Display panel, display panel manufacturing method, and display device

Abstract

To provide a display panel capable of reducing damages of a signal wiring in a non-display region.SOLUTION: A display panel contains a display region AA and a non-display region NA, and at least one part of the non-display region NA is provided so as to surround the display region AA. The display panel contains: a substrate 10; a wiring layer 40; a light emitting layer; and an isolation structure 20. The wiring layer 40 is positioned on one side of the substrate 10, and the wiring layer 40 contains a metal layer positioned to the display region AA, and a signal wiring layer 41 that is positioned to the non-display region NA. The light emitting layer is positioned to the side facing to the substrate 10 of the wiring layer 40, and the light emitting layer contains a plurality of light emitting units 30. The isolation structure 20 is positioned to a position facing to the substrate of the wiring layer 40, and an isolation opening for housing each light emitting unit 30 to the isolation structure 20 is provided. The isolation structure 20 is electrically connected to the signal wiring layer 41, and provides a protection part 50 facing to the substrate 10 of at least one part of the signal wiring layer 41.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to the field of display technology, and more particularly to a display panel, a method for manufacturing a display panel, and a display device. [Background technology]

[0002] Flat display panels, such as organic light-emitting diode (OLED) panels and display panels using light-emitting diode (LED) devices, have advantages such as high image quality, low power consumption, thin body, and wide range of applications, and are therefore widely used in various consumer electronic products such as mobile phones, televisions, personal digital assistants, digital cameras, laptops, and desktop computers, becoming the mainstream display device.

[0003] However, current organic light emitting diode display panels still have the problem of signal failure. Summary of the Invention [Problem to be solved by the invention]

[0004] SUMMARY OF THE INVENTION Embodiments of the present invention provide a display panel, a manufacturing method of a display panel, and a display device that can reduce the possibility of damaging signal wiring in a non-display area. [Means for solving the problem]

[0005] In a first aspect, an embodiment of the present invention provides a display panel including a display area and a non-display area, at least a portion of which surrounds the display area, the display panel including a substrate, a wiring layer, a light-emitting layer, and an isolation structure. The wiring layer is located on one side of the substrate, and includes a metal layer located in the display area and a signal line layer located in the non-display area. The isolation structure is located on a side of the wiring layer facing away from the substrate, and an isolation opening is provided in the isolation structure for accommodating a light-emitting unit. The isolation structure is electrically connected to the signal line layer, and a protective portion is provided on a side of at least a portion of the signal line layer facing away from the substrate.

[0006] In some embodiments, the signal line layer includes a first surface located on a side facing away from the substrate and second surfaces connected to both sides of the first surface and extending toward the substrate, and the protective portion covers the first surface and the second surface.

[0007] In some embodiments, the signal line layer and the metal layer are provided in the same layer and are made of at least a part of the same material.

[0008] In some embodiments, the wiring layer further includes a conductive connection portion located in the display area, the substrate includes a driving circuit, and the display panel further includes a first electrode, the first electrode being located on the side of the conductive connection portion facing away from the driving circuit, and the first electrode and the driving circuit being connected via the conductive connection portion.

[0009] In some embodiments, the display panel further includes a pixel definition layer, the pixel definition layer being disposed on the substrate, the pixel definition layer including pixel limiting portions and pixel openings defined by the pixel limiting portions, the pixel openings and the isolation openings penetrating therethrough to accommodate light-emitting units, the orthogonal projection of an inner wall of each pixel opening on the substrate being located within the orthogonal projection of an inner wall of each isolation opening on the substrate, and at least a portion of the protective portion and the pixel limiting portion being made of the same material.

[0010] In some embodiments, the isolation structure is provided on a side of the pixel limiting portion that is remote from the substrate, or an accommodation groove is provided in the pixel limiting portion, and the isolation structure is provided in the accommodation groove.

[0011] In some embodiments, the material of the protective portion comprises an inorganic material.

[0012] In some embodiments, a via hole is provided in the pixel limiting portion, and the signal line layer is electrically connected to the isolation structure through the via hole.

[0013] In some embodiments, the substrate further includes a planarization layer, and the protective portion includes a first sub-layer and a second sub-layer stacked along the thickness direction of the substrate, the first sub-layer and the planarization layer being made of the same material, and the second sub-layer and the pixel limiting portion being made of the same material.

[0014] In some embodiments, the isolation structure includes a first isolation portion and a second isolation portion located on a side of the first isolation portion away from the substrate, and an orthogonal projection of the first isolation portion on the substrate is located within an orthogonal projection of the second isolation portion on the substrate. The display panel further includes a conductive portion located in the non-display area, the conductive portion being located on a side of the protection portion facing away from the signal line layer and being made of the same material as the first isolation portion.

[0015] In some embodiments, the material of the conductive portion comprises molybdenum or aluminum.

[0016] In some embodiments, the isolation structure further includes a third isolation portion, the first isolation portion is located between the third isolation portion and the second isolation portion, and the conductive portion is made of the same material as the third isolation portion.

[0017] In a second aspect, an embodiment of the present invention provides a method for manufacturing a display panel, including the steps of: forming a wiring layer on one side of a substrate, the wiring layer including a metal layer located in a display area and a signal line layer located in a non-display area; forming a protective material layer on the side of the signal line layer facing away from the substrate, and performing a patterning process on the protective material layer to form a protective portion on the side of the signal line layer facing away from the substrate; and forming an isolation structure on the side of the wiring layer facing away from the substrate, so as to form an isolation opening surrounded by the isolation structure and for accommodating a light-emitting unit.

[0018] In some embodiments, in the step of forming a protective material layer on a side of the signal line layer facing away from the substrate and patterning the protective material layer to form a protective portion located on a side of the signal line layer away from the substrate, the protective material layer is patterned to further form a pixel limiting portion and a pixel opening, the pixel opening and the isolation opening penetrate each other to accommodate a light-emitting unit, the orthogonal projection of the inner wall of each pixel opening on the substrate is located within the orthogonal projection of the inner wall of each isolation opening on the substrate, the pixel opening is for accommodating the light-emitting unit, and at least a part of the protective portion and the pixel limiting portion are made of the same material.

[0019] In a third aspect, an embodiment of the present invention provides a display device including the display panel described above. [Effects of the Invention]

[0020] The present invention provides a display panel, a manufacturing method for the display panel, and a display device, wherein in the manufacturing process of the display panel, the manufacturing of the signal line layer is performed before the manufacturing of the isolation structure, and before the manufacturing of the isolation structure or the manufacturing of the subsequent film layer of the signal line layer, a protective part is further manufactured on the side of the signal line layer facing away from the substrate, thereby reducing the possibility that the isolation structure or other subsequent film layer will erode and damage the signal line layer during the manufacturing process, and improving the reliability of the display panel.

[0021] Other features, objects and advantages of the present invention will become apparent from the following detailed description of non-limiting embodiments, taken in conjunction with the drawings. [Brief explanation of the drawings]

[0022] In the drawings, the same elements are designated by the same reference numerals, and the drawings are not drawn to scale. Here, the same or similar reference numerals indicate the same or similar features. [Figure 1] 1 is a structural schematic diagram of a display panel according to an embodiment of the present invention; [Figure 2] 2 is a diagram showing the relative positional relationship between the isolation structures at Q locations and the first signal line in FIG. 1; FIG. [Figure 3]FIG. 3 is a schematic cross-sectional view of the AA portion in FIG. 2. [Figure 4] 10 is a schematic cross-sectional view of the structure of still another display panel taken along the line AA in accordance with an embodiment of the present invention. FIG. [Figure 5] 10 is a schematic cross-sectional view of the structure of still another display panel taken along the line AA in accordance with an embodiment of the present invention. FIG. [Figure 6] 1 is a schematic cross-sectional view of a display panel according to an embodiment of the present invention; [Figure 7] 10 is a schematic cross-sectional view of the structure of still another display panel taken along the line AA in accordance with an embodiment of the present invention. FIG. [Figure 8] 10 is a schematic cross-sectional view of the structure of still another display panel taken along the line AA in accordance with an embodiment of the present invention. FIG. [Figure 9] 10 is a schematic cross-sectional view of the structure of still another display panel taken along the line AA in accordance with an embodiment of the present invention. FIG. [Figure 10] 1 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention. [Figure 11A] 5A to 5C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present invention. [Figure 11B] 5A to 5C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present invention. [Figure 11C] 5A to 5C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present invention. [Figure 12A] 10A to 10C are schematic diagrams illustrating manufacturing steps of a manufacturing method for still another display panel according to an embodiment of the present invention. [Figure 12B] 10A to 10C are schematic diagrams illustrating manufacturing steps of a manufacturing method for still another display panel according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0023] Features and exemplary embodiments of each aspect of the present invention are described in detail below. In the following detailed description, numerous specific details are presented to provide a thorough understanding of the present invention. However, it will be apparent to one skilled in the art that the present invention may be practiced without the need for some of these specific details. The following description of the embodiments is merely intended to provide examples of the present invention and to provide a better understanding of the present invention. In the drawings and the following description, at least some known structures and techniques are not shown to avoid unnecessarily obscuring the present invention. Also, the dimensions of some structures may be exaggerated for clarity. Furthermore, the features, structures, or characteristics described below may be combined in any suitable manner in one or more embodiments.

[0024] In describing this invention, unless otherwise specified, "plurality" means two or more. Terms such as "upper," "lower," "left," "right," "inner," and "outer" imply orientation or positional relationships solely for the convenience and simplicity of the description of this invention and do not indicate or imply that a specified device or element must have a particular orientation, be configured, or operate in a particular orientation, and therefore should not be understood as limiting the invention. Furthermore, terms such as "first," "second," and the like are used for descriptive purposes only and should not be understood as indicating or implying relative importance.

[0025] Any directional terms used in the following description refer to the directions shown in the drawings and do not limit the specific structure of the embodiments of the present invention. In the description of the present invention, unless otherwise clearly specified or limited, the terms "attached" and "connected" should be understood in a broad sense. For example, they may be fixedly connected, detachably connected, or integrally connected. They may be directly connected or indirectly connected. Those skilled in the art can understand the specific meanings of the above terms in the present invention according to specific circumstances.

[0026] In the related art, various circuit structures are usually arranged at the frame position of a display panel to meet the normal operation requirements of the display panel, and after these circuit structures are manufactured, other structures are usually manufactured in the display area, and the manufacturing process of these other structures will erode the circuit structures, thereby damaging the circuit structures themselves and causing problems such as a reduction in signal transmission effect and even failure.

[0027] Therefore, to solve the above problems, in a first aspect, embodiments of the present invention provide a display panel, a method for manufacturing a display panel, and a display device.

[0028] Fig. 1 is a structural schematic diagram of a display panel according to an embodiment of the present invention. Fig. 2 is a schematic diagram of the relative positional relationship between the isolation structure at a position Q in Fig. 1 and a first signal line. Fig. 3 is a cross-sectional structural schematic diagram of a position AA in Fig. 2.

[0029] As shown in FIGS. 1 to 3, the display panel according to the present invention includes a display area AA and a non-display area NA, with at least a portion of the non-display area NA surrounding the display area AA. The display panel includes a substrate 10, a wiring layer 40, a light-emitting layer, and an isolation structure 20. The wiring layer 40 is located on one side of the substrate 10. The wiring layer 40 includes a metal layer located in the display area AA and a signal line layer 41 located in the non-display area NA. The isolation structure 20 is located on the side of the wiring layer 40 facing away from the substrate 10, and is provided with an isolation opening 21 for accommodating a light-emitting unit 30. The isolation structure 20 is electrically connected to the signal line layer 41, and a protective portion 50 is provided on at least a portion of the signal line layer 41 facing away from the substrate 10.

[0030] The display panel has at least two regions: a display region AA and a non-display region NA. The display region AA is the main region for realizing the display effect of the display panel, and the non-display region NA is located on the outer periphery of the display region AA and is mainly used for arranging signal lines in the display panel. The sizes and shapes of the display region AA and the non-display region NA are not limited in the embodiments of the present invention. For example, the display region AA may have a rectangular structure, and the non-display region NA is located on at least one side of the display region AA in the circumferential direction, and the non-display region NA may have a ring-shaped, semi-ring-shaped, or strip-shaped structure.

[0031] The substrate 10 mainly functions as a support / mounting device, and other film layers are sequentially stacked on the substrate 10. The term "stacking" as used herein refers to the fact that other film layers are sequentially stacked along the thickness direction Y of the substrate 10. Here, the substrate 10 may include multiple film layer structures, and the specific configuration of the film layer structure of the substrate 10 is not limited to the embodiments of the present invention. Furthermore, the thickness direction Y of other film layers located on the substrate 10 side generally coincides with the thickness direction Y of the substrate 10 itself, and therefore, for convenience of explanation, the thickness direction Y of the substrate 10 or the thickness direction Y of other film layers described below in the embodiments of the present invention will all be shown as the same direction.

[0032] The isolation structure 20 is located on the side of the wiring layer 40 facing away from the substrate 10. The isolation structure 20 surrounds and forms isolation openings 21 for accommodating the light-emitting units 30, which are one of the main devices for realizing light-emitting display. The light-emitting units 30 include, but are not limited to, a red light-emitting unit that emits red light, a blue light-emitting unit that emits blue light, and a green light-emitting unit that emits green light. Each light-emitting unit 30 may include a hole injection layer (HIL), a hole transport layer (HTL), a light-emitting layer, an electron injection layer (EIL), and an electron transport layer (ETL), which are stacked one on the other.

[0033] The isolation openings 21 formed by being surrounded by the isolation structures 20 can accommodate the light-emitting units 30. In other words, the orthogonal projections of the light-emitting units 30 on the substrate 10 and the orthogonal projections of the isolation openings 21 on the substrate 10 at least partially overlap, and at least a portion of the orthogonal projections of the light-emitting units 30 on the substrate 10 is located within the orthogonal projections of the isolation openings 21 on the substrate 10. Furthermore, during the manufacturing process of the light-emitting units 30, the presence of the isolation structures 20 allows the luminescent material to be separated into independent light-emitting units 30 by the isolation structures 20, eliminating the need for a precision metal mask deposition process.

[0034] For example, in the case where the red light-emitting units are manufactured before the green light-emitting units are manufactured, in order to omit the need for a precision metal mask, a red light-emitting material corresponding to the red light-emitting units is first dropped into each isolation opening 21, and then a portion of the red light-emitting material in the isolation opening 21 is selectively etched away to leave a portion of the red light-emitting material in the isolation opening 21, thereby forming the red light-emitting units. After that, a green light-emitting material corresponding to the green light-emitting units 30 is dropped into each isolation opening 21, and then a portion of the green light-emitting material in the isolation opening 21 is selectively etched away to leave a portion of the green light-emitting material in the isolation opening 21, thereby forming the green light-emitting units.

[0035] Furthermore, the display panel may include a second electrode 70, and the second electrode 70 and the first electrode 60 may be provided on both sides of the light-emitting unit, respectively, and the second electrode 70 may be provided electrically connected to the isolation structure 20. That is, the isolation structure 20 may include a conductive material, and the second electrode 70 and the conductive material in the isolation structure 20 may communicate with each other, so that the second electrodes in different isolation openings are interconnected via the isolation structure to form a plane electrode. Preferably, the second electrode 70 may be a cathode.

[0036] The conductive material for electrically connecting to the second electrodes 70 within the isolation structure 20 may be arranged in a grid pattern within the display area, so that the isolation structure 20 can interconnect each second electrode 70 within the display area as a planar electrode. Alternatively, the conductive material for electrically connecting to the second electrodes 70 within the isolation structure 20 may be separated into a plurality of independent conductive sections. That is, at least some different second electrodes 70 may receive or transmit power signals of different voltage magnitudes via the isolation structure 20, thereby achieving independent or compartmentalized control of the light-emitting units 30, although embodiments of the present invention are not limited thereto.

[0037] The wiring layer 40 is provided on one side of the substrate 10, and includes a signal line layer 41 located in the non-display area NA, i.e., the signal line layer 41 is insulated from other conductive film layers on the substrate 10 via an insulating layer. Preferably, a driving chip IC is further provided in the non-display area NA of the display panel, and the signal line layer 41 is located between the driving chip IC and the display area AA. Preferably, the material of the signal line layer 41 includes a conductive material, and for example, the material of the signal line layer 41 includes a metallic material.

[0038] The signal line layer 41 is used to transmit a corresponding power supply signal to the second electrode 70. In the related art, the second electrode 70 is provided over the entire surface of the display area, and the signal line layer 41 for electrically connecting to the second electrode 70 is usually located within the non-display area NA and is arranged in a ring-shaped structure so as to surround the outer periphery of the second electrode 70. This arrangement causes the first electrode 60 to occupy more space than necessary at the frame position of the display panel, which is detrimental to achieving a narrow frame effect.

[0039] In this embodiment of the present invention, the signal line layer 41 is not directly connected to the second electrodes 70, but transmits power signals to each second electrode 70 via the isolation structures 20. Specifically, the isolation structures 20 themselves are provided corresponding to each second electrode 70, enabling signal transmission between the two. Therefore, the signal line layer 41 does not need to extend to the position of each second electrode 70, i.e., the signal line layer 41 does not need to be arranged around each second electrode 70. Instead, the signal line layer 41 is arranged on one side of the isolation structures 20 along the first direction X and electrically connected to the isolation structures 20. In this way, the power signals located within the signal line layer 41 are transmitted to each second electrode 70 via the isolation structures 20, thereby satisfying the signal transmission requirements. Furthermore, since the signal line layer 41 is not annular but is only arranged on one side of the isolation structures 20 along the first direction X, this helps reduce the frame size of the display panel and improve the display effect. Preferably, the first direction X may intersect with the thickness direction Y.

[0040] The embodiment of the present invention is not limited to a specific wiring form of the signal line layer 41. Furthermore, depending on the actual situation, the signal line layer 41 may be entirely located on one side of the isolation structure 20 along the first direction X, or a small number of signal line layers 41 may be located on the other side of the isolation structure 20 along a different direction, as long as most of the signal line layers 41 are located on the same side of the isolation structure 20.

[0041] In the manufacturing process of the display panel according to the embodiment of the present invention, the signal line layer 41 is manufactured before the isolation structure 20 is manufactured, and before manufacturing the isolation structure 20 or the subsequent film layers of the signal line layer 41, a protective portion 50 is further manufactured on the side of the signal line layer 41 facing away from the substrate 10. This reduces the possibility that the isolation structure 20 or other subsequent film layers will erode and damage the signal line layer 41 during the manufacturing process, and improves the reliability of the display panel.

[0042] In some embodiments, as shown in FIG. 3, the signal line layer 41 includes a first surface 411 located on the side facing away from the substrate 10 and a second surface 412 connected to both sides of the first surface 411 and extending toward the substrate 10, and the protective portion 50 covers the first surface 411 and the second surface 412.

[0043] The embodiment of the present invention is not limited to the specific dimensions and shape of the signal line layer 41. For example, the cross section of the signal line layer 41 may be rectangular or trapezoidal to reduce the electrical resistance of the signal line layer 41. Taking the cross section of the signal line layer 41 as an example, assuming that it has a trapezoidal shape, the first surface 411 and the second surface 412 of the signal line layer 41 may be the upper base and legs of the trapezoid.

[0044] In an embodiment of the present invention, by providing the protective portion 50 to cover the first surface 411 and the second surface 412, the possibility that the isolation structure 20 or other film layers will erode the signal line layer 41 during the manufacturing process can be further reduced, and the possibility that the signal line layer 41 will be damaged can be reduced.

[0045] In some embodiments, the signal line layer 41 and the metal layer are provided in the same layer and are made of at least some of the same material so that the signal line layer 41 and the metal layer can be manufactured and shaped in the same process step.

[0046] FIG. 4 is a schematic cross-sectional view of the structure of still another display panel according to an embodiment of the present invention, taken along the line AA.

[0047] In some embodiments, as shown in FIG. 4, the wiring layer 40 further includes a conductive connection 42 located in the display area AA, the substrate 10 includes a driving circuit 11, and the display panel further includes a first electrode 60 located between the light-emitting layer and the substrate, the first electrode 60 being located on the side of the conductive connection 42 facing away from the driving circuit 11, and the first electrode 60 and the driving circuit 11 being connected via the conductive connection 42.

[0048] Preferably, the first electrode 60 and the second electrode 70 are provided on opposite sides of the light-emitting unit 30 in the thickness direction Y, a plurality of first electrodes 60 are provided, each corresponding to a respective light-emitting unit 30, and the first electrode 60 and the second electrode 70 drive and control whether or not the light-emitting unit 30 emits light. Illustratively, the first electrode 60 is an anode, and the second electrode 70 is a cathode. Furthermore, a plurality of insulating layers may be provided between the first electrodes 60 and the drive circuit 11, through holes may be provided in the insulating layers, and the conductive connection portion 42 may connect the first electrodes 60 and the drive circuit 11 via the through holes.

[0049] Preferably, the material of the conductive connection portion 42 is the same as the material of the signal line layer 41. Illustratively, the conductive connection portion 42 and the signal line layer 41 are manufactured and shaped in the same process step.

[0050] Note that the signal line layer 41 may be located entirely within the non-display area NA, or may partially extend into the display area AA. Similarly, the isolation structure 20 may be located entirely within the display area AA, or may partially extend into the non-display area NA. Similarly, the conductive connection 42 may be located entirely within the display area AA, or may partially extend into the non-display area NA.

[0051] In some embodiments, as shown in Figures 3 and 4, the display panel further includes a pixel definition layer 80, which is disposed on the substrate 10, and which includes a pixel limiting portion 81 and a pixel opening 82 defined by the pixel limiting portion 81, and the pixel opening 82 penetrates the isolation openings 21 to accommodate the light-emitting unit 30, and the orthogonal projection of each pixel opening 82 on the substrate 10 is located within the orthogonal projection of each isolation opening 21 on the substrate 10, and at least a portion of the protective portion 50 and the pixel limiting portion 81 are made of the same material.

[0052] The pixel definition layer 80 includes a pixel limiting portion 81 and a pixel opening 82, and the pixel opening 82 is arranged corresponding to the isolation opening 21. For example, the orthogonal projection of the pixel opening 82 on the substrate 10 may be located within the orthogonal projection of the isolation opening 21 on the substrate 10, and some structures in the light-emitting unit 30 and the second electrode 70 may be located within the pixel opening 82.

[0053] In some examples, at least a portion of the protective portion 50 and the pixel limiting portion 81 may be made of the same material, that is, the protective portion 50 and the pixel limiting portion 81 may be manufactured and shaped in the same process step.

[0054] As can be seen from the above, the signal line layer 41 and the conductive connection portion 42 are manufactured and formed in the same process step, and therefore by making the distance between the signal line layer 41 and the substrate on the substrate 10 the same as the distance between the conductive connection portion 42 and the substrate on the substrate 10, the distance between the protective portion 50 and the substrate can be made equal to or less than the distance between the pixel limiting portion 81 and the substrate, thereby improving the effect of the protective portion 50 on the thickness of the film layer in the non-display area NA and reducing the overall thickness of the film layer in the non-display area NA.

[0055] FIG. 5 is a schematic cross-sectional view of the structure of still another display panel according to an embodiment of the present invention taken along the line AA.

[0056] In some embodiments, as shown in Figures 4 and 5, the isolation structure 20 is provided on the side of the pixel limiting portion 81 that is away from the substrate 10, or an accommodating groove 811 is provided in the pixel limiting portion 81, and the isolation structure 20 is provided in the accommodating groove 811.

[0057] The isolation structure 20 is provided on the side of the pixel limiting portion 81 away from the substrate 10, i.e., the orthogonal projection of the isolation structure 20 on the substrate 10 is within the orthogonal projection of the pixel limiting portion 81 on the substrate 10, thereby improving the blocking effect of the isolation opening 21 formed by being surrounded by the isolation structure 20.

[0058] An accommodation groove 811 may be provided in the pixel limiting portion 81, and the accommodation groove 811 may be formed by being recessed from the side of the pixel limiting portion 81 facing away from the substrate 10. Preferably, the recess depth of the accommodation groove 811 may be the same as or different from the recess depth of the pixel opening 82. Preferably, the accommodation groove 811 may be provided so as to penetrate the pixel limiting portion 81.

[0059] Preferably, one or more receiving grooves 811 may be provided between two adjacent pixel openings 82. By providing the isolation structures 20 in the receiving grooves 811, the space occupied by the isolation structures 20 in the thickness direction Y of the display panel can be reduced, and the overall thickness of the display panel can be reduced.

[0060] In some embodiments, the material of the protective portion 50 includes an inorganic material, which allows the protective portion 50 to have good density and reduces the possibility of the protective portion 50 being eroded when it comes into contact with the isolation structure 20 or other film layer etching solution or etching gas, and the protective portion 50 exposes at least a portion of the signal line layer 41, thereby reducing the possibility of the signal line layer 41 being eroded and causing failure.

[0061] FIG. 6 is a schematic cross-sectional view of a display panel according to an embodiment of the present invention.

[0062] In some embodiments, as shown in FIG. 6, a via hole 43 is provided in the pixel limiting portion 81 , and the signal line layer 41 is electrically connected to the isolation structure 20 through the via hole 43 .

[0063] Optionally, a portion of the signal line layer 41 may extend to the display area AA, and a via hole is provided through the pixel limiting portion 81 along the thickness direction of the display panel.

[0064] In another example, a portion of the isolation structure 20 may be located in the non-display area NA, and a via hole may be provided in the protective part 50. Specifically, after the fabrication of the isolation structure 20 is completed, a via hole 43 may be formed in the protective part 50, and the portion of the isolation structure 20 located in the non-display area NA may be electrically connected to the signal line layer 41 through the via hole 43.

[0065] FIG. 7 is a schematic cross-sectional view of the structure of still another display panel according to an embodiment of the present invention taken along the line AA.

[0066] In some embodiments, as shown in FIG. 7, the substrate 10 further includes a planarization layer 12, and the protective portion 50 includes a first sublayer 51 and a second sublayer 52 stacked along the thickness direction Y of the substrate 10, where the first sublayer 51 is made of the same material as the planarization layer 12, and the second sublayer 52 is made of the same material as the pixel limiting portion 81.

[0067] Optionally, the first sub-layer 51 and the second sub-layer 52 of the protective part 50 may cover the same area of ​​the signal line layer 41. For example, the first sub-layer 51 covers the first surface 411 and the second surface 412 of the signal line layer 41, and the second sub-layer 52 covers the area of ​​the first sub-layer 51 corresponding to the first surface 411 and the second surface 412 of the signal line layer 41. Of course, the areas of the signal line layer 41 covered by the first sub-layer 51 and the second sub-layer 52 may be different. For example, the first sub-layer 51 covers the first surface 411 of the signal line layer 41, and the second sub-layer 52 covers the area of ​​the first sub-layer 51 corresponding to the first surface 411 of the signal line layer 41 and the second surface 412 of the signal line layer 41.

[0068] The first sub-layer 51 and the planarization layer 12 are formed using the same material, i.e., the first sub-layer 51 and the planarization layer 12 are manufactured and shaped in the same process step. The second sub-layer 52 is formed using the same material as the pixel limiting portion 81, i.e., the second sub-layer 52 is manufactured and shaped in the same process step as the pixel limiting portion 81. This reduces the possibility that the first sub-layer 51 will similarly react with other substances after the second sub-layer 52 reacts with other substances, and improves the reliability of the protection portion 50.

[0069] FIG. 8 is a schematic cross-sectional view of the structure of still another display panel according to an embodiment of the present invention, taken along the line AA.

[0070] 8 , the isolation structure 20 includes a first isolation portion 22 and a second isolation portion 23 located on a side of the first isolation portion 22 away from the substrate 10, and the orthogonal projection of the first isolation portion 22 on the substrate 10 is located within the orthogonal projection of the second isolation portion 23 on the substrate 10. The display panel further includes a conductive portion 90 located in the non-display area NA, the conductive portion 90 being located on a side of the protection portion 50 facing away from the signal line layer 41, and the conductive portion 90 being made of the same material as the first isolation portion 22.

[0071] The embodiments of the present invention are not limited to the specific dimensions and shapes of the first isolation portion 22 and the second isolation portion 23. For example, the isolation structure 20 may have a T-shaped cross section. This design contributes to preventing the luminescent material and electrode material from easily extending along the sidewall of the first isolation portion 22 to the sidewall of the second isolation portion 23 during the manufacturing process of the light emitting unit 30 and the second electrode 70. This makes it possible to manufacture and separate the light emitting units 30 and the second electrodes 70 within different isolation openings 21 without the need for a fine metal mask.

[0072] Regarding the material composition of the first isolation portion 22 and the second isolation portion 23, the embodiment of the present invention is not limited, and the first isolation portion 22 and the second isolation portion 23 may both include a conductive material, or the first isolation portion 22 may include a conductive material and the second isolation portion 23 may include an insulating material, as long as the two electrodes can realize signal transmission through the isolation structure 20.

[0073] The conductive portion 90 is used to connect the functional film layer in the display area AA of the driving chip IC to the driving chip IC, so that signals from the driving chip IC can be transmitted to the functional film layer. The conductive portion 90 is made of the same material as the first isolation portion 22, i.e., the conductive portion 90 is manufactured and shaped in the same process step as the first isolation portion 22. This allows the first isolation portion 22 and the conductive portion 90 to be manufactured simultaneously during the manufacturing process, thereby reducing manufacturing costs.

[0074] In some embodiments, the material of the conductive portion 90 may include molybdenum or aluminum to improve the conductive performance of the conductive portion 90 .

[0075] FIG. 9 is a schematic cross-sectional view of the structure of still another display panel according to an embodiment of the present invention, taken along the line AA.

[0076] In some embodiments, as shown in FIG. 9, the isolation structure 20 further includes a third isolation portion 24, the first isolation portion 22 is located between the third isolation portion 24 and the second isolation portion 23, and the conductive portion 90 is made of the same material as the third isolation portion 24.

[0077] The isolation structure 20 includes at least a first isolation portion 22, a second isolation portion 23, and a third isolation portion 24, and the embodiment of the present invention is not limited to the dimensions and shapes of the first isolation portion 22, the second isolation portion 23, and the third isolation portion 24. Illustratively, the orthogonal projection of the first isolation portion 22 on the substrate 10 is located within the orthogonal projection of the third isolation portion 24 on the substrate 10, i.e., the vertical cross-sectional shapes of the first isolation portion 22, the second isolation portion 23, and the third isolation portion 24 are U-shaped.

[0078] Similar to the first isolation portion 22, the third isolation portion 24 also includes a conductive material, and the second electrode 70 may be in direct contact with the third isolation portion 24 to establish electrical connection with the first isolation portion 22 via the third isolation portion 24. Optionally, the second electrode 70 is disposed so as to overlap the third isolation portion 24. Furthermore, the second electrode 70 may be partially located on the side of the third isolation portion 24 that is away from the substrate 10, and the provision of the third isolation portion 24 contributes to improving the reliability of the electrical connection between the second electrode 70 and the isolation structure 20.

[0079] The conductive portion 90 may be made of the same material as the third isolation portion 24, i.e., the conductive portion 90 may be made of the same material as the third isolation portion 24. As can be seen from the above, the conductive portion 90 may be made of the same material as the third isolation portion 24, and the conductive portion 90 may include a first sub-portion and a second sub-portion that are stacked along the thickness direction Y of the substrate 10. By making the first sub-portion and the third isolation portion 24 of the same material and making the second sub-portion and the first isolation portion 22 of the same material, the electrical resistance of the conductive portion 90 can be further reduced and the reliability of the conductive portion 90 can be improved.

[0080] In some examples, the conductive portion 90 may be made of the same material as only the first isolation portion 22. In other examples, the conductive portion 90 may be made of the same material as only the third isolation portion 24.

[0081] Fig. 10 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention. Figs. 11A to 11C are schematic views of the manufacturing process of a display panel according to an embodiment of the present invention. Figs. 12A and 12B are schematic views of the manufacturing process of yet another display panel according to an embodiment of the present invention.

[0082] In a second embodiment, as shown in FIG. 10, a method for manufacturing a display panel according to the present invention includes the following steps, and the display panel may be the display panel shown in FIGS.

[0083] In S100, a wiring layer 40 is formed on one side of the substrate 10, and the wiring layer 40 includes a metal layer located in the display area AA and a signal line layer 41 located in the non-display area NA.

[0084] 11A, in step S100, a wiring layer 40 is formed on one side of the substrate 10, i.e., a conductive material layer is provided on one side of the substrate 10, and a patterning process is performed on the conductive material layer to form a signal line layer 41 and a metal layer. Optionally, the material of the signal line layer 41 includes a titanium-aluminum-titanium three-layer metal structure.

[0085] In S200, a protective material layer D1 is formed on the side of the signal line layer 41 facing away from the substrate 10, and a patterning process is performed on the protective material layer D1 to form a protective portion 50 located on the side of the signal line layer 41 away from the substrate 10.

[0086] 11B, in step S200, after patterning the protective material layer D1, only the protective portion 50 may be formed, or other film layers in the display area AA may be formed together with the protective portion 50. Optionally, the protective material layer D1 may be manufactured by a process such as photolithography.

[0087] In S300, an isolation structure 20 is formed on the wiring layer 40 on the side facing away from the substrate 10, and an isolation opening 21 is formed surrounded by the isolation structure 20 to accommodate the light emitting unit 30.

[0088] In some embodiments, as shown in FIG. 11C , in step S300, in the manufacturing process of the isolation structure 20, in order to facilitate the manufacturing of the first isolation portion 22 and the second isolation portion 23, the first isolation portion 22 is manufactured by wet etching, and a protective portion 50 may be provided covering the surface of the signal line layer 41 to reduce the possibility that the etching solution used in the manufacturing process of the first isolation portion 22 will corrode the metal material and corrode the signal line layer 41.

[0089] In S400, a light-emitting unit is formed in the isolation opening.

[0090] 11C, in step S400, light-emitting units 30 of different colors are formed in the isolation openings 21. Exemplarily, a red light-emitting unit, a green light-emitting unit, and a blue light-emitting unit are formed in each of the isolation openings 21. In forming the light-emitting units 30, an isolation structure may be used instead of a precision metal mask.

[0091] In some embodiments, as shown in FIGS. 11C, 12A and 12B, step S200 includes the following steps:

[0092] In S210, the protective material layer D1 is patterned to further form pixel limiting portions 81 and pixel openings 82, the pixel openings 82 and the isolation openings 21 penetrate to accommodate the light-emitting units 30, the orthogonal projection of the inner wall of each pixel opening 82 on the substrate 10 is located within the orthogonal projection of the inner wall of each isolation opening 21 on the substrate 10, and at least a portion of the protective portions 50 and the pixel limiting portions 81 are made of the same material.

[0093] In some embodiments, in step S210, the pixel limiting portion 81 and the pixel opening 82 may be fabricated before the isolation structure 20 is fabricated, or the pixel limiting portion 81 and the pixel opening 82 may be fabricated after the isolation structure 20 is fabricated. In the embodiments of the present invention, the pixel limiting portion 81 and the pixel opening 82 are fabricated after the isolation structure 20 is fabricated. As shown in FIG. 12A , the protective material layer D1 can cover the display area AA and the non-display area NA. As shown in FIG. 12B , the protective material layer D1 is patterned to form a pixel defining material layer D2 and a protective portion, and the isolation structure 20 is formed in the corresponding region of the pixel defining material layer D2 to form the pixel limiting portion 81 and the pixel opening 82, thereby reducing the possibility of damaging the signal line layer 41 and the first electrode 60 during the fabrication of the isolation structure 20.

[0094] In a third aspect, the present invention further provides a display device including any one of the display panels described above. Since the display device according to the embodiment of the present invention includes any one of the display panels described above, the display device according to the embodiment of the present invention has the beneficial effects of any one of the display panels described above, and the description thereof will be omitted here.

[0095] Display devices in embodiments of the present invention include, but are not limited to, devices with display capabilities such as mobile phones, personal digital assistants (abbreviated as PDAs), tablet computers, e-books, televisions, door controls, smart landlines, and consoles.

[0096] Although the present invention has been described above with reference to preferred embodiments, various modifications may be made and equivalents may be substituted for its components without departing from the scope of the present invention. In particular, the technical features described in each embodiment may be arbitrarily combined as long as there is no structural contradiction. The present invention is not limited to the specific embodiments disclosed in this specification, but includes all technical solutions encompassed by the claims. [Explanation of symbols]

[0097] 10 Substrate 11 Drive circuit 12 Planarization layer 20 Isolation structure 21 Isolation opening 22 1st isolation section 23 2nd isolation section 24 3rd Isolation Department 30 Lighting Unit 40 wiring layer 41 Signal Line Layer 411 1st surface 412 2nd surface 42 Conductive connection 43 Signal line connection part 50 Protection Department 51 First Sub-Layer 52 Second Sub-Layer 60 1st electrode 70 2nd electrode 80 Pixel Definition Layer 81 Pixel Limited Section 811 Storage groove 82 pixel aperture 90 Conductive part D1 Protective material layer D2 pixel definition material layer IC driver chip AA display area NA hidden area X 1st direction Y thickness direction

Claims

1. A display panel including a display area and a non-display area, wherein at least a part of the non-display area is provided so as to surround the display area, A substrate; a wiring layer located on one side of the substrate, the wiring layer including a metal layer located in the display area and a signal line layer located in the non-display area; a light-emitting layer located on a side of the wiring layer facing away from the substrate, the light-emitting layer including a plurality of light-emitting units; an isolation structure located on a side of the wiring layer facing away from the substrate, the isolation structure having an isolation opening for accommodating a light emitting unit; a protection portion is provided on at least a part of the signal line layer on a side facing away from the substrate; the signal line layer includes a first surface located on a side facing away from the substrate, and the protection portion covers the first surface; the display panel further includes a pixel definition layer, the pixel definition layer being provided on the substrate, the pixel definition layer including a pixel limiting portion and a pixel opening defined by the pixel limiting portion, and at least a portion of the protective portion and the pixel limiting portion being made of the same material.

2. the signal line layer further includes second surfaces connected to both sides of the first surface and extending toward the substrate, and the protection portion further covers the second surfaces; 2. The display panel according to claim 1, wherein the signal line layer and the metal layer are provided in the same layer and are made of at least a part of the same material.

3. the isolation structure is electrically connected to the signal line layer; The display panel of claim 1, characterized in that the metal layer includes a conductive connection portion, the substrate includes a driving circuit, the display panel further includes a first electrode located between the light-emitting layer and the substrate, the first electrode being located on the side of the conductive connection portion facing away from the driving circuit, and the first electrode and the driving circuit being connected via the conductive connection portion.

4. The pixel openings and the isolation openings penetrate to accommodate the light-emitting units, and the orthogonal projection of the inner wall of each pixel opening on the substrate is located within the orthogonal projection of the inner wall of each isolation opening on the substrate; the isolation structure is provided on a side of the pixel limiting portion that is away from the substrate, or an accommodation groove is provided in the pixel limiting portion, and the isolation structure is provided in the accommodation groove; the material of the protective portion includes an inorganic material; 2. The display panel according to claim 1, wherein a via hole is provided in the pixel limiting portion, and the signal line layer is electrically connected to the isolation structure through the via hole.

5. 5. The display panel of claim 4, wherein the substrate further includes a planarization layer, the protective portion includes a first sub-layer and a second sub-layer stacked along the thickness direction of the substrate, the first sub-layer and the planarization layer being made of the same material, and the second sub-layer and the pixel limiting portion being made of the same material.

6. the isolation structure includes a first isolation portion and a second isolation portion located on a side of the first isolation portion away from the substrate, and an orthogonal projection of the first isolation portion on the substrate is located within an orthogonal projection of the second isolation portion on the substrate; the display panel further includes a conductive portion located in the non-display area, the conductive portion being located on a side of the protection portion facing away from the signal line layer and being made of the same material as the first isolation portion; a vertical cross section of the first isolation portion is trapezoidal, and an area of ​​the first isolation portion on a side closer to the substrate is larger than an area of ​​the side farther from the substrate; 2. The display panel according to claim 1, wherein the light-emitting layer is not present on the side of the isolation structure that is farther from the substrate.

7. 7. The display panel of claim 6, wherein the isolation structure further includes a third isolation portion, the first isolation portion is located between the third isolation portion and the second isolation portion, and the conductive portion is made of the same material as the third isolation portion.

8. forming a wiring layer including a metal layer located in a display area and a signal line layer located in a non-display area on one side of a substrate; forming a protective material layer on a side of the signal line layer facing away from the substrate, and performing a patterning process on the protective material layer to form a protective portion located on a side of the signal line layer away from the substrate; forming an isolation structure on a side of the wiring layer facing away from the substrate, the isolation structure having an isolation opening for receiving a light emitting unit; forming the light emitting units in the isolation openings; the signal line layer includes a first surface located on a side facing away from the substrate, and the protection portion covers the first surface; a step of forming a protective material layer on a side of the signal line layer facing away from the substrate, and performing a patterning process on the protective material layer to form a protective portion located on the side of the signal line layer away from the substrate, further forming a pixel limiting portion and a pixel opening by performing a patterning process on the protective material layer, and at least a portion of the protective portion and the pixel limiting portion are made of the same material.

9. 9. The method for manufacturing a display panel according to claim 8, wherein in the steps of forming a protective material layer on a side of the signal line layer facing away from the substrate and patterning the protective material layer to form a protective portion located on a side of the signal line layer away from the substrate, the pixel openings and the isolation openings penetrate each other to accommodate the light-emitting units, and orthogonal projections of inner walls of each of the pixel openings on the substrate are located within orthogonal projections of inner walls of each of the isolation openings on the substrate, and the pixel openings are for accommodating the light-emitting units.

10. A display device comprising the display panel according to any one of claims 1 to 7.

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