Multi-mode resonator and filter

Abstract

The utility model relates to the field of communication, and provides a multimode resonator and a filter. The multi-mode resonator at least has two resonant modes of an HE mode, the multi-mode resonator comprises a resonator shell, a dielectric resonance piece and a grounding plate piece, and the dielectric resonance piece comprises a dielectric main body and at least three dielectric pins connected to the peripheral side of the dielectric main body; the grounding plates are in one-to-one correspondence with the dielectric pins and are connected to the ends, away from the dielectric main body, of the dielectric pins; the dielectric resonance part and the grounding plate parts are arranged in the resonator shell, and the grounding plate parts are connected to the inner wall of the resonator shell in a grounding mode. Based on the structure, the multi-mode resonator can be used for coupling at least two orthogonal high-Q-value resonance modes of the HE mode in a single cavity, and the performance, the space utilization rate, the usability, the applicability and the practicability of the multi-mode resonator can be improved; moreover, compared with the prior art, the installation convenience and the installation reliability of the dielectric resonance piece can be optimized, and the overall assembly convenience and the assembly reliability of the multimode resonator can be improved.

Description

Technical Field

[0001] This application belongs to the field of communication technology, and in particular relates to a multimode resonator and filter. Background Technology

[0002] In some cases, multimode resonators have at least two resonance modes: HE mode and H mode. A multimode resonator includes a resonator housing and a dielectric resonator housed within the housing. The dielectric resonator is electroplated around its perimeter and welded to the sidewalls of the resonator housing. However, this design results in poor installation convenience and reliability for the dielectric resonator. Utility Model Content

[0003] This application provides a multimode resonator designed to address the issues of poor installation convenience and reliability of dielectric resonators.

[0004] To achieve the above objectives, the technical solution adopted in the embodiments of this application is as follows:

[0005] In a first aspect, a multimode resonator is provided, the multimode resonator having at least two resonance modes, HE mode and the multimode resonator comprising:

[0006] Resonator housing;

[0007] A dielectric resonator includes a dielectric body and at least three dielectric feet connected to the periphery of the dielectric body;

[0008] Ground plane components are provided one-to-one with the dielectric pins and connected to the end of the dielectric pin away from the dielectric body; the dielectric resonator and each of the ground plane components are provided inside the resonator housing, and the ground plane components are grounded and connected to the inner wall of the resonator housing.

[0009] In some embodiments, the ground plane component is separately connected to the resonator housing.

[0010] In some embodiments, each of the dielectric feet is arranged in a circular shape with equal angles around the central axis of the dielectric body, and each of the ground plane members is arranged in a circular shape with equal angles around the central axis of the dielectric body, and one of the polarization directions of the HE mode is along the extension direction of one of the dielectric feet.

[0011] In some embodiments, each of the media feet is rotated and replicated around the central axis of the media body, and each of the grounding plate members is rotated and replicated around the central axis of the media body.

[0012] In some embodiments, the grounding plate members are provided in an odd number.

[0013] In some embodiments, the grounding plate member is provided in three or five parts.

[0014] In some embodiments, the resonator housing has a first plate and a second plate disposed opposite to each other along the axial direction of the dielectric resonator, and the grounding plate abuts between the first plate and the second plate.

[0015] In some embodiments, the end face of the dielectric foot facing the ground plane component has a blind hole, and at least a portion of the inner wall of the blind hole is covered with a loading metal layer, which is electrically connected to the ground plane component.

[0016] In some embodiments, the entire inner wall of the blind hole is covered with the loaded metal layer;

[0017] And / or, each of the loaded metal layers is arranged in a circular pattern at equal angles around the central axis of the medium body.

[0018] In some embodiments, the resonator housing has a first plate and a second plate disposed opposite to each other along the axial direction of the dielectric resonator, the dielectric resonator being spaced apart from the first plate and spaced apart from the second plate.

[0019] In some embodiments, the resonator housing has a first plate and a second plate disposed opposite to each other along the axial direction of the dielectric resonator, the dielectric resonator being disposed abutting against the first plate and the second plate, and the multimode resonator having at least three resonance modes: HE mode and TM mode.

[0020] Secondly, a filter is provided, including the multimode resonator provided in the embodiments of this application.

[0021] The advantages of the multimode resonator provided in this application are as follows:

[0022] The multimode resonator provided in this application embodiment can achieve shielding and prevent signal leakage through the resonator housing; it can form a polygonal columnar resonant space by using at least three grounded grounding plates disposed within the resonator housing; and it can generate resonance at a specific frequency within the resonant space by using dielectric resonators disposed within the resonant space and connected one-to-one to the grounding plates via dielectric pins. Based on this, the multimode resonator, while achieving shielding and preventing signal leakage through the resonator housing, can form a resonant unit through the dielectric resonators and each grounding plate, thereby ensuring that the resonant frequencies of the HE dual-mode are within the passband and close to the same frequency band. Thus, the multimode resonator can couple at least two orthogonal high-Q resonant modes of the HE mode in a single cavity, achieving at least two-order filtering effects, equivalent to the filtering effect of at least two single-mode resonators, i.e., equivalent to the filtering effect of at least two microwave resonators, thereby improving the performance and space utilization of the multimode resonator. Furthermore, multimode resonators are not limited by the shape of the resonator housing. Through resonant elements and resonant spaces, they can form cavities with other resonators and establish coupling (including adjacent coupling and cross coupling), thereby improving the usability, applicability, and practicality of multimode resonators. In addition, multimode resonators are smaller in size, which is beneficial for miniaturization and lightweight design.

[0023] Furthermore, this embodiment, by designing the dielectric resonator with at least three dielectric pins and connecting each dielectric pin to a ground plane component one-to-one, eliminates the need for electroplating of the dielectric resonator. It allows for intuitive and rapid determination of the assembly angle of the dielectric resonator relative to each ground plane component without complex alignment, enables quick, easy, and reliable fixing of the dielectric resonator to each ground plane component, and allows for multi-point fixation between the dielectric resonator and the ground plane components, thus enhancing stability. Moreover, since both the resonator housing and the ground plane components are at least metal-clad, connecting the ground plane components to the inner wall of the resonator housing is significantly easier and more reliable than connecting the dielectric resonator to the inner wall of the resonator housing; that is, the ground plane components can be directly, quickly, and reliably connected to the inner wall of the resonator housing. Therefore, compared to the prior art of "electroplated around the dielectric resonator and then welded to the inner wall of the resonator housing," this embodiment optimizes the installation convenience and reliability of the dielectric resonator and improves the overall assembly convenience and reliability of the multimode resonator. Attached Figure Description

[0024] To clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments of this application or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 A three-dimensional schematic diagram of a multimode resonator provided for some embodiments of this application;

[0026] Figure 2 for Figure 1 The provided schematic diagram shows a partial structure of a multimode resonator, in which three ground plane components are provided;

[0027] Figure 3 for Figure 2 A top view of the provided multimode resonator;

[0028] Figure 4 This is a schematic diagram of the arrangement of multiple resonant spaces provided in some embodiments of this application, wherein the multiple resonant spaces are all hexagonal and have the same orientation;

[0029] Figure 5 A partial structural schematic diagram of a multimode resonator provided for other embodiments of this application, wherein five ground plane components are provided;

[0030] Figure 6 for Figure 5 A top view of the provided multimode resonator;

[0031] Figure 7 The diagram below illustrates the arrangement of multiple resonant spaces in some other embodiments of this application, wherein each resonant space is decagonal and faces the same direction.

[0032] Figure 8 for Figure 1 A three-dimensional sectional view of a multimode resonator is provided, wherein the dielectric resonator is spaced apart from the first plate and spaced apart from the second plate;

[0033] Figure 9 This is a perspective cross-sectional view of a multimode resonator provided in some other embodiments of this application, wherein the dielectric resonator is disposed in contact with a first plate and also in contact with a second plate;

[0034] Figure 10 A perspective view of a dielectric resonator provided in some other embodiments of this application, wherein a blind hole is provided on the end face of the dielectric lead facing the ground plane component;

[0035] Figure 11 for Figure 10 A cross-sectional view of the provided assembly of a dielectric resonator, a ground plane component, and a loading metal layer, wherein the entire inner wall of the blind hole is covered by the loading metal layer, and the loading metal layer is electrically connected to the ground plane component.

[0036] The following are the labeling elements in the figure:

[0037] 10-Resonator housing, 11-Inner cavity, 12-First plate, 13-Second plate, 14-Side wall; 20-Dielectric resonator, 21-Dielectric body, 22-Dielectric foot, 221-Blind hole; 30-Ground plate, 31-Resonant space, 31a-First resonant space, 31b-Second resonant space, 31c-Third resonant space; 40-Loaded metal layer; 100-Resonant unit. Detailed Implementation

[0038] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clear, the application will be described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application. Unless otherwise specified, all embodiments and optional embodiments of this application can be combined to form new technical solutions. Unless otherwise specified, all technical features and optional technical features of this application can be combined to form new technical solutions.

[0039] In the description of this application, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0040] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0041] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0042] In this application, "central axis" refers to a line that passes through the geometric center of the corresponding structure.

[0043] In this application, "axial" refers to the direction of extension of the central axis of the corresponding structure, "radial" refers to any direction of the corresponding structure that passes through and is perpendicular to the central axis, and "circumferential" refers to the direction of circumference of the outer circumference of the corresponding structure.

[0044] A multimode resonator is a resonator capable of simultaneously generating multiple stable oscillation signals at various frequencies. Multimode resonators can be two-mode, three-mode, four-mode, etc. Within their passband, multimode resonators support multiple resonance modes. These modes can be HE (Hybrid Electromagnetic Mode), TM (Transverse Magnetic), TE (Transverse Electric), TEM (Transverse Electric and Magnetic Field), etc. For example, a HE two-mode resonator supports two HE modes within its passband; a HE-TM three-mode resonator supports both HE and TM modes; a HE-TE three-mode resonator supports both HE and TE modes; and a HE-TE-TM four-mode resonator supports all four modes (HE, TE, and TM) within its passband.

[0045] In some cases, multimode resonators have at least two resonance modes: HE mode and H mode. A multimode resonator includes a resonator housing and a dielectric resonator housed within the housing. The dielectric resonator is electroplated around its perimeter and welded to the sidewalls of the resonator housing. However, this design results in poor installation convenience and reliability for the dielectric resonator.

[0046] The embodiments provided in this application will solve the above problems.

[0047] To illustrate the technical solutions provided in this application, the following detailed description is provided in conjunction with specific drawings and embodiments.

[0048] Please see Figure 1 , Figure 2 , Figure 3 Some embodiments of this application provide a multimode resonator, which has at least two resonance modes: HE mode and H mode. The multimode resonator includes a resonator housing 10, a dielectric resonator 20, and a ground plane 30. The dielectric resonator 20 includes a dielectric body 21 and at least three dielectric pins 22 connected to the periphery of the dielectric body 21. The ground plane 30 is provided in a one-to-one correspondence with the dielectric pins 22 and is connected to the end of the dielectric pin 22 away from the dielectric body 21. The dielectric resonator 20 and each ground plane 30 are disposed inside the resonator housing 10, and the ground plane 30 is grounded and connected to the inner wall of the resonator housing 10.

[0049] It should be noted that a multimode resonator has at least two orthogonal high-Q resonant modes, namely HE mode and HE mode. That is, a multimode resonator can support at least HE mode within its passband. For example, a multimode resonator can be a HE dual-mode resonator, a HE-TM tri-mode resonator, a HE-TE tri-mode resonator, a HE-TE-TM quad-mode resonator, and so on.

[0050] It should also be noted that the multimode resonator includes a resonator housing 10. The resonator housing 10 is entirely made of metal, or the surface of the resonator housing 10 is covered with a metal layer (the portion of the resonator housing 10 located within the metal layer can be made of non-metallic material). The resonator housing 10 provides shielding to prevent signal leakage. The resonator housing 10 has an internal cavity 11 (which can be an air cavity). The shape and size of the resonator housing 10 can be flexibly configured as needed, and the shape and size of the internal cavity 11 can also be flexibly configured as needed. For example, the internal cavity 11 can be, but is not limited to, a rectangular internal cavity, a square internal cavity, a polygonal cylindrical internal cavity, a cylindrical internal cavity, etc.

[0051] The multimode resonator also includes a dielectric resonator 20. The dielectric resonator 20 is a resonator made of a dielectric material. The dielectric resonator 20 can be a ceramic dielectric resonator or a dielectric resonator made of other materials. The dielectric resonator 20 includes a dielectric body 21 and at least three dielectric feet 22. The dielectric body 21 is the main part of the dielectric resonator 20. The dielectric body 21 can be, but is not limited to, disc-shaped, columnar, block-shaped, etc. The cross-sectional shape of the dielectric body 21 perpendicular to its axial direction can be, but is not limited to, circular, rectangular, square, polygonal, petal-shaped, cross-shaped, etc. The cross-sectional shape of the dielectric body 21 parallel to its axial direction can be, but is not limited to, circular, rectangular, square, polygonal, petal-shaped, cross-shaped, etc. A central hole may or may not be provided at the central axis of the dielectric body 21. Each dielectric foot 22 is connected to the periphery of the dielectric body 21, and the dielectric feet 22 are arranged at intervals along the circumference of the dielectric body 21. The dielectric feet 22 and the dielectric body 21 can be integrally connected or separately connected. The dielectric pin 22 can be extended in a straight line or in a curved line. For example, as shown... Figure 3 As shown, in some embodiments, the dielectric foot 22 extends in a straight line, and the extension direction of the dielectric foot 22 may coincide with a radial direction of the dielectric body 21, that is, the extension direction of the dielectric foot 22 may pass through the central axis of the dielectric body 21 and be perpendicular to the central axis of the dielectric body 21. Here, the axial direction of the dielectric body 21 (i.e., the axial direction of the dielectric resonator 20) refers to the extension direction of the central axis of the dielectric body 21, the circumferential direction of the dielectric body 21 refers to the direction of circumference of the outer circumference of the dielectric body 21, and the radial direction of the dielectric body 21 refers to any direction of the dielectric body 21 that passes through the central axis and is perpendicular to the central axis.

[0052] The multimode resonator also includes at least three ground plane components 30. Each ground plane component 30 is entirely metal, or its surface is covered with a metal layer (the portion of the ground plane component 30 within the metal layer may be made of a non-metallic material). Each ground plane component 30 is correspondingly positioned to a dielectric pin 22, with the end of the dielectric pin 22 furthest from the dielectric body 21 connected one-to-one to the surface of the ground plane component 30. Figure 2 , Figure 3 As shown, in some embodiments, the end of the dielectric foot 22 furthest from the dielectric body 21 can abut against and be fixed to the surface of the grounding plate 30. The connection and fixing methods can include, but are not limited to, welding, bonding, pressing, plugging, threaded connection, snap-fit, riveting, and screw fastening. In other embodiments, the end of the dielectric foot 22 furthest from the dielectric body 21 can be indirectly connected to the surface of the grounding plate 30 via an abutment structure (the abutment structure can be an insulating abutment structure or a metal abutment structure) connected to it. The number of dielectric feet 22 and the number of grounding plates 30 can be odd (e.g., 3, 5, 7, 9, etc.) or even (e.g., 4, 6, 8, etc.).

[0053] The dielectric resonator 20 and each grounding plate 30 are disposed within the inner cavity 11 of the resonator housing 10. The grounding plate 30 is grounded to any inner wall of the resonator housing 10 (e.g., the first plate 12, the second plate 13, or any side wall 14 connecting the first plate 12 and the second plate 13). The grounding plate 30 can be directly connected (whether integrally connected or separately connected) to the inner wall of the resonator housing 10 for grounding, or it can be indirectly connected to the inner wall of the resonator housing 10 via other conductive components for grounding. Optionally, the dielectric resonator 20 can be centrally arranged within the inner cavity 11.

[0054] Based on this, within the inner cavity 11, each ground plate member 30 can collectively enclose a polygonal columnar resonant space 31. For example, three ground plate members 30 can collectively enclose a hexagonal columnar resonant space 31 (e.g., Figure 3 , Figure 4 As shown), for example, five ground plane components 30 can be combined to form a decagonal columnar resonant space 31 (as shown). Figure 5 , Figure 6As shown, the shape of the resonant space 31 is not affected by the shape of the resonator housing 10. Therefore, the dielectric resonator 20 will be located within the resonant space 31, primarily generating resonance at a specific frequency within this space. That is, based on the shielding function of the resonator housing 10 and the prevention of signal leakage, the dielectric resonator 20 and each ground plane component 30 can jointly form the resonant unit 100, thereby ensuring that the resonant frequency of the HE dual-mode is within the passband and close to the same frequency band. Furthermore, the multimode resonator mainly connects with other resonators via the resonant unit 100 and the resonant space 31, forming cavities and establishing coupling (including adjacent coupling and cross coupling).

[0055] In summary, the multimode resonator provided in this application embodiment can achieve shielding and prevent signal leakage through the resonator housing 10; it can form a polygonal columnar resonant space 31 by having at least three grounded grounding plates 30 disposed within the resonator housing 10; and it can generate resonance at a specific frequency within the resonant space 31 by having dielectric resonators 20 disposed within the resonant space 31 and connected one-to-one to the grounding plates 30 via dielectric pins 22. Based on this, the multimode resonator can achieve shielding and prevent signal leakage through the resonator housing 10, and form a resonant unit 100 through the dielectric resonators 20 and each grounding plate 30, so that the resonant frequencies of the HE dual-mode are within the passband and close to the same frequency band. Thus, the multimode resonator can couple at least two orthogonal high-Q resonant modes of the HE mode in a single cavity, achieving at least two-order filtering effects, which is equivalent to the filtering effect of at least two single-mode resonators, i.e., equivalent to the filtering effect of at least two microwave resonators, thereby improving the performance and space utilization of the multimode resonator. Furthermore, the multimode resonator is not limited by the shape of the resonator housing 10. Through the resonant unit 100 and the resonant space 31, it can form cavities with other resonators and establish coupling (including adjacent coupling and cross coupling), thereby improving the usability, applicability and practicality of the multimode resonator. In addition, the multimode resonator has a smaller size, which is beneficial for miniaturization and lightweight design.

[0056] Furthermore, by designing at least three dielectric feet 22 on the dielectric resonator 20 and connecting the dielectric feet 22 one-to-one with the ground plane 30, this embodiment eliminates the need for electroplating of the dielectric resonator 20. It also allows for intuitive and quick determination of the assembly angle of the dielectric resonator 20 relative to each ground plane 30 without complex alignment. This enables the dielectric resonator 20 to be quickly, easily, and reliably fixed to each ground plane 30, and allows for multi-point fixation between the dielectric resonator 20 and each ground plane 30, thereby enhancing stability. The connection of the dielectric feet 22 of the dielectric resonator 20 to the ground plane 30 is significantly easier to operate and more reliable than the connection of the dielectric resonator 20 to the inner wall of the resonator housing 10. Furthermore, since the resonator housing 10 is at least covered with a metal layer on its surface, and since the ground plane component 30 is at least covered with a metal layer on its surface, "connecting the ground plane component 30 to the inner wall of the resonator housing 10" is significantly easier to operate and more reliable than "connecting the dielectric resonator 20 to the inner wall of the resonator housing 10." That is, the ground plane component 30 can be directly, quickly, and reliably connected to the inner wall of the resonator housing 10. Therefore, compared to the prior art of "first electroplating the perimeter of the dielectric resonator and then welding it to the inner wall of the resonator housing," this embodiment optimizes the installation convenience and reliability of the dielectric resonator 20, and improves the overall assembly convenience and reliability of the multimode resonator.

[0057] Furthermore, the two resonant modes, HE and HE, of the multimode resonator can be tuned independently without affecting each other. The specific tuning method is not limited. For example, in some embodiments, the multimode resonator includes a tuning screw, which is threaded to the resonator housing 10 and is located in any polarization direction of the HE mode. The tuning screw is used to adjust the resonant frequency of the HE mode submode in its polarization direction.

[0058] Please see Figure 2 , Figure 3 In some embodiments of this application, the ground plane component 30 is separately connected to the resonator housing 10.

[0059] It should be noted that the ground plane component 30 is first formed independently relative to the resonator housing 10, and then separately connected to the resonator housing 10 to achieve a fixed connection and grounding. The separate connection between the ground plane component 30 and the resonator housing 10 can be achieved through methods including, but not limited to, welding, bonding, pressing, plugging, threaded connection, snap-fit, riveting, and screw fastening. Since the ground plane component 30 and the resonator housing 10 are separately formed and separately connected, the materials of the ground plane component 30 and the resonator housing 10 can be the same or different.

[0060] By adopting the above scheme, the ground plane component 30 can be formed independently relative to the resonator housing 10, and then separately connected to the resonator housing 10, thereby achieving a fixed connection to the resonator housing 10 and grounding. Based on this, it is convenient to pre-assemble the dielectric resonator 20 and each ground plane component 30 outside the resonator housing 10, and then assemble the dielectric resonator 20 and each ground plane component 30 as a whole into the resonator housing 10 in the form of components. Compared with the assembly method of "first forming the resonator housing 10 and each ground plane component 30 as a whole, and then assembling the dielectric resonator 20 into the resonant space 31 formed by the ground plane components 30", this assembly method can significantly reduce the assembly difficulty, thereby improving the installation convenience and reliability of the dielectric resonator 20, and improving the overall assembly convenience and reliability of the multimode resonator.

[0061] Furthermore, compared to the existing technology of "first electroplating the periphery of the dielectric resonator, and then welding and fixing the dielectric resonator to the inner wall of the resonator housing", this embodiment connects the dielectric foot 22 of the dielectric resonator 20 to the independently formed ground plane piece 30 to form the resonant unit 100, and then connects the resonant unit 100 to the inner wall of the resonator housing 10 (that is, connects the ground plane piece 30 of the resonant unit 100 to the inner wall of the resonator housing 10), thereby realizing the installation of the dielectric resonator 20 in the inner cavity 11 of the resonator housing 10. Based on this, this embodiment can optimize the installation convenience and installation reliability of the dielectric resonator 20, and improve the overall assembly convenience and assembly reliability of the multimode resonator.

[0062] Of course, in other embodiments, the ground plane member 30 may be integrally connected to the resonator housing 10.

[0063] Please see Figure 2 , Figure 3 In some embodiments of this application, each dielectric foot 22 is arranged in a circular shape with equal angles around the central axis of the dielectric body 21, and each ground plate member 30 is arranged in a circular shape with equal angles around the central axis of the dielectric body 21. One of the polarization directions of the HE mode is along the extension direction of one of the dielectric feet 22.

[0064] By adopting the above scheme, by arranging each dielectric pin 22 in a circular arrangement at equal angles around the central axis of the dielectric body 21 (i.e., in a circular array arrangement), and by arranging each ground plate component 30 in a circular arrangement at equal angles around the central axis of the dielectric body 21 (i.e., in a circular array arrangement), the distribution of each dielectric pin 22 and each ground plate component 30 on the periphery of the dielectric body 21 can be balanced, which can promote the resonant unit 100 formed by the dielectric resonator 20 and each ground plate component 30 to have better structural symmetry. Based on this, on the one hand, it helps to promote a uniform distribution of resonant modes (such as the HE mode) and electromagnetic field in the resonant space 31, reducing the distortion of resonant modes and improving the stability of the resonant frequency; on the other hand, it helps to clearly separate different resonant modes, helps to control the polarization characteristics of resonant modes, especially helps to separate the two orthogonal polarization modes of the HE mode, helps to guide one polarization direction of the HE mode to align with the extension direction of one of the dielectric pins 22, and guides the other polarization direction of the HE mode to be approximately perpendicular to one of the polarization directions of the HE mode; furthermore, it can promote similar field distribution and frequency characteristics of the two orthogonal polarization modes of the HE mode in the resonant space 31, optimize the resonance balance of the HE dual-mode, and make the resonant frequencies of the HE dual-mode close to meet the passband requirements. Therefore, the performance and Q value of the multimode resonator can be optimized and improved.

[0065] Furthermore, the equiangularly arranged dielectric leads 22 and ground plane components 30 make assembly between them intuitive and simple, eliminating the need for complex alignment operations, thereby improving assembly convenience, efficiency, and reliability. Moreover, the equiangularly arranged dielectric leads 22 and ground plane components 30 regularize the structure of the multimode resonator, facilitating its design and manufacturing, reducing manufacturing errors, and improving product consistency.

[0066] Of course, in other embodiments, based on the fact that the dielectric pins 22 of the dielectric resonator 20 are connected one-to-one to the ground plane 30, and the resonant frequencies of the HE dual modes are within the passband and close to the same frequency band, it is permissible for each dielectric pin 22 to be arranged in unequal angles around the central axis of the dielectric body 21, and for each ground plane 30 to be arranged in unequal angles around the central axis of the dielectric body 21. In this case, the polarization direction of the HE mode is determined by simulation.

[0067] Please see Figure 2 , Figure 3 In some embodiments of this application, each medium foot 22 is rotated and replicated around the central axis of the medium body 21, and each ground plate member 30 is rotated and replicated around the central axis of the medium body 21.

[0068] It should be noted that each medium pin 22 is replicated by rotation around the central axis of the medium body 21. That is, each medium pin 22 can rotate around the central axis of the medium body 21 to coincide with other medium pins 22; in other words, each medium pin 22 is a copy obtained by rotating other medium pins 22 around the central axis of the medium body 21 by a certain angle. Similarly, each ground plate component 30 is replicated by rotation around the central axis of the medium body 21. That is, each ground plate component 30 can rotate around the central axis of the medium body 21 to coincide with other ground plate components 30; in other words, each ground plate component 30 is a copy obtained by rotating other ground plate components 30 around the central axis of the medium body 21 by a certain angle. When the medium pin 22 is indirectly connected to the surface of the ground plate component 30 via a first component (not shown in the figure, referring to "other components"), each first component is also replicated by rotation around the central axis of the medium body 21.

[0069] Based on the previous embodiment, by adopting the above scheme, each group of dielectric pins 22 and ground plane components 30 can be arranged in a circular array around the central axis of the dielectric body 21, ensuring that the shape and size of each group of dielectric pins 22 and ground plane components 30 are the same. This results in a high degree of consistency in the circumferential distribution of the dielectric pins 22 and ground plane components 30, enhancing the structural symmetry of the resonant unit 100 formed by the dielectric resonator 20 and each ground plane component 30. Consequently, the uniformity of the electromagnetic field distribution in the resonant space 31 can be improved, the distortion of the resonant mode can be reduced, and the stability of the resonant frequency can be improved. It also helps to accurately control the polarization characteristics of the resonant mode, enabling clear separation of the two orthogonal polarization modes of the HE mode. Furthermore, it allows the two orthogonal polarization modes of the HE mode to have similar field distributions and frequency characteristics within the resonant space 31, optimizing the resonant balance of the HE dual-mode and ensuring that the resonant frequencies are close and meet the passband requirements. This, in turn, improves the Q value and filtering performance of the multimode resonator.

[0070] Of course, in other embodiments, slight differences in the shape and size of each medium foot 22 and the shape and size of each ground plate 30 are permitted.

[0071] It should be noted that in the multimode resonator provided in this application embodiment, the resonator housing 10 mainly serves the function of "shielding and preventing signal leakage". The multimode resonator mainly forms cavities and establishes coupling (including adjacent coupling and cross coupling) with other resonators through the resonant unit 100 and the resonant space 31, without being limited by the shape of the resonator housing 10. However, when there are an even number of ground plane members 30 (e.g., 4, 6, 8, etc.), the shape of the resonant space 31 enclosed by each ground plane member 30 is more suitable for forming adjacent cavities and establishing adjacent coupling with adjacent multimode resonators, but not suitable for forming adjacent cavities and establishing cross coupling with non-adjacent multimode resonators. If the orientation of the resonant space 31 of different multimode resonators is adjusted according to the cross coupling relationship, the adjustment operation will be cumbersome, complex and difficult, and it is easy to have a situation where "while the coupling adjustment between a multimode resonator and one multimode resonator is completed, the coupling between the multimode resonator and another multimode resonator deviates". Among them, "adjacent cavity arrangement" refers to the ability of two resonant spaces 31 to arrange cavities close to each other.

[0072] For this, please refer to Figure 2 , Figure 3 , Figure 4 In some embodiments of this application, the grounding plate member 30 is provided with an odd number.

[0073] It should be noted that the number of grounding plate components 30 is equal to the number of media pins 22, and there is an odd number (e.g., 3, 5, 7, 9, etc.).

[0074] For example, such as Figure 2 , Figure 3 , Figure 4 As shown, in some embodiments, there are three ground plane members 30, and the resonant space 31 enclosed by each ground plane member 30 is hexagonal in shape. Figure 4 The three resonant spaces 31 shown are the first resonant space 31a, the second resonant space 31b, and the third resonant space 31c. The first resonant space 31a, the second resonant space 31b, and the third resonant space 31c are all hexagonal and have the same orientation. The first resonant space 31a, the second resonant space 31b, and the third resonant space 31c can be arranged in a honeycomb pattern, so that the first resonant space 31a and the second resonant space 31b can be arranged with adjacent cavities and adjacent coupling can be constructed. The second resonant space 31b and the third resonant space 31c can be arranged with adjacent cavities and adjacent coupling can be constructed. The first resonant space 31a and the third resonant space 31c can be arranged with adjacent cavities and cross coupling can be constructed.

[0075] For example, such as Figure 5 , Figure 6 , Figure 7As shown, in some embodiments, there are five ground plane members 30, and the resonant space 31 enclosed by each ground plane member 30 is decagonal in shape. Figure 7 The three resonant spaces 31 shown are the first resonant space 31a, the second resonant space 31b, and the third resonant space 31c. The first resonant space 31a, the second resonant space 31b, and the third resonant space 31c are all decagonal and have the same orientation. The first resonant space 31a, the second resonant space 31b, and the third resonant space 31c can be arranged in a honeycomb pattern, so that the first resonant space 31a and the second resonant space 31b can be arranged with adjacent cavities and adjacent coupling can be constructed. The second resonant space 31b and the third resonant space 31c can be arranged with adjacent cavities and adjacent coupling can be constructed. The first resonant space 31a and the third resonant space 31c can be arranged with adjacent cavities and cross coupling can be constructed.

[0076] Similarly, in some embodiments, there are 7 ground plane members 30, and the resonant space 31 enclosed by each ground plane member 30 is 14-sided. Multiple resonant spaces 31 that are all 14-sided and face the same direction can be arranged in a honeycomb pattern so that adjacent cavities can be arranged between two resonant spaces 31 and the required adjacent coupling or cross coupling can be constructed.

[0077] Similarly, in some embodiments, there are nine ground plane members 30, and the resonant space 31 enclosed by each ground plane member 30 is octagonal in shape. Multiple resonant spaces 31 that are all octagonal and face the same direction can be arranged in a honeycomb pattern so that adjacent cavities can be arranged between two resonant spaces 31 and the required adjacent coupling or cross coupling can be constructed.

[0078] By adopting the above scheme, and by having an odd number of ground plane components 30, the shape of the resonant space 31 enclosed by each ground plane component 30 can be adapted to form adjacent cavity arrangement and adjacent coupling with the resonant space 31 of adjacent multimode resonators, and also to form adjacent cavity arrangement and cross coupling with the resonant space 31 of non-adjacent multimode resonators, without needing to adjust the orientation of the resonant space 31 of different multimode resonators according to the cross coupling relationship. That is, when there is an odd number of ground plane components 30, multiple resonant spaces 31 can be arranged in a honeycomb pattern with the same orientation, allowing adjacent cavity arrangement and the establishment of the required adjacent coupling or cross coupling between two resonant spaces 31. This improves the usability, applicability, and practicality of multimode resonators, facilitates the arrangement and coupling design between multiple multimode resonators, optimizes the coupling effect between multiple multimode resonators, and thus facilitates the simulation design and coupling design of filters, thereby improving the performance of filters.

[0079] Please see Figure 2 , Figure 3 , Figure 4 In some embodiments of this application, the grounding plate member 30 is provided with three.

[0080] It should be noted that the number of ground plane components 30 is equal to the number of dielectric pins 22, and there are 3 of them. The 3 ground plane components 30 are distributed at intervals along the circumference of the dielectric body 21, and together they enclose a hexagonal columnar resonant space 31.

[0081] Multiple resonant spaces 31, all hexagonal prisms and facing the same direction, can be arranged in a honeycomb pattern. For example, such as... Figure 4 As shown, the three resonant spaces 31 are the first resonant space 31a, the second resonant space 31b, and the third resonant space 31c. The first resonant space 31a, the second resonant space 31b, and the third resonant space 31c are all hexagonal and have the same orientation. The first resonant space 31a, the second resonant space 31b, and the third resonant space 31c can be arranged in a honeycomb pattern, so that the first resonant space 31a and the second resonant space 31b can be arranged with adjacent cavities and adjacent coupling can be constructed. The second resonant space 31b and the third resonant space 31c can be arranged with adjacent cavities and adjacent coupling can be constructed. The first resonant space 31a and the third resonant space 31c can be arranged with adjacent cavities and cross coupling can be constructed.

[0082] By adopting the above scheme, and by having three ground plane components 30, the resonant space 31 enclosed by each ground plane component 30 can be hexagonal in shape. This ensures that the resonant space 31 has sufficient sides to provide ample adjacent cavity routing paths and coupling paths. Based on this, multiple resonant spaces 31, all hexagonal and facing the same direction, can be arranged in a honeycomb pattern with the same orientation. This allows adjacent cavity routing between two resonant spaces 31 to build the required adjacent coupling or cross coupling, thereby improving the usability, applicability, and practicality of the multimode resonator. It also facilitates the arrangement and coupling design between multiple multimode resonators, and is particularly suitable for conventional adjacent coupling and cross coupling designs. This facilitates the simulation design and coupling design of filters, and improves the performance of filters. Furthermore, since hexagons are an effective space-filling shape, compared to cases where the ground plane component 30 has other odd numbers such as 5, 7, or 9, the hexagonal resonant space 31 formed in this embodiment can be arranged in a more compact, regular, and smaller honeycomb pattern, maximizing space utilization and maintaining structural stability. This improves the space utilization and integration of the filter, facilitating filter miniaturization, and is particularly suitable for scenarios requiring high space utilization, miniaturization, and high integration. Moreover, compared to other cases, this embodiment has the fewest dielectric pins 22 and ground plane components 30, reducing the number of components, simplifying the structure of the multimode resonator, and facilitating miniaturization, simplification, and weight reduction. It also reduces assembly steps between the dielectric pins 22 and the ground plane component 30, and between the ground plane component 30 and the resonator housing 10, improving the assembly convenience and efficiency of the multimode resonator.

[0083] Please see Figure 5 , Figure 6 , Figure 7 In some embodiments of this application, the grounding plate member 30 is provided with 5.

[0084] It should be noted that the number of ground plane components 30 is equal to the number of dielectric feet 22, and there are 5 of them. The 5 ground plane components 30 are distributed at intervals along the circumference of the dielectric body 21, and together they enclose a decagonal columnar resonant space 31.

[0085] Multiple resonant spaces 31, all decagonal in shape and facing the same direction, can be arranged in a honeycomb pattern. For example, such as... Figure 7 As shown, the three resonant spaces 31 are the first resonant space 31a, the second resonant space 31b, and the third resonant space 31c. The first resonant space 31a, the second resonant space 31b, and the third resonant space 31c are all decagonal and have the same orientation. The first resonant space 31a, the second resonant space 31b, and the third resonant space 31c can be arranged in a honeycomb pattern, so that the first resonant space 31a and the second resonant space 31b can be arranged with adjacent cavities and adjacent coupling can be constructed. The second resonant space 31b and the third resonant space 31c can be arranged with adjacent cavities and adjacent coupling can be constructed. The first resonant space 31a and the third resonant space 31c can be arranged with adjacent cavities and cross coupling can be constructed.

[0086] By adopting the above scheme, and by having five ground plane components 30, the resonant space 31 enclosed by each ground plane component 30 can be decagonal in shape. This allows the resonant space 31 to have more sides, providing more adjacent cavity routing paths and coupling paths. Based on this, multiple resonant spaces 31, all decagonal and facing the same direction, can be arranged in a honeycomb pattern with the same orientation. This allows adjacent cavity routing between two resonant spaces 31 to build the required adjacent coupling or cross coupling, thereby improving the usability, applicability, and practicality of the multimode resonator. It facilitates the arrangement and coupling design between multiple multimode resonators, especially supporting complex coupling designs. It is particularly suitable for scenarios requiring high-order filtering or complex coupling relationships, thus facilitating filter simulation design and coupling design, and improving filter performance and frequency selectivity. Furthermore, the number of dielectric pins 22 and ground plane components 30 in this embodiment is also smaller, which can reduce the number of parts, simplify the structure of the multimode resonator, and facilitate the miniaturization, simplification, and weight reduction of the multimode resonator; it can also reduce the assembly steps between the dielectric pins 22 and the ground plane components 30, and between the ground plane components 30 and the resonator housing 10, thereby improving the assembly convenience and assembly efficiency of the multimode resonator.

[0087] Please see Figure 8 , Figure 9In some embodiments of this application, the resonator housing 10 has a first plate 12 and a second plate 13 disposed opposite to each other along the axial direction of the dielectric resonator 20, and the ground plate 30 abuts between the first plate 12 and the second plate 13.

[0088] It should be noted that the resonator housing 10 has a first plate 12 and a second plate 13, which are arranged opposite to each other along the axial direction of the dielectric resonator 20. In practical applications, the resonator housing 10 can be placed with the second plate 13 facing upwards, or with the second plate 13 facing left, right, forward, or backwards. Along the axial direction of the dielectric resonator 20, one side of the ground plane 30 abuts against the first plate 12, and the other side of the ground plane 30 abuts against the second plate 13.

[0089] By adopting the above scheme, on the one hand, it facilitates the connection and assembly of the grounding plate 30 with the first plate 12 and the second plate 13. During assembly, the grounding plate 30 can be first assembled into the inner cavity 11 and made to abut against one of the first plate 12 and the second plate 13, and then the other of the first plate 12 and the second plate 13 can be directly fastened, thus completing the assembly conveniently and quickly, thereby simplifying the assembly process and improving assembly convenience, assembly efficiency, and assembly reliability. On the other hand, it can cause the grounding plate 30 to be limited and installed between the first plate 12 and the second plate 13, thereby restricting the grounding plate 30 from moving along the axial direction of the dielectric resonator 20. This can stabilize the installation position and installation state of the grounding plate 30 between the first plate 12 and the second plate 13, stabilize the connection position and connection state between the grounding plate 30 and the resonator housing 10, improve the connection stability and connection reliability between the grounding plate 30 and the resonator housing 10, and facilitate the reliable grounding setting of the grounding plate 30. On the one hand, since the ground plane component 30 abuts against the first plate component 12 and the second plate component 13 at the same time, the ground plane component 30 can form a wall-like structure. In this case, the resonant space 31 enclosed by each ground plane component 30 has the best effect, thereby optimizing the performance indicators of the dielectric resonator 20 and the resonant unit 100 formed by each ground plane component 30, and optimizing the radio frequency indicators (e.g., intermodulation indicators) of the multimode resonator.

[0090] Furthermore, based on this embodiment, the grounding plate 30 can be interference-fitted between the first plate 12 and the second plate 13 to make the planar position of the grounding plate 30 relative to the first plate 12 and the second plate 13 substantially stable by means of friction; the grounding plate 30 can also be completely fixed by welding, bonding, pressing, inserting, threading, snapping, riveting, screw fastening, etc. with at least one of the first plate 12 and the second plate 13; and so on.

[0091] Of course, in other embodiments, the grounding plate 30 may be grounded only to the first plate 12 and spaced apart from the second plate 13; the grounding plate 30 may be grounded only to the second plate 13 and spaced apart from the first plate 12; the grounding plate 30 may be grounded only to the side wall 14 and spaced apart from both the first plate 12 and the second plate 13; the grounding plate 30 may be grounded to both the first plate 12 and the side wall 14 and spaced apart from the second plate 13; or the grounding plate 30 may be grounded to both the second plate 13 and the side wall 14 and spaced apart from the first plate 12.

[0092] Please see Figure 3 , Figure 10 , Figure 11 In some embodiments of this application, a blind hole 221 is provided on the end face of the dielectric foot 22 facing the ground plane member 30, and at least a portion of the inner wall of the blind hole 221 is covered with a loading metal layer 40, which is electrically connected to the ground plane member 30.

[0093] It should be noted that each dielectric foot 22 has a blind hole 221 on its end face facing the corresponding ground plane component 30. The blind hole 221 may or may not extend into the dielectric body 21 along its own extension direction. The blind hole 221 does not penetrate the dielectric resonator 20 along its own extension direction. The blind hole 221 is located between the two end faces of the dielectric resonator 20 along the axial direction. The blind hole 221 can be, but is not limited to, a circular hole, a rectangular hole, etc. The inner wall of the blind hole 221 includes the hole wall and the hole bottom. All or part of the inner wall of the blind hole 221 is covered with a loading metal layer 40, which means that the loading metal layer 40 and the blind hole 221 together form a metallized blind hole. The loading metal layer 40 can be coated on the inner wall of the blind hole 221 by, but is not limited to, electroplating.

[0094] The loading metal layer 40 is made of a conductive metal material and has conductive properties. The loading metal layer 40 is conductively connected to the ground plane component 30. Since the ground plane component 30 is grounded and connected to the inner wall of the resonator housing 10, the loading metal layer 40 is indirectly conductively connected to the resonator housing 10.

[0095] The loading metal layer 40 and the ground plane member 30 can be electrically connected in various ways. For example, in some embodiments, when the end of the dielectric foot 22 away from the dielectric body 21 abuts against and is fixed to the plate surface of the ground plane member 30 (i.e., in direct contact), the loading metal layer 40 can be extended to the edge of the blind hole 221 so that the loading metal layer 40 located at the edge of the hole directly abuts against the plate surface of the ground plane member 30 to achieve a conductive connection. With this configuration, the dielectric foot 22 and the ground plane member 30 can directly abut against and be fixed, and the loading metal layer 40 and the ground plane member 30 can directly abut against each other and be stably electrically connected. The assembly is simple, and the number of parts can be reduced to a large extent (no additional metal conductive parts are required), and the structure can be simplified to a large extent (the ground plane member 30 does not need to be provided with an additional protruding structure).

[0096] In other embodiments, when the end of the medium foot 22 away from the medium body 21 abuts against and is fixed to the surface of the ground plate member 30 (i.e., when it directly abuts against the plate), the loading metal layer 40 can be disposed in the blind hole 221 and does not directly contact the surface of the ground plate member 30. In this case, the ground plate member 30 can have a protrusion that can extend into the blind hole 221 and contact the loading metal layer 40, thereby realizing the conductive connection between the ground plate member 30 and the loading metal layer 40; or, the ground plate member 30 and the loading metal layer 40 located in the blind hole 221 can be electrically connected through an additional metal conductive member.

[0097] In other embodiments, when the end of the dielectric foot 22 away from the dielectric body 21 is indirectly connected to the surface of the ground plate member 30 via an insulating contact structure connected thereto, the ground plate member 30 may have a protrusion that can extend into the blind hole 221 and contact the loading metal layer 40, thereby achieving a conductive connection between the ground plate member 30 and the loading metal layer 40; or, the ground plate member 30 and the loading metal layer 40 located in the blind hole 221 may be electrically connected via an additional metal conductive member.

[0098] In other embodiments, when the end of the medium foot 22 away from the medium body 21 is indirectly connected to the surface of the ground plate member 30 via a metal abutment structure connected thereto, the metal abutment structure may have a protrusion that extends into the blind hole 221 and contacts the loaded metal layer 40, thereby achieving a conductive connection between the ground plate member 30 and the loaded metal layer 40 via the metal abutment structure and its protrusion; or, the metal abutment structure and the loaded metal layer 40 located in the blind hole 221 are electrically connected through an additional metal conductive element; or, the loaded metal layer 40 extends to the edge of the blind hole 221, so that the loaded metal layer 40 located at the edge of the hole directly contacts the metal abutment structure for conductive connection.

[0099] By adopting the above scheme, the loaded metal layer 40 can be accommodated and disposed through blind holes 221 opened on the end face of the dielectric pin 22 facing the ground plane component 30, which facilitates the conductive connection between the loaded metal layer 40 and the ground plane component 30. The loaded metal layer 40, distributed in each blind hole 221, loads metal relatively evenly in the circumference of the dielectric resonator 20, thereby lowering the resonant frequency; the more metal loaded, the lower the resonant frequency. Based on this, the content of the loaded metal layer 40 can be adjusted by adjusting the "area ratio of the loaded metal layer 40 relative to the inner wall of the blind hole 221", the "hole depth of the blind hole 221", and the "hole diameter of the blind hole 221", i.e., adjusting the loaded metal content. Increasing the "content of the loaded metal layer 40" lowers the resonant frequency of the HE dual-mode; decreasing the "content of the loaded metal layer 40" increases the resonant frequency of the HE dual-mode. Therefore, the resonant frequency of the HE dual-mode can be conveniently and controllably adjusted, improving the ease and accuracy of adjustment. This facilitates precise design where the resonant frequency of the HE dual-mode is within the passband and close to the desired frequency band, thereby improving the performance and design flexibility of the multimode resonator. Specifically, the larger the area ratio of the loaded metal layer 40 relative to the inner wall of the blind via 221, and the higher the metal content, the lower the resonant frequency of the HE dual-mode. The greater the depth of the blind via 221 and the larger the area of ​​its inner wall, the higher the metal content that can be loaded, and the lower the resonant frequency of the HE dual-mode. The larger the diameter of the blind via 221 and the larger the area of ​​its inner wall, the higher the metal content that can be loaded, and the lower the resonant frequency of the HE dual-mode.

[0100] In other embodiments, metal loading may be achieved by adding a metal screw, but this would increase the amount of material and the overall volume of the multimode resonator would increase because the metal screw would occupy external space of the resonator housing 10. In other embodiments, metal loading may be achieved by protruding a metal part on the inner wall of the resonator housing 10 (e.g., the first plate 12 or the second plate 13), or by protruding a metal part on the surface of the ground plane 30 facing the dielectric resonator 20, etc. However, this would create additional structures, increase weight, and cause inconvenience in processing, manufacturing, and assembly, resulting in a complex and redundant internal structure of the multimode resonator, which would be detrimental to the simplification, miniaturization, and lightweighting of the multimode resonator; moreover, if the protruding part is an integral structure, it would increase the processing cost of the resonator housing 10 or the ground plane 30; if the protruding part is a separate structure, it would also increase the amount of material. Compared to other embodiments, this embodiment, by incorporating a loaded metal layer 40 within the blind hole 221, transfers the space for loading the metal to the interior of the dielectric resonator 20. This avoids occupying the external space of the dielectric resonator 20 within the inner cavity 11, and also avoids occupying the external space of the resonator housing 10. This helps reduce the overall volume of the multimode resonator and facilitates its miniaturization. Furthermore, the blind hole 221 reduces the weight of the dielectric resonator 20, and the weight of the loaded metal layer 40 is negligible. Therefore, the metal loading method in this embodiment not only does not increase weight, but also... This effectively reduces weight, thus contributing to the lightweight design of the multimode resonator. Furthermore, this embodiment does not add any additional structures or components to the resonator housing 10 and the ground plane component 30, resulting in a simpler structure and fewer components for the multimode resonator, facilitating processing, manufacturing, and assembly. This simplifies the multimode resonator and reduces processing and material costs. In addition, this embodiment only opens a blind hole 221 at the end of the dielectric pin 22, which does not affect the assembly with the ground plane component 30, making assembly simple and convenient. Moreover, the design of the loading metal layer 40 inside the blind hole 221 makes manufacturing relatively simple and convenient.

[0101] In other embodiments, the loading metal layer 40 may be omitted, and a block metal may be embedded in the blind hole 221. However, this may lead to fit and fixation problems between the block metal and the blind hole 221 due to assembly tolerances, manufacturing tolerances, etc. For example, since the strength of the dielectric resonator 20 is not high, if the block metal is excessively inserted into the blind hole 221, it may cause the dielectric resonator 20 to crack. For another example, if the block metal is gapped into the blind hole 221, it will be difficult to fix the block metal stably. Moreover, since the thermal expansion coefficients of the block metal and the dielectric resonator 20 are different, even if the block metal is gapped into the blind hole 221, it may still cause the dielectric resonator 20 to crack in high and low temperature environments. In addition, the reliable conductive connection between the block metal and the ground plane component 30 needs to be considered. Furthermore, the block metal will significantly increase the weight, which is not conducive to the lightweighting of the multimode resonator. Compared to other embodiments, this embodiment allows the loaded metal layer 40 to cover and fix the inner wall of the blind hole 221, which directly solves the matching and fixing problems between the loaded metal layer 40 and the blind hole 221, and will not cause the dielectric resonator 20 to crack, thus improving practicality and reliability. It also facilitates convenient, quick and reliable conductive connection between the loaded metal layer 40 and the ground plane component 30. Furthermore, the opening of the blind hole 221 reduces the weight of the dielectric resonator 20, and the weight of the loaded metal layer 40 is negligible. Therefore, this embodiment not only does not increase the weight, but also effectively reduces the weight, thereby contributing to the lightweighting of the multimode resonator.

[0102] Of course, in other embodiments, the blind hole 221 and the loaded metal layer 40 can be omitted as needed.

[0103] Please see Figure 10 , Figure 11 In some embodiments of this application, the entire inner wall of the blind hole 221 is covered with a loaded metal layer 40.

[0104] By adopting the above-described scheme, the loading metal layer 40 can be conveniently, quickly, and reliably coated onto the entire area of ​​the inner wall of the blind via 221 using electroplating or other methods, without selectively leaving parts of the inner wall of the blind via 221 uncoated with the loading metal layer 40. Therefore, compared to the two implementation methods of "first coating the entire area of ​​the inner wall of the blind via 221 with the loading metal layer 40, then scraping off parts of the loading metal layer 40 to achieve the loading metal layer 40 covering only a portion of the inner wall of the blind via 221" and "first applying an electroplated barrier layer to a portion of the inner wall of the blind via 221, then coating the remaining area of ​​the inner wall of the blind via 221 without the electroplated barrier layer with the loading metal layer 40, and then peeling off the electroplated barrier layer to achieve the loading metal layer 40 covering only a portion of the inner wall of the blind via 221," this embodiment simplifies the processing steps related to the loading metal layer 40, thereby improving the processing convenience and efficiency of the multimode resonator. Furthermore, since the loaded metal layer 40 covers the entire area of ​​the inner wall of the blind via 221, the area ratio of the loaded metal layer 40 to the inner wall of the blind via 221 is 100%. In this case, the "content of the loaded metal layer 40" can be adjusted directly by adjusting the size of the blind via 221 (i.e., hole depth and hole diameter). This facilitates convenient, controllable, and precise adjustment of the resonant frequency of the HE dual-mode, improves the convenience and accuracy of adjusting the resonant frequency of the HE dual-mode, and makes it easier to accurately design the "resonant frequency of the HE dual-mode to be within the passband and close to the same desired frequency band". This improves the performance and design flexibility of the multimode resonator.

[0105] Of course, in other embodiments, a portion of the inner wall of the blind hole 221 is covered with a loaded metal layer 40. In one possible implementation, the loaded metal layer 40 can be first applied to the entire inner wall of the blind hole 221, and then the loaded metal layer 40 can be scraped off from a portion of the inner wall of the blind hole 221, so that the loaded metal layer 40 only covers a portion of the inner wall of the blind hole 221. In another possible implementation, an electroplated barrier layer can be first applied to a portion of the inner wall of the blind hole 221, and then the loaded metal layer 40 can be applied to the remaining portion of the inner wall of the blind hole 221 where the electroplated barrier layer is not applied, and then the electroplated barrier layer can be peeled off, so that the loaded metal layer 40 only covers a portion of the inner wall of the blind hole 221.

[0106] Please see Figure 10 , Figure 11 In some embodiments of this application, each loaded metal layer 40 is arranged in a circular shape with equal angles around the central axis of the medium body 21. Correspondingly, since the loaded metal layer 40 is disposed on the inner wall of the blind hole 221, each blind hole 221 is also arranged in a circular shape with equal angles around the central axis of the medium body 21.

[0107] By adopting the above scheme, and by arranging each loaded metal layer 40 in a circular pattern at equal angles around the central axis of the dielectric body 21 (i.e., in a circular array), the distribution of each loaded metal layer 40 on the periphery of the dielectric body 21 can be balanced. This can promote the balanced loading of metal on the circumference of each loaded metal layer 40 in the dielectric resonator 20, thereby evenly lowering the resonant frequency. This can optimize the resonance balance of the HE dual-mode, facilitate the precise design of "the resonant frequency of the HE dual-mode is within the passband and close to the same desired frequency band", and optimize the performance of the multimode resonator.

[0108] Please see Figure 10 , Figure 11 In some embodiments of this application, each loaded metal layer 40 is replicated by rotating around the central axis of the medium body 21.

[0109] It should be noted that each loaded metal layer 40 is a copy obtained by rotating around the central axis of the medium body 21. That is, each loaded metal layer 40 can rotate around the central axis of the medium body 21 to coincide with other loaded metal layers 40, meaning that each loaded metal layer 40 is a copy obtained by rotating other loaded metal layers 40 around the central axis of the medium body 21 by a certain angle. Correspondingly, since the loaded metal layers 40 are disposed on the inner wall of the blind vias 221, each blind via 221 is also a copy obtained by rotating around the central axis of the medium body 21. That is, each blind via 221 can rotate around the central axis of the medium body 21 to coincide with other blind vias 221, meaning that each blind via 221 is a copy obtained by rotating other blind vias 221 around the central axis of the medium body 21 by a certain angle.

[0110] Based on the previous embodiment, by adopting the above scheme, each loaded metal layer 40 is replicated by rotating around the central axis of the dielectric body 21, so that the content of each loaded metal layer 40 is basically the same and consistent. Based on this, each loaded metal layer 40 can be loaded with metal more evenly in the circumference of the dielectric resonator 20, so as to lower the resonant frequency more evenly. This can optimize the resonance balance of HE dual mode, and facilitate the precise design of "the resonant frequency of HE dual mode is in the passband range and close to the same desired frequency band", thus optimizing the performance of multimode resonator.

[0111] Please see Figure 8 In some embodiments of this application, the resonator housing 10 has a first plate 12 and a second plate 13 disposed opposite to each other along the axial direction of the dielectric resonator 20, the dielectric resonator 20 being spaced apart from the first plate 12 and spaced apart from the second plate 13.

[0112] It should be noted that, along the axial direction of the dielectric resonator 20, the dielectric resonator 20 is spaced apart from both the first plate 12 and the second plate 13. The distance between the dielectric resonator 20 and the first plate 12 may be the same as or different from the distance between the dielectric resonator 20 and the second plate 13.

[0113] By adopting the above scheme, and by spacing the dielectric resonator 20 from the first plate 12 and from the second plate 13, the dielectric resonator 20 can be connected to the first plate 12 and the second plate 13 without grounding, thus preventing the introduction of the TM mode resonance mode into the vicinity of the passband. Based on this, the multimode resonator can operate in a single-cavity uncoupled TM mode resonance mode, and can primarily support the required HE mode resonance mode. This reduces the mode complexity of the multimode resonator, reduces mode interference, makes the frequency response of the multimode resonator pure and controllable, and improves the filtering performance and frequency selectivity of the multimode resonator.

[0114] In the absence of other designs that introduce the TE-mode resonant mode to the vicinity of the passband, the multimode resonator in this embodiment is an HE dual-mode resonator.

[0115] Please see Figure 9 In some embodiments of this application, the resonator housing 10 has a first plate 12 and a second plate 13 disposed opposite to each other along the axial direction of the dielectric resonator 20. The dielectric resonator 20 is disposed in abutment with the first plate 12 and in abutment with the second plate 13. The multimode resonator has at least three resonance modes: HE mode and TM mode.

[0116] It should be noted that, along the axial direction of the dielectric resonator 20, the dielectric resonator 20 is disposed in contact with both the first plate 12 and the second plate 13, that is, the dielectric resonator 20 is grounded and connected between the first plate 12 and the second plate 13. The dielectric resonator 20 can abut against the first plate 12 or the second plate 13 via the dielectric body 21, or via the dielectric foot 22. Alternatively, other dielectric portions can be provided on the dielectric body 21 or the dielectric foot 22 to abut against the first plate 12 or the second plate 13 via these dielectric portions.

[0117] By adopting the above scheme, and by abutting the dielectric resonator 20 against the first plate 12 and the second plate 13, the dielectric resonator 20 can be grounded and connected to both the first plate 12 and the second plate 13, thereby introducing the TM mode resonance mode to the vicinity of the passband. Based on this, the resonant frequency of the TM mode can be made close to the resonant frequency of the HE mode, approaching the same frequency band and falling within the passband range. This facilitates the realization of at least three high-Q resonant modes in a single-cavity coupled HE mode and TM mode in a multimode resonator, increasing the mode diversity of the multimode resonator, enabling complex filtering characteristics, achieving low-loss and high-performance filtering effects, improving the filtering performance, frequency selectivity, and versatility of the multimode resonator, and meeting a wide range of application needs.

[0118] Furthermore, this multimode resonator can achieve at least a third-order filtering effect, which is equivalent to the filtering effect of at least three single-mode resonators, or the filtering effect of at least three microwave resonators. This can improve the performance and space utilization of the multimode resonator, and facilitate miniaturization and integration.

[0119] In the absence of other designs that introduce the TE mode resonant mode to the vicinity of the passband, the multimode resonator in this embodiment is an HE-TM three-mode resonator.

[0120] Please see Figure 1 Some embodiments of this application provide a filter, including the multimode resonator provided in the embodiments of this application.

[0121] It should be noted that the filter may include one or more resonators, and at least one resonator is a multimode resonator provided in the embodiments of this application. When there are multiple resonators, the multiple resonators can be arranged and designed to form adjacent coupling and cross coupling as needed.

[0122] By adopting the above scheme, the filter can improve its performance and power capacity, reduce insertion loss, and reduce size by using the multimode resonator provided in the embodiments of this application.

[0123] The above are merely optional embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

Claims

1. A multimode resonator, characterized in that, The multimode resonator has at least two resonance modes: HE mode and H mode. The multimode resonator includes: Resonator housing; A dielectric resonator includes a dielectric body and at least three dielectric feet connected to the periphery of the dielectric body; Ground plane components are provided one-to-one with the dielectric pins and connected to the end of the dielectric pin away from the dielectric body; the dielectric resonator and each of the ground plane components are provided inside the resonator housing, and the ground plane components are grounded and connected to the inner wall of the resonator housing.

2. The multimode resonator as described in claim 1, characterized in that, The ground plane component is separately connected to the resonator housing.

3. The multimode resonator as described in claim 1, characterized in that, Each of the dielectric feet is arranged in a circle at equal angles around the central axis of the dielectric body, and each of the grounding plate members is arranged in a circle at equal angles around the central axis of the dielectric body. One of the polarization directions of the HE mode is along the extension direction of one of the dielectric feet.

4. The multimode resonator as described in claim 3, characterized in that, Each of the aforementioned media feet is replicated by rotating around the central axis of the media body, and each of the aforementioned grounding plate components is replicated by rotating around the central axis of the media body.

5. The multimode resonator as described in claim 1, characterized in that, The number of the grounding plate components is odd.

6. The multimode resonator as described in claim 5, characterized in that, The grounding plate component has 3 or 5 parts.

7. The multimode resonator as described in any one of claims 1-6, characterized in that, The resonator housing has a first plate and a second plate disposed opposite to each other along the axial direction of the dielectric resonator, and the grounding plate abuts between the first plate and the second plate.

8. The multimode resonator as described in any one of claims 1-6, characterized in that, The dielectric foot has a blind hole on its end face facing the ground plane component. At least a portion of the inner wall of the blind hole is covered with a loading metal layer, which is electrically connected to the ground plane component.

9. The multimode resonator as described in claim 8, characterized in that, The entire inner wall of the blind hole is covered with the loaded metal layer; And / or, each of the loaded metal layers is arranged in a circular pattern at equal angles around the central axis of the medium body.

10. The multimode resonator as described in any one of claims 1-6, characterized in that, The resonator housing has a first plate and a second plate disposed opposite to each other along the axial direction of the dielectric resonator. The dielectric resonator is spaced apart from the first plate and spaced apart from the second plate.

11. The multimode resonator as described in any one of claims 1-6, characterized in that, The resonator housing has a first plate and a second plate arranged opposite to each other along the axial direction of the dielectric resonator. The dielectric resonator is abutted against the first plate and the second plate. The multimode resonator has at least three resonance modes: HE mode and TM mode.

12. A filter, characterized in that, Including the multimode resonator as described in any one of claims 1-11.

Images