Coil Device

Abstract

To facilitate assembling of a coil device which can be directly mounted onto a circuit board.SOLUTION: A reactor (a coil device) comprises: an element part having a core and a coil; a guide component 50 guiding an extension line of the coil; and a pedestal base arranged on a circuit board vertical to a Z direction, and determining a position of the element part and the guide component to the circuit board. The guide component comprises a columnar head part 51 extending in a Y direction vertical to the Z direction arranged on the core. In an outer peripheral part of the head part, a guide groove 55 extending in a circumferential direction of the head part and guiding the extension line, and each rotation guiding surface (53c, 53d, 53e, 51d, and 51e) extending in the circumferential direction of the head part, and being a curved surface guiding a rolling motion of the guide component on the core and a rotation slide are formed. The guide component comprises a pressing part 54 pressing the extension line from an opposite side from the guide groove so as to prevent the extension line from being deviated from the guide groove.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present invention relates to a coil device. [Background technology]

[0002] Patent Document 1 describes a coil component that can be mounted on a circuit board. The coil component described in Patent Document 1 includes a bobbin, and the bobbin has a groove formed therein for accommodating a lead wire of the coil. The bobbin also has a pin terminal embedded therein that is soldered to the circuit board, and the lead wire of the coil is connected to the pin terminal. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-34429 Summary of the Invention [Problem to be solved by the invention]

[0004] The coil component described in Patent Document 1 requires a step of connecting the coil's lead wire to a pin terminal, which requires a large number of assembly steps. Furthermore, when a conductor with a large cross-sectional area and high rigidity is used for the coil, it is difficult to manually bend the conductor to fit into a curved groove, and a jig or tool must be used to bend the conductor, further increasing the number of assembly steps.

[0005] The present invention has been made in view of the above circumstances, and an object of the present invention is to facilitate the assembly of a coil device that can be directly mounted on a circuit board. [Means for solving the problem]

[0006] A coil device according to one embodiment of the present invention comprises an element part having a core and a coil, a guide part that guides the coil's lead wire, and a base that is arranged on a circuit board perpendicular to the Z direction and positions the element part and the guide part relative to the circuit board, wherein the guide part has a columnar head that is arranged on the core and extends in the Y direction that is perpendicular to the Z direction, and the outer periphery of the head is formed with a guide groove that extends circumferentially around the head to guide the lead wire, and a rotation guide surface that is a curved surface that extends circumferentially around the head to guide the rolling or rotational sliding of the guide part on the core, and the guide part has a pressing part that presses the lead wire from the opposite side of the guide groove to prevent the lead wire from escaping from the guide groove.

[0007] In the above coil device, the guide part may have a base extending in the Z direction from one end in the X direction perpendicular to the Y and Z directions of the head toward the circuit board, the back surface of the base may be arranged facing the core, and the guide groove may extend over the entire length of the front surface of the base in the Z direction.

[0008] In the above coil device, a pair of side walls of the guide groove may each have an extension portion extending beyond the tip of the base, and the pair of extension portions may be connected via a clamping portion, with the base and the clamping portion arranged at a predetermined distance in the Z direction.

[0009] In the above coil device, the core may be configured to stand upright on the circuit board via a base, have a wall extending in the Y direction, the main body of the coil be located on the back side of the wall, the head of the guide part be located on top of the wall, the lead wire bent into a U shape along a guide groove formed in the head of the guide part, and the tip of the lead wire be located on the front side of the wall.

[0010] In the above coil device, the lower surface of the head and the back surface of the base may be planes perpendicular to each other, and the corner formed by the planes of the lower surface of the head and the base may accommodate the corner formed by the upper surface and outer surface of the wall portion of the core.

[0011] In the above coil device, the base may include a base positioning means for positioning the base relative to the circuit board, an element portion positioning means for positioning the element portion relative to the base, and a first fitting portion that fits with the guide component, and the guide component may include a second fitting portion that fits with the first fitting portion to position the guide component relative to the base.

[0012] In the above coil device, the second fitting portion may be a tip end portion of a guide component, and the first fitting portion may have a first fitting groove into which the tip end portion of the guide component is fitted.

[0013] In the coil device described above, the guide component may have a configuration in which both side surfaces of the tip end thereof are formed with slopes that gradually narrow toward the rear surface.

[0014] In the above coil device, a protrusion may be formed on the edge of the first fitting groove to prevent the second fitting portion from coming out of the first fitting groove.

[0015] In the above coil device, a second fitting groove into which the lead wire is fitted may be formed in the first fitting portion.

[0016] In the above coil device, the first fitting portion may have a pair of opposing protrusions protruding from both side surfaces of the first fitting groove, and the second fitting groove may be formed by the tip surfaces of the pair of protrusions and the bottom surface of the first fitting groove.

[0017] In the above coil device, The upper surface of the protrusion may be configured to come into contact with the tip of the guide component to position the guide component in the Z direction perpendicular to the circuit board.

[0018] In the above coil device, the base positioning means may include a recess that fits into the core and positions the element portion relative to the base.

[0019] In the coil device described above, an opening for passing the coil may be formed in the bottom of the base. [Effects of the Invention]

[0020] According to one embodiment of the present invention, it is possible to easily assemble a coil device that can be directly mounted on a circuit board. [Brief explanation of the drawings]

[0021] [Figure 1] 1 is an external view of a reactor according to an embodiment of the present invention; [Figure 2] 1 is an external view of a reactor according to an embodiment of the present invention; [Figure 3] FIG. 2 is an exploded view of the reactor according to the embodiment of the present invention. [Figure 4] FIG. 2 is an external view of a base according to an embodiment of the present invention. [Figure 5] FIG. 2 is an external view of a guide component according to an embodiment of the present invention. [Figure 6] FIG. 2 is an external view of a guide component according to an embodiment of the present invention. [Figure 7] FIG. 2 is a vertical cross-sectional view of a guide component according to an embodiment of the present invention. [Figure 8] 10A to 10C are diagrams illustrating a procedure for bending a lead wire using a guide part. DETAILED DESCRIPTION OF THE INVENTION

[0022] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the following description, identical or corresponding items will be assigned identical or corresponding reference numerals, and duplicate explanations will be omitted. In addition, when multiple items with the same reference numerals are displayed in each drawing, the reference numerals will be omitted for some of the multiple displays as appropriate.

[0023] 1 and 2 are external views of a reactor 1 (coil device) according to an embodiment of the present invention, and FIG.

[0024] In the following description, the direction from the upper right to the lower left in Fig. 1 is defined as the X direction, the direction from the upper left to the lower right as the Y direction, and the direction from the lower to the upper Z direction. The X and Y directions are horizontal directions that are perpendicular to each other, and the Z direction is a vertical direction. Note that reactor 1 may be used with any of the X, Y, and Z directions in Fig. 1 or any intermediate direction oriented vertically.

[0025] A reactor 1 according to an embodiment of the present invention described below is configured so as to be mountable on a dedicated circuit board (specifically, having an opening formed therein through which a spiral portion 11 of a coil 10, which will be described later, passes). The Z direction is the vertical direction of the circuit board.

[0026] As shown in FIG. 3, the reactor 1 includes an element portion 1a that performs an electrical function, and a socket 1b for attaching the element portion 1a to a circuit board.

[0027] The element portion 1a includes a coil 10 (winding), a core 20 (magnetic core), and insulating sheets 31 and 32 for ensuring insulation between the coil 10 and the core 20.

[0028] The coil 10 is formed by winding a conductor wire coated with an insulating film or insulating coating such as enamel in a spiral (helical shape). The conductor wire may be, for example, a rectangular wire or a round wire made of copper, aluminum, or the like. More specifically, the coil 10 of this embodiment is formed by edgewise winding a rectangular wire, but the cross-sectional shape and winding method of the conductor wire are not limited to this configuration.

[0029] The coil 10 has a spiral portion 11 (main body) in which a conducting wire is wound in a spiral shape, and a pair of lead wires 12 extending from both ends of the spiral portion 11.

[0030] The core 20 is an eight-shaped powder magnetic core formed by combining a substantially rectangular cylindrical O-shaped core 21 (frame-shaped magnetic core) and an elongated cylindrical I-shaped core 22 (bar-shaped magnetic core). As shown in Fig. 1, the O-shaped core 21 is formed by connecting a pair of linear portions extending in the X direction that form the outer legs 20b of the core 20 and a pair of linear portions extending in the Y direction that form the yoke 20c of the core 20 in a frame shape.

[0031] The I-shaped core 22 is disposed between the pair of outer legs 20b with its length oriented in the X direction, and serves as the center leg of the core 20. The I-shaped core 22 is passed through the hollow portion of the coil 10 and is housed together with the coil 10 in the hollow portion of the O-shaped core 21.

[0032] The inner peripheral surface of the O-core 21 is covered with an insulating sheet 31, ensuring insulation between the O-core 21 and the coil 10. The outer peripheral surface of the I-core 22 is covered with an insulating sheet 32, ensuring insulation between the I-core 22 and the coil 10.

[0033] The O-shaped core 21 of this embodiment is formed by stacking and joining two substantially rectangular cylindrical O-shaped core units 211 concentrically (i.e., so that their center lines coincide). The two O-shaped core units 211 are joined by, for example, welding, brazing, or adhesive. The O-shaped core 21 may be composed of a single O-shaped core unit 211, or may be composed of three or more O-shaped core units 211. The performance (e.g., inductance value, etc.) of the reactor 1 can be adjusted by changing the number of O-shaped core units 211 constituting the O-shaped core 21. By systematizing the O-shaped core 21 as a unit, it becomes possible to manufacture reactors 1 with various performances from O-shaped core units 211 of a single size, thereby reducing manufacturing costs by standardizing parts.

[0034] The socket 1b includes a base 40 that positions the element portion 1a (directly, the core 20) on the circuit board, and a guide part 50 that guides the lead wire 12 of the coil 10. The base 40 and the guide part 50 are made of an electrically insulating material such as phenol resin, epoxy resin, unsaturated polyester resin, urethane resin, BMC (Bulk Molding Compound), PPS (Polyphenylene Sulfide), or PBT (Polybutylene Terephthalate).

[0035] 2, cylindrical feet 411 are formed at each of the four corners of the bottom surface of base 40. Providing feet 411 makes it possible to place base 40 parallel and stably on the upper surface of a circuit board.

[0036] Two positioning pins 42 (base positioning means) are vertically embedded in the bottom surface of base 40. The two positioning pins 42 are provided at positions diagonally apart on one side of the bottom surface of base 40. When reactor 1 is attached to the circuit board, the positioning pins 42 are fitted into positioning holes provided in the circuit board and soldered thereto. This positions and fixes reactor 1 relative to the circuit board in the X-axis and Y-axis directions.

[0037] The positioning pins 42 are formed from a metal wire such as a steel wire, and are subjected to a surface treatment such as tin plating so that they can be soldered to a circuit board. The positioning pins 42 are embedded in the bottom surface of the base 40 by press-fitting or insert molding.

[0038] 4 is a perspective view of the base 40. A rectangular recess 44 (element portion positioning means) that accommodates the bottom of the core 20 is formed on the top surface of the base 40. The recess 44 is formed to a size that allows the bottom of the core 20 to fit therein with almost no gap. Therefore, by fitting the bottom of the core 20 into the recess 44, the element portion 1a is positioned relative to the base 40 in the X, Y, and Z directions.

[0039] An opening 43 is formed in the center of the bottom of the recess 44, through which the spiral portion 11 of the coil 10 passes. An opening of the same size as the opening 43 is also formed in the circuit board to which the base 40 is attached, at a position corresponding to the opening 43. A cooling plate is also disposed on the back side of the circuit board. When the reactor 1 is attached to the circuit board, the lower part of the spiral portion 11 passes through the opening 43 of the base 40 and the opening in the circuit board, and comes into contact with the cooling plate. This allows heat generated by the reactor 1 during use to be released to the cooling plate, maintaining the reactor 1 at an appropriate temperature and stabilizing the performance of the reactor 1.

[0040] The base 40 has fitting portions 40f (first fitting portions) formed at two locations spaced apart in the other diagonal direction (i.e., the diagonal direction where the positioning pin 42 is not provided) on the bottom surface of the base 40. The fitting portions 40f fit with a fitting portion 50f (described later) formed at the tip of the guide component 50 and the lead wire 12, and position the guide component 50 and the lead wire 12 relative to the base 40.

[0041] The fitting portion 40f has a protruding portion 45 that protrudes upward from the upper surface of the base 40. The front surface of the protruding portion 45 (the surface opposite to the core 20) has a square groove 46 (first fitting groove) that extends vertically. The rectangular groove 46 accommodates the fitting portion 50f of the guide part 50. Pawls 49, which are small linear protrusions extending along the edge of the rectangular groove 46, are formed at the bottom of a pair of side surfaces 46a of the rectangular groove 46. The distance between the pair of pawls 49 is narrower than the width of the fitting portion 50f of the guide part 50, so the pair of pawls 49 prevent the fitting portion 50f from escaping from the rectangular groove 46. Instead of the linear pawls 49 of this embodiment, a single point-like protrusion or multiple point-like protrusions aligned along the edge of the rectangular groove 46 may be provided.

[0042] The square groove 46 is formed to a size that allows the fitting portion 50f of the guide component 50 to fit therein with almost no gap. Therefore, when the fitting portion 50f is fitted into the square groove 46, the guide component 50 is positioned relative to the base 40 in the X-axis and Y directions.

[0043] The rectangular groove 46 extends to the lower end of the base 40. A pair of plate-shaped protrusions 47 protruding perpendicularly from both side surfaces 46a are formed at the bottom of the rectangular groove 46. Tip surfaces 47a of the pair of protrusions 47 and a bottom surface 46b of the rectangular groove 46 form a rectangular groove 48 (a second fitting groove).

[0044] The width of the square groove 48 is formed to be large enough to fit the lead wire 12 with almost no gap. When the fitting portion 50f of the guide part 50 and the fitting portion 40f of the base 40 are fitted together, the lead wire 12 is pressed against the bottom of the square groove 48 by a pressing portion 54 of the guide part 50, which will be described later. Therefore, the lead wire 12 is positioned in the X and Y directions with respect to the base 40 at a portion near its tip.

[0045] 5 and 6 are external views of the guide component 50, and Fig. 7 is a cross-sectional view of the guide component 50 cut along a plane perpendicular to the Y direction. In the following description of the guide component 50, the surface facing the positive X direction in Figs. 5-7 is referred to as the front surface of the guide component 50, and the surface facing the negative X direction is referred to as the back surface of the guide component 50.

[0046] The guide component 50 includes a columnar head 51 extending in the Y direction, a flat base 52 extending downward from the front end of the head 51 (one end in the X direction), and a pair of parallel side walls 53 extending upright from both ends of the head 51 and base 52 in the width direction (Y direction). The side walls 53 are formed from the front of the base 52 to the upper surface of the head 51. The head 51 and base 52 are respectively interposed between the lead wire 12 and the core 20 to ensure insulation therebetween. The head 51, base 52, and the pair of side walls 53 form a rectangular groove 55 (guide groove) extending in the Z direction. The side walls 53 extend beyond the tip of the base 52. The portion of the side walls 53 extending beyond the tip of the base 52 is called an extension portion 531. A flat pressing portion 54 connecting the pair of extension portions 531 is formed at the bottom of the guide component 50.

[0047] The base 52 and the pressing portion 54 are each formed perpendicular to the X direction, and are spaced apart in the X direction by a distance equal to or slightly longer than the thickness t of the lead wire 12 of the coil 10.

[0048] At the tip end 532 of the extension portion 531 of the side wall 53, the rear end surface 532a of the side wall 53 is retracted toward the front side, forming a step 533. In addition, slopes 532b are formed on both side surfaces of the tip end 532 of the extension portion 531 so that the width of the guide component 50 (the distance between both ends in the Y direction) gradually narrows toward the rear surface. Note that the pressing portion 54 connects the pair of side walls 53 at the tip end 532 of the extension portion 531. The tip end portions 532 of the pair of side walls 53 and the pressing portion 54 form a fitting portion 50f (second fitting portion) of the guide component 50.

[0049] When the fitting portion 50f of the guide component 50 fits into the fitting portion 40f of the base 40, the lower portion of the guide component 50 (i.e., the tip portions 532 and the pressing portions 54 of the pair of side walls 53 that constitute the fitting portion 50f) is accommodated in the square groove 46 of the fitting portion 40f of the base 40. By providing a step 533 at the tip portions 532 of the side walls 53, interference between the back plate 451 of the protruding portion 45 of the base 40 and the guide component 50 is avoided.

[0050] As shown in FIG. 7, the outer peripheral surface of the head 51 of the guide component 50 has a straight portion 51a, a curved portion 51b, a straight portion 51c, a curved portion 51d, and a straight portion 51e. The straight portions 51a, 51c, and 51e are flat, and the curved portions 51b and 51d are cylindrical. The straight portion 51a, the curved portion 51b, the straight portion 51c, the curved portion 51d, and the straight portion 51e are smoothly connected in this order (i.e., so that the curvature is continuous). The straight portion 51e is the underside 51e of the head 51. The underside 51e of the head 51 is perpendicularly connected to the backside 52b of the base 52, and a corner portion 50c (FIG. 8(c)) is formed by the underside 51e of the head 51 and the backside 52b of the base 52. The corner portion 50c accommodates a corner portion 20d formed by the upper surface and outer surface of the yoke 20c (wall portion) of the core 20.

[0051] The end surface of the side wall 53 of the guide component 50 has a straight portion 53a, a curved portion 53b, a straight portion 53c, a curved portion 53d, and a straight portion 53e formed on the outer periphery of the head 51. The straight portions 53a, 53c, and 53e are flat, and the curved portions 53b and 53d are cylindrical surfaces. The straight portion 53a, the curved portion 53b, the straight portion 53c, the curved portion 53d, and the straight portion 53e are smoothly connected in this order. As shown in FIG. 7 , when projected onto a plane perpendicular to the Y direction, the curved portion 51d of the head 51 is smoothly connected to the curved portion 53d of the side wall 53. Therefore, while the head 51 (or the side wall 53 formed on the outer periphery of the head 51) is pressed against the upper surface of the core 20, the guide component 50 can be smoothly rotated and slid around an axis (Y axis) that passes through the head 51 and is parallel to the Y direction.

[0052] 8(a)-(c) are diagrams illustrating the procedure for attaching the guide part 50. As shown in Fig. 8, after the element part 1a is assembled, the lead wire 12 of the coil 10 extends straight upward from the end of the spiral part 11.

[0053] 7 is directed downward, and the tip of the lead wire 12 is fitted into the straight portion 55a of the groove 55. When the guide part 50 is lowered with the lead wire 12 fitted into the groove 55, the lead wire 12 is passed between the base 52 and the pressing part 54. The guide part 50 is further lowered, and the straight portion 53a of the head 51 of the guide part 50 abuts against the upper surface of the core 20.

[0054] Next, as shown in Figures 8(b)-(c), when the head 51 (or the side wall 53 formed on the outer periphery of the head 51) of the guide part 50 is brought into contact with the upper surface of the core 20 and the guide part 50 is rotated around the Y axis centered on the head 51, the holding part 54 presses the lead wire 12 in the rotation direction of the guide part 50 (i.e., in the circumferential direction of a circle centered on the rotation axis), causing the lead wire 12 to rotate together with the guide part 50.

[0055] 8(a) to 8(c), the guide part 50 rotates 180° with the head part 51 in contact with the upper surface of the core 20. At this time, the lead wire 12 is bent into a U-shape along the outer peripheral surface of the head part 51 of the guide part 50 (the straight portion 51a, the curved portion 51b, the straight portion 51c, and the curved portion 51d).

[0056] As the guide component 50 rotates, the surface that comes into contact with the upper surface of the core 20 switches sequentially from the straight portion 53c of the side wall 53 to the curved portion 53d, the straight portion 53e, the curved portion 51d of the head portion 51, and the straight portion 51e, as shown in Fig. 7. The straight portion 53c, the curved portion 53d, the straight portion 53e, the curved portion 51d, and the straight portion 51e are smoothly connected when projected onto a plane perpendicular to the Y direction, allowing the guide component 50 to rotate (roll or rotationally slide) smoothly on the core 20. That is, the straight portion 53c, the curved portion 53d, the straight portion 53e, the curved portion 51d, and the straight portion 51e form a rotation guide surface, which is a curved surface that guides the rotation of the guide component 50.

[0057] The fitting portion 50f of the guide component 50 is fitted into the fitting portion 40f of the base 40 (FIG. 4) from the front (i.e., from the X direction). At this time, the fitting portion 50f of the guide component 50 is guided into the square groove 46 of the fitting portion 40f of the base 40 by a pair of sloped surfaces 532b. When the fitting portion 50f of the guide component 50 is completely accommodated in the square groove 46 of the base 40, a pair of claws 49 formed on the fitting portion 40f of the base 40 (specifically, on the edge of the square groove 46) prevents the fitting portion 50f from escaping from the square groove 46. The tip end of the lead wire 12 protruding from the lower end of the guide component 50 is guided into the square groove 48 by a pair of guide sloped surfaces 47b formed on the fitting portion 40f of the base 40.

[0058] When the mating portion 50f of the guide part 50 is mated with the mating portion 40f of the base 40, the guide part 50 is positioned so that the back surface 52b of the base 52 contacts (or faces closely to) the side surface of the core 20 and the underside 51e of the head 51 contacts (or faces closely to) the side surface of the core 20.

[0059] When the mating portion 50f of the guide part 50 is mated with the mating portion 40f of the base 40, the tip of the lead wire 12 held by the guide part 50 is positioned relative to the base 40 in the X-axis and Y directions and is fixed to the base 40.

[0060] In the Z direction, which is the extension direction of the lead wire 12 held by the guide part 50, the base 52 and the pressing part 54 of the guide part 50 are disposed with a predetermined distance d between them. The distance between the base 52 and the pressing part 54 in the X direction is approximately the same as the thickness of the lead wire 12. Therefore, for example, if the base 52 and the pressing part 54 are disposed without a distance in the Z direction (or so that they partially overlap), the gap between the base 52 and the pressing part 54 when passing the lead wire 12 becomes small, making it difficult to pass the lead wire 12. In this embodiment, the base 52 and the pressing part 54 are disposed with a predetermined distance d between them, making it easy to pass the lead wire 12 between them. Furthermore, because the space for passing the lead wire 12 is widened in the Z direction rather than in the X direction where positioning is performed, it is possible to easily pass the lead wire 12 without reducing positioning accuracy.

[0061] 2, the tip of the lead wire 12 protrudes from the lower surface of the base 40. When the reactor 1 is mounted on a circuit board, the tip of the lead wire 12 is inserted into a through-hole formed at a corresponding position on the circuit board and soldered thereto.

[0062] A countersunk portion 412 is formed on the underside of the base 40 around the tip of the lead wire 12. In this embodiment, the countersunk portion 412 is formed from the lower end of the square groove 46 and the underside of the pair of protrusions 47. By providing the countersunk portion 412, the distance between the position where the lead wire 12 is fixed on the circuit board and the position where the lead wire 12 is fixed on the base 40 is increased, thereby mitigating the force applied to the lead wire 12 due to misalignment between the through hole and the fitting portion 40f.

[0063] The reactor 1 of this embodiment includes the guide part 50, which makes it easy to bend the lead wire 12. Furthermore, by routing the lead wire 12 using the guide part 50, the lead wire 12 is bent while being pulled outward in the X direction indicated by the arrow P in FIG. 8(c), which allows a gap to be provided between the spiral portion 11 of the coil 10 and the lead wire 12. This makes it possible to prevent poor insulation caused by the lead wire 12 rubbing against the spiral portion 11.

[0064] Furthermore, by interposing a base 52 of a predetermined thickness between the folded-back lead wire 12 and the core 20, the distance by which the lead wire 12 is pulled in the direction of arrow P ( FIG. 8(c) ) when the lead wire 12 is folded back is extended by the thickness of the base 52. This allows the lead wire 12 to be fixed in a taut state, making it possible to more reliably provide a gap between the spiral portion 11 of the coil 10 and the lead wire 12.

[0065] Although the above is a description of the embodiments of the present invention, the present invention is not limited to the configurations of the above embodiments and various modifications are possible. For example, the scope of the present invention also includes an appropriate combination of at least a part of the technical configurations of one or more embodiments described in the specification with a known technical configuration.

[0066] In the above embodiment, the groove 55 of the guide component 50 is a square groove, but the present invention is not limited to this configuration, and the cross-sectional shape of the groove 55 is determined according to the cross-sectional shape of the lead wire 12 to be accommodated. For example, when a round wire is used as the lead wire 12, the groove 55 is formed to have an arc-shaped or U-shaped cross-sectional shape.

[0067] In the above embodiment, the rotation guide surfaces are provided on both sides of the groove 55, but the rotation guide surface may be provided on only one side of the groove 55.

[0068] In the above embodiment, insulating sheets 31 and 32 are used to ensure insulation between coil 10 and core 20, but if coil 10 or core 20 is provided with a sufficient insulating coating, insulating sheets 31 and 32 do not need to be used.

[0069] Although the O-shaped core 21 in the above embodiment is composed of a plurality of O-shaped core units 211, the O-shaped core 21 may be composed of a single member. Also, the I-shaped core 22 may be composed of, for example, a plurality of I-shaped core units connected in the longitudinal direction.

[0070] The core 20 in the above embodiment is a combination of an O-shaped core 21 and an I-shaped core 22. However, other core shapes may also be used, such as an EI core, which is a combination of an E-shaped core and an I-shaped core, an EE core, which is a combination of two E-shaped cores, an EER core or a PQ core, which are modifications of the EE core, or a pot-shaped core (e.g., a PP-shaped core, an RM-shaped core, or an EP-shaped core). The O-shaped core 21 may also be formed by combining two U-shaped cores.

[0071] Although the core 20 in the above embodiment is a powder magnetic core, other types of cores (e.g., laminated steel plate, ferrite core, nanocrystal core, metal composite core formed from resin containing magnetic particles, etc.) may also be used.

[0072] The above embodiment is an example in which the present invention is applied to a reactor, but the present invention is not limited to reactors and can also be applied to other types of coil devices, such as transformers and choke coils. [Explanation of symbols]

[0073] 1 reactor 10 coils 20 cores 40 pedestal 50 Guide parts

Claims

1. an element portion including a core and a coil; a guide part for guiding a lead wire of the coil; a base that is disposed on a circuit board and positions the element portion and the guide component relative to the circuit board; Equipped with the guide component includes a columnar head portion disposed on the core and extending in a Y direction perpendicular to a Z direction that is a vertical direction of the circuit board, On the outer periphery of the head, a guide groove extending in a circumferential direction of the head portion for guiding the lead wire; a rotation guide surface that is a curved surface extending in the circumferential direction of the head and that guides the rolling or rotational sliding of the guide part on the core, the guide component includes a pressing portion that presses the lead wire from the opposite side of the guide groove so that the lead wire does not slip out of the guide groove, Coil device.

2. the guide component includes a base extending in the Z direction from one end of the head in the X direction perpendicular to the Y direction and the Z direction toward the circuit board, the base is disposed with its back surface facing the core, The guide groove extends over the entire length of the front surface of the base in the Z direction. The coil device according to claim 1 .

3. a pair of side walls of the guide groove each having an extension portion extending beyond a tip end of the base; The pair of extension portions are connected via the pressing portion, The base and the pressing portion are disposed at a predetermined interval in the Z direction. The coil device according to claim 2 .

4. the core stands upright on the circuit board via the base and has a wall portion extending in the Y direction; The main body of the coil is disposed on the rear side of the wall, The head of the guide part is disposed on the wall part, The lead wire is bent into a U-shape along the guide groove formed in the head of the guide component, and a tip end of the lead wire is disposed on the front side of the wall portion. The coil device according to claim 2 .

5. The lower surface of the head and the rear surface of the base are planes perpendicular to each other, a corner formed by the lower surface of the head and the flat surface of the base, the corner formed by the upper surface and outer surface of the wall portion of the core being accommodated; The coil device according to claim 4 .

6. The base is a base positioning means for positioning the base relative to the circuit board; an element portion positioning means for positioning the element portion with respect to the base; a first fitting portion that fits with the guide component, The guide component is a second fitting portion that fits with the first fitting portion to position the guide component relative to the base; The coil device according to any one of claims 1 to 5.

7. the second fitting portion is a tip end portion of the guide component, the first fitting portion has a first fitting groove into which the tip end portion of the guide component is fitted; The coil device according to claim 6 .

8. The guide member has slopes on both sides of the tip thereof that gradually narrow toward the rear surface. The coil device according to claim 7 .

9. a protrusion is formed on an edge of the first fitting groove to prevent the second fitting portion from escaping from the first fitting groove; The coil device according to claim 7 .

10. a second fitting groove into which the lead wire is fitted is formed in the first fitting portion; The coil device according to claim 7 .

11. The first fitting portion is a pair of opposing protrusions protruding from both side surfaces of the first fitting groove; The second fitting groove is formed by the tip surfaces of the pair of protrusions and the bottom surface of the first fitting groove. The coil device according to claim 10.

12. An upper surface of the protrusion contacts a tip of the guide component to position the guide component in the Z direction. The coil device according to claim 11.

13. The base positioning means a recess that fits into the core and positions the element portion relative to the base; The coil device according to claim 6 .

14. An opening through which the main body of the coil passes is formed at the bottom of the base. The coil device according to any one of claims 1 to 13.

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