Battery pack

Abstract

To provide a battery pack.SOLUTION: A battery pack includes: battery cells; and sensing units for acquiring state information of the battery cells. The sensing units include: sensing substrates extending in a first direction and having a first position at which sensing devices are positioned; and sensing terminals connected to the sensing substrates at a second position different from the first position and connected to the battery cells to acquire the state information. The sensing substrates and the sensing terminals (i) overlap each other at the first and second positions and (ii) extend to cross each other so that upper and lower positions are reversed in the second direction in which they overlap each other at the first and second positions. With this, there is provided the battery pack in which the sensing substrates formed as one surface circuit substrates are applied, and in which lamination of the sensing devices and sensing terminals can be formed on the upper and lower surfaces of the sensing substrates via the sensing substrates and sensing terminals extending to cross each other while forming the sensing units for collecting the state information of the battery cells.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a battery pack. [Background technology]

[0002] Generally, secondary batteries are batteries that can be charged and discharged, unlike primary batteries that cannot be charged. Secondary batteries are used as energy sources for mobile devices, electric vehicles, hybrid vehicles, electric bicycles, uninterruptible power supplies, etc. Depending on the type of external device to which they are applied, they are used in the form of a single battery or in the form of a module in which multiple batteries are connected together to form a single unit.

[0003] Small mobile devices such as mobile phones can operate for a certain period of time with the output and capacity of a single battery, but when long-term operation and high-power operation are required, such as in electric vehicles and hybrid vehicles that consume a lot of power, a modular configuration containing multiple batteries is preferred due to issues of output and capacity, and the output voltage and output current can be increased depending on the number of built-in batteries. Summary of the Invention [Problem to be solved by the invention]

[0004] The problem to be solved by the present invention is to provide a battery pack that uses a sensing substrate formed as a one-sided circuit board to form a sensing unit for collecting status information of a battery cell, and that can form a stack of sensing elements and sensing terminals on the upper and lower surfaces of the sensing substrate via the sensing substrate and sensing terminals that extend crosswise relative to each other. [Means for solving the problem]

[0005] In order to solve the above problems and other problems, a battery pack of the present invention includes: a battery cell; a sensing unit for obtaining status information of the battery cell, the sensing unit including a sensing substrate extending side by side along a first direction and including a first position where a sensing element is formed; and a sensing terminal connected to the sensing substrate at a second position different from the first position and connected to a side of the battery cell to acquire the status information, wherein the sensing substrate and the sensing terminal i) overlap each other at the first and second positions, and ii) extend crossing each other so that their up-down positions are reversed along the second direction overlapping each other at the first and second positions.

[0006] For example, in the first position, the sensing substrate and the sensing terminal on which the sensing element is formed may be disposed at an upper position opposite the battery cell and a lower position facing the battery cell, respectively, and in the second position, the sensing substrate and the sensing terminal may be disposed at a lower position facing the battery cell and an upper position facing the battery cell, respectively.

[0007] For example, the sensing element may be formed on the upper surface of the sensing substrate opposite the battery cell.

[0008] For example, at least one of the sensing substrate and the sensing terminal may include a deformation portion for connecting the upper and lower positions that are inverted to each other at the first and second positions.

[0009] For example, the deformation portion may connect the upper and lower positions that are inverted to each other at the first and second positions with a step or at an incline.

[0010] For example, the sensing board may include a deformation portion that intersects with the sensing terminal and connects between a position above the sensing terminal in the first position and a position below the sensing terminal in the second position.

[0011] For example, the sensing terminal may include a deformed portion that crosses the sensing substrate and connects between a position below the sensing substrate at the first position and a position above the sensing substrate at the second position.

[0012] For example, a through hole through which the sensing terminal penetrates may be formed at a third position between the first and second positions of the sensing substrate along the first direction such that the sensing substrate and the sensing terminal intersect with each other.

[0013] For example, the deformation portion may be formed within the through hole.

[0014] For example, along a third direction intersecting the first and second directions, the periphery of the through hole of the sensing substrate extending along the first direction to surround the through hole at a position outside the through hole of the sensing substrate, and the through portion of the sensing terminal penetrating the through hole may intersect with each other.

[0015] For example, at least one of the periphery of the through hole and the through portion may extend obliquely to connect between upper and lower positions that are inverted at the first and second positions, and may intersect with each other.

[0016] For example, the through-hole periphery and the through-hole portion may extend obliquely in opposite directions to each other and cross each other so as to connect between upper and lower positions that are inverted in the first and second positions.

[0017] For example, the sensing substrate and the sensing terminals may be bonded to each other by thermocompression or laminating.

[0018] For example, along the first direction, the sensing substrate extends from the first position to a second position, and the sensing terminal extends from the first position to a fourth position offset from the second position.

[0019] For example, the sensing terminal may be connected to a side of the battery cell at a fourth position spaced apart from the sensing substrate along the first direction.

[0020] For example, the sensing terminal may be connected to a terminal surface of a battery cell on which an electrode is formed.

[0021] For example, a weld may be formed between the sensing terminal and a terminal surface of the battery cell.

[0022] For example, a metal layer including a first bonding pad for connection to the sensing element may be formed at a first location on the sensing substrate.

[0023] For example, a first adhesive member for coupling with the sensing terminal may be interposed at a first position of the sensing substrate.

[0024] For example, in the first position, a metal layer including the first bonding pad may be formed on an upper surface of the sensing substrate opposite the battery cell, and the first adhesive member may be formed on a lower surface of the sensing substrate facing the battery cell.

[0025] For example, a metal layer including second bonding pads for coupling to the sensing terminals may be formed at a second location on the sensing substrate.

[0026] For example, a second adhesive member for coupling with the sensing terminal may be interposed at a second position of the sensing substrate.

[0027] For example, metal layers including first and second bond pads for connection to the sensing element and the sensing terminal, respectively, may be formed at first and second positions of the sensing substrate, and the metal layers including the first and second bond pads may be formed together on the upper surface of the sensing substrate opposite the battery cell.

[0028] For example, the sensing substrate may be formed as a one-sided circuit board that does not include the metal layer on a lower surface facing the battery cell. [Effects of the Invention]

[0029] According to the present invention, a single-sided circuit board, which has a relatively low manufacturing cost, is used to form a sensing unit for collecting status information of a battery cell, and the sensing element and the sensing terminal may be stacked or coupled on opposite upper and lower surfaces of the sensing substrate provided as a single-sided circuit board via the sensing substrate and the sensing terminal extending crosswise relative to each other. By stacking the sensing element and the sensing terminal on opposite upper and lower surfaces of the sensing substrate in this manner, soldering of the sensing element and the sensing substrate may be stably supported under a support base for the sensing terminal. Furthermore, according to the present invention, by using a sensing substrate formed as a single-sided circuit board, soldering of the sensing element and soldering of the sensing terminal may be performed simultaneously on one surface of the sensing substrate.

[0030] According to the present invention, the sensing element is not disposed on the lower surface of the sensing substrate facing the battery cell, but is disposed on the upper surface of the sensing substrate opposite the battery cell, thereby preventing damage to the sensing element due to impact with the battery cell. [Brief explanation of the drawings]

[0031] [Figure 1] 1 is an exploded perspective view of a battery pack according to a preferred embodiment of the present invention; [Figure 2] FIG. 2 is an exploded perspective view showing a part of the battery pack shown in FIG. 1, illustrating the arrangement of a sensing unit and battery cells. [Figure 3] FIG. 3 is a perspective view of the sensing unit shown in FIG. 2. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3. [Figure 5] 4 is a view showing a top view of the sensing unit shown in FIG. 3; [Figure 6] 4 is a view showing a bottom surface of the sensing unit shown in FIG. 3; [Figure 7] 4 is a diagram showing the assembly of the sensing unit shown in FIG. 3; [Figure 8] FIG. 10 is a perspective view of a sensing unit according to another embodiment of the present invention; [Figure 9]9 is a view showing a top view of the sensing unit shown in FIG. 8. [Figure 10] 9 is a view showing a bottom surface of the sensing unit shown in FIG. 8; [Figure 11] FIG. 10 is a cross-sectional view taken along line XI-XI in FIG. 8. DETAILED DESCRIPTION OF THE INVENTION

[0032] Hereinafter, a battery pack according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings.

[0033] FIG. 1 is an exploded perspective view of a battery pack according to a preferred embodiment of the present invention. FIG. 2 is an exploded perspective view showing a portion of the battery pack shown in FIG. 1, illustrating the arrangement of a sensing unit and battery cells. FIG. 3 is a perspective view of the sensing unit shown in FIG. 2. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3. FIGS. 5 and 6 are views showing different top and bottom views of the sensing unit shown in FIG. 3, respectively. FIG. 7 is a view showing the assembly of the sensing unit shown in FIG. 3.

[0034] 1 , a battery pack according to an embodiment of the present invention includes a plurality of battery cells B arranged along a first direction Z1, and a bus bar 50 disposed on the plurality of battery cells B to electrically connect different battery cells B to each other. A bus bar holder H is interposed between the bus bar 50 and the battery cells B to provide electrical insulation therebetween and to align the assembly position of the bus bar 50. A sensing substrate 20 for collecting status information of the battery cells B together with the bus bar 50 is disposed on the bus bar holder H. In an embodiment of the present invention, the bus bar 50 may be connected to first and second electrode terminals E1 and E2 of opposite polarities disposed on a terminal surface 11 of the battery cells B along a third direction Z3 intersecting the first direction Z1 in which the plurality of battery cells B are arranged. The first and second electrode terminals E1, E2 may form first and second row electrode terminals E1, E2 along a first direction Z1 in which the plurality of battery cells B are arranged, and the bus bars 50 electrically connected to the first and second row electrode terminals E1, E2 may form the first and second row bus bars 50 on the first and second row electrode terminals E1, E2. A sensing substrate 20 for collecting status information of the plurality of battery cells B may be disposed between the first and second row electrode terminals E1, E2 or the first and second row bus bars 50. For example, the first and second row bus bars 50 and the sensing substrate 20 disposed between the first and second row bus bars 50 may be supported together on a bus bar holder H. By being disposed on the bus bar holder H, the assembly positions may be aligned while insulation from the battery cells B may be ensured.

[0035] The battery cell B includes a terminal surface 11 on which first and second electrode terminals E1 and E2 are formed, a bottom surface 12 opposite the terminal surface 11, and side surfaces 13 and 14 connecting the terminal surface 11 and the bottom surface 12, the wide side surface 13 occupying a relatively large area and the narrow side surface 14 occupying a relatively small area. For example, a plurality of battery cells B arranged along the first direction Z1 may be arranged such that the wide sides 13 face each other. A vent portion 15 for relieving internal pressure of the battery cell B is formed between the first and second electrode terminals E1 and E2 of opposite polarities on the terminal surface 11 of the battery cell B, and vent holes V and 20′ for allowing the flow of exhaust gas discharged through the vent portion 15 of the battery cell B may be formed in the bus bar holder H and the sensing substrate 20 disposed on the vent portion 15, respectively. A connector CN electrically connected to the sensing board 20 is formed at one end of the sensing board 20, and the sensing board 20 is electrically connected to a battery management unit (not shown) through the connector CN. In an embodiment of the present invention, in addition to the vent hole V, the bus bar holder H may be formed with an opening H' for exposing the sensing unit 25 including the connection portion 22 of the sensing board 20 toward the terminal surface 11 of the battery cell B.

[0036] The bus bars 50 may electrically connect different battery cells B to one another, and the electrically connected bus bars 50 are also electrically connected to an external device via input / output terminals 51 and 52. The input / output terminals 51 and 52 include a pair of input / output terminals 51 and 52 connected to the bus bars 50 connected to battery cells B at one end and the other end, or to battery cells B at one end and the other end, in the electrical connection of the battery cells B electrically connected to one another via the bus bars 50. The external device to which the battery cells B are connected via the input / output terminals 51 and 52 may be an external load to which discharge power is supplied from the battery pack or an external charger that supplies charging power to the battery pack.

[0037] The sensing substrate 20 also includes a main body 21 of the sensing substrate 20 and a plurality of connection portions 22 of the sensing substrate 20 branching from the main body 21 of the sensing substrate 20 toward different battery cells B. Throughout this specification, the sensing substrate 20 forming a part of the sensing portion 25 refers to the connection portions 22 of the sensing substrate 20 branching from the main body 21 of the sensing substrate 20 toward each battery cell B, rather than the main body 21 of the sensing substrate 20. Hereinafter, the sensing substrate 20 forming the sensing portion 25 will be referred to as the sensing substrate 20 without distinguishing between the main body 21 and the connection portion 22 of the sensing substrate 20, but the sensing substrate 20 forming the sensing portion 25 refers to the connection portion 22 of the sensing substrate 20 branching from the main body 21 of the sensing substrate 20 toward the battery cell B. In one embodiment of the present invention, the connection portion 22 of the sensing substrate 20 extends in a meandering shape from the main body 21 of the sensing substrate 20, and the connection portion 22 of the sensing substrate 20 extends in a meandering shape so as to flexibly follow the displacement of the battery cell B in the first direction Z1 due to expansion and contraction of the battery cell B.

[0038] Hereinafter, the sensing unit 25 for collecting state information of a plurality of battery cells in an embodiment of the present invention will be described in more detail with reference to FIGS.

[0039] That is, a battery pack according to one embodiment of the present invention includes a battery cell B, a sensing substrate 20 that extends side by side along a first direction Z1 and includes a first position P1 where a sensing element 40 is formed, as a sensing unit 25 for obtaining status information of the battery cell B, and a sensing terminal 30 that is connected to the sensing substrate 20 at a second position P2 different from the first position P1 and is connected to the battery cell B side to acquire the status information, wherein the sensing substrate 20 and the sensing terminal 30 i) overlap each other at the first and second positions P1, P2, and ii) extend crossing each other so that their up-down positions are reversed along the second direction Z2 where they overlap each other at the first and second positions P1, P2.

[0040] In one embodiment of the present invention, the sensing unit 25 can measure status information such as the temperature, voltage, and current of the battery cell B. For example, the sensing unit 25 includes a sensing element 40 including a thermistor that measures temperature by using the characteristic of increasing or decreasing resistance according to temperature, such as a PTC (positive temperature coefficient thermistor) or NTC (negative temperature coefficient thermistor) for sensing the temperature of the battery cell B, and can generate and output an electrical signal corresponding to temperature information of the battery cell B.

[0041] In one embodiment of the present invention, the sensing substrate 20 and the sensing terminal 30 extend parallel to each other along a first direction Z1, which corresponds to the longitudinal direction of the sensing substrate 20 and / or the sensing terminal 30. For reference, throughout this specification, the second direction Z2 is a direction intersecting the first direction Z1, which corresponds to the longitudinal direction, and corresponds to a thickness direction perpendicular to the first direction Z1. The second direction Z2 may refer to the thickness direction of each sensing substrate 20 and sensing terminal 30, or the thickness direction of the entire sensing unit 25 including the sensing substrate 20 and sensing terminal 30 assembled relative to each other. Throughout this specification, terms such as "upper position," "upper side position," and "lower side position" refer to positions in the vertical direction following the second direction Z2, or positions relative to each other in the vertical direction following the second direction Z2. As will be described later, the sensing substrate 20 and the sensing terminal 30 each include a lower surface facing the battery cell B and an upper surface opposite the battery cell B. Among first and second positions P1 and P2 that are different from each other along the first direction Z1, at the first position P1, the sensing substrate 20 and the sensing terminal 30 are disposed at relatively upper and lower positions, respectively. That is, at the first position P1, the lower surface of the sensing substrate 20 and the upper surface of the sensing terminal 30 are disposed opposite to each other. In contrast, at the second position P2, the sensing substrate 20 and the sensing terminal 30 are disposed at relatively lower and upper positions, respectively. That is, at the second position P2, the upper surface of the sensing substrate 20 and the lower surface of the sensing terminal 30 are disposed opposite to each other.

[0042] As described below, the sensing substrate 20 and the sensing terminal 30 extend side by side along the first direction Z1, are arranged overlapping each other along the second direction Z2 at first and second positions P1 and P2 that are different from each other along the first direction Z1, and extend crossing each other so that their relative positions are inverted along the second direction Z2 at the first and second positions P1 and P2.

[0043] Throughout this specification, the third direction Z3 is a direction intersecting the first and second directions Z1 and Z2 and corresponds to a width direction perpendicular to the first and second directions Z1 and Z2. For reference, the first direction Z1 corresponding to the length direction and the third direction Z3 corresponding to the width direction may refer to the length and width directions of the sensing substrate 20 and the sensing terminal 30, respectively, or may refer to the length and width directions of the entire sensing unit 25 in which the sensing substrate 20 and the sensing terminal 30 are assembled together. As will be described later, in one embodiment of the present invention, the sensing substrate 20 and the sensing terminal 30 extend side by side along the first direction Z1, and extend crossing each other between the first and second positions P1 and P2, which are different from each other along the first direction Z1, so that their up-down positions are inverted. They also intersect with each other through a through hole 20' formed at a third position P3 between the first and second positions P1 and P2. In this case, the periphery of the through hole 20' formed in the sensing substrate 20, which is outside the through hole 20' along the third direction Z3, and the penetration portion of the sensing terminal 30 penetrating the through hole 20' may intersect with each other.

[0044] Throughout this specification, the expression "the sensing substrate 20 and the sensing terminal 30 extend crosswise relative to each other" means that the sensing terminal 30 is disposed opposite the bottom and top surfaces of the sensing substrate 20 at first and second positions P1 and P2 that are different from each other along the first direction Z1. For example, the sensing terminal 30 faces the bottom surface of the sensing substrate 20 at the first position P1, and faces the top surface of the sensing substrate 20 at the second position P2. In one embodiment of the present invention, the sensing terminal 30 extends crosswise relative to the sensing substrate 20, penetrating the sensing substrate 20 at a third position P3 between the first and second positions P1 and P2, such that its vertical position relative to the sensing substrate 20 is reversed at the first and second positions P1 and P2. For example, the fact that the sensing terminal 30 and the sensing substrate 20 extend crossing each other means that, between the sensing terminal 30 and the sensing substrate 20, which have upper and lower surfaces that are opposite to each other along the second direction Z2, the upper surface of the sensing terminal 30 and the lower surface of the sensing substrate 20 face each other at the first position P1, and the lower surface of the sensing terminal 30 and the upper surface of the sensing substrate 20 face each other at the second position P2. That is, the sensing terminal 30 is exposed on the lower surface of the sensing substrate 20 at the first position P1, and is exposed on the upper surface of the sensing substrate 20 at the second position P2.

[0045] In an embodiment of the present invention, the sensing terminal 30 and the sensing substrate 20 each include an upper and lower surface that are opposite to each other along the second direction Z2, and the upper and lower surfaces of the sensing terminal 30 and the sensing substrate 20 refer to opposite surfaces that are arranged in the same orientation. More specifically, the lower surface of the sensing terminal 30 and the sensing substrate 20 refers to a surface that is relatively adjacent to or faces battery cell B among the upper and lower surfaces that are opposite to each other along the second direction Z2, and the upper surface of the sensing terminal 30 and the sensing substrate 20 refers to a surface that is relatively far from battery cell B among the upper and lower surfaces that are opposite to each other along the second direction Z2, or a surface that faces away from battery cell B.

[0046] The sensing terminal 30 is exposed on the lower surface of the sensing substrate 20 at the first position P1, i.e., at the first position P1, the sensing terminal 30 is disposed on the lower surface of the sensing substrate 20, leaving the upper surface of the sensing substrate 20 open as a space for mounting the sensing element 40, thereby allowing connection of the sensing element 40 on the upper surface of the sensing substrate 20 and supporting the sensing substrate 20 on which the sensing element 40 is formed. At the second position P2 different from the first position P1, the sensing terminal 30 is exposed on the upper surface of the sensing substrate 20, thereby forming a bond with the upper surface of the sensing substrate 20.

[0047] According to an embodiment of the present invention, the sensing substrate 20 may be provided as a one-sided circuit board with the sensing substrate 20 and the sensing terminal 30 extending crosswise, and the sensing element 40 and the sensing terminal 30 may be stacked or coupled on opposite upper and lower surfaces of the sensing substrate 20. For example, a stacked structure may be formed in which the sensing terminal 30, the sensing substrate 20, and the sensing element 40 are stacked on each other along the second direction Z2 from the lower surface to the upper surface of the sensing substrate 20 at the first position P1. As will be described later, the sensing terminal 30 may be coupled to the battery cell B at the fourth position P4 and form an input side to which status information of the battery cell B is input. Status information of the battery cell B is also transmitted to the sensing element 40 via the sensing terminal 30 extending from the second position P2 to the first position P1. The status information of the battery cell B converted into an electrical signal via the sensing element 40 is also transmitted to a battery management unit connected to one end of the sensing substrate 20 via the sensing substrate 20 electrically connected to the sensing element 40.

[0048] According to an embodiment of the present invention, the sensing board 20 includes upper and lower surfaces that are opposite to each other along the second direction Z2, and a metal layer including bond pads S1 and S2 for coupling with other components is formed on the upper surface of the sensing board 20, but a metal layer including bond pads S1 and S2 for coupling with other components is not formed on the lower surface of the sensing board 20 opposite to the upper surface. For example, the sensing board 20 may be soldered to the sensing element 40 at a first position P1 and to the sensing terminal 30 at a second position P2 via the metal layer including the first and second bond pads S2 formed on the upper surface of the sensing board 20.

[0049] In one embodiment of the present invention, the sensing substrate 20 may be formed as a single-sided circuit board in which a metal layer including the first and second bonding pads S2 is formed on one of the upper and lower surfaces that are opposite to each other in the second direction Z2, and no metal layer is formed on the lower surface. As such, the sensing substrate 20 applicable to one embodiment of the present invention may be formed as a single-sided circuit board, and such a single-sided circuit board may be understood to have a different configuration from a double-sided circuit board in which a metal layer is formed on both the upper and lower surfaces that are opposite to each other in the second direction Z2. For example, the sensing substrate 20 may be formed in a simpler form and through an easier process than a double-sided circuit board, thereby reducing production costs.

[0050] In one embodiment of the present invention, a single-sided circuit board sensing board 20 is used, which can reduce manufacturing costs due to its relatively simplified configuration. The sensing board 20 and the sensing terminal 30 extend crossing each other to form soldering with other components via a metal layer formed on the top surface of the sensing board 20, instead of a double-sided circuit board having metal layers on both the top and bottom surfaces. Instead, a single-sided circuit board sensing board 20 having a metal layer formed on the top surface of the sensing board 20 may be used, and the sensing element 40 and the sensing terminal 30 may be stacked or coupled on the top and bottom surfaces of the sensing board 20, respectively, which are opposite to each other.

[0051] In the comparative example compared to the present invention, a double-sided circuit board sensing substrate 20 including metal layers on both the top and bottom surfaces is used, so that the sensing element 40 can be stacked on the top surface of the sensing substrate 20 and the sensing terminal 30 can be stacked on the bottom surface of the sensing substrate 20, for example, at a position corresponding to the first position P1 of the present invention. However, unlike the comparative example in which a double-sided circuit board sensing substrate 20 is used, an embodiment of the present invention uses a single-sided circuit board sensing substrate 20 having a relatively simple structure, but forms a structure in which the sensing substrate 20 and the sensing terminal 30 cross each other, so that the sensing element 40 and the sensing terminal 30 can be stacked on the top and bottom surfaces of the sensing substrate 20, respectively.

[0052] In one embodiment of the present invention, the sensing element 40 and the sensing terminal 30 are respectively formed on the upper and lower surfaces of the sensing substrate 20, which are opposite to each other. In other words, the sensing element 40 and the sensing terminal 30 are formed on the upper and lower surfaces of the sensing substrate 20, which are opposite to each other. This allows the sensing substrate 20 on which the sensing element 40 is formed to be stably supported via the sensing terminal 30. Furthermore, since the sensing element 40 is disposed on the upper surface of the sensing substrate 20 opposite to the battery cell B, rather than on the lower surface of the sensing substrate 20 opposite to the battery cell B, damage to the sensing element 40 due to impact with the battery cell B can be prevented.

[0053] In one embodiment of the present invention, the sensing substrate 20 may have a laminate of the sensing element 40 and the sensing terminal 30 via a metal layer formed on either a lower surface facing the battery cell B or an upper surface opposite the battery cell B. A one-sided circuit board may be applied in which a metal layer is formed on the upper surface opposite the battery cell B but no metal layer is formed on the lower surface facing the battery cell B.

[0054] In one embodiment of the present invention, the sensing substrate 20 and the sensing terminal 30 extend crossing each other. Throughout this specification, the term "the sensing substrate 20 and the sensing terminal 30 extend crossing each other" refers to the sensing substrate 20 and the sensing terminal 30 extending crossing each other in the second direction Z2 such that their vertical positions are reversed. For example, in one embodiment of the present invention, the sensing substrate 20 and the sensing terminal 30 are vertically reversed at first and second positions P1 and P2 that are different from each other along the first direction Z1. For example, at the first position P1, the sensing substrate 20 and the sensing terminal 30 are disposed at upper and lower positions, respectively, along the second direction Z2, while at the second position P2, the sensing terminal 30 and the sensing substrate 20 are disposed at upper and lower positions, respectively.

[0055] More specifically, the intersection of the sensing substrate 20 and the sensing terminal 30 may also occur at a third position P3 between the first and second positions P1 and P2 along the first direction Z1. The sensing terminal 30 may intersect with the sensing substrate 20 through a through-hole 20' formed in the sensing substrate 20 at the third position P3. For example, the sensing terminal 30 may extend from a lower position of the sensing substrate 20 at the first position P1 to an upper position of the sensing substrate 20 at the second position P2 through the through-hole 20' of the sensing substrate 20. Here, the through-hole 20' of the sensing substrate 20 may provide an intersection position between the sensing substrate 20 and the sensing terminal 30. The intersection position between the sensing substrate 20 and the sensing terminal 30 also corresponds to a position where a thickness centerline of the sensing substrate 20 and a thickness centerline of the sensing terminal 30 intersect with each other along the extension direction of the sensing substrate 20 and the sensing terminal 30. For example, in one embodiment of the present invention, the sensing substrate 20 and the sensing terminal 30 also intersect within a through-hole 20′ of the sensing substrate 20 formed at a third position P3 between the first and second positions P1 and P2. The sensing substrate 20 and the sensing terminal 30 are disposed at upper and lower positions, respectively, from the first position P1 to the third position P3 along the first direction Z1, and are reversed up and down at the third position P3, which corresponds to the intersecting position, so that the sensing substrate 20 and the sensing terminal 30 are disposed at lower and upper positions, respectively, from the third position P3 to the second position P2.

[0056] As described above, in one embodiment of the present invention, the sensing substrate 20 and the sensing terminal 30 form upside-down positions at the first and second positions P1 and P2, and form upside-down positions relative to each other. For example, the sensing substrate 20 and the sensing terminal 30 may form different levels at the first and second positions P1 and P2 along a level following the second direction Z2 from the terminal surface 11 of the battery cell B where the sensing unit 25 including the sensing substrate 20 and the sensing terminal 30 is arranged. For example, the sensing substrate 20 extends from a high level at the first position P1 to a low level at the second position P2, while the sensing terminal 30 extends from a low level at the first position P1 to a high level at the second position P2. To this end, the sensing substrate 20 and the sensing terminal 30 each include deforming portions F2 and F3 for connecting different levels at the first and second positions P1 and P2 along a level that follows the second direction Z2 from the terminal surface 11, and the deforming portions F2 and F3 of the sensing substrate 20 and the sensing terminal 30 may connect the different levels at the first and second positions P1 and P2 with a step or may connect the different levels at the first and second positions P1 and P2 with an incline. The deforming portions F2 and F3 of the sensing substrate 20 and the sensing terminal 30 may continuously connect the different levels at the first and second positions P1 and P2 without discontinuing the sensing substrate 20 between the first and second positions P1 and P2, and for this purpose, the different levels at the first and second positions P1 and P2 may be connected with a step or may be connected with an incline. For example, the deformation portions F2 and F3 may be formed between the first and second positions P1 and P2 of the sensing substrate 20 or the sensing terminal 30. Throughout this specification, when it is said that the deformation portions F2 and F3 incline to connect the first and second positions P1 and P2 at different levels, the incline may include not only an incline at a constant angle but also an incline at an angle that changes along the extension direction of the sensing substrate 20 and the sensing terminal 30. Furthermore, the incline may extend linearly or curvedly.

[0057] In an embodiment of the present invention, the deformation portion F2 of the sensing substrate 20 may be formed around the through hole 20' extending in the first direction Z1 to surround the through hole 20' at a position outside the through hole 20' in the third direction Z3 corresponding to the width direction of the sensing substrate 20. The deformation portion F3 of the sensing terminal 30 may be formed at a through portion passing through the through hole 20'. In this case, the sensing substrate 20 and the sensing terminal 30 may form an intersecting position within the through hole 20'. More specifically, the periphery of the through hole 20' surrounding the through hole 20' of the sensing substrate 20 and the through portion of the sensing terminal 30 passing through the through hole 20' may intersect with each other to form an intersecting position. In one embodiment of the present invention, the sensing terminal 30 may be formed of a metal plate having excellent rigidity, and the sensing terminal 30 having excellent rigidity may be assembled with the sensing substrate 20 having insufficient rigidity with a deformation portion F3 formed thereon in advance. The sensing substrate 20 may flexibly deform to correspond to the shape of the sensing terminal 30, and the deformation portion F2 may be formed while adaptively responding to the shape of the sensing terminal 30. For example, the sensing terminal 30 having the deformation portion F3 formed thereon in advance may be assembled to the sensing substrate 20 so as to pass through the through-hole 20′ of the sensing substrate 20, and the deformation portion F3 of the sensing terminal 30 may be assembled to the sensing substrate 20 so as to be positioned within the through-hole 20′ of the sensing substrate 20. The deformation portion F2 may be formed around the through-hole 20′ of the sensing substrate 20 to correspond to the shape of the sensing terminal 30. In one embodiment of the present invention, the sensing substrate 20 may be formed as a flexible circuit board. To prevent damage to the sensing substrate 20 due to insufficient flexibility of the sensing substrate 20, a deformation portion F2 may be formed around the through-hole 20' of the sensing substrate 20, which has excellent flexibility due to the through-hole 20'. In various embodiments of the present invention, the deformation portions F2 and F3 of the sensing substrate 20 and the sensing terminal 30 may be formed during the process of bonding the sensing substrate 20 and the sensing terminal 30 to each other by thermocompression bonding or laminating after the sensing substrate 20 and the sensing terminal 30 are assembled. For example, the deformation portions F2 and F3 having corresponding shapes may be formed on the sensing substrate 20 and the sensing terminal 30 while the assembly including the sensing terminal 30 sandwiched in the through-hole 20' of the sensing substrate 20 is thermocompression bonded or laminated to each other in a flat shape.

[0058] As described above, in one embodiment of the present invention, the sensing substrate 20 and the sensing terminal 30 may be at different levels from each other along the second direction Z2 from the terminal surface 11 of the battery cell B. Alternatively, while one of the sensing substrate 20 and the sensing terminal 30 may be at different levels from each other at the first and second positions P1 and P2, the other may be at the same level from each other at the first and second positions P1 and P2, and the sensing substrate 20 and the sensing terminal 30 may be at positions that are upside down from each other at the first and second positions P1 and P2. For example, the sensing substrate 20 may be at different levels at the first and second positions P1 and P2, but the sensing terminal 30 may be at the same level at the first and second positions P1 and P2. For example, the sensing terminal 30 may be formed of a relatively light metal plate, or a relatively strong metal plate may be formed of a flat metal plate that forms the same level. The sensing terminal 30 that forms the same level may extend across the lower position and upper position of the sensing substrate 20, which is relatively weak in rigidity or flexible, at the same level. For example, the sensing terminal 30 with excellent rigidity may pass through the through-hole 20′ and extend across the lower position of the sensing substrate 20 at the first position P1 on one side of the through-hole 20′, and extend across the upper position of the sensing substrate 20 at the second position P2 on the other side of the through-hole 20′, thereby inducing deformation portions F2 and F3 between the first and second positions P1 and P2 of the sensing substrate 20, which is relatively weak in rigidity or flexible. For example, the deformation portion F2 of the sensing substrate 20 may be formed around the through-hole 20' of the sensing substrate 20 extending in the first direction Z1 to surround the through-hole 20' at a position outside the through-hole 20' in the third direction Z3 corresponding to the width direction of the sensing substrate 20. In this case, the periphery of the through-hole 20' of the sensing substrate 20 and the through-hole portion of the sensing terminal 30 that passes through the through-hole 20' may intersect with each other, and the sensing substrate 20 and the sensing terminal 30 may form an intersection position within the through-hole 20'.

[0059] As described above, in various embodiments of the present invention, one of the sensing terminal 30 and the sensing substrate 20 may be at different levels at the first and second positions P1 and P2, while the other may be at the same level at the first and second positions P1 and P2, with the sensing substrate 20 and the sensing terminal 30 being upside down at the first and second positions P1 and P2. However, as described above, in one embodiment of the present invention, the sensing terminal 30 may be at the same level at the first and second positions P1 and P2, but the sensing substrate 20 may be at different levels at the first and second positions P1 and P2. Alternatively, in other embodiments of the present invention, the sensing substrate 20 may be at the same level at the first and second positions P1 and P2, but the sensing terminal 30 may be at different levels at the first and second positions P1 and P2. For example, a deformed portion F3 may be formed in advance in the sensing terminal 30 having relatively high rigidity. The sensing terminal 30 may be sandwiched between the through-holes 20' of the sensing substrate 20 so that the deformed portion F3 is positioned within the through-holes 20' of the sensing substrate 20. The deformed portion F3 may extend across the upper and lower positions of the sensing substrate 20, which are formed at the same level, in the first direction Z1, across the through-holes 20'. In this embodiment, the deformed portion F3 may be formed in advance in the sensing terminal 30 having relatively high rigidity, to prevent the sensing substrate 20, which is assembled with the sensing terminal 30, from being damaged during the assembly process. More specifically, to prevent the sensing substrate 20, which is relatively low in rigidity, from being damaged when it is deformed to conform to the shape of the sensing terminal 30, the sensing substrate 20 may be maintained at the same level at the first and second positions P1 and P2. The deformed portion F3 may be formed in the sensing terminal 30 sandwiched between the through-holes 20' of the sensing substrate 20, instead of the sensing substrate 20.Even in such an embodiment, an intersection position is formed at a third position P3 between the first and second positions P1 and P2, for example, within the through hole 20' formed at the third position P3, and for example, the penetration portion of the sensing terminal 30 penetrating the through hole 20' and the periphery of the through hole 20' extending along the first direction Z1 to surround the through hole 20' at a position outside the through hole 20' along the third direction Z3 corresponding to the width direction of the sensing substrate 20 intersect with each other within the through hole 20'.

[0060] In one embodiment of the present invention, the third position P3 and the second position P2 are formed adjacent to each other along the first direction Z1. For example, the third position P3 providing the intersection position and the second position P2 where the sensing substrate 20 and the sensing terminal 30, which are upside down through the third position P3, are coupled to each other are formed adjacent to each other. That is, a through-hole 20' corresponding to the third position P3 and the second position P2 where the sensing terminal 30 and the sensing substrate 20 are coupled to each other outside the adjacent through-hole 20' are formed.

[0061] In one embodiment of the present invention, the first and second positions P1 and P2 refer to positions where the sensing element 40 and the sensing terminal 30 are connected to the sensing substrate 20 along the first direction Z1. For example, in one embodiment of the present invention, the first position P1 refers to a position where the sensing element 40 is connected to the sensing substrate 20 or a position where the sensing element 40 is coupled to the sensing substrate 20, and the second position P2 refers to a position where the sensing terminal 30 is connected to the sensing substrate 20 or a position where the sensing terminal 30 is coupled to the sensing substrate 20. For example, in one embodiment of the present invention, the sensing element 40 and the sensing terminal 30 may be coupled to each other at different first and second positions P1 and P2 along the sensing substrate 20, and the coupling at the first and second positions P1 and P2 may be performed by soldering. For example, in one embodiment of the present invention, the first and second positions P1 and P2 are connected to the sensing element 40 and the sensing terminal 30 at the first and second positions P1 and P2, respectively, through a metal layer formed on the upper surface of the sensing substrate 20 among the upper and lower surfaces of the sensing substrate 20 that are opposite to each other. In one embodiment of the present invention, the sensing substrate 20 is connected to the sensing element 40 and the sensing terminal 30 at the first and second positions P1 and P2, respectively, through a metal layer (first and second bonding pads S1 and S2) formed on the upper surface of the sensing substrate 20, alternatively, among the lower surface facing the battery cell B and the upper surface facing the battery cell B. That is, by applying the sensing substrate 20, which is a one-sided circuit board having metal layers (first and second bonding pads S1, S2) alternatively formed on the upper surface, the first and second positions P1, P2 forming connections on the upper surface of the sensing substrate 20 are simultaneously and collectively connected. For example, through the metal layers (first and second bonding pads S1, S2) formed on the upper surface of the sensing substrate 20, the connection to the sensing element 40 at the first position P1 and the connection to the sensing terminal 30 at the second position P2 are simultaneously performed by a single soldering process such as reflow soldering.In various embodiments of the present invention, the first and second positions P1 and P2 are connected by various types of thermal bonding, including soldering. For example, at the first position P1, the electrode of the sensing element 40 is connected to the metal layer (first bonding pad S1) of the sensing substrate 20 by any available thermal bonding, and at the second position P2, the sensing terminal 30 is connected to the metal layer (second bonding pad S2) of the sensing substrate 20 by any available thermal bonding.

[0062] In one embodiment of the present invention, the sensing substrate 20, which is connected at the first and second positions P1 and P2, may be formed as a one-sided circuit board having a metal layer (first and second bonding pads S1 and S2) formed on one of the upper and lower surfaces, or may be provided as a flexible circuit board. This provides a support base that can firmly support the flexible circuit board during the soldering process, e.g., reflow soldering. In one embodiment of the present invention, the sensing substrate 20 can be firmly supported during soldering at the first and second positions P1 and P2 via the sensing terminals 30 that can support the sensing substrate 20. For example, in one embodiment of the present invention, the sensing terminal 30 disposed below the sensing substrate 20 at the first position P1 can firmly support the sensing substrate 20 on which the sensing element 40 is formed, and can prevent the sensing element 40, which has a relatively narrow soldering area, from moving out of its correct position due to distortion or twisting caused by the flexibility of the sensing substrate 20. As a result, a firm electrical and physical connection between the sensing element 40 and the sensing substrate 20 can be formed.

[0063] Throughout this specification, the connection at the first position P1, or stacking or forming the sensing substrate 20 and the sensing element 40 at the first position P1, comprehensively refers to both a physical connection and an electrical connection. For example, the sensing substrate 20 and the sensing element 40 are electrically connected to each other, so that an electrical signal related to status information of the battery cell B generated through the sensing element 40 is transmitted via the sensing substrate 20, and the status information of the battery cell B is collected through a battery management unit connected to one end of the sensing substrate 20. Similarly, the connection at the second position P2, or stacking or forming the sensing substrate 20 and the sensing terminal 30, refers to a physical connection. For example, the sensing substrate 20 and the sensing terminal 30 may be coupled to each other through a physical connection.

[0064] In an embodiment of the present invention, the sensing substrate 20 and the sensing terminal 30 are coupled together at the second position P2 and the first position P1 as well. More specifically, the sensing unit 25 according to an embodiment of the present invention includes the sensing substrate 20 and the sensing terminal 30, on which the sensing element 40 is formed, and the coupling between the sensing substrate 20 and the sensing terminal 30 is performed at first and second positions P1 and P2 that are different from each other along the first direction Z1. For example, at the second position P2, the sensing substrate 20 (e.g., the second bonding pad S2 of the sensing substrate 20) and the sensing terminal 30 that overlap each other are coupled together using a soldering material, and at the first position P1, the sensing substrate 20 and the sensing terminal 30 are coupled together using an adhesive member 60. In an embodiment of the present invention, the adhesive member 60 may be a double-sided adhesive tape. In one embodiment of the present invention, the sensing substrate 20 and the sensing terminal 30 are formed to extend elongatedly along the first direction Z1, and may be firmly coupled to each other by forming a coupling at first and second positions P1 and P2 that are different from each other along the first direction Z1. That is, the sensing substrate 20 and the sensing terminal 30 may be coupled to each other at the first position P1 via an adhesive member 60 interposed between the lower surface of the sensing substrate 20 and the upper surface of the sensing terminal 30, and may be coupled to each other at the second position P2 via a soldering material interposed between the upper surface of the sensing substrate 20 and the lower surface of the sensing terminal 30.

[0065] In one embodiment of the present invention, the sensing substrate 20 includes an insulating substrate and a metal layer formed on one surface of the insulating substrate, i.e., on an upper surface of the insulating substrate opposite the battery cell B. For example, the sensing substrate 20 may include a copper layer as a metal layer formed on an upper surface of a polyimide substrate serving as an insulating substrate. The metal layer of the sensing substrate 20 includes a first bonding pad S1 formed in a shape corresponding to an electrode of the sensing element 40 at a first position P1, and a second bonding pad S2 formed in a sufficient area to cover the sensing terminal 30 at a second position P2. In one embodiment of the present invention, the sensing substrate 20 may further include a conductive line L extending from the first bonding pad S1 and connected to the electrode of the sensing element 40.

[0066] In one embodiment of the present invention, the sensing terminal 30 has greater structural rigidity than the sensing substrate 20 so as to stably support the sensing substrate 20, and is also formed of a metal material that has excellent soldering properties with a metal layer (e.g., a copper layer) formed on the sensing substrate 20. For example, the sensing terminal 30 may be formed of a metal plate extending along the first direction Z1. More specifically, the sensing terminal 30 may be formed of a nickel plate. In one embodiment of the present invention, the sensing terminal 30 extends from a first position P1 to a second position P2 along the first direction Z1 and is connected to the battery cell B at a fourth position P4 separated from the second position P2. Temperature information of the battery cell B may be transmitted from the second position P2 connected to the battery cell B to the first position P1 where the sensing element 40 is disposed, as status information of the battery cell B. To this end, the sensing terminal 30 is formed of a metal material with excellent thermal conductivity, thereby enabling sensitive detection of status information of the battery cell B.

[0067] In an exemplary embodiment of the present invention, a weld W may be formed between the sensing terminal 30 detached from the sensing substrate 20 and the battery cell B at a fourth position P4, which is opposite the first position P1 with respect to the second position P2. In an exemplary embodiment of the present invention, the sensing terminal 30 detached from the sensing substrate 20 directly faces the battery cell B at the fourth position P4 and is directly coupled to the battery cell B. For example, the sensing terminal 30 and the battery cell B are coupled to each other via the weld W. For example, the weld W formed at the fourth position P4 may form a thermal and / or electrical connection between the sensing terminal 30 and the battery cell B, thereby transmitting information such as temperature, voltage, and current as status information transmitted from the battery cell B. The status information of the battery cell B transmitted via the weld W at the fourth position P4 is converted into an electrical signal related to the status information of the battery cell B via the sensing element 40 formed at the first position P1 and transmitted to the sensing substrate 20.

[0068] In one embodiment of the present invention, the battery cell B side refers to a measurement location where status information of battery cell B can be measured, and for example, it collectively refers to the battery cell B itself or a configuration thermally and / or electrically connected to battery cell B. In various embodiments of the present invention, the battery cell B side includes the battery cell B itself or a bus bar electrically connected to battery cell B. Here, the bus bar is a configuration that electrically connects different battery cells B, is thermally and / or electrically connected to battery cell B, and can transmit status information of battery cell B to the sensing element 40 via the sensing terminal 30.

[0069] In one embodiment of the present invention, the sensing terminal 30 is directly coupled to the battery cell B itself, and the sensing terminal 30 may be coupled to an outer surface of the case 10 that forms the outer shape of the battery cell B. In one embodiment of the present invention, the sensing terminal 30 is coupled to a terminal surface 11 on the outer surface of the case 10, on which electrodes E1 and E2 are formed. The terminal surface 11 to which the sensing terminal 30 is coupled is insulated from the electrodes E1 and E2 of the battery cell B and corresponds to a position outside the charge / discharge path of the battery cell B. Therefore, the configuration in which the terminal surface 11 of the battery cell B is used as a measurement point can sensitively capture state information of the battery cell B away from Joule heat due to the charge / discharge power of the battery cell B, thereby increasing the reliability of state information of the battery cell B compared to an embodiment in which a bus bar that forms the charge / discharge path of the battery cell B is used as a measurement point.

[0070] For reference, in one embodiment of the present invention, the battery cell B includes an internal electrode assembly (not shown) and a case 10 that accommodates the internal electrode assembly (not shown). The case 10 may include main surfaces 13 formed facing each other between adjacent battery cells B along the first direction Z1, and may further include a bottom surface 12 opposite to a terminal surface 11 on which the electrodes E1 and E2 are formed, and a side surface 14 that connects the terminal surface 11 and the bottom surface 12 and has an area smaller than that of the main surface 13.

[0071] In one embodiment of the present invention, the sensing substrate 20 and the sensing terminal 30 forming the sensing unit 25 extend to different lengths along the first direction Z1. For example, the sensing substrate 20 extends from a first position P1 to a second position P2 along the first direction Z1 and does not extend beyond the second position P2 to a fourth position P4. In another embodiment of the present invention, the sensing substrate 20 extends from the first position P1 to the second position P2 along the first direction Z1. Unlike the sensing substrate 20, the sensing terminal 30 extends from the first position P1 to the second position P2 along the first direction Z1 to a fourth position P4, and may form a connection with the battery cell B at the fourth position P4 beyond the sensing substrate 20. That is, in one embodiment of the present invention, the sensing substrate 20 and the sensing terminal 30 forming the sensing unit 25 may be disposed to overlap each other from the first position P1 to the second position P2. However, the sensing substrate 20 in which the through-hole 20' is formed at the third position P3 does not overlap with the sensing terminal 30 passing through the through-hole 20'.

[0072] 4, the sensing substrate 20 and the sensing terminal 30 forming the sensing unit 25 are bonded to each other at first and second positions P1 and P2 by adhesive bonding and thermal bonding, respectively. For example, they may be bonded to each other by adhesive bonding at the first position P1 and thermal bonding at the second position P2. For example, an adhesive member 60 is disposed on the sensing terminal 30 disposed opposite the sensing substrate 20 at the first position P1, and a bonding pad (second bonding pad S2) is formed on the sensing substrate 20 disposed opposite the sensing terminal 30 at the second position P2. The bonding pad (second bonding pad S2) also corresponds to a metal layer formed on the sensing substrate 20 at the second position P2. The sensing substrate 20 includes a first bonding pad S1 formed corresponding to an electrode of the sensing element 40 to be connected to the sensing element 40 at a first position P1, and a second bonding pad S2 formed with a large area covering the sensing terminal 30 to be connected to the sensing terminal 30 at a second position P2. The bonding pads S1 and S2 also correspond to a metal layer formed on an insulating substrate forming the sensing substrate 20. In addition to the bonding pads S1 and S2, a conductive line L electrically connected to the bonding pads S1 and S2 may be further formed on the insulating substrate. Also, reference numeral 30′ denotes a bonding hole formed in the sensing terminal 30 to provide bonding (soldering) between the sensing terminal 30 and the sensing substrate 20.

[0073] 7 is a diagram illustrating the assembly of the sensing unit 25 shown in FIG. 7, the sensing substrate 20 and the sensing terminal 30 forming the sensing unit 25 are assembled at positions corresponding to each other. For example, the sensing terminal 30 is sandwiched in the through-hole 20' of the sensing substrate 20 so that the first to third positions P1, P2, and P3 of the sensing substrate 20 correspond to the first to third positions P1', P2', and P3' of the sensing terminal 30. In FIG. 7, the first to third positions P1, P2, and P3 of the sensing substrate 20 are used as references, and the first and second positions of the sensing terminal 30 are used as references. Although the third positions P1', P2', and P3' are shown as being aligned, it is sufficient that the sensing substrate 20 and the sensing terminal 30 at each of the first to third positions P1, P2, P3, P1', P2', and P3' are aligned with each other through relative positional alignment, and the fourth position P4' of the sensing terminal 30 is sandwiched in the through-hole 20' of the sensing substrate 20 and exposed from the third position P3, and can be connected to the terminal surface 11 of the battery cell B.

[0074] Figure 8 is a perspective view of a sensing unit according to another embodiment of the present invention. Figures 9 and 10 are views showing different top and bottom views of the sensing unit shown in Figure 8. Figure 11 is a cross-sectional view taken along line XI-XI in Figure 8.

[0075] Hereinafter, a battery pack according to another embodiment of the present invention will be described with reference to Figures 8 to 11. Referring to the drawings, in this embodiment, the sensing substrate 120 and sensing terminal 130 forming the sensing unit 125 may be coupled to each other at first and second positions P1 and P2 by thermocompression bonding or lamination. For example, the sensing substrate 120 and sensing terminal 130 are arranged overlapping each other along the first direction Z1, except for a third position P3 where a through-hole 120' is formed and a fourth position P4 where a connection is made with the battery cell B. Thermocompression bonding or lamination is performed over the entire overlapping area along the first direction Z1. Therefore, unlike the embodiment shown in Figure 4, the embodiment of Figure 11 does not have a separate bonding pad (second bonding pad S2 of Figure 4) formed at the second position P2. An adhesive member 70 may be interposed between the sensing substrate 120 and the sensing terminal 130 where the thermocompression bonding or lamination is performed, and the adhesive member 70 may be interposed between the sensing substrate 120 in the upper position and the sensing terminal 130 in the lower position at the first position P1, and between the sensing terminal 130 in the upper position and the sensing substrate 120 in the lower position at the second position P2. However, in addition to the first and second positions P1 and P2, the adhesive member 70 may be formed throughout the entire area between the sensing substrate 120 and the sensing terminal 130 that are overlapped with each other.

[0076] For example, in the embodiment shown in FIG. 4, the sensing substrate 20 and the sensing terminal 30 are bonded separately at the first and second positions P1 and P2, whereas in the embodiment shown in FIG. 11, the sensing substrate 120 and the sensing terminal 130 are bonded together at the first and second positions P1 and P2. For example, thermocompression bonding or lamination may be performed all at once between the sensing substrate 120 and the sensing terminal 130, which overlap each other and include the first and second positions P1 and P2.

[0077] The present invention has been described with reference to the embodiments shown in the accompanying drawings, but these are merely examples, and those skilled in the art will recognize that various modifications and equivalent alternative embodiments are possible therefrom.

[0078] [1] A battery cell; a sensing unit for obtaining status information of the battery cell, a sensing substrate extending side by side along a first direction and including first locations at which sensing elements are formed; a sensing terminal connected to the sensing substrate at a second position different from the first position and connected to a side of the battery cell to capture the state information; The sensing substrate and the sensing terminal are i) overlapping one another at said first and second positions; ii) a sensing portion extending across each other so that the up-down positions are inverted along a second direction that overlaps each other at the first and second positions. [2] In the first position, the sensing substrate on which the sensing element is formed and the sensing terminal are respectively disposed at an upper position opposite to the battery cell and a lower position facing the battery cell; [1] The battery pack according to [1], characterized in that in the second position, the sensing substrate and the sensing terminal are respectively arranged at a lower position facing the battery cell and at an upper position opposite the battery cell. [3] The battery pack according to [1], wherein the sensing element is formed on an upper surface of the sensing substrate opposite the battery cell. [4] The battery pack described in [1], wherein at least one of the sensing substrate and the sensing terminal includes a deformation portion that connects the upper and lower positions that are inverted to each other in the first and second positions. [5] The battery pack described in [4], characterized in that the deformation portion connects the upper and lower positions that are inverted to each other at the first and second positions with a step or at an incline. [6] The battery pack described in [4], characterized in that the sensing substrate includes a deformation portion that intersects with the sensing terminal and connects between a position above the sensing terminal in the first position and a position below the sensing terminal in the second position. [7] The battery pack described in [4], characterized in that the sensing terminal includes a deformation portion that intersects with the sensing substrate and connects between a position below the sensing substrate in the first position and a position above the sensing substrate in the second position. [8] The battery pack described in [4], characterized in that a through hole is formed at a third position between the first and second positions of the sensing substrate along the first direction, through which the sensing terminal passes so that the sensing substrate and the sensing terminal intersect with each other. [9] The battery pack according to [8], wherein the deformation portion is formed within the through-hole.

[10] The battery pack described in [8], characterized in that the periphery of the through hole of the sensing board, which extends along the first direction so as to surround the through hole at a position outside the through hole of the sensing board along a third direction intersecting the first and second directions, and the penetration portion of the sensing terminal that penetrates the through hole intersect with each other.

[11] The battery pack described in

[10] , characterized in that at least one of the periphery of the through hole and the through portion extends at an angle to connect between upper and lower positions that are inverted relative to each other at the first and second positions, and intersects with each other.

[12] The battery pack described in

[10] , wherein the periphery of the through hole and the through portion extend at an angle tending to be opposite to each other so as to connect between upper and lower positions that are inverted to each other at the first and second positions, and intersect with each other.

[13] The battery pack according to [1], wherein the sensing substrate and the sensing terminal are bonded to each other by thermocompression bonding or laminating.

[14] Along the first direction, the sensing substrate extends from the first position to a second position; The battery pack according to [1], wherein the sensing terminal extends from the first position to a fourth position that is out of the second position.

[15] The battery pack described in

[14] , wherein the sensing terminal is connected to the battery cell side at a fourth position outside the sensing substrate along the first direction.

[16] The battery pack according to

[15] , wherein the sensing terminal is connected to a terminal surface of a battery cell on which an electrode is formed.

[17] The battery pack according to

[16] , wherein a weld is formed between the sensing terminal and the terminal surface of the battery cell.

[18] The battery pack described in [1], characterized in that a metal layer including a first bonding pad for connection with the sensing element is formed at a first position of the sensing substrate.

[19] The battery pack described in

[18] , wherein a first adhesive member for coupling with the sensing terminal is interposed at a first position of the sensing substrate.

[20] In the first position, a metal layer including the first bonding pad is formed on an upper surface of the sensing substrate opposite to the battery cell; The battery pack according to

[19] , wherein the first adhesive member is formed on a lower surface of the sensing substrate facing the battery cell.

[21] The battery pack described in [1], characterized in that a metal layer including a second bonding pad for coupling with the sensing terminal is formed at a second position of the sensing substrate.

[22] The battery pack described in [1], wherein a second adhesive member for coupling with the sensing terminal is interposed at a second position of the sensing substrate.

[23] A metal layer including first and second bonding pads for connection to the sensing element and the sensing terminal is formed at a first and second position of the sensing substrate, respectively; The battery pack according to [1], wherein the metal layer including the first and second bond pads is formed on the upper surface of the sensing substrate opposite the battery cell.

[24] The sensing substrate The battery pack according to

[23] , characterized in that the lower surface facing the battery cell is formed as a one-sided circuit board that does not include the metal layer. [Explanation of symbols]

[0079] 11 Terminal surface 20 Sensing substrate 21 Sensing board body 22 Sensing board connection 25 Sensing part 30 Sensing terminal 40 Sensing element 60,70 Adhesive material B Battery cell F2, F3 deformation section L Conductive Line P1 1st position P2 2nd position P3 3rd position P4 4th position S1 First Bonding Pad S2 Second Bonding Pad W welded section

Claims

1. A battery cell; a sensing unit for obtaining status information of the battery cell, a sensing substrate extending side by side along a first direction and including first locations at which sensing elements are formed; a sensing terminal connected to the sensing substrate at a second position different from the first position and connected to a side of the battery cell to capture the state information; The sensing substrate and the sensing terminal are i) overlapping with respect to each other at said first and second positions; ii) sensing portions extending in a second direction and crossing each other at the first and second positions so as to be inverted in up-down positions, metal layers including first and second bonding pads for connection to the sensing element and the sensing terminal, respectively, are formed at first and second positions of the sensing substrate; The battery pack, wherein the metal layer including the first and second bond pads is formed on an upper surface of a sensing substrate opposite the battery cell.

2. In the first position, the sensing substrate on which the sensing element is formed and the sensing terminal are disposed at an upper position opposite to the battery cell and a lower position facing the battery cell, respectively; The battery pack according to claim 1 , wherein, in the second position, the sensing board and the sensing terminal are disposed at a lower position facing the battery cell and an upper position opposite the battery cell, respectively.

3. The battery pack according to claim 1 , wherein the sensing element is formed on an upper surface of the sensing substrate opposite the battery cell.

4. The battery pack according to claim 1 , wherein at least one of the sensing board and the sensing terminal includes a deformation portion for connecting upper and lower positions that are inverted to each other at the first and second positions.

5. The battery pack according to claim 4, wherein the deforming portion connects the upper and lower positions that are inverted to each other at the first and second positions with a step or an inclination.

6. 5. The battery pack according to claim 4, wherein the sensing board includes a deformation portion that intersects with the sensing terminal and connects between a position above the sensing terminal at the first position and a position below the sensing terminal at the second position.

7. 5. The battery pack according to claim 4, wherein the sensing terminal includes a deformed portion that crosses the sensing board and connects between a position below the sensing board at the first position and a position above the sensing board at the second position.

8. 5. The battery pack of claim 4, wherein a through-hole through which the sensing terminal passes is formed at a third position between the first and second positions of the sensing board along the first direction, such that the sensing board and the sensing terminal intersect with each other.

9. The battery pack according to claim 8, wherein the deformation portion is formed within the through-hole.

10. 9. The battery pack of claim 8, wherein a periphery of the through-hole of the sensing board extending along the first direction to surround the through-hole at a position outside the through-hole of the sensing board along a third direction intersecting the first and second directions, and a through-hole portion of the sensing terminal passing through the through-hole intersect with each other.

11. 11. The battery pack of claim 10, wherein at least one of the periphery of the through hole and the through portion extends obliquely to connect between upper and lower positions that are inverted to each other at the first and second positions, and intersects with each other.

12. 11. The battery pack of claim 10, wherein the periphery of the through-hole and the through-portion extend obliquely in opposite directions to each other and intersect with each other so as to connect between upper and lower positions that are inverted in the first and second positions.

13. The battery pack according to claim 1 , wherein the sensing substrate and the sensing terminal are bonded to each other by thermocompression bonding or laminating.

14. Along the first direction, the sensing substrate extends from the first position to a second position; The battery pack according to claim 1 , wherein the sensing terminal extends from the first position to a fourth position that is spaced apart from the second position.

15. The battery pack of claim 14, wherein the sensing terminal is connected to a side of the battery cell at a fourth position separated from the sensing board along the first direction.

16. The battery pack according to claim 15, wherein the sensing terminal is connected to a terminal surface of the battery cell on which an electrode is formed.

17. The battery pack according to claim 16, wherein a weld is formed between the sensing terminal and a terminal surface of the battery cell.

18. The battery pack according to claim 1 , wherein a metal layer including a first bonding pad for connection with the sensing element is formed at a first position of the sensing substrate.

19. The battery pack of claim 18, wherein a first adhesive member for coupling with the sensing terminal is interposed at a first position of the sensing board.

20. In the first position, a metal layer including the first bonding pad is formed on an upper surface of the sensing substrate opposite to the battery cell; The battery pack of claim 19, wherein the first adhesive member is formed on a lower surface of the sensing substrate facing the battery cell.

21. The battery pack according to claim 1 , wherein a metal layer including a second bonding pad for coupling with the sensing terminal is formed at a second position of the sensing substrate.

22. The battery pack of claim 1 , wherein a second adhesive member is interposed at a second position of the sensing board for coupling with the sensing terminal.

23. The sensing substrate comprises: The battery pack according to claim 1 , wherein a one-sided circuit board is formed on a lower surface facing the battery cells, the one-sided circuit board not including the metal layer.

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