Wearable computing device and head-mounted wearable computing device

Abstract

Systems and methods are provided for thermal management in wearable computing devices. The thermal management strategy included in the wearable computing device provides for dissipation of heat generated by electronic components located within the enclosure or housing of the wearable computing device to maintain operability of the electronic components, maintain functionality and / or operability of the wearable computing device, and maintain user comfort while the wearable computing device is worn. The enclosure includes a multi-layer stack of materials including a thermal layer embedded in an insulating layer. The thermal layer can be shaped to direct the spread of heat in a desired direction, maintain surface touch temperatures within acceptable ranges, and maintain internal enclosure temperatures within the operating range of the electronic components.

Description

[Technical Field]

[0001] This specification relates generally to thermal management in wearable devices, and more particularly to thermal management in head-worn wearable computing devices that include electronic components. [Background technology]

[0002] background Wearable computing devices may include, for example, head-mounted wearable devices, wrist-mounted wearable devices, hand-mounted wearable devices, pendants, etc. Head-mounted wearable devices may include, for example, smart glasses, headsets, goggles, earphones, etc. Wrist / hand-mounted wearable devices may include, for example, smart watches, smart bracelets, smart rings, etc. Wearable computing devices may include various types of electronic components that provide the functionality of the wearable computing device. These electronic components may generate heat during operation, and if the heat is not effectively dissipated, it may degrade the operation of the components, affect the functionality of the wearable computing device, or cause discomfort to the user. The volume available within the housing of a wearable computing device for installing these electronic components may be somewhat constrained by the form factor of the wearable computing device, the required placement of the electronic components within a constrained installation volume to provide the desired functionality, and other such factors. Therefore, this type of installation environment may not easily accommodate conventional heat dissipation systems and methods. A housing or enclosure that can provide thermal management in the form factors associated with these types of wearable computing devices can maintain the functionality of the electronic components and the wearable computing device, as well as the comfort of the user. Summary of the Invention

[0003] overview Systems and methods according to implementations described herein may incorporate thermal management strategies into a wearable computing device that provide effective heat dissipation and diffusion while preserving an internal volume for installing electronic components and maintaining a desired overall form factor of the wearable computing device. In some general aspects, a thin-walled housing defining an internal volume and external form factor may incorporate a shaped or contoured intermediate layer embedded in the inner and outer layers. The intermediate layer may have a relatively higher thermal conductivity than the inner and outer layers to define a thermal path for diffusion and / or dissipation of heat generated by electronic components installed within the thin-walled housing. For example, manufacturing techniques such as thermoforming, compression molding, and additive manufacturing may provide for the manufacture of such thin-walled housings while preserving the internal installation volume and still maintaining a desired external form factor of the wearable computing device.

[0004] The details of one or more implementations are set forth in the accompanying drawings and the description below. Other features will be apparent from the description and drawings, and from the claims. [Brief explanation of the drawings]

[0005] [Figure 1A] FIG. 1 illustrates an exemplary wearable device worn by a user. [Figure 1B] FIG. 1B is a front view of the exemplary head-mounted wearable device shown in FIG. 1A. [Figure 1C] FIG. 1B is a rear view of the exemplary head-mounted wearable device shown in FIG. 1A. [Figure 1D] FIG. 1D is a front view of the head-mounted wearable device shown in FIGS. 1B and 1C being worn by a user. [Figure 2A] FIG. 1 is a perspective view of an exemplary frame of an exemplary head-mounted wearable device. [Figure 2B] FIG. 1 is a top view of an exemplary frame of an exemplary head-mounted wearable device. [Figure 2C]FIG. 1 is a first side view of an exemplary frame of an exemplary head-mounted wearable device. [Figure 2D] FIG. 10 is a second side view of an exemplary frame of an exemplary head-mounted wearable device. [Figure 3A] 2A is a perspective view of section A shown in FIG. 2A of an exemplary arm portion of the exemplary frame shown in FIGS. 2A-2D. [Figure 3B] FIG. 3B is a cross-sectional view taken along line BB in FIG. 3A. [Figure 3C] FIG. 2E is a perspective view of an exemplary front frame portion of the exemplary frame shown in FIGS. 2A-2D. [Figure 3D] FIG. 3D is a cross-sectional view taken along line DD in FIG. 3C. [Figure 3E] 3A-3D are schematic diagrams of an exemplary layup of materials forming the exemplary housing shown in FIGS. 3A-3D. [Figure 4A] FIG. 10 is a surface temperature plot illustrating the surface temperature of an exemplary housing during operation of an exemplary heat-generating component. [Figure 4B] FIG. 10 is a surface temperature plot illustrating the surface temperature of an exemplary housing during operation of an exemplary heat-generating component. [Figure 4C] FIG. 10 is a surface temperature plot illustrating the surface temperature of an exemplary housing during operation of an exemplary heat-generating component. DETAILED DESCRIPTION OF THE INVENTION

[0006] Detailed Description The present disclosure relates to systems and methods for providing thermal management in wearable computing devices. The systems and methods, according to implementations described herein, provide for the incorporation or integration of a thermal management system into the enclosure or housing of a wearable computing device. The systems and methods, according to implementations described herein, provide for the dissipation of heat generated by electronic components located within the enclosure or housing of the wearable computing device to maintain operability of the electronic components, maintain functionality and / or operability of the wearable computing device, and maintain user comfort while the wearable computing device is worn.

[0007] 1A illustrates a user wearing several different wearable devices, including an exemplary head-mounted wearable device 100 in the form of smart glasses or augmented reality glasses, including display and computing / processing capabilities. The exemplary wearable devices illustrated in FIG. 1A also include another exemplary head-mounted wearable device 196 in the form of earphones, and an exemplary wrist-mounted wearable device 198 in the form of a smartwatch. In the following, the systems and methods are described with respect to a wearable computing device in the form of a head-mounted wearable computing device, or smart glasses, or augmented reality glasses, for purposes of explanation and illustration only. The principles described herein may also be applied to other types of wearable computing devices.

[0008] FIG. 1B is a front view of the exemplary head-worn wearable device 100 shown in FIG. 1A , and FIG. 1C is a rear view thereof. FIG. 1D is a front view of the exemplary head-worn wearable device 100 being worn by a user. The exemplary head-worn wearable device 100 includes a frame 110. The frame 110 includes a front frame portion 120 and a pair of temple arms 130 rotatably coupled to the front frame portion by respective hinge portions 140. The front frame portion 120 includes rim portions 123 that surround respective optical portions in the form of lenses 127, with a bridge portion 129 connecting the rim portions 123. The arms 130 are coupled to the front frame portion 120 at the hinge portions 140 of the respective rim portions 123, e.g., pivotally or rotatably coupled. In some examples, the lenses 127 are corrective / prescription lenses. In some examples, the lenses 127 are optical materials that include glass and / or plastic portions that do not necessarily incorporate corrective / prescription parameters.

[0009] In some examples, wearable device 100 includes a display device 104 that can output visual content so that the visual content is viewable by a user, for example, at an output coupler 105. In some examples, display device 104 is provided on a portion of frame 110. In the example shown in Figures 1B and 1C, display device 104 is provided on one of two arms 130 for purposes of explanation and illustration only. Display device 104 may also be provided on each of two arms 130 to provide binocular output of content.

[0010] In some examples, display device 104 may be a see-through near-eye display. In some examples, display device 104 may be configured to project light from a display source onto a portion of teleprompter glass that acts as a beam splitter, positioned at an angle (e.g., 30-45 degrees). The beam splitter may allow for reflection and transmission values ​​that partially reflect light from the display source while transmitting the remaining light. Such an optical design may enable a user to see both physical items in the world next to content (e.g., digital images, user interface elements, virtual content, etc.) output by display device 104, for example, through lens 127. In some implementations, waveguide optics may be used to render content on display device 104.

[0011] In some examples, the head-mounted wearable device includes one or more of an audio output device 106 (e.g., one or more speakers), a lighting device 108, a sensing system 111, a control system 112, at least one processor 114, and an outward-facing image sensor 116 or a camera 116. In some examples, the head-mounted wearable device 100 may include an eye-tracking device 115 including, for example, one or more sensors 117, to detect and track gaze direction and movement. Data captured by the eye-tracking device 115 may be processed to detect and track gaze direction and movement as user input. In some examples, the sensing system 111 may include various sensing devices, and the control system 112 may include various control system devices including, for example, one or more processors 114 operably coupled to components of the control system 112. In some examples, the control system 112 may include a communications module that provides communication and information exchange between the wearable computing device 100 and other external devices.

[0012] In some examples, some or all of the electronic components described above with respect to the exemplary head-mounted wearable device 100 are received within respective enclosures or housings defined by the front frame portion 120 and / or temple arm portions 130 of the frame 110. Numerous factors may influence the placement and / or installation of these types of electronic components within the respective enclosures or housings defined by the front frame portion 120 and / or temple arm portions 130. One of these factors may include, for example, the size and / or configuration of the electronic components relative to the available installation volume within the respective enclosures or housings. Another of these factors may include the installation location of a particular electronic component associated with its function. This may include, for example, the positioning of the audio output device 106 so that audio signals output by the audio output device 106 are directed toward the user's ear, the positioning of the image sensor 116 to capture image data of the physical environment within the field of view of the image sensor 116, and other such factors.

[0013] Considerations such as the form factor, internal configuration, and the like associated with the frame 110 of the head-worn wearable device 100, alone or in combination with the above installation factors, make it difficult to incorporate typical thermal management / heat dissipation strategies into the head-worn wearable device 100. For example, in installation environments less constrained by form factor, available internal installation volume, and the like, elements such as heat sinks, fans, thermal gel, heat pipes, and metal heat dissipation structures may be implemented to maintain the installation temperature below a set temperature threshold limit. Without these types of thermal management / heat dissipation elements, it may be difficult to maintain the installation components below a maximum threshold operating temperature. This may result in thermal throttling of the operation of the electronic components and the corresponding experience provided by the head-worn wearable device 100. Without these types of thermal management / heat dissipation elements, continued operation of the electronic components may result in localized hot spots on the exterior / outer surface of the frame 110 that exceed the desired touch temperature threshold. This may result in user discomfort, particularly in the area of ​​or adjacent to the user's head. This can adversely affect the fit of the head-worn wearable device over a significant period of time, potentially reducing its functionality and / or usability.

[0014] Thus, without effective thermal management, heat generated due to the operation of electronic components housed within the enclosure or housing defined by the front frame portion 120 and / or the arm portion 130 can degrade the operability / functionality of the electronic components and / or the operability / functionality of the head-worn wearable device 100. Systems and methods according to implementations described herein provide a solution to the problem of incorporating a thermal management system into such enclosures or housings having a somewhat limited form factor to preserve the operability and / or functionality of the electronic components and / or the wearable device in which the electronic components are installed and to preserve user comfort when using the head-worn wearable device. Systems and methods according to implementations described herein provide one or more thermal management devices incorporated into and / or integrated into one or more housings or enclosures defined by the front frame portion and / or the temple arm portions of the head-worn wearable device. In some examples, the head-worn wearable device is in the form of smart glasses or augmented reality glasses. Systems and methods according to implementations described herein may utilize material processing techniques to fabricate housings or enclosures for consumer products that exhibit non-uniform thermal properties. In some examples, thermal mitigation devices are distributed along the surface of a housing or enclosure to facilitate the dissipation of heat generated by the enclosure or electronic components installed within the housing to the environment. Using materials / material processing to fabricate a housing or enclosure with such non-uniform thermal properties may enable electronic components with dynamic heat output / dissipation requirements to operate as needed to output a particular experience while also optimizing heat dissipation to the environment.

[0015] FIG. 2A is a perspective view of an exemplary frame 210 of a head-mounted wearable device. The frame 210 may be used with the exemplary head-mounted wearable device 100 shown in FIGS. 1A-1D or other head-mounted wearable devices. FIG. 2B is a top view of the exemplary frame 210, FIG. 2C is a first side view thereof, and FIG. 2D is a second side view thereof. The exemplary frame 210 shown in FIGS. 2A-2D includes a front frame portion 220 coupled to arm portions 230 (i.e., first arm portion 230A and second arm portion 230B) at respective limb portions 223 (i.e., first limb portion 223A and second limb portion 223B) by hinge portions 240 (i.e., first hinge portion 240A and second hinge portion 240B) of the front frame portion 220. In particular, the first arm portion 230A is coupled to the first limb portion 223A at the first hinge portion 240A. The second arm portion 230B is coupled to the second limb portion 223B of the front frame portion 220 at the second hinge portion 240B. In some examples, a bridge portion 229 extends between the first limb portion 223A and the second limb portion 223B. The front frame portion 220 may define a housing or enclosure having one or more internal spaces in which electronic components of a head-mounted wearable device can be received. One or both of the first arm portion 230A and / or the second arm portion 230B may define a housing or enclosure having one or more internal spaces in which electronic components of a head-mounted wearable device can be received. Thus, at least a portion of one or both of the front frame portion 220 and / or the temple arm portion 230 may be at least partially hollow so as to define one or more internal spaces therein in which electronic components can be received.

[0016] The exemplary frame 210 shown in FIGS. 2A-2D includes one or more exemplary components 250 received within the first arm portion 230A of the frame 210. The one or more exemplary components 250 are received within the front frame portion 220, particularly within the first rim portion 223A proximate the first hinge portion 240A. The one or more exemplary components 250 are received within the second arm portion 230B. The exemplary components 250 may be, for example, electronic components of the exemplary head-mounted wearable device 100 described above and / or other types of components that selectively generate heat when operating within the interior installation volume defined within the exemplary frame 210. The exemplary components 250 are shown solely for purposes of explanation and illustration. More or fewer components and / or combinations of components, arranged similarly or differently to those shown, may be installed / received within the interior space defined within the exemplary frame 210. The principles described herein are also applicable to other electronic components and / or combinations of components disposed within other interior spaces defined within other interiors of exemplary frame 210. Similarly, the principles described herein may also be applied to thermal management and heat dissipation in other types of wearable devices.

[0017] As described above, operation of the various exemplary components 250 can generate heat in concentrated areas within the respective housings defined by the front frame portion 220 and / or the arm portion 230. Without thermal management measures, heat generated by operation of one or more of the components 250 can cause localized hot spots, particularly within the form factor and associated constrained installation volume of the frame 210. In some circumstances, continued operation of components installed within the frame 210 can generate enough heat to create localized hot spots that cause user discomfort and / or exceed acceptable touch temperature thresholds. These localized hot spots can also affect the operation of one or more of the components 250 and / or the overall operation of the head-mounted wearable device 100. For example, an operating temperature of one or more of the components at or above a corresponding operating temperature threshold can require throttling of the operation of the one or more components and a corresponding throttling of one or more functional features of the head-mounted wearable device 100. Systems and methods according to implementations described herein may address the problem of hot spots arising from the operation of one or more of the components 250 by allowing heat generated by one or more components to move and / or spread laterally within their respective housings to maintain operation of one or more of the components 250. This may include spreading heat laterally within the material of the respective housings while insulating the heat from moving horizontally outwardly of one or more of the exterior surfaces of the respective housings. This may maintain internal temperatures within the respective housings within a set operating range and reduce or substantially eliminate hot spots on the exterior surfaces of the frame 210 that would otherwise exceed a temperature threshold for user comfort when wearing the head-mounted wearable device 100. In some examples, spreading heat in this manner may flatten out the hot spots over time, providing substantially uniform heat dissipation over time.

[0018] 3A is a close-up semi-transparent view of an exemplary section of one arm 230 of the exemplary frame 210 shown in FIGS. 2A-2D. In particular, FIG. 3A is a close-up semi-transparent view of section A of the arm 230A of the exemplary frame 210 shown in FIG. 2A. 3 3B is a cross-sectional view taken along line BB in FIG. 3A. FIG. 3C is a semi-transparent view of the front frame portion 220 of the example frame 210 shown in FIGS. 2A-2D. FIG. 3D is a cross-sectional view taken along line DD in FIG. 3C. FIG. 3E schematically illustrates an example layup of material forming one of the example housings shown in FIGS. 3A-3D. For purposes of explanation and illustration only, FIGS. 3A-3D illustrate the installation of the example component 250 within the interior installation volume defined within the arm portion 230 of the example frame 210 and within the front frame portion 220 of the example frame 210. The principles described herein may be applied to other components and / or other portions of the example frame 210.

[0019] The section of the arm portion 230 shown in FIGS. 3A and 3B is oriented such that, when the head-mounted wearable device 100 is worn by a user, a first side 231 (i.e., the side facing the user) of the arm portion 230 faces the user's head and a second side 232 (i.e., the side facing the world) of the arm portion 230 faces the physical environment. As shown in FIGS. 3A and 3B , the structure of the arm portion 230 forms a housing 300 or enclosure 300 that defines an interior space 350 or volume 350. The structure of the enclosure 300 defined by the arm portion 230 includes material formed by an intermediate layer 330 located between a first (inner) layer 310 and a second (outer) layer 320. In the example arrangement shown in FIGS. 3A and 3B , the exemplary component 250 is installed in the interior space 350 at a position corresponding to the first side 231 of the arm portion 230 of the frame 210.

[0020] In some examples, the housing 300 defined by the structure of the arm portion 230 may be an enclosure of composite or additional materials with thermal management elements integrated, incorporated, or embedded into the structure. In some examples, the thermal management elements are configured to allow customized heat diffusion and / or dissipation for specific placement of components at specific locations within the respective housing. In some examples, the first layer 310 may define the interior surface of the housing 300, and the second layer 320 may define the exterior surface of the housing 300. In some examples, the first layer 310 may be made of a material with relatively low thermal conductivity, e.g., a relatively low thermal conduction coefficient, such as, for example, a polycarbonate-based material, a plastic-based material, a resin-based material, an epoxy-based material, and other such materials. In some examples, the second layer 320 may be made of a material with relatively low thermal conductivity, e.g., a relatively low thermal conduction coefficient, such as, for example, a polycarbonate-based material, a plastic-based material, a resin-based material, an epoxy-based material, and other such materials. In some examples, the intermediate layer 330 may include a material having a relatively high thermal conductivity, e.g., a relatively high thermal conduction coefficient. For example, the intermediate layer 330 may include a material having a relatively high thermal conductivity compared to the thermal conductivity of the first layer 310 and / or the second layer 320. In some examples, the first layer 310 and / or the second layer 320 may define an insulating layer on either side of the intermediate layer 330.

[0021] In some examples, intermediate layer 330 may be configured to provide varying levels of thermal conductivity. For example, intermediate layer 330 may include multiple sections. In some examples, the multiple sections may be made of different materials with different thermal conductivities or different thermal conductivity coefficients. In some examples, the multiple sections may have different shapes and / or sizes and / or configurations to provide different thermal conductivities. In some examples, the multiple sections may be arranged based on their respective thermal conductivities to direct heat in desired directions.

[0022] In the example shown in FIGS. 3A and 3B , the intermediate layer 330 includes a first section 331 and a second section 332. In the example arrangement shown in FIGS. 3A and 3B , the thermal conductivity of the material of the first section 331 of the intermediate layer 330 may be relatively high, such as a material with thermal properties that provide for the dissipation of heat generated by one or more of the components 250. The material with thermal properties configured to dissipate heat may have a thermal conductivity greater than that of at least one adjacent / adjacent material. In particular, the thermal conductivity may be greater than that of each adjacent / adjacent material. In this example arrangement, the second section 332 may have a relatively low thermal conductivity. In some examples, the second section 332 may be formed of a material with thermal properties that provide little or no conductivity to inhibit further dissipation of heat. The material with thermal properties configured to inhibit further dissipation of heat may have a thermal conductivity less than that of at least one adjacent / adjacent material. In particular, the thermal conductivity may be less than that of each adjacent / adjacent material. Thus, the first section of intermediate layer 330 may be considered a thermal or thermally conductive layer, and the second section 332 of intermediate layer 330 may be considered a non-thermal or insulating layer. In some examples, the second section may be formed of a similar or substantially identical material to one or both of first layer 310 and / or second layer 320. In some examples, the material of second section 332 of intermediate layer 330 may exhibit insulating properties such that heat from first section 331 propagates to and does not propagate through second section 332 of intermediate layer 330.

[0023] In some examples, the first section 331 can be configured to provide heat diffusion or dissipation in a desired manner, including, for example, a desired direction, a desired rate, etc. relative to one or more components 250. For example, the shape of the first section 331 can draw heat generated by one or more components 250 in a desired direction toward a desired portion of the housing 300. The shape of the first section 331 and the interface between a peripheral portion of the first section 331 and a corresponding peripheral portion of the second section 332 can inhibit further diffusion or dissipation of heat from the first section 331 to the second section 332 due to the thermal conductivity of the second section 332. Thus, the boundary of the first section 331 against the corresponding peripheral second section 332 can maintain residual heat within the portion of the housing 300 corresponding to the first section 331 of the intermediate layer 330. In some examples, the rate of heat diffusion or dissipation along the first section 331 of the intermediate layer 330 may be based on, for example, the thermal conductivity of the material of the first section 331 of the intermediate layer 330. For example, a variety of different materials having a variety of different thermal conductivities may be used in the intermediate layer 330 to provide different levels of thermal conductivity.

[0024] 3B illustrates the lateral diffusion or dissipation of heat generated by one or more components 250 along the first section 331 of the intermediate layer 330 in the direction of arrow L. Further diffusion or dissipation of heat is inhibited at the interface between the first section 331 and the second section 332 (see, for example, region C shown in FIG. 3B ), where a peripheral portion of the first section 331 meets a corresponding peripheral portion of section 332. As shown in the inset of FIG. 3B , heat generated by one or more components 250 is drawn away from the one or more components and diffused or dissipated by the first section 331 of the intermediate layer 330 in direction L1. Further diffusion from the first section 331 to the second section 332 in direction L2 is inhibited because the thermal conductivity of the material of the second section 332 is relatively low compared to the thermal conductivity of the first section 331 of the intermediate layer 330. Similarly, the thermal conductivity of the material of the first and / or second layers 310, 320 is relatively low compared to the thermal conductivity of the first section 331 of the intermediate layer 330, thereby inhibiting horizontal diffusion or dissipation of heat in the direction of arrow T from the first section 331 of the intermediate layer 330 to the first layer 310 and / or the second layer 320.

[0025] Due to the relatively high thermal conductivity of the material of the intermediate layer 330 compared to the thermal conductivity of the material of the first layer 310 and / or the second layer 320, the heat can be diffused and dissipated by the lateral diffusion (in the direction of arrow L1 in FIG. 3B ) of the heat generated by the one or more components 250 and substantially maintained within the intermediate layer 330. That is, because the thermal conductivity of the intermediate layer 330 is relatively high compared to the thermal conductivity of the first layer 310 and / or the second layer 320, horizontal heat diffusion (in the direction of arrow T in FIG. 3B ) is suppressed. This substantially maintains heat within the intermediate layer 330 and maintains the outer surface of the second layer 320 (which defines the outer surface of the arm portion 230 of the exemplary frame 210 shown in FIGS. 3A and 3B ) at or below the threshold touch temperature, thereby maintaining user comfort during use of the head-mounted wearable device 100. This also prevents heat from entering the interior space 350 through the first layer 310, thereby enabling the interior space 350 within the housing 300 to be maintained below a threshold operating temperature of one or more components 250 installed in the interior space 350.

[0026] In the example shown in Figure 3B, one or more components 250 at least partially contact the first section 331 of the middle layer 330. That is, in the example arrangement shown in Figure 3B, a portion of the first layer 310 is cut away to allow one or more components 250 to at least partially contact the first section 331 of the middle layer 330. In some examples, First layer 310 One or more components 250 may be placed on the first layer 310 with the material interposed between the one or more components 250 and the first section 331 of the inner layer 330. When positioned in this manner, heat from a hot spot generated in a portion of the inner layer 310 corresponding to one or more components 250 may be transferred and diffused laterally to the corresponding portion of the first section 331 of the inner layer 330 in the direction of arrow L1, as described above.

[0027] In some examples, the configuration of the intermediate layer 330 may direct the diffusion or dissipation of heat in a desired direction, such as to a desired region or portion of the housing 300. For example, the shape or peripheral contour 335 of the first section 331 abutting a corresponding peripheral portion 337 of the second section 332 of the intermediate layer 330 may direct the diffusion or dissipation of heat generated by one or more components 250 in a desired direction toward a desired portion of the housing 300 corresponding to the peripheral contour 335 of the first section 331 of the intermediate layer 330. As described above, heat may be diffused or dissipated through the first section 331 and may be inhibited from diffusing or dissipating into the second section 332 based on the relative thermal properties of the first and second sections 331, 332 of the intermediate layer 330. Thus, the diffusion and / or dissipation of heat may be controlled, at least in part, by the shape and / or contour of the first section 331 relative to the second section 332 of the intermediate layer 330 of the structure forming the housing 300.

[0028] A similar approach may be taken when providing for heat diffusion or dissipation within the front frame portion 220 of the exemplary frame 210. The front frame portion 220 shown in Figures 3C and 3D is oriented so that, when the head-mounted wearable device 100 is worn by a user, a first side 221 (i.e., the side facing the user) of the front frame portion 220 faces the user's head and a second side 222 (i.e., the side facing the world) of the front frame portion 220 faces the physical environment. The structure of the front frame portion 220 forms a housing 380 or enclosure 380 that defines an interior space 385 or volume 385. In the example shown in Figures 3C and 3D, one or more components 250 are located in a portion of the front frame portion 220 proximate the hinge portion 240 solely for purposes of explanation and illustration.

[0029] The structure of the housing 380 defined by the front frame portion 220 may include a layup of materials similar to those described above with respect to the arm portion 230 shown in FIGS. 3A and 3B . That is, the material may include an intermediate layer 330 positioned between a first (inner) layer 310 and a second (outer) layer 320. The material of the front frame portion 220 may be the same / similar to or different from the material of the arm portion 230. As noted above, the structure of the front frame portion 220 may include an encapsulation of composite or additional materials with thermal management elements integrated, incorporated, or embedded into the structure, thereby enabling customized heat spreading and / or dissipation for specific installations of components at specific locations within the housing 380. In some examples, the first layer 310 may define the inner surface of the housing 380, and the second layer 320 may define the outer surface of the housing 380. Intermediate layer 330 may include a material having a relatively high thermal conductivity, particularly compared to the thermal conductivity of first layer 310 and / or second layer 320. In some examples, first layer 310 and / or second layer 320 may define insulating layers on either side of intermediate layer 330 of housing 380.

[0030] The structure of the intermediate layer 330 shown in Figures 3C and 3D is conceptually similar to that described above with respect to Figures 3A and 3B and may include a first section 331 made of a material having a relatively high thermal conductivity to provide diffusion or dissipation of heat generated by one or more components 250, and a second section 332 having a relatively low thermal conductivity (i.e., providing little or no thermal conductivity) so that heat from the first section 331 propagates to the second section 332 of the intermediate layer 330 and does not propagate through the second section 332.

[0031] As described above, the first section 331 may be configured to provide heat diffusion or dissipation in a desired manner, including, for example, in a desired direction, at a desired rate, etc., relative to one or more components 250. This may enable the system to maintain the temperature of the interior space 385 at or below a threshold operating temperature of one or more components and maintain a touch temperature at the exterior surface of the front frame portion 220 at or below a touch temperature threshold. For example, the shape of the first section 331 may draw heat generated by one or more components 250 in a desired direction toward a desired portion of the housing 300, such as away from the user's face and toward a portion of the housing where no components are located. The shape of the first section 331 and the interface between a peripheral portion of the first section 331 and a corresponding peripheral portion of the second section 332 may inhibit further diffusion or dissipation of heat from the first section 331 to the second section 332 due to the thermal conductivity of the second section 332.

[0032] 3A and 3B, the configuration (i.e., shape, peripheral contour, thickness, etc.) of the first section 331 and the second section 332 of the intermediate layer 330 provides for lateral diffusion of heat while inhibiting horizontal diffusion of heat generated by one or more components 250 located in the interior space 385 of the housing 380. For example, the first and second sections 331, 332 of the intermediate layer 330 may be configured to draw heat generated by one or more components away from the user's face and toward portions of the housing 380 where no or few components are located.

[0033] Because the second section 332 of the intermediate layer 330 has a relatively low thermal conductivity and the first and second layers 310, 320 have relatively low thermal conductivity compared to the intermediate layer 330, heat is substantially maintained within the first section 331 of the intermediate layer 330. This maintains the outer surface of the second layer 320 (which defines the outer surface of the front frame portion 220 of the exemplary frame 210) at or below a threshold touch temperature, thereby maintaining user comfort when using the head-worn wearable device 100. This also inhibits heat from entering the interior space 385 through the first layer 310, thereby maintaining the interior space 385 within the housing 380 at or below a threshold operating temperature of one or more components 250 installed in the interior space 385.

[0034] As noted above, in some examples, first layer 310 and / or second layer 320 may include a material having a relatively low thermal conductivity. In some examples, first layer 310 and / or second layer 320 may provide insulation. In some examples, first layer 310 and / or second layer 320 may include polycarbonate-based materials, plastic-based materials, resin-based materials, epoxy-based materials, and other such materials that may have a relatively low thermal conductivity and may provide some insulation. In some examples, first layer 310 and second layer 3 2 0 are substantially the same material. In some examples, the first layer and the second layer 320 are different materials.

[0035] In some examples, at least a portion of intermediate layer 330 includes a material having a relatively high thermal conductivity. Such materials may include, for example, aluminum-based materials, copper-based materials, graphite-based materials, and other materials that can provide thermal conductivity within the layered stack of materials that form housing 300. In some examples, at least a portion of intermediate layer 330 includes a material having a relatively low thermal conductivity. Such materials may include, for example, polycarbonate-based materials, plastic-based materials, resin-based materials, epoxy-based materials, and other such materials that may have relatively low thermal conductivity and may provide some insulation. In some examples, intermediate layer 330 includes multiple sections, including at least one section (i.e., first section 331) made of a material having a relatively high thermal conductivity and at least one section (i.e., second section 332) made of a material having a relatively low thermal conductivity.

[0036] The above thermal management strategies can be achieved by incorporating inner layers within the enclosure of composite or additional materials that allow for custom tailoring of lateral (diffusion) and vertical (through-hole) thermal paths within the enclosure (i.e., the above-described enclosures 300, 380 and other such enclosures) in which heat-generating components are installed. When configured in this manner, a smaller internal volume (i.e., internal space 350, 385) can accommodate placement of heat-generating components closer to the exterior of the enclosure while balancing the thermal load. The above thermal management strategies can increase the heat dissipation surface area of ​​the device in which the components are installed and flatten hot spots caused by the internally installed components, thereby increasing the operating time (especially continuous operating time) of high-power experiences and enabling devices with smaller overall form factors to achieve higher overall power experiences. This is illustrated in the surface temperature plots shown in Figures 4A and 4B.

[0037] FIG. 4A(1) is a surface temperature plot of a first side of an exemplary housing or enclosure, such as the exemplary housing or enclosure 300, 380 described above or other such housings or enclosures, with a heat-generating component installed therein, and FIG. 4A(2) is a surface temperature plot of a second side thereof. In FIGS. 4A(1) and 4A(2), the enclosure is made of a stack of laminated materials including multiple plastic-based layers. As shown in FIG. 4A(1), without a thermal mitigation strategy such as those described above, operation of the heat-generating component would result in a hot spot on the installed side of the enclosure with a peak temperature of approximately 114 degrees Celsius. In the example shown in FIGS. 4A(1) and 4A(2), the enclosure material experiences a temperature gradient of approximately 89 degrees Celsius.

[0038] FIG. 4B(1) is a surface temperature plot of a first side of an exemplary enclosure, such as the exemplary enclosures 300, 380 described above or other such enclosures, as shown in FIG. 4B(3), with a heat-generating component installed inside, and FIG. 4B(2) is a surface temperature plot of a second side thereof. In FIGS. 4B(1) and 4B(2), the enclosure is comprised of a stack of laminated materials including inner and outer layers formed of a plastic-based material and an intermediate layer between the inner and outer layers comprising an aluminum material. In this example, the intermediate layer is substantially fully embedded between the mating surfaces of the first and second layers of the enclosure, as shown in FIG. 4B(3). As shown in FIG. 4B(1), incorporating the embedded aluminum-based layer as described above reduces the peak temperature of the hot spot on the installed side of the enclosure to approximately 42 degrees Celsius when the heat-generating component is operating. In the example shown in FIGS. 4B(1)-4B(3), adding the intermediate layer comprising an aluminum material as shown reduces the temperature gradient to approximately 4 degrees Celsius.

[0039] FIG. 4C(1) is a surface temperature plot of a first side of an exemplary enclosure, such as the exemplary enclosures 300, 380 described above or other such enclosures, as shown in FIG. 4C(3), with a heat-generating component installed inside, and FIG. 4C(2) is a surface temperature plot of a second side thereof. In FIGS. 4C(1) and 4C(2), the enclosure is comprised of a laminated material stack including inner and outer layers formed of a plastic-based material and an intermediate layer between the inner and outer layers comprising an aluminum material. In particular, in this example, the intermediate layer is comprised of a structured aluminum and plastic material that defines a thermal path in the area where the aluminum material is located. That is, in this example, the intermediate layer is contoured or shaped to direct heat diffusion or dissipation in a desired direction in an enclosure such as that shown in FIG. 4C(3). As shown in FIG. 4C(1), incorporating the embedded aluminum structured layer as described above reduces the peak temperature of a hot spot on the installed side of the enclosure to approximately 54 degrees Celsius when a heat-generating component is operating, enabling specific control of the heat dissipation surface. In the example shown in Figures 4C(1) to 4C(3), the temperature gradient is reduced to about 27 degrees Celsius by adding an intermediate layer containing an aluminum material as shown.

[0040] For devices such as exemplary head-mounted wearable device 100 (and other such devices having relatively small form factors), to maintain the desired relatively small form factor, a typical overall thickness of the housing of head-mounted wearable device 100 (such as exemplary housing 300, 380 or other such housings) may be about 6.0 mm to about 15 mm, and a typical wall thickness may be about 0.6 mm to 0.8 mm. Conventional material fabrication techniques cannot embed the above types of thermal management measures into the construction of these types of thin-walled housings while providing internal installation volume and maintaining the desired relatively small form factor.

[0041] In some examples, thermoforming or compression molding techniques can be adapted to manufacture thin-walled enclosures (such as the enclosures 300, 380 described above or other such enclosures) that include the exemplary thermal management measures described above. That is, thermoforming techniques can be used to manufacture a bonded layered stack of materials that includes, for example, a plastic-based thin film, a sheet of thermal material (e.g., an aluminum sheet, a copper sheet, a graphite sheet, or other such material), and another plastic-based thin film. The sheet of thermal material can be stamped, as described above, so that the shape and / or contour of the thermal material provides a desired thermal path for heat dissipation. The layered film can be positioned on a mold, and heat and / or pressure and / or vacuum can be applied to the mold to form a bonded / laminate stack of materials with the thermal material embedded as an inner layer. The resulting bonded / laminate stack of materials can form a non-uniform thin-walled enclosure. In some examples, additive manufacturing techniques can be adapted to manufacture thin-walled enclosures (such as the enclosures 300, 380 described above or other such enclosures) that include the exemplary thermal management measures described above. For example, additive manufacturing can be used to produce thin thermal structures including the thermal materials described above. For example, a sintered metal matrix in the form of a thermal layer can be added to a layered stack of materials including a plastic-based layer to form a desired housing. The resulting layered stack of materials can form a non-uniform, thin-walled housing. Furthermore, the sintered metal matrix thermal structure can be placed in an injection molding machine to overmold or insert mold a plastic or other high-flow material around the thermal layer to produce a non-uniform, thin-walled housing. These manufacturing methods can produce thin-walled structures with a relatively small overall form factor, desired for head-mounted wearable devices in the form of smart glasses or augmented reality glasses, while providing thermal management / heat diffusion and dissipation and preserving interior space / installation volume to accommodate components within the housing.

[0042] Some examples are given below. Example 1: A wearable computing device may include a frame and a housing formed by a portion of the frame, the housing defining an interior space. The housing may include a first layer defining an interior surface of the housing, a second layer defining an exterior surface of the housing, and an intermediate layer positioned between the first layer and the second layer. The intermediate layer may include a first section including a first material having thermal properties configured to dissipate heat generated by at least one heat-generating component disposed in the interior space of the housing, and a second section including a second material having thermal properties configured to inhibit further dissipation of heat through the housing.

[0043] Example 2: The wearable computing device of Example 1, wherein the wearable computing device is a head-mounted wearable computing device. The frame may include a front frame portion, a first arm portion rotatably coupled to a first end of the front frame portion, and a second arm portion rotatably coupled to a second end of the front frame portion.

[0044] Example 3: The wearable computing device of Example 2, wherein the housing is defined in at least one of the front frame portion, the first arm portion, or the second arm portion.

[0045] Example 4: The wearable computing device of any one of the preceding examples, wherein the first layer may be a polycarbonate-based material. The second layer may be a polycarbonate-based material. The first section of the intermediate layer may be one of an aluminum material, a copper material, or a graphite material. The second section of the intermediate layer may be a polycarbonate-based material. The material of each of the first layer, the second layer, the first section of the intermediate layer, and the second section of the intermediate layer may be realized separately from the material of the remaining three of the first layer, the second layer, the first section of the intermediate layer, and the second section of the intermediate layer.

[0046] Example 5: The wearable computing device of any one of the preceding examples, wherein the thermal conductivity of the first material of the first section of the intermediate layer is greater than the thermal conductivity of the second material of the second section of the intermediate layer.

[0047] Example 6: The wearable computing device of any one of the preceding examples, wherein the thermal conductivity of the first material of the first section of the intermediate layer is greater than the thermal conductivity of the first layer, and / or the thermal conductivity of the first material of the first section of the intermediate layer is greater than the thermal conductivity of the second layer.

[0048] Example 7: The wearable computing device of any one of the preceding examples, wherein the housing includes a compression-molded, non-uniform, heat-dissipating housing including a bonded layered stack of materials, the bonded layered stack including the first layer, the second layer, and the intermediate layer.

[0049] Example 8: The wearable computing device of Example 7, wherein the first layer is a thin-film plastic-based layer, the middle layer is a contoured sheet of thermal material, the contoured sheet of thermal material defining a thermal path from the at least one heat-generating component through the housing, and the second layer is a thin-film plastic-based layer.

[0050] Example 9: The wearable computing device of any one of Examples 1 to 6, wherein the housing comprises a sintered heterogeneous heat dissipating housing formed of a laminated stack of materials. The first layer may be a plastic-based layer. The middle layer may be a sintered metal matrix layer. The second layer may be a plastic-based layer.

[0051] Example 10: The wearable computing device of any one of the preceding examples, wherein a peripheral contour of the first section of the intermediate layer corresponds to a thermal path within the housing for dissipating heat generated by the at least one heat-generating component.

[0052] Example 11: The wearable computing device of any one of the preceding examples, wherein a peripheral contour of the second section of the intermediate layer is confined to the first section of the intermediate layer such that further spread of heat is inhibited by a boundary between the first section and the second section. 1 is complementary to the above peripheral contour of the section.

[0053] Example 12: A head-mounted wearable computing device may include a frame. The frame may include a front frame portion and a pair of arms coupled to opposite ends of the front frame portion. The head-mounted wearable computing device may include a housing formed by at least one of the front frame portion or one of the pair of arms, the housing defining an interior space. The housing may include a first layer defining an interior surface of the housing, a second layer defining an exterior surface of the housing, and an intermediate layer positioned between the first layer and the second layer, the intermediate layer including a thermal layer. The shape of the thermal layer may define a thermal path for diffusing heat generated by at least one heat-generating component installed in the interior space of the housing. To suppress horizontal diffusion of heat from the thermal layer to the first layer and the second layer, the thermal layer may have a thermal conductivity coefficient greater than that of the first layer and greater than that of the second layer.

[0054] Example 13: A head-mounted wearable device of Example 12, wherein the intermediate layer includes an insulating layer located laterally adjacent to the thermal layer, and the thermal conductivity coefficient of the thermal layer is greater than the thermal conductivity coefficient of the insulating layer to suppress lateral diffusion of heat from the thermal layer to the insulating layer.

[0055] Example 14: The head-mounted wearable computing device of Example 12 or Example 13, wherein the peripheral contour of the thermal layer corresponds to a thermal path within the housing for dissipating heat generated by the at least one heat-generating component, and the peripheral contour of the insulating layer is complementary to the peripheral contour of the thermal layer such that further dissipation of heat is inhibited by an interface between the thermal layer and the insulating layer.

[0056] Example 15: The head-mounted wearable computing device of any one of Examples 12 to 13, wherein the first layer may be a polycarbonate-based material. The second layer may be a polycarbonate-based material. The thermal layer of the intermediate layer may be one of an aluminum material, a copper material, or a graphite material. The insulating layer of the intermediate layer may be a polycarbonate-based material. The material of each of the first layer, the second layer, the thermal layer of the intermediate layer, and the insulating layer of the intermediate layer may be realized separately from the material of the remaining three of the first layer, the second layer, the thermal layer of the intermediate layer, and the insulating layer of the intermediate layer.

[0057] Example 16: The head-mounted wearable computing device of any one of Examples 12 to 14, wherein the housing comprises a compression-molded, non-uniform, heat-dissipating housing including an adhered layered stack of material including the first layer, the second layer, and the intermediate layer. The first layer may be a thin-film plastic-based layer. The thermal layer may be a contoured sheet of thermal material, the contoured sheet of thermal material defining a thermal path from the at least one heat-generating component through the housing. The second layer may be a thin-film plastic-based layer.

[0058] Example 17: The head-mounted wearable computing device of Example 12, wherein the housing comprises a sintered heterogeneous heat-dissipating housing formed of a laminated stack of materials. The first layer may be a plastic-based layer. The thermal layer may be a sintered metal matrix layer. The second layer may be a plastic-based layer.

[0059] Specific structural and functional details disclosed herein are merely representative for purposes of describing example embodiments, however, example embodiments may be embodied in many alternative forms and should not be construed as limited to only the embodiments set forth herein.

[0060] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. It will be further understood that the terms "comprises" and / or "includes" as used herein specify the presence of stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof.

[0061] When an element is referred to as being "coupled," "connected," or "responsive to," or "on" another element, it will be understood that an element may be directly coupled to, connected to, responsive to, or directly on the other element, or that there may be additional intervening elements. In contrast, when an element is referred to as being "directly coupled," "directly connected," or "directly responsive to," or "directly on" another element, there are no intervening elements present. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0062] Spatially relative terms such as "below," "below," "below," "above," and the like may be used herein to simplify the description of the relationship of one element or feature to another as depicted in the figures. It will be understood that the spatially relative terms are intended to encompass various orientations during use or operation of the device, in addition to the orientation depicted. For example, if the device in the figures were turned over, elements described as being "below" or "below" other elements or features would then be oriented "above" those other elements or features. Thus, the term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 70 degrees or otherwise) and the spatially relative descriptors used herein may be interpreted accordingly.

[0063] Exemplary embodiments of the concepts are described herein with reference to cross-section illustrations that are schematic illustrations of idealized embodiments (and intermediate structures) of the exemplary embodiments. As such, variations from the shapes of the illustrations are to be expected as a result, for example, of manufacturing techniques and / or tolerances. Thus, exemplary embodiments of the described concepts should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. Accordingly, the illustrated regions are schematic in nature and the shapes are not intended to represent the actual shape of a region of a device, nor are they intended to limit the scope of the exemplary embodiments.

[0064] It will be understood that terms such as "first," "second," and the like may be used herein to describe various elements, but these elements should not be limited by these terms. These terms are merely used to distinguish one element from another. Thus, a "first" element could be termed a "second" element without departing from the teachings of the present embodiments.

[0065] Unless otherwise defined, terms used herein (including technical and scientific terms) have the same meaning as commonly understood by those skilled in the art to which these concepts belong. Furthermore, terms such as those defined in commonly used dictionaries should be interpreted to have a meaning consistent with their meaning in the relevant art and / or the context of this specification, and will not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0066] While certain features of the described implementations have been described as set forth herein, many variations, substitutions, changes, and equivalents will occur to those skilled in the art. It is therefore to be understood that the appended claims are intended to cover all such variations and modifications that are within the scope of the implementations. They have been presented by way of example only, and not by way of limitation, and it is to be understood that various changes in form and details may be made. Any portion of the apparatus and / or methods described herein may be combined in any combination except in mutually exclusive combinations. The implementations described herein may include various combinations and / or subcombinations of the functions, components, and / or features of the various implementations described.

Claims

1. The frame and a housing formed by a portion of the frame, the housing defining an interior space, the housing comprising: a first layer defining an interior surface of the housing; a second layer defining an exterior surface of the housing; an intermediate layer located between the first layer and the second layer, the intermediate layer comprising: a first section including a first material having thermal properties configured to dissipate heat generated by at least one heat-generating component disposed in the interior space of the housing and in thermal contact with the at least one heat-generating component; a second section including a second material having thermal properties configured to inhibit further spread of heat through the housing.

2. The wearable computing device is a head-mounted wearable computing device, and the frame comprises: The front frame and a first arm portion rotatably coupled to a first end portion of the front frame portion; and a second arm portion rotatably coupled to a second end of the front frame portion.

3. The wearable computing device of claim 2 , wherein the housing is defined in at least one of the front frame portion, the first arm portion, or the second arm portion.

4. the housing is defined by the first arm portion, 3. The wearable computing device of claim 2, wherein the first section is in contact with the second section in a direction perpendicular to a direction in which the user and the physical environment are separated from each other in a cross section of the first arm portion perpendicular to a longitudinal direction of the first arm portion.

5. the housing is defined by the front frame portion, a first portion of the front frame portion on a user's side relative to the interior space includes a stack of the first layer, the first section, and the second layer; The wearable computing device of claim 2 , wherein a second portion of the front frame portion on a side of the interior space facing the physical environment includes a stack of the first layer, the second section, and the second layer.

6. the first layer is a polycarbonate-based material; the second layer is a polycarbonate-based material; the first section of the intermediate layer is one of an aluminum material, a copper material, or a graphite material; The wearable computing device of claim 1 , wherein the second section of the intermediate layer is a polycarbonate-based material.

7. 6. The wearable computing device of claim 1, wherein a thermal conductivity coefficient of the first material of the first section of the intermediate layer is greater than a thermal conductivity coefficient of the second material of the second section of the intermediate layer.

8. the thermal conductivity coefficient of the first material of the first section of the intermediate layer is greater than the thermal conductivity coefficient of the first layer; and / or 6. The wearable computing device of claim 1, wherein the thermal conductivity of the first material of the first section of the intermediate layer is greater than the thermal conductivity of the second layer.

9. 6. The wearable computing device of claim 1, wherein the housing comprises a compression-molded, non-uniform, heat-dissipating housing including a bonded layered stack of materials including the first layer, the second layer, and the intermediate layer.

10. the first layer is a thin film plastic-based layer; the intermediate layer is a contoured sheet of thermal material, the contoured sheet of thermal material defining a thermal path from the at least one heat-generating component through the housing; The wearable computing device of claim 9 , wherein the second layer is a thin film plastic-based layer.

11. the housing comprises a sintered non-uniform heat dissipating housing formed from a laminated stack of materials; the first layer is a plastic-based layer; the intermediate layer is a sintered metal matrix layer; The wearable computing device of claim 1 , wherein the second layer is a plastic-based layer.

12. 6. The wearable computing device of claim 1, wherein a peripheral contour of the first section of the intermediate layer corresponds to a thermal path within the housing for dissipating heat generated by the at least one heat-generating component.

13. 6. The wearable computing device of claim 1, wherein a peripheral contour of the second section of the intermediate layer is complementary to the peripheral contour of the first section of the intermediate layer such that further spread of heat is inhibited by a boundary between the first and second sections.

14. a frame, the frame comprising: The front frame and a pair of arms connected to both ends of the front frame; a housing formed by at least one of the front frame portion and one arm portion of the pair of arm portions, the housing defining an internal space, the housing comprising: a first layer defining an interior surface of the housing; a second layer defining an exterior surface of the housing; an intermediate layer located between the first layer and the second layer, the intermediate layer including a thermal layer in thermal contact with a heat-generating component; the shape of the thermal layer defines a thermal path for diffusing heat generated by at least one heat-generating component installed in the internal space of the housing; a thermal conductivity coefficient of the thermal layer is greater than a thermal conductivity coefficient of the first layer and greater than a thermal conductivity coefficient of the second layer; A head-mounted wearable computing device, wherein the intermediate layer includes an insulating layer positioned laterally adjacent to the thermal layer, and the thermal conductivity coefficient of the thermal layer is greater than the thermal conductivity coefficient of the insulating layer.

15. the housing is defined by one of the pair of arms, 15. The head-mounted wearable computing device of claim 14, wherein the thermal layer contacts the insulating layer in a direction perpendicular to the direction in which the user and the physical environment are separated from each other in a cross section of one of the pair of arm portions perpendicular to the longitudinal direction of the one of the pair of arm portions.

16. a peripheral contour of the thermal layer corresponding to the thermal path within the housing for dissipating heat generated by the at least one heat-generating component; 16. A head-mounted wearable computing device as described in claim 14 or claim 15, wherein the peripheral contour of the insulating layer is complementary to the peripheral contour of the thermal layer such that further spread of heat is inhibited by the boundary between the thermal layer and the insulating layer.

17. the first layer is a polycarbonate-based material; the second layer is a polycarbonate-based material; the thermal layer of the intermediate layer is one of an aluminum material, a copper material, or a graphite material; 16. The head-mounted wearable computing device of claim 14 or claim 15, wherein the insulating layer of the intermediate layer is a polycarbonate-based material.

18. the housing comprises a compression molded non-uniform heat dissipating housing including a bonded layered stack of materials including the first layer, the second layer, and the intermediate layer; the first layer is a thin film plastic-based layer; the thermal layer is a contoured sheet of thermal material, the contoured sheet of thermal material defining the thermal path from the at least one heat-generating component through the housing; 16. A head-mounted wearable computing device as described in claim 14 or claim 15, wherein the second layer is a thin film plastic-based layer.

19. the housing comprises a sintered non-uniform heat dissipating housing formed from a laminated stack of materials; the first layer is a plastic-based layer; the thermal layer is a sintered metal matrix layer; 16. The head-mounted wearable computing device of claim 14 or claim 15, wherein the second layer is a plastic-based layer.

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