Light-emitting device

Abstract

To improve the light extraction efficiency of a light-emitting device that can emit light of a desired chromaticity.SOLUTION: A light-emitting device includes a light-emitting element that emits first light, a first wavelength conversion member that is arranged on the light-emitting element and has a bottom surface bonded to the light-emitting element, an upper surface opposite the bottom surface, and a side surface connected to the upper surface, and that is excited by the first light and emits second light, a second wavelength conversion member that exposes the top surface of the first wavelength conversion member, covers the side surface, and has a sloping surface from the side surface to the outside, and emits third light when excited by at least one of the first light and the second light, and a first light reflective member covering the sloping surface.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present disclosure relates to a light emitting device. [Background technology]

[0002] In recent years, there has been an increasing demand for light emitting devices that emit white light and that emit light in a desired chromaticity range. For example, the light emitting device described in Patent Document 1 adjusts the color temperature of the emitted light by using a phosphor layer that covers the side surface of the light emitting element. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2018-082027 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the light emitting device described in Patent Document 1 still has room for improvement in terms of light extraction efficiency.

[0005] The present disclosure aims to improve the light extraction efficiency in a light emitting device that can emit light in a desired chromaticity range. [Means for solving the problem]

[0006] A light emitting device according to one embodiment of the present disclosure includes: a light emitting element that emits a first light; a first wavelength conversion member that is disposed on the light emitting element and has a bottom surface bonded to the light emitting element, an top surface opposite the bottom surface, and a side surface connected to the top surface, and that is excited by the first light to emit a second light; a second wavelength conversion member that exposes the top surface of the first wavelength conversion member and covers the side surface, and has an inclined surface extending outward from the side surface, and that is excited by at least one of the first light and the second light to emit a third light; and a first light reflective member that covers the inclined surface. [Effects of the Invention]

[0007] According to an embodiment of the present disclosure, it is possible to improve the light extraction efficiency in a light emitting device that can emit light in a desired chromaticity range. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a schematic top view of a light emitting device according to a first embodiment of the present disclosure. [Figure 2] 2 is a schematic cross-sectional view of the light-emitting device shown in FIG. 1 taken along line II-II. [Figure 3] 3 is a schematic cross-sectional view of the light-emitting device shown in FIG. 1 taken along line III-III. [Figure 4] FIG. 2 is a diagram schematically illustrating how light travels in the light-emitting device shown in FIG. [Figure 5A] 1 is a schematic cross-sectional view showing one step of a method for manufacturing a light emitting device according to Embodiment 1. FIG. [Figure 5B] 1 is a schematic top view illustrating one step of a method for manufacturing a light emitting device according to Embodiment 1. FIG. [Figure 5C] 1 is a schematic cross-sectional view showing one step of a method for manufacturing a light emitting device according to Embodiment 1. FIG. [Figure 5D] 1 is a schematic cross-sectional view showing one step of a method for manufacturing a light emitting device according to Embodiment 1. FIG. [Figure 5E] 1 is a schematic cross-sectional view showing one step of a method for manufacturing a light emitting device according to Embodiment 1. FIG. [Figure 5F] 1 is a schematic cross-sectional view showing one step of a method for manufacturing a light emitting device according to Embodiment 1. FIG. [Figure 5G] 1 is a schematic cross-sectional view showing one step of a method for manufacturing a light emitting device according to Embodiment 1. FIG. [Figure 5H] 1 is a schematic cross-sectional view showing one step of a method for manufacturing a light emitting device according to Embodiment 1. FIG. [Figure 6] FIG. 10 is a schematic cross-sectional view of a light emitting device according to a second embodiment of the present disclosure. [Figure 7] 1 is a schematic cross-sectional view of a light-emitting device according to an embodiment of the present disclosure. [Figure 8]FIG. 10 is a schematic cross-sectional view of a light emitting device according to a third embodiment of the present disclosure. [Figure 9] 1 shows a graph of chromaticity coordinates in which the chromaticity of light emitted by the light emitting device of the example and the chromaticity of light emitted by the light emitting device of the comparative example are plotted. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments and examples for carrying out the present invention will be described with reference to the drawings. Note that the light emitting device described below is intended to embody the technical concept of the present invention, and unless otherwise specified, the present invention is not limited to the following. In each drawing, components having the same function may be given the same symbol. For convenience, the embodiments and examples may be shown separately to facilitate explanation or understanding of the main points, but partial substitution or combination of the configurations shown in different embodiments and examples is possible. In the embodiments and examples described below, descriptions of matters common to the above may be omitted, and only the differences may be described. In particular, similar effects due to similar configurations will not be mentioned sequentially in each embodiment or example. The size and positional relationship of components shown in each drawing may be exaggerated to clarify the explanation. In this specification, the lower part of the light emitting device refers to the side on which the substrate 50 is disposed, and the upper part of the light emitting device refers to the side opposite the lower part. In addition, in this specification, the inside of the light emitting device refers to the center side of the light emitting device, and the outside of the light emitting device refers to the outer surface side of the light emitting device.

[0010] Embodiment 1. Embodiment 1 1 to 3 , a light emitting device 100 according to the first embodiment includes a light emitting element 1 that emits a first light, a first wavelength conversion member 10 that is disposed on the light emitting element 1 and has a bottom surface 12 bonded to the light emitting element 1, a top surface 11 opposite the bottom surface 12, and a side surface 13 continuous with the top surface 11, and that is excited by the first light to emit a second light, a second wavelength conversion member 20 that exposes the top surface 11 of the first wavelength conversion member 10 and covers the side surface 13, and has an inclined surface 22 that extends outward from the side surface 13, and a first light-reflective member 30 that covers the inclined surface 22. The second wavelength conversion member 20 is excited by at least one of the first light and the second light to emit a third light. Furthermore, the light emitting device 100 may include a substrate 50 on which the light emitting element 1 is placed, and a second light reflective member 40 disposed between the side surface 3 of the light emitting element 1 and the second wavelength conversion member 20. Furthermore, on the substrate 50, a first convex portion 91, a second convex portion 92, and a protective element 80 may be arranged to support the first light reflective member 30 and cover part of the side surface of the first light reflective member 30.

[0011] (substrate) The substrate 50 is a member on which the light-emitting element 1 is mounted, and includes wiring 56 for supplying power from the outside to the light-emitting element 1. As shown in Figures 1 to 3, the substrate 50 includes the wiring 56 and a base material 55 that supports the wiring 56. The wiring 56 is disposed on at least the upper surface of the base material 55.

[0012] The base material 55 has, for example, a substantially rectangular parallelepiped shape and includes four side surfaces that are continuous with the upper surface on which the light-emitting element is mounted. The four side surfaces are a first side surface 51 and a second side surface 52 that face each other, and a third side surface 53 and a fourth side surface 54 that connect the first side surface 51 and the second side surface 52 and face each other. It is preferable to use a material that is difficult for light from the light-emitting element and external light to pass through as the substrate 55. Examples of the material include ceramics such as aluminum oxide, aluminum nitride, and silicon nitride, resins such as phenolic resin, epoxy resin, polyimide resin, BT resin, and polyphthalamide, semiconductors such as silicon, and metals such as copper and aluminum, as well as composite materials thereof. Examples of the material for the wiring 56 include metals such as iron, copper, nickel, aluminum, gold, silver, platinum, titanium, tungsten, and palladium, or alloys containing at least one of these metals. The substrate 50 may have a recess on its upper surface, and the light emitting device 100 may have a structure in which the light emitting element 1 is placed on the bottom of the recess of the substrate 50. The light emitting device 100 may also have a structure without the substrate 50. For example, the light emitting device may have a structure in which a metal member exposed from a covering member such as the second wavelength conversion member 20 that covers the light emitting element 1 is provided as an electrode of the light emitting device.

[0013] The wiring 56 is electrically connected to the electrode 6 of the light-emitting element 1. The wiring 56 and the electrode 6 can be connected via, for example, a conductive bonding member 70. Examples of the bonding member 70 include eutectic solder, conductive paste, and bumps. The wiring 56 includes an anode-side wiring 56 and a cathode-side wiring 56. As shown in FIGS. 1 and 3 , a portion of the anode-side wiring 56 and a portion of the cathode-side wiring 56 are exposed on the surface of the light-emitting device 100 and function as external electrodes of the light-emitting device 100.

[0014] (light-emitting element) The light emitting element 1 emits a first light. 2 and 3, the light-emitting element 1 includes a semiconductor stack 5 and an electrode 6. The light-emitting element 1 may include a support substrate 7 that supports the semiconductor stack 5.

[0015] The semiconductor stack 5 includes, for example, a first semiconductor layer, a second semiconductor layer, and a light emitting layer disposed between the first semiconductor layer and the second semiconductor layer. The semiconductor laminate 5 may be made of various semiconductors such as III-V group compound semiconductors and II-VI group compound semiconductors.X Al Y Ga 1-X-Y Examples of the nitride semiconductor material include nitride semiconductor materials such as InN, AlN, GaN, InGaN, AlGaN, and InGaAlN (0≦X, 0≦Y, X+Y≦1). For the thickness and structure of each layer, those known in the art can be used. The semiconductor laminate 5 emits a first light from the light-emitting layer. The peak wavelength of the first light is, for example, in the range of 260 nm to 630 nm. The first light is, for example, blue light.

[0016] The light-emitting element 1 may have one semiconductor laminate 5 on one support substrate, or may have multiple semiconductor laminates 5 on one support substrate. Furthermore, one semiconductor laminate 5 may have only one light-emitting layer, or may have multiple light-emitting layers. The structure of the semiconductor laminate 5 having multiple light-emitting layers may be a structure including multiple light-emitting layers between one first semiconductor layer and one second semiconductor layer, or a structure in which a structure including a first semiconductor layer, a light-emitting layer, and a second semiconductor layer in that order is repeated multiple times.

[0017] The light-emitting element 1 includes an electrode 6 on a semiconductor laminate 5. The electrode 6 includes a first electrode connected to the first semiconductor layer and a second electrode connected to the second semiconductor layer. The first electrode and the second electrode may be disposed on different surfaces of the semiconductor laminate 5, or may be disposed on the same surface.

[0018] In the light emitting device 100, the shape of the light emitting element 1 when viewed from above is, for example, a square or a rectangle. Alternatively, the shape of the light emitting element 1 when viewed from above may be a polygon such as a triangle or a hexagon.

[0019] (First wavelength conversion member) As shown in FIGS. 2 and 3, the first wavelength converting member 10 is disposed on the light emitting element 1. As shown in FIG. The first wavelength conversion member 10 includes a bottom surface 12 bonded to the light-emitting element 1, a top surface 11 opposite the bottom surface 12, and a side surface 13 continuous with the top surface 11. The bottom surface 12 of the first wavelength conversion member 10 is bonded to the top surface 2 of the light-emitting element 1. The first wavelength conversion member 10 is excited by the first light emitted by the light-emitting element 1 and emits second light. The first wavelength conversion member 10 is, for example, a flat-plate-shaped member. The top surface 11 and the bottom surface 12 are flat surfaces parallel to each other, and the top surface 11 is rectangular as shown in FIG. 1 . The lower surface 12 covers the entire upper surface 2 of the light-emitting element 1, as shown in FIGS. The side surface 13 includes a plurality of side surfaces. Specifically, the side surface 13 includes four side surfaces that are connected to the respective sides of the rectangular top surface 11. Here, each of the four side surfaces is a plane perpendicular to the top surface 11.

[0020] The above-described shape of the first wavelength conversion member 10 is merely an example. For example, the first wavelength conversion member 10 may have an upper surface 11 and a lower surface 12 that are flat surfaces with the same area, or may have a shape in which one of the upper surface 11 and the lower surface 12 contains the other in a planar view. In this case, the first wavelength conversion member 10 may have a structure with a step between the upper surface 11 and the lower surface 12, or may have a side surface that is inclined from the upper surface toward the lower surface.

[0021] The first wavelength conversion member 10 can be bonded to the upper surface 2 of the light-emitting element 1 via, for example, a light-transmitting bonding member. Alternatively, the first wavelength conversion member 10 and the light-emitting element 1 may be bonded directly without a bonding member. The upper surface 11 of the first wavelength conversion member 10 can be exposed from the first light-reflective member 30 and form part of the upper surface of the light-emitting device 100. In this case, the upper surface 11 of the first wavelength conversion member 10 is the light-emitting surface of the light-emitting device 100.

[0022] The first wavelength conversion member 10 includes a phosphor that is excited by the first light emitted from the light-emitting element 1 and emits second light. The peak wavelength of the second light is longer than the peak wavelength of the first light. The peak wavelength of the second light is, for example, in the range of 520 nm to 560 nm. The second light is, for example, yellow-green to yellow light.

[0023] The first wavelength conversion member 10 includes, for example, a sintered body of a phosphor, or a material in which phosphor powder is contained in resin, glass, ceramic, or other inorganic substances. Further, as the first wavelength conversion member 10, a layer containing a phosphor may be disposed on the surface of a molded body of resin, glass, ceramic, or the like. Further, the first wavelength conversion member 10 may contain a filler such as a diffusing material to such an extent that it does not block light. As the diffusing material, for example, titanium oxide, silicon oxide, aluminum oxide, zinc oxide, or the like can be used. When resin is used as a binder for the phosphor and the diffusing material, as the resin, for example, resins such as epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylic resin, and fluororesin can be used. The first wavelength conversion member has light transmissivity, and preferably has a transmittance of 50% or more, more preferably 70% or more, with respect to the first light emitted from the light emitting element 1, the wavelength-converted second light, and the third light.

[0024] As the phosphor contained in the first wavelength conversion member 10, a phosphor that can be excited by the first light emitted from the light emitting element 1 is used. For example, as a green-emitting phosphor, yttrium aluminum garnet-based phosphors (e.g., Y3(Al,Ga)5O 12 :Ce), lutetium aluminum garnet-based phosphors (e.g., Lu3(Al,Ga)[]5O 12 :Ce), terbium aluminum garnet-based phosphors (e.g., Tb3(Al,Ga)5O 12 :Ce), silicate-based phosphors (e.g., (Ba,Sr)2SiO4:Eu), chlorosilicate-based phosphors (e.g., Ca8Mg(SiO4)4C l2 :Eu), β-sialon-based phosphors (e.g., Si 6-z Al z O z N 8-z :Eu(0 < z < 4.2)), SGS-based phosphors (e.g., SrGa2S4:Eu), and the like can be mentioned. As a yellow-emitting phosphor, α-sialon-based phosphors (e.g., Mz(Si,Al) 12 (O,N) 16(However, 0 < z ≤ 2, and M includes Li, Mg, Ca, Y, and lanthanide elements excluding La and Ce, etc.). In addition, among the above-mentioned green-emitting phosphors, there are also yellow-emitting phosphors. For example, in the yttrium aluminum garnet-based phosphor, by substituting a part of Y with Gd, the emission peak wavelength can be shifted to the longer wavelength side, enabling yellow emission. Also, among these, there are fluorescent substances capable of orange emission. Examples of the red-emitting phosphor include nitrogen-containing calcium aluminosilicate (CASN or SCASN) - based phosphors (e.g., (Sr,Ca)AlSiN3:Eu), BSESN - based phosphors (e.g., (Ba,Sr,Ca)2Si5N8:Eu), etc. In addition, manganese-activated fluoride - based phosphors (general formula (I) A2[M 1-a Mn a F6] - represented phosphors (wherein, in the above general formula (I), A is at least one selected from the group consisting of K, Li, Na, Rb, Cs, and NH4, M is at least one element selected from the group consisting of Group 4 elements and Group 14 elements, and a satisfies 0 < a < 0.2)) can be mentioned. Examples of this manganese-activated fluoride - based phosphor include KSF - based phosphors (e.g., K2SiF6:Mn), KSAF - based phosphors (e.g., K2Si 0.99 Al 0.01 F 5.99 :Mn) and MGF - based phosphors (e.g., 3.5MgO·0.5MgF2·GeO2:Mn), etc.

[0025] The KSAF - based phosphor may have a composition represented by the following formula (I). M2[Si p Al q Mn r F s (I)

[0026] In formula (I), M represents an alkali metal and may contain at least K. Mn may be a tetravalent Mn ion. p, q, r, and s may satisfy 0.9 ≦ p + q + r ≦ 1.1, 0 < q ≦ 0.1, 0 < r ≦ 0.2, 5.9 ≦ s ≦ 6.1. Preferably, 0.95 ≦ p + q + r ≦ 1.05 or 0.97 ≦ p + q + r ≦ 1.03, 0 < q ≦ 0.03, 0.002 ≦ q ≦ 0.02 or 0.003 ≦ q ≦ 0.015, .005 ≦ r ≦ 0.15, 0.01 ≦ r ≦ 0.12 or 0.015 ≦ r ≦ 0.1, 5.92 ≦ s ≦ 6.05 or 5.95 ≦ s ≦ 6.025. For example, compositions represented by K2[Si 0.946 Al 0.005 Mn 0.049 F 5.995 , K2[Si 0.942 Al 0.008 Mn 0.050 F 5.992 , K2[Si 0.939 Al 0.014 Mn 0.047 F 5.986 can be mentioned. According to such a KSAF-based phosphor, high luminance and red light emission with a narrow full width at half maximum of the emission peak wavelength can be obtained.

[0027] Among them, as the phosphor contained in the first wavelength conversion member, as a yellow light-emitting phosphor, a yttrium-aluminum-garnet-based phosphor (for example, Y3(Al,Ga)5O 12 :Ce) in which a part of Y is substituted with Gd can be preferably used. Thereby, the light-emitting device 100 can emit white light in which blue light as the first light and yellow light as the second light are mixed as the light emitted from the first wavelength conversion member.

[0028] (Second wavelength conversion member) The second wavelength conversion member 20 exposes the upper surface 11 of the first wavelength conversion member 10 and covers the side surface 13 of the first wavelength conversion member 10. The second wavelength conversion member 20 has an inclined surface (hereinafter referred to as the first inclined surface 22) that faces outward from the side surface 13 of the first wavelength conversion member 10. The second wavelength conversion member 20 is excited by at least one of the first light and the second light and emits the third light.

[0029] The second wavelength conversion member 20 is excited by at least one of the first light emitted by the light-emitting element 1 and the second light emitted by the first wavelength conversion member 10, and emits third light. The peak wavelength of the third light is longer than the peak wavelength of the first light. Here, the peak wavelength of the third light is longer than the peak wavelength of the first light and the peak wavelength of the second light. The peak wavelength of the third light is, for example, 600 nm or more and 660 nm or less. The third light is, for example, orange to red light.

[0030] 2 and 3, the second wavelength conversion member 20 includes a first surface 21 in contact with the side surface of the first wavelength conversion member 10, and a first inclined surface 22 extending outward from the upper end of the first surface 21. The second wavelength conversion member 20 may further include a second inclined surface 23 extending outward from the lower end of the first surface 21. When the first wavelength conversion member 10 includes multiple side surfaces, the second wavelength conversion member 20 continuously covers the multiple side surfaces of the first wavelength conversion member 10. In the light emitting device 100, the second wavelength conversion member 20 preferably continuously covers four side surfaces of the first wavelength conversion member 10, and more preferably covers the entire side surfaces 13 of the first wavelength conversion member 10. When the light emitting device 100 includes a second light reflective member 40 described below, the second wavelength conversion member 20 may cover at least a part of the upper region of each side surface 3 of the light emitting element 1 that is exposed from the second light reflective member 40. When the light emitting device 100 does not include a second light reflective member 40 described below, the second wavelength conversion member 20 preferably extends from the side surface of the first wavelength conversion member 10 to the side surface 3 of the light emitting element 1 and covers all of the side surfaces 3 of the light emitting element 1. The first inclined surface 22 is connected to the first surface 21. The upper end of the first inclined surface 22 is in contact with the side surface of the first wavelength conversion member 10, and the lower end is in contact with the upper surface of the substrate 50, for example. The second inclined surface 23 is located more inward than the first inclined surface 22, and its upper end contacts the side surface of the first wavelength conversion member 10 or the side surface of the light emitting element 1, and its lower end contacts the upper surface of the substrate 50, for example.

[0031] The first inclined surface 22 and the second inclined surface 23 may each be a flat surface or a curved surface. In particular, as shown in FIGS. 2 and 3 , the first inclined surface 22 is preferably a curved surface whose cross-sectional shape is a curved line that is convex from the outside to the inside of the light-emitting device. Here, the first inclined surface is disposed as a bowl-shaped curved surface that is a curved line that is convex toward the light-emitting element 1 in cross-sectional view. This shape allows light incident on the second wavelength conversion member 20 to be reflected, and the reflected light to travel toward the first wavelength conversion member 10. In other words, it is possible to guide more light to the first wavelength conversion member 10, thereby improving the light extraction efficiency of the light-emitting device 100.

[0032] It is preferable that the entire first inclined surface 22 is covered with the first light-reflective member 30. The light reflection function of the first light-reflective member 30 allows more light to be guided toward the first wavelength conversion member 10, thereby increasing the light extraction efficiency of the light-emitting device 100. The upper end of the first inclined surface 22 may be in contact with the upper end of the side surface 13 of the first wavelength conversion member 10 (in other words, the outer edge of the upper surface 11 of the first wavelength conversion member 10), or may be in contact with a lower position than the upper end of the side surface 13 of the first wavelength conversion member 10. When the upper end of the first inclined surface 22 is in contact with the upper end of the side surface 13 of the first wavelength conversion member 10 (that is, when the second wavelength conversion member 20 forms part of the upper surface of the light emitting device 100), the thickness of the second wavelength conversion member 20 exposed on the upper surface of the light emitting device 100 is preferably thin. For example, it is preferably 10 μm or less. This makes it possible to reduce the amount of light emitted from the second wavelength conversion member 20 to the outside without passing through the first wavelength conversion member 10, thereby suppressing unevenness in the emitted light color of the light emitting device 100. Furthermore, when the upper end of the first inclined surface 22 contacts a lower position than the upper end of the side surface 13 of the first wavelength conversion member 10 (that is, when the second wavelength conversion member 20A exposes the upper portion 13A of the side surface 13 of the first wavelength conversion member 10, as in the light emitting device 100A shown in FIG. 7 ), in the light emitting device 100A, the upper portion 13A of the side surface 13 of the first wavelength conversion member 10 exposed from the second wavelength conversion member 20A is preferably covered by the first light reflective member 30. This makes it difficult for the light emitted from the second wavelength conversion member 20 to be visible to the outside through the first light reflective member 30, thereby making it possible to suppress unevenness in the emitted color of the light emitting device 100.

[0033] The second wavelength conversion member 20 may be a resin containing a light-reflecting material and a phosphor. Specifically, a resin in which a light-reflecting material and a phosphor are contained in a base resin can be used. When the second wavelength conversion member 20 contains a light-reflecting material, the first light and the second light can be efficiently reflected. Furthermore, when the second wavelength conversion member 20 contains a phosphor, light that has passed through without being reflected by the light-reflecting material can be wavelength-converted into third light, which can be reflected by the first inclined surface 22 and / or the second inclined surface 23 and travel toward the first wavelength conversion member. When the light emitted from the light emitting device 100 contains the third light, the chromaticity of the light emitted from the light emitting device 100 can be adjusted. As the light reflective substance contained in the second wavelength conversion member 20, titanium oxide, aluminum oxide, silicon oxide, zinc oxide, barium carbonate, barium sulfate, boron nitride, aluminum nitride, glass filler, etc. can be suitably used. As the resin for the base material, the same resin as the resin exemplified for the first wavelength conversion member 10 can be used. The phosphor contained in the second wavelength conversion member 20 is one that can be excited by at least one of the first light emitted by the light emitting element 1 and the second light emitted by the first wavelength conversion member 10. As the phosphor, the same phosphor as the above-mentioned phosphor can be used. Among these, as the phosphor contained in the second wavelength conversion member 20, a BSESN phosphor (for example, (Ba, Sr, Ca) 2 Si 5 N 8 :Eu) can be suitably used as a phosphor that emits orange light. In this way, since the second wavelength conversion member 20 contains an orange-emitting phosphor, the light emitting device 100 can shift the chromaticity of white light obtained by mixing blue light and yellow light toward the orange side.

[0034] The phosphor contained in the second wavelength conversion member 20 may be the same as the phosphor contained in the first wavelength conversion member 10. In this case, the chromaticity of the light emitted by the light emitting device 100 can also be adjusted.

[0035] (First light reflective member) The first light-reflective member 30 covers the first inclined surface 22 of the second wavelength conversion member 20. The first light-reflective member 30 exposes the upper surface 11 of the first wavelength conversion member 10. On the upper surface of the light-emitting device 100, the first light-reflective member 30 is preferably disposed contiguous with the upper surface 11 of the first wavelength conversion member 10. The upper surface of the first light-reflective member 30 is part of the upper surface of the light-emitting device 100.

[0036] As shown in FIG. 1, the outer edge of the first light reflective member 30 has, for example, a substantially rectangular shape in a top view, and the first light reflective member 30 includes, for example, four side surfaces connected to the upper surface. Two opposing side surfaces 33, 34 of the first light reflective member 30 are part of the side surfaces of the light emitting device 100. As shown in FIG. 2, one side surface 33 of the two side surfaces 33, 34 is disposed substantially flush with a third side surface 53 of the substrate 50. The other side surface 34 of the two side surfaces 33, 34 is disposed substantially flush with a fourth side surface 54 of the substrate 50. The other opposing side surfaces 31, 32 of the first light reflective member 30 are covered by convex portions (first convex portions 91 or second convex portions 92) as shown in FIG. 3. The light emitting device 100 does not necessarily have to include the first convex portion 91. In this case, the first light reflective member 30 has a side surface disposed substantially flush with the first side surface 51 of the substrate 50.

[0037] The first light-reflecting member 30 can be made of, for example, a resin containing a light-reflecting substance. The light-reflecting substance can be the same as the materials exemplified for the second wavelength conversion member. The resin can be the same as the resin exemplified for the first wavelength conversion member 10. The first light-reflecting member 30 may contain a light-absorbing substance such as carbon black or graphite. First light reflective member 30 preferably has a reflectance of 60% or more with respect to light emitted from light emitting element 1, and more preferably 80% or more.

[0038] (Second light reflective member) The light emitting device 100 can include a second light reflective member 40 disposed between the side surface of the light emitting element 1 and the second wavelength conversion member 20. The second light reflective member 40 preferably covers the side surface 3 of the light emitting element 1. This allows light emitted from the side surface 3 of the light emitting element 1 to be reflected and travel toward the light emitting element 1. Furthermore, when the light emitting element 1 is mounted on a substrate 50, the second light reflective member 40 preferably covers the area between the lower surface 4 of the light emitting element 1 and the upper surface of the substrate 50, and the side surface of the electrode 6 of the light emitting element 1. This allows light emitted from the light emitting element 1 and traveling downward to be reflected and travel toward the light emitting element 1. Note that when the side surface of the light emitting element 1 is covered with a translucent bonding member, such as when the light emitting element 1 and the first wavelength conversion member 10 are bonded via a translucent bonding member, the second light reflective member 40 can cover the side surface 3 of the light emitting element 1 via the translucent bonding member. The second light-reflective member 40 is preferably disposed as a fillet on the side surface 3 of the light-emitting element 1. As a result, the second wavelength conversion member 20 covering the second light-reflective member 40 can have a second inclined surface 23 in contact with the second light-reflective member 40. The second inclined surface 23 is preferably a curved surface whose cross-sectional shape is a convex curved line extending from the outside to the inside of the light-emitting device. As a result, more light emitted from the side surface of the light-emitting element 1 can be reflected toward the light-emitting element 1. Note that light that is not reflected by the second inclined surface 23 and enters the second wavelength conversion member 20 is reflected by the first inclined surface 22 and guided toward the first wavelength conversion member 10, thereby constituting part of the emitted light of the light-emitting device 100. As a result, the light extraction efficiency of the light-emitting device 100 can be improved.

[0039] The second light reflective member 40 can be selected from the same materials as those constituting the first light reflective member 30. The material constituting the first light reflective member 30 and the material producing the second light reflective member 40 may be the same or different.

[0040] (Convex part) As shown in FIG. 3 , the light-emitting device 100 may include a convex portion that holds the first light-reflective member. The convex portion includes a first convex portion 91 that covers one side of the first light-reflective member 30 and a second convex portion 92 that covers the opposite side of the first side. The first convex portion 91 is disposed on the outer edge of the upper surface of the substrate 50 on the first side surface 51 side. The second convex portion 92 is disposed on the upper surface of the substrate 50 on the second side surface 52 side. The first light-emitting element 1, the first wavelength conversion member 10, the second light-reflective member 40, the second wavelength conversion member 20, the first light-reflective member 30, and the protective element 80 are disposed in the region between the first convex portion 91 and the second convex portion 92. Hereinafter, the region where the first convex portion 91 and the second convex portion 92 are disposed and the region between the first convex portion 91 and the second convex portion 92 are referred to as the mounting region R1. A portion of the wiring 56 is exposed in the region closer to the second side surface 52 of the substrate 50 than the second convex portion 92. Hereinafter, this region will be referred to as the external connection region R2.

[0041] For example, a resin can be used for the first convex portion 91 and the second convex portion 92. The resin can be any of the resins described above. The resin constituting the convex portions may be a light-transmitting resin, a white resin containing a light-reflecting material, a gray resin containing a light-absorbing material, or a black resin.

[0042] (protective element) The light emitting device 100 may further include a protective element 80. The protective element 80 is connected to the wiring 56 of the substrate 50 via a bonding member such as a bump. The surface of the protective element 80 is covered with one or more members selected from the first light reflective member 30, the second wavelength conversion member 20, and the second light reflective member 40. The protective element 80 is, for example, a Zener diode.

[0043] (How light travels) With reference to FIG. 4, the way light travels in the light emitting device 100 will be described. The first light (for example, arrow A1) emitted from the upper surface 2 of the light-emitting element 1 is incident on the first wavelength conversion member 10. A part of the first light (for example, arrow A2) emitted from the side surface 3 and lower surface 4 of the light-emitting element 1 is reflected by the side surface 3 and lower surface 4 of the light-emitting element 1, emitted from the upper surface 2 of the light-emitting element 1 (for example, arrow A3), and incident on the first wavelength conversion member 10. A part of the light (for example, arrow B5) incident on the first wavelength conversion member 10 is emitted to the outside from the upper surface of the first wavelength conversion member 10 (for example, arrow C1). A part of the light emitted from the side surface 13 of the first wavelength conversion member 10 (for example, arrow B1) is reflected by the first surface 21 and / or the second wavelength conversion member 20 (for example, arrow B4) and is emitted from the upper surface of the first wavelength conversion member 10 (for example, arrow C4). Another part of the light is incident on the second wavelength conversion member 20 (for example, arrow D1). A portion of the first light and / or second light incident on the second wavelength conversion member 20 is converted into third light by the second wavelength conversion member 20. Another portion of the first light and / or second light incident on the second wavelength conversion member 20 is emitted from the second wavelength conversion member without being wavelength-converted into third light. As a result, the light emitted from the second wavelength conversion member 20 can include the first light, the second light, and the third light. A portion of the light emitted by the second wavelength conversion member 20 (for example, arrow D1) is reflected by the first inclined surface 22 and / or the first light reflective member 30. A portion of the light reflected by the first inclined surface 22 and / or the first light reflective member 30 (for example, arrow D2) passes through the first surface 21, enters the first wavelength conversion member 10 (for example, arrow B2), and is emitted from the upper surface of the first wavelength conversion member 10 (for example, arrow C2). As a result, the light emitted from the upper surface of the first wavelength conversion member 10 can include the first light, the second light, and the third light. The light emitted from the upper surface of the first wavelength conversion member 10 constitutes the light emitted by the light emitting device 100.

[0044] The light emitted from the light emitting device 100 configured as described above includes light that has passed through each of the components as described above. This allows the light emitting device 100 to emit light that is a mixture of the first light, the second light, and the third light. In particular, when the first light is blue light, the second light includes yellow-green to yellow light, and the third light includes orange to red light, the light emitting device 100 can adjust the chromaticity of the white light composed of the first light and the second light toward the red side by adjusting the type and amount of phosphor contained in the second wavelength conversion member. In other words, by including the second wavelength conversion member 20, the light emitting device 100 can adjust the chromaticity of the light emitted by the light emitting device 100.

[0045] Furthermore, the light emitted from the light emitting device 100 may not substantially contain the first light. For example, when a light emitting device emitting orange to red light is obtained using a blue-emitting light emitting element, the light emitted from the light emitting device 100 may be composed almost entirely of the second light and the third light. In this case, too, the light emitting device may include a second wavelength conversion member, thereby adjusting the chromaticity of the light emitted from the light emitting device. Furthermore, the first light can be prevented from leaking from the side surface of the light emitting device via the first light reflecting member.

[0046] Furthermore, when light emitting device 100 includes a second light reflective member, a portion of the light emitted from the side surface 3 and bottom surface 4 of light emitting element 1 that is not reflected by the side surface 3 and bottom surface 4 of light emitting element 1 or second light reflective member 40 but passes through second light reflective member 40 (for example, arrow E1) is incident on second wavelength conversion member 20 (for example, arrow D3). A portion of the first light incident on second wavelength conversion member 20 is converted into third light by second wavelength conversion member 20.

[0047] As described above, the light emitted from the second wavelength conversion member 20 includes the first light incident on the second wavelength conversion member 20 via the second light reflecting member 40 and the third light resulting from the first light. A portion of the light passing through the second wavelength conversion member 20 (e.g., arrow D3) is reflected by the first inclined surface 22 and / or the first light reflecting member 30 (e.g., arrow D4), enters the first wavelength conversion member 10 from the first surface 21 (e.g., arrow B3), and is emitted from the upper surface of the first wavelength conversion member 10 (e.g., arrow C3). Therefore, the light incident on the second wavelength conversion member 20 via the second light reflecting member 40 can also constitute the light emitted by the light emitting device 100. That is, the light emitting device 100 configured as described above can also emit the light resulting from the first light transmitted through the second light reflecting member 40 from the light emitting surface. As a result, the light extraction efficiency of the light emitting device 100 can be improved. For the sake of simplicity, the arrows in Figure 4 are merely a schematic representation of the direction in which some of the light travels. In reality, the direction in which light travels changes as it passes between and through components due to differences in the refractive index of the components, scattering by the components included, and other factors.

[0048] Furthermore, the content of the third light emitted from the light-emitting surface can be adjusted by appropriately changing the shapes and volumes of the first inclined surface 22 and the second inclined surface 23, the amount of phosphor contained in the second wavelength conversion member 20, etc. In other words, the color of the light emitted by the light-emitting device 100 can be appropriately adjusted.

[0049] 2. Manufacturing method The method for manufacturing the light emitting device 100 includes the steps of: (1) preparing an assembly substrate; (2) a step of arranging a protrusion; (3) disposing the light-emitting element; (4) disposing a first wavelength conversion member; (5) placing a protective element; (6) disposing a second light reflective member; (7) disposing a second wavelength conversion member; (8) disposing a second light reflective member; (9) dividing the assembly substrate into individual pieces; Includes: Each step will be described below with reference to FIGS. 5A to 5H.

[0050] (1) Preparation of an assembly substrate In the step of preparing an aggregate substrate, an aggregate substrate 50A including a plurality of substrate 50 regions is prepared as shown in Fig. 5A. The plurality of substrates 50 are arranged, for example, in a matrix as shown in Fig. 5B. The aggregate substrate 50A includes wiring 56 of a predetermined pattern for each area of ​​the light emitting device 100 to be manufactured. 5A and 5B are imaginary lines indicating the boundaries of the substrate 50 of the light emitting device 100 to be manufactured, in order to facilitate understanding of the drawings. Also, the wiring 56 shown in Fig. 5B is represented in a simplified shape in order to facilitate understanding of the drawing.

[0051] The wiring 56 can be arranged by a known method such as plating, vapor deposition, or sputtering. The aggregate substrate 50A may be prepared by purchasing or receiving a substrate on which the wiring 56 has already been arranged.

[0052] (2) Step of arranging the protrusions In the step of arranging the convex portions, a frame-shaped convex portion 90A is arranged on the upper surface of the aggregate substrate 50A. As shown in Fig. 5B, the convex portion 90A collectively surrounds the mounting region R1 of each of the light emitting devices 100 to be manufactured so as to separate the mounting region R1 from the external connection region R2. By arranging the convex portion 90A in this manner, in the step described below, the second light reflective member 40, the second wavelength conversion member 20, and the first light reflective member 30 can be easily arranged only in the region surrounded by the convex portion 90A.

[0053] (3) Step of arranging the light-emitting element In the step of arranging the light emitting element, the light emitting element 1 is arranged on the wiring 56 surrounded by the protrusion 90A, as shown in Fig. 5C. The light emitting element 1 is arranged via the bump 70, for example.

[0054] (4) Step of arranging the first wavelength conversion member In the step of arranging the first wavelength conversion member, as shown in Fig. 5D, the first wavelength conversion member 10 is arranged on the upper surface 2 of the light emitting element 1. The first wavelength conversion member 10 is bonded to the light emitting element 1 using, for example, a light-transmitting adhesive. In addition, the step of placing the first wavelength conversion member may be performed before the step of placing the light-emitting element, in which case the light-emitting element 1 with the first wavelength conversion member is placed on the wiring 56 in the step of placing the light-emitting element.

[0055] (5) Step of placing protective elements In the step of arranging the protective element, the protective element 80 is arranged on the wiring 56 surrounded by the protrusion 90A, as shown in Fig. 5E. The protective element 80 is arranged via a bump, for example.

[0056] (6) Step of disposing a second light-reflective member In the step of arranging the second light-reflective member, as shown in FIG. 5F , the second light-reflective member 40 is arranged in the area surrounded by the convex portion 90A so as to cover the side surface 3 of the light-emitting element 1. Specifically, the uncured second light-reflective member 40 is arranged around the protective element 80 by potting, spraying, or the like. The uncured second light-reflective member 40 creeps up the side surface 3 of the light-emitting element 1 due to surface tension, covering the side surface 3 of the light-emitting element 1. As a result, the second light-reflective member 40 expands as it approaches the aggregate substrate 50A, resulting in a second light-reflective member 40 having a first curved surface 41 that moves away from the light-emitting element 1 as it approaches the aggregate substrate 50A. The first curved surface 41 has a curved shape that is convex toward the light-emitting element 1.

[0057] (7) Step of arranging the second wavelength conversion member In the step of arranging the second wavelength conversion member, as shown in FIG. 5G , the second wavelength conversion member 20 is arranged in an area surrounded by the convex portion 90A so as to cover the side surface 13 of the first wavelength conversion member 10. Specifically, the uncured second wavelength conversion member 20 is arranged on the first curved surface 41 of the second light-reflective member 40 by potting, spraying, or the like. The uncured second wavelength conversion member 20 creeps up the side surface 13 of the first wavelength conversion member 10 due to surface tension, and covers the side surface 13 of the first wavelength conversion member 10. This results in a second wavelength conversion member 20 having a first inclined surface 22 that moves away from the side surface 13 of the first wavelength conversion member 10 as it approaches the upper surface of the aggregate substrate 50A. In the light-emitting device 100, the first inclined surface 22 is arranged at a position lower than the upper surface 11 of the first wavelength conversion member 10 and has a curved shape that is convex inward (i.e., toward the first wavelength conversion member 10 and light-emitting element 1). Furthermore, the second wavelength conversion member 20 covers the first curved surface 41 of the second light reflective member 40. As a result, the second wavelength conversion member 20 has a second inclined surface 23 along the first curved surface 41 at the interface with the second light reflective member 40.

[0058] (8) Step of disposing the first light-reflective member In the step of disposing the first light-reflective member, the first light-reflective member 30 is disposed in the area surrounded by the convex portion 90A, as shown in Fig. 5H. Specifically, the uncured first light-reflective member 30 is disposed on the first inclined surface 22 of the second wavelength conversion member 20 by potting, spraying, or the like, and then flattened by its own weight. At this time, it is preferable to adjust the amount of supply so that the surface of the first light-reflective member 30 is aligned with the upper surface 11 of the first wavelength conversion member 10, i.e., so that both surfaces are positioned on approximately the same plane. Thereafter, the first light-reflective member 30, the second wavelength conversion member 20, and the second light-reflective member 40 are cured, for example, by heating.

[0059] (9) Slicing process In the step of dividing into individual pieces, cutting is performed at cutting positions CL, an example of which is shown in Fig. 5H, to obtain the light emitting devices 100. The cutting is performed using, for example, a blade.

[0060] The above manufacturing method provides a light-emitting device 100 including a first light-reflective member 30, a second wavelength conversion member 20, and a second light-reflective member 40. Preferably, the first light-reflective member 30, the second wavelength conversion member 20, and the second light-reflective member 40 are cured by heating or the like after flowing into their respective desired shapes. This facilitates the formation of desired interface shapes between the respective members. However, the first light-reflective member 30, the second wavelength conversion member 20, and the second light-reflective member 40 may be cured simultaneously. For example, the second light-reflective member 40 may be applied, its shape may be defined, and the curing may be temporary. Thereafter, the second wavelength conversion member 20 may be applied, its shape may be defined, and the curing may be temporary. The first light-reflective member 30 may then be applied, and the first light-reflective member 30, the second wavelength conversion member 20, and the second light-reflective member 40 may be cured permanently. Each component needs to be cured and molded under conditions appropriate for that component, and the material should be selected so that the curing conditions for each component do not adversely affect the other components. Each component may use the same or different base material.

[0061] 3. Embodiment 2 A light emitting device 200 according to a second embodiment of the present disclosure will be described with reference to Fig. 6. The light emitting device 200 differs from the light emitting device 100 according to the first embodiment in that a second wavelength conversion member 220 covers the side surface 3 of the light emitting element 1.

[0062] The second wavelength conversion member 220 covers the side surfaces of the first wavelength conversion member 10 and also covers the side surfaces 3 of the light emitting element 1. When the light emitting element 1 includes multiple side surfaces, for example, four side surfaces, the second wavelength conversion member 220 continuously covers the multiple side surfaces of the light emitting element 1. The second wavelength conversion member 220 may cover the entire side surfaces 3 of the light emitting element 1, or may cover, for example, the lower parts of the side surfaces 3 of the light emitting element 1 while exposing them. In this case, the side surfaces 3 of the light emitting element 1 exposed from the second wavelength conversion member 220 are covered with the second light reflective member 40.

[0063] In the light emitting device 200 configured in this manner, a portion of the first light emitted from the side surface 3 of the light emitting element 1 is converted into third light by the second wavelength conversion member 20. The first light incident on the second wavelength conversion member 20 and a portion of the third light obtained by wavelength conversion of the first light are reflected by the first inclined surface 22 and / or the second inclined surface 23, are made incident on the first wavelength conversion member 10, and are emitted from the upper surface of the first wavelength conversion member 10.

[0064] This allows the light emitting device 200 to emit white light having a desired chromaticity. Furthermore, the light emitting device 200 can convert the wavelength of more of the first light emitted from the light emitting element 1 into the third light, thereby increasing the proportion of the third light contained in the light emitted from the light emitting device 200.

[0065] 4. Embodiment 3 A light emitting device 100B according to a third embodiment of the present disclosure will be described with reference to Fig. 8. The light emitting device 100B differs from the light emitting device 100 according to the first embodiment in that the shape of the first wavelength conversion member 10B is different. The first wavelength conversion member 10 exemplified in the above embodiment is a flat plate-shaped member in which the upper surface 11 and the lower surface 12 have the same shape and dimensions, but is not limited to this. The first wavelength conversion member may be a rectangular member in which the upper surface 11B and the lower surface 12B have different dimensions, as in the light emitting device 100B shown in FIG.

[0066] When the upper surface 11B and the lower surface 12B have different dimensions, the side surface 13B of the first wavelength conversion member 10B includes, for example, a first side surface 14 continuing to the upper surface 11B and a second side surface 15 continuing to the lower surface 12B. The first side surface 14 includes a plurality of side surfaces. Specifically, the first side surface 14 includes four surfaces that connect to the respective sides of the rectangular top surface 11B. Each of the four surfaces is, for example, a plane perpendicular to the top surface 11B. The second side surface 15 includes a plurality of side surfaces. Specifically, the second side surface 15 includes four third side surfaces 16 connected to each side of the rectangular bottom surface 12B, and four fourth side surfaces 17 connected to the four third side surfaces 16, respectively. Each of the four third side surfaces 16 is, for example, a plane perpendicular to the bottom surface 12B. Each of the four fourth side surfaces 17 connects each of the third side surfaces 16 to each of the first side surfaces 14. Each of the fourth side surfaces 17 is, for example, a plane parallel to the top surface 11B and the bottom surface 12B.

[0067] By having the first wavelength conversion member 10 configured as described above, the area of ​​the light extraction surface is narrowed, and the light emitting device 100B can have a higher brightness.

[0068] Furthermore, in the side surface 13B of the first wavelength conversion member 10B having the above-described configuration, the first side surface 14 and the second side surface 15 may be continuously covered by the second wavelength conversion member 20. Alternatively, the entire first side surface 14 and the entire second side surface 15 may be covered by the second wavelength conversion member 20. Alternatively, an upper portion of the first side surface 14 or parts of the first side surface 14 and the second side surface 15 may be exposed from the second wavelength conversion member 20.

[0069] 5. Working Example As an example of the light emitting device, the light emitting device according to the first embodiment was produced. The light emitting element used was a GaN-based semiconductor light emitting element that emitted a first light having an emission peak wavelength of 450 nm. The first wavelength conversion member is a plate-shaped sintered body containing an yttrium-aluminum-garnet phosphor as a phosphor, and emits second light having an emission peak wavelength in the range of 520 nm to 560 nm. The second wavelength conversion member uses a silicone resin containing titanium oxide as a light-reflecting material and BSESN phosphor as a phosphor. The amount of titanium oxide contained in the second wavelength conversion member is 60 parts by mass relative to 100 parts by mass of the silicone resin. The amount of phosphor contained in the second wavelength conversion member is 10 parts by mass relative to 100 parts by mass of the silicone resin. The second wavelength conversion member emits third light having an emission peak wavelength in the range of 600 nm to 620 nm. The first light-reflective member was made of a silicone resin containing titanium oxide as a light-reflective material. The amount of titanium oxide contained in the first light-reflective member was 60 parts by mass per 100 parts by mass of silicone resin. The second light-reflective member was made of a silicone resin containing titanium oxide as a light-reflective material. The amount of titanium oxide contained in the second light-reflective member was 60 parts by mass per 100 parts by mass of silicone resin.

[0070] As a light emitting device of Comparative Example 1, a light emitting device similar to the light emitting device of Example was produced, except that it did not include the second wavelength conversion member.

[0071] For the light emitting devices of Example and Comparative Example 1 thus prepared, the x and y chromaticity coordinates of the chromaticity diagram in the CIE1931 color system were determined using a light measurement system combining a multi-channel spectroscope and an integrating sphere. FIG. 9 shows a graph of chromaticity coordinates plotting the chromaticity of light emitted by the light-emitting device of the example and the chromaticity of light emitted by the light-emitting device of the comparative example. In FIG. 9, plot P1 is the chromaticity of light emitted from the entire light-emitting device of the example. In FIG. 9, plot P2 is the chromaticity of light emitted from the entire light-emitting surface of the example. In FIG. 9, plot Q1 is the chromaticity of light emitted from the entire light-emitting device of the comparative example. In FIG. 9, plot Q2 is the chromaticity of light emitted from the entire light-emitting surface of the comparative example.

[0072] Based on the above graph, the chromaticity of the light emitted by the light emitting device of the example was compared with the chromaticity of the light emitted by the light emitting device of the comparative example, and as a result, it was revealed that the chromaticity of the light emitted by the light emitting device of the example is closer to red than the light emitted by the light emitting device of the comparative example. In other words, by providing the light emitting device of the example with the second wavelength conversion member, the chromaticity of the light emitted from the light emitting device can be adjusted.

[0073] The light emitting device according to the embodiment of the present disclosure can be used as a light emitting device for various applications, for example, as a headlight for a vehicle.

[0074] Although each embodiment of the present disclosure has been described above, the disclosed contents may vary in details of the configuration, and changes in the combination and order of elements in each embodiment may be realized without departing from the scope and spirit of the claimed disclosure. [Explanation of symbols]

[0075] 1 Light-emitting element 2 Top side 3. Aspects 4 Bottom side 5. Semiconductor laminate 6 electrodes 7 Support substrate 10, 10B First wavelength conversion member 11, 11B top surface 12, 12B bottom surface 13, 13B side 13A upper part 14 First aspect 15 Second aspect 16 Third aspect 17 Fourth aspect 20, 220, 20A Second wavelength conversion member 21 Page 1 22 1st slope 23 Second slope 30 First light reflective member 31~34 Side 40 Second light reflective member 41 First curved surface 50 boards 50A collective board 51 First aspect 52 Second aspect 53 Third aspect 54 Fourth aspect 55 Base material 56 Wiring 70 Bump 80 Protection element 90A convex part 91 First convex part 92 Second convex part 100, 200, 100A, 100B Light-emitting device R1 Mounting area R2 external connection area

Claims

1. A substrate; a light emitting element disposed on the substrate and emitting a first light; a first wavelength conversion member disposed on the light emitting element and including a phosphor that is excited by the first light and emits second light; a second wavelength conversion member that exposes an upper surface of the first wavelength conversion member, covers a side surface of the first wavelength conversion member, a side surface of the light-emitting element, and an upper surface of the substrate, and has an inclined surface extending from the side surface of the first wavelength conversion member to an outer side, the second wavelength conversion member including: a phosphor that is excited by at least one of the first light and the second light to emit third light; and a light-reflecting substance; a first light reflective member covering the inclined surface; A light emitting device comprising:

2. The light emitting device according to claim 1 , further comprising a second light reflective member disposed between a side surface of the light emitting element and the second wavelength converting member.

3. The light emitting device according to claim 2 , wherein the second light reflective member covers a side surface of the light emitting element.

4. The light emitting device according to claim 2 , wherein the second light reflective member contains titanium oxide.

5. an upper portion of the side surface of the first wavelength converting member is exposed from the second wavelength converting member; The light emitting device according to claim 1 , wherein the first light reflective member covers a side surface of the first wavelength conversion member that is exposed from the second wavelength conversion member.

6. the side surface of the first wavelength conversion member includes a first side surface connected to the upper surface and a second side surface connected to the lower surface of the first wavelength conversion member, The light emitting device according to claim 1 , wherein the second wavelength conversion member continuously covers the first side surface and the second side surface.

7. a peak wavelength of the second light is longer than a peak wavelength of the first light, 7. The light emitting device according to claim 1, wherein the peak wavelength of the third light is longer than the peak wavelength of the first light and the peak wavelength of the second light.

8. the first light is blue light; the second light is yellow light; The light emitting device according to claim 1 , wherein the third light is red light.

9. the light-emitting element includes a gallium nitride-based semiconductor layer, The light emitting device according to claim 1 , wherein the first wavelength conversion member includes an yttrium aluminum garnet phosphor.

10. The light emitting device according to claim 1 , wherein the second wavelength conversion member contains a BSESN phosphor and titanium oxide.

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