Photosensitive resin composition for forming partition wall, partition wall structure manufactured using the same, and display device including the partition wall structure

Abstract

To provide a partition-forming photosensitive resin composition which offers superior reliability, in terms of solvent resistance and the like. and a superior swelling property, and is capable of preventing the surface irregularity problem.SOLUTION: A partition-forming photosensitive resin composition is provided, comprising a (A) colorant containing a white pigment, (B) UV absorber, (C) alkali-soluble resin, (D) photopolymerizable compound, (E) photopolymerization initiator, and (F) solvent, the UV absorber containing one or more of benzotriazole-based and triazine-based UV absorbers.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a photosensitive resin composition for forming a partition wall, a partition wall structure produced using the same, and a display device including the partition wall structure. [Background technology]

[0002] In the case of conventional flat panel or liquid crystal display devices, the display structure used to lose a lot of light, but recently, research has been conducted on displays using color conversion panels. For example, in a structure consisting of a backlight that generates blue and a color conversion panel, the blue light from the backlight is used as is for blue, so the light from the backlight can be fully utilized. Also, in pixels that display red or green, blue is converted to red or green for display, so more light is generated in the pixel compared to conventional methods that use absorption and transmission to display desired colors.

[0003] Displays manufactured using low-temperature processes have significant advantages over displays manufactured using previous high-temperature processes. Generally, high-temperature processes are used to enhance the reliability of patterns in order to increase the reliability of materials. However, in the case of recently developed OLEDs, high-temperature processes are difficult to use because OLEDs are sensitive to heat. Therefore, manufacturing flexible or rollable displays by manufacturing each element separately and then bonding them together later makes it difficult to manufacture them. Therefore, color conversion pixels must be formed on top of OLED panels using a photolithography process, and the demand for low-temperature processes to form color conversion pixels is increasing. Furthermore, as display devices become larger, the size of exposure equipment in mass production lines is increasing to shorten exposure times for process efficiency, resulting in the need for high-intensity exposure.

[0004] In addition, in a display device including a color conversion panel, partitions are formed between each color conversion pixel to prevent color mixing between the color conversion pixels, and the partitions between each color conversion pixel are formed to a thickness of 3 to 15 μm depending on the conversion efficiency of the color conversion pixels.

[0005] Conventional photosensitive resin compositions for black matrices have no problem in forming patterns when the film thickness is 1 to 1.5 μm, as in the past, but the barrier ribs of color conversion pixels must be formed to a film thickness of 3 to 15 μm, which is not preferable. Furthermore, when forming barrier ribs in a thick film using conventional black matrices, there is a problem that light does not reach the bottom of the pattern due to a decrease in UV transmittance during the exposure process, and the lower part of the film does not undergo photo-curing, which causes severe undercutting after the development process, resulting in disadvantages such as a weak process margin.

[0006] In addition, the photosensitive resin composition for forming the barrier ribs may contain scattering particles such as white pigments or metal oxides to improve the optical characteristics of pixels in a display structure including quantum dots. Such photosensitive resin compositions containing scattering particles may scatter light from an exposure device, resulting in hardening of unexposed areas. This phenomenon is particularly severe in high-intensity exposure devices, resulting in problems such as reverse taper angles, residual film, and undeveloped images. Furthermore, if the barrier ribs have poor solvent resistance, residues may form inside the barrier ribs during the thermal process used to manufacture the barrier ribs, thereby reducing the efficiency and lifespan of the color conversion pixels.

[0007] Korean Patent Publication No. 10-2007-0094460 aims to provide a photosensitive resin composition for forming partition walls that has excellent shape stability against heat, but the above-mentioned problems are not yet overcome. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Republic of Korea Patent Publication No. 10-2007-0094460 (Published on September 20, 2007) Summary of the Invention [Problem to be solved by the invention]

[0009] The present invention has been made to overcome the above-mentioned conventional technical problems, and an object of the present invention is to provide a photosensitive resin composition for forming partition walls, which has excellent reliability such as solvent resistance and excellent swelling properties, and can prevent the problem of surface unevenness.

[0010] Another object of the present invention is to provide a photosensitive resin composition for forming partition walls which does not leave a residual film or residue even when exposed to high-intensity light and has excellent processability for tapering.

[0011] A further object of the present invention is to provide a partition structure and a display device produced using the photosensitive resin composition for forming partition walls. [Means for solving the problem]

[0012] The present invention provides a photosensitive resin composition for forming partition walls, which comprises (A) a colorant containing a white pigment, (B) a UV absorber, (C) an alkali-soluble resin, (D) a photopolymerizable compound, (E) a photopolymerization initiator, and (F) a solvent, wherein the UV absorber includes at least one of a benzotriazole-based or triazine-based UV absorber.

[0013] The present invention also provides a barrier rib structure manufactured using the photosensitive resin composition for forming a barrier rib, and a display device including the same. [Effects of the Invention]

[0014] The photosensitive resin composition for forming partition walls and the partition wall structure according to the present invention have excellent reliability such as solvent resistance and excellent swelling properties, and can provide the effect of preventing the problem of surface unevenness.

[0015] Furthermore, the photosensitive resin composition for forming a partition wall and the partition wall structure according to the present invention do not leave any residual film or residue even when exposed to high-intensity light, and can provide excellent tapering process characteristics. [Brief explanation of the drawings]

[0016] [Figure 1] FIG. 1 is a diagram showing the evaluation criteria for residual film / residue properties of cured films of partition wall patterns prepared using photosensitive resin compositions for forming partition walls according to examples and comparative examples of the present invention. [Figure 2] FIG. 1 is a diagram showing the evaluation criteria for taper characteristics of cured films of barrier rib patterns prepared using photosensitive resin compositions for forming barrier ribs according to examples and comparative examples of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0017] The present invention relates to a photosensitive resin composition for forming a partition wall, which comprises (A) a colorant containing a white pigment, (B) a UV absorber, (C) an alkali-soluble resin, (D) a photopolymerizable compound, (E) a photopolymerization initiator, and (F) a solvent, wherein the UV absorber comprises at least one of a benzotriazole-based or a triazine-based UV absorber, a partition wall structure produced from the photosensitive resin composition for forming a partition wall, and a display device including the same.

[0018] The present invention will be described in detail below. <Photosensitive resin composition for forming partition walls> The photosensitive resin composition for partition wall formation according to the present invention can contain (A) a colorant including a white pigment, (B) a UV absorber, (C) an alkali-soluble resin, (D) a photopolymerizable compound, (E) a photopolymerization initiator, and (F) a solvent.

[0019] (A) Colorant The colorant according to the present invention is characterized by containing (a1) a white pigment.

[0020] (a1) White pigment The white pigment is used to improve the reflective properties of the barrier rib structure. Specifically, it improves the reflectivity of the barrier rib structure for red and / or green wavelength light, thereby reflecting light in a specific wavelength range generated by the color conversion element toward the barrier rib, thereby improving brightness. However, when only a white pigment is used, it acts as a scatterer and may scatter light from an exposure device, resulting in hardening of unexposed areas. In this case, this phenomenon may become more severe in high-intensity exposure devices, resulting in problems such as reverse taper angle, residual film, and undeveloped areas.

[0021] The white pigment preferably has an average particle size of 150 nm to 400 nm. If the average particle size is less than 150 nm, the white pigment exhibits UV light blocking properties, but does not allow sufficient UV light to penetrate to the bottom during the exposure process, making pattern formation difficult. If the particle size is too small, the visible light transmittance increases, resulting in reduced blocking properties. If the average particle size exceeds 400 nm, dispersibility and storage stability may be poor, the surface smoothness of the exposed area may decrease, and the interface between the exposed and unexposed areas may become uneven, resulting in ineffective reflective properties.

[0022] The white pigment (Pigment White) may be one or more selected from the group consisting of titanium oxide (TiO2), silicon dioxide (SiO2), aluminum oxide (Al2O3), tin oxide (SnO2), iron oxide (Fe2O3), zinc oxide (ZnO), magnesium oxide (MgO), zirconium oxide (ZrO2), cerium oxide (CeO2), lithium oxide (Li2O), silver oxide (AgO), antimony oxide (Sb2O3, Sb2O5), and calcium oxide (CaO), and preferably includes titanium oxide (TiO2) or zirconium oxide (ZrO2), and more preferably includes titanium oxide (TiO2).

[0023] As the white pigment, any white pigment known in this field (CI Pigment White) can be used as long as it satisfies the above-mentioned conditions, and examples of the white pigment include CI Pigment White 4, 5, 6, 6:1, 7, 18, 18:1, 19, 20, 22, 25, 26, 27, 28, and 32. In terms of reflection efficiency and whiteness, it is preferable to include CI Pigment White 6 or 22, and it is more preferable to include CI Pigment White 6. These can be used alone or in combination of two or more types.

[0024] Titanium oxide (TiO2) contained in CI Pigment White 6 is inexpensive, has a high refractive index and excellent reflectance, so it can be used as an effective white pigment, and from the standpoint of colorability and whiteness, it is preferable that it has a rutile structure.

[0025] The titanium oxide (TiO2) may be subjected to, as required, a resin treatment, a surface treatment using a pigment derivative into which an acidic group or a basic group has been introduced, a graft treatment onto the pigment surface using a polymer compound, a micronization treatment using a sulfuric acid micronization method or the like, a washing treatment using an organic solvent or water to remove impurities, or a treatment to remove ionic impurities using an ion exchange method or the like.

[0026] The titanium oxide (TiO2) may be surface-treated with one or more selected from the group consisting of silicon oxide (SiO2), aluminum oxide (Al2O3), zirconium oxide (ZrO2), and organic compounds. Preferably, the titanium oxide (TiO2) may be sequentially surface-treated with silicon oxide (SiO2), aluminum oxide (Al2O3), and zirconium oxide (ZrO2). More preferably, the outermost surface of the surface-treated titanium oxide (TiO2) may be surface-treated with an organic compound. The organic compound may be any organic compound that coats the titanium oxide (TiO2) with a low-polarity monomolecular layer to reduce the energy required for dispersing the titanium oxide (TiO2) and prevent the titanium oxide (TiO2) from being compressed and agglomerated. In one or more embodiments, stearic acid, trimethylpropane (TMP), pentaerythritol, etc. may be used.

[0027] By performing the surface treatment of titanium dioxide (TiO2) as described above, it is possible to improve the reflective brightness characteristics while reducing the photocatalytic activity of titanium dioxide (TiO2), and in particular, according to a preferred embodiment of the surface treatment, there is an advantage in terms of improving reliability such as heat resistance and chemical resistance. The surface treatment may be a treatment by encapsulation.

[0028] The content of the titanium oxide (TiO2) core contained in the surface-treated titanium oxide (TiO2) is preferably 85 to 95 wt % relative to the total weight of the surface-treated titanium oxide (TiO2). When the surface of the titanium oxide (TiO2) core is treated within this range, the titanium oxide (TiO2) exhibits excellent whiteness and reflective brightness.

[0029] Commercially available titanium oxide (TiO2) products include DuPont's R-101, R-102, R-103, R-104, R-105, R-350, R-706, R-794, R-796, TS-6200, R-900, R-902, R-902+, R-931, and R-960, as well as Huntsman's R-FC5, TR81, and TR88, and ISK's CR-57.

[0030] The white pigment is contained in an amount of 1 to 30% by weight based on the total weight of the colorant (A) in the photosensitive resin composition for forming partition walls of the present invention. If the content of the white pigment is less than 1% by weight, the reflectance in the wavelength ranges of red and green pixels is insufficient, and improvement in light efficiency cannot be expected. If the content of the white pigment is more than 30% by weight, a residual film may be generated during high-intensity exposure, or the taper shape may become poor.

[0031] (a2) Additional pigments or dyes The colorant (A) according to the present invention may further contain organic pigments, inorganic pigments, dyes, etc. that are commonly used in the art, within the scope of the present invention, and preferably, one or more pigments selected from the group consisting of black pigments, red pigments, yellow pigments, and blue pigments may be mixed and used.

[0032] The black pigment can be appropriately selected from black organic pigments or black inorganic pigments.

[0033] The black organic pigment may be one or more selected from the group consisting of lactam black, perylene black, cyanine black, and aniline black. The black inorganic pigment may be one or more selected from the group consisting of carbon black, chromium oxide, iron oxide, and titanium black. Depending on the purpose, the black organic pigment and the black inorganic pigment may be used alone or in combination of two or more.

[0034] The red pigment (Pigment Red) may be one or more selected from the group consisting of diketopyrroles, anthraquinones, perylenes, and azos. Preferably, the red pigment is one or more selected from the group consisting of CI Red Pigments 9, 81, 97, 105, 122, 123, 144, 149, 150, 155, 166, 168, 171, 175, 176, 177, 179, 180, 185, 192, 202, 208, 209, 214, 215, 216, 220, 222, 224, 242, 254, 255, 264, 269, 270, and 272. More preferably, the red pigment is one or more selected from the group consisting of CI Red Pigments 177, 179, 254, 264, and 269.

[0035] The yellow pigment (Pigment Yellow) may be one or more selected from anthraquinone-based, isoindolinone-based, and azo-based pigments. Preferably, the yellow pigment may be one or more selected from the group consisting of CI Yellow Pigment 11, 13, 20, 24, 31, 53, 83, 86, 93, 94, 95, 99, 108, 109, 110, 117, 125, 128, 129, 138, 139, 147, 148, 150, 151, 154, 155, 166, 167, 173, 180, 185, and 199. More preferably, the yellow pigment may be one or more selected from the group consisting of CI Yellow Pigment 138, 139, 150, and 185.

[0036] The blue pigment may be one or more selected from CI Pigment Blue 15, CI Pigment Blue 15:3, CI Pigment Blue 15:4, and CI Pigment Blue 15:6.

[0037] The dye can be used without any limitation as long as it is soluble or dispersible in an organic solvent. It is preferable to use a dye that is soluble in an organic solvent and can ensure reliability such as solubility in an alkaline developer, heat resistance, and solvent resistance.

[0038] The dye may be selected from acid dyes having an acidic group such as sulfonic acid or carboxylic acid, salts of acid dyes and nitrogen-containing compounds, sulfonamides of acid dyes, and derivatives thereof. In addition, azo-, xanthene-, and phthalocyanine-based acid dyes and derivatives thereof may also be selected.

[0039] Preferably, the dye is a compound classified as a dye in the Color Index (published by The Society of Dyers and Colourists) or a known dye as described in Dyeing Notes (Shikisensha).

[0040] Specific examples of the dye include: CI Solvent Green 1, 3, 4, 5, 7, 28, 29, 32, 33, 34, 35 CI Solvent Yellow 4, 14, 15, 16, 21, 23, 24, 38, 56, 62, 63, 68, 79, 82, 93, 94, 98, 99, 151, 162, 163 CI Solvent Blue 18, 35, 36, 45, 58, 59, 59:1, 63, 68, 69, 78, 79, 83, 94, 97, 98, 100, 101, 102, 104, 105, 111, 112, 122, 128, 132, 136, 139 Red dyes such as CI Solvent Red 8, 45, 49, 89, 111, 122, 125, 130, 132, 146, 179; CI Acid Red 1, 4, 8, 14, 17, 18, 26, 27, 29, 31, 34, 35, 37, 42, 44, 50, 51, 52, 57, 66, 73, 80, 87, 88, 91, 92, 94, 97, 103, 111, 114, 129, 133, 134, 138, 143, 145, 150, 151, 158, 176, 182, 183, 198, 206, 211 , 215, 216, 217, 227, 228, 249, 252, 257, 258, 260, 261, 266, 268, 270, 274, 277, 280, 281, 195, 308, 312, 315, 316, 339, 341, 345, 346, 349, 382, ​​383, 394, 401, 412, 417, 418, 422, 426.

[0041] The pigments and dyes can be used either alone or in combination of two or more. (a3) Pigment dispersant The pigment dispersant is added to deflocculate the pigment and maintain its stability, and any dispersant commonly used in the art can be used without limitation. Specific examples of the pigment dispersant include cationic, anionic, nonionic, amphoteric, polyester, and polyamine surfactants, and these can be used alone or in combination of two or more.

[0042] The pigment dispersant preferably includes an acrylate-based dispersant (hereinafter referred to as "acrylate-based dispersant") containing butyl methacrylate (BMA) or N,N-dimethylaminoethyl methacrylate (DMAEMA). The acrylate-based dispersant is preferably manufactured by a living control method. Commercially available products include DISPER BYK-2000, DISPER BYK-2001, DISPER BYK-2070, and DISPER BYK-2150. The acrylate-based dispersants can be used alone or in combination of two or more.

[0043] In addition to acrylate-based dispersants, other resin-type pigment dispersants may be used as the pigment dispersant. Examples of such other resin-type pigment dispersants include known resin-type pigment dispersants, particularly oily dispersants such as polyurethanes, polycarboxylic acid esters such as polyacrylates, unsaturated polyamides, polycarboxylic acids, (partial) amine salts of polycarboxylic acids, ammonium salts of polycarboxylic acids, alkylamine salts of polycarboxylic acids, polysiloxanes, long-chain polyaminoamidophosphate salts, esters of hydroxyl group-containing polycarboxylic acids and their modified products, or amides formed by the reaction of polyesters having free carboxyl groups with poly(lower alkyleneimines) or their salts; water-soluble resins or water-soluble polymer compounds such as (meth)acrylic acid-styrene copolymers, (meth)acrylic acid-(meth)acrylate ester copolymers, styrene-maleic acid copolymers, polyvinyl alcohol, and polyvinylpyrrolidone; polyesters; modified polyacrylates; ethylene oxide / propylene oxide addition products; and phosphate esters.

[0044] Examples of commercially available products of the other resin-type pigment dispersants include, for example, BYK Chemie products under the trade names: DISPER BYK-160, DISPER BYK-161, DISPER BYK-162, DISPER BYK-163, DISPER BYK-164, DISPER BYK-166, DISPER BYK-171, DISPER BYK-182, DISPER BYK-183, DISPER BYK-184, DISPER BYK-185, DISPER BYK-186, DISPER BYK-187, DISPER BYK-188, DISPER BYK-189 ... BYK-184; BASF trade names: EFKA-44, EFKA-46, EFKA-47, EFKA-48, EFKA-4010, EFKA-4050, EFKA-4055, EFKA-4020, EFKA-4015, EFKA-4060, EFKA-4300, EFKA-4330, EFKA-4400, EFKA-4406, EFKA-4510, EFKA-4800; Lubrizol trade names: SOLSPERS-24000, SOLSPERS-32550 , NBZ-4204 / 10; Kawaken Fine Chemicals Co., Ltd. trade names: HINOACT T-6000, HINOACT T-7000, HINOACT T-8000; Ajinomoto Co., Ltd. trade names: AJISPUR PB-821, AJISPUR PB-822, AJISPUR PB-823; Kyoeisha Chemical Co., Ltd. trade names: FLORENE DOPA-17HF, FLORENE DOPA-15BHF, FLORENE DOPA-33, FLORENE DOPA-44, etc.

[0045] In addition to the acrylate-based dispersants, other resin-type pigment dispersants can be used either alone or in combination of two or more, and may be used in combination with the acrylate-based dispersants.

[0046] The pigment dispersant is contained in an amount of 1 to 50 parts by weight, preferably 5 to 30 parts by weight, per 100 parts by weight of the solid content of the colorant. A pigment dispersant content within this range is preferred because it allows for the production of dispersed pigments with uniform particle sizes. If the dispersant content exceeds 50 parts by weight, the viscosity increases, while if it is less than 1 part by weight, it may be difficult to atomize the pigment or problems such as gelation after dispersion may occur.

[0047] (B) UV absorber The UV absorber according to the present invention can reduce CD bias caused by diffraction by partially absorbing UV light, thereby enabling the realization of desired patterns. CD refers to the convex portion of a pattern, and CD bias refers to the degree to which the size of a formed pattern is larger than the desired mask pattern.

[0048] In addition, when a photosensitive resin composition containing scattering particles such as a white pigment or a metal oxide is exposed to high illuminance (15,000 mW or more), problems of residual film and residue may occur. The UV absorber of the present invention helps maintain sensitivity in the depth while reducing sensitivity at the surface during high illuminance exposure, thereby suppressing residual film in the form of drag caused by the difference in sensitivity between the top and bottom, and preventing the generation of residual film and residue.

[0049] The UV absorber according to the present invention includes a UV absorber that absorbs light at i-line wavelengths, and contains at least one benzotriazole-based and triazine-based UV absorber as an essential component.

[0050] The benzotriazole-based and triazine-based UV absorbers have superior absorption at a maximum absorption wavelength of 365 nm compared to other UV absorbers, and may be advantageous for high-intensity exposure.

[0051] Examples of the benzotriazole-based UV absorber include octyl 3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propionate, 2-ethylhexyl 3-(3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl)propionate, [3-[3-(2H-benzotriazol-2-yl)-5-(1,1-methylethyl)-4-hydroxyphenyl]-1-oxopropyl]-w-[3-[3-(2H-benzotriazol-2-yl)-5-(1,1-dimethylethyl)-4-hydroxyphenyl]-1-oxopropoxy]poly(oxy-1,2-ethanediyl), (3-(3-(2H-benzotriazol-2-yl)-5 -(1,1-dimethylethyl)-4-hydroxyphenyl)-1-oxopropyl)-hydroxypoly(oxo-1,2-ethanediyl), 2-(3-tert-butyl-2-hydroxy-5-methylphenyl)-5-chloro-2H-benzotriazole, 2-(2H-benzotriazol-2-yl)-4,6-ditertopentylphenol, 3-(2H-benzotriazolyl)-5-(1,1-dimethylethyl)-4-hydroxy-benzenepropionic acid octyl ester, 2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol, 2-(2H-benzotriazol-2-yl)-6-(1-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol, and the like.

[0052] Examples of the triazine-based UV absorber include 2-(4,6-dimethyl-1,3,5-triazin-2-yl)-5-((hexyl)oxy)-phenol, 2-(4-(2-hydroxy-3-tridecyloxypropyl)oxy)-2-hydroxyphenyl)-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine, and 2-(4-(2-hydroxy-3-didecyloxypropyl)oxy)-2-hydroxyphenyl)-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine. 2,2'-[6-(2,4-dibutoxyphenyl)-1,3,5-triazine-2,4-diyl]bis(5-butoxyphenol), 6-methylheptyl 2-{4-[4,6-di(4-biphenylyl)-1,3,5-triazine-2-yl]-3-hydroxyphenoxy}propanoate, and the like.

[0053] The content of the UV absorber is preferably 0.05 to 10 wt % based on the total weight of the solid content of the photosensitive resin composition for forming partition walls of the present invention. If the content of the UV absorber is below this range, it is difficult to achieve the effects expected from using the UV absorber, while if it is above this range, the sensitivity of the composition may become too low, resulting in problems such as pattern loss, film thickness reduction, and reliability deterioration.

[0054] (C) Alkali-soluble resin The alkali-soluble resin of the present invention is a component that imparts solubility to the alkaline developer used in the development step, and acts as a dispersion medium for the pigment.

[0055] The alkali-soluble resin can be any resin that can be dissolved in an alkali developer, and preferably includes a cardo resin, an acrylic resin, or a mixture thereof.

[0056] The cardo resin has reactivity due to the action of light or heat and alkali solubility, and the cardo resin contained in the photosensitive resin composition for forming partition walls of the present invention is not limited as long as it functions as a binder resin for colorants including white pigments and is soluble in an alkaline developer.

[0057] The cardo resin of the present invention may contain one or more of the compounds represented by Chemical Formula 1-1 and Chemical Formula 1-2.

[0058] [ka]

[0059] [ka]

[0060] In the above Chemical Formula 1-1 or Chemical Formula 1-2, R1, R2, R3, and R4 each independently represent an alkyl group having 1 to 5 carbon atoms, a cycloalkyl group having 4 to 8 carbon atoms, or TIFF0007778597000003.tif1998, X is a hydrogen atom; an alkyl group having 1 to 5 carbon atoms; or a hydroxyl group, R5 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms.

[0061] In the present invention, the compound represented by the chemical formula 1-1 is synthesized using a compound represented by the following chemical formula 2-1, and the compound represented by the chemical formula 1-2 is synthesized using a compound represented by the chemical formula 2-2.

[0062] [ka]

[0063] [ka]

[0064] The alkali-soluble acrylic resin is preferably produced by copolymerizing an ethylenically unsaturated monomer having a carboxyl group.

[0065] Specific examples of ethylenically unsaturated monomers having a carboxyl group include monocarboxylic acids such as acrylic acid, methacrylic acid, and crotonic acid; dicarboxylic acids such as fumaric acid, mesaconic acid, and itaconic acid; and anhydrides of the above dicarboxylic acids; and mono(meth)acrylates of polymers having a carboxyl group and a hydroxyl group at both ends, such as ω-carboxypolycaprolactone mono(meth)acrylate, with acrylic acid and methacrylic acid being preferred.

[0066] The alkali-soluble resin can also be produced by polymerizing an unsaturated monomer copolymerizable with the ethylenically unsaturated monomer having a carboxyl group.

[0067] Specific examples of the copolymerizable unsaturated polymerizable monomer include glycidyl methacrylate, which is an unsaturated monomer having a glycidyl group; ethylenically unsaturated monomers having a hydroxyl group, such as hydroxyethyl (meth)acrylates, such as 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, and N-hydroxyethyl acrylamide; aromatic vinyl compounds, such as styrene, vinyltoluene, α-methylstyrene, p-chlorostyrene, o-methoxystyrene, m-methoxystyrene, p-methoxystyrene, o-vinylbenzyl methyl ether, m-vinylbenzyl methyl ether, p-vinylbenzyl methyl ether, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, and p-vinylbenzyl glycidyl ether; N-cyclohexylmaleimide; N-substituted maleimide compounds such as N-benzylmaleimide, N-phenylmaleimide, No-hydroxyphenylmaleimide, Nm-hydroxyphenylmaleimide, Np-hydroxyphenylmaleimide, No-methylphenylmaleimide, Nm-methylphenylmaleimide, Np-methylphenylmaleimide, No-methoxyphenylmaleimide, Nm-methoxyphenylmaleimide, and Np-methoxyphenylmaleimide; alkyl (meth)acrylates such as methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, i-propyl (meth)acrylate, n-butyl (meth)acrylate, i-butyl (meth)acrylate, sec-butyl (meth)acrylate, and t-butyl (meth)acrylate; cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, 2-methylcyclohexyl (meth)acrylate, tricyclo[5.2.1.Alicyclic (meth)acrylates such as 02,6]decan-8-yl (meth)acrylate, 2-dicyclopentanyloxyethyl (meth)acrylate, and isobornyl (meth)acrylate; aryl (meth)acrylates such as phenyl (meth)acrylate and benzyl (meth)acrylate; unsaturated oxetane compounds such as 3-(methacryloyloxymethyl)oxetane, 3-(methacryloyloxymethyl)-3-ethyloxetane, 3-(methacryloyloxymethyl)-2-trifluoromethyloxetane, 3-(methacryloyloxymethyl)-2-phenyloxetane, 2-(methacryloyloxymethyl)oxetane, and 2-(methacryloyloxymethyl)-4-trifluoromethyloxetane; and the like.

[0068] The copolymerizable unsaturated monomers may be used alone or in combination of two or more.

[0069] The acid value of the alkali-soluble resin is preferably 30 to 200 mgKOH / g. If the acid value of the alkali-soluble resin is less than 30 mgKOH / g, it is difficult to ensure a sufficient development rate of the photosensitive resin composition for partition wall formation, while if it exceeds 200 mgKOH / g, adhesion to the substrate decreases, which makes the pattern prone to short-circuiting, and problems arise in compatibility with the colorant, which causes the colorant in the photosensitive resin composition to precipitate, or the storage stability of the photosensitive resin composition decreases, which makes it prone to an increase in viscosity.

[0070] The "acid value" is a value measured as the amount (mg) of potassium hydroxide required to neutralize 1 g of acrylic polymer, and is usually determined by titration with an aqueous potassium hydroxide solution.

[0071] Additionally, cardo resins or alkali-soluble acrylic resins having a weight-average molecular weight (hereinafter simply referred to as "weight-average molecular weight") of 2,000 to 20,000, preferably 3,000 to 10,000, as measured by gel permeation chromatography (GPC; using tetrahydrofuran as an elution solvent) in terms of polystyrene, are preferred. Within this molecular weight range, film loss during the development step can be suppressed and pattern stability can be improved.

[0072] The alkali-soluble resin is contained in an amount of 5 to 85% by weight, preferably 5 to 60% by weight, based on the total weight of the solid content of the photosensitive resin composition for partition wall formation according to the present invention. When the alkali-soluble resin is contained within this range, the solubility in the developer is sufficient, the formation of a cured film is easy, film reduction in pixel areas of exposed areas is prevented during development, and removal properties of unexposed areas are good, which is preferable.

[0073] (D) Photopolymerizable compound The photopolymerizable compound is a compound that can be polymerized by the action of the photopolymerization initiator (D) described below, and may be a monofunctional monomer, a bifunctional monomer, or a polyfunctional monomer, and preferably a polyfunctional monomer having two or more functionalities.

[0074] Specific examples of the monofunctional monomer include, but are not limited to, nonylphenyl carbitol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-ethylhexyl carbitol acrylate, 2-hydroxyethyl acrylate, and N-vinylpyrrolidone.

[0075] Specific examples of the bifunctional monomer include, but are not limited to, 1,6-hexanediol di(meth)acrylate, ethylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, bis(acryloyloxyethyl) ether of bisphenol A, and 3-methylpentanediol di(meth)acrylate.

[0076] Specific examples of the polyfunctional monomer include, but are not limited to, trimethylolpropane tri(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, propoxylated trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, ethoxylated dipentaerythritol hexa(meth)acrylate, propoxylated dipentaerythritol hexa(meth)acrylate, and dipentaerythritol hexa(meth)acrylate.

[0077] The photopolymerizable compound is contained in an amount of 5 to 50 wt %, preferably 7 to 45 wt %, based on the total weight of the solid content of the photosensitive resin composition for forming partition walls. When the photopolymerizable compound is contained within the above range, it is preferable in terms of strength and smoothness.

[0078] (E) Photopolymerization initiator The photopolymerization initiator according to the present invention is a compound that generates radicals capable of initiating polymerization of the photopolymerizable compound when exposed to radiation such as visible light, ultraviolet light, far ultraviolet light, electron beams, or X-rays.

[0079] Examples of the photopolymerization initiator that can be used include acetophenone-based compounds, benzophenone-based compounds, biimidazole-based compounds, triazine-based compounds, oxime ester-based compounds, and thioxanthone-based compounds.

[0080] Specific examples of the acetophenone-based compound include diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyl dimethyl ketal, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butan-1-one, 2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propan-1-one, and 2-(4-methylbenzyl)-2-(dimethylamino)-1-(4-morpholinophenyl)butan-1-one.

[0081] Specific examples of the benzophenone-based compounds include benzophenone, methyl O-benzoylbenzoate, 4-phenylbenzophenone, 4-benzoyl-4'-methyldiphenyl sulfide, 3,3',4,4'-tetra(tert-butylperoxycarbonyl)benzophenone, and 2,4,6-trimethylbenzophenone.

[0082] Specific examples of the biimidazole compound include 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(2,3-dichlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(alkoxyphenyl)biimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(trialkoxyphenyl)biimidazole, 2,2-bis(2,6-dichlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, and imidazole compounds in which the phenyl groups at the 4,4',5,5'-positions are substituted with carboalkoxy groups. Of these, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(2,3-dichlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, and 2,2-bis(2,6-dichlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole are preferably used.

[0083] Specific examples of the triazine-based compound include 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxynaphthyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-piperonyl-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxystyryl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[ 2-(5-methylfuran-2-yl)ethenyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(furan-2-yl)ethenyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(4-diethylamino-2-methylphenyl)ethenyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(3,4-dimethoxyphenyl)ethenyl]-1,3,5-triazine, and the like.

[0084] Specific examples of the oxime ester compound include o-ethoxycarbonyl-α-oximino-1-phenylpropan-1-one, 1,2-octadione, -1-(4-phenylthio)phenyl, -2-(o-benzoyloxime), ethanone, -1-(9-ethyl)-6-(2-methylbenzoyl-3-yl)-, 1-(o-acetyloxime), and the like. Commercially available products include CGI-124 and CGI-224 from Ciba-Geigy Corporation, Irgacure (registered trademark) OXE-01, Irgacure (registered trademark) OXE-02, and Irgacure (registered trademark) OXE-03 from BASF, N-1919 and NCI-831 from Adeka Corporation, and PBG-327 and PBG-345 from Tronley Corporation.

[0085] Specific examples of the thioxanthone compounds include 2-isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-dichlorothioxanthone, and 1-chloro-4-propoxythioxanthone.

[0086] The photopolymerization initiators can be used alone or in combination of two or more. The photopolymerization initiator is contained in an amount of 0.01 to 10 wt %, preferably 0.01 to 5 wt %, based on the total weight of the solid content of the photosensitive resin composition for forming partition walls. When the photopolymerization initiator is contained within this range, the photopolymerization reaction rate is appropriate, preventing an increase in the overall process time and preventing a deterioration in the physical properties of the final cured film due to overreaction, which is preferable.

[0087] The photosensitive resin composition for forming a partition wall according to the present invention may further include a photopolymerization initiation assistant in addition to the photopolymerization initiator. When the photopolymerization initiation assistant is used together with the photopolymerization initiator, the photosensitive resin composition has a higher sensitivity, which is preferable because it improves productivity.

[0088] The photopolymerization initiator aid is a compound used to promote the polymerization of the polymerizable compound whose polymerization has been initiated by the photopolymerization initiator, and one or more compounds selected from the group consisting of amines and carboxylic acid compounds can be preferably used.

[0089] When the photopolymerization initiation aid is contained, the content thereof is usually more than 0 mol to 10 mol or less, preferably 0.01 mol to 5 mol, per 1 mol of the photopolymerization initiator. When the photopolymerization initiation aid is contained within the above range, it is preferable because the photopolymerization efficiency can be improved and the effect of improving productivity can be expected.

[0090] (F) Solvent As the solvent, any organic solvent known in this field can be used without any particular limitation.

[0091] Specific examples of the solvent include ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, dipropylene glycol dipropyl ether, and dipropylene glycol dibutyl ether; aromatic hydrocarbons such as benzene, toluene, xylene, and mesitylene; ketones such as methyl ethyl ketone, acetone, methyl amyl ketone, methyl isobutyl ketone, and cyclohexanone; ethanol, propanol, butanol, hexanol, Alcohols such as cyclohexanol, ethylene glycol, and glycerin; ethyl 3-ethoxypropionate, methyl 3-methoxypropionate, methyl cellosolve acetate, ethyl cellosolve acetate, ethyl acetate, butyl acetate, amyl acetate, methyl lactate, ethyl lactate, butyl lactate, 3-methoxybutyl acetate, 3-methyl-3-methoxy-1-butyl acetate, methoxypentyl acetate, ethylene glycol monoacetate, ethylene glycol Examples of the solvent include esters such as ethylene glycol diacetate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monoacetate, diethylene glycol diacetate, diethylene glycol monobutyl ether acetate, propylene glycol monoacetate, propylene glycol diacetate, propylene glycol monoethyl ether acetate, ethylene carbonate, propylene carbonate, and γ-butyrolactone. The solvent can be used alone or in combination of two or more selected from the group consisting of the above-mentioned solvents.

[0092] Of the above solvents, from the viewpoint of coatability and drying property, it is preferable to use an organic solvent having a boiling point of 100 to 200°C, more preferably alkylene glycol alkyl ether acetates, ketones, esters such as ethyl 3-ethoxypropionate and methyl 3-methoxypropionate, and even more preferably propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, cyclohexanone, ethyl 3-ethoxypropionate, methyl 3-methoxypropionate, etc. These solvents can be used either alone or in combination of two or more.

[0093] The solvent is contained in an amount sufficient to make the total weight of the photosensitive resin composition for forming partition walls 100% by weight. Specifically, in the present invention, the "balance" refers to the amount sufficient to make the total weight of the composition, which further includes the essential components of the present invention and other additional components, 100% by weight. The meaning of the "balance" does not necessarily mean that the photosensitive resin composition for forming partition walls of the present invention does not include additional components.

[0094] For example, the solvent is contained in an amount of 60 to 90 wt %, preferably 70 to 85 wt %, based on the total weight of the photosensitive resin composition for forming partition walls, but is not limited thereto. However, when the solvent is contained within the above content range, it is preferable because it provides an effect of improving coatability when the composition is coated using a coating device such as a roll coater, a spin coater, a slit and spin coater, a slit coater (sometimes called a die coater), or an inkjet.

[0095] (G) Epoxy compounds The photosensitive resin composition for forming partition walls of the present invention may further contain an epoxy compound. By including the epoxy compound, the reliability of the coating film, such as heat resistance and solvent resistance, can be improved, and low-temperature curing properties can be improved.

[0096] The epoxy compound may be an alicyclic epoxy compound, a bisphenol A epoxy compound, a bisphenol F epoxy compound, a novolac epoxy compound, a polyfunctional amine epoxy compound, or the like, and these may be used alone or in combination of two or more. Preferably, an alicyclic epoxy compound, more preferably a bifunctional alicyclic epoxy compound, is used, as these are superior in terms of low-temperature curing property and solvent resistance.

[0097] Examples of the alicyclic epoxy compound include vinylcyclohexene monoxide, 1,2-epoxy-4-vinylcyclohexane, 1,2:8,9 diepoxylimonene, 3,4-epoxycyclohexenylmethyl-3'4'-epoxycyclohexenecarboxylate, limonene dioxide, di(3,4-epoxycyclohexyl)adipate, (3,4-epoxycyclohexyl)methyl-3,4-epoxycyclohexanecarboxylate, (3,4-epoxy-6-methylcyclohexyl)methyl-3,4-epoxy-6-methylcyclohexanecarboxylate, ethylene-1,2-di(3,4- Examples of epoxycyclohexanecarboxylic acid esters include bis(3,4-epoxycyclohexylmethyl)adipate, bis(3,4-epoxy-6-methylcyclohexylmethyl)adipate, diethylene glycol bis(3,4-epoxycyclohexylmethyl ether), ethylene glycol bis(3,4-epoxycyclohexylmethyl ether), 4-(3,4-epoxycyclohexyl)-2,6-dioxa-8,9-epoxyspiro[5.5]undecane, 4-vinylcyclohexene dioxide, bis-2,3-epoxycyclopentyl ether, and dicyclopentadiene dioxide. Among these, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxycyclohexylmethyl alcohol, and 3,4-epoxycyclohexylethyltrimethoxysilane are preferred.

[0098] The alicyclic epoxy compound may be synthesized or may be a commercially available product. Examples of commercially available alicyclic epoxy compounds include "Celloxide 2000 (CEL2000: vinylcyclohexene monoxide 1,2-epoxy-4-vinylcyclohexane)," "Celloxide 3000 (CEL3000: 1,2:8,9 diepoxy limonene)," and "Celloxide 2021P (CEL2021P: 3,4-epoxycyclohexenylmethyl-3',4'-epoxycyclohexenecarboxylate)" manufactured by Daicel Chemical Industries, Ltd., but are not limited thereto. These may be used alone or in combination of two or more.

[0099] The epoxy compound is contained in an amount of 5 to 50 wt %, preferably 7 to 45 wt %, based on the total weight of the solid content of the photosensitive resin composition for forming partition walls. When the epoxy compound is contained within the above range, it is preferred from the viewpoint of improving low-temperature curability and solvent resistance.

[0100] additives The photosensitive resin composition for forming partition walls according to the present invention may further contain, as necessary, additives such as fillers, other polymer compounds, curing agents, surfactants, adhesion promoters, antioxidants, UV absorbers, anti-aggregation agents, etc. The additives may be used alone or in combination of two or more.

[0101] The filler may be specifically glass, silica, alumina, etc., but is not limited to these.

[0102] Specific examples of the other polymer compounds that can be used include curable resins such as epoxy resins and maleimide resins, and thermoplastic resins such as polyvinyl alcohol, polyacrylic acid, polyethylene glycol monoalkyl ether, polyfluoroalkyl acrylate, polyester, and polyurethane, but are not limited to these.

[0103] Examples of the surfactant include silicone-based, fluorine-based, ester-based, cationic, anionic, nonionic, and amphoteric surfactants, and these may be used alone or in combination of two or more.

[0104] The antioxidant may include, for example, one or more selected from the group consisting of phosphorus-based antioxidants, sulfur-based antioxidants, and phenol-based antioxidants, which can suppress discoloration that may occur at high temperatures during processing or yellowing that may occur due to light sources after display fabrication. The antioxidant may include one or more selected from the group consisting of phenolic compounds, phosphorus-based compounds, and sulfur-based compounds, which can be used in combination as phenolic-phosphorus compounds, phenolic-sulfur compounds, phosphorus-sulfur compounds, or phenolic-phosphorus-sulfur compounds.

[0105] Specific examples of the adhesion promoter include vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris(2-methoxyethoxy)silane, N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-chloropropylmethyldimethoxysilane, 3-chloropropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-isocyanatopropyltrimethoxysilane, and 3-isocyanatopropyltriethoxysilane, and these compounds may be used alone or in combination.

[0106] The anti-aggregating agent may be, for example, sodium polyacrylate, but is not limited thereto.

[0107] Those skilled in the art can appropriately add and use the additives as long as the effects of the present invention are not impaired. For example, the additives can be used in an amount of 0.05 to 10% by weight, preferably 0.1 to 10% by weight, and more preferably 0.1 to 5% by weight, based on the total weight of the photosensitive resin composition for partition wall formation, but the amount is not limited thereto.

[0108] <Bulkhead structure and display device> The present invention also provides a partition structure manufactured using the photosensitive resin composition for forming partition walls, and a display device including the same.

[0109] In a display device including a color conversion panel, each pixel is driven to form a color, and therefore a partition structure that can distinguish each pixel must be formed. A display device including a partition structure formed using the photosensitive resin composition for forming partitions of the present invention prevents color mixing between pixels, which is advantageous for forming fine patterns, and enables the manufacture of partitions with minimal change in line width due to changes in development time in the development process. Minimal change in partition line width allows for sufficient space between color conversion pixels, which is advantageous in achieving high-quality images.

[0110] The partition structure is preferably formed to a height or thickness of 3 to 20 μm, preferably 3 to 15 μm, and more preferably 3 to 12 μm.

[0111] The display device may include, but is not limited to, a liquid crystal display device, an organic light emitting diode, a flexible display, etc., and may be any display device known in this field that is applicable.

[0112] To manufacture the color-converting barrier ribs, a method commonly used in the art can be applied without any particular limitation using the barrier rib-forming composition according to the present invention. For example, the barrier ribs can be formed by coating the above-described composition on one surface of a substrate and forming a cured film through photo-curing and development processes. The barrier rib structure of the color-converting panel, which distinguishes color-converting pixels from each other, can be formed using a photolithography process.

[0113] Specifically, to form the partition walls, each photosensitive resin composition is applied to one surface of a substrate, and then the composition is dried by heating, thereby removing volatile components such as solvents and obtaining a smooth cured film.

[0114] The method for applying the composition is not particularly limited, but examples thereof include spin coating, casting coating, roll coating, slit and spin coating, and slit coating.

[0115] After the composition is applied, it is dried by heating (pre-baking) or dried under reduced pressure and then heated to volatilize volatile components such as the solvent. The heating temperature is usually, but not limited to, 70 to 150°C, and preferably 80 to 130°C.

[0116] To form the desired pattern on the coating film thus formed, ultraviolet light is irradiated through a mask to cure the irradiated portions. It is preferable to use a mask aligner or stepper or other device to ensure that the entire exposed portion is uniformly irradiated with parallel light and to accurately align the mask and the cured film substrate. Examples of ultraviolet light that can be used include g-rays (wavelength: 436 nm), h-rays, and i-rays (wavelength: 365 nm). The amount of ultraviolet light irradiation can be appropriately selected as needed.

[0117] The cured coating film is brought into contact with a developer to dissolve the unexposed areas and develop the film, thereby forming a cured film having a desired pattern.

[0118] The cured film thus formed can be further hardened by an additional heat curing process (post-baking, post-firing), in which the heating temperature may be 90 to 180°C and the heating time may be 5 to 180 minutes, preferably 15 to 90 minutes, but is not limited thereto.

[0119] The present invention will be described in more detail below through examples. However, the following examples are provided to further illustrate the present invention, and the scope of the present invention is not limited to the following examples. The following examples can be appropriately modified or changed by those skilled in the art within the scope of the present invention.

[0120] In the following, "%" and "parts" indicating the content are by weight unless otherwise specified. [Example]

[0121] Synthesis example: Synthesis of alkali-soluble resin and dispersing resin 277 g of methoxybutyl acetate was placed in a 1-liter separatory flask, and the temperature was raised to 80°C. 301 g of a 50:50 molar mixture of 3,4-epoxytricyclo[5.2.1.0(2,6)]decan-9-yl acrylate and 3,4-epoxytricyclo[5.2.1.0(2,6)]decan-8-yl acrylate, 49 g of methacrylic acid, and 23 g of azobisdimethylvaleronitrile were dissolved in 350 g of methoxybutyl acetate. The mixture was then added dropwise over 5 hours and aged for 3 hours to obtain an alkali-soluble resin and a dispersible resin [solid content (NV) 35.0 wt %].

[0122] <Production of Photosensitive Resin Composition> Colorants and photosensitive resin compositions according to examples and comparative examples were prepared with reference to the compositions and parts by weight shown in Tables 1 and 2 below.

[0123] [Table 1]

[0124] [Table 2]

[0125] -White pigment: TiO2 (Ti-Pure R-101, DuPont) -Dispersion resin: Resin of synthesis example -Dispersant: DISPERBYK-2000 -B-1: Tinuvin 326 (benzotriazole UV absorber, Basf) -B-2: Tinuvin 328 (benzotriazole UV absorber, Basf) -B-3: Tinuvin 479 (triazine UV absorber, Basf) -B-4: Tinuvin 928 (benzotriazole UV absorber, Basf) -B-5: Chimassorb 90 (benzophenone UV absorber, Basf) -B-6: Tinuvin 5100 (HALS UV absorber, Basf) -Alkali-soluble resin: Resin synthesis example -Photopolymerizable monomer: Dipentaerythritol pentaacrylate / Dipentaerythritol hexaacrylate (A9570NS, Shin-Nakamura Co., Ltd.) -Photopolymerization initiator: OXE-03 (BASF) -Epoxy compound: Celloxide 2021P (Daicel) -Solvent: Propylene glycol monomethyl ether acetate (PGMEA) -Additive: F554 (DIC) <Experimental Example> (1) Manufacturing of barrier rib pattern cured film A 5 cm x 5 cm glass substrate (Corning) was washed with a neutral detergent and water and then dried. The photosensitive resin compositions of the Examples and Comparative Examples were spin-coated onto the glass substrate to a final film thickness of 10 μm, pre-baked at 80°C, and dried for 2 minutes to remove the solvent. Then, a mask containing a 1-100 μm line / space pattern and a 1-200 μm wide rectangular pattern with 1-100 μm partition walls between the patterns was used for the exposure at an illuminance of 25,000 mW and a dose of 100 mJ / cm. 2 The unexposed areas were removed using an alkaline aqueous solution. The resulting cured film was then post-baked at 180° C. for 30 minutes to prepare a 10 μm thick barrier rib patterned cured film.

[0126] The properties of the prepared barrier rib pattern cured film were evaluated according to the following evaluation criteria, and the results are shown in Table 3 below.

[0127] (2) Residual film / residue characteristics evaluation The surfaces of the cured films of the barrier rib patterns prepared using the photosensitive resin compositions according to the examples and comparative examples were observed using an optical microscope and evaluated according to the film residue / residue characteristic evaluation criteria shown in FIG. 1. The results are shown in Table 3 below.

[0128] <Residual Film / Residue Evaluation Criteria> ○: No residual film / residue △: Residue occurs X: Residual film occurs In addition, the cured films of the barrier rib patterns prepared using the photosensitive resin compositions of Example 1 and Comparative Example 1 were exposed to high-intensity light at 30 mW (KarlSuss Mask Aligner), 600 mW (Canon, MPA 600 super), 25,000 mW (Canon, MPA-7500 CF), and 45,000 mW (Canon, MPA-8500 CF) to check for residual film / residue. The results are shown in Table 4 below.

[0129] (3)Taper characteristic evaluation A 100 μm line pattern was cut from the cured film of the barrier rib pattern prepared using the photosensitive resin composition prepared in the Examples and Comparative Examples, and the cross section was observed using a scanning electron microscope (SEM, SU-8100, Hitachi). As shown in Figure 2, the difference in length between the maximum line width (a) and the minimum line width (b) in the cross section was calculated and evaluated according to the following criteria.

[0130] <Taper characteristic evaluation criteria> ◎: 10μm or less ○: More than 10μm, less than 20μm △: More than 20μm, less than 30μm X: Exceeding 30μm (4) Swelling characteristics evaluation After post-baking the cured films made from the photosensitive resin compositions according to the above Examples and Comparative Examples at 180 °C for 30 minutes and 85 °C for 60 minutes respectively, white-ink was dropped into the cured films and left for 30 minutes, and then the presence or absence of Swelling unevenness on the pattern surface was confirmed.

[0131] <Swelling Evaluation Criteria> ○: No Swelling occurred △: Weak Swelling occurred X: Strong Swelling occurred

[0132]

Table 3

[0133]

Table 4

[0134] Referring to Tables 3 and 4 above, the cured films of the partition patterns produced using the photosensitive resin compositions according to the Examples can not only prevent the generation of residual films and residues during high-intensity exposure, but also have a small line width difference in the taper, are excellent in taper shape, can prevent problems such as undercut, and it can be confirmed that they also have excellent swelling characteristics.

[0135] In contrast, when not containing the UV absorber according to the present invention (Comparative Examples 1 and 2), or when containing other types of UV absorbers that are not benzotriazole-based or triazine-based UV absorbers (Comparative Examples 3 and 4), residual films and residues occur during high-intensity exposure, the line width difference of the taper also becomes large, there are problems of poor taper shape and undercut generation, and it can be confirmed that the swelling characteristics are also inferior compared to the Examples.

Claims

1. A photosensitive resin composition for forming a partition wall, comprising: (A) a colorant containing a white pigment; (B) a UV absorber; (C) an alkali-soluble resin; (D) a photopolymerizable compound; (E) a photopolymerization initiator; and (F) a solvent, the white pigment has an average particle size of 150 to 400 nm; The photosensitive resin composition for forming partition walls has a thickness of 3 to 20 μm, and the UV absorber contains at least one of a benzotriazole-based UV absorber and a triazine-based UV absorber.

2. The white pigment is titanium oxide (TiO ２ 2. The photosensitive resin composition for forming partition walls according to claim 1, comprising:

3. The titanium oxide (TiO ２ ) has its surface covered with silicon oxide (SiO ２ ), aluminum oxide (Al ２ O ３ ), zirconium oxide (ZrO ２ 3. The photosensitive resin composition for forming partition walls according to claim 2, characterized in that the composition has been surface-treated with at least one selected from the group consisting of methyl methacrylate, ...

4. 2. The photosensitive resin composition for forming partition walls according to claim 1, wherein the colorant (A) further comprises one or more pigments selected from the group consisting of black pigments, red pigments, yellow pigments, and blue pigments.

5. 2. The photosensitive resin composition for forming partition walls according to claim 1, wherein the white pigment is contained in an amount of 1 to 30% by weight based on the total weight of the colorant (A) in the photosensitive resin composition.

6. 2. The photosensitive resin composition for forming partition walls according to claim 1, wherein the UV absorber is contained in an amount of 0.05 to 10 wt % based on the total weight of the solid content of the photosensitive resin composition for forming partition walls.

7. 2. The photosensitive resin composition for forming partition walls according to claim 1, wherein the alkali-soluble resin (C) includes at least one of a cardo resin and an acrylic resin.

8. The photosensitive resin composition for forming partition walls according to claim 1 , further comprising an epoxy compound.

9. 9. The photosensitive resin composition for forming partition walls according to claim 8, wherein the epoxy compound is an alicyclic epoxy compound.

10. 2. The photosensitive resin composition for forming partition walls according to claim 1, further comprising at least one selected from the group consisting of a filler, a polymer compound, a curing agent, a surfactant, an adhesion promoter, an antioxidant, and an anti-aggregation agent.

11. A partition wall structure manufactured from the photosensitive resin composition for forming partition walls according to any one of claims 1 to 10, wherein the thickness of the partition wall structure is 3 to 20 µm.

12. A display device comprising the partition structure according to claim 11.

Images