Manufacturing method of resin molded product and resin molded product

Abstract

To prevent resin from entering an electrode terminal and its surroundings even when the unevenness of the electrode terminal and its surroundings of an insert member or the position of the inserted electrode terminal varies greatly from molding to molding, in a method for manufacturing a resin molded product.SOLUTION: Sandwiching an insert member, a film 10, and a block member 50 between a first surface 91a of a first mold 91, which is a first face within an inner surface of a molding space SP, and a second surface 92a of a second mold 92, which is a second face within the inner surface, the block member 50, in which an elastic polymer compound is arranged in a first part 51 and a second part 52 that contact the first surface 91a and the second surface 92a, is deformed elastically. Thereafter, an area around the block member 50 is filled with molten resin to solidify a resin around the block member 50. Furthermore, the block member 50 is removed from a resin molded body 20 to expose an electrode terminal 15.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present invention relates to a resin molded product having an insert member inserted therein and a manufacturing method thereof, and more particularly to a resin molded product having an insert member having an electrode terminal and a manufacturing method thereof. [Background technology]

[0002] In a resin molded product having an insert member inserted therein, the insert member, such as a film or a substrate, may have electrode terminals formed thereon, which may need to be exposed to allow electrical connection to electrical components, electronic components, or electrical circuits contained in the insert member from the outside. If the insert member has an electrode terminal, a gap may form between the mold and the connection part, allowing resin to flow in. To prevent such a gap from forming, an elastic body is provided at the tip of the mold's retaining pin, as described in Patent Document 1 (Japanese Patent No. 3994683), for example. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 3994683 Summary of the Invention [Problem to be solved by the invention]

[0004] For example, the technology described in Patent Document 1 proposes a manufacturing method in which a sheet-shaped elastic body is provided at the tip of the retaining pin, preventing gaps from occurring between the retaining pin and the insert member even if the terminal has some unevenness. However, if the thickness of the insert member varies or if the electrode terminal and its surroundings are uneven, it becomes difficult to prevent gaps from occurring with the technique described in Patent Document 1.

[0005] An object of the present invention is to prevent infiltration of resin into the electrode terminal and its surroundings even when there is a large change in the unevenness of the electrode terminal and its surroundings of the insert member or in the position of the inserted electrode terminal from molding to molding. [Means for solving the problem]

[0006] Below, several aspects will be described as means for solving the problems. These aspects can be arbitrarily combined as necessary. A method for manufacturing a resin molded product according to one aspect of the present invention includes a first step of placing an insert member having one main surface between a first mold and a second mold; a second step of clamping the first mold and the second mold to form a molding space containing the insert member; a third step of pouring molten resin into the molding space to form a resin molded article with the insert member inserted; and a fourth step of opening the first mold and the second mold to remove the resin molded article with the insert member inserted. In the first step, a block member is placed on the one main surface so as to contact an electrode terminal used for electrical connection provided on the one main surface. In the second step, the insert member and the block member are sandwiched between a first surface of the first mold, which is a first surface within the inner surface of the molding space, and a second surface of the second mold, which is a second surface within the inner surface, to elastically deform the block member, which has an elastic polymer compound disposed in a first portion and a second portion contacting the first surface and the second surface. In the third step, the block member is filled with molten resin and the resin around the block member is solidified. In the fourth step, the block member is removed from the resin molded body to expose the electrode terminals. In the manufacturing method for a resin molded product configured as described above, even if there are large irregularities on the electrode terminals of the insert member and their surroundings or if the position of the inserted electrode terminals changes significantly, the block member adheres closely to the electrode terminals and their surroundings when the mold is closed in the second step. With the block member adhered closely to the electrode terminals and their surroundings, the area around the block member can be filled with molten resin in the third step.

[0007] In the above-described method for manufacturing a resin molded product, the polymer compound may be configured to have elasticity by containing a silicone-based elastomer or a fluorine-based elastomer, or by being processed into a sponge-like form. In the method for manufacturing a resin molded product configured in this manner, a block member that easily adheres to the terminal and its surroundings and that deforms appropriately can be used to manufacture the resin molded product. In the above-described method for manufacturing a resin molded product, the first distance between the surface of the first portion and the surface of the second portion before elastic deformation due to sandwiching the block member between the first surface and the second surface can be configured to be within a range of 1.2 to 3 times the second distance between the surface of the first portion and the surface of the second portion after elastic deformation. In the method for manufacturing a resin molded product configured in this manner, the block member can be sufficiently adhered to the electrode terminal and its periphery while preventing damage to the block member. In the above-described method for manufacturing a resin molded product, the block member can be configured to have a hardness of Shore A20 or more and Shore A70 or less. In the method for manufacturing a resin molded product configured in this manner, the block member with an appropriate hardness can be firmly adhered to the electrode terminal and its surroundings. In the block member of the above-described method for producing a resin molded product, the polymer compound can be configured to occupy 50% or more of the total volume. In the method for producing a resin molded product configured in this manner, a block member that easily adheres to the terminal and its surroundings and deforms appropriately can be used to produce the resin molded product.

[0008] A resin molded product according to one aspect of the present invention includes a resin molded body molded into a predetermined shape and an insert member inserted into the resin molded body and having an electrode terminal on one main surface thereof for use in electrical connection. The resin molded body has an opening through which a portion of the electrode terminal is exposed. The wall surface of the opening is curved in a concave shape. In the resin molded product configured in this manner, when a sealing material is filled in the opening, the concavely curved wall surface of the opening allows the sealing material to be firmly fixed. The above-mentioned resin molded product can be configured so that the electrode terminal has an uneven or curved surface. A resin molded product configured in this way can provide a high-quality resin molded product in which the electrode terminal has a shape suited to the application and no resin has entered the electrode terminal or its surroundings. In the resin molded product described above, the insert member has a plurality of electrode terminals, and the plurality of electrode terminals are arranged on the curved surface region of the insert member or on the first and second flat surface regions of the insert member. A resin molded product configured in this manner can provide a high-quality resin molded product in which the plurality of electrode terminals conform to the shape of the insert member and no resin has entered the plurality of electrode terminals or their surroundings. [Effects of the Invention]

[0009] The method for manufacturing a resin molded product according to the present invention can prevent resin from penetrating even when there is a large change in the electrode terminal of the insert member and the unevenness around it or in the position of the inserted electrode terminal from molding to molding. The resin molded product according to the present invention does not allow resin to penetrate into the electrode terminal of the insert member and the unevenness around it, making it easier to achieve good electrical connection of the electrode terminal. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a plan view showing an example of a resin molded product according to the present invention. [Figure 2] 2 is a cross-sectional view showing a cross section of the resin molded product of FIG. 1 taken along line II. [Figure 3] FIG. 2 is a perspective view showing an example of the configuration of a resin molded body into which a film is inserted. [Figure 4] 1 is a flowchart showing an example of a flow of a method for manufacturing a resin molded product according to the present invention. [Figure 5] FIG. 1 is a cross-sectional view showing an example of a film used in a method for producing a resin molded product. [Figure 6] FIG. 2 is a cross-sectional view showing a state in which a film and a block member are set between a first die and a second die. [Figure 7]FIG. 2 is a cross-sectional view showing the state of the film and the block member between the clamped first and second dies. [Figure 8] FIG. 10 is a cross-sectional view showing a state in which molten resin is injected into a molding space between a first mold and a second mold that are clamped together. [Figure 9] FIG. 3 is a cross-sectional view showing the state of the film, the resin molded body, and the block member taken out from the first mold and the second mold. [Figure 10] 10 is a cross-sectional view showing a state in which a block member is being removed from the resin molded body in the state shown in FIG. 9. FIG. [Figure 11] FIG. 10 is a cross-sectional view showing another example of a resin molded product according to Modification 1A. [Figure 12] FIG. 10 is a cross-sectional view showing an example of a film having a restricting portion according to Modification 1B. [Figure 13] 10 is a cross-sectional view showing an example of a first mold and a second mold having a restraining portion according to modification example 1C. FIG. [Figure 14] FIG. 10 is a cross-sectional view showing an example of a first mold, a second mold, and a film according to Modification Example 1D. [Figure 15] FIG. 10 is a cross-sectional view showing an example of a film according to Modification 1E. [Figure 16] 16 is a cross-sectional view showing a cross section of the film of FIG. 15 taken along line II-II. [Figure 17] FIG. 10 is a cross-sectional view showing an example of a film according to Modification 1F. [Figure 18] FIG. 10 is a cross-sectional view showing an example of an electrode terminal according to Modification 1G. [Figure 19] FIG. 10 is a cross-sectional view showing an example of an electrode terminal according to Modification 1G. [Figure 20] FIG. 10 is a cross-sectional view showing an example of an electrode terminal according to Modification 1G. [Figure 21] FIG. 10 is a cross-sectional view showing an example of an electrode terminal according to Modification 1G. [Figure 22] FIG. 10 is a cross-sectional view showing an example of an electrode terminal according to Modification 1G. [Figure 23] FIG. 10 is a plan view showing the electrode terminal and the block member according to Modification 1H before injection molding. [Figure 24]24 is a cross-sectional view showing a cross section of the electrode terminal and the block member taken along a line corresponding to line III-III in FIG. 23. FIG. [Figure 25] 24 is a cross-sectional view showing a cross section of the electrode terminal and the block member taken along a line IV-IV in FIG. 23. FIG. [Figure 26] 24 is a cross-sectional view showing a cross section taken along a portion corresponding to line VV of the electrode terminal and the block member in FIG. 23. FIG. [Figure 27] 24 is a cross-sectional view showing a cross section of the electrode terminal and the block member taken along a line corresponding to line VI-VI in FIG. 23. FIG. [Figure 28] FIG. 10 is a cross-sectional view showing an example of a resin molded product according to a second embodiment. [Figure 29] FIG. 10 is a cross-sectional view showing another example of the resin molded product according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] First Embodiment (1) Overview of resin molded products An example of a resin molded product manufactured by the method for manufacturing a resin molded product according to the first embodiment of the present invention is shown in Figures 1 and 2. The resin molded product 1 shown in Figures 1 and 2 includes a film 10 that is an insert member and a resin molded body 20 into which the film 10 is inserted. Figure 1 shows the planar shape of the resin molded product 1. Figure 2 shows a cross section of the resin molded product 1 taken along line II in Figure 1. The film 10 can be rephrased as a film-like device. The resin molded product 1 shown here is a heater. The film 10 has, on one main surface 10a, copper wiring 16 that generates heat. The film 10 also has, on one main surface 10a, electrode terminals 15 used for electrically connecting the copper wiring 16. The copper wiring 16 is connected to the electrode terminals 15 to supply power to the copper wiring 16 via the electrode terminals 15. In this resin molded article 1, the resin molded body 20 is formed on one main surface 10a, and the resin molded body 20 is not formed on the other main surface 10b. In other words, the other main surface 10b of the film 10 is exposed to the outside of the resin molded article 1. Here, we will explain the case where the other main surface 10b is exposed to the outside of the resin molded product 1, but the present invention can also be applied to resin molded products in which the other main surface 10b is not exposed to the outside of the resin molded product 1, for example, resin molded products in which the other main surface 10b is also covered with a resin molded body.

[0012] As shown in Fig. 3, the resin molded body 20 has an octagonal plate shape. An opening 21 is formed in the resin molded body 20 at a position overlapping a portion of the electrode terminal 15 in a plan view. Here, the opening 21 is formed at a position overlapping a portion of the electrode terminal 15 in a plan view, but the opening 21 may be formed at a position overlapping the entire electrode terminal 15 in a plan view. The opening 21 is a rectangular parallelepiped hole that penetrates the resin molded body 20. In this resin molded body 20, the opening 21 is disposed at a position overlapping the electrode terminal 15 in a plan view, and therefore a portion of the electrode terminal 15 is exposed at the bottom of the opening 21. The resin molded article 1 includes a connection pin 30 electrically connected to the electrode terminal 15. The connection pin 30 is connected to an electrical equipment, electrical circuit, or electrical device external to the resin molded article 1. An example of the electrical equipment is a power supply unit that supplies power to a heater. An example of the electrical circuit is a power supply circuit that supplies power to a heater. An example of the electrical device is a power generation element that supplies power to a heater. Note that, since the resin molded article 1 has a heater function, a power supply unit, a power supply circuit, or a power generation element are used as examples of the external electrical equipment, electrical circuit, or electrical device. However, since the electrical function of the resin molded article 1 is not limited to a heater, various external electrical equipment, electrical circuits, or electrical devices can be selected according to the electrical function of the resin molded article 1. The electrode terminal 15 and the connection pin 30 are joined, for example, with solder or conductive paste. In the resin molded product 1, the opening 21 of the resin molded body 20 is filled with a sealant 40. The sealant 40 is filled so as to be flush with the exposed surface of the resin molded body 20. The sealant 40 is a member that seals the electrode terminals 15 and the joints between the electrode terminals 15 and the connection pins 30 to prevent moisture from entering. Examples of the sealant 40 include epoxy resin, acrylic UV-curable resin, polyethylene resin, polypropylene resin, urethane resin, polyimide resin, fluororesin, and silicone resin.

[0013] (2) Manufacturing method for resin molded products Fig. 4 shows part of the flow of the manufacturing method for the resin molded product 1. A case will be described in which a resin molded body into which an insert member for manufacturing three resin molded products 1 is inserted is manufactured in the three cycles C1, C2, and C3 shown in Fig. 4. Here, for ease of explanation, one resin molded body is manufactured in each of the manufacturing cycles C1, C2, and C3, but it is also possible to configure the manufacturing process so that multiple resin molded bodies are manufactured in each of the cycles C1, C2, and C3. One resin molded body is manufactured in the manufacturing cycle C1 before the manufacturing cycle C2, and one resin molded body is manufactured in the manufacturing cycle C3 after the manufacturing cycle C2. 5 to 10 show cross sections of the film 10 or the resin molded body 20 into which the film 10 is inserted in the order of steps in the manufacturing method of the resin molded product 1. The cross section of the resin molded product 1 including the film 10 and the resin molded body 20 is shown in FIG. 2, which has already been described. To manufacture the resin molded product 1, a plurality of films 10 shown in FIG. 5 are prepared. The film 10, which is an insert member, includes a film substrate 11. Copper wiring 16 and electrode terminals 15 electrically connected to the copper wiring 16 are formed on one main surface 10a of the film 10. The film 10 is processed into a shape suitable for the resin molded product 1, for example, by press processing. In this example, the film 10 is processed to have a circular planar shape that is smaller than the octagonal resin molded product 1. The circular film 10 on which the copper wiring 16 is arranged is located in the center of the resin molded body 20 in a plan view.

[0014] In a first step S1, as shown in Fig. 6, a film 10, which is an insert member, is set between a first die 91 and a second die 92. The film 10 is arranged so that one main surface 10a faces in the direction where a molding space SP (see Fig. 7) is to be formed. In the second step S2, the first die 91 and the second die 92 are clamped together to form a molding space SP that contains the film 10 (see FIG. 7). In the third step S3, the molten resin MR is poured into the molding space SP to form the resin molded body 20 into which the film 10 is inserted (see FIG. 8). In other words, in the third step S3, the molten resin MR is injected into the molding space SP and cooled to solidify the molten resin. In a fourth step S4, first molds 91 and 92 are opened to remove resin molded body 20 into which film 10 has been inserted. Fig. 9 shows resin molded body 20 that has been removed. In a fifth step S5, the connection pins 30 are connected to the electrode terminals 15, for example, by soldering, and the openings 21 are filled with the sealing material 40. By connecting the connection pins 30 and filling the sealing material 40, the production of the resin molded product 1 shown in FIGS. 1 and 2 is completed. The wall surface 21a (see FIG. 10) of the opening 21 of the resin molded body 20 formed by the block member 50 is concavely curved. Because of this concave curve, the sealing material 40 is firmly fixed to the resin molded body 20 by an anchor effect. Forming a curved surface like the wall surface 21a using a mold is difficult because it would prevent the metal mold from being removed. However, because the block member 50 is made of an elastically deformable material, the force applied to the block member 50 during mold clamping is released when the mold is opened, and the block member 50 returns to its original shape, making it easy to pull out of the resin molded body 20.

[0015] In the first step S1 described above, a block member 50 is placed on one main surface 10a of the film 10 so as to come into contact with the electrode terminals 15 provided on the one main surface 10a (see FIG. 6). The electrode terminals 15 are used for electrical connection of the copper wiring 16. In the second step S2 described above, the film 10 and the block member 50 are sandwiched between the first surface 91a of the first die 91 and the second surface 92a of the second die 92, and the block member 50 is elastically deformed (see FIG. 7). The first surface 91a of the first die 91 is the first surface within the inner surface of the molding space SP, and the second surface 92a of the second die 92 is the second surface within the inner surface of the molding space SP. The molding space SP may be surrounded by only the first surface 91a and the second surface 92a. In other words, the inner surface of the molding space SP may consist of only the first portion (first surface 91a) and the second portion (second surface 92a). The molding space SP may also be surrounded by the first surface 91a, the second surface 92a, and a third surface other than these. In other words, the inner surface of the molding space SP may consist of the first portion (first surface 91a), the second portion (second surface 92a), and a third surface other than these. The third surface is, for example, the surface of a third die that is combined with the first die 91 and the second die 92, or the surface of a movable pin in the molding space SP when the movable pin provided in the die is considered to be something other than the first die 91 and the second die 92.

[0016] In the block member 50, an elastic polymer compound is disposed at least in the first portion 51 and the second portion 52 that contact the first surface 91 a and the second surface 92 a. The block member 50 shown in Fig. 7 is entirely made of an elastic polymer compound, and therefore, the elastic polymer compound is disposed necessarily in the first portion 51 and the second portion 52 that contact the first surface 91 a and the second surface 92 a. In the third step S3 described above, the area around the block member 50 is filled with molten resin MR, and the resin around the block member 50 is cooled and solidified (see FIG. 8). At this time, the molten resin MR does not penetrate into the area where the block member 50 is disposed. As shown in FIG. 8, the electrode terminal 15 has steps (an example of unevenness) due to the thickness of the copper wiring 16. However, because the block member 50 is significantly deformed, no gaps are created between the block member 50 and the electrode terminal 15 through which the molten resin MR can penetrate. In the above-mentioned fourth step S4, the resin molded body 20 is removed from the first mold 91 and the second mold 92 (see Figure 9), and the block member 50 is removed from the resin molded body 20 (see Figure 10), exposing the electrode terminal 15 through the opening 21.

[0017] As shown in FIG. 9 , when the block member 50 is no longer sandwiched between the first die 91 and the second die 92, the elastic deformation of the block member 50 is released and the block member 50 returns to its original shape. Having returned to its original shape, the block member 50 protrudes from the resin molded body 20. The protruding portion of the block member 50 from the resin molded body 20 is grasped by, for example, a robot arm and removed from the resin molded body 20. This protruding portion of the block member 50 functions as a gripping portion that makes the block member 50 easier to hold. For example, the block member 50 removed in the fourth step S4 of the previous cycle C1 may be placed, by, for example, a robot arm, on the film 10 set between the first die 91 and the second die 92 in the first step S1 of the next cycle C2. Furthermore, the block member 50 removed in the fourth step S4 of cycle C2 may be placed on the film 10 set between the first die 91 and the second die 92 in the first step S1 of the next cycle C3. By using the block member 50 in multiple cycles C1, C2, and C3 in this way, consumption of the block member 50 can be reduced.

[0018] (3) Materials used in the manufacture of resin molded products (3-1) Insert material In the first embodiment, the film 10 has been described as an example of the insert member. The film substrate 11 of the film 10 is required to insulate between the copper wirings 16. Therefore, the film substrate 11 is preferably insulating. For example, a resin film or an elastomer film can be used as the insulating film substrate 11. Examples of materials for the resin film include thermosetting resins and thermoplastic resins. Examples of materials for the resin film include polyimide, polyethylene terephthalate, polycarbonate, and cycloolefin. The insert member is not limited to a film-like member and may be, for example, a member having a three-dimensional shape. The insert member may be, for example, a molded interconnect device (MID). The insert member may be, for example, a member having a three-dimensional shape on the surface of which wiring is formed by laser direct structuring (LDS).

[0019] (3-2) Materials for resin molded bodies Thermoplastic resins that can be used as materials for molten resin MR include, for example, polyester resin, polyethylene terephthalate (PET) resin, acrylic resin, polycarbonate resin, polybutylene terephthalate (PBT) resin, triacetyl cellulose resin, polyimide resin, polyethylene naphthalate (PEN) resin, liquid crystal polymer (LCP) resin, cycloolefin polymer (COP), styrene resin, and ABS resin. (3-3) Electrode terminals and copper wiring The electrode terminals 15 are made of a material such as gold (Au), nickel (Ni), tin (Sn), copper (Cu), aluminum (Al), silver (Ag), or platinum (Pt), or an alloy containing any of these. The electrode terminals 15 are formed by, for example, plating or vapor deposition. The thickness of the electrode terminals 15 is, for example, 50 μm to 500 μm. For example, when the electrode terminals 15 are rectangular in plan view, the long and short sides are in the range of 1 mm to 50 mm. The thickness of the copper wiring 16 is, for example, 10 μm to 500 μm. The copper wiring 16 shown in FIG. 2 is formed by embedding a portion of a copper wire in the film substrate 11 by, for example, laser processing or ultrasonic processing. However, the copper wiring 16 can also be wired without embedding the copper wire in the film substrate 11; FIGS. 5 to 10 show cases where the copper wire is not embedded in the film substrate 11. When the copper wire is not embedded in the film substrate 11, the copper wire is fixed to the film substrate 11 with, for example, an adhesive to form the copper wiring 16. The width of the copper wiring 16 is formed in the range of, for example, 0.01 mm to 0.5 mm. Copper wiring can also be formed by, for example, screen printing or photolithography. The thickness of copper wiring formed by such a method is, for example, 0.1 μm to 20 μm. The width of such copper wiring 16 is, for example, in the range of 0.05 mm to 5 mm. Here, the case where copper wiring 16 suitable for a heater is used has been described, but the wiring connected to the electrode terminal 15 is not limited to copper wiring 16 and may be formed of a metal such as nickel (Ni), aluminum (Al), gold (Au), or silver (Ag), or may be an alloy.

[0020] (3-4) Block material As already described, the block member 50 has an elastic polymer compound disposed in the first portion 51 and the second portion 52 that contact the first surface 91a of the first die 91 and the second surface 92a of the second die 92. In the first embodiment, the entire block member 50 is made of an elastic polymer compound. The polymer compound of the block member 50 contains a silicone-based elastomer or a fluorine-based elastomer, or is processed into a sponge-like material to have elasticity. For example, the entire block member 50 is made of a silicone-based elastomer or a fluorine-based elastomer. An example of a material for the block member 50 that has elasticity due to being processed into a sponge-like material is foamed polyethylene. Even when a sponge-like material is used for the block member 50, it is preferable that the surface be processed to have no irregularities so that the block member 50 can be easily removed from the opening 21. In the block member 50, the first distance between the surface of the first portion 51 and the surface of the second portion 52 before elastic deformation due to being sandwiched between the first surface 91a and the second surface 92a is preferably within a range of 1.2 to 3 times the second distance between the surface of the first portion 51 and the surface of the second portion 52 after elastic deformation. If (first distance / second distance) is less than 1.2, it becomes difficult for the block member 50 to adhere closely to the electrode terminal 15 and its surroundings, and gaps are likely to occur. If (first distance / second distance) is greater than 3, it becomes difficult for the elastic deformation of the block member 50 to fall within the designed range, and the shape of the opening 21 during manufacturing varies greatly. The block member 50 preferably has a hardness of not less than Shore A20 and not more than Shore A70. If the hardness is lower than Shore A20 (if soft), the block member 50 is more deformed by the molten resin MR, and the molten resin MR is more likely to get into between the block member 50 and the electrode terminal 15. If the hardness is higher than Shore A70 (if hard), the block member 50 is more likely to be damaged when elastically deforming between the first surface 91a of the first die 91 and the second surface 92a of the second die 92, or it may not be able to follow the shape of the electrode terminal 15, causing a gap to form.

[0021] (3-5) Encapsulating material Examples of materials for the sealing material 40 include resin adhesives and inorganic adhesives. Examples of resin adhesives that can be used include acrylate UV-curable resins, polyethylene resins, polypropylene resins, urethane resins, epoxy resins, fluorine resins, and silicone resins. Examples of inorganic adhesives that can be used include glass frit and ceramics.

[0022] (4) Variations (4-1) Variation 1A In the first embodiment, the case where the sealing material 40 is filled in the openings 21 has been described. However, the resin molded product 1 may be one in which the sealing material 40 is not filled in the openings 21. An example of the resin molded product 1 in which the sealing material 40 is not filled in the openings 21 is shown in FIG. 11, the opening 21 is not filled with the sealing material 40, and one main surface 10a of the film 10 is exposed in the opening 21. The electrode terminal 15 is also exposed through the opening 21. For example, a connection pin 30 is joined to this exposed electrode terminal 15, and a connector 35 is connected to the connection pin 30. (4-2) Variation 1B In the first embodiment, the block member 50 is simply placed on the film 10, and no particular member is provided to restrict movement of the block member 50. Even if no member is provided to restrict movement of the block member 50, if the block member 50 is made of, for example, a silicone-based elastomer or a fluorine-based elastomer, the block member 50 will be difficult to move from the location where it is placed in close contact with one main surface 10a of the film 10. However, because the block member 50 receives force from the molten resin MR when the molten resin MR is injected, a restricting portion for strengthening restriction of the movement of the block member 50 may be provided on the film 10, i.e., the insert member. For example, as shown in FIG. 12 , the film 10 may be configured to have a protrusion 17 as a restricting portion. The protrusion 17 can restrict movement of the block member 50 in the in-plane direction of the one main surface 10 a. The protrusion 17 is formed, for example, by the same method as the method for forming the electrode terminal 15. It is preferable that multiple protrusions 17 are provided around the electrode terminal 15. Here, the protrusion 17 is shown as the restricting portion, but the restricting portion is not limited to the protrusion 17. For example, an opening may be provided in the film substrate 11 so that a portion of the block member 50 fits into the opening of the film substrate 11.

[0023] (4-3) Variation 1C In the first embodiment, the block member 50 placed on the film 10 is sandwiched between the planar first surface 91a and second surface 92a and elastically deformed. The first die 91 and the second die 92 do not have any portions that prevent the block member 50 from moving. For example, as shown in FIG. 13 , the first die 91 may be configured to have a recess 93 on the first surface 91a as a preventing portion. When the first die 91 and the second die 92 are clamped together, a portion of the block member 50 fits into the recess 93. The portion of the block member 50 fitting into the recess 93 prevents the block member 50 from moving in the in-plane direction of the first surface 91a. The preventing portion may be provided on at least one of the first die 91 and the second die 92. (4-4) Variation 1D In the first embodiment, the electrode terminal 15 is disposed in a flat portion (flat portion 20a (see FIG. 2)) of the resin molded body 20. However, the electrode terminal 15 may also be disposed in a curved portion of the resin molded body 20. In that case, as shown in FIG. 14, the electrode terminal 15 is set on the curved second surface 92a. In the case shown in FIG. 14, the electrode terminal 15 and its surroundings also have a curved shape, but when the mold is closed, the block member 50 deforms to fit the curved shape. Therefore, during injection molding, the block member 50 can sufficiently prevent the occurrence of gaps between the electrode terminal 15 and its surroundings that allow the molten resin MR to penetrate.

[0024] (4-5) Variation 1E In the first embodiment, the film 10 is described as having a single-layer film substrate 11 made of resin on which electrode terminals 15 and copper wiring 16 are formed. However, the film 10 may have a multilayer structure. As shown in FIGS. 15 and 16 , the film 10 may include an outer design layer 12 that decorates the outer surface of the resin molded product, an inner design layer 13 that decorates the inner surface of the resin molded product, and an overcoat layer 14 that protects the copper wiring 16. FIG. 16 shows a cross section of the film 10 taken along line II-II in FIG. 15 . The outer design layer 12 is provided, for example, to conceal the copper wiring 16 from view from the outside or to decorate the resin molded product 1. The inner design layer 13 is provided, for example, when the resin molded body 20 is transparent or translucent, to conceal the copper wiring 16 from view from the outside or to decorate the resin molded product 1. (4-6) Variation 1F In the first embodiment, the case where the copper wiring 16 is provided only on one main surface 10a of the film 10 has been described. However, in the film 10, at least one of the electrode terminals 15 and the copper wiring 16 may be provided on multiple surfaces. In the insert member, wiring may be provided on multiple surfaces of the insert member, or electrode terminals and wiring may be provided. FIG. 17 shows a case where the copper wiring 16 is provided on both the one main surface 10a and the other main surface 10b. The copper wiring 16 is arranged on the one main surface 10a and the other main surface 10b through an opening 11a formed in the film substrate 11. As in the first embodiment, a resin molded product 1 is manufactured by forming a resin molded body 20 on one main surface 10a of the film 10 shown in FIG. 17. Alternatively, a plurality of film substrates 11 may be stacked, and the electrode terminals 15 and copper wiring 16 may be provided on each of the plurality of film substrates 11 .

[0025] (4-7) Variation 1G In the first embodiment, the electrode terminals 15 have the same thickness. In the first embodiment, the electrode terminals 15 are deformed in a step shape from the portion in contact with the film substrate 11 to the portion in contact with the copper wiring 16 (see FIG. 5). In addition, in Modification 1D, an example has been described in which the electrode terminals 25 are deformed in a concave shape (see FIG. 14). However, the shape of the electrode terminals 15 is not limited to the above-mentioned shape. FIG. 18 shows an electrode terminal 15 having an L-shaped cross section. Fig. 19 shows an electrode terminal 15 having a step-shaped cross section. Although Fig. 19 shows an electrode terminal 15 having a step shape that is one step higher, it may have a step shape with multiple steps. Fig. 20 shows an electrode terminal 15 having an inclined portion 15a. The electrode terminal 15 in Fig. 20 has only one inclined portion 15a. However, an electrode terminal 15 may have multiple inclined portions 15a. 21 shows an electrode terminal 15 having an arc-shaped surface. The surface of the electrode terminal 15 may be a curved surface other than an arc. FIG. 22 shows an electrode terminal 15 that is curved convexly toward the opposite side of the film substrate 11. The planar shape of the electrode terminals 15 in FIGS. 18, 19, 20, 21, and 22 may be any shape, for example, rectangular, square, oval, or circular. As shown in Figures 18, 19, 20, 21, and 22, even if the exposed surface of the electrode terminal 15 is not flat, the block member 50 is sufficiently deformed, so that it is possible to prevent gaps from occurring.

[0026] (4-8) Variation 1H In the first embodiment, a case where one block member 50 is applied to a plurality of electrode terminals 15 has been described. However, as will be described with reference to FIGS. 23, 24, 25, 26, and 27, one block member 50 may be applied to one electrode terminal 15. FIG. 23 shows three cases of the relationship between the rectangular parallelepiped electrode terminal 15 and the rectangular parallelepiped block member 50. FIG. 23 shows a plan view of the electrode terminal 15 and the block member 50, each of which has a rectangular planar shape. The first surface 91a and the second surface 92a of the first mold 91 and the second mold 92 are, for example, arranged parallel to the rectangular surfaces of the electrode terminal 15 and the block member 50 in FIG. 23. FIG. 23 shows the block member 50 placed on the film 10 before injection molding. In the first case, in a plan view, the block member 50 covers the entire electrode terminal 15. A cross section of the film 10 and the resin molded body 20 formed in the first case, taken along line III-III, is shown in Figure 24. The second case is a case in which, in a plan view, the block member 50 does not cover a part of the short side of the electrode terminal 15. A cross section taken along line VI-VI of the film 10 and the resin molded body 20 formed in the second case is shown in Figure 25. The third case is a case in which, in a plan view, the block member 50 does not cover a part of the short side and a part of the long side of the electrode terminal 15. A cross section taken along line VV of the film 10 and the resin molded body 20 formed in the third case is shown in Figure 26. FIG. 27 shows a cross section of the film 10 and the resin molded body 20 formed by the first, second, and third cases, taken along line VI-VI.

[0027] The wall surface 21a of the opening 21 of the resin molded body 20 formed by the block member 50 is curved in a concave shape. This is because when the block member 50 is elastically deformed by the first surface 91a and the second surface 92a, the portion away from the first surface 91a and the second surface 92a is largely deformed. Furthermore, of the four sides of the rectangle of the block member 50 in plan view, the side that does not overlap with the electrode terminal 15 and is farthest from the electrode terminal 15 is easily deformed by the pressure of the molten resin MR. The block member 50 in the portion overlapping with the electrode terminal 15 experiences higher internal pressure due to the thickness of the electrode terminal 15. In contrast, the block member 50 in the portion overlapping with the electrode terminal 15 experiences lower internal pressure because it does not overlap with the electrode terminal 15. Thus, the side farther from the electrode terminal 15 is more likely to deform. To avoid this situation, for example, it is possible to change the thickness of the block member 50 so that the crushing distance is the same. To take such a measure, the block member 50 may be shaped so that the portion overlapping with the electrode terminal 15 is thin and the portion not overlapping with the electrode terminal 15 is thick when the first mold 91 and the second mold 92 are not clamped together. Since the first surface 91a and the second surface 92a are not limited to being flat, nor are they limited to being arranged parallel to each other, the shape of the block member 50 is not limited to being a rectangular parallelepiped, and it is preferable to select a shape from various shapes in accordance with the shape and arrangement of the first surface 91a and the second surface 92a.

[0028] (4-9) Variation 1I In the first embodiment, the case where the electrode terminals 15 are provided on the one main surface 10a and the block member 50 is placed on the one main surface 10a has been described. However, it is also possible to configure the film substrate 11 so that the electrode terminals 15 are also provided on the other main surface 10b and the block member 50 is also placed on the other main surface 10b. For example, the film substrate 11 is arranged upright in the vertical direction, and the block members 50 can be placed by attaching the block members 50 to the one main surface 10a side and the other main surface 10b side of the film substrate 11, respectively. (4-10) Variation 1J In the first embodiment, the case where the entire block member 50 is made of one type of polymer compound has been described. However, the block member 50 may be made of multiple types of polymer compounds. For example, the first portion 51 and the second portion 52 of the block member 50 may be made of the same silicone-based elastomer but with different Shore A hardnesses. Alternatively, the first portion 51 and the second portion 52 of the block member 50 may be made of a silicone-based elastomer and a fluorine-based elastomer. Furthermore, the block member 50 may use a material other than a polymer compound for portions other than the first portion 51 and the second portion 52. For example, a silicone-based elastomer may be used for the first portion 51 and the second portion 52, with a metal or ceramic plate sandwiched between the first portion 51 and the second portion 52. In this case, the block member 50 has a three-layer structure of silicone-based elastomer / metal or ceramic plate / silicone-based elastomer. When a material other than a polymer compound is used for the block member 50, it is preferable to configure the block member 50 so that 50% or more of the total volume is made up of the polymer compound. By having the polymer compound account for 50% or more of the total volume, the block member can be sufficiently elastically deformed.

[0029] Second Embodiment (5) Overview of resin molded products In the first embodiment, the case where the plurality of electrode terminals 15 are arranged on the same plane has been described. However, the plurality of electrode terminals may be arranged on different planes or on a curved surface. An example of the resin molded article 1 according to the second embodiment is shown in FIG. 28, and another example is shown in FIG. 28 shows a resin molded product 1 including a three-dimensional insert member 60 with a curved surface. The insert member 60 is a member in which a film substrate 11 is attached to a three-dimensional base member 62 made of, for example, a thermosetting resin, and copper wiring 16 and a plurality of electrode terminals 15 are formed on the film substrate 11. The plurality of electrode terminals 15 are arranged in a curved region 61 of the base member 62. The opening 21 of the resin molded product 20 is also formed in the curved region 61. In the second embodiment, the wall surface 21a of the opening 21 is also curved in a concave shape. A plurality of electrode terminals 15 are provided on one main surface 60a of the insert member 60. A resin molded body 20 is formed on one main surface 60a of the insert member 60. The block member 50 for forming the opening 21 has a shape similar to a rectangular parallelepiped. An abutting surface 53 that abuts against the curved region 61 of the block member 50 is a curved surface that matches the curved region 61. An opposing surface 54 that faces the abutting surface 53 is a curved surface that easily matches the surface of the resin molded body 20 when the mold is closed.

[0030] 29 shows a resin molded article 1 including a three-dimensional insert member 70 having at least two planar regions (a first planar region 71 and a second planar region 72). The insert member 70 is a member in which, for example, a film substrate 11 is attached to a three-dimensional base member 73 made of a thermosetting resin, and copper wiring 16 and a plurality of electrode terminals 15 are formed on the film substrate 11. The electrode terminals 15 are disposed in both the first planar region 71 and the second planar region 72 of the base member 73. The opening 21 of the resin molded article 20 is formed at the boundary between the first planar region 71 and the second planar region 72, spanning the two. In the second embodiment as well, the wall surface 21a of the opening 21 is curved in a concave shape. A plurality of electrode terminals 15 are provided on one main surface 70a of the insert member 70. A resin molded body 20 is formed on one main surface 70a of the insert member 70. The block member 50 for forming the opening 21 has a shape obtained by combining two rectangular parallelepipeds in a Λ shape. A first abutment surface 55 that abuts against the first flat area 71 of the block member 50 is a flat surface that coincides with the first flat area 71. A second abutment surface 56 that abuts against the second flat area 72 is a flat surface that coincides with the second flat area 72. A first opposing surface 57 and a second opposing surface 58 that face the first abutment surface 55 and the second abutment surface 56 are two flat surfaces that easily coincide with the surface of the resin molded body 20 when the mold is closed.

[0031] (6) Manufacturing method for resin molded products 28 and 29 of the second embodiment, the shape of the insert members 60, 70 is different from that of the film 10 of the first embodiment, and therefore the shape of the block member 50 is also different. However, the flow of the method for manufacturing the resin molded product 1 of the second embodiment is the same as the flow shown in the flowchart of FIG. 4. Therefore, the resin molded product 1 of the second embodiment can be manufactured by the same manufacturing method as that described in "(2) Method for manufacturing resin molded product" of the first embodiment.

[0032] (7) Variations (7-1) Variation 2A In the second embodiment, the resin molded product 1 in which the openings 21 are not filled with a sealing material has been described (see FIGS. 28 and 29). However, in the resin molded product 1 of the second embodiment, the openings 21 may also be filled with a sealing material, as in the resin molded product 1 of the first embodiment. Furthermore, in the second embodiment, when no sealing material is filled, the exposed electrode terminals 15 may be joined to connection pins 30, as described with reference to FIG. 11, and a connector 35 may be connected to the connection pins 30. (7-2) Variation 2B In the manufacturing method of the resin molded product 1 of the second embodiment, as described in Modification 1B of the first embodiment, the insert members 60, 70 can also be provided with a restricting portion that restricts the movement of the block member 50. The restricting portion provided on the insert members 60, 70 can be, for example, the protrusion 17 shown in FIG. 12 or an opening in the film substrate 11.

[0033] (7-3) Variation 2C In the manufacturing method of the resin molded product 1 of the second embodiment, as described in Modification 1C of the first embodiment, a restraining portion that restrains movement of the block member 50 can be provided in at least one of the first die 91 and the second die 92. The restraining portion provided in at least one of the first die 91 and the second die 92 can be, for example, the recess 93 shown in FIG. 13. The restraining portion can be provided in at least one of the first die 91 and the second die 92. (7-4) Variation 2D In the second embodiment, the case where the plurality of electrode terminals 15 are arranged on the curved surface region 61 of the insert member 60 or on different first and second flat surface regions 71 and 72 has been described. However, the regions on which the plurality of electrode terminals 15 are arranged are not limited to this, and for example, the plurality of electrode terminals 15 may be arranged on different curved surface regions, or on a curved surface region and a flat surface region. (7-5) Variation 2E In the second embodiment, a resin molded product 1 without a design layer has been described. However, the resin molded product 1 of the second embodiment may be provided with a design layer having a function similar to at least one of the outer design layer 12 and the inner design layer 13 of the first embodiment. Furthermore, the resin molded product 1 of the second embodiment may be provided with an overcoat layer having a function similar to the overcoat layer 14 of the first embodiment.

[0034] (7-6) Variation 2F In the second embodiment, the electrode terminals 15 and the copper wiring 16 are provided on one film substrate 11. However, a plurality of film substrates 11 may be stacked, and the electrode terminals 15 and the copper wiring 16 may be provided on each of the plurality of film substrates 11. (7-7) Variation 2G In the second embodiment, the electrode terminals 15 have the same thickness. However, the electrode terminals 15 in the second embodiment may have various shapes as described in the modified examples 1D and 1G of the first embodiment. (7-8) Variation 2H In the second embodiment, a case has been described in which one block member 50 is applied to a plurality of electrode terminals 15. However, a plurality of block members 50 may be applied to a plurality of electrode terminals 15 in the second embodiment.

[0035] (7-9) Variation 2I In the second embodiment, a case has been described in which a plurality of electrode terminals 15 are provided on one main surface 60a, 70a and the block member 50 is placed on one main surface 60a, 70a. However, a configuration may also be adopted in which a plurality of electrode terminals 15 are also provided on the other main surface and the block member 50 is also placed on the other main surface. (7-10) Variation 2J In the second embodiment, the case where the entire block member 50 is made of one type of polymer compound has been described. However, as described in Modification 1J of the first embodiment, the block member 50 may be made of multiple types of polymer compounds, and materials other than polymer compounds may be used for portions other than the first portion 51 and the second portion 52. When a material other than a polymer compound is used for the block member 50, it is preferable to configure the block member 50 so that the polymer compound accounts for 50% or more of the total volume.

[0036] (8) Features (8-1) The manufacturing method of the resin molded product 1 of the first and second embodiments includes a first step S1 of setting an insert member 60, 70 or a film 10 which is an insert member having one main surface 10a, 60a, 70a between a first mold 91 and a second mold 92; a second step S2 of clamping the first mold 91 and the second mold 92 to form a molding space SP which contains the insert member 60, 70 or the film 10 which is an insert member; a third step S3 of pouring molten resin MR into the molding space SP to form a resin molded body 20 into which the insert member 60, 70 or the film 10 which is an insert member is inserted; and a fourth step S4 of opening the first mold 91 and the second mold 92 to remove the resin molded body 20 into which the insert member 60, 70 or the film 10 which is an insert member is inserted.

[0037] In the first step S1, the block member 50 is placed on the one main surface 10a, 60a, 70a so as to come into contact with the electrode terminals 15 used for electrical connection provided on the one main surface 10a, 60a, 70a. In the second step S2, the insert member 60, 70 or the film 10 which is the insert member and the block member 50 are sandwiched between the first surface 91a of the first mold 91 which is the first surface within the inner surface of the molding space SP and the second surface 92a of the second mold 92 which is the second surface within the inner surface, and the block member 50, in which an elastic polymer compound is arranged in the first portion 51 and the second portion 52 which are in contact with the first surface 91a and the second surface 92a, is elastically deformed. In the third step S3, the periphery of the block member 50 is filled with molten resin MR, and the resin around the block member 50 is solidified. In a fourth step S4, the block member 50 is removed from the resin molded body 20 to expose the electrode terminals 15. In the manufacturing methods of resin molded products according to the first and second embodiments or their modifications, even if there is a large amount of unevenness on and around the electrode terminals 15 of the insert members 60, 70 or the film 10 that is the insert member, or even if there is a large change in the position of the inserted electrode terminals 15, the block member 50 adheres closely to the electrode terminals 15 and their peripheries when the mold is closed in the second step S2. With the block member 50 adhered closely to the electrode terminals 15 and their peripheries, the periphery of the block member 50 can be filled with molten resin MR in the third step S3.

[0038] (8-2) In the manufacturing method of the resin molded product 1 according to the first and second embodiments or their modifications, the polymer compound has elasticity by containing, for example, a silicone-based elastomer or a fluorine-based elastomer, or by being processed into a sponge-like material. As a result, the block member 50 that easily adheres to the electrode terminal 15 and its surroundings and deforms appropriately can be used to manufacture the resin molded product 1. (8-3) In the manufacturing method of the resin molded product 1 of the first embodiment, the second embodiment, or their modified examples, the block member 50 is sandwiched between the first surface 91a and the second surface 92a, and the first distance between the surface of the first portion 51 and the surface of the second portion 52 before elastic deformation is within a range of 1.2 to 3 times the second distance between the surface of the first portion 51 and the surface of the second portion 52 after elastic deformation. As a result, the block member 50 can be sufficiently attached to the electrode terminal 15 and its periphery while preventing damage to the block member 50.

[0039] (8-4) In the manufacturing method of the resin molded product 1 according to the first and second embodiments or their modifications, the block member 50 has a hardness of Shore A20 or more and Shore A70 or less. As a result, the block member 50 with an appropriate hardness can be firmly adhered to the electrode terminal 15 and its surroundings. (8-5) In the method for manufacturing the resin molded product 1 according to the first and second embodiments or their modifications, the block member 50 has a configuration in which the polymer compound occupies 50% or more of the total volume. As a result, the block member 50, which easily adheres to the electrode terminal 15 and its surroundings and deforms appropriately, can be used to manufacture the resin molded product 1. (8-6) The resin molded product 1 according to the first and second embodiments or their modifications includes a resin molded body 20 molded into a predetermined shape, and a film 10 or an insert member 60, 70. The film 10 or an insert member 60, 70 is inserted into the resin molded body 20 and has an electrode terminal 15 used for electrical connection on one main surface 10a, 60a, 70a. The resin molded body 20 has an opening 21 that exposes a portion of the electrode terminal 15. The wall surface of the opening 21 is curved in a concave shape. In such a resin molded product 1, when the opening 21 is filled with a sealing material 40, the wall surface of the opening 21 is curved in a concave shape, and the sealing material 40 can be firmly fixed.

[0040] (8-7) In the resin molded product 1 of the first and second embodiments or their modified examples, the electrode terminal 15 can be made uneven or curved. This makes it possible to provide a high-quality resin molded product 1 in which the electrode terminal 15 has a shape suited to the application and no resin has entered the electrode terminal 15 or its surroundings.

[0041] (8-8) In the resin molded product 1 of the second embodiment or its modified example, the insert members 60, 70 have a plurality of electrode terminals 15, and the plurality of electrode terminals 15 are arranged in the curved surface region 61 of the insert member 60, or in the first flat surface region 71 and the second flat surface region 72 of the insert member 70. In this way, it is possible to provide a high-quality resin molded product 1 in which the plurality of electrode terminals 15 conforms to the shape of the insert members 60, 70, and no resin has entered the plurality of electrode terminals 15 or their surroundings. Although the first and second embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications are possible without departing from the spirit of the invention. In particular, the multiple embodiments and modifications described in this specification can be arbitrarily combined as necessary. [Explanation of symbols]

[0042] 1 Resin molded products 10 Film (example of insert material) 10a One main surface 15 Electrode terminal 20 Resin molding 21 Opening 40 Encapsulating material 50 Block member 51 Part 1 52 Part 2 60,70 Insert material 60a, 70a One main surface 61 Curved area 71 1st plane area 72 Second plane area 91 Type 1 91a 1st surface 92 Type 2 92a 2nd surface MR molten resin SP forming space

Claims

1. a first step of setting an insert member having one main surface between a first mold and a second mold; a second step of clamping the first mold and the second mold together to form a molding space containing the insert member; a third step of pouring molten resin into the molding space to mold a resin molded body into which the insert member is inserted; a fourth step of opening the first mold and the second mold to remove the resin molded body into which the insert member has been inserted; A method for manufacturing a resin molded product, comprising: In the first step, a block member is placed on the one main surface so as to come into contact with an electrode terminal provided on the one main surface and used for electrical connection; In the second step, the insert member and the block member are sandwiched between a first surface of the first mold, which is a first surface within the inner surface of the molding space, and a second surface of the second mold, which is a second surface within the inner surface, and the block member, which has an elastic polymer compound disposed in a first portion and a second portion contacting the first surface and the second surface, is elastically deformed; In the third step, the molten resin is filled around the block member and the resin around the block member is solidified; In the fourth step, the block member is removed from the resin molded product to expose the electrode terminals.

2. The polymer compound has elasticity by containing a silicone elastomer or a fluorine elastomer or by being processed into a sponge-like form. A method for producing the resin molded product according to claim 1.

3. a first distance between a surface of the first portion and a surface of the second portion before elastic deformation caused by sandwiching the block member between the first surface and the second surface is within a range of 1.2 to 3 times a second distance between the surface of the first portion and the surface of the second portion after elastic deformation; A method for producing the resin molded product according to claim 1 or 2.

4. The block member has a hardness of Shore A20 or more and Shore A70 or less. A method for producing the resin molded product according to claim 1 or 2.

5. The polymer compound occupies 50% or more of the total volume of the block member. A method for producing the resin molded product according to claim 1 or 2.

6. a resin molded body molded into a predetermined shape; an insert member that is inserted into the resin molded body and has an electrode terminal used for electrical connection on one main surface; Equipped with the resin molded body has a through hole through which a part of the electrode terminal arranged on one main surface is exposed from the other main surface, The through hole has a wall surface that is curved concavely so that the through hole has a diameter larger than the diameter at the surface of the resin molded article in a cross-sectional view.

7. The electrode terminal has an uneven or curved surface. The resin molded product according to claim 6.

8. the insert member has a plurality of the electrode terminals, The plurality of electrode terminals are arranged on a curved surface area of ​​the insert member, or on a first flat surface area and a second flat surface area of ​​the insert member. The resin molded product according to claim 6 or 7.

Images