Illumination module and lighting device including the same

Abstract

To increase the light emitting area of a lamp using a light emitting diode.SOLUTION: A lighting module 100 includes: a substrate 11; a plurality of light emitting devices 21 disposed in N rows (N is an integer equal to or greater than 1) on the substrate 11; a first resin layer 31 covering the plurality of light emitting devices 21; a first diffusion layer 41 disposed on the first resin layer 31 and diffusing light emitted from the first resin layer 31; and a second diffusion layer 51 disposed on the first diffusion layer 41 and diffusing light emitted from the first diffusion layer 41; where the first diffusion layer 41 includes a diffusing agent, and the second diffusion layer 51 includes a phosphor and / or ink particles.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] An embodiment of the invention relates to a lighting module having a light emitting element.

[0002] An embodiment of the invention relates to a lighting module having a light emitting element and multiple resin layers.

[0003] An embodiment of the invention relates to a lighting module that provides an area light source.

[0004] An embodiment of the invention relates to a light unit or vehicle lamp having a lighting module . [Background technology]

[0005] Typical lighting applications include vehicle lighting as well as display and signboard lighting. Includes backlight.

[0006] Light-emitting elements, such as light-emitting diodes (LEDs), are more efficient than conventional light sources such as fluorescent lamps and incandescent lamps. All of them have advantages such as low power consumption, semi-permanent lifespan, fast response speed, safety, and environmental friendliness. Such light emitting diodes are used in various applications such as various display devices, indoor lights, and outdoor lights. It is applied to lighting devices.

[0007] Recently, lamps that use light-emitting diodes have been proposed as vehicle light sources. Compared to heat lamps, light-emitting diodes have the advantage of low power consumption. Since the angle of light emitted from a photodiode is small, light emitting diodes are used as vehicle lamps. When used as a light emitting diode, the lamp must be used to increase the light emitting area. There is a request.

[0008] The small size of light-emitting diodes allows for greater freedom in lamp design. It is also economical due to its semi-permanent lifespan. Summary of the Invention [Problem to be solved by the invention]

[0009] An embodiment of the invention can provide a lighting module that provides an area light source.

[0010] An embodiment of the invention provides a lighting module having a resin layer disposed over a plurality of light emitting elements. It is possible.

[0011] An embodiment of the invention is a lighting module having a plurality of resin layers disposed over a substrate and a light emitting element. We can provide you with a guide.

[0012] An embodiment of the invention includes a plurality of resin layers over a light emitting element that emits light through a top surface and a plurality of side surfaces. A lighting module can be provided in which the layers are arranged.

[0013] An embodiment of the invention includes a plurality of resin layers disposed on a substrate and a light emitting element, the plurality of resin layers being A lighting module may be provided in which at least one of the zinc layers contains a phosphor.

[0014] An embodiment of the invention includes a plurality of resin layers disposed over the substrate and the light emitting element, and providing a lighting module including ink particles in at least one of the plurality of resin layers. This can be done.

[0015] An embodiment of the invention comprises a substrate and a light emitting element, the phosphor, ink particles and diffuser disposed thereon. A resin layer or a diffusion layer having at least one or two of the above-mentioned agents is disposed on the light emitting device. A lighting module can be provided.

[0016] An embodiment of the invention includes a plurality of resin layers disposed on a substrate and a light emitting element, the plurality of resin layers being a light emitting element layer including a diffusing agent in the layer adjacent to the light emitting element; can be done.

[0017] An embodiment of the invention is a lighting module in which a resin layer having phosphors separates the substrate and the light emitting element. A rule can be provided.

[0018] An embodiment of the invention is an illumination device in which a resin layer having ink particles thereon separates the substrate and the light emitting element. A module can be provided.

[0019] An embodiment of the invention is a resin layer disposed on the light emitting device, wherein at least one of the resin layers contains a phosphor and a and a lighting module having ink particles disposed thereon.

[0020] In the embodiment of the invention, ink particles are formed on the top layer of a plurality of resin layers arranged on the light emitting element. A lighting module with added components can be provided.

[0021] An embodiment of the invention is a flexible lighting module having a light emitting element and multiple resin layers. Provides a guide.

[0022] Embodiments of the invention provide lighting modules with improved light extraction efficiency and side lighting characteristics.

[0023] An embodiment of the invention provides a lighting module for illuminating a surface light source and a lighting device having the same. do.

[0024] An embodiment of the invention is a light unit, a liquid crystal display device or a vehicle having a lighting module. Lamps for use can be provided. [Means for solving the problem]

[0025] The lighting module according to an embodiment of the invention comprises a substrate; and N rows of light emitting diodes (N is an integer greater than or equal to 1) on the substrate. a first resin layer covering the plurality of light-emitting elements; a first diffusing layer disposed on the first resin layer to diffuse light emitted from the first resin layer; and a second diffusing layer disposed on the first diffusing layer to diffuse light emitted from the first diffusing layer; the first diffusing layer includes a diffusing agent, the second diffusing layer includes a phosphor, and the plurality of emitting layers The spacing between the optical elements is equal to or greater than the thickness of the first resin layer, and the second diffusion layer The light emitted to the outside through the reflective surface can have a light uniformity of 90% or more.

[0026] According to an embodiment of the invention, the linear distance between the lower surface of the substrate and the upper surface of the second diffusion layer is: The thickness of the first diffusion layer is 220% or less of the thickness of the first resin layer. the thickness of the second diffusion layer is in the range of 40% to 80% of the thickness of the first diffusion layer; It can be up to 25% of the layer thickness.

[0027] According to an embodiment of the invention, the size of the diffusing agent is determined based on the wavelength of the light emitted from the light emitting element. The size of the diffusing agent is in the range of 4 μm to 6 μm, and the refractive index of the diffusing agent is The ratio may range from 1.4 to 2.

[0028] According to an embodiment of the invention, the phosphor has a size ranging from 1 μm to 100 μm. The phosphor is contained in the resin material of the second diffusion layer in a range of 40 wt % to 60 wt %. It is possible.

[0029] According to an embodiment of the invention, the first resin layer and the first diffusion layer are formed of the same resin material. The second diffusion layer may be formed of a resin material different from that of the first diffusion layer.

[0030] According to an embodiment of the invention, the refractive index of the second diffusion layer is in the range of 1.45 to 1.6. the light emitting element emits blue light, the second diffusion layer emits red light, and the second diffusion layer The top surface color may include reddish colors.

[0031] According to an embodiment of the invention, the content of the phosphor added to the second diffusion layer is The second diffusion layer is doped with a diffusing agent having a content five times higher than that of the first diffusion layer. The diffusion layer may include a side portion extending from the upper surface frame toward the substrate.

[0032] A lighting module according to an embodiment of the invention comprises a substrate; a plurality of light-emitting elements on the substrate; a first resin layer for molding the light-emitting element; and ink particles on the first resin layer. and a second resin layer comprising: One may include a phosphor.

[0033] According to an embodiment of the invention, the content of the ink particles is less than the content of the phosphor. There is a saying.

[0034] According to an embodiment of the invention, the phosphor is disposed in the second resin layer, and the second resin The content of the phosphor in the second resin layer is in the range of 12 wt% to 23 wt%. The content of the ink particles may range from 3 wt % to 13 wt %.

[0035] According to an embodiment of the invention, the phosphor is disposed on the second resin layer and is attached to the light emitting element. The second resin layer may be spaced apart from the first resin layer and may have a thickness less than the thickness of the first resin layer.

[0036] According to an embodiment of the invention, the phosphor has a wavelength longer than the wavelength of the light emitted from the light emitting element. The ink particles may emit light of the same color as the phosphor.

[0037] According to an embodiment of the invention, the wavelength emitted from the phosphor and the ink particles are the same red. The light emitting element emits light having a wavelength in the range of 420 nm to 470 nm. This can be done.

[0038] According to an embodiment of the invention, the linear distance between the lower surface of the substrate and the upper surface of the second resin layer is , the thickness of the second resin layer is 220% or less of the thickness of the first resin layer, It may range from 40% to 80% of the thickness of the resin layer.

[0039] According to an embodiment of the invention, the second resin layer has a side portion extending to a side of the first resin layer. a side portion of the second resin layer contacting the substrate and interposing the phosphor and the ink particles therebetween; and

[0040] According to an embodiment of the invention, the first resin layer contains a diffusing agent, and the diffusing agent has a diameter of 4 μm to 6 μm, and the diffusing agent may have a refractive index in the range of 1.4 to 2.

[0041] According to an embodiment of the invention, a resin layer is formed between the first and second resin layers in a direction perpendicular to the light emitting element. It may include overlapping light blocking portions.

[0042] According to an embodiment of the invention, the surface of the second resin layer is red, and the surface of the second resin layer is The saturation at the surface may be less than the saturation of the light emitted through the second resin layer.

[0043] According to an embodiment of the present invention, the light emitting device comprises: a transparent substrate; a first conductive layer disposed under the transparent substrate; a light emitting structure having a first conductive type semiconductor layer, an active layer and a second conductive type semiconductor layer; a first electrode connected to the first conductive type semiconductor layer; and a second electrode connected to the second conductive type semiconductor layer under the light emitting structure. a second electrode connected to the conductive semiconductor layer; and the first electrode and the second electrode of the light emitting device The electrode may face the substrate and be electrically connected to the substrate.

[0044] The lighting module according to an embodiment of the invention comprises a substrate; and N rows of light emitting diodes (N is an integer greater than or equal to 1) on the substrate. a plurality of light-emitting elements arranged in a first diffusion layer; and a first diffusion layer for diffusing light emitted from the light-emitting elements. a second diffusion layer for diffusing the light emitted from the light emitting element; and a third diffusion layer for diffusing the received light, wherein the first diffusion layer contains a diffusing agent, and the second diffusion layer the layer contains a phosphor, and the third diffusion layer contains at least one of a phosphor and ink particles. The distance between the light emitting elements is determined by the first diffusion layer, the second diffusion layer, and the third diffusion layer. the thickness of the first and second diffusion layers is greater than or equal to the individual thickness of the first and second diffusion layers It may be less than the thickness of the first diffusion layer. [Brief explanation of the drawings]

[0045] [Figure 1] 1 is a longitudinal cross-sectional view showing a lighting module according to a first embodiment of the invention. [Figure 2] 2 is an example of a plan view of the lighting module of FIG. 1. [Figure 3] FIG. 2 is a diagram showing a first modified example of the lighting module of FIG. [Figure 4] FIG. 2 is a diagram showing a second modified example of the lighting module of FIG. [Figure 5] 5 is another example of the lighting module of FIG. 4. [Figure 6] 1. FIG. 4 is a diagram showing a third modified example of the lighting module of FIG. [Figure 7] 7 is another example of the lighting module of FIG. 6. [Figure 8] FIG. 10 is a diagram showing a fourth modified example of the lighting module of FIG. [Figure 9] 9 is another example of the lighting module of FIG. 8. [Figure 10] 2 is another example of the lighting module of FIG. 1. [Figure 11] 10 is a fifth modified example of the lighting module of FIG. [Figure 12] 12 is another example of the lighting module of FIG. 11. [Figure 13] 10 is a sixth modified example of the lighting module of FIG. [Figure 14] 10 is an example of a longitudinal cross-sectional view of a lighting module according to a second embodiment of the invention. [Figure 15] 10 is a first modified example of the lighting module according to the second embodiment. [Figure 16] 16 is a second modified example of the lighting module of FIG. [Figure 17] 10 is a third modified example of the lighting module according to the second embodiment. [Figure 18] 10 is a fourth modified example of the lighting module according to the second embodiment. [Figure 19] 10 is a fifth modified example of the lighting module according to the second embodiment. [Figure 20] 10 is a sixth modified example of the lighting module according to the second embodiment. [Figure 21] 10 is a seventh modified example of the lighting module according to the second embodiment. [Figure 22] 10 is an eighth modified example of the lighting module according to the second embodiment. [Figure 23] 13 is a ninth modified example of the lighting module according to the second embodiment. [Figure 24] 10 is a tenth modified example of the lighting module according to the second embodiment. [Figure 25] 11 illustrates an eleventh modification of the lighting module according to the second embodiment. [Figure 26]10A and 10B are diagrams illustrating an example of a change in surface color due to turning on and off of a light-emitting element in a resin layer having ink particles according to a second embodiment. [Figure 27] 10 is a graph showing light uniformity depending on the refractive index of resin in a lighting module according to an embodiment of the present invention. [Figure 28] 10 is a graph showing the light efficiency depending on the refractive index of resin in the lighting module according to the embodiment of the present invention. [Figure 29] 10 is a graph showing light uniformity depending on the refractive index of a diffusing agent added to a resin in a lighting module according to an embodiment of the present invention. [Figure 30] 10 is a graph showing light uniformity depending on the size of a diffusing agent added to a resin in a lighting module according to an embodiment of the present invention. [Figure 31] 31(a) and (b) are graphs showing the change in chromaticity depending on the density of the diffusing agent and the amount of phosphor added to the resin in the lighting module according to the embodiment of the invention. [Figure 32] 1 is an example of a light-emitting element in a lighting module according to an embodiment of the invention. [Figure 33] (a) and (b) of FIG. 33 are diagrams comparing the luminance distributions of the light-emitting elements of the comparative example and the example. [Figure 34] 34 is a diagram showing beam pattern distributions of the light-emitting elements of the comparative example and the example of FIG. 33. FIG. [Figure 35] FIG. 10 is a diagram comparing the color appearance of the surface color of a reference example and examples 1 to 9 in a lighting module according to a second embodiment when the light emitting element is turned off. [Figure 36] 10 is a diagram comparing the color appearance of the surface color of a reference example and examples 1 to 9 in a lighting module according to a second embodiment when the light emitting element is turned on. FIG. [Figure 37] FIG. 10 is a diagram comparing the luminous flux distribution of the sample and case of the lighting module according to the second embodiment. [Figure 38] 10 is a diagram comparing color coordinate distributions for different cases depending on the content of phosphor and ink particles in the lighting module according to the second embodiment. [Figure 39] 1 is a plan view of a vehicle to which a lamp having a lighting module according to an embodiment is applied; [Figure 40] 1 shows a lamp with a lighting module or lighting device according to an embodiment; DETAILED DESCRIPTION OF THE INVENTION

[0046] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0047] However, the technical concept of the present invention is not limited to the described embodiments, and various different embodiments may be used. The components of the embodiments may be embodied in various forms, and may be interchangeable within the scope of the technical concept of the present invention. One or more of these may be selectively combined or substituted for each other. Terms used (including technical and scientific terms) are not expressly and specifically defined and described. The meaning and interpretation of the present invention are as follows: Commonly used terms, such as predefined terms, may be interpreted differently in the context of the relevant art. The meaning of the expression can be interpreted by taking into account the meaning of the expression. The terms used are for the purpose of describing the embodiments and are not intended to limit the invention. In this specification, the singular includes the plural unless the phrase specifically states otherwise. It is written as "A and (and) at least one (or more than one) of B and C." In this case, it may include one or more of all possible combinations of A, B, and C. In describing the components of the present invention, terms such as first, second, A, B, (a), (b), etc. Such terms may be used to distinguish the component from other components. merely by the term, the essence, order, or procedure of the corresponding component cannot be determined. When a component is described as being "connected", "coupled", or "joined" to another component, that component can be not only directly connected, coupled, or joined to the other component, but also "connected", "coupled", or "joined" by another component between that component and the other component. Also, when it is described that something is formed or disposed "above" or "below" each component, "above" or "below" includes not only the case where two components are in direct contact with each other, but also the case where one or more other components are formed or disposed between the two components. Further, when expressed as "above" or "below", it can include the meaning not only in the upward direction but also in the downward direction with respect to one component as a reference. The lighting device according to the present invention is applicable to various lamp devices that require lighting, for example, vehicle lamps, household lighting devices, or industrial lighting devices. For example, when applied to vehicle lamps, it is applicable to headlamps, side marker lamps, side mirror lamps, fog lamps, tail lamps, stop lamps, daytime running lamps, vehicle interior lighting, door scarves, rear combination lamps, backup lamps, etc. The lighting device of the present invention is also applicable to indoor and outdoor advertising devices, display devices, and various automotive fields, and moreover, it will be applicable to all lighting-related fields and advertising-related fields that have been currently developed and commercialized or that can be realized by future technological developments. When a component is described as being "connected", "coupled", or "joined" to another component, that component can be not only directly connected, coupled, or joined to the other component, but also "connected", "coupled", or "joined" by another component between that component and the other component. Also, when it is described that something is formed or disposed "above" or "below" each component, "above" or "below" includes not only the case where two components are in direct contact with each other, but also the case where one or more other components are formed or disposed between the two components. Further, when expressed as "above" or "below", it can include the meaning not only in the upward direction but also in the downward direction with respect to one component as a reference. When described as being formed or disposed "above" or "below" each component, "above" or "below" includes not only the case where two components are in direct contact with each other, but also the case where one or more other components are formed or disposed between the two components. Also, when expressed as "above" or "below", it can include the meaning not only in the upward direction but also in the downward direction with respect to one component as a reference. The lighting device according to the present invention is applicable to various lamp devices that require lighting, for example, vehicle lamps, household lighting devices, or industrial lighting devices.

[0048] For example, when applied to vehicle lamps, it is applicable to headlamps, side marker lamps, side mirror lamps, fog lamps, tail lamps, stop lamps, daytime running lamps, vehicle interior lighting, door scarves, rear combination lamps, backup lamps, etc. The lighting device of the present invention is also applicable to indoor and outdoor advertising devices, display devices, and various automotive fields, and moreover, it will be applicable to all lighting-related fields and advertising-related fields that have been currently developed and commercialized or that can be realized by future technological developments. For example, when applied to vehicle lamps, it is applicable to headlamps, side marker lamps, side mirror lamps, fog lamps, tail lamps, stop lamps, daytime running lamps, vehicle interior lighting, door scarves, rear combination lamps, backup lamps, etc. [[ID=​​​​​​​​​​​​​ <First Example>

[0050] FIG. 1 is a longitudinal cross-sectional view showing a lighting module according to a first embodiment, and FIG. 2 is a longitudinal cross-sectional view showing the lighting module of FIG. 1 is an example of a plan view of a light module.

[0051] 1 and 2, the lighting module 100 includes a substrate 11, The light emitting element 21 arranged on the substrate 11 and a first resin layer covering the light emitting element 21 31, and at least one upper layer 41, 51 may be included on the first resin layer 31. Cut.

[0052] The lighting module 100 emits light emitted from the light emitting element 21 into a surface light source. The lighting module 100 includes a reflecting member disposed on the upper surface of the substrate 11. The reflecting member may reflect light traveling to the upper surface of the substrate 11 toward the first register. The light emitting element 21 can be arranged in plural on the substrate 11. The plurality of light emitting elements 21 in the lighting module 100 may be arranged in N rows (N is an integer greater than or equal to 1). ) or / and M rows (M is an integer of 1 or more). 2, can be arranged in N columns and M rows (N and M are integers of 2 or more). The module 100 is suitable for various lamp devices requiring illumination, such as vehicle lamps, household lamps, etc. For example, the lighting model applied to vehicle lamps can be used in lighting devices and industrial lighting devices. In the case of a Joule, headlights, width lights, side mirror lights, fog lights, tail lights tail lamp, turn signal lamp, reverse Back-up lamp, stop lamp, daytime running light (Daytime running light), vehicle interior lighting, door scarf (do or scarf), rear combination lamps, backup lamps, etc. is.

[0053] As shown in FIGS. 1 and 2, the substrate 11 includes the light emitting element 21 and the first resin layer 31. The support member may function as a base member or a support member located underneath the support member.

[0054] The substrate 11 is a printed circuit board (PCB). The substrate 11 may be, for example, a resin-based printed circuit board (PCB), a metal core ( Metal Core PCB, Flexible PCB, Ceramic PCB, The substrate 11 may include at least one of a FR-4 substrate, a FR-5 substrate, a FR-6 substrate, a FR-7 substrate, a FR-8 substrate, a FR-9 substrate, a FR-10 substrate, a FR-11 substrate, a FR-12 substrate, a FR-13 substrate, a FR-14 substrate, a FR-15 substrate, a FR-16 substrate, a FR-17 substrate, a FR-18 substrate, a The substrate 11 may include a flexible PCB or a rigid PCB. The upper surface has an X-axis-Y-axis plane, and the thickness of the substrate 11 is in a Z direction perpendicular to the X and Y directions. Here, the X direction is the first direction, and the Y direction is the second direction perpendicular to the X direction. The Z direction may be a third direction perpendicular to the X and Y directions. The substrate 11 may be made of a flexible material, and the upper or lower surface of the substrate 11 may include a curved surface. do.

[0055] The substrate 11 includes a wiring layer (not shown) on the top thereof, and the wiring layer electrically connects the light emitting element 21 to the wiring layer. The substrate 11 may include a reflective member or a protective layer disposed thereon. The protective layer can protect the wiring layer. The light emitting elements may be connected in series, in parallel, or in series-parallel by the wiring layer of the substrate 11. The elements 21 are connected in series or parallel in groups of two or more. can be connected in series or in parallel.

[0056] As shown in FIG. 2, the length x1 in the X direction and the length y1 in the Y direction of the substrate 11 are different from each other. For example, the length x1 in the X direction may be longer than the length y1 in the Y direction. The length x1 in the X direction may be set to be at least twice the length y1 in the Y direction. The thickness may be 0.5 mm or less, for example, in the range of 0.3 mm to 0.5 mm. Since the thickness of the substrate is thin, the thickness of the lighting module is not increased. The plate 11 is provided with a thickness of 0.5 mm or less, so that it can support the flexible module. The thickness of the substrate 11 from the bottom surface of the substrate 11 to the top surface of the top layer can be The substrate may have a thickness of 0.1 times or less, or may be in the range of 0.1 times to 0.06 times the thickness of the substrate. The distance from the bottom surface of 11 to the top surface of the top layer 51 may be the thickness of the lighting module.

[0057] The thickness of the lighting module 100 is the length x1, y1 of the substrate 11 in the X and Y directions. The thickness of the lighting module 100 may be 1 / 3 or less of the short length, but is not limited thereto. The thickness of the substrate 11 is 5.5 mm or less at the bottom, or between 4.5 mm and 5.5 mm. The range of the lighting module 100 may be in the range of 100 to 4.5 mm or in the range of 4.5 to 5 mm. The thickness may be the linear distance between the lower surface of the substrate 11 and the upper surface of the top layer 41, 51. The thickness of the lighting module 100 is 220% or less of the thickness of the first resin layer 31, for example For example, the thickness of the lighting module 100 may be in the range of 180% to 220%. the distance from the lower surface of the first resin layer 31 to the upper surface of the uppermost layer, and is 2.2 times or less the thickness of the first resin layer 31. , for example, in the range of 1.8 to 2.2 times. The thickness is 5.5mm or less, making it flexible and slim, and it can be used as a surface light source module. and can be provided.

[0058] If the thickness of the lighting module 100 is thinner than this range, the light diffusion space is reduced, resulting in a hot If the thickness of the module is greater than the above range, spots may occur. This may result in spatial restrictions on installation and reduced freedom of design. The thickness of the module 100 is 5.5mm or less, or 5mm or less, and the module can be curved. This allows for greater freedom in design and reduces spatial constraints. The relationship between the thickness of the lighting module 100 and the length y1 of the lighting module 100 in the Y direction is The ratio may be 1 mm, and may have a ratio relationship of m≧1, where m is a natural number equal to or greater than 1. and the number of rows of the light-emitting elements 21 can be an integer smaller than m. For example, If the thickness of the module 100 is four times larger than the thickness of the module 100, the light emitting elements 21 can be arranged in four rows. .

[0059] The substrate 11 has a connector 14 at a part thereof, and supplies power to the light emitting element 21. The area 13 of the substrate 11 where the connector 14 is arranged is covered with the first resin layer. is not formed, and the length is equal to or smaller than the length y1 of the substrate 11 in the Y direction. The connector 14 may be disposed on a part of the upper surface or a part of the lower surface of the substrate 11. If the connector 14 is located on the bottom surface of the substrate 11, the area is removed. The substrate 11 may have a rectangular, square, or other polygonal shape in top view. The connector 14 may have a curved surface or a bar shape. , a terminal connected to the light emitting element 21, or a female connector or a male connector.

[0060] The substrate 11 may include a protective layer or a reflective layer thereon. The thermal transfer layer may include a member having a solder resist material, and the solder resist material The material is a white material and can reflect incident light.

[0061] In another example, the substrate 11 may include a transparent material. 11 is provided, so that the light emitted from the light emitting device 21 is directed toward the upper surface of the substrate 11 and and downward.

[0062] The light emitting element 21 is disposed on the substrate 11 and sealed by the first resin layer 31. The plurality of light emitting devices 21 may be in contact with the first resin layer 31. The first resin layer 31 may be disposed on the side and top surfaces of the light emitting device 21. The resin layer 31 protects the light emitting device 21 and may be in contact with the upper surface of the substrate 11 .

[0063] Light emitted from the light emitting device 21 can be emitted through the first resin layer 31 . The light emitting element 21 has a top surface S1 and a plurality of side surfaces S2. The top surface S1 is formed by an upper layer 41, The upper surface S faces the upper surface of the upper layer 41 and emits light in the direction of the upper layer 51. The light emitting surface S1 of the light emitting element 21 is a light emitting surface from which most of the light is emitted. , which includes at least four side surfaces, and emits light in the lateral direction of the light emitting element 21. The light emitting element 21 is an LED chip that emits light from at least five sides, and is mounted on the substrate 11. The light emitting device 21 may be arranged in a lip chip shape. The light emitting device 21 may be formed to a thickness of 0.3 mm or less. Alternatively, the light emitting device 21 may be implemented as a horizontal chip or a vertical chip. In the case of the horizontal chip or vertical chip, the wires are used to connect the chip to other chips or wirings. When a wire is connected to the LED chip, the wire The thickness of the diffusion layer may increase depending on the height of the wire, and the connection space due to the length of the wire may increase. The distance between the light emitting elements 21 may be increased. The light emitting element 21 is mounted on the front surface of the flip chip. The light emitting elements 21 may be disposed on the substrate 11. The distance a between the light emitting elements 21 may be determined by the first resin layer 31. The distance a may be equal to or larger than the thickness b (b≦a) of the The thickness may be 2.5 mm or more, and may vary depending on the LED chip size. The minimum spacing between the first resin layers 31 is equal to or greater than the individual thickness of each of the first resin layers 31. This sometimes happens.

[0064] The light emitting device 21 disclosed in the embodiment is provided as a flip chip that emits light from at least five sides. Therefore, the luminance distribution and the directivity angle distribution of the light emitting element 21 can be improved. In addition, when the luminance distribution of the light-emitting device disclosed in the example is examined, it is constant over the entire area as shown in FIG. 33b. However, in the case of the vertical chip of the comparative example, As shown in Fig. 33a, it can be seen that a female portion occurs in the region between each light emitting element. The light module is designed so that no female parts are generated even if the spacing between the light emitting elements is further increased. As shown in FIG. 34, the directivity angle distribution of the light emitting element of Comparative Example a is 120 degrees or less. It can be seen that the directivity angle distribution of the light emitting element of Example b is 130 degrees or more. That is, the directivity angle distribution becomes wider, and the light diffusion effect can be achieved. The spacing between light emitting elements can be increased by reducing the female portion generation.

[0065] When the light emitting elements 21 are arranged on the substrate 11 in an N×M matrix, N is one row or There are two or more columns, and M can be one row or two or more rows. N and M are integers of 1 or more. The light emitting elements 21 may be arranged in the Y-axis and X-axis directions, respectively.

[0066] The light emitting element 21 is a light emitting diode (LED) chip, and can emit blue, red, green, It can emit at least one of ultraviolet (UV) and infrared rays. The optical element 21 can emit at least one of blue, red, and green light, for example. The light emitting element 21 may be electrically connected to the substrate 11, but is not limited thereto.

[0067] The light emitting element 21 may be sealed with a transparent insulating layer or resin on the surface, but is not limited thereto. The light emitting element 21 may have a phosphor layer formed on the surface thereof.

[0068] The light emitting element 21 is supported by a ceramic support member or a metal plate at the bottom. may be arranged on the support member, which may be used as an electrical and thermal conductive member.

[0069] The lighting module according to the embodiment includes a light emitting element 21 and a plurality of resin layers on the substrate 11. The plurality of resin layers may include, for example, two or more layers or three or more layers. The plurality of resin layers may include a layer containing no impurities, a layer containing phosphors, and at least two or three of the layer containing a diffusing agent and the layer containing phosphor / diffusing agent. At least one of the plurality of resin layers may include a spreading layer. It can selectively contain at least one of powder, phosphor, and ink particles. That is, the phosphor and the diffusing agent are added to separate resin layers or mixed together. The impurities may be phosphors, diffusing agents, or ink particles. The layers each including the phosphor and the diffusing agent are arranged adjacent to each other. The layer in which the phosphor and the diffusing agent are disposed may be disposed as shown in FIG. When the layers are separated from each other, the layer in which the phosphor is disposed is located above the layer in which the diffusing agent is disposed. The phosphor and the ink particles may be arranged in the same layer or in different layers. For example, the layer containing the ink particles may be thicker than the layer containing the phosphor. It may be positioned further above.

[0070] The phosphors include blue phosphor, green phosphor, red phosphor, amber phosphor, yellow phosphor, The size of the phosphor may be 1 μm to 100 μm. For example, if the phosphor emits red light, the red wavelength may be in the range of The light emitting element 21 may include a range of 400 nm to 740 nm. emitting blue light in the range of 420 nm to 500 nm, for example, in the range of 420 nm to 470 nm The higher the density of the phosphor, the higher the wavelength conversion efficiency may be, but the lower the luminous intensity may be. Therefore, the light efficiency can be taken into consideration when adding the particles within the above-mentioned size. The diffusing agent is a PMMA (Poly Methyl Meth Acrylate)-based material, It can contain at least one of TiO2, SiO2, Al2O3, and silicon-based The diffusing agent has a refractive index in the range of 1.4 to 2 at the emission wavelength and a size of 1 μm The diffusing agent may have a spherical shape, but is not limited thereto. As shown in FIG. 29, when the refractive index of the diffusing agent is 1.4 or more, the uniformity of light is improved. As shown in FIG. 30, the size of the diffusing agent is 1 μm. When the thickness is in the range of 100 μm to 30 μm, the light uniformity can be 90% or more. The uniformity is the light uniformity on the area where the light emitting elements are connected to each other, and is provided at 90% or more. It is possible.

[0071] The ink particles are at least one of a metallic ink, a UV ink, and a hardening ink. The ink particles may have a size smaller than that of the phosphor. The surface color of the ink particles is one of green, red, yellow, and blue. The type of ink particles may be PVC (Polyvinyl Chloride). de) ink, PC (Polycarbonate) ink, ABS (acrylic trile butadiene styrene copolymer) ink, UV Resin ink, epoxy ink, silicone ink, PP (polypropylene ) ink, water-based ink, plastic ink, PMMA (poly methyl methacrylate) Choose from thiathacrylate ink or PS (Polystyrene) ink Here, the width or diameter of the ink particles is 5 μm or less, for example, 0 At least one of the ink particles may be in the range of 0.05 μm to 1 μm. The material of the ink particles may be red, green, yellow, or blue. For example, the phosphor may emit red wavelengths, The ink particles may include red. For example, the red color of the ink particles may be The color of the ink particles may be darker than the color of the phosphor or wavelength of light. The color of the light emitted from the light element may be different from the color of the ink particles. It can provide the effect of blocking or blocking light.

[0072] The resin layer may include a resin or a resin-based material. The layers have the same refractive index, or at least two layers have the same refractive index, or The refractive index of the layers adjacent to the top layer may be gradually lower or higher.

[0073] Referring to FIG. 1, the lighting module 100 includes at least one resin layer 31 on the first resin layer 31. The first resin layer 31 may include another upper layer. The upper layer may be disposed on the first resin layer 31. The second diffusion layer 51 may include a first diffusion layer 41 and a second diffusion layer 51 disposed on the first diffusion layer 41. The first and second diffusion layers 41 and 51 are disposed on the first resin layer 31. Alternatively, the first diffusion layer 41 may be a resin layer disposed on the first resin layer. The second diffusion layer 51 may be defined as a third layer disposed on the second resin layer. It can be defined as a zinc layer.

[0074] The first resin layer 31 is disposed on the substrate 11 to seal the light emitting element 21. The first resin layer 31 may have a thickness greater than that of the light emitting device 21 . The first resin layer 31 is made of a transparent resin material, for example, UV (Ultra Violet) It may be made of a resin material such as resin, silicone or epoxy. The resin layer 31 can be a layer without a diffusing agent or a transparent molding layer.

[0075] The thickness b of the first resin layer 31 may be greater than the thickness of the substrate 11. The thickness b of the resin layer 31 is 5 times or more, for example, 5 to 9 times, the thickness of the substrate 11. The thickness of the first resin layer 31 may be in the range. Therefore, the light emitting device 21 can be sealed on the substrate 11 to prevent moisture from penetrating. The first resin layer 31 and the substrate 11 are made of a flexible plastic. The thickness b of the first resin layer 31 is 2.7 mm or less, for example, 2 The thickness b of the first resin layer 31 may be in the range of 2.7 mm to 2.7 mm. If it is small, the distance between the light emitting element 21 and the first diffusion layer 41 is reduced, or the thickness of the diffusion layer is increased. If the thickness is greater than the above range, the module thickness may increase or the luminous intensity may decrease. There is.

[0076] The first resin layer 31 is disposed between the substrate 11 and the first diffusion layer 41. The light emitted from the element 21 is guided to the first diffusion layer 41. The resin layer 31 may be a transparent layer to which no impurities are added. Since there are no impurities, light can pass through in a straight line.

[0077] The light emitted from the light emitting element 21 is emitted through the top surface S1 and the side surface S2. Light emitted through the surface S1 and the side surface S2 can travel through the first resin layer 31. The light emitted through the side surface S2 or reflected within the first and second diffusion layers 41 and 51 is The light emitting element 21 emits light of, for example, 420 nm or less. It can emit blue light in the 470 nm range.

[0078] The first diffusion layer 41 may be in contact with the first resin layer 31. The diffusion layer 41 is formed of a resin material containing a diffusion agent after the first resin layer 31 is hardened. Here, the amount of the diffusing agent is determined based on the amount of the first diffusing layer 41 in the process. The first diffusion layer 41 may be doped in a range of 1.5 wt % to 2.5 wt %. Resin materials, such as UV (Ultra violet) resin, epoxy Alternatively, the first diffusion layer 41 may be made of a resin material similar to silicone. For example, the range may be 1.1 to 1.8 or 1.4 to 1.6. The refractive index may be lower than that of the diffusing agent.

[0079] The UV resin is made, for example, of urethane acrylate oligomer as the main material. For example, synthetic oligomers can be used. A urethane acrylate oligomer having a low boiling point and a dilute urethane acrylate oligomer can be used. IBOA (isobornyl acrylate), HBA ( Hydroxybutyl Acrylate), HEMA(Hydroxy Meta) It may further contain a mixed monomer such as ethyl acrylate. As an additive, a photoinitiator (e.g., 1-hydroxycyclohexyl phenyl l-ketone, Diphenyl), Diphenyl(2, 4, 6-trimet hylbenzoyl phosphine oxide) or antioxidants The UV resin can be mixed with 10 to 21% of oligomer and 30% of monomer. In this case, the composition may be formed by containing 1.5 to 6% of the above-mentioned components. The monomers are IBOA (isobornyl acrylate) 10-21%, HB A (Hydroxybutyl Acrylate) 10~21%, HEMA (Hydr It can be composed of a mixture of 10-21% of oxy methyl acrylate The additive can be made to function as a photoinitiator by adding 1 to 5% of a photoinitiator. , and formed as a mixture that can improve yellowing phenomenon by adding 0.5 to 1% of antioxidant. The resin layer formed using the above-mentioned composition can be formed by using a UV resin instead of a light guide plate. The layer is formed with a resin such as acrylic resin, making it possible to adjust the refractive index and thickness, and The composition can be used to satisfy all of the requirements for adhesive properties, reliability, and mass production speed. can.

[0080] The first resin layer 31 and the first diffusion layer 41 may be made of the same resin material. When the resin layer 31 and the first diffusion layer 41 are made of the same resin material, the first resin layer 31 and the second diffusion layer 41 The first diffusion layer 41 is in close contact with the first resin layer 31 and the first diffusion layer 41 at the interface between them. As shown in FIG. 27, the first resin layer 31 and the first diffusion layer 4 When the refractive index of the resin material in 1 is 1.4 or more at the emission wavelength, the light uniformity is 90% or more. The refractive index of such a resin material is 1.8 or less, for example, 1.1 or The refractive index of the diffusing agent may be in the range of 1.8 or in the range of 1.4 to 1.6. As shown in FIG. 28, the refractive index of the resin material of the first resin layer 31 and the first diffusion layer 41 is It can be seen that when is in the range of 1.1 to 1.8, the light efficiency is 95% or more.

[0081] The first diffusion layer 41 is formed to a thickness c that is thinner than the thickness b of the first resin layer 31, where b>c. The thickness c of the first diffusion layer 41 may be 80% or less of the thickness b of the first resin layer 31. For example, the first diffusion layer 41 may be provided with a small thickness. Therefore, the flexibility of the lighting module can be ensured.

[0082] The first diffusion layer 41 has a diffusion agent (beads or dispersing agent) therein. The first diffusion layer 41 may include the first resin layer 31 and the second diffusion layer 42. The diffusing agent may be disposed between the diffusing layer 51 and the light emitting layer 52. The diffusing agent may have a refractive index in the range of 1.4 to 2 at the emission wavelength. and its size can be in the range of 4 μm to 6 μm. The diffusing agent is spherical in shape. As shown in FIG. 29, the refractive index of the diffusing agent is 1.4 or more. For example, in the case of 1.4 or 2, the light uniformity is 90% or more. As shown in FIG. 30, when the size of the diffusing agent is in the range of 4 μm to 6 μm, The light uniformity can be over 90%.

[0083] The diffusing agent of the first diffusing layer 41 diffuses the light incident through the first resin layer 31. Therefore, the hole formed by the light emitted through the first diffusion layer 41 can be diffused. The diffusion agent can reduce the occurrence of hot spots. The size of such a diffusing agent can be larger than the wavelength of the irradiated light. The large size and arrangement can improve the light diffusion effect.

[0084] The content of the diffusing agent in the first diffusion layer 41 is 5 wt % or less, for example, 2 wt % or less. If the content of the diffusing agent is less than the above range, the hot stamping There is a limit to how low the pot can be, and if it is higher than this range, the light transmittance may decrease. Therefore, the diffusing agent is disposed in the first diffusion layer 41 at the above content. This diffuses the light and reduces hot spots without reducing light transmittance. .

[0085] The second diffusion layer 51 is made of a material different from the resin material of the first resin layer 31 and the first diffusion layer 41. The second diffusion layer 51 may be a transparent layer and may contain a phosphor therein. The second diffusion layer 51 contains one or more kinds of phosphors, for example, red phosphor, amber (am At least one of the following phosphors may be included: By adding a phosphor to the second diffusion layer 51, the diffused light can be The wavelength conversion efficiency of the second diffusion layer 51 can be increased. The second diffusion layer 51 may include a material such as SiO2. The refractive index of the second diffusion layer 51 may be in the range of 1.6. The second diffusion layer 51 may be formed by bonding the first resin layer 31 and the first diffusion layer 52 together. The refractive index of the second diffusion layer 51 may be higher than that of the second diffusion layer 41. If the temperature is lower than this range, the uniformity of light will be reduced, and if the temperature is higher than this range, the light transmittance will be reduced. Accordingly, the refractive index of the second diffusion layer 51 is provided within the above range to improve the light transmittance and The second diffusion layer 51 has a phosphor therein, so that the light can be uniformly irradiated. The surface color of the second diffusion layer 51 can be red or The surface color of the second diffusion layer 51 can be the same as that of the phosphor when the light emitting element is turned off. As another example, the surface color of the second diffusion layer 51 is shown in the The phosphor may be of a different color.

[0086] The phosphor may be added in the same amount as the resin material forming the second diffusion layer 51 . The ratio of the phosphor to the resin material of the second diffusion layer 51 is 40% to 60%. For example, the third phosphor and the resin material of the second diffusion layer 51 may be added at a ratio of 100 to 40%. The ingredients may be added in equal proportions to each other, for example, a 50% to 50% mix. The phosphor may be in the range of 40 wt % to 60 wt %. The content of the phosphor may be in the range of 40 wt% to 60 wt%. The ratio of the resin material to the scattering layer 51 may have a difference of 20% or less or 10% or less. Here, as shown in FIG. 31a-b, the density of the diffusing agent (beads) added to the first diffusion layer is It can be seen that the amount of phosphor required for the color coordinates Cx and Cy decreases as the intensity increases. This shows that the amount of phosphor is adjusted according to the degree of light diffusion by the diffusing agent.

[0087] In the embodiment, the content of the phosphor in the second diffusion layer 51 is 40 wt % or more, or By adding the SiO 2 in the range of t% to 60wt%, the surface of the second diffusion layer 51 Color can be provided by the color hue of the phosphor, and light diffusion and wavelength conversion efficiency can be improved. The wavelength of the light emitted from the light emitting element 21 through the second diffusion layer 51, for example, In addition, the blue light extracted through the second diffusion layer 51 can be reduced. The emitted light can be provided to a surface light source at the wavelength of the phosphor. For example, the phosphor emits red light. In this case, the red wavelength may include the range of 625 nm to 740 nm.

[0088] The second diffusion layer 51 is formed by adding a fluorescent substance to a resin material and then curing the resin material. The second diffusion layer 51 may be formed directly on the first diffusion layer 41. The second diffusion film manufactured in the form of a film can be formed separately and then bonded. The second diffusion layer 51 may be bonded to the surface of the first diffusion layer 41. An adhesive may be placed between the layers 41 .

[0089] The adhesive is a transparent material, such as UV adhesive, silicone or epoxy. The second diffusion layer 51 is provided in a film form, so that the inner It can provide uniform phosphor distribution and provide a certain level of surface color. It is possible.

[0090] The second diffusion layer 51 is made of a resin film, so that polyester ( Compared to using PET film, it is possible to provide a module with high flexibility. The second diffusion layer 51 is a protective film containing a phosphor or a protective film containing a phosphor. The second diffusion layer 51 may be a release film. It may be provided as a film that can be attached to or separated from the first diffusion layer 41 .

[0091] The second diffusion layer 51 has a thickness d, d which is smaller than the thickness c of the first diffusion layer 41. <c<bで For example, the thickness of the second diffusion layer 51 may be in the range of 0.3 mm to 0.5 mm. The thickness d is 25% or less of the thickness c of the first diffusion layer 41, for example, in the range of 16% to 25%. The thickness d of the second diffusion layer 51 may be 18% of the thickness b of the first resin layer 31. The thickness d of the second diffusion layer 51 may be in the range of, for example, 14% to 18%. If the thickness is greater than the above range, the light extraction efficiency may decrease or the module thickness may increase. If the wavelength is smaller than the above range, it may be difficult to suppress hot spots or the wavelength conversion efficiency may be low. The second diffusion layer 51 is a layer for wavelength conversion and external protection. If the thickness is greater than the above range, the flexibility of the module may be poor and the design itself may be compromised. The degree of freedom may be reduced.

[0092] The phosphor converts the wavelength of the light emitted from the light emitting element 21. The light source can emit light with a wavelength longer than that of the light emitted from the light emitting element 21 . When the phosphor is a red phosphor, the light is converted into red light. The wavelength of most of the light emitted from the first diffusion layer 41 can be converted. The light is uniformly diffused through the powder, and the diffused light is added to the second diffusion layer 51. In another example, the phosphor may be, for example, amber ( Amber phosphor, yellow phosphor, green phosphor, red phosphor , or blue phosphors.

[0093] The second diffusion layer 51 includes a phosphor, so that the color of the appearance appears to be the color of the phosphor. For example, when the phosphor is red, the surface color of the second diffusion layer 51 may be The surface of the second diffusing layer 51 or the surface of the lighting module may appear red. The surface may be provided with a red image when the light emitting element 21 is off, and the light emitting element 21 When the LED is lit, red light with a certain luminance is diffused and provided as a red image of a surface light source. According to whether the light emitting element 21 is turned on or off, the color coordinates of the surface color are obtained as follows: The phosphor may have other values ​​within its color range.

[0094] The lighting module 100 according to the embodiment has a thickness of 5.5 mm or less, and has a surface through the top surface. The lighting module 100 can emit light and has flexibility. can emit light through the sides.

[0095] In the embodiment, a plurality of resin layers are formed on a substrate 11, for example, a first resin layer 31 and a diffusion layer 41, 5 1. A lighting module according to an embodiment may include: The light is guided in the first resin layer 31 in a radial direction or a linear direction so as to spread, The light is diffused through the diffusing agent of the first diffusion layer 41 and converted into wavelength light through the phosphor of the second diffusion layer 51. This allows the light to be converted and diffused through the illumination module. The light emitted from the light source is then emitted to the surface light source. The light emitting element 21 is flip-type and has five faces on a flexible substrate. The light emitted through the first and second diffusion layers 41 and 51 and the light emitted through the first and second diffusion layers 41 and 51 are directed in the direction of the first diffusion layer 41 and the second diffusion layer 51. The light emitted from the light emitting element 21 can be emitted in the lateral direction of the resin layer 31. The light can be emitted from the top surface of the module and from all sides. The module is used in vehicle lamps and displays with Micro LEDs. The first resin layer 31 may be polygonal or It may have a curved shape.

[0096] The lighting module has a surface color to provide a surface light source, The inner lens can be removed, and the first resin layer 31 is a light emitting element. By sealing the light emitting element 21, there is no air gap or the light emitting element 21 is inserted. The structures for this purpose can be removed.

[0097] The lighting module 100 has a flat plate shape when viewed from the side. It may be provided in a convex curved shape, a concave curved shape, or a shape having both a convex and a concave shape. When viewed from above, the lighting modules have a variety of shapes, including striped bar shapes, polygonal shapes, Circular, elliptical, or with convex or concave sides It can be in the form of.

[0098] 3 to 13 show examples of modifications of the diffusion layer and other structures in the lighting module of the present invention. The same configuration as the above configuration can be selectively applied to this modified example or other examples by referring to the above description. It can be used.

[0099] FIG. 3 shows a first modification of the lighting module of FIG.

[0100] Referring to FIG. 3, the lighting module includes a substrate 11 on which a plurality of light-emitting elements 21 are arranged. A first resin layer 32 may be disposed on the plurality of light emitting elements 21. The lighting module is shown in FIG. This is the configuration of the lighting module described with two layers removed.

[0101] The first resin layer 32 may include a phosphor and a diffusing agent. For example, red phosphor, amber phosphor, yellow phosphor, green phosphor, or white phosphor. The first resin layer 32 may include at least one of a diffusion layer or a resin. The first resin layer 32 may be defined as a resin layer. They may be made of the same material.

[0102] The content of the diffusing agent added to the first resin layer 32 is 5 wt% or less, for example, 2 wt%. If the content of the diffusing agent is less than the above range, the hot There is a limit to how low the spot can be, and if it is greater than this range, the light transmittance will decrease. Therefore, the diffusion agent is disposed in the first resin layer 32 at the above content. This diffuses the light and reduces hot spots without reducing light transmission. Cut.

[0103] The phosphor added in the first resin layer 32 is intimately connected to the resin material of the first resin layer 32. The difference in content may be 25% or less, or 15% or less. The content may be 35 wt% or more, or in the range of 35 wt% to 45 wt%. The content of the phosphor in the first resin layer 32 may be five times or more higher than the content of the diffusing agent. Accordingly, the color on the surface of the first resin layer 32 is provided by the color of the phosphor. This can improve the light diffusion and wavelength conversion efficiency. 32, the wavelength of light emitted from the light emitting element 21, for example, blue light, is reduced from passing through. In addition, the light extracted through the first resin layer 32 is converted into a fluorescent material having a wavelength. The thickness of the first resin layer 32 is 3 mm or more, for example, 3 mm to The first resin layer 32 may be formed to a thickness of 5 mm. By doing so, the light can be diffused and wavelength converted. The thickness of the first resin layer 32 is set to 1 / 2 mm between the light emitting elements 21. The spacing between the plurality of light-emitting elements 21 may be equal to or smaller than the spacing between the plurality of light-emitting elements 21. The gap may be the same as or greater than the thickness of the first resin layer 32 .

[0104] The lighting module of FIG. 3 has a structure in which the first and second diffusion layers of FIG. 1 are removed, and The thickness of the resin layer 32 can be used to provide a wavelength-converted surface light source. One resin layer 32 can include the functions of the first and second diffusion layers disclosed in FIG. The first resin layer 32 can be molded onto the light emitting device 21 and hardened. The lighting module according to the embodiment has a thickness of 5.5 mm or less and emits surface light through the upper surface. The lighting module can emit light from the side and has flexible characteristics. can be released.

[0105] FIG. 4 shows a second modification of the lighting module of FIG.

[0106] Referring to FIG. 4, the lighting module has a plurality of light emitting elements 21 arranged on a substrate 11. The plurality of light emitting elements 21 are molded with a first resin layer 33. A first diffusing layer 55 may be disposed thereon. The lighting module may be the same as the lighting module illustrated in FIG. This structure has one layer removed from the core.

[0107] The first resin layer 33 may mold the light emitting element 21. The first resin layer 33 may be formed of a resin material containing the diffusing agent and then hardened. Here, the amount of the diffusing agent is 1.5 wt. based on the amount of the first resin layer 33 in the process. The first resin layer 33 may be made of a transparent resin material. For example, UV (Ultra violet) resin, epoxy or silicone. The first diffusion layer 55 and the first resin layer 33 may be made of a resin material such as silicon dioxide. The lighting module can be made of the same resin material as the light source module. The module thickness can be reduced, and the light is diffused through the first resin layer 33 to prevent hot spots. The first resin layer 33 has the function of the layer having the diffusing agent in FIG. It is possible.

[0108] The thickness of the first resin layer 33 is 3 mm or more, for example, in the range of 3 mm to 4 mm. The first resin layer 33 is formed to a thickness of 100 mm, so that the reduction in light diffusion can be prevented. The part may contain beads or dispersing agent. The first resin layer 33 may be disposed between the substrate 11 and the first diffusion layer 55. Such a first resin layer 33 can diffuse the light emitted through the light emitting element 21. Therefore, the hot spot caused by the light emitted through the first resin layer 33 can be prevented. The diffusing agent can reduce the wavelength of the light emitted from the light emitting element 21. Such a diffusing agent may have a size larger than the wavelength. , the light diffusion effect can be improved.

[0109] The content of the diffusing agent in the first resin layer 33 is 5 wt % or less, for example, 2 wt %. If the content of the diffusing agent is less than the above range, the hot spot There is a limit to how low the pot can be, and if it is higher than this range, the light transmittance may decrease. Therefore, the diffusing agent is disposed in the first resin layer 33 in the above-mentioned amount. This diffuses the light and reduces hot spots without reducing light transmission. It is possible.

[0110] The first diffusion layer 55 may include a phosphor, and the phosphor may be, for example, a red phosphor. At least one of amber phosphor, yellow phosphor, green phosphor, and white phosphor The phosphor added to the first diffusion layer 55 may include The difference in content between the first diffusion layer 5 and the resin material of the second diffusion layer 5 may be 20% or less, or 10% or less. 5, the content of phosphor is 40 wt% or more, or in the range of 40 wt% to 60 wt% Accordingly, the color on the surface of the first diffusion layer 55 can be determined by the color of the phosphor. The first diffusion layer can be provided to improve light diffusion and wavelength conversion efficiency. 55, the wavelength of light emitted from the light emitting element 21, for example, blue light, is reduced from passing through. In addition, the light extracted through the first diffusion layer 55 is reflected by the surface of the phosphor. The thickness of the first diffusion layer 55 is 0.3 mm or more, for example, 0.3 mm. The first diffusion layer 55 may be formed to a thickness in the range of 0.1 to 0.7 mm. By providing such a light source, it is possible to diffuse the light and convert its wavelength. The module may be provided as a surface light source. The lighting module according to the embodiment may have a diameter of 5.5 mm or less. It has a thickness so that it can emit a surface light source through the upper surface and has flexibility. The lighting module can emit light through the side surfaces.

[0111] FIG. 5 is another example of the lighting module of FIG. 4. Referring to FIG. 5, the lighting module The first diffusion layer 55 is disposed on the first resin layer 33 that covers the light emitting element 21 disclosed in the embodiment. The first diffusion layer 55 includes a side surface portion 55a that covers the side surface of the first resin layer 33. The side surface portion 55a of the first diffusion layer 55 is formed along the side surface of the first resin layer 33. The side surface portion 55a is disposed to cover the side surface of the first resin layer 33. , may extend from the upper edge of the first resin layer 33 toward the surface of the substrate 11. The side surface 55a of the first diffusion layer 55 can be in contact with the upper surface of the substrate 11. The side surface 55a of the first diffusion layer 55 contacts the outer periphery of the substrate 11. The first diffusion layer can prevent moisture penetration and protect the side surface of the lighting module. The side surface 55a of the light emitting element 55 may be doped with the phosphor disclosed above, but is not limited thereto. The side surface portion 55a of the first diffusion layer 55 is one side surface of the first resin layer 33, and at least two It can be formed on one or all sides or at least one side can be open. Some light can be extracted through the open area.

[0112] FIG. 6 shows a third modification of the lighting module of FIG.

[0113] Referring to FIG. 6, the lighting module includes a substrate 11 on which a plurality of light-emitting elements 21 are arranged. A first resin layer 33 is molded on the plurality of light emitting elements 21. A first diffusing layer 52 may be disposed on the light source 33. The lighting module may be the same as the lighting module illustrated in FIG. This is a configuration in which one layer has been removed from the module.

[0114] The first resin layer 33 may mold the light emitting element 21. The first resin layer 33 may be formed of a resin material containing the diffusing agent and then cured. The diffusion agent is used in an amount of 1.5 wt % to 2 wt % based on the amount of the first resin layer 33 during the process. The first resin layer 33 may be made of a transparent resin material, for example, UV (Ultra violet) resin, epoxy or silicone The lighting module can be made of a resin material such as the one shown in FIG. 1 with one layer removed. This allows the module thickness to be thin, and the light is diffused through the first resin layer 33. This can reduce hot spots.

[0115] The thickness of the first resin layer 33 is 3 mm or more, for example, in the range of 3 mm to 4 mm. The first resin layer 33 is formed of a resin that diffuses inward, thereby preventing a decrease in light diffusion. It may contain beads or dispersing agents. The first resin layer 33 may be disposed between the substrate 11 and the first diffusion layer 52. The first resin layer 33 can diffuse the light emitted through the light emitting element 21. Therefore, the occurrence of hot spots due to the light emitted through the first resin layer 33 is prevented. The diffusing agent can reduce the wavelength of the light emitted from the light emitting element 21. Such a diffusing agent may have a size larger than the wavelength. Since the light diffusing effect can be improved, the light diffusing effect can be improved.

[0116] The content of the diffusing agent in the first resin layer 33 is 5 wt % or less, for example, 2 wt %. If the content of the diffusing agent is less than the above range, the hot There is a limit to how low the spot can be, and if it is greater than this range, the light transmittance will decrease. Therefore, the diffusion agent is disposed in the first resin layer 33 at the above content. This diffuses the light and reduces hot spots without reducing light transmission. It is possible.

[0117] The first diffusion layer 52 may include a phosphor and a diffusing agent, and the phosphor may be, for example, , red phosphor, amber phosphor, yellow phosphor, green phosphor, or white phosphor The diffusing agent may include at least one of PMMA (PolyMethoxymethylcellulose). Meth Acrylate), TiO2, SiO2, Al2O3, silicon series The diffusing agent may include at least one of the following: The diffusing agent has a refractive index in the range of 1.4 to 2 at the emission wavelength and a size of 4 μm. The diffusing agent may be in the range of 100 μm to 6 μm. The diffusing agent may be in the shape of a sphere, but is not limited thereto. 29, the refractive index of the diffusing agent is 1.4 or more, for example, 1.4 to In the case of 2, the uniformity of the light can be more than 90%. When the size of the diffusing agent is in the range of 4 μm to 6 μm, the uniformity of the light is 90% or more. The diffusion agent may be in a spherical shape, but is not limited thereto. The content of the diffusion agent is The content of the first resin layer 33 may be 5 wt % or less, for example, in the range of 2 wt % to 5 wt %. If the content of the diffusing agent is less than the above range, there is a limit to how much hot spots can be reduced. If the value is greater than the above range, the light transmittance may decrease. The powder is disposed in the first resin layer 33 in the above-mentioned amount to diffuse light. This reduces hot spots without reducing light transmittance.

[0118] The phosphor added to the first diffusion layer 52 is mixed with the resin material of the first diffusion layer 52. The difference in the amount may be 35% or less, or 25% or less. The first spreading agent may be added in an amount of 35 wt% or more or in a range of 35 wt% to 45 wt%. The content of the phosphor in the diffusion layer 52 may be five times or more higher than the content of the diffusing agent. Accordingly, the color on the surface of the first diffusion layer 52 can be provided by the color of the phosphor. The first diffusion layer 52 can improve the light diffusion and wavelength conversion efficiency. It is possible to reduce the transmission of light of a wavelength, for example, blue light, emitted from the light emitting element 21. In addition, the light extracted through the first diffusion layer 52 is provided to the surface light source according to the wavelength of the phosphor. The thickness of the first diffusion layer 52 may be 0.3 mm or more, for example, 0.3 mm to 0.7 mm. The first diffusion layer 52 can be formed to a thickness in the range of mm. By doing so, the light can be diffused and wavelength converted. The lighting module may be a flexible surface light source module having a thin thickness. It can be provided by mail.

[0119] FIG. 7 shows another example of the lighting module of FIG.

[0120] Referring to FIG. 7, the lighting module includes a first layer covering the light emitting element 21 disclosed in the embodiment. A first diffusion layer 52 is disposed on the first resin layer 33. The side surface portion 52a of the first diffusion layer 52 may include a side surface portion 52a covering the side surface of the first diffusion layer 52. , covering the side surface of the first resin layer 33 and extending in the surface direction of the substrate 11; The side surface 52a of the first diffusion layer 52 can be in contact with the upper surface of the substrate 11. The side surface 52a of the first diffusion layer 52 contacts the substrate 11 along the outer periphery. This prevents moisture penetration and protects the sides of the lighting module. The side surface of the first diffusion layer 52 may be doped with the phosphor and diffusing agent disclosed above. The side surface portion 52a of the first diffusion layer 52 is formed on one side surface of the first resin layer 33. , formed on at least two sides or all sides, or at least one side Some light can be extracted through the open area.

[0121] FIG. 8 shows a fourth modification of the lighting module of FIG. 1. The fourth modification has the structure of FIG. The following description will focus on modified examples that differ from the description of FIG.

[0122] Referring to FIG. 8, the lighting module includes a substrate 11, a plurality of light-emitting elements 2 on the substrate 11, and 1, a first resin layer 31 covering the light emitting element 21, a first diffusion layer 4 on the first resin layer 31, The first and second diffusion layers 41 may include a second diffusion layer 53 on the first diffusion layer 41. The structure of the second diffusion layer 53 is explained with reference to FIG. 1. The second diffusion layer 53 is a second resin layer. , a diffusion layer or a phosphor layer.

[0123] The second diffusion layer 53 may include a phosphor and a diffusing agent. The phosphor may be, for example, , red phosphor, amber phosphor, yellow phosphor, green phosphor, or white phosphor The diffusing agent may include at least one of PMMA (Poly Methyl Methyl Ether). Methacrylate, TiO2, SiO2, Al2O3, silicon-based The diffusing agent may have a refractive index of 1.4 or less at the emission wavelength. The size of the diffusing agent may be in the range of 4 μm to 6 μm. The diffusing agent may be, but is not limited to, a material having a refractive index of 1 as shown in FIG. 0.4 or more, for example, 1.4 or 2, the uniformity of the light is 90 % or more, and the size of the diffusing agent is in the range of 4 μm to 6 μm as shown in FIG. When this is done, the light uniformity can be over 90%.

[0124] The diffusing agent may be, but is not limited to, a spherical shape. The diffusion layer 41 may contain 5 wt% or less, for example, in the range of 2 wt% to 5 wt%. If the content of the agent is less than the above range, there is a limit to how much hot spots can be reduced. If the thickness is greater than the above range, the light transmittance may decrease. By disposing the above content in the first diffusion layer 41, the light is diffused and the light transmittance is increased. This reduces hot spots without degradation.

[0125] The phosphor added to the second diffusion layer 53 is mixed with the resin material of the second diffusion layer 53. The difference in the amount may be 35% or less, or 25% or less. can be added in amounts of 35 wt% or more or in the range of 35 wt% to 45 wt%. Therefore, the color on the surface of the second diffusion layer 53 can be provided by the color of the phosphor. The diffusion and wavelength conversion efficiency of the emitted light can be improved through the second diffusion layer 53. The wavelength of light emitted from the optical element 21, for example, blue light, can be reduced from passing through. In addition, the light extracted through the second diffusion layer 53 is provided to the surface light source according to the wavelength of the phosphor. The thickness of the second diffusion layer 53 is 0.3 mm or more, for example, 0.3 mm to 0.5 mm. The second diffusion layer 53 may be formed to a thickness in the range of 1 / 2 m. This allows the light to be diffused and wavelength converted. It may be provided with a light source.

[0126] FIG. 9 is another example of the lighting module of FIG. 8, in which the first and second The second diffusion layer is the same and further includes a side portion 52a of the second diffusion layer 52. The second diffusion layer 52 has a side surface portion 52 that covers the side surfaces of the first resin layer 31 and the first diffusion layer 41. The side surface portion 52a of the second diffusion layer 52 may include the first resin layer 31. The first diffusion layer 41 is covered along its side surface and can extend in the direction of the upper surface of the substrate 11. The side surface 52 a of the second diffusion layer 52 may be in contact with the upper surface of the substrate 11 . The side surface portion 52a of the second diffusion layer 52 contacts the outer periphery of the substrate 11. This can prevent moisture penetration and protect the side surface of the lighting module. The side surface 52a of the diffusion layer 52 may be doped with the phosphor and diffusing agent disclosed above. The side surface portion 52a of the second diffusion layer 52 is one side surface of the first resin layer 31 and the first diffusion layer 41, Formed on at least two sides or all sides, or open on at least one side It can be turned on.

[0127] FIG. 10 is another example of the lighting module of FIG. 1, in which the first and second The first and second diffusion layers are identical and further include side portions 51 a of second diffusion layer 51 . The second diffusion layer 51 has a side portion 51 that covers the side surfaces of the first resin layer 31 and the first diffusion layer 41. The side portion of the second diffusion layer 51 may include a first diffusion layer 52 and a second diffusion layer 53. The diffusion layer 41 may cover the side surface of the diffusion layer 41 and extend in the direction of the upper surface of the substrate 11. The side surface 51a of the second diffusion layer 51 may contact the upper surface of the substrate 11. The side surface 51a of the second diffusion layer 51 contacts the outer periphery of the substrate 11, The second diffusion layer 5 can prevent moisture penetration and protect the side surfaces of the lighting module. The side surface 51a may be doped with the phosphor disclosed above, but is not limited thereto. The side surface portion 51a of the second diffusion layer 51 is formed on one side surface of the first and second diffusion layers, and on at least two It can be formed on one or all sides or open on at least one side. can.

[0128] 11 shows a fifth modification of the lighting module of FIG. 1. The fifth modification is a modification of the structure of FIG. The following description will focus on examples that are different from the description of FIG.

[0129] Referring to FIG. 11, the lighting module includes a substrate 11 and a plurality of light-emitting elements on the substrate 11. 21, a first resin layer 31 covering the light emitting element 21, and a first resin layer 32 on the first resin layer 31. The first resin layer 31 may include a diffusion layer 54. For the configuration of the first resin layer 31, refer to the description of FIG. Specifically, this is the lighting module of FIG. 1 with one layer removed.

[0130] The first diffusing layer 54 may include a phosphor and a diffusing agent, and the phosphor may be, for example, , red phosphor, amber phosphor, or yellow phosphor The diffusing material may include at least one of a green phosphor and a white phosphor. The agent is PMMA (Poly Methyl Meth Acrylate) based, TiO2 The diffusion layer may contain at least one of SiO2, Al2O3, and silicon-based materials. The powder has a refractive index in the range of 1.4 to 2 at the emission wavelength and a size of 4 μm to 6 μm. The diffusion agent may be in the range of m. The diffusion agent may be in the shape of a sphere, but is not limited thereto. When the refractive index of the diffusing agent is 1.4 or more, for example, 1.4 to 2, the light The uniformity of the diffusion layer can be 90% or more. When the particle size is in the range of 4 μm to 6 μm, the uniformity of the light can be more than 90%. The diffusing agent may be, but is not limited to, a spherical shape. The diffusion layer 54 may contain up to 5 wt % of the cellulose, for example, in the range of 2 wt % to 5 wt %. If the powder content is less than the above range, there is a limit to how much hot spots can be reduced. If the amount is greater than the above range, the light transmittance may decrease. By disposing the above-mentioned content in the first diffusion layer 54, the light is diffused and the light transmittance is increased. This reduces hot spots without reducing power consumption.

[0131] The phosphor added to the first diffusion layer 54 is mixed with the resin material of the first diffusion layer 54. The difference in the amount of phosphor in the first diffusion layer 54 may be 35% or less, or 25% or less. It may be added in an amount of 35 wt% or more, or in a range of 35 wt% to 45 wt%. The phosphor content in the diffusion layer 54 may be five times higher than the diffusing agent content. Accordingly, the color on the surface of the first diffusion layer 54 can be provided by the color of the phosphor. The first diffusion layer 54 can improve the light diffusion and wavelength conversion efficiency. It is possible to reduce the transmission of light of a wavelength, for example, blue light, emitted from the light emitting element 21. In addition, the light extracted through the first diffusion layer 54 is provided to a surface light source according to the wavelength of the phosphor. The thickness of the first diffusion layer 54 may be 1.7 mm or more, for example, 1.7 mm to 2.2 mm. The first diffusion layer 54 can be formed to a thickness in the range of mm. By doing so, the light can be diffused and wavelength converted. The lighting module may be a flexible surface light source module having a thin thickness. The first diffusion layer 54 can be a resin layer, a diffusion layer, or a phosphor layer. It can be defined.

[0132] FIG. 12 shows another example of the lighting module of FIG. 11. The silicon layer 31 is the same and further includes a side portion 54a of the first diffusion layer 54. The first diffusion layer 54 may include a side surface portion 54a that covers the side surface of the first resin layer 31. The side surface portion 54a of the first diffusion layer 54 is covered along the side surface of the first resin layer 31. The side surface portion 54a of the first diffusion layer 54 may extend in the direction of the upper surface of the substrate 11. The side surface 54a of the first diffusion layer 54 can contact the upper surface of the substrate 11. The contact along the outer periphery of the substrate 11 prevents moisture penetration and The side surface portion 54a of the first diffusion layer 54 is provided with the above-mentioned The phosphor may be added to the side surface 54a of the first diffusion layer 54, but is not limited thereto. is formed on one side, at least two sides, or all sides of the first resin layer 31. or at least one side can be open.

[0133] Fig. 13 shows a sixth modification of the lighting module of Fig. 1. Fig. 13 shows the lighting module of Fig. 1. This is an example in which the area between the first and second diffusion layers is deformed.

[0134] Referring to FIG. 13, the lighting module includes a substrate 11, a light-emitting element disposed on the substrate 11, and a light-emitting element. A first resin layer 31 is formed on the element 21 and the substrate 11, and an adhesive layer is formed on the first resin layer 31. 45 and a light-shielding portion 46, a first diffusion layer 41 on the adhesive layer 45 and the light-shielding portion 46, and A second diffusing layer 51 may be included on the first diffusing layer 41. In such a lighting module, The first resin layer 31 and the first and second diffusion layers 41, 51 have the same configuration as in FIG. 1. The overlapping explanations will be omitted.

[0135] The adhesive layer 45 may be bonded between the first resin layer 31 and the first diffusion layer 41. The adhesive layer 45 may be made of the same material as the first resin layer 31 and the first diffusion layer 41 or another material. The adhesive layer 45 may be made of a resin material such as silicone or epoxy. The adhesive layer 45 may be disposed around the light-shielding portion 46 or may extend to the underside of the light-shielding portion 46. The light-shielding portion 46 is formed on the lower surface of the first diffusion layer 41 in a position corresponding to the light-emitting element 21. The light-shielding portion 46 can be arranged in a vertical direction so as to overlap the light-emitting element 21. The light-shielding portion 46 is formed on the light-emitting element 21 so as to occupy 50% of the area of ​​the upper surface of the light-emitting element 21. The range may be, for example, 50% to 120%. The light-shielding portion 46 may be formed through a printed area. 3. Use reflective ink containing one of CaCO3, BaSO4, or Silicon. The light-shielding portion 46 can be printed by using the light-emitting element 21 through the light-emitting surface. The emitted light is reflected to prevent the occurrence of hot spots on the light emitting element 21 due to the luminous intensity of the light. The light blocking part 46 is formed by printing a light blocking pattern using light blocking ink. The light blocking portion 46 is formed on the lower surface of the first diffusion layer 41 by printing. The light blocking portion 46 does not block 100% of the incident light, but has a transmittance lower than a reflectance. The light blocking portion 46 can block and diffuse light. They may be formed in a single layer or multiple layers, and may have the same or different pattern shapes. It is possible.

[0136] The second diffusion layer 51 may include the side portion as disclosed above, and the first resin layer 31 and the first diffusion layer 52 may be disposed in a space between the first resin layer 31 and the first diffusion layer 52. In another example, the side surface of the first diffusion layer 41 may be covered. In another example, the side portion of the second diffusion layer 51 may be formed by extending from the substrate 1. 11, but the first resin layer 31 and the first diffusion layer 41 may be in contact with each other. In another example, the second diffusion layer 51 may be in contact with the top surface of either of the first diffusion layer 51 and the second diffusion layer 52. The surface portion is formed by bonding at least one of the upper surface of the first resin layer 31 and the upper surface of the first diffusion layer 41 to the substrate. In this case, the first resin layer 31 and the first diffusion layer 41 may contact the upper surface of the first resin layer 31. The outer periphery of the can be formed in a concave-convex pattern shape.

[0137] In the lighting module according to the embodiment, the diffusion layer having the phosphor is located at the farthest position from the light emitting element. When the first and second laser diodes are arranged in a position where the wavelength conversion efficiency is the highest, The diffusion layers may be stacked in the same or different layer order. The first diffusion layer having the diffusion agent is adjacent to the light emitting device or is further from the first resin layer. For example, the second diffusion layer having the phosphor may be disposed adjacent to the light emitting element. The lighting module may be disposed further below the first resin layer, but is not limited thereto. The light source can be provided as a flexible surface light source module having a small thickness.

[0138] The area of ​​the upper surface of the substrate 11 disclosed in the first embodiment is the area of ​​the upper surface of the substrate 11 below the first resin layer disclosed above. The area of ​​the substrate 11 may be equal to or greater than the area of ​​the surface. The lengths of X and Y may be greater than the lengths of the first resin layer in the first and second directions. The outer periphery of the substrate 11 may extend outward beyond the side surface of the first resin layer. The outer periphery of the plate 11 can extend further outward than the side portions of the first and second diffusion layers. The length of the substrate 11 in the first and second directions can be determined by the side surface of the first resin layer, the length of the first and 10% or less, or 1% or less, of at least one of the side portions of the second diffusion layer. It may be in the range of 10% or more.

[0139] In the embodiment of the invention, the material of the diffusion plate, which is the same as the light guide plate, is not flexible, so it has a curved structure. In addition, the number of light emitting elements can be reduced for a surface light source. It is possible.

[0140] In the embodiment, a plurality of resin layers are formed on a substrate 11, for example, a first resin layer 31 and a diffusion layer 41, 5 1 and 2. A soft lighting module having such a laminated structure can be provided. A soft lighting module can be provided. In an embodiment, the lighting module includes a first resin layer. The first diffusion layer 41 guides and spreads the light in a radial or linear direction within the first diffusion layer 41. The light is diffused through a diffusing agent, and wavelength conversion and diffusion are performed through the phosphor of the second diffusion layer 51. It can be dispersed.

[0141] Accordingly, the light finally emitted through the lighting module is directed to a surface light source. In addition, the plurality of light emitting elements 21 in the lighting module 100 are flexible and flip-type. The light is emitted from five surfaces on the substrate, and the light is emitted from the surface and side of the light emitting element 21. The light is emitted in the direction of the first and second diffusion layers 41 and 51 and in the lateral direction of the first resin layer 31. It is possible.

[0142] <Second Example>

[0143] In describing the second embodiment, a duplicated description of the same configuration as in the first embodiment will be omitted. The same configuration as in the first embodiment will be referred to. The lighting module according to the second embodiment is as follows: The light emitting device and the substrate may include one or more resin layers. The layer may include, for example, one or more layers or two or more layers. The resin layer may include impurities. The layers are: a layer without a phosphor, a layer with a diffusing agent, a layer with ink particles added, and a layer with a diffusing agent. a layer containing phosphor and a diffusing agent, or a layer containing phosphor and ink particles. The impurities may include at least two layers or three layers or more. At least one of the plurality of resin layers may include ink particles. The ink may selectively contain at least one of a diffusing agent, a phosphor, and ink particles. That is, the phosphor, the diffusing agent, and the ink particles are added to separate resin layers. The phosphor, the diffusing agent, and the like may be mixed together and disposed in one resin layer. At least one or more of the ink particles may be added to one resin layer. The layers containing the phosphor and the diffusing agent may be disposed adjacent to each other or may be disposed adjacent to each other. When the phosphor layer and the diffusing agent layer are separated from each other, The layer in which the phosphor is disposed may be disposed above the layer in which the diffusing agent is disposed. The photo body and the ink particles may be disposed in the same layer or in different layers. The resin layer containing ink particles is placed above the resin layer containing phosphor. It is possible.

[0144] FIG. 14 is a vertical cross-sectional view of a lighting module according to a second embodiment.

[0145] Referring to FIG. 14, the lighting module 101 includes a substrate 11, a a light emitting element 21 formed on the substrate 11; and a first resin layer 61 covering the light emitting element 21 on the substrate 11. The substrate 11 and the light emitting element 21 may have the structure disclosed in FIGS. We will refer to the composition of the

[0146] The lighting module 101 emits light emitted from the light emitting element 21 into a surface light source. The lighting module 101 can be formed by a reflecting member disposed on the upper surface of the substrate 11. The reflecting member may reflect light traveling to the upper surface of the substrate 11 toward the first register. The light emitting element 21 can be reflected by the insulating layer 61. A plurality of the light emitting elements 21 are arranged on the substrate 11. The plurality of light emitting elements 21 arranged on the lighting module 101 may be arranged as shown in FIG. The substrate 1 may be arranged in N columns and M rows (N and M are integers of 1 or more). A connector is provided on a part of the upper or lower surface of the light emitting element 21 to supply power to the light emitting element 21. It is possible.

[0147] The light emitting element 21 is an LED chip that emits light from at least five surfaces, and is provided on the substrate 11. As another example, the light emitting device 21 may be arranged in a horizontal chip form. The light emitting element 21 may be a light emitting diode (LED) chip. and at least one of blue, red, green, ultraviolet (UV), or infrared. The light emitting element 21 can emit light of at least one of blue, red, and green, for example. The light emitting element 21 can emit light at the same time. The light emitting element 21 may be a fluorescent material having a phosphor on the surface. A body layer can be formed.

[0148] The light emitting element 21 is disposed on the substrate 11 and sealed by the first resin layer 61. The plurality of light emitting devices 21 may be in contact with the first resin layer 61. The first resin layer 61 may be disposed on the side and top surfaces of the light emitting element 21 .

[0149] The first resin layer 61 protects the light emitting element 21 and contacts the upper surface of the substrate 11. The light emitted from the light emitting element 21 is emitted through the first resin layer 61. The light emitting element 21 can emit light in the range of 400 nm to 500 nm, for example, 420 It can emit blue light in the range of 470 nm to 470 nm.

[0150] The first resin layer 61 may have a thickness greater than that of the light emitting device 21. The resin layer 61 is made of a transparent resin material, for example, a UV (Ultra violet) resin ( Resin), silicone or epoxy.

[0151] The first resin layer 61 may include a phosphor. The first resin layer 61 may contain phosphors, ink particles, and the like. The first resin layer 61 may contain phosphor, ink particles, and a diffusing agent. The phosphor may contain at least one or more of the following diffusing agents: , red phosphor, amber phosphor, yellow phosphor, green phosphor, or white phosphor The diffusing agent may include at least one of PMMA (PolyMethoxymethylcellulose). Meth Acrylate), TiO2, SiO2, Al2O3, silicon The diffusing agent may have a refractive index of less than 1.4 at the emission wavelength. The size of the diffusing agent may range from 1 μm to 100 μm. As shown in FIG. 29, the diffusing agent has a refractive index of 1.4. If the uniformity of the light is 90% or more, the uniformity of the light can be 90% or more. Thus, when the size of the diffusing agent is in the range of 1 μm to 30 μm, the uniformity of the light is 9. The light uniformity can be 0% or more. Light uniformity of 90% or more can be provided.

[0152] The ink particles are at least one of a metallic ink, a UV ink, and a hardening ink. The size of the ink particles may be smaller than the size of the phosphor. The surface color of the ink particles is one of green, red, yellow, and blue. The type of ink is PVC (Poly vinyl chloride) ink. ink, PC (Polycarbonate) ink, ABS (acrylonitrile e butadiene styrene copolymer ink, UV resin ink Ink, epoxy ink, silicone ink, PP (polypropylene) ink , water-based ink, plastic ink, PMMA (poly methyl methac Selective application of either acrylate ink or PS (Polystyrene) ink wherein the width or diameter of the ink particles is 5 μm or less, or 0. At least one of the ink particles may be in the range of 0.5 μm to 1 μm. It may be smaller than the length.

[0153] The color of the ink particles includes at least one of red, green, yellow, and blue. For example, the phosphor may emit red wavelengths and the ink particles may contain red color. For example, the red color of the ink particles is greater than the color of the phosphor or the wavelength of light. The ink particles may be thick and have a different color than the light emitted from the light emitting element 21. The ink particles can have a blocking or blocking effect on incident light. The ink particles may contain the same color system as the phosphor.

[0154] The lighting module 101 according to the second embodiment has a first resin layer 61 containing phosphor and ink particles. The ink particles can block the light emitted from the light emitting element 21. The ink particles increase the phosphor concentration to For example, in the case of a lighting module without ink particles, the phosphor The content of phosphor can be increased to more than 35%, and in the case of lighting modules containing ink particles, the content of phosphor The content can be reduced to 23% or less. The surface of the lighting module 101 or the surface of the first resin layer 61 is a surface cover when emitting light. That is, the light emitting element 21 can be turned on / off to provide a light emitting device. This can reduce the chromaticity or color difference on the surface of the first resin layer 61.

[0155] The first resin layer 61 may contain phosphor, diffusing agent and ink particles. The content of the composite diffusing agent may be 3 wt% or less, for example, in the range of 1 wt% to 3 wt%, The phosphor content is 23 wt% or less, or is added in the range of 10 wt% to 23 wt%. The ink particles are added in an amount of 12 wt % or less, for example, in the range of 4 wt % to 12 wt %. In the first resin layer 61, the amount of the diffusing agent is determined by the amount of the diffusing agent. The content of the phosphor can reduce the amount of light emitted from the glass and prevent the light transmittance from decreasing. This prevents a decrease in wavelength conversion efficiency, and the surface coverage can be controlled by the content of the ink particles. This can reduce the color difference and reduce hot spots.

[0156] When the first resin layer 61 contains phosphor and ink particles, the diffusing agent is 0 wt %. In such a structure, the content of the phosphor is 23 wt% or less, or 10 wt% or less. The ink particles may be added in a range of 12 wt% or less, for example, 4 wt%. The phosphor content in the first resin layer 61 may be in the range of 0.1 wt % to 12 wt %. The content of the ink particles is 3 wt% or more, or in the range of 3 wt% to 13 wt% Since the weight of the ink particles is smaller than the weight of the phosphor, The ink particles may be distributed in an area adjacent to the surface of the first resin layer from the phosphor. Accordingly, the color of the surface of the first resin layer 61 can be provided by the color of the ink particles. These ink particles can reduce light transmission, reducing hot spots. It is possible.

[0157] The color on the surface of the first resin layer 61 can be provided by the color of the ink particles. The difference in color of the appearance image due to the on / off of the optical element 21 can be reduced, and the wavelength conversion efficiency In addition, the light emitted from the light emitting element 21 through the first resin layer 61 can be prevented from decreasing. The first layer can reduce the transmission of light of a certain wavelength or blue light. The light emitted through the phosphor layer 61 can be provided to a surface light source according to the wavelength of the phosphor. The thickness of the resin layer 61 may be 3 mm or more, for example, in the range of 3 mm to 5 mm. The thickness of the first resin layer 61 is equal to the spacing between the light emitting elements 21, or There are small things.

[0158] The first resin layer 61 may be molded onto the light emitting device 21 and cured. The lighting module 101 has a thickness of 5.5 mm or less and can emit a surface light source through the upper surface. The lighting module 101 emits light through its surface and sides. It can be put out.

[0159] FIG. 15 shows a first modification of the lighting module of FIG.

[0160] Referring to FIG. 15, the lighting module 101A includes a substrate 11, a light-emitting element 21, a first register, and a second register. The insulating layer 47 and the first diffusion layer 62 may be included.

[0161] In the lighting module 101, the first structural example is a structure in which the first resin layer 47 is provided with a diffusing agent and The first diffusion layer 62 may contain ink particles. In the example, the first resin layer 47 contains a diffusing agent, and the first diffusing layer 62 contains a phosphor and an insulator. In the third structural example, the first resin layer 47 is a layer without impurities. The first diffusion layer 62 may contain phosphor, ink particles, and a diffusion agent. The first resin layer 47 is doped with a fluorescent material, and the first diffusion layer 62 contains ink particles. In the fifth structural example, the first resin layer 47 is a layer without impurities, and the first diffusion layer The layer 62 may be a layer containing phosphor and ink particles. In other words, the first resin layer 47 and the first diffusion layer 62 may not contain a diffusion agent.

[0162] The content of the diffusing agent in the first resin layer 47 is 3 wt % or less, for example, 1 wt %. If the content of the diffusing agent is less than the above range, the hot spot There is a limit to how much pot can be reduced, and if it is greater than the above range, the light transmittance will decrease. Therefore, the diffusion agent is disposed in the first resin layer 47 in the above-mentioned amount. This diffuses the light and reduces hot spots without reducing light transmission. do.

[0163] The content of the phosphor added to the first resin layer 47 or the first diffusion layer 62 is 23 wt. % or less or in the range of 10 wt to 23 wt%. The first diffusion layer can improve the light diffusion and wavelength conversion efficiency in the module. 62, the wavelength of light emitted from the light emitting element 21, for example, blue light, is reduced from passing through. In addition, the light extracted through the first diffusion layer 62 is diffused in a plane depending on the wavelength of the phosphor. The phosphor may be, for example, a red phosphor, an amber phosphor, a yellow phosphor, or the like. The light source may include at least one of a phosphor, a green phosphor, or a white phosphor.

[0164] The content of ink particles added to the first diffusion layer 62 is 12 wt % or less, or 4 wt % or less. The amount of the added SiO2 can be in the range of 10 to 12 wt %. It can improve the surface color and prevent light diffusion and hot spots. The color of the phosphor particles can be the same as the color of the light wavelength-converted by the phosphor. The color of the ink particles may be the same as the color of the phosphor.

[0165] The first resin layer 47 molds the light emitting device 21 and covers the upper surface of the substrate 11. The thickness of the first resin layer 47 is 3 mm or more, for example, 3 The first resin layer 47 may be provided in a thickness range of 1 mm to 4 mm. Since the first resin layer 47 is provided in the vicinity of the first resin layer 47, the light diffusion property can be improved. When at least one of a diffusing agent and a phosphor is disposed inside, the light diffusion property is improved. It can be done.

[0166] The first diffusion layer 62 is made of a transparent resin material, for example, a UV (Ultra Violet) resin. The material may be a resin, such as resin, epoxy, or silicone. The refractive index of the diffusion layer 62 is 1.8 or less, for example, in the range of 1.1 to 1.8 or less than 1.4. The refractive index of the first diffusion layer 62 may be in the range of 1.6 or lower than that of the diffusing agent. The thickness of the first diffusion layer 62 may be smaller than that of the first resin layer 47. can be formed to a thickness of 0.3 mm or more, for example, in the range of 0.3 mm to 0.7 mm.

[0167] The phosphor added to the first diffusion layer 62 is mixed with the resin material of the first diffusion layer 62. The difference in the amount may be 20% or less, or 10% or less. The content of may be 10 wt% or more, or may be added in the range of 10 wt% to 23 wt%. Accordingly, the color on the surface of the first diffusion layer 62 can be provided by the color of the phosphor. The first diffusion layer 62 can improve the light diffusion and wavelength conversion efficiency. It is possible to reduce the transmission of light of a wavelength, for example, blue light, emitted from the light emitting element 21. In addition, the light extracted through the first diffusion layer 62 is provided to the surface light source according to the wavelength of the phosphor. The first diffusion layer 62 can diffuse light by being provided in the above-mentioned thickness range. Such a lighting module can be provided as a surface light source. The red color of the first diffusion layer 62 when the light emitting element 21 is turned off is When the light source 21 is turned on, the color of the light emitted through the first diffusion layer 62 is more intense. That is, the surface saturation of the light-emitting element in the off state can be as low as or higher than the For example, in the off state of the light emitting device, the surface saturation may be lower than that in the on state. The surface chroma of the first diffusion layer 62 is close to medium chroma, and the light emitting element is in an on state. In this case, the surface saturation of the first diffusion layer 62 and the surface saturation of the emitted light are close to high saturation. There is.

[0168] The thickness of the lighting module 101 is 220% or less of the thickness of the first resin layer 47, e.g. For example, in the range of 180% to 220%, or the thickness of the lighting module 101 may be the distance from the lower surface of the substrate 11 to the upper surface of the first diffusion layer 62. The thickness of the first diffusion layer 62 may be thinner than that of the first resin layer 47. The thickness is 80% or less of the thickness of the first resin layer 47, for example, in the range of 40% to 80%. Since the first diffusing layer 62 is provided with a small thickness, the flexibility of the lighting module can be improved. The lighting module 101 is provided with a thickness of 5.5 mm or less. This allows the light source to be provided as a flexible and slim surface light source module.

[0169] The lighting module according to the embodiment has a thickness of 5.5 mm or less and has a surface light source through the upper surface. The lighting module can emit light and has a flexible characteristic. The lighting module can be flexible or curved. It can include structure.

[0170] FIG. 16 shows a modification of the lighting module shown in FIG. 15, and the same components as those shown in FIG. 15 are the same as those shown in FIG. 16, the lighting module 102 is The first diffusion layer 62 is disposed on the first resin layer 47 that covers the light emitting element 21 disclosed in the embodiment. The first diffusion layer 62 includes a side portion 62a that covers the side surface of the first resin layer 47. The first diffusion layer 62 can be defined as a second resin layer.

[0171] The side surface portion 62a of the first diffusion layer 62 is disposed along the side surface of the first resin layer 47. The side surface portion 62a covers the side surface of the first resin layer 47. The first extension 47 may extend from the upper edge of the resin layer 47 toward the upper surface of the substrate 11. The side surface 62a of the diffusion layer 62 may contact the upper surface of the substrate 11. The side portions 62a of the layer 62 contact the substrate 11 along the outer periphery, thereby preventing moisture penetration. The side of the first diffusion layer 62 can be protected from light transmission. The surface portion 62a may include the phosphor and ink particles disclosed above. The side surface portion 62a of the first diffusion layer 62 is one side surface of the first resin layer 47, and at least two side surfaces of the first resin layer 47. Or it can be formed on all sides or open on at least one side. Some light can be extracted through the open area.

[0172] Since ink particles are added to the first diffusion layer 62 and its side surface portion 62a, The color appearance of the surface color of the diffusion layer 62 is different when the light emitting element 21 is driven and when it is not driven. In other words, the color caused by the ink particles is relatively far away. When viewed from a distance, the color is clearer and more intense, even when the light emitting element 21 is turned off. Accordingly, even if the light emitting element 21 is in an on / off state, the illumination module The color difference on the surface of the module can be reduced. The content of the ink particles in the upper surface of the first diffusion layer 62 is the same as or greater than that of the upper surface of the first diffusion layer 62. can be quite high.

[0173] An adhesive may be disposed between the first resin layer 47 and the first diffusion layer 62. The adhesive can be a transparent material, such as a UV adhesive, silicone, or epoxy. The first diffusion layer 62 may be adhered in the form of a film or may be injection molded. When the first diffusion layer 62 is provided in the form of a film, it may be adhered with an adhesive to provide a uniform light distribution. It is possible to provide a certain level of surface color. The first diffusion layer 62 can be a second resin layer, which will be described later. The first diffusion layer 62 can be attached by the surface adhesive force of the first resin layer 47. The phosphor in the first diffusion layer 62 is disposed on the upper surface of the first resin layer 47, and the light-emitting element The phosphor and ink particles in the first diffusion layer 62 can be separated from the molecules 21. The phosphor and ink particles may be disposed on the top surface of the first resin layer 47. The phosphor may be disposed on the upper surface of the first resin layer 47, spaced apart from the light emitting element 21. The wavelength conversion efficiency can be improved as the ink particles are farther away from the light emitting element 21. The further away from the light emitting element 21 or the closer to the surface of the first diffusion layer 62, the less visible the surface color. It can improve sexuality.

[0174] In the second embodiment of the present invention, the first resin layer 47 does not contain a diffusing agent. The luminous flux of the fluorescent material and ink particles added to 62 is compared as follows: For the experiment, red phosphor and red ink particles were added to the first diffusion layer as shown in Table 1. The reference example (Ref) is a sample with no red ink particles and a red phosphor content of 50 wt%. This is an example where the diffusing agent content was 10 wt%.

[0175] In Examples 1, 2, and 3, the phosphor content in the first diffusion layer 62 is 10 wt %. and the red ink particle content is 5wt%, 7wt%, and 10wt%, respectively. In Examples 4, 5, and 6, the phosphor content is 15 wt %, and the red ink particles The contents of are 5 wt%, 7 wt%, and 10 wt%, respectively. In 9, the phosphor content is 20 wt% and the red ink particle content is 5 wt%, 7wt%, and 10wt%.

[0176] [Table 1]

[0177] Table 1 shows the structure of FIG. 15 and FIG. 16 in which the phosphor and ink particles are added to the first diffusion layer. This is the configuration in which experiments were conducted on Examples 1 to 9 in which the content of Zn was added.

[0178] FIG. 35 shows the lighting module of FIG. 15 and FIG. 16 with the light emitting element 21 turned off. FIG. 36 is a diagram comparing the surface color of the reference example and examples 1 to 9 in the above state. In the lighting module of FIG. 15 and FIG. 16, the substrate in the state where the light emitting element 21 is turned on This is a diagram comparing the surface color of the reference example with that of examples 1 to 9. The surface in this figure indicates the top surface of the first diffusion layer.

[0179] As shown in FIGS. 35 and 36, when the light emitting element 21 is in the off state, the table of the reference example (Ref) The surface color is yellow (amber), but in Examples 1 to 9, the surface color is reddish. When the light emitting element 21 is in an on state, the surface color increases due to the increase in the content of the phosphor. The color tone can be brighter, and the luminous flux can be reduced due to the increased ink particle content. It can be seen that...

[0180] Table 2 compares the color coordinates and luminous flux of the reference example in Table 1 with those of Examples 1 to 9. do.

[0181] [Table 2]

[0182] The reference example in Table 2 has the highest luminous flux, but as shown in Figures 35 and 36, it is a lighting module. There is a large difference in the color of the appearance depending on whether the light-emitting element is on or off. This may reduce the visibility of the module when the LED is off. This may cause an increase in

[0183] In the above Examples 1 to 9, the difference in color coordinates with the reference example is not large, and the color impression of the appearance is It can be seen that the light element is displayed in red when it is on or off. Examples 1, 4 and 7 have a luminous flux difference of 20% or less compared to the reference example and a red surface color. In the above-mentioned examples 1, 4 and 7, the red ink particles are the first diffusion. The content of the phosphor is 5 wt% of the layer content, and the content of the phosphor is in the range of 10 wt% to 20 wt%. It can be seen that the highest luminous flux is obtained when the

[0184] As shown in FIG. 37, in Examples 1 to 9, the content of the phosphor and ink particles was added. Comparison of luminous flux in lighting module samples (spl#1, 2, 3) provided with the first diffusion layer As shown in FIG. 38, the sample examples 1 to 3 are plotted on the color coordinate area (G1, G2, G3). Example 9 is distributed as follows: the color coordinates of samples 1, 2, and 3 of the lighting module Based on the region, the most suitable example 1 to example 9 can be selected and used. The second embodiment of the present invention is based on the above experimental example, and the content of ink particles in the first diffusion layer is The range of 4 wt% to 12 wt% and the range of 10 wt% to 23 wt% of the phosphor content It can be selectively added within the range.

[0185] FIG. 17 shows a third modified example of the lighting module according to the second embodiment.

[0186] Referring to FIG. 17, the lighting module includes a substrate 11, a light-emitting element 21, a first resin layer 47, and a light-emitting device 21a. The first resin layer may include a second diffusion layer 51 and a second resin layer 63. The second diffusing layer 51 may contain a powder or may be provided without a diffusing agent. The second resin layer 63 may be a layer to which ink particles are added. For example, the second diffusion layer 51 may be a layer to which a phosphor and a diffusing agent are added. The second resin layer 63 may contain phosphor and ink particles. A phosphor may be added to the second diffusion layer 51 and the second resin layer 63, and the second diffusion layer and the The two resin layers 63 may contain the same phosphor or different phosphors.

[0187] The second resin layer 63 may be disposed on the second diffusion layer 51. may be disposed between the first resin layer and the second resin layer 63. The thickness of the second diffusion layer 63 may be smaller than the thickness of the second diffusion layer 51. The thickness may be 0.3 mm or more, for example, in the range of 0.3 mm to 0.7 mm. The thickness of the resin layer 63 is 0.1 mm or more, for example, in the range of 0.1 mm to 0.5 mm. can be formed.

[0188] At least one or both of the second diffusion layer 51 and the second resin layer 63 are pre-formed. The side surfaces of the first resin layer can be covered.

[0189] The phosphor is at least one of red, green, blue, amber, and yellow phosphors. The ink particles may contain a color of the phosphor or a wavelength of the phosphor. It can have the same color as the converted color.

[0190] FIG. 18 is a fourth modification of the lighting module according to the second embodiment, which is a modification of FIG. 17. do.

[0191] Referring to FIG. 18, the lighting module includes a substrate 11, a light emitting element 21, a first resin layer 31, and a light emitting device 22. , the first diffusion layer 41 and the second resin layer 64. A second resin layer 64 may be disposed on the side surface. The side surface portion 64a of the second resin layer 64 may be The side surface 64a of the second resin layer 64 may be adhered to the surface of the substrate 11. The side surface of the diffusion layer 41 and the side surface of the first resin layer 31 can be in contact with each other. Therefore, the second resin layer 64 can improve the color difference of the surface color in the lateral direction. The first diffusion layer 41 may include a phosphor or may contain a phosphor and a diffusion agent. The second resin layer 64 may include phosphor and ink particles.

[0192] FIG. 19 is a modification of FIG. 17, and is a fifth modification of the lighting module according to the second embodiment. do.

[0193] Referring to FIG. 19, the lighting module includes a substrate 11, a light emitting element 21, a first resin layer 31, and a light emitting device 22. , a second diffusion layer 56 and a second resin layer 66. A second resin layer 66 may be disposed on the side surface. The side surface portion 66a of the second resin layer 66 may be The second resin layer 66 may be adhered to the upper surface of the substrate 11. The side surface 66a of the second resin layer 66 may be adhered to the upper surface of the substrate 11. The second resin layer 31 can contact the side of the diffusion layer 56 and the side of the first resin layer 31. The diffusion layer 56 may be doped with a phosphor or may be doped with a phosphor and a diffusion agent. Layer 66 can contain ink particles without phosphor. Layer 66 can improve the lateral color difference of the surface color.

[0194] FIG. 20 is a modification of FIG. 17, and is a sixth modification of the lighting module according to the second embodiment. do.

[0195] Referring to FIG. 20, the lighting module includes a substrate 11, a light-emitting element 21, a first resin layer 47, and a light-emitting element 21a. , a first diffusion layer 52 and a second resin layer 63. A first diffusion layer 52 may be disposed on the side surface. A side surface portion 52a of the first diffusion layer 52 may be The first diffusion layer 52 may be adhered to the upper surface of the substrate 11. The side surface 52a of the first diffusion layer 52 may be adhered to the upper surface of the substrate 11. The first resin layer 47 may be doped with a diffusing agent or may be in contact with the side of the first resin layer 47. The first diffusion layer 52 may be made of a transparent material without a diffusing agent. The second resin layer 63 may contain ink particles without phosphor. The side surface portion 52a of the layer 52 covers the side surface of the first resin layer 47. The side surface 52a of the first diffusion layer 52 may be exposed to the side of the lighting module. The side surface 52a of the first diffusion layer 52 and the surface color of the second resin layer 63 are different from each other. The surface color of the second resin layer 63 is the same as the color of the side surface portion 52a of the first diffusion layer 52. It can have a richer color than the previous one.

[0196] Referring to Figures 17 and 20, the resin layers 63, 64, 66 disclosed above The content of added ink particles is 12 wt% or less, or in the range of 4 wt% to 12 wt%. Accordingly, the surface color of the resin layers 63, 64, and 66 is The ink particles can be prevented from forming hot spots by blocking light. The color of the light may be the same as the color of the light wavelength-converted by the phosphor. The color of the ink particles may be the same as the color of the phosphor.

[0197] The thickness of the diffusion layers 51, 41, 52 is 0.3 mm or more, for example, 0.3 mm to 0. The diffusion layers 51, 41, and 52 may be formed in a range of 7 mm. Amounts may be added in excess of 10 wt% or in the range of 10 wt% to 23 wt%.

[0198] 21 to 24 show seventh to tenth modified examples of the second embodiment, in which the first resin layer It has a structure with two or more layers stacked on top.

[0199] Referring to FIG. 21, the lighting module includes a substrate 11, a light emitting element 21, a first resin layer 31, and a light emitting device 22. , the first diffusion layer 41, the second diffusion layer 56, and the second resin layer 63. The structure of the second resin layer 63 is the same as that described above, and the first and second diffusion layers 41 and 56 For the configuration, please refer to the description of the first embodiment.

[0200] For example, a diffusing agent is added to the first diffusing layer 41, and a phosphor is added to the second diffusing layer 56. The second resin layer 63 may be doped with ink particles as disclosed above. The side surface portion 63a of the second resin layer 63 is in contact with the side surfaces of the first and second diffusion layers 41 and 56. The side surface of the first resin layer 31 is covered. contacts the side surfaces of the first and second diffusion layers 41 and 56 and the side surface of the first resin layer 31. The upper surface of the substrate 11 can be contacted with the electrode.

[0201] Referring to FIG. 22, the lighting module includes a substrate 11, a light-emitting element 21, a first resin layer 47, and a light-emitting element 21a. , the first diffusion layer 52 and the second resin layer 63. The structure is the same as that described above, and the structure of the first diffusion layer 52 is the same as that described in the first and second embodiments. I will refer to Ming.

[0202] For example, the first diffusion layer 52 may be doped with a phosphor or a phosphor and a diffusing agent. When the first diffusion layer 52 contains a diffusing agent, the second resin layer 63 contains a phosphor and an insulator. The second resin layer 63 is formed by adding phosphor to the first diffusion layer 52. If so, the ink particles may be included without phosphor.

[0203] The side portion 52a of the first diffusion layer 52 may be disposed on the side of the second resin layer 63. The side surface 63a of the second resin layer 63 is located outside the side surface 52a of the first diffusion layer 52. The side surface 63a of the second resin layer 63 may be disposed on the side surface 52 of the first diffusion layer 52. 2a and the side surface of the first resin layer 47. The side surface 63a of the second resin layer 63 and the second resin layer 52a are in contact with the upper surface of the substrate 11. can.

[0204] Referring to FIG. 23, the lighting module includes a substrate 11, a light emitting element 21, a first resin layer 31, and a light emitting device 22. , the first diffusion layer 41, the second diffusion layer 57, and the second resin layer 63. The structure of the second resin layer 63 is the same as that described above, and the first and second diffusion layers 41 and 57 For the configuration, please refer to the description of the first embodiment.

[0205] For example, a diffusing agent is added to the first diffusing layer 41, and a phosphor is added to the second diffusing layer 57. The second resin layer 63 may be doped with ink particles as disclosed above.

[0206] The side portion 57a ​​of the second diffusion layer 57 may be disposed on the side of the first resin layer 47. The side surface 63a of the second resin layer 63 is located outside the side surface 57a of the second diffusion layer 57. The side surface 63a of the second resin layer 63 may be disposed on the side surface 57 of the second diffusion layer 57. 7a and the side surface of the first resin layer 31. The side surface 63a of the second resin layer 63 and the second resin layer 57a are in contact with the upper surface of the substrate 11. can.

[0207] Referring to FIG. 24, the lighting module includes a substrate 11, a light emitting element 21, a first resin layer 31, and a light emitting device 22. , the first diffusion layer 41, the second diffusion layer 56, and the second resin layer 63. The structure of the second resin layer 63 is the same as that described above, and the first and second diffusion layers 41 and 56 For the configuration, please refer to the description of the first embodiment.

[0208] For example, a diffusing agent is added to the first diffusing layer 41, and a phosphor is added to the second diffusing layer 56. The second resin layer 63 may be doped with ink particles as disclosed above.

[0209] The side portion 41a of the first diffusion layer 41 may be disposed on the side of the first resin layer 31. The side surface portion 56a of the second diffusion layer 56 is disposed outside the side surface portion 41a of the first diffusion layer 41. The side surface 63a of the second resin layer 63 may be located at the side surface 56a of the second diffusion layer 56. The side surface portion 56a of the second diffusion layer 56 may be disposed outside the first diffusion layer 41. The first expansion layer 41 may be disposed between the side surface 41a and the side surface 63a of the second resin layer 63. The side surface 41 a of the diffusion layer 41, the side surface 56 a of the second diffusion layer 56 and the second resin layer 63 The side surface portion 63 a can come into contact with the upper surface of the substrate 11 .

[0210] FIG. 25 shows an eleventh modification of the lighting module according to the second embodiment.

[0211] Referring to FIG. 25, the lighting module includes a substrate 11, a light emitting element disposed on the substrate 11, and a light emitting element. A first resin layer 31 is formed on the element 21 and the substrate 11, and an adhesive layer is formed on the first resin layer 31. 45 and a light-shielding portion 46, a first diffusion layer 52 on the adhesive layer 45 and the light-shielding portion 46, and A second resin layer 63 may be included on the first diffusion layer 52. For the configuration of the second resin layer 63, please refer to the description of the second embodiment disclosed above.

[0212] The adhesive layer 45 may be bonded between the first resin layer 31 and the first diffusion layer 52. The adhesive layer 45 may be made of the same material as the first resin layer 31 and the first diffusion layer 52, or may be made of a different material. The adhesive layer 45 may be made of a resin material such as silicone or epoxy. The adhesive layer 45 may be disposed around the light-shielding portion 46 or on the lower surface of the light-shielding portion 46. The light-shielding portion 46 is formed on the lower surface of the first diffusion layer 41 so as to extend from the light-emitting element 2 to the lower surface of the first diffusion layer 41. The light-shielding portion 46 may be disposed in a region corresponding to the light-emitting element 21. The area may be 50% or more of the upper surface area of ​​the element 21, for example, in the range of 50% to 120%. The light-shielding portion 46 may be formed through an area printed with a white material. For example, any of TiO2, Al2O3, CaCO3, BaSO4, and Silicon The light-shielding portion 46 can be printed using reflective ink including one of the light-emitting The light emitted through the light emitting surface of the element 21 is reflected, and the luminous intensity of the light is increased on the light emitting element 21. The light-shielding portion 46 is made of a light-shielding ink. The light-shielding portion 46 is formed under the first diffusion layer 52. The light blocking portion 46 does not block 100% of the incident light. In some cases, transmittance is lower than reflectance, so it can block and diffuse light. The light-shielding portion 46 may be formed in one layer or multiple layers, and may have the same pattern shape or different patterns. The pattern shape may be any of the following.

[0213] The second resin layer 63 may include the side portion 63a disclosed above, and the first resin layer 31 The side surface of the first diffusion layer 52 can be covered with the side surface portion 63a. may be formed by extending the first diffusion layer 52. Although the side surface portion 63a has been described as being in contact with the upper surface of the substrate 11, the first resin layer The upper surface of either the first diffusion layer 31 or the first diffusion layer 52 may be in contact with the upper surface of the other layer. The side surface 63a of the second resin layer 63 is in contact with the first resin layer 31 and the first diffusion layer 52. At least one of the surfaces can be in contact with the upper surface of the substrate 11. The outer periphery of the first resin layer 31 and the first diffusion layer 52 has a concave-convex pattern or a stepped structure. It can be provided in

[0214] Referring to FIG. 26, the lighting module of FIGS. 15 and 16 according to an embodiment of the invention The light emitting element 21, for example, the LED, is turned on or off. 1 The surface color of the diffusion layer or second resin layer (Color1) and the maximum value when the LED is on. Reduces the color difference of the surface color (Color2) of the upper layer, the first diffusion layer or the second resin layer. It is possible.

[0215] The lighting module of the embodiment has a first resin layer and / or a first diffusion layer on a substrate 11. A second resin layer can be disposed. An embodiment has multiple resin layers on the substrate 11. A soft lighting module can be provided. In an embodiment, the lighting module includes a first resin layer. The light is guided in a radial direction or a linear direction within the first diffusion layer 41 so as to be spread. The wavelength is converted by the fluorescent material, and the color difference of the surface color is improved through the ink particles in the second resin layer. Accordingly, the light finally emitted through the lighting module can be The light emitting elements 21 in the lighting module 100 emit light to the light source. The light emitting element 21 emits light from five sides on a flexible substrate in a lip type. The light emitted through the light emitting element 21 can be emitted in the upper and side directions. The electrode can face the substrate 11 .

[0216] The light emitted from the light emitting element 21 is incident on the top surface and all side surfaces of the lighting module. The lighting module can emit light in various directions. It can be applied to display devices having D (Micro LED) or various lighting devices.

[0217] The lighting module provides a surface light source, and an additional inner lens (In The inner lens can be removed, and the first resin layer 31 seals the light emitting device 21. By doing so, an air gap or a structure for inserting the light emitting element 21 can be formed above the light emitting element 21. The artifacts can be removed.

[0218] The lighting module 100 may have a flat plate shape when viewed from the side, or The can be provided with a convex curved shape or a concave curved shape, or a convex / concave shape. When viewed from above, the lighting module has a striped bar shape, a polygonal shape, and Shapes that are round, circular, oval, or have convex or concave sides It could be.

[0219] FIG. 32 is a diagram showing an example of a light emitting element of a lighting module according to an embodiment.

[0220] Referring to FIG. 32, the light emitting device includes a light emitting structure 225 and a plurality of electrodes 245, 247. The light emitting structure 225 includes a compound semiconductor layer of group II to group VI elements, for example, Formed from a compound semiconductor layer of III-V group elements or a compound semiconductor layer of II-VI group elements The plurality of electrodes 245 and 247 may be selectively applied to the semiconductor layer of the light emitting structure 225. and supplies power.

[0221] The light emitting device may include a light-transmitting substrate 221. The light-transmitting substrate 221 may include a front The light-transmitting substrate 221 is disposed on the light-emitting structure 225. The light-transmitting substrate 221 is, for example, a light-transmitting insulating substrate. The transparent substrate 221 may be, for example, a sapphire ( AL2O3), SiC, Si, GaAs, GaN, ZnO, Si, GaP, InP, Ge At least one of the following can be used: At least one or all of the top surface and bottom surface have a plurality of protrusions (not shown). The vertical cross-sectional shape of each convex portion can be a hemispherical shape, a semi-elliptical shape, or the like. The light-transmitting group may have at least one of a circular shape and a polygonal shape. The plate 221 may be removed, but is not limited to this.

[0222] A buffer layer (not shown) is provided between the transparent substrate 221 and the light emitting structure 225. and a low conductivity semiconductor layer (not shown). The buffer layer is a layer for reducing the difference in lattice constant between the transparent substrate 221 and the semiconductor layer. The buffer layer can be formed selectively from a group II to group VI compound semiconductor. An undoped III-V compound semiconductor layer is further formed below the first layer. This may include, but is not limited to:

[0223] The light emitting structure 225 may be disposed under the light-transmitting substrate 221, and may be a first conductive type semiconductor. The layer 222, the active layer 223, and the second conductive type semiconductor layer 224 are included. 3, 224 may further include another semiconductor layer disposed above and / or below the semiconductor layer; This is not limited to this.

[0224] The first conductive type semiconductor layer 222 is disposed under a light-transmitting substrate 221 and is a first conductive type semiconductor layer. The first conductive layer may be realized by a doped semiconductor, for example, an n-type semiconductor layer. The In type semiconductor layer 222 is x Al y GA 1-x-y N(0≦x≦1, 0≦y≦1, 0≦x +y≦1). The first conductive type semiconductor layer 222 is a compound of III-V elements. Compound semiconductors, such as GaN, AlN, AlGaN, InGaN, InN, and InAlGaN , AlInN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP The first conductive type dopant may be selected from the group consisting of Si, Ge, and S as an n-type dopant. The active layer 223 includes a dopant such as n, Se, Te, etc. The active layer 223 is a first conductive type semiconductor. The layer 222 may be disposed below a single proton well, a multiple proton well (MQW), or a quanta Selectively includes a um wire structure or a quantum dot structure, The well layer / barrier layer period may be, for example, InGaN / GaN , GaN / AlGaN, AlGaN / AlGaN, InGaN / AlGaN, InGaN / InGaN, AlGaAs / GaA, InGaAs / GaAs, InGaP / GaP, It contains at least one of the pairs AlInGaP / InGaP and InP / GaAs. The second conductive type semiconductor layer 224 is disposed below the active layer 223. The conductor layer 224 is a semiconductor doped with a second conductivity type dopant, for example, In. x Al y GA 1-x-y N(0≦x≦1, 0≦y≦1, 0≦x+y≦1). The second conductive type semiconductor layer 224 is made of GaN, InN, AlN, InGaN, AlGaN, In AlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, AlGaIn The second conductive type semiconductor may be made of at least one of a compound semiconductor such as P. The conductor layer 224 is a p-type semiconductor layer, and the first conductive type dopant is a p-type dopant. The alloy may contain Mg, Zn, Ca, Sr, and Ba.

[0225] In another example, the light emitting structure 225 may be formed such that the first conductive type semiconductor layer 222 is a p-type semiconductor. The second conductive type semiconductor layer 224 may be an n-type semiconductor layer. A third conductive type semiconductor layer having a polarity opposite to that of the second conductive type semiconductor layer 224 is formed under the second conductive type semiconductor layer 224. In addition, the light emitting structure 225 may have an np junction structure, a pn It is realized by one of the following structures: junction structure, npn junction structure, and pnp junction structure. It is possible.

[0226] First and second electrodes 245 and 247 are disposed under the light emitting structure 225. The first electrode 245 is electrically connected to the first conductive type semiconductor layer 222, and the second electrode 247 is electrically connected to the second conductive type semiconductor layer 224. The light emitting structure 225 may have a polygonal or circular bottom shape. may include a plurality of recesses 226.

[0227] The light emitting element includes first and second electrode layers 241 and 242, a third electrode layer 243, an insulating layer 2 Each of the first and second electrode layers 241 and 242 may be a single layer or The first and second electrode layers may be formed in multiple layers and may function as a current spreading layer. 241, 242 are a first electrode layer 241 disposed under the light-emitting structure 225; and The first electrode layer 241 may include a second electrode layer 242 disposed below the first electrode layer 241. The first electrode layer 241 serves to diffuse current, and the second electrode layer 242 serves to reflect incident light. It becomes possible.

[0228] The first and second electrode layers 241 and 242 may be formed of different materials. The first electrode layer 241 may be formed of a light-transmitting material, for example, a metal oxide or a metal nitride. The first electrode layer 241 may be formed of, for example, ITO (indium tin oxide). de), ITON (ITO nitride), IZO (indium zinc ox ide), IZON (IZO nitride), IZTO (indium zinc tin oxide), IAZO(indium aluminum zinc oxide) de), IGZO (indium gallium zinc oxide), IGTO (indium gallium tin oxide), AZO(aluminum zinc oxide), ATO(antimony tin oxide), GZO( The second electrode may be formed selectively from a material selected from the group consisting of gallium zinc oxide and gallium zinc oxide. The polar layer 242 is in contact with the lower surface of the first electrode layer 241 and can function as a reflective electrode layer. The second electrode layer 242 may include a metal, such as Ag, Au, or Al. The second electrode layer 242 is formed to cover the light emitting structure when a portion of the first electrode layer 241 is removed. The underside of 225 can be partially contacted.

[0229] In another example, the structure of the first and second electrode layers 241 and 242 may be omnidirectionally reflective (OD R: Omni Directional Reflector layer) structure The omnidirectional reflecting structure may be formed by a first electrode layer 241 having a low refractive index and a second electrode layer 242 having a low refractive index. It is formed by a laminated structure of a second electrode layer 242 made of a highly reflective metal material in contact with the electrode layer 241. The electrode layers 241 and 242 may be formed, for example, with a laminated structure of ITO / Ag. The interface between the first electrode layer 241 and the second electrode layer 242 has an omnidirectional reflection angle. It can be improved.

[0230] Alternatively, the second electrode layer 242 may be removed and replaced with a reflective layer of another material. The reflective layer is a distributed Bragg reflector. The distributed Bragg reflection structures may be formed of different structures. The dielectric layer has two alternating dielectric layers with different refractive indices, e.g., a SiO2 layer, a S Any one of an i3N4 layer, a TiO2 layer, an AL2O3 layer, and an MgO layer that is different from each other In another example, the electrode layers 241 and 242 may each include a dispersed type It can include both Bragg reflection structures and omnidirectional reflection structures, in which case it is 98% or more The flip-type light-emitting element can provide a light-emitting element having a light reflectance of 1000 .mu.m or less. The optical element is configured so that light reflected from the second electrode layer 242 is emitted through the substrate 221. Therefore, most of the light can be emitted vertically upward. The reflected light is reflected to the light emitting area by the reflecting member via the adhesive member according to the embodiment. can.

[0231] The third electrode layer 243 is disposed below the second electrode layer 242 and is connected to the first and second The third electrode layer 243 is electrically insulated from the electrode layers 241 and 242. The third electrode layer 243 is made of a metal, for example, Titanium (Ti), Copper (Cu), Nickel (Ni), Gold (Au), Chromium (Cr), Tungsten At least one of thallium (Ta), platinum (Pt), tin (Sn), silver (Ag), and phosphorus (P) A first electrode 245 and a second electrode 247 are disposed under the third electrode layer 243. It will be placed.

[0232] The insulating layers 231 and 233 are connected to the first and second electrode layers 241 and 242 and the third electrode layer 24 3. The first and second electrodes 245, 247 prevent unwanted contact between layers of the light-emitting structure 225. The insulating layers 231 and 233 are first and second insulating layers 231 and 233. The first insulating layer 231 is disposed between the third electrode layer 243 and the second electrode layer 242. The second insulating layer 233 is disposed between the third electrode layer 243 and the first and second electrodes 245 and 246. It is placed between 7.

[0233] The third electrode layer 243 is connected to the first conductive type semiconductor layer 222. The connecting portion 244 of the layer 243 connects the first and second electrode layers 241 and 242 and the light emitting structure 225 The connecting portion 2 protrudes through the lower portion of the first conductive type semiconductor layer 222 in a via structure and contacts the first conductive type semiconductor layer 222. The connecting portion 244 of the third electrode layer 243 may be arranged in plural. A portion 232 of the insulating layer 231 extends along the recess 226 of the light-emitting structure 225, and the third electrode layer 243, the first and second electrode layers 241, 242, the second conductive type semiconductor layer 224 and the active layer The light emitting structure 225 is provided with a side protection film on the side thereof. For this purpose, an insulating layer may be disposed, but is not limited to this.

[0234] The second electrode 247 is disposed under the second insulating layer 233. At least one of the first and second electrode layers 241 and 242 is connected through the open region. The first electrode 245 is disposed under the second insulating layer 233. , and is connected to the third electrode layer 243 through the open region of the second insulating layer 233. As a result, the protrusion 248 of the second electrode 247 is The protrusion 246 of the first electrode 245 is electrically connected to the second conductive type semiconductor layer 224. The light emitting device is electrically connected to the first conductive type semiconductor layer 222 through the electrode layer 243. The bottom electrodes 245, 247 may face the substrate.

[0235] FIG. 39 is a plan view of a vehicle to which a vehicle lamp to which a lighting module according to an embodiment is applied is applied. FIG. 40 is a side view of a vehicle having a lighting module or lighting device according to the disclosed embodiment. FIG.

[0236] 39 and 40, in a vehicle 900, a rear tail lamp 800 includes a first lamp. unit 812, a second lamp unit 814, a third lamp unit 816, and a housing The first lamp unit 812 may include a turn signal lamp. The second lamp unit 814 may be a light source for the role of a sidelight. The third lamp unit 816 may be a light source for the role of a stop lamp, Of the first to third lamp units 812, 814, and 816, At least one or all of the lighting modules disclosed in the embodiments may be included. The housing 810 accommodates first to third lamp units 812, 814, and 816. In this case, the housing 810 is made of a transparent material. The first to third lamp units 812, 814 may have a bend depending on the design. , 816 can realize a surface light source that may have a curved surface depending on the shape of the housing 810. Such a vehicle lamp can be used as a tail lamp, a stop lamp, or the like. If applied to lamps or turn signal lamps, apply to the vehicle's turn signal lamps It can be done.

[0237] According to the embodiment of the invention, the lighting module can improve the light uniformity of the surface light source. .

[0238] According to an embodiment of the present invention, the lighting module guides and diffuses the light, and the light is emitted as a surface light source. The uniformity can be improved.

[0239] According to an embodiment of the invention, the light diffused by the lighting module can be wavelength converted by the phosphor. This can improve the uniformity of the wavelength-converted light.

[0240] According to an embodiment of the invention, hot spots on each light emitting element in the lighting module are This can reduce the number of spots.

[0241] According to an embodiment of the invention, a colored phosphor film is provided on the lighting module, and when lit, the fluorescent light It has the effect of realizing images in the color of the light film.

[0242] According to an embodiment of the present invention, a flexible sheet is formed by laminating a plurality of diffusion layers made of resin material. This makes it possible to realize a versatile lighting module.

[0243] Embodiments of the invention can improve the light efficiency and photometric properties of lighting modules.

[0244] The embodiment of the invention is to reduce the chromaticity difference between the appearance image and the luminous image of the resin layer of the lighting module. It can be reduced.

[0245] An embodiment of the invention has a top layer of the lighting module with the same color as the phosphor's emission color. By arranging the ink particles, the amount of phosphor can be reduced.

[0246] Embodiments of the invention can improve the unlit color of a lighting module.

[0247] Improved optical reliability of lighting modules and lighting devices having the same according to embodiments of the invention It can be improved.

[0248] Improving the reliability of vehicle lighting devices having lighting modules according to embodiments of the invention can be done.

[0249] The embodiments of the invention include a backlight unit having a lighting module, various display devices, and a surface light. It can be applied to a light source lighting device or a vehicle lamp.

[0250] The features, structures, effects, etc. described in the above embodiments may be applied to at least one embodiment of the present invention. The present invention is not limited to only one embodiment. The features, structures, effects, etc. illustrated in the examples are understood by those skilled in the art to which the examples pertain. Therefore, it can be combined with or modified into other embodiments. All such combinations and modifications are to be construed as falling within the scope of the present invention. do.

[0251] Although the above description has been centered on the examples, these are merely examples and do not limit the present invention. The present invention is not intended to be limited to the above, and a person having ordinary skill in the art to which the present invention pertains would be able to understand the essential features of the present invention. It is understood that various modifications and applications not exemplified above are possible within the scope of the characteristics. For example, each component specifically shown in the embodiment of the present invention may be modified. The differences relating to such modifications and applications are set forth in the accompanying drawings. and the like, which are to be construed as being within the scope of the present invention as defined in the appended claims.

Claims

1. A substrate; a plurality of light-emitting elements disposed on the substrate, the light-emitting elements emitting blue light; a first resin layer disposed on the substrate and sealing the plurality of light-emitting elements; a first diffusion layer disposed on the first resin layer and including a phosphor and a diffusing agent; a second resin layer disposed on the first diffusion layer and having ink particles; Including, the first resin layer contains a UV resin and is disposed on top surfaces and side surfaces of the plurality of light-emitting elements; The content of the phosphor added to the first diffusion layer is in the range of 10 wt % to 23 wt % in the resin material of the first diffusion layer, and the content of the diffusing agent is less than 3 wt % in the resin material of the first diffusion layer, the color of the ink particles corresponds to the color of the light wavelength-converted from the phosphor of the first diffusion layer; the ink particles in the second resin layer block incident light; The lighting module, wherein the first diffusing layer is not in contact with the substrate.

2. the spacing between the plurality of light-emitting elements is equal to or greater than the thickness of the first resin layer; the thickness of the first resin layer is greater than the thickness of the substrate; The lighting module according to claim 1 , wherein the thickness of the first resin layer is a height from a lower surface of the first resin layer to an upper surface of the first resin layer.

3. the thickness of the first resin layer is greater than the thickness of the first diffusion layer; The lighting module according to claim 2 , wherein the thickness of the first diffusion layer is a height from a lower surface of the first diffusion layer to an upper surface of the first diffusion layer disposed on an upper surface of the first resin layer.

4. The lighting module of claim 3 , wherein the light uniformity of the light emitted to the outside through the first diffusion layer is 90% or more.

5. The lighting module of claim 3 , wherein the first diffusing layer emits red light.

6. the first resin layer and the first diffusion layer are formed of the same resin material, The lighting module according to claim 5 , wherein the first resin layer is provided as a layer that does not contain a diffusing agent.

7. the first diffusion layer includes an upper portion covering an upper surface of the first resin layer, and a side portion extending from the upper portion toward the substrate and covering a side surface of the first resin layer, The lighting module of claim 6, wherein the second resin layer includes an upper portion covering an upper surface of the first diffusion layer, and a side portion extending from the upper portion of the second resin layer toward the substrate and covering a side surface of the first diffusion layer.

8. the thickness of the first resin layer is 2.7 mm or less; each of the plurality of light-emitting elements emits a wavelength in the range of 420 nm to 470 nm; a linear distance between the lower surface of the substrate and the upper surface of the first diffusion layer is 220% or less of a thickness of the first resin layer; 8. The lighting module according to claim 3, wherein the thickness of the first diffusion layer is 40% to 80% of the thickness of the first resin layer.

9. Each of the plurality of light-emitting elements a light-transmitting substrate; a light emitting structure disposed under the transparent substrate, the light emitting structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a first electrode connected to the first conductive type semiconductor layer and disposed under the light emitting structure; a second electrode connected to the second conductive type semiconductor layer and disposed under the light emitting structure; Including, The lighting module of claim 1 , wherein the first electrode and the second electrode are electrically connected to the substrate in a flip-chip manner.

10. 8. The lighting module according to claim 1, wherein the diffusing agent has a refractive index in the range of 1.4 to 2.

11. the thickness of the first resin layer is 2.7 mm or less; 8. A lighting module according to any one of claims 3 to 7, characterized in that the lighting module is provided with a thickness of 5.5 mm or less.

12. the first diffusion layer includes ink particles; 8. The lighting module according to claim 1, wherein the phosphor in the first diffusing layer emits red light and the ink particles in the first diffusing layer have a red color.

13. The lighting module according to claim 12 , wherein one side portion of the first diffusing layer has phosphor and ink particles in the first diffusing layer and is in contact with the substrate.

14. a plurality of light-shielding portions disposed between the first resin layer and the first diffusion layer and vertically overlapping with each of the plurality of light-emitting elements; the total area of ​​each of the plurality of light-shielding portions is in the range of 50% to 120% of the total upper surface area of ​​each of the light-emitting elements; The lighting module according to claim 1 , wherein the plurality of light-blocking portions are not in contact with the substrate.

15. The lighting module according to claim 1 , wherein the content of the ink particles contained in the second resin layer is 12 wt % or less in the resin material of the second resin layer.

16. A substrate; a plurality of light-emitting elements disposed on the substrate and emitting wavelengths in the range of 420 nm to 470 nm; a first resin layer disposed on the substrate and the plurality of light-emitting elements; a first diffusion layer disposed on the first resin layer and including a phosphor and ink particles; Including, a content of the phosphor contained in the first diffusion layer in a range of 10 wt % to 23 wt % in a resin material of the first diffusion layer, and a content of the ink particles contained in the first diffusion layer is less than 3 wt % less than the content of the phosphor in the first diffusion layer; a lighting module having a layer from the lower surface of the substrate to the top layer, the lighting module having a thickness of 5.5 mm or less and emitting red light; the ink particles include at least one of a metallic ink, an ultraviolet (UV) ink, or a curable ink; the color of the ink particles corresponds to the color of the light wavelength-converted by the phosphor; the ink particles in the first diffusion layer block incident light; the first diffusion layer includes an upper portion covering an upper surface of the first resin layer, and a side portion extending from the upper portion toward the substrate and covering a side surface of the first resin layer, an upper portion and a side portion of the first diffusion layer include the phosphor and ink particles; The lighting module, wherein the first diffusing layer is not in contact with the substrate.

17. a second resin layer disposed on the first diffusion layer and having ink particles; The content of the ink particles contained in the second resin layer is 12 wt % or less in the resin material of the second resin layer, the phosphor in the first diffusion layer and the ink particles in the first diffusion layer and the second resin layer have a red color; The lighting module according to claim 16, wherein the second resin layer has a thickness thinner than that of the first diffusion layer.

18. The plurality of light emitting elements are arranged in N columns and M rows, where N and M are integers of 2 or more; The lighting module according to claim 16 or 17, wherein each of the plurality of light emitting elements includes a first electrode and a second electrode electrically connected to the substrate and facing an upper surface of the substrate.

19. the spacing between the plurality of light-emitting elements is equal to or greater than the thickness of the first resin layer; the thickness of the first resin layer is 5 times or more the thickness of the substrate; the thickness of the first resin layer is greater than the thickness of the first diffusion layer; 19. The lighting module according to claim 18, wherein the first resin layer has a thickness of 2 mm to 2.7 mm.

20. the second resin layer includes an upper portion covering an upper surface of the first diffusion layer, and a side portion extending from the upper portion toward the substrate and covering a side surface of the first diffusion layer, The lighting module of claim 17, wherein the upper and side portions of the second resin layer contain red ink particles having a red color.

Images