Image sensor with color separation lens array and electronic device including the same

Abstract

To provide an image sensor including a color separation lens array, and an electronic device including the same.SOLUTION: An image sensor includes a sensor substrate including a first pixel and a second pixel for sensing light, and a color separation lens array for changing the phase of the first wavelength light so that the first wavelength light included in the incident light advances to the first pixel. The sensor substrate includes an active pixel region for outputting a video generation active pixel signal, a first dummy pixel region disposed outside the active pixel region and outputting a dummy pixel signal for correcting video data generated by the active pixel signal, and a second dummy pixel region disposed outside the active pixel region and the first dummy pixel region and not outputting the pixel signal.SELECTED DRAWING: Figure 10A

Description

[Technical Field]

[0001] The present invention relates to an image sensor having a color separation lens array capable of separating and focusing incident light according to wavelength, and an electronic device including the image sensor. [Background technology]

[0002] Image sensors typically use color filters to sense the color of incident light. However, color filters absorb light of colors other than the color of the filter, resulting in reduced light utilization efficiency. For example, when an RGB color filter is used, only one-third of the incident light is transmitted and the remaining two-thirds is absorbed, resulting in a light utilization efficiency of only about 33%. Therefore, in color display devices and color image sensors, most of the light loss occurs in the color filters. In this regard, the following Patent Documents 1 to 3 are known. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Korean Patent No. 10-1772968 [Patent Document 2] Korean Patent Publication No. 10-2018-0131175 [Patent Document 3] Chinese Patent Application Publication No. 106483594 Summary of the Invention [Problem to be solved by the invention]

[0004] The present invention provides an image sensor and an electronic device including the image sensor, which have improved light utilization efficiency by using a color separation lens array that can separate and condense incident light according to wavelength. [Means for solving the problem]

[0005] According to one embodiment, an image sensor includes a sensor substrate including first and second pixels that sense light, and a color separation lens array that changes the phase of first-wavelength light included in incident light and focuses the first-wavelength light onto the first pixels. The sensor substrate includes an active pixel region that outputs pixel signals for generating an image, a first dummy pixel region that is disposed outside the active pixel region and outputs pixel signals that assist in image generation, and a second dummy pixel region that is disposed outside the first dummy pixel region and does not output pixel signals. The color separation lens array includes a plurality of regions corresponding to the first and second pixels of the active pixel region, the first dummy pixel region, and the second dummy pixel region, respectively. At least a portion of the first-wavelength light incident on the region of the color separation lens array disposed in the second dummy pixel region can be focused onto the first pixels formed in the first dummy pixel region.

[0006] According to another embodiment, an image sensor includes a sensor substrate including first and second pixels that sense light, and a color separation lens array that changes the phase of first-wavelength light among incident light and focuses the first-wavelength light onto the first pixels. The sensor substrate includes an active pixel region that outputs pixel signals for generating an image, a dummy pixel region that is disposed outside the active pixel region and outputs pixel signals that assist in image generation, and an optical black region that is disposed outside the dummy pixel region and outputs a dark level signal. The color separation lens array includes a plurality of regions that respectively correspond to the first and second pixels of the active pixel region, the first dummy pixel region, and the optical black region, and at least a portion of the first-wavelength light incident on the region of the color separation lens array that is disposed in the optical black region can be focused onto the first pixels formed in the first dummy pixel region.

[0007] According to an embodiment, an electronic device includes an image sensor that converts an optical image into an electrical signal, and a processor that controls the operation of the image sensor and stores and outputs the signal generated by the image sensor. The image sensor includes a sensor substrate including first and second pixels that sense light, and a color separation lens array that changes the phase of first-wavelength light included in incident light and focuses the first-wavelength light onto the first pixels. The sensor substrate includes an active pixel region that outputs pixel signals for generating an image, a first dummy pixel region that is disposed outside the active pixel region and outputs pixel signals that assist in image generation, and a second dummy pixel region that is disposed outside the first dummy pixel region and does not output pixel signals. The color separation lens array includes a plurality of regions that correspond to the first and second pixels of the active pixel region, the first dummy pixel region, and the second dummy pixel region, respectively. At least a portion of the first-wavelength light incident on the region of the color separation lens array disposed in the second dummy pixel region can be focused onto the first pixels formed in the first dummy pixel region.

[0008] According to another embodiment, an electronic device includes an image sensor that converts an optical image into an electrical signal, and a processor that controls the operation of the image sensor and stores and outputs the signal generated by the image sensor. The image sensor includes a sensor substrate including first and second pixels that sense light, and a color separation lens array that changes the phase of first-wavelength light among incident light and focuses the first-wavelength light onto the first pixels. The sensor substrate includes an active pixel region that outputs pixel signals for generating an image, a dummy pixel region that is disposed outside the active pixel region and outputs pixel signals that assist in image generation, and an optical black region that is disposed outside the dummy pixel region and outputs a dark level signal. The color separation lens array includes a plurality of regions that respectively correspond to the first and second pixels of the active pixel region, the first dummy pixel region, and the optical black region. At least a portion of the first-wavelength light incident on the region of the color separation lens array disposed in the optical black region can be focused onto the first pixels formed in the first dummy pixel region. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a block diagram of an image sensor according to an embodiment. [Figure 2A] 2 is a diagram illustrating the pixel array of FIG. 1 divided into sections based on the functions performed by pixels included in the pixel array. [Figure 2B] 2 is a diagram illustrating the pixel array of FIG. 1 divided into sections based on the functions performed by pixels included in the pixel array. [Figure 3A] 2C are schematic diagrams showing different cross sections of region A located within the active pixel region of FIGS. 2A and 2B; [Figure 3B] 2C are schematic diagrams showing different cross sections of region A located within the active pixel region of FIGS. 2A and 2B; [Figure 4] 3 is a plan view schematically showing the arrangement of pixels in the pixel array of FIG. 2. FIG. [Figure 5A] 10 is a plan view illustrating an example of a form in which nanoposts are arranged on a color separation lens array. FIG. [Figure 5B] FIG. 5B is an enlarged plan view showing a portion of FIG. 5A in detail. [Figure 6A] 5B is a diagram showing the phase distribution of first and second wavelength light beams that have passed through a color separation lens array, taken along line II' of FIG. 5A. [Figure 6B] 10 is a diagram showing the phases of first wavelength light that has passed through a color separation lens array at the centers of first to fourth regions. [Figure 6C] 10 is a diagram showing the phases of second wavelength light that has passed through a color separation lens array at the centers of first to fourth regions. [Figure 6D] 10 is a diagram illustrating an example of a traveling direction of first wavelength light incident on a first region of a color separation lens array corresponding to a first pixel and its periphery; [Figure 6E] 10 is a diagram illustrating an example of a microlens array that functions equivalently to a color separation lens array for first wavelength light. [Figure 6F] 10 is a diagram illustrating an example of a traveling direction of second wavelength light incident on a second region of a color separation lens array corresponding to a second pixel and its periphery; [Figure 6G]10 is a diagram illustrating an example of a microlens array that functions equivalently to a color separation lens array for second wavelength light. [Figure 7A] 5B is a diagram showing the phase distribution of the first and third wavelength light beams that have passed through the color separation lens array, taken along line II-II' of FIG. 5A. [Figure 7B] 10 is a diagram showing the phase of third wavelength light that has passed through a color separation lens array at the centers of first to fourth regions. [Figure 7C] 10 is a diagram showing the phases of first wavelength light that has passed through a color separation lens array at the centers of first to fourth regions. [Figure 7D] 10 is a diagram illustrating an example of a traveling direction of third wavelength light incident on a third region of a color separation lens array corresponding to a third pixel and its periphery; [Figure 7E] 10 is a diagram illustrating an example of a microlens array that functions equivalently to a color separation lens array for third wavelength light. [Figure 7F] 10 is a diagram illustrating an example of the traveling direction of first-wavelength light incident on a fourth region and its periphery; [Figure 7G] 10 is a diagram illustrating an example of a microlens array that functions equivalently to a color separation lens array for first wavelength light. [Figure 8] 3C is a diagram showing the spectrum of light incident on a sensor substrate through the color separation lens arrays of FIGS. 3A and 3B. [Figure 9A] 10 is a plan view illustrating an example of a shape of a unit pattern of a color separation lens array according to another embodiment applied to a Bayer pattern type image sensor; [Figure 9B] 10 is a plan view illustrating an example of a shape of a unit pattern of a color separation lens array according to still another embodiment; [Figure 10A] FIG. 2C is a cross-sectional view showing region B of FIGS. 2A and 2B. [Figure 10B] FIG. 10B is a plan view of the sensor substrate of FIG. 10A. [Figure 11] 10 is a diagram illustrating a distance that light incident on one pixel is spread by a color separation lens array. [Figure 12A]2C is a cross-sectional view of region B of an embodiment in which one pixel included in the pixel array of FIGS. 2A and 2B includes four sub-pixels. FIG. [Figure 12B] FIG. 12B is a plan view of the sensor substrate of FIG. 12A. [Figure 13A] 10 is a diagram showing the structure of a pixel array according to another embodiment; [Figure 13B] FIG. 13B is a cross-sectional view of region B′ in FIG. 13A. [Figure 14] 1 is a block diagram that schematically illustrates an electronic device including an image sensor according to an embodiment. [Figure 15] FIG. 15 is a block diagram illustrating the camera module of FIG. 14. [Figure 16] 1A to 1C are diagrams illustrating various examples of electronic devices to which image sensors according to embodiments are applied; [Figure 17] 1A to 1C are diagrams illustrating various examples of electronic devices to which image sensors according to embodiments are applied; [Figure 18] 1A to 1C are diagrams illustrating various examples of electronic devices to which image sensors according to embodiments are applied; [Figure 19] 1A to 1C are diagrams illustrating various examples of electronic devices to which image sensors according to embodiments are applied; [Figure 20] 1A to 1C are diagrams illustrating various examples of electronic devices to which image sensors according to embodiments are applied; [Figure 21] 1A to 1C are diagrams illustrating various examples of electronic devices to which image sensors according to embodiments are applied; [Figure 22] 1A to 1C are diagrams illustrating various examples of electronic devices to which image sensors according to embodiments are applied; [Figure 23] 1A to 1C are diagrams illustrating various examples of electronic devices to which image sensors according to embodiments are applied; [Figure 24] 1A and 1B are diagrams illustrating various examples of electronic devices to which image sensors according to embodiments are applied; [Figure 25] 1A to 1C are diagrams illustrating various examples of electronic devices to which image sensors according to embodiments are applied; DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, an image sensor having a color separation lens array and an electronic device including the same will be described in detail with reference to the accompanying drawings. The described embodiments are merely exemplary, and various modifications are possible from such embodiments. In the following drawings, the same reference numerals refer to the same components, and the size of each component may be exaggerated in the drawings for clarity and convenience of explanation.

[0011] Hereinafter, the term "upper" or "above" includes not only what is in contact and directly above / below / left / right, but also what is not in contact and is above / below / left / right.

[0012] Terms such as first, second, etc. may be used to describe various components, but are used only to distinguish one component from another, and such terms do not limit the differences in material or structure of the components.

[0013] The singular expressions include the plural expressions unless the context clearly dictates otherwise. Furthermore, when a part "comprises" a certain element, this does not mean that other elements are excluded, but that other elements may also be included, unless otherwise specified to the contrary.

[0014] In addition, terms such as "unit" and "module" used in the specification refer to a unit that processes a function or operation, and may be realized by hardware or software, or by a combination of hardware and software.

[0015] The use of "the" and similar directives also applies to both the singular and the plural.

[0016] The steps constituting the method are performed in the order of the description unless there is an explicit reference to performing them in the order of description. Furthermore, the use of all exemplary terms (such as, for example, etc.) is merely for the purpose of explaining the technical idea in detail, and does not limit the scope of the right by such terms, except as limited by the claims.

[0017] 1 is a schematic block diagram of an image sensor according to an embodiment. Referring to FIG. 1, an image sensor 1000 includes a pixel array 1100, a timing controller 1010, a row decoder 1020, and an output circuit 1030. The image sensor may be a charge coupled device (CCD) image sensor or a complementary metal oxide semiconductor (CMOS) image sensor that converts an optical image into an electrical signal.

[0018] The pixel array 1100 includes pixels arranged two-dimensionally along a plurality of rows and columns. The row decoder 1020 selects one of the rows of the pixel array 1100 in response to a row address signal output from the timing controller 1010. The output circuit 1030 outputs a photo-sensing signal in units of columns from a plurality of pixels arranged along the selected row. To this end, the output circuit 1030 includes a column decoder and an analog-to-digital converter (ADC). For example, the output circuit 1030 includes a plurality of ADCs arranged for each column between the column decoder and the pixel array 1100, or a single ADC arranged at the output end of the column decoder. The timing controller 1010, the row decoder 1020, and the output circuit 1030 may be implemented on a single chip or on separate chips. A processor for processing the image signal output via the output circuit 1030 may be implemented on a single chip together with the timing controller 1010, the row decoder 1020, and the output circuit 1030.

[0019] 2A and 2B are diagrams illustrating the pixel array of FIG. 1, with the functions performed by the pixels included in the pixel array being the focus.

[0020] Referring to FIG. 2A, the pixel array 1100 includes an active pixel area 1110 that outputs pixel signals for image generation, a first dummy pixel area 1120 that is arranged outside the active pixel area 1110 and outputs pixel signals to assist in image generation, a second dummy pixel area 1130 that is arranged outside the first dummy pixel area 1120 and does not output pixel signals, and an optical black area 1140 that is arranged outside the second dummy pixel area 1130 and includes a light-blocking metal layer and outputs background signals.

[0021] The pixel array 1100, the active pixel area 1110, the first dummy pixel area 1120, and the optical black area 1140 may be connected to the output circuit 1030 via a readout bus. In one embodiment, no readout bus is provided between the second dummy pixel area 1130 and the output circuit 1030 so that pixel signals are not transmitted from the second dummy pixel area 1130 to the output circuit 1030.

[0022] The active pixel region 1110 is a region including active pixels that output signals directly used to generate an image provided by the image sensor 1000. Some or all of the pixels included in the active pixel region 1110 may sense light of a specific wavelength band, i.e., light of a specific color, from light incident on the image sensor and output the magnitude of the color component included in the incident light. The active pixel region 1110 may include three or more types of pixels, for example, green pixels that sense the magnitude of the green light component of the incident light, red pixels that sense the magnitude of the red light component, and blue pixels that sense the magnitude of the blue light component. Specifically, the green pixels may mainly receive light in the green wavelength band (500 nm to 565 nm) included in the incident light, photoelectrically convert the received light, and output the magnitude of the green light component as a pixel signal such as a voltage. Each pixel includes one or more subpixels, which are units that independently perform photoelectric conversion. For example, one green pixel may include two or four subpixels.

[0023] The output circuit 1030 can output an active pixel signal, a dummy pixel signal, and a black pixel signal corresponding to pixel values ​​read from the active pixel area 1110, the first dummy pixel area 1120, and the optical black area 1140, respectively.

[0024] The image sensor 1000 further includes an analog-to-digital converter (ADC) 1040 and a processor 1050. The ADC 1040 can convert the analog active pixel signals, dummy pixel signals, and black pixel signals into digital active pixel signals, dummy pixel signals, and black pixel signals. The processor 1050 can process the digital active pixel signals, dummy pixel signals, and black pixel signals to obtain image data. For example, the processor 1050 can correct the image data obtained from the active pixel signals based on the dummy pixel signals and black pixel signals.

[0025] The image sensor 1000 can generate an image using active signals output by each active pixel arranged in the active pixel region 1110, and the more active pixels included in the active pixel region 1110, the higher the resolution of the generated image. That is, since each active pixel in the active pixel region 1110 can correspond to the smallest unit of image representation, the more active pixels there are in the active pixel region 1110, the more finely-represented images can be generated. The active pixels are exposed to incident light to acquire an image projected onto the surface of the image sensor 1000, and can generate an electrical signal in response to the optical characteristics (e.g., light intensity, wavelength, etc.) of the light incident on the active pixel region 1110. Pixel signals that contribute to improving the resolution of the generated image, such as active pixel signals, can also be said to be directly used in generating the image.

[0026] The first dummy pixel region 1120 is a region where dummy pixels that output signals indirectly used in image generation are formed. The signals output from the first dummy pixel region 1120 are image correction signals used for data correction for active pixels. The first dummy pixel region 1120 may be disposed around the active pixel region 1110 to surround the active pixel region 1110. The structure of the dummy pixels included in the first dummy pixel region 1120 is the same as that of the active pixels included in the active pixel region 1110. However, the dummy pixel signals output from the first dummy pixel region 1120 differ from the active pixel signals output from the active pixel region 1110 in that they do not contribute to improving image resolution.

[0027] The dummy pixel signals output by the dummy pixels included in the first dummy pixel area 1120 may be used to improve image quality. For example, if some active pixels included in the active pixel area 1110 malfunction, a substitute signal to be used in place of the malfunctioning active pixel signal can be generated by interpolating signals from neighboring pixels surrounding the malfunctioning active pixel. The neighboring pixels surrounding the malfunctioning active pixel may include only active pixels, or may include one or more dummy pixels depending on the location of the malfunctioning active pixel. If the malfunctioning active pixel is located at the outermost edge of the active pixel area 1110, i.e., at the boundary between the active pixel area 1110 and the first dummy pixel area 1120, a pixel signal for the malfunctioning active pixel can be generated using the dummy pixel signal from the first dummy pixel area 1120 adjacent to the malfunctioning active pixel. The dummy pixel signal from the first dummy pixel area 1120 does not contribute to improving the resolution of the image, but it does contribute to improving the quality of the generated image, and therefore can be said to be indirectly used in image generation.

[0028] In one embodiment, the processor 1050 may compare the pixel value of each of a plurality of pixels with the pixel values ​​of adjacent pixels. If the difference between the pixel value of a particular pixel and the pixel values ​​of the adjacent pixels is greater than a predetermined difference, the processor 1050 may determine the particular pixel as a malfunctioning active pixel. For example, if a particular pixel is surrounded by eight adjacent pixels, the processor 1050 may compare the pixel value of the particular pixel with the average of the pixel values ​​of the eight adjacent pixels. If the difference between the pixel value of the particular pixel and the average of the pixel values ​​of the eight adjacent pixels is greater than a predetermined difference, the processor 1050 may determine the particular pixel as a malfunctioning pixel. If the particular pixel is determined to be a malfunctioning pixel, the processor 1050 may perform interpolation on the pixel values ​​of the eight adjacent pixels to obtain an interpolated pixel value and replace the pixel value of the particular pixel with the interpolated pixel value.

[0029] The dummy pixel signals of the first dummy pixel area 1120 can be used for purposes such as focus sensing, optical image stabilization (OIS), etc. in addition to supplementing the pixel signals of the active pixel area 1110.

[0030] The second dummy pixel region 1130 is a region in which pixels that do not output signals are formed, and may be disposed outside the first dummy pixel region 1120 to surround the first dummy pixel region 1120. The dummy pixels formed in the second dummy pixel region 1130 differ from the first dummy pixel region 1120 in that they do not output pixel signals. The second dummy pixel region 1130 provides a space through which a portion of light directed toward the second dummy pixel region 1130 can travel to the first dummy pixel region 1120, thereby enabling the pixels in the first dummy pixel region 1120 to sense light under the same conditions as the pixels in the active pixel region 1110. The structure of the second dummy pixel region 1130 will be described below with reference to FIG. 10A.

[0031] The optical black area 1140 includes optical black pixels that output pixel signals in the absence of incident light, i.e., black level or dark level signals (hereinafter, referred to as black pixel signals). The optical black pixels are hardly affected by light incident on the image sensor 1000. The optical black area 1140 may block light incident on the surface of the image sensor 1000. The optical black area 1140 may be disposed outside the second dummy pixel area 1130 to surround the second dummy pixel area 1130. The optical black area 1140 differs from the active pixel area 1110 and the first and second dummy pixel areas 1120 and 1130 in that it includes a light-shielding film for blocking light incident on the pixels. The light-shielding film may include a light-absorbing material. The optical black pixels disposed in the optical black region 1140 may output a black level or dark level signal, which may be noise generated by the material or structure of the photodiode included in the pixel or noise generated by other components constituting the pixel other than the photodiode, when light is blocked. The black level or dark level signal may be used as a reference signal for noise correction of the active pixel signals of the active pixel region 1110 and the dummy pixel signals of the first dummy pixel region 1120. Therefore, the optical black region 1140 may provide a baseline electrical signal level for the active pixels and the dummy pixels. The structure of the optical black region 1140 will be described below with reference to FIG. 10A.

[0032] In the embodiment shown in FIG. 2B, readout buses are provided between each of the active pixel area 1110, the first dummy pixel area 1120, the second dummy pixel area 1130, and the optical black area 1140 and the output circuit 1030.

[0033] The output circuit 1030 can acquire pixel values ​​read from each of the active pixel area 1110, the first dummy pixel area 1120, the second dummy pixel area 1130, and the optical black area 1140 through read buses connected to the active pixel area 1110, the first dummy pixel area 1120, the second dummy pixel area 1130, and the optical black area 1140. The output circuit 1030 can output an active pixel signal, a dummy pixel signal, and a black pixel signal based on the pixel values ​​read from the active pixel area 1110, the first dummy pixel area 1120, and the optical black area 1140, respectively, regardless of the pixel value read from the second dummy pixel area 1130.

[0034] Except for the connection between the second dummy pixel area 1130 and the output circuit 1030 and the operation of the output circuit 1030 with respect to the pixel values ​​read from the second dummy pixel area 1130, the elements shown in FIG. 2B operate substantially the same as those shown in FIG. 2A, and therefore a description thereof will be omitted.

[0035] 3A and 3B are schematic diagrams showing different cross sections of region A located within the active pixel region 1110 of FIGS. 2A and 2B, FIG. 4 is a plan view showing the pixel arrangement of the pixel array of FIGS. 2A and 2B, FIG. 5A is a plan view showing an example of the arrangement of nanoposts in a color separation lens array, and FIG. 5B is a plan view showing an enlarged detail of a portion of FIG. 5A.

[0036] Referring to Figures 3A and 3B, the pixel array 1100 of the image sensor 1000 may include a sensor substrate 110 including a plurality of light-sensing pixels 111, 112, 113, and 114, a transparent spacer layer 120 on the sensor substrate 110, and a color separation lens array 130 arranged on the spacer layer 120.

[0037] The sensor substrate 110 may include first through fourth pixels 111, 112, 113, and 114 that convert light into electrical signals. The first through fourth pixels 111, 112, 113, and 114 may be arranged such that the first and second pixels 111 and 112 are alternately arranged along a first direction (X direction) as shown in FIG. 3A, and the third and fourth pixels 113 and 114 are alternately arranged in a cross section at a different position in the Y direction as shown in FIG. 3B. FIG. 4 illustrates pixels when the pixel array 1100 of the image sensor 1000 has a Bayer pattern. This arrangement is for dividing incident light into unit patterns such as the Bayer pattern and sensing the light. For example, the first and fourth pixels 111 and 114 may sense light of a first wavelength, the second pixel 112 may sense light of a second wavelength, and the third pixel 113 may sense light of a third wavelength. Hereinafter, the first wavelength light is exemplified as green light, the second wavelength light as blue light, and the third wavelength light as red light, and the first to third pixels are also green pixels G, blue pixels B, and red pixels R, respectively.

[0038] The pixel array 1100 may be arranged in various ways other than the Bayer pattern. For example, a CYGM type arrangement in which a magenta pixel M, a cyan pixel C, a yellow pixel Y, and a green pixel G form one unit pixel may be used. An RGBW type arrangement in which a green pixel G, a red pixel R, a blue pixel B, and a white pixel W form one unit pattern may also be used. The unit pixel may also have a 3x2 array form. The following description will be given assuming that the pixel array 1100 of the image sensor 1000 has a Bayer pattern.

[0039] The spacer layer 120 is disposed between the sensor substrate 110 and the color separation lens array 130, and serves to maintain a constant distance between the sensor substrate 110 and the color separation lens array 130. The spacer layer 120 may be made of a material transparent to visible light, for example, a dielectric material having a refractive index lower than that of the nanopost NPs and low absorption in the visible light band, such as SiO2 or siloxane-based spin-on glass (SOG). The thickness h of the spacer layer 120 is ht -p≦h≦h t +p, where the theoretical thickness of the spacer layer 120 is h t can be expressed by the following Equation 1, where n is the refractive index of the spacer layer 120 for the wavelength λ 0 and p is the pixel pitch, which is the distance between the centers of immediately adjacent pixels.

[0040]

number

[0041] The theoretical thickness h of the spacer layer 120 t may refer to the focal length at which light having a wavelength of λ0 is focused onto the upper surfaces of the pixels 111, 112, 113, and 114 by the color separation lens array 130. λ0 is also a wavelength that serves as a reference for determining the thickness h of the spacer layer 120, and the thickness of the spacer layer 120 may be designed based on 540 nm, which is the central wavelength of green light.

[0042] 5A, the color separation lens array 130 may be divided into first to fourth regions 131, 132, 133, and 134 corresponding to the first to fourth pixels 111, 112, 113, and 114 of FIG. 4. The first to fourth regions 131, 132, 133, and 134 may be arranged to face the first to fourth pixels 111, 112, 113, and 114, respectively. For example, the first region 131 of the color separation lens array 130 may be arranged to correspond to the first pixel 111, the second region 132 may be arranged to correspond to the second pixel 112, the third region 133 may be arranged to correspond to the third pixel 113, and the fourth region 134 may be arranged to correspond to the fourth pixel 114. The first to fourth regions 131, 132, 133, and 134 may be two-dimensionally arranged along a first direction (X direction) and a second direction (Y direction) such that a first row in which the first and second regions 131, 132 are alternately arranged and a second row in which the third and fourth regions 133, 134 are alternately arranged alternately are alternately repeated. The color separation lens array 130 also includes a plurality of unit patterns arranged two-dimensionally like the pixel array of the sensor substrate 110, and each unit pattern includes the first to fourth regions 131, 132, 133, and 134 arranged in a 2x2 format.

[0043] 3A and 3B illustrate an example of a structure in which the first to fourth regions 131, 132, 133, and 134 and the first to fourth pixels 111, 112, 113, and 114 have the same size and face each other vertically, but the color separation lens array 130 may also be divided into multiple regions defined in other forms, such as a region that collects first wavelength light and a region that collects second wavelength light.

[0044] The color separation lens array 130 may include nanopost NPs whose size, shape, spacing, and / or arrangement are determined so that first wavelength light is branched and focused at the first pixel 111 and the fourth pixel 114, second wavelength light is branched and focused at the second pixel 112, and third wavelength light is branched and focused at the third pixel 113. Meanwhile, the thickness of the color separation lens array 130 along the third direction (Z direction) is similar to the height of the nanopost NPs. For example, the thickness of the color separation lens array 130 and the height of the nanopost NPs are approximately 500 nm to approximately 1500 nm.

[0045] 5A, the first through fourth regions 131, 132, 133, and 134 include cylindrical nanopost NPs with circular cross sections, and nanopost NPs with different cross-sectional areas are arranged in the center of each region, and nanopost NPs can also be arranged at the centers of inter-pixel boundaries and at intersections of pixel boundaries. The cross-sectional areas of the nanopost NPs arranged at the inter-pixel boundaries are smaller than those of the nanopost NPs arranged at the center of the pixels.

[0046] 5B shows in detail the arrangement of nanoposts NPs included in a portion of FIG. 5A, i.e., first through fourth regions 131, 132, 133, and 134 constituting the unit pattern. In FIG. 5B, the nanoposts NPs are labeled p1 through p9 according to their detailed positions in the unit pattern. Referring to FIG. 5B, the cross-sectional areas of nanopost p1 located at the center of first region 131 and nanopost p4 located at the center of fourth region 134 are larger than the cross-sectional areas of nanopost p2 located at the center of second region 132 and nanopost p3 located at the center of third region 133, and the cross-sectional area of ​​nanopost p2 located at the center of second region 132 is larger than the cross-sectional area of ​​nanopost p3 located at the center of third region 133. However, this is merely an example, and nanoposts NPs of various shapes, sizes, and arrangements may be used as needed.

[0047] The nanoposts NP in the first and fourth regions 131 and 134 corresponding to the green pixel G have different distribution patterns in the first direction (X direction) and the second direction (Y direction). For example, the nanoposts NP arranged in the first and fourth regions 131 and 134 have different size arrangements in the first direction (X direction) and the second direction (Y direction). As shown in FIG. 5B, the cross-sectional area of ​​nanopost p5 located at the boundary between the first region 131 and the second region 132 adjacent to it in the first direction (X direction) is different from the cross-sectional area of ​​nanopost p6 located at the boundary between the first region 131 and the third region 133 adjacent to it in the second direction (Y direction). Similarly, the cross-sectional area of ​​nanopost p7 located at the boundary between the fourth region 134 and the third region 133 adjacent to it in the first direction (X direction) is different from the cross-sectional area of ​​nanopost p8 located at the boundary between the second region 132 adjacent to it in the second direction (Y direction).

[0048] Meanwhile, the nanoposts NP arranged in the second region 132 corresponding to the blue pixel B and the third region 133 corresponding to the red pixel R may have a symmetrical distribution pattern along the first direction (X direction) and the second direction (Y direction). As shown in FIG. 5B, among the nanoposts NP, nanopost p5 arranged at the boundary between pixels adjacent to the second region 132 in the first direction (X direction) and nanopost p8 arranged at the boundary between pixels adjacent to the second region 132 in the second direction (Y direction) have the same cross-sectional area. Similarly, in the third region 133, nanopost p7 arranged at the boundary between pixels adjacent to the first direction (X direction) and nanopost p6 arranged at the boundary between pixels adjacent to the second direction (Y direction) have the same cross-sectional area.

[0049] On the other hand, the nanoposts p9 arranged at the four corners of each of the first to fourth regions 131, 132, 133, and 134, that is, at the positions where the four regions intersect, have the same cross-sectional area.

[0050] This distribution is due to the pixel arrangement of the Bayer pattern. The blue pixel B and the red pixel R are identical in that the pixels adjacent to each other in the first direction (X direction) and the second direction (Y direction) are green pixels G, whereas the green pixel G corresponding to the first region 131 is different in that the pixel adjacent to each other in the first direction (X direction) is a blue pixel B and the pixel adjacent to each other in the second direction (Y direction), and the green pixel G corresponding to the fourth region 134 is different in that the pixel adjacent to each other in the first direction (X direction) is a red pixel R and the pixel adjacent to each other in the second direction (Y direction). The green pixels G corresponding to the first region 131 and the fourth region 134 have four diagonally adjacent green pixels G, which are identical to each other. The blue pixels B corresponding to the second region 132 have four diagonally adjacent red pixels R, which are identical to each other. The red pixels R corresponding to the third region 133 have four diagonally adjacent blue pixels B, which are identical to each other. Therefore, in the second and third regions 132 and 133 corresponding to the blue and red pixels B and R, the nanoposts NPs may be arranged in a four-fold symmetry pattern, and in the first and fourth regions 131 and 134 corresponding to the green pixels G, the nanoposts NPs may be arranged in a two-fold symmetry pattern. In particular, the first and second green pixel-corresponding regions 131 and 134 are rotated 90° relative to each other.

[0051] 5A and 5B are illustrated as having a symmetrical circular cross-sectional shape, some nanoposts may have an asymmetrical cross-sectional shape. For example, the first and fourth regions 131 and 134 corresponding to the green pixel G may employ nanoposts having an asymmetrical cross-sectional shape with different widths in the first direction (X direction) and the second direction (Y direction), while the second and third regions 132 and 133 corresponding to the blue pixel B and the red pixel R may employ nanoposts having a symmetrical cross-sectional shape with the same widths in the first direction (X direction) and the second direction (Y direction).

[0052] The illustrated arrangement rule of the color separation lens array 130 is merely an example for realizing a phase distribution in which first wavelength light is split and focused at the first pixel 111 and the fourth pixel 114, second wavelength light is split and focused at the second pixel 112, and third wavelength light is split and focused at the third pixel 113, and is not limited to the illustrated pattern.

[0053] Figure 6A shows the phase distribution of the first and second wavelength light that has passed through the color separation lens array 130 along line I-I' in Figure 5A, Figure 6B shows the phase of the first wavelength light that has passed through the color separation lens array 130 at the centers of the first to fourth regions 131, 132, 133, and 134, and Figure 6C shows the phase of the second wavelength light that has passed through the color separation lens array 130 at the centers of the first to fourth regions 131, 132, 133, and 134. The phase distribution of the first and second wavelength light shown in Figure 6A is the same as the phase distribution of the first and second wavelength light exemplarily described in Figure 3B.

[0054] 6A and 6B, the first wavelength light passing through the color separation lens array 130 has a first phase distribution PP1 that is greatest at the center of the first region 131 and decreases in a direction away from the center of the first region 131. Specifically, the phase of the first wavelength light is greatest at the center of the first region 131 immediately after passing through the color separation lens array 130, i.e., on the lower surface of the color separation lens array 130 or the upper surface of the spacer layer 120, and gradually decreases concentrically with increasing distance from the center of the first region 131. The phase is minimum at the centers of the second and third regions 132 and 133 in the X and Y directions, and is minimum at the junction of the first region 131 and the fourth region 134 in the diagonal direction. If the phase of the first wavelength light emitted from the center of the first region 131 is determined to be 2π as a reference, light with a phase of 0.9π to 1.1π can be emitted from the centers of the second and third regions 132 and 133, a phase of 2π can be emitted from the center of the fourth region 134, and a phase of 1.1π to 1.5π can be emitted from the junction of the first region 131 and the fourth region 134. However, the first phase distribution PP1 does not mean that the phase delay of light passing through the center of the first region 131 is the largest. When the phase of light passing through the first region 131 is determined to be 2π, the phase value of light passing through other positions (when the phase delay is even larger, greater than 2π) is the value remaining after removing 2nπ, i.e., a wrapped phase distribution. For example, if the phase of light passing through the first region 131 is 2π, and the phase of light passing through the center of the second region 132 is 3π, the phase in the second region 132 is also the π remaining after removing 2π (when n=1) from 3π.

[0055] 6A and 6C, the second-wavelength light passing through the color separation lens array 130 has a second phase distribution PP2 that is greatest at the center of the second region 132 and decreases in a direction away from the center of the second region 132. Specifically, immediately after passing through the color separation lens array 130, the phase of the second-wavelength light is greatest at the center of the second region 132 and gradually decreases concentrically with increasing distance from the center of the second region 132, reaching minimums at the centers of the first and fourth regions 131 and 134 in the X and Y directions and at the center of the third region 133 in the diagonal direction. If the phase of the second-wavelength light at the center of the second region 132 is 2π, the phase of the second-wavelength light is 0.9π to 1.1π at the centers of the first and fourth regions 131 and 134 and is a value smaller than π, for example, 0.2π to 0.9π, at the center of the third region 133.

[0056] Figure 6D exemplarily shows the first region 131 of the color separation lens array 130 corresponding to the first pixel 111 and the direction of propagation of the first wavelength light incident on its periphery, and Figure 6E exemplarily shows a microlens array that acts equivalently to the color separation lens array 130 on the first wavelength light.

[0057] The first wavelength light incident on the periphery of the first region 131 is condensed by the color separation lens array 130 onto the first pixel 111 as shown in FIG. 6D, and the first wavelength light from the first to third regions 131, 132, and 133 is incident on the first pixel 111. The phase distribution of the first wavelength light described in FIG. 6A and FIG. 6B is similar to the phase distribution of light passing through a virtual first microlens ML1 formed by connecting the centers of two second regions 132 and two third regions 133 that are adjacent to the first region 131 and have one side abutted against the first region 131. Therefore, as shown in FIG. 6E, the color separation lens array 130 can function equivalently to an array of a plurality of first microlenses ML1 arranged around the first region 131 for the first wavelength light incident on the periphery of the first region 131. Each of the equivalent first microlenses ML1 has an area larger than that of the corresponding first pixel 111, and therefore can collect not only the first wavelength light incident on the first region 131 but also the first wavelength light incident on the second and third regions 132 and 133 onto the first pixel 111. The area of ​​the first microlens ML1 is 1.2 to 2 times larger than the area of ​​the corresponding first pixel 111.

[0058] Figure 6F exemplarily shows the direction of propagation of second wavelength light incident on the second region 132 of the color separation lens array 130 corresponding to the second pixel 112 and its surroundings, and Figure 6G exemplarily shows a microlens array that acts equivalently to the color separation lens array 130 with respect to the second wavelength light.

[0059] The second wavelength light is condensed by the color separation lens array 130 onto the second pixel 112 as shown in Figure 6F, and the second wavelength light from the first to fourth regions 131, 132, 133, and 134 is incident on the second pixel 112. The phase distribution of the second wavelength light described in Figures 6A and 6C is similar to the phase distribution of light passing through a virtual second microlens ML2 formed by connecting the centers of four third regions 133 adjacent to the second region 132 with their vertices abutting. Therefore, as shown in Figure 6G, the color separation lens array 130 can function equivalently to an array of multiple second microlenses ML2 arranged around the second region 132 for the second wavelength light. Since each second microlens ML2 is larger than the corresponding second pixel 112, not only the second wavelength light incident in the direction of the second pixel 112 but also the second wavelength light incident in the directions of the first, third and fourth pixels 111, 113 and 114 can be focused on the second pixel 112. The area of ​​the second microlens ML2 is 1.5 to 4 times larger than the area of ​​the corresponding second pixel 112.

[0060] Figure 7A shows the phase distribution of the first and third wavelength light that has passed through the color separation lens array 130 along line II-II' in Figure 5A, Figure 7B shows the phase of the third wavelength light that has passed through the color separation lens array 130 at the centers of the first to fourth regions 131, 132, 133, and 134, and Figure 7C shows the phase of the first wavelength light that has passed through the color separation lens array 130 at the centers of the first to fourth regions 131, 132, 133, and 134.

[0061] 7A and 7B, the third wavelength light passing through the color separation lens array 130 may have a phase distribution similar to that of the second wavelength light described above, centered around the second region 132, and may have a third phase distribution PP3 that is greatest at the center of the third region 133 and decreases in a direction away from the center of the third region 133. Specifically, the third wavelength light is greatest at the center of the third region 133 immediately after passing through the color separation lens array 130, and gradually decreases concentrically as it moves away from the center of the third region 133, reaching its minimum at the centers of the first and fourth regions 131 and 134 in the X and Y directions, and its minimum at the center of the second region 132 in the diagonal direction. If the phase of the third wavelength light at the center of the third region 133 is 2π, the phase of the third wavelength light at the centers of the first and fourth regions 131, 134 is 0.9π to 1.1π, and at the center of the second region 132 is a value smaller than π, approximately 0.2π to 0.9π.

[0062] Figure 7D exemplarily shows the direction of travel of third wavelength light incident on the third region 133 of the color separation lens array 130 corresponding to the third pixel 113 and its surroundings, and Figure 7E exemplarily shows a microlens array that acts equivalently to the color separation lens array 130 with respect to the third wavelength light.

[0063] The third wavelength light is condensed by the color separation lens array 130 onto the third pixel 113 as shown in Figure 7D, and the third wavelength light from the first to fourth regions 131, 132, 133, and 134 is incident on the third pixel 113. The phase distribution of the third wavelength light described above in Figures 7A and 7B is similar to the phase distribution of light passing through a virtual third microlens ML3 formed by connecting the centers of four second regions 132 adjacent to the third region 133 with their vertices butted against each other. Therefore, as shown in Figure 7E, the color separation lens array 130 can function equivalently to an array of multiple third microlenses ML3 arranged around the third pixel 113 for the third wavelength light. The area of ​​each third microlens ML3 is larger than the corresponding third pixel 113, so that not only the third wavelength light incident in the direction of the third pixel 113 but also the third wavelength light incident in the directions of the first, second and fourth pixels 111, 112 and 114 can be focused on the third pixel 113. The area of ​​the third microlens ML3 is 1.5 to 4 times larger than the area of ​​the corresponding third pixel 113.

[0064] 7A and 7C, the first-wavelength light incident on the periphery of the fourth region 134 has a phase distribution similar to that of the first-wavelength light described above, centered on the first region 131, and has a fourth phase distribution PP4 that is greatest at the center of the fourth region 134 and decreases in a direction away from the center of the fourth region 134. The phase of the first-wavelength light centered on the fourth region 134 is greatest at the center of the fourth region 134 immediately after passing through the color separation lens array 130 and gradually decreases concentrically with increasing distance from the center of the fourth region 134, reaching minimums at the centers of the second and third regions 132 and 133 in the X and Y directions and at the junction of the first region 131 and the fourth region 134 in the diagonal direction. If the phase of the first wavelength light is 2π at the center of the fourth region 134, it is 0.9π to 1.1π at the centers of the second and third regions 132 and 133, 2π at the center of the first region 131, and 1.1π to 1.5π at the intersection of the first region 131 and the fourth region 134.

[0065] 7F exemplarily shows the traveling direction of first-wavelength light incident on the fourth region and its periphery, and FIG. 7G exemplarily shows a microlens array that acts equivalently to a color separation lens array on the first-wavelength light. The first-wavelength light is collected on two pixels 111 and 114, and the phase distribution and traveling direction of the first-wavelength light incident on the fourth region 134 are similar to the phase distribution and traveling direction of the first-wavelength light incident on the first region 131, so a duplicated description will be omitted.

[0066] 7F, the first wavelength light incident on the periphery of the fourth region 134 is condensed onto the fourth pixel 114 by the color separation lens array 130, and the first wavelength light from the second to fourth regions 132, 133, and 134 is incident on the fourth pixel 114. As shown in FIG. 7G, the color separation lens array 130 can function equivalently to a plurality of fourth microlenses ML4 arrays arranged around the fourth pixel 114 for the first wavelength light incident on the periphery of the fourth region 134.

[0067] FIG. 8 is a diagram showing the spectrum of light incident on the sensor substrate through the color separation lens arrays of FIGS. 3A and 3B.

[0068] The vertical axis of FIG. 8 represents QE (Quantum Efficiency), and the horizontal axis represents the wavelength of light. QE (Quantum Efficiency) is quantum efficiency, and indicates the degree to which photons incident on the pixel array 1100 are converted into electrons by a photoelectric conversion element. For example, when incident photons are converted into electrons with 80% efficiency, the QE is 0.8, and when incident photons are converted into electrons with 100% efficiency, the QE is 1.0. In a typical pixel array, the QE does not exceed 1.0, but the pixel arrays of FIGS. 3A and 3B include the color separation lens array 130, so the QE can exceed 1.0. For example, when the second pixel 112 has a QE of 2.0 for a 475 nm wavelength, this means that when 100 photons of 475 nm wavelength light travel toward the second pixel 112, the second pixel 112 generates electrons corresponding to 200 photons. 3A and 3B, not only photons of 475 nm wavelength light traveling toward the second pixel 112 but also photons of 475 nm wavelength light traveling toward the first and third pixels 111 and 113 are incident on the second pixel 112, so the QE is 1.0 or more. That is, the amount of 475 nm wavelength light photons incident on the second pixel 112 after passing through the color separation lens array 130 is greater than the amount of 475 nm wavelength light photons traveling toward the second pixel 112 before passing through the color separation lens array 130, so the QE of the second pixel 112 for 475 nm wavelength light is greater than 1.0.

[0069] 8, the first spectrum S1 represents the spectrum of light sensed by the first and fourth pixels 111 and 114, which are green pixels G, after light incident on the pixel array 1100 is split by the color separation lens array 130. The spectrum has the highest QE in the 490-580 nm wavelength band corresponding to green light. The second spectrum S2 represents the spectrum of light sensed by the second pixel 112, which is a blue pixel B, and the highest QE in the 420-475 nm wavelength band corresponding to blue light. The third spectrum S3 represents the spectrum of light sensed by the third pixel 113, which is a red pixel R, and the highest QE in the 590-680 nm wavelength band corresponding to red light.

[0070] The color separation lens array 130 shown in Figure 5A is merely an example, and various types of color separation lens arrays 130 can be designed depending on the color characteristics of the image sensor, the pixel pitch, the angle of incidence of incident light, etc. Also, although the color separation lens array 130 has been described as including a plurality of cylindrical nanoposts NP spaced apart from one another, this is not necessarily the case. For example, Figure 9A is a plan view showing the unit pattern shape of another color separation lens array applied to a Bayer pattern type image sensor, and Figure 9B is a plan view showing the unit pattern shape of yet another color separation lens array.

[0071] The first through fourth regions 131', 132', 133', and 134' of the color separation lens array 130' shown in Figure 9A are optimized for digitized binary patterns in a 16x16 rectangular array, and the unit patterns have a form consisting of a 32x32 rectangular array. In contrast, the first through fourth regions 131', 132', 133', and 134' of the color separation lens array 130'' shown in Figure 9B have non-digitized continuous curved forms.

[0072] The color separation lens arrays 130, 130', and 130" that satisfy the above-described phase distribution and performance can be designed automatically through various computer simulations. For example, the structures of the first through fourth regions 131, 132, 133, 134, 131', 132', 133', 134', 131", 132", 133", and 134" can be optimized using nature-inspired algorithms such as genetic algorithms, particle swarm optimization algorithms, and ant colony optimization, or through an inverse design method based on an adjoint optimization algorithm.

[0073] The design of the color separation lens arrays 130, 130', 130" can be performed by optimizing the first through fourth structures of the first through fourth regions 131, 132, 133, 134, 131', 132', 133', 134', 131", 132", 133", 134" while evaluating the performance of candidate color separation lens arrays based on evaluation factors such as color separation spectrum, optical efficiency, and signal-to-noise ratio. For example, if target values ​​for each evaluation factor are predetermined, the structures of the first through fourth regions 131, 132, 133, 134, 131', 132', 133', 134', 131", 132", 133", 134" can be optimized by minimizing the sum of the differences between the target values ​​for the evaluation factors and the design values. Alternatively, if performance is indexed for each evaluation factor, the structures of the first to fourth regions 131, 132, 133, 134, 131', 132', 133', 134', 131'', 132'', 133'', and 134'' can be optimized to maximize the value indicating the performance.

[0074] 10A is a cross-sectional view of region B in FIGS. 2A and 2B, and FIG. 10B is a plan view of the sensor substrate in FIG. 10A.

[0075] Region B of Figure 2 differs from region A of Figures 2A and 2B, which includes only the active pixel region 1110, in that region B of Figure 2 includes an active pixel region 1110, a first dummy pixel region 1120, a second dummy pixel region 1130, and an optical black region 1140 of the pixel array 1100.

[0076] As described above, the first dummy pixel region 1120 is a region in which pixels that output signals indirectly used in image generation are formed, and is disposed outside the active pixel region 1110 to surround the active pixel region 1110. The first dummy pixel region 1120 has a structure and operation similar to that of the active pixel region 1110 described above with reference to Figures 3A and 3B, and therefore a redundant description will be omitted.

[0077] The second dummy pixel region 1130 is a region for providing a path for light incident on pixels formed in the first dummy pixel region 1120, and may be disposed outside the first dummy pixel region 1120 to surround the first dummy pixel region 1120. The second dummy pixel region 1130 is similar in structure to the active pixel region 1110 and the first dummy pixel region 1120 in that it includes a sensor substrate 110, a spacer layer 120, and a color separation lens array 130, but differs in that the pixels included in the second dummy pixel region 1130 do not output pixel signals. Specifically, the second dummy pixel region 1130 is provided to extend the color separation lens array 130 outside the first dummy pixel region 1120, and can allow a portion of the light that passes through the color separation lens array 130 arranged in the second dummy pixel region 1130 (i.e., the color separation lens array 130 located directly above the pixels in the second dummy pixel region 1130) to be incident on the pixels arranged in the first dummy pixel region 1120.

[0078] 10A , a portion of blue light incident on the first region 131 of the color separation lens array 130 formed in the second dummy pixel region 1130 is condensed by the second pixel 112 in the first dummy pixel region 1120, so that the second pixel 112 in the first dummy pixel region 1120 receives light under the same conditions as the second pixel 112 in the active pixel region 1110. If the color separation lens array 130 were not present in the second dummy pixel region 1130, the blue light incident on the first region 131 of the second dummy pixel region 1130 would not be condensed by the second pixel 112 in the first dummy pixel region 1120, and therefore the second pixel 112 in the first dummy pixel region 1120 would not be able to receive light under the same conditions as the second pixel 112 in the active pixel region 1110. As mentioned above, in order to use the pixel signals of the first dummy pixel area 1120 to correct the pixel signals of the active pixel area 1110 or to focus the image sensor, the first dummy pixel area 1120 must receive incident light under the same conditions as the active pixel area 1110, and the second dummy pixel area 1130 is required to satisfy such conditions.

[0079] In addition to providing a path for light incident on the first dummy pixel region 1120, the second dummy pixel region 1130 may also function to prevent contamination of the first dummy pixel region 1120 during the formation process of the optical black region 1140.

[0080] The optical black area 1140 is an area in which pixels that output pixel signals in the absence of incident light, i.e., black level or dark level signals, are formed, and may be disposed outside the second dummy pixel area 1130 to surround the second dummy pixel area 1130. The optical black area 1140 may include the sensor substrate 110, the spacer layer 120, and the light-shielding film 121.

[0081] The light-shielding film 121 is formed on the pixels 111 and 112 included in the optical black area 1140, and can block light incident on the pixels 111 and 112. The light-shielding film 121 is made of a material containing a metal such as copper or tungsten.

[0082] A color separation lens array 130 may be formed in the optical black area 1140, but since the optical black area 1140 is separated from the active pixel area 1110 and the first dummy pixel area 1120 by the second dummy pixel area 1130, the color separation lens array 130 is not formed in the optical black area 1140.

[0083] FIG. 11 is a diagram illustrating the distance over which light incident on one pixel is spread by the color separation lens array 130. As shown in FIG.

[0084] 11 shows the extent to which green light having a wavelength of 530 nm is incident on the third region 133 of the color separation lens array 130 formed in the second dummy pixel region 1130 and sensed by the sensor substrate 110. Specifically, the incident position of the green light is a reference third region 133 (not shown) disposed above the reference third pixel 113 in the Z direction, which is underlined among the third pixels 113 in FIG. 11. The magnitude of the green light incident on the reference third region 133 is shown numerically, assuming that the magnitude of the green light incident on the reference third region 133 is 1. For example, after green light having a magnitude of 1 passes through the reference third region 133 of the color separation lens array 130 and is branched, it is sensed by about 0.060 by the first pixel 111 adjacent to the reference third pixel 113 with one side facing the reference third pixel 113, and by about 0.059 and 0.056 by the fourth pixel 114 adjacent to the reference third pixel 113 with one side facing the reference third pixel 113, respectively.

[0085] 11, the light sensed by pixels three or more squares away from the reference third pixel 113 is negligibly small, at 0.002 or less. For example, the light sensed by the fourth pixel 114, which is located three squares away from the reference third pixel 113 in the X direction, and the light sensed by the first pixel 111, which is located three squares away from the reference third pixel 113 in the Y direction, are both small, at 0.002. In other words, light incident on the color separation lens array 130 is considered to affect pixels located vertically below the incident area and pixels located within two squares.

[0086] Referring again to FIG. 10A, since light incident on the second region 132 included in the second dummy pixel region 1130 can affect the second pixel 112 included in the first dummy pixel region 1120, the second dummy pixel region 1130 in FIG. 10B may include two or more pixels in a direction away from the first dummy pixel region 1120, for example, in the X direction of FIG. 10B, and may include 2 to 10 pixel columns or pixel rows, or 2 to 4 pixel columns or pixel rows.

[0087] 12A is a cross-sectional view of region B of an embodiment in which one pixel included in the pixel array of FIGS. 2A and 2B includes four sub-pixels, and FIG. 12B is a plan view of the sensor substrate of FIG. 12A.

[0088] 12B, each pixel included in the sensor substrate 110a of FIG. 12B may include four subpixels. For example, a first pixel 111 may include 1-a through 1-d subpixels 111a, 111b, 111c, and 111d; a second pixel 112 may include 2-a through 2-d subpixels 112a, 112b, 112c, and 112d; a third pixel 113 may include 3-a through 3-d subpixels 113a, 113b, 113c, and 113d; and a fourth pixel 114 may include 4-a through 4-d subpixels 114a, 114b, 114c, and 114d, forming a TetraCell structure. Each of the four subpixels included in one pixel may output a pixel signal individually, or may output a single pixel signal that is the sum of signals sensed by the four subpixels.

[0089] The color separation lens array 130 of Fig. 12A has a similar structure and operation to the color separation lens array 130 of Fig. 3A, and therefore a redundant description will be omitted. Light incident on the second region 132 of the color separation lens array 130 included in the second dummy pixel region 1130 of Fig. 12A can affect the 2-a and 2-b sub-pixels 112a and 112b included in the first dummy pixel region 1120. Therefore, the second dummy pixel region 1130 of Fig. 12A may include four or more sub-pixels in a direction away from the first dummy pixel region 1120, for example, in the X direction of Fig. 12B, and may include, for example, 4 to 20 sub-pixels.

[0090] FIG. 13A is a diagram showing the structure of a pixel array according to another embodiment, and FIG. 13B is a cross-sectional view of region B' in FIG. 13A.

[0091] The pixel array 1100' of FIG. 13A differs from the pixel array 1100 of FIGS. 2A and 2B in that it does not include a second dummy pixel region 1130 and that a color separation lens array 130' is formed in an optical black region 1140'.

[0092] 13B, the pixel array 1100′ may include a color separation lens array 130′ formed in the optical black region 1140′ so that the pixels 111 and 112 included in the first dummy pixel region 1120 receive light under the same conditions as the active pixel region 1110. A portion of incident light traveling into the optical black region 1140′ may be split by the color separation lens array 130′ formed in the optical black region 1140′ and travel to the pixels formed in the first dummy pixel region 1120. The optical black region 1140′ in FIG. 13B may include two or more pixels in a direction away from the first dummy pixel region 1120, for example, in the X direction of FIG. 13B. For example, the optical black region 1140′ may include 2 to 10 pixel columns or pixel rows, or 2 to 4 pixel columns or pixel rows, arranged in a direction away from the first dummy pixel region 1120.

[0093] The image sensor 1000 including the pixel array 1100 described above has almost no light loss due to color filters, e.g., organic color filters, and can therefore provide a sufficient amount of light to pixels even when the pixel size is small. Therefore, it is possible to fabricate ultra-high-resolution, micro-high-sensitivity image sensors having hundreds of millions of pixels. Such ultra-high-resolution, micro-high-sensitivity image sensors can be used in a variety of high-performance optical devices or electronic devices. Examples of such electronic devices include, but are not limited to, various portable devices such as smartphones, personal digital assistants (PDAs), laptops, and PCs, home appliances, security cameras, medical cameras, automobiles, Internet of Things (IoT) devices, and other mobile or non-mobile computing devices.

[0094] In addition to the image sensor 1000, the electronic device may further include a processor, for example, an application processor (AP), that controls the image sensor. The processor may run an operating system or application program to control multiple hardware or software components and perform various data processing and calculations. The processor may further include a graphic processing unit (GPU) and / or an image signal processor. When the processor includes an image signal processor, the image (or video) acquired by the image sensor may be stored and / or output using the processor.

[0095] 14 is a block diagram illustrating an example of an electronic device 1401 including an image sensor 1000. Referring to FIG. 14 , in a network environment 1400, the electronic device 1401 can communicate with another electronic device 1402 through a first network 1498 (e.g., a short-range wireless communication network) or can communicate with yet another electronic device 1404 and / or a server 1408 through a second network 1499 (e.g., a long-range wireless communication network). The electronic device 1401 can communicate with the electronic device 1404 through the server 1408. The electronic device 1401 may include a processor 1420, a memory 1430, an input device 1450, an audio output device 1455, a display device 1460, an audio module 1470, a sensor module 1476, an interface 1477, a haptic module 1479, a camera module 1480, a power management module 1488, a battery 1489, a communication module 1490, a subscriber identity module 1496, and / or an antenna module 1497. The electronic device 1401 may omit some of the components (e.g., the display device 1460) or add other components. Some of the components may be implemented as a single integrated circuit. For example, the sensor module 1476 (e.g., a fingerprint sensor, an iris sensor, an illuminance sensor, etc.) may be embedded in the display device 1460 (e.g., a display).

[0096] The processor 1420 may execute software (e.g., program 1440) to control one or more different components (e.g., hardware and software components) of the electronic device 1401 coupled to the processor 1420 and perform various data processing or computations. As part of the data processing or computations, the processor 1420 may load instructions and / or data received from other components (e.g., sensor module 1476, communication module 1490) into volatile memory 1432, process the instructions and / or data stored in volatile memory 1432, and store the resulting data in non-volatile memory 1434. The processor 1420 may include a main processor 1421 (e.g., a central processing unit, an application processor, etc.) and an auxiliary processor 1423 (e.g., a graphics processing unit, an image signal processor, a sensor hub processor, a communication processor, etc.) that may operate independently or in conjunction with the main processor 1421. The auxiliary processor 1423 may use less power than the main processor 1421 and may perform specialized functions.

[0097] The auxiliary processor 1423 can control functions and / or states of some components (such as the display device 1460, the sensor module 1476, and the communication module 1490) of the electronic device 1401 in place of the main processor 1421 while the main processor 1421 is in an inactive state (sleep state), or together with the main processor 1421 while the main processor 1421 is in an active state (application execution state). The auxiliary processor 1423 (such as an image signal processor or a communication processor) may also be embodied as part of other functionally related components (such as the camera module 1480 and the communication module 1490).

[0098] The memory 1430 can store various data required by the components of the electronic device 1401 (e.g., the processor 1420, the sensor module 1476, etc.). The data may include, for example, input data and / or output data for software (e.g., the program 1440) and its associated instructions. The memory 1430 may include a volatile memory 1432 and / or a non-volatile memory 1434. The non-volatile memory 1434 may include an internal memory 1436 fixed within the electronic device 1401 and a removable external memory 1438.

[0099] Programs 1440 are stored as software in memory 1430 and may include operating systems 1442, middleware 1444, and / or applications 1446.

[0100] The input device(s) 1450 can receive instructions and / or data from outside the electronic device 1401 (e.g., a user) for use by components of the electronic device 1401 (e.g., the processor 1420). The input device(s) 1450 may include a microphone, a mouse, a keyboard, and / or a digital pen (e.g., a stylus pen).

[0101] The audio output device 1455 can output audio signals to the outside of the electronic device 1401. The audio output device 1455 may include a speaker and / or a receiver. The speaker is used for general purposes such as multimedia playback or recording and playback, and the receiver is used to receive incoming calls. The receiver may be combined with the speaker or may be implemented as a separate, independent device.

[0102] Display device 1460 can visually provide information external to electronic device 1401. Display device 1460 may include a display, a holographic device, or a projector and control circuitry for controlling the device. Display device 1460 may include touch circuitry configured to sense a touch and / or sensor circuitry (such as a pressure sensor) configured to measure the strength of a force generated by a touch.

[0103] Audio module 1470 may convert sound into an electrical signal or vice versa. Audio module 1470 may acquire sound through input device 1450 or output sound through audio output device 1455 and / or speakers and / or headphones of other electronic devices (such as electronic device 1402) directly or wirelessly coupled to electronic device 1401.

[0104] The sensor module 1476 can sense an operating state (e.g., power, temperature) of the electronic device 1401 or an external environmental state (e.g., user state) and generate an electrical signal and / or data value corresponding to the sensed state. The sensor module 1476 may include a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (Infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, and / or an illuminance sensor.

[0105] The interface 1477 may support one or more specified protocols that can be used to directly or wirelessly connect the electronic device 1401 to other electronic devices (such as the electronic device 1402). The interface 1477 may include an HDMI (High Definition Multimedia Interface, registered trademark), a USB (Universal Serial Bus) interface, an SD card interface, and / or an audio interface.

[0106] The connection terminal 1478 includes a connector that physically connects the electronic device 1401 to another electronic device (such as the electronic device 1402). The connection terminal 1478 includes an HDMI connector, a USB connector, an SD card connector, and / or an audio connector (such as a headphone connector).

[0107] The haptic module 1479 can convert electrical signals into mechanical stimuli (such as vibrations or movements) or electrical stimuli that can be perceived by the user through touch or kinesthetic sensations. The haptic module 1479 can include motors, piezoelectric elements, and / or electrical stimulators.

[0108] The camera module 1480 can capture still and video images. The camera module 1480 may include a lens assembly including one or more lenses, the image sensor 1000 of FIG. 1, an image signal processor, and / or a flash. The lens assembly included in the camera module 1480 can collect light emitted from a subject being imaged.

[0109] The power management module 1488 may manage the power supplied to the electronic device 1401. The power management module 1488 may be embodied as part of a power management integrated circuit (PMIC).

[0110] Battery 1489 can provide power to the components of electronic device 1401. Battery 1489 can include non-rechargeable primary batteries, rechargeable secondary batteries, and / or fuel cells.

[0111] The communication module 1490 can support the establishment of a direct (wired) communication channel and / or a wireless communication channel between the electronic device 1401 and other electronic devices (such as the electronic device 1402, the electronic device 1404, and the server 1408) and the execution of communication via the established communication channel. The communication module 1490 includes one or more communication processors that operate independently of the processor 1420 (such as an application processor) and support the direct communication and / or the wireless communication. The communication module 1490 includes a wireless communication module 1492 (such as a cellular communication module, a short-range wireless communication module, or a GNSS (Global Navigation Satellite System) communication module) and / or a wired communication module 1494 (such as a LAN (Local Area Network) communication module or a power line communication module). Among these communication modules, the communication module can communicate with other electronic devices through a first network 1498 (a short-range communication network such as Bluetooth, WiFi Direct, or IrDA (Infrared Data Association)) or a second network 1499 (a long-range communication network such as a cellular network, the Internet, or a computer network (LAN, WAN, etc.)). Multiple types of communication modules can be integrated into one component (e.g., a single chip) or embodied as multiple separate components (multiple chips). The wireless communication module 1492 can identify and authenticate the electronic device 1401 in a communication network such as the first network 1498 and / or the second network 1499 using subscriber information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the subscriber identification module 1496.

[0112] The antenna module 1497 transmits or receives signals and / or power to or from the outside (such as other electronic devices). An antenna includes a radiator made of a conductive pattern formed on a substrate (such as a PCB). The antenna module 1497 may include one or more antennas. When multiple antennas are included, the communication module 1490 can select an antenna from the multiple antennas that is suitable for a communication method used in a communication network such as the first network 1498 and / or the second network 1499. Signals and / or power are transmitted or received between the communication module 1490 and other electronic devices through the selected antenna. In addition to the antenna, other components (such as an RFIC) may be included as part of the antenna module 1497.

[0113] Some of the components are connected to each other through a communication method between peripheral devices (bus, GPIO (General Purpose Input and Output), SPI (Serial Peripheral Interface), MIPI (Mobile Industry Processor Interface), etc.) and can exchange signals (commands, data, etc.).

[0114] Commands or data may be transmitted or received between the electronic device 1401 and an external electronic device 1404 via a server 1408 connected to a second network 1499. The other electronic devices 1402 and 1404 may be the same or different types of devices as the electronic device 1401. All or part of the operations performed by the electronic device 1401 may be performed by one or more of the other electronic devices 1402, 1404, and 1408. For example, when the electronic device 1401 needs to perform a certain function or service, instead of performing the function or service itself, it may request one or more other electronic devices to perform the function or service in whole or in part. The one or more other electronic devices that receive the request may perform the additional function or service related to the request and transmit the results of the execution to the electronic device 1401. For this purpose, cloud computing, distributed computing, and / or client-server computing technologies may be used.

[0115] FIG. 15 is a block diagram illustrating the camera module 1480 of FIG. 14. Referring to FIG. 15, the camera module 1480 may include a lens assembly 1510, a flash 1520, an image sensor 1000 (e.g., the image sensor 1000 of FIG. 1), an image stabilizer 1540, a memory 1550 (e.g., a buffer memory), and / or an image signal processor 1560. The lens assembly 1510 may collect light emitted from a subject to be imaged. The camera module 1480 may include multiple lens assemblies 1510, in which case the camera module 1480 may be a dual camera, a 360° camera, or a spherical camera. Some of the multiple lens assemblies 1510 may have the same lens attributes (e.g., angle of view, focal length, autofocus, F-number, optical zoom, etc.) or may have different lens attributes. The lens assembly 1510 may include a wide-angle lens or a telephoto lens.

[0116] The flash 1520 can emit light used to enhance light emitted or reflected from a subject. The flash 1520 can include one or more light-emitting diodes (e.g., RGB (Red-Green-Blue) LEDs), white LEDs, infrared LEDs, ultraviolet LEDs, etc.) and / or xenon lamps. The image sensor 1000 is also the image sensor described in FIG. 1 and can capture an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly 1510 into an electrical signal. The image sensor 1000 can include one or more sensors selected from image sensors with different attributes, such as an RGB sensor, a BW (Black and White) sensor, an IR sensor, or a UV sensor. Each sensor included in the image sensor 1000 can be implemented as a charge coupled device (CCD) sensor and / or a complementary metal oxide semiconductor (CMOS) sensor.

[0117] The image stabilizer 1540 may respond to movement of the camera module 1480 or the electronic device 1501 including the same by moving one or more lenses included in the lens assembly 1510 or the image sensor 1000 in a specific direction or by controlling the operating characteristics of the image sensor 1000 (such as adjusting read-out timing) to compensate for negative effects of the movement. The image stabilizer 1540 may sense movement of the camera module 1480 or the electronic device 1401 using a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module 1480. The image stabilizer 1540 may also be embodied optically.

[0118] The memory 1550 can store some or all of the data of an image acquired through the image sensor 1000 for subsequent image processing. For example, when multiple images are acquired at high speed, the acquired original data (Bayer-Patterned data, high-resolution data, etc.) can be stored in the memory 1550, and after displaying only the low-resolution image, the original data of the selected (e.g., user-selected) image can be transmitted to the image signal processor 1560. The memory 1550 can be integrated with the memory 1430 of the electronic device 1401 or can be configured as a separate memory that operates independently.

[0119] The image signal processor 1560 may perform image processing on images acquired through the image sensor 1000 or image data stored in the memory 1550. Image processing may include depth map generation, 3D modeling, panorama generation, feature point extraction, image synthesis, and / or image compensation (noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, softening, etc.). The image signal processor 1560 may perform control (exposure time control, readout timing control, etc.) on components included in the camera module 1480 (e.g., the image sensor 1000). Images processed by the image signal processor 1560 may be stored back in the memory 1550 for further processing or provided to external components of the camera module 1480 (e.g., the memory 1430, the display device 1460, the electronic device 1402, the electronic device 1404, the server 1408, etc.). The image signal processor 1560 may be integrated into the processor 1420 or configured as a separate processor that operates independently of the processor 1420. If the image signal processor 1560 is configured as a separate processor from the processor 1420, the image processed by the image signal processor 1560 may be displayed on the display device 1460 after undergoing additional image processing by the processor 1420.

[0120] The electronic device 1401 may include multiple camera modules 1480 with different attributes or capabilities. In such cases, one of the multiple camera modules 1480 may be a wide-angle camera and another may be a telephoto camera. Similarly, one of the multiple camera modules 1480 may be a front-facing camera and another may be a rear-facing camera.

[0121] The image sensor 1000 according to the embodiment may be applied to a mobile phone or smartphone 1600 shown in FIG. 16, a tablet or smart tablet 1700 shown in FIG. 17, a digital camera or camcorder 1800 shown in FIG. 18, a laptop computer 1900 shown in FIG. 19, or a television or smart TV 2000 shown in FIG. 20. For example, the smartphone 1600 or the smart tablet 1700 may include multiple high-resolution cameras, each equipped with a high-resolution image sensor. The high-resolution cameras may be used to extract depth information of an object in an image, adjust out-of-focus of the image, or automatically identify an object in the image.

[0122] The image sensor 1000 may also be applied to the smart refrigerator 2100 shown in FIG. 21, the security camera 2200 shown in FIG. 22, the robot 2300 shown in FIG. 23, and the medical camera 2400 shown in FIG. 24. For example, the smart refrigerator 2100 automatically recognizes food in the refrigerator using an image sensor and notifies the user via a smartphone of the presence or absence of a specific food item, the type of food that has been stored or removed, etc. The security camera 2200 provides ultra-high-resolution images and uses high sensitivity to enable recognition of objects or people in the images even in dark environments. The robot 2300 can be deployed in disaster or industrial sites where direct human access is impossible and provide high-resolution images. The medical camera 2400 provides high-resolution images for diagnosis or surgery and can dynamically adjust the field of view.

[0123] 25, the image sensor 1000 may be applied to a vehicle 2500. The vehicle 2500 may include a plurality of vehicle cameras 2510, 2520, 2530, and 2540 arranged at various positions, and each of the vehicle cameras 2510, 2520, 2530, and 2540 may include an image sensor according to the embodiment. The vehicle 2500 may provide a driver with various information related to the inside or surroundings of the vehicle 2500 using the plurality of vehicle cameras 2510, 2520, 2530, and 2540, and may automatically recognize objects or people in the image to provide information necessary for autonomous driving.

[0124] Although the image sensor with the color separation lens array and the electronic device including the same have been described based on the embodiments shown in the drawings, these are merely examples, and a person skilled in the art would understand that various modifications and equivalent embodiments are possible. Therefore, the disclosed embodiments should be considered from an illustrative perspective, not a restrictive perspective. The scope of the claims is set forth in the appended claims, not the foregoing description, and all differences within the scope of the claims should be construed as being within the scope of the claims. [Explanation of symbols]

[0125] 110 Sensor board 120 spacer layer 130 Color Separation Lens Array 111, 112, 113, 114 1st to 4th pixels 131, 132, 133, 134 Areas 1 to 4 1000 image sensors 1010 Timing Controller 1020 Row Decoder 1030 Output circuit 1040 Analog-to-Digital Converter 1050 processor 1100 pixel array 1110 active pixel area 1120 First dummy pixel area 1130 Second dummy pixel area 1140 Optical Black Area

Claims

1. A sensor substrate; a color separation lens array disposed opposite the sensor substrate; The sensor substrate includes: an active pixel area that outputs an active pixel signal for generating a video; a first dummy pixel area that is disposed outside the active pixel area and outputs dummy pixel signals for correcting video data generated from the video generating active pixel signals; a second dummy pixel area that is disposed outside the active pixel area and the first dummy pixel area and does not output a pixel signal; the color separation lens array includes nanoposts formed on the active pixel area, the first dummy pixel area, and the second dummy pixel area; An image sensor in which the color separation lens array focuses at least a portion of first light of a first wavelength that is incident on an area of ​​the color separation lens array facing the second dummy pixel area of ​​the sensor substrate onto a first pixel within the first dummy pixel area of ​​the sensor substrate by changing the phase of the first light of the first wavelength.

2. The image sensor of claim 1 , wherein the second dummy pixel area includes pixels arranged in two or more columns or two or more rows outside the active pixel area.

3. 3. The image sensor of claim 1, wherein the color separation lens array changes the phase of the second light of the second wavelength so that it is different from the phase of the first light of the first wavelength, and focuses the second light of the second wavelength onto a second pixel of the sensor substrate.

4. 4. The image sensor according to claim 1, wherein the dummy pixel signal output from the first dummy pixel region is a signal for correcting the active pixel signal output from the active pixel region.

5. 5. The image sensor according to claim 1, wherein the first dummy pixel region is disposed outside the active pixel region so as to surround the active pixel region.

6. 6. The image sensor according to claim 1, wherein the second dummy pixel region is disposed outside the first dummy pixel region so as to surround the first dummy pixel region.

7. 7. The image sensor of claim 1, wherein the sensor substrate further comprises an optical black area disposed outside the second dummy pixel area, the optical black area including a light-blocking metal layer, and outputting a black pixel signal.

8. The image sensor of claim 7 , wherein the color separation lens array includes nanoposts disposed on top of the optical black areas.

9. 9. The image sensor according to claim 7, wherein the optical black region is disposed outside the second dummy pixel region so as to surround the second dummy pixel region.

10. 10. The image sensor according to claim 7, wherein the optical black area outputs a pixel signal based on noise of a photodiode.

11. 11. The image sensor of claim 1, wherein the color separation lens array includes a plurality of microlenses that focus the first light of the first wavelength onto the first pixel, and the area of ​​the plurality of microlenses is larger than the area of ​​the first pixel.

12. The image sensor of claim 11 , wherein an area of ​​each of the plurality of microlenses is 1.5 to 4 times larger than an area of ​​the first pixel.

13. A sensor substrate; a color separation lens array disposed opposite the sensor substrate; The sensor substrate includes: an active pixel area that outputs an active pixel signal for generating a video; a dummy pixel area that is disposed outside the active pixel area and outputs dummy pixel signals for correcting video data generated from the video generating active pixel signals; an optical black area disposed outside the active pixel area and the dummy pixel area and configured to output a black pixel signal; the color separation lens array includes nanoposts formed on the active pixel area, the dummy pixel area, and the optical black area; An image sensor in which the color separation lens array focuses at least a portion of first light of a first wavelength that is incident on an area of ​​the color separation lens array facing the optical black area onto a first pixel within the dummy pixel area.

14. 14. The image sensor of claim 13, wherein the optical black area includes pixels arranged in two or more columns or two or more rows in a direction away from the active pixel area.

15. 15. The image sensor of claim 13, wherein the color separation lens array changes the phase of second light of a second wavelength so that it is different from the phase of first light of the first wavelength, and focuses the second light of the second wavelength onto second pixels of the sensor substrate.

16. 16. The image sensor of claim 13, wherein the sensor substrate includes a light-blocking metal layer formed on pixels included in an optical black region of the sensor substrate.

17. 17. The image sensor according to claim 13, wherein the dummy pixel signal output from the dummy pixel region is a signal for correcting the active pixel signal output from the active pixel region.

18. 18. The image sensor according to claim 13, wherein the dummy pixel region is arranged outside the active pixel region so as to surround the active pixel region.

19. 19. The image sensor according to claim 13, wherein the optical black area is arranged outside the dummy pixel area so as to surround the dummy pixel area.

20. 20. The image sensor of claim 13, wherein the pixels included in the optical black area output a black pixel signal based on noise of a photodiode.

21. 21. The image sensor of claim 13, wherein the color separation lens array includes a plurality of microlenses that focus the first light of the first wavelength onto the first pixel, and the area of ​​the plurality of microlens regions is larger than the area of ​​the first pixel.

22. 22. The image sensor of claim 21, wherein an area of ​​each of the plurality of microlenses is 1.5 to 4 times larger than an area of ​​the first pixel.

23. an image sensor according to any one of claims 1 to 12; a processor that controls the operation of the image sensor and stores and outputs signals generated by the image sensor.

24. The electronic device of claim 23 , wherein the processor acquires an image based on the active pixel signals and the dummy pixel signals.

25. The processor: determining whether an active pixel within the active pixel region malfunctions based on a comparison of the pixel value of the active pixel with a pixel value of a neighboring pixel immediately adjacent to the active pixel; If the active pixel is determined to be malfunctioning, adjusting the pixel value of the active pixel based on the pixel values ​​of the neighboring pixels; acquiring an image based on the adjusted pixel values ​​of the active pixels; The electronic device of claim 23 , wherein the neighboring pixels include at least one dummy pixel contained within the first dummy pixel region.

Images