Voice-controlled electronic device and voice-controlled speaker
The array speaker design with axisymmetric housing and radial driver distribution, along with vibration-reducing grommets and touch-sensitive interfaces, addresses directional issues and vibration problems, achieving uniform audio and reduced noise in compact configurations.
Patent Information
- Application Number
- JP2025061420
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2017-06-02
- Filing Date
- 2025-04-02
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2037-08-11
AI Technical Summary
Conventional speakers often create dead spots in a room due to their directional nature and can cause vibration excursions, especially with subwoofers, leading to noise and movement, necessitating improvements in speaker design for uniform audio performance and reduced vibrations.
An array speaker design featuring an axisymmetric housing with radially distributed audio driver assemblies, a power supply unit between drivers, and a subwoofer with a magnet having radially protruding lobes, along with elastomeric grommets to minimize vibrations, and a user interface with touch-sensitive controls and LED illumination.
The design achieves uniform audio distribution across a room, reduces vibrations and noise, and allows for compact speaker configurations with improved audio quality and user interaction.
Smart Images

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Abstract
Description
[Technical Field]
[0001] This disclosure applies generally to speakers, and in particular to arrays of speakers housed within cylindrical enclosures. [Background technology]
[0002] (CROSS-REFERENCE TO RELATED APPLICATIONS) This application claims priority to U.S. patent application Ser. No. 15 / 613,054, filed June 2, 2017, U.S. patent application Ser. No. 15 / 613,060, filed June 2, 2017, U.S. patent application Ser. No. 15 / 613,063, filed June 2, 2017, U.S. patent application Ser. No. 15 / 613,066, filed June 2, 2017, U.S. patent application Ser. No. 15 / 613,073, filed June 2, 2017, and U.S. patent application Ser. No. 15 / 613,079, filed June 2, 2017, which are hereby incorporated by reference. Each of these applications claims the benefit of priority to U.S. Provisional Patent Application No. 62 / 399,165, filed September 23, 2016; U.S. Provisional Patent Application No. 62 / 399,229, filed September 23, 2016; U.S. Provisional Patent Application No. 62 / 399,262, filed September 23, 2016; U.S. Provisional Patent Application No. 62 / 399,293, filed September 23, 2016; U.S. Provisional Patent Application No. 62 / 399,288, filed September 23, 2016; and U.S. Provisional Patent Application No. 62 / 507,007, filed May 16, 2017.
[0003] Conventional speakers are generally directional in nature, which can have the effect of leaving dead spots in a room. To achieve a substantially uniform level of audio performance throughout a room, an array of large speakers is often distributed around the room. Conventional speakers can also be subject to vibration excursions in certain playback regimes. For example, a subwoofer can cause significant noise and / or movement of the speaker depending on the volume and frequency of the music being played. Therefore, further improvements in speaker design are desirable. Summary of the Invention
[0004] This disclosure describes various embodiments relating to electronic devices incorporating a speaker or an array of speakers.
[0005] An array speaker is disclosed that includes an axisymmetric equipment housing, a plurality of audio driver assemblies distributed radially around the interior of the axisymmetric equipment housing, and a power supply unit disposed between two or more of the audio driver assemblies.
[0006] An electronic device is disclosed that includes audio driver assemblies arranged in a circular configuration within an electronic device housing, with the diaphragm of each audio driver assembly arranged such that acoustic waves generated by the diaphragm are initially directed toward a central region of the circular configuration.
[0007] An electronic device is disclosed that includes an axisymmetric device and an array of audio driver assemblies disposed within the axisymmetric housing at regular radial intervals, each of the audio driver assemblies configured to generate acoustic waves that exit the substantially axisymmetric housing through an acoustic vent defined by a downwardly facing end of the axisymmetric housing.
[0008] An electronic device is disclosed that includes a subwoofer having a diaphragm, a coil coupled to the diaphragm and configured to generate a varying magnetic field, and a permanent magnet configured to interact with the varying magnetic field generated by the coil to move the diaphragm axially, the permanent magnet including lobes projecting radially therefrom.
[0009] A speaker is disclosed that includes an equipment housing and a subwoofer disposed within the equipment housing and having a diaphragm configured to oscillate in a direction aligned with a longitudinal axis of the equipment housing, the subwoofer including a permanent magnet with a plurality of protrusions distributed at regular radial intervals around the longitudinal axis of the equipment housing.
[0010] An electronic device is disclosed that includes an equipment housing, a subwoofer disposed in the equipment housing, the subwoofer including a permanent magnet having radially protruding lobes, an audio driver assembly disposed within the equipment housing, and a capacitor configured to provide power to the audio driver assembly and disposed between two of the lobes.
[0011] An audio driver is disclosed that includes a driver housing defining an audio exit opening, a diaphragm disposed within the driver housing, and a phase plug assembly disposed between the diaphragm and the audio exit opening, wherein the diaphragm and the phase plug assembly separate a front volume from a rear volume, with a portion of the rear volume extending beyond the diaphragm toward the audio exit opening.
[0012] An array speaker is disclosed, the array speaker including: a first audio driver assembly disposed between a second audio driver assembly and a third audio driver assembly and including a driver housing defining an audio exit opening; a diaphragm disposed within the driver housing; and a phase plug disposed between the diaphragm and the audio exit opening, the phase plug separating a front volume from a rear volume, a portion of the rear volume extending beyond the diaphragm toward the audio exit opening.
[0013] An audio driver assembly is disclosed that includes a driver housing defining an audio exit opening, a phase plug separating a front volume from a rear volume, the phase plug having a portion of the rear volume extending toward the audio exit opening, a U-cup engaging the phase plug to define an interior volume, a diaphragm disposed within the interior volume, the diaphragm coupled to a conductive coil configured to generate a varying magnetic field, and a driver magnet coupled to the U-cup and configured to interact with the varying magnetic field. Interaction between the varying magnetic field and a portion of the magnetic field disposed in an air gap located between a top plate and an inward-facing wall of the U-cup causes the diaphragm to vibrate within the interior volume.
[0014] A speaker is disclosed that includes an equipment housing, a user interface assembly disposed at an end of the equipment housing, a printed circuit board (PCB) secured to an inward-facing surface of the user interface assembly, and a subwoofer configured to force air toward the PCB during operation of the speaker.
[0015] An electronic device is disclosed that includes a device housing, a user interface assembly, a printed circuit board (PCB) secured to an inward-facing surface of the user interface assembly, and an audio component having a diaphragm configured to force air toward the PCB during operation of the electronic device.
[0016] An array speaker is disclosed that includes an array of audio driver assemblies arranged in a circular geometric shape, a speaker housing defining an audio exit channel for each of the audio driver assemblies, and a base supporting the speaker housing, the base having a smaller diameter than the speaker housing, a surface of the base cooperating with the surface of the speaker housing to define an outlet area for the audio exit channel, and a first distance from a periphery of the base to an outer edge of the speaker housing that is greater than a second distance from a distal end of the base to a downward-facing surface of the speaker housing.
[0017] An electronic device is disclosed that includes an axisymmetric instrument housing, an audio driver assembly disposed within the axisymmetric instrument housing, and a base having a diameter substantially smaller than that of the axisymmetric instrument housing, the base cooperating with a downwardly facing surface of the axisymmetric instrument housing to define an audio exit area shaped to diffuse acoustic waves generated by the audio driver assembly as the acoustic waves exit the axisymmetric instrument housing.
[0018] An electronic device is disclosed that includes an electronic device housing having an upper housing component and a lower housing component, an annular support member that engages with threads defined by the lower housing component, a subwoofer coupled to the annular support member, and a fastener that extends through an opening defined by the upper housing component and engages the annular support member.
[0019] An electronic device is disclosed that includes an instrument housing including a first housing component and a second housing component that cooperate to define an interior volume, an annular support member disposed within the interior volume and engaging threads arranged along an inwardly facing surface of the first housing component, and an audio component coupled to the annular support member, the audio component including a diaphragm configured to vibrate in a direction aligned with a longitudinal axis of the instrument housing.
[0020] A speaker device is disclosed that includes an axisymmetric device housing including an upper housing component and a lower housing component coupled to the upper housing component; a support structure that engages with threads disposed along an inwardly facing surface of the lower housing component and includes a first annular member and a second annular member coupled to the first annular member; a subwoofer coupled to the support structure and blocking a central opening defined by the support structure; and a fastener that extends through the opening defined by the upper housing component and engages the annular support member.
[0021] A user interface is disclosed that includes an exterior surface configured to receive touch input, light sources configured to direct light toward the exterior surface and arranged in a lens pattern, and an integrated lens array disposed between the light sources and the exterior surface, the lens array including lenses arranged in the lens pattern, each of the lenses protruding from a transparent substrate and having a surface facing a respective one of the light sources.
[0022] An electronic device is disclosed that includes a device housing and a user interface arranged along an exterior surface at a first end of the device housing, the user interface including light sources configured to illuminate an area of the exterior surface and an integrated lens array including lenses arranged in a lens pattern, each of the lenses protruding from a transparent substrate and having a concave surface facing a respective one of the light sources.
[0023] A speaker device is disclosed, the speaker device including: an appliance housing; a speaker driver assembly disposed within the appliance housing; and a user interface, the user interface configured to receive touch input; a decorative surface arranged along an outer surface of the appliance housing; a light source configured to emit light toward the decorative surface; and a lens array disposed between the light source and the decorative surface, the lens array including lenses arranged in a lens pattern, each of the lenses protruding from a transparent substrate and having a concave surface facing a corresponding one of the light sources.
[0024] Other aspects and advantages of the present invention will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, which illustrate, by way of example, the principles of the described embodiments. [Brief explanation of the drawings]
[0025] The present disclosure will be readily understood from the following detailed description taken in conjunction with the accompanying drawings, in which like reference numerals indicate like structural elements. [Figure 1] FIG. 1 is a perspective view of an array speaker. [Figure 2A] FIG. 1 is a cross-sectional view of the array speaker, showing only the components arranged in the lower third of the array speaker. [Figure 2B] FIG. 1 is a simplified diagram of one side of an array speaker and associated audio exit channels. [Figure 2C] 1 shows an internal schematic diagram of an audio exit channel associated with one of the audio drivers of the array speaker, illustrating how acoustic waves propagate through the audio exit channel. [Figure 3A] FIG. 3 is a cross-sectional view of the array speaker taken along the cutting line AA in FIG. 2. [Figure 3B] FIG. 3 is a cross-sectional view of the array speaker taken along the cutting line BB in FIG. 2. [Figure 4] FIG. 1 is a perspective view of multiple driver assemblies. [Figure 5A] FIG. 2 is a perspective view of a rear portion of the driver assembly. [Figure 5B] 10A-10C are cross-sectional views of different embodiments in which fasteners are used as part of the conductive path. [Figure 5C] 10A-10C are cross-sectional views of different embodiments in which fasteners are used as part of the conductive path. [Figure 6] FIG. 2 is an exploded view of the driver assembly. [Figure 7] FIG. 2 is a cross-sectional view of the driver assembly. [Figure 8] FIG. 1 is a cross-sectional view of an array speaker, showing only the components within the central portion of the array speaker. [Figure 9A] 1 shows a subwoofer including a magnet, the magnet extending radially from the subwoofer. [Figure 9B] 9B shows the subwoofer shown in FIG. 9A and a number of capacitors arranged around the subwoofer. [Figure 9C] FIG. 1 shows a subwoofer having a magnet with multiple lobes projecting from it. [Figure 9D] 9D shows the subwoofer shown in FIG. 9C and multiple capacitors arranged between multiple lobes of a magnet. [Figure 10A] 1 is a perspective view of a subwoofer with a lip having multiple notches configured to receive fasteners; FIG. [Figure 10B] FIG. 10 shows a grommet suitable for mounting a subwoofer. [Figure 11A] FIG. 1 is an exploded view of a convex user interface. [Figure 11B] FIG. 1 is a cross-sectional view of an assembled convex user interface. [Figure 11C] FIG. 1 is a cross-sectional view of a convex user interface installed in an array speaker. [Figure 12A] 1A-1C show various views of a seal for sealing a first interior portion of an instrument from a second interior portion of the instrument. [Figure 12B] 1A-1C show various views of a seal for sealing a first interior portion of an instrument from a second interior portion of the instrument. [Figure 12C] 1A-1C show various views of a seal for sealing a first interior portion of an instrument from a second interior portion of the instrument. [Figure 13A] 10A-10C show how the upper housing component can be attached to the lower housing component. [Figure 13B] 10A-10C show how the upper housing component can be attached to the lower housing component. [Figure 14A] 10A-10C are various views of the projection base. [Figure 14B] 10A-10C are various views of the projection base. [Figure 14C]10A-10C are various views of the projection base. [Figure 14D] 10A-10C are various views of the projection base. [Figure 15] FIG. 10 is an exploded view of another convex user interface. [Figure 16A] FIG. 16 is a diagram showing the downward surface of the lens array shown in FIG. [Figure 16B] 16B is a side cross-sectional view of the portion of the convex user interface shown in FIG. 15, including the lens array, taken along section line EE shown in FIG. 16A. [Figure 17A] FIG. 1 is an exploded cross-sectional view of an expandable opening defined by one end of the exterior fabric. [Figure 17B] FIG. 1 is a cross-sectional view of exterior fabrics that are fully bonded together, showing how both ends of a drawstring can protrude from the same radial position on the exterior fabric. [Figure 17C] FIG. 1 is a top view of exterior fabric placed around the upper housing component of the array speaker. [Figure 17D] FIG. 1 is a top view of exterior fabric placed around the upper housing component of the array speaker. [Figure 18] FIG. 1 is an exploded view of the halo assembly. [Figure 19] 1 is a partial cross-sectional view of a speaker device with a halo assembly installed therein. [Figure 20] 10A-10C illustrate how fasteners can secure the upper housing component to the halo assembly. [Figure 21] FIG. 10 is a perspective view of an alternative upper housing component defining a diamond-shaped vent. [Figure 22] FIG. 1 illustrates different types of connected electronic devices that can communicate and / or interact with the array speaker. [Figure 23] FIG. 2 is a block diagram illustrating the communication and interoperability between the various electrical components of the array speaker. DETAILED DESCRIPTION OF THE INVENTION
[0026] Representative examples of applications of the methods and apparatus according to the present application are described in this section. These examples are provided solely to provide further context and to aid in understanding the described embodiments. Thus, it will be apparent to one of ordinary skill in the art that the described embodiments can be practiced without some or all of these specific details. In other instances, well-known process steps have not been described in detail to avoid unnecessarily obscuring the described embodiments. Other applications are possible, and therefore the following examples should not be construed as limiting.
[0027] In the following Detailed Description, reference is made to the accompanying drawings, which form a part of the description, and in which is shown by way of illustration specific embodiments in accordance with the described embodiments. These embodiments are described in sufficient detail to enable those skilled in the art to practice the described embodiments, but these examples are not to be understood as limiting, and therefore other embodiments may be used, and changes may be made without departing from the spirit and scope of the described embodiments.
[0028] Speaker configurations tend to be excessively large when high-quality audio reproduction is desired and the audio output can be highly directional in nature, which often requires the user to be located in one specific location to obtain the desired level of quality audio content produced by the speakers. For example, a multi-channel speaker configuration requires mounting speakers in multiple different corners of a room to achieve a substantially uniform sound distribution within the room.
[0029] One way to reduce the size and simplify the speaker configuration while maintaining even sound distribution in the room is to package multiple mid- to high-frequency drivers in a single enclosure. Drivers can be distributed within a speaker device so that their associated audio exit channels are distributed at regular radial intervals along the periphery of the speaker device. In some embodiments, beamforming techniques can be applied to improve audio performance by adjusting acoustic waves exiting adjacent audio exit openings to form constructive interference. In one particular embodiment, drivers can be arranged in a circular array within a cylindrical enclosure to achieve a flat radial distribution of sound waves. Destructive interference caused by reflections from a support surface on which the device is placed can be prevented by orienting the audio exit openings laterally of the support surface.
[0030] In some embodiments, the size of the speaker device can be reduced by closely packing the various internal components. For example, a power supply unit can be located within a central cavity defined by the circular array of drivers. In some embodiments, a capacitor can be located between a centrally located subwoofer and a sidewall of the speaker device's housing. In one particular embodiment, the magnet of the subwoofer can be shaped in a particular way to accommodate a larger capacitor between the subwoofer and the sidewall of the speaker device.
[0031] Heat isolation can also be important if the speaker equipment also includes processing components. In some embodiments, the main logic board of the speaker equipment can be placed in front of the subwoofer so that the air pushed by the subwoofer can convect heat away from the heat-generating components of the main logic board.
[0032] Mounting a subwoofer within a speaker device can generate vibrations that can cause unwanted noise or movement within the speaker device. In some embodiments, fasteners with elastomeric grommets can be used to attach the subwoofer to a mounting bracket within the device housing. The elastomeric grommets can reduce the amount of vibration transmitted by the subwoofer to the rest of the speaker device.
[0033] In some embodiments, the mounting bracket can take the form of an annular support structure that is placed within the equipment housing of the speaker equipment by rotating the annular support structure along threads arranged along the interior surface of the equipment housing. The mounting bracket can be configured to accept fasteners and a subwoofer associated with an upper housing component of the equipment housing. In some embodiments, the annular support structure can be formed of two separate rings that are compressed together by a series of fasteners.
[0034] In some embodiments, the speaker device may include a pressure-sensitive user interface disposed on a top surface of the speaker device. The pressure-sensitive user interface may include illuminators that illuminate different regions of the pressure-sensitive user interface. For example, a central portion of the user interface may illuminate with a changing color pattern in response to receiving or processing a voice command. The changing color pattern is created by an array of LEDs embedded beneath the outer surface of the pressure-sensitive user interface. Other controls illuminated on the pressure-sensitive user interface may include a volume control. The pressure-sensitive user interface may utilize capacitive or other touch sensors suitable for detecting gesture-based touch input.
[0035] These and other embodiments are described below with reference to Figures 1-23. However, those skilled in the art will readily appreciate that the Detailed Description described herein with reference to these figures is for illustrative purposes only and should not be construed as limiting.
[0036] FIG. 1 shows a perspective view of an array speaker 100. The array speaker 100 can have a continuous, aesthetically pleasing exterior and a symmetrical, substantially cylindrical geometry. As used herein, the term "substantially cylindrical geometry" refers to a geometry that is perfectly cylindrical (i.e., a geometry that includes straight, parallel sides and is circular or oval in cross section), as well as a geometry in which the sides of the upper and / or lower edges are tapered and more rounded than an actual cylinder. The array speaker 100 can also have other geometries. For example, an equipment housing for an array speaker can have many different axisymmetric shapes, which allows audio equipment assemblies to be radially distributed within the equipment housing. An axisymmetric geometry refers to a shape that has symmetry about at least one axis. In the described embodiment, the equipment housing exhibits an axisymmetric geometry with symmetry about the longitudinal axis of the equipment housing. It should also be noted that the term "axisymmetric" may be interpreted to encompass shapes that are substantially symmetric about one axis. For example, for purposes of the following description, a small indentation or protrusion does not preclude a housing from being described as having an axisymmetric geometric shape.
[0037] The top portion of the array speaker 100 may include a user interface 102. The user interface 102 may allow a user to adjust settings of the array speaker 100. For example, track selection and volume changes may be handled by interacting with the user interface 102. In some embodiments, the user interface 102 may take the form of a touch-sensitive surface. The user interface 102 may include one or more light sources that illuminate various areas of the user interface 102 to assist a user in interacting with the user interface 102. A majority of the array speaker 100 may be covered with an acoustic fabric 104. The acoustic fabric 104 may give the array speaker 100 a matching exterior. Some audio exit ports may be shielded by the acoustic fabric 104, resulting in minimal impact on the volume and / or quality of the sound output from the array speaker 100.
[0038] 2A is a cross-sectional view of the array speaker 100, showing only the components disposed in the lower third of the array speaker 100. In particular, a cross-section of one audio driver assembly 202 is shown. The audio driver assembly 202 can include a driver housing 204 that encloses the audio components that make up the audio driver assembly 202 and defines a rectangular channel 206 that allows acoustic waves generated by a diaphragm 207 of the audio driver assembly 202 to exit the driver housing 204. Fasteners 210 can secure the audio driver assembly 202 to a lower housing component 208. The driver housing 204 can be rotated so that the rectangular channel 206 aligns with an audio exit channel 212 defined by the lower housing component 208. Acoustic waves 214 exiting the audio exit channels 212 pass through the acoustic fabric 104 and, due to the geometry of the exit of the audio exit channels 212, propagate along a support surface 216 on which the array speaker 100 rests. In some embodiments, the acoustic fabric 104 can have a pattern designed to hide components or features located underneath the acoustic fabric 104.
[0039] 2A also shows power terminals 220. The power terminals 220 may extend between two adjacent audio driver assemblies 202 to transmit power to various components within the array speaker 100. A conductive cable 224 may electrically connect the power terminals 220 to a power supply unit 222. In some embodiments, the power supply unit 222 may be coupled to a power supply board 226, which is further coupled to the lower housing component 208. The power supply unit 222 extends into a recess defined by the audio driver assemblies 202. The audio driver assemblies 202 are radially distributed at regular intervals around the array speaker 100. In this way, the power supply unit 222 utilizes the available space within the recess defined by the audio driver assemblies 202. In some embodiments, an amplifier board 228 and components distributed thereon may also be electrically connected to the power supply unit 222 and the power terminals 220 via the conductive cable 224. 2A also shows a protruding pedestal 230 that supports the weight of the array loudspeaker 100 on the support surface 216. The protruding pedestal 230 may be formed of a damping material, such as silicone, configured to minimize the amount of vibration transmitted from the array loudspeaker 100 to the support surface 216. The protruding pedestal 230 may be configured to dissipate forces transmitted in the Z-axis direction as well as moments acting about the X-axis and / or Y-axis. The large area and symmetrical footprint of the protruding pedestal 230 helps prevent speaker rocking due to moments acting about the X-axis and / or Y-axis.
[0040] 2B shows an internal cross-sectional view of one side of the array speaker 100, illustrating the diaphragm 207 and an audio exit channel 212 associated with one of the audio driver assemblies 202. Various dimensions of the outlet of the audio exit channel 212 are shown in millimeters. Specifically, the distance between the end of the audio exit channel 212 and the edge 229 of the side wall of the lower housing component 208 is approximately 1.5 times the height of the downward-facing face of the array speaker 100 from the support surface that supports the array speaker 100. The height of the pedestal 230 directly below the outlet region of the audio exit channel 212 is approximately ½ the distance from the support surface 216 and the top surface of the audio exit channel 212. In some embodiments, the thickness of the periphery of the pedestal 230 is approximately 6 / 11 of the distance 231 between the distal end of the pedestal 230 (or the support surface 216) and the top surface of the audio exit channel 212 in the outlet region. This geometry causes high-frequency acoustic waves to move around the corners of the base 230 and the corners of the outer edge of the housing so that flat vertical directivity is achieved for both low-frequency and high-frequency acoustic waves. Distance 232 between the edge of lower housing component 208 and the periphery of the base may be slightly longer than distance 231. This allows the downward-facing surface of lower housing component 208 to assist in shaping the acoustic waves as they propagate away from the speaker device. In some embodiments, the ratio of distance 231 to distance 232 may be approximately 11 / 15.
[0041] FIG. 2C shows a schematic internal view of the lower region of the array speaker 100. It illustrates how a diaphragm 207 associated with one of the audio driver assemblies 202 can be configured to output acoustic waves through multiple vertical slots 233 defined by the lower housing component 208. The dashed lines 234 shown within the rectangular channel 206 and the audio exit channel 212 represent the sound waves generated by the diaphragm 207. Specifically, the dashed lines 234 are shown redirecting within different regions of the rectangular channel 206 and the audio exit channel 212. These channels are intentionally shaped to minimize destructive interference caused by vibrations of the diaphragm 207, which can adversely affect the quality and / or volume of the sound. For example, swirls in the audio channels direct the acoustic waves to maintain a coherent wavefront along the length of the audio channel. The shape of the audio channel also helps direct acoustic waves in a radially outward and upwardly oriented direction 236, resulting in a spherically expanding wavefront moving away from the support surface on which the lower housing component 208 rests. While the acoustic waves are depicted in two dimensions by dashed lines 234, it should be understood that the acoustic waves have a three-dimensional profile extending circumferentially within and from the lower housing component 208. FIG. 2C also illustrates how the acoustic waves generated by the diaphragm 602 are redirected in a direction substantially orthogonal to the original direction from which they initially originated. For example, the direction of the acoustic waves can shift by 70 to 80 degrees before exiting the driver housing 204 through the audio exit opening 710.
[0042] FIG. 3A shows a cross-sectional view of the array speaker 100 taken along section line AA in FIG. 2A . Each driver assembly includes an adapter 302 configured to position a phase plug 304 within the driver housing 204. The phase plug 304 reduces destructive interference by guiding acoustic waves from the large surface area of the diaphragm to the small entrance area of the horn throat, rather than allowing the waves to interact destructively near the diaphragm. The phase plug also helps shape the sound waves exiting the audio driver assembly 202 to fit the non-circular, and in some cases more rectangular, channel 206 and audio exit channel 212. The periphery of the diaphragm associated with the coil assembly 306 engages with the phase plug 304, as shown. The coil assembly 306 is attached to a central portion of the diaphragm and includes a coil of wire configured to generate a moving magnetic field that interacts with a permanent magnet 308, thereby generating acoustic waves. When the moving magnetic field interacts with the magnetic field generated by the permanent magnet 308, the diaphragm vibrates at a rate suitable for generating acoustic waves associated with the media file being played by the array speaker 100. Behind the permanent magnet 308 is a support assembly in the form of a magnetic motor assembly including a U-cup 310, a top plate 311, and the permanent magnet 308. In addition to providing a surface onto which the magnet 308 can be mounted, the U-cup 310 directs the magnetic field generated by the magnet 308 into the air gap in which the coil is located. Behind the U-cup 310 is a foam layer 312, which can be formed from open-cell foam. The foam layer 312 can improve the audio performance of the audio driver assembly 202. In some embodiments, the foam layer 312 can increase the apparent size of the rear volume of the audio driver assembly 202. Finally, a lid 314 is secured to the driver housing 204 to close the opening at the rear of the audio driver assembly 202. This rear opening in the driver housing 204 can be used to insert the audio components described above into the driver housing 204.FIG. 3A also shows how the channels 206 leading from the driver housing 204 can be distributed at regular radial intervals.
[0043] 3B shows a cross-sectional view of the array speaker 100 taken along section line BB in FIG. 2A. In this view, the top surface of the driver housings 204 is shown. Each driver housing has two driver screw terminals 316. The driver screw terminals 316 can be used to form conductive paths between audio components within the driver housings 204 and other components of the array speaker 100.
[0044] FIG. 4 shows a perspective view of each of the audio driver assemblies 202. Specifically, the lid 314 closing the rear opening to the driver housing 204 is shown. Each audio driver assembly 202 is also shown with an alignment bracket 402. The alignment bracket 402 can be configured to provide a buffer between each audio driver assembly 202 and the lower housing component 208. The alignment bracket 402 can also be configured to assist in aligning the amplifier board 228 with the driver screw terminals 316. The amplifier board 228 is configured to support capacitors 404 and other electronic components, such as electronic components 406. The capacitors 404 are configured to provide power to the audio driver assemblies 202. Specifically, power from the capacitors 404 can be used to support separate amplification channels powering each audio driver assembly 202. The amplifier boards 228 are also shown with terminals 408. Each terminal 408 can be configured to receive a fastener for coupling the amplifier board 228 to the driver screw terminals 316. In this manner, the amplifier board 228 can be rigidly coupled to each of the audio driver assemblies 202 .
[0045] FIG. 5A shows a perspective view of the rear portion of audio driver assembly 202. Lid 314 has been removed from audio driver assembly 202 to reveal the rear-facing surface of U-cup 310. U-cup 310 is coupled to a peripheral tab portion 508 of phase plug 304. Also shown are wires 502 that can electrically connect audio components of audio driver assembly 202 to their corresponding driver screw terminals 316. Amplifier board 228 is shown fastened to audio driver assembly 202 by fasteners 504, which engage with driver screw terminals 316. FIG. 5A also shows the back of U-cup 310, which includes an engagement feature 506 that engages with tab 508 on phase plug 304.
[0046] 5B shows a cross-sectional view of fasteners 504 engaging driver screw terminals 316. Fasteners 504 can be conductive fasteners and can be configured to carry signals received from terminals 408 disposed on amplifier board 228. In some embodiments, amplifier board 228 also includes lower terminals 507 disposed on a lower surface of amplifier board 228. In some embodiments, lower terminals 507 can be pressed against driver screw terminals 316, thereby carrying signals or establishing a ground path between lower terminals 507 and driver screw terminals 316 along conductive paths 509. The signals can then be carried to wires 502 soldered to a lower portion of driver screw terminals 316. The signals can include instructions to generate acoustic waves using audio components within driver housing 204. In some embodiments, one of wires 502 can be used to receive instructions, and the other wire 502 can be configured to receive power. In some embodiments, one of wires 502 can function as a ground path.
[0047] 5C shows another embodiment in which fasteners 504 engage openings defined by driver housing 204. If driver housing 204 is made of an electrically insulating material, one or more of wires 502 can carry electrical signals and power to driver housing 204. In some embodiments, a metal sheet 510 can be disposed between driver housing 204 and amplifier board 228. Metal sheet 510 can be bent to help define conductive paths 509 toward the exterior surface of driver housing 204. Metal sheet 510 can also define openings or notches configured to accommodate fasteners 504. In some embodiments, wires 502 can be soldered to metal sheet 510.
[0048] FIG. 6 shows an exploded view of the audio driver assembly 202. An adapter 302 can be inserted into the driver housing 204. The driver housing 204 can include an interior feature suitable for receiving the adapter 302. The adapter 302 can define an opening that allows acoustic waves to pass through the adapter 302 and exit the driver housing 204. A rearward-facing surface of the adapter 302 can be configured to receive protrusions of a phase plug 304. The phase plug 304 defines several openings that shape the acoustic waves to prevent destructive interference as they are directed toward the exit of the driver housing 204. The phase plug 304 is also shown with tabs 508 that are configured to be engaged by engagement features 506 of the U-cup 310.
[0049] FIG. 6 also shows the coil assembly 306, which includes a diaphragm 602 and a coil 604. The coil 604 is electrically connected to a power source so that it can receive an alternating current. The alternating current causes the coil 604 to output a moving magnetic field that interacts with the magnetic field generated by the permanent magnet 308 of the magnetic motor assembly. This interaction results in the coil assembly 306 moving back and forth between the phase plug 304 and the U-cup 310. The direction of movement of the coil assembly 306 can be determined by the circumferential current flow direction in the coil and the direction of the radially oriented magnetic flux generated by the permanent magnet 308 in the air gap between the top plate 606 and the U-cup 310. The force direction is perpendicular to both the current flow and the magnetic flux lines in the coil 604. Movement in this direction is enabled by the flexible surrounding portion of the diaphragm 602. The plate 606 can be coupled to the permanent magnet 308 and can be designed to help shape the magnetic flux flow generated by the permanent magnet 308. A force applied to the coil 604 results in movement of the diaphragm 602 , generating an acoustic wave that propagates through the phase plug 304 and then exits the driver housing 204 .
[0050] FIG. 7 shows a cross-sectional view of audio driver assembly 202. In particular, rear volume 702 of audio driver assembly 202 is shown. Generally, the rear volume refers to an open area within the speaker enclosure that contains air; the rear volume is in fluid communication with the rear-facing surface of the diaphragm but not with the listener. Similarly, the front volume refers to another open area within the speaker enclosure that contains air; the front volume is in fluid communication with both the forward-facing surface of the diaphragm and the listener. Increasing rear volume 702 increases the amount of air behind diaphragm 602, helping to increase low-frequency output at a given power output for audio driver assembly 202. Foam layer 312 increases the apparent size of rear volume 702 by slowing the air in the rear volume, thereby increasing the apparent volume of rear volume 702. Additionally, a portion 704 of the rear volume that is in front of the diaphragm allows rear volume 702 to expand. By leaving an air gap 706 between the phase plug 304 and the driver housing 204, additional open space can be added to the overall volume of the rear volume 702. In some embodiments, this additional volume in front of the diaphragm 602 can significantly improve audio performance when the diaphragm 602 vibrates in the direction indicated by arrow 708. In some embodiments, the total rear volume 702 and the forward rear volume 704 can be approximately 17 cc (cm). FIG. 7 also shows magnetic flux flow lines 710, illustrating how both the U-cup 310 and the plate 606 cooperate to define a flux flow path for the magnetic field emanating from the permanent magnet 308. In this way, the magnetic field can be concentrated around the path traversed by the coil 604 during operation of the audio driver assembly 202.
[0051] FIG. 8 is a cross-sectional view of the array speaker 100, showing only the components within the central portion of the array speaker 100. FIG. 8 shows a subwoofer 802 and a microphone 804. The subwoofer 802 includes a permanent ring magnet 806 for driving a coil 808 and a diaphragm 810 of the subwoofer 802. Note that the diaphragm 810 can also be referred to as a cone. While the term "cone" often refers to a rigid vibrating member associated with a subwoofer for purposes of this description, the vibrating member of a subwoofer will generally be described as a diaphragm. The subwoofer 802 can be attached to the lower housing component 208 by a damper coupling 812, which can minimize the amount of force and / or vibration transferred from the subwoofer 802 to the lower housing component 208. The magnetic field emitted by the ring magnet 806 can be shaped by a pole structure 814 and a plate structure 816. The air gap between the pole structure 814 and the plate structure 816 can help concentrate the magnetic field emitted by the ring magnet 806 around the coil 808 . The location of the subwoofer 802 in the upper portion of the enclosure allows the area below the subwoofer 802 to be used as a rear volume for amplifying the acoustic waves generated by the subwoofer 802. Although not shown, this rear volume area contains the audio driver assembly 202. This works well because the acoustic waves generated by the audio driver assembly 202 are insulated by the enclosure 204 of the audio driver assembly 202, and the acoustic waves generated by the audio driver assembly 202 exit the bottom edge of the device enclosure.
[0052] FIG. 8 also illustrates how the microphones 804 can be radially distributed as shown in FIG. 8. In some embodiments, a flexible ribbon cable or a flexible PCB 818 can be utilized to electrically connect each of the microphones 804 together. In some embodiments, the microphones 804 can be configured to detect both internal and external audio sources. In some embodiments, the microphones 804 can be configured to monitor the inside of the array speaker 100 for distortion or overdrive to prevent speaker damage. In some embodiments, the microphones 804 can be configured to relay audible user commands to a processor of the array speaker 100. For example, the microphones 804 can be aligned with and sealed across an opening in a sidewall of the device housing, allowing the multiple microphones 804 to cooperatively triangulate the location of any acoustic waves detected by two or more microphones 804.
[0053] 9A illustrates how, according to one embodiment, magnets 806 of subwoofer 802 can extend radially around the periphery of subwoofer 802. Because magnets 806 extend radially from subwoofer 802, the diameter of capacitors 404 is limited. For this reason, more capacitors 404 may be required to power audio driver assembly 202 than would be required for larger diameter capacitors, as shown in FIG. 9B. In general, using more capacitors 404 tends to be more expensive and takes up more space on amplifier board 228.
[0054] FIG. 9C illustrates a subwoofer 902 according to some embodiments of the present disclosure that includes a magnet 904 instead of magnet 806. The magnet 904 includes multiple protruding lobes 906 that can extend radially near, or in some cases all the way to, the inward-facing surface of the lower housing component 208. While the magnet 904 is shown with three lobes 906, it should be understood that the magnet 904 can have any number of lobes 906, so long as they are evenly spaced and distributed around the magnet 904. For example, four narrower lobes may be utilized. Distributing the lobes evenly helps prevent the magnetic field emitted by the magnet 904 from becoming asymmetric. It should be understood that, in addition to the lobes 906, an upper plate 908 directly above the magnet 904 and a lower plate directly below the magnet 904 can be shaped to match the lobes 906 of the magnet 904. FIG. 9D illustrates how the lobes 906 of the magnet 904 leave sufficient space for a larger-diameter capacitor 912. This configuration allows a larger diameter capacitor 912 to power the audio driver assembly 202 (not shown), which in some embodiments allows more power to be supplied to the audio driver assembly 202, allowing for a higher quality driver assembly 202 and / or a louder audio output.
[0055] FIG. 10A shows a perspective view of the subwoofer 802. The subwoofer 802 includes a lip with multiple notches configured to accept fasteners. The lip is used to secure the subwoofer 802 to the housing of the array speaker 100. Unfortunately, the inertia of the moving mass of the subwoofer 802 creates a force in the Z axis and moments about the X and Y axes, which can lead to noticeable shaking and hopping of the array speaker 100. This can cause the array speaker 100 to move laterally while playing music, creating a risk of it falling. The movement caused by the subwoofer 802 can also create vibrations throughout the system, which can cause audible noise and potentially result in premature component failure or disconnection. Additionally, vertical movement of the array speaker in the Z axis can make touch interfaces located on top of the array speaker 100 more difficult to use. For example, vertical movement of the array speaker 100 may cause the user to touch the wrong part of the touch interface or to input earlier than desired.
[0056] 10A shows a solution to this problem. A plurality of elastomeric grommets 1002 and shoulder screws 1004 can be used to secure a flange 1006 of the subwoofer 802 to a mounting feature within the array speaker 100. This can be achieved by sliding each grommet 1002 into a notch 1008 defined by the flange 1006. After tightening into the notch 1008, the shoulder screws 1004 can be inserted into the openings defined by the grommets 1002. The shoulder portion of the shoulder screws 1004 can be positioned within the openings defined by the grommets 1002, and the threaded portion of the shoulder screws 1004 can be used to engage the mounting feature.
[0057] FIG. 10B shows a perspective view of grommet 1002, which can be made from high-damping rubber and can have a specific geometry to achieve optimal stiffness characteristics for damping vibrations generated by subwoofer 802. Grommet 1002 can define a U-shaped channel 1010 configured to allow grommet 1002 to slide into one of notches 1008. When flange 1006 engages within U-shaped channel 1010, the shape of U-shaped channel 1010 acts as an anti-rotation feature that prevents rotation of grommet 1002 within notch 1008. This can be helpful when turning shoulder screw 1004 within the mounting feature. Grommet 1002 also includes a protrusion 1012 protruding from upper flange 1014. Protrusion 1012 also protrudes from lower flange 1016. The protrusions 1012 may also be configured to allow for easier compression when the shoulder screws 1004 pass through the openings 1018 and engage the grommet 1002. The height and / or width of the protrusions 1012 may be adjusted to adjust the overall stiffness provided by the grommet 1002.
[0058] FIG. 11A shows an exploded view of a convex user interface 1100. The decorative layer 1102 can be formed from glass or plastic and configured to provide a smooth surface on which a user can comfortably input. The illustrated pattern on the decorative layer 1102 includes symbols corresponding to increasing and decreasing settings. In some embodiments, plus (+) and minus (-) symbols can be used to increase the volume or skip tracks within a song. For example, a long press of the plus (+) can be configured to increase the volume, while a short press can skip to the next track in a media playlist. The decorative layer 1102 can be bonded to an adhesive layer 1104. The adhesive layer 1104 can bond the decorative layer to wedges 1106, which can bond the wedges 1106 to a touch / LED substrate 1108. The adhesive layer 1104 can define a plurality of openings configured to reduce attenuation of touch signals generated by the adhesive layer 1104. The wedges 1106 can define the convex geometric shape of the user interface 1100. The dielectric constant of the wedges 1106 can be tailored to efficiently transmit touch input from the decorative layer 1102 to the touch / LED substrate 1108. Some of the openings defined by the adhesive layer 1104 and the wedges 1106 can be designed to accommodate fasteners 1110 that secure the touch / LED substrate 1108 to a mounting frame 1112. The light guides 1114 can be configured to direct light emitted by light sources coupled to the touch / LED substrate 1108 directly toward the decorative layer 1102 of the user interface 1100. In some embodiments, the openings defined by the different openings can be configured to allow light from LEDs disposed on the touch / LED substrate 1108 to illuminate a portion of the decorative layer 1102.
[0059] 11B is a cross-sectional view of the assembled convex user interface 1100. LEDs 1116 are shown on the top and bottom surfaces of the touch / LED substrate 1108. In this manner, the upper LEDs 1116 can shine light directly toward the decorative layer 1102. The lower LEDs 1116 shine light into a recess defined by the mounting frame 1112. The light emitted by the lower LEDs 1116 can then be deflected by the light guide 1114 toward another opening in the decorative layer 1102 below the plus (+) and minus (-) indicators.
[0060] FIG. 11C shows a cross-sectional view of the array speaker 100 with the convex user interface 1100 disposed on top. Vertical acoustic waves 1118 generated by vibration of the subwoofer 802 are shown. In some embodiments, the vibrations can be aligned with the longitudinal axis of the lower housing component 208. In this case, the term “aligned” is used to mean that the direction of motion is substantially parallel to the longitudinal axis of the lower housing component 208. The acoustic waves 1118 are configured to exit the array speaker 100 through a vent 1120. A main logic board 1122 is shown clamped to the bottom surface of the convex user interface 1100. The main logic board 1122 can include one or more heat-generating components, such as a processor. The acoustic waves 1118 incident on the main logic board 1122 can dissipate heat generated by the heat-generating components of the main logic board 1122. In some embodiments, heat generated by the touch / LED substrate 1108 may be conducted to the main logic board 1122, where it can be convectively dissipated by air displaced by the acoustic waves 1118. In some embodiments, if heat dissipation is a priority, the subwoofer 802 may be configured to operate at a subaudible frequency designed to maximize the amount of air displaced from the main logic board 1122. In some embodiments, the array speaker 100 may include various sensors within the subwoofer 802 that identify high thermal load conditions, which prioritize heat dissipation. For example, thermal sensors may be mounted on the surface of the main logic board 1122. Additionally, various flow sensors may be positioned between the subwoofer 802 and the vent 1120 to identify if the vent is blocked. The subwoofer 802 may also be configured to vibrate at a frequency that generates haptic feedback along the outer surface of the convex user interface 100. For example, the subwoofer 802 can be instructed to operate at a frequency that generates haptic feedback in response to one or more different types of user input.
[0061] FIG. 11C also shows a seal 1124 configured to seal the rear volume of the subwoofer 802. The seal 1124 can help prevent the upper housing component 1126 from vibrating against the lower housing component 208. FIG. 11C also shows a vibrating ring 1125 that twists along threads 1128. The vibrating ring 1125, formed from a polymer material, twists downward until it engages with a channel defined by the alignment bracket 402 of the driver housing 204 of each driver to prevent vibration of the audio driver assembly 202. In some embodiments, the vibrating ring 1125 can include at least three rows of threads around the periphery of the vibrating ring 1125.
[0062] FIG. 12A shows a perspective view of the seal 1124. The seal 1124 is arranged in a loop and can form a seal around an audio component fastened to the lower housing component 208. The seal 1124 is configured to seal across parting lines and accommodate the tolerances of injection-molded plastic parts. The seal 1124 can be constructed of multiple layers. FIG. 12B shows a cross-section of the seal 1124 through section line CC. This cross-section shows how two flexible foam layers 1202 can be bonded together by a rigid plastic layer 1204. The rigid plastic layer 1204 can increase installation reliability by helping to maintain the shape of the seal 1124. This design can provide better performance at a lower cost than a typical O-ring. FIG. 12C shows a close-up view of the seal 1124 arranged between the upper housing component 1126 and the support halo 1206.
[0063] 13A-13B show how the upper housing component 1126 can be attached to the lower housing component 208. Both the upper housing component 1126 and the lower housing component 208 include a plurality of individual thread segments. The thread segments are arranged on the outward-facing surface of the upper housing component 1126 and the inward-facing surface of the lower housing component 208. To attach the upper housing component 1126 and the lower housing component 208 together, the thread segment 1302 of the upper housing component 1126 can be aligned with the thread segment 1304 of the lower housing component 208. The upper housing component 1126 can then be lowered until the thread segments 1302 and 1304 contact one another. The upper housing component 1126 can then be twisted to move the thread segment 1302 to the right until the thread segment 1302 passes through the thread segment 1304 and then contacts the thread segment 1306. After thread segment 1302 contacts thread segment 1306, upper housing component 1126 can be twisted in the opposite direction, moving thread segment 1302 to the left until thread segment 1302 passes thread segment 1306 and contacts thread segment 1308. Upper housing component 1126 can continue to move in alternating directions until thread segment 1310 is secured against locking surface 1312 of thread segment 1314. Thread segment 1310 can have a locking feature 1316 configured to engage locking surface 1312. Due to the area surrounding locking feature 1316 being removed from upper housing component 1126, locking feature 1316 can flex. FIG. 13B shows the upper housing component 1126 locked to the lower housing component 208 by the interaction between the locking surface 1312 and the locking feature 1316 .
[0064] 14A-14D show the protruding pedestal 230. FIG. 14A shows the protruding pedestal 230 directly below the array speaker 100. The protruding pedestal 230 is configured to support the weight of the array speaker 100 above a support surface and to dissipate any vibrations propagating through the array speaker 100. FIG. 14B shows a perspective view of the protruding pedestal 230. An inner layer 1402 of the protruding pedestal 230 can be formed of a somewhat rigid but flexible material, such as polycarbonate. An outer layer 1404, formed of a more flexible material, such as silicone, can be configured to dissipate vibrations transmitted to the protruding pedestal 230. Unfortunately, with more standard vibration-dissipating pedestals, vibrations can be severe enough to cause bouncing or lateral displacement.
[0065] FIG. 14C shows a top view of the protruding base 230, with section line DD bisecting the protruding base 230. FIG. 14D shows the inner layer 1402 and outer layer 1404. When a force 1406 acts on the protruding base 230, not only does the thickness of the outer layer 1404 serve to dissipate any vibrations transmitted to the protruding base 230, but the protruding arms 1408 also deform radially, as shown, to absorb a portion of the force 1406 associated with the vibration. The radial deformation results in a horizontal translation of vertical vibrations, resulting in a significant reduction in vertical vibrations. Another positive effect of the radial deformation is that the outer layer 1404 comes into more contact with the support surface, increasing friction between the protruding base 230 and the support surface and, consequently, increasing the array speaker's resistance to lateral displacement. In some embodiments, the protruding base 230 and the grommet 1002 work together to damp undesired vibrations of the array speaker 100. In some embodiments, an annular foam 1410 can be added along the periphery of the protruding base 230, which can be configured to prevent unwanted vibrations of the periphery of the protruding base 230. In this manner, if a speaker device generates acoustic waves that can resonate within the protruding base 230, the foam 1410 is positioned to prevent vibrations that could cause troublesome vibrations.
[0066] FIG. 15 shows an exploded view of an alternative convex user interface 1500 that differs in several respects from the user interface shown in FIGS. 11A-11C. Specifically, the convex user interface 1500 includes two separate illuminated touch interface areas. The user interface 1500 includes a mounting frame 1502 that defines a channel 1503 extending around the periphery of the mounting frame 1502. The channel 1503 can be configured to receive a drawstring associated with the acoustic fabric covering the array speaker 100. The channel 1503 allows each end of the drawstring to be conveniently wrapped around the mounting frame 1502 along the channel 1503. The mounting frame 1502 also defines a plurality of recesses 1504 configured to receive and accommodate light-emitting components. Specifically, the light-emitting components include an LED array substrate 1506 and a light source 1508. The LED array substrate 1506 includes an array of LEDs 1510. Each of the LEDs 1510 can be configured to emit light of three or more colors. The LEDs 1510 can also be configured to cooperatively generate various designs associated with the first touch interface area. The light sources 1508 can each include one or more LEDs for emitting light of one or more colors associated with the second touch interface area. The interposer substrate 1512 can be configured to establish a separation distance between the LED array substrate 1506 and a touch printed circuit board (PCB) 1514. The interposer substrate 1512 can define an opening that allows light generated by the LEDs 1510 to pass through the interposer substrate 1512. The interposer substrate 1512 can take the form of an electrically insulating layer with conductive edge plating arranged along its periphery for transmitting power and signals between the touch PCB 1514 and the LED array substrate 1506. In this manner, the light emitted by the LEDs 1510 can be modulated according to touch input processed by components associated with the touch PCB 1514. The touch PCB 1514 defines a number of apertures through which light generated by the light emitting components passes.In particular, the volume control opening 1516 may have the shape of a plus (+) symbol to increase the volume and a minus (-) symbol to decrease the volume of a speaker system associated with the user interface 1500.
[0067] FIG. 15 also shows fasteners 1518 that can be configured to secure the touch PCB 1514 to the mounting frame 1502. In some embodiments, the fasteners 1518 can be self-tapping screws that thread within openings defined by the mounting frame 1502. An adhesive layer 1522 can couple the touch PCB 1514 to a wedge 1520. Both the adhesive layer 1522 and the wedge 1520 can include openings through which light emitted by the light-emitting components can pass. The adhesive layer 1522 and the wedge 1520 can also include openings to accommodate the heads of the fasteners 1518. The wedge 1520 can be configured so that its central region is significantly thicker than its peripheral regions, giving the user interface 1500 a curved or convex exterior geometry. The central region of the wedge 1520 includes an opening to accommodate a diffuser assembly 1523 configured to diffuse light received from the LEDs 1510. The diffuser assembly 1523 includes a lens array 1524 with individual diffusing optics for each LED 1510. In some embodiments, the lens array 1524 can take the form of a single piece of glass that diffuses the light from each LED 1510. In other embodiments, the lens array 1524 can include multiple individual lenses that diffuse the light. The lens array 1524 can be secured to the touch PCB 1514 with an adhesive foam ring 1526. In some embodiments, a touch plate 1528 can be secured to the downward-facing surface of the lens array 1524. Openings defined by the touch plate 1528 can accommodate the lens protrusions of the lens array 1524. The touch plate 1528 can take the form of a thin conductive plate that improves capacitive coupling of touch input received by the user interface 1500. The touch plate can be electrically connected to the touch PCB 1514. In some embodiments, the flat surface of the touch plate 1514 can include a touch sensor optimized to read input made on the convex decorative touch surface of the user interface 1500.For example, the density of the sensing grid associated with the touch plate 1514 can be varied to allow input provided to conform to the curvature of the exterior surface. In this manner, consistent user input can be achieved across the entire exterior touch surface of the user interface 1500, thereby avoiding a situation where touch input is read at a different rate along the periphery of the touch sensor than at the center. The upward-facing surface of the lens array 1524 can be secured to the first diffuser plate 1530 by adhesive strips 1532 arranged along the periphery of the lens array 1524. A layer of diffuser film 1534 can be disposed between the first diffuser plate 1530 and the lens array 1524 for further light diffusion. The first diffuser plate 1530 can also be configured to increase the amount of diffusion of light emitted by the LEDs 1510.
[0068] In some embodiments, the first diffuser plate 1530 can be formed from a clear polycarbonate resin doped with particles having a different refractive index. For example, the polycarbonate resin can be doped with titanium oxide particles, which not only give the first diffuser plate 1530 a white appearance but also help further diffuse light passing through the first diffuser plate 1530. The first diffuser plate 1530 is secured to the second diffuser plate 1536 by adhesive strips 1532 arranged along the periphery of the first diffuser plate 1530. The adhesive strips 1532 can be sized to create a small air gap between the first and second diffuser plates. The second diffuser plate 1536 can have a domed surface that helps the diffuser assembly 1523 achieve the same curvature as the wedge 1520. Finally, a fade film 1538 can be applied to the upward-facing surface of the second diffuser plate 1536. The fade film can take the form of a radial gradient filter that feathers the light intensity along the periphery of the light emitted by the LEDs 1510. In this manner, the fade film 1538 prevents the adhesive layer 1540 from suddenly changing from illuminated to unilluminated in the central region of the top cover 1542. The top cover 1542 can take the form of a layer of transparent polymer material, such as glass or a polycarbonate material. In some embodiments, the top cover 1542 can include an ink layer to further diffuse light passing through the top cover 1542. In some embodiments, the light emitted by the LEDs 1510 and diffused by the diffusing elements described above can cooperatively produce a mixed light having a diameter of approximately 3 centimeters.
[0069] 16A shows the downward-facing surface of lens array 1524. As shown, lens array 1524 takes the form of a single piece of molded glass with individual optics for multiple different light sources. Specifically, lens array 1524 includes convex lenses 1602 for diffusing light from 19 LEDs 1510 arranged in a honeycomb pattern. It should be understood that a greater or lesser number of LEDs 1510 may be accommodated in lens array 1524. Furthermore, convex lenses 1602 may be arranged in an irregular pattern or in a different regular pattern, such as a square lattice.
[0070] FIG. 16B shows a side cross-sectional view of a portion of the convex user interface 1500, including the lens array 1524, taken along section line EE. The adhesive layer has been omitted from this view for clarity. In particular, LEDs 1510 are shown mounted on an LED array substrate 1506. Five LEDs 1510 are shown emitting light toward the lens array 1524. Convex lenses 1602 of the lens array 1524 diffuse the light received from the LEDs 1510 before the light enters the first and second diffuser plates 1530 and 1536. As shown, each of the convex lenses 1602 includes a concave surface directed toward a corresponding one of the LEDs 1510. The diffuser plate can be configured to further diffuse the light before it exits through the top cover 1542. Light emitted from each LED 1510 can mix with light from adjacent ones of the LEDs 1510 by the time the light exits through the top cover 1542. In this way, a relatively small number of LEDs can cooperate to form a mixed light pattern at the outer surface defined by the top cover 1542. In some embodiments, the light emerging along the outer surface can have a total diameter of about 30 mm, and the light from each LED 1510 can be spread over a diameter of about 7 mm.
[0071] FIG. 17A shows an exploded cross-sectional view of an expandable opening defined by one end of fabric 1700. Fabric 1700 can take the form of a tube having fixed-size openings at a first end and a resilient and / or expandable second end. FIG. 17A shows the expandable second end. Fabric layers 1702, 1704, and 1706 can be configured to provide a decoratively attractive exterior for the speaker device without impeding the passage of acoustic waves generated by the speaker device. Fabric layers 1702, 1704, and 1706 can be formed from materials such as polyester, nylon, and polyurethane. In some embodiments, fabric layer 1702 can have a diamond pattern defining an array of diamond-shaped openings that limit the amount of resistance created by fabric layer 1702. Fabric layer 1702 can be adhered to fabric layer 1704 by adhesive layer 1708. While adhesive layer 1708 is shown as a solid layer, it should be understood that the adhesive can be formed to have the same pattern as fabric layer 1702. In this way, no adhesive material can be exposed on the outer surface of fabric 1700. The inner lip of fabric layer 1704 can be bonded to fabric layer 1706 by adhesive ring 1710. Fabric layer 1706 can then be secured to upper housing component 1126 (not shown in this view, see FIG. 13B). In this manner, fabric 1700 can be securely bonded to the speaker device.
[0072] 17A also shows sewn threaders 1712. In some embodiments, the sewn threaders 1712 can be sewn into the lip of the fabric layer 1702. The sewn threaders 1712 can take the form of fibers arranged in a plurality of loops along the lip of the fabric 1700 and sized to accommodate the drawstrings 1714. The drawstrings 1714 can be threaded through openings defined by the loops of the sewn threaders 1712. The openings defined by the lip of the fabric 1700 can be expanded or contracted by pulling on either end of the drawstrings 1714 to attach the fabric 1700 to a speaker device or by loosening the drawstrings 1714 to remove the fabric 1700 from a speaker device.
[0073] 17B is a cross-sectional view of the fully bonded fabric assembly 1700, illustrating how both ends of the drawstring 1714 can extend from the same radial location on the fabric assembly 1700. The drawstring 1714 can be long enough to wrap around a mounting frame associated with the speaker device's user interface, allowing the drawstring to smoothly contract through an opening 1716 defined by the fabric 1700. In some embodiments, the sewn threads 1712 and drawstring 1714 can be replaced with elastic loops insert molded around the lip of the fabric 1700. The elastic loops can act similar to rubber bands and have the resilience to hold the fabric securely in place while also allowing the fabric defining the opening 1716 to expand in order to remove the fabric assembly 1700 from the speaker device.
[0074] Figure 17C shows a top view of the fabric assembly 1700 attached around a portion of the upper housing component 1126. Figure 17C shows the drawstring 1714 only partially tightened, leaving an annular gap between the opening defined by the fabric assembly 1700 and the opening defined by the upper housing component 1126. Figure 17D shows how the drawstring 1714 can be threaded through the opening 1708 defined by the mounting frame 1502, and then the fabric assembly 1700 can be tightened evenly around the periphery of the mounting frame 1502.
[0075] FIG. 18 shows an exploded view of halo assembly 1800. The halo assembly includes upper ring 1802 and lower ring 1804, which are coupled together by fasteners 1806. Both upper ring 1802 and lower ring 1804 cooperatively define threads around their respective peripheries. The threads allow the rings to be twisted into position within the interior volume of the speaker enclosure. The bottom surface of upper ring 1802 and the top surface of lower ring 1804 have complementary geometries that allow the two rings to be radially aligned. Furthermore, when the rings are radially aligned, the peripheral threads continue smoothly across the interface between the two rings. For example, the lower ring includes a tapered feature 1808 that aligns with a recessed feature 1810 when the two rings are radially aligned. As a result of radially aligning rings 1802 and 1804, fastener openings 1812 also align with fastener openings 1814. Upper ring 1802 can include additional openings adjacent each opening 1812, the additional openings configured to receive additional fasteners for securing other internal components to halo assembly 1800. An inward-facing surface of upper ring 1802 can include protrusions that help thicken a portion of upper ring 1802, the upper ring including openings configured to receive fasteners. Halo assembly 1800 also includes seal 1124, which can be disposed in groove 1816 and can function to prevent acoustic waves from propagating around the periphery of halo assembly 1800.
[0076] FIG. 18 also illustrates a flex connector assembly 1820. The flex connector assembly 1820 can be configured to electrically connect components distributed throughout the speaker enclosure. Specifically, the flex connector assembly can extend through an opening 1818 in the upper ring 1802 to reach electrical component connectors disposed above the halo assembly 1800. Also, in some embodiments, the ring 1804 can include an opening aligned with the opening 1818 to allow a flex connector substrate 1822 to pass through. The flex connector substrate 1822 can take the form of a polyimide substrate. In some embodiments, the flex connector assembly 1820 includes a board-to-board connector 1824 configured to electrically connect with electrical components such as the touch PCB 1514 (see FIG. 15 ). The flex connector assembly 1820 can include other connectors, such as a connector 1826, configured to electrically connect with a speaker driver at the bottom end of an associated speaker device.
[0077] 19 shows a partial cross-sectional view of a speaker device with a halo assembly 1800 mounted therein. The upper ring 1802 and the lower ring 1804 are shown in direct contact. After the upper ring 1802 and the lower ring 1804 are rotated along the threads 1902 of the housing component 208, fasteners 1806 are shown securing the two rings together. Before the fasteners 1806 secure the upper ring 1802 and the lower ring 1804 together, the threads 1904 and 1906 may fit somewhat loosely between the threads 1902. In this manner, the halo assembly is configured to easily rotate into the housing component 208. Once in the correct position, fasteners 1806 cause threads 1904 and 1906 to carry threads 1902, which tighten the halo assembly in place and prevent vibration of halo assembly 1800 relative to housing component 208. Figure 19 also shows how fasteners 1004 associated with flange 1006 secure flange 1006 of subwoofer 802 to upper ring 1802 of halo assembly 1800.
[0078] FIG. 20 illustrates how the upper housing component 1126 can be secured to the halo assembly 1800 by fasteners 2002. The upper housing component 1126 can include fastener openings, such that the fasteners 2002 extend vertically through the upper housing component 1126 and can engage the upper ring 1802 of the halo assembly 1800. A decorative plug 2004 can be inserted into a recess surrounding the opening configured to accommodate the fasteners 2002. The decorative plug 2004 prevents the fabric cover from protruding into the recess and adversely affecting the aesthetic appearance of the speaker equipment. FIG. 20 also illustrates how a seal 1124 can be disposed between the upper ring 1802 and the lower housing component 208, the seal operable to prevent acoustic waves from propagating around the periphery of the upper ring 1802. The speaker may also include a seal 2006 disposed between the upper ring 1802 and the flange 1006, which may assist in preventing acoustic waves from propagating through a central opening in the upper ring 1802. Figure 20 also shows the relative positions of the shoulder threads 1302 of the upper housing component 1126 and the shoulder threads 1304 of the lower housing component 208.
[0079] FIG. 21 shows a perspective view of an alternative upper housing component. The upper housing component 2100 includes diamond-shaped vents 2102. The diamond-shaped vents 2102 can have a shape similar to the pattern of acoustic fabric covering the upper housing component 2100. Even if the diamond-shaped vents 2102 are significantly larger than the pattern of acoustic fabric, having a similar pattern results in the outlines of the patterns aligning. This alignment can significantly reduce the likelihood that a user of a speaker device associated with the upper housing component 2100 will be able to see the vent openings below the acoustic fabric. In some embodiments, the pattern of the acoustic fabric can be aligned with the vents 2102. For example, the acoustic fabric can be aligned so that one of the four or sixteen diamond patterns aligns inside each of the vents 2102. In this manner, the edges of the patterns can be aligned, further reducing the likelihood that a user will be able to see the vents 2102. The upper housing component 2100 may also include a protruding support member 2104 configured to support a convex user interface in accordance with the convex user interface 1500 shown in FIG.
[0080] FIG. 22 shows a diagram illustrating various types of connected electronic devices that can communicate and / or interact with the array speaker 100. In some embodiments, the array speaker 100 can act as a central hub to facilitate home automation. The array speaker's on-board memory 100, or memory accessible through a network accessible by the array speaker 100, can be used to store rules governing the interaction of the various device types shown. The array speaker can then transmit instructions to the disparate devices according to the stored rules. Microphones disposed within the array speaker 100 can be configured to receive voice commands to perform specific actions related to connected electronic devices in a user's home. In some embodiments, a convex user interface can receive commands to adjust various settings on specific connected electronic devices. For example, the array speaker 100 can be configured to receive commands to adjust a smart lock device 2202. In some embodiments, the array speaker 100 can include instructions that enable the smart lock device 2202 to be locked and unlocked in response to voice commands. Additionally, the array speaker 100 can be configured to alert a resident in the home that the smart lock device 2202 has been unlocked. In some embodiments, the array speaker 100 can announce the identity of the user who unlocked the smart lock device 2202. In such a situation, the smart lock device 2202 can be configured to open in response to a command received from an electronic device, such as a cell phone. The array speaker 100 can then identify the user when the cell phone becomes associated with the user. In some embodiments, the array speaker 100 can be configured to interact with other devices in response to activation of the smart lock device 2202. For example, the array speaker can direct the illumination of one or more of the lights 2204 and adjust the temperature of an HVAC system associated with the smart thermometer 2206 in response to an unlocking event.
[0081] 22 also illustrates communication between the array speaker 100 and the smart garage opener 2208. In response to detecting an opening event of the smart garage opener 2208, the array speaker may be configured to perform similar actions as described above with respect to the operation of the smart lock device 2202. In some embodiments, different ones of the lights 2204 may be illuminated in anticipation of a user entering the housing from different directions.
[0082] The array speaker 100 can also be configured to operate different smart devices according to various calendar events associated with an electronic calendar. For example, the array speaker can be configured to disable the surveillance camera 2210 during an event located in the same room as the surveillance camera 2210 if the event is marked private. The array speaker can also be configured to notify one or more users if the window sensor 2212 indicates that a window should be left open after a certain time, day or night. In some embodiments, the array speaker 100 can act as a media hub, collaborating with other components such as the television / monitor 2214 to present both video and audio content in response to various user inputs and / or smart device activities. For example, the television / monitor 2214 may represent a status screen and / or progress monitor showing the status and / or activities being performed by the other components, and the television / monitor may or may not be capable of presenting a graphical interface to a user of the array speaker 100. In some embodiments, the array speaker 100 may be configured to remotely instruct the refrigerator 2216 to send an image of the interior area of the refrigerator 2216 to the user before the user goes out for a scheduled grocery shopping trip. These various operations can be stored in the internal memory of the array speaker 100, while the array speaker 100 can communicate with a cloud service provider that assists in coordinating various activities with the user, and the cloud service provider may or may not be connected to a local area network that includes the array speaker 100. For example, a user can remotely connect to the array speaker 100 with a device such as a smartphone and activate a specific task on a smart component with which the array speaker 100 is communicating.
[0083] In some embodiments, the array speaker can be configured to interact with a wearable display 2218. The wearable display 2218 can take the form of augmented reality or virtual reality goggles that present digital content to the user. If the wearable display 2218 is an augmented reality display, the wearable display 2218 can overlay various control interfaces around the array speaker 100. For example, to make the user interface larger, virtual content can overlay a convex user interface on top of the array speaker 100. In some embodiments, the enlarged user interface can include an expanded display and enlarged control manipulation areas that allow the user to control the array speaker 100 more efficiently and / or with more diverse options. For example, the user interface can be configured to display a virtual graphic equalizer that allows the user to increase or decrease the treble and / or bass output associated with the audio produced by the array speaker 100. In some embodiments, the user can be presented with an overlay that visualizes the various areas of the room covered by each of several speaker drivers included in the array speaker 100. The user can then adjust the audio output specific to a particular region associated with one or more speaker drivers. For example, the user can identify only the illustrated region containing individuals listening to audio output from the array speaker 100. Further, the user can reduce the audio output for a first user in a first region of the array speaker associated with a first audio driver and increase the audio output for a second user in a second region of the array speaker associated with a second audio driver. In this manner, listeners can enjoy audio at a desired volume, and the virtual interface allows the user to quickly identify regions where various listeners are located.In some embodiments, the array speaker 100 may include various indicia that assist circuitry and sensors associated with the wearable display 2218 in orienting virtual content relative to the array speaker 100. For example, because the array speaker 100 is cylindrical, it may be difficult to determine the radial position of each of the speaker drivers within the array speaker 100. Small indicia, such as decorative symbols, may be embedded within the acoustic fabric cover that covers the array speaker 100. In this way, different listening zones may be more accurately associated with the array speaker 100. In some embodiments, the array speaker 100 may include optical sensors configured to identify the positions of various listeners within a room and then modify the audio output to enhance the audio experience of the identified listeners.
[0084] In some embodiments, the wearable display device can be configured to receive optical commands from the array speaker 100. For example, a display associated with a user interface can be configured to output a particular light pattern. An optical sensor in the wearable display device 2218 can identify the light pattern and, in response, alter the display in some way. For example, the type, size, and orientation of the virtual controls displayed by the wearable display 2218 can change according to the output of the display associated with the user interface.
[0085] FIG. 23 is a block diagram illustrating communication and interoperability between the various electrical components of the array speaker 100. A processor 2302 can communicate with the illustrated electrical components. A user interface 2304 can receive user input, which is then received by the processor 2302. In response to the user input, the processor 2302 can interpret and relay signals corresponding to the received user input to other electrical components. For example, the user interface can receive user input instructing an increase in the output of both the subwoofer 2306 and the audio driver assembly 2308. In some embodiments, all of the electrical components can be coupled together by conductive paths established by components such as the flex connector 1820. The conductive paths can route electrical signals to the various electrical components distributed throughout the device housing of the array speaker 100. The array speaker 100 can also include a display system 2312. The display system 2312 can be configured to provide visual feedback to a user of the array speaker 100. For example, visual feedback may be provided in response to an interaction with a voice assistant, such as the Siri® voice assistant manufactured by Apple Inc. of Cupertino, California. In some embodiments, a colorful mosaic pattern array may be presented while processing a voice request and / or when the voice assistant is waiting for a voice request. The array speaker may also include computer-readable medium 2314. The computer-readable medium 2314 may be configured to store or at least cache a certain amount of media files for playback by the subwoofer 2306 and audio driver assembly 2308. In some embodiments, the media files stored on the computer-readable medium 2314 may include, for example, movies, TV shows, photos, recordings, and music videos. In some embodiments, the video portion of the media file may be transmitted to another device for display via the wireless communication system 2316.This may be desirable even when display system 2312 is displaying a video portion, as another device may have a larger or more easily viewable display for a particular user. For example, other display devices may be selected according to the user's location in the room.
[0086] 23 also shows a RAM / ROM component 2318. The RAM / ROM component 2318 may include a RAM (random access memory) for short-term caching of frequently used information and / or information inserted just prior to playback. A ROM (read only memory) may be used to store computer code such as device drivers and lower level code used in the basic operation of the array speaker 100. In some embodiments, the RAM / ROM component 2318 may take the form of two separate components.
[0087] FIG. 23 also illustrates how the array speaker 100 can include a sensor array 2320, including microphones, proximity sensors, touch sensors, accelerometers, etc. The microphones of the sensor array 2320 can be configured to monitor voice commands. In some embodiments, the microphones can be configured to process voice commands only after recognizing a command phrase indicating the user's intent to issue the voice command. The microphones can be scattered radially along the outside of the device housing so that the housing does not occlude or obscure the voice command. Multiple microphones can also be utilized to triangulate the user's location within the room. In certain cases, it may be desirable to optimize audio output or cue an additional smart device (see FIG. 22) according to the determined user location.
[0088] In addition to identifying a user's location through triangulation using spatially distributed microphones, proximity sensors can be distributed along the exterior of the array speaker 100 to assist in identifying the user's presence and / or obstacles around the array speaker 100. In some embodiments, the proximity sensors can be configured to emit infrared pulses that help characterize objects around the array speaker 100. The pulses that reflect back to the sensors can be processed by the processor 2302, which can then characterize any objects around the array speaker 100. In some embodiments, the audio output of the array speaker 100 can be adjusted in situations where surrounding objects significantly alter the expected audio output of the array speaker 100. For example, if the array speaker 100 is placed against a wall or pillar, the infrared sensors can identify obstacles and attenuation, or even disable the output of speaker drivers facing the wall or pillar. The reflected pulses and audio triangulation data can be combined to further refine the user's location sending commands to the array speaker 100. The sensor array 2320 may also include touch sensors that allow a user to input commands along the exterior surface of the array speaker 100. For example, the touch PCB 1514 of the convex user interface shown in Figure 15 is configured to detect user gestures made along the top cover 1542 and interpret the gestures as various commands that are executed by one or more components of the array speaker 100.
[0089] The sensor array 2320 may also include one or more accelerometers. The accelerometers may be configured to measure the tilt of the array speaker 100 relative to a gravitational reference frame, if any. Because the array speaker 100 is optimized to evenly distribute audio content in a room when placed on a flat surface, placing the array speaker 100 on a tilted or slanted surface may adversely affect the acoustic output of the array speaker 100. In response to the accelerometer determining that the array speaker 100 is tilted at an angle greater than 2 degrees, the array speaker may be configured to prompt the user to find a flatter surface on which to place the array speaker. Alternatively, the array speaker may be configured to modify its acoustic output to compensate for the tilt angle. In some embodiments, the accelerometers may also be configured to monitor resonant vibrations, if any, within the array speaker 100. The processor 2302 can then be configured to adjust the audio output to assist the subwoofer 2306 and / or audio driver assembly 2308 in avoiding or reducing the occurrence of frequencies that cause the array speaker 100 to vibrate at one or more resonant frequencies.
[0090] Various aspects, embodiments, implementations, or features of the described embodiments can be used individually or in any combination. Various aspects of the described embodiments can be implemented by software, hardware, or a combination of hardware and software. The described embodiments can also be implemented as computer-readable code on a computer-readable medium for controlling the operation of an array speaker. In some embodiments, the computer-readable medium can include code for interacting with other connected devices in a user's home. For example, the array speaker can be configured to use an ambient light sensor to identify human activity and learn when to activate and deactivate specific devices in the user's home. The computer-readable medium is any data storage device capable of storing data that can subsequently be read by a computer system. Examples of computer-readable media include read-only memory, random-access memory, CD-ROMs, hard disk drives, DVDs, magnetic tape, and optical data storage devices. The computer-readable medium can also be distributed across network-coupled computer systems so that the computer-readable code is stored and executed in a distributed fashion.
[0091] The foregoing description, for purposes of explanation, used specific terminology to provide a thorough understanding of the described embodiments. However, it will be apparent to those skilled in the art that specific details are not required to practice the described embodiments. Thus, the descriptions of the specific embodiments set forth above are presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the described embodiments to the precise forms disclosed. It will be apparent to those skilled in the art that many modifications and variations are possible in light of the above teachings.
Claims
1. A voice-controlled electronic device, comprising: an axisymmetric instrument housing having a longitudinal axis intersecting opposing top and bottom surfaces and a side surface extending between the top and bottom surfaces; a computer readable memory disposed within the axisymmetric machine housing; a plurality of microphones disposed within the axisymmetric instrument housing and radially distributed about the longitudinal axis; a processor disposed within the axisymmetric machine housing and coupled to the computer readable memory, the processor configured to execute computer instructions stored in the computer readable memory to interact with a user and process voice commands received by the plurality of microphones after recognizing command phrases indicative of the user's intent to issue a voice command; a main logic board disposed within the axisymmetric device housing and on which the processor is mounted; a first transducer; a first transducer and a second transducer disposed within the axisymmetric instrument housing and configured to generate acoustic waves within a first frequency range; a third transducer disposed within the axisymmetric instrument housing and configured to generate acoustic waves within a second frequency range lower than the first frequency range, wherein the first transducer and the second transducer are disposed at an angle relative to the third transducer and are distributed around the circumference of the axisymmetric instrument housing; an outer cover having a pattern formed thereon and disposed on the side of the axisymmetric equipment housing concealing an audio component disposed beneath the outer cover, wherein the outer cover provides a matching outer surface for the voice-controlled electronic device, and wherein acoustic waves generated by the first transducer, the second transducer, and the third transducer can pass through the outer cover; a touch-sensitive user interface disposed on the top surface of the axisymmetric device housing and configured to adjust speaker volume; a second circuit board disposed within the axisymmetric instrument housing, wherein the third transducer includes a diaphragm configured to cool the second circuit board by pushing air toward the second circuit board during operation; a power supply unit disposed within the axisymmetric device housing and configured to provide power to the voice-controlled electronic device; A voice-controlled electronic device comprising:
2. The voice-controlled electronic device of claim 1 , wherein the voice-controlled electronic device is configured to identify a user's location by triangulation using the multiple microphones.
3. The voice-controlled electronic device of claim 1 , wherein the touch-sensitive user interface includes a capacitive touch sensor.
4. The voice-controlled electronic device of claim 1 , further comprising a wireless communication system disposed within the axisymmetric device housing.
5. The voice-controlled electronic device of claim 1 , further comprising circuitry configured to implement beamforming techniques to improve audio performance.
6. The voice-controlled electronic device of claim 5 , wherein the beamforming technique produces constructive interference.
7. The voice-controlled electronic device of claim 1 , wherein the processor is configured to process commands for operating a smart device.
8. The voice-controlled electronic device of claim 7 , wherein the processor is configured to modify the output of the first transducer or the second transducer based on feedback from the plurality of microphones.
9. The voice-controlled electronic device of claim 1 , wherein the top and bottom surfaces of the axisymmetric device housing are parallel to each other and generally perpendicular to the side surfaces.
10. 10. The voice-controlled electronic device of claim 1, wherein the first transducer is part of a transducer array including a plurality of transducers distributed radially around the axisymmetric device housing.
11. 1. A voice-controlled speaker, comprising: A device housing; a plurality of microphones disposed within the device housing; a computer-readable memory disposed within the device housing; a processor disposed within the device housing and coupled to the computer-readable memory, the processor configured to execute computer instructions stored in the computer-readable memory to interact with a user and process voice commands received by the plurality of microphones after recognizing command phrases indicative of the user's intent to issue a voice command; a circuit board disposed within the device housing and on which the processor is mounted; a first transducer and a second transducer disposed within the device housing and configured to generate acoustic waves within a first frequency range; a third transducer disposed within the device housing and configured to generate acoustic waves within a second frequency range lower than the first frequency range, wherein the first transducer and the second transducer are disposed at an angle relative to the third transducer to direct sound away from the device housing, the third transducer including a diaphragm aligned parallel to the circuit board, wherein during operation, when the third transducer generates sound, air is moved across the circuit board to dissipate heat generated by the processor from the processor; an outer cover having a pattern formed thereon and forming at least a portion of an outer surface of the voice-controlled speaker concealing an audio component disposed beneath the outer cover, wherein the outer cover allows acoustic waves generated by the first transducer and the second transducer to pass through the outer cover; a touch-sensitive user interface disposed on an exterior surface of the device housing, the touch-sensitive user interface configured to allow a user to adjust a volume level of the voice-controlled speaker; a power supply unit disposed within the device housing and configured to provide power to the voice-controlled speaker; A voice-controlled speaker comprising:
12. 12. The voice-controlled speaker of claim 11, further comprising a sensor disposed within the device housing and configured to detect a high thermal load condition.
13. 13. The voice-controlled speaker of claim 12, wherein the sensor is mounted on a surface of the circuit board.
14. 12. The voice-controlled speaker of claim 11, further comprising a plurality of vents located along within the device housing, wherein acoustic waves generated by the third transducer exit the voice-controlled speaker through the plurality of vents.
15. 15. The voice-controlled speaker of claim 14, further comprising one or more flow sensors disposed between the third transducer and the plurality of vents to detect vent blockages.
16. 12. The voice-controlled speaker of claim 11, wherein the third transducer is configured to operate at an infrasound frequency designed to maximize the amount of air moved across the circuit board.
17. 12. The voice-controlled speaker of claim 11, wherein the processor is configured to interact with a user interface on a mobile device to adjust treble or bass output.
18. 12. The voice-controlled speaker of claim 11, further comprising circuitry configured to implement beamforming techniques to improve audio performance.
19. 20. The voice-controlled speaker of claim 18, wherein the beamforming technique produces constructive interference.
20. 12. The voice-controlled speaker of claim 11, wherein the processor is configured to process commands for operating a smart device.
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