Display and optical semiconductor element encapsulation sheets

Abstract

To provide a display body which hardly causes brightness unevenness and has high brightness.SOLUTION: A display body 1 includes a substrate 2, a plurality of optical semiconductor elements 3a to 3c arranged on the substrate 2, and a sealing resin layer 4 for sealing the plurality of optical semiconductor elements 3a to 3c. The sealing resin layer 4 includes a diffusion function layer 41 and a non-diffusion function layer 42. When a distance between the surface of the substrate 2 and an end TA on a front side of a center GA of gravity of the optical semiconductor element 3a is represented by LA, a distance between the surface of the substrate 2 and an end TC on a front side of the diffusion function layer 41 in a vertical line PC relative to the surface of the substrate 2 passing through a middle point C of the center GA of gravity of the optical semiconductor element 3a, and a center GB of gravity of the adjacent optical semiconductor element 3b in the same pixel 3 as the optical semiconductor element 3a is represented by LC, a distance between a vertical line PA relative to the surface of the substrate 2 passing through the end TA and the vertical line PC relative to the surface of the substrate 2 passing through the end TC is represented by LA-C, and an angle of an elevation angle from the end TA to the vertical line PC is represented by θ°, the display body satisfies the following expression (1): LC≤LA+LA-Ctanθ.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a display body and a sheet for encapsulating an optical semiconductor element. More specifically, the present invention relates to a display body in which an optical semiconductor element of, for example, a self-luminous display device is encapsulated, and a sheet suitable for use in encapsulating an optical semiconductor element. [Background technology]

[0002] In recent years, self-emitting display devices, such as mini / micro LED display devices (Mini / Micro Light Emitting Diode Displays), have been devised as next-generation display devices. Mini / micro LED display devices basically consist of a substrate on which numerous tiny optical semiconductor elements (LED chips) are densely arranged, used as a display panel, with the optical semiconductor elements encapsulated in an encapsulant and a cover member such as a resin film or glass plate laminated on the outermost surface.

[0003] In displays equipped with self-luminous display devices such as mini / micro LED display devices, wiring (metal wiring) made of metal or metal oxide such as ITO is arranged on the substrate of the display panel. Such display devices have a problem in that, for example, when the light is off, the metal wiring reflects light, making the screen look bad and resulting in poor design. For this reason, a technology has been adopted in which an anti-reflection layer is used as an encapsulant for encapsulating optical semiconductor elements to prevent reflection from the metal wiring.

[0004] Furthermore, displays using self-luminous display devices have the problem of uneven brightness (luminance unevenness) caused by the light source of the optical semiconductor element. When uneven brightness occurs, a phenomenon called "color shift" occurs, in which the color tone changes when viewed from the front and when viewed from an oblique angle.

[0005] Patent Document 1 discloses an adhesive sheet capable of suppressing brightness unevenness, which is a laminate of a colored adhesive layer and a colorless adhesive layer, with the colorless adhesive layer positioned so as to be in contact with an optical semiconductor element. It is described that when the adhesive sheet is brought into contact with and conforms to the uneven shape formed by a substrate and an optical semiconductor element mounted on the substrate, the colorless adhesive layer comes into contact with the unevenness, and the unevenness is absorbed to some extent by the colorless adhesive layer, thereby suppressing compression and deformation of the colored adhesive layer, thereby suppressing unevenness in transmittance in the adhesive layer and brightness unevenness. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2020-169262 Summary of the Invention [Problem to be solved by the invention]

[0007] However, although adhesive sheets having a colored adhesive layer are expected to prevent reflections from metal wiring and suppress brightness unevenness when encapsulating an optical semiconductor element, they also hinder the transmission of light emitted by the optical semiconductor element in oblique directions from the front, resulting in a problem of reduced front brightness of the display. When the front brightness decreases, power consumption increases in order to increase the brightness. For this reason, there is a demand for displays that have high brightness while reducing brightness unevenness.

[0008] The present invention was conceived under these circumstances, and an object of the present invention is to provide a display that is less likely to cause uneven brightness and has high brightness. Another object of the present invention is to provide a sheet for encapsulating semiconductor elements that can be used to produce a display that is less likely to cause uneven brightness and has high brightness by encapsulating an optical semiconductor element. [Means for solving the problem]

[0009] As a result of intensive research to achieve the above object, the inventors have found that, when a plurality of optical semiconductor elements arranged on a substrate are encapsulated with an encapsulating resin layer including a diffusion functional layer and a non-diffusion functional layer, a display having a structure in which the height of the front edge of the diffusion functional layer in the center between two nearest optical semiconductor elements is equal to or less than a certain height relative to the height of the front edge of the optical semiconductor elements can reduce brightness unevenness and achieve high brightness. The present invention was completed based on these findings.

[0010] That is, the present invention provides a display comprising a substrate, a plurality of optical semiconductor elements arranged on the substrate, and a sealing resin layer that seals the plurality of optical semiconductor elements, the sealing resin layer includes a diffusion functional layer and a non-diffusion functional layer, From the surface of the substrate, the end T A Distance to L A , A line perpendicular to the substrate surface passing through the midpoint between the center of gravity of the first optical semiconductor element and the center of gravity of a second optical semiconductor element adjacent to the first optical semiconductor element in the same pixel from the substrate surface to the front end T of the diffusion functional layer C Distance to L C , Above end T A From the perpendicular line to the substrate passing through the edge T C The distance to the perpendicular line to the board passing through L A-C , Above end T A From the above end T C When the angle of elevation with respect to a line perpendicular to the substrate passing through the line is θ°, the display satisfies the following formula (1): L C ≦L A +L A-C tanθ (1)

[0011] In the display body, the encapsulating resin layer encapsulating the optical semiconductor elements includes the diffusion functional layer, so that the light emitted by the optical semiconductor elements is diffused in the diffusion functional layer, thereby making it possible to further increase the front brightness and further suppress brightness unevenness. C is the distance L A than L A-C By being below the high tan θ position, the tan θ is sufficiently low according to the distance between the optical semiconductor elements, and the diffusion functional layer can sufficiently diffuse the light emitted by the optical semiconductor elements, for example, the light emitted from the side in addition to the light emitted from the front, allowing the light to transmit over a sufficiently wide field of view, suppressing brightness unevenness and increasing the front brightness of the display body.

[0012] The height of the optical semiconductor element on the substrate is preferably 500 μm or less. When the height is 500 μm or less, the sealing resin layer is more excellent in conformity to the uneven shape formed by the optical semiconductor element and the substrate surface.

[0013] The diffusion functional layer preferably has adhesiveness. With such a configuration, the encapsulating resin layer can easily encapsulate the optical semiconductor element, and also has excellent adhesion between the layers, resulting in superior encapsulation of the optical semiconductor element.

[0014] The display preferably comprises a self-luminous display device.

[0015] The display is preferably an image display device.

[0016] The present invention also provides a sheet for encapsulating a plurality of optical semiconductor elements arranged on a substrate, comprising: the sheet includes a sealing resin layer including a diffusion functional layer and a non-diffusion functional layer, When the plurality of optical semiconductor elements are encapsulated with the encapsulating resin layer to form the encapsulating resin layer, From the surface of the substrate, the end TA Distance to L A , A line perpendicular to the substrate surface passing through the midpoint between the center of gravity of the first optical semiconductor element and the center of gravity of a second optical semiconductor element adjacent to the first optical semiconductor element in the same pixel from the substrate surface to the front end T of the diffusion functional layer C Distance to L C , Above end T A From the perpendicular line to the substrate passing through the edge T C The distance to the perpendicular line to the board passing through L A-C , Above end T A From the above end T C The present invention provides a sheet for encapsulating an optical semiconductor element, which satisfies the following formula (1), where θ° is the angle of elevation of the sheet with respect to a perpendicular line passing through the substrate. L C ≦L A +L A-C tanθ (1)

[0017] The diffusion function layer preferably has adhesiveness. [Effects of the Invention]

[0018] The display of the present invention is highly luminous and resistant to uneven brightness due to light emitted by optical semiconductor elements. Therefore, the display is less susceptible to color shift and can be viewed with the same color from a wide field of view. Furthermore, the display is bright and looks good without increasing power consumption. Furthermore, the sheet for encapsulating optical semiconductor elements of the present invention can encapsulate optical semiconductor elements to provide a highly luminous display that is less susceptible to uneven brightness. [Brief explanation of the drawings]

[0019] [Figure 1] FIG. 1 is a partial top view of an optical member in which a plurality of optical semiconductor elements are arranged on a substrate in pixel units. [Figure 2] 1 is a partial cross-sectional view showing an embodiment of a display of the present invention. [Figure 3]FIG. 3 is a partially enlarged view of the display shown in FIG. [Figure 4] 3 is a partial cross-sectional view showing how an optical semiconductor element of the display shown in FIG. 2 emits light. FIG. [Figure 5] FIG. 10 is a partial cross-sectional view showing how an optical semiconductor element of a conventional display emits light. [Figure 6] FIG. 10 is a partial cross-sectional view showing another embodiment of the display of the present invention. [Figure 7] FIG. 10 is a partial cross-sectional view showing still another embodiment of the display of the present invention. [Figure 8] 1 is a cross-sectional view showing one embodiment of a sheet for encapsulating an optical semiconductor element of the present invention. [Figure 9] 9 is a partial cross-sectional view showing a step of encapsulating an optical semiconductor element using the optical semiconductor element encapsulation sheet shown in FIG. 8. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0020] [Display] The display of the present invention includes at least a substrate, a plurality of optical semiconductor elements arranged on the substrate, and an encapsulating resin layer encapsulating the plurality of optical semiconductor elements. The display is a device for displaying information using light emitted by the optical semiconductor elements.

[0021] Examples of the optical semiconductor element include light emitting diodes (LEDs) such as blue light emitting diodes, green light emitting diodes, red light emitting diodes, and ultraviolet light emitting diodes.

[0022] The plurality of optical semiconductor elements are arranged within one pixel (picture element) on the substrate, and a plurality of pixels are arranged. That is, the plurality of optical semiconductor elements are arranged for each pixel including a plurality of optical semiconductor elements. FIG. 1 shows a partial top view of an optical member in which a plurality of optical semiconductor elements are arranged for each pixel on a substrate. In the optical member 11 shown in FIG. 1, three optical semiconductor elements 3a to 3c are arranged closely to each other on a substrate 2, and the three optical semiconductor elements 3a to 3c form one pixel (pixel 3). Furthermore, three optical semiconductor elements 3d to 3f are arranged closely to each other on the substrate 2, and the three optical semiconductor elements 3d to 3f form one pixel (pixel 3'). A plurality of pixels, such as pixel 3 and pixel 3', are arranged on the substrate 2.

[0023] The display of the present invention has an uneven shape formed by the substrate and the optical semiconductor elements, with the substrate surface in the area between the two closest optical semiconductor elements where no optical semiconductor elements are placed being a recess and the optical semiconductor elements being a protrusion.

[0024] The height of the optical semiconductor element on the substrate (the height from the surface of the substrate to the edge of the front side of the optical semiconductor element. A When the height is 500 μm or less, the sealing resin layer has better ability to conform to the uneven shape.

[0025] It is preferable that the encapsulating resin layer contacts the plurality of optical semiconductor elements and conforms to the uneven shape. It is also preferable that the encapsulating resin layer collectively encapsulates the plurality of optical semiconductor elements. In this specification, "encapsulating the optical semiconductor elements" means embedding at least a portion of the optical semiconductor elements in the encapsulating resin layer or conforming to and covering the optical semiconductor elements with the encapsulating resin layer.

[0026] The encapsulating resin layer includes at least a diffusion functional layer and a non-diffusion functional layer. In the encapsulating resin layer, the diffusion functional layer and the non-diffusion functional layer may be laminated directly or via another layer. The encapsulating resin layer may encapsulate the optical semiconductor element such that the diffusion functional layer side faces the optical semiconductor element, or such that the non-diffusion functional layer side faces the optical semiconductor element.

[0027] Any one of the plurality of optical semiconductor elements is defined as a first optical semiconductor element. An optical semiconductor element adjacent to the first optical semiconductor element in the same pixel is defined as a second optical semiconductor element. A distance T from the surface of the substrate to the front side of the center of gravity of the first optical semiconductor element is 1 / 2. A Distance to L A The end T of the diffusion functional layer on the front side of the substrate surface is defined as a line perpendicular to the substrate surface, passing through the midpoint between the center of gravity of the first optical semiconductor element and the center of gravity of the second optical semiconductor element. C Distance to L C The above end T A From the perpendicular line to the substrate surface passing through the edge T C The distance to the perpendicular line to the substrate surface that passes through A-C Then, the end T A From the above end T C The elevation angle with respect to the perpendicular line to the substrate surface passing through the line is defined as θ°. In this case, the display of the present invention satisfies the following formula (1). L C ≦L A +L A-C tanθ (1)

[0028] In the display body, the encapsulating resin layer encapsulating the optical semiconductor elements includes the diffusion functional layer, so that the light emitted by the optical semiconductor elements is diffused in the diffusion functional layer, thereby making it possible to further increase the front brightness and further suppress brightness unevenness. C is the distance L A More than L A-CBy being below the high tan θ position, the tan θ is sufficiently low according to the distance between the optical semiconductor elements, and the diffusion functional layer can sufficiently diffuse the light emitted by the optical semiconductor elements, for example, the light emitted from the side in addition to the light emitted from the front, allowing the light to transmit over a sufficiently wide field of view, suppressing brightness unevenness and increasing the front brightness of the display body.

[0029] In this specification, the term "front" refers to the side from which the display is viewed, and is, for example, the upward direction in FIG. 2 described later.

[0030] (First embodiment) The display of the present invention will be described using one embodiment of the display shown in Fig. 2. The display 1 shown in Fig. 2 includes a substrate 2, a plurality of optical semiconductor elements 3a to 3c arranged on the substrate 2, an encapsulating resin layer 4 that collectively encapsulates the optical semiconductor elements 3a to 3c, and a base material part 5 that is bonded to the surface of the encapsulating resin layer 4 on the side opposite to the optical semiconductor elements 3a to 3c. Fig. 2 is an enlarged view of a vertical cross section with respect to the substrate 2 that passes through the centers of gravity of the optical semiconductor elements 3a to 3c.

[0031] Each of the optical semiconductor elements 3a to 3c is fixed onto one substrate 2 by a support 31. The display 1 has an uneven shape formed by the substrate 2 and the optical semiconductor elements 3a to 3c, with the surface of the substrate 2 in areas between the optical semiconductor elements 3a to 3c where no optical semiconductor elements are arranged being recessed portions N and the optical semiconductor elements 3a to 3c being protruding portions P.

[0032] 2 are the optical semiconductor elements 3a to 3c shown in FIG. 1, and the optical semiconductor elements 3a to 3c are located within the same pixel 3. For example, the optical semiconductor element 3a is a first optical semiconductor element, and the optical semiconductor element 3b is a second optical semiconductor element adjacent to the optical semiconductor element 3a.

[0033] As shown in FIG. 2, the sealing resin layer 4 comes into contact with the plurality of optical semiconductor elements 3a to 3c, conforms to the uneven shape, and seals the plurality of optical semiconductor elements 3a to 3c collectively.

[0034] The sealing resin layer 4 is configured by directly laminating a diffusion function layer 41 and a non-diffusion function layer 42, and seals the optical semiconductor elements 3a to 3c so that the diffusion function layer 41 side faces the optical semiconductor elements 3a to 3c. The diffusion function layer 41 in contact with the optical semiconductor elements 3a to 3c follows the uneven shape described above, and the diffusion function layer 41 also has an uneven shape in the display body 1. On the other hand, one surface of the non-diffusion function layer 42 follows the uneven shape of the diffusion function layer 41, and therefore has an uneven shape that is the opposite of the uneven shape of the diffusion function layer 41, and the other surface is flat.

[0035] That is, the encapsulating resin layer 4 includes, from the optical semiconductor element side 3a to 3c, a diffusion function layer 41 and a non-diffusion function layer 42 in this order. The encapsulating resin layer 4 encapsulates the optical semiconductor elements 3a to 3c such that the diffusion function layer 41 is in contact with the optical semiconductor elements 3a to 3c.

[0036] 3 is a partially enlarged view of the area between the optical semiconductor elements 3a and 3b of the display 1 shown in FIG. 3. As shown in FIG. 3, in the display 1, the distance between the surface of the substrate 2 and the center of gravity G of the optical semiconductor element 3a is A Front end T A Distance to L A Let's say. L A corresponds to the height of the optical semiconductor element 3a. The center of gravity G of the optical semiconductor element 3a A The perpendicular line to the surface of substrate 2 that passes through A End T A is the center of gravity G A Normal line P to the surface of substrate 2 passing through A and the front surface of the optical semiconductor element 3a. A and the center of gravity G of the optical semiconductor element 3b B The midpoint of the two lines is C. The perpendicular line to the surface of the substrate 2 that passes through the midpoint C is called the perpendicular line P C Let P be the perpendicular line C The end T of the diffusion functional layer 41 on the front side C Distance to L C End T C is the perpendicular P C and the front interface of the diffusion functional layer 21, and corresponds to the height from the surface of the substrate 2 at the midpoint C to the front interface of the diffusion functional layer 21.C The perpendicular line P may be located closer to the substrate 2 (lower side in the drawing) than the midpoint C, or may be located closer to the front side (upper side in the drawing). A Perpendicular line P from C Distance to L A-C Let P be the perpendicular line A and perpendicular P C are parallel. And the end T A Perpendicular line P from C When the angle of elevation to the vertical line P is θ°, the display 1 satisfies the above formula (1). C At this point, the height from the surface of substrate 2 is L A +L A-C The point at the position of tanθ is denoted by T.

[0037] In the display 1, the encapsulating resin layer 4 that encapsulates the optical semiconductor elements 3a to 3c includes the diffusion functional layer 41, so that the light emitted by the optical semiconductor elements 3a to 3c is diffused in the diffusion functional layer 41, thereby making it possible to further increase the front brightness and further suppress brightness unevenness. C The height of the distance L C is the center of gravity G of the optical semiconductor element 3a A Front end T A The height of the distance L A than L A-C By being below the high tan θ position, it is sufficiently low according to the distance between the optical semiconductor elements 3a and 3b, and the diffusion function layer 41 can sufficiently diffuse the light emitted by the optical semiconductor element 3a, for example, the light emitted from the side in addition to the light emitted from the front, allowing the light to transmit over a sufficiently wide field of view, suppressing brightness unevenness and increasing the front brightness of the display 1.

[0038] In addition, in Figure 3, the case where optical semiconductor element 3a located at one end within a pixel satisfies the above formula (1) has been described. However, in addition to or instead of this case, the above formula (1) may be satisfied when an optical semiconductor element located within a pixel, such as optical semiconductor element 3b, is designated as the first optical semiconductor element, and an optical semiconductor element adjacent to the optical semiconductor element within the pixel, such as optical semiconductor element 3a and / or optical semiconductor element 3c, is designated as the second optical semiconductor element, or the above formula (1) may be satisfied when an optical semiconductor element located at the other end within a pixel, such as optical semiconductor element 3c, is designated as the first optical semiconductor element, and an optical semiconductor element adjacent to the optical semiconductor element located at the other end within the pixel, such as optical semiconductor element 3b, is designated as the second optical semiconductor element.

[0039] Furthermore, it is preferable that all optical semiconductor elements within the same pixel satisfy the above formula (1) in relation to all adjacent optical semiconductor elements. In this case, for example, the diffusion functional layer 41 can sufficiently diffuse light emitted from all optical semiconductor elements 3a to 3c within the same pixel shown in Fig. 2, for example, light emitted from the side in addition to light emitted from the front, and the light can be transmitted over a sufficiently wide field of view, brightness unevenness can be suppressed, and the front brightness of the display 1 can be further increased.

[0040] Specifically, as shown in FIG. 4, light F emitted from the optical semiconductor elements 3a to 3c toward the front is A , F B , and F C In addition, the light L emitted by the optical semiconductor elements 3a to 3c is directed to the side surfaces. A ,R A ,L B ,R B ,L C , and R C is diffused within the diffusion functional layer 41, increasing the amount of light in the front direction and in the front oblique direction, and is emitted uniformly and efficiently to the front side. This allows the light to be transmitted over a sufficiently wide field of view, suppressing brightness unevenness and increasing the front brightness of the display unit.

[0041] On the other hand, Fig. 5 shows one embodiment of a conventional display. The display shown in Fig. 5 includes, in order from the optical semiconductor element side, a non-diffusion functional layer 42 and a diffusion functional layer 41, and the front-side interface of the diffusion functional layer 41 between the optical semiconductor elements 3a and 3b is located farther toward the front side than the front-side end of the optical semiconductor elements 3a to 3c, and does not satisfy the above formula (1). In the display shown in Fig. 5, the light L emitted by the optical semiconductor elements 3a to 3c toward the side faces A ,R A ,L B ,R B ,L C , and R C Since the light emitted from the optical semiconductor element is radiated into the non-diffusion functional layer 42, it is not diffused, and the amount of light emitted in the front direction and in the front oblique direction is small. As a result, the brightness in front of the display is low, and the light emitted by the optical semiconductor element cannot be sufficiently transmitted over a wide field of view in front of the display, which may result in brightness unevenness. In contrast, a display of the present invention that satisfies the above formula (1) can have high front brightness and excellent suppression of brightness unevenness.

[0042] In this way, by satisfying the above formula (1), the display of the present invention has a sufficiently low height of the diffusion functional layer between the optical semiconductor elements according to the distance between the optical semiconductor elements, and the light emitted by the optical semiconductor elements in the lateral direction is easily diffused in the front direction and in the front oblique direction, allowing the light to be transmitted over a sufficiently wide field of view, suppressing brightness unevenness and increasing the front brightness of the display.

[0043] The value of θ is not particularly limited, and is set appropriately depending on the field of view in which the brightness unevenness of the display should be suppressed. θ is, for example, 0° or more and less than 90°, preferably 45° or less, more preferably 30° or less, and may be 25° or less or 20° or less, and particularly preferably 15° or less. When θ is within the above range, brightness unevenness is suppressed over a wide field of view. Therefore, in the above formula (1), θ is preferably 45°, 30°, 25°, 20°, or 15°, and is preferably 0° (in this case, L C ≦L A ) may also be used.

[0044] The center of gravity of the optical semiconductor element (the center of gravity G of the optical semiconductor element 3a in FIG. 3)A , the center of gravity G of the optical semiconductor element 3b B The center of gravity of the optical semiconductor element is determined by the three-dimensional shape of the optical semiconductor element. The three-dimensional shape of the optical semiconductor element is not particularly limited, and examples include a rectangular prism such as a cube or rectangular parallelepiped, a truncated pyramid, a cylinder, a truncated cone, and shapes with a dome-shaped upper portion of any of these. When the three-dimensional shape of the optical semiconductor element is a regular prism, the center of gravity is the center of the optical semiconductor element.

[0045] The display 1 does not necessarily have to include the substrate 5. The number of optical semiconductor elements in one pixel does not have to be three, and is not particularly limited.

[0046] Second Embodiment Another embodiment (second embodiment) of the display of the present invention is shown in Fig. 6. Similar to Fig. 2, the display 1 shown in Fig. 6 includes a substrate 2, a plurality of optical semiconductor elements 3a to 3c arranged on the substrate 2, an encapsulating resin layer 4 that collectively encapsulates these optical semiconductor elements 3a to 3c, and a base member 5 bonded to the surface of the encapsulating resin layer 4 opposite to the optical semiconductor elements 3a to 3c.

[0047] In the display element 1 shown in Figure 6, the sealing resin layer 4 is constructed by laminating a non-diffusion functional layer 43, a diffusion functional layer 41, and a non-diffusion functional layer 42 in order from the optical semiconductor elements 3a to 3c side, and seals the optical semiconductor elements 3a to 3c so that the non-diffusion functional layer 43 side faces the optical semiconductor elements 3a to 3c and the non-diffusion functional layer 43 is in contact with the optical semiconductor elements 3a to 3c.

[0048] The non-diffusion functional layer 43 in contact with the optical semiconductor elements 3a to 3c conforms to the above-mentioned uneven shape, and one surface of the diffusion functional layer 41 conforms to the uneven shape of the non-diffusion functional layer 43, thereby having an uneven shape that is the opposite of the uneven shape of the non-diffusion functional layer 43, and the other surface is flat. The non-diffusion functional layer 42 in contact with the diffusion functional layer 41 has flat surfaces on both sides. The display 1 shown in FIG. 6 also satisfies the above formula (1). The rest is the same as the display 1 shown in FIG. 2.

[0049] (Third embodiment) Another embodiment (third embodiment) of the display of the present invention is shown in Fig. 7. Similar to Fig. 2, the display 1 shown in Fig. 7 includes a substrate 2, a plurality of optical semiconductor elements 3a to 3c arranged on the substrate 2, an encapsulating resin layer 4 that collectively encapsulates these optical semiconductor elements 3a to 3c, and a base member 5 bonded to the surface of the encapsulating resin layer 4 opposite to the optical semiconductor elements 3a to 3c.

[0050] In the display element 1 shown in Figure 7, the sealing resin layer 4 is composed of a diffusion function layer 41, a colored layer 44, and a non-diffusion function layer 42 laminated in this order from the optical semiconductor elements 3a to 3c side, and seals the optical semiconductor elements 3a to 3c so that the diffusion function layer 41 side faces the optical semiconductor elements 3a to 3c and the diffusion function layer 41 is in contact with the optical semiconductor elements 3a to 3c.

[0051] The diffusion function layer 41 in contact with the optical semiconductor elements 3a to 3c conforms to the uneven shape, and the diffusion function layer 41 in the display 1 also has an uneven shape. One surface of the colored layer 44 conforms to the uneven shape of the diffusion function layer 41, and thus has an uneven shape that is the opposite of the uneven shape of the diffusion function layer 41, and the other surface is flat. The diffusion function layer 42 in contact with the colored layer 44 has flat surfaces on both sides. The display 1 shown in FIG. 7 also satisfies the above formula (1). The rest is the same as the display 1 shown in FIG. 2.

[0052] The cross-sectional views of the display body shown in Figures 2 to 7 can be obtained, for example, by exposing the cross section by cutting the display body in a cooled state perpendicular to the substrate surface so as to pass through the center of gravity of the multiple optical semiconductor elements. Cooling the display body can prevent the encapsulating resin layer from melting or deforming due to the heat generated during cutting. Cutting can be performed using a known or commonly used cutting device such as a laser beam irradiator or ion beam irradiator. After cutting, the exposed cross section may be milled to expose a cross section with a lower degree of deformation. The cooling temperature is appropriately set within a range that prevents the degree of deformation of the encapsulating resin layer and cracking of the display body.

[0053] <Sealing resin layer> The encapsulating resin layer includes at least the diffusion functional layer and the non-diffusion functional layer. Each layer constituting the encapsulating resin layer (such as the diffusion functional layer and the non-diffusion functional layer) may be a single layer within the encapsulating resin layer, or may be multiple layers having the same or different compositions. When multiple diffusion functional layers or non-diffusion functional layers are included, the multiple layers may be stacked in contact with each other or may be stacked separately. The total number of layers constituting the encapsulating resin layer is two or more, including the diffusion functional layer and the non-diffusion functional layer, and may be three or more. From the viewpoint of reducing the thickness of the display body, the total number of layers may be, for example, 10 or less, 5 or less, or 4 or less.

[0054] In the display of the present invention, the encapsulating resin layer preferably includes the diffusing functional layer and the non-diffusing functional layer in this order from the optical semiconductor element side. This configuration prevents the uneven surface of the diffusing functional layer from being exposed on the front surface of the encapsulating resin layer (opposite the optical semiconductor element side), and also makes the front surface of the encapsulating resin layer more likely to be flat, reducing the likelihood of diffused reflection of external light, improving the appearance of the display both when the display is turned on and when the display is off. In the display 1 shown in Figures 2, 6, and 7, the encapsulating resin layer 4 includes the diffusing functional layer 41 and the non-diffusing functional layer 42 in this order from the optical semiconductor element side.

[0055] The sealing resin layer may include a colored layer. When a colored layer is included, it is possible to prevent light reflection due to metal wiring or the like provided on the substrate. In the display 1 shown in FIG. 7, the sealing resin layer 4 includes a colored layer 44.

[0056] When the encapsulating resin layer includes the colored layer, the encapsulating resin layer preferably includes, from the optical semiconductor element side, the diffusion functional layer, the colored layer, and the non-diffusion functional layer in this order. With this configuration, it is possible to further increase the front luminance, further suppress luminance unevenness, and further improve the appearance of the display body both when it is turned on and when it is turned off.

[0057] In the display of the present invention, it is preferable that at least one surface of the diffusion function layer (particularly the surface on the optical semiconductor element side) has an uneven shape that follows the uneven shape. In this case, the display of the present invention is more likely to satisfy the above formula (1). Furthermore, the front surface of the diffusion function layer may have an uneven shape that follows the uneven shape. In the display 1 shown in Figures 2 and 7, the diffusion function layer 41 has an uneven shape on both the front side and the optical semiconductor element side. In the display 1 shown in Figure 6, only the surface of the diffusion function layer 41 on the optical semiconductor element side has an uneven shape, and the front surface is flat.

[0058] In the display of the present invention, the non-diffusion functional layer located closer to the front than the diffusion functional layer preferably has a flat front surface. In this case, diffuse reflection of external light is less likely to occur on the surface of the sealing resin layer, improving the appearance of the display both when the display is turned on and when the display is off. In the display 1 shown in Figures 2, 6, and 7, the front surface of the non-diffusion functional layer 42 is flat.

[0059] In the display of the present invention, when the display has the colored layer, it is preferable that at least one surface of the colored layer (particularly the surface on the optical semiconductor element side) has an uneven shape that follows the uneven shape. In this case, the front brightness is further increased. In the display 1 shown in Fig. 7, only the surface of the colored layer 44 on the optical semiconductor element side has an uneven shape, and the surface on the front side is flat.

[0060] In the display member of the present invention, the non-diffusion functional layer may be provided on the optical semiconductor element side of the diffusion functional layer. That is, the encapsulating resin layer may include the non-diffusion functional layer and the diffusion functional layer in this order from the optical semiconductor element side. Furthermore, when the non-diffusion functional layer is provided on the optical semiconductor element side of the diffusion functional layer, it is preferable that both surfaces of the non-diffusion functional layer have an uneven shape that follows the uneven shape. With such a configuration, the diffusion functional layer is likely to have an uneven shape. In the display member 1 shown in FIG. 6, the encapsulating resin layer 4 includes, in order from the optical semiconductor element 3a-3c side, the non-diffusion functional layer 43 and the diffusion functional layer 41, and both surfaces of the non-diffusion functional layer 43 have an uneven shape that follows the uneven shape.

[0061] Each layer constituting the encapsulating resin layer may or may not independently have adhesive properties. Among these, adhesive properties are preferred. This configuration allows the encapsulating resin layer to easily encapsulate the optical semiconductor element, and also provides excellent adhesion between the layers, resulting in superior encapsulation of the optical semiconductor element. In particular, it is preferred that at least the layer in contact with the optical semiconductor element be adhesive. This configuration provides excellent conformability and embedding of the optical semiconductor element by the encapsulating resin layer. As a result, the design is excellent even when the step caused by the optical semiconductor element is high. Note that layers other than the layer in contact with the optical semiconductor element do not need to be adhesive. In this case, the adhesiveness between adjacent encapsulating resin layers in a tiling state is low, and when adjacent small-sized stacks (stacks in which encapsulating resin layers encapsulate optical semiconductor elements arranged on a substrate) are separated from each other, damage to the encapsulating resin layer and adhesion of adjacent encapsulating resin layers are unlikely to occur.

[0062] (Diffusion functional layer) The diffusion functional layer is a layer intended to diffuse light, and is preferably a resin layer made of resin.

[0063] The diffusion functional layer is preferably a non-colored layer different from the colored layer. The non-colored layer is a layer that is not intended to prevent light reflection by metal wiring or the like provided on the substrate of the display. The non-colored layer may be a colorless layer or may be slightly colored.

[0064] The content of the colorant in the diffusion functional layer is preferably less than 0.2% by mass, more preferably less than 0.1% by mass, and even more preferably less than 0.05% by mass, relative to the total amount of the diffusion functional layer (100% by mass), and may be less than 0.01% by mass or less than 0.005% by mass.

[0065] The diffusion functional layer preferably contains, but is not limited to, light-diffusing fine particles. That is, the diffusion functional layer preferably contains light-diffusing fine particles dispersed in a resin layer. The light-diffusing fine particles may be used alone or in combination of two or more types.

[0066] The light-diffusing fine particles have an appropriate refractive index difference from the resin constituting the diffusion functional layer, and impart diffusion properties to the diffusion functional layer. Examples of the light-diffusing fine particles include inorganic fine particles and polymer fine particles. Examples of materials for the inorganic fine particles include silica, calcium carbonate, aluminum hydroxide, magnesium hydroxide, clay, talc, and metal oxides. Examples of materials for the polymer fine particles include silicone resin, acrylic resin (including polymethacrylate resin such as polymethyl methacrylate), polystyrene resin, polyurethane resin, melamine resin, polyethylene resin, and epoxy resin.

[0067] The polymeric fine particles are preferably fine particles made of silicone resin. The inorganic fine particles are preferably fine particles made of metal oxide. The metal oxide is preferably titanium oxide or barium titanate, more preferably titanium oxide. This structure provides the diffusion layer with superior light diffusion properties and reduces brightness unevenness.

[0068] The shape of the light-diffusing fine particles is not particularly limited, and may be, for example, spherical, flat, or irregular.

[0069] The average particle diameter of the light-diffusing fine particles is preferably 0.1 μm or more, more preferably 0.15 μm or more, even more preferably 0.2 μm or more, and particularly preferably 0.25 μm or more, from the viewpoint of imparting appropriate light diffusion performance. Furthermore, the average particle diameter of the light-diffusing fine particles is preferably 12 μm or less, more preferably 10 μm or less, and even more preferably 8 μm or less, from the viewpoint of preventing the haze value from becoming too high and displaying high-resolution images. The average particle diameter can be measured, for example, using a Coulter counter.

[0070] The refractive index of the light-diffusing fine particles is preferably 1.2 to 5, more preferably 1.25 to 4.5, even more preferably 1.3 to 4, and particularly preferably 1.35 to 3.

[0071] The absolute value of the refractive index difference between the light-diffusing fine particles and the resin constituting the diffusion functional layer (the resin layer excluding the light-diffusing fine particles in the diffusion functional layer) is preferably 0.001 or more, more preferably 0.01 or more, even more preferably 0.02 or more, particularly preferably 0.03 or more, and may be 0.04 or more, or 0.05 or more, from the viewpoint of more efficiently reducing brightness unevenness of the display body. Furthermore, the absolute value of the refractive index difference between the light-diffusing fine particles and the resin is preferably 5 or less, more preferably 4 or less, and even more preferably 3 or less, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image.

[0072] The content of the light-diffusing fine particles in the diffusion functional layer is preferably 0.01 parts by mass or more, more preferably 0.05 parts by mass or more, even more preferably 0.1 parts by mass or more, and particularly preferably 0.15 parts by mass or more, relative to 100 parts by mass of the resin constituting the diffusion functional layer, from the viewpoint of imparting appropriate light-diffusing performance to the encapsulating resin layer. Furthermore, the content of the light-diffusing fine particles is preferably 80 parts by mass or less, more preferably 70 parts by mass or less, relative to 100 parts by mass of the resin constituting the diffusion functional layer, from the viewpoint of preventing the haze value from becoming too high and displaying a high-resolution image.

[0073] The haze value (initial haze value) of the diffusion functional layer is not particularly limited, but from the viewpoint of efficiently reducing brightness unevenness, it is preferably 30% or more, more preferably 40% or more, even more preferably 50% or more, and particularly preferably 60% or more. It may be 70% or more, 80% or more, 90% or more, 95% or more, or 97% or more, and a value around 99.9% is more effective in improving brightness unevenness. The upper limit of the haze value of the diffusion functional layer is not particularly limited, and may be 100%. The haze value is the value at the thickest part of the diffusion functional layer in the display.

[0074] The total light transmittance of the diffusion functional layer is not particularly limited, but from the viewpoint of ensuring brightness, it is preferably 40% or more, more preferably 60% or more, even more preferably 70% or more, and particularly preferably 80% or more. Furthermore, the upper limit of the total light transmittance of the diffusion functional layer is not particularly limited, but it may be less than 100%, or may be 99.9% or less, or 99% or less. The total light transmittance is the value at the thickest part of the diffusion functional layer in the display.

[0075] The haze value and total light transmittance of the above-mentioned diffusion functional layer are values ​​for a single layer and can be measured by the methods specified in JIS K7136 and JIS K7361-1. They can be controlled by the type and thickness of the diffusion functional layer, the type and amount of light-diffusing microparticles, etc.

[0076] (Non-diffusion functional layer) The non-diffusion functional layer is a layer that is not intended to diffuse light. The non-diffusion functional layer is preferably a resin layer made of resin. The non-diffusion functional layer is preferably the non-colored layer.

[0077] The content of the colorant in the non-diffusion functional layer is preferably less than 0.2% by mass, more preferably less than 0.1% by mass, and even more preferably less than 0.05% by mass, relative to 100% by mass of the total amount of the non-diffusion functional layer, and may be less than 0.01% by mass or less than 0.005% by mass.

[0078] The haze value (initial haze value) of the non-diffusion functional layer is not particularly limited, but from the viewpoint of improving the brightness of the display, it is preferably less than 30%, more preferably 10% or less, even more preferably 5% or less, particularly preferably 1% or less, and may be 0.5% or less. The lower limit of the haze value of the non-diffusion functional layer is not particularly limited. The haze value is the value at the thickest part of the non-diffusion functional layer in the display.

[0079] The total light transmittance of the non-diffusion functional layer is not particularly limited, but from the viewpoint of ensuring the brightness of the display, it is preferably 60% or more, more preferably 70% or more, even more preferably 80% or more, and particularly preferably 90% or more. Furthermore, the upper limit of the total light transmittance of the non-diffusion functional layer is not particularly limited, but it may be less than 100%, or may be 99.9% or less, or 99% or less. The total light transmittance is the value at the thickest part of the non-diffusion functional layer in the display.

[0080] The haze value and total light transmittance of the non-diffusion functional layer are values ​​for a single layer, and can be measured by the methods specified in JIS K7136 and JIS K7361-1. They can be controlled by the type and thickness of the non-diffusion functional layer.

[0081] In order to improve the brightness of the display, the content of the colorant and / or light-diffusing microparticles in the non-diffusion functional layer is preferably less than 0.01 parts by mass, and more preferably less than 0.005 parts by mass, per 100 parts by mass of the resin constituting the non-diffusion functional layer.

[0082] (colored layer) The colored layer is a layer intended to prevent light reflection from metal wiring or the like provided on a substrate in a display. The colored layer contains at least a colorant. The colored layer is preferably a resin layer composed of a resin. The colorant may be a dye or a pigment as long as it is soluble or dispersible in the colored layer. Dyes are preferred because they can achieve low haze even with a small amount of addition, do not sediment like pigments, and are easily distributed uniformly. Pigments are also preferred because they provide high color expression even with a small amount of addition. When a pigment is used as a colorant, it is preferable that it has low or no conductivity. One or more of the colorants may be used.

[0083] The colorant is preferably a black colorant. Known or commonly used colorants (pigments, dyes, etc.) for producing black can be used as the black colorant, including, for example, carbon black (furnace black, channel black, acetylene black, thermal black, lamp black, pine soot, etc.), graphite, copper oxide, manganese dioxide, aniline black, perylene black, titanium black, cyanine black, activated carbon, ferrite (non-magnetic ferrite, magnetic ferrite, etc.), magnetite, chromium oxide, iron oxide, molybdenum disulfide, chromium complexes, anthraquinone-based colorants, and zirconium nitride. Alternatively, a colorant functioning as a black colorant may be used by combining and blending colorants producing colors other than black.

[0084] From the viewpoint of imparting appropriate anti-reflection properties to the display, the content of the colorant in the colored layer is preferably 0.2% by mass or more, more preferably 0.4% by mass or more, relative to the total amount (100% by mass) of the colored layer. The content of the colorant is, for example, 10% by mass or less, preferably 5% by mass or less, and more preferably 3% by mass or less. The content may be appropriately set depending on the type of colorant, the color tone and light transmittance of the display, and the like. The colorant may be added to the composition as a solution or dispersion in which it is dissolved or dispersed in an appropriate solvent.

[0085] The haze value (initial haze value) of the colored layer is not particularly limited, but from the viewpoint of ensuring front brightness and visibility of the display, it is preferably 50% or less, more preferably 40% or less, even more preferably 30% or less, and particularly preferably 20% or less. Furthermore, from the viewpoint of efficiently reducing brightness unevenness of the display, the haze value of the colored layer is preferably 1% or more, more preferably 3% or more, even more preferably 5% or more, particularly preferably 8% or more, and may be 10% or more. The haze value is the value at the thickest part of the colored layer in the display.

[0086] The total light transmittance of the colored layer is not particularly limited, but from the viewpoint of further improving the anti-reflection function of metal wiring and the contrast of the display, it is preferably 40% or less, more preferably 30% or less, even more preferably 25% or less, and particularly preferably 20% or less. Furthermore, from the viewpoint of ensuring the brightness of the display, the total light transmittance of the colored layer is preferably 0.5% or more, more preferably 1% or more, even more preferably 1.5% or more, particularly preferably 2% or more, and may even be 2.5% or more, or 3% or more. The total light transmittance is the value at the thickest part of the colored layer in the display.

[0087] The haze value and total light transmittance of the colored layer are values ​​for a single layer and can be measured by the methods specified in JIS K7136 and JIS K7361-1, and can be controlled by the type and thickness, the type and amount of colorant, etc.

[0088] (resin layer) When each of the layers is a resin layer, the resin constituting the resin layer may be a known or commonly used resin, such as an acrylic resin, a urethane acrylate resin, a urethane resin, a rubber resin, an epoxy resin, an epoxy acrylate resin, an oxetane resin, a silicone resin, a silicone acrylic resin, a polyester resin, a polyether resin (such as polyvinyl ether), a polyamide resin, a fluorine-containing resin, a vinyl acetate / vinyl chloride copolymer, or a modified polyolefin. One or more of the resins may be used. The resins constituting each layer of the encapsulating resin layer may be the same or different.

[0089] When the resin layer is a layer having adhesive properties (adhesive layer), a known or commonly used pressure-sensitive adhesive can be used as the resin. Examples of the adhesive include acrylic adhesives, rubber adhesives (natural rubber, synthetic rubber, and mixtures thereof), silicone adhesives, polyester adhesives, urethane adhesives, polyether adhesives, polyamide adhesives, and fluorine adhesives. One or more of the adhesives may be used.

[0090] The resin layer may contain other components in addition to the above-mentioned components, as long as the effects of the present invention are not impaired in each layer. Examples of such other components include curing agents, crosslinking accelerators, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), oligomers, antioxidants, fillers (metal powders, organic fillers, inorganic fillers, etc.), antioxidants, plasticizers, softeners, surfactants, antistatic agents, surface lubricants, leveling agents, light stabilizers, UV absorbers, polymerization inhibitors, granular materials, and foil-like materials. Only one or more of the above other components may be used.

[0091] Examples of the laminate structure of the encapsulating resin layer include [diffusion functional layer / non-diffusion functional layer], [non-diffusion functional layer / diffusion functional layer], and [non-diffusion functional layer / diffusion functional layer / non-diffusion functional layer] (all in order from the optical semiconductor element side). When the encapsulating resin layer includes the colored layer, the colored layer can be laminated at any position in the laminate structure. When the encapsulating resin layer includes the colored layer, examples of the laminate structure include [colored layer / diffusion functional layer / non-diffusion functional layer], [diffusion functional layer / colored layer / non-diffusion functional layer], [non-diffusion functional layer / colored layer / diffusion functional layer], [non-diffusion functional layer / diffusion functional layer / colored layer], [diffusion functional layer / non-diffusion functional layer / colored layer], and [colored layer / diffusion functional layer / colored layer / non-diffusion functional layer] (all in order from the optical semiconductor element side).

[0092] <Base material part> The display of the present invention may or may not include a substrate. When the substrate is provided on the front side of the encapsulating resin layer in the display, the surface of the encapsulating resin layer can be made flat, thereby reducing the occurrence of diffused reflection of light and improving the appearance of the display both when the display is turned on and when the display is not lit. Furthermore, by forming an anti-glare layer or an anti-reflection layer described below on the substrate, anti-glare properties and anti-reflection properties can be imparted to the display. Furthermore, the substrate serves as a support for the encapsulating resin layer in the sheet for encapsulating optical semiconductor elements described below, and the presence of the substrate provides excellent handleability of the sheet for encapsulating optical semiconductor elements.

[0093] The substrate may be a single layer, or may be multiple layers having the same or different compositions, thicknesses, etc. When the substrate is multiple layers, each layer may be bonded to another layer such as a pressure-sensitive adhesive layer. The substrate layer used in the substrate is the part that is attached to the substrate including the optical semiconductor element together with the encapsulating resin layer, and the "substrate" does not include a release liner that is peeled off when the sheet for encapsulating optical semiconductor elements is used (attached), or a surface protection film that merely protects the surface of the substrate.

[0094] Examples of the substrate layer constituting the substrate part include glass and plastic substrates (particularly, plastic films). Examples of resins constituting the plastic substrate include low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, high-density polyethylene, very low-density polyethylene, random copolymer polypropylene, block copolymer polypropylene, homopolypropylene, polybutene, polymethylpentene, ionomer, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid ester (random, alternating) copolymer, ethylene-vinyl acetate copolymer (EVA), ethylene-propylene copolymer, cyclic olefin polymer, ethylene-butene copolymer, ethylene-hexene copolymer, etc. Examples of suitable resins include polyolefin resins, polyurethanes, polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate, and polybutylene terephthalate (PBT), polycarbonates, polyimide resins, polyether ether ketones, polyetherimides, polyamides such as aramids and wholly aromatic polyamides, polyphenyl sulfides, fluororesins, polyvinyl chloride, polyvinylidene chloride, cellulose resins such as triacetyl cellulose (TAC), silicone resins, acrylic resins such as polymethyl methacrylate (PMMA), polysulfones, polyarylates, and polyvinyl acetates. The above resins may be used singly or in combination. The substrate layer may be any of various optical films, such as antireflection (AR) films, polarizing plates, and retardation plates.

[0095] The thickness of the plastic film is preferably 20 to 300 μm, more preferably 40 to 250 μm. When the thickness is 20 μm or more, the supportability and handleability of the sheet for encapsulating an optical semiconductor element are further improved. When the thickness is 250 μm or less, the display body can be made thinner.

[0096] The surface of the substrate on the side where the encapsulating resin layer is provided may be subjected to surface treatments such as physical treatments such as corona discharge treatment, plasma treatment, sand matting treatment, ozone exposure treatment, flame exposure treatment, high-voltage shock exposure treatment, and ionizing radiation treatment; chemical treatments such as chromic acid treatment; and adhesion-enhancing treatments using a coating agent (primer), for the purpose of improving adhesion and retention with the encapsulating resin layer. The surface treatment for improving adhesion is preferably applied to the entire surface of the substrate on the side where the encapsulating resin layer is provided.

[0097] The thickness of the substrate is preferably 5 μm or more, more preferably 10 μm or more, from the viewpoint of excellent support function and surface scratch resistance, and is preferably 300 μm or less, more preferably 250 μm or less, from the viewpoint of excellent transparency.

[0098] <Display body> The display may include a layer having antiglare and / or antireflection properties. Such a configuration can suppress the gloss and light reflection of the display, improving its appearance. An example of the layer having antiglare properties is an antiglare-treated layer. An example of the layer having antireflection properties is an antireflection-treated layer. The antiglare treatment and the antireflection treatment can be performed by known or conventional methods. The antiglare layer and the antireflection layer may be the same layer or different layers. The display may have only one layer having antiglare and / or antireflection properties, or two or more layers.

[0099] The haze value (initial haze value) of the encapsulating resin layer or the laminate having the encapsulating resin layer and the base material as both end faces is not particularly limited, but from the viewpoint of achieving a superior effect of suppressing brightness unevenness and design, it is preferably 80% or more, more preferably 85% or more, even more preferably 90% or more, and particularly preferably 95% or more. The upper limit of the haze value is not particularly limited.

[0100] The total light transmittance of the encapsulating resin layer or the laminate having the encapsulating resin layer and the base material as both end faces is not particularly limited, but is preferably 40% or less, more preferably 30% or less, and even more preferably 20% or less, from the viewpoint of further improving the anti-reflection function of metal wiring etc. and contrast. Moreover, the total light transmittance is preferably 0.5% or more, from the viewpoint of ensuring brightness.

[0101] The haze value and total light transmittance can be measured by the methods specified in JIS K7136 and JIS K7361-1, respectively, and can be controlled by the stacking order, type, thickness, etc. of the layers constituting the encapsulating resin layer and the base material portion.

[0102] The thickness of the encapsulating resin layer or the laminate having the encapsulating resin layer and the base material as both end faces is preferably 10 to 600 μm, more preferably 20 to 550 μm, even more preferably 30 to 500 μm, still more preferably 40 to 450 μm, and particularly preferably 50 to 400 μm, from the viewpoint of improving the anti-reflection function and contrast of metal wiring and the like while more efficiently reducing color shift. Note that the thickness of the release liner is not included in the above.

[0103] The display of the present invention preferably includes a self-luminous display device. Furthermore, the self-luminous display device can be combined with a display panel, if necessary, to form a display device that is an image display device. In this case, the optical semiconductor elements are LED elements. Examples of the self-luminous display device include LED displays, backlights, and organic electroluminescence (organic EL) display devices. The backlight is preferably a full-surface direct backlight. The backlight includes, as at least a part of its components, a laminate comprising, for example, the substrate and a plurality of optical semiconductor elements arranged on the substrate. For example, in the self-luminous display device, a metal wiring layer is laminated on the substrate for transmitting light emission control signals to each LED element. LED elements emitting red (R), green (G), and blue (B) light are alternately arranged on the substrate via the metal wiring layer. The metal wiring layer is formed of a metal such as copper, and adjusts the light emission intensity of each LED element to display each color.

[0104] The display of the present invention may be a display that is used by folding, for example, a foldable image display device (flexible display) (particularly, a foldable image display device (foldable display)). Specific examples include a display device equipped with a foldable backlight and a display device equipped with a foldable self-luminous display device.

[0105] In the display of the present invention, the sealing resin layer has excellent followability and embeddability for the optical semiconductor element, and therefore the optical semiconductor element may be a mini LED element or a micro LED element.

[0106] According to the display of the present invention, uneven brightness due to the light emitted by the optical semiconductor element is unlikely to occur, and the brightness is high. Therefore, the display is unlikely to undergo color shift, and the display can be viewed with the same color from a wide field of view. Furthermore, the display is bright and looks good without increasing power consumption.

[0107] [Display manufacturing method] The display member of the present invention can be produced by laminating a sheet for encapsulating an optical semiconductor element, which includes an encapsulating resin layer, to a substrate on which an optical semiconductor element is arranged, and encapsulating the optical semiconductor element with the encapsulating resin layer.

[0108] (Optical semiconductor element encapsulation sheet) The optical semiconductor element encapsulation sheet is a sheet for encapsulating a plurality of optical semiconductor elements arranged on a substrate. The optical semiconductor element encapsulation sheet includes at least an encapsulating resin layer including a diffusion functional layer and a non-diffusion functional layer. The optical semiconductor element encapsulation sheet is a sheet that can satisfy the above formula (1) when the encapsulating resin layer is formed by encapsulating the plurality of optical semiconductor elements with the encapsulating resin layer. The optical semiconductor element encapsulation sheet of the present invention can provide a display that is less prone to brightness unevenness and has high brightness by encapsulating the optical semiconductor elements.

[0109] The optical semiconductor element encapsulation sheet includes at least an encapsulating resin layer including a diffusion layer and a non-diffusion layer. The encapsulating resin layer is a layer capable of forming the encapsulating resin layer in the display of the present invention. Specifically, the diffusion layer in the encapsulating resin layer is a layer capable of forming the diffusing layer in the display of the present invention, and the non-diffusion layer in the encapsulating resin layer is a layer capable of forming the non-diffusion layer in the display of the present invention. Specifically, the diffusion layer in the encapsulating resin layer may be a layer having the same composition (components and their blending ratios) and physical properties (haze, total light transmittance, etc.) as the diffusion layer in the display of the present invention, or may be a layer that becomes the diffusion layer in the display of the present invention upon curing. Furthermore, the non-diffusion layer in the encapsulating resin layer may be a layer having the same composition (components and their blending ratios) and physical properties (haze, total light transmittance, etc.) as the non-diffusion layer in the display of the present invention, or may be a layer that becomes the non-diffusion layer in the display of the present invention upon curing.

[0110] The encapsulating resin layer is appropriately designed according to the structure of the encapsulating resin layer in the display of the present invention. For example, when the display of the present invention includes the colored layer, the encapsulating resin layer in the sheet for encapsulating optical semiconductor elements includes a colored layer. The colored layer in the encapsulating resin layer may be a layer having the same composition (constituent components and their blending ratio) and physical properties (haze, total light transmittance, etc.) as the colored layer in the display of the present invention, or may be a layer that becomes the colored layer in the display of the present invention upon curing. Furthermore, the encapsulating resin layer preferably includes the diffusion functional layer, the colored layer, and the non-diffusion functional layer in this order.

[0111] Each layer constituting the encapsulating resin layer may or may not independently have tackiness and / or adhesiveness. Among these, tackiness and / or adhesiveness are preferred. This configuration allows the encapsulating resin layer to be easily bonded to the substrate and the optical semiconductor element, and provides excellent adhesion between the layers, resulting in superior encapsulation of the optical semiconductor element. In particular, it is preferred that at least the layer in contact with the optical semiconductor element has tackiness and / or adhesiveness. This configuration allows the encapsulating resin layer to have excellent conformability and embeddability of the optical semiconductor element. As a result, the design is excellent even when the step caused by the optical semiconductor element is high.

[0112] Each layer constituting the encapsulating resin layer may independently be a resin layer that is cured by irradiation with radiation (a radiation-curable resin layer), or a resin layer that is not cured by irradiation with radiation (a non-radiation-curable resin layer). Examples of the radiation include electron beams, ultraviolet rays, α-rays, β-rays, γ-rays, and X-rays. When the colored layer is a radiation-curable resin layer, the colorant that may be contained in the colored layer preferably absorbs visible light and is transparent to light of a wavelength that can cure the radiation-curable resin layer.

[0113] The optical semiconductor element encapsulation sheet may include the substrate. When the substrate is included, the encapsulating resin layer may be provided on at least one surface of the substrate. The surface of the encapsulating resin layer that comes into contact with the substrate is the surface opposite to the side of the encapsulating resin layer that comes into contact with the optical semiconductor element. When the optical semiconductor element encapsulation sheet includes the substrate, the optical semiconductor element encapsulation sheet is attached to the optical semiconductor element and the substrate together with the substrate, and the substrate in the optical semiconductor element encapsulation sheet serves as the substrate in the display body of the present invention.

[0114] The encapsulating resin layer may also be formed on a release-treated surface of a release liner. When the optical semiconductor element encapsulation sheet is formed on the release liner, the side of the encapsulating resin layer that contacts the optical semiconductor element is the side that contacts the release liner. When the substrate portion is not present, both sides of the encapsulating resin layer may be the sides that contact the release liner. The release liner is used as a protective material for the optical semiconductor element encapsulation sheet and is peeled off when encapsulating the optical semiconductor element. The substrate portion and release liner are not necessarily provided.

[0115] The release liner is an element for covering and protecting the surface of the optical semiconductor element encapsulation sheet, and is peeled off from the sheet when the optical semiconductor element encapsulation sheet is attached to a substrate on which an optical semiconductor element is arranged.

[0116] Examples of the release liner include polyethylene terephthalate (PET) film, polyethylene film, polypropylene film, plastic film and paper whose surface is coated with a release agent such as a fluorine-based release agent or a long-chain alkyl acrylate-based release agent.

[0117] The thickness of the release liner is, for example, 10 to 200 μm, preferably 15 to 150 μm, and more preferably 20 to 100 μm. When the thickness is 10 μm or more, the release liner is less likely to break due to cuts during processing. When the thickness is 200 μm or less, the release liner is more easily peeled from the optical semiconductor element encapsulation sheet during use.

[0118] An embodiment of the optical semiconductor element encapsulation sheet will be described with reference to FIG. 8. FIG. 8 is a cross-sectional view of the optical semiconductor element encapsulation sheet capable of forming the display shown in FIG. 2. As shown in FIG. 8, the optical semiconductor element encapsulation sheet 10 can be used to encapsulate one or more optical semiconductor elements arranged on a substrate, and includes a substrate 5 and an encapsulating resin layer 7 formed on the substrate 5. The encapsulating resin layer 7 is formed from a laminate of a diffusion functional layer 71 and a non-diffusion functional layer 72. The diffusion functional layer 71 and the non-diffusion functional layer 72 have adhesive properties and are directly laminated to each other. A release liner 6 is attached to the surface of the diffusion functional layer 71 of the encapsulating resin layer 7, and the substrate 5 is attached to the surface of the non-diffusion functional layer 72.

[0119] (Sealing process) The method for producing a display member of the present invention using the optical semiconductor element encapsulation sheet includes an encapsulation step of laminating the optical semiconductor element encapsulation sheet to a substrate on which optical semiconductor elements are arranged and encapsulating the optical semiconductor elements with an encapsulating resin layer. Specifically, the encapsulation step first involves peeling the release liner from the optical semiconductor element encapsulation sheet to expose the encapsulating resin layer. Then, of a laminate (such as an optical member) including a substrate and optical semiconductor elements (preferably multiple optical semiconductor elements) arranged on the substrate, the encapsulating resin layer surface, which is the exposed surface of the optical semiconductor element encapsulation sheet, is laminated to the substrate surface on which the optical semiconductor elements are arranged. If the laminate includes multiple optical semiconductor elements, the encapsulating resin layer is further arranged to fill the gaps between the multiple optical semiconductor elements, thereby encapsulating the multiple optical semiconductor elements collectively. Specifically, as shown in Figure 9, the diffusion function layer 71 of the sheet 10 for encapsulating optical semiconductor elements, from which the release liner 6 has been peeled off, is placed facing the surface of the substrate 2 on which the optical semiconductor elements 3a to 3c are arranged, and the sheet 10 for encapsulating optical semiconductor elements is attached to the surface of the substrate 2 on which the optical semiconductor elements 3a to 3c are arranged, and the optical semiconductor elements 3a to 3c are embedded in the encapsulating resin layer 7.

[0120] The temperature during the lamination is, for example, within a range from room temperature to 110°C. Furthermore, reduced pressure or pressure may be applied during the lamination. This reduced pressure or pressure can prevent voids from forming between the encapsulating resin layer and the substrate or the optical semiconductor element. Furthermore, in the encapsulation step, it is preferable to laminate the optical semiconductor element encapsulation sheet under reduced pressure and then apply pressure. When reduced pressure is applied, the pressure is, for example, 1 to 100 Pa, and the depressurization time is, for example, 5 to 600 seconds. When pressurized, the pressure is, for example, 0.05 to 0.5 MPa, and the pressurization time is, for example, 5 to 600 seconds.

[0121] By appropriately setting the thickness of the diffusion layer in the encapsulating resin layer, and the temperature and pressure during lamination, it is possible to adjust the conformability of the diffusion layer to the optical semiconductor element in the resulting display body and the thickness of the diffusion layer in each of the concave and convex regions in the uneven shape, thereby enabling the resulting display body to have a configuration that satisfies the above formula (1).

[0122] (Radiation irradiation process) When the encapsulating resin layer comprises a radiation-curable resin layer, the manufacturing method may further comprise a radiation irradiation step of irradiating a laminate comprising the substrate, an optical semiconductor element disposed on the substrate, and the optical semiconductor element encapsulation sheet that encapsulates the optical semiconductor element with radiation to cure the radiation-curable resin layer and form a cured product layer. As described above, examples of the radiation include electron beams, ultraviolet rays, α rays, β rays, γ rays, and X-rays. Among these, ultraviolet rays are preferred. The temperature during radiation irradiation is, for example, within a range from room temperature to 100°C, and the irradiation time is, for example, from 1 minute to 1 hour.

[0123] (dicing process) The manufacturing method may further include a dicing step of dicing a laminate including the substrate, an optical semiconductor element disposed on the substrate, and the optical semiconductor element encapsulation sheet that encapsulates the optical semiconductor element. The dicing may be performed on the laminate that has undergone the radiation irradiation step. When the laminate includes a cured product layer formed by curing a radiation-curable resin layer by the radiation irradiation, the dicing step involves dicing and removing the cured product layer of the optical semiconductor element encapsulation sheet and the side edges of the substrate. This allows the surface of the cured product layer, which has been sufficiently cured and has reduced adhesion, to be exposed on the side. The dicing can be performed by a known or conventional method, such as a method using a dicing blade or laser irradiation.

[0124] (Tiling process) The manufacturing method may further include a tiling step of arranging the plurality of display bodies obtained in the dicing step so that they are in contact with each other in a planar direction. In the tiling step, the plurality of stacked bodies obtained in the dicing step are tiled so that they are in contact with each other in a planar direction. In this way, a single large display body can be manufactured.

[0125] In this manner, the display body of the present invention can be manufactured. When the encapsulating resin layer 7 in the sheet 10 for encapsulating an optical semiconductor element does not have a radiation-curable resin layer, the encapsulating resin layer 7 becomes the encapsulating resin layer 4 in the display body 1. On the other hand, when the encapsulating resin layer 7 in the sheet 10 for encapsulating an optical semiconductor element has a radiation-curable resin layer, for example, when the non-diffusion functional layer 72 is a radiation-curable resin layer, the non-diffusion functional layer 72 is cured to form the non-diffusion functional layer 42, which becomes the encapsulating resin layer 4. [Explanation of symbols]

[0126] 1 Display body 2 boards 3a to 3f Optical semiconductor elements 31 Support 3,3' pixels 4 Sealing resin layer 41 Diffusion functional layer 42,43 Non-diffusive functional layer 44 Colored layer 5 Base material part 6 Release liner 7 Sealing resin layer 71 Diffusion functional layer 72 Non-diffusive functional layer 10. Optical semiconductor element encapsulation sheet 11 Optical components

Claims

1. A display comprising a substrate, a plurality of optical semiconductor elements arranged on the substrate, and a sealing resin layer that seals the plurality of optical semiconductor elements, the sealing resin layer includes a diffusion functional layer and a non-diffusion functional layer, A perpendicular line to the substrate surface passing through the center of gravity of the first optical semiconductor element is defined as a perpendicular line P Ａ and the perpendicular line P Ａ In The end T of the first optical semiconductor element on the front side from the center of gravity of the substrate surface Ａ The distance to Ａ , A front end T of the diffusion functional layer on a perpendicular line to the substrate surface that passes through the midpoint between the center of gravity of the first optical semiconductor element and the center of gravity of a second optical semiconductor element adjacent to the first optical semiconductor element in the same pixel. Ｃ The distance to Ｃ , Said end T Ａ From the perpendicular line to the substrate surface passing through the end T Ｃ The distance to the perpendicular line to the substrate surface that passes through Ａ－Ｃ , Said end T Ａ From the end T Ｃ A display that satisfies the following formula (1), when an elevation angle with respect to a normal line passing through the substrate surface is θ°. L Ｃ ≦L Ａ +L Ａ－Ｃ tるθ(θ=45°) (1)

2. 2. The display according to claim 1, wherein the height of the optical semiconductor element above the substrate is 500 [mu]m or less.

3. 3. The display according to claim 1, wherein the diffusion function layer has adhesiveness.

4. 4. The display according to claim 1, comprising a self-luminous display device.

5. The display according to any one of claims 1 to 4, which is an image display device.

6. A sheet for encapsulating a plurality of optical semiconductor elements arranged on a substrate, the sheet includes an encapsulating resin layer including a diffusion functional layer and a non-diffusion functional layer; When the plurality of optical semiconductor elements are encapsulated with the encapsulating resin layer to form the encapsulating resin layer, A perpendicular line to the substrate surface passing through the center of gravity of the first optical semiconductor element is defined as a perpendicular line P Ａ and the perpendicular line P Ａ In The end T of the first optical semiconductor element on the front side from the center of gravity of the substrate surface Ａ The distance to Ａ , A front end T of the diffusion functional layer on a perpendicular line to the substrate surface that passes through the midpoint between the center of gravity of the first optical semiconductor element and the center of gravity of a second optical semiconductor element adjacent to the first optical semiconductor element in the same pixel. Ｃ The distance to Ｃ , Said end T Ａ From the perpendicular line to the substrate surface passing through the end T Ｃ The distance to the perpendicular line to the substrate surface that passes through Ａ－Ｃ , Said end T Ａ From the end T Ｃ The sheet for encapsulating an optical semiconductor element can satisfy the following formula (1), where θ° is an elevation angle with respect to a perpendicular line passing through the substrate surface: L Ｃ ≦L Ａ +L Ａ－Ｃ tるθ(θ=45°) (1)

7. The sheet for encapsulating an optical semiconductor element according to claim 6 , wherein the diffusion functional layer has adhesiveness.

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