Light-emitting device and sealing resin composition

Abstract

To provide a light-emitting device and an encapsulating resin composition capable of arranging a sealing member containing a resin at a desired position on a base having a resin portion.SOLUTION: A light-emitting device includes a base including a first electrode, a second electrode, and a resin portion having a polar group on its surface, a light-emitting element electrically connected to the first electrode and the second electrode and arranged on the base, a sealing member that seals the light-emitting element, the sealing member contains a highly polar resin and an organosiloxane compound having an alkyl group, and the content of the organosiloxane compound in the sealing member is 10 ppm or more and 3% or less.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a light emitting device and an encapsulating resin composition. [Background technology]

[0002] Light-emitting devices using light-emitting elements such as LEDs are used in a wide range of fields. Some light-emitting devices include a base containing a resin portion, a light-emitting element disposed on the base, and a sealing member containing a resin that covers the light-emitting element. As a composition for forming a sealing member for a light-emitting device, a composition containing a methylphenyl silicone resin and a dispersion containing inorganic particles to which a surface modifier having a dimethyl silicone skeleton is attached has been proposed (see, for example, Patent Document 1). Also proposed is a silicone resin composition containing an organopolysiloxane having a weight-average molecular weight of 500 to 20,000, a white pigment, an inorganic filler, and an organopolysiloxane having a linear diorganopolysiloxane residue (see, for example, Patent Document 2). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2020-33515 [Patent Document 2] Japanese Patent Application Laid-Open No. 2010-106243 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in such a light emitting device, the sealing member may not be disposed at a desired position on the base.

[0005] Therefore, an object of the present disclosure is to provide a light emitting device and an encapsulating resin composition that allow a resin-containing encapsulating member to be disposed at a desired position on a base having a resin portion. [Means for solving the problem]

[0006] The light emitting device according to the present disclosure includes a base including a first electrode, a second electrode, and a resin portion having polar groups on its surface; a light emitting element electrically connected to the first electrode and the second electrode and disposed on the base; and a sealing member that includes a highly polar resin and an organosiloxane compound having an alkyl group and seals the light emitting element, wherein the content of the organosiloxane compound in the sealing member is 10 ppm or more and 3% or less.

[0007] The encapsulating resin composition according to the present disclosure is an encapsulating resin composition including a highly polar resin base material and an organosiloxane compound having an alkyl group, and the content of the organosiloxane compound in the encapsulating resin composition is 10 ppm or more and 3% or less. [Effects of the Invention]

[0008] According to the light emitting device and the encapsulating resin composition according to an embodiment of the present disclosure, the encapsulating member containing the resin can be disposed at a desired position on the base having the resin portion. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a schematic top view of a light emitting device according to an embodiment of the present disclosure. [Figure 2] 2 is a schematic cross-sectional view of the light-emitting device shown in FIG. 1 taken along the line II-II. [Figure 3] 1A to 1C are schematic top views illustrating an example of a manufacturing process for the light emitting device according to Embodiment 1. [Figure 4] 4A to 4C are schematic cross-sectional views of the manufacturing process shown in FIG. [Figure 5] 3A to 3C are schematic cross-sectional views illustrating an example of a manufacturing process for the light emitting device according to the first embodiment. [Figure 6] 3A to 3C are schematic cross-sectional views illustrating an example of a manufacturing process for the light emitting device according to the first embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments and examples for carrying out the present invention will be described with reference to the drawings. Note that the light emitting device and encapsulating resin composition described below are intended to embody the technical concept of the present invention, and unless otherwise specified, the present invention is not limited to the following. In each drawing, components having the same function may be assigned the same symbol. For convenience, the embodiments and examples may be shown separately to facilitate explanation or understanding of the main points, but partial substitution or combination of the configurations shown in different embodiments and examples is possible. In the following embodiments and examples, descriptions of matters common to the above will be omitted, and only the differences will be described. In particular, similar effects due to similar configurations will not be mentioned sequentially in each embodiment or example. The size and positional relationship of components shown in each drawing may be exaggerated to clarify the explanation.

[0011] 1. Embodiment A light emitting device 1 according to an embodiment of the present disclosure includes a base 10, a light emitting element 20, and a sealing member 30, as shown in FIGS. The substrate 10 includes a first electrode 11 and a second electrode 12. The substrate 10 also includes a resin support 13 having polar groups on the surface thereof. The light emitting element 20 is electrically connected to the first electrode 11 and the second electrode 12 and is disposed on the substrate 10 . The sealing member 30 contains a highly polar resin and an organosiloxane compound having an alkyl group. The content of the organosiloxane compound in the sealing member 30 is 10 ppm or more and 3% or less.

[0012] The base 10 includes a bottom 14 and a wall 15 disposed along the outer periphery of the bottom 14. The bottom 14 includes a first electrode 11, a second electrode 12, and a resin support 13. The resin support 13 is disposed in a region between the first electrode 11 and the second electrode 12 and supports the first electrode 11 and the second electrode 12. The wall 15 is disposed so that the upper surface 11a of the first electrode 11 and the upper surface 12a of the second electrode 12 are exposed. The wall 15, together with the bottom 14, defines a recess 17 of the base 10. The wall 15 is formed of a resin. The resin support 13 and the wall 15 may be formed of, for example, the same resin, or the resin support 13 and the wall 15 may be integrally molded to form a resin portion 16 of the base 10. As the substrate 10, NHSW757, NSSW146, NJSW157, etc. (all manufactured by Nichia Corporation) can be used.

[0013] A polar group may be present on the surface of the resin portion 16. The polar group may be a partial structure of the resin constituting the resin portion 16, may be derived from the partial structure of the resin, or may be contained in a surface treatment layer disposed on the surface of the resin portion 16. The surface treatment layer is formed by surface treating the surface of the resin portion 16. Examples of applicable surface treatments include silica coating (SiO), alumina coating (AlO), and plasma treatment. The polar group may be, for example, at least one selected from the group consisting of an amide group, an ester group, a silanol group, an epoxy group, and a hydroxyl group, and preferably at least one selected from the group consisting of a silanol group and a hydroxyl group.

[0014] The resin constituting the resin portion 16 may include, for example, a thermoplastic resin or a thermosetting resin. Specific examples of thermosetting resins include epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, polyimide resin, and modified polyimide resin. Specific examples of thermoplastic resins include urethane resin, modified urethane resin, bismaleimide triazine resin, polyamide resin, polyphthalamide resin, polycyclohexylene dimethyl terephthalate, polycyclohexane terephthalate, liquid crystal polymer, polyethylene terephthalate, and polyethylene naphthalate. The resin constituting the resin portion 16 may preferably include an epoxy resin or a polyamide resin. These resins can be used, for example, as the resin material that forms the base material of the resin portion 16. Furthermore, the resin constituting the resin portion 16 may be composed of one type alone or a combination of two or more types.

[0015] The resin portion 16 may contain a white pigment with high light reflectance. In addition to the white pigment, the resin portion 16 may also contain a filler, a diffusing agent, or a light-reflecting substance. Examples of the white pigment, filler, diffusing agent, or light-reflecting substance include silicon oxide, titanium oxide, zinc oxide, aluminum oxide, zirconium oxide, calcium oxide, calcium silicate, potassium titanate, and glass particles. When the resin portion 16 contains a white pigment or the like, it is possible to reduce light transmission toward the side surfaces of the recess 17 and increase the reflection on the inner side surfaces of the recess 17.

[0016] The base material constituting the first electrode 11 and the second electrode 12 can be a plate-shaped body made of at least one metal selected from copper, aluminum, gold, silver, tungsten, iron, and nickel, or an alloy such as an iron-nickel alloy or phosphor bronze. A metal film made of silver, aluminum, gold, or an alloy thereof may be formed on the surfaces of the first electrode 11 and the second electrode 12. This allows light from the light-emitting element 20 to be extracted more efficiently. The film formed on the surfaces of the first electrode 11 and the second electrode 12 may be a single-layer film or a multi-layer film. The film formed on the surfaces of the first electrode 11 and the second electrode 12 is preferably formed by a plating process.

[0017] (light-emitting element) The light emitting element 20 has semiconductor layers including an n-type semiconductor layer, a p-type semiconductor layer, and an active layer disposed between the n-type semiconductor layer and the p-type semiconductor layer. The emission peak wavelength of the light emitting element 20 may be, for example, 320 nm or more and 550 nm or less, and preferably 420 nm or more and 475 nm or less. The half width of the emission spectrum of the light emitting element 20 may be, for example, 30 nm or less, and preferably 25 nm or less, or 20 nm or less. Here, the half width means the full width at half maximum (FWHM) of the emission peak in the emission spectrum, and refers to the wavelength width of the emission peak that indicates 50% of the maximum value of the emission peak in the emission spectrum. The light emitting element 20 is made of, for example, a nitride-based semiconductor (In X Al Y Ga 1-X-Y N, 0≦X, 0≦Y, X+Y≦1) may be used. By using a semiconductor light-emitting element as light-emitting element 20, it is possible to obtain a light-emitting device 1 that is highly efficient, has high linearity with respect to input, and is stable and resistant to mechanical shock.

[0018] 1 and 2, the light-emitting element 20 used in the first embodiment has an upper surface 20a as a light-emitting surface, and includes an n-side electrode 21 connected to the n-type semiconductor layer and a p-side electrode 22 connected to the p-type semiconductor layer on the upper surface 20a side. The light-emitting element 20 is mounted face-up on the upper surface 11a of the first electrode 11 of the base 10. The bonding member 50 bonding the light-emitting element 20 to the first electrode 11 of the base 10 may be an insulating bonding member or a conductive bonding member, and any known bonding member can be used. The n-side electrode 21 and the p-side electrode 22 of the light-emitting element 20 are connected to the first electrode 11 and the second electrode 12 of the base 10, for example, via wires 60, respectively.

[0019] (protective element) 1, the light emitting device 1 may also include a protective element 40. The protective element 40 is disposed on, for example, the upper surface 12a of the second electrode 12. The protective element 40 may be a so-called Zener diode. The protective element 40 has, for example, one electrode (e.g., a p-side electrode) on its lower surface and the other electrode (e.g., an n-side electrode) on its upper surface. The protective element 40 is connected, for example, to the first electrode 11 of the base 10 via a wire 60 and to the second electrode 12 of the base 10 via solder. It should be noted that one electrode and the other electrode of the protection element 40 are omitted from the drawing.

[0020] (Sealing member) The sealing member 30 is disposed in the recess 17, covering the light emitting element 20. If a protective element 40 is provided, the sealing member 30 also covers the protective element 40. The encapsulating member 30 may be a cured product of an encapsulating resin composition containing a highly polar resin matrix and an organosiloxane compound having an alkyl group (hereinafter also referred to as an "alkylsiloxane compound"). A highly polar resin is a resin having a highly polar functional group. An example of the highly polar functional group is a phenyl group. A highly polar resin exhibits a high refractive index due to the inclusion of a highly polar functional group. Specifically, the refractive index of the highly polar resin after curing may be 1.47 or more and 1.55 or less, preferably 1.50 or more and 1.53 or less. The highly polar resin may include, for example, a phenyl silicone resin. The encapsulating member 30 is formed by curing an encapsulating resin composition containing such a highly polar resin matrix, for example, by room temperature curing, heat curing, or photocuring with ultraviolet light.

[0021] (Sealing resin composition) The highly polar resin matrix contained in the encapsulating resin composition may be an addition-curable silicone resin composition containing an organopolysiloxane containing a crosslinkable functional group and an aryl group in one molecule. The addition-curable silicone resin composition preferably contains an organopolysiloxane containing a crosslinkable functional group and an aryl group in one molecule, an organohydrogenpolysiloxane containing at least two silicon atoms bonded to hydrogen atoms (SiH groups) in one molecule, and a hydrosilylation catalyst.

[0022] The organopolysiloxane contains at least two crosslinkable functional groups per molecule, preferably 2 to 100, and more preferably 2 to 50. The crosslinkable functional groups contained in the organopolysiloxane are preferably aliphatic unsaturated hydrocarbon groups bonded to silicon atoms. The aliphatic unsaturated hydrocarbon groups may be, for example, monovalent aliphatic hydrocarbon groups having 2 to 8 carbon atoms and containing an unsaturated bond, preferably alkenyl groups having 2 to 8 carbon atoms. Examples of alkenyl groups bonded to silicon atoms include vinyl groups, allyl groups, propenyl groups, isopropenyl groups, butenyl groups, hexenyl groups, cyclohexenyl groups, and octenyl groups. The crosslinkable functional groups are particularly preferably vinyl groups. The aliphatic unsaturated hydrocarbon groups may be bonded to silicon atoms at the molecular chain terminals of the organopolysiloxane, silicon atoms in the molecular chain, or both.

[0023] Examples of the aryl group contained in the organopolysiloxane include a phenyl group, a tolyl group, a xylyl group, and a naphthyl group, with a phenyl group being preferred.

[0024] The crosslinkable functional groups and silicon-bonded organic groups other than aryl groups contained in the organopolysiloxane are preferably unsubstituted or substituted monovalent hydrocarbon groups having 1 to 18 carbon atoms, preferably 1 to 10 carbon atoms, and more preferably 1 to 8 carbon atoms. Examples of monovalent hydrocarbon groups include alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, pentyl, neopentyl, hexyl, cyclohexyl, octyl, nonyl, and decyl; aralkyl groups such as benzyl, phenylethyl, and phenylpropyl; and groups in which some or all of the hydrogen atoms of these groups have been substituted with halogen atoms such as fluorine, bromine, or chlorine, or with cyano groups, such as chloromethyl, chloropropyl, bromoethyl, trifluoropropyl, and cyanoethyl. The crosslinkable functional groups and silicon-bonded organic groups other than aryl groups are preferably methyl groups.

[0025] The molecular structure of the organopolysiloxane is not particularly limited as long as it is capable of undergoing a crosslinking reaction. Examples of the molecular structure of the organopolysiloxane include linear, branched, and linear with a partial branched or cyclic structure. The organopolysiloxane may be used alone or in combination of two or more.

[0026] The organopolysiloxane may be, for example, an organopolysiloxane represented by the following average composition formula (1). (R 1 ) a (R 2 ) b (R 3 ) c SiO (4-a-b-c) / 2 (1)

[0027] In the average composition formula (1), a is a number satisfying 0.3≦a≦1.0, preferably 0.4≦a≦0.8, b is a number satisfying 0.05≦b≦1.5, preferably 0.2≦b≦0.8, and c is a number satisfying 0.05≦c≦0.8, preferably 0.05≦c≦0.3, provided that 0.5≦a+b+c≦2.0, more preferably 0.5≦a+b+c≦1.6.

[0028] In the average composition formula (1), R 1 R is an aryl group having 6 to 14 carbon atoms, preferably 6 to 10 carbon atoms, and particularly preferably a phenyl group. 2 is a substituted or unsubstituted monovalent hydrocarbon group having 1 to 6 carbon atoms, preferably 1 to 3 carbon atoms, excluding aryl groups and alkenyl groups. 2 Examples of the alkyl group include alkyl groups such as a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a tert-butyl group, a pentyl group, a neopentyl group, a hexyl group, an octyl group, a nonyl group, and a decyl group; aralkyl groups such as a benzyl group, a phenylethyl group, and a phenylpropyl group; and groups in which some or all of the hydrogen atoms of these groups have been substituted with halogen atoms such as fluorine, bromine, and chlorine, or with a cyano group, for example, halogen-substituted alkyl groups such as a chloromethyl group, a chloropropyl group, a bromoethyl group, and a trifluoropropyl group; and a cyanoethyl group, and a methyl group is preferred.

[0029] In the average composition formula (1), R 3 is an alkenyl group having 2 to 8 carbon atoms, preferably 2 to 6 carbon atoms. 3 Examples of the alkyl group include vinyl, allyl, propenyl, isopropenyl, butenyl, hexenyl, cyclohexenyl, and octenyl groups, and among these, vinyl and allyl groups are preferred.

[0030] The organopolysiloxane may be a linear silicone oil and / or a silicone resin having a branched structure. The linear silicone oil contained in the organopolysiloxane contains a crosslinkable functional group, preferably an aliphatic unsaturated hydrocarbon group bonded to a silicon atom, in one molecule.

[0031] In addition, silicone resins as organopolysiloxanes contain SiO2 units (Q units) and / or (R 4 )SiO 1.5It has a branched structure represented by units (T units). In the case of silicone resins, the aryl group content of the substituents bonded to silicon atoms (excluding oxygen atoms forming siloxane bonds) is preferably 5 mol % or more, more preferably in the range of 10 mol % to 80 mol %, and particularly preferably in the range of 20 mol % to 70 mol %. Specifically, SiO2 units, (R 4 )3SiO 0.5 Silicone resin consisting of units (M units), (R 4 )SiO 1.5 Silicone resin consisting of units, (R 4 )SiO 1.5 Units, (R 4 )2SiO units (D units) silicone resin, (R 4 )SiO 1.5 Units, (R 4 )2SiO units, (R 4 )3SiO 0.5 Examples include silicone resins consisting of units.

[0032] The organopolysiloxane preferably has a weight-average molecular weight, measured by gel permeation chromatography (GPC) in the range of 500 to 100,000 in terms of polystyrene. Resin-structure organopolysiloxanes can be obtained by hydrolyzing the corresponding hydrolyzable group-containing silanes, siloxanes, etc., either alone or together, by known methods.

[0033] It is preferable to use organopolysiloxane in combination with silicone resin and silicone oil. By using them in combination, the sealant's properties such as hardness, elasticity, and crack resistance are improved, and surface tackiness is also improved. The preferred blend ratio, by mass, of silicone resin to silicone oil is preferably in the range of 95:5 or more and 30:70 or less, more preferably 90:10 or more and 40:60 or less, and particularly preferably 90:10 or more and 50:50 or less.

[0034] The organohydrogenpolysiloxane contained in the addition-curable silicone resin composition may contain at least two silicon atoms (SiH groups) bonded to hydrogen atoms per molecule (usually in the range of 2 to 300), and preferably 3 or more, 3 to 200, 3 to 100, or 3 to 20. The organohydrogenpolysiloxane may be any one in which the SiH groups in the molecule can undergo an addition reaction with the aliphatic unsaturated hydrocarbon groups of the functional groups contained in the organopolysiloxane in the presence of a hydrosilylation catalyst to form a crosslinked structure.

[0035] Organohydrogenpolysiloxanes have organic groups bonded to silicon atoms. Examples of the organic groups bonded to silicon atoms include monovalent hydrocarbon groups other than aliphatic unsaturated hydrocarbon groups. The organic groups bonded to silicon atoms are particularly unsubstituted or substituted monovalent hydrocarbon groups having 1 to 12 carbon atoms, preferably 1 to 10 carbon atoms. Examples of organic groups bonded to silicon atoms include alkyl groups such as methyl, ethyl, propyl, butyl, hexyl, and dodecyl; aryl groups such as phenyl; aralkyl groups such as 2-phenylethyl and 2-phenylpropyl; and groups in which some or all of the hydrogen atoms of these groups have been substituted with halogen atoms such as fluorine, bromine, and chlorine, or with cyano groups, such as chloromethyl, chloropropyl, bromoethyl, trifluoropropyl, and cyanoethyl groups; and epoxy group-containing organic groups (glycidyl or glycidyloxy-substituted alkyl groups) such as 2-glycidoxyethyl, 3-glycidoxypropyl, and 4-glycidoxybutyl. The organic groups bonded to the silicon atoms of the organohydrogenpolysiloxane preferably contain at least an aryl group.

[0036] The molecular structure of the organohydrogenpolysiloxane is not particularly limited, and examples of the molecular structure of the organohydrogenpolysiloxane include linear, branched, cyclic, and linear structures having a partially branched or cyclic structure.

[0037] The amount of organohydrogenpolysiloxane blended is an amount such that the number of SiH groups relative to the total number of crosslinkable functional groups in the organopolysiloxane, preferably aliphatic unsaturated hydrocarbon groups, is in the range of 0.5 to 5, preferably 0.8 to 3, and more preferably 1 to 2.5. If the organohydrogenpolysiloxane is contained in an amount such that the ratio of SiH groups in the organohydrogenpolysiloxane relative to the crosslinkable functional groups in the organopolysiloxane falls within the above range, unintended addition reactions can be prevented from proceeding, resulting in a non-uniform crosslinked structure and deterioration of the shelf life of the composition.

[0038] The organohydrogenpolysiloxane is represented by the following average composition formula (2) and contains at least two (usually in the range of 2 to 300) silicon atoms (SiH groups) bonded to hydrogen atoms in one molecule, and preferably three or more (for example, in the range of 3 to 200). H e (R) f SiO (4-e-f) / 2 (2)

[0039] In the average composition formula (2), R is the same or different monovalent hydrocarbon group containing no aliphatic unsaturated bonds, and e and f are numbers satisfying 0.001≦e<2, 0.7≦f≦2, and 0.8≦e+f≦3.

[0040] In the average composition formula (2), R is preferably the same or different monovalent hydrocarbon group having 1 to 10 carbon atoms, particularly 1 to 7 carbon atoms, that does not contain an aliphatic unsaturated bond. For example, a lower alkyl group such as a methyl group, an aryl group such as a phenyl group, or the like, can be used as the substituent R in the average composition formula (1). 2 Examples include those exemplified in.

[0041] Furthermore, e and f are numbers that satisfy 0.001≦e<2, 0.7≦f≦2, and 0.8≦e+f≦3, and are preferably numbers that satisfy 0.05≦e≦1, 0.8≦f≦2, and 1≦e+f≦2.7. There are no particular restrictions on the position of the silicon atom to which the hydrogen atom is bonded, and it may be at either the terminal or non-terminal position of the molecule.

[0042] Examples of such organohydrogenpolysiloxanes include tris(dimethylhydrogensiloxy)methylsilane, tris(dimethylhydrogensiloxy)phenylsilane, 1,1,3,3-tetramethyldisiloxane, 1,3,5,7-tetramethylcyclotetrasiloxane, methylhydrogenpolysiloxane capped at both ends with trimethylsiloxy groups, copolymer of dimethylsiloxane and methylhydrogensiloxane capped at both ends with trimethylsiloxy groups, dimethylpolysiloxane capped at both ends with dimethylhydrogensiloxy groups, copolymer of dimethylsiloxane and methylhydrogensiloxane capped at both ends with dimethylhydrogensiloxane, copolymer of methylhydrogensiloxane and diphenylsiloxane capped at both ends with trimethylsiloxy groups, copolymer of methylhydrogensiloxane, diphenylsiloxane and dimethylsiloxane capped at both ends with trimethylsiloxy groups, and (CH3)2HSiO 1 / 2 Units and SiO 4 / 2 A copolymer consisting of (CH3)2HSiO units 1 / 2 Units and SiO 4 / 2 Units and (C6H5)SiO 3 / 2 and copolymers consisting of units.

[0043] In the organohydrogenpolysiloxane, it is preferred that aryl groups, particularly phenyl groups, account for 5 mol % to 70 mol % of the substituents bonded to silicon atoms (excluding oxygen atoms forming siloxane bonds). Such an addition-curable silicone resin composition has higher transparency and is more suitable for light-emitting devices.

[0044] The addition-curable silicone resin composition preferably contains a hydrosilylation catalyst. Examples of the hydrosilylation catalyst include platinum-based, palladium-based, and rhodium-based catalysts. Examples of platinum-based hydrosilylation catalysts include platinum, platinum black, and chloroplatinic acid. Specific examples include HPtCl·mH0, KPtCl, KHPtCl·mH0, KPtCl, KPtCl·mH0, and PtO·mH0 (where m is a positive integer, preferably an integer between 0 and 6, more preferably 0 or 6), as well as complexes of these with hydrocarbons such as olefins, alcohols, or vinyl-containing organopolysiloxanes. These catalysts can be used alone or in combination.

[0045] The amount of the hydrosilylation catalyst to be added may be an amount effective for curing, i.e., a catalytic amount, which is usually in the range of 0.1 ppm to 1,000 ppm, particularly 0.5 ppm to 200 ppm, calculated as platinum group metal by mass per 100 parts by mass of the total amount of organopolysiloxane.

[0046] The addition-curable silicone resin composition contained in the high-polarity resin matrix preferably yields a cured product with a refractive index in the range of 1.47 to 1.55, and more preferably in the range of 1.50 to 1.53. The refractive index of the cured product obtained by curing the addition-curable silicone resin composition is affected by the organic groups bonded to the silicon atoms constituting the main chain of the organopolysiloxane. When the organic group is an aryl group, particularly a phenyl group, and the content of phenyl groups increases, the refractive index increases. The addition-curable silicone resin composition contained in the encapsulating resin composition, if it yields a cured product with a refractive index in the range of 1.47 to 1.55, has excellent transparency and can be suitably used as an encapsulating resin composition for light-emitting devices that encapsulate light-emitting elements. The refractive index of the cured product obtained by curing the addition-curable silicone resin composition can be measured at 25°C using an Abbe refractometer using sodium D line at a typical wavelength of 589 nm in accordance with JIS K7142:2008. Furthermore, if the addition-curable silicone resin composition is commercially available, the catalog value can be used.

[0047] The encapsulating resin composition contains at least one organosiloxane compound having an alkyl group (alkylsiloxane compound). The alkyl group may be directly bonded to a silicon atom constituting the alkylsiloxane compound. The alkyl group contained in the alkylsiloxane compound may have, for example, 1 to 18 carbon atoms, and preferably 1 to 10 carbon atoms. Specific examples of the alkyl group contained in the alkylsiloxane compound include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, pentyl, neopentyl, hexyl, cyclohexyl, octyl, nonyl, and decyl groups.

[0048] Specific examples of alkylsiloxane compounds include organosiloxane compounds having a (meth)acrylate group and a dimethylsiloxane unit, organosiloxane compounds having a dimethylsiloxane unit and a diphenylsiloxane unit, organosiloxane compounds having a dimethylsiloxane unit and being polyether-modified, and organosiloxane compounds having a dimethylsiloxane unit and being polyester-modified. It is preferable to include at least one selected from the group consisting of these.

[0049] The weight average molecular weight of the alkylsiloxane compound may be, for example, 150 or more and 10,000 or less, and preferably 500 or more and 2,000 or less.

[0050] The content of the alkylsiloxane compound in the encapsulating resin composition is 10 ppm or more and 3% or less, preferably 10 ppm or more and 0.5% or less, and more preferably 10 ppm or more and 0.1% or less.

[0051] Furthermore, the encapsulating resin composition may contain at least one silane coupling agent. The inclusion of a silane coupling agent in the encapsulating resin composition improves adhesion between the encapsulating member and the substrate. The silane coupling agent is not particularly limited as long as it is a compound having a functional group that bonds to the silicone resin component of the encapsulating member and a functional group that bonds to the substrate, and can be appropriately selected from commonly used silane coupling agents. Examples of the functional group that bonds to the substrate include trialkoxysilyl groups such as trimethoxysilyl and triethoxysilyl. Examples of the functional group that bonds to the silicone resin component include epoxy groups, vinyl groups, amino groups, mercapto groups, and ureido groups. The encapsulating resin composition may contain at least one selected from the group consisting of these groups, and preferably contains at least one of an epoxy group and a vinyl group.

[0052] Specific examples of silane coupling agents include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris(2-methoxyethoxy)silane, 3-aminopropyltriethoxysilane, 3-(2-aminoethyl)aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-(2-aminoethyl)aminopropyltrimethoxysilane, 3-phenylaminopropyltrimethoxysilane, 3-mercaptotriethoxysilane, and 3-ureidopropyltriethoxysilane. Silane coupling agent oligomers such as silane-modified isocyanuric acid compounds (e.g., divinyltrimethoxysilylpropylisocyanuric acid) can also be used. These silane coupling agents can be used alone or in combination of two or more.

[0053] The content of the silane coupling agent in the encapsulating resin composition may be, for example, 0.3% by mass to 10.0% by mass, and preferably 0.5% by mass to 3.0% by mass. When the content of the silane coupling agent is within the above range, the adhesion between the encapsulating member 30 and the base 10 is further improved, and the peel resistance of the encapsulating member 30 from the base 10 can be further improved.

[0054] The encapsulating resin composition may contain a phosphor that absorbs light from the light emitting element 20 and converts it into light of a different wavelength. Examples of the phosphor that can be used include a YAG (yttrium aluminum garnet) phosphor activated with Ce (cerium), a LAG (lutetium aluminum garnet) phosphor activated with Ce, a nitrogen-containing calcium aluminosilicate (CaO-Al2O3-SiO2) phosphor activated with at least one of Eu (europium) and Cr (chromium), a silicate ((Sr,Ba)2SiO4) phosphor activated with Eu, a β-sialon phosphor, a fluoride (K2(Si,Al)F6:Mn) phosphor, and nitride phosphors such as CaAlSiN3:Eu, (Sr,Ca)AlSiN3:Eu, and (Sr,Ca)2Si5N8:Eu. In the composition representing the phosphor, multiple elements separated by a comma (,) include at least one element selected from the multiple elements separated by the comma (,), and may include a combination of two or more of the multiple elements. In the composition representing the phosphor, the part before the colon (:) represents the elements constituting the host crystal and their molar ratio, and the part after the colon (:) represents an activator element. The phosphor contained in the encapsulating resin composition may be one type of phosphor used alone, or two or more types of phosphors may be used in combination.

[0055] The content of the phosphor in the encapsulating resin composition may be appropriately selected depending on the type of phosphor or the desired color tone of the emitted light. The content of the phosphor in the encapsulating resin composition may be, for example, in the range of 1 part by mass to 400 parts by mass, 2 parts by mass to 300 parts by mass, or 5 parts by mass to 250 parts by mass, relative to 100 parts by mass of the addition-curable silicone resin composition.

[0056] The encapsulating resin composition may contain other components such as a filler, a light stabilizer, a colorant, etc. Examples of fillers include silicon oxide, barium titanate, titanium oxide, and aluminum oxide. The content of the other components in the encapsulating resin composition may be preferably in the range of 0.01 parts by mass or more and 100 parts by mass or less per 100 parts by mass of the addition-curable silicone resin composition.

[0057] The encapsulating resin composition is placed in the recess 17 of the base 10 and cured in the steps of placing the encapsulating resin composition and curing the encapsulating resin composition, which will be described later, to form the encapsulating member 30 that covers the light-emitting element 20.

[0058] In the light emitting device 1 configured in this manner, the sealing member 30 is disposed in the recess 17 of the base 10. This is because the sealing resin composition is prevented from wetting and spreading over the resin portion 16 of the base 10, and the sealing resin composition is disposed at a desired position in the resin portion 16 of the base 10.

[0059] Here, the principle by which the wetting and spreading of the encapsulating resin composition configured as described above onto the resin portion of a substrate having polar groups on its surface is suppressed will be explained. An encapsulating resin composition containing a highly polar resin matrix easily wets and spreads onto the resin portion of a substrate having polar groups on its surface. This ease of wetting and spreading is thought to be due to the fact that resins having high polarity have high hydrophilicity. Therefore, by adding an organosiloxane compound having an alkyl group to the encapsulating resin composition to reduce the polarity of the encapsulating resin composition, the hydrophilicity between the encapsulating resin composition and the resin portion of the substrate is reduced. As a result, the wetting and spreading of the encapsulating resin composition onto the resin portion of the substrate having polar groups on its surface is suppressed.

[0060] 2. Manufacturing method The method for manufacturing the light emitting device 1 according to the first embodiment includes the following steps: (1) preparing an assembly substrate; (2) disposing a light-emitting element; (3) placing an encapsulating resin composition; (4) curing the encapsulating resin composition; (5) singulating; Includes.

[0061] (1) A step of preparing an assembly substrate 3 and 4, an aggregate substrate 100 having a plurality of recesses 17 is prepared. The aggregate substrate 100 includes a lead frame 18 having a plurality of first electrodes 11 and a plurality of second electrodes 12 connected together, and a molded resin part 116 that supports the lead frame 18 and has a plurality of recesses 17 integrally molded therein. In the step of preparing the aggregate substrate, for example, a lead frame 18 having a plurality of first electrodes 11 and second electrodes 12 connected together is prepared, the lead frame 18 is supported at a predetermined position in the cavity of a resin molding die, and molding resin is injected into the cavity and cured. Methods for injecting molding resin into the cavity include, for example, injection molding and transfer molding. The assembly substrate 100 may be purchased and prepared.

[0062] (2) Step of arranging the light-emitting element 5, in the step of arranging the light-emitting elements, light-emitting elements 20 are arranged in each recess 17 of the aggregate base 100. The light-emitting elements 20 have positive and negative electrodes on their upper surfaces (light-emitting surfaces), and are arranged on the upper surfaces 11a of the first electrodes 11 exposed on the bottom surfaces of the recesses 17. The n-side electrode 21 and p-side electrode 22 of the light-emitting elements 20 are connected to the first electrodes 11 and second electrodes 12 of the aggregate base 100, respectively, by wires 60. When arranging the light-emitting elements 20, a bonding member 50 containing, for example, silicone resin or epoxy resin may be used.

[0063] (3) Step of placing the encapsulating resin composition 6, in the step of disposing the encapsulating resin composition, the encapsulating resin composition 130 is disposed in the recess 17 so as to cover the light emitting element 20. The encapsulating resin composition 130 is disposed in the recess 17 by, for example, an injection molding method, a potting molding method, a printing method, a transfer molding method, or a compression molding method. The encapsulating resin composition 130 contains a highly polar resin base material and an organosiloxane compound having an alkyl group. Details of the encapsulating resin composition are as described above.

[0064] (4) Step of curing the encapsulating resin composition In the step of curing the encapsulating resin composition, the encapsulating resin composition 130 is cured by, for example, room temperature curing, heat curing, or photocuring with ultraviolet light. In the case of heat curing, the encapsulating resin composition 130 is cured by heating at 150°C or higher for 4 hours, for example.

[0065] (5) Slicing process In the singulation step, the aggregate base 100 in which the encapsulating resin composition 130 has been cured is singulated into individual light emitting devices 1. Methods that can be used to singulate the aggregate base 100 include cutting with a lead cut mold or a dicing saw, or cutting with laser light. The singulation is performed, for example, along the lines CL shown in FIG. 6.

[0066] In the above, the aggregate substrate 100 is prepared, the light-emitting element 20 and the encapsulating resin composition 130 are arranged, and then the aggregate substrate 100 is divided into individual pieces. However, before arranging the light-emitting element 20 and the encapsulating resin composition 130, the aggregate substrate 100 may be divided into individual pieces using a dicer or the like, and the light-emitting element 20 and the encapsulating resin composition 130 may be arranged on the divided pieces.

[0067] In the light emitting device 1 manufactured in this manner, the encapsulating resin composition 130 placed in the recess 17 remains within the recess 17, and the encapsulating resin composition 130 is prevented from spreading onto the upper surface 10a of the base 10. Therefore, even when the encapsulating resin composition 130 is cured, the formation of burrs in unintended areas on the upper surface 10a of the base 10 is prevented. This makes it possible to prevent the burrs from peeling off and scattering when the aggregate base 100 is divided into individual pieces. Furthermore, it is possible to prevent the light emitting devices 1 from sticking together when transporting the light emitting devices 1 or when mounting them on a wiring board or the like.

[0068] In the above-described method for manufacturing a light emitting device, the aggregate substrate 100 is used, but the light emitting devices 1 may also be manufactured individually one by one. [Example]

[0069] The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples.

[0070] Example 1 A modified organopolysiloxane (KP-423, manufactured by Shin-Etsu Chemical Co., Ltd.) was added as an organosiloxane compound having an alkyl group to a phenylsilicone resin (OE-6630, manufactured by DuPont-Toray Specialty Materials Co., Ltd.; n = 1.54). The modified organopolysiloxane was added to an encapsulating resin composition containing the phenylsilicone resin and the modified organopolysiloxane so that the content was 100 ppm. Furthermore, per 100 parts by mass of the phenylsilicone resin, 15 parts by mass of silica fine particles A (KYKLOS LER-11, manufactured by Tatsumori Co., Ltd.; particle diameter 11 μm, specific gravity 2.2), 0.4 parts by mass of silica fine particles B (YC100C-SM2, manufactured by Admatechs Co., Ltd.; particle diameter 100 nm, specific gravity 2.2), and 0.4 parts by mass of phosphor (LuAlO 12 90 parts by mass of phosphor B ((Sr,Ca)AlSiN3:Eu, manufactured by Nichia Corporation) and 5 parts by mass of phosphor B were mixed together to obtain an encapsulating resin composition E1 of Example 1.

[0071] Example 2 An encapsulating resin composition E2 of Example 2 was obtained in the same manner as in Example 1, except that the amount of modified organopolysiloxane (KP-423, manufactured by Shin-Etsu Chemical Co., Ltd.) added was 10 ppm.

[0072] Comparative Example 1 An encapsulating resin composition C1 of Comparative Example 1 was obtained in the same manner as in Example 1, except that the amount of modified organopolysiloxane (KP-423, manufactured by Shin-Etsu Chemical Co., Ltd.) added was 1 ppm.

[0073] Comparative Example 2 An encapsulating resin composition C2 of Comparative Example 2 was obtained in the same manner as in Example 1, except that no modified organopolysiloxane (KP-423 manufactured by Shin-Etsu Chemical Co., Ltd.) was added.

[0074] Resin leakage evaluation The encapsulating resin composition obtained above was placed as an encapsulating member on a substrate S1 (manufactured by Nichia Corporation, product number: NHSW757H) molded using an epoxy resin and having a silica-coated surface. The number of packages meeting the following criteria was counted. The results are shown in Table 1. Judgment criteria A: No resin leakage B: Resin leakage that does not cross the CL line that separates (OK wet) C: Resin leakage beyond the CL line that is being separated (NG wetting) The total number (n number) of substrates S1 evaluated was 36.

[0075] [Table 1] TIFF0007776729000001.tif20145

[0076] As a result of the resin leakage evaluation, it was confirmed that modified organopolysiloxane (KP-423 manufactured by Shin-Etsu Chemical Co., Ltd.) had a high resin leakage suppression effect when added in an amount of 10 ppm or more.

[0077] Example 3 A phenylsilicone resin (DuPont-Toray Specialty Materials Co., Ltd.; OE-6630; n = 1.54) was mixed with a silanol-terminated diphenylsiloxane (Gelest; PDS-1615) as an organosiloxane compound having alkyl groups, and 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd.; KBM-303) as a silane coupling agent. The silanol-terminated diphenylsiloxane was added to the encapsulating resin composition containing the phenylsilicone resin and the silanol-terminated diphenylsiloxane at 500 ppm. The 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane was added to the encapsulating resin composition at 1% by mass. Further, for 100 parts by mass of phenyl silicone resin, 10 parts by mass of silica fine particles A (manufactured by Tatsumori Co., Ltd.; FUSELEX X; particle diameter 2.5 μm, specific gravity 2.2), 0.45 parts by mass of silica fine particles B (manufactured by Nippon Aerosil Co., Ltd.; trade name "Aerosil RY200L; particle diameter 12 nm, specific gravity 2.0) and 0.45 parts by mass of phosphor (YAlO 12 : Ce, manufactured by Nichia Corporation) was added to the mixture so that the amount was 11 parts by mass, and they were mixed to obtain an encapsulating resin composition E3 of Example 3.

[0078] Example 4 An encapsulating resin composition E4 of Example 4 was obtained in the same manner as in Example 3, except that a silane-modified isocyanuric acid ester compound (manufactured by Shin-Etsu Chemical Co., Ltd.; X-12-1290) was used as the silane coupling agent.

[0079] Example 5 An encapsulating resin composition E5 of Example 5 was obtained in the same manner as in Example 3, except that no silane coupling agent was added.

[0080] Example 6 An encapsulating resin composition C6 of Example 6 was obtained in the same manner as in Example 3, except that the amount of the organosiloxane compound added was 200 ppm and no silane coupling agent was added.

[0081] Comparative Example 3 An encapsulating resin composition C3 of Comparative Example 3 was obtained in the same manner as in Example 3, except that no organosiloxane compound was added and no silane coupling agent was contained.

[0082] Resin leakage evaluation The encapsulating resin composition obtained above was placed as an encapsulating member on a substrate S2 (manufactured by Nichia Corporation, product number: NSSW146A) molded using nylon 9T resin and having a plasma-treated surface of the resin portion. The number of packages meeting the following criteria was counted. The results are shown in Table 2. Judgment criteria A: No resin leakage B: Leak on one of the four sides of the top surface 10a C: Leaks on two or three of the four sides of the top surface 10a D: Leaks on four of the four sides of the top surface 10a The total number (n number) of substrates S2 evaluated was 120.

[0083] [Table 2] TIFF0007776729000002.tif25145

[0084] As a result of the resin leakage evaluation, when Examples 3 to 5 were compared with Comparative Example 3, it was found that Examples 3 to 5 had less leakage on two or three sides than Comparative Example 3, and it was therefore confirmed that adding a double-ended silanol diphenylsiloxane (PDS-1615, manufactured by Gelest) as an organosiloxane compound having an alkyl group had the effect of suppressing resin leakage.

[0085] Thermal shock resistance evaluation Thermal shock test conditions: -40°C, 15 minutes → 125°C, 15 minutes After 1040 cycles of the thermal shock test, the step portions of the wall portion 15 of the base body S2 and the occurrence of peeling of the sealing member were visually inspected, and the number of packages in which peeling occurred was counted. The results are shown in Table 3. Judgment criteria A: No peeling B: Peeling The total number (n number) of substrates S2 evaluated was 30.

[0086] [Table 3] TIFF0007776729000003.tif15145

[0087] As a result of the thermal shock resistance evaluation, it was confirmed that the inclusion of a silane coupling agent has the effect of suppressing peeling between the step portion of the wall portion 15 of the base S2 and the sealing member during the thermal shock test.

[0088] The above describes the embodiments, examples, and comparative examples of the present disclosure, but the disclosed contents may vary in the details of the configuration, and changes in the combination and order of elements in the embodiments, examples, and comparative examples may be realized without departing from the scope and concept of the claimed disclosure. [Explanation of symbols]

[0089] 1. Light-emitting device 10 Base 10a top surface 11 1st electrode 12 2nd electrode 13 Resin support 14 Bottom 15 Wall 16 Resin part 17 Recess 20 Light-emitting element 20a top surface 21 n-side electrode 22 p side electrode 30 Sealing member 40 Protection element 50 Joint material 60 wire 100 Aggregate Substrate 116 Molded resin part 130 Sealing resin composition

Claims

1. a substrate including a first electrode, a second electrode, and a resin portion having a polar group on its surface; a light-emitting element electrically connected to the first electrode and the second electrode and disposed on the base; a sealing member that contains a phenyl silicone resin and an organosiloxane compound having an alkyl group and seals the light-emitting element; the content of the organosiloxane compound in the sealing member is 10 ppm or more and 3% or less; The organosiloxane compound includes at least one selected from the group consisting of organosiloxane compounds having a (meth)acrylate group and a dimethylsiloxane unit; organosiloxane compounds having a dimethylsiloxane unit, a diphenylsiloxane unit, and silanol groups at both ends; organosiloxane compounds having a dimethylsiloxane unit and being polyether-modified; and organosiloxane compounds having a dimethylsiloxane unit and being polyester-modified.

2. 2. The light emitting device according to claim 1, wherein the polar group includes at least one selected from the group consisting of an amide group, an ester group, an epoxy group, a silanol group, and a hydroxyl group.

3. 3. The light-emitting device according to claim 1, wherein the phenyl silicone resin is an addition-curable silicone resin composition comprising: an organopolysiloxane containing a crosslinkable functional group and an aryl group in one molecule; an organohydrogenpolysiloxane containing at least two silicon atoms (SiH groups) bonded to hydrogen atoms in one molecule; and a hydrosilylation catalyst.

4. The light emitting device according to claim 1 , wherein the resin portion includes a thermosetting resin or a thermoplastic resin.

5. The light emitting device according to claim 1 , wherein the resin portion includes an epoxy resin or a polyamide resin.

6. The light emitting device according to claim 1 , wherein the sealing member further contains a silane coupling agent.

7. The light emitting device according to claim 6 , wherein the silane coupling agent has at least one of an epoxy group and a vinyl group.

8. An encapsulating resin composition comprising a resin base material containing a phenyl silicone resin and an organosiloxane compound having an alkyl group, a content of the organosiloxane compound in the encapsulating resin composition is 10 ppm or more and 3% or less; The organosiloxane compound includes at least one selected from the group consisting of organosiloxane compounds having a (meth)acrylate group and a dimethylsiloxane unit; organosiloxane compounds having a dimethylsiloxane unit, a diphenylsiloxane unit, and silanol groups at both ends; organosiloxane compounds having a dimethylsiloxane unit and being polyether-modified; and organosiloxane compounds having a dimethylsiloxane unit and being polyester-modified.

9. 9. The encapsulating resin composition according to claim 8, wherein the resin base material is an addition-curable silicone resin composition comprising: an organopolysiloxane containing a crosslinkable functional group and an aryl group in one molecule; an organohydrogenpolysiloxane containing at least two silicon atoms bonded to hydrogen atoms (SiH groups) in one molecule; and a hydrosilylation catalyst.

10. The encapsulating resin composition according to claim 8 , further comprising a silane coupling agent having at least one of an epoxy group and a vinyl group.

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