Electronic Components

Abstract

To provide an electronic component capable of suppressing variation in quality when an error occurs in the length of the connecting part.SOLUTION: A laminated filter 1 (electronic component) includes an element 2 formed by laminating a plurality of insulator layers and including a pair of mutually opposed sides 2e and 2f, a second terminal electrode 4 (terminal) disposed on the side 2e, and a resonator 5 provided within the element 2. The resonator 5 includes a drawer part 6 having a plurality of connection parts 70 electrically connected to the second terminal electrode 4. The plurality of connection parts 70 is connected in parallel with respect to the second terminal electrode 4.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to electronic components. [Background technology]

[0002] A known example of conventional technology relating to electronic components is the laminated dielectric filter described in Patent Document 1. This laminated dielectric filter includes an earth electrode provided on a part of the surface of a body formed by laminating dielectric layers, and first and second resonant elements provided inside the body, one end of each of which is short-circuited to the earth electrode. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 8-288706 Summary of the Invention [Problem to be solved by the invention]

[0004] In the manufacturing process of the electronic component described above, for example, a substrate on which multiple units constituting the electronic component are formed is first cut to separate the individual units. At this time, the surface of the body of the unit is exposed, along with the cut surface of the connection portion of the resonant element extending from the interior of the body toward the surface. Furthermore, a ground electrode is provided on the surface where the connection portion is exposed, and the resonant element is electrically connected to the ground electrode via the connection portion. Here, the inductance of the resonant circuit formed by the resonant element correlates with the length of the resonant element (the length of the transmission line). Therefore, if an error occurs in the length of the connection portion during the cutting process, the waveforms of the pass band and attenuation band of the multilayer filter will vary from product to product, resulting in variation in quality.

[0005] The present invention has been made to solve the above-mentioned problems, and has an object to provide an electronic component that can suppress variations in quality even when an error occurs in the length of the connection portion. [Means for solving the problem]

[0006] An electronic component according to one aspect of the present invention comprises a base body formed by stacking a plurality of insulating layers and including a pair of opposing side surfaces, a terminal disposed on at least one of the pair of side surfaces, and a resonator provided within the base body, the resonator including an extraction portion having a plurality of connection portions electrically connected to the terminal, the plurality of connection portions being connected in parallel to the terminal.

[0007] In this electronic component, the resonator includes a lead-out portion having multiple connection portions electrically connected to the terminals, and the multiple connection portions are connected in parallel to the terminals. Here, the combined inductance when the multiple connection portions are connected in parallel to the terminals is smaller than the inductance when only one connection portion is connected to the terminal. Therefore, even if an error occurs in the length of the connection portions during the process of cutting the connection portions, the amount of change in the inductance of the resonator is smaller than when only one connection portion is connected to the terminal. As a result, the waveform of the attenuation characteristics can be prevented from varying from product to product. Therefore, even if an error occurs in the length of the connection portions, quality variations can be reduced.

[0008] The lead-out portion may have an internal electrode, a first through-hole extending from the internal electrode to one side in the stacking direction in which the insulator layers are stacked, and a second through-hole extending from the internal electrode to the other side in the stacking direction, and the multiple connection portions may be formed by multiple pads extending from the first through-hole and the second through-hole in the opposing direction of the pair of side surfaces and connected to the terminals. In this case, the multiple pads extending from the first through-hole and the second through-hole in the opposing direction of the pair of side surfaces can form connection portions connected in parallel to the terminals.

[0009] The lengths of the pads in the opposing direction may be equal to each other. In this case, variations in the electrical resistance of the pads can be suppressed, allowing current to flow in a balanced manner to the pads.

[0010] The lengths of the pads in the opposing direction and in the direction intersecting the stacking direction may be equal to each other. In this case, variations in the electrical resistance values ​​of the pads can be suppressed, and current can be balanced among the pads.

[0011] The number of pads may be two. In this case, it is possible to prevent the electrical resistance values ​​of the two pads from varying, thereby allowing current to flow in a balanced manner through the two pads.

[0012] The length of the first through hole in the stacking direction may be equal to the length of the second through hole in the stacking direction. In this case, variations in the electrical resistance of the first through hole and the second through hole can be suppressed. This allows current to flow in a balanced manner to each of the multiple pads. [Effects of the Invention]

[0013] According to the present invention, it is possible to provide an electronic component that can suppress variations in quality even when an error occurs in the length of a connection portion. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 is a perspective view showing a multilayer filter according to an embodiment. [Figure 2] FIG. 2 is a schematic perspective view showing the internal structure of the element body shown in FIG. [Figure 3] FIG. 3 is an enlarged view of a main part of the resonator shown in FIG. [Figure 4] FIG. 4 is a perspective view showing a multilayer filter according to a comparative example. [Figure 5] FIG. 5 is a schematic diagram showing an example of a manufacturing process for a multilayer filter. [Figure 6] FIG. 10(a) is a schematic diagram showing another example of the manufacturing process of the multilayer filter, and FIG. 10(b) is a schematic diagram showing yet another example of the manufacturing process of the multilayer filter. [Figure 7] FIG. 7 is a diagram showing the characteristics of the multilayer filter. DETAILED DESCRIPTION OF THE INVENTION

[0015] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of an electronic component according to one aspect of the present invention will now be described in detail with reference to the drawings.

[0016] First, the configuration of a multilayer filter 1 (electronic component) according to this embodiment will be described with reference to FIGS.

[0017] Fig. 1 is a perspective view showing a multilayer filter 1 according to one embodiment. The multilayer filter 1 is, for example, a diplexer. As shown in Fig. 1, the multilayer filter 1 has an element body 2, a pair of first terminal electrodes 3, and a pair of second terminal electrodes 4 (terminals).

[0018] The element body 2 has a rectangular parallelepiped shape. The element body 2 has, as its outer surfaces, a pair of opposing end faces 2a, 2b, a pair of opposing main faces 2c, 2d extending to connect the pair of end faces 2a, 2b, and a pair of opposing side faces 2e, 2f extending to connect the pair of main faces 2c, 2d. The main face 2d is defined as the surface that faces another electronic device (not shown, for example) when the multilayer filter 1 is mounted on the other electronic device (e.g., a circuit board or an electronic component).

[0019] The opposing direction D1 of the end faces 2a, 2b, the opposing direction D2 of the main faces 2c, 2d, and the opposing direction D3 of the side faces 2e, 2f are substantially perpendicular to one another. Note that the rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and ridges, and a rectangular parallelepiped shape with rounded corners and ridges.

[0020] The element body 2 is formed, for example, by stacking multiple insulator layers. Each insulator layer is stacked in the opposing direction D2 of the main surfaces 2c, 2d of the element body 2. In other words, the stacking direction D4 of each insulator layer coincides with the opposing direction D2 of the main surfaces 2c, 2d of the element body 2. Hereinafter, the opposing direction of the main surfaces 2c, 2d will also be referred to as the "stacking direction." Each insulator layer has a substantially rectangular shape. In the actual element body 2, the insulator layers are integrated to the extent that the boundaries between the layers are not visible.

[0021] Each insulating layer is made of, for example, a sintered ceramic green sheet containing a dielectric material (BaTiO3-based material, Ba(Ti,Zr)O3-based material, (Ba,Ca)TiO3-based material, glass material, alumina material, or the like).

[0022] Each of the pair of first terminal electrodes 3 is disposed on a pair of end faces 2a, 2b. One of the pair of first terminal electrodes 3 is formed so as to cover part of the end face 2a along the stacking direction D4 of the element body 2, and is also formed on part of the principal face 2c and part of the principal face 2d. The other of the pair of first terminal electrodes 3 is formed so as to cover part of the end face 2b along the stacking direction D4 of the element body 2, and is also formed on part of the principal face 2c and part of the principal face 2d.

[0023] Each of the pair of second terminal electrodes 4 is disposed on a pair of side surfaces 2e, 2f. One of the pair of second terminal electrodes 4 is formed so as to cover part of the side surface 2e along the stacking direction D4 of the element body 2, and is also formed on part of the principal surface 2c and part of the principal surface 2d. The other of the pair of second terminal electrodes 4 is formed so as to cover part of the side surface 2f along the stacking direction D4 of the element body 2, and is also formed on part of the principal surface 2c and part of the principal surface 2d.

[0024] Each of the pair of first terminal electrodes 3 and the pair of second terminal electrodes 4 (hereinafter sometimes simply referred to as terminal electrodes) contains a conductive material (for example, Ag or Pd). The terminal electrodes are formed as sintered bodies of conductive paste containing a conductive material (for example, Ag powder or Pd powder). A plating layer is formed on the surface of the terminal electrode. The plating layer is formed, for example, by electroplating. The plating layer has a layer structure consisting of a Cu plating layer, a Ni plating layer, and a Sn plating layer, or a layer structure consisting of a Ni plating layer and a Sn plating layer.

[0025] FIG. 2 is a schematic perspective view showing the internal structure of the element body 2 shown in FIG. 1, and FIG. 3 is an enlarged view of a main portion of the resonator shown in FIG. 2. The element body 2, first terminal electrode 3, and second terminal electrode 4 shown in FIG. 1 are omitted in FIG. 2, and the element body 2 is omitted in FIG. 3. As shown in FIG. 2, a resonator 5 including a resonance circuit is disposed within the element body 2. The resonator 5, for example, functions as a so-called bandpass filter and selectively passes signals of a specific frequency. As shown in FIGS. 2 and 3, the resonator 5 includes a pair of lead portions 6 electrically connected to one of a pair of second terminal electrodes 4. The configuration of the resonator 5 is not particularly limited, and a known configuration may be used.

[0026] The lead-out portion 6 has an internal electrode 61, a first through-hole 62, a second through-hole 63, and a plurality of connection portions 70. In this embodiment, the internal electrode 61 is disposed between the insulating layers of the element body 2. In this embodiment, one end of the internal electrode 61 is electrically connected to the resonant circuit via a through-hole conductor. The internal electrode 61 is configured to contain, for example, at least one of Ag and Pd as a conductive material. Note that the through-hole conductor is not an essential component of the resonator 5 and may not be provided.

[0027] 2 and 3, a first through hole 62 and a second through hole 63 are connected to the other end of the internal electrode 61. As shown in FIG. 3, the first through hole 62 extends from the other end of the internal electrode 61 to one side in the stacking direction D4 (upper side in the example of FIG. 3). The second through hole 63 extends from the other end of the internal electrode 61 to the other side in the stacking direction D4 (lower side in the example of FIG. 3). The length of the first through hole 62 in the stacking direction D4 is equal to the length of the second through hole 63 in the stacking direction D4.

[0028] The multiple connection portions 70 are electrically connected to the second terminal electrode 4. The multiple connection portions 70 are connected in parallel to the second terminal electrode 4. The form of the connection portions 70 is not particularly limited, and various types can be used. In this embodiment, the multiple connection portions 70 are configured as multiple pads 64 connected to the second terminal electrode 4.

[0029] Each of the pads 64 is a rectangular connecting piece disposed between the insulating layers of the element body 2. In this embodiment, each of the pads 64 is disposed between insulating layers different from the insulating layers between which the internal electrodes 61 are disposed. Each of the pads 64 extends from the first through-hole 62 and the second through-hole 63 in the opposing direction D3 of the pair of side surfaces 2e, 2f and is connected to one of the second terminal electrodes 4. In this embodiment, the number of pads 64 is two. One of the two pads 64 is connected to the end of the first through-hole 62 in the stacking direction D4 (the upper end in the example of FIG. 3). The other of the two pads 64 is connected to the end of the second through-hole 63 in the stacking direction D4 (the lower end in the example of FIG. 3). With this configuration, the two pads 64 are connected in parallel to one of the second terminal electrodes 4. The pads 64 are configured to contain, for example, Ag or Cu. The shape and size of the pads 64 are not particularly limited.

[0030] As shown in FIG. 3, the lengths of the two pads 64 in the facing direction D3 are equal to each other. The distance between the end of one pad 64 exposed from the side surface 2e and the portion of the one pad 64 connected to the first through-hole 62 is equal to the distance between the end of the other pad 64 exposed from the side surface 2e and the portion of the other pad 64 connected to the second through-hole 63. As shown in FIG. 2, the lengths of the two pads 64 in the direction intersecting the facing direction D3 and the stacking direction D4 (facing direction D1) are equal to each other. With the above configuration, in the lead-out portion 6, the electrical resistance of the transmission line formed by the first through-hole 62 and one pad 64 is equal to the electrical resistance of the transmission line formed by the second through-hole 63 and the other pad 64. Therefore, when a current flows from the resonator 5 to the second terminal electrode 4, the current flows equally through each of the two pads 64.

[0031] Next, the effects of the multilayer filter 1 according to the present embodiment will be described while a multilayer filter 100 according to a comparative example will be described with reference to FIGS.

[0032] 4 is a perspective view showing a multilayer filter 100 according to a comparative example. The multilayer filter 100 differs from the multilayer filter 1 in that it has an outgoing portion 60 instead of the outgoing portion 6. The outgoing portion 60 does not have the first through-hole 62, the second through-hole 63, or the two pads 64. In the multilayer filter 100, the other end of the internal electrode 61 is directly connected to the second terminal electrode 4. That is, in the multilayer filter 100 according to the comparative example, the connecting portion 70 is formed by the other end of the internal electrode 61.

[0033] 5 is a schematic diagram showing an example of a manufacturing process for a multilayer filter. As shown in FIG. 5, in the manufacturing process for a multilayer filter, first, a substrate E on which a plurality of units EU constituting the multilayer filter are formed is prepared. The unit EU has the same configuration as the multilayer filter except for the first terminal electrode 3 and the second terminal electrode 4. In other words, the unit EU has an element body 2 and a resonator 5 provided inside the element body 2.

[0034] Next, as shown in FIG. 5 , the substrate E on which a plurality of units EU are formed is cut along cutting reference lines CL to separate the substrate E into individual units EU. The cutting reference lines CL are lines that serve as a reference when cutting the substrate E. In this embodiment, the cutting reference lines CL are set so that the lengths of the connection portions 70 of adjacent units EU are equal to each other. At this time, the side surface 2e of the element body 2 of the unit EU is exposed, as well as the cut surface of the internal electrode 61 of the resonator 5 extending from the inside of the element body 2 toward the side surface 2e. Next, a second terminal electrode 4 is provided on the side surface 2e where the internal electrode 61 is exposed, and as a result, the resonator 5 is electrically connected to the second terminal electrode 4 via the internal electrode 61. Through the above-mentioned processes, the multilayer filter 100 is manufactured.

[0035] Fig. 6(a) is a schematic diagram showing another example of the manufacturing process of the multilayer filter. The example of Fig. 6(a) illustrates a case where the connection portions 70 (internal electrodes 61) are cut along the cutting reference line CL in the step of cutting the substrate E. In this case, the cutting line C1 used to cut the connection portions 70 coincides with the cutting reference line CL. As a result, the lengths of the connection portions 70 of adjacent units EU are each equal to a predetermined reference length L1.

[0036] FIG. 6(b) is a schematic diagram showing yet another example of the manufacturing process of the multilayer filter. The example of FIG. 6(b) illustrates a case where, in the step of cutting the substrate E, the connection portions 70 are cut at positions offset from the cutting reference line CL. In this case, the cutting line C2 used to cut the connection portions 70 is offset (to the left in the example of FIG. 6(b)) from the cutting reference line CL. As a result, the lengths of the connection portions 70 of adjacent units EU are either longer or shorter than a predetermined reference length L1. For example, the length of one connection portion 70 (on the right side in the example of FIG. 6(b)) is a length L2 that is longer than the reference length L1, and the length of the other connection portion 70 (on the left side in the example of FIG. 6(b)) is a length L3 that is shorter than the reference length L1.

[0037] Here, assuming that the resonant frequency of the resonant circuit is f0, the electrostatic capacitance of the resonant circuit is C, and the inductance of the resonant circuit is L, f0, C, and L satisfy the relational expression (1). However, the inductance of the resonant circuit is correlated with the length of the connection portion 70 (the length of the transmission line). Therefore, if an error occurs in the length of the connection portion 70 during the process of cutting the connection portion 70, the inductance of the resonant circuit will fluctuate. If the amount of change in inductance caused by an error in the length of the connection portion 70 is Lx, the relational expression (2) holds. In this case, the waveform of the attenuation characteristics of the multilayer filter 100 will vary from product to product, resulting in variation in quality from product to product. f0=1 / (2×π×(L×C) 1 / 2 ) …(1) f0=1 / (2×π×((L+Lx)×C) 1 / 2 ) …(2)

[0038] Now, let us consider the case where two coils are connected in parallel. If the inductances of the two coils are L1 and L2, respectively, and the combined inductance of the two coils is L0, then the relational expression in equation (3) is satisfied. If the relational expression in equation (4) is also satisfied, then the relational expression in equation (5) holds for the combined inductance. 1 / L0=(1 / L1)+(1 / L2) …(3) L1 = L2 …(4) L0 = (1 / 2) × L1 = (1 / 2) × L2 … (5)

[0039] In contrast, in the multilayer filter 1 according to this embodiment, the two pads 64 that make up the connection portion 70 are connected in parallel to the second terminal electrode 4. In the manufacturing process of the multilayer filter 1, when the substrate E is cut to separate each unit EU, the cut surfaces of the two pads 64 of the resonator 5 that extend from the inside of the element body 2 toward the side surface 2e are exposed, along with the side surface 2e of the element body 2 of each unit EU. Furthermore, the second terminal electrode 4 is provided on the side surface 2e where the two pads 64 are exposed, and as a result, the resonator 5 is connected in parallel to the second terminal electrode 4 via the two pads 64.

[0040] In the multilayer filter 1 according to this embodiment, if an error occurs in the length of the connecting portion 70 (two pads 64) during the process of cutting the connecting portion 70, the inductance of the resonant circuit will fluctuate. However, if the amount of change in inductance due to an error in the length of one of the pads 64 is denoted as Lx, then from equations (2) and (5), f0, C, and L satisfy the relational expression in equation (6). In other words, even if an error occurs in the length of the connecting portion 70 during the process of cutting the connecting portion 70, the effect on the resonant frequency is smaller than in the multilayer filter 100 according to the comparative example. Therefore, it can be seen that the multilayer filter 1 according to this embodiment can suppress variations in the resonant frequency between products. f0=1 / (2×π×((L+(1 / 2)×Lx)×C) 1 / 2 ) …(6)

[0041] As described above, in this multilayer filter 1, the resonator 5 includes an extension portion 6 having a plurality of connection portions 70 electrically connected to the second terminal electrode 4, and the plurality of connection portions 70 are connected in parallel to the second terminal electrode 4. Here, the combined inductance when the plurality of connection portions 70 are connected in parallel to the second terminal electrode 4 is smaller than the inductance when only one connection portion 70 is connected to the second terminal electrode 4. Therefore, even if an error occurs in the length of the connection portion 70 during the process of cutting the connection portion 70, the amount of change in the inductance of the resonator 5 is smaller than when only one connection portion 70 is connected to the second terminal electrode 4. As a result, it is possible to suppress variations in the waveform of the attenuation characteristics between products. Therefore, even if an error occurs in the length of the connection portion 70, it is possible to suppress variations in quality.

[0042] In the multilayer filter 1 according to this embodiment, the lead-out portion 6 has an internal electrode 61, a first through-hole 62 extending from the internal electrode 61 to one side in the stacking direction D4 in which the insulator layers are stacked, and a second through-hole 63 extending from the internal electrode 61 to the other side in the stacking direction D4, and the multiple connection portions 70 are configured from multiple pads 64 extending from the first through-hole 62 and the second through-hole 63 in the opposing direction D3 of the pair of side surfaces 2e, 2f and connected to the second terminal electrode 4. In this case, the connection portions 70 connected in parallel to the second terminal electrode 4 can be configured by the multiple pads 64 extending from the first through-hole 62 and the second through-hole 63 in the opposing direction D3 of the pair of side surfaces 2e, 2f.

[0043] In the multilayer filter 1 according to this embodiment, the lengths of the pads 64 in the opposing direction D3 are equal to one another. In this case, it is possible to prevent variations in the electrical resistance values ​​of the pads 64. This allows current to flow through the pads 64 in a balanced manner.

[0044] In the multilayer filter 1 according to this embodiment, the lengths of the pads 64 in the facing direction D1 intersecting with the facing direction D3 and the stacking direction D4 are equal to each other. In this case, it is possible to suppress variations in the electrical resistance values ​​of the pads 64. Therefore, it is possible to pass a current in a balanced manner through the pads 64. From the viewpoint of reducing inductance caused by errors in the length of the connection portion 70, it is preferable that the lengths of the pads 64 constituting the connection portion 70 in the facing direction D1 are long.

[0045] In the multilayer filter 1 according to this embodiment, the number of pads 64 is two. In this case, it is possible to suppress variations in the electrical resistance values ​​of the two pads 64. Therefore, it is possible to pass current through the two pads 64 in a balanced manner.

[0046] In the multilayer filter 1 according to this embodiment, the length of the first through-hole 62 in the stacking direction D4 is equal to the length of the second through-hole 63 in the stacking direction D4. In this case, it is possible to prevent variations in the electrical resistance values ​​of the first through-hole 62 and the second through-hole 63. This allows current to flow through each of the multiple pads 64 in a balanced manner.

[0047] Next, the results of the evaluation test of the multilayer filter will be described with reference to FIG.

[0048] FIG. 7 shows the characteristics of a multilayer filter. This evaluation test measured the attenuation characteristics of the multilayer filter. Graphs A1 and A2, shown by thick solid lines in FIG. 7, show the attenuation characteristics of a multilayer filter (Example) having two pads connected in parallel to the second terminal electrode. Graphs B1 and B2, shown by dashed lines in FIG. 7, show the attenuation characteristics of a multilayer filter (Comparative Example) having one internal electrode connected to the second terminal electrode. Graph C, shown by thin solid lines in FIG. 7, shows the attenuation characteristics of a multilayer filter having two pads or one internal electrode connected to the second terminal electrode. Graph A1 shows the attenuation characteristics of a multilayer filter in which two pads are cut 50 μm shorter than a predetermined reference length. Graph A2 shows the attenuation characteristics of a multilayer filter in which two pads are cut 50 μm longer than a predetermined reference length. Graph B1 shows the attenuation characteristics of a multilayer filter in which the internal electrode is cut 50 μm shorter than a predetermined reference length. Graph B2 shows the attenuation characteristics of a multilayer filter when the internal electrodes are cut 50 μm longer than the predetermined reference length. Graph C shows the attenuation characteristics of a multilayer filter when two pads or internal electrodes are cut to the same length as the predetermined reference length. The results shown in FIG. 7 confirm that the multilayer filter according to the example can suppress variations in the waveform of the attenuation characteristics and reduce variations in quality between products, even when there is an error in the pad length, compared to the multilayer filter according to the comparative example. Note that FIG. 7 illustrates an example in which the attenuation characteristics of a multilayer filter having two pads and a multilayer filter having one internal electrode match when there is no cutting deviation between the two pads or internal electrodes, as shown in Graph C. However, the inductance of a multilayer filter having two pads may differ from the inductance of a multilayer filter having one internal electrode. In this case, the attenuation characteristics of a multilayer filter having two pads may be shifted toward higher frequencies compared to the attenuation characteristics of a multilayer filter having one internal electrode.

[0049] The present invention is not limited to the above-described embodiments.

[0050] For example, in the above-described embodiment, the connecting portion 70 is configured by one pad 64 connected to the end of the first through hole 62 in the stacking direction D4 and the other pad 64 connected to the end of the second through hole 63 in the stacking direction D4. However, the connecting portion 70 may be configured by one pad 64 connected to the end of the first through hole 62 in the stacking direction D4 (or the other pad 64 connected to the end of the second through hole 63 in the stacking direction D4) and the other end of the internal electrode 61. In this case, the internal electrode 61 and one pad 64 connected to the first through hole 62 (or one pad 64 connected to the second through hole 63) may be connected in parallel to the second terminal electrode 4. Furthermore, at least one of the first through hole 62 and the second through hole 63 does not have to be provided at the other end of the internal electrode 61.

[0051] In the above-described embodiment, the connection portion 70 is configured by a plurality of pads 64 arranged between insulator layers different from the insulator layers between which the internal electrodes 61 are arranged. However, the connection portion 70 may not be configured by a plurality of pads 64, but may be configured by the other ends of the internal electrodes 61 branching in the opposing direction D1. In other words, the other ends of the internal electrodes 61 may be positioned so as to be spaced apart from each other in the opposing direction D1, and each of the other ends of the internal electrodes 61 may be connected in parallel to the second terminal electrode 4.

[0052] In the above-described embodiment, the connecting portion 70 is configured with one pad 64 connected to the end of the first through hole 62 in the stacking direction D4 and the other pad 64 connected to the end of the second through hole 63 in the stacking direction D4. However, the pad 64 may be provided closer to the second through hole 63 than the end of the first through hole 62 in the stacking direction D4, or may be provided closer to the first through hole 62 than the end of the second through hole 63 in the stacking direction D4. Even in this case, it is preferable to make the electrical resistance of the transmission line formed by the first through hole 62 and the one pad 64 equal to the electrical resistance of the transmission line formed by the second through hole 63 and the other pad 64. As an example, it is preferable to make the distance between the internal electrode 61 and the portion of the first through hole 62 where the one pad 64 is connected equal to the distance between the internal electrode 61 and the portion of the second through hole 63 where the other pad 64 is connected.

[0053] In the above-described embodiment, an example has been given in which the connection portion 70 is configured with two pads 64. However, the number of the multiple pads 64 may be three or more. In this case, one pad 64 may be provided closer to the second through hole 63 than the end of the first through hole 62 in the stacking direction D4, or may be provided closer to the first through hole 62 than the end of the second through hole 63 in the stacking direction D4. However, from the viewpoint of making the lengths of the transmission lines of the multiple pads 64 equal, it is preferable that the number of the multiple pads 64 be two.

[0054] The configuration of the connection portion 70 may be changed as appropriate as long as it is connected in parallel to the second terminal electrode 4, and the effects of the present invention can be achieved.

[0055] In this specification, "equal" does not necessarily mean that the numerical values ​​are exactly equal. In other words, "equal" also includes being within a predetermined numerical range. The numerical range may be determined based on the range in which the effects of the present invention are achieved. [Explanation of symbols]

[0056] 1... multilayer filter (electronic component), 2... element body, 2e, 2f... side surface, 4... second terminal electrode (terminal), 5... resonator, 6... lead-out portion, 61... internal electrode, 62... first through-hole, 63... second through-hole, 64... pad, 70... connection portion, D3... opposing direction, D4... stacking direction.

Claims

1. an element body formed by stacking a plurality of insulator layers and including a pair of side surfaces facing each other; a terminal disposed on at least one of the pair of side surfaces; a resonator including a resonant circuit provided within the element body, the resonator includes a plurality of connection portions electrically connected to the terminals and a lead portion having an internal electrode; the plurality of connection portions are connected in parallel to the terminals, one end of the internal electrode is electrically connected to the resonant circuit and is not connected to any of the terminals; The electronic component has a plurality of the connection portions provided on the other end side of the internal electrode.

2. The drawer portion is a first through hole extending from the internal electrode to one side in the lamination direction in which the insulator layers are laminated; a second through hole extending from the internal electrode to the other side in the stacking direction, 2. The electronic component of claim 1, wherein the plurality of connection portions extend from the first through hole and the second through hole in the opposing direction of the pair of side surfaces and are composed of a plurality of pads connected to the terminals, one end of the plurality of pads being connected to the terminals and the other end being not connected to any of the terminals.

3. 3. The electronic component according to claim 2, wherein the pads have the same length in the opposing direction.

4. 4. The electronic component according to claim 2, wherein the pads have the same length in the opposing direction and in a direction intersecting the stacking direction.

5. 5. The electronic component according to claim 2, wherein the number of the plurality of pads is two.

6. 6. The electronic component according to claim 2, wherein the length of said first through hole in said stacking direction is equal to the length of said second through hole in said stacking direction.

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