Vibration devices and equipment

Abstract

To provide a vibration device that improves reliability and sound pressure characteristics, and a device including the same.SOLUTION: A vibration device includes a vibration generator 10 including a piezoelectric material in a vibration structure 11, and a sensor unit 30 configured as the vibration generator, and is capable of correcting or compensating for changes in the electrical characteristics of the vibration generator, and capable of correcting or compensating for the vibration characteristics of the vibration generator.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present specification relates to vibration devices and apparatus. [Background technology]

[0002] The vibration device can vibrate and output sound using a coil type including a magnet and a coil, or a piezoelectric type using a piezoelectric element.

[0003] Piezoelectric vibration devices have the disadvantage of being easily damaged by external impact due to the brittleness of the piezoelectric element, resulting in low reliability of sound reproduction. Additionally, piezoelectric vibration devices have the disadvantage of lower acoustic characteristics and / or sound pressure characteristics in the low frequency range compared to coil-type devices due to the low piezoelectric constant of the piezoelectric element.

[0004] The inventors have found that the piezoelectric properties or vibration properties of the piezoelectric material of the piezoelectric element change depending on the temperature. Furthermore, the inventors have found that the vibration properties and / or driving properties of the piezoelectric material of the piezoelectric element can be changed depending on variables in the surrounding environment, such as temperature and / or humidity, which can result in a problem of low reliability in sound reproduction. Summary of the Invention [Problem to be solved by the invention]

[0005] Therefore, the inventors of the present specification have recognized the above problems and conducted several experiments to realize a vibration device using a piezoelectric material with improved reliability in sound reproduction, and further conducted several experiments to realize a vibration device that can improve acoustic characteristics and / or sound pressure characteristics in the low frequency range. Through several experiments, the inventors of the present specification have invented a new vibration device that can improve the reliability of sound reproduction and a device including the same, and have invented a new vibration device that can improve acoustic characteristics and / or sound pressure characteristics in the low frequency range and a device including the same.

[0006] An object of the present invention is to provide a vibration device having improved reliability of a vibration generator using a piezoelectric material, and a device including the vibration device.

[0007] The problem to be solved in one embodiment of the present specification is to provide a vibration device that can correct the electrical characteristics and / or vibration characteristics of a vibration generator that uses a piezoelectric material, and an apparatus including the same.

[0008] An object of the present invention is to provide a vibration device that can improve acoustic characteristics and / or sound pressure characteristics in the low frequency band, and a device including the vibration device.

[0009] An object of one embodiment of the present specification is to provide a vibration device capable of reproducing sound including sound of two or more channels, and a device including the vibration device.

[0010] The problems to be solved by the examples of this specification are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0011] A device according to an embodiment of the present disclosure may include a vibration generator including a piezoelectric material and a sensor unit configured on the vibration generator.

[0012] An apparatus according to one embodiment of the present specification may include a vibration generating device having a vibration member and one or more vibration elements configured to vibrate the vibration member, wherein the one or more vibration elements may include a vibration generator including a piezoelectric material and a sensor unit configured on the vibration generator.

[0013] Specific details relating to various examples of this specification other than the means for solving the problems mentioned above are included in the following description and drawings. [Effects of the Invention]

[0014] According to an embodiment of the present specification, it is possible to provide a vibration device in which the reliability of a vibration generator using a piezoelectric material is improved, and an apparatus including the vibration device.

[0015] According to an embodiment of the present specification, it is possible to provide a vibration device capable of correcting the electrical characteristics and / or vibration characteristics of a vibration generator using a piezoelectric material, and an apparatus including the same.

[0016] According to an embodiment of the present specification, it is possible to provide a vibration device having improved acoustic characteristics and / or sound pressure characteristics in the low frequency band, and a device including the same.

[0017] The problem to be solved by one embodiment of the present specification is to provide a vibration device capable of reproducing sound including sound of two or more channels, and a device including the same.

[0018] The above-mentioned problems to be solved, means for solving the problems, and effects do not specify essential features of the claims, and the scope of the claims is not limited by the matters described in the contents of the invention. [Brief explanation of the drawings]

[0019] [Figure 1] 1 illustrates a vibration device according to one embodiment of the present disclosure. [Figure 2] 2 is a cross-sectional view taken along line AA' shown in FIG. [Figure 3A] FIG. 2 illustrates a sensor unit according to an embodiment of the present specification. [Figure 3B] FIG. 2 illustrates a sensor unit according to an embodiment of the present specification. [Figure 4] 2 is another cross-sectional view taken along the line AA' shown in FIG. 1. FIG. [Figure 5] 2 is another cross-sectional view taken along the line AA' shown in FIG. 1. FIG. [Figure 6] 2 is another cross-sectional view taken along the line AA' shown in FIG. 1. FIG. [Figure 7] 2 is another cross-sectional view taken along the line AA' shown in FIG. 1. FIG. [Figure 8]10A and 10B show vibration devices according to other embodiments of the present specification. [Figure 9] 10A and 10B show vibration devices according to other embodiments of the present specification. [Figure 10] 10 is a cross-sectional view taken along line BB' shown in FIG. 9. [Figure 11] 10A and 10B show vibration devices according to other embodiments of the present specification. [Figure 12] 12 is a cross-sectional view taken along line CC' shown in FIG. 11. [Figure 13] 12 is another cross-sectional view taken along the line CC' shown in FIG. 11. FIG. [Figure 14] 10A and 10B show vibration devices according to other embodiments of the present specification. [Figure 15] FIG. 15 is a cross-sectional view taken along line DD' shown in FIG. [Figure 16] FIG. 16 is a perspective view showing a vibrating part of the vibrating structure shown in FIG. [Figure 17A] FIG. 10 is a perspective view showing a vibrating part of a vibrating structure according to another embodiment of the present specification. [Figure 17B] FIG. 10 is a perspective view showing a vibrating part of a vibrating structure according to another embodiment of the present specification. [Figure 17C] FIG. 10 is a perspective view showing a vibrating part of a vibrating structure according to another embodiment of the present specification. [Figure 17D] FIG. 10 is a perspective view showing a vibrating part of a vibrating structure according to another embodiment of the present specification. [Figure 18] 10A and 10B illustrate a vibration generator according to another embodiment of the present specification. [Figure 19] FIG. 19 is a cross-sectional view taken along line EE' shown in FIG. [Figure 20] 10A and 10B show vibration devices according to other embodiments of the present specification. [Figure 21] FIG. 2 is a block diagram showing a vibration drive circuit of a vibration device according to an embodiment of the present specification. [Figure 22] 1 is a flowchart illustrating a method for driving a vibration device according to an embodiment of the present specification. [Figure 23] 10 is a flowchart illustrating a method for driving a vibration device according to another embodiment of the present specification. [Figure 24] 1 illustrates an apparatus according to one embodiment of the present disclosure. [Figure 25] FIG. 25 is a plan view of the device shown in FIG. 24. [Figure 26] FIG. 10 shows an apparatus according to another embodiment of the present disclosure. [Figure 27] FIG. 27 is a cross-sectional view taken along line FF' shown in FIG. 26. [Figure 28] FIG. 28 is a plan view of the device shown in FIG. 27. [Figure 29] 27 is another cross-sectional view taken along the line FF' shown in FIG. 26. FIG. [Figure 30] FIG. 30 is a plan view of the device shown in FIG. 29. [Figure 31] 27 is another cross-sectional view taken along the line FF' shown in FIG. 26. FIG. [Figure 32] FIG. 32 is a plan view of the device shown in FIG. 31. [Figure 33] 27 is another cross-sectional view taken along the line FF' shown in FIG. 26. FIG. [Figure 34] FIG. 34 is a plan view of the device shown in FIG. 33. [Figure 35] 27 is another cross-sectional view taken along the line FF' shown in FIG. 26. FIG. [Figure 36] FIG. 36 is a plan view of the device shown in FIG. 35. [Figure 37] 27 is another cross-sectional view taken along the line FF' shown in FIG. 26. FIG. [Figure 38] FIG. 38 is a plan view of the device shown in FIG. 37. [Figure 39] 27 is another cross-sectional view taken along the line FF' shown in FIG. 26. FIG. [Figure 40] FIG. 40 is a plan view of the device shown in FIG. 39. [Figure 41] 27 is another cross-sectional view taken along the line FF' shown in FIG. 26. FIG. [Figure 42] FIG. 42 is a plan view of the device shown in FIG. 41. [Figure 43A] FIG. 10 is a diagram showing vibration strength of a device according to an experimental example. [Figure 43B] FIG. 10 illustrates vibration strength of a device according to an embodiment of the present specification. DETAILED DESCRIPTION OF THE INVENTION

[0020] The advantages and features of the present specification, and methods for achieving them, will become clearer with reference to the following detailed description of an embodiment accompanied by the accompanying drawings. However, the present specification is not limited to the embodiment disclosed below, and may be realized in various different forms. The embodiment is provided merely to complete the disclosure of the specification and to fully convey the scope of the invention to those skilled in the art to which the specification pertains. The specification is defined only by the scope of the claims.

[0021] In order to explain the embodiments of the present specification, the shapes, sizes, ratios, angles, numbers, etc. shown in the drawings are merely examples and the present specification is not limited to the details shown in the drawings. The same reference numerals refer to the same elements throughout the specification. Furthermore, in describing the present specification, if a detailed description of related prior art is deemed to unnecessarily obscure the gist of the present invention, such detailed description may be omitted. When terms such as "comprise," "have," and "consist of" are used in the present specification, other parts may be added unless "only" is used. When a component is expressed in the singular, the plural may also be included unless otherwise explicitly stated.

[0022] When interpreting elements, a margin of error should be included even if there is no explicit statement otherwise. When describing a positional relationship, for example, when the positional relationship of two parts is described using terms such as "above," "on top," "below," or "beside," one or more other parts may be located between the two parts unless "immediately" or "directly" is used. When describing a temporal relationship, for example, when the temporal relationship is described using terms such as "after," "following," "next," or "before," non-consecutive cases may also be included unless "immediately" or "directly" is used.

[0023] Although terms such as "first" and "second" are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another. Therefore, a first component referred to below may also be a second component within the technical spirit of the present invention. When describing components in this specification, terms such as "first," "second," A, B, (a), and (b) may be used. These terms are used to distinguish the component from other components and do not limit the nature, order, sequence, or number of the components. When a component is described as being "connected," "coupled," or "connected" to another component, it should be understood that the component may be directly connected or connected to the other component, but that other components may also be "intervened" between each component that is indirectly connected or connected unless otherwise explicitly stated.

[0024] The term "at least one" should be understood to include all possible combinations of one or more associated items. For example, "at least one of the first, second, and third items" may mean not only the first, second, or third item, but also all possible combinations of the first, second, and third items that can be present in two or more of the first, second, and third items.

[0025] The features of the various embodiments of this specification may be partially or fully combined or combined with each other, and various technical interlocking and driving mechanisms may be possible, and each embodiment may be implemented independently of the other, or may be implemented together in a related relationship.

[0026] The following detailed description of the present invention will be given with reference to the accompanying drawings and examples. The scales of the components shown in the drawings may differ from the actual scales for the sake of convenience, and are not limited to the scales shown in the drawings.

[0027] Fig. 1 is a diagram showing a vibration device according to an embodiment of the present specification, and Fig. 2 is a cross-sectional view taken along line AA' shown in Fig. 1.

[0028] Referring to FIGS. 1 and 2, a vibration device according to an embodiment of the present specification may include a vibration generator 10 and a sensor unit 30.

[0029] The vibration generator 10 may include a piezoelectric material. For example, the vibration generator 10 may include a piezoelectric material (or piezoelectric element) having piezoelectric properties (or piezoelectric effect). For example, the vibration generator 10 may include an inner region (MA) and an outer region (EA) surrounded by the inner region (MA). For example, in the vibration generator 10, the inner region (MA) may be expressed as, but is not limited to, a first region, an inner region, a middle region, or a central region. The outer region (EA) may be expressed as, but is not limited to, a second region, a peripheral region, a frame region, an edge region, or an outer region. For example, the outer region (EA) of the vibration generator 10 may include multiple corner regions.

[0030] A vibration generator 10 according to an embodiment of the present disclosure may include a vibrating structure 11 , a first protective member 13 , and a second protective member 15 .

[0031] The vibrating structure 11 may be configured in the inner region (MA) of the vibration generator 10, but is not limited thereto. The vibrating structure 11 may include a piezoelectric material (or piezoelectric element) having piezoelectric properties (or piezoelectric effect). For example, a piezoelectric material may have the property that when pressure or torsion is applied to a crystal structure by an external force, a potential difference is generated by dielectric polarization due to a change in the relative positions of positive (+) and negative (-) ions, and vibration is generated by an electric field due to an inversely applied voltage. For example, the vibrating structure 11 may be expressed as, but is not limited to, a vibration generating structure, a sound generating structure, a vibration generating unit, a sound generating unit, a piezoelectric structure, or a displacement structure.

[0032] The vibrating structure 11 according to an embodiment of the present specification may include a vibrating portion 11a containing a piezoelectric material, a first electrode portion 11b arranged on a first surface of the vibrating portion 11a, and a second electrode portion 11c arranged on a second surface opposite to the first surface of the vibrating portion 11a or other than the first surface.

[0033] The vibrating unit 11a may include a piezoelectric material and may be expressed as, but is not limited to, a vibration layer, a piezoelectric layer, a piezoelectric material layer, a piezoelectric material portion, a piezoelectric vibration layer, a piezoelectric vibration portion, an electroactive layer, an electroactive portion, a displacement portion, a piezoelectric displacement layer, a piezoelectric displacement portion, a sound wave generating layer, a sound wave generating portion, an inorganic material layer, an inorganic material portion, a piezoelectric ceramic, or a piezoelectric ceramic layer.

[0034] The vibrating portion 11a may be made of a transparent, semi-transparent, or opaque piezoelectric material, and may therefore be transparent, semi-transparent, or opaque.

[0035] The vibrating unit 11a may be made of a ceramic material capable of achieving relatively high vibration, or may be made of a piezoelectric ceramic having a perovskite-based crystal structure. The perovskite crystal structure may have a plate-like structure with piezoelectric and inverse piezoelectric effects and orientation. The perovskite crystal structure may be represented by the chemical formula ABO3, where the A site is composed of a divalent metal element and the B site is composed of a tetravalent metal element. As an example of the present specification, in the chemical formula ABO3, the A site and the B site may be cations, and O may be an anion. For example, the chemical formula ABO3 may include at least one of PbTiO3, PbZrO3, BaTiO3, and SrTiO3, but is not limited thereto.

[0036] The vibrating portion 11a according to the embodiments of the present specification may include one or more of lead (Pb), zirconium (Zr), titanium (Ti), zinc (Zn), nickel (Ni), and niobium (Nb), but is not limited thereto.

[0037] The vibrating unit 11a according to other embodiments of the present specification may include, but is not limited to, a PZT (lead zirconate titanate)-based material including lead (Pb), zirconium (Zr), and titanium (Ti), or a PZNN (lead zirconate nickel niobate)-based material including lead (Pb), zirconium (Zr), nickel (Ni), and niobium (Nb). Alternatively, the vibrating unit 11a may include, but is not limited to, at least one of CaTiO3, BaTiO3, and SrTiO3, which do not include lead (Pb).

[0038] The vibrating section 11a according to an embodiment of the present specification may include a piezoelectric deformation coefficient (d33) along the thickness direction (Z). For example, the vibrating section 11a may include a piezoelectric deformation coefficient (d33) of 1,000 pC / N or more along the thickness direction (Z). 33 ), and thus can be applied to a vibration device having a relatively large size, or can be applied to a vibration device having sufficient vibration characteristics or piezoelectric characteristics. For example, the vibration part 11a according to one embodiment of the present specification may include a PZT-based material (PbZrTiO3) as a main component, a softener dopant material doped in the A site (Pb), and a relaxor ferroelectric material doped in the B site (ZrTi).

[0039] The softener dopant material can form a morphotropic phase boundary (MPB) of the piezoelectric material, thereby improving the piezoelectric and dielectric properties of the vibrating unit 11a. For example, the vibrating unit 11a can include a softener dopant material in a PZT-based material (PbZrTiO3) to form a morphotropic phase boundary, thereby improving the piezoelectric and dielectric properties. For example, the softener dopant material can increase the piezoelectric deformation coefficient (d33) of the vibrating unit 11a. The softener dopant material according to the embodiments of the present specification can include a +2 to +3 valent element. For example, the softener dopant material can include strontium (Sr), barium (Ba), lanthanum (La), neodymium (Nd), calcium (Ca), yttrium (Y), erbium (Er), or ytterbium (Yb).

[0040] The relaxor ferroelectric material can improve the electrodeformation characteristics of the vibrating unit 11a. For example, a relaxor ferroelectric material doped into a PZT-based material (PbZrTiO3) can improve the electrodeformation characteristics of the vibrating unit 11a. For example, the relaxor ferroelectric material according to an embodiment of the present specification can include, but is not limited to, a PMN (lead magnesium niobate)-based material or a PNN (lead nickel niobate)-based material. The PMN-based material can include lead (Pb), magnesium (Mg), and niobium (Nb), such as Pb(Mg,Nb)O3. The PNN-based material can include lead (Pb), nickel (Ni), and niobium (Nb), such as Pb(Ni,Nb)O3.

[0041] According to an embodiment of the present disclosure, the vibrating unit 11a may further include a donor material doped into the B site (ZrTi) of the PZT-based material (PbZrTiO3) to further improve the piezoelectric coefficient. For example, the donor material doped into the B site (ZrTi) may include an element with a valence of +4 to +6. For example, the donor material doped into the B site (ZrTi) may include tellurium (Te), germanium (Ge), uranium (U), bismuth (Bi), niobium (Nb), tantalum (Ta), antimony (Sb), or tungsten (W).

[0042] The vibrating section 11a according to the embodiment of the present specification has a piezoelectric deformation coefficient (d 33 ), a vibration device with improved vibration characteristics can be realized. For example, a vibration device including the vibration unit 11a with improved vibration characteristics can be applied to a device including a large-area vibrating member or a display device.

[0043] The vibration portion 11a according to the embodiments of the present specification may be configured in a circular shape, an elliptical shape, or a polygonal shape, but is not limited thereto.

[0044] The first electrode unit 11b may be disposed on the first surface (or upper surface) of the vibrating unit 11a. For example, the first electrode unit 11b may be electrically connected to the first surface of the vibrating unit 11a. For example, the first electrode unit 11b may have the shape of a single electrode (or a common electrode) disposed over the entire first surface of the vibrating unit 11a. For example, the first electrode unit 11b may have the same shape as the vibrating unit 11a, but is not limited thereto. The first electrode unit 11b according to the embodiments of the present specification may be made of a transparent conductive material, a semi-transparent conductive material, or an opaque conductive material. For example, the transparent or semi-transparent conductive material may include, but is not limited to, indium tin oxide (ITO) or indium zinc oxide (IZO). The opaque conductive material may include, but is not limited to, aluminum (Al), copper (Cu), gold (Au), silver (Ag), molybdenum (Mo), magnesium (Mg), or an alloy thereof.

[0045] The second electrode unit 11c may be disposed on a second surface (or back surface) opposite to the first surface of the vibrating unit 11a or different from the first surface. For example, the second electrode unit 11c may be electrically connected to the second surface of the vibrating unit 11a. For example, the second electrode unit 11c may have the shape of a single electrode (or a common electrode) disposed over the entire second surface of the vibrating unit 11a. For example, the second electrode unit 11c may have the same shape as the vibrating unit 11a, but is not limited to this. The second electrode unit 11c according to the embodiments of the present specification may be made of a transparent conductive material, a semi-transparent conductive material, or an opaque conductive material. For example, the second electrode unit 11c may be made of the same material as the first electrode unit 11b, but is not limited to this. In another embodiment of the present specification, the second electrode unit 11c may be made of a different material from the first electrode unit 11b.

[0046] The vibrating part 11a may be polarized by a constant voltage applied to the first electrode part 11b and the second electrode part 11c in a constant temperature atmosphere or in a temperature atmosphere that changes from high temperature to room temperature, but is not limited thereto. For example, the vibrating part 11a may be displaced or vibrate by alternately repeating contraction and expansion due to the inverse piezoelectric effect caused by a vibration drive signal (or an acoustic signal or a voice signal) applied from the outside to the first electrode part 11b and the second electrode part 11c.

[0047] The first protective member 13 may be disposed on the first electrode portion 11b. The first protective member 13 may protect the first electrode portion 11b. The second protective member 15 may be disposed on the second electrode portion 11c. The second protective member 15 may protect the second electrode portion 11c. For example, each of the first protective member 13 and the second protective member 15 may be made of, but is not limited to, a plastic material, a fiber material, or a wood material. For example, the first protective member 13 may be made of the same or a different material from the second protective member 15. Each of the first protective member 13 and the second protective member 15 may be, but is not limited to, a polyimide (PI) film or a polyethylene terephthalate (PET) film. Either one of the first protective member 13 and the second protective member 15 may be connected or coupled to a vibrating member (or diaphragm) via a connecting member. For example, the first protective member 13 may be connected or coupled to the rear surface of the vibration member via a connecting member.

[0048] The vibration generator 10 according to the embodiment of the present specification may further include a first adhesive layer 12 and a second adhesive layer 14.

[0049] The first adhesive layer 12 may be disposed between the vibrating structure 11 and the first protective member 13. For example, the first adhesive layer 12 may be disposed between the first electrode portion 11b of the vibrating structure 11 and the first protective member 13. The first protective member 13 may be disposed on the first surface (or the first electrode portion 11b) of the vibrating structure 11 via the first adhesive layer 12. For example, the first protective member 13 may be bonded or connected to the first surface (or the first electrode portion 11b) of the vibrating structure 11 by a film lamination process using the first adhesive layer 12 as an intermediary.

[0050] The second adhesive layer 14 may be disposed between the vibrating structure 11 and the second protective member 15. For example, the second adhesive layer 14 may be disposed between the second electrode portion 11c of the vibrating structure 11 and the second protective member 15. The second protective member 15 may be disposed on the second surface (or the second electrode portion 11c) of the vibrating structure 11 via the second adhesive layer 14. For example, the second protective member 15 may be bonded or connected to the second surface (or the second electrode portion 11c) of the vibrating structure 11 by a film lamination process using the second adhesive layer 14 as an intermediary.

[0051] The first adhesive layer 12 and the second adhesive layer 14 may be connected or bonded to each other between the first protective member 13 and the second protective member 15. For example, the first adhesive layer 12 and the second adhesive layer 14 may be connected or bonded to each other in the outer area (EA) of the vibration generator 10. For example, the first adhesive layer 12 and the second adhesive layer 14 may be connected or bonded to each other at the edge portion between the first protective member 13 and the second protective member 15. This allows the vibrating structure 11 to be surrounded by the first adhesive layer 12 and the second adhesive layer 14. For example, the first adhesive layer 12 and the second adhesive layer 14 may completely surround the entire vibrating structure 11.

[0052] Each of the first adhesive layer 12 and the second adhesive layer 14 may include an electrically insulating material. For example, the electrically insulating material may include a material that has adhesive properties and is compressible and resilient. For example, one or more of the first adhesive layer 12 and the second adhesive layer 14 may include, but are not limited to, an epoxy-based polymer, an acrylic-based polymer, a silicone-based polymer, or a urethane-based polymer.

[0053] The vibration generator 10 according to the embodiment of the present specification may further include a pad portion (or a terminal portion) 17.

[0054] The pad portion 17 may be electrically connected to one or more portions (or one side or one end) of the first electrode portion 11b and the second electrode portion 11c. For example, the pad portion 17 may be disposed on one or more first edge portions of the first protective member 13 and the second protective member 15.

[0055] The pad portion 17 according to the embodiment of the present specification may include a first pad electrode 17 a and a second pad electrode 17 b. For example, one or more of the first pad electrode 17 a and the second pad electrode 17 b may be exposed at a first edge portion of one or more of the first protective member 13 and the second protective member 15.

[0056] The first pad electrode 17a may be electrically coupled to or directly connected to a portion of the first electrode portion 11b. For example, the first pad electrode 17a may be a protrusion that extends or protrudes from a portion of the first electrode portion 11b, but is not limited thereto.

[0057] The second pad electrode 17b may be electrically coupled to or directly connected to a portion of the second electrode portion 11c. For example, the second pad electrode 17b may be a protrusion that extends or protrudes from a portion of the second electrode portion 11c, but is not limited thereto.

[0058] The sensor unit 30 may be configured in the vibration generator 10. For example, the sensor unit 30 may be configured externally or internally of the vibration generator 10. For example, the sensor unit 30 may include one or more sensors configured in one or more of an inner area (MA) and an outer area (EA) of the vibration generator 10.

[0059] The sensor unit 30 according to an embodiment of the present specification may be disposed in the outer area (EA) of the vibration generator 10. For example, the sensor unit 30 may be disposed in the outer area (EA) adjacent to the pad unit 17 of the vibration generator 10.

[0060] The sensor unit 30 according to one embodiment of the present specification may be configured on one or more of the first protective member 13 and the second protective member 15 of the vibration generator 10. For example, the sensor unit 30 may be configured on one side edge portion (or a first edge portion) of one of the first protective member 13 and the second protective member 15, parallel to the pad unit 17 of the vibration generator 10.

[0061] The sensor unit 30 according to an embodiment of the present specification may be configured to sense environmental changes around the vibration device or vibration generator 10. For example, the sensor unit 30 may be configured to sense changes in temperature and / or humidity around the vibration device or vibration generator 10, or may be configured to sense changes in temperature and / or humidity of the vibration device or vibration generator 10 due to the surrounding environment of the vibration device or vibration generator 10. For example, the sensor unit 30 may be configured such that its electrical characteristics are changed by physical displacement and / or deformation of the vibration device or vibration generator 10 due to changes in temperature and / or humidity.

[0062] The sensor unit 30 according to an embodiment of the present specification may be configured to sense changes in electrical characteristics and / or physical changes in the vibration generator 10. For example, the sensor unit 30 may be configured to sense changes in electrical characteristics and / or physical changes in the vibration generator 10 due to changes in the vibration device or the environment around the vibration generator 10. The sensor unit 30 may be configured to have electrical characteristics that change due to physical displacement and / or deformation caused by stress applied to the vibration generator 10. For example, stress applied to the vibration generator 10 may include, but is not limited to, force, pressure, tension, weight, heat, humidity, etc.

[0063] The sensor unit 30 according to an embodiment of the present specification may include, but is not limited to, a strain gauge, a capacitance sensor, an acceleration sensor, etc. For example, when the sensor unit 30 includes a strain gauge, the strain gauge may include, but is not limited to, a linear strain gauge, a shear strain gauge, a half-bridge strain gauge, a full-bridge strain gauge, a multi-grid strain gauge, or a diaphragm strain gauge.

[0064] The sensor unit 30 according to an embodiment of the present specification may be physically displaced and / or deformed due to a temperature change and / or a humidity change of the vibration device or the vibration generator 10. Furthermore, the sensor unit 30 according to an embodiment of the present specification may be physically displaced and / or deformed due to the vibration of the vibration generator 10. For example, the sensor unit 30 may be physically deformed due to a temperature change and / or a humidity change of the vibration generator 10, or the electrical characteristics of the sensor unit 30 may be changed due to the physical deformation caused by the vibration of the vibration generator 10.

[0065] The sensor unit 30 according to an embodiment of the present specification can be adhered or coupled to the vibration generator 10 via an adhesive member 20 .

[0066] The adhesive member 20 is disposed between the vibration generator 10 and the sensor unit 30, thereby adhering or coupling the sensor unit 30 to the vibration generator 10. For example, the sensor unit 30 may be coupled or connected to the rear surface of the vibration generator 10 via the adhesive member 20. For example, the sensor unit 30 may be coupled or connected to one of the first protective member 13 and the second protective member 15 of the vibration generator 10 via the adhesive member 20. For example, the sensor unit 30 may be coupled or connected to the rear surface of the second protective member 15 of the vibration generator 10 via the adhesive member 20. For example, when the first protective member 13 of the vibration generator 10 is coupled to the vibration member by a coupling member, the sensor unit 30 may be coupled or connected to the rear surface of the second protective member 15 of the vibration generator 10 via the adhesive member 20.

[0067] The adhesive member 20 according to the embodiments of the present specification may be made of a material including an adhesive layer with excellent adhesion or bonding strength to each of the vibration generator 10 and the sensor unit 30. For example, the adhesive member 20 may include, but is not limited to, double-sided tape or adhesive. For example, the adhesive layer of the adhesive member 20 may include, but is not limited to, an epoxy-based polymer, an acrylic-based polymer, a silicone-based polymer, or a urethane-based polymer. For example, the adhesive layer of the adhesive member 20 may include, among acrylics and urethanes, an acrylic-based substance (or material) that has relatively excellent adhesion and high hardness. As a result, one or more of deformation of the vibration generator 10 due to temperature and / or humidity and deformation of the vibration generator 10 due to vibration of the vibration generator 10 may be efficiently transmitted to the sensor unit 30, thereby improving the sensing sensitivity of the sensor unit 30.

[0068] The vibration device according to an embodiment of the present specification may further include a vibration driving circuit coupled to each of the vibration generator 10 and the sensor unit 30.

[0069] The vibration drive circuit (or acoustic processing circuit) can generate an AC vibration drive signal based on a sound source and supply it to the vibration generator 10. The vibration drive circuit can sense changes in the electrical characteristics of the sensor unit 30 and correct or vary the vibration drive signal supplied to the vibration generator 10. For example, the vibration drive circuit can generate sensing data based on the electrical signal supplied from the sensor unit 30 and set or vary the gain value of the amplifier circuit that outputs the vibration drive signal based on the sensing data, thereby compensating for changes in the characteristics of the vibration generator 10 (or the vibrating structure 11) due to temperature and / or humidity, or compensating for the acoustic characteristics and / or sound pressure characteristics of the vibration generator 10 (or the vibrating structure 11) due to vibration of the vibration generator 10.

[0070] Such a vibration device according to an embodiment of the present specification includes a sensor unit 30 that senses changes in the electrical characteristics and / or physical changes of the vibration generator 10 (or the vibrating structure 11), and is therefore capable of correcting or compensating for changes in the electrical characteristics of the vibration generator 10 (or the vibrating structure 11) due to temperature and / or humidity, correcting or compensating for the vibration characteristics of the vibration generator 10 (or the vibrating structure 11), and detecting physical changes such as damage or breakage of the vibration generator 10 (or the vibrating structure 11).

[0071] 3A and 3B are diagrams illustrating a sensor unit according to an embodiment of the present specification, and show the sensor unit shown in FIGS.

[0072] Referring to FIG. 3A, a sensor portion 30 according to an embodiment of the present disclosure may include a base member 31, a gauge pattern portion 33, and an insulating member 35.

[0073] The base member 31 may include an electrically insulating material. For example, the base member 31 may include a plastic material. For example, the base member 31 may be, but is not limited to, a polyimide (PI) film or a polyethylene terephthalate (PET) film.

[0074] The gauge pattern portion 33 may be configured on the base member 31. For example, the gauge pattern portion 33 may be configured on a first surface of the base member 31, or may be configured to contact or directly contact the first surface of the base member 31.

[0075] The gauge pattern section 33 according to the embodiments of the present specification may include one or more gauge patterns 33-1, 33-2, 33-3. For example, the gauge pattern section 33 may include first to third gauge patterns 33-1, 33-2, 33-3.

[0076] The one or more gauge patterns 33-1, 33-2, 33-3 may include a grid pattern 33a configured in a zigzag shape, a first terminal pattern 33b arranged on one side edge portion of the base member 31 and coupled to one end of the grid pattern 33a, and a second terminal pattern 33b arranged on one side edge portion of the base member 31 and coupled to the other end of the grid pattern 33a.

[0077] The grid pattern 33a, the first terminal pattern 33b, and the second terminal pattern 33c may be formed simultaneously by a patterning process of a metal layer disposed on the base member 31. For example, the metal layers forming the grid pattern 33a, the first terminal pattern 33b, and the second terminal pattern 33c may be formed of, but are not limited to, copper, nickel, chromium, aluminum, tungsten, platinum, a copper-nickel alloy, a copper-nickel-aluminum-iron alloy, a nickel-iron alloy, a chromium-nickel alloy, an aluminum alloy, a tungsten alloy, or a platinum-tungsten alloy.

[0078] According to the embodiments of the present specification, when the gauge pattern section 33 includes first to third gauge patterns 33-1, 33-2, and 33-3, the grid pattern 33a of the first gauge pattern 33-1 may include a zigzag shape having a straight line shape, the grid patterns 33a of the second and third gauge patterns 33-2 and 33-3 may include a zigzag shape having a diagonal line shape, and the grid patterns 33a of the second and third gauge patterns 33-2 and 33-3 may include a symmetrical structure centered on the grid pattern 33a of the first gauge pattern 33-1.

[0079] According to an embodiment of the present specification, one or more grid patterns 33-1, 33-2, 33-3 configured on the gauge pattern section 33 may be deformed by the temperature and / or humidity of the vibration device, or by one or more of deformation of the vibration generator 10 (or the vibrating structure 11) due to temperature and / or humidity, and deformation of the vibration generator 10 (or the vibrating structure 11) due to vibration of the vibration generator 10 (or the vibrating structure 11).

[0080] The insulating member 35 may be configured on the base member 31 to cover the gauge pattern portion 33. For example, the insulating member 35 may be configured on the base member 31 to cover the remaining portion of the base member 31 except for one side edge portion, thereby covering or protecting the gauge pattern portion 33. For example, the insulating member 35 may be configured on the base member 31 to expose at least a portion of the first terminal pattern 33b and the second terminal pattern 33b of one or more gauge patterns 33-1, 33-2, 33-3 configured on the gauge pattern portion 33.

[0081] The insulating member 35 according to an embodiment of the present disclosure may include an electrically insulating layer or an electrically insulating material layer, such as, but not limited to, an epoxy-based polymer, an acrylic-based polymer, a silicone-based polymer, or a urethane-based polymer.

[0082] The insulating member 35 according to other embodiments of the present disclosure may include a plastic material that is the same as or different from the base member 31. For example, the insulating member 35 may be, but is not limited to, a polyimide (PI) film or a polyethylene terephthalate (PET) film.

[0083] The sensor unit 30 according to an embodiment of the present disclosure may further include a sensor lead 37 coupled to the gauge pattern unit 33 .

[0084] The sensor lead 37 may be electrically coupled to each of the first terminal pattern 33b and the second terminal pattern 33c configured on one or more gauge patterns 33-1, 33-2, 33-3 or each of the plurality of gauge patterns 33-1, 33-2, 33-3. For example, the sensor lead 37 may include a first sensor lead electrically coupled to the first terminal pattern 33b and a second sensor lead electrically coupled to the second terminal pattern 33c.

[0085] The sensor lead 37 according to an embodiment of the present specification may be electrically coupled to the vibration drive circuit. As a result, the vibration drive circuit is electrically coupled to the sensor lead 37 and senses an electrical signal due to deformation of the gauge pattern portion 33 via the sensor lead 37. Based on this, the vibration drive circuit can correct or compensate for changes in the electrical characteristics of the vibration generator 10 (or the vibrating structure 11) and can detect physical changes such as damage or breakage of the vibration generator 10 (or the vibrating structure 11).

[0086] According to an embodiment of the present specification, each of the first terminal pattern 33b and the second terminal pattern 33c and at least a portion of the sensor lead wire 37 may be covered by, but is not limited to, the insulating member 35. As a result, a portion of the sensor lead wire 37 may protrude outside the base member 31 or be exposed outside the base member 31.

[0087] 3A, the gauge pattern portion 33 of the sensor portion 30 has been described as having three gauge patterns 33-1, 33-2, and 33-3 having linear strain gauge structures, but is not limited thereto. For example, the gauge pattern portion 33 of the sensor portion 30 may include a structure such as a shear strain gauge, a half-bridge strain gauge, a full-bridge strain gauge, or a multi-grid strain gauge in addition to one linear strain gauge structure or multiple linear strain gauge structures.

[0088] Referring to FIG. 3B, a sensor portion 30 according to another embodiment of the present disclosure may include a base member 31, a gauge pattern portion 33, and an insulating member 35.

[0089] The base member 31 is the same as the base member 3 described with reference to FIG. 3A except that it has a circular shape, so a redundant description thereof will be omitted.

[0090] The gauge pattern portion 33 may be configured on the base member 31. For example, the gauge pattern portion 33 may be configured on a first surface of the base member 31, or may be configured to contact or directly contact the first surface of the base member 31.

[0091] The gauge pattern section 33 according to the embodiment of the present specification may include one or more gauge patterns 33-1, 33-2. For example, the gauge pattern section 33 may include first and second gauge patterns 33-1, 33-2.

[0092] The one or more gauge patterns 33-1, 33-2 or the first and second gauge patterns 33-1, 33-2 may include a first grid pattern 33a1 configured in a zigzag shape, a second grid pattern 33a2 configured in a zigzag shape, a first terminal pattern 33b coupled to one end of the first grid pattern 33a1, a second terminal pattern 33c coupled to one end of the second grid pattern 33a2, and a third terminal pattern 33d coupled in common to the other end of the first grid pattern 33a1 and the other end of the second grid pattern 33a2.

[0093] In the sensor unit 30 according to another embodiment of the present specification, each of the first and second gauge patterns 33-1 and 33-2 may include, but is not limited to, a half-bridge structure. According to another embodiment of the present specification, one or more grid patterns 33-1 and 33-2 formed in the gauge pattern unit 33 may be deformed due to the temperature and / or humidity of the vibration device, or may be deformed due to one or more of deformation of the vibration generator 10 (or the vibrating structure 11) due to the temperature and / or humidity, and deformation of the vibration generator 10 (or the vibrating structure 11) due to vibration of the vibration generator 10 (or the vibrating structure 11).

[0094] Based on the center of the base member 31, the first gauge pattern 33-1 may be configured on the upper side of the base member 31, and the second gauge pattern 33-2 may be configured on the lower side of the base member 31, but is not limited to this.

[0095] The sensor unit 30 according to another embodiment of the present disclosure may further include a sensor lead 37 coupled to the gauge pattern unit 33 .

[0096] The sensor lead 37 may be electrically coupled to each of the first to third terminal patterns 33b, 33c, and 33d configured on one or more gauge patterns 33-1 and 33-2 or each of the first and second gauge patterns 33-1 and 33-2. For example, the sensor lead 37 may include a first sensor lead electrically coupled to the first terminal pattern 33b, a second sensor lead electrically coupled to the second terminal pattern 33c, and a third sensor lead electrically coupled to the third terminal pattern 33d.

[0097] According to one embodiment of the present specification, the gauge pattern portion 33 and the sensor lead wire 37 arranged on the base member 31 may be covered by, but are not limited to, the insulating member 35. As a result, a portion of the sensor lead wire 37 may protrude outside the base member 31 or may be exposed outside the base member 31.

[0098] 3B, the gauge pattern unit 33 of the sensor unit 30 has been described as having a half-bridge strain gauge structure using two gauge patterns 33-1 and 33-2, but is not limited thereto. For example, the gauge pattern unit 33 of the sensor unit 30 may include a structure other than the half-bridge strain gauge structure, such as a single linear strain gauge structure, a plurality of linear strain gauge structures, a shear strain gauge, a full-bridge strain gauge, or a multi-grid strain gauge.

[0099] Fig. 4 is another cross-sectional view taken along the line AA' shown in Fig. 1. Fig. 4 shows a modification of the sensor unit shown in Fig. 2.

[0100] 1 and 4, a vibration device according to another embodiment of the present disclosure may include a vibration generator 10 and a sensor unit 30.

[0101] The vibration generator 10 is substantially the same as the vibration generator 10 described with reference to FIGS. 1 and 2, and therefore a duplicated description thereof will be omitted.

[0102] The sensor unit 30 may be configured inside the vibration generator 10. For example, the sensor unit 30 is built into the vibration generator 10 and is not exposed to the outside of the vibration generator 10. For example, the sensor unit 30 may be built into an outer area (EA) adjacent to the pad unit 17 of the vibration generator 10. For example, the sensor unit 30 may be disposed between the first protective member 13 and the second protective member 15 in parallel with the pad unit 17 of the vibration generator 10.

[0103] Sensor unit 30 according to one embodiment of the present specification may be disposed between first protective member 13 and second protective member 15 of vibration generator 10 and surrounded by first and second adhesive layers 12, 14. For example, sensor unit 30 may be completely surrounded by first and second adhesive layers 12, 14. For example, sensor unit 30 may be embedded in or built into first and second adhesive layers 12, 14. In this way, first protective member 13 and second protective member 15 of vibration generator 10 can protect vibration generator 10 and also serve the function of protecting sensor unit 30.

[0104] Sensor unit 30 according to an embodiment of the present specification may be disposed midway between first protective member 13 and second protective member 15 of vibration generator 10 with respect to the thickness direction (Z) of vibration generator 10, but is not limited to this. For example, sensor unit 30 may be disposed on the same plane (or the same layer) as either first electrode unit 11b or second electrode unit 11c of vibration generator 10 with respect to the thickness direction (Z) of vibration generator 10.

[0105] The sensor unit 30 according to an embodiment of the present specification may include a base member 31, a gauge pattern unit 33, an insulating member 35, and a sensor lead wire 37. For example, the base member 31, the gauge pattern unit 33, the insulating member 35, and the sensor lead wire 37 of the sensor unit 30 are substantially the same as the base member 31, the gauge pattern unit 33, the insulating member 35, and the sensor lead wire 37 of the sensor unit 30 described with reference to Fig. 3A or 3B, respectively, and therefore redundant description thereof will be omitted. According to an embodiment of the present specification, the sensor lead wire 37 of the sensor unit 30 may penetrate the first and second adhesive layers 12 and 14 and protrude to the outside of the side surface of the vibration generator 10.

[0106] The sensor unit 30 according to one embodiment of the present specification may be deformed due to one or more of deformation of the vibration generator 10 (or the vibrating structure 11) due to temperature and / or humidity, etc., and deformation of the vibration generator 10 due to vibration of the vibrating structure 11.

[0107] Such vibration devices according to other embodiments of this specification can have the same effect as the vibration devices described in Figures 1 and 2, and by incorporating sensor unit 30 inside vibration generator 10, first protective member 13 and second protective member 15 of vibration generator 10 can prevent damage to sensor unit 30, etc.

[0108] Fig. 5 is another cross-sectional view taken along the line AA' shown in Fig. 1. Fig. 5 shows a modification of the sensor unit shown in Fig. 4.

[0109] Referring to FIGS. 1 and 5, a vibration device according to another embodiment of the present disclosure may include a vibration generator 10 and a sensor unit 30.

[0110] The vibration generator 10 is substantially the same as the vibration generator 10 described with reference to FIGS. 1 and 2, and therefore a duplicated description thereof will be omitted.

[0111] The sensor unit 30 may be configured inside the vibration generator 10. For example, the sensor unit 30 is built into the vibration generator 10 and is not exposed to the outside of the vibration generator 10. For example, the sensor unit 30 may be built into an outer area (EA) adjacent to the pad unit 17 of the vibration generator 10. For example, the sensor unit 30 may be disposed between the first protective member 13 and the second protective member 15 in parallel with the pad unit 17 of the vibration generator 10.

[0112] Sensor unit 30 according to one embodiment of the present specification may be disposed between first protective member 13 and second protective member 15 of vibration generator 10, and may be surrounded by first and second adhesive layers 12, 14. In this way, first protective member 13 and second protective member 15 of vibration generator 10 can protect vibration generator 10 and also serve to protect sensor unit 30.

[0113] The sensor unit 30 according to one embodiment of the present specification may be disposed or configured on the inner surface 13a (or back surface or second surface) of the first protective member 13 of the vibration generator 10. For example, the sensor unit 30 may be disposed or configured on the inner surface 13a of the first protective member 13 that faces the vibrating structure 11 or that faces the vibrating structure 11 in the vibration generator 10. For example, the sensor unit 30 may be adhered or coupled to the inner surface 13a of the first protective member 13 via an adhesive member 20 in the vibration generator 10.

[0114] The sensor unit 30 according to an embodiment of the present specification may include a base member 31, a gauge pattern unit 33, an insulating member 35, and a sensor lead wire 37. For example, the base member 31, the gauge pattern unit 33, the insulating member 35, and the sensor lead wire 37 of the sensor unit 30 are substantially the same as the base member 31, the gauge pattern unit 33, the insulating member 35, and the sensor lead wire 37 of the sensor unit 30 described with reference to Fig. 3A or 3B, respectively, and therefore redundant description thereof will be omitted. According to an embodiment of the present specification, the sensor lead wire 37 of the sensor unit 30 may penetrate the first and second adhesive layers 12 and 14 and protrude to the outside of the side surface of the vibration generator 10.

[0115] According to one embodiment of the present specification, the base member 31 of the sensor unit 30 may be adhered or coupled to the inner surface 13a of the first protective member 13 via the adhesive member 20, but is not limited thereto. For example, the insulating member 35 of the sensor unit 30 may be adhered or coupled to the inner surface 13a of the first protective member 13 via the adhesive member 20.

[0116] 5, the sensor unit 30 is described as being adhered or coupled to the inner surface 13a of the first protective member 13 via the adhesive member 20, but this is not limited thereto. For example, the sensor unit 30 according to an embodiment of the present specification may be disposed or configured on the inner surface 15a (or front surface or first surface) of the second protective member 15 of the vibration generator 10. For example, the sensor unit 30 may be disposed or configured on the inner surface 15a of the second protective member 15 facing the vibrating structure 11 in the vibration generator 10. For example, the base member 31 and the insulating member 35 of the sensor unit 30 may be adhered or coupled to the inner surface 15a of the second protective member 15 via the adhesive member 20.

[0117] The sensor unit 30 according to one embodiment of the present specification may be deformed due to one or more of deformation of the vibration generator 10 (or the vibrating structure 11) due to temperature and / or humidity, etc., and deformation of the vibration generator 10 due to vibration of the vibrating structure 11.

[0118] Such vibration devices according to other embodiments of the present specification can have the same effects as the vibration devices described with reference to FIGS. 1 and 4, and therefore, redundant description thereof will be omitted.

[0119] Fig. 6 is another cross-sectional view taken along the line AA' shown in Fig. 1. Fig. 6 shows a modification of the sensor unit shown in Fig. 2.

[0120] Referring to FIGS. 1 and 6, a vibration device according to another embodiment of the present disclosure may include a vibration generator 10 and a sensor unit 30.

[0121] The vibration generator 10 is substantially the same as the vibration generator 10 described with reference to FIGS. 1 and 2, and therefore a duplicated description thereof will be omitted.

[0122] The sensor unit 30 may be directly configured or integrated inside the vibration generator 10. For example, the sensor unit 30 may be directly configured or integrated on the inner surface 13 a, 15 a of any one of the first protective member 13 and the second protective member 15, parallel to the pad unit 17 of the vibration generator 10.

[0123] The sensor unit 30 according to an embodiment of the present specification may include a gauge pattern unit 33, an insulating member 35, and a sensor lead wire 37. For example, each of the gauge pattern unit 33, the insulating member 35, and the sensor lead wire 37 of the sensor unit 30 may include a structure in which the base member 31 is omitted from the sensor unit 30 described with reference to FIG. 3A or 3B.

[0124] The gauge pattern unit 33 of the sensor unit 30 may be directly formed on or integrated with the inner surface 13a, 15a of either the first protective member 13 or the second protective member 15. In this case, each of the first protective member 13 and the second protective member 15 may include, but is not limited to, a plastic material on which a metal layer can be formed and patterned. For example, each of the first protective member 13 and the second protective member 15 may be, but is not limited to, a polyimide (PI) film or a polyethylene terephthalate (PET) film.

[0125] The gauge pattern unit 33 according to an embodiment of the present disclosure may be configured on the inner surface 15a of the second protective member 15 or may be configured to directly contact the inner surface 15a of the second protective member 15. For example, the gauge pattern unit 33 has substantially the same structure as the gauge pattern unit 33 of the sensor unit 30 described in FIG. 3A or 3B except that the gauge pattern unit 33 is configured to directly contact the inner surface 15a of the second protective member 15 instead of the base member, and therefore, redundant description thereof will be omitted. For example, the gauge pattern unit 33 may include a structure such as a shear strain gauge, a half-bridge strain gauge, a full-bridge strain gauge, or a multi-grid strain gauge in addition to the gauge pattern unit 33 of the sensor unit 30 described in FIG. 3A or 3B.

[0126] The insulating member 35 may be configured on the inner surface 15a of the second protective member 15 on which the gauge pattern portion 33 is configured, and may be configured to cover the gauge pattern portion 33. For example, the insulating member 35 may be configured on the inner surface 15a of the second protective member 15 so as to cover the gauge pattern portion 33.

[0127] The sensor lead wire 37 may be configured on the inner surface 15a of the second protective member 15 together with the gauge pattern portion 33. For example, the sensor lead wire 37 may be formed on the inner surface 15a of the second protective member 15 simultaneously with the gauge pattern portion 33 by a patterning process of a metal layer formed on the inner surface 15a of the second protective member 15. At least a portion of the sensor lead wire 37 may be exposed to the outside, similar to the pad portion 17 of the vibration generator 10. This may omit a process for connecting the gauge pattern portion 33 and the sensor lead wire 37, such as a soldering process.

[0128] According to one embodiment of the present specification, the insulating member 35 may be configured to surround the gauge pattern portion 33 and cover a portion of the sensor lead wire 37, but is not limited to this. For example, the insulating member 35 may be configured to cover the entire gauge pattern portion 33 and the sensor lead wire 37. For example, at least a portion of the sensor lead wire 37 configured adjacent to the pad portion 17 of the vibration generator 10 may be exposed to the outside, similar to the pad portion 17 of the vibration generator 10.

[0129] 6 illustrates that the gauge pattern portion 33 is formed on the inner surface 15a of the second protective member 15, but this is not limited thereto. For example, the gauge pattern portion 33 may be configured to be in direct contact with the inner surface 13a of the first protective member 13. For example, the insulating member 35 may be configured on the inner surface 13a of the first protective member 13 on which the gauge pattern portion 33 is formed, and may be configured to cover the gauge pattern portion 33. For example, the insulating member 35 may be configured on the inner surface 13a of the first protective member 13 so as to cover the gauge pattern portion 33.

[0130] The sensor lead wire 37 may be configured on the inner surface 13a of the first protective member 13 together with the gauge pattern portion 33. For example, the sensor lead wire 37 may be formed on the inner surface 13a of the first protective member 13 simultaneously with the gauge pattern portion 33 by a patterning process of a metal layer formed on the inner surface 13a of the first protective member 13. At least a portion of the sensor lead wire 37 may be exposed to the outside, similar to the pad portion 17 of the vibration generator 10. This may omit a process for connecting the gauge pattern portion 33 and the sensor lead wire 37, such as a soldering process.

[0131] 6, the insulating member 35 of the sensor unit 30 may be omitted. For example, the sensor unit 30 has a gauge pattern portion 33 configured to be in direct contact with the inner surface 15a of the second protective member 15 or the inner surface 13a of the first protective member 13, and the gauge pattern portion 33 can be covered by the adhesive layers 12, 14 of the vibration generator 10, so that the insulating member 35 may be omitted.

[0132] The sensor unit 30 according to one embodiment of the present specification may be deformed due to one or more of deformation of the vibration generator 10 (or the vibrating structure 11) due to temperature and / or humidity, etc., and deformation of the vibration generator 10 due to vibration of the vibrating structure 11.

[0133] Such a vibration device according to another embodiment of this specification can have the same effect as the vibration device described in Figures 1 and 4 or the vibration device described in Figures 1 and 5, and a separate sensor assembly process for attaching or coupling the sensor unit 30 to the vibration generator 10 can be omitted.

[0134] Fig. 7 is another cross-sectional view taken along the line AA' shown in Fig. 1. Fig. 7 shows a modification of the sensor unit shown in Fig. 6.

[0135] Referring to FIGS. 1 and 6, a vibration device according to another embodiment of the present disclosure may include a vibration generator 10 and a sensor unit 30.

[0136] The vibration generator 10 is substantially the same as the vibration generator 10 described with reference to FIGS. 1 and 2, and therefore a duplicated description thereof will be omitted.

[0137] The sensor unit 30 may be directly configured on the outside of the vibration generator 10 or may be integrated therein. For example, the sensor unit 30 may be directly configured on or integrated with the outer surface 13b, 15b of one of the first protective member 13 and the second protective member 15, parallel to the pad unit 17 of the vibration generator 10. For example, the outer surface 13b of the first protective member 13 may be expressed as the front surface or first surface of the first protective member 13, but is not limited thereto. The outer surface 15b of the second protective member 15 may be expressed as the back surface or second surface of the second protective member 13, but is not limited thereto.

[0138] The sensor unit 30 according to an embodiment of the present specification may include a gauge pattern unit 33, an insulating member 35, and a sensor lead wire 37. For example, each of the gauge pattern unit 33, the insulating member 35, and the sensor lead wire 37 of the sensor unit 30 may include a structure in which the base member 31 is omitted from the sensor unit 30 described with reference to FIG. 3A or 3B.

[0139] The gauge pattern unit 33 of the sensor unit 30 according to an embodiment of the present specification may be directly formed on or integrated with the outer surface 13b, 15b of either the first protective member 13 or the second protective member 15. In this case, each of the first protective member 13 and the second protective member 15 may include, but is not limited to, a plastic material on which a metal layer can be formed and patterned. For example, each of the first protective member 13 and the second protective member 15 may be, but is not limited to, a polyimide (PI) film or a polyethylene terephthalate (PET) film.

[0140] The gauge pattern unit 33 of the sensor unit 30 according to an embodiment of the present specification is substantially the same as the gauge pattern unit 33 of the sensor unit 30 described in FIG. 6 , except that it is directly formed on or integrated with the outer surface 15b of the second protective member 15. Therefore, a redundant description thereof will be omitted. For example, when the first protective member 13 of the vibration device or vibration generator 10 according to an embodiment of the present specification is connected or coupled to a vibrating member (or diaphragm) via a connecting member, the sensor unit 30 may be directly formed on or integrated with the outer surface 15b of the second protective member 15. For example, the insulating member 35 of the sensor unit 30 may be formed in a pattern shape on the outer surface 13b of the first protective member 13 so as to cover the gauge pattern unit 33 formed directly on the outer surface 13b of the first protective member 13, but is not limited thereto. For example, the insulating member 35 of the sensor unit 30 may be configured to cover the entire outer surface 15b of the second protective member 15. As a result, outer surface 15b of second protective member 15 on which sensor unit 30 is formed or the back surface of vibration generator 10 can have a flat surface structure without any step due to sensor unit 30.

[0141] The gauge pattern unit 33 of the sensor unit 30 according to other embodiments of the present specification is substantially the same as the gauge pattern unit 33 of the sensor unit 30 described in FIG. 6, except that it is directly formed on or integrated with the outer surface 13b of the first protective member 13. Therefore, a redundant description thereof will be omitted. For example, when the second protective member 15 of the vibration device or vibration generator 10 according to other embodiments of the present specification is connected or coupled to the vibrating member (or diaphragm) via a connecting member, the sensor unit 30 may be directly formed on or integrated with the outer surface 13b of the first protective member 13. For example, the insulating member 35 of the sensor unit 30 may be configured to cover the entire outer surface 13b of the first protective member 13. As a result, the outer surface 13b of the first protective member 13 on which the sensor unit 30 is formed or the back surface of the vibration generator 10 may have a flat surface structure without any step due to the sensor unit 30.

[0142] The sensor unit 30 according to one embodiment of the present specification may be deformed due to one or more of deformation of the vibration generator 10 (or the vibrating structure 11) due to temperature and / or humidity, etc., and deformation of the vibration generator 10 due to vibration of the vibrating structure 11.

[0143] Such a vibration device according to another embodiment of this specification can have the same effect as the vibration device described in Figures 1 and 2, and a separate sensor assembly process for attaching or coupling the sensor unit 30 to the vibration generator 10 can be omitted.

[0144] Fig. 8 is a diagram showing a vibration device according to another embodiment of the present specification. Fig. 8 shows a modification of the sensor unit shown in Fig. 1 and Fig. 2. The cross-sectional view taken along line A-A' shown in Fig. 8 is shown in any one of Fig. 2 and Fig. 4 to Fig. 7.

[0145] 2 and 8, a vibration device according to another embodiment of the present disclosure may include a vibration generator 10 and a sensor unit 30.

[0146] The vibration generator 10 is substantially the same as the vibration generator 10 described with reference to FIGS. 1 and 2, and therefore a duplicated description thereof will be omitted.

[0147] The sensor unit 30 may be configured outside the vibration generator 10. The sensor unit 30 may be disposed in an outer area (EA) of the vibration generator 10. For example, the sensor unit 30 may be configured on the outer surface of either the first protective member 13 or the second protective member 15, parallel to the pad unit 17 of the vibration generator 10.

[0148] The sensor unit 30 according to other embodiments of the present specification may include a plurality of sensors 30-1, 30-2, 30-3, and 30-4. For example, the sensor unit 30 may include first to fourth sensors 30-1, 30-2, 30-3, and 30-4.

[0149] Each of the plurality of sensors 30-1, 30-2, 30-3, 30-4 or each of the first to fourth sensors 30-1, 30-2, 30-3, 30-4 may be configured at a corner portion of vibration generator 10. For example, if vibration generator 10 has a square shape including first to fourth corner portions, each of the first to fourth sensors 30-1, 30-2, 30-3, 30-4 may be configured at each of the first to fourth corner portions of vibration generator 10.

[0150] Each of the first to fourth sensors 30-1, 30-2, 30-3, and 30-4 includes a base member, a gauge pattern portion, an insulating member, and a sensor lead wire, similar to the sensor portion 30 described in FIG. 3A or 3B, and therefore, redundant description thereof can be omitted.

[0151] First to fourth sensors 30-1, 30-2, 30-3, and 30-4 may be arranged at corners of the outer surface of second protective member 15 that correspond to the corners of vibration generator 10, respectively.

[0152] Each of the first to fourth sensors 30-1, 30-2, 30-3, and 30-4 may be deformed by one or more of deformations at each corner of the vibration generator 10 (or vibrating structure 11) due to temperature and / or humidity, etc., and deformations at each corner of the vibration generator 10 due to vibration of the vibrating structure 11.

[0153] The sensor unit 30 according to another embodiment of the present specification includes a plurality of sensors 30-1, 30-2, 30-3, and 30-4 individually arranged at each corner of the vibration generator 10, thereby enabling more precise detection of one or more of deformation of the vibration generator 10 due to temperature and / or humidity, and deformation of the vibration generator 10 due to vibration of the vibrating structure 11. For example, the vibration device according to another embodiment of the present specification can precisely correct or compensate for changes in the electrical characteristics of the vibration generator 10 due to temperature and / or humidity, thereby optimizing the vibration characteristics of the vibration generator 10 and accurately detecting physical changes, such as damage or breakage of the vibration generator 10, by detecting the deformation of the vibration generator 10 via each of the first to fourth sensors 30-1, 30-2, 30-3, and 30-4 individually arranged at each corner of the vibration generator 10.

[0154] Sensor unit 30 according to other embodiments of the present specification may further include fifth to seventh sensors 30-5, 30-6, and 30-7 arranged in intermediate portions between adjacent corner portions of vibration generator 10.

[0155] The fifth sensor 30-5 may be configured between the first sensor 30-1 and the third sensor 30-3. The sixth sensor 30-6 may be configured between the second sensor 30-2 and the fourth sensor 30-4. The seventh sensor 30-7 may be configured between the third sensor 30-3 and the fourth sensor 30-4. Each of the fifth to seventh sensors 30-5, 30-6, and 30-7 includes a base member, a gauge pattern portion, an insulating member, and a sensor lead wire, similar to the sensor unit 30 described with reference to FIG. 3A or 3B, and therefore, redundant description thereof will be omitted.

[0156] Each of the fifth to seventh sensors 30-5, 30-6, 30-7 may be deformed by one or more of deformations in the middle part of the outer area (EA) of the vibration generator 10 due to temperature and / or humidity, etc., and deformations in the middle part of the outer area (EA) of the vibration generator 10 due to vibration of the vibrating structure 11.

[0157] The sensor unit 30 according to another embodiment of the present specification further includes fifth to seventh sensors 30-5, 30-6, and 30-7 individually arranged in the middle portion of the outer area (EA) of the vibration generator 10, thereby enabling more precise detection of one or more of deformation of the vibration generator 10 due to temperature and / or humidity, etc., and deformation of the vibration generator 10 due to vibration of the vibrating structure 11. For example, the vibration device according to another embodiment of the present specification can precisely correct or compensate for changes in the electrical characteristics of the vibration generator 10 due to temperature and / or humidity, etc., by detecting deformation of the vibration generator 10 via each of the first to seventh sensors 30-1, 30-2, 30-3, 30-4, 30-5, 30-6, and 30-7, thereby further optimizing the vibration characteristics of the vibration generator 10 or improving the vibration uniformity of the vibration generator 10, and more precisely detecting physical changes, such as damage or breakage of the vibration generator 10.

[0158] According to one embodiment of the present specification, the sensor unit 30 may include only the first to fourth sensors 30-1, 30-2, 30-3, and 30-4, or may include only the fifth to seventh sensors 30-5, 30-6, and 30-7, but is not limited thereto, and may include all of the first to seventh sensors 30-1, 30-2, 30-3, 30-4, 30-5, 30-6, and 30-7.

[0159] According to one embodiment of the present specification, each of the first to fourth sensors 30-1, 30-2, 30-3, 30-4 and / or the fifth to seventh sensors 30-5, 30-6, 30-7 may be connected or coupled to any one of the first protective member 13 and the second protective member 15 of the vibration generator 10 via an adhesive member 20, as described in FIG. 2, and redundant description thereof may be omitted.

[0160] According to one embodiment of the present specification, each of the first to fourth sensors 30-1, 30-2, 30-3, 30-4 and / or the fifth to seventh sensors 30-5, 30-6, 30-7 may be configured between the first protective member 13 and the second protective member 15 of the vibration generator 10, as described in Figure 4 or Figure 5, and redundant description thereof may be omitted.

[0161] According to other embodiments of the present specification, each of the first to fourth sensors 30-1, 30-2, 30-3, 30-4 and / or the fifth to seventh sensors 30-5, 30-6, 30-7 may be configured to be in direct contact with the inner surface 13a, 15a of any one of the first protective member 13 and the second protective member 15 of the vibration generator 10, as described in FIG. 6, and redundant description thereof may be omitted.

[0162] According to other embodiments of the present specification, each of the first to fourth sensors 30-1, 30-2, 30-3, 30-4 and / or the fifth to seventh sensors 30-5, 30-6, 30-7 may be configured to be in direct contact with the outer surface 13b, 15b of any one of the first protective member 13 and the second protective member 15 of the vibration generator 10, as described in FIG. 7, and redundant description thereof may be omitted.

[0163] Fig. 9 is a diagram showing a vibration device according to another embodiment of the present specification. Fig. 10 is a cross-sectional view taken along line B-B' shown in Fig. 9. Figs. 9 and 10 show modifications of the sensor unit shown in Figs. 1 and 2.

[0164] 9 and 10, a vibration device according to another embodiment of the present specification can include a vibration generator 10 and a sensor unit 30.

[0165] The vibration generator 10 is substantially the same as the vibration generator 10 described with reference to FIGS. 1 and 2, and therefore a duplicated description thereof will be omitted.

[0166] The sensor unit 30 may be configured in the inner area (MA) of the vibration generator 10. For example, the sensor unit 30 may be configured in the inner area (MA) of the vibration generator 10 so as to overlap with at least a portion of the vibrating unit 11a configured in the vibration generator 10. For example, the sensor unit 30 may be configured to sense deformation of the inner area (MA) of the vibration generator 10 in response to temperature and / or humidity, etc., and / or characteristic changes or vibration characteristics of the inner area (MA) of the vibration generator 10.

[0167] The sensor unit 30 according to an embodiment of the present specification may include a base member 31, a gauge pattern unit 33, an insulating member 35, and a sensor lead wire 37. For example, the base member 31, the gauge pattern unit 33, the insulating member 35, and the sensor lead wire 37 of the sensor unit 30 are substantially the same as the base member 31, the gauge pattern unit 33, the insulating member 35, and the sensor lead wire 37 of the sensor unit 30 described with reference to Fig. 3A or 3B, respectively, and therefore, redundant description thereof will be omitted.

[0168] The sensor unit 30 according to one embodiment of the present specification may be configured in a central portion of the vibration generator 10. For example, the sensor unit 30 may be configured in the exact center of the vibration generator 10. For example, the sensor unit 30 may be configured in a central portion of the vibrating unit 11a configured in the vibration generator 10. For example, the central portion of the sensor unit 30 may be located or aligned with the central portion of the vibration generator 10.

[0169] According to one embodiment of the present specification, the sensor lead wire 37 of the sensor unit 30 may be extended to the pad unit 17 of the vibration generator 10. For example, the sensor lead wire 37 may be arranged in parallel with each of the first pad electrode 17a and the second pad electrode 17b of the pad unit 17.

[0170] The sensor unit 30 according to an embodiment of the present specification may be connected or coupled to the rear surface of the vibration generator 10 via an adhesive member 20. For example, the sensor unit 30 may be connected or coupled to one of the first protective member 13 and the second protective member 15 of the vibration generator 10 via the adhesive member 20. For example, the adhesive member 20 is substantially the same as the adhesive member 20 described with reference to FIGS. 1 and 2, and therefore, a redundant description thereof may be omitted.

[0171] According to one embodiment of the present specification, the sensor unit 30 may be connected or coupled to a center of the outer surface 15b of the second protective member 15, which corresponds to the center of the vibration generator 10, via an adhesive member 20. According to another embodiment of the present specification, the sensor unit 30 may be connected or coupled to a center of the outer surface 13b of the first protective member 13, which corresponds to the center of the vibration generator 10, via an adhesive member 20.

[0172] According to one embodiment of the present specification, the sensor unit 30 may be coupled to or connected to a surface opposite to a coupling surface of the vibration generator 10 that is coupled to or connected to a vibration member via a coupling member. For example, when a first surface (or a second surface) of the vibration generator 10 is coupled to or connected to a vibration member, the sensor unit 30 may be coupled to or connected to the second surface (or the first surface) of the vibration generator 10.

[0173] Such a vibration device according to another embodiment of the present specification includes a sensor unit 30 that senses electrical characteristic changes and / or physical changes in the center of the vibration generator 10, and is therefore capable of correcting or compensating for changes in the electrical characteristics of the vibration generator 10 due to temperature and / or humidity, etc., correcting or compensating for the vibration characteristics of the vibration generator 10, and detecting physical changes such as damage or breakage of the vibration generator 10. Furthermore, a vibration device according to another embodiment of the present specification senses deformation in the center of the vibration generator 10, which has the largest displacement or largest vibration amplitude in the vibration generator 10, via the sensor unit 30, and is thereby capable of correcting or compensating for changes in the electrical characteristics of the vibration generator 10 due to temperature and / or humidity, etc., optimizing the vibration characteristics of the vibration generator 10, and detecting physical changes such as damage or breakage of the vibration generator 10.

[0174] Vibration devices according to other embodiments of the present specification may further include an auxiliary sensor unit configured in the outer area (EA) of vibration generator 10. The auxiliary sensor unit may include first to fourth sensors 30-1, 30-2, 30-3, and 30-4 and / or fifth to seventh sensors 30-5, 30-6, and 30-7 described in FIG. 8. The sensors of the auxiliary sensor unit may be coupled to one of first protective member 13 and second protective member 15 of vibration generator 10 via adhesive member 20, as described in FIG. 2, FIG. 4, or FIG. 5, or may be configured between first protective member 13 and second protective member 15, and therefore, redundant description thereof will be omitted. Therefore, vibration devices according to other embodiments of the present specification may further have the effects of the vibration device described in FIG. 8 by further including an auxiliary sensor unit configured in the outer area (EA) of vibration generator 10.

[0175] Fig. 11 is a diagram showing a vibration device according to another embodiment of the present specification. Fig. 12 is a cross-sectional view taken along line CC' shown in Fig. 11. Figs. 11 and 12 show modifications of the sensor unit described in Figs. 9 and 10.

[0176] 11 and 12, a vibration device according to another embodiment of the present specification can include a vibration generator 10 and a sensor unit 30.

[0177] The vibration generator 10 is substantially the same as the vibration generator 10 described with reference to FIGS. 1 and 2, and therefore a duplicated description thereof will be omitted.

[0178] The sensor unit 30 may be directly formed on or integrated into the exterior of the vibration generator 10 corresponding to the interior area (MA) of the vibration generator 10. For example, the sensor unit 30 may be directly formed on or integrated into the outer surface 13b, 15b of one of the first protective member 13 and the second protective member 15 overlapping the interior area (MA) of the vibration generator 10. For example, the sensor unit 30 may be directly formed on or integrated into the center of the outer surface 13b, 15b of one of the first protective member 13 and the second protective member 15 overlapping the center of the vibration generator 10. In this case, each of the first protective member 13 and the second protective member 15 may include, but is not limited to, a plastic material on which a metal layer can be formed and patterned. For example, each of the first protective member 13 and the second protective member 15 may be, but is not limited to, a polyimide (PI) film or a polyethylene terephthalate (PET) film.

[0179] The sensor unit 30 according to one embodiment of the present specification may be configured in the vibration generator 10. For example, the sensor unit 30 may be configured in the center of the vibration generator 10. For example, the sensor unit 30 may be configured in the exact center of the vibration generator 10. The center of the sensor unit 30 may be located or aligned with the center of the vibration generator 10.

[0180] The sensor unit 30 according to an embodiment of the present specification may include a gauge pattern unit 33, an insulating member 35, and a sensor lead wire 37. For example, each of the gauge pattern unit 33, the insulating member 35, and the sensor lead wire 37 of the sensor unit 30 may include a structure in which the base member 31 is omitted from the sensor unit 30 described with reference to FIG. 3A or 3B.

[0181] The sensor unit 30 according to one embodiment of the present specification is substantially the same as the sensor unit 30 described in FIG. 7, except that it is configured to directly contact the center of the outer surface 13b, 15b of either the first protective member 13 or the second protective member 15 that overlaps the center of the vibration generator 10, and therefore, redundant explanations therefor may be omitted.

[0182] According to one embodiment of the present specification, the gauge pattern portion 33 of the sensor portion 30 may be directly configured or integrated in the center of a surface opposite to a connecting surface of the vibration generator 10 that is connected or coupled to a vibration member via a connecting member. For example, when the first surface (or second surface) of the vibration generator 10 is connected or coupled to a vibration member, the gauge pattern portion 33 of the sensor portion 30 may be directly configured or integrated in the center of the second surface (or first surface) of the vibration generator 10.

[0183] According to one embodiment of the present specification, the sensor lead wire 37 of the sensor unit 30 may be extended to the pad unit 17 of the vibration generator 10. For example, the sensor lead wire 37 may be arranged in parallel with each of the first pad electrode 17a and the second pad electrode 17b of the pad unit 17.

[0184] Such a vibration device according to another embodiment of the present specification can have the same effect as the vibration device described in Figures 9 and 10, and a separate sensor assembly process for attaching or coupling the sensor unit 30 to the vibration generator 10 can be omitted.

[0185] Vibration devices according to other embodiments of the present specification may further include an auxiliary sensor unit configured in the outer area (EA) of vibration generator 10. The auxiliary sensor unit may include first to fourth sensors 30-1, 30-2, 30-3, and 30-4 and / or fifth to seventh sensors 30-5, 30-6, and 30-7 described in FIG. 8. The sensors of the auxiliary sensor unit may be directly configured on or integrated into the outer surface 13b, 15b of either first protective member 13 or second protective member 15 of vibration generator 10, as described in FIG. 7. Therefore, vibration devices according to other embodiments of the present specification may further have the effects of the vibration device described in FIG. 8 by further including an auxiliary sensor unit configured in the outer area (EA) of vibration generator 10.

[0186] Fig. 13 is another cross-sectional view taken along the line CC' shown in Fig. 11. Fig. 13 shows a modification of the sensor unit described with reference to Figs.

[0187] 11 and 13, a vibration device according to another embodiment of the present specification can include a vibration generator 10 and a sensor unit 30.

[0188] The vibration generator 10 is substantially the same as the vibration generator 10 described with reference to FIGS. 1 and 2, and therefore a duplicated description thereof will be omitted.

[0189] The sensor unit 30 may be directly configured or built-in inside the vibration generator 10 corresponding to the inner area (MA) of the vibration generator 10. For example, the sensor unit 30 may be directly configured or integrated on one or more inner surfaces 13a, 15a of the first protective member 13 and the second protective member 15 overlapping the inner area (MA) of the vibration generator 10. For example, the sensor unit 30 may be directly configured or integrated on the center of one or more inner surfaces 13a, 15a of the first protective member 13 and the second protective member 15 overlapping the center of the vibration generator 10. In this case, each of the first protective member 13 and the second protective member 15 may include, but is not limited to, a plastic material on which a metal layer can be formed and patterned. For example, each of the first protective member 13 and the second protective member 15 may be, but is not limited to, a polyimide (PI) film or a polyethylene terephthalate (PET) film.

[0190] The sensor unit 30 according to one embodiment of the present specification may be configured in the vibration generator 10. For example, the sensor unit 30 may be configured in the center of the vibration generator 10. For example, the sensor unit 30 may be configured in the exact center of the vibration generator 10. The center of the sensor unit 30 may be located or aligned with the center of the vibration generator 10.

[0191] The sensor unit 30 according to an embodiment of the present specification may include a gauge pattern unit 33, an insulating member 35, and a sensor lead wire 37. For example, each of the gauge pattern unit 33 and the sensor lead wire 37 of the sensor unit 30 may include a structure in which the base member 31 and the insulating member 35 are omitted from the sensor unit 30 described with reference to FIG. 3A or 3B.

[0192] The gauge pattern portion 33 of the sensor unit 30 according to one embodiment of the present specification is substantially the same as the gauge pattern portion 33 of the sensor unit 30 described in FIG. 6, except that it is configured to directly contact the center of the inner surface 13a, 15a of either the first protective member 13 or the second protective member 15 that overlaps the center of the vibration generator 10, and therefore, redundant description thereof may be omitted.

[0193] The gauge pattern portion 33 of the sensor unit 30 according to other embodiments of this specification is substantially the same as the gauge pattern portion 33 of the sensor unit 30 described in FIG. 6, except that it is configured to directly contact the central portions of the inner surfaces 13a and 15a of the first protective member 13 and the second protective member 15, which overlap the central portion of the vibration generator 10, and therefore, redundant description thereof will be omitted.

[0194] According to one embodiment of the present specification, the gauge pattern portion 33 of the sensor unit 30 formed on the inner surface 13a of the first protective member 13 can be electrically insulated by being covered with the first adhesive layer 12. According to one embodiment of the present specification, the gauge pattern portion 33 of the sensor unit 30 formed on the inner surface 15a of the second protective member 15 can be electrically insulated by being covered with the second adhesive layer 14.

[0195] According to one embodiment of the present specification, the sensor lead wire 37 of the sensor unit 30 may be extended to the pad unit 17 of the vibration generator 10. For example, the sensor lead wire 37 may be arranged in parallel with each of the first pad electrode 17a and the second pad electrode 17b of the pad unit 17.

[0196] Such a vibration device according to another embodiment of the present specification can have the same effect as the vibration device described with reference to FIGS. 11 and 12, and the insulating member of the sensor unit 30 can be omitted.

[0197] Vibration devices according to other embodiments of the present specification may further include an auxiliary sensor unit configured in the outer area (EA) of vibration generator 10. The auxiliary sensor unit may include first to fourth sensors 30-1, 30-2, 30-3, and 30-4 and / or fifth to seventh sensors 30-5, 30-6, and 30-7 described in FIG. 8. The sensors of the auxiliary sensor unit may be directly configured on or integrated into the inner surface 13a, 15a of either one of first protective member 13 and second protective member 15 of vibration generator 10, as described in FIG. 6. Therefore, vibration devices according to other embodiments of the present specification may further have the effects of the vibration device described in FIG. 8 by further including an auxiliary sensor unit configured in the outer area (EA) of vibration generator 10.

[0198] FIG. 14 is a diagram showing a vibration device according to another embodiment of the present specification. FIG. 15 is a cross-sectional view taken along line D-D' in FIG. 14. FIG. 16 is a perspective view showing a vibration part of the vibration structure shown in FIG. 15. FIGS. 1 to 16 show modifications of the vibration structure described in one or more of FIGS. 1, 2, and 4 to 13. Therefore, in the following description, except for the vibration structure and the configuration related thereto, redundant descriptions of the remaining configuration may be omitted or simplified.

[0199] 14 to 16, a vibration device according to another embodiment of the present specification can include a vibration generator 10 and a sensor unit 30.

[0200] The vibration generator 10 according to an embodiment of the present specification may be expressed as, but is not limited to, a flexible vibration structure, a flexible vibrator, a flexible vibration generating element, a flexible vibration generator, a flexible sound generator, a flexible sound element, a flexible sound generating element, a flexible sound generator, a flexible actuator, a flexible speaker, a flexible piezoelectric speaker, a film actuator, a film-type piezoelectric composite actuator, a film speaker, a film-type piezoelectric speaker, or a film-type piezoelectric composite speaker.

[0201] Vibration generator 10 according to one embodiment of the present specification may include vibrating structure 11, first protective member 13, and second protective member 15. Vibration generator 10 (or vibrating structure 11) according to other embodiments of the present specification may include vibrating portion 11a, first electrode portion 11b, and second electrode portion 11c.

[0202] The vibrating unit 11a may include a piezoelectric material, a composite piezoelectric material, or an electroactive material having a piezoelectric effect. The vibrating unit 11a may include an inorganic material and an organic material. For example, the vibrating unit 11a may include a plurality of inorganic material portions made of a piezoelectric material and at least one organic material portion made of a soft material. For example, the vibrating unit 11a may be expressed as, but is not limited to, a vibration layer, a piezoelectric layer, a piezoelectric material layer, a piezoelectric material portion, a piezoelectric vibration layer, a piezoelectric vibration portion, an electroactive layer, an electroactive portion, a displacement portion, a piezoelectric displacement layer, a piezoelectric displacement portion, a sound wave generating layer, a sound wave generating portion, an organic / inorganic material layer, an organic / inorganic material portion, a piezoelectric composite layer, a piezoelectric composite, or a piezoelectric ceramic composite. The vibrating unit 11a may be made of a transparent, translucent, or opaque piezoelectric material, and thus may be transparent, translucent, or opaque.

[0203] The vibrating unit 11a according to the embodiments of the present specification may include a plurality of first portions 11a1 and a plurality of second portions 11a2. For example, the plurality of first portions 11a1 and the plurality of second portions 11a2 may be alternately arranged along a first direction (X) (or a second direction (Y)). For example, the first direction (X) may be the horizontal direction of the vibrating unit 11a, and the second direction (Y) may be the vertical direction of the vibrating unit 11a that intersects with the first direction (X), but is not limited thereto. For example, the first direction (X) may be the vertical direction of the vibrating unit 11a, and the second direction (Y) may be the horizontal direction of the vibrating unit 11a.

[0204] Each of the first portions 11a1 may be made of an inorganic material. The inorganic material may include a piezoelectric material having a piezoelectric effect, a composite piezoelectric material, or an electroactive material. For example, each of the first portions 11a1 may be made of substantially the same piezoelectric material as the vibrating portion 11a described in FIGS. 1 and 2, and therefore the same reference numerals will be used to denote the same piezoelectric material, and redundant description thereof will be omitted.

[0205] Each of the plurality of first portions 11a1 according to the embodiments of the present specification may be disposed between the plurality of second portions 11a2. The plurality of second portions 11a2 may be disposed (or arranged) side by side with the plurality of first portions 11a1 sandwiched therebetween. Each of the plurality of first portions 11a1 may have a first width (W1) parallel to the first direction (X) (or the second direction (Y)) and a length parallel to the second direction (Y) (or the first direction (X)). Each of the plurality of second portions 11a2 may have a second width (W2) parallel to the first direction (X) (or the second direction (Y)) and a length parallel to the second direction (Y) (or the first direction (X)).

[0206] According to embodiments of the present specification, the first width (W1) may be the same as or different from the second width (W2). For example, the first width (W1) may be greater than the second width (W2). The first portions 11a1 may all have the same size, e.g., width, area, or volume. For example, the first portions 11a1 may all have the same size, e.g., width, area, or volume, within a range of process error (or tolerance) that occurs in the manufacturing process. For example, the first portions 11a1 and the second portions 11a2 may include line or stripe shapes having the same or different sizes.

[0207] Therefore, the vibrating unit 11a has a 2-2 composite structure, and thus can have a resonant frequency of 20 kHz or less, but is not limited to this. For example, the resonant frequency of the vibrating unit 11a can be changed depending on at least one of the shape, length, and thickness.

[0208] According to the embodiments of the present specification, each of the plurality of first portions 11a1 and each of the plurality of second portions 11a2 may be arranged (or aligned) next to one another on the same plane (or the same layer). Each of the plurality of first portions 11a1 and each of the plurality of second portions 11a2 may be arranged (or aligned) next to one another on the same plane (or the same layer) and connected or coupled to one another.

[0209] Each of the plurality of second portions 11a2 may be configured to fill a gap between two adjacent first portions 11a1. Each of the plurality of second portions 11a2 may be coupled or bonded to an adjacent first portion 11a1. Each of the plurality of second portions 11a2 may be configured to fill a gap between two adjacent first portions 11a1, thereby being coupled or bonded to an adjacent first portion 11a1. This allows the vibrating portion 11a to be expanded to a desired size or length by side coupling (or coupling) the first portions 11a1 and the second portions 11a2.

[0210] According to an embodiment of the present specification, the width (W2) of each of the plurality of second portions 11a2 may gradually decrease from the middle portion of the vibrating part 11a or the vibration generator 10 toward both edge portions (or both tips).

[0211] According to one embodiment of the present specification, the second portion 11a2 having the largest width (W2) among the plurality of second portions 11a2 may be located in a portion where the greatest stress is concentrated when the vibrating unit 11a or the vibration generator 10 vibrates in the vertical direction (Z) (or thickness direction). The second portion 11a2 having the smallest width (W2) among the plurality of second portions 11a2 may be located in a portion where the least stress is generated when the vibrating unit 11a or the vibration generator 10 vibrates in the vertical direction (Z). For example, the second portion 11a2 having the largest width (W2) among the plurality of second portions 11a2 may be located in a central portion of the vibrating unit 11a, and the second portion 11a2 having the smallest width (W2) among the plurality of second portions 11a2 may be located at both edge portions of the vibrating unit 11a. As a result, when the vibrating unit 11a or the vibration generator 10 vibrates in the vertical direction (Z), interference of sound waves generated at the portion where the greatest stress is concentrated or overlap of resonant frequencies can be minimized, thereby improving the phenomenon of dipping sound pressure generated in the low frequency range and improving the flatness of acoustic characteristics in the low frequency range. For example, the flatness of acoustic characteristics can be the magnitude of the deviation between the maximum sound pressure and the minimum sound pressure.

[0212] According to one embodiment of the present specification, the plurality of first portions 11a1 may have different sizes (or widths). For example, the sizes (or widths) of the plurality of first portions 11a1 may gradually decrease or increase from the middle of the vibrating unit 11a or the vibration generator 10 toward both edge portions (or both ends) of the vibrating unit 11a. As a result, the vibrating unit 11a may have various natural vibration frequencies due to the vibration of the plurality of first portions 11a1 having different sizes, thereby improving the sound pressure characteristics of the sound and expanding the sound reproduction band.

[0213] Each of the plurality of second portions 11a2 may be disposed between the plurality of first portions 11a1. As a result, the vibration energy of the vibrating unit 11a or the vibration generator 10 may be increased by the second portions 11a2 due to the linkage within the unit cell of the first portions 11a1, thereby improving vibration characteristics and ensuring piezoelectric characteristics and flexibility. For example, the second portions 11a2 may be one or more of an epoxy-based polymer, an acrylic-based polymer, and a silicone-based polymer, but are not limited thereto.

[0214] According to an embodiment of the present specification, each of the plurality of second portions 11a2 may be made of an organic material portion. For example, the organic material portion may be disposed between the inorganic material portions to absorb impacts applied to the inorganic material portion (or the first portion) and release stress concentrated in the inorganic material portion, thereby improving the durability of the vibrating portion 11a or the vibration generator 10 and providing flexibility to the vibrating portion 11a or the vibration generator 10.

[0215] According to an embodiment of the present specification, the second portion 11a2 may have a lower modulus (or Young's modulus) and viscoelasticity than the first portion 11a1, thereby improving the reliability of the first portion 11a1, which is vulnerable to impact due to the brittle characteristics of the first portion 11a1. For example, the second portion 11a2 may be made of a material having a loss factor of 0.01 to 1 and a modulus of 0.1 to 10 GPa (Giga Pascal).

[0216] The organic material portion of the second portion 11a2 may include an organic material, an organic polymer, an organic piezoelectric material, or an organic non-piezoelectric material having flexibility compared to the inorganic material portion of the first portion 11a1. For example, the second portion 11a2 may be expressed as, but is not limited to, a flexible adhesive portion, an elastic portion, a bending portion, a damping portion, or a soft portion.

[0217] The vibrating unit 11a according to the embodiments of the present specification may have the shape of a single thin film by arranging (or connecting) a plurality of first portions 11a1 and second portions 11a2 on the same plane. For example, the vibrating unit 11a may have a structure in which a plurality of first portions 11a1 are connected to one side. For example, the plurality of first portions 11a1 may have a structure in which the entire vibrating unit 11a is connected to each other via the second portions 11a2. For example, the vibrating unit 11a may vibrate in the up and down direction due to the first portions 11a1 having vibration characteristics, and may bend into a curved shape due to the second portions 11a2 having flexibility.

[0218] In the vibrating unit 11a according to the embodiments of the present specification, the size of the first portion 11a1 and the size of the second portion 11a2 can be set depending on the piezoelectric characteristics and flexibility required for the vibrating unit 11a or the vibration generator 10. As one embodiment of the present specification, in the case of the vibrating unit 11a that requires piezoelectric characteristics more than flexibility, the size of the first portion 11a1 can be configured larger than the size of the second portion 11a2. As another embodiment of the present specification, in the case of the vibrating unit 11a that requires flexibility more than piezoelectric characteristics, the size of the second portion 11a2 can be configured larger than the size of the first portion 11a1. Therefore, since the size of the vibrating unit 11a can be adjusted depending on the required characteristics, there is an advantage in that the design of the vibrating unit 11a is easy.

[0219] The first electrode unit 11b may be disposed on the first surface (or upper surface) of the vibrating unit 11a. The first electrode unit 11b may be commonly disposed on or coupled to the first surfaces of the first portions 11a1 and the second portions 11a2, and may be electrically connected to the first surfaces of the first portions 11a1. For example, the first electrode unit 11b may have the shape of a single electrode (or a common electrode) disposed over the entire first surface of the vibrating unit 11a. For example, the first electrode unit 11b may have substantially the same shape as the vibrating unit 11a, but is not limited thereto.

[0220] The second electrode portion 11c may be disposed on a second surface (or rear surface) different from (or opposite to) the first surface of the vibrating portion 11a. The second electrode portion 11c may be commonly disposed on or coupled to the second surface of each of the plurality of first portions 11a1 and the second surface of each of the plurality of second portions 11a2, and may be electrically connected to the second surface of each of the plurality of first portions 11a1. For example, the second electrode portion 11c may have the shape of a single electrode (or a common electrode) disposed over the entire second surface of the vibrating portion 11a. For example, the second electrode portion 11c may have the same shape as the vibrating portion 11a, but is not limited thereto.

[0221] The first electrode portion 11b and the second electrode portion 11c according to the embodiments of the present specification may be made of the same piezoelectric material as the first electrode portion 11b and the second electrode portion 11c described in Figures 1 and 2, respectively, and therefore, redundant description thereof may be omitted.

[0222] The first electrode portion 11b can be covered by the first protective member 13 described above. The second electrode portion 11c can be covered by the second protective member 15 described above.

[0223] The vibrating unit 11a may be polarized (or subjected to a polling treatment) by a constant voltage applied to the first electrode unit 11b and the second electrode unit 11c in a constant temperature atmosphere or in a temperature atmosphere that changes from a high temperature to a room temperature, but is not limited thereto. For example, the vibrating unit 11a may be displaced or vibrate by alternately repeating contraction and expansion due to an inverse piezoelectric effect caused by a vibration drive signal (or an acoustic signal or a voice signal) applied from the outside to the first electrode unit 11b and the second electrode unit 11c. For example, the vibrating unit 11a may vibrate by a vertical vibration (d33) and a planar (or horizontal) vibration (d31) caused by the vibration drive signal applied to the first electrode unit 11b and the second electrode unit 11c. The displacement of the vibrating unit 11a may be increased by contraction and expansion in the planar direction, thereby further improving the vibration characteristics.

[0224] The vibration generator 10 according to an embodiment of the present specification may further include a first power supply line (PL1) and a second power supply line (PL2).

[0225] The first power supply line (PL1) may be disposed on the first protective member 13 and electrically connected to the first electrode portion 11b. For example, the first power supply line (PL1) may be disposed on an inner surface 13a of the first protective member 13 facing the first electrode portion 11b and electrically connected to or directly connected to the first electrode portion 11b. The second power supply line (PL2) may be disposed on the second protective member 15 and electrically connected to the second electrode portion 11c. For example, the second power supply line (PL2) may be disposed on an inner surface 15a of the second protective member 15 facing the second electrode portion 11c and electrically connected to or directly connected to the second electrode portion 11c.

[0226] The vibration generator 10 according to an embodiment of the present specification may further include a pad portion 17.

[0227] The pad portion 17 may be configured on an edge portion of one side of either the first protective member 13 or the second protective member 15 so as to be electrically connected to one side (or one end) of each of the first power supply line (PL1) and the second power supply line (PL2).

[0228] The pad part 17 according to one embodiment of the present specification may include a first pad electrode electrically connected to one end of the first power supply line (PL1) and a second pad electrode electrically connected to one end of the second power supply line (PL2).

[0229] The first pad electrode may be disposed on an edge portion on one side of either the first protective member 13 or the second protective member 15, and may be connected to one end of the first power supply line (PL1). For example, the first pad electrode may pass through either the first protective member 13 or the second protective member 15 and be electrically connected to one end of the first power supply line (PL1).

[0230] The second pad electrode may be disposed next to the first pad electrode and connected to one end of the second power supply line (PL2). For example, the second pad electrode may pass through either the first protective member 13 or the second protective member 15 and be electrically connected to one end of the second power supply line (PL2).

[0231] According to an embodiment of the present disclosure, each of the first power supply line (PL1), the second power supply line (PL2), and the pad portion 17 may be configured to be transparent, semi-transparent, or opaque.

[0232] The pad portion 17 according to an embodiment of the present disclosure may be electrically connected to a signal cable 19 .

[0233] The signal cable 19 is electrically connected to the pad unit 17 arranged on the vibration generator 10, and can supply a vibration drive signal (or an acoustic signal or a voice signal) provided from an audio processing circuit (or a vibration drive circuit) to the vibration generator 10. The signal cable 19 according to an embodiment of the present specification may include a first terminal electrically connected to a first pad electrode of the pad unit 17 and a second terminal electrically connected to a second pad electrode of the pad unit 17. For example, the signal cable 19 may be formed of, but is not limited to, a flexible printed circuit cable, a flexible flat cable, a single-sided flexible printed circuit, a single-sided flexible printed circuit board, a flexible multilayer printed circuit, or a flexible multilayer printed circuit board.

[0234] The sensor unit 30 may include one or more sensors 30-1, 30-2, 30-3, and 30-4 configured in the vibration generator 10. For example, the sensor unit 30 is substantially the same as the sensor unit 30 described with reference to FIGS. 1 to 13, and therefore, redundant description thereof may be omitted or simplified.

[0235] According to one embodiment of the present specification, the sensor unit 30 may include one or more sensors 30-1, 30-2, 30-3, and 30-4 configured externally or internally of the vibration generator 10. In one embodiment of the present specification, the sensor unit 30 may include first to fourth sensors 30-1, 30-2, 30-3, and 30-4 configured in an outer area (EA) of the vibration generator 10. This is substantially the same as the sensor unit 30 described with reference to FIGS. 1, 2, and 4 to 7, so a redundant description thereof will be omitted. In another embodiment of the present specification, the sensor unit 30 may include first to fourth sensors 30-1, 30-2, 30-3, and 30-4 configured in corner portions of the vibration generator 10. This is substantially the same as the sensor unit 30 described with reference to FIG. 8, so a redundant description thereof will be omitted.

[0236] According to one embodiment of the present specification, the sensor unit 30 may include first to fourth sensors 30-1, 30-2, 30-3, and 30-4. Each of the first to fourth sensors 30-1, 30-2, 30-3, and 30-4 may include a gauge pattern portion configured to be in direct contact with the inner surface 13a, 15a of one of the first protective member 13 and the second protective member 15 of the vibration generator 10, as described with reference to FIG. 6 or 13. For example, the gauge pattern portion of each of the first to fourth sensors 30-1, 30-2, 30-3, and 30-4 may be made of the same metal material as the first power supply line (PL1) or the second power supply line (PL2), and may be patterned together with the first power supply line (PL1) or the second power supply line (PL2). For example, each of the first to fourth sensors 30-1, 30-2, 30-3, and 30-4 can be covered with one or more of the first adhesive layer 12 and the second adhesive layer 14, thereby being electrically insulated.

[0237] Vibration generator 10 according to another embodiment of the present specification may be realized in the form of a thin film by alternately and repeatedly connecting first portions 11a1 having piezoelectric properties and second portions 11a2 having flexibility. As a result, the flexibility of a vibration device including vibration generator 10 may minimize or prevent damage or breakage due to external impact, thereby improving the reliability of sound reproduction.

[0238] 17A to 17D are perspective views showing a vibrating part of a vibrating structure according to another embodiment of the present specification. The vibrating part described in FIGS. 15 and 16 is modified in FIGS. 17A to 17D. Therefore, in the following description, except for the vibrating part and the related components, redundant descriptions of the remaining components may be omitted or simplified.

[0239] Referring to FIG. 17A, a vibrating portion 11a according to another embodiment of the present specification may include a plurality of first portions 11a1 spaced apart from each other along a first direction (X) and a second direction (Y), and a second portion 11a2 arranged between the plurality of first portions 11a1.

[0240] The plurality of first portions 11a1 may be arranged to be spaced apart from one another along the first direction (X) and the second direction (Y). For example, the plurality of first portions 11a1 may have hexahedral shapes of the same size and be arranged in a lattice pattern. Each of the plurality of first portions 11a1 may be made of substantially the same piezoelectric material as the vibrating unit 11a described in FIGS. 1 and 2 or the first portion 11a1 described in FIGS. 14 to 16, and therefore the same reference numerals will be used therefor, and redundant description thereof will be omitted.

[0241] The second portion 11a2 may be disposed between the first portions 11a1 along each of the first direction (X) and the second direction (Y). The second portion 11a2 may be connected to or bonded to the adjacent first portions 11a1 by filling the gap between two adjacent first portions 11a1 or surrounding each of the first portions 11a1. According to one embodiment of the present specification, the width of the second portion 11a2 disposed between two adjacent first portions 11a1 along the first direction (X) may be the same as or different from the width of the first portions 11a1, and the width of the second portion 11a2 disposed between two adjacent first portions 11a1 along the second direction (Y) may be the same as or different from the width of the first portions 11a1. The second portion 11a2 may be made of substantially the same organic material as the second portion 11a2 described in FIGS. 14 to 16, and therefore, the same reference numerals will be used and redundant description thereof will be omitted.

[0242] The vibrating unit 11a according to the other embodiments of this specification may have a resonant frequency of 30 MHz or less by including a 1-3 composite structure having piezoelectric characteristics of the 1-3 vibration mode, but is not limited thereto. For example, the resonant frequency of the vibrating unit 11a may be changed depending on at least one of the shape, length, and thickness.

[0243] Referring to FIG. 17B, a vibrating portion 11a according to another embodiment of the present specification may include a plurality of first portions 11a1 spaced apart from each other along a first direction (X) and a second direction (Y), and a second portion 11a2 arranged between the plurality of first portions 11a1.

[0244] Each of the plurality of first portions 11a1 may have a circular planar structure. For example, each of the plurality of first portions 11a1 may have a disk shape, but is not limited thereto. For example, each of the plurality of first portions 11a1 may have a point shape, including an oval shape, a polygonal shape, or a doughnut shape. Each of the plurality of first portions 11a1 may be made of substantially the same piezoelectric material as the vibrating portion 11a described in FIGS. 1 and 2 or the first portion 11a1 described in FIGS. 14 to 16, and therefore, the same reference numerals will be used therefor, and redundant description thereof will be omitted.

[0245] The second portion 11a2 may be disposed between the first portions 11a1 along each of the first direction (X) and the second direction (Y). The second portion 11a2 may be configured to surround each of the first portions 11a1, and thereby connected to or bonded to each side of the first portions 11a1. The first portions 11a1 and the second portions 11a2 may be disposed (or arranged) side by side on the same plane (or the same layer). For example, the second portion 11a2 may be made of substantially the same organic material as the second portion 11a2 described in FIGS. 14 to 16, and therefore the same reference numerals will be used to denote the second portion 11a2, and redundant description thereof will be omitted.

[0246] Referring to FIG. 17C, in a vibration generator 10 according to another embodiment of the present specification, the vibrating portion 11a may include a plurality of first portions 11a1 spaced apart from each other along a first direction (X) and a second direction (Y), and a second portion 11a2 arranged between the plurality of first portions 11a1.

[0247] Each of the plurality of first portions 11a1 may have a triangular planar structure. For example, each of the plurality of first portions 11a1 may have a triangular plate shape. Each of the plurality of first portions 11a1 may be made of substantially the same piezoelectric material as the vibrating unit 11a described with reference to FIGS. 1 and 2 or the first portion 11a1 described with reference to FIGS. 14 to 16, and therefore, redundant description thereof will be omitted.

[0248] According to one embodiment of the present specification, four adjacent first portions 11a1 among the plurality of first portions 11a1 may be arranged adjacent to each other to form a square shape (or a regular square shape). Each vertex of the four adjacent first portions 11a1 forming the square shape may be arranged adjacent to the center (or the exact center) of the square shape.

[0249] The second portion 11a2 may be disposed between the first portions 11a1 along each of the first direction (X) and the second direction (Y). The second portion 11a2 may be configured to surround each of the first portions 11a1, and thereby connected to or bonded to each side of the first portions 11a1. The first portions 11a1 and the second portions 11a2 may be disposed (or arranged) side by side on the same plane (or the same layer). For example, the second portion 11a2 may be made of substantially the same organic material as the second portion 11a2 described in FIGS. 14 to 16, and therefore the same reference numerals will be used to denote the second portion 11a2, and redundant description thereof will be omitted.

[0250] Referring to FIG. 17D, in a vibration generator 10 according to another embodiment of the present specification, the vibration portion 11a may include a plurality of first portions 11a1 spaced apart from each other along a first direction (X) and a second direction (Y), and a second portion 11a2 arranged between the plurality of first portions 11a1.

[0251] Each of the plurality of first portions 11a1 may have a triangular planar structure. For example, each of the plurality of first portions 11a1 may have a triangular plate shape. Each of the plurality of first portions 11a1 may be made of substantially the same piezoelectric material as the vibrating unit 11a described with reference to FIGS. 1 and 2 or the first portion 11a1 described with reference to FIGS. 14 to 16, and therefore, redundant description thereof will be omitted.

[0252] According to one embodiment of the present specification, six adjacent first portions 11a1 among the plurality of first portions 11a1 may be arranged adjacent to each other to form a hexagonal shape (or a regular hexagonal shape). Each vertex of the six adjacent first portions 11a1 forming the hexagonal shape may be arranged adjacent to the center (or the exact center) of the hexagonal shape.

[0253] The second portion 11a2 may be disposed between the first portions 11a1 along each of the first direction (X) and the second direction (Y). The second portion 11a2 may be configured to surround each of the first portions 11a1, and thereby connected to or bonded to each side of the first portions 11a1. The first portions 11a1 and the second portions 11a2 may be disposed (or arranged) side by side on the same plane (or the same layer). For example, the second portion 11a2 may be made of substantially the same organic material as the second portion 11a2 described in FIGS. 14 to 16, and therefore the same reference numerals will be used to denote the second portion 11a2, and redundant description thereof will be omitted.

[0254] Fig. 18 is a diagram showing a vibration generator according to another embodiment of the present specification. Fig. 19 is a cross-sectional view taken along line E-E' in Fig. 18. Figs. 18 and 19 show modifications of the vibrating structure described in Figs. 14 to 16. Therefore, in the following description, except for the vibrating structure and the configuration related thereto, redundant descriptions of the remaining configuration may be omitted or simplified.

[0255] 18 and 19, a vibration device according to another embodiment of the present specification can include a vibration generator 10 and a sensor unit 30.

[0256] A vibration generator 10 according to an embodiment of the present specification may include a first vibrating structure 11-1, a second vibrating structure 11-2, a first protective member 13, and a second protective member 15.

[0257] The first and second vibrating structures 11-1 and 11-2 may be electrically separated and spaced apart from each other along the first direction (X). For example, the first and second vibrating structures 11-1 and 11-2 may be a vibrating array, a vibration generating array, a divided vibrating array, a partial vibrating array, a divided vibrating structure, a partial vibrating structure, an individual vibrating structure, a vibrating module, a vibrating module array section, or a vibrating array structure, but are not limited to these terms.

[0258] Each of the first and second vibrating structures 11-1 and 11-2 can vibrate by alternately or repeatedly contracting and expanding due to the piezoelectric effect. For example, the first and second vibrating structures 11-1 and 11-2 can be arranged or tiled at a fixed interval (D1) along a first direction (X). Thus, the vibration generator 10 in which the first and second vibrating structures 11-1 and 11-2 are tiled can be a vibrating film, a displacement generator, a displacement film, a displacement structure, an acoustic generating structure, an acoustic generator, a tiling vibrating array, a tiling array module, or a tiling vibrating film, but is not limited to these terms.

[0259] Each of the first and second vibrating structures 11-1 and 11-2 according to the embodiments of the present specification may have a rectangular shape. For example, each of the first and second vibrating structures 11-1 and 11-2 may have a rectangular shape with a width of 5 cm or more. For example, each of the first and second vibrating structures 11-1 and 11-2 may have a square shape with a size of 5 cm x 5 cm or more, but is not limited thereto.

[0260] Each of the first and second vibrating structures 11-1, 11-2 is arranged on the same plane or tiled, so that the vibration generator 10 can be made large in area by tiling the first and second vibrating structures 11-1, 11-2, which have relatively small dimensions.

[0261] The first and second vibrating structures 11-1 and 11-2 may be arranged at regular intervals or tiled to form a single vibrating device (or a single vibrating device) that is not driven independently but driven as a complete single unit. According to one embodiment of the present specification, the first separation distance (D1) between the first and second vibrating structures 11-1 and 11-2 in the first direction (X) may be, but is not limited to, 0.1 mm or more and less than 3 cm.

[0262] According to an embodiment of the present specification, the first and second vibrating structures 11-1 and 11-2 can be arranged or tiled to have a separation (or gap) (D1) of 0.1 mm or more and less than 3 cm, so that they can be driven as a single vibrating device, and the reproduction band and sound pressure characteristics of the sound generated in conjunction with the single-body vibration of the first and second vibrating structures 11-1 and 11-2 can be increased. For example, in order to increase the reproduction band of the sound generated in conjunction with the single-body vibration of the first and second vibrating structures 11-1 and 11-2 and to increase the sound pressure characteristics of low-frequency sound, for example, below 500 Hz, the first and second vibrating structures 11-1 and 11-2 can be arranged with a gap (D1) of 0.1 mm or more and less than 5 mm.

[0263] According to one embodiment of the present specification, when the first and second vibrating structures 11-1 and 11-2 are arranged with a gap (D1) of less than 0.1 mm or no gap (D1), the reliability of the first and second vibrating structures 11-1 and 11-2 or the vibration generator 10 may be reduced due to cracks or breakage caused by physical contact between the first and second vibrating structures 11-1 and 11-2 when they vibrate.

[0264] According to one embodiment of the present specification, when the first and second vibrating structures 11-1 and 11-2 are spaced apart (D1) by 3 cm or more, the first and second vibrating structures 11-1 and 11-2 may not be driven as a single vibrating device due to their independent vibrations. This may result in a reduction in the reproduction frequency band and sound pressure characteristics of the sound generated by the vibration of the first and second vibrating structures 11-1 and 11-2. For example, when the first and second vibrating structures 11-1 and 11-2 are spaced apart (D1) by 3 cm or more, the acoustic characteristics and sound pressure characteristics in the low frequency band, for example, below 500 Hz, may be reduced.

[0265] According to one embodiment of the present specification, when the first and second vibrating structures 11-1, 11-2 are arranged at a distance (D1) of 5 mm, the first and second vibrating structures 11-1, 11-2 are not driven as a single vibrating device, and therefore the acoustic characteristics and sound pressure characteristics may be reduced in the low frequency range, for example, below 200 Hz.

[0266] According to another embodiment of the present specification, when the first and second vibrating structures 11-1 and 11-2 are spaced apart by 1 mm (D1), the first and second vibrating structures 11-1 and 11-2 vibrate as a single vibrating device, thereby expanding the sound reproduction band and increasing the sound pressure characteristics in the low-frequency range, for example, at frequencies below 500 Hz. For example, when the first and second vibrating structures 11-1 and 11-2 are spaced apart by 1 mm (D1), the vibration generator 10 can be realized as a large-area vibrating body by optimizing the separation distance (D1) between the first and second vibrating structures 11-1 and 11-2. As a result, the first and second vibrating structures 11-1 and 11-2 can be driven as a large-area vibrating body by single-body vibration, and as a result, the sound reproduction band and the acoustic characteristics and sound pressure characteristics in the low-frequency range generated in conjunction with the large-area vibration of the vibration generator 10 can be increased or improved.

[0267] Therefore, in order to realize the single-body vibration of the first and second vibrating structures 11-1, 11-2 (or one vibrating device), the separation distance (D1) between the first and second vibrating structures 11-1, 11-2 may be set to 0.1 mm or more and less than 3 cm. Also, in order to realize the single-body vibration of the first and second vibrating structures 11-1, 11-2 (or one vibrating device) and increase the sound pressure characteristics of the low-frequency sound, the separation distance (D1) between the first and second vibrating parts 11-1, 11-2 may be set to 0.1 mm or more and less than 5 mm.

[0268] Each of the first and second vibrating structures 11-1 and 11-2 according to an embodiment of the present specification may include a vibrating portion 11a, a first electrode portion 11b, and a second electrode portion 11c.

[0269] The vibrating portion 11a may be made of a ceramic material capable of achieving relatively high vibration. For example, the vibrating portion 11a may have a 1-3 composite structure having piezoelectric characteristics in a 1-3 vibration mode, or a 2-2 composite structure having piezoelectric characteristics in a 2-2 vibration mode. For example, the vibrating portion 11a may include a first portion 11a1 and a second portion 11a2 similar to the vibrating portion 11a described in FIGS. 15 and 16, or similar to the vibrating portion 11a described in any one of the vibrating portions 11a described in FIGS. 17A to 17D. Therefore, the same reference numerals are used to denote the first portion 11a1 and the second portion 11a2, and redundant description thereof will be omitted.

[0270] According to one embodiment of the present specification, the first vibrating structure 11-1 may include any one of the vibrating parts 11a described in Figures 15, 16, and 17A to 17D. The second vibrating structure 11-2 may include a vibrating part 11a that is the same as or different from the vibrating part 11a of the first vibrating structure 11-1 among the vibrating parts 11a described in Figures 15, 16, and 17A to 17D.

[0271] According to one embodiment of the present specification, the vibrating portion 11a may be made of a transparent, semi-transparent, or opaque piezoelectric material, and therefore may be transparent, semi-transparent, or opaque.

[0272] The first electrode portion 11b is disposed on a first surface of the corresponding vibrating portion 11a and may be electrically coupled to the first surface of the vibrating portion 11a. The first electrode portion 11b is substantially the same as the first electrode portion 11b described in FIG. 15, and therefore the same reference numerals are used to denote the first electrode portion 11b, and redundant description thereof will be omitted.

[0273] The second electrode portion 11c is disposed on the second surface of the corresponding vibrating portion 11a and may be electrically coupled to the second surface of the vibrating portion 11a. The second electrode portion 11c is substantially the same as the second electrode portion 11c described in FIG. 15, and therefore the same reference numerals are used to denote the second electrode portion 11c, and redundant description thereof will be omitted.

[0274] The vibration generator 10 according to an embodiment of the present specification may further include a first protective member 13 and a second protective member 15.

[0275] First protective member 13 can be arranged on the first surface of vibration generator 10. For example, first protective member 13 can be commonly connected to the first surfaces of first and second vibrating structures 11-1 and 11-2 or commonly support the first surfaces of first and second vibrating structures 11-1 and 11-2 by covering first electrode portions 11b arranged on the first surfaces of first and second vibrating structures 11-1 and 11-2. In this way, first protective member 13 can protect the first surfaces or first electrode portions 11b of first and second vibrating structures 11-1 and 11-2.

[0276] The second protective member 15 may be disposed on the second surface of the vibration generator 10. For example, the second protective member 15 may cover the second electrode portions 11c disposed on the second surfaces of the first and second vibratory structures 11-1 and 11-2, thereby being commonly connected to the second surfaces of the first and second vibratory structures 11-1 and 11-2 or commonly supporting the second surfaces of the first and second vibratory structures 11-1 and 11-2. In this way, the second protective member 15 can protect the second surfaces or the second electrode portions 11c of the first and second vibratory structures 11-1 and 11-2.

[0277] According to an embodiment of the present specification, each of the first protective member 13 and the second protective member 15 may include, but is not limited to, one or more of plastic, fiber, and wood. For example, each of the first protective member 13 and the second protective member 15 may include the same or different materials. For example, each of the first protective member 13 and the second protective member 15 may be, but is not limited to, a polyimide (PI) film or a polyethylene terephthalate (PET) film.

[0278] The first protective member 13 according to an embodiment of the present specification may be disposed on the first surfaces of the first and second vibrating structures 11-1 and 11-2 via the first adhesive layer 12. For example, the first protective member 13 may be disposed directly on the first surfaces of the first and second vibrating structures 11-1 and 11-2 by a film lamination process using the first adhesive layer 12 as an intermediary. Therefore, the first and second vibrating structures 11-1 and 11-2 may be integrated with (or disposed on) or tiled to the first protective member 13 so as to have a certain interval (D1) therebetween.

[0279] The second protective member 15 according to one embodiment of the present specification may be disposed on the second surfaces of the first and second vibrating structures 11-1 and 11-2 via the second adhesive layer 14. For example, the second protective member 15 may be disposed directly on the second surfaces of the first and second vibrating structures 11-1 and 11-2 by a film lamination process using the second adhesive layer 14 as an intermediary. Therefore, the first and second vibrating structures 11-1 and 11-2 may be integrated with (or disposed on) or tiled to the second protective member 15 so as to have a certain interval (D1). For example, the vibration generator 10 may be realized with a single film using the first protective member 13 and the second protective member 15.

[0280] The first adhesive layer 12 may be disposed between the first and second vibrating structures 11-1 and 11-2 and on the first surfaces of the first and second vibrating structures 11-1 and 11-2. For example, the first adhesive layer 12 may be formed on an inner surface 13a of the first protective member 13 facing the first surfaces of the first and second vibrating structures 11-1 and 11-2, filling the space between the first and second vibrating structures 11-1 and 11-2, and being disposed between the first protective member 13 and the first surfaces of the first and second vibrating structures 11-1 and 11-2.

[0281] The second adhesive layer 14 may be disposed between the first and second vibrating structures 11-1 and 11-2 and on the second surfaces of the first and second vibrating structures 11-1 and 11-2. For example, the second adhesive layer 14 may be formed on an inner surface 15a of the second protective member 15 facing the second surfaces of the first and second vibrating structures 11-1 and 11-2, filling the space between the first and second vibrating structures 11-1 and 11-2, and being disposed between the second protective member 15 and the second surfaces of the first and second vibrating structures 11-1 and 11-2.

[0282] The first and second adhesive layers 12, 14 may be interconnected or bonded between the first and second vibrating structures 11-1, 11-2, such that each of the first and second vibrating structures 11-1, 11-2 may be surrounded by the first and second adhesive layers 12, 14. For example, the first and second adhesive layers 12, 14 may be configured between the first protective member 13 and the second protective member 15 so as to completely surround each of the first and second vibrating structures 11-1, 11-2. For example, each of the first and second vibrating structures 11-1, 11-2 may be embedded or built-in between the first adhesive layer 12 and the second adhesive layer 14.

[0283] According to an embodiment of the present disclosure, each of the first and second adhesive layers 12, 14 may include an electrically insulating material that is compressible and resilient while maintaining adhesive properties. For example, each of the first and second adhesive layers 12, 14 may include, but is not limited to, an epoxy-based polymer, an acrylic-based polymer, a silicone-based polymer, or a urethane-based polymer. For example, each of the first and second adhesive layers 12, 14 may be configured to be transparent, translucent, or opaque.

[0284] A vibration generator 10 according to another embodiment of the present specification may further include a first power supply line (PL1) arranged on the first protective member 13, a second power supply line (PL2) arranged on the second protective member 15, and a pad portion 17 electrically coupled to the first power supply line (PL1) and the second power supply line (PL2).

[0285] The first power supply line (PL1) may be disposed on an inner surface 13a of the first protective member 13 facing the first surfaces of the first and second vibrating structures 11-1 and 11-2, respectively. The first power supply line (PL1) may be electrically coupled to or directly connected to the first electrode portions 11b of the first and second vibrating structures 11-1 and 11-2.

[0286] The first power supply line (PL1) according to an embodiment of the present specification may include first and second power supply lines (PL11, PL12) arranged along the second direction (Y). For example, the first power supply line (PL11) may be electrically coupled to the first electrode portion 11b of the first vibrating structure 11-1. The first and second power supply lines (PL12) may be electrically coupled to the first electrode portion 11b of the second vibrating structure 11-2.

[0287] The second power supply line (PL2) may be disposed on an inner surface 15a of the second protective member 15 facing the second surfaces of the first and second vibrating structures 11-1 and 11-2, respectively. The second power supply line (PL2) may be electrically coupled to or directly connected to the second electrode portions 11c of the first and second vibrating structures 11-1 and 11-2, respectively.

[0288] The second power supply line (PL2) according to an embodiment of the present specification may include 2-1 and 2-2 lower power lines (PL21, PL22) arranged along the second direction (Y). For example, the 2-1 power line (PL21) may be electrically coupled to the second electrode portion 11c of the first vibrating structure 11-1. For example, the 2-1 power line (PL21) and the 1-1 power line (PL11) may not overlap each other but may cross each other. The 2-2 power line (PL22) may be electrically coupled to the second electrode portion 11c of the second vibrating structure 11-2. For example, the 2-2 power line (PL22) and the 1-2 power line (PL12) may not overlap each other but may cross each other.

[0289] The pad portion 17 may be configured on an edge portion of one side of either the first protective member 13 or the second protective member 15 so as to be electrically coupled to one side (or one end) of each of the first power supply line (PL1) and the second power supply line (PL2).

[0290] The pad section 17 according to one embodiment of the present specification may include a first pad electrode electrically coupled to one end of the first power supply line (PL1) and a second pad electrode electrically coupled to one end of the second power supply line (PL2).

[0291] The first pad electrode may be commonly coupled to one end of each of the 1-1 and 1-2 power supply lines (PL11, PL12) of the first power supply line (PL1). For example, one end of each of the 1-1 and 1-2 power supply lines (PL11, PL12) may branch off from the first pad electrode. The second pad electrode may be commonly coupled to one end of each of the 2-1 and 2-2 power supply lines (PL21, PL22) of the second power supply line (PL2). For example, one end of each of the 2-1 and 2-2 power supply lines (PL21, PL22) may branch off from the second pad electrode.

[0292] The vibration generator 10 according to another embodiment of the present disclosure may further include a signal cable 19 .

[0293] The signal cable 19 is electrically connected to the pad unit 17 arranged on the vibration generator 10, and can supply a vibration drive signal (or an acoustic signal or a voice signal) provided from a vibration drive circuit (or an acoustic processing circuit) to the vibration generator 10. The signal cable 19 according to an embodiment of the present specification may include a first terminal electrically coupled to a first pad electrode of the pad unit 17 and a second terminal electrically coupled to a second pad electrode of the pad unit 17. For example, the signal cable 19 may be formed of, but is not limited to, a flexible printed circuit cable, a flexible flat cable, a single-sided flexible printed circuit, a single-sided flexible printed circuit board, a flexible multilayer printed circuit, or a flexible multilayer printed circuit board.

[0294] Such vibration generator 10 according to other embodiments of the present specification can have the same effects as vibration generator 10 described with reference to Figures 1 to 17D. Furthermore, vibration generator 10 according to other embodiments of the present specification can be driven as a large-area vibrating body by single-body vibration of first and second vibrating structures 11-1 and 11-2, by including first and second vibrating structures 11-1 and 11-2 that are arranged (or tiled) at a constant interval (D1) so as to be realized as one single vibrating body without being driven independently.

[0295] Figure 20 is a diagram showing a vibration device according to another embodiment of the present specification. Figure 20 shows the vibration generator shown in Figures 18 and 19 configured with four vibration structures. Therefore, in the following description, except for the four vibration structures and their associated components, the remaining components will be given the same reference numerals, and redundant description thereof will be omitted. The cross section taken along line E-E' in Figure 20 is shown in Figure 19.

[0296] Combining FIG. 20 with FIG. 19, vibration generator 10 according to other embodiments of the present specification may include a plurality of vibrating structures 11-1, 11-2, 11-3, and 11-4 or first to fourth vibrating structures 11-1, 11-2, 11-3, and 11-4.

[0297] The multiple vibrating structures 11-1, 11-2, 11-3, and 11-4 may be arranged electrically separated from one another along the first direction (X) and the second direction (Y). For example, the multiple vibrating structures 11-1, 11-2, 11-3, and 11-4 may be arranged or tiled in an i x j pattern on the same plane, thereby enabling the vibration generator 10 to have a large area by tiling the multiple vibrating structures 11-1, 11-2, 11-3, and 11-4, which have relatively small sizes. For example, i is the number of vibrating structures arranged along the first direction (X) and is a natural number of 2 or greater, and j is the number of vibrating structures arranged along the second direction (Y) and may be the same or different natural number of 2 or greater. For example, each of the multiple vibration structures 11-1, 11-2, 11-3, and 11-4 may be arranged or tiled in a 2 x 2 pattern, but is not limited to this. In the following description, it is assumed that the vibration generator 10 includes first to fourth vibration structures 11-1, 11-2, 11-3, and 11-4.

[0298] According to one embodiment of the present specification, the first and second vibrating structures 11-1 and 11-2 may be spaced apart from each other along the first direction (X). The third and fourth vibrating structures 11-3 and 11-4 may be spaced apart from each other along the first direction (X) and from the first and second vibrating structures 11-1 and 11-2 along the second direction (Y). The first and third vibrating structures 11-1 and 11-3 may face each other and be spaced apart from each other along the second direction (Y). The second and fourth vibrating structures 11-2 and 11-4 may face each other and be spaced apart from each other along the second direction (Y).

[0299] Vibration generator 10 according to another embodiment of the present specification may further include first protective member 13 and second protective member 15.

[0300] The first to fourth vibrating structures 11-1, 11-2, 11-3, and 11-4 may be disposed between the first protective member 13 and the second protective member 15. For example, the first protective member 13 and the second protective member 15 may connect the first to fourth vibrating structures 11-1, 11-2, 11-3, and 11-4 or support them in common, thereby driving the first to fourth vibrating structures 11-1, 11-2, 11-3, and 11-4 as one vibrating device (or a single vibrating device). For example, the first to fourth vibrating structures 11-1, 11-2, 11-3, and 11-4 may be driven as one vibrating device (or a single vibrating device) by tiling them at regular intervals on the protective members 13 and 15.

[0301] According to one embodiment of the present specification, as described with reference to Figures 18 and 19, the first to fourth vibrating structures 11-1, 11-2, 11-3, and 11-4 may be arranged (or tiled) at intervals of 0.1 mm or more and less than 3 cm along each of the first direction (X) and the second direction (Y) for complete single-body vibration or large-area vibration, and may be arranged (or tiled) at intervals (D1, D2) of 0.1 mm or more and less than 5 mm.

[0302] Each of the first to fourth vibrating structures 11-1, 11-2, 11-3, and 11-4 can include a vibrating portion 11a, a first electrode portion 11b, and a second electrode portion 11c.

[0303] The vibrating portion 11a may be made of a ceramic material capable of achieving relatively high vibration. For example, the vibrating portion 11a may have a 1-3 composite structure having piezoelectric characteristics in a 1-3 vibration mode, or a 2-2 composite structure having piezoelectric characteristics in a 2-2 vibration mode. For example, the vibrating portion 11a may be the same as the vibrating portion 11a described in FIGS. 15 and 16, or may include a first portion 11a1 and a second portion 11a2 similar to the vibrating portion 11a described in any one of FIGS. 17A to 17D. Therefore, the same reference numerals are used to denote the same portions, and redundant description thereof will be omitted.

[0304] According to one embodiment of the present specification, each of the first to fourth vibrating structures 11-1, 11-2, 11-3, and 11-4 may include any one of the vibrating parts 11a described in Figures 15, 16, and 17A to 17D.

[0305] According to other embodiments of the present specification, one or more of the first to fourth vibrating structures 11-1, 11-2, 11-3, and 11-4 may include a different vibrating portion 11a from the vibrating portions 11a described in Figures 15, 16, and 17A to 17D.

[0306] The first electrode portion 11b is disposed on a first surface of the corresponding vibrating portion 11a and may be electrically coupled to the first surface of the vibrating portion 11a. The first electrode portion 11b is substantially the same as the first electrode portion 11b described in FIG. 15, and therefore the same reference numerals are used to denote the first electrode portion 11b, and redundant description thereof will be omitted.

[0307] The second electrode portion 11c is disposed on the second surface of the corresponding vibrating portion 11a and may be electrically coupled to the second surface of the vibrating portion 11a. The second electrode portion 11c is substantially the same as the second electrode portion 11c described in FIG. 15, and therefore the same reference numerals are used to denote the second electrode portion 11c, and redundant description thereof will be omitted.

[0308] According to one embodiment of the present specification, the first and second adhesive layers 12 and 14 may be connected or bonded to each other between the first to fourth vibrating structures 11-1, 11-2, 11-3, and 11-4. As a result, each of the first to fourth vibrating structures 11-1, 11-2, 11-3, and 11-4 may be surrounded by the first and second adhesive layers 12 and 14. For example, the first and second adhesive layers 12 and 14 may be configured between the first protective member 13 and the second protective member 15 so as to completely surround each of the first to fourth vibrating structures 11-1, 11-2, 11-3, and 11-4. For example, each of the first to fourth vibrating structures 11-1, 11-2, 11-3, and 11-4 may be embedded or built-in between the first adhesive layer 12 and the second adhesive layer 14.

[0309] A vibration generator 10 according to another embodiment of the present specification may further include a first power supply line (PL1), a second power supply line (PL2), and a pad unit 17.

[0310] The first power supply line (PL1) and the second power supply line (PL2) are substantially the same as the first power supply line (PL1) and the second power supply line (PL2), respectively, described in Figures 18 and 19, except for the electrical coupling structures with the first to fourth vibration structures 11-1, 11-2, 11-3, and 11-4. Therefore, in the following explanation, only the electrical coupling structures between the first power supply line (PL1) and the second power supply line (PL2), respectively, and the first to fourth vibration structures 11-1, 11-2, 11-3, and 11-4 can be briefly explained.

[0311] The first power supply line (PL1) according to the embodiment of the present specification may include a first-1 power supply line (PL11) and a first-2 power supply line (PL12) arranged along the second direction (Y). For example, the first-1 power supply line (PL11) may be electrically coupled to the first electrode portions 11b of the first and third vibrating structures 11-1 and 11-3 (or a first group or a first vibrating structure group) arranged in a first row parallel to the second direction (Y) among the first to fourth vibrating structures 11-1, 11-2, 11-3, and 11-4. For example, the first-2 power supply line (PL12) can be electrically coupled to the first electrode portions 11b of the second and fourth vibrating structures 11-2, 11-4 (or the second group, or the second vibrating structure group) among the first to fourth vibrating structures 11-1, 11-2, 11-3, 11-4, which are arranged in a second row parallel to the second direction (Y).

[0312] The second power supply line (PL2) according to the embodiment of the present specification may include a 2-1 power supply line (PL21) and a 2-2 power supply line (PL22) arranged along the second direction (Y). For example, the 2-1 power supply line (PL21) may be electrically coupled to the second electrode portions 11c of the first and third vibrating structures 11-1 and 11-3 (or a first group or a first vibrating structure group) arranged in a first row parallel to the second direction (Y) among the first to fourth vibrating structures 11-1, 11-2, 11-3, and 11-4. For example, the 2-2 power supply line (PL22) can be electrically coupled to the second electrode portions 11c of the second and fourth vibrating structures 11-2, 11-4 (or the second group, or the second vibrating structure group) among the first to fourth vibrating structures 11-1, 11-2, 11-3, 11-4, which are arranged in a second row parallel to the second direction (Y).

[0313] The pad section 17 may be formed on one side edge of either the first protective member 13 or the second protective member 15 so as to be electrically connected to one side (or one end) of each of the first power supply line (PL1) and the second power supply line (PL2). Since the pad section 17 is substantially the same as the pad section 17 described with reference to Figures 18 and 19, the same reference numerals will be used to denote the pad section 17, and redundant description thereof will be omitted.

[0314] Such vibration generator 10 according to the other embodiments of the present specification can have the same effects as vibration generator 10 described with reference to FIGS. 14 to 17D. Furthermore, vibration generator 10 according to other embodiments of this specification includes first to fourth vibrating structures 11-1, 11-2, 11-3, and 11-4 that are arranged (or tiled) at regular intervals (D1, D2) so that they are realized as one single vibrating body without being driven independently, and can thereby be driven as a large-area vibrating body by the single-body vibration of first to fourth vibrating structures 11-1, 11-2, 11-3, and 11-4.

[0315] FIG. 21 is a block diagram illustrating a vibration drive circuit of a vibration device according to one embodiment of the present specification.

[0316] Referring to FIG. 21, the vibration device according to an embodiment of the present specification may further include a vibration drive circuit 50.

[0317] The vibration drive circuit 50 may be electrically coupled to each of the vibration generator 10 and the sensor unit 30. For example, the vibration drive circuit 50 may be electrically coupled to each of the vibration generator 10 and the sensor unit 30 via a signal cable. For example, the vibration generator 10 and the sensor unit 30 are substantially the same as the vibration generator 10 and the sensor unit 30, respectively, described with reference to FIGS. 1 to 20, and therefore the same reference numerals are used therefor, and redundant description thereof may be omitted.

[0318] The vibration drive circuit 50 supplies a vibration drive signal to the vibration generator 10, senses changes in the electrical characteristics of the sensor unit 30 to generate sensing data, and can correct the vibration drive signal supplied to the vibration generator 10 based on the sensing data.

[0319] The vibration driver circuit 50 (or acoustic processing circuit) according to one embodiment of the present specification may include a signal generating circuit section 51, a sensing circuit section 53, and a control circuit section 55.

[0320] The signal generating circuit section 51 can convert the vibration data (or acoustic data) supplied from the control circuit section 55 into a vibration drive signal (or acoustic signal) and supply it to the vibration generator 10.

[0321] The signal generating circuit unit 51 according to one embodiment of the present specification may include a digital-to-analog conversion circuit that converts vibration data supplied from the control circuit unit 55 into analog vibration data, and an amplifier circuit having one or more operational amplifiers that amplify the analog vibration data to generate a vibration drive signal. For example, the amplifier circuit may amplify the analog sound data based on a gain value set in the one or more operational amplifiers to generate a vibration drive signal. For example, the gain value may be a parameter for setting or varying a reference voltage supplied to the one or more operational amplifiers.

[0322] According to one embodiment of the present specification, the vibration drive signal may include a first vibration drive signal and a second vibration drive signal. For example, the first vibration drive signal may be one of a positive (+) vibration drive signal and a negative (-) vibration drive signal, and the second vibration drive signal may be one of a positive (+) vibration drive signal and a negative (-) vibration drive signal.

[0323] The sensing circuit unit 53 can sense a change in the electrical characteristics of the sensor unit 30 and generate sensing data.

[0324] The sensing circuit unit 53 according to an embodiment of the present specification may generate sensing data by sensing a change in the electrical characteristics of the sensor unit 30 using a bridge circuit electrically coupled to the sensor unit 30. For example, in the sensing circuit unit 53, the bridge circuit electrically coupled to the sensor unit 30 may be, but is not limited to, a quarter-bridge circuit, a half-bridge circuit, or a full-bridge circuit.

[0325] The control circuit unit 55 can generate vibration data based on an acoustic source supplied from the host system and provide the vibration data to the signal generation circuit unit 51. For example, the control circuit unit 55 can generate vibration data for one or more channels based on an acoustic source and provide the vibration data to the signal generation circuit unit 51.

[0326] The control circuit unit 55 according to one embodiment of this specification can compensate for changes in the characteristics of the vibration generator 10 due to temperature and / or humidity, etc., or can compensate for the acoustic characteristics and / or sound pressure characteristics of the vibration generator 10 due to vibration of the vibrating structure 11, by setting or varying the gain value of the amplifier circuit that outputs the vibration drive signal based on the sensing data supplied from the sensing circuit unit 53.

[0327] The control circuit unit 55 according to an embodiment of the present specification calculates the frequency components of the acoustic source from the acoustic source using an FFT (Fast Fourier Transform) algorithm, and corrects (or modulates) the phase and / or amplitude of the frequency components of the acoustic source based on the sensing data supplied from the sensing circuit unit 53, thereby generating vibration data in which changes in the electrical characteristics of the sensor unit 30 have been corrected. For example, the control circuit unit 55 can change (or improve) the vibration characteristics of the vibration generator 10 by shifting or inverting the phase of the frequency components of the acoustic source based on the sensing data, or correct (or compensate) for changes in the characteristics of the vibration generator 10 based on changes in the electrical characteristics of the sensor unit 30.

[0328] For example, the control circuit section 55 can correct or compensate for changes in the characteristics of the vibration generator 10 based on changes in the electrical characteristics of the sensor section 30.

[0329] The control circuit unit 55 according to an embodiment of the present specification can filter the frequency components of the acoustic source to calculate treble and bass frequency components, and generate vibration data by synthesizing the treble and bass frequency components. For example, one or more of the treble and bass frequency components included in the vibration data can have an opposite phase to the corresponding frequency components filtered from the frequency components of the acoustic source. This allows the vibration generator 10 to vibrate in one or more of the bass and treble vibration modes in response to a vibration drive signal corresponding to the vibration data.

[0330] The vibration driving circuit 50 (or the sound processing circuit) according to an embodiment of the present specification may further include a sound receiver 57.

[0331] The sound receiver 57 may be disposed around the vibration generator 10. For example, the sound receiver 57 may overlap at least a portion of the vibration generator 10. The sound receiver 57 can collect sound generated by vibration of the vibration generator 10 and generate a collected sound signal.

[0332] As an example of the present specification, the control circuit unit 55 can correct the vibration data or vary the gain value of the amplifier circuit based on the frequency characteristics of the collected sound signal supplied from the sound receiver 57. This allows the control circuit unit 55 to correct the frequency characteristics and / or sound pressure characteristics of the sound generated by the vibration of the vibration generator 10 in real time.

[0333] As another embodiment of the present specification, the control circuit unit 55 can correct the vibration data or vary the gain value of the amplifier circuit based on the frequency characteristics of the collected acoustic signal supplied from the sound receiver 57 and the sensing data supplied from the sensing circuit unit 53. In this way, the control circuit unit 55 can correct changes in the characteristics of the vibration generator 10 due to temperature and / or humidity, etc., and correct the frequency characteristics and / or sound pressure characteristics of the sound generated by the vibration of the vibration generator 10 in real time.

[0334] According to one embodiment of the present specification, as described in Figures 8, 14, 18, or 20, when the sensor unit 30 includes multiple sensors, the control circuit unit 55 may set or vary the gain value of the amplifier circuit based on the average or maximum value of the sensing data sensed by each of the multiple sensors, but is not limited to this.

[0335] According to another embodiment of the present specification, as described in Figure 18 or Figure 20, when the vibration generator 10 includes multiple vibrating structures and the sensor unit 30 includes multiple sensors, the control circuit unit 55 can group one or more sensors arranged around each of the multiple vibrating structures, and set or vary the gain value of the amplifier circuit that supplies a vibration drive signal to each of the multiple vibrating structures based on the average value or maximum value of the sensing data for each group, but is not limited to this.

[0336] 22 is a flowchart illustrating a method for driving a vibration device according to an embodiment of the present specification. FIG. 22 illustrates an initial compensation process for a change in vibration characteristics of a vibration generator in a vibration device according to an embodiment of the present specification.

[0337] 22 in conjunction with FIG. 21, the initial compensation process for changes in the vibration characteristics of the vibration generator in the vibration device according to one embodiment of the present specification will be described below.

[0338] First, the vibration drive circuit 50 generates test vibration data corresponding to the test sound source supplied from the host system, or generates test vibration data by itself, and reproduces the test vibration or test sound by vibrating the vibration generator 10 with a vibration drive signal corresponding to the test vibration data (step S11).

[0339] Next, sensing circuit unit 53 senses a change in the electrical characteristics of sensor unit 30 due to the vibration of vibration generator 10, and generates sensing data (step S12).

[0340] Next, according to one embodiment of the present specification, the control circuit unit 55 analyzes changes in the vibration characteristics of the vibration generator 10 based on the sensing data (step S13). For example, the control circuit unit 55 analyzes the sensing data using an FFT (Fast Fourier Transform) algorithm to calculate changes in the electrical characteristics of the sensor unit 30, and analyzes whether or not there has been a change in the vibration characteristics of the vibration generator 10 based on the calculated changes in the electrical characteristics of the sensor unit 30. For example, the electrical characteristics of the sensor unit 30 may change due to the temperature and / or humidity around the vibration device, or may change due to the temperature and / or humidity of the vibration generator 10. Thus, changes in the vibration characteristics of the vibration generator 10 due to temperature and / or humidity may be calculated or predicted from changes in the electrical characteristics of the sensor unit 30 through analysis of the sensing data.

[0341] According to one embodiment of the present specification, the control circuit unit 55 can further reflect the frequency characteristics of the collected acoustic signal supplied from the sound receiver 57 and analyze whether or not there is a change in the vibration characteristics of the vibration generator 10.

[0342] Next, the control circuit unit 55 sets or corrects a gain value of the amplifier circuit to compensate for the change in the vibration characteristics of the vibration generator 10 based on the change in the vibration characteristics of the vibration generator 10 (step S14). For example, the control circuit unit 55 may compare the reference vibration characteristics of the vibration generator 10 stored in the storage circuit with the change in the vibration characteristics of the vibration generator 10 calculated by analyzing the sensing data, and set or correct a gain value of the amplifier circuit to compensate for the change in the vibration characteristics of the vibration generator 10. For example, the reference vibration characteristics of the vibration generator 10 may be, but are not limited to, the vibration characteristics of the vibration generator 10 calculated under an ambient environment such as normal temperature and / or humidity. For example, the set or corrected gain value may be stored in the storage circuit.

[0343] Therefore, the driving method of the vibration device according to one embodiment of the present specification can compensate for changes in the vibration characteristics of the vibration generator 10 by detecting changes in the electrical characteristics of the sensor unit 30 to generate sensing data, and setting or correcting the gain value of the amplifier circuit that outputs a vibration drive signal based on the sensing data.

[0344] 23 is a flowchart illustrating a method for driving a vibration device according to an embodiment of the present specification. FIG. 23 illustrates a real-time compensation process for a change in vibration characteristics of a vibration generator in a vibration device according to an embodiment of the present specification.

[0345] 23 in conjunction with FIG. 21, a real-time compensation process for changes in vibration characteristics of a vibration generator in a vibration device according to another embodiment of the present specification will be described below.

[0346] First, the vibration drive circuit 50 generates vibration data corresponding to an acoustic source provided by the host system, and vibrates the vibration generator 10 according to a vibration drive signal corresponding to the vibration data, thereby reproducing a sound corresponding to the acoustic source. Then, the vibration drive circuit 50 generates test vibration data corresponding to the acoustic source provided by the host system, or generates test vibration data by itself, and vibrates the vibration generator 10 according to a test vibration drive signal corresponding to the test vibration data, thereby reproducing a test sound corresponding to the acoustic source (step S21). For example, the test sound may be reproduced together with the sound corresponding to the acoustic source, but is not limited thereto. For example, the test sound may have a high frequency or an inaudible frequency, but is not limited thereto.

[0347] Next, sensing circuit unit 53 senses a change in the electrical characteristics of sensor unit 30 due to the vibration of vibration generator 10, and generates sensing data (step S22).

[0348] Next, according to one embodiment of the present specification, the control circuit unit 55 analyzes changes in the vibration characteristics of the vibration generator 10 based on the sensing data (step S23). For example, the control circuit unit 55 analyzes the sensing data using an FFT (Fast Fourier Transform) algorithm to calculate changes in the electrical characteristics of the sensor unit 30, and analyzes whether or not there has been a change in the vibration characteristics of the vibration generator 10 based on the calculated changes in the electrical characteristics of the sensor unit 30. For example, the electrical characteristics of the sensor unit 30 may change due to the temperature and / or humidity around the vibration device, or may change due to the temperature and / or humidity of the vibration generator 10. Thus, changes in the vibration characteristics of the vibration generator 10 due to temperature and / or humidity may be calculated or predicted from changes in the electrical characteristics of the sensor unit 30 through analysis of the sensing data.

[0349] According to one embodiment of the present specification, the control circuit unit 55 can further reflect the frequency characteristics of the collected acoustic signal supplied from the sound receiver 57 and analyze whether or not there is a change in the vibration characteristics of the vibration generator 10.

[0350] Next, the control circuit unit 55 sets or corrects the gain value of the amplifier circuit to compensate for the change in the vibration characteristics of the vibration generator 10 based on the change in the vibration characteristics of the vibration generator 10 (step S24). For example, the control circuit unit 55 can set or correct the gain value of the amplifier circuit to compensate for the change in the vibration characteristics of the vibration generator 10 by comparing the reference vibration characteristics of the vibration generator 10 stored in the storage circuit with the change in the vibration characteristics of the vibration generator 10 calculated by analyzing the sensing data.

[0351] Next, the vibration drive circuit 50 can correct changes in the vibration characteristics of the vibration generator 10 in real time by ending the sound playback or repeating the above-mentioned steps S21 to S24 depending on whether the sound has ended due to the supply of the sound source from the host system.

[0352] Therefore, the driving method of the vibration device according to another embodiment of this specification can compensate for changes in the vibration characteristics of the vibration generator 10 in real time by detecting changes in the electrical characteristics of the sensor unit 30 to generate sensing data in real time, and correcting the gain value of the amplifier circuit that outputs the vibration drive signal in real time based on the sensing data.

[0353] Fig. 24 is a diagram showing an apparatus according to one embodiment of the present specification. Fig. 25 is a plan view of the apparatus shown in Fig. 24. Figs. 24 and 25 show an apparatus including the vibration device described in Figs. 1 to 20.

[0354] 24 and 25 , a device according to an embodiment of the present specification may be realized as a display device, an audio device, an audio output device, a sound bar, an audio system, an audio device for a vehicle, an audio output device for a vehicle, or a sound bar for a vehicle. For example, a vehicle may include one or more seats and one or more glass windows. For example, a vehicle may include, but is not limited to, a vehicle, a train, a ship, or an aircraft. In addition, a device according to an embodiment of the present specification may be realized as analog signage or digital signage such as an advertising billboard, a poster, or a guide board.

[0355] An apparatus according to one embodiment of the present disclosure may include a vibration member 100 and a vibration generating device 200 .

[0356] The vibrating member 100 may be realized to output sound and / or vibration due to vibration of the vibration generating device 200. Accordingly, the vibrating member 100 may be expressed by terms such as, but not limited to, a vibrating object, a vibrating plate, a vibrating panel, an acoustic plate, an acoustic output member, an acoustic panel, an acoustic output panel, a manually vibrating member, or a front member.

[0357] A vibration member 100 according to one embodiment of the present disclosure may include a first surface (or front surface) 100a and a second surface (or back surface) 100b that is different from (or opposite to) the first surface 100a. One or more of the first surface 100a and the second surface 100b of the vibration member 100 may include a non-planar structure.

[0358] According to an embodiment of the present specification, the vibrating member 100 may include a display panel having pixels for displaying an image. For example, the display panel may include, but is not limited to, a flat display panel, a curved display panel, or a flexible display panel. For example, the display panel may include, but is not limited to, a liquid crystal display panel, an organic light emitting display panel, a quantum dot light emitting display panel, a micro light emitting diode display panel, or an electrophoretic display panel. For example, the display panel may include a touch panel or a touch electrode unit for sensing a user's touch.

[0359] According to another embodiment of the present specification, the vibrating member 100 may include a non-display panel that does not have pixels for displaying an image. For example, the non-display panel may include, but is not limited to, a screen panel onto which an image is projected from a display device, a lighting panel, or a signage panel.

[0360] The lighting panel according to one embodiment of the present specification may include, but is not limited to, a light emitting diode lighting panel (or device), an organic light emitting lighting panel (or device), or an inorganic light emitting lighting panel (or device).

[0361] A signage panel according to an embodiment of the present disclosure may include, but is not limited to, analog signage such as an advertising billboard, a poster, or a guide board. For example, when the vibrating member 100 is used as a signage panel, the analog signage may include signage content such as text, pictures, and symbols. The signage content may be arranged on the vibrating member 100 so as to be visible. For example, the signage content may be directly attached to one or more of the first surface 100a and the second surface 100b of the vibrating member 100. For example, the signage content may be printed on a medium such as paper, and the medium on which the signage content is printed may be directly attached to one or more of the first surface 100a and the second surface 100a of the vibrating member 100. For example, when the signage content is attached to the second surface 100b of the vibrating member 100, the vibrating member 100 may be made of a transparent material.

[0362] According to other embodiments of the present disclosure, the vibrating member 100 may have a flat or curved shape. For example, the vibrating member 100 may have a flat or curved plate. For example, the plate of the vibrating member 100 may be transparent, translucent, or opaque. For example, the plate of the vibrating member 100 may include a metallic material having material properties suitable for outputting sound through vibration, or a non-metallic material (or a composite non-metallic material). In one embodiment of the present disclosure, the metallic material of the plate of the vibrating member 600 may include, but is not limited to, any one or more of stainless steel, aluminum (Al), aluminum alloy, magnesium (Mg), magnesium alloy, and magnesium-lithium (Mg-Li) alloy. For example, the non-metallic material (or composite non-metallic material) of the plate of the vibrating member 100 may include, but is not limited to, one or more of glass, plastic, foam plastic, porous plastic, fiber, porous fiber, leather, porous leather, wood, porous wood, cloth, and paper. For example, the paper may be a speaker cone paper. For example, the cone paper may be made of, but is not limited to, pulp, foamed plastic, or porous plastic.

[0363] In other embodiments of the present specification, the vibration member 100 may include, but is not limited to, one or more of the following: an interior material of a vehicle, a glass window of a vehicle, an exterior material of a vehicle, a ceiling material of a building, an interior material of a building, a glass window of a building, an interior material of an aircraft, a glass window of an aircraft, and a mirror.

[0364] The vibration generator 200 may be configured to vibrate (or displace) the vibration member 100. The vibration generator 200 according to an embodiment of the present specification may include one or more vibration elements 210a, 210b, and 210c. For example, the vibration generator 200 may include a plurality of vibration elements 210a, 210b, and 210c arranged at regular intervals along one or more of a first direction (X) and a second direction (Y).

[0365] Each of the plurality of vibration elements 210a, 210b, and 210c may include a vibration generator 10 and a sensor unit 30. The vibration generator 10 and the sensor unit 30 configured in each of the plurality of vibration elements 210a, 210b, and 210c are substantially the same as the vibration generators and the sensor units described with reference to FIGS. 1 to 20, and therefore the same reference numerals will be used to denote them, and redundant description thereof will be omitted.

[0366] Each of the multiple vibration elements 210a, 210b, and 210c can be connected or coupled to the second surface 100b of the vibration member 100 via the connecting member 220. For example, the second surface 100b of the vibration member 100 can be connected or coupled to any one of the first protective member and the second protective member of each of the multiple vibration elements 210a, 210b, and 210c via the connecting member 220. This allows each of the multiple vibration elements 210a, 210b, and 210c to be supported or suspended from the second surface 100b of the vibration member 100.

[0367] The connecting member 220 according to an embodiment of the present specification may include an adhesive layer (or a sticky layer) having excellent adhesion or bonding strength. For example, the connecting member 220 may include a double-sided adhesive tape, a double-sided adhesive foam pad, or an adhesive sheet. For example, if the connecting member 220 includes an adhesive sheet (or a sticky layer), the connecting member 220 may include only the adhesive layer or the sticky layer without a base member such as a plastic material.

[0368] The adhesive layer (or sticky layer) of the connecting member 220 according to one embodiment of the present specification may include, but is not limited to, an epoxy-based polymer, an acrylic-based polymer, a silicone-based polymer, or a urethane-based polymer.

[0369] The adhesive layer (or sticky layer) of the connecting member 220 according to other embodiments of the present specification may include PSA (pressure sensitive adhesive), OCA (optically clear adhesive), or OCR (optically clear resin), but the embodiments of the present specification are not limited thereto.

[0370] The device according to an embodiment of the present disclosure may further include an enclosure 230 .

[0371] The enclosure 230 can be coupled to the vibration member 100 so as to cover or surround the vibration generating device 200. For example, the enclosure 230 can be coupled to the second surface 100b of the vibration member 100 via an adhesive member 240, thereby covering the vibration generating device 200 on the second surface 100b of the vibration member 100.

[0372] The enclosure 230 according to one embodiment of the present specification can be coupled to the second surface 100b of the vibration member 100 via an adhesive member 240 so as to individually cover each of the multiple vibration elements 210a, 210b, and 210c. For example, the enclosure 230 can maintain a constant impedance component due to air acting on the vibration member 100 when the vibration member 100 vibrates. For example, the air surrounding the vibration member 100 resists the vibration of the vibration member 100 and acts as an impedance component having resistance and reactance components that vary depending on the frequency. As a result, the enclosure 230 forms a sealed space surrounding each of the multiple vibration elements 210a, 210b, 210c formed on the second surface 100b of the vibrating member 100, thereby maintaining a constant impedance component (or air impedance or elastic impedance) acting on the vibrating member 100 due to air, thereby improving the acoustic characteristics and / or sound pressure characteristics in the low frequency range and improving the sound quality of the high frequency range. For example, the low frequency range may be 500 Hz or less, but is not limited to this. The high frequency range may be 1 kHz or more, or 3 kHz or more, but is not limited to this.

[0373] Although FIG. 24 shows the enclosure 230 as having a closed structure, the enclosure 230 is not limited thereto, and may be configured to have a bass-reflex or open-baffle structure.

[0374] The device according to an embodiment of the present disclosure may further include a vibration driver circuit 250 .

[0375] The vibration drive circuit 250 can be electrically coupled to each of the vibration generators 10 and the sensor unit 30 configured in each of the multiple vibration elements 210a, 210b, and 210c. For example, the vibration drive circuit 250 can be electrically coupled to each of the vibration generators 10 and the sensor unit 30 via a signal cable.

[0376] The vibration drive circuit 250 according to one embodiment of the present specification supplies vibration drive signals to the vibration generators 10 configured for each of the plurality of vibration elements 210a, 210b, and 210c, senses changes in the electrical characteristics of the sensor units 30 configured for each of the plurality of vibration elements 210a, 210b, and 210c to generate element-specific sensing data, and can correct or generate the vibration drive signals to be supplied to the vibration generators 10 for each of the plurality of vibration elements 210a, 210b, and 210c based on the element-specific sensing data. Furthermore, the vibration drive circuit 250 can correct or generate the vibration drive signals to be supplied to the vibration generators 10 for each of the plurality of vibration elements 210a, 210b, and 210c based on the element-specific sensing data and the frequency characteristics of the collected acoustic signal supplied from the sound receiver 57. For example, the vibration drive circuit 250 is substantially the same as the vibration drive circuit 50 shown in Fig. 21 except that it is coupled to a plurality of vibration elements 210a, 210b, and 210c, and therefore a redundant description thereof will be omitted. The vibration drive circuit 250 can compensate for changes in the vibration characteristics of each of the vibration generators 10 of the plurality of vibration elements 210a, 210b, and 210c through a method substantially the same as the driving method of the vibration drive circuit 50 described in Fig. 21 or 22, and therefore a redundant description thereof will be omitted or simplified.

[0377] According to one embodiment of the present specification, the vibration drive circuit 250 may be configured to generate or correct an element-specific vibration drive signal based on element-specific sensing data for each of the plurality of vibration elements 210 a, 210 b, and 210 c. Therefore, the vibration drive signal or element-specific vibration drive signal referred to in the following description of the embodiment of the present specification may be interpreted as being generated or corrected based on element-specific sensing data.

[0378] The vibration drive circuit 250 according to one embodiment of the present disclosure can provide the same vibration drive signal to each of the plurality of vibration elements 210 a, 210 b, 210 c, or can provide different vibration drive signals to one or more of the plurality of vibration elements 210 a, 210 b, 210 c, thereby allowing each of the plurality of vibration elements 210 a, 210 b, 210 c to vibrate in the same or different manners using the same or different vibration drive signals.

[0379] As one embodiment of the present specification, the vibration drive circuit 250 generates element-specific vibration data for each of the plurality of vibration elements 210a, 210b, and 210c from an acoustic source, generates element-specific vibration drive signals corresponding to the element-specific vibration data, and supplies the generated signals to each of the plurality of vibration elements 210a, 210b, and 210c. For example, the element-specific vibration drive signals may be a composite signal of a low-frequency vibration drive signal and a high-frequency vibration drive signal generated from the acoustic source. For example, the element-specific vibration drive signal may be a composite signal of a low-frequency vibration drive signal generated from the acoustic source and a phase-inverted high-frequency vibration drive signal. Therefore, each of the plurality of vibration elements 210a, 210b, and 210c can vibrate in one or more vibration modes selected from a low-frequency vibration mode and a high-frequency vibration mode.

[0380] As an example of the present disclosure, the vibration drive circuit 250 can supply vibration drive signals in the same frequency range to each of the multiple vibration elements 210a, 210b, and 210c, or can supply vibration drive signals in different frequency ranges to one or more of the multiple vibration elements 210a, 210b, and 210c. For example, the vibration drive circuit 250 can supply an acoustic isolation vibration drive signal to any one of the multiple vibration elements 210a, 210b, and 210c. For example, the acoustic isolation vibration drive signal can have a different phase from the vibration drive signal supplied to an adjacent vibration element or can have an opposite phase to the vibration drive signal supplied to the adjacent vibration element. This can minimize or prevent acoustic interference caused by the vibration of each of the multiple vibration elements 210a, 210b, and 210c.

[0381] A vibration drive circuit 250 according to another embodiment of the present disclosure can separate the multiple vibration elements 210a, 210b, and 210c into multiple vibration channels and supply the same or different vibration drive signals to each of the vibration elements 210a, 210b, and 210c of the multiple vibration channels. For example, the vibration drive circuit 250 can supply vibration drive signals in the same frequency range to each of the vibration elements 210a, 210b, and 210c of the multiple vibration channels, or supply vibration drive signals in different frequency ranges to the vibration elements 210a, 210b, and 210c of two or more of the multiple vibration channels. For example, the vibration drive circuit 250 can supply vibration drive signals for acoustic isolation to the vibration elements 210a, 210b, and 210c of vibration channels between two adjacent vibration channels of the multiple vibration channels. Therefore, a device according to an embodiment of the present disclosure can provide a user with sounds including stereo sound, two-channel or more sound, or surround sound.

[0382] The vibration drive circuit 250 according to an embodiment of the present specification can improve the flatness of sound by matching the phases of the vibration drive signals supplied to each of the plurality of vibration elements 210a, 210b, and 210c, thereby minimizing dips and peaks in the sound frequency generated by the vibration of the vibrating member 100. Therefore, the device according to an embodiment of the present specification can provide the user with a sound field that is the same as that of actual sound.

[0383] The vibration driving circuit 250 according to another embodiment of the present specification can improve the acoustic characteristics and / or sound pressure characteristics of the low-frequency band generated by the vibration of the vibrating member 100 by correcting or shifting the phase of the vibration driving signal supplied to each of the plurality of vibration elements 210a, 210b, and 210c to be the same based on the low-frequency band sensing data of each element sensed through the sensor unit 30 of each of the plurality of vibration elements 210a, 210b, and 210c for the test sound in the low-frequency band.

[0384] The vibration drive circuit 250 according to another embodiment of the present specification can improve the acoustic characteristics and / or sound pressure characteristics of a specific frequency band generated by the vibration of the vibrating member 100 by matching the vibration drive signal supplied to each of the multiple vibration elements 210a, 210b, 210c to a specific frequency band.

[0385] A vibration drive circuit 250 according to another embodiment of the present specification can concentrate in a specific direction the sound generated by the vibration of the vibrating member 100 by finely adjusting or shifting the phase of the vibration drive signal supplied to each of the multiple vibration elements 210a, 210b, 210c. For example, the phase of the vibration drive signal supplied to the vibration elements 210a, 210c at the edge of the vibrating member 100 can be finely adjusted or shifted based on the phase of the vibration drive signal supplied to the vibration element 210b at the middle part of the vibrating member 100.

[0386] The device according to an embodiment of the present specification can vibrate the vibrating member 100 via the plurality of vibrating elements 210a, 210b, and 210c to output sound, and can provide a user with sound including two or more channels or surround sound, thereby providing the user with a sound field similar to that of actual sound. Furthermore, the device according to an embodiment of the present specification can correct or compensate for changes in the electrical characteristics of the vibration generator 10 due to temperature and / or humidity, etc., based on sensing data via the sensor units configured in each of the plurality of vibrating elements 210a, 210b, and 210c, can correct or compensate for the vibration characteristics of the vibration generator 10, and can detect physical changes, such as damage or breakage, of the vibration generator 10.

[0387] Fig. 26 is a diagram showing an apparatus according to another embodiment of the present specification. Fig. 27 is a cross-sectional view taken along line F-F' shown in Fig. 26. Fig. 28 is a plan view of the apparatus shown in Fig. 27. Figs. 26 to 28 show apparatuses including the vibration device described with reference to Figs. 1 to 20.

[0388] Referring to Figures 26 to 28, devices according to other embodiments of the present specification may be realized as a display device, an audio device, an audio output device, a sound bar, an audio system, an audio device for a transportation device, an audio output device for a transportation device, or a sound bar for a transportation device, as described in Figure 24.

[0389] An apparatus according to another embodiment of the present disclosure may include a vibration member 100 , a vibration generating device 200 , and a housing 300 .

[0390] The vibrating member 100 can be realized to output sound and / or vibration by vibration of the vibration generator 200. Accordingly, the vibrating member 100 can be expressed by terms such as, but not limited to, a vibrating object, a diaphragm, a vibrating panel, an acoustic plate, an acoustic output member, an acoustic panel, an acoustic output panel, a manually vibrating member, or a front member. For example, the vibrating member 100 is substantially the same as the vibrating member 100 described in FIGS. 24 and 25, and therefore the same reference numerals will be used to denote the same, and redundant description thereof will be omitted.

[0391] The vibration generator 200 may be configured to vibrate (or displace) the vibration member 100. The vibration generator 200 according to an embodiment of the present specification may include a plurality of vibration elements 210a, 210b, 210c, 210d, and 210e. For example, the vibration generator 200 may include a plurality of vibration elements 210a, 210b, 210c, 210d, and 210e arranged at regular intervals along one or more of a first direction (X) and a second direction (Y).

[0392] Each of the multiple vibration elements 210a, 210b, 210c, 210d, and 210e is substantially the same as the vibration device including the vibration generator 10 and sensor unit 30 described in Figures 1 to 20, so duplicated explanations corresponding thereto can be omitted.

[0393] According to one embodiment of the present specification, each of the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e may be electrically coupled to the vibration drive circuit 250 described in FIG. 24. For example, the vibration drive circuit 250 may be configured to supply the same or different vibration drive signals to the vibration generators 10 of each of the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e. The vibration drive circuit 250 may be configured to individually generate or individually correct the vibration drive signals to be supplied to the vibration generators 10 of each of the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e based on element-specific sensing data sensed via the sensor unit 30 of each of the vibration elements 210a, 210b, 210c, 210d, and 210e. Such a vibration drive circuit is substantially the same as the vibration drive circuit 250 described in FIG. 24, and therefore, repeated description thereof will be omitted.

[0394] Each of the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e is or can be connected to the second surface 100b of the vibration member 100 via a connecting member 220. For example, the second surface 100b of the vibration member 100 can be connected or coupled to any one of the first protective member and the second protective member of each of the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e via the connecting member 220. As a result, each of the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e can be supported or suspended from the second surface 100b of the vibration member 100. For example, the connecting member 220 is substantially the same as the connecting member 220 described with reference to FIGS. 24 and 25, and therefore the same reference numerals will be used to denote the same, and redundant description thereof will be omitted.

[0395] The housing 300 may be disposed on the second surface 100b of the vibration member 100 to cover the second surface 100b of the vibration member 100 and the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e. The housing 300 has an internal space 300s for accommodating the vibration generator 200 and may have a box shape with one side open.

[0396] The housing 300 according to an embodiment of the present specification may include, but is not limited to, one or more of a metal material or a non-metal material (or a composite non-metal material). For example, the housing 300 may include, but is not limited to, one or more of a metal material, plastic, and wood. For example, the housing 300 may be expressed by terms such as, but not limited to, a support member, a case, an outer case, a case member, a housing member, a cabinet, an enclosure, a sealing member, a sealing cap, a sealed box, or a sound box. For example, the internal space 300s may be expressed by terms such as, but not limited to, a gap space, an air gap, a vibration space, an acoustic space, a sound box, or a sealed space.

[0397] The housing 300 according to one embodiment of the present specification can maintain a constant impedance component due to air acting on the vibrating member 100 when the vibrating member 100 vibrates. For example, the air surrounding the vibrating member 100 resists the vibration of the vibrating member 100 and acts as an impedance component having different resistance and reactance components depending on the frequency. As a result, the housing 300 forms an enclosed space surrounding the vibration device 200, thereby maintaining a constant impedance component (or air impedance or elastic impedance) acting on the vibrating member 100 due to air, thereby improving the acoustic characteristics and / or sound pressure characteristics in the low frequency range generated by the vibration of the vibrating member 100 and improving the sound quality of the high frequency range.

[0398] A housing 300 according to one embodiment of the present disclosure may include a bottom 310 and sides 330 .

[0399] The bottom 310 may be arranged to cover the second surface 100b of the vibration member 100 and the vibration generator 200. For example, the bottom 310 may be arranged to be spaced apart from the second surface 100b of the vibration member 100 and the vibration generator 200. For example, the bottom 310 may be expressed by terms such as a housing plate or a housing bottom, but is not limited thereto.

[0400] The side portion 330 may be connected to an edge portion of the bottom portion 310. For example, the side portion 330 may be bent from the edge portion of the bottom portion 310 along the thickness direction (Z) of the vibration member 10. For example, the side portion 330 may be parallel to the thickness direction (Z) of the vibration member 10 or inclined from the thickness direction (Z) of the vibration member 10. For example, the side portion 330 may include first to fourth side portions. For example, the side portion 330 may be expressed by terms such as a housing side surface or a housing side wall, but is not limited thereto.

[0401] The side portion 330 may be integrated with the bottom portion 310. For example, the bottom portion 310 and the side portion 330 may be integrated into one body, thereby providing an internal space 300s surrounded by the side portion 330 on the bottom portion 310. Therefore, the bottom portion 310 and the side portion 330 may have a box shape with one side open.

[0402] The side portion 330 may be connected or coupled to the second surface 100b of the vibration member 100 via the connecting member 150. For example, the side portion 330 may be connected or coupled to an edge portion of the second surface 100b of the vibration member 110 via the connecting member 150.

[0403] The housing 300 according to an embodiment of the present disclosure may further include a connecting frame portion 350 formed on the bottom portion 310 .

[0404] The connecting frame portion 350p may be connected to the bottom portion 310. For example, the connecting frame portion 350 may be disposed parallel to the bottom portion 310 and connected to the side portion 330. The connecting frame portion 350 may be bent parallel to the first direction (X) from the tip of the side portion 330 and extend to a certain length along the first direction (X). The connecting frame portion 350 may include an opening corresponding to the internal space 300s formed on the bottom portion 310 by the side portion 330. The side portion 330, the bottom portion 310, and the connecting frame portion 350 may be integrated into a single body, so that the bottom portion 310, the side portion 330, and the connecting frame portion 350 may have a box shape with an open side. For example, the connecting frame portion 350 may be expressed by terms such as, but not limited to, a housing connecting portion, a housing eaves portion, a housing skirt portion, etc.

[0405] According to one embodiment of the present specification, when the housing 300 includes the connecting frame portion 350, the connecting member 150 may be disposed between the connecting frame portion 350 of the housing 300 and the second surface 100b of the vibration member 100. For example, the connecting member 150 may connect or join an edge portion of the second surface 100b of the vibration member 100 to the connecting frame portion 3502.

[0406] According to an embodiment of the present disclosure, the connecting member 150 may be configured to minimize or prevent vibrations of the vibrating member 100 from being transmitted to the housing 300. The connecting member 150 may include material properties suitable for isolating vibrations. For example, the connecting member 150 may include a material having elasticity for vibration absorption (or shock absorption). The connecting member 150 according to an embodiment of the present disclosure may be made of, but is not limited to, a polyurethane material or a polyolefin material. For example, the connecting member 150 according to an embodiment of the present disclosure may include, but is not limited to, one or more of an adhesive, a double-sided tape, a double-sided foam tape, and a double-sided cushion tape.

[0407] Such a device according to another embodiment of the present specification can have the same effects as the device described in Figures 24 and 25. Furthermore, by including a housing 300 configured to cover the second surface 100b of the vibrating member 100 and the vibration generating device 200, the device according to another embodiment of the present specification can improve the acoustic characteristics and / or sound pressure characteristics in the low frequency range generated by the vibration of the vibrating member 100, and can improve the sound quality of the high frequency range sound.

[0408] Figure 29 is another cross-sectional view taken along line F-F' in Figure 26. Figure 30 is a plan view of the device shown in Figure 29. Figures 29 and 30 show the device described in Figures 27 and 28 to which a vibration control member is further added. Therefore, in the following description, except for the vibration control member and related components, the remaining components will be given the same reference numerals, and redundant description thereof will be omitted.

[0409] 26, 29 and 30, the device or vibration generating device 200 according to other embodiments of the present specification may further include a vibration control member 260.

[0410] The vibration member 100 may include a plurality of regions (A1 to A5). For example, the vibration member 100 may include first to fifth regions (A1 to A5). The first region (A1) may be disposed closest to one side edge portion (or first edge portion) (E1) of the vibration member 100. The fifth region (A5) may be disposed closest to the other side edge portion (or second edge portion) (E2) that is opposite or parallel to the one side edge portion of the vibration member 100. The second to fourth regions (A2, A3, A4) may be disposed in intermediate regions of the vibration member 100. The third region (A3) may be disposed in the central region of the vibration member 100.

[0411] Each of the multiple regions (A1 to A5) can include one or more vibration elements 210a, 210b, 210c, 210d, and 210e. For example, the vibration generator 200 can include first to fifth vibration elements 210a, 210b, 210c, 210d, and 210e arranged in each of the multiple regions (A1 to A5).

[0412] The first to fifth vibration elements 210a, 210b, 210c, 210d, and 210e can vibrate in the same manner with the same vibration component signal or individually with individually controlled vibration drive signals under the control of the vibration drive circuit. For example, the vibration drive circuit can supply the same vibration component signal to each of the first to fifth vibration elements 210a, 210b, 210c, 210d, and 210e, or supply different vibration drive signals to one or more of the first to fifth vibration elements 210a, 210b, 210c, 210d, and 210e. Such a vibration drive circuit is substantially the same as the vibration drive circuit 250 described in FIG. 24, and therefore a redundant description thereof will be omitted.

[0413] A device or vibration generating device 200 according to another embodiment of the present specification may further include a vibration control member 260 coupled to vibration elements 210a, 210b, 210c, 210d, and 210e configured in one or more of the regions (A1 to A5) defined in the vibration member 100. For example, the vibration control member 260 may be expressed as a mass body, mass member, weight member, or rigid member, but is not limited thereto.

[0414] The vibration control member 260 is configured to increase the mass distribution in the middle region of the vibrating member 100, thereby improving the acoustic characteristics and / or sound pressure characteristics in the low frequency range generated by the vibration of the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e. For example, when the mass distribution in the middle region of the vibrating member 100 is relatively high, the response of the first order component of the vibration generated when the vibrating member 100 vibrates can be improved, thereby improving the acoustic characteristics and / or sound pressure characteristics in the low frequency range.

[0415] The vibration control member 260 according to one embodiment of the present specification may be coupled to each of the vibration elements 210a, 210b, 210c, 210d, and 210e arranged in the intermediate regions (A2, A3, and A4) of the multiple regions (A1 to A5) defined in the vibration member 100. As one embodiment of the present specification, the vibration control member 260 may be coupled to the back surface of each of the second to fourth vibration elements 210b, 210c, and 210d arranged in the second to fourth regions (A2, A3, and A4) of the vibration member 100. As another embodiment of the present specification, the vibration control member 260 may be coupled to the back surface of one or more third vibration elements 210c arranged in the third region (A3) of the vibration member 100.

[0416] The vibration control member 260 according to an embodiment of the present specification may include a metal material or a high-density metal material, such as, but not limited to, one or more of aluminum (Al), magnesium (Mg), an aluminum alloy, a magnesium alloy, and a magnesium-lithium (Mg-Li) alloy.

[0417] The vibration control member 260 according to one embodiment of the present specification can reduce the vibration frequency response for the intermediate region of the vibrating member 100 and improve the response of the first-order component of vibration by increasing the mass distribution in the intermediate region of the vibrating member 100, thereby improving the acoustic characteristics and / or sound pressure characteristics in the low-frequency range generated by the vibration of the vibrating member 100. Furthermore, the vibration control member 260 can improve the acoustic characteristics and / or sound pressure characteristics in the low-frequency range generated by the vibration of the vibrating member 100 by increasing the mass of each of the second to fourth vibrating elements 210b, 210c, and 210d configured in the intermediate region of the vibrating member 100 and reducing the resonance frequency for the intermediate region of the vibrating member 100.

[0418] Such devices according to other embodiments of the present specification can have the same effects as the devices described with reference to Figures 24 to 28. Furthermore, devices according to other embodiments of the present specification can improve the acoustic characteristics and / or sound pressure characteristics in the low frequency range by providing a relatively high mass distribution in the middle region of vibrating member 100 due to vibration control member 260.

[0419] Figure 31 is another cross-sectional view taken along line F-F' in Figure 26. Figure 32 is a plan view of the device shown in Figure 31. Figures 31 and 32 show modifications of the vibration control member described in Figures 29 and 30. Therefore, in the following description, except for the vibration control member and related components, the remaining components will be given the same reference numerals, and redundant description thereof will be omitted.

[0420] 26, 31 and 32, the device or vibration generating device 200 according to other embodiments of the present specification may further include a vibration control member 260.

[0421] The vibration control member 260 may be coupled to one or more vibration elements 210a, 210b, 210c, 210d, and 210e arranged in each of the multiple regions (A1 to A5) defined in the vibration member 100. For example, the vibration control member 260 may be coupled to the back surface of each of the first to fourth vibration elements 210a, 210b, 210c, 210d, and 210e arranged in each of the multiple regions (A1 to A5) defined in the vibration member 100.

[0422] The mass of the vibration control member 260 according to one embodiment of the present specification may increase from the edge portions (E1, E2) of the vibration member 100 to the central portion. For example, the vibration control member 260 coupled to the first vibration element 210a and the fifth vibration element 210e, respectively, configured in the first and fifth regions (A1, A5) of the vibration member 100 may have a first mass. The vibration control member 260 coupled to one or more third vibration elements 210c, respectively, configured in the third region (A3) of the vibration member 100 may have a second mass higher than the first mass. And the vibration control member 260 coupled to the second vibration element 210b and the fourth vibration element 210d, respectively, configured in the second and fourth regions (A2, A4) of the vibration member 100 may have a third mass higher than the first mass and lower than the second mass.

[0423] The mass distribution of the vibration member 100 according to one embodiment of the present specification gradually increases from the edge portions (E1, E2) to the middle portion due to differential equalization (differentiation) of the mass by region of the vibration control member 260, thereby reducing the vibration frequency response in the middle region of the vibration member 100 and improving the response of the first order component of vibration, thereby improving the acoustic characteristics and / or sound pressure characteristics in the low frequency range generated by the vibration of the vibration member 100 and improving the flatness of the sound.

[0424] The first to fifth vibration elements 210a, 210b, 210c, 210d, and 210e can vibrate in the same manner with the same vibration component signal or individually with individually controlled vibration drive signals under the control of the vibration drive circuit. For example, the vibration drive circuit can supply the same vibration component signal to each of the first to fifth vibration elements 210a, 210b, 210c, 210d, and 210e, or supply different vibration drive signals to one or more of the first to fifth vibration elements 210a, 210b, 210c, 210d, and 210e. Such a vibration drive circuit is substantially the same as the vibration drive circuit 250 described in FIG. 24, and therefore a redundant description thereof will be omitted.

[0425] Such a device according to another embodiment of the present specification can have the same effect as the device described in Fig. 24. Furthermore, the device according to another embodiment of the present specification can further improve the acoustic characteristics and / or sound pressure characteristics in the low frequency range by having a relatively high mass distribution from the edge portion to the middle portion of the vibrating member 100 due to the vibration control member 260.

[0426] Figure 33 is another cross-sectional view taken along line F-F' in Figure 26. Figure 34 is a plan view of the device shown in Figure 33. Figures 33 and 34 show the devices described in Figures 27 and 28 with a modified vibration generator. Therefore, in the following description, except for the vibration generator and related components, the remaining components will be given the same reference numerals, and redundant description thereof will be omitted.

[0427] 26, 33 and 34, an apparatus according to another embodiment of the present disclosure may include a vibration member 100 and a vibration generating device 200.

[0428] The vibrating member 100 may include a first region (A1), a second region (A2), and a third region (A3) between the first region (A1) and the second region (A2). Except for including the first to third regions (A1, A2, A3), the vibrating member 100 is substantially the same as the vibrating member 100 described in Figures 27 and 28, and therefore the same reference numerals will be used to denote the same and redundant description thereof will be omitted.

[0429] In the vibration member 100, the first region (A1) can be a left region or a left channel, the second region (A2) can be a right region or a right channel, and the third region (A3) can be a middle region, a middle channel, or a channel separation region.

[0430] The vibration generator 200 may include a plurality of vibration elements 210a, 210b, 210c, 210d, and 210e connected or coupled to the second surface 100b of the vibration member 100 via a connecting member 220. For example, the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e may be connected or coupled to the second surface 100b of the vibration member 100 so as to have regular intervals along the first direction (X), but are not limited thereto. Each of the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e is substantially the same as the vibration device including the vibration generator 10 and the sensor unit 30 described with reference to FIGS. 1 to 20, and therefore, corresponding redundant description will be omitted.

[0431] According to one embodiment of the present specification, each of the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e may be electrically coupled to the vibration drive circuit 250 described in FIG. 24. For example, the vibration drive circuit 250 may be configured to supply the same or different vibration drive signals to the vibration generators 10 of each of the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e. The vibration drive circuit 250 may be configured to individually generate or individually correct the vibration drive signals to be supplied to the vibration generators 10 of each of the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e based on element-specific sensing data sensed via the sensor unit 30 of each of the vibration elements 210a, 210b, 210c, 210d, and 210e. Such a vibration drive circuit is substantially the same as the vibration drive circuit 250 described in FIG. 24, and therefore, repeated description thereof will be omitted.

[0432] The vibration generator 200 according to one embodiment of the present specification may include one or more vibration elements 210a, 210b, 210c, 210d, and 210e arranged in each of the first to third regions (A1, A2, and A3) of the vibration member 100.

[0433] According to one embodiment of the present specification, the vibration generating device 200 may include a plurality of vibration channels (GR1, GR2, GR3) each having one or more vibration elements. For example, the vibration drive signals supplied to the one or more vibration elements configured in each of the plurality of vibration channels (GR1, GR2, GR3) may be the same or different. For example, the number of vibration elements configured in each of the plurality of vibration channels (GR1, GR2, GR3) may be the same or different.

[0434] According to one embodiment of the present specification, the vibration generating device 200 may include first and second vibration elements 210a, 210b configured in a first region (A1) of the vibration member 100, fourth and fifth vibration elements 210d, 210e configured in a second region (A2) of the vibration member 100, and a third vibration element 210c configured in a third region (A3) of the vibration member 100.

[0435] According to one embodiment of the present specification, the third vibration element 210c may include a third-first vibration element 210c1 and a third-second vibration element 210c2. The third-first vibration element 210c1 and the third-second vibration element 210c2 may have the same size as or different from the first, second, fourth, and fifth vibration elements 210a, 210b, 210d, and 210e. For example, the third-first vibration element 210c1 and the third-second vibration element 210c2 may have a smaller size than the adjacent second vibration element 210b and fourth vibration element 210d.

[0436] The first and second vibration elements 210a, 210b can constitute a first vibration channel (GR1), the fourth and fifth vibration elements 210d, 210e can constitute a second vibration channel (GR2), and the third-1 and third-2 vibration elements 210c1, 210c2 can constitute a third vibration channel (GR3).

[0437] According to one embodiment of the present specification, the first to fifth vibration elements 210a, 210b, 210c, 210d, and 210e formed in the first to third vibration channels (GR1, GR2, and GR3), respectively, can be vibrated by the same vibration drive signal. For example, the vibration drive circuit supplies the same low-frequency vibration drive signal to the first to fifth vibration elements 210a, 210b, 210c, 210d, and 210e of the first to third vibration channels (GR1, GR2, and GR3), respectively, for acoustic frequencies in the low-frequency range, thereby improving the acoustic characteristics and / or sound pressure characteristics in the low-frequency range generated by the vibration of the vibrating member 100.

[0438] According to one embodiment of the present specification, the first and second vibration elements 210a and 210b configured in the first vibration channel (GR1) can vibrate with the same vibration drive signal to realize a left sound or a left channel, and the fourth and fifth vibration elements 210d and 210e configured in the second vibration channel (GR2) can vibrate with the same vibration drive signal to realize a right sound or a right channel.

[0439] According to one embodiment of the present specification, high-frequency sound waves generated in the first vibration channel (GR1) proceed to the second vibration channel (GR2) via the third vibration channel (GR3), and high-frequency sound waves generated in the second vibration channel (GR2) proceed to the first vibration channel (GR1) via the third vibration channel (GR3), so that separation of the left and right channels may not occur. As a result, the third vibration element 210c configured in the third vibration channel (GR3) vibrates in response to a vibration drive signal, thereby configuring an acoustic separation channel that separates left and right sounds (or left and right channels).

[0440] According to one embodiment of the present specification, the third-1st vibration element 210c1 of the third vibration channel (GR3) vibrates in response to the third-1st vibration drive signal for acoustic isolation to generate a first acoustic separation wave, thereby blocking or minimizing sound waves traveling from the first vibration channel (GR1) to the second vibration channel (GR2). In one embodiment of the present specification, the third-1st vibration drive signal for acoustic isolation may have a different phase or an opposite phase from the vibration drive signals supplied to the first and second vibration elements 210a, 210b of the first vibration channel (GR1). For example, the treble frequency component of the third-1st vibration drive signal for acoustic isolation may have an opposite phase to the treble frequency component of the vibration drive signals supplied to the first and second vibration elements 210a, 210b of the first vibration channel (GR1).

[0441] According to one embodiment of the present specification, the third-2 vibration element 210c2 of the third vibration channel (GR3) vibrates in response to the third-2 acoustic isolation vibration drive signal to generate a second acoustic isolation wave, thereby blocking or minimizing sound waves traveling from the second vibration channel (GR2) to the first vibration channel (GR1). In one embodiment of the present specification, the third-2 acoustic isolation vibration drive signal may have a different phase or an opposite phase from the vibration drive signals supplied to the fourth and fifth vibration elements 210d, 210e of the second vibration channel (GR2). For example, the treble frequency component of the third-2 acoustic isolation vibration drive signal may have an opposite phase to the treble frequency component of the vibration drive signals supplied to the fourth and fifth vibration elements 210d, 210e of the second vibration channel (GR2).

[0442] The device according to another embodiment of the present disclosure may further include a vibration control member 260 .

[0443] The vibration control member 260 may be configured so that the mass distribution of the vibration member 100 gradually increases from the edge portion to the middle portion.

[0444] The vibration control member 260 may be connected or coupled to the rear surfaces of the first to fifth vibration elements 210a, 210b, 210c, 210d, and 210e, which are arranged in the first to third regions (A1, A2, and A3) of the vibration member 100. The mass of the vibration control member 260 according to an embodiment of the present specification may increase from the edge portions (E1 and E2) of the vibration member 100 toward the center portion. For example, the mass of the vibration control member 260 may gradually increase from the first vibration element 210a to the third-first vibration element 210c1 and gradually decrease from the third-second vibration element 210c2 to the fifth vibration element 210e. This vibration control member 260 is substantially the same as the vibration control member 260 described with reference to FIGS. 31 and 32, and therefore, redundant description thereof will be omitted.

[0445] In Figures 33 and 34, the vibration control member 260 is described as being configured for each of the first to fifth vibration elements 210a, 210b, 210c, 210d, and 210e, but this is not limited to this, and the vibration control member 260 can be coupled only to each of the 3-1 and 3-2 vibration elements 210c1 and 210c2 of the third vibration channel (GR3), as described in Figures 29 and 30, thereby allowing the vibration control member 260 to relatively increase or concentrate the mass distribution in the middle portion of the vibration member 100, thereby further improving the acoustic characteristics and / or sound pressure characteristics in the low-frequency range.

[0446] Such a device according to another embodiment of the present specification may have the same effect as the device described in Fig. 24 or the same effect as the device described in Fig. 29 to Fig. 32. Furthermore, the device according to another embodiment of the present specification can provide the user with stereo sound from the left and right sides by separating the left and right sounds through vibration of the third vibration element 210c of the third vibration channel (GR3) configured in the third region (or middle region) of the vibrating member 100, and the vibration control member 260 can improve the acoustic characteristics and / or sound pressure characteristics of the bass band of each of the left and right sounds.

[0447] Figure 35 is another cross-sectional view taken along line F-F' in Figure 26. Figure 36 is a plan view of the device shown in Figure 35. Figures 35 and 36 show modifications to the vibration generator configuration of the device described in Figures 33 and 34. Therefore, in the following description, except for the vibration generator and related components, the remaining components will be given the same reference numerals, and redundant description thereof will be omitted.

[0448] 26, 35 and 36, an apparatus according to another embodiment of the present disclosure may include a vibrating member 100 and a vibration generating device 200.

[0449] The vibration member 100 may include a first region (A1), a second region (A2), a third region (A3) between the first region (A1) and the second region (A2), a fourth region (A4) between the first region (A1) and the third region (A3), and a fifth region (A5) between the second region (A2) and the third region (A3). The vibration member 100 is substantially the same as the vibration member 100 described in Figures 33 and 34 except that it further includes the fourth and fifth regions (A4, A5), so redundant description thereof will be omitted.

[0450] In the vibration member 100, the first region (A1) can be the left region or left channel. The second region (A2) can be the right region or right channel. The third region (A3) can be the middle region or middle channel. The fourth region (A4) can be the left channel separation region or first channel separation region. The fifth region (A5) can be the right channel separation region or second channel separation region.

[0451] The vibration generator 200 may include a plurality of vibration elements 210a, 210b, 210c, 210d, and 210e connected or coupled to the second surface 100b of the vibration member 100 via a connecting member 220. For example, the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e may be connected or coupled to the second surface 100b of the vibration member 100 so as to have regular intervals along the first direction (X), but are not limited thereto. Each of the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e is substantially the same as the vibration device including the vibration generator 10 and the sensor unit 30 described with reference to FIGS. 1 to 20, and therefore, corresponding redundant description will be omitted.

[0452] According to one embodiment of the present specification, each of the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e may be electrically coupled to the vibration drive circuit 250 described in FIG. 24. For example, the vibration drive circuit 250 may be configured to supply the same or different vibration drive signals to the vibration generators 10 of each of the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e. The vibration drive circuit 250 may be configured to individually generate or individually correct the vibration drive signals to be supplied to the vibration generators 10 of each of the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e based on element-specific sensing data sensed via the sensor unit 30 of each of the vibration elements 210a, 210b, 210c, 210d, and 210e. Such a vibration drive circuit is substantially the same as the vibration drive circuit 250 described in FIG. 24, and therefore, repeated description thereof will be omitted.

[0453] The vibration generator 200 according to one embodiment of the present specification may include one or more vibration elements 210a, 210b, 210c, 210d, and 210e configured in each of the first to third regions (A1, A2, A3, A4, and A5) of the vibration member 100.

[0454] According to one embodiment of the present specification, the vibration generating device 200 may include a plurality of vibration channels (GR1, GR2, GR3, GR4, GR5) each having one or more vibration elements. For example, the vibration drive signals supplied to the one or more vibration elements configured in each of the plurality of vibration channels (GR1, GR2, GR3, GR4, GR5) may be the same or different. For example, the number of vibration elements configured in each of the plurality of vibration channels (GR1, GR2, GR3, GR4, GR5) may be the same or different.

[0455] According to one embodiment of the present specification, the vibration generating device 200 may include a first vibration element 210a configured in a first region (A1) of the vibration member 100, a second vibration element 210b configured in a second region (A2) of the vibration member 100, a third vibration element 210c configured in a third region (A3) of the vibration member 100, a fourth vibration element 210d configured in a fourth region (A4) of the vibration member 100, and a fifth vibration element 210e configured in a fifth region (A5) of the vibration member 100.

[0456] According to one embodiment of the present specification, the fourth vibration element 210d may include a fourth-first vibration element 210d1 and a fourth-second vibration element 210d2. The fourth-first vibration element 210d1 and the fourth-second vibration element 210d2 may have the same size as or different from the first, second, and third vibration elements 210a, 210b, and 210c, respectively. For example, the fourth-first vibration element 210d1 and the fourth-second vibration element 210d2 may have a smaller size than the adjacent first vibration element 210a and the third vibration element 210c, respectively.

[0457] According to one embodiment of the present specification, the fifth vibration element 210e may include a fifth-first vibration element 210e1 and a fifth-second vibration element 210e2. The fifth-first vibration element 210e1 and the fifth-second vibration element 210e2 may have the same size as or different from the first, second, and third vibration elements 210a, 210b, and 210c. For example, the fifth-first vibration element 210e1 and the fifth-second vibration element 210e2 may have a smaller size than the adjacent second vibration element 210b and third vibration element 210c.

[0458] The 4-1 vibration element 210d1 and the 4-2 vibration element 210d2 may have the same size as each other or different sizes. The 5-1 vibration element 210e1 and the 5-2 vibration element 210e2 may have the same size as each other or different sizes. The 4-1 vibration element 210d1 and the 4-2 vibration element 210d2 and the 5-1 vibration element 210e1 and the 5-2 vibration element 210e2 may have the same size as each other or different sizes.

[0459] The first to fifth vibration elements 210a, 210b, 210c, 210d, and 210e can respectively configure first to fifth vibration channels (GR1, GR2, GR3, GR4, and GR5).

[0460] According to one embodiment of the present specification, the first to fifth vibration elements 210a, 210b, 210c, 210d, and 210e formed in the first to fifth vibration channels (GR1, GR2, GR3, GR4, and GR5), respectively, can be vibrated by the same vibration drive signal. For example, the vibration drive circuit supplies the same low-frequency vibration drive signal to the first to fifth vibration elements 210a, 210b, 210c, 210d, and 210e of the first to fifth vibration channels (GR1, GR2, GR3, GR4, and GR5), respectively, for acoustic frequencies in the low-frequency range, thereby improving the acoustic characteristics and / or sound pressure characteristics in the low-frequency range generated by the vibration of the vibrating member 100.

[0461] According to one embodiment of the present specification, the first vibration element 210a configured in the first vibration channel (GR1) can vibrate in response to a vibration drive signal to realize a left sound or a left channel. The second vibration element 210b configured in the second vibration channel (GR2) can vibrate in response to a vibration drive signal to realize a right sound or a right channel. The third vibration element 210c configured in the third vibration channel (GR3) can vibrate in response to a vibration drive signal to realize a center sound or a center channel.

[0462] According to one embodiment of the present specification, high-frequency sound waves generated in the first vibration channel (GR1) proceed to the third vibration channel (GR3) via the fourth vibration channel (GR4), and high-frequency sound waves generated in the second vibration channel (GR2) proceed to the third vibration channel (GR3) via the fifth vibration channel (GR5), so that separation into the left and right channels and the center channel may not be performed. As a result, the fourth vibration element 210d configured in the fourth vibration channel (GR4) and the fifth vibration element 210e configured in the fifth vibration channel (GR5) vibrate in response to a vibration drive signal, thereby forming sound separation channels that separate the left and right sounds (or left and right channels) from the center sound (or center channel).

[0463] According to one embodiment of the present specification, the 4-1 vibration element 210d1 of the fourth vibration channel (GR4) vibrates in response to the 4-1 acoustic isolation vibration drive signal to generate the 4-1 acoustic isolation wave, thereby blocking or minimizing sound waves traveling from the first vibration channel (GR1) to the third vibration channel (GR3). In one embodiment of the present specification, the 4-1 acoustic isolation vibration drive signal may have a different phase or an opposite phase from the vibration drive signal supplied to the first vibration element 210a of the first vibration channel (GR1). For example, the treble frequency component of the 4-1 acoustic isolation vibration drive signal may have an opposite phase to the treble frequency component of the vibration drive signal supplied to the first vibration element 210a of the first vibration channel (GR1).

[0464] According to one embodiment of the present specification, the 4-2 vibration element 210d2 of the fourth vibration channel (GR4) vibrates in response to the 4-2 acoustic isolation vibration drive signal to generate a 4-2 acoustic isolation wave, thereby blocking or minimizing sound waves traveling from the third vibration channel (GR3) to the first vibration channel (GR1). In one embodiment of the present specification, the 4-2 acoustic isolation vibration drive signal may have a different phase or an opposite phase from the vibration drive signal supplied to the third vibration element 210c of the third vibration channel (GR3). For example, the treble frequency component of the 4-2 acoustic isolation vibration drive signal may have an opposite phase to the treble frequency component of the vibration drive signal supplied to the third vibration element 210c of the third vibration channel (GR3).

[0465] According to one embodiment of the present specification, the 5-1 vibration element 210e1 of the fifth vibration channel (GR5) vibrates in response to the 5-1 acoustic isolation vibration drive signal to generate the 5-1 acoustic isolation wave, thereby blocking or minimizing sound waves traveling from the third vibration channel (GR3) to the second vibration channel (GR2). In one embodiment of the present specification, the 5-1 acoustic isolation vibration drive signal may have a different phase or an opposite phase from the vibration drive signal supplied to the third vibration element 210c of the third vibration channel (GR3). For example, the treble frequency component of the 5-1 acoustic isolation vibration drive signal may have an opposite phase to the treble frequency component of the vibration drive signal supplied to the third vibration element 210c of the third vibration channel (GR3).

[0466] According to one embodiment of the present specification, the 5-2 vibration element 210e2 of the fifth vibration channel (GR5) vibrates in response to the 5-2 acoustic isolation vibration drive signal to generate a 5-2 acoustic isolation wave, thereby blocking or minimizing sound waves traveling from the second vibration channel (GR2) to the third vibration channel (GR3). In one embodiment of the present specification, the 5-2 acoustic isolation vibration drive signal may have a different phase or an opposite phase from the vibration drive signal supplied to the second vibration element 210b of the second vibration channel (GR2). For example, the treble frequency component of the 5-2 acoustic isolation vibration drive signal may have an opposite phase to the treble frequency component of the vibration drive signal supplied to the second vibration element 210b of the second vibration channel (GR2).

[0467] The device according to another embodiment of the present disclosure may further include a vibration control member 260 .

[0468] The vibration control member 260 may be configured so that the mass distribution of the vibration member 100 gradually increases from the edge portion to the middle portion.

[0469] The vibration control member 260 may be connected or coupled to the rear surfaces of the first to fifth vibration elements 210a, 210b, 210c, 210d, and 210e, which are respectively configured in the first to fifth regions (A1, A2, A3, A4, and A5) defined in the vibration member 100. The mass of the vibration control member 260 according to an embodiment of the present specification may increase from the edge portions (E1 and E2) of the vibration member 100 toward the center portion. For example, the mass of the vibration control member 260 may gradually increase from the first vibration element 210a to the third-first vibration element 210c1 and gradually decrease from the third-second vibration element 210c2 to the fifth vibration element 210e. This vibration control member 260 is substantially the same as the vibration control member 260 described with reference to FIGS. 31 and 32, and therefore, redundant description thereof will be omitted.

[0470] In Figures 35 and 36, the vibration control member 260 is described as being configured for each of the first to fifth vibration elements 210a, 210b, 210c, 210d, and 210e, but this is not limited to this, and the vibration control member 260 can be coupled only to each of the 3-1 and 3-2 vibration elements 210c1 and 210c2 of the third vibration channel (GR3), as described in Figures 29 and 30, thereby allowing the vibration control member 260 to relatively increase or concentrate the mass distribution in the middle portion of the vibration member 100, thereby further improving the acoustic characteristics and / or sound pressure characteristics in the low-frequency range.

[0471] Such a device according to another embodiment of the present specification may have the same effects as the device described in Fig. 24 or the same effects as the device described in Fig. 29 to Fig. 32. Furthermore, in the device according to another embodiment of the present specification, the left and right sounds and the center sound are separated from each other by the vibration of the fourth vibration element 210d of the fourth vibration channel (GR4) formed between the first region (A1) and the third region (A3) of the vibrating member 100, and the vibration of the fifth vibration element 210e of the fifth vibration channel (GR5) formed between the second region (A2) and the third region (A3) of the vibrating member 100, so that three-channel sound can be provided to the user by the left, right and center sounds, and the acoustic characteristics and / or sound pressure characteristics of the low-frequency range of each of the left and right sounds can be improved by the vibration control member 260.

[0472] Figure 37 is another cross-sectional view taken along line F-F' in Figure 26. Figure 38 is a plan view of the device shown in Figure 37. Figures 37 and 38 show the device described in Figures 27 and 28 to which a vibration damping member is further added. Therefore, in the following description, the remaining components, except for the vibration damping member and related components, will be given the same reference numerals, and redundant description thereof will be omitted.

[0473] 26, 37 and 38, devices according to other embodiments of the present disclosure may further include a vibration adjustment member.

[0474] The vibration control member 270 can be configured to reduce the dip phenomenon in the sound generated by the vibration of the vibration elements 210a, 210b, 210c, 210d, and 210e. For example, the vibration adjusting member 270 can improve the dip phenomenon that occurs in the high-frequency band frequency components generated by the vibration of the vibrating member 100 by adjusting the vibration of the vibrating elements 210a, 210b, 210c, 210d, and 210e. For example, the vibration adjusting member 270 can improve the dip phenomenon in the frequency range of 3 kHz to 4 kHz in the sound generated by the vibration of the vibrating member 100. The frequency components of 3 kHz to 4 kHz can affect the clarity of the sound, and if a dip phenomenon occurs at this frequency, the sound output characteristics can be reduced due to unclear sound.

[0475] The vibration adjustment member 270 according to one embodiment of the present specification may be configured between one or more vibration elements 210a, 210b, 210c, 210d, and 210e connected or coupled to the vibration member 100 and the housing 300. The vibration adjustment member 270 may be configured between the rear surface of each of the first to fifth vibration elements 210a, 210b, 210c, 210d, and 210e and the bottom 310 of the housing 300.

[0476] According to one embodiment of the present specification, a first surface (or front surface) of vibration tuning member 270 may be adhered or coupled to vibration elements 210a, 210b, 210c, 210d, and 210e. A second surface (or rear surface) of vibration tuning member 270 may be adhered or coupled to bottom 310 of housing 300. In this way, vibration tuning member 270 can support vibration elements 210a, 210b, 210c, 210d, and 210e using bottom 310 of housing 300 as a support base, and thus vibration elements 210a, 210b, 210c, 210d, and 210e can be fixed to housing 300 by vibration tuning member 270. For example, central portions of vibration elements 210a, 210b, 210c, 210d, and 210e can be fixed to housing 300 by vibration tuning member 270. This can improve the dip phenomenon at 3 kHz to 4 kHz.

[0477] According to one embodiment of the present specification, the vibration adjusting member 270 may be a mass body connected between the vibration elements 210a, 210b, 210c, 210d, and 210e and the housing 300. The vibration adjusting member 270 functions as a mass (m), stiffness (k), and damping (c) in a function that represents the natural frequency characteristics of the vibration elements 210a, 210b, 210c, 210d, and 210e, thereby inducing damped vibration of the vibration elements 210a, 210b, 210c, 210d, and 210e. This improves the vibration balance of the vibration elements 210a, 210b, 210c, 210d, and 210e, reduces dips due to transient responses, and improves acoustic flatness. The vibration adjusting member 270 also reduces anti-phase vibration of the vibration elements 210a, 210b, 210c, 210d, and 210e.

[0478] The vibration damping member 270 according to an embodiment of the present disclosure may be made of an elastic material capable of absorbing or damping vibrations. For example, the vibration damping member 270 may be made of, but is not limited to, one or more of a silicone-based polymer, a polyolefin, a paraffin wax, and an acrylic-based polymer. For example, the vibration damping member 270 may be expressed as, but is not limited to, an elastic member, a buffer member, a pad member, a foam member, a damping member, or a damping portion.

[0479] Such a device according to another embodiment of the present specification may have the same effect as the device described in Fig. 24 or the same effect as the device described in Fig. 26 to Fig. 28. In addition, the device according to another embodiment of the present specification may further include vibration adjustment member 270 configured between vibration elements 210a, 210b, 210c, 210d, and 210e and housing 300, thereby improving the acoustic dip phenomenon that occurs with vibration of vibrating member 100, and thereby improving the acoustic output characteristics and acoustic flatness.

[0480] Figure 39 is another cross-sectional view taken along line F-F' in Figure 26. Figure 40 is a plan view of the device shown in Figure 39. Figures 39 and 40 show the device described in Figures 37 and 38 to which a partition member is further added. Therefore, in the following description, the same reference numerals will be used for the remaining components except for the partition member and related components, and redundant description thereof will be omitted.

[0481] 26, 39, and 40, devices according to other embodiments herein may further include a partition member 275.

[0482] The partition member 275 according to one embodiment of the present specification may be configured between the second surface 100b of the vibration member 100 around one or more vibration elements 210a, 210b, 210c, 210d, and 210e and the housing 300. The partition member 275 may be configured between the second surface 100b of the vibration member 100 and the bottom 310 of the housing 300 in one or more regions among the regions between the first to fifth vibration elements 210a, 210b, 210c, 210d, and 210e.

[0483] According to one embodiment of the present specification, the first surface (or front surface) of the partition member 275 may be adhered or coupled to the second surface 100b of the vibration member 100. The second surface (or back surface) of the partition member 275 may be adhered or coupled to the bottom 310 of the housing 300. For example, the partition member 275 may be made of a material that can absorb or adjust vibrations. For example, the partition member 275 may be made of the same material as the vibration adjustment member 270. The partition member 275 may be adhered or coupled to the second surface 100b of the vibration member 100 and the bottom 310 of the housing 300 via an adhesive member such as double-sided tape or double-sided foam tape.

[0484] The partition member 275 according to one embodiment of the present specification can reduce anti-phase vibrations of the vibration member 100 by damping the vibrations of the vibration member 100 around one or more vibration elements 210a, 210b, 210c, 210d, and 210e.

[0485] According to one embodiment of the present specification, the vibration member 100 may include a first region (A1), a second region (A2), and a third region (A3) between the first region (A1) and the second region (A2). For example, the first region (A1) may be an edge region on one side of the vibration member 100, the second region (A2) may be an edge region on the other side of the vibration member 100, and the third region (A3) may be a middle region of the vibration member 100.

[0486] The partition member 275 according to one embodiment of the present specification may be configured between the second surface 100b of the vibrating member 100 and the bottom 310 of the housing 300, between the first region (A1) and the third region (A3) and between the second region (A2) and the third region (A3). As a result, the partition member 275 spatially separates the first to third regions (A1, A2, A3) of the vibrating member 100, thereby preventing or minimizing acoustic interference between the first to third regions (A1, A2, A3).

[0487] The numbers of vibration elements 210a, 210b, 210c, 210d, and 210e arranged in each of the first to third regions (A1, A2, and A3) of the vibration member 100 may be the same or different. For example, each of the first region (A1) and the second region (A2) may include one or more vibration elements 210a and 210e. The third region (A3) may include a plurality of vibration elements 210b, 210c, and 210d, which is greater than the number of vibration elements arranged in each of the first region (A1) and the second region (A2).

[0488] Such a device according to another embodiment of the present specification may have the same effect as the device described in Fig. 37. In addition, the device according to another embodiment of the present specification may further include a partition member 275 arranged between the vibrating member 100 and the housing 300 around the vibrating elements 210a, 210b, 210c, 210d, and 210e, thereby reducing anti-phase vibration of the vibrating member 100 and improving the acoustic output characteristics and acoustic flatness.

[0489] Figure 41 is another cross-sectional view taken along line F-F' in Figure 26. Figure 42 is a plan view of the device shown in Figure 41. Figures 41 and 42 show the device described in Figures 27 and 28 to which a gap member is further added. Therefore, in the following description, the same reference numerals will be used for the remaining components except for the gap member and related components, and redundant description thereof will be omitted.

[0490] 26, 41 and 42, devices according to other embodiments herein may further include a gap member 280.

[0491] The gap member 280 may be configured to reduce anti-phase vibrations of the vibration elements 210a, 210b, 210c, 210d, and 210e. For example, the vibration member 100 vibrates due to the vibration of each of the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e arranged at regular intervals. This may cause anti-phase vibrations in one or more of the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e due to the vibration of the vibration member 100, or may cause anti-phase vibrations in regions of the vibration member 100 corresponding to regions between the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e. This may result in non-uniform vibrations or peak and dip phenomena, which may reduce the vibration characteristics or acoustic output characteristics of the vibration member 100.

[0492] The gap member 280 may be configured between one or more of the vibration elements 210 a , 210 b , 210 c , 210 d , 210 e and the housing 300 , and between the vibration member 100 and the housing 300 .

[0493] The gap member 280 according to an embodiment of the present disclosure may include one or more of a first gap member 281 and a second gap member 283 .

[0494] The first gap member 281 according to an embodiment of the present specification may be configured to form a first air gap (AG1) between the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e and the housing 300. The first gap member 281 may include a first support portion 281a and a first gap plate 281b.

[0495] The first support portion 281a may be configured perpendicular to the bottom 310 of the housing 300 overlapping with the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e. For example, the first support portion 281a may overlap with the center portions of the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e. The height of the first support portion 281a may be smaller than the height between the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e and the bottom 310 of the housing 300.

[0496] The first gap plate 281b may be configured on an upper surface of the first support portion 281a so as to face the rear surfaces of the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e. The first gap plate 281b may be parallel to or directly face the rear surfaces of the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e with a first air gap (AG1) therebetween. For example, the first gap plate 281b may have the same size as or a smaller size than the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e.

[0497] According to one embodiment of the present specification, the first support portion 281a and the first gap plate 281b may be made of the same material. For example, the first support portion 281a and the first gap plate 281b may be made of, but are not limited to, a plastic material. For example, the first support portion 281a and the first gap plate 281b may be made of the same material as the housing 300.

[0498] According to an embodiment of the present specification, the first support portion 281a and the first gap plate 281b may be made of different materials. For example, the first support portion 281a may be made of a plastic material or the same material as the housing 300, and the first gap plate 281b may be made of a plastic material different from that of the first support portion 281a or a metal material, but is not limited thereto.

[0499] The first gap member 281 according to one embodiment of the present specification can function as an air rigidity member by forming a relatively narrow first air gap (AG1) on the rear surface of the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e. For example, the first gap member 281 can reduce anti-phase vibrations of the vibration elements through an air damping effect caused by air flow on the rear surface of the vibration elements, and can maintain constant the impedance components (or air impedance or elastic impedance) acting on each of the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e using air, thereby improving the acoustic characteristics and / or sound pressure characteristics in the low frequency range and improving the sound quality of high frequency sounds.

[0500] In the first gap member 281 according to one embodiment of the present specification, the first gap plate 281b may be configured to be in direct contact with the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e. In this case, the first gap plate 281b may be made of a material that can absorb or adjust vibrations. The first gap member 281 configured so that the first gap plate 281b is in direct contact with the vibration elements 210a, 210b, 210c, 210d, and 210e has substantially the same function as the vibration adjustment member 270 described with reference to FIGS. 37 and 38, and therefore, a redundant description thereof will be omitted.

[0501] The second gap member 283 according to an embodiment of the present specification may be configured to form a second air gap (AG2) between the vibration member 100 around the vibration elements 210a, 210b, 210c, 210d, and 210e and the housing 300. The second gap member 283 may be configured to spatially separate the spaces behind each of the multiple vibration elements 210a, 210b, 210c, 210d, and 210e.

[0502] The second gap member 283 according to an embodiment of the present disclosure may include a second support portion 283a and a second gap plate 283b.

[0503] The second support portion 283a may be configured perpendicular to the bottom 310 of the housing 300 and overlap with the areas between the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e. For example, the height of the second support portion 283a may be smaller than the height between the vibration member 100 and the bottom 310 of the housing 300. An upper side of the second support portion 283a adjacent to the second surface 100b of the vibration member 100 may be located between the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e. For example, the upper side of the second support portion 283a adjacent to the second surface 100b of the vibration member 100 may directly face or be parallel to the side of the adjacent vibration elements 210a, 210b, 210c, 210d, and 210e.

[0504] The second gap plate 283b may be configured on the upper surface of the second support portion 283a so as to face the second surface 100b of the vibration member 100. The second gap plate 283b may face the second surface 100b of the vibration member 100 in parallel or directly with a second air gap (AG2) therebetween.

[0505] According to one embodiment of the present disclosure, the second support portion 283a and the second gap plate 283b may be made of the same material. For example, the second support portion 283a and the second gap plate 283b may be made of, but are not limited to, a plastic material. For example, the second support portion 283a and the second gap plate 283b may be made of the same material as the housing 300.

[0506] According to an embodiment of the present specification, the second support portion 283a and the second gap plate 283b may be made of different materials. For example, the second support portion 283a may be made of a plastic material or the same material as the housing 300, and the second gap plate 283b may be made of a plastic material different from that of the second support portion 283a or a metal material, but is not limited thereto.

[0507] The second gap member 283 according to one embodiment of the present specification can function as an air stiffness member by forming a relatively narrow second air gap (AG2) on the second surface 100b of the vibration member 100 around the plurality of vibration elements 210a, 210b, 210c, 210d, and 210e. For example, the second gap member 283 can reduce the anti-phase vibration of the areas of the vibrating member 100 corresponding to the areas between the plurality of vibrating elements 210a, 210b, 210c, 210d, and 210e or the vibrating elements through the air damping effect caused by the air flow between the plurality of vibrating elements 210a, 210b, 210c, 210d, and 210e, and can keep the impedance component (or air impedance or elastic impedance) acting on each of the plurality of vibrating elements 210a, 210b, 210c, 210d, and 210e constant by the air, thereby improving the acoustic characteristics and / or sound pressure characteristics in the low frequency range and improving the sound quality of the acoustics in the high frequency range.

[0508] In the second gap member 283 according to one embodiment of the present specification, the second gap plate 283b may be configured to be in direct contact with the second surface 100b of the vibrating member 100. In this case, the second gap plate 283b may be made of a material that can absorb or adjust vibrations, or may be replaced with an adhesive material such as double-sided tape or double-sided foam tape. As a result, the second gap member 283 may be connected or coupled to the second surface 100b of the vibrating member 100 and the bottom 310 of the housing 300, thereby functioning as a partition member that separates or spatially separates each of the plurality of vibrating elements 210a, 210b, 210c, 210d, and 210e.

[0509] Such a device according to another embodiment of the present specification may have the same effect as the device described in Fig. 24 or the same effect as the device described in Fig. 26 to Fig. 28. Furthermore, the device according to another embodiment of the present specification may further include a gap member 280 formed between one or more of the vibration elements 210a, 210b, 210c, 210d, 210e and the housing 300, and between the vibration member 100 and the housing 300, thereby reducing anti-phase vibrations of the vibration elements 210a, 210b, 210c, 210d, 210e, and thereby improving the acoustic output characteristics and the degree of acoustic flatness.

[0510] FIG. 43A is a diagram showing the vibration intensity of a device according to an experimental example. FIG. 43B is a diagram showing the vibration intensity of a device according to an example of the present specification. FIG. 43A shows the measurement of the vibration intensity when vibration drive signals having the same phase are applied to two vibration elements. FIG. 43B shows the measurement of the vibration intensity when phase-shifted vibration drive signals are applied to two vibration elements based on sensing data via the sensor unit.

[0511] 43A and 43B, it can be seen that the device according to the experimental example has a maximum vibration intensity of 0.69923. It can be seen that the device according to the present specification has a maximum vibration intensity of 0.73558. It can also be seen that the vibration area of ​​each of the two vibration elements in the device according to the present specification is relatively wider than that of the device according to the experimental example.

[0512] Therefore, the vibration device according to the present specification and devices including the same can improve acoustic characteristics and / or sound pressure characteristics by compensating for or generating a vibration drive signal based on sensing data via the sensor unit.

[0513] The vibration device according to the embodiments of the present specification can be applied to a vibration device disposed on a device (or a display device). The apparatus according to the embodiments of the present specification may be applied to a mobile device, a video phone, a smart watch, a watch phone, a wearable apparatus, a foldable apparatus, a rollable apparatus, a bendable apparatus, a flexible apparatus, a curved apparatus, a sliding apparatus, a variable apparatus, an electronic organizer, an electronic book, a portable multimedia player (PMP), a personal digital assistant (PDA), an MP3 player, a mobile medical device, a desktop PC, a laptop PC, a netbook computer, a workstation, a navigation system, a vehicle navigation system, a vehicle display device, a vehicle device, a theater device, a theater display device, a television, a wallpaper device, a signage device, a game device, a notebook computer, a monitor, a camera, a video camera, and a home appliance. Furthermore, a vibration device according to some embodiments of the present specification may be applied to a light-emitting diode lighting device, an organic light-emitting lighting device, or an inorganic light-emitting lighting device. When the vibration device is applied to a lighting device, the vibration device may serve as a light and a speaker. When the vibration device according to some embodiments of the present specification is applied to a mobile device, the vibration device may serve as one or more of a speaker, a receiver, and a haptic, but is not limited thereto. In another embodiment of the present specification, the vibration device according to some embodiments of the present specification may be applied to a non-display device or a vibrating object (or a vibrating member) instead of a display device.For example, when the vibration device is applied to a non-display device or a vibrating object rather than a display device, the vibration device may be, but is not limited to, a vehicle speaker, a speaker implemented together with lighting, or the like.

[0514] A vibration device according to an embodiment of the present specification may include a vibration generator including a piezoelectric material and a sensor unit configured in the vibration generator.

[0515] According to some embodiments herein, the sensor unit may be configured externally or internally to the vibration generator.

[0516] According to some embodiments of the present disclosure, the vibration generator may include an inner region and an outer region surrounding the inner region, and the sensor unit may include one or more sensors configured in one or more of the inner region and the outer region of the vibration generator.

[0517] According to some embodiments of the present specification, the vibration generator may include a plurality of corner portions and a central portion between the plurality of corner portions, and the sensor unit may include one or more sensors configured in one or more of the plurality of corner portions and the central portion of the vibration generator.

[0518] According to some embodiments of the present specification, the vibration generator includes a vibration part including a piezoelectric material, a first protective member arranged on a first surface of the vibration part, and a second protective member arranged on a second surface different from the first surface of the vibration part, and the sensor part may be configured on one or more of the first protective member and the second protective member.

[0519] According to some embodiments herein, the sensor portion may be overlapped with at least a portion of the vibration portion.

[0520] According to some embodiments of the present specification, the sensor portion may include a gauge pattern portion configured to contact an inner surface of either the first protective member or the second protective member facing the vibration portion, and a sensor lead wire connected to the gauge pattern portion.

[0521] According to some embodiments of the present specification, the vibration generator may include a vibration part including a piezoelectric material, a first protective member arranged on a first surface of the vibration part, and a second protective member arranged on a second surface different from the first surface of the vibration part, and the sensor part may be configured between the first protective member and the second protective member.

[0522] According to some embodiments of the present specification, the sensor portion may include a base member disposed between the first protective member and the second protective member, a gauge pattern portion formed on the base member, an insulating member formed on the base member to cover the gauge pattern portion, and a sensor lead wire connected to the gauge pattern portion.

[0523] According to some embodiments of the present specification, a vibration generator includes a plurality of vibrating structures arranged along a first direction and a second direction intersecting the first direction, each of the vibrating structures including a piezoelectric material, a first protective member connected to a first surface of each of the plurality of vibrating structures via a first adhesive layer, and a second protective member connected to a second surface different from the first surface of each of the plurality of vibrating structures via a second adhesive layer, and a sensor unit may be configured on one or more of the first protective member and the second protective member.

[0524] According to some embodiments of the present specification, the sensor portion includes a gauge pattern portion configured to contact an inner surface of either the first protective member or the second protective member facing the vibration portion, and the gauge pattern portion may be covered by one or more of the first adhesive layer and the second adhesive layer.

[0525] According to some embodiments of the present specification, each of the plurality of vibration structures may include a vibration portion including a piezoelectric material and a soft material, a first electrode portion configured between the vibration portion and a first protective member, and a second electrode portion configured between the vibration portion and a second protective member.

[0526] According to some embodiments of the present disclosure, the vibration portion may include a plurality of inorganic material portions including a piezoelectric material, and an organic material portion including a soft material and located between the plurality of inorganic material portions.

[0527] According to some embodiments of the present specification, the vibration generator may further include a first power supply line configured between a first electrode portion of each of the plurality of vibration structures and the first protective member, and a second power supply line configured between a second electrode portion of each of the plurality of vibration structures and the second protective member.

[0528] According to some embodiments of the present disclosure, the sensor unit may include a gauge pattern unit configured in the same layer as one or more of the first power supply line and the second power supply line.

[0529] The vibration device according to some embodiments of the present disclosure may further include a vibration drive circuit coupled to each of the vibration generator and the sensor unit.

[0530] According to some embodiments of the present specification, the vibration drive circuit may include a signal generation circuit section including an amplifier circuit that supplies a vibration drive signal to the vibration generator, a sensing circuit section that is connected to the sensor section and senses changes in the electrical characteristics of the sensor section to generate sensing data, and a control circuit section that supplies vibration data to the signal generation circuit section and corrects the gain value of the amplifier circuit based on the sensing data.

[0531] A device according to some embodiments of the present specification may include a vibration generating device having a vibration member and one or more vibration elements configured to vibrate the vibration member, wherein the one or more vibration elements may include a vibration generator including a piezoelectric material and a sensor portion configured on the vibration generator.

[0532] According to some embodiments of the present disclosure, the vibration generating device may further include a vibration generator configured with one or more vibration elements and a vibration drive circuit coupled to the sensor unit.

[0533] According to some embodiments of the present specification, the vibration drive circuit may include a signal generation circuit section including an amplifier circuit that supplies a vibration drive signal to the vibration generator, a sensing circuit section that is connected to the sensor section and senses changes in the electrical characteristics of the sensor section to generate sensing data, and a control circuit section that supplies vibration data to the signal generation circuit section and corrects the gain value of the amplifier circuit based on the sensing data.

[0534] According to some embodiments of the present specification, a vibration generating device includes a plurality of vibration channels having one or more vibration elements, and the vibration drive signals supplied to the vibration elements configured in each of the plurality of vibration channels can be the same or different.

[0535] According to some embodiments of the present disclosure, the number of vibration elements configured in each of the multiple vibration channels may be the same or different.

[0536] According to some embodiments of the present specification, the vibration member includes first to third regions, and the vibration generating device includes a first vibration channel having one or more vibration elements configured in the first region of the vibration member, a second vibration channel having one or more vibration elements configured in the second region of the vibration member, and a third vibration channel having one or more vibration elements configured in a third region between the first and second regions of the vibration member, and the vibration drive signals supplied to the vibration elements configured in each of the first to third vibration channels may be the same or different.

[0537] According to some embodiments of the present specification, the third vibration channel includes a third-1 vibration element and a third-2 vibration element, and the vibration drive signal supplied to the third-1 vibration element can be the same as or different from the vibration drive signal supplied to the third-2 vibration element.

[0538] According to some embodiments of the present specification, the vibration drive signal supplied to the 3-1 vibration element may be the same as or different from the vibration drive signal supplied to the vibration element configured in the first vibration channel, and the vibration drive signal supplied to the 3-2 vibration element may be the same as or different from the vibration drive signal supplied to the vibration element configured in the second vibration channel.

[0539] According to some embodiments of the present specification, the vibration member further includes a fourth region between the first region and the third region, and a fifth region between the second region and the third region, and the vibration generating device includes a fourth vibration channel having one or more vibration elements configured in the fourth region of the vibration member, and a fifth vibration channel having one or more vibration elements configured in the fifth region of the vibration member, and the vibration drive signals supplied to the vibration elements configured in each of the first to fifth vibration channels may be the same or different.

[0540] According to some embodiments of the present specification, the fourth vibration channel includes a 4-1 vibration element and a 4-2 vibration element, the fifth vibration channel includes a 5-1 vibration element and a 5-2 vibration element, and the vibration drive signal supplied to the 4-1 vibration element can be the same as or different from the vibration drive signal supplied to the 4-2 vibration element, and the vibration drive signal supplied to the 5-1 vibration element can be the same as or different from the vibration drive signal supplied to the 5-2 vibration element.

[0541] According to some embodiments of the present specification, the vibration drive signal supplied to the 4-1 vibration element may be the same as or different from the vibration drive signal supplied to the vibration element configured in the first vibration channel, the vibration drive signal supplied to the 4-2 vibration element may be the same as or different from the vibration drive signal supplied to the vibration element configured in the third vibration channel, the vibration drive signal supplied to the 5-1 vibration element may be the same as or different from the vibration drive signal supplied to the vibration element configured in the third vibration channel, and the vibration drive signal supplied to the 4-2 vibration element may be the same as or different from the vibration drive signal supplied to the vibration element configured in the second vibration channel.

[0542] According to some embodiments of the present specification, the vibration member includes a plurality of regions, each of which includes one or more vibration elements, and the vibration generating device may further include a vibration control member coupled to one or more vibration elements configured in an intermediate region of the plurality of regions.

[0543] According to some embodiments herein, the mass distribution of the vibration member coupled to the vibration generator may be higher at the middle portion than at the edge portion.

[0544] According to some embodiments of the present disclosure, the mass distribution of the vibration member coupled to the vibration generator may increase from the edge portion to the middle portion.

[0545] The device according to some embodiments of the present specification may further include a housing that covers the rear surface of the vibration member and the vibration generating device, and a vibration adjusting member that is arranged between the rear surface of the vibration member and the housing.

[0546] According to some embodiments of the present disclosure, the device of claim 32, wherein the vibration-damping member is made of an elastic material.

[0547] The device according to some embodiments herein may further include a partition member configured between the rear surface of the vibration member and the housing around the one or more vibration elements.

[0548] According to some embodiments of the present specification, the vibration member includes a first region, a second region, and a third region between the first region and the second region, and the partition member can separate each of the first to third regions.

[0549] According to some embodiments of the present specification, the number of vibration elements configured in the third region may be greater than the number of vibration elements configured in each of the first region and the second region.

[0550] The device according to some embodiments of the present specification may further include a housing that covers the back surface of the vibration member and the vibration generating device, and a gap member configured between one or more of the vibration element and the housing and between the back surface of the vibration member and the housing.

[0551] According to some embodiments of the present specification, the gap member may include one or more of a first gap member configured between the vibration element and the housing with a first air gap therebetween, and a second gap member configured between the vibration element and the housing with a second air gap therebetween.

[0552] According to some embodiments of the present specification, the vibration generating device may include a plurality of vibration elements, a first gap member may be configured between each of the plurality of vibration elements and the housing with a first air gap therebetween, and a second gap member may be configured between the rear surface of the vibration member and the housing in the region between the plurality of vibration elements with a second air gap therebetween.

[0553] The present specification, which has been described with reference to the above, is not limited to the above-described embodiments and the attached drawings, and it will be apparent to those skilled in the art that various substitutions, modifications, and alterations are possible within the scope of the technical idea of ​​the present specification. Therefore, the scope of the present specification is defined by the claims set forth below, and all modifications and alterations derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present specification. [Explanation of symbols]

[0554] 10: Vibration generator 11-1~11-4: Vibration structure 11a: Vibration part 11b: First electrode part 11c: Second electrode part 13: First protective member 15: Second protective member 17: Pad section 30: Sensor unit 30-1 to 30-7: Sensor 31: Base material 33: Gauge pattern section 35: Insulating material 100: Vibration member 200: Vibration generator 210a to 210e: vibration elements 220: Connecting member 250: Vibration drive circuit

Claims

1. A vibrating member; a vibration generating device including a piezoelectric material and disposed on the vibration member, the vibration generating device including a first vibration element and a second vibration element; a first sensor unit configured on the first vibration element and a second sensor unit configured on the second vibration element; a first enclosure bonded to a surface of the vibration member so as to surround or cover the first vibration element and the first sensor portion; a second enclosure bonded to a surface of the vibration member so as to surround or cover the second vibration element and the second sensor portion; The device, wherein each of the first sensor unit and the second sensor unit includes one or more sensors configured at one or more of a plurality of corner portions of the first vibration element and the second vibration element and at a central portion of the first vibration element and the second vibration element.

2. each of the first vibration element and the second vibration element includes an inner region and an outer region surrounding the inner region; The device according to claim 1 , wherein each of the first and second sensor units is configured in one or more of the inner and outer regions of the vibration generating device.

3. Each of the first vibration element and the second vibration element is at least one vibrating structure having a vibrating portion including the piezoelectric material; a first protective member disposed on a first surface of the vibration section; The device according to claim 1 , further comprising: a second protective member disposed on a second surface of the vibration portion opposite the first surface.

4. The first and second sensor units are disposed on the first protective member and / or the second protective member, respectively; or The device of claim 3 , wherein each of the first and second sensor portions is disposed between the first and second protective members.

5. The vibration device according to claim 3 , wherein each of the first and second sensor units overlaps at least a portion of the vibration unit.

6. Each of the first and second sensor units includes: a gauge pattern portion configured to come into contact with an inner surface of either the first protective member or the second protective member facing the vibration portion; 4. The apparatus of claim 3, further comprising a sensor lead connected to the gauge pattern portion.

7. Each of the first and second sensor units includes: a base member disposed between the first protective member and the second protective member; a gauge pattern portion formed on the base member; an insulating member formed on the base member so as to cover the gauge pattern portion; 4. The apparatus of claim 3, further comprising a sensor lead connected to the gauge pattern portion.

8. Each of the first vibration element and the second vibration element is a plurality of vibration structures including the piezoelectric material, the vibration structures being arranged along a first direction and a second direction intersecting the first direction; the first protection member is connected to the first surface of each of the plurality of vibration structures via a first adhesive layer; The device according to claim 3 , wherein the second protective member is coupled to a second surface of each of the plurality of vibrating structures, the second surface being different from the first surface, via a second adhesive layer.

9. each of the first and second sensor units includes a gauge pattern unit configured to come into contact with an inner surface of either the first protective member or the second protective member facing the vibration unit; The device of claim 8 , wherein the gauge pattern portion is covered by one or more of the first adhesive layer and the second adhesive layer.

10. Each of the plurality of vibrating structures comprises: a vibration part including the piezoelectric material and a soft material; a first electrode portion configured between the vibration portion and the first protection member; The device according to claim 8 , further comprising a second electrode portion configured between the vibration portion and the second protection member.

11. The vibration unit is a plurality of inorganic material portions including the piezoelectric material; The device of claim 10 , further comprising: an organic material portion that includes the soft material and is located between the plurality of inorganic material portions.

12. The vibration generating device is a first power supply line configured between the first electrode portion of each of the plurality of vibration structures and the first protection member; The vibration device according to claim 10 , further comprising: a second power supply line configured between the second electrode portion of each of the plurality of vibration structures and the second protection member.

13. 13. The device of claim 12, wherein each of the first and second sensor portions includes a gauge pattern portion configured in the same layer as one or more of the first power supply line and the second power supply line.

14. The vibration device according to claim 1 , further comprising a vibration drive circuit coupled to the vibration generator and the first and second sensor units, respectively.

15. The vibration drive circuit includes: a signal generating circuit unit including an amplifier circuit that supplies a vibration drive signal to the vibration generating device; a sensing circuit unit connected to each of the first and second sensor units, for sensing a change in an electrical characteristic of the sensor units and generating sensing data; The vibration device according to claim 14 , further comprising: a control circuit section that supplies vibration data to the signal generation circuit section and corrects a gain value of the amplifier circuit based on the sensing data.

16. the vibration generating device includes a first vibration channel having the first vibration element and a second vibration channel including the second vibration element; The apparatus of claim 1 , wherein the vibration drive signals supplied to the vibration elements configured in each of the first and second vibration channels are the same or different.

17. 17. The device of claim 16, wherein the number of vibration elements configured in each of the first and second vibration channels is the same or different.

18. the vibration member includes first to third regions, The vibration generating device is a first vibration channel configured in the first region of the vibration member and having the first vibration element; a second vibration channel configured in the second region of the vibration member and having the second vibration element; a third vibration channel having one or more vibration elements configured in the third region between the first region and the second region of the vibration member; The device according to claim 1 , wherein the vibration drive signals supplied to the vibration elements configured in each of the first to third vibration channels are the same or different.

19. the third vibration channel includes a third-1 vibration element and a third-2 vibration element; 19. The apparatus of claim 18, wherein the vibration drive signal supplied to the third-1 vibration element is the same as or different from the vibration drive signal supplied to the third-2 vibration element.

20. The vibration drive signal supplied to the 3-1 vibration element is the same as or different from the vibration drive signal supplied to the vibration element configured in the first vibration channel, 20. The apparatus of claim 19, wherein the vibration drive signal supplied to the third-second vibration element is the same as or different from the vibration drive signal supplied to a vibration element configured in the second vibration channel.

21. the vibration member further includes a fourth region between the first region and the third region, and a fifth region between the second region and the third region; The vibration generating device is a fourth vibration channel having one or more vibration elements configured in the fourth region of the vibration member; a fifth vibration channel having one or more vibration elements configured in the fifth region of the vibration member; 19. The device of claim 18, wherein the vibration drive signals supplied to the vibration elements configured in each of the first to fifth vibration channels are the same or different.

22. the fourth vibration channel includes a fourth-1 vibration element and a fourth-2 vibration element; the fifth vibration channel includes a fifth-1 vibration element and a fifth-2 vibration element; The vibration drive signal supplied to the 4-1 vibration element is the same as or different from the vibration drive signal supplied to the 4-2 vibration element, 22. The apparatus of claim 21, wherein the vibration drive signal supplied to the 5-1 vibration element is the same as or different from the vibration drive signal supplied to the 5-2 vibration element.

23. The vibration drive signal supplied to the 4-1 vibration element is the same as or different from the vibration drive signal supplied to the vibration element configured in the first vibration channel, The vibration drive signal supplied to the 4-2 vibration element is the same as or different from the vibration drive signal supplied to the vibration element configured in the third vibration channel, The vibration drive signal supplied to the 5-1 vibration element is the same as or different from the vibration drive signal supplied to the vibration element configured in the third vibration channel, 23. The apparatus of claim 22, wherein the vibration drive signal supplied to the 5-2 vibration element is the same as or different from the vibration drive signal supplied to a vibration element configured in the second vibration channel.

24. The vibration member is a first region located at a first end, a second region located at a second end, and one or more regions located between the first and second regions; the first region includes the first vibration element, the second region includes the second vibration element, and each of the one or more regions includes one or more vibration elements; The apparatus of claim 1 , wherein the vibration generating device further comprises a vibration control member coupled to the one or more vibration elements.

25. The device of claim 1 , wherein the mass distribution of the vibration member coupled to the vibration generator is higher in a middle portion than in an edge portion.

26. The device of claim 1 , wherein the mass distribution of the vibration member coupled to the vibration generator increases from the edge portion to the middle portion.

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