terminal amino groups. The molecular weight of the alicyclic diamine constituting the alicyclic diamine unit is preferably 195 or more, more preferably 200 or more, and is preferably 500 or less, more preferably 400 or less, and even more preferably 300 or less. In this embodiment, the alicyclic diamine unit is more preferably represented by formula (PA-0). [ka] (In formula (PA-0), each R is independently a substituent, each n is independently an integer of 0 to 5, L is a single bond or a divalent linking group, and * is a bonding site to another unit or a terminal group.) In formula (PA-0), each R is independently a substituent, and is preferably an aliphatic group having 1 to 6 carbon atoms, more preferably an alkyl group having 1 to 6 carbon atoms, even more preferably a linear or branched alkyl group having 1 to 6 carbon atoms, still more preferably a methyl group, an ethyl group, or a propyl group, and even more preferably a methyl group. In formula (PA-0), n's are each independently an integer of 0 to 5, preferably an integer of 1 or greater, and more preferably an integer of 4 or less, more preferably an integer of 3 or less, even more preferably an integer of 2 or less, and even more preferably an integer of 1 or less. In formula (PA-0), L represents a single bond or a divalent linking group, more preferably a single bond or a divalent aliphatic hydrocarbon group, more preferably a single bond or a divalent alkylene group, even more preferably a single bond or an alkylene group having 1 to 3 carbon atoms, still more preferably a single bond, a methylene group, an ethylene group, or an isopropylene group, and even more preferably a methylene group. * is the bonding site with another unit or a terminal group. That is, it is usually bonded to -C(=O)- to form an amide bond together with NH in formula (PA-0), or to a hydrogen atom to form a terminal amino group together with NH in formula (PA-0), or to a terminal group.

[0013] In this embodiment, the alicyclic diamine unit is more preferably represented by formula (PA-1). [ka] (In formula (PA-1), R 1 are each independently an alkyl group having 1 to 5 carbon atoms, and each n1 is independently an integer of 0 to 3. * is a bonding site to another unit or a terminal group.

[0014] In formula (PA-1), R 1 is an alkyl group having 1 to 5 carbon atoms, preferably a linear or branched alkyl group having 1 to 5 carbon atoms, more preferably a methyl group, an ethyl group or a propyl group, and even more preferably a methyl group. In formula (PA-1), n1 is an integer of 0 to 3, preferably an integer of 1 or more, and more preferably an integer of 2 or less.

[0015] Specific examples of the alicyclic diamine include 1,3-bis(aminomethyl)cyclohexane, 1,4-bis(aminomethyl)cyclohexane, 1,3-diaminocyclohexane, 1,4-diaminocyclohexane, bis(4-aminocyclohexyl)methane, bis(4-amino-3-methylcyclohexyl)methane, 2,2-bis(4-aminocyclohexyl)propane, 2,2-bis(4-amino-3-methylcyclohexyl)propane, bis(aminomethyl)decalin, and bis(aminomethyl)tricyclodecane.

[0016] The polyamide resin (A) contains alicyclic diamine units in a proportion of preferably 75 mol % or more, more preferably 80 mol % or more, even more preferably 85 mol % or more, still more preferably 90 mol % or more, still more preferably 95 mol % or more, particularly preferably 99 mol % or more, and 100 mol % or less of the diamine units constituting the polyamide resin. The alicyclic diamine units may be one type or a combination of two or more types.

[0017] Examples of diamines other than alicyclic diamines that can be used as the raw diamine component of the polyamide resin (A) include aliphatic diamines such as tetramethylenediamine, pentamethylenediamine, 2-methylpentanediamine, hexamethylenediamine, heptamethylenediamine, octamethylenediamine, nonamethylenediamine, decamethylenediamine, dodecamethylenediamine, 2,2,4-trimethyl-hexamethylenediamine, and 2,4,4-trimethylhexamethylenediamine, and diamines having an aromatic ring such as xylylenediamine, bis(4-aminophenyl)ether, paraphenylenediamine, and bis(aminomethyl)naphthalene, and these can be used alone or in combination of two or more.

[0018] In this embodiment, the aliphatic dicarboxylic acid having 7 to 20 carbon atoms constituting the aliphatic dicarboxylic acid unit having 7 to 20 carbon atoms is preferably a linear or branched aliphatic dicarboxylic acid having 7 to 20 carbon atoms, more preferably a linear aliphatic dicarboxylic acid having 7 to 20 carbon atoms, and even more preferably an α,ω-linear aliphatic dicarboxylic acid having 7 to 20 carbon atoms. The number of carbon atoms constituting the linear aliphatic dicarboxylic acid having 7 to 20 carbon atoms is preferably 8 or more, more preferably 9 or more, and even more preferably 10 or more, and is preferably 18 or less, more preferably 16 or less, even more preferably 14 or less, even more preferably 13 or less, and even more preferably 12 or less. The aliphatic dicarboxylic acid having 7 to 20 carbon atoms is preferably HOOC-(CH2) n It is preferably represented by —COOH, where n is an integer of 5 to 18. The aliphatic dicarboxylic acid unit having 7 to 20 carbon atoms that can be used in this embodiment preferably contains at least one of a sebacic acid unit, an undecanedioic acid unit, and a dodecanedioic acid unit, and more preferably contains a sebacic acid unit and / or a dodecanedioic acid unit.

[0019] The polyamide resin (A) contains aliphatic dicarboxylic acid units having 7 to 20 carbon atoms in a proportion of preferably 75 mol % or more, more preferably 80 mol % or more, even more preferably 85 mol % or more, still more preferably 90 mol % or more, still more preferably 95 mol % or more, particularly preferably 99 mol % or more, and 100 mol % or less, of the dicarboxylic acid units constituting the polyamide resin. The aliphatic dicarboxylic acid units having 7 to 20 carbon atoms may be one type, or two or more types may be combined.

[0020] Examples of dicarboxylic acid components other than the aliphatic dicarboxylic acids having 7 to 20 carbon atoms include phthalic acid compounds such as isophthalic acid, terephthalic acid, and orthophthalic acid, and isomers of naphthalenedicarboxylic acid such as 1,2-naphthalenedicarboxylic acid, 1,3-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,5-naphthalenedicarboxylic acid, 1,6-naphthalenedicarboxylic acid, 1,7-naphthalenedicarboxylic acid, 1,8-naphthalenedicarboxylic acid, 2,3-naphthalenedicarboxylic acid, 2,6-naphthalenedicarboxylic acid, and 2,7-naphthalenedicarboxylic acid, and these can be used alone or in combination of two or more.

[0021] Although the polyamide resin (A) contains diamine units and dicarboxylic acid units as its main components, it does not completely exclude other monomer units, and may, of course, contain lactam units such as ε-caprolactam and laurolactam, and aliphatic aminocarboxylic acid units such as aminocaproic acid and aminoundecanoic acid. Here, "main component" refers to the fact that, among the monomer units constituting the polyamide resin (A), the total number of diamine units and dicarboxylic acid units is the largest among all the monomer units. In this embodiment, the total of the diamine units and dicarboxylic acid units in the polyamide resin (A) preferably accounts for 90% by mass or more of all the monomer units, more preferably 95% by mass or more, even more preferably 97% by mass or more, and even more preferably 99% by mass or more.

[0022] The polyamide resin (A) is preferably an amorphous resin. An amorphous resin is a resin that does not have a clear melting point. Specifically, it refers to a resin having a crystalline fusion enthalpy ΔHm of less than 5 J / g, preferably 3 J / g or less, and more preferably 1 J / g or less. The crystalline fusion enthalpy ΔHm is measured in accordance with JIS K7121 and K7122 during the heating process. Specifically, the polyamide resin is measured using a differential scanning calorimeter (DSC) in a nitrogen stream by heating from room temperature to 250°C at a heating rate of 10°C / min, immediately cooling to below room temperature, and then heating again from room temperature to 250°C at a heating rate of 10°C / min.

[0023] It is also preferable to use polyamide resin (A) produced using biomass raw materials (biomass polyamide resin). Using biomass polyamide resin can reduce the environmental impact. Polyamide resin (A) can also be made from monomer raw materials that have been mass balance certified (ISCC PLUS). Mass balance certification means that the amount of renewable raw materials and bio-based raw materials used at each factory or production facility and the amount of products produced and shipped are quantified, and the quality is guaranteed. Furthermore, the polyamide resin (A) may be a recycled product (including recovered products, material recycled products, chemical recycled products, etc.), a rejected product, or scrap material generated during molding of the polyamide resin (A) or the resin composition of the present embodiment.

[0024] The content of polyamide resin (A) in the resin composition of this embodiment is preferably 80% by mass or more, more preferably 82% by mass or more, even more preferably 84% by mass or more, even more preferably 86% by mass or more, and even more preferably 88% by mass or more, based on 100% by mass of the resin composition. By setting the content at or above the lower limit, the glass transition temperature tends to be higher. Furthermore, the content of polyamide resin (A) in the resin composition of this embodiment is preferably 99% by mass or less, more preferably 98% by mass or less, even more preferably 97% by mass or less, even more preferably 95% by mass or less, and even more preferably 93% by mass or less, based on 100% by mass of the resin composition. By setting the content at or below the upper limit, the YI value of the resulting film tends to be lower. The resin composition of the present embodiment may contain only one type of polyamide resin (A), or may contain two or more types. When two or more types are contained, the total amount is preferably within the above range.

[0025] The resin composition of the present embodiment may or may not contain a polyamide resin other than the polyamide resin (A). Examples of polyamide resins other than the polyamide resin (A) include aliphatic polyamide resins other than the polyamide resin (A) and aromatic polyamide resins. Examples of aliphatic polyamide resins include polyamide 4, polyamide 46, polyamide 6, polyamide 66, polyamide 666, polyamide 610, polyamide 11, polyamide 116, polyamide 12, and polyamide 612. Examples of aromatic polyamide resins include polyhexamethylene terephthalamide (polyamide 6T), polyhexamethylene isophthalamide (polyamide 6I), polyamide 66 / 6T, polyamide 9T, polyamide 9MT, polyamide 10T, polyamide 6I / 6T, and xylylenediamine-based polyamide resins (such as MXD6).

[0026] It is also preferable to use a polyamide resin produced from recycled resin or biomass raw material (biomass thermoplastic resin) as the aliphatic polyamide resin and aromatic polyamide resin. Furthermore, the resin composition of this embodiment preferably does not substantially contain any polyamide resin other than the polyamide resin (A). Specifically, the content of polyamide resins other than the polyamide resin (A) contained in the resin composition of this embodiment is preferably less than 10% by mass, more preferably less than 5% by mass, even more preferably less than 3% by mass, even more preferably less than 1% by mass, and even more preferably less than 0.1% by mass, based on 100% by mass of the resin composition.

[0027] <Polyetheramide elastomer> The resin composition of the present embodiment contains a polyetheramide elastomer. A polyetheramide elastomer is an elastomer containing a polyether structure and a polyamide structure. The polyetheramide elastomer in this embodiment is substantially free of an ester structure. "Substantially free of an ester structure" means that the elastomer is not a polyesteretheramide elastomer. More specifically, the content of the ester structure is usually less than 1% by mass of the polyetheramide elastomer, preferably less than 0.5% by mass, more preferably less than 0.1% by mass, and even more preferably less than 0.01% by mass. The polyetheramide elastomer used in this embodiment preferably contains a polyalkylene glycol block and a polyamide block.

[0028] The polyalkylene glycol block is -(alkylene group -O) n2 It is preferable that the -(alkylene group -O) is represented by -. n2The alkylene group in - is preferably a linear or branched alkylene group having 1 to 10 carbon atoms. The number of carbon atoms constituting the alkylene group is preferably 2 or more, more preferably 3 or more, and is preferably 8 or less, more preferably 6 or less, even more preferably 5 or less, and still more preferably 5 or less. Specific examples of the -(alkylene group -O)- include -(CHO)-, -(CHCHO)-, -(CHCHCHO)-, -(CH(CH)CHO)-, -(CHCHCHCHCHO)-, and -(C(CH)CHO)-, and may be a combination of two or more of these. The -(alkylene group -O) n2 n2 in - is preferably 1 to 200, and more preferably 3 to 100. The polyalkylene glycol block preferably comprises a polypropylene glycol (PPG) block and / or a polytetramethylene ether glycol (PTMG) block.

[0029] The proportion of polyalkylene glycol in the polyetheramide elastomer used in this embodiment is preferably 5 mol% or more, more preferably 10 mol% or more, even more preferably 15 mol% or more, and even more preferably 20 mol% or more, relative to 100 mol% of all structural units of the polyetheramide elastomer. Depending on the application, it may be 30 mol% or more, 40 mol% or more, 50 mol% or more, 60 mol% or more, or 65 mol% or more. By ensuring that the proportion is above the lower limit, the effect of improving impact strength when added to a polyamide resin tends to be more improved. Furthermore, the proportion of polyalkylene glycol in the polyetheramide elastomer used in this embodiment is preferably 90 mol% or less, more preferably 85 mol% or less, even more preferably 80 mol% or less, and even more preferably 75 mol% or less, relative to 100 mol% of all structural units of the polyetheramide elastomer. By ensuring that the proportion is below the upper limit, compatibility with the polyamide resin tends to be improved. The polyetheramide elastomer may contain only one type of polyalkylene glycol, or may contain two or more types. When two or more types are contained, the total amount is preferably within the above range.

[0030] The polyamide block is preferably represented by an aliphatic polyamide block, -(NH(CH2) n3 C(=O)) n4 Preferably, the aliphatic polyamide block is represented by the formula: wherein n3 is preferably 3 or more, more preferably 5 or more, even more preferably 7 or more, still more preferably 9 or more, and even more preferably 10 or more, and is preferably 20 or less, more preferably 18 or less, even more preferably 16 or less, still more preferably 14 or less, and even more preferably 12 or less. Furthermore, when n5 is the number of carbon atoms in the aliphatic dicarboxylic acid having 7 to 20 carbon atoms that constitutes the polyamide resin (A) (for example, n5=10 for sebacic acid), the difference (absolute value) between n5 and n3 is preferably small. More specifically, |n5-n3| is preferably 3 or less, and more preferably 2 or less. n4 is preferably 1-300, and more preferably 5-100.

[0031] The proportion of polyamide in the polyetheramide elastomer used in this embodiment is preferably 10 mol% or more, more preferably 15 mol% or more, even more preferably 20 mol% or more, and even more preferably 25 mol% or more, relative to 100 mol% of all structural units of the polyetheramide elastomer. By ensuring that the proportion is above the above-mentioned lower limit, compatibility with amorphous polyamide tends to be further improved. Furthermore, the proportion of polyamide in the polyetheramide elastomer used in this embodiment is preferably 95 mol% or less, more preferably 90 mol% or less, even more preferably 85 mol% or less, and even more preferably 80 mol% or less, relative to 100 mol% of all structural units of the polyetheramide elastomer. By ensuring that the proportion is below the above-mentioned upper limit, the effect of suppressing a decrease in glass transition temperature when added to a polyamide resin tends to be further improved. The polyetheramide elastomer may contain only one type of polyamide, or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.

[0032] In the polyetheramide elastomer used in the present embodiment, the total of the polyalkylene glycol blocks and the polyamide blocks is preferably 90% by mass or more, more preferably 95% by mass or more, and even more preferably 97% by mass or more, based on 100% by mass of the polyetheramide elastomer, and is preferably 100% by mass or less.

[0033] The weight-average molecular weight of the polyetheramide elastomer used in this embodiment is preferably 3,000 or more, more preferably 5,000 or more, and is preferably 100,000 or less, more preferably 80,000 or less. By making the weight-average molecular weight equal to or greater than the lower limit, toughness tends to be improved when mixed with polyamide. By making the weight-average molecular weight equal to or less than the upper limit, compatibility with polyamide resins tends to be improved. The number average molecular weight is a polystyrene-equivalent value measured by GPC (gel permeation chromatography).

[0034] The content of the polyetheramide elastomer in the resin composition of this embodiment is preferably 1% by mass or more, more preferably 2% by mass or more, even more preferably 3% by mass or more, even more preferably 5% by mass or more, and even more preferably 7% by mass or more, based on 100% by mass of the resin composition. By ensuring that the content is above the lower limit, the impact strength and color improvement effects when added to an amorphous polyamide tend to be further improved. Furthermore, the content of the polyetheramide elastomer in the resin composition of this embodiment is preferably 20% by mass or less, more preferably 18% by mass or less, even more preferably 16% by mass or less, even more preferably 14% by mass or less, and even more preferably 12% by mass or less, based on 100% by mass of the resin composition. By ensuring that the content is below the upper limit, compatibility with the amorphous polyamide tends to be further improved. The resin composition of the present embodiment may contain only one type of polyetheramide elastomer, or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.

[0035] In the resin composition of the present embodiment, the content of the polyamide resin (A) in the resin composition is preferably 80 to 99% by mass, and the content of the polyetheramide elastomer is preferably 20 to 1% by mass.

[0036] In the resin composition of this embodiment, the total of the polyamide resin (A) and the polyetheramide elastomer preferably accounts for 90% by mass or more, more preferably 95% by mass or more, even more preferably 97% by mass or more, and even more preferably 99% by mass or more, of 100% by mass of the resin composition, and is preferably 100% by mass or less.

[0037] <Other ingredients> The resin composition of the present embodiment may or may not contain components other than the polyamide resin (A) and the polyetheramide elastomer. Examples of other components include ultraviolet absorbers, antioxidants, release agents, heat stabilizers, flame retardants, flame retardant assistants, colorants, antistatic agents, fluorescent brighteners, antifogging agents, flow improvers, plasticizers, dispersants, antibacterial agents, antiblocking agents, impact improvers, sliding improvers, hue improvers, and acid trapping agents. In addition, the resin composition of this embodiment may contain additives described in paragraphs 0047 to 0103 of International Publication No. 2021 / 241471 and additives described in paragraphs 0041 to 0056 of Japanese Patent Application Laid-Open No. 2023-61203, within the scope of the present invention, and the contents of these additives are incorporated herein by reference.

[0038] When other components are contained, the total content thereof is preferably 0.001 to 3 mass% of the resin composition, more preferably less than 2 mass%, even more preferably less than 1 mass%, even more preferably less than 0.5 mass%, even more preferably less than 0.1 mass%, and may be less than 0.01 mass%. The other component may be contained in only one kind or in two or more kinds. When two or more kinds of other components are contained, it is preferable that the total amount is in the above range.

[0039] <Physical properties of resin composition> The resin composition of the present embodiment preferably has excellent transparency. Specifically, the resin composition of this embodiment preferably has a total light transmittance of 80% or more, more preferably 85% or more, and even more preferably 90% or more when molded to a thickness of 300 μm. The upper limit of the total light transmittance is preferably 100%, but the required performance is also satisfied even if it is 99% or less. Furthermore, the resin composition of this embodiment, when molded to a thickness of 300 μm, preferably has a haze of 3.0% or less, more preferably 2.5% or less, even more preferably less than 2.0%, even more preferably 1.8% or less, even more preferably 1.7% or less, and even more preferably 1.5% or less. The lower limit of the haze is preferably 0%, but the required performance is also satisfied even if it is 0.001% or more. The total light transmittance and haze are measured according to the description in the examples below.

[0040] <Method of manufacturing resin composition> As a method for producing the resin composition of the present embodiment, any method can be adopted. For example, it can be obtained by adding polyamide resin (A) and polyetheramide elastomer and melt-kneading them. More specifically, the polyamide resin (A), polyetheramide elastomer, and other components added as needed are mixed using a mixing means such as a V-type blender to prepare a lump blend, which is then melt-kneaded in a vented extruder and pelletized.

[0041] <Film> The film of this embodiment is formed from the film of this embodiment. The thickness of the film of this embodiment is preferably 10 μm or more, more preferably 50 μm or more, and even more preferably 100 μm or more, and is preferably 1000 μm or less, more preferably 800 μm or less, even more preferably 700 μm or less, even more preferably 600 μm or less, and even more preferably 500 μm or less.

[0042] The film of the present embodiment preferably has excellent transparency. Specifically, the film of this embodiment preferably has a total light transmittance of 80% or more, more preferably 85% or more, and even more preferably 90% or more. The upper limit of the total light transmittance of the film is preferably 100%, but the required performance is also satisfied even if it is 99% or less. Furthermore, the haze of the film of this embodiment is preferably 3.0% or less, more preferably 2.5% or less, even more preferably less than 2.0%, even more preferably 1.8% or less, even more preferably 1.7% or less, and even more preferably 1.5% or less. The lower limit of the haze of the film is preferably 0%, but the required performance is also satisfied even if it is 0.001% or more. The total light transmittance and haze are measured according to the description in the examples below.

[0043] <Wound body> The film of this embodiment can be wound around a core material to form a roll.

[0044] <Polarizing sheet> A film formed from the resin composition of this embodiment or the film of this embodiment is preferably used as a protective film for a polarizing sheet (a film that protects a polarizing film). In this embodiment, the polarizing sheet preferably includes the film of this embodiment and a polarizing film, and is a sheet laminated in this order: the polarizing film and the protective film. That is, the film of this embodiment is preferably used as at least one of the protective films of the polarizing sheet. The protective film is usually attached to the polarizing film via an adhesive. In this embodiment, the protective film on one side of the polarizing sheet may be the film of this embodiment or another protective film. The protective film on the other side of the polarizing sheet may be a known protective film for a polarizing sheet, and may be the same as the film of this embodiment. Known polarizing films can be used, and examples thereof include polyvinyl alcohol (PVA) films with iodine or a dichroic organic dye adsorbed or impregnated therein. The adhesive used to bond the film / protective film and the polarizing film of the present embodiment can be a known adhesive, and examples thereof include acrylic adhesives, urethane adhesives, epoxy adhesives, silicone adhesives, polyvinyl alcohol adhesives, etc. Among these, urethane adhesives are preferred. The thickness of the adhesive is usually 1 μm or more and usually 30 μm or less. Furthermore, the polarizing sheet of this embodiment may further include a masking film or the like on the outer side of the protective film.

[0045] In this embodiment, the polarizing sheet of this embodiment is preferably used for a heat-bent molded article that has been subjected to heat bending processing. When the film of this embodiment is used in a polarizing sheet, it may be provided on either side of a polarizing film, or on both sides. In the first mode, the film of this embodiment is disposed so as to be positioned on the concave side of the polarizing film after heat bending, for example, on the side of the protective film 4 in FIG. In the second mode, the film of this embodiment is disposed so as to be positioned on the convex side of the polarizing film after heat bending, for example, on the side of the protective film 3 in FIG. In the third embodiment, the film of this embodiment is positioned on both sides of the polarizing film, for example, both of the protective films 3 and 4 in FIG. 1 are the film of this embodiment. In FIG. 1, the polarizing sheet has a lens 1, a polarizing film 2, and protective films 3 and 4 that are bent, but it goes without saying that this embodiment also includes a case where they are not bent. The protective film used in the polarizing sheet of this embodiment may be stretched or not. In the first embodiment, it is preferably stretched. In the second embodiment, it is preferably not stretched.

[0046] In this embodiment, the polarizing sheet is preferably used as a polarizing sheet for use in liquid crystal display devices, polarized lenses (sunglasses, ski goggles, prescription eyeglass lenses, camera viewfinder lenses), covers for various instruments, glass for automobiles, glass for trains, polarizing sheets for in-vehicle display panels and electronic device housings, etc., in-vehicle inner mirrors, silver mirrors for helmets, etc., and is particularly preferably used as sunglasses. [Example]

[0047] The present invention will be explained in more detail below with reference to examples. The materials, amounts used, ratios, processing details, processing procedures, etc. shown in the following examples can be appropriately changed without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. If the measuring instruments used in the examples are difficult to obtain due to discontinuation or the like, measurements can be made using other instruments with equivalent performance.

[0048] 1.Raw materials A1: XE4205, manufactured by EMS, a polyamide resin synthesized from bis(4-amino-3-methylcyclohexyl)methane and sebacic acid A2: XE4805, manufactured by EMS, a polyamide resin synthesized from bis(4-amino-3-methylcyclohexyl)methane and dodecanedioic acid B1: 9048X1, a polyetheramide elastomer composed of 30 mol% polyamide 12, 43 mol% PTMG, and 27 mol% PPO, manufactured by UBE B2: 9055X1, a polyetheramide elastomer composed of 42 mol% polyamide 12, 37 mol% PTMG, and 21 mol% PPO, manufactured by UBE B3: 9063X1, a polyetheramide elastomer composed of 69 mol% polyamide 12, 18 mol% PTMG, and 12 mol% PPO, manufactured by UBE B4: TPAE-32, polyetheresteramide, manufactured by T&K TOKA B5: TPAE-826-S, polyetheresteramide, manufactured by T&K TOKA

[0049] 2. Examples 1 to 4 and Comparative Examples 1 to 3 <Film manufacturing> A polyamide resin film was produced by the following method. Each component described in Table 1 was weighed so as to be the addition amount described in Table 1 (Table 1 is shown in parts by mass). Then, after mixing for 15 minutes in a tumbler, a T-die melt extruder consisting of a twin-screw segmented extruder with a vent (manufactured by Toyo Seiki Co., Ltd., "2D30W2") with a barrel diameter of 25 mm and a screw L / D = 30 was used and extruded in a molten state under the conditions of a discharge rate of 8 Kg / h and a screw rotation speed of 100 rpm, and cooled and solidified only by the first roll of a film / sheet take-up device (manufactured by Toyo Seiki Co., Ltd., "FT3W20") to produce a polyamide resin film. The cylinder-die head temperature was 280 °C and the roll temperature was 120 °C, and a film with a thickness of 300 μm was obtained.

[0050] <Measurement of haze and total light transmittance> Using a haze meter, under the conditions of a D65 light source and a 10° field of view, the haze (%) and total light transmittance (%) of the 300-μm-thick film obtained above were measured. The haze meter used was "HM-150" manufactured by Murakami Color Research Laboratory.

[0051] <Charpy impact strength> The Charpy impact strength was measured in accordance with JIS K 7111-1. Specifically, the polyamide resin composition was melt-kneaded at a cylinder temperature of 290 °C using a twin-screw injection molding machine with a vent (manufactured by Sodick Co., Ltd., "PE-100", an intermeshing co-rotating type with a twin-screw diameter of 29 mm and a plunger diameter of 28 mm), and a molded body (test piece) with a length of 80 mm × width of 10 mm × thickness of 4 mm was produced under the condition of a mold temperature of 50 °C. Then, in accordance with JIS K 7111-1, a Charpy impact test with a notch was performed to measure the Charpy impact strength. The unit of the Charpy impact strength is kJ / m 2 as shown.

[0052] <Measurement of YI value> The measurement of the YI value was carried out in accordance with JIS Z 8722 using a spectrocolorimeter under the illumination-receiving conditions of a post-spectroscopic method with di: 0°. Specifically, the resin composition was melt-kneaded at a cylinder temperature of 290°C using a vented twin-screw injection molding machine ("PE-100" manufactured by Sodick Corporation, intermeshing co-rotating twin screws with a diameter of 29 mm and a plunger diameter of 28 mm) and molded bodies (test pieces) measuring 100 mm in length, 100 mm in width and 4 mm in thickness were produced at a mold temperature of 50°C. The YI value of the obtained molded bodies was then measured. The spectrophotometer used was the SD-7000 manufactured by Nippon Denshoku Industries Co., Ltd.

[0053] [Table 1]

[0054] As is clear from the above results, the resin composition of the present invention was excellent in transparency and impact resistance, and also had a low YI value. In contrast, when no polyetheramide elastomer was included (Comparative Example 1), the impact resistance was poor and the YI value was also high. On the other hand, when polyether ester amide was used instead of polyether amide elastomer (Comparative Examples 2 and 3), the impact resistance was excellent, but the transparency was poor and the YI value was also high. [Explanation of symbols]

[0055] 1 lens 2. Polarizing film 3 Protective film 4 Protective Film

Claims

1. A resin composition comprising a polyamide resin containing an alicyclic diamine unit and an aliphatic dicarboxylic acid unit having 7 to 20 carbon atoms, and a polyetheramide elastomer, A resin composition, wherein the content of the polyamide resin in the resin composition is 80 to 99% by mass, and the content of the polyetheramide elastomer in the resin composition is 20 to 1% by mass.

2. 2. The resin composition according to claim 1, wherein the aliphatic dicarboxylic acid unit having 7 to 20 carbon atoms includes a sebacic acid unit and / or a dodecanedioic acid unit.

3. The resin composition according to claim 1 or 2, wherein the alicyclic diamine constituting the alicyclic diamine unit contains two substituted or unsubstituted cyclohexane rings.

4. The resin composition according to claim 1 or 2, wherein the alicyclic diamine unit includes a unit represented by formula (PA-1): 【Chemical 1】 (In formula (PA-1), R １ are each independently an alkyl group having 1 to 5 carbon atoms, and each n1 is independently an integer of 0 to 3. * is a bonding site with another unit or a terminal group.

5. The resin composition according to claim 1 or 2, wherein the polyetheramide elastomer comprises a polyalkylene glycol block and a polyamide block.

6. The resin composition according to claim 5 , wherein the polyalkylene glycol block comprises a polypropylene glycol (PPG) block and / or a polytetramethylene ether glycol (PTMG) block.

7. the aliphatic dicarboxylic acid unit having 7 to 20 carbon atoms includes a sebacic acid unit and / or a dodecanedioic acid unit, The alicyclic diamine unit contains a unit represented by formula (PA-1): the polyetheramide elastomer comprises a polyalkylene glycol block and a polyamide block; The resin composition according to claim 1 , wherein the polyalkylene glycol block comprises a polypropylene glycol (PPG) block and / or a polytetramethylene ether glycol (PTMG) block. 【Chemistry 2】 (In formula (PA-1), R １ are each independently an alkyl group having 1 to 5 carbon atoms, and each n1 is independently an integer of 0 to 3. * is a bonding site with another unit or a terminal group.

8. The resin composition according to claim 1 , 2 or 7 , wherein the polyamide resin is an amorphous resin.

9. 8. The resin composition according to claim 1, wherein the resin composition has a haze of 3.0% or less when molded into a film having a thickness of 300 μm.

10. 8. The resin composition according to claim 1, wherein the resin composition has a total light transmittance of 80% or more when molded into a film having a thickness of 300 μm.

11. The resin composition according to claim 1 , which is used as a protective film for a polarizing sheet.

12. A film formed from the resin composition according to claim 1, 2 or 7.

13. A polarizing sheet comprising the film according to claim 12 and a polarizing film.

14. Sunglasses comprising the polarizing sheet according to claim 13.

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