electronic machines

Abstract

To provide a highly convenient electronic apparatus used on a body.SOLUTION: The electronic apparatus is used on an arm, and includes a display panel, a power storage device, a circuit, and a sealing body. The display panel performs display with electric power supplied from the power storage device. The circuit has an antenna and charges the power storage device wirelessly. The sealing body contains the display panel, the power storage device, and the circuit. The sealing body has a part that transmits a visible light. The sealing body is either worn by an arm or is connected to a structure wearable on an arm.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] One aspect of the present invention relates to an electronic device, and in particular to a wearable electronic device. , for example, in relation to wrist-worn electronic devices.

[0002] Note that one embodiment of the present invention is not limited to the above technical field. Examples of the semiconductor device include a semiconductor device, a display device, a light-emitting device, a power storage device, a memory device, an electronic device, a lighting device, Input devices (e.g., touch sensors), input / output devices (e.g., touch panels), etc. These driving methods or manufacturing methods can be cited as examples.

[0003] In this specification, the term "electronic device" refers to any device that operates by supplying power. Electro-optical devices and information terminal devices that have a power source (for example, a power storage device) are all electronic devices.

[0004] In this specification, the term "electricity storage device" refers to elements and devices in general that have an electricity storage function. Storage batteries (also called secondary batteries) such as lithium-ion secondary batteries, lithium-ion capacitors, and Electric double layer capacitors and the like are all energy storage devices. [Background technology]

[0005] In recent years, display devices and electronic devices that are worn on the human body have been proposed, and wearable displays have become popular. These devices are called play devices, wearable devices, etc. For example, head-mounted devices Development of displays and wrist-worn smartwatches is underway.

[0006] Patent Document 1 discloses a ring-shaped display device that can be worn on the human body.

[0007] Wearable devices are worn on the human body, making them highly portable and comfortable to wear. To achieve this, it is necessary to reduce the weight of the entire device, including the display panel, drive circuit, and power supply. It can be seen.

[0008] Wearable devices often have built-in power storage devices. For example, lithium-ion Secondary batteries are being actively developed because they can be made larger in capacity and smaller in size.

[0009] In addition, electroluminescence (EL) The light-emitting element (also called EL element) used can be easily made thin, lightweight, and flexible. It has the following characteristics: it can respond quickly to input signals, and it can be driven using a low-voltage DC power supply. It has the following characteristics and is one of the display elements suitable for wearable displays. [Prior art documents] [Patent documents]

[0010] [Patent Document 1] US Patent Application Publication No. 2015 / 0077438 Summary of the Invention [Problem to be solved by the invention]

[0011] Swimming, scuba diving, and other water sports (including marine sports), or There is a demand for wearable devices that can be used while bathing.

[0012] In addition, since wearable devices are used in a variety of environments, it is necessary to develop a device with a wide temperature range. For example, there is a demand for display panels and power storage devices on the dashboard or windows of automobiles. Do not store the product in direct sunlight, in a car parked in the hot sun, in a high temperature environment such as a desert, or on ice. In cold regions with rivers and other low-temperature environments, electronic devices may not function properly. do.

[0013] An object of one embodiment of the present invention is to provide an electronic device that can be used underwater. An object of one embodiment of the present invention is to provide an electronic device with high waterproofness. An object of one embodiment of the present invention is to provide an electronic device that is worn on the body when used. Another object of one embodiment of the present invention is to provide an all-weather electronic device. An object of one embodiment of the present invention is to provide a highly convenient electronic device. An object of one embodiment of the present invention is to provide a highly reliable electronic device. One aspect of the present invention aims to provide an electronic device that has high visibility regardless of the ambient brightness. It shall be one.

[0014] Another aspect of the present invention is to provide an electronic device that can be used in a wide temperature range. Another embodiment of the present invention is a small, lightweight, or flexible battery. Another object of the present invention is to provide a slave device. Another object of the present invention is to provide an electronic device with low power consumption. Another object of the present invention is to provide a device that can be used for a long time on a single charge. Another object of the present invention is to provide an electronic device that can be used for a long time. One of the objects of the present invention is to provide a novel electronic device.

[0015] The description of these problems does not preclude the existence of other problems. It is not necessary for the embodiments to solve all of these problems. It is possible to extract other problems from the description of the claim. [Means for solving the problem]

[0016] One embodiment of the present invention is an electronic device including a display panel, a power storage device, a circuit, and a sealing body. The display panel includes a light-emitting element. The light-emitting element emits light using power supplied from a power storage device. The circuit has a function of emitting light. The circuit has an antenna. The circuit has a function of wirelessly charging the power storage device. The sealing body has a display panel, a power storage device, and a circuit therein. At least a part of the encapsulant has a function of transmitting light emitted by the light-emitting element. is.

[0017] When the user wears the sealing body on his / her arm, the electronic device has a power storage device, an antenna, and a display panel may be laminated in this order.

[0018] Alternatively, one embodiment of the present invention is a display device having a display panel, a power storage device, a circuit, a sealing body, and a structure. The display panel includes a light-emitting element. The light-emitting element receives power from a power storage device. The circuit has a function of emitting light using the power stored in the circuit. The sealing body has a function of charging the device. The sealing body is connected to the structure. The sealing body has a display At least a part of the sealing body is encapsulated in a light-emitting element. The structure can be worn on the arm.

[0019] When the user wears the structure on his / her arm, the electronic device has a power storage device, an antenna, and the display panel may be laminated in this order.

[0020] Another embodiment of the present invention is an electronic device including a display panel, a power storage device, a circuit, and a sealing body. The display panel has a function of displaying information using power supplied from the power storage device. The circuit has an antenna and a function of wirelessly charging the power storage device. The display panel, the power storage device, and the circuit are disposed inside the sealing body. The display panel has a function of transmitting light. The display panel has a first display element and a second display element. The first display element has a reflective layer that has a function of reflecting light. The reflective layer has a function of controlling the transmission of light. The reflective layer has an opening. The second display element has an opening. The second display element has a function of emitting light toward the opening. The opening preferably has an area of ​​5% to 20% of the area of ​​the reflective layer.

[0021] In the electronic device, the display panel further includes a signal line, a pixel circuit, a first conductive layer, a second conductive layer, a The second display element preferably has a second conductive layer and an insulating layer. The first display element is electrically connected to the first conductive layer. The first conductive layer is The first conductive layer has a portion overlapping with the second conductive layer via an insulating layer. The second conductive layer is electrically connected to the pixel circuit. The pixel circuit is a signal It is electrically connected to the line.

[0022] Another embodiment of the present invention is an electronic device including a display panel, a power storage device, a circuit, and a sealing body. The display panel has a function of displaying information using power supplied from the power storage device. The circuit has an antenna and a function of wirelessly charging the power storage device. The display panel, the power storage device, and the circuit are disposed inside the sealing body. The display panel has a function of transmitting light. The liquid crystal element and the light-emitting element are The liquid crystal display device has a liquid crystal layer, a first conductive layer, and a second conductive layer. The first conductive layer has a function of reflecting light. The first conductive layer has an opening. The light-emitting element includes a layer containing a light-emitting substance, a first conductive layer, and a second conductive layer. The light-emitting element has a portion overlapping with the opening. The optical element has a function of emitting light toward the opening. The opening has an area of ​​the first conductive layer. It is preferable that the area is 5% or more and 20% or less.

[0023] In the electronic device, the display panel further includes a signal line, a pixel circuit, a fifth conductive layer, a The light-emitting element is preferably electrically connected to the pixel circuit. The liquid crystal element is electrically connected to the fifth conductive layer. The fifth conductive layer is electrically connected to the fifth conductive layer through an insulating layer. The fifth conductive layer has a portion overlapping with the sixth conductive layer. The fifth conductive layer is electrically connected to the sixth conductive layer. The sixth conductive layer is electrically connected to the pixel circuit. The pixel circuit is electrically connected to the signal line. is connected to.

[0024] In the electronic device having each of the above configurations, it is preferable that the sealing body be wearable on the user's arm. When the sealed body is worn on the arm, the electronic device of one embodiment of the present invention receives power from the arm side. The display panel may be laminated in this order.

[0025] Alternatively, the electronic device having each of the above configurations preferably has a structure. The structure can be attached to the arm. When the user attaches the structure to the arm, In an electronic device of one embodiment of the present invention, a power storage device, an antenna, and a display panel are arranged in this order from the wrist. The film may be laminated with the above.

[0026] Furthermore, in each of the above configurations, a voice input unit, a touch sensor, an illuminance sensor, or a wrist-worn The device may have one or more of the components for inputting the voice signal or the touch sensor. The audio input unit, touch sensor, and lighting unit can be located inside or outside the encapsulant. The voice input unit, the touch sensor, and the touch panel are preferably disposed inside the sealing body. The sensor and the illuminance sensor are connected to a display panel, a power storage device, a circuit, etc. Alternatively, the display panel may have a touch sensor. The component is connected to the seal or structure.

[0027] In each of the above configurations, the display panel has a curved surface with a curvature radius of 1 mm or more and 150 mm or less. In each of the above configurations, the display panel may have a curvature radius of 150 mm. For example, the display panel may have a radius of curvature greater than 150 mm. The curved surface may be as large as less than 1 m, or may have a curved surface with a radius of curvature of 1 m or more and 10 m or less. The curved surface of the display panel may be a concave curved surface, a convex curved surface, or both a concave curved surface and a convex curved surface. In each of the above configurations, the display panel may have a flexible portion. may have

[0028] In each of the above configurations, the power storage device has a curved surface with a curvature radius of 10 mm or more and 150 mm or less. In each of the above structures, the power storage device may have a flexible portion. It may be possible.

[0029] In each of the above configurations, the inside of the sealing body is preferably a reduced pressure atmosphere. In each of the above configurations, it is preferable that a buoyancy material be provided inside the sealing body. [Effects of the Invention]

[0030] According to one embodiment of the present invention, an electronic device that can be used underwater can be provided. In this way, it is possible to provide a highly waterproof electronic device. According to one embodiment of the present invention, an electronic device can be provided that can be used in an all-weather environment. According to one embodiment of the present invention, a highly convenient electronic device can be provided. According to one embodiment of the present invention, a highly reliable electronic device can be provided. According to one embodiment, an electronic device with high visibility can be provided regardless of the ambient brightness.

[0031] According to one embodiment of the present invention, an electronic device that can be used in a wide temperature range can be provided. According to one aspect of the present invention, an electronic device that is small, lightweight, or flexible is provided. According to one embodiment of the present invention, an electronic device with high heat resistance can be provided. According to one embodiment of the present invention, a highly safe electronic device can be provided. According to one embodiment of the present invention, an electronic device with low power consumption can be provided. An electronic device that can be used for a long time by charging can be provided. , and novel electronic devices can be provided.

[0032] The description of these effects does not preclude the existence of other effects. The embodiments do not necessarily have all of these effects. From the description of the section, it is possible to extract other effects. [Brief explanation of the drawings]

[0033] [Figure 1] 1A and 1B are diagrams illustrating examples of electronic devices. [Figure 2] 1A and 1B are diagrams illustrating examples of electronic devices. [Figure 3] 1A and 1B are diagrams illustrating examples of electronic devices. [Figure 4] 1A and 1B are diagrams illustrating examples of electronic devices. [Figure 5] 1A and 1B are diagrams illustrating examples of electronic devices. [Figure 6] 1A and 1B are diagrams illustrating examples of components of an electronic device. [Figure 7] 1A and 1B are diagrams illustrating examples of components of an electronic device. [Figure 8] 1A and 1B are diagrams illustrating examples of components of an electronic device. [Figure 9] 1A and 1B are diagrams illustrating examples of electronic devices. [Figure 10] 1A and 1B are diagrams illustrating examples of electronic devices. [Figure 11] 10A and 10B are diagrams showing examples of how electronic devices are worn. [Figure 12] 1A and 1B illustrate an example of a power storage device and an example of an electrode. [Figure 13] FIG. 1 illustrates an example of a power storage device. [Figure 14] FIG. 1 illustrates an example of a power storage device. [Figure 15] FIG. 1 illustrates an example of a power storage device. [Figure 16] FIG. 1 illustrates an example of a power storage device. [Figure 17] FIG. 1 illustrates an example of a power storage device. [Figure 18] FIG. 1 illustrates an example of a power storage device. [Figure 19] 1A to 1C illustrate an example of a method for manufacturing a power storage device. [Figure 20] FIG. 1 illustrates an example of a power storage device. [Figure 21] FIG. 1 illustrates an example of a power storage device. [Figure 22] 1A to 1C illustrate an example of a method for manufacturing a power storage device. [Figure 23] FIG. 1 illustrates an example of a power storage device. [Figure 24] 1A and 1B illustrate an example of a light-emitting device. [Figure 25] 1A and 1B illustrate an example of a light-emitting device. [Figure 26] 1A and 1B illustrate an example of a light-emitting device. [Figure 27] 1A and 1B illustrate an example of a light-emitting device. [Figure 28] FIG. 1 illustrates an example of an input / output device. [Figure 29] FIG. 1 illustrates an example of an input / output device. [Figure 30] FIG. 1 illustrates an example of an input / output device. [Figure 31] FIG. 1 illustrates an example of an input / output device. [Figure 32] 1A and 1B are diagrams illustrating examples of components of an electronic device. [Figure 33] 1A and 1B are diagrams illustrating examples of components of an electronic device. [Figure 34] 1A and 1B illustrate examples of transistors. [Figure 35] 1A and 1B are diagrams illustrating examples of electronic devices. [Figure 36] 1A and 1B are diagrams illustrating examples of electronic devices. [Figure 37] 1A and 1B are diagrams illustrating examples of electronic devices. [Figure 38] 1A and 1B are diagrams illustrating examples of electronic devices. [Figure 39] 1A and 1B are diagrams illustrating examples of electronic devices. [Figure 40] 1A and 1B are diagrams illustrating examples of components of an electronic device. [Figure 41] FIG. 1 is a diagram illustrating an example of a pixel circuit of a display device. [Figure 42] FIG. 1 illustrates an example of a display device. [Figure 43] FIG. 1 illustrates an example of a display device. [Figure 44] FIG. 1 illustrates an example of a display device. [Figure 45] 1A and 1B are diagrams illustrating examples of components of an electronic device. DETAILED DESCRIPTION OF THE INVENTION

[0034] The embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. The present invention is not limited to the above embodiments, and various changes and modifications may be made in the form and details thereof without departing from the spirit and scope of the present invention. It will be readily understood by those skilled in the art that the present invention can be achieved by the following embodiments. It should not be construed as being limited to the contents described.

[0035] In the configuration of the invention described below, the same parts or parts having similar functions are designated by the same reference numerals. The same reference numerals are used in common among different drawings, and the repeated explanations thereof will be omitted. When referring to a function, the hatch pattern may be the same and no particular symbol may be added.

[0036] In addition, the position, size, range, etc. of each component shown in the drawings are not necessarily the same as in reality for ease of understanding. Therefore, the disclosed invention may not necessarily represent the position, size, range, etc. Furthermore, the present invention is not limited to the position, size, range, etc. disclosed in the drawings.

[0037] The words "film" and "layer" may be used interchangeably depending on the situation. For example, the term "conductive layer" can be used interchangeably with the term "conductive film." Alternatively, for example, the term "insulating film" can be changed to " The term "insulating layer" may be changed to "insulating layer."

[0038] (Embodiment 1) In this embodiment, electronic devices of one embodiment of the present invention will be described with reference to FIGS.

[0039] In this embodiment, a wrist-worn electronic device and a wristwatch-type electronic device will be mainly described as examples. However, there is no particular limitation on the way of using the electronic device of one embodiment of the present invention. It can be used on the wrist, or it can be worn on a part other than the arm (such as the waist or leg).

[0040] One embodiment of the present invention is an electronic device including a display panel, a power storage device, a circuit, and a sealing body. The display panel includes a light-emitting element. The light-emitting element emits light using power supplied from a power storage device. The circuit has an antenna and a function of wirelessly charging the power storage device. The sealing body includes a display panel, a power storage device, and a circuit therein. In addition, some of the light-emitting elements have a function of transmitting light emitted from the light-emitting elements. The sealing body may be wearable on the arm, or a structure connected to the sealing body may be wearable on the arm. may be.

[0041] By using the sealing body, it is possible to protect the display panel, the power storage device, the circuit, and the like, which are the objects to be sealed. This allows for the realization of a durable electronic device. It is highly water-soluble, making it possible to realize electronic devices that can be used underwater.

[0042] Note that in this specification and the like, among the components of the electronic device of one embodiment of the present invention, the inside of the sealing body The components located in the above-mentioned area and sealed by the sealing body are also collectively referred to as sealed bodies.

[0043] In manufacturing an electronic device of one embodiment of the present invention, a display panel and a power storage device are encapsulated together by a sealing body. Therefore, highly reliable electronic devices can be easily manufactured. Furthermore, by making the sealing body into a shape that is easy to wear on the human body, such as a belt-like shape, the sealing body It can be attached to the human body and used as a wearable device.

[0044] In an electronic device of one embodiment of the present invention, a power storage device can be charged by contactless power transmission. Therefore, there is no need to remove the power storage device from the sealed body when charging. The entire encapsulant can be completely covered with the encapsulant, further improving the waterproofing of the electronic device. do.

[0045] In one embodiment of the present invention, even if one or more components of the sealed body have flexibility, For example, the display panel or the power storage device may be flexible. Both the electrode and the power storage device may be flexible.

[0046] Since the sealing body is flexible, at least one of the display panel and the power storage device is flexible. When the protective layer is provided, it is possible to protect the protective layer without impairing the flexibility of the protective layer. As described above, by applying one embodiment of the present invention, a highly reliable, safe, and flexible electrode can be obtained. When an electronic device has flexibility, it becomes easy to attach and detach the electronic device. This is preferable because it provides the effect of providing the user with a comfortable fit.

[0047] In the electronic device of this embodiment, the entire sealed body is covered with a flexible sealing body. By covering the sealed object with a flexible sealing body, repeated bending and stretching can be performed. This makes it possible to realize an electronic device that is less likely to be damaged even when exposed to heat.

[0048] In addition, by using a highly heat-resistant sealant, the display panel can be driven even at high temperatures. In addition, electronic devices can be reversibly bent even at high temperatures. It is more preferable to use a light emitting element and a storage device with high efficiency.

[0049] Next, the electronic device of this embodiment will be described in detail.

[0050] FIG. 1(A) shows a perspective view of the electronic device 100. FIG. 1(B) shows a perspective view of the electronic device 100. A top view is shown in FIG. 1(B), a cross-sectional view between the dashed line AB in FIG. 1(C), and a dashed line AB in FIG. The cross section between the chain lines CD is shown in FIG.

[0051] The electronic device 100 includes a display panel 10, a power storage device 20, a circuit 30, and a sealing body 40. In FIG. 1A and other figures, the portion of the display panel 10 that is visible to the user is the electronic device 10. It is written as 0 display part 15.

[0052] <Display section 15> The electronic device 100 has a display unit 15. In FIG. 1(A), the display unit 15 has a curved surface. In this embodiment, an example in which the display panel 10 has light-emitting elements is shown. In FIG. 1C and other figures, the direction in which light is emitted from the light-emitting element is indicated by an arrow.

[0053] The display unit 15 may be flexible. That is, the display unit 15 may be deformed to change the shape of the display unit 15. The curvature of the sphere may be changed from the state shown in FIG. 1(A). The display unit 15 is transformed from a curved state to a flat state as shown in FIG. It should be noted that the flexible display unit 15 does not need to be deformed to a flat state. good.

[0054] The display unit 15 does not have to be flexible. A display unit 15 that does not have flexibility is flat. It may have a curved surface.

[0055] When the flexibility of the display panel is lower than that of the sealing body, the electronic device of one embodiment of the present invention When the electronic device is worn on the arm, the radius of curvature of the display unit 15 hardly changes, and the edge of the electronic device It is preferable that the shape be flexible.

[0056] <Sealing body 40> The electronic device 100 has a sealing body 40. In FIG. 1(A), the sealing body 40 has a curved surface. do.

[0057] The sealing body 40 has a band-like part that can be worn on the arm. It can function as a band.

[0058] The encapsulant 40 is flexible. That is, the encapsulant 40 can be deformed to change its curvature. The curvature of the encapsulant 40 can be changed from the state shown in FIG. It may be larger or smaller than the original state, or both may be possible. In addition, the curved surface shown in FIG. 1(A) can be changed to a flat surface shown in FIG. 1(B). The sealing body 40 may be deformed in the same manner. It is not necessary to be able to deform to this extent.

[0059] The sealing body 40 preferably has a film. The film has surface protection properties and shape maintenance properties. The film has one or more properties selected from the group consisting of optical properties and gas barrier properties. The sealing body 40 may have a single layer structure or a laminated structure. It may be a structure.

[0060] The sealing body 40 has the display panel 10, the power storage device 20, the circuit 30, etc., as sealed bodies inside. The sealed object is sealed by the sealing body 40 and isolated from the atmosphere outside the electronic device 100. do.

[0061] For example, one film is folded and the object to be sealed is placed between the folded film, or between a pair of films. Place the sealed object in the lamination process (pouch processing, etc.) with one or a pair of films. ) to seal the object to be sealed.

[0062] Alternatively, one or a pair of films are bonded together using an adhesive to seal the object to be sealed. The adhesive may be a light-curing adhesive such as an ultraviolet-curing adhesive, a reaction-curing adhesive, or a heat-curing adhesive. Various curing adhesives such as curing adhesives and anaerobic adhesives can be used. Examples include epoxy resin, acrylic resin, silicone resin, phenolic resin, and polyimide resin. , imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin Examples include grease, EVA (ethylene vinyl acetate) resin, etc. In particular, epoxy resin, etc. A material with low moisture permeability is preferred. Two-component resin may also be used.

[0063] If irregularities along the shape of the sealed object occur on the surface of the electronic device 100, the visibility of the display will be reduced. Therefore, the sealed object may be placed in a case such as a plastic case. By sealing the electronic device 100 with the sealing body 40, the surface of the electronic device 100 can be made flat, which is preferable.

[0064] By using a film for the sealing body 40, the flexibility of the sealing body 40 can be increased.

[0065] The material of the seal 40 is not particularly limited as long as it can withstand the temperature of the usage environment. The stopper 40 is made of various materials such as glass, organic resin, rubber, plastic, and metal. It can be formed.

[0066] For example, the sealing body 40 may be made of polyethylene television, which is flexible and transparent to visible light. Polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), Acrylonitrile resin, polyimide resin, polymethyl methacrylate resin, polycarbonate Polycarbonate (PC) resin, Polyethersulfone (PES) resin, Polyamide resin, Cyclohexyl Ether olefin resin, polystyrene resin, polyamide-imide resin, polyvinyl chloride resin, arami A resin or the like can be used.

[0067] It is preferable that the sealing body 40 has high waterproof properties. Specifically, the sealing body 40 is made of a highly waterproof material. It is preferable to use a waterproof material or to apply a waterproofing treatment to the surface of the sealing body 40. The electronic device 100 is protected from moisture from the outside by the insulating film 100. Furthermore, by improving the waterproofness of the sealing body 40, the reliability of the electronic device 10 can be improved. 0 can be used in water.

[0068] The encapsulant 40 is capable of transmitting visible light at least in the display portion 15. The display on the display panel 10 can be seen through the sealing body 40. In this case, the power storage device 20 and the circuit 30 may be visible.

[0069] In one embodiment of the present invention, the encapsulant 40 may not transmit visible light except for the display unit 15. For example, the portion other than the display portion 15 may be configured to block visible light, and the user may be At least one of the circuit 30 and the circuit 30 may be made invisible.

[0070] In the electronic device 100, a display panel 10, a power storage device 20, and a circuit 30 are stacked. The order in which these layers are stacked is not particularly limited as long as the display on the display panel 10 can be viewed by the user. Furthermore, they do not need to be stacked, and the display panel 10 and the power storage device 2 may be placed on the same plane. 0 and circuit 30 may be arranged.

[0071] For example, as shown in FIG. 1F, the electronic device 100 includes a circuit 30 on the power storage device 20. Alternatively, the display panel 10 may be provided on the circuit 30. When the sealing body 40 is worn on the arm, The power storage device 20, the circuit 30, and the display panel 10 are stacked in this order from the side closest to the power storage device 20. When the user turns the display panel 10, the display on the display panel 10 can be seen by the user. Alternatively, the circuit 30, the power storage device 20, and the display panel 10 may be stacked in this order.

[0072] The space sealed by the sealing body 40 is preferably a reduced pressure atmosphere or an inert atmosphere. By creating these atmospheres, the display panel can be more easily displayed than when the space is an air atmosphere. It can increase the reliability of 10th order.

[0073] 1(D) and (E) are different from FIG. 1(C), and are different from FIG. 1(B). FIG. 1(G) is a cross-sectional view taken along the line AB. FIG. 1(G) is different from FIG. 1(F), and shows the same structure as in FIG. 1(B). FIG. 1 is a cross-sectional view taken along dashed lines CD.

[0074] In FIGS. 1C and 1F, the sealing body 40 on the front (display surface) side of the electronic device 100 is In this example, the side surfaces are covered and the back surface of the electronic device 100 is flat, but this is not limiting. As shown in (D) and (G), the sealing body 40 on the front (display surface) side of the electronic device 100 and the sealing body 40 on the back side The sealing body 40 covers the side surface of the sealed object, and the electronic device 100 is in contact with other parts (back and front) of the sealed object. As shown in FIG. 1(E), The sealing body 40 on the back side of the electronic device 100 covers the side of the sealed object, and the front (front The surface on the display side may be flat. The part including the display unit 15 may protrude from other parts (such as the band part). As shown in FIG. 1(E), the back side of the electronic device 100 has a protruding portion (such as a band portion) that protrudes more than other portions. It may have a portion where

[0075] 2 to 5 show electronic devices different from the electronic device 100. FIG.

[0076] 2A shows a perspective view of the electronic device 100a. 3(A) is a cross-sectional view taken along the dashed line EF in FIG. 3(B). A cross section between the dotted chain lines GH is shown in FIG.

[0077] The electronic device 100a has a display unit 15. The electronic device 100a also has a sealing body 40. The electronic device 100a also includes a display panel 10, a power storage device 20, and a sealing body 40. , and circuit 30.

[0078] In the electronic device 100a, the display panel 10 overlaps the power storage device 20, and the circuit 30 0, and the display panel 10 and the circuit 30 do not overlap. The part that functions as a band may also have a sealed object located therein. For example, a flexible When using the power storage device 20, the power storage device 20 is arranged in a wide area inside the sealing body 40. This makes it possible to realize an electronic device that can be used for a long time on a single charge.

[0079] The sealing body 40 may have a buoyancy material inside. The buoyancy material may be, for example, a solid buoyancy material. The buoyancy material can be a polymer material (such as resin) or a gas-filled buoyancy material. The buoyancy material may be polyethylene, polypropylene, or gas (carbon dioxide, etc.). A foamed resin made by foaming propylene, styrene, or the like may also be used.

[0080] By using a buoyancy material to make the electronic device of one embodiment of the present invention more buoyant in water, the electronic device can be easily carried out in water. This makes it easier to find the device if it is lost.

[0081] Furthermore, the sealing body 40 may have a member having rubber elasticity inside. In the electronic device of one embodiment of the present invention, the internal stress generated during deformation is easily dispersed in the member. When the electronic device is bent, the stress locally applied to the bent portion is alleviated, thereby preventing damage to the electronic device. It can also function as a buffer to disperse external physical pressure or impact. .

[0082] Rubber elasticity is the ability to absorb energy when an external force is applied and return to its original shape. It refers to the elasticity that can be stored as energy. A material with rubber elasticity is one that can undergo reversible deformation. Shape is possible.

[0083] 3(C) to 3(E) are different from FIG. 3(B) in that the dashed line in FIG. 3(A) is different. This is a cross-sectional view between EF.

[0084] For example, a buoyancy material or rubber elasticity may be provided in the space 42 shown in Figs. 3(B), (C), (D), and (F). It is preferable to have a member having such a structure.

[0085] As shown in FIG. 3B, the display panel 10 and the power storage device 20, or the circuit 30 and the power storage device 20 As shown in FIG. 3(C), the display panel 10 and the power storage device Similarly, the circuit 30 and the power storage device 20 do not need to be in contact with each other. The display panel 10, the power storage device 20, and the circuit 30 are each in contact with the sealing body 40. 3B and 3C show an example in which the power storage device 20 and the sealing body 40 are in contact with each other. FIG. 3(C) shows an example in which the display panel 10 and the sealing body 40 are in contact with each other. As shown in Fig. 1D, the sealing body 40 and the sealed body do not need to be in contact with each other. 0, the part where two or more of the power storage device 20, the circuit 30, and the sealing body 40 contact each other If there is a contact, it may be fixed by adhesive or the like, or may be in contact with the contact so as to be relatively movable. good.

[0086] Furthermore, as shown in FIG. 3(E), the inside of the sealing body 40 may be sufficiently depressurized. As a result, the display panel 10, the power storage device 20, the circuit 30, etc. may be deteriorated by impurities, etc. Furthermore, it is possible to reduce the thickness and weight of the electronic device.

[0087] In FIGS. 3B and 3F, the sealing body 40 on the front (display surface) side of the electronic device 100a is In this example, the side surfaces of the electronic device 100a are covered and the rear surface of the electronic device 100a is flat, but the present invention is not limited to this. As shown in FIG. 3(D), the sealing body 40 on the front (display surface) side of the electronic device 100a and the sealing body 40 on the back side The electronic device 100a covers the side surfaces of the sealed object, and both the front and back of the electronic device 100a are in contact with other parts (backsides). The conductor may have a portion that protrudes beyond the conductor (such as a bond portion).

[0088] Furthermore, the display panel 10, the power storage device 20, and the circuit 30 included in the electronic device of one embodiment of the present invention The number of each is not limited to one, and may be two or more independently. The number of display units 15 included in the electronic device of this embodiment is not limited to one, and may be two or more. stomach.

[0089] FIG. 2(B) shows a display device having three display units (display unit 15a, display unit 15b, and display unit 15c). 1 shows a perspective view of an electronic device 100b.

[0090] The three display units of the electronic device 100b are displayed on a single display panel 10 having three display units. Alternatively, the display device may be configured with three display panels 10 each having one display unit. The present invention may be configured as follows.

[0091] When an electronic device has multiple displays, the variety of displays can be increased. The display units may be used as independent display units and may display different images. The same image may be displayed on two or more display units. good.

[0092] The electronic device according to one aspect of the present invention is configured to detect the line of sight of the user, the vertical direction of the electronic device, or the angle of rotation of the electronic device. It is preferable to provide a sensor that detects the direction, etc. For example, a gyro sensor, an image sensor, etc. This allows the display to be oriented in a way that is easy for the user to see. Or, the display can be displayed on a display unit that is easy for the user to see. By turning off the display, which is difficult to see, it is possible to reduce power consumption. The user may operate the electronic device to select the display unit to be used or the display content of the display unit.

[0093] The electronic device 100c shown in FIG. 2C has a larger display unit 15 than the electronic device 100a. do.

[0094] Even in the case of electronic devices with large displays, the above-mentioned sensors can be used or the user can By operating electronic devices, etc., only the parts that are easy for the user to see are displayed, and other By turning off the part, it is possible to reduce power consumption.

[0095] The electronic device of one embodiment of the present invention may have a structure in which the sealing body is attached to the arm, or may have a structure in which the sealing body is connected to the arm. The structure may be a band (string, wire, etc.) connected to the wrist. The attachment method is by means of a wire, net, belt, etc., or a spring. There are three types of devices: those worn directly on the skin, those worn on the arm over clothing, and those worn on the arm over clothing. A method of sewing electronic devices to the part that overlaps the arm of the clothing, and a method of attaching Velcro to the part that overlaps the arm of the clothing. Methods of attaching electronic devices using hook-and-loop fasteners, such as RAPE (registered trademark) There is.

[0096] The sealing body is made by combining a film and a strip-shaped leaf spring made of a convex material (stainless steel, etc.). Alternatively, the structure may be a convex member (stainless steel, etc.) A strip-shaped leaf spring such as a spring may be used. This allows for instantaneous attachment of electronic devices. In this case, the electronic device can be attached to the skin or removed from clothing. The electronic device is fixed to the arm by sandwiching it between the two. The length of the band can be adjusted by using a leaf spring. This eliminates the need for a wristwatch and allows the electronic device to be worn regardless of the thickness of the arm.

[0097] FIG. 4A shows a perspective view of the electronic device 100d. FIG. 5A shows a perspective view of the electronic device 100d. 5(A) is a top view of the cascade line JK in FIG. 5(A), and FIG. 5(B) is a cross-sectional view taken along the dashed line JK in FIG. 5(A). In FIG. 5B, the arrow indicates the direction in which light emitted from the light emitting elements of the display panel 10 is extracted. Indicated by a mark.

[0098] The electronic device 100d has a sealing body 40 and a band 155. The display panel 10, the circuit 30, the power storage device 20, etc. are included. The sealing body 40 and the band 155 are is connected.

[0099] It is preferable that the seal 40 and the band 155 are detachably connected. 40, and multiple bands with different designs are available, allowing you to choose the perfect band for the day. The band to be connected to the sealing body 40 can be selected depending on the session, place, time, situation, etc. This will increase the chances of using electronic devices. Also, it is recommended to use old bands. It is also possible to replace the band with a new one. may be prepared, and the sealing body 40 to be connected to the band may be selected depending on the situation.

[0100] As shown in FIG. 4B, the band 155 has a recess, and the recess The sealing body 40 may be disposed inside the band 155. If the device is in use, it may rub against or collide with other objects. As a result, the display unit 15 may be scratched, and the electronic device may even be damaged. The band 155 and the sealing body 40 are connected so that the surfaces of the band 155 and the sealing body 40 are substantially flush with each other. It is preferable that the recess of the band 155 is thicker than the thickness of the sealing body 40. It can be deep.

[0101] 4A and 5A show an example in which the width of the sealing body 40 is equal to the width of the band 155. However, one embodiment of the present invention is not limited to this. However, the width may be narrower than the width of the band 155. Alternatively, as shown in FIG. 5(D), The width of the 0 may be wider than the width of the band 155 .

[0102] Next, examples of components of an electronic device of one embodiment of the present invention will be described.

[0103] The elements 150 shown in FIG. 6A include the display panel 10, the power storage device 20, the circuit 30, and the sealing body. The sealing body 40 has the display panel 10, the power storage device 20, and the circuit 30 therein. In the following description, the display panel 10, the power storage device 20, and the circuit 30 are collectively referred to as a sealed body. It may be noted.

[0104] The element 150 may be, for example, an element 150a in FIG. 4(A) and an element 150b in FIG. 4(B). In addition, the sealing body 40 can be connected to the band 155. As shown in (E), the seal 40 is formed in a band shape, so that the seal 40 itself can be worn on the arm. That's fine.

[0105] An example of the connection relationship of the sealed objects is shown in the block diagram of FIG. 6(B).

[0106] The display panel 10 includes a light-emitting element 11. The light-emitting element 11 receives power from a power storage device 20. It has the function of emitting light using the power supplied.

[0107] The display panel 10 has a function of emitting light using power supplied from a source other than the power storage device 20. It may have.

[0108] The power storage device 20 has a portion that overlaps with the display panel 10 .

[0109] The power storage device 20 may also have a function of supplying power to devices other than the display panel 10.

[0110] The electricity storage device 20 includes a positive electrode, a negative electrode, a separator, an electrolyte, an exterior body, and the like.

[0111] The circuit 30 has an antenna 31. The antenna 31 has a portion overlapping with the display panel 10. The circuit 30 can charge the power storage device 20 wirelessly (or contactlessly). .

[0112] The area where the display panel 10 and the circuit 30 overlap each other, or the area where the display panel 10 and the power storage device 20 overlap each other By having overlapping portions, the size of the element 150 can be reduced. It is preferable to provide a portion where the display panel 10, the power storage device 20, and the circuit 30 overlap each other. The miniaturization of the element 150 is particularly effective when the band is provided separately from the sealing body 40. In addition, when the sealing body 40 is used as a band of an electronic device, the element 150 can be made smaller. When this is not necessary, the overlapping portion of the display panel 10 and the circuit 30 or the display panel 10 and the power storage device 20 do not necessarily have to have an overlapping portion with each other.

[0113] The power storage device 20 preferably has a portion overlapping with the circuit 30. For example, the antenna 31 At least a part of the antenna 31 may overlap with the power storage device 20. and the power storage device 20, so that the antenna 31 is not easily visible to the user of the electronic device. By stacking the display panel 10, the power storage device 20, and the circuit 30 so that The display is preferably placed between the external antenna and the antenna 31. Even if the panel 10 is installed, radio waves can be transmitted and received. The transmitted radio waves pass through the display panel 10 and are received by the antenna 31 .

[0114] If the environment in which the electronic device is used is determined, a light-emitting element capable of emitting light in that environment, and A power storage device capable of supplying power to the display panel under such an environment is used.

[0115] The electronic device according to one aspect of the present invention can preferably be used in both low-temperature and high-temperature environments. Alternatively, the electronic device of one embodiment of the present invention can be used in a wide temperature range (for example, 0° C. or higher and 100° C. or lower, Preferably, it is used at a temperature between -25°C and 150°C, more preferably between -50°C and 200°C. The electronic device of one embodiment of the present invention can be used both indoors and outdoors. That's fine.

[0116] The light-emitting element included in the electronic device of one embodiment of the present invention can be used in an environment of 0° C. and an environment of 100° C. It is preferable that the electronic device of one embodiment of the present invention can emit light from each of the light sources. The power storage device supplies power to the display panel in both 0°C and 100°C environments. It is preferable to be able to do this.

[0117] The electronic device may have a switch. In FIGS. 6(C) and 6(D), the following is shown as the object to be sealed: A display panel 10, a power storage device 20, a circuit 30, a circuit 50, and a switch 51 are shown.

[0118] For example, as shown in FIG. 6C, when the switch 51 is in the off state, the circuit 30 communicates wirelessly. The power storage device 20 can be charged.

[0119] For example, as shown in FIG. 6(D), when the switch 51 is in the on state, the power storage device 20 The display panel 10 can be powered.

[0120] Components included in an electronic device of one embodiment of the present invention will be described below in detail.

[0121] <Display panel 10> The display panel 10 has light-emitting elements 11. As an example of the configuration of the display panel 10, In the third embodiment, a light-emitting device will be described in detail, and in the fourth embodiment, an input / output device will be described in detail. The display elements of the display panel 10 are not limited to light-emitting elements. It may have a detection element such as a sensor.

[0122] The display panel 10 has an active element (active element, non-linear element) in the pixel. Use a passive matrix system or a passive matrix system that does not have active elements in the pixels. can be done.

[0123] The display panel 10 may be flexible. For example, the support substrate and sealing substrate for the light emitting element 11 By using a film on at least one of the substrates, the flexibility of the display panel 10 is increased. It is possible.

[0124] For example, a display that can withstand 100,000 bending and stretching tests with a curvature radius of 5 mm. It is preferable to use a display panel having a curvature radius of 1 mm or more and 150 mm or less. Preferably, the electronic device should be used in a bent state with a curvature radius of 5 mm or more and 150 mm or less. It would be preferable if this could be done.

[0125] The light emitting element 11 is an element that can emit light in both low temperature and high temperature environments. The low temperature environment is, for example, an environment of -100°C or higher and 0°C or lower, preferably - An environment between 100°C and -25°C, preferably between -100°C and -50°C The high temperature environment is, for example, an environment of 100°C or higher and 300°C or lower, preferably An environment of 150°C or higher and 300°C or lower, more preferably an environment of 200°C or higher and 300°C or lower, is preferred. The light emitting element 11 can be used not only in a low temperature environment or a high temperature environment, but also in a temperature higher than 0°C. For example, the light emitting element 11 can be made to emit light in an environment of less than 0°C. It can emit light at temperatures below 30°C.

[0126] The light emitting element 11 can be a self-luminous element, and can be turned on or off by a current or a voltage. The category includes devices whose brightness is controlled, such as light-emitting diodes (LEDs), In addition, other display devices, such as organic EL devices and inorganic EL devices, can be used. The element can also be applied.

[0127] The higher the heat resistance of the light emitting element 11, the more preferable. In this case, the glass transition temperature of each organic compound contained in the organic EL element is 100°C or higher and 300°C or lower. °C or less, and more preferably 150 to 300 °C.

[0128] In one embodiment of the present invention, the antenna 31 receives signals from an external antenna via the display panel 10. In the case of a configuration in which the light emitting element 11 is electrically connected, it is preferable that the thickness of the pair of electrodes of the light emitting element 11 is as thin as possible. The sum of the thicknesses of the pair of electrodes is 1 μm or less, preferably 500 nm or less, more preferably 35 It is preferable to set the thickness to 0 nm or less, and more preferably to set the thickness to 250 nm or less.

[0129] <Electricity storage device 20> The power storage device 20 is capable of supplying power to the display panel 10 in both low-temperature and high-temperature environments. It is preferable to use a power storage device that can store electricity. ° C. or lower, preferably -100° C. or higher and -25° C. or lower, more preferably -100° C. Examples of high-temperature environments include environments of 100°C or higher and 30°C or lower. An environment of 0°C or less, preferably an environment of 150°C or more and 300°C or less, more preferably 200°C The power storage device 20 can be placed in a low temperature environment or a high temperature environment. It can be used in environments above 0°C and below 100°C. The device 20 can be used at room temperature (above 20° C. and below 30° C.).

[0130] The power storage device 20 may be, for example, a lithium polymer battery (lithium Lithium-ion secondary batteries such as ion polymer batteries, nickel-metal hydride batteries, nickel-cadmium batteries, Examples include organic radical batteries, lead-acid batteries, secondary air batteries, nickel-zinc batteries, and silver-zinc batteries. can be.

[0131] By using lithium-ion secondary batteries that can achieve high energy density, the weight of electronic devices can be reduced. This is preferable because it allows for a reduction in size and size.

[0132] For example, a secondary battery having a non-aqueous electrolyte can be used. The non-aqueous electrolyte is an ionic liquid. Ionic liquids have both room temperature molten salts and alkali metal salts. They are flame-retardant and non-volatile. Therefore, a secondary battery with high heat resistance can be realized. For example, the ionic liquid is an imidazolium cation. It is preferable that the alkali metal salt has an ion and an anion. It is preferable that there is.

[0133] Secondary batteries using gel electrolytes or all-solid-state secondary batteries using solid electrolytes are heat-resistant or It is highly safe and preferable.

[0134] The power storage device 20 may be of various types such as a coin type (single-layer flat type), a cylindrical type, a thin type, a square type, or a sealed type. In addition, a secondary battery having a plurality of positive electrodes, negative electrodes, and separators can be used. Alternatively, the positive electrode, the negative electrode, and the separator may be wound together (wound type). stomach.

[0135] In addition, the electronic device of one embodiment of the present invention may include a lithium ion capacitor as the power storage device 20. It may also have a double layer capacitor or the like.

[0136] The power storage device 20 may be flexible. For example, by using a film for the exterior body, This can increase the flexibility of the power storage device 20. The area surrounded by the exterior body contains the positive electrode, the negative electrode, and and an electrolyte (or electrolytic solution).

[0137] In the electronic device, the light emitting element 11 and the power storage device 20 may be arranged so as to overlap each other. The larger the overlapping area between the optical element 11 and the power storage device 20, the more heat generated by the light emitting element 11 is utilized. This allows the power storage device 20 to be heated over a wide area. Even when a power storage device that is difficult to install is used, the reliability of the electronic device can be improved.

[0138] A configuration example of the power storage device 20 will be described in detail in the second embodiment.

[0139] <Circuit 30> The circuit 30 includes an antenna 31. The circuit 30 further includes a controller 32. That's fine.

[0140] The antenna 31 can receive power from an external antenna (for example, the antenna 68 of the charger). The antenna 31 may receive power from an external antenna via the display panel 10. Alternatively, the antenna 31 may receive power from an external antenna via the power storage device 20.

[0141] The controller 32 converts the power received by the antenna 31 into a power to be supplied to the power storage device 20. and outputs it to the power storage device 20. For example, the controller 32 In this case, the power received by the antenna 31 may function as a C converter. The electric power is converted into DC power and output to the power storage device 20 .

[0142] In the electronic device of this embodiment, the antenna 68 (primary coil) of the charger and the antenna of the electronic device The secondary coil is magnetically coupled to the magnetoresistive element 31 (secondary coil), and the AC magnetic field generated by the primary coil The power is transmitted to the secondary coil without contact by electromagnetic induction, which generates a voltage in the coil. The charging method is not limited to the electromagnetic induction method.

[0143] The use of the antenna of the electronic device is not limited to contactlessly charging the power storage device 20. For example, an electronic device may be provided with an antenna and a memory to transmit and receive electronic data. Depending on the received data, the display panel 10 may display images or information. , GPS (Global Positioning System) function to locate An antenna may be provided to obtain information or GPS time.

[0144] For safety reasons, it is important that the input / output terminals for charging or discharging the storage device are not exposed on the surface of the electronic device. If the input / output terminals are exposed, they may be shorted out by rain or other water. There is a risk of electric shock if the input / output terminal comes into contact with the human body. Since the power storage device can be charged by contact, the input / output terminals are not exposed on the surface of the electronic device. It can be configured as follows.

[0145] <Circuit 50> The circuit 50 converts the power supplied from the power storage device 20 into power that causes the light emitting element 11 to emit light. For example, the output voltage of the power storage device 20 is set to the value required for the light emitting element 11 to emit light. The power supply may have a function of converting (boosting or lowering) the voltage to a desired voltage.

[0146] The circuit 50 also generates a signal for driving the display panel 10 and outputs it to the display panel 10. The circuit 50 may have a signal line driver circuit or a scanning line driver circuit. In addition, the display panel 10 may have a signal line driving circuit or a scanning line driving circuit. Good too.

[0147] <Switch 51> The switch 51 is electrically connected to the circuit 50. The switch 51 is also connected to the power storage device 20. The switch 51 is electrically connected to the circuit 30. There are.

[0148] The switch 51 is not particularly limited, and may be, for example, an electrical switch, a mechanical switch, or the like. Specifically, transistors, diodes, magnetic switches, mechanical Examples include switches having contacts.

[0149] 7(A) and (B) show specific examples of the object to be sealed. FIG. 7(A) shows the surface of the object to be sealed (display surface) ) and FIG. 7(B) shows the back surface of the object to be sealed.

[0150] 7A and 7B show an example in which a laminated secondary battery is used as the power storage device 20. As shown in FIG. 7(B), the central part of the electricity storage device 20 is a part where a plurality of electrodes are stacked. It is thicker than the ends.

[0151] The electrode 21a is electrically connected to one of the positive electrode and the negative electrode of the power storage device 20. b is electrically connected to the other of the positive electrode or the negative electrode of the power storage device 20.

[0152] The electrodes 21a and 21b are bent through the circuit board 55 and connected to the terminals 33 on the circuit board 55. a and 33b, respectively.

[0153] The circuit board 55 is provided with elements (electronic components) that constitute the circuit 30, the circuit 50, etc., shown in FIG. 6(C) and the like. The circuit board 55 is provided with, for example, a capacitance element, a resistance element, and the like. The circuit board 55 is provided with electronic components such as a printed circuit board, a switch element, etc. A support substrate can be used.

[0154] In addition, a switch 51 is provided on the circuit board 55. In FIGS. An example in which a magnetic switch is used as the switch 51 is shown. The switch is turned on and off by attaching and detaching a magnet. Can be switched off.

[0155] The antenna 31 is electrically connected to a terminal 34 on the circuit board 55. A part of the power storage device 20 is located between the power storage device 20 and the display panel 10. The antenna 31 has a portion overlapping with the display panel 10. The antenna 31 also has a storage It has an overlapping portion with the device 20.

[0156] The antenna 31 can receive power from an external antenna via the display panel 10.

[0157] The terminal 12a of the display panel 10 is connected to the terminal 52a on the circuit board 55 via the wiring 53a. The terminal 12b of the display panel 10 is electrically connected to the It is electrically connected to a terminal 52 b on a circuit board 55 .

[0158] In an electronic device of one embodiment of the present invention, a power storage device and an antenna are independently provided on a display panel. 7A and 7B, the power storage device and the circuit overlap. ), for example, a part of the antenna 31 is located between the display panel 10 and the power storage device 20. It may be located.

[0159] As described above, the power storage device, the display panel, the circuit board, the antenna, etc., which constitute the electronic device, If at least two of the elements have overlapping portions, the size of the sealed object can be reduced. This is preferable.

[0160] For example, the power storage device 20 may be connected to at least one of the display panel 10, the circuit board 55, and the antenna 31. It is preferable that at least one of them has an overlapping portion. ), the power storage device 20 is connected to the display panel 10, the circuit board 55, and the antenna 31. It is particularly preferable that they have overlapping portions with each other.

[0161] The environment in which the electronic device of one embodiment of the present invention can be used is not limited to the air atmosphere. The electronic device can be used in water at temperatures between 0°C and 100°C. The temperature range in which the power storage device can be used is wide, and the light emitting element and the power storage device are sealed by a sealant. Therefore, the electronic device according to one embodiment of the present invention is highly reliable even when used underwater. Reliability can be ensured.

[0162] As shown in FIGS. 8A and 8B, the electronic device of one embodiment of the present invention is sealed with a sealing body 40. As shown in Figures 8(A) and 8(B), the object to be sealed may have multiple sealed regions. The sealing area 41 may be divided into several spaces. Wiring 45 and the like connecting the two may overlap. This region is a flexible region 70. As shown in FIG. 8B, the electronic device can be bent at the flexible region 70. In FIG. 8B, even if the display panel 10 is not flexible, it can be mounted on a flexible panel. By bending the region 70 where the sealing body 40 overlaps with the power storage device 20, the electronic device It is possible to bend the display panel 10 and wrap it around the arm, etc. The panel 10 may be bent to deform the electronic device.

[0163] In FIG. 8A, the display panel 10 is included in the upper space, and the power storage device 20 and The display panel 10 includes the power storage device 20 and the circuit 30 via the wiring 45. are electrically connected to each other.

[0164] The electronic device may have a double sealed region. A sealing region 41b may be provided to surround the region 41a, thereby doubly sealing the display panel 10 and the like. By providing two or more layers of protection, the reliability of electronic devices can be improved.

[0165] As shown in FIG. 8C, the display panel 10, the power storage device 20, and the circuit 30 are It is preferable that the edges of each of the display panel 10, the power storage device 20, and the circuit Since it is possible to prevent the seal from being broken at the corners of the path 30, it is possible to use a film or the like for the seal. This also makes it possible to suppress a decrease in the reliability of electronic devices.

[0166] Furthermore, the electronic device of one embodiment of the present invention includes a photoelectric conversion element, and the photoelectric conversion element is used to generate a power storage device. For example, it is preferable to be able to charge a power storage device using solar power generation. Alternatively, the electronic device of one embodiment of the present invention may have a function of generating power and charging by the movement of a user's arm. It may have.

[0167] The electronic device of one embodiment of the present invention preferably includes one or more sensors. For example, force, displacement, position, velocity, acceleration, angular velocity, rotation speed, distance, light (visible light, infrared light) , ultraviolet light, etc.), liquid, magnetism, temperature, chemicals, sound, time, hardness, electric field, current, voltage, The equipment may include functions to measure force, radiation, flow rate, humidity, gradient, vibration, or odor. This can be done.

[0168] The electronic device according to one aspect of the present invention is configured to measure a user's biological information such as heart rate, respiratory rate, pulse, body temperature, or blood pressure. It is preferable to have a sensor that measures the information.

[0169] The electronic device according to one aspect of the present invention has a function of detecting biological information and position information, and For example, the electronic device may detect changes in the user's physical condition. It is possible to transmit biometric information and location information to other electronic devices. In the event of illness or an accident, the user can receive prompt assistance. .

[0170] For example, an optical sensor can be used to measure heart rate from the contraction of capillaries in the arm, etc. .

[0171] In addition, sensors that detect whether an electronic device is attached to the user's arm based on the electrical conductivity of the skin are also being developed. By using a sensor, it may be possible to automatically turn on and off the power of electronic devices. .

[0172] These sensors are mounted on the surface of an electronic device that comes into contact with the user's skin. It is preferable that

[0173] The electronic device of one embodiment of the present invention may be capable of measuring data on the environment in which it is used. The device may have an external radiation sensor or illuminance sensor. By knowing the amount of ultraviolet light, the device can It can be used to prevent burns. In addition, the brightness of the display is automatically adjusted depending on the illuminance of the usage environment. These sensors may be used in electronic devices, for example, to adjust the display. It is preferable that the light source is mounted on the front side.

[0174] The electronic device according to one embodiment of the present invention may be capable of receiving GPS signals.

[0175] The electronic device of one embodiment of the present invention includes a driver circuit for a display panel, a power storage device for wirelessly charging, and a power supply circuit for wirelessly charging a power storage device. It also has a protection circuit to prevent overcharging of the power storage device. The device may have a control or driving circuit, specifically an integrated circuit (such as a CPU).

[0176] In addition, the electronic device of one embodiment of the present invention can include an imaging element, a power generating element, a speaker, a microphone, and the like. It may have a variety of functional elements or components.

[0177] The electronic device according to one embodiment of the present invention may include a touch panel.

[0178] In one embodiment of the present invention, a capacitive touch sensor or a pressure-sensitive touch sensor is displayed. A configuration in which the touch sensor is provided on the panel, or a configuration in which the touch sensor function is provided on the display panel itself (i.e., In-cell touch panels (also called in-cell touch panels) can be applied. A capacitive or optical touch sensor or the like can be applied to the touch panel.

[0179] Please note that you should not touch the device while swimming, scuba diving, or other water sports, or while bathing. Therefore, in one embodiment of the present invention, it is difficult to perform a touch operation or to detect a touch. It is preferable that the electronic device has a voice input unit as an input means. It is preferable to have a microphone, especially a bone conduction microphone. A bone conduction microphone has excellent noise resistance. Therefore, it can detect voices with high sensitivity even in noisy or noisy outdoor environments. It can be used underwater. Furthermore, the microphone does not need to be located near the mouth. This allows for a high degree of freedom in the positioning of the electronic device, and the device can be easily used in wrist-worn electronic devices. The electronic device may also have a bone conduction speaker as an output means. The vessel may also have other microphones or speakers that can be used underwater.

[0180] Furthermore, by applying one aspect of the present invention, a waterproof wearable device for everyday use can be manufactured. For example, an electronic device according to one embodiment of the present invention can be realized at a pressure of 2 atmospheres (bar) or more. Preferably, the pressure is 5 atmospheres or more, more preferably 10 atmospheres or more, and even more preferably 20 atmospheres or more. It is waterproof.

[0181] Furthermore, by applying one aspect of the present invention, a wearable device for diving can be realized. For example, the electronic device according to one embodiment of the present invention is waterproof up to 100 m, more preferably 20 If the watch is waterproof to 0m, it can be used when diving in shallow waters, such as when scuba diving. Furthermore, the electronic device according to one embodiment of the present invention can be waterproof up to 300 m. Preferably, a watch with water resistance up to 1000m would be ideal for deep sea diving, not just shallow waters. The electronic device of one embodiment of the present invention includes a display panel using a light-emitting element. Therefore, the display has the advantage of being highly visible even at night or underwater.

[0182] The electronic device according to one embodiment of the present invention includes a rotating bezel for measuring diving time or decompression time. , and in particular, it is preferable to have a unidirectional rotating bezel.

[0183] The electronic device according to one embodiment of the present invention is a device for measuring air temperature, water temperature, water depth, dive log, or the like. It may have a function of recording and displaying time, or a chronograph function. may have a function to transmit location information determined by GPS signals to other electronic devices. This can improve the safety of marine sports or work underwater.

[0184] Furthermore, when the electronic device according to one embodiment of the present invention is saltwater resistant, it can be used for marine sports or underwater activities. This is preferable because it can be suitably used when carrying out work.

[0185] 9(A) to 9(D) and 10(A) to 9(D) show a wrist-worn electronic device according to one embodiment of the present invention. A specific example is given below.

[0186] The electronic devices shown in FIGS. 9(A) to 9(D) and 10(A) to 10(D) each include one or more The display device includes a display unit and one or more encapsulants.

[0187] 9(A), (B), and 10(A) to (C) show the sealing body 40 directly attached to the arm or the like. This is an example of an electronic device that can be wrapped around a

[0188] The sealing body 40 is flexible and can be bent to fit the shape of the part where the electronic device is to be attached. Furthermore, the display unit 15 may also be flexible.

[0189] The fastener 91 is connected to the closure 40 .

[0190] The sealing body 40 is provided with a plurality of openings 93. The sealing body 40 is and impurities from entering the inside of the sealing body 40 through the end of the opening 93. To prevent this, it is preferable to provide a sealing portion 95 at the end of the opening 93. The sealing portion 95 is The sealing body 40 can be reinforced near the end of the opening 93. There is no limitation on the material of the sealing portion 95. For example, metals, alloys, organic resins, etc. can be used.

[0191] 9(A) and 10(A) show an example in which the display unit 15 is rectangular, and FIG. 9(B) and FIG. 10(B) and (C) show examples in which the display unit 15 is circular. For example, various shapes such as polygons other than squares, ellipses, semicircles, stars, hearts, etc. Display units of various shapes can be applied.

[0192] 9A and 9B show an electronic device having one display unit located approximately in the center of the electronic device. However, the position and number of the display units are not particularly limited. 10(B) and 10(C), the electronic device may have a display unit. The electronic device may have a display unit at a position shifted from the display unit. In this case, the shapes of the plurality of display sections may be the same or different from each other.

[0193] 9(C), 9(D), and 10(D) show structures connected to the sealing body 40. This is an example of an electronic device whose structure can be worn on the arm or other part of the body.

[0194] The electronic device may have a chain-like structure as shown in FIG. 9(C) and FIG. 10(D). Alternatively, the electronic device may have a structure and a A belt-like band 155 may be provided.

[0195] 9(C) and (D) show an example having one sealing body 40 and one display unit 15, and FIG. ) shows an example in which there are two sealing bodies 40 and two display units 15.

[0196] The structure may be made of, for example, one or more of metal, resin, or natural material. As the metal, stainless steel, aluminum, titanium alloy, etc. can be used. The resin may be an acrylic resin, a polyimide resin, or the like. Materials that can be used include processed wood, stone, bone, leather, paper, and cloth.

[0197] 11A to 11C show examples of how an electronic device of one embodiment of the present invention is attached. 11B shows an example of wearing an electronic device of one embodiment of the present invention on a wrist. This is an example of an electronic device worn over clothing, and can also be called an armband-type electronic device. 1 is an example in which an electronic device of one embodiment of the present invention is worn on the upper arm.

[0198] Furthermore, the electronic device according to one aspect of the present invention is not limited to being attached to a part of the body, but may be attached to a robot. robots (factory robots, humanoid robots, etc.), columnar objects (building poles, utility poles, sign poles) Alternatively, it may be attached to a tool or the like.

[0199] The electronic device of one embodiment of the present invention has a communication function and can send and receive emails by itself. For example, electronic devices may be used for mobile phone calls, e-mail, text browsing and writing, music playback, etc. , internet communication, computer games, and other applications. It is preferable.

[0200] Alternatively, the electronic device of one embodiment of the present invention may be used with a mobile phone such as a smartphone or other mobile information device. By connecting wirelessly to a terminal, e-mails can be sent and received. For example, When used together with a smartphone, the display portion of the electronic device of one embodiment of the present invention can be used as a sub-display. It may also be used.

[0201] As described above, in one embodiment of the present invention, a display panel, a circuit, a power storage device, or the like is sealed with a highly waterproof sealant. By stopping the device, it is possible to realize a wearable device that can be used during water sports or bathing. In one embodiment of the present invention, a sealed body, a display panel, and By applying a power storage device, it is possible to realize a wearable device that can be used over a wide temperature range. do.

[0202] This embodiment mode can be combined with other embodiment modes as appropriate.

[0203] (Embodiment 2) In this embodiment, a power storage device that can be used in an electronic device of one embodiment of the present invention will be described. 12 to 23. Note that the power storage device according to one embodiment of the present invention is The configuration is not limited to the example shown in the form, and various shapes and configurations can be applied.

[0204] In this embodiment, a lithium-ion secondary battery will be described as an example. One embodiment of the present invention is a battery, a primary battery, a secondary battery, a lithium-air battery, a lead-acid battery, batteries, lithium-ion polymer secondary batteries, nickel-metal hydride batteries, nickel-cadmium batteries Batteries, nickel-iron batteries, nickel-zinc batteries, silver-oxide-zinc batteries, solid-state batteries, air Zinc-air battery, capacitor, lithium-ion capacitor, electric double layer capacitor It may be applied to ultracapacitors, supercapacitors, etc.

[0205] In one embodiment of the present invention, the power storage device is in contact with a power supply source (hereinafter also referred to as a power transmission device). When the device is not connected to the power supply, power is supplied to the target device (hereinafter also referred to as the power receiving device) (contactless Power can be supplied using a non-contact power supply method (also known as contactless power supply or wireless power supply). Examples of such a method include a magnetic field resonance method, an electromagnetic induction method, and an electrostatic induction method.

[0206] <Configuration example 1> FIG. 12(A) shows the battery unit 500. In FIG. 12(A), Although a thin secondary battery is shown as an example, one embodiment of the present invention is not limited to this. For example, a secondary battery using a wound body, or a cylindrical or coin-type secondary battery is an embodiment of the present invention. The present invention may be applied to various electronic devices.

[0207] As shown in FIG. 12(A), the battery unit 500 includes a positive electrode 503, a negative electrode 506, a separator The battery unit 500 has a positive electrode lead 510 and a negative electrode lead 511. It may have a pole lead 511 .

[0208] 13(A) and 13(B) show examples of cross-sectional views taken along the dashed line A1-A2 in FIG. 12(A). 13(A) and 13(B) show a pair of a positive electrode 503 and a negative electrode 506. 1 and 2 show the cross-sectional structure of the battery unit 500.

[0209] As shown in FIGS. 13A and 13B, the battery unit 500 includes a positive electrode 503, a negative electrode 506, The battery includes a separator 507, an electrolyte 508, and an exterior body 509. The separator 507 is The area surrounded by the exterior body 509 is filled with the electrolyte 50 It is filled with 8.

[0210] The positive electrode 503 includes a positive electrode active material layer 502 and a positive electrode current collector 501. It includes an active material layer 505 and a negative electrode current collector 504. The active material layer is formed on one or both sides of the current collector. The separator 507 is disposed between the positive electrode current collector 501 and the negative electrode current collector 504. Located.

[0211] The battery unit has one or more positive electrodes and one or more negative electrodes. It is also possible to have a laminated structure consisting of several positive electrodes and several negative electrodes.

[0212] FIG. 14A shows another example of a cross-sectional view taken along the dashed dotted line A1-A2 in FIG. FIG. 14B shows a cross-sectional view taken along the dashed line B1-B2 in FIG.

[0213] 14(A) and (B) show a battery unit fabricated using multiple pairs of positive electrodes 503 and negative electrodes 506. The cross-sectional structure of the battery unit 500 is shown. There is no limit to the number of electrode layers that the battery unit 500 has. When the number of electrode layers is large, the power storage device can have a larger capacity. When the number of capacitors is small, the power storage device can be thin and highly flexible.

[0214] 14(A) and (B), a positive electrode having a positive electrode active material layer 502 on one side of a positive electrode current collector 501 is shown. and two positive electrodes 503 each having a positive electrode active material layer 502 on both sides of a positive electrode current collector 501. In addition, in an example using three negative electrodes 506 each having a negative electrode active material layer 505 on both sides of a negative electrode current collector 504, That is, the battery unit 500 has six positive electrode active material layers 502 and six negative electrode active material layers 503. 14(A) and (B), the separator 507 is in the form of a bag. However, the separator 507 is not limited to this, and may be a strip or a bellows shape. stomach.

[0215] Next, Fig. 12(B) shows an external view of the positive electrode 503. The positive electrode 503 is composed of a positive electrode current collector 501 and and a positive electrode active material layer 502.

[0216] 12(C) shows an external view of the negative electrode 506. The negative electrode 506 is made up of a negative electrode current collector 504 and a and a negative electrode active material layer 505 .

[0217] Here, the positive electrode 503 and the negative electrode 506 are stacked together by a plurality of positive electrodes or a plurality of negative electrodes. For electrical connection, it is preferable to have a tab region. It is preferable to electrically connect the boards.

[0218] As shown in FIG. 12(B), the positive electrode 503 preferably has a tab region 281. A portion of the tab region 281 is preferably welded to the positive electrode lead 510. It is preferable that the positive electrode current collector 501 has an exposed region. By welding the positive electrode lead 510 to the area where the positive electrode lead 510 is located, the contact resistance can be reduced. In addition, in FIG. 12(B), the positive electrode current collector 501 is exposed over the entire area of ​​the tab region 281. However, the tab region 281 may have a positive electrode active material layer 502 in a part thereof.

[0219] As shown in FIG. 12(C), the negative electrode 506 preferably has a tab region 282. A portion of the tab region 282 is preferably welded to the negative electrode lead 511. It is preferable that the negative electrode current collector 504 is exposed in a region. By welding the negative electrode lead 511 to the region where the negative electrode lead 511 is located, the contact resistance can be further reduced. In addition, in FIG. 12(C), the negative electrode current collector 504 is exposed over the entire area of ​​the tab region 282. 10, the tab region 282 may have a negative electrode active material layer 505 in a part thereof.

[0220] In addition, although FIG. 12(A) shows an example in which the ends of the positive electrode 503 and the negative electrode 506 are roughly aligned, The positive electrode 503 may have a portion located outside the end of the negative electrode 506 .

[0221] In the battery unit 500, the area of ​​the negative electrode 506 that does not overlap with the positive electrode 503 is small. The more the better.

[0222] FIG. 13A shows an example in which the end of the negative electrode 506 is located inside the positive electrode 503. By adopting such a configuration, the negative electrode 506 is entirely overlapped with the positive electrode 503, or the positive electrode 503 of the negative electrode 506 is overlapped with the positive electrode 503. The area of ​​the region that does not overlap with the pole 503 can be reduced.

[0223] Alternatively, in the battery unit 500, the areas of the positive electrode 503 and the negative electrode 506 are approximately the same. For example, a positive electrode 503 and a negative electrode 506 facing each other with a separator 507 interposed therebetween are preferably For example, the areas of the two electrodes facing each other with the separator 507 in between are preferably approximately the same. It is preferable that the area of ​​the positive electrode active material layer 502 and the area of ​​the negative electrode active material layer 505 are approximately the same. stomach.

[0224] For example, as shown in FIGS. 14(A) and 14(B), the surface of the positive electrode 503 on the separator 507 side It is preferable that the area of ​​the surface of the negative electrode 506 facing the separator 507 is approximately the same as that of the positive electrode 506. The area of ​​the surface of the negative electrode 503 on the negative electrode 506 side is approximately the same as the area of ​​the surface of the negative electrode 506 on the positive electrode 503 side. By doing so, the area of ​​the negative electrode 506 that does not overlap with the positive electrode 503 is reduced (or ideally This can reduce the irreversible capacity of the battery unit 500. 14(A) and (B), the separator of the positive electrode active material layer 502 The area of ​​the surface of the negative electrode active material layer 505 on the separator 507 side is approximately the same as the area of ​​the surface of the negative electrode active material layer 505 on the separator 507 side. It is preferable that the same.

[0225] As shown in FIGS. 14(A) and 14(B), the end of the positive electrode 503 and the end of the negative electrode 506 are roughly It is preferable that the edges of the positive electrode active material layer 502 and the negative electrode active material layer 505 are approximately aligned. It is preferable.

[0226] FIG. 13B shows an example in which the edge of the positive electrode 503 is located inside the negative electrode 506. By adopting such a configuration, the positive electrode 503 is completely overlapped with the negative electrode 506, or the positive electrode 50 The area of ​​the region that does not overlap with the negative electrode 506 of the third electrode can be reduced. If the electrode is positioned inside the end of the positive electrode 503, the current may concentrate at the end of the negative electrode 506. For example, when a current is concentrated in a part of the negative electrode 506, lithium may be deposited on the negative electrode 506. The area of ​​the positive electrode 503 that does not overlap with the negative electrode 506 is reduced. This can prevent current from concentrating on a part of the negative electrode 506. This is preferable because it can prevent lithium from being deposited on the negative electrode 506 .

[0227] As shown in FIG. 12(A), the positive electrode lead 510 can be electrically connected to the positive electrode 503. Similarly, the negative electrode lead 511 is preferably electrically connected to the negative electrode 506. The positive electrode lead 510 and the negative electrode lead 511 are exposed to the outside of the exterior body 509 and are electrically connected to the outside. It functions as a terminal for obtaining electrical contact.

[0228] Alternatively, the positive electrode current collector 501 and the negative electrode current collector 504 may serve as terminals for electrical contact with the outside. In this case, the positive electrode current collector 501 and the negative electrode current collector 502 can be connected without using an electrode lead. The electrode current collector 504 may be disposed so that a part of it is exposed to the outside from the exterior body 509 .

[0229] In addition, in FIG. 12(A), the positive electrode lead 510 and the negative electrode lead 511 are connected to the battery unit 500. 15, the positive electrode lead 510 and the negative electrode lead 51 1 may be arranged on different sides of the battery unit 500. The pond unit allows for free placement of electrode leads, allowing for a high degree of freedom in design. This allows for greater freedom in designing products that use power storage devices. Product productivity can be increased.

[0230] The components of the battery unit will be described in detail below.

[0231] <Current collector> The current collector may be any suitable material, as long as it exhibits high electrical conductivity without causing significant chemical changes within the storage device. There is no limitation. The positive electrode current collector and the negative electrode current collector may be made of, for example, stainless steel, gold, platinum, zinc, or iron. , nickel, copper, aluminum, titanium, tantalum, manganese and other metals, and their alloys, Alternatively, copper or stainless steel may be used. It may be coated with carbon, nickel, titanium, or the like. Al alloys with added elements that improve heat resistance, such as neodymium, scandium, and molybdenum. Aluminum alloys can be used, or react with silicon to form silicides. The current collector may be formed of a metal element. A metal element that reacts with silicon to form a silicide. These include zirconium, titanium, hafnium, vanadium, niobium, tantalum, and chromium. , molybdenum, tungsten, cobalt, nickel, etc.

[0232] An irreversible reaction may occur between the surface of the positive electrode current collector or the surface of the negative electrode current collector and the electrolyte. Therefore, it is preferable that the positive electrode current collector and the negative electrode current collector each have low reactivity with the electrolyte. For example, by using stainless steel for the positive electrode current collector or the negative electrode current collector, the electrolyte This is preferable because it may be possible to make the reactivity with the

[0233] The positive electrode current collector and the negative electrode current collector are each in the form of a foil, a plate (sheet), a mesh, a cylinder, or the like. Shape: sheet, coil, punched metal, expanded metal, porous, and nonwoven fabric Furthermore, the adhesiveness to the active material layer can be improved. To achieve this, the positive electrode current collector and the negative electrode current collector may each have fine irregularities on their surfaces. The thickness of the positive electrode current collector and the negative electrode current collector is 5 μm or more and 30 μm or less. It is recommended to use the following.

[0234] An undercoat layer may be provided on a part of the surface of the current collector. The purpose of this is to reduce the contact resistance between the current collector and the active material layer or to improve the adhesion between the current collector and the active material layer. The undercoat layer is not formed on the entire surface of the current collector. The undercoat layer may be formed in an island shape (partially). The undercoat layer may be made of, for example, a carbon material. Examples of carbon materials include carbon black such as acetylene black, carbon black, Carbon nanotubes, graphite, etc. can be used as the undercoat layer. Metal layers, layers containing carbon and polymers, and layers containing metal and polymers can also be used. .

[0235] ≪Active material layer≫ The active material layer contains an active material. The active material is a material that is involved in the insertion and desorption of ions, which act as carriers. In this specification, the layer containing the active material is called the active material layer. In addition to the active material, the conductive material may contain a conductive aid and a binder.

[0236] The positive electrode active material layer contains one or more positive electrode active materials. The negative electrode active material layer contains one or more negative electrode active materials. It has an active material.

[0237] The positive electrode active material and the negative electrode active material play a central role in the battery reaction of the energy storage device and are the carrier ions. To extend the life of the power storage device, the active material must be able to absorb and release charge. It is preferable that the capacity of the material involved in the irreversible reaction is small, and that the material has high charge / discharge efficiency. It is preferable that

[0238] The positive electrode active material is a material that can insert and extract carrier ions such as lithium ions. The positive electrode active material can be, for example, a material having an olivine type crystal structure or a layered rock salt type crystal structure. Examples of such materials include those having a crystalline structure, a spinel crystalline structure, and a NASICON crystalline structure. do.

[0239] For example, the positive electrode active material may be LiFeO2, LiCoO2, LiNiO2, or LiMn2O 4. Compounds such as V2O5, Cr2O5, and MnO2 can be used as materials.

[0240] Materials with an olivine-type crystal structure include lithium-containing complex phosphates (general formula LiM PO4 (M is one or more of Fe(II), Mn(II), Co(II), and Ni(II)) Representative examples of the general formula LiMPO4 include LiFePO4, LiNiPO4 , LiCoPO4, LiMnPO4, LiFe a Ni b PO4, LiFe a Co b PO4 , LiFe a Mn b PO4, LiNi a Co b PO4, LiNi a Mn bPO4(a + b is 1 or less, 0 < a < 1, 0 < b < 1), LiFe c Ni d Co e PO4, LiFe c Ni d Mn e PO4, LiNi c Co d Mn e PO4 (c + d + e is 1 or less, 0 < c < 1, 0 < d < 1, 0 < e < 1), LiFe f Ni g Co h Mn i PO4 (f + g + h + i is 1 or less , 0 < f < 1, 0 < g < 1, 0 < h < 1, 0 < i < 1), etc. Compounds such as these can be mentioned.

[0241] For example, lithium iron phosphate (LiFePO4) satisfies the requirements for a cathode active material, such as safety, stability, high capacity density, high potential , the presence of lithium ions that can be extracted during initial oxidation (charging), etc., in a well - balanced manner, so it is preferable. By using LiFePO4 as the cathode active material, a storage device that is stable and highly safe against external loads such as overcharging can be realized. Therefore, for example, as a storage device used in mobile devices that can be carried around

[0242] or wearable devices worn on the body, etc., it is particularly excellent.

[0243] Examples of materials having a layered rock - salt - type crystal structure include, for example, lithium cobalt oxide (LiCoO 2), LiNiO2, LiMnO2, Li2MnO3, LiNi 2), LiNiO2, LiMnO2, Li2MnO3, LiNi 0.8 Co 0.2 O2, etc. Among them, Ni - Co - based (general formula is LiNi x Co 1-x O2 (0 < x < 1)), LiNi 0.5 Mn0.5 O2 etc. NiMn system (general formula: LiNi x Mn 1-x O2(0 <x<1)) , LiNi 1 / 3 Mn 1 / 3 Co 1 / 3 NiMnCo system (also called NMC) such as O2. The formula is LiNi x Mn y Co 1-x-y O2(x>0, y>0, x+y<1) Furthermore, Li(Ni 0.8 Co 0.15 Al 0.05 )O2, Li2MnO3-L iMO2 (M is Co, Ni or Mn) and the like are also included.

[0244] In particular, LiCoO2 has a large capacity and is more stable in the air than LiNiO2. It is preferable because it has advantages such as being more thermally stable than LiNiO2.

[0245] Examples of materials having a spinel-type crystal structure include LiMn2O4, Li 1+x Mn 2-x O4(0 <x<2)、LiMn 2-x Al x O4(0 <x<2)、LiMn 1.5 Ni 0.5 Examples include O4.

[0246] A material with a spinel-type crystal structure containing manganese, such as LiMn2O4, and a small amount of nickel Lithium nitrate (LiNiO2, or LiNi 1-x M x O2(0 <x<1)(M=Co、 Mixing Al, etc., has the advantage of suppressing the elution of manganese and the decomposition of the electrolyte. This is preferable.

[0247] Alternatively, the positive electrode active material may be a compound represented by the general formula Li(2-j) MSiO₄ (where M is one or more of Fe(II), Mn(II), Co(II), Ni(II); 0 ≦ j ≦ 2), etc., lithium-containing composite silicates can be used. The general formula is Li MSiO₄. Representative examples of Li (2-j) MSiO₄ include L i (2-j) FeSiO₄, Li (2-j) NiSiO₄, Li (2-j) CoSiO₄ 、Li (2-j) MnSiO₄, Li (2-j) Fe k Ni l SiO₄, Li[[ID=​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​ Alternatively, as the positive electrode active material, A x M2(XO4)3(A=Li, Na, Mg, M=Fe, Mn, Ti, V, Nb, Al, X = S, P, Mo, W, As, Si) NASICON type compounds can be used. As the NASICON type compounds, Fe 2(MnO4)3, Fe2(SO4)3, Li3Fe2(PO4)3, etc.

[0249] Alternatively, as the positive electrode active material, Li2MPO4F, Li2MP2O7, Li5MO4 (M= Compounds represented by the general formula (Fe, Mn), perovskite-type fluorides such as FeF3, Ti Metal chalcogenides (sulfides, selenides, tellurides) such as S2 and MoS2, LiMV Materials with an inverse spinel crystal structure such as O4 (M = Mn, Co, Ni), vanadate Compounds (V2O5, V6O 13 , LiV3O8, etc.), manganese oxides, organic sulfur compounds, etc. The following materials can be used.

[0250] Furthermore, a combination of the above materials may be used as the positive electrode active material. A solid solution of a combination of these materials can be used as the positive electrode active material. Co 1 / 3 Mn 1 / 3 Ni 1 / 3 A solid solution of O2 and Li2MnO3 was used as the positive electrode active material. It is possible.

[0251] In addition, the carrier ions are alkali metal ions other than lithium ions, or alkaline earth ions. In the case of metal ions, the positive electrode active material may be the above lithium compounds or lithium-containing complex phosphates. In the lithium-containing complex silicates, lithium is preferably substituted with an alkali metal (e.g., sodium Alkaline earth metals (e.g., calcium, strontium, barium, etc.), Compounds substituted with a carrier such as tungsten, beryllium, magnesium, etc. may also be used.

[0252] The average particle size of the primary particles of the positive electrode active material is preferably, for example, 5 nm or more and 100 μm or less.

[0253] For example, when a lithium-containing composite phosphate having an olivine structure is used as the positive electrode active material, In olivine, the diffusion path of lithium is one-dimensional, so lithium diffusion is slow. When using a lithium-containing composite phosphate with a phosphate structure, the positive electrode active material must be increased in order to increase the charge / discharge rate. The average particle size of the substance is preferably, for example, 5 nm or more and 1 μm or less. The specific surface area of ​​the active material is preferably 10 m 2 / g or more 50m 2 / g or less is recommended. .

[0254] Active materials with an olivine structure have a higher crystalline structure than active materials with a layered rock salt structure, for example. Compared to lithium-ion batteries, the structural changes that occur during charging and discharging are extremely small, and the crystalline structure is stable, so there is no risk of overcharging or other problems. When used as a positive electrode active material, it is possible to realize a highly safe energy storage device. It can be realized.

[0255] As the negative electrode active material, for example, a carbon-based material, an alloy-based material, or the like can be used.

[0256] Carbon materials include graphite, easily graphitizable carbon (soft carbon), and non-graphitizable carbon (hard carbon). graphene, carbon black, etc. Examples include mesocarbon microbeads (MCMB), coke-based artificial graphite, and pitch-based artificial graphite. There are artificial graphite such as graphite and natural graphite such as spherical natural graphite. There are globular and spherical ones.

[0257] When lithium ions are inserted into graphite (when lithium-graphite intercalation compounds are formed), It exhibits a low potential similar to that of lithium metal (0.1 to 0.3 V vs. Li / Li + This allows the lithium-ion secondary battery to exhibit a high operating voltage. Graphite has a relatively high capacity per unit volume, small volume expansion, is inexpensive, and is a lithium It is preferable because it has advantages such as higher safety compared to metals.

[0258] When the carrier ion is a lithium ion, the alloy material may be, for example, Mg, Ca , Ga, Si, Al, Ge, Sn, Pb, As, Sb, Bi, Ag, Au, Zn, Cd, Materials containing at least one of Hg, In, etc. can be used. Silicon has a higher capacity than carbon, and its theoretical capacity is 4200mAh / g. The capacity of the power storage device can be increased. Examples of the materials include Mg2Si, Mg2Ge, Mg2Sn, SnS2, V2Sn3, FeSn2, CoSn2, Ni3Sn2, Cu6Sn5, Ag3Sn, Ag3Sb, Ni 2MnSb, CeSb3, LaSn3, La3Co2Sn7, CoSb3, InSb, S bSn, etc.

[0259] In addition, the negative electrode active material is SiO, SnO, SnO2, titanium dioxide (TiO2), lithium Sodium titanium oxide (Li4Ti5O 12 ), lithium-graphite intercalation compound (Li x C6), Niobium pentoxide (Nb2O5), tungsten oxide (WO2), molybdenum oxide (MoO2 ) and other oxides can be used. Here, SiO is a compound containing silicon and oxygen. If the atomic ratio of silicon to oxygen is silicon:oxygen=α:β, α has a value close to β. Here, having a value close to the value of β means that, for example, the absolute value of the difference between α and β is equal to the value of β. It is preferably 20% or less, more preferably 10% or less.

[0260] In addition, the negative electrode active material is a composite nitride of lithium and transition metals, which has a Li3N structure. Li 3-x M x N (M is Co, Ni or Cu) can be used. For example, Li 2. 6Co 0.4 N3 has a large charge / discharge capacity (900mAh / g, 1890mAh / cm 3 )of This is preferable.

[0261] When a composite nitride of lithium and a transition metal is used, the negative electrode active material contains lithium ions, The positive electrode active material is a combination of materials such as V2O5 and Cr3O8 that do not contain lithium ions. Even when a material containing lithium ions is used as the positive electrode active material, By first removing the lithium ions contained in the positive electrode active material, lithium is released as the negative electrode active material. A complex nitride of ammonium and a transition metal can be used.

[0262] In addition, a material that undergoes a conversion reaction can also be used as the negative electrode active material. , cobalt oxide (CoO), nickel oxide (NiO), iron oxide (FeO), etc. A transition metal oxide that does not undergo an alloying reaction with the negative electrode active material may be used. Further materials that undergo a reaction include Fe2O3, CuO, Cu2O, RuO2, and Cr2O Third order oxide, CoS 0.89 , NiS, CuS and other sulfides, Zn3N2, Cu3N, G Nitrides such as e3N4, phosphides such as NiP2, FeP2, CoP3, FeF3, BiF3 Fluorides such as:

[0263] The average particle size of the primary particles of the negative electrode active material is preferably, for example, 5 nm or more and 100 μm or less.

[0264] The positive electrode active material layer and the negative electrode active material layer may each contain a conductive additive.

[0265] As the conductive additive, for example, a carbon material, a metal material, or a conductive ceramic material is used. In addition, a fibrous material may be used as the conductive additive. The content of the conductive additive is preferably 1 wt% or more and 10 wt% or less, and more preferably 1 wt% or more and 5 wt% or less. % or less is more preferable.

[0266] The conductive additive can form an electrically conductive network in the electrode. This allows the electrical conduction path between the negative electrode active materials to be maintained. By adding the agent, an active material layer having high electrical conductivity can be realized.

[0267] Examples of the conductive additive include natural graphite, artificial graphite such as mesocarbon microbeads, and carbon fiber. Examples of carbon fibers that can be used include mesophase pitch carbon fibers. Carbon fibers such as isotropic pitch-based carbon fibers can be used. Carbon nanofibers or carbon nanotubes can be used. The nanotubes can be produced by, for example, a vapor phase growth method. For example, carbon black (acetylene black (AB) etc.), graphite particles Carbon materials such as silicon, graphene, and fullerene can be used. Metal powder or metal fiber such as nickel, aluminum, silver, gold, or conductive ceramic Materials such as lacquer can be used.

[0268] Flaky graphene has excellent electrical properties, such as high conductivity, as well as flexibility and functionality. Graphene has excellent physical properties, such as mechanical strength, and is therefore used as a conductive additive. This can increase the electrical conductivity between the active materials or between the active material and the current collector.

[0269] In this specification, graphene refers to a single-layer graphene or a graphene having 2 to 100 layers. Single-layer graphene is a graphene consisting of a single atomic layer of carbon molecules with π bonds. Graphene oxide refers to a compound in which the graphene is oxidized. This is what is meant.

[0270] Graphene allows for surface contact with low contact resistance, and is conductive even when thin. The conductivity is so high that even a small amount can efficiently form a conductive path within the active material layer.

[0271] When using an active material with a small average particle size, for example, an active material with a particle size of 1 μm or less, the specific surface area of ​​the active material In such cases, the area is large and more conductive paths are required to connect the active materials. Graphene is used, which has extremely high conductivity and can efficiently form conductive paths even in small amounts. It is particularly preferred that

[0272] The positive electrode active material layer and the negative electrode active material layer may each contain a binder.

[0273] In this specification, the binder has the function of binding or adhering active materials together, and It has at least one of the functions of binding or adhering the active material layer and the current collector. The state of the binder may change during the preparation of the electrode or battery. For example, the binder It may take at least one of the following states: liquid, solid, or gel. The agent changes from a monomer to a polymer during the fabrication of an electrode or battery. There are cases where this happens.

[0274] For example, a water-soluble polymer can be used as the binder. For example, polysaccharides can be used. Examples of polysaccharides include carboxymethyl cellulose. (CMC), methyl cellulose, ethyl cellulose, hydroxypropyl cellulose, di Cellulose derivatives such as acetyl cellulose and regenerated cellulose, or starch, etc. may be used. This can be done.

[0275] In addition, styrene-butadiene rubber (SBR), styrene-isoprene rubber (SBR), etc. are used as binders. Styrene rubber, acrylonitrile butadiene rubber, butadiene rubber, fluororubber, ethylene Rubber materials such as ethylene-propylene-diene copolymers can be used. These rubber materials may be used in combination with the water-soluble polymers described above. It has a high elasticity and is therefore prone to expansion and contraction due to the expansion and contraction of the active material during charging and discharging, or bending of the electrode. On the other hand, it has a hydrophobic group and is soluble in water. In such cases, the particles may be dispersed in an aqueous solution without dissolving in water. Therefore, a composition containing a solvent used to form the active material layer (also called an electrode mixture composition) is applied to the electrode. It can be difficult to increase the viscosity to a level suitable for spreading. The use of highly water-soluble polymers, such as polysaccharides, is expected to have the effect of increasing the viscosity of the solution to an appropriate degree. In addition, it can be dispersed uniformly with the rubber material, resulting in a highly uniform and good electrode, for example, Alternatively, an electrode with high uniformity in electrode resistance can be obtained.

[0276] Alternatively, PVdF, polystyrene, polymethyl acrylate, polymethacrylate, etc. may be used as a binder. Methyl acrylate (Polymethyl methacrylate (PMMA)), sodium polyacrylate, poly Polyvinyl alcohol (PVA), polyethylene oxide (PEO), polypropylene oxide Sid, polyimide, polyvinyl chloride, polytetrafluoroethylene, polyethylene, poly Propylene, isobutylene, polyethylene terephthalate (PET), nylon, polyamide PAN, polyvinyl chloride, ethylene propylene diene polymer Materials such as polyvinyl acetate and nitrocellulose can be used.

[0277] Two or more of the above binders may be used in combination.

[0278] The content of the binder relative to the total amount of the active material layer is preferably 1 wt% or more and 10 wt% or less, The content is more preferably from 3 wt% to 8 wt% and even more preferably from 3 wt% to 5 wt%.

[0279] ≪Electrolyte≫ The solvent of the electrolytic solution 508 is preferably an aprotic organic solvent, for example, ethylene glycol. Carbonate (EC), Propylene Carbonate (PC), Butylene Carbonate, Chloride Ethylene carbonate, vinylene carbonate (VC), γ-butyrolactone, γ-valerolactone Lactone, dimethyl carbonate (DMC), diethyl carbonate (DEC), ethyl Methyl carbonate (EMC), methyl formate, methyl acetate, methyl butyrate, 1,3-diox San, 1,4-dioxane, dimethoxyethane (DME), dimethyl sulfoxide, diethylene ethyl ether, methyl diglyme, acetonitrile, benzonitrile, tetrahydrofuran one of sultone, sulfolane, sultone, or any combination of two or more of these. It can be used in various ratios.

[0280] In addition, a flame-retardant and non-volatile ionic liquid (room-temperature molten salt) was used as the solvent for the electrolyte. Or, by using multiple batteries, the internal temperature of the storage device may rise due to an internal short circuit or overcharging. Even if the battery is used, the battery can be prevented from exploding or catching fire. The electrolyte solution is made of tetravalent cations and anions. ammonium cations, tertiary sulfonium cations, and quaternary phosphonium cations Aliphatic onium cations such as the above, as well as imidazolium cations and pyridinium cations The following aromatic cations are also used as anions in electrolytes: monovalent amide-based Anions, monovalent methide anions, fluorosulfonate anions, perfluoroalkanes perfluoroalkyl borate anion, tetrafluoroborate anion, perfluoroalkyl bo ... phosphate anion, hexafluorophosphate anion, or perfluoroalkylphosphate anions, etc.

[0281] In addition, when lithium ions are used as a carrier, the electrolyte to be dissolved in the solvent is , such as LiPF6, LiClO4, LiAsF6, LiBF4, LiAlCl4, Li SCN, LiBr, LiI, Li2SO4, Li2B 10 Cl 10 , Li2B 12 Cl1 2, LiCF3SO3, LiC4F9SO3, LiC(CF3SO2)3, LiC(C2 F5SO2)3, LiN(FSO2)2, LiN(CF3SO2)2, LiN(C4F9 SO2)(CF3SO2), LiN(C2F5SO2)2, or one of these lithium salts Two or more of these may be used in any combination and in any ratio.

[0282] In addition, the electrolyte used in the electricity storage device is free from granular waste or elements other than the constituent elements of the electrolyte (hereinafter, It is preferable to use a highly purified electrolyte solution with a low content of impurities. Specifically, the weight ratio of impurities to the electrolyte is 1% or less, preferably 0.1% or less. More preferably, it is set to 0.01% or less.

[0283] In addition, the electrolyte contains vinylene carbonate (VC), propane sultone (PS), tert- Butylbenzene (TBB), fluoroethylene carbonate (FEC), LiBOB, etc. The concentration of the additive may be, for example, 0.1 wt % or more relative to the total solvent. It can be 5 wt% or less.

[0284] Alternatively, a polymer gel electrolyte may be used in which a polymer is swollen with an electrolytic solution.

[0285] Examples of the polymer include polyalkylene oxides such as polyethylene oxide (PEO). Polymers with a hexafluoroethylene structure, such as PVdF and polyacrylonitrile, and copolymers containing these For example, a copolymer of PVdF and hexafluoropropylene (HFP) can be used. The polymer PVdF-HFP can be used. The polymer has a porous shape. It may have.

[0286] Alternatively, a polymerization initiator and a crosslinking agent may be added to the electrolytic solution to gel the electrolytic solution. Polymerizable functional groups are introduced into the cations or anions that make up the ionic liquid, and a polymerization initiator is used. The ionic liquid itself may be polymerized by polymerizing them. The liquid may be gelled with a cross-linking agent.

[0287] In addition, a solid electrolyte having an inorganic material such as a sulfide or oxide in combination with an electrolytic solution is also used. solid electrolytes, or polymeric materials such as PEO (polyethylene oxide) For example, a solid electrolyte may be formed on the surface of the active material layer. When using a combination of electrolytes, the installation of a separator or spacer is not required. There is.

[0288] In addition, by using a polymer material that gels as a solvent for the electrolyte, safety against leakage etc. is improved. Safety is improved. In addition, it is possible to make the power storage device thinner and lighter. For example, polyethylene Oxide-based, polyacrylonitrile-based, polyvinylidene fluoride-based, polyacrylate-based, Polymethacrylate polymers can be used. It is preferable to use a polymer that can gel the solution. Alternatively, a silicone gel or the like can be used. In this specification and the like, for example, the term "polyvinylidene fluoride polymer" refers to a polyvinylidene fluoride polymer. It means a polymer containing polyvinylidene fluoride (PVdF), and poly(vinylidene fluoride- Poly(hexafluoropropylene) copolymers, etc.

[0289] The above polymers can be determined by using an FT-IR (Fourier transform infrared spectrophotometer) or the like. For example, polyvinylidene fluoride polymers can be analyzed by FT-IR. The spectrum shows absorption indicating C—F bonds. The FT-IR spectrum shows absorption indicative of a C≡N bond.

[0290] <Separator> The separator 507 may be made of paper, nonwoven fabric, glass fiber, ceramics, or nylon ( Polyamide), Vinylon (polyvinyl alcohol fiber), polyester, acrylic, Synthetic fibers such as polyethylene and polyurethane can be used. 7 may have a single layer structure or a laminated structure.

[0291] More specifically, the separator 507 may be made of, for example, a fluorine-based polymer, polyethylene oxide, or the like. Polyethers such as olefins, polypropylene oxide, polyethylene, polypropylene, etc. Polyolefin, Polyacrylonitrile, Polyvinylidene chloride, Polymethyl methacrylate , polymethyl acrylate, polyvinyl alcohol, polymethacrylonitrile, polyvinyl Acetate, Polyvinylpyrrolidone, Polyethyleneimine, Polybutadiene, Polystyrene Polyethylene, polyisoprene, polyurethane polymers, polyphenylene sulfide, and the like One or two of the following may be used: derivatives thereof, cellulose, paper, nonwoven fabric, and glass fiber. The above may be used in combination.

[0292] <Exterior body> The surface of the exterior body 509 that comes into contact with the electrolyte 508, i.e., the inner surface, has a significant reaction with the electrolyte 508. It is preferable that the battery unit 500 does not undergo any reaction. If moisture gets into the electrolyte 508, a reaction may occur between the components of the electrolyte 508 and the water. It is preferable that the exterior body 509 has low moisture permeability.

[0293] The exterior body 509 is made of, for example, polyethylene, polypropylene, polycarbonate, iono Flexible materials such as aluminum, stainless steel, copper, and nickel are applied to a film made of acrylic or polyamide. A thin metal film having excellent heat resistance is provided on the thin metal film, and a polyamide resin is further provided on the outer surface of the exterior body. A three-layer film having an insulating synthetic resin film such as a polyester resin may be used. By using such a three-layer structure, it is possible to block the permeation of the electrolyte or gas, and The outer casing is folded inward and stacked, or By stacking the two exterior bodies with their inner surfaces facing each other and applying heat, the inner material The two exterior bodies are fused together, forming a sealed structure.

[0294] The battery unit 500 has a flexible structure by using a flexible exterior body 509. If the structure is flexible, the flexible portion can be at least It can be mounted on a power storage device or electronic device that has a part of it, and the power storage device or electronic device can be modified. The battery unit 500 can be bent accordingly.

[0295] <Configuration example 2> FIG. 16(A) shows a perspective view of the secondary battery 200, and FIG. 16(B) shows a top view of the secondary battery 200. Shows.

[0296] FIG. 17(A) shows a cross-sectional view taken along the dashed line C1-C2 in FIG. 16(B). 16(B) shows a cross-sectional view taken along the dashed line C3-C4 in FIG. 16(B). ) and (B), some of the components are selectively shown for clarity.

[0297] The secondary battery 200 includes a positive electrode 211, a negative electrode 215, and a separator 203. The battery 200 further includes a positive electrode lead 221 , a negative electrode lead 225 , and an outer casing 207 .

[0298] The positive electrode 211 and the negative electrode 215 each have a current collector and an active material layer. The negative electrodes 215 are arranged so that the active material layers face each other with the separator 203 interposed therebetween. There are.

[0299] The electrodes (positive electrode 211 and negative electrode 215) of the secondary battery 200 are located on the inner diameter side of the curve. It is preferable that the one positioned on the outer diameter side is longer in the direction of curvature than the one positioned on the outer diameter side. With this configuration, when the secondary battery 200 is bent at a certain curvature, the positive electrode 211 and the negative electrode 212 are In other words, all of the positive electrode active material layers of the positive electrode 211 can be aligned. All of the regions can be disposed facing the negative electrode active material layer of the negative electrode 215. Therefore, the positive electrode active material contained in the positive electrode 211 can be efficiently utilized in the battery reaction. Therefore, the capacity per volume of the secondary battery 200 can be increased. This is particularly effective when the curvature of the secondary battery 200 is fixed when the battery 200 is in use.

[0300] The positive electrode lead 221 is electrically connected to the plurality of positive electrodes 211. The negative electrode lead 225 is , and are electrically connected to the plurality of negative electrodes 215. The positive electrode lead 221 and the negative electrode lead 225 Each of the semiconductor devices has a sealing layer 220 .

[0301] The exterior body 207 includes a plurality of positive electrodes 211, a plurality of negative electrodes 215, and a plurality of separators 203. The secondary battery 200 contains an electrolyte (not shown) in the area covered by the exterior body 207. The secondary battery 200 is sealed by gluing three sides of the exterior body 207 together.

[0302] 17(A) and (B), a plurality of rectangular separators 203 are used to separate a positive electrode 211 and a negative electrode 2 15, one separator 203 is placed between each of the electrodes 15. However, the method is not limited to this. One sheet of separator may be folded zigzag (into an accordion shape, Or, by winding it, the separator is positioned between the positive and negative electrodes. Good too.

[0303] For example, a method for manufacturing a secondary battery 200 is shown in FIGS. FIG. 18 shows a cross-sectional view taken along the dashed line C1-C2 in FIG. 16(B) in this case.

[0304] First, the negative electrode 215 is placed on the separator 203 (FIG. 19(A)). The negative electrode active material layer of 215 is disposed so as to overlap with the separator 203 .

[0305] Next, the separator 203 is folded and placed on the negative electrode 215. Then, the positive electrode 211 is placed on the separator 203 (FIG. 19(B)). The positive electrode active material layer of the separator 201 is disposed so as to overlap the separator 203 and the negative electrode active material layer. When an electrode having an active material layer formed on one side of a current collector is used, the positive electrode 211 The positive electrode active material layer and the negative electrode active material layer of the negative electrode 215 are arranged opposite to each other with the separator 203 interposed therebetween. Place.

[0306] When the separator 203 is made of a material that can be heat-sealed, such as polypropylene, The overlapping area of ​​the electrodes 203 is thermally welded together, and then the next electrode is placed on top of it. Specifically, the electrode can be prevented from shifting during the process. In the region where the separators 203 overlap each other, for example, the region 203 in FIG. 19(B) It is preferable to heat-weld the area indicated by a.

[0307] By repeating this process, the positive electrode 202 is formed with the separator 203 sandwiched between them as shown in FIG. 19(C). 211 and anode 215 can be stacked.

[0308] The separator 203 is repeatedly folded in advance, and a plurality of negative electrodes 215 and a plurality of negative electrodes 215 are attached to the separator 203. The positive electrodes 211 may be arranged so as to be sandwiched alternately.

[0309] Next, as shown in FIG. 19(C), a plurality of positive electrodes 211 and a plurality of negative electrodes are separated by a separator 203. Covers 215.

[0310] Furthermore, as shown in FIG. 19(D), in the region where the separators 203 overlap each other, for example, By thermally welding the region 203b shown in FIG. 19(D), a plurality of positive electrodes 211 and a plurality of negative electrodes 2 15 is covered with a separator 203 and bound.

[0311] The plurality of positive electrodes 211, the plurality of negative electrodes 215, and the separator 203 are bound together using a binding material. May be bundled.

[0312] In this process, the positive electrode 211 and the negative electrode 215 are stacked, and the separator 203 is In the separator 203, the area sandwiched between the positive electrode 211 and the negative electrode 215 and the area sandwiched between the positive electrode 211 and the negative electrode 215 are The electrode 211 and the region arranged to cover the plurality of negative electrodes 215 are also included.

[0313] In other words, the separator 203 of the secondary battery 200 shown in FIGS. 18 and 19(D) is A partially folded separator. Folded area of ​​separator 203 A plurality of positive electrodes 211 and a plurality of negative electrodes 215 are sandwiched between the positive electrodes 211 and the negative electrodes 215.

[0314] <Configuration example 3> FIG. 20(A) shows a perspective view of the secondary battery 250, and FIG. 20(B) shows a top view of the secondary battery 250. 20(C1) shows a cross-sectional view of the first electrode assembly 230, and FIG. 20(C2) shows a cross-sectional view of the first electrode assembly 230. ) shows a cross-sectional view of the second electrode assembly 231.

[0315] The secondary battery 250 includes a first electrode assembly 230, a second electrode assembly 231, and a separator. The secondary battery 250 further includes a positive electrode lead 221, a negative electrode lead 225, and and an exterior body 207.

[0316] As shown in FIG. 20(C1), the first electrode assembly 230 includes a positive electrode 211a, a separator 211b, and a 03, a negative electrode 215a, a separator 203, and a positive electrode 211a are laminated in this order. The positive electrode 211a and the negative electrode 215a each have an active material layer on both sides of a current collector. do.

[0317] As shown in FIG. 20(C2), the second electrode assembly 231 includes a negative electrode 215a, a separator 215b, and a 03, a positive electrode 211a, a separator 203, and a negative electrode 215a are laminated in this order. The positive electrode 211a and the negative electrode 215a each have an active material layer on both sides of a current collector. do.

[0318] That is, in the first electrode assembly 230 and the second electrode assembly 231, the positive electrode and the negative electrode are The active material layers are arranged so as to face each other with the separator 203 interposed therebetween.

[0319] The positive electrode lead 221 is electrically connected to the plurality of positive electrodes 211. The negative electrode lead 225 is , and are electrically connected to the plurality of negative electrodes 215. The positive electrode lead 221 and the negative electrode lead 225 Each of the semiconductor devices has a sealing layer 220 .

[0320] FIG. 21 shows an example of a cross-sectional view taken along the dashed line C3-C4 in FIG. 20(B). In order to clarify the diagram, only some of the components are shown in FIG.

[0321] As shown in FIG. 21, the secondary battery 250 includes a plurality of first electrode assemblies 230 and a plurality of second The electrode assembly 231 is covered with a wound separator 203.

[0322] The exterior body 207 includes a plurality of first electrode assemblies 230, a plurality of second electrode assemblies 231, and The secondary battery 200 has an electrolyte (see FIG. The secondary battery 200 is sealed by adhering three sides of the exterior body 207. are.

[0323] For example, a method for manufacturing a secondary battery 250 is shown in FIGS.

[0324] First, the first electrode assembly 230 is placed on the separator 203 (FIG. 22(A)).

[0325] Next, the separator 203 is folded and placed on the first electrode assembly 230. Next, two sets of first electrode plates are placed above and below the first electrode assembly 230 with separators 203 interposed therebetween. The two electrode assemblies 231 are stacked (FIG. 22(B)).

[0326] Next, the separator 203 is wound around the two sets of second electrode assemblies 231. Furthermore, two sets of first electrode assemblies 231 are disposed above and below the two sets of second electrode assemblies 231 via separators 203. The electrode assemblies 230 are then stacked (FIG. 22(C)).

[0327] Next, the separator 203 is wound around the two first electrode assemblies 230 so as to cover them (see FIG. 22(D)).

[0328] Through this process, a plurality of first electrode assemblies 230 and a plurality of second electrode assemblies 231 are stacked. To stack these electrode assemblies, they are arranged between spirally wound separators 203. It will be placed.

[0329] It is preferable that the outermost electrode does not have an active material layer on the outside.

[0330] In addition, in Figures 20(C1) and (C2), the electrode assembly has three electrodes and two separators. However, one embodiment of the present invention is not limited to this. By increasing the number of electrodes, the capacity of the secondary battery 250 can be further improved. Alternatively, the electrode may have two electrodes and one separator. If the number of electrodes is small, the secondary battery can be made more resistant to bending. 250 shows a configuration having three sets of first electrode assemblies 230 and two sets of second electrode assemblies 231. However, one aspect of the present invention is not limited to this. By increasing the number of electrode assemblies, the capacity of the secondary battery 250 can be further improved. Also, a configuration having fewer electrode assemblies may be used. This makes it possible to provide a secondary battery that is more resistant to bending.

[0331] FIG. 23 shows another example of a cross-sectional view taken along the dashed dotted line C3-C4 in FIG. 20(B). As shown in FIG. 23, the separator 203 is folded in an accordion shape to form a first electrode assembly. A separator 203 may be disposed between 230 and the second electrode assembly 231 .

[0332] This embodiment mode can be combined with other embodiment modes as appropriate.

[0333] (Embodiment 3) In this embodiment, a light-emitting device that can be used in an electronic device according to one embodiment of the present invention is illustrated. In this embodiment, a light emitting device using an organic EL element will be mainly exemplified. However, one embodiment of the present invention is not limited to this.

[0334] <Configuration example 1> FIG. 24(A) shows a plan view of the light emitting device, and the area between the dashed dotted line D1-D2 in FIG. 24(A) is An example of a cross-sectional view is shown in FIG. 24(B). The light-emitting device shown in Configuration Example 1 uses a color filter method. In this embodiment, the light emitting device is a top emission type light emitting device. For example, a configuration in which one color is expressed by three sub-pixels of R (red), G (green), and B (blue), A configuration in which one color is expressed by four sub-pixels of R, G, B, and Y (yellow), or A configuration in which one color is expressed by four sub-pixels can be applied. There is no particular limitation on the color elements. Colors other than RGBWY may be used, for example, cyan or magenta.

[0335] The light emitting device shown in FIG. 24(A) includes a light emitting portion 804, a driving circuit portion 806, and an FPC 808. do.

[0336] The light emitting device shown in FIG. 24(B) includes a flexible substrate 701, an adhesive layer 703, an insulating layer 705, and a plurality of a transistor, a conductive layer 857, an insulating layer 815, an insulating layer 817, a plurality of light-emitting elements, an insulating layer 821, adhesive layer 822, colored layer 845, light shielding layer 847, insulating layer 715, adhesive layer 713, average and a flexible substrate 711. The adhesive layer 822, the insulating layer 715, the adhesive layer 713, and the flexible substrate 711 are The conductive substrate 711 transmits visible light. The electrodes and transistors are supported by a flexible substrate 701, a flexible substrate 711, and an adhesive layer 822. It is sealed.

[0337] The light emitting section 804 is formed by attaching a transistor to the flexible substrate 701 via the adhesive layer 703 and the insulating layer 705. The light-emitting element 830 has a lower electrode 840 on the insulating layer 817. an electrode 831, an EL layer 833 on the lower electrode 831, and an upper electrode 835 on the EL layer 833; The lower electrode 831 is electrically connected to the source electrode or the drain electrode of the transistor 820. The end of the lower electrode 831 is covered with an insulating layer 821. Preferably, the upper electrode 835 is transparent to visible light.

[0338] The light-emitting section 804 includes a colored layer 845 overlapping the light-emitting element 830 and a layer overlapping the insulating layer 821. The light-emitting element 830 and the colored layer 845 are filled with an adhesive layer 822. It is being done.

[0339] The insulating layer 815 has the effect of suppressing the diffusion of impurities into the semiconductor that constitutes the transistor. The insulating layer 817 also has a planarizing function to reduce surface irregularities caused by the transistor. When an organic material is used as the insulating layer 817, The light emitting element 830 or the like emits light through the insulating layer 817 exposed at the edge of the light emitting device. There is a risk that impurities such as moisture may enter the optical device from the outside. Deterioration of the light emitting element 830 leads to deterioration of the light emitting device. As shown in B), an opening is provided in the insulating layer 817 to reach the inorganic film (here, the insulating layer 815). Therefore, even if impurities such as moisture enter the light-emitting device from the outside, the transistor or the light-emitting element 830 It is preferable that the insulating layer 817 is formed so that the insulating layer 817 is difficult to reach the edge of the light-emitting device. It may be formed so that it is not placed thereon.

[0340] The driving circuit section 806 is formed on the flexible substrate 701 via the adhesive layer 703 and the insulating layer 705. In FIG. 24B, the driver circuit portion 806 has a plurality of transistors. That is, one transistor is shown.

[0341] The insulating layer 705 and the flexible substrate 701 are bonded together by an adhesive layer 703. The edge layer 715 and the flexible substrate 711 are bonded together by an adhesive layer 713. When a highly moisture-proof film is used for at least one of the insulating layer 715 and the light-emitting element 83, 0 or the transistor 820 can be prevented from being infiltrated by impurities such as water, thereby improving the reliability of the light-emitting device. is preferred because

[0342] The conductive layer 857 serves as an external input terminal for transmitting a signal or potential from the outside to the driver circuit portion 806. Electrically connect. Here, an example is shown where an FPC808 is used as the external input terminal. In order to prevent an increase in the number of steps, the conductive layer 857 is formed by forming an electrode or wiring used in the light-emitting section or the driving circuit section. It is preferable to fabricate the conductive layer 857 using the same material and process as the wire. An example is shown in which the electrodes are made of the same material and in the same process as those of the transistor 820.

[0343] In the light emitting device shown in FIG. 24(B), the FPC 808 is located on the flexible substrate 711. The body 825 is made up of a flexible substrate 711, an adhesive layer 713, an insulating layer 715, an adhesive layer 822, an insulating layer 8 17 and the conductive layer 857 through an opening provided in the insulating layer 815. The connector 825 is connected to the FPC 808. The layer 857 is electrically connected. When the conductive layer 857 and the flexible substrate 711 overlap, By opening the flexible substrate 711 (or by using a substrate having openings), the conductive layer 857, The connector 825 and the FPC 808 can be electrically connected.

[0344] 24(A) and 24(B) show modifications of the light emitting device. An example of a cross section taken along the dashed line D3-D4 in FIG. 25(A) is shown in FIG. 25(B). Also, an example of a cross section between the dashed dotted line D5-D6 in Figure 25(A) is shown in Figure 26(A). show.

[0345] The light emitting device shown in FIGS. 25(A) and 25(B) has a flexible substrate 701 and a flexible substrate 711 each having a different size. This is an example in which the FPC 808 is located on the insulating layer 715 and the flexible substrate 711 The connecting body 825 is made up of the insulating layer 715, the adhesive layer 822, the insulating layer 817, and the insulating layer The conductive layer 857 is connected through an opening formed in the flexible substrate 711. Since there is no need to provide a flexible substrate 711, there are no restrictions on the material of the flexible substrate 711.

[0346] Note that an insulating layer formed using an organic resin with low gas barrier properties or moisture resistance is By adopting such a configuration, it is possible to prevent unwanted light from being exposed from the side of the light emitting device. For example, as shown in FIG. 25(B) and FIG. 26(A), The insulating layer 817 may not be provided at the edge of the light-emitting device.

[0347] A modified example of the light emitting section 804 is shown in FIG.

[0348] The light-emitting device shown in FIG. 26B includes an insulating layer 817a and an insulating layer 817b. A conductive layer 856 is provided over the transistor 7a. A source electrode or a drain electrode of the transistor 820 is provided over the transistor 7a. The lower electrode of the light emitting element 830 is electrically connected via a conductive layer 856 .

[0349] The light-emitting device shown in FIG. 26(B) has a spacer 823 over an insulating layer 821. By providing the flexible substrate 701 and the flexible substrate 711, the distance between the flexible substrate 701 and the flexible substrate 711 can be adjusted. do.

[0350] The light emitting device shown in FIG. 26(B) includes an overcoat 8 that covers the colored layer 845 and the light blocking layer 847. The space between the light emitting element 830 and the overcoat 849 is filled with an adhesive layer 822. There are.

[0351] A modified example of the light emitting element 830 is shown in FIG.

[0352] As shown in FIG. 26(C), the light emitting element 830 is made up of a lower electrode 831 and an EL layer 833. The optical adjustment layer 832 may be formed between the first and second layers. The optical adjustment layer 832 may include a light-transmitting conductive layer. It is preferable to use conductive materials. Color filter (colored layer) and microcavity structure By combining with the (optical adjustment layer), the light-emitting device of one embodiment of the present invention can emit light with high color purity. The thickness of the optical adjustment layer is changed depending on the emission color of each sub-pixel. .

[0353] <Configuration example 2> The light emitting device shown in FIG. 26(D) includes a flexible substrate 701, an adhesive layer 703, an insulating layer 705, a conductive layer 706, and a conductive film 708. layer 814, conductive layer 857a, conductive layer 857b, light-emitting element 830, insulating layer 821, adhesive layer 7 13, and a flexible substrate 711.

[0354] The conductive layer 857a and the conductive layer 857b are external connection electrodes of the light emitting device, and are electrically connected to an FPC or the like. can be effectively connected.

[0355] The light-emitting element 830 includes a lower electrode 831, an EL layer 833, and an upper electrode 835. The end of the electrode 831 is covered with an insulating layer 821. The light emitting element 830 is a bottom emitter. The type is a top-emission type, a dual-emission type, or a top-emission type. The electrode, substrate, insulating layer, etc. are transparent to visible light. Make an electrical connection.

[0356] The substrate on the light extraction side has a light extraction structure that includes a hemispherical lens, a microlens array, The substrate may have a film with a concave-convex structure, a light diffusion film, etc. For example, a resin substrate The lens or film is placed on the substrate, and the refractive index is the same as that of the substrate or the lens or film. By bonding using an adhesive or the like having the above structure, a substrate having a light extraction structure is formed. can be done.

[0357] The conductive layer 814 is not necessarily provided, but the voltage drop due to the resistance of the lower electrode 831 For the same purpose, the upper electrode 835 and the A conductive layer for electrically connecting the insulating layer 821, the EL layer 833, the upper electrode 835, or the like is provided on the insulating layer 821, the EL layer 833, or the upper electrode 835. It is okay to do so.

[0358] The conductive layer 814 may be made of copper, titanium, tantalum, tungsten, molybdenum, chromium, or neodymium. Materials selected from the group consisting of zinc, scandium, nickel, and aluminum, or alloys containing these as their main components The conductive layer 814 can be formed as a single layer or a multilayer using a gold material or the like. For example, it can be 0.1 μm or more and 3 μm or less, and preferably 0.1 μm or more and 0. It is less than 5 μm.

[0359] <Configuration example 3> FIG. 25(A) shows a plan view of the light emitting device, and the area between the dashed dotted line D3-D4 in FIG. 25(A) is An example of a cross-sectional view is shown in Figure 27(A). The light-emitting device shown in Configuration Example 3 uses a color filter method. The light emitting device used was a bottom emission type.

[0360] The light emitting device shown in FIG. 27(A) includes a flexible substrate 701, an adhesive layer 703, an insulating layer 705, and a plurality of the transistor, the conductive layer 857, the insulating layer 815, the colored layer 845, the insulating layer 817a, and the insulating layer 817b, a conductive layer 856, a plurality of light-emitting elements, an insulating layer 821, an adhesive layer 713, and a flexible substrate The flexible substrate 701, the adhesive layer 703, the insulating layer 705, the insulating layer 815, the insulating layer 816, the insulating layer 817, the insulating layer 818, the insulating layer 819, the insulating layer 820, the insulating layer 821, the insulating layer 822, the insulating layer 823, the insulating layer 824, the insulating layer 825, the insulating layer 826, the insulating layer 827 The edge layer 817a and the insulating layer 817b are transparent to visible light.

[0361] The light emitting section 804 is formed by attaching a transistor to the flexible substrate 701 via the adhesive layer 703 and the insulating layer 705. The light-emitting element 830 includes a resistor 820, a transistor 824, and a light-emitting element 830. A lower electrode 831 on the insulating layer 817b, an EL layer 833 on the lower electrode 831, and an EL layer 83 The lower electrode 831 is connected to the source electrode of the transistor 820. The end of the lower electrode 831 is covered with an insulating layer 821. The upper electrode 835 preferably reflects visible light. The lower electrode 831 The position where the colored layer 845 overlapping the light emitting element 830 is provided is not particularly limited. For example, between the insulating layer 817a and the insulating layer 817b, or between the insulating layer 815 and the insulating layer 817a, etc. It can be set up in.

[0362] The driving circuit section 806 is formed on the flexible substrate 701 via the adhesive layer 703 and the insulating layer 705. In FIG. 27A, the driver circuit portion 806 has a plurality of transistors. In other words, two transistors are shown.

[0363] The insulating layer 705 and the flexible substrate 701 are bonded together by an adhesive layer 703. When a highly moisture-proof film is used for the light-emitting element 830, the transistor 820, or the transistor This can prevent impurities such as water from entering the sapphire 824, thereby increasing the reliability of the light-emitting device. preferable.

[0364] The conductive layer 857 serves as an external input terminal for transmitting a signal or potential from the outside to the driver circuit portion 806. Electrically connect. Here, an example is shown where an FPC808 is used as the external input terminal. Here, the conductive layer 857 is made of the same material and in the same process as the conductive layer 856. Here is an example.

[0365] <Configuration Example 4> FIG. 25(A) shows a plan view of the light emitting device, and the area between the dashed dotted line D3-D4 in FIG. 25(A) is An example of a cross-sectional view is shown in Figure 27(B). The light-emitting device shown in Configuration Example 4 uses a color-coded method. This is a top-emission type light-emitting device.

[0366] The light emitting device shown in FIG. 27(B) includes a flexible substrate 701, an adhesive layer 703, an insulating layer 705, and a plurality of a transistor, a conductive layer 857, an insulating layer 815, an insulating layer 817, a plurality of light-emitting elements, an insulating layer 821, a spacer 823, an adhesive layer 713, and a flexible substrate 711. The flexible substrate 711 is transparent to visible light.

[0367] In the light-emitting device shown in FIG. 27(B), the connector 825 is located on the insulating layer 815. The conductive layer 857 is connected to the insulating layer 815 through an opening. The connector 825 is connected to the FPC 808. The FPC 808 and the conductive layer 825 are connected to each other via the connector 825. 857 is electrically connected.

[0368] <Example of materials> Next, materials that can be used in the light-emitting device will be described. The description of the configuration may be omitted.

[0369] The substrate can be made of materials such as glass, quartz, organic resin, metal, alloy, and semiconductor. The substrate on the side from which light from the light emitting element is extracted is made of a material that transmits the light.

[0370] In particular, it is preferable to use a flexible substrate. For example, an organic resin or a flexible substrate may be used. For example, a glass, metal, or alloy having a thickness of 1000 nm can be used. is preferably 1 μm or more and 200 μm or less, more preferably 1 μm or more and 100 μm or less, More preferably, the thickness is 10 μm or more and 50 μm or less, and even more preferably, the thickness is 10 μm or more and 25 μm or less. stomach.

[0371] Since organic resin has a smaller specific gravity than glass, if organic resin is used as a flexible substrate, This is preferable because it allows the light-emitting device to be made lighter than when glass is used.

[0372] It is preferable to use a highly tough material for the substrate. This makes it superior in impact resistance and breakage resistance. For example, an organic resin substrate, a thin metal substrate, or By using an alloy substrate, it is lighter and less likely to break than when using a glass substrate. This makes it possible to realize a light-emitting device with high light emission.

[0373] Metallic and alloy materials have high thermal conductivity and can easily conduct heat across the entire substrate, making them ideal for light-emitting devices. This is preferable because it can suppress local temperature rises in the device. The thickness of the substrate is preferably 10 μm or more and 200 μm or less, and more preferably 20 μm or more and 50 μm or less. It is more preferable to do so.

[0374] The material for forming the metal substrate or alloy substrate is not particularly limited, but for example, aluminum Preferably, the material is a metal alloy such as aluminum, copper, nickel, or an aluminum alloy or stainless steel. The semiconductor substrate can be suitably used. Examples of materials that form the semiconductor substrate include silicon. .

[0375] In addition, using a material with high thermal emissivity for the substrate prevents the surface temperature of the light-emitting device from rising. For example, the substrate may be made of a metal substrate and the heat radiation may be prevented from being broken or the reliability of the light emitting device may be reduced. A stack of high-index layers (which can be, for example, metal oxide or ceramic materials) It may also be possible to use the following.

[0376] Examples of materials that are flexible and transparent include polyethylene terephthalate (PET). ), polyester resins such as polyethylene naphthalate (PEN), polyacrylonitrile Resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin , polyethersulfone (PES) resin, polyamide resin (nylon, aramid, etc.), Chloroolefin resin, polystyrene resin, polyamide-imide resin, polyvinyl chloride resin, Polytetrafluoroethylene (PTFE) resin is one example. In particular, it has a low linear expansion coefficient. It is preferable to use a material such as polyamide-imide resin, polyimide resin, polya A resin such as a mide resin or PET can be preferably used. Also called prepreg), or a substrate in which inorganic filler is mixed with organic resin to lower the linear expansion coefficient It can also be used.

[0377] As for the flexible substrate, a layer using the above material is used as a hard cover to protect the surface of the device from scratches. a layer of a material capable of dispersing pressure (e.g., a silicon nitride layer) or a layer of a material capable of dispersing pressure (e.g., an arranging layer) The insulating layer may be laminated with a polymer layer (e.g., a polymer layer).

[0378] The flexible substrate may be formed by stacking a plurality of layers. This improves the barrier properties against water or oxygen, making it possible to provide a highly reliable light-emitting device. Cut.

[0379] For example, a flexible substrate in which a glass layer, an adhesive layer, and an organic resin layer are laminated from the side closer to the light emitting element. The thickness of the glass layer is preferably 20 μm or more and 200 μm or less. The thickness of the glass layer is 25 μm or more and 100 μm or less. A glass layer with such a thickness is highly resistant to water and oxygen. The thickness of the organic resin layer can be set to 1. The thickness is 0 μm or more and 200 μm or less, preferably 20 μm or more and 50 μm or less. By providing a resin layer, breakage or cracking of the glass layer is suppressed and mechanical strength is improved. By applying such a composite material of glass material and organic resin to a substrate, This allows for a highly reliable and flexible light emitting device.

[0380] The adhesive layer can be made of a variety of adhesives, including UV-curable and other light-curable adhesives, reactive-curable adhesives, heat-curable adhesives, and adhesives containing Various curing adhesives such as vapor-curing adhesives can be used. Good too.

[0381] The adhesive layer may also contain a desiccant. For example, an alkaline earth metal oxide (oxide Use a substance that absorbs moisture by chemical adsorption, such as calcium or barium oxide. Alternatively, moisture can be absorbed by physical adsorption, such as with zeolite or silica gel. If a desiccant is included, impurities such as moisture may be absorbed into the functional element. This is preferable because it can prevent the light from entering the light emitting device and improve the reliability of the light emitting device.

[0382] Furthermore, by including a filler or a light scattering material with a high refractive index in the adhesive layer, the light emitted from the light emitting element can be It is possible to improve the light extraction efficiency. For example, titanium oxide, barium oxide, zeolite For example, tungsten, zirconium, etc. can be used.

[0383] The insulating layers 705 and 715 can each be formed using a highly moisture-proof insulating film. Alternatively, the insulating layers 705 and 715 may be formed to prevent impurities from entering the light-emitting element. It is preferable that the material has a function of preventing diffusion.

[0384] Highly moisture-proof insulating films include silicon nitride films and silicon nitride oxide films containing nitrogen and silicon. and films containing nitrogen and aluminum, such as aluminum nitride films. A silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like may also be used.

[0385] For example, the water vapor permeability of a highly moisture-proof insulating film is 1×10 -5 [g / (m 2 ·day)] Less than 1 × 10 -6 [g / (m 2 ·day)] or less, more preferably 1 × 10 -7 [g / (m 2 ·day)] or less, more preferably 1 × 10 -8 [g / (m 2 ·da y)] or less.

[0386] In the light-emitting device, at least one of the insulating layer 705 and the insulating layer 715 is a layer that The insulating layer 705 or the insulating layer 715 must transmit light emitted from the light-emitting element. The insulating layer on the side where the light is incident is more resistant to light with wavelengths of 400 nm or more and 800 nm or less than the other insulating layer. A high average transmittance is preferred.

[0387] The structure of the transistor included in the light-emitting device is not particularly limited. The transistor may be a top gate type or an inverted stagger type. The semiconductor used in the transistor may have any of the following transistor structures: The material is not particularly limited, and examples thereof include silicon, germanium, and organic semiconductors. Or, metal oxides containing at least one of indium, gallium, and zinc, such as In-Ga-Zn metal oxides. An oxide semiconductor containing at least one of these may be used.

[0388] The crystallinity of the semiconductor material used in the transistor is not particularly limited. A semiconductor having crystallinity (microcrystalline semiconductor, polycrystalline semiconductor, single crystal semiconductor, or a semiconductor having a partially crystalline region) When a semiconductor having crystallinity is used, the transistor This is preferable because it can suppress deterioration of the star characteristics.

[0389] In one embodiment of the present invention, a semiconductor material used for a transistor is a CAAC-OS (CA xis Aligned Crystalline Oxide Semiconductor CAAC-OS has fewer defect levels than amorphous materials. In addition, the grain boundaries of the CAAC-OS are clearly defined, which improves the reliability of the transistor. It is possible to form a stable and uniform film over a large area, In addition, when a flexible light-emitting device is bent, stress is applied to the CAAC-OS film, causing it to crack. It is less likely to cause problems.

[0390] CAAC-OS is a crystalline oxide semiconductor whose c-axis is aligned approximately perpendicular to the film surface. Another crystal structure of oxide semiconductors is the nanoscale microcrystalline aggregate, n It is clear that there are various structures that are different from single crystals, such as ano-crystal (nc). CAAC-OS has lower crystallinity than single crystals and higher crystallinity than nc. stomach.

[0391] For stabilizing the characteristics of the transistor, it is preferable to provide an underlayer film. Inorganic films such as silicon oxide film, silicon nitride film, silicon oxynitride film, and silicon nitride oxide film The insulating film can be formed as a single layer or a laminated layer. CVD (Chemical Vapor Deposition) method (Plasma CVD method) , thermal CVD method, MOCVD (Metal Organic CVD) method, etc.), ALD ( Formed using Atomic Layer Deposition (ALD), coating, printing, etc. In addition, the undercoat film may not be provided if it is not necessary. 705 can also serve as an underlying film for the transistor.

[0392] The light emitting element can be a self-luminous element, and the brightness can be controlled by a current or a voltage. This category includes devices that are controlled by light emitting diodes (LEDs), organic EL elements, inorganic EL elements, etc. can be used.

[0393] The light emitting elements are top emission type, bottom emission type, and dual emission type. For the electrode on the light extraction side, a conductive film that transmits visible light is used. It is also preferable to use a conductive film that reflects visible light for the electrode on the side from which light is not extracted. .

[0394] The conductive film that transmits visible light is made of, for example, indium oxide or indium tin oxide (ITO). Indium Tin Oxide, Indium Zinc Oxide, Zinc Oxide (ZnO), Gallium It can be formed using zinc oxide doped with ammonium. It can also be formed using gold, silver, platinum, magnesium, etc. Nesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium Metallic materials such as aluminum or titanium, alloys containing these metallic materials, or nitrogen in these metallic materials Titanium nitride (for example, titanium nitride) can also be used by forming it thin enough to have light transmission properties. Furthermore, a laminated film of the above materials can be used as a conductive film. For example, a laminated film of silver and manganese can be used as a conductive film. The use of a laminated film of magnesium alloy and ITO is preferred because it can increase the conductivity. Graphene or the like may also be used.

[0395] The conductive film that reflects visible light is made of, for example, aluminum, gold, platinum, silver, nickel, or tungsten. Metallic materials such as zinc, chromium, molybdenum, iron, cobalt, copper, or palladium, or Alloys containing these metal materials can be used. Tungsten, neodymium, germanium, etc. may be added. Aluminum alloy, aluminum-nickel alloy, aluminum-neodymium alloy, aluminum Aluminum-containing alloys, such as aluminum, nickel, and lanthanum alloys (Al-Ni-La) (aluminum alloy), silver-copper alloy, silver-palladium-copper alloy (Ag-Pd-Cu, APC can be formed using an alloy containing silver, such as an alloy of silver and magnesium. An alloy containing silver and copper is preferable because it has high heat resistance. By laminating a metal film or metal oxide film in contact with the aluminum alloy film, oxidation of the aluminum alloy film is suppressed. Examples of materials for the metal film and metal oxide film include titanium and titanium oxide. Furthermore, the conductive film that transmits visible light and a film made of a metal material may be laminated together. For example, a laminated film of silver and ITO, or a laminated film of silver-magnesium alloy and ITO can be used. This can be done.

[0396] The electrodes can be formed by vapor deposition or sputtering. or by using a discharge method such as an ink jet method, a printing method such as a screen printing method, or a plating method. It can be formed by

[0397] A voltage higher than the threshold voltage of the light-emitting element is applied between the lower electrode 831 and the upper electrode 835. When this occurs, holes are injected into the EL layer 833 from the anode side, and electrons are injected from the cathode side. The electrons and holes are recombined in the EL layer 833, and the light-emitting material contained in the EL layer 833 emits light. do.

[0398] The EL layer 833 has at least a light-emitting layer. The EL layer 833 has a positive electrode as a layer other than the light-emitting layer. Highly hole-injecting materials, highly hole-transporting materials, hole-blocking materials, highly electron-transporting materials , a substance with high electron injection properties, or a bipolar substance (a substance with high electron transport properties and hole transport properties) The film may further include a layer containing a material such as a polymer.

[0399] The EL layer 833 can be made of either a low molecular weight compound or a high molecular weight compound. The layers constituting the EL layer 833 may each be formed by evaporation (vacuum evaporation). The method may include a transfer method, a printing method, an ink jet method, a coating method, etc. do.

[0400] The light-emitting element 830 may contain two or more types of luminescent materials. For example, it is possible to realize a light-emitting element that emits color light. White light can be obtained by selecting luminescent materials so that they have a complementary color relationship. For example, a light-emitting object that emits light such as R (red), G (green), B (blue), Y (yellow), or O (orange). or a luminescent material that emits light containing spectral components of two or more of the colors R, G, and B. For example, a light-emitting material that emits blue light and a light-emitting material that emits yellow light can be used. In this case, the emission spectrum of the luminescent material that emits yellow light may be a spectrum of green and red. The light emitting element 830 preferably contains a wavelength in the visible region. (For example, 350 nm to 750 nm, or 400 nm to 800 nm, etc.) It is preferable that the range has two or more peaks.

[0401] The EL layer 833 may have a plurality of light-emitting layers. The layers may be stacked in contact with each other or with a separating layer interposed therebetween. For example, a separation layer may be provided between the fluorescent-emitting layer and the phosphorescent-emitting layer.

[0402] The separation layer is, for example, a layer for converting the excited state of the phosphorescent material generated in the phosphorescent-emitting layer into the fluorescent material in the fluorescent-emitting layer. To prevent energy transfer (especially triplet energy transfer) to materials via the Dexter mechanism The separation layer only needs to be a few nanometers thick. m or more and 20 nm or less, or 1 nm or more and 10 nm or less, or 1 nm or more and 5 nm or less The separating layer may be made of a single material (preferably a bipolar material) or a plurality of materials (preferably a Preferably, the material contains a hole transporting material and an electron transporting material.

[0403] The separation layer may be formed using a material contained in the light-emitting layer that is in contact with the separation layer. This facilitates the fabrication of the light-emitting device and reduces the driving voltage. When the separation layer is made of a host material, an assist material, and a phosphorescent material (guest material), In other words, the separation layer may be formed of a phosphorescent material and an assist material. The phosphorescent layer has a region that does not contain a phosphorescent material, and the phosphorescent layer has a region that contains a phosphorescent material. It is possible to deposit the separation layer and the phosphorescent light-emitting layer with or without the phosphorescent material. By forming the separation layer and the phosphorescent layer in the same chamber, it becomes possible to form the separation layer and the phosphorescent layer in the same chamber. This makes it possible to reduce manufacturing costs.

[0404] The light-emitting element 830 may be a single element having one EL layer, or may be a charge-generating element. The device may be a tandem device having a plurality of EL layers stacked with an intervening layer.

[0405] It is preferable that the light emitting element is provided between a pair of highly moisture-proof insulating films. This prevents impurities such as water from entering the light emitting element, and prevents a decrease in the reliability of the light emitting device. Specifically, as described above, the insulating layer 705 and the insulating layer 715 can be made of a highly moisture-proof material. When a highly moisture-proof insulating film is used, the light-emitting element is located between a pair of highly moisture-proof insulating films, and the reliability of the light-emitting device is improved. This can prevent a decrease in reliability.

[0406] The insulating layer 815 may be, for example, a silicon oxide film, a silicon oxynitride film, or an aluminum oxide film. An inorganic insulating film such as a rubber film can be used. The insulating layer 817b may be made of, for example, polyimide, acrylic, polyamide, or polyimide acryl. Organic materials such as amide and benzocyclobutene resins can be used. A dielectric constant material (low-k material) can be used. Also, multiple insulating films can be stacked. Each insulating layer may be formed by this method.

[0407] The insulating layer 821 is formed using an organic insulating material or an inorganic insulating material. For example, polyimide resin, polyamide resin, acrylic resin, siloxane resin, epoxy Resin, phenolic resin, etc. can be used. In particular, a photosensitive resin material is used, and the lower An opening is formed on the electrode 831, and the sidewall of the opening is an inclined surface formed with a curvature. It is preferable to form it so that

[0408] The method for forming the insulating layer 821 is not particularly limited. For example, the method may be a photolithography method, a sputtering method, or the like. ink jet method, vapor deposition method, droplet ejection method (inkjet method, etc.), printing method (screen printing, offset printing, Printing, etc. can be used.

[0409] The spacer 823 can be formed using an inorganic insulating material, an organic insulating material, a metal material, or the like. For example, inorganic insulating materials or organic insulating materials can be used for the insulating layer. Examples of metal materials that can be used include titanium and aluminum. The spacer 823 containing a conductive material and the upper electrode 835 are electrically connected to each other. This can suppress the potential drop caused by the resistance of the upper electrode 835. The shape of the 23 may be either a forward tapered shape or a reverse tapered shape.

[0410] A light-emitting device that functions as an electrode or wiring of a transistor, an auxiliary electrode of a light-emitting element, or the like The conductive layer used in the present invention is made of, for example, molybdenum, titanium, chromium, tantalum, tungsten, or aluminum. Metallic materials such as aluminum, copper, neodymium, scandium, etc., or alloy materials containing these elements The conductive layer can be formed as a single layer or a stacked layer using a conductive metal oxide. The conductive metal oxide may be indium oxide (In2O3 etc.), tin oxide (SnO2 etc.), ZnO, ITO, indium zinc oxide (In2O3- ZnO, etc.) or these metal oxide materials containing silicon oxide can be used. Cut.

[0411] The colored layer is a colored layer that transmits light in a specific wavelength band, for example, red, green, blue, or A color filter that transmits light in the yellow wavelength band can be used. Using various materials, etching using printing, inkjet, and photolithography methods The white sub-pixels are formed at desired positions by a bonding method or the like. A transparent or white resin may be placed on the surface.

[0412] The light-shielding layer is provided between adjacent colored layers. The light-shielding layer blocks light from the adjacent light-emitting element. The colored layer is formed on the edge of the light-shielding layer, and the colored layer is formed on the edge of the light-shielding layer, thereby suppressing color mixing between adjacent light-emitting elements. By providing the light-shielding layer so that it overlaps with the light-shielding layer, it is possible to suppress light leakage. A material that blocks light emitted from the optical element can be used, for example, a metallic material or a pigment or dye. The black matrix can be formed using a resin material containing a light-shielding material. If the light emitting element is provided in an area other than the light emitting part, such as the driving circuit part, unintended light leakage due to guided light etc. This is preferable because it can be suppressed.

[0413] An overcoat may be provided to cover the colored layer and the light-shielding layer. This makes it possible to prevent impurities contained in the colored layer from diffusing into the light emitting element. The bar coat is made of a material that transmits light emitted from the light emitting element, such as a silicon nitride film. The insulating film may be an inorganic insulating film such as a silicon oxide film, or an organic insulating film such as an acrylic film or a polyimide film. The insulating film may have a laminated structure of an organic insulating film and an inorganic insulating film.

[0414] In addition, when the material for the adhesive layer is applied onto the colored layer and the light-shielding layer, the material for the overcoat is It is preferable to use a material that has high wettability with respect to the material of the adhesive layer. As the substrate, an oxide conductive film such as an ITO film or a metal film such as an Ag film that is thin enough to be transparent is used. It is preferred to use a membrane.

[0415] By using a material for the overcoat that has high wettability with respect to the adhesive layer material, adhesion is improved. This allows the layer material to be applied uniformly, eliminating the need for air bubbles when bonding a pair of substrates together. This can prevent bubbles from being mixed in, thereby preventing display defects.

[0416] As a connector, various anisotropic conductive films (ACF) Conductive Film), or Anisotropic Conductive Paste (ACP) c Conductive Paste) can be used.

[0417] As described above, one embodiment of the present invention can be applied to a light-emitting device, a display device, an input / output device, and the like. Examples of display elements include EL elements (EL elements containing organic and inorganic materials, organic EL elements, etc.). EL elements, inorganic EL elements), LEDs (white LEDs, red LEDs, green LEDs, blue LEDs, etc. etc.), liquid crystal elements, electrophoretic elements, MEMS (microelectromechanical systems) Examples of such devices include display elements using organic EL devices.

[0418] Note that the light-emitting device of one embodiment of the present invention may be used as a display device or a lighting device. For example, a light source such as a backlight or a frontlight, i.e., a It may also be used as a lighting device for

[0419] This embodiment mode can be combined with other embodiment modes as appropriate.

[0420] (Fourth embodiment) In this embodiment, an input / output device that can be used for an electronic device of one embodiment of the present invention will be described. The following description will be made with reference to the drawings. For the same components as those of the light emitting device, the above description can also be referred to. In addition, in this embodiment, a touch panel using a light-emitting element is exemplified. Not limited to.

[0421] <Configuration example 1> 28(A) is a top view of the input / output device. 28(C) is a cross-sectional view of the area between B and the area between the dashed dotted line C and D. Cross-sectional view of section F.

[0422] The touch panel 390 shown in FIG. 28(A) includes a display unit 301 (which also serves as an input unit), a scanning line driver, driving circuit 303g(1), imaging pixel driving circuit 303g(2), image signal line driving circuit 303s (1) and an imaging signal line driving circuit 303s(2).

[0423] The display unit 301 includes a plurality of pixels 302 and a plurality of imaging pixels 308 .

[0424] The pixel 302 includes a plurality of sub-pixels, each of which includes a light-emitting element and a pixel circuit.

[0425] The pixel circuit can supply power to drive the light emitting element. The pixel circuit is electrically connected to a wiring that can supply an image signal. The wiring is electrically connected to the wiring.

[0426] The scanning line driver circuit 303g(1) can supply a selection signal to the pixel 302.

[0427] The image signal line driver circuit 303s(1) can supply image signals to the pixels 302.

[0428] A touch sensor can be configured using the imaging pixels 308. 08 can detect a finger or the like touching the display unit 301.

[0429] The imaging pixel 308 includes a photoelectric conversion element and an imaging pixel circuit.

[0430] The imaging pixel circuit can drive the photoelectric conversion element. The imaging pixel circuit provides a control signal. The imaging pixel circuit is electrically connected to a wiring that can supply a power supply potential. The wiring can be electrically connected to the wiring.

[0431] The control signal may be, for example, a signal to select an imaging pixel circuit that reads out a recorded imaging signal. a signal that can initialize the imaging pixel circuit, and a signal that can initialize the imaging pixel circuit Examples of such signals include signals that can determine the time at which the signal is detected.

[0432] The imaging pixel drive circuit 303g(2) can supply control signals to the imaging pixels 308. .

[0433] The imaging signal line driving circuit 303s(2) can read out imaging signals.

[0434] As shown in FIGS. 28B and 28C, the touch panel 390 includes a flexible substrate 701, an adhesive layer 702, and a 703 , an insulating layer 705 , a flexible substrate 711 , an adhesive layer 713 , and an insulating layer 715 . Moreover, the flexible substrate 701 and the flexible substrate 711 are bonded together by an adhesive layer 360 .

[0435] The flexible substrate 701 and the insulating layer 705 are bonded together with an adhesive layer 703. The plate 711 and the insulating layer 715 are bonded together with an adhesive layer 713. For materials that can be used for the layers, refer to Embodiment Mode 3.

[0436] The pixel 302 includes a subpixel 302R, a subpixel 302G, and a subpixel 302B (see FIG. 28). (C)). The subpixel 302R has a light-emitting module 380R, and the subpixel 302G has a light-emitting The subpixel 302B has a light emitting module 380G, and the subpixel 302B has a light emitting module 380B.

[0437] For example, the sub-pixel 302R includes a light-emitting element 350R and a pixel circuit. The light emitting module 300R includes a transistor 302t that can supply power to the light emitting module 350R. The module 380R includes a light emitting element 350R and an optical element (for example, a colored layer 3 67R).

[0438] The light emitting element 350R comprises a lower electrode 351R, an EL layer 353, and an upper electrode 352 in this order. They are stacked (Figure 28(C)).

[0439] The EL layer 353 includes a first EL layer 353a, an intermediate layer 354, and a second EL layer 353b. The layers are stacked in this order.

[0440] In order to efficiently extract light of a specific wavelength, the light emitting module 380R is equipped with a micro Specifically, a cavity structure can be provided to efficiently extract specific light. Even if an EL layer is placed between a film that reflects visible light and a film that is semi-reflective and semi-transmissive, good.

[0441] For example, the light emitting module 380R includes an adhesive layer in contact with the light emitting element 350R and the color layer 367R. The colored layer 367R is located so as to overlap the light emitting element 350R. A part of the light emitted by the light emitting element 350R is transmitted through the adhesive layer 360 and the colored layer 367R. As shown by the arrow in the middle, the light is emitted to the outside of light-emitting module 380R.

[0442] The touch panel 390 has a light-shielding layer 367BM. The light-shielding layer 367BM is a colored layer (for example, For example, the colored layer 367R is provided so as to surround the colored layer 367R.

[0443] The touch panel 390 has an anti-reflection layer 367p at a position overlapping the display unit 301. The blocking layer 367p may be, for example, a circular polarizer.

[0444] The touch panel 390 includes an insulating layer 321. The insulating layer 321 is formed on the transistors 302t and the like. The insulating layer 321 is used to flatten out unevenness caused by the pixel circuit or the imaging pixel circuit. It can also be used as a layer for diffusing impurities into the transistor 302t, etc. It is preferable to cover the transistor 302t and the like with an insulating layer that can suppress diffusion.

[0445] The touch panel 390 has a partition wall 328 that overlaps the end of the lower electrode 351R. A spacer 329 for controlling the distance between the flexible substrate 701 and the flexible substrate 711 is provided on the partition wall 328. Has.

[0446] The image signal line driver circuit 303s(1) includes a transistor 303t and a capacitor 303c. The driver circuit can be formed on the same substrate as the pixel circuit in the same process. As shown in B), the transistor 303t has a second gate 304 on the insulating layer 321. The second gate 304 is electrically connected to the gate of the transistor 303t. If necessary, the second The gate 304 may be provided to the transistor 308t or the transistor 302t, etc. good.

[0447] The imaging pixel 308 includes a photoelectric conversion element 308p and an imaging pixel circuit. The photoelectric conversion element 308p can detect light incident thereon. For example, a pin-type photodiode is used as the photoelectric conversion element 308p. You can be there.

[0448] The touch panel 390 has wiring 311 through which signals can be supplied, and terminals 319 are arranged. The FP can supply signals such as image signals and synchronization signals. C309 is electrically connected to terminal 319. FPC309 is a printed wiring board ( A PWB may be attached.

[0449] In addition, transistors such as transistor 302t, transistor 303t, and transistor 308t The resistors can be formed in the same process, or they can be formed in different processes. Good too.

[0450] <Configuration example 2> 29(A) and (B) are perspective views of the touch panel 525. For clarity, only a representative FIG. 30 is a cross-sectional view taken along the dashed line X1-X2 in FIG. 29(A). do.

[0451] As shown in FIGS. 29(A) and 29(B), the touch panel 525 includes a display unit 521, a scanning line drive The touch panel 525 includes a circuit 303g(1), a touch sensor 595, and the like. , a flexible substrate 701, a flexible substrate 711, and a flexible substrate 590.

[0452] The touch panel 525 has a plurality of pixels and a plurality of wirings 311. The plurality of wirings 311 are The wirings 311 are arranged along the periphery of the flexible substrate 701. The terminal 319 is made of FPC529( 1) and electrically connect.

[0453] The touch panel 525 includes a touch sensor 595 and a plurality of wirings 598. 598 is electrically connected to the touch sensor 595. The plurality of wirings 598 are connected to the flexible substrate 5 90, and a part of it forms a terminal. 29(B), for clarity, the flexible substrate 59 Electrodes of the touch sensor 595 provided on the rear surface side of the flexible substrate 701 and wiring etc. are shown by solid lines.

[0454] The touch sensor 595 may be, for example, a capacitance type touch sensor. There are various types of capacitive touch sensors, such as surface capacitive touch sensors and projected capacitive touch sensors. This shows a case where a capacitive touch sensor is applied.

[0455] The projected capacitive touch panel is classified into two types: self-capacitance type and mutual-capacitance type. The use of such a method is preferable because it enables simultaneous multipoint detection.

[0456] The touch sensor 595 is capable of detecting the proximity or contact of a detection object such as a finger. A variety of sensors can be applied.

[0457] The projected capacitive touch sensor 595 has an electrode 591 and an electrode 592. 91 is electrically connected to one of the plurality of wirings 598, and the electrode 592 is electrically connect to one of the others.

[0458] As shown in FIGS. 29(A) and 29(B), the electrode 592 is a plurality of electrodes repeatedly arranged in one direction. It has a shape in which quadrilaterals are connected at their corners.

[0459] The electrode 591 is quadrilateral and is repeatedly arranged in a direction intersecting the direction in which the electrode 592 extends. The plurality of electrodes 591 are not necessarily arranged in a direction perpendicular to one electrode 592. The angle need not be 90 degrees, but may be less than 90 degrees.

[0460] The wiring 594 is provided so as to intersect with the electrodes 592. The wiring 594 connects one of the electrodes 592. The two sandwiching electrodes 591 are electrically connected. At this time, the intersection of the electrode 592 and the wiring 594 It is preferable that the area of ​​the electrode be as small as possible. As a result, the area of ​​the touch sensor 595 can be reduced, and the unevenness of the light transmittance can be reduced. It is possible to reduce unevenness in brightness of transmitted light.

[0461] The shapes of the electrodes 591 and 592 are not limited to this, and various shapes are possible.

[0462] As shown in FIG. 30(A), the touch panel 525 includes a flexible substrate 701, an adhesive layer 703, The device includes an insulating layer 705, a flexible substrate 711, an adhesive layer 713, and an insulating layer 715. The flexible substrate 701 and the flexible substrate 711 are bonded together by an adhesive layer 360 .

[0463] The adhesive layer 597 is attached to the flexible substrate 590 so that the touch sensor 595 overlaps the display unit 521. The adhesive layer 597 is attached to a flexible substrate 711. The adhesive layer 597 transmits light.

[0464] The electrode 591 and the electrode 592 are formed using a light-transmitting conductive material. Conductive materials that can be used include indium oxide, indium tin oxide, indium zinc oxide, Conductive oxides such as zinc oxide and zinc oxide doped with gallium can be used. Alternatively, a film containing graphene may be used. The film containing graphene may be formed in a film shape, for example. The film containing graphene oxide can be formed by reducing the film. and methods of applying heat.

[0465] In addition, conductive films such as electrodes 591, electrodes 592, and wiring 594, that is, the touch panel, are formed. The material used for the wiring or electrode is a transparent material containing indium oxide, tin oxide, zinc oxide, etc. Also, the wiring or Materials that can be used for the electrodes preferably have low resistance. Examples include silver, copper, Aluminum, carbon nanotubes, graphene, metal halides (silver halides, etc.) ) may also be used. Furthermore, very thin (for example, a few nanometers in diameter) Alternatively, a metal nanowire made of multiple conductors may be used. A metal mesh made of Ag nanowires, Cu nanowires, Al nanowires, Ag mesh, Cu mesh, Al mesh, etc. may also be used. For example, when Ag nanowires are used for the wiring or electrodes that make up a touch panel, they are This allows the transmittance to be 89% or more and the sheet resistance to be 40Ω / □ or more and 100Ω / □ or less. In addition, the material that can be used for the wiring or electrodes that constitute the above-mentioned touch panel can be Examples include metal nanowires, metal meshes, carbon nanotubes, and graphene. Since the transmittance of the transparent conductive film is high in the visible light, it is suitable for use in electrodes (for example, pixel electrodes or common electrodes) used in display devices. It may also be used as a conductive electrode.

[0466] After a light-transmitting conductive material is formed on a flexible substrate 590 by a sputtering method, Using various patterning techniques such as photolithography, unnecessary parts are removed to form electrodes. 591 and electrode 592 can be formed.

[0467] The electrodes 591 and 592 are covered with an insulating layer 593. A hole is provided in the insulating layer 593, and a wiring 594 electrically connects the adjacent electrodes 591. The photoconductive material is preferred for the wiring 594 because it can increase the aperture ratio of the touch panel. In addition, a material having higher conductivity than the electrodes 591 and 592 can be used. It can be suitably used for the wiring 594 because it can reduce air resistance.

[0468] Note that an insulating layer is provided to cover the insulating layer 593 and the wiring 594 to protect the touch sensor 595. It is possible.

[0469] Furthermore, the connection layer 599 electrically connects the wiring 598 and the FPC 529(2).

[0470] The display unit 521 has a plurality of pixels arranged in a matrix. Since the details are similar, the explanation will be omitted.

[0471] As shown in FIG. 30(B), the flexible substrate 590 is not used, and the flexible substrate 701 and the flexible substrate 590 are used. The touch panel may be configured with two substrates, namely, the flexible substrate 711 and the insulating substrate 712. The layer 715 is bonded to the insulating layer 715 by the adhesive layer 713, and the touch sensor 59 is in contact with the insulating layer 715. 5 is provided. A colored layer 367R is provided in contact with the insulating layer 589 that covers the touch sensor 595. The insulating layer 589 is not provided, and the colored layer 367R or the shielding layer 367BM is provided. The optical layer 367BM may be provided in contact with the wiring 594.

[0472] <Configuration example 3> 31 is a cross-sectional view of touch panel 525B. 525B is a point and time when the image information is displayed on the side where the transistor is provided. The touch sensor is provided on the flexible substrate 701 side of the display unit, which is the difference from the touch panel of the second configuration example. This section explains the different configuration in detail and explains how to use a similar configuration. The above explanation will be used where possible.

[0473] The colored layer 367R is located at a position overlapping the light emitting element 350R. The element 350R emits light toward the side where the transistor 302t is provided. A part of the light emitted by the light emitting element 350R passes through the colored layer 367R and travels in the direction of the arrow shown in the figure. The light is emitted to the outside of the light emitting module 380R in the opposite direction.

[0474] The touch panel 525B has a light-shielding layer 367BM in the light-emitting direction. The BM is provided so as to surround the colored layer (for example, the colored layer 367R).

[0475] The touch sensor 595 is provided on the flexible substrate 701 side, not on the flexible substrate 711 side. (Figure 31(A)).

[0476] The adhesive layer 597 flexibly fixes the flexible substrate 590 so that the touch sensor 595 overlaps the display unit. The adhesive layer 597 is attached to a transparent substrate 701. The adhesive layer 597 is light-transmitting.

[0477] The configuration in which a bottom gate type transistor is applied to the display unit 521 is shown in FIG. As shown in (A) and (B).

[0478] For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like is formed as shown in FIG. This can be applied to the transistor 302t and the transistor 303t.

[0479] For example, a semiconductor layer containing polycrystalline silicon or the like is used as a transistor 302t shown in FIG. and transistor 303t.

[0480] FIG. 31C shows a structure in the case where a top-gate transistor is used.

[0481] For example, a polycrystalline silicon or a single crystal silicon film transferred from a single crystal silicon substrate, etc. The semiconductor layer containing the can be applied.

[0482] As described in Embodiment 1 and the like, an electronic device of one embodiment of the present invention includes a display panel and a power storage device. Figure 32(A) and (B) show the touch panel and the thin secondary battery stacked together. The touch panel shown in FIG. 32(A) is a cross-sectional view of the touch panel shown in FIG. The thin secondary battery shown in FIG. 32(A) has the same configuration as the touch panel 525 shown in FIG. 32(B) is the same as the battery unit 500 shown in FIG. The panel has the same configuration as the touch panel 525 shown in FIG. 30(B), and The thin secondary battery shown has the same configuration as the battery unit 500 shown in FIG. 14(B).

[0483] In FIGS. 32A and 32B, the flexible substrate 701 and the battery unit of the touch panel are shown. However, one embodiment of the present invention is not limited to this. The panel and the battery unit may be fixed to each other with adhesive or the like. A circuit board or the like may be provided between the cable and the battery unit.

[0484] In FIG. 32(A), the sub-pixel 302R of the touch panel and the scanning line driving circuit 303g(1) Modified examples of the stacked structure of the touch panel and the thin secondary battery are shown in Figures 33(A) and (B). vinegar.

[0485] FIG. 33(A) shows an example in which an insulating layer 705 and an exterior body 509 are bonded together with an adhesive layer 703. As described above, in one embodiment of the present invention, a transistor and a light-emitting element formed on a formation substrate The elements may be transposed onto the secondary battery.

[0486] In FIG. 33(B), the flexible substrate 701 and the insulating layer 705 are bonded together with an adhesive layer 703a. 7, in which the flexible substrate 701 and the exterior body 509 are bonded together with an adhesive layer 703b. .

[0487] The transistor 848 shown in FIG. 34 is a top-gate transistor having a back gate electrode. FIG. 34A is a top view of the transistor 848. FIG. 34B is a 34(A) is a cross-sectional view taken along the dashed line X1-X2 in FIG. 34(A). ) is a cross-sectional view taken along the dashed dotted line Y1-Y2 in FIG.

[0488] In the transistor 848, the semiconductor layer 742 is formed on a protrusion provided in an insulating layer 772. By providing the semiconductor layer 742 on the protrusions provided in the insulating layer 772, the semiconductor layer 74 The side of the second transistor can also be covered with the electrode 743. That is, the transistor 848 can be The semiconductor layer 742 can be electrically surrounded by the electric field of the third electrode. In this way, the electric field of the conductive film electrically surrounds the semiconductor layer in which the channel is formed. The structure of the transistor is called the surrounded channel (s-channel) A transistor with an s-channel structure is called an "s-channel" transistor. It is also called an "EL-type transistor" or "S-channel transistor."

[0489] In the s-channel structure, a channel is formed in the entire (bulk) of the semiconductor layer 742. The s-channel structure allows the drain current of the transistor to be increased. This allows for a larger on-state current to be obtained. This makes it possible to deplete the entire channel formation region formed in the semiconductor layer 742. Therefore, in the s-channel structure, it is possible to further reduce the off-state current of the transistor. This can be done.

[0490] The electrode 723 is provided on a substrate 771 having an insulating surface. It can function as a cathode electrode.

[0491] The electrode 744a provided on the insulating layer 729 is connected to the insulating layer 726, the insulating layer 728, and the insulating layer 729. An opening 747c is provided in the insulating film 729, which is electrically connected to the semiconductor layer 742. The electrode 744b provided over the insulating layer 729 is formed between the insulating layers 726, 728, and An opening 747d is formed in the insulating layer 729, and the insulating layer 729 is electrically connected to the semiconductor layer 742. There are.

[0492] The electrode 743 provided on the insulating layer 726 is formed by the insulating layer 726 and the insulating layer 772. The openings 747a and 747b are electrically connected to the electrode 723. The same potential is supplied to the electrode 746 and the electrode 723. It is also possible to omit either of the openings 747a and 747b. When neither the opening 747a nor the opening 747b is provided, the electrode 7 23 and electrode 746 can be supplied with different potentials.

[0493] As a semiconductor used for a transistor having an s-channel structure, an oxide semiconductor Conductor, or polycrystalline silicon, or single crystal silicon transferred from a single crystal silicon substrate, etc. Examples include silicon such as kon.

[0494] This embodiment mode can be combined with other embodiment modes as appropriate.

[0495] (Embodiment 5) In this embodiment, electronic devices of one embodiment of the present invention will be described with reference to FIGS. 35 to 40. .

[0496] One embodiment of the present invention is an electronic device including a display panel, a power storage device, a circuit, and a sealing body. The display panel has a function of displaying information using power supplied from the power storage device. The circuit has a function of wirelessly charging the power storage device. At least a part of the sealing body transmits visible light. In the electronic device of one embodiment of the present invention, the sealing body may be wearable on the arm. Alternatively, the structure connected to the sealing body may be wearable on the arm.

[0497] By using the sealing body, it is possible to protect the display panel, the power storage device, the circuit, and the like, which are the objects to be sealed. This allows for the realization of a durable electronic device. It is highly water-soluble, making it possible to realize electronic devices that can be used underwater.

[0498] In manufacturing an electronic device of one embodiment of the present invention, a display panel and a power storage device are encapsulated together by a sealing body. Therefore, highly reliable electronic devices can be easily manufactured. Furthermore, by making the sealing body into a shape that is easy to wear on the human body, such as a belt-like shape, the sealing body It can be attached to the human body and used as a wearable device.

[0499] In an electronic device of one embodiment of the present invention, a power storage device can be charged by contactless power transmission. Therefore, there is no need to remove the power storage device from the sealed body when charging. The entire encapsulant can be completely covered with the encapsulant, further improving the waterproofing of the electronic device. do.

[0500] In one embodiment of the present invention, even if one or more components of the sealed body have flexibility, For example, the display panel or the power storage device may be flexible. Both the electrode and the power storage device may be flexible.

[0501] Since the sealing body is flexible, at least one of the display panel and the power storage device is flexible. When the protective layer is provided, it is possible to protect the protective layer without impairing the flexibility of the protective layer. As described above, by applying one embodiment of the present invention, a highly reliable, safe, and flexible electrode can be obtained. When an electronic device has flexibility, it becomes easy to attach and detach the electronic device. This is preferable because it provides the effect of providing the user with a comfortable fit.

[0502] In the electronic device of this embodiment, the entire sealed body is covered with a flexible sealing body. By covering the sealed object with a flexible sealing body, repeated bending and stretching can be performed. This makes it possible to realize an electronic device that is less likely to be damaged even when exposed to heat.

[0503] In addition, by using a highly heat-resistant sealant, the display panel can be driven even at high temperatures. In addition, electronic devices can be reversibly bent even at high temperatures. It is more preferable to use a high-quality display panel and a high-quality storage device.

[0504] In this embodiment, the display device described in detail in the sixth embodiment is applied to the display panel. The electronic devices of this embodiment mode may be appropriately configured with the electronic devices described in Embodiment 1. The configuration can be applied.

[0505] The display device of one embodiment of the present invention can be configured to change the brightness depending on the ambient brightness or the state of incidence of external light to the display device. By switching the display element (selecting which display element to use), The user can see the display on the display device clearly regardless of the brightness of the surroundings. For example, in a bright environment, it is preferable to use external light and a reflective liquid crystal element for display. For example, in a dimly lit environment, it is preferable to use a light emitting element such as an organic EL element for display. The display device may use a plurality of types of display elements at the same time to perform display.

[0506] An electronic device according to one aspect of the present invention has a sensor that detects the brightness of the environment in which the electronic device is used. For example, it is preferable to have a photodiode or an image sensor. In electronic devices, the display element is automatically switched depending on the brightness detected by the sensor. It is preferable to automatically change the display state of the display device depending on the brightness of the environment. This can improve convenience for users of electronic devices.

[0507] In an electronic device according to one embodiment of the present invention, a user of the electronic device can manually switch an element used for display. It is preferable that

[0508] Next, the electronic device of this embodiment will be described in detail.

[0509] FIG. 35(A) shows a perspective view of the electronic device 101. FIG. 35(B) shows the electronic device 101. 35(B) shows a top view of the semiconductor device 1, and FIG. 35(C) shows a cross section taken along the dashed line AB in FIG. 35(B). A cross section between dashed dotted lines CD is shown in FIG.

[0510] The electronic device 101 includes a display panel 10, a power storage device 20, a circuit 30, and a sealing body 40. In FIG. 35(A) and other figures, the portion of the display panel 10 that the user can see is the electronic device 1. This is written as display unit 15 of 01.

[0511] <Display section 15> The electronic device 101 has a display unit 15. In FIGS. 35(A), (C), (F), etc., The display unit 15 is flat. In FIG. 35(C) and other figures, an arrow is shown on the electronic device 101. The side that is touched is the display surface.

[0512] The display unit 15 may be flexible. That is, the display unit 15 may be deformed to change the shape of the display unit 15. The curvature of the display unit 15 may be changed from the state shown in FIG. It is not necessary for the object to be unable to deform from a flat or curved state.

[0513] When the flexibility of the display panel is lower than that of the sealing body, the electronic device of one embodiment of the present invention When the electronic device is worn on the arm, the radius of curvature of the display unit 15 hardly changes, and the edge of the electronic device It is preferable that the shape be flexible.

[0514] <Sealing body 40> The electronic device 101 has a sealing body 40. In FIG. 35(A), the sealing body 40 has a curved surface. The curved surface shown in FIG. 35(A) is changed to a flat surface shown in FIG. 35(B). The encapsulant 40 can be deformed into a flat state. The details are the same as those in the first embodiment, and therefore will not be described here.

[0515] In the electronic device 101, a display panel 10, a power storage device 20, and a circuit 30 are stacked. The order in which these layers are stacked is not particularly limited as long as the display on the display panel 10 can be viewed by the user. Furthermore, they do not need to be stacked, and the display panel 10 and the power storage device 2 may be placed on the same plane. 0 and circuit 30 may be arranged.

[0516] For example, as shown in FIG. 35(F), the electronic device 101 includes a circuit 30 on the power storage device 20. The display panel 10 may be disposed on the circuit 30. When the sealing body 40 is worn on the arm, The power storage device 20, the circuit 30, and the display panel 10 are stacked in this order from the side closest to the arm. When the display panel 10 is positioned on the side closer to the arm, the user can see the display on the display panel 10. The circuit 30, the power storage device 20, and the display panel 10 may be stacked in this order.

[0517] The space sealed by the sealing body 40 is preferably a reduced pressure atmosphere or an inert atmosphere. By creating these atmospheres, the display panel can be more easily displayed than when the space is an air atmosphere. It can increase the reliability of 10th order.

[0518] 35(D) and (E) are different from FIG. 35(C) and are different from FIG. 35(B). 35(G) is a cross-sectional view taken along the dashed line AB. 5(B) is a cross-sectional view taken along dashed lines CD.

[0519] In FIGS. 35(C) and 35(F), the sealing body 40 on the front (display surface) side of the electronic device 101 is In this example, the side surface of the electronic device 101 is covered and the back surface of the electronic device 101 is flat, but the present invention is not limited to this. As shown in 35(D) and 35(G), the sealing body 40 on the front (display surface) side of the electronic device 101 and the sealing body 40 on the back side The sealing body 40 covers the side surface of the sealed body, and the electronic device 101 is not exposed to other parts on both the front and back. It may have a protruding portion (such as a band portion) as shown in FIG. As shown, the sealing body 40 on the back side of the electronic device 101 covers the side of the sealed body, and the sealing body 40 on the back side of the electronic device 101 The surface on the front (display surface) side may be flat. The portion of 101 including the display unit 15 may protrude from other portions (such as the band portion). Also, as shown in FIG. 35(E), other parts (such as a band) are attached to the back side of the electronic device 101. It may have a portion that protrudes beyond the

[0520] 36 to 39 show electronic devices different from electronic device 101. FIG.

[0521] FIG. 36(A) shows a perspective view of the electronic device 101a. FIG. 37(A) shows a perspective view of the electronic device 101a. 37(A) is a cross-sectional view of the device 1a taken along the dashed line EF in FIG. 37(B). The cross section between the dashed line GH is shown in FIG. 37(F). 1 shows a perspective view of the vessel 101b.

[0522] 36(A) and (B) show an example in which the display unit 15 is flat. FIG. 36(B) shows an example in which the device 20 and the circuit 30 are both flexible and have curved surfaces. This is an example in which the power storage device 20 is flexible and has a curved surface. The flexibility of the display panel 10 is not an issue. In FIG. 36(B), the flexibility of the circuit 30 is not an issue. stomach.

[0523] The electronic device 101a has a display unit 15. The electronic device 101a also has a sealing body 40. The electronic device 101a also includes a display panel 10, a power storage device 20, and a sealing body 40. , and circuit 30.

[0524] In the electronic device 101a, the display panel 10 overlaps the power storage device 20, and the circuit 30 0, and the display panel 10 and the circuit 30 do not overlap. The part that functions as a band may also have a sealed object located therein. For example, a flexible When using the power storage device 20, the power storage device 20 is arranged in a wide area inside the sealing body 40. This makes it possible to realize an electronic device that can be used for a long time on a single charge.

[0525] As described in detail in the first embodiment, the sealing body 40 contains a buoyancy material and a member having rubber elasticity. The semiconductor device may have at least one of the following:

[0526] 37(C) to (E) are different from FIG. 37(B) and show the same structure as in FIG. 37(A). FIG. 1 is a cross-sectional view taken along dashed line EF.

[0527] For example, a buoyancy material or rubber elastic material may be inserted into the space 42 shown in Figures 37(B), (C), (D), and (F). It is preferable to have a member having the following structure.

[0528] As shown in FIG. 37B, the display panel 10 and the power storage device 20, or the circuit 30 and the power storage device 2 37(C), the display panel 10 and the storage Similarly, the circuit 30 and the power storage device 20 may not be in contact with each other. The display panel 10, the power storage device 20, and the circuit 30 may each be enclosed by a sealing body 40. 37(B) and (C), the power storage device 20 and the sealing body 40 are in contact with each other. 37(C) shows an example in which the display panel 10 and the sealing body 40 are in contact with each other. As shown in Fig. 37(D), the sealing body 40 and the sealed body do not need to be in contact with each other. Two or more of the display panel 10, the power storage device 20, the circuit 30, and the sealing body 40 are connected to each other. If the part has a connecting part, it may be fixed by adhesive or the like, or may be connected so as to be relatively movable. It may be possible.

[0529] Also, as shown in FIG. 37(E), the inside of the sealing body 40 may be sufficiently depressurized. As a result, the display panel 10, the power storage device 20, the circuit 30, etc. are deteriorated by impurities, etc. Furthermore, it is possible to reduce the thickness and weight of the electronic device.

[0530] In FIGS. 37B and 37F, the sealing body 40 on the front (display surface) side of the electronic device 101a is In this example, the electronic device 101a covers the side of the body and the back surface of the electronic device 101a is flat, but is not limited to this. As shown in FIG. 37(D), the sealing body 40 on the front (display surface) side of the electronic device 101a and the sealing body 40 on the back side Both sides of the sealing body 40 cover the side surfaces of the sealed object, and the electronic device 101a is not exposed to other parts on both the front and back. It may have a portion that protrudes beyond the outer periphery (such as a band portion).

[0531] FIG. 38(A) shows a perspective view of the electronic device 101c. FIG. 39(A) shows a perspective view of the electronic device 101c. 39(A) is a cross-sectional view of the cascaded line JK in FIG. 39(B). Shown below.

[0532] The electronic device 101c has a sealing body 40 and a band 155. The display panel 10, the circuit 30, the power storage device 20, etc. are included. The sealing body 40 and the band 155 are It is preferable that the sealing body 40 and the band 155 are detachably connected. .

[0533] In addition, the electronic device 101d shown in FIG. 38(B) and the electronic device 101e shown in FIG. 38(C) As described above, even if the band 155 has a recess and the sealing body 40 is disposed in the recess, If the sealing body 40 protrudes in comparison with the band 155, the electronic device may be damaged during use. The display unit 15 may be scratched due to the device rubbing against or colliding with other objects. Therefore, the surfaces of the band 155 and the sealing body 40 are preferably approximately flush with each other. It is preferable that the band 155 and the seal 40 are connected to form a single plane. The recess of the hole 155 may be deeper than the thickness of the encapsulant 40 .

[0534] The electronic device 101d is an example in which the display unit 15 is flat. 5 is an example with a curved surface.

[0535] 38(A) and 39(A) show examples in which the width of the sealing body 40 and the width of the band 155 are equal. 39(C), the sealing body 4 The width of the band 0 may be narrower than the width of the band 155. Alternatively, as shown in FIG. 39(D), The width of the encapsulant 40 may be greater than the width of the band 155 .

[0536] Next, examples of components of an electronic device of one embodiment of the present invention will be described.

[0537] The element 151 shown in Fig. 40(A) has a display panel 10, a power storage device 20, a circuit 30, and a sealing body 40. The sealing body 40 has, inside thereof, the display panel 10, the power storage device 20, and the circuit 30 inside. Hereinafter, the display panel 10, the power storage device 20, and the circuit 30 may be collectively referred to as the sealed body.

[0538] The element 151 can be used by connecting the sealing body 40 to a band 155, for example, like the element 151a in Fig. 38(A), the element 151b in Fig. 38(B), and the element 151c in Fig. 38(C). Alternatively, as shown in Figs. 37(A) to (E), by forming the sealing body 40 in a band shape, the sealing body 40 itself may be worn on the arm.

[0539] An example of the connection relationship of the sealed body is shown in a block diagram in Fig. 40(B).

[0540] The display panel 10 has a display element 13. The display panel 10 has a function of performing display using the power <​​​​​​​​​​​​​​​​​​​​​​​​​​​The area where the display panel 10 and the circuit 30 overlap each other, or the area where the display panel 10 and the power storage device 20 overlap each other By having overlapping portions, the size of the element 151 can be reduced. It is preferable to provide a portion where the display panel 10, the power storage device 20, and the circuit 30 overlap each other. The miniaturization of the element 151 is particularly effective when the band is provided separately from the sealing body 40. In addition, when the sealing body 40 is used as a band of an electronic device, the element 151 can be made smaller. When this is not necessary, the overlapping portion of the display panel 10 and the circuit 30 or the display panel 10 and the power storage device 20 do not necessarily have to have an overlapping portion with each other.

[0546] The power storage device 20 preferably has a portion overlapping with the circuit 30. For example, the antenna 31 At least a part of the antenna 31 may overlap with the power storage device 20. and the power storage device 20, so that the antenna 31 is not easily visible to the user of the electronic device. By stacking the display panel 10, the power storage device 20, and the circuit 30 so that The display is preferably placed between the external antenna and the antenna 31. Even if the panel 10 is installed, radio waves can be transmitted and received. The transmitted radio waves pass through the display panel 10 and are received by the antenna 31 .

[0547] If the environment in which the electronic device will be used is determined, the display panel and A power storage device capable of supplying power to the display panel under such an environment is used.

[0548] The electronic device according to one aspect of the present invention can preferably be used in both low-temperature and high-temperature environments. Alternatively, the electronic device of one embodiment of the present invention can be used in a wide temperature range (for example, 0° C. or higher and 100° C. or lower, Preferably, it is used at a temperature between -25°C and 150°C, more preferably between -50°C and 200°C. The electronic device of one embodiment of the present invention can be used both indoors and outdoors. That's fine.

[0549] The display panel included in the electronic device of one embodiment of the present invention is It is preferable that each of the display devices can display a display. The device supplies power to the display panel in both 0°C and 100°C environments. It is preferable to be able to do this.

[0550] The electronic device may have a switch. 1, a display panel 10, a power storage device 20, a circuit 30, a circuit 50, and a switch 51.

[0551] For example, as shown in FIG. 40(C), when the switch 51 is in the off state, the circuit 30 The power storage device 20 can be charged with the

[0552] For example, as shown in FIG. 40(D), when the switch 51 is in the on state, the power storage device 20 The display panel 10 can be supplied with power.

[0553] Components included in an electronic device of one embodiment of the present invention will be described below in detail.

[0554] <Display panel 10> The display panel 10 includes a display element 13. As an example of the configuration of the display panel 10, Section 6 will explain the display device in detail. The display panel has a sensing element such as a touch sensor. That's fine.

[0555] The display panel 10 uses an active matrix system or a passive matrix system. It is possible.

[0556] The display panel 10 may be flexible. For example, the support substrate and sealing substrate of the display element 13 By using a film on at least one of the substrates, the flexibility of the display panel 10 is increased. It is possible.

[0557] For example, the display panel has a curvature radius in the range of 1 m to 10 m, preferably 1 m or more. It is preferable that the electronic device can be used in a state where it is bent within a range of 5 m or less. If the panel is more flexible, it can be bent with a radius of curvature of 1 mm or more but less than 1 m. Alternatively, electronic devices may be used.

[0558] It is preferable that the display panel 10 can perform display in both low temperature and high temperature environments. For example, an environment of -100°C or higher and 0°C or lower, preferably -100°C or higher and -25°C or lower The following environments are preferred, more preferably an environment between -100°C and -50°C: For example, an environment of 100°C or higher and 300°C or lower, preferably 150°C or higher and 300°C or lower The following environments are preferred, and more preferably, an environment of 200°C or higher and 300°C or lower. The panel 10 can be used not only in low temperature or high temperature environments, but also in environments above 0°C and below 100°C. For example, when the display panel 10 is kept at room temperature (20° C. or higher and 30° C. or lower), It can be displayed.

[0559] The display element 13 may be a light-emitting element, a liquid crystal element, an electrophoretic element, or a MEMS (microelectromechanical system). Display elements using electro-mechanical systems can be used. The element can be a self-luminous element, and the brightness can be controlled by current or voltage. This category includes devices that are controlled by light. For example, light-emitting diodes (LEDs) and organic electroluminescent devices An inorganic EL element or the like can be used.

[0560] The higher the heat resistance of the display element 13, the more preferable. For example, when an organic EL element is used as the display element 13, When using, the glass transition temperature of each organic compound contained in the organic EL element is 100°C or more. 00°C or less is preferable, and 150°C or more and 300°C or less is more preferable.

[0561] <Electricity storage device 20> For details and configuration examples of the power storage device 20, reference can be made to the first and second embodiments. The explanation in is omitted.

[0562] In the electronic device, the display element 13 and the power storage device 20 may be arranged so as to overlap each other. The larger the overlapping area between the display element 13 and the power storage device 20, the more heat generated by the display element 13 can be utilized. This allows the power storage device 20 to be heated over a wide area. Even when a power storage device that is difficult to install is used, the reliability of the electronic device can be improved.

[0563] <Circuit 30> For details of the circuit 30, please refer to the first embodiment, and therefore the description will be omitted here. .

[0564] <Circuit 50> The circuit 50 converts the power supplied from the power storage device 20 into power for driving the display element 13. For example, the output voltage of the power storage device 20 is required to drive the display element 13. The power supply may have a function of converting (boosting or lowering) the voltage to be supplied.

[0565] <Switch 51> For details of the switch 51, please refer to the first embodiment, and therefore the explanation will be omitted here. do.

[0566] The environment in which the electronic device of one embodiment of the present invention can be used is not limited to the air atmosphere. The electronic device can be used in water at temperatures between 0°C and 100°C. The display panel and the power storage device can be used in a wide temperature range. Since the electronic device of one embodiment of the present invention is sealed, it is highly suitable for use in water. This ensures high reliability.

[0567] The contents explained with reference to FIG. 8 can also be applied to the components of the electronic device of this embodiment. Cut.

[0568] The electronic device and its components of this embodiment are configured as a wrist-worn electronic device shown in FIGS. 9 and 10. It can also be applied.

[0569] This embodiment mode can be combined with other embodiment modes as appropriate.

[0570] (Embodiment 6) In this embodiment, a display device that can be used in an electronic device according to one embodiment of the present invention is illustrated. In this embodiment, a display device using a liquid crystal element and an organic EL element will be mainly described. However, one embodiment of the present invention is not limited to this. For the same components as those in the third embodiment, the above description can also be referred to.

[0571] A display device according to one embodiment of the present invention includes a first display element and a second display element. The element has a reflective layer that has the function of reflecting light. The first display element controls the transmission of light. The reflective layer has an opening. The second display element has a portion overlapping the opening. The second display element has a function of emitting light toward the opening. It is preferable that the area of ​​the protective layer is 5% or more and 20% or less of the area of ​​the projection layer.

[0572] For example, when sufficient external light is incident on the display device (such as in a bright environment), the external light and the first Display can be performed using a display element, thereby reducing the power consumption of the display device. In addition, even if the surroundings of the display device are dark and there is little external light incident on the display device, In a dimly lit environment, the first display element can be used to display the image. Alternatively, the first display element and the second display element may both be driven to display the image. In the following example, display may be performed using only the second display element. This allows for a highly visible and convenient display device or all-weather display device regardless of the ambient brightness. The device can be realized.

[0573] A display device according to one embodiment of the present invention includes one first display element and one second display element. For example, the number of pixels formed by the first display element may be equal to or greater than two. When the number of pixels configured by the display elements is the same, the display using the first display element and the display using the second display element are different. Display using a display element is preferable because it provides the same resolution.

[0574] The display device having the above configuration further includes a signal line, a pixel circuit, a first conductive layer, a second conductive layer, and It is preferable that an insulating layer is provided. The second display element is electrically connected to the pixel circuit. The first display element is electrically connected to the first conductive layer. The first conductive layer is electrically connected to the first conductive layer via the insulating layer. The first conductive layer has a portion overlapping with the second conductive layer. The first conductive layer is electrically connected to the second conductive layer. The second conductive layer is electrically connected to the pixel circuit. The pixel circuit is electrically connected to the signal line. The pixel circuit is connected to a first display element and a second display element arranged to sandwich an insulating layer. Both the child and the parent can be driven.

[0575] Alternatively, a display device according to one embodiment of the present invention includes a liquid crystal element and a light-emitting element. The first conductive layer has a function of reflecting light. The first conductive layer has an opening. The light-emitting element has a layer containing a light-emitting substance, a third conductive layer, and a The light-emitting element has a portion overlapping with the opening. The element has a function of emitting light toward the opening. The opening is 5% of the area of ​​the first conductive layer. It is preferable that the area is 20% or less.

[0576] A display device according to one embodiment of the present invention includes a reflective liquid crystal element as a first display element, and an organic EL The element serves as a second display element.

[0577] This allows the display device to display images using external light and a reflective liquid crystal element when sufficient external light is incident on the display device. The display can be displayed in a dark environment and the amount of external light entering the display is small. In this way, display can be performed using an organic EL element according to one embodiment of the present invention. Therefore, it is a highly visible and convenient display device regardless of the ambient brightness, or an all-weather display device. This can be achieved.

[0578] The display device having the above configuration further includes a signal line, a pixel circuit, a fifth conductive layer, a sixth conductive layer, and The liquid crystal element preferably has an insulating layer. The light-emitting element is electrically connected to a pixel circuit. The fifth conductive layer is electrically connected to the sixth conductive layer via an insulating layer. The fifth conductive layer has a portion overlapping with the sixth conductive layer. The fifth conductive layer is electrically connected to the sixth conductive layer. The electrical layer is electrically connected to the pixel circuit. The pixel circuit is electrically connected to the signal line. The element circuit can drive both the light emitting element and the liquid crystal element, which are arranged so as to sandwich the insulating layer. can.

[0579] FIG. 41 shows a circuit diagram of a pixel circuit included in the display device of this embodiment mode. 6 is a circuit diagram of a pixel circuit 630(i,j) and a pixel circuit 630(i,j+1).

[0580] Pixel circuits 630(i,j) and 630(i,j+1) shown in FIG. The circuit includes a switch SW1, a switch SW2, a capacitance element C1, a capacitance element C2, and a transistor M. In FIG. 41, the first display element 650 and the second display element 651 are shown within the dotted line frame indicating the pixel circuit. Although elements 640 are included, they will be described below as not being included in the pixel circuit. Reveal.

[0581] In FIG. 41, the switch SW1 and the switch SW2 each include a transistor. The switches SW1 and SW2 are transistors using oxide semiconductors. It is preferable to have a resistor.

[0582] Regarding the connection relationship between pixel circuits 630(i,j) and 630(i,j+1) shown in FIG. I will explain.

[0583] The pixel circuit 630(i,j) is connected to a signal line S1(j), a signal line S2(j), and a scanning line G1(i). , the scanning line G2(i), the wiring CSCOM, and the wiring ANO.

[0584] The pixel circuit 630(i, j+1) is connected to a signal line S1(j+1), a signal line S2(j+1), and a scanning The line G1(i), the scanning line G2(i), the wiring CSCOM, and the wiring ANO are electrically connected. do.

[0585] The voltage used for the signal supplied to the signal line S2(j) is the same as the voltage used for the signal supplied to the signal line S1(j+1). If the voltage used for the signal is different from that used for the signal, separate the signal line S1(j+1) from the signal line S2(j). In FIG. 41, signal line S2(j+1) is placed adjacent to signal line S2(j). An example is shown below.

[0586] The gate of the switch SW1 is electrically connected to the scanning line G1(i). One of the source and drain is electrically connected to the signal line S1(j), and the other is a capacitance element One electrode of C1 and one electrode of the first display element 650 are electrically connected.

[0587] The other electrode of the capacitive element C1 is electrically connected to the wiring CSCOM.

[0588] The other electrode of the first display element 650 is electrically connected to the wiring VCOM1.

[0589] The gate of the switch SW2 is electrically connected to the scanning line G2(i). One of the source and drain is electrically connected to the signal line S2(j), and the other is connected to the transistor The gate and back gate of the capacitor M and one electrode of the capacitor C2 are electrically connected to the do.

[0590] One of the source and drain of the transistor M is connected to the other terminal of the wiring ANO and the capacitor C2. The other electrode is electrically connected to one electrode of the second display element 640. do.

[0591] The other electrode of the second display element 640 is electrically connected to the wiring VCOM2.

[0592] The pixel circuit 630(i,j) is electrically connected to a first display element 650(i,j). The pixel circuit 630(i,j) is electrically connected to a second display element 640(i,j).

[0593] FIG. 42A is a block diagram illustrating the arrangement of pixels, wiring, and the like included in the display device 600. 42(B-1) and (B-2) show the opening 65 of the display device 600. FIG. 1H is a schematic diagram illustrating 1H.

[0594] As shown in FIG. 42(A), the display device 600 has i scanning lines G1, i scanning lines G2, j signal lines S1, j signal lines S2, j wiring CSCOM, j wiring ANO, m× The device has n pixels 602, a driver circuit GD, and a driver circuit SD, where i is 1 or more and m or less. where j is an integer between 1 and n, and m and n are integers of 1 or greater.

[0595] The display device 600 shown in FIG. 42 has a pixel 602(i,j).

[0596] The scanning line G1(i), the scanning line G2(i), the wiring CSCOM, and the wiring ANO are respectively A group of pixels 602(i,1) to 602(i,2) arranged in the row direction (the direction indicated by the arrow R in the drawing) 02(i,n) are electrically connected.

[0597] The signal line S1(j) and the signal line S2(j) are arranged in the column direction (the direction indicated by the arrow C in the figure). ) and electrically connects to another group of pixels 602(1,j) to 602(m,j) arranged in the To be continued.

[0598] For example, a pixel 602(i,j+1) adjacent to the pixel 602(i,j) in the row direction is It is preferable to provide the openings so that the arrangement of the openings 651H is different from that of the openings 651H relative to the positions of the openings 651A and 651B. (Figure 42(B-1)).

[0599] Alternatively, for example, a pixel 602(i+1,j) adjacent to the pixel 602(i,j) in the column direction is , the arrangement of the opening 651H relative to the pixel 602(i,j) is different from that of the opening 651H. This is preferable (Figure 42(B-2)).

[0600] Alternatively, the openings 651H may be arranged at the same position in all pixels.

[0601] The driving circuit GD is electrically connected to the scanning line G1(i). The driver circuit GD can be implemented using various sequential circuits such as transistors and The transistors included in the driver circuit GD can be used in the pixel circuit 6. It can be formed in the same process as the transistor included in 30(i,j).

[0602] The drive circuit SD is electrically connected to the signal line S1(j). The drive circuit SD includes, for example, Specifically, the driver circuit SD can be formed on a silicon substrate. A circuit having such a configuration can be used.

[0603] For example, the pixel circuit 630(i,j) is formed by using a COG (Chip on Glass) method. The driver circuit SD can be mounted on the pads that are electrically connected to the anisotropic The conductive film can be used to mount an integrated circuit on the pad.

[0604] 43(A) is a bottom view of the display device 600 (a view of the surface opposite to the display surface). (B-1) and (B-2) are bottom views illustrating a part of the configuration of the display device 600. FIG. 43(B-2) is a bottom view illustrating the configuration shown in FIG. 43(B-1) with some of the components omitted. FIG. 43(A) shows an example in which one unit has three pixels 602(i, j). Shows.

[0605] FIG. 44(A) shows the dashed lines X1-X2 and X shown in FIGS. 43(A), (B-1), and (B-2). 3-X4, X5-X6, X7-X8, X9-X10, and X11-X12 are cross-sectional views. 44(B) to (D) show transistors that can be used in the display device 600. 1 is an example of a star configuration.

[0606] In FIG. 44(A), the intensity of reflection of external light is controlled to display the first display element 650(i, j). The direction of the display is indicated by a dashed arrow. The direction in which the second display element 640 (i, j) displays is indicated by a solid arrow. The first display element 650(i,j) displays in the same direction as the first display element 650(i,j). It is possible.

[0607] As shown in FIG. 44(A), the driving circuit GD includes a transistor MD.

[0608] As shown in FIG. 44(A), pixel 602(i,j) is a first display element 650(i,j). , a second display element 640(i,j), a first conductive layer 681, a second conductive layer 682, an insulating layer 44(A), the pixel circuit 630( Among the elements i and j, the transistor M and the switch SW1 are shown.

[0609] The first display element 650(i,j) has a first electrode 651(i,j), a second electrode 652, and a layer 653 containing a liquid crystal material. The second electrode 652 is connected to the first electrode 651(i,j ) are arranged so that an electric field that controls the orientation of the liquid crystal material is generated between them.

[0610] The display device 600 preferably has alignment films AF1 and AF2. The containing layer 653 is located between the alignment film AF2 and the alignment film AF1.

[0611] The first display element 650(i,j) has a reflective layer that reflects incident light. In addition, the first display element 650(i,j) has a function of controlling the intensity of the reflected light. The reflective layer has an opening 651H. In FIG. 44(A), the first electrode 651(i,j) In this example, a conductive layer that transmits light and a conductive layer that reflects light are stacked. A reflective layer may be provided separately from the first electrode 651(i,j).

[0612] As shown in FIG. 44(A), the side edge of the first electrode 651(i, j) is embedded in the insulating layer 621. It's embedded.

[0613] The second display element 640(i, j) may be a light-emitting element. 640(i,j) is a third electrode 641(i,j), a fourth electrode 642, and a light-emitting material The insulating layer 668 is formed on the edge of the third electrode 641(i,j). The insulating layer 668 formed along the periphery of the third electrode 641(i, j) covers the third A short circuit between the electrode 641(i, j) and the fourth electrode 642 can be prevented.

[0614] The second display element 640(i, j) has a function of emitting light toward the opening 651H. .

[0615] The second display element 640(i,j) is the area where the first display element 650(i,j) displays. The first table can be displayed in the area surrounded by (Fig. 43(B-1) and (B-2)). The display element 650(i, j) displays in the area overlapping with the first electrode 651(i, j), and the second electrode 651(i, j) displays in the area overlapping with the first electrode 651(i, j). Display element 640(i,j) displays in the area overlapping with opening 651H.

[0616] The first conductive layer 681 is electrically connected to the first display element 650(i,j). In (A), the first conductive layer 681 and the first electrode 651(i, j) are electrically connected. The first conductive layer 681 can have a single layer structure or a stacked layer structure. The conductive layer 681 may function as the first electrode 651(i,j).

[0617] The second conductive layer 682 has an area overlapping with the first conductive layer 681. can be a single layer structure or a laminate structure.

[0618] The insulating layer 621 includes a region sandwiched between the second conductive layer 682 and the first conductive layer 681. .

[0619] In the region 691c, the second conductive layer 682 is electrically connected to the first conductive layer 681. do.

[0620] The second conductive layer 682 is electrically connected to the pixel circuit 630(i,j). In the example, the second conductive layer 682 and the conductive layer 612b are electrically connected.

[0621] The conductive layer 612a and the conductive layer 612b are connected to the switch SW1. The conductive layer 612a functions as a source and the other functions as a drain. ) is electrically connected to the signal line S1(j). Alternatively, the conductive layer 612a can be said to be a part of the signal line S1(j). (Figures 41 and 44(A)).

[0622] The first electrode 651(i,j) of the first display element 650(i,j) is a first conductive layer 681 and the second conductive layer 682, the switch SW1 is electrically connected to the conductive layer 612b of the switch SW1. That is, the first display element 650(i,j) is electrically connected to the pixel circuit 630(i , j). The first display element 650(i, j) and the pixel circuit The method for electrically connecting the first and second electrodes 630(i,j) is not limited to this. The electrode 651(i, j) and the conductive layer 612b are connected to the first conductive layer 681 or the second conductive layer Alternatively, the first electrode 651(i,j) may be electrically connected to the first electrode 651(i,j) via one of the first electrodes 651(i,j) and 651(j). and the conductive layer 612b may be directly connected.

[0623] One of the source and the drain of the transistor M is electrically connected to the wiring ANO. The third electrode 641(i,j) of the second display element 640(i,j) is connected to the connection portion 66 2 is electrically connected to the other of the source and drain of the transistor M. As a result, the second display element 640(i,j) is electrically connected to the pixel circuit 630(i,j). The transistor M is connected to the third electrode 641(i, j) via the insulating layer 661. Overlap.

[0624] The display device 600 also includes a conductive layer 619b and a conductive layer 611b (see FIG. 44(A)). )).

[0625] The insulating layer 621 includes a region sandwiched between the conductive layer 619b and the conductive layer 611b.

[0626] The conductive layer 619b is electrically connected to the conductive layer 611b in the region 691b. The conductive layer 611b is electrically connected to the pixel circuit 630(i,j).

[0627] The conductive layer 619b is connected to a flexible printed circuit board (hereinafter referred to as FPC) via a connector ACF. This allows power or In FIG. 44(A), the connection part of the conductive layer 619b with the FPC Although an example is shown in which the display device 600 is located on the display surface side, it may be located on the opposite side to the display surface. Good too.

[0628] The pixel 602(i,j) further includes a colored layer CF, a light-shielding layer BM, an insulating layer 671, and a functional film. It has 670.

[0629] The colored layer CF has an area overlapping with the first display element 650(i, j). An opening is provided in the area overlapping with the first display element 650(i,j).

[0630] The colored layer CF has an area overlapping with the second display element 640(i, j). An opening is provided in the area overlapping with second display element 640(i,j).

[0631] The insulating layer 671 is provided between the colored layer CF and the layer 653 containing the liquid crystal material, or between the light-shielding layer BM and the liquid crystal material This allows unevenness due to the thickness of the colored layer CF to be flattened. Alternatively, the layer 65 containing the liquid crystal material can be formed from the light-shielding layer BM or the colored layer CF. Diffusion of impurities into 3 can be suppressed.

[0632] The functional film 670 has an area that overlaps with the first display element 650(i, j). The functional film 670 has an area overlapping with the second display element 640(i, j). The substrate 690 is disposed between the display element 650(i, j) and the display element 650(i, j).

[0633] The second display element 640(i, j) is sealed by the adhesive layer 605 and the substrate 610. The method of sealing the second display element 640(i, j) is not limited to this. The second display element 640(i, j) can be covered with an insulating film with high barrier properties. In this case, the adhesive layer 605 and the substrate 610 may not be provided.

[0634] The substrate 690 has an area overlapping the substrate 610. The functional layer 660 is formed by overlapping the substrate 610 and the substrate The functional layer 660 includes a pixel circuit 630(i,j), a second display element 690, and a 640(i,j), insulating layer 616, insulating layer 618, insulating layer 621, insulating layer 661, and insulating layer 640(i,j). The adhesive layer 695 functions to bond the functional layer 660 to the substrate 690. The structure KB has a function of providing a predetermined gap between the functional layer 660 and the substrate 690. .

[0635] The thickness of the substrate 690 is preferably thin. For example, the substrate 690 may have a thickness of 0.2 mm or Alkali-free glass polished to 0.1 mm can be suitably used.

[0636] The display device 600 includes a conductive layer 619a, a conductive layer 611a, and a conductor CP.

[0637] Insulating layer 621 includes a region sandwiched between conductive layer 619a and conductive layer 611a.

[0638] The conductive layer 619a is electrically connected to the conductive layer 611a in a region 691a. The conductive layer 611a is electrically connected to the pixel circuit 630(i,j).

[0639] The conductor CP is sandwiched between the conductive layer 619a and the second electrode 652. For example, conductive particles can be used as the conductor CP. Cut.

[0640] Examples of materials that can be used in the display device are listed below. It can be used for plates, adhesive layers, transistors, light-emitting elements, conductive layers, insulating layers, colored layers, and light-shielding layers. For the materials that can be used for the above, the description of the third embodiment can be referred to. The explanation will be omitted.

[0641] The first display element 650(i, j) is a display element having a function of controlling reflection or transmission of light. For example, a liquid crystal element and a polarizing plate may be combined, or a shutter may be used. A reflective type MEMS display element can be used. This reduces the power consumption of the display panel. can be used for the first display element 650(i,j).

[0642] IPS (In-Plane-Switching) mode, TN (Twisted Ne matic) mode, FFS (Fringe Field Switching) mode , ASM(Axially Symmetric aligned Micro-cel l) mode, OCB (Optically Compensated Birefringence ence) mode, FLC (Ferroelectric Liquid Crystal al) mode, AFLC (AntiFerroelectric Liquid Cry It is possible to use a liquid crystal element that can be driven using a driving method such as a static mode. can.

[0643] Furthermore, for example, a vertical alignment (VA) mode, specifically, an MVA (Multi-Domain Vertical Alignment mode, PVA (Patterned Ve Orthogonal Alignment mode, ECB (Electrically Co ntrolled Birefringence) mode, CPA(Continuouou) mode Pinwheel Alignment mode, ASV (Advanced Su The liquid crystal element can be driven using a driving method such as a (per-View) mode. It is possible.

[0644] For example, thermotropic liquid crystal, low molecular weight liquid crystal, polymer liquid crystal, polymer dispersed liquid crystal, ferroelectric Liquid crystal, antiferroelectric liquid crystal, etc. can be used. Alternatively, cholesteric phase, smectic It is possible to use liquid crystal materials that exhibit a chiral phase, cubic phase, chiral nematic phase, isotropic phase, etc. Alternatively, a liquid crystal material exhibiting a blue phase can be used.

[0645] The reflective layer is made of a material that reflects visible light. For example, the reflective layer is made of a material containing silver, silver and A material containing palladium and silver, a material containing silver and copper, etc. can be used.

[0646] The reflective layer can reflect light transmitted through the layer 653 containing the liquid crystal material.

[0647] The reflective layer may have a surface with irregularities, which allows incident light to be reflected in various directions. This allows a white display.

[0648] The first electrode 651(i,j) may be used as a reflective layer. Alternatively, the layer 653 containing a liquid crystal material may be used as a reflective layer. A reflective layer may be disposed between the first electrode 651(i,j) and the first electrode 651(i,j). A first electrode 651(i, j) having light-transmitting properties may be disposed between layers 653 containing a material. .

[0649] The total area of ​​the openings 651H can be set as appropriate. If the ratio of the total area of ​​the first display element 650(i,j) to the total area of ​​the second display element 650(i,j) is small, In addition, the ratio of the total area of ​​the opening 651H to the total area of ​​the non-opening is large. If the second display element 640(i,j) is not used, the display using the second display element 640(i,j) can be brighter. The area of ​​the opening 651H is determined so that sufficient brightness can be obtained even when displaying using the is preferred.

[0650] In addition, if the area of ​​the opening 651H is small, the electric field applied to the layer 653 containing the liquid crystal material can be uniform. This can prevent a decrease in the display quality of the first display element 650(i, j). If the area of ​​the second display element 640(i, j) is large, the light emitted from the second display element 640(i, j) is not reflected outside the display device. This can improve extraction efficiency.

[0651] The shape of the opening 651H is not particularly limited, and may be, for example, a polygon such as a square, an ellipse, a circle, The openings 651H may be in the shape of a cross, a stripe, a slit, or a checkerboard pattern. Preferably, the openings 651H are arranged close to the sub-pixels of the same color. As a result, the light emitted by the second display element 640(i, j) is reflected by the other adjacent display elements. This suppresses the phenomenon of light entering the colored layers arranged in the color sub-pixels (also known as crosstalk). Cut.

[0652] The second electrode 652 can be made of a conductive material that transmits visible light. The electrode 652 can be made of a conductive oxide such as a conductive oxide containing indium. Alternatively, the second electrode 652 may be formed with a thin film (for example, a thickness of 1 nm or more) that is thin enough to transmit light. Alternatively, the second electrode 652 may be made of a metal film containing silver. Nanowires, such as metal nanowires, can be used.

[0653] Specifically, the second electrode 652 is made of indium oxide, indium tin oxide, indium Zinc oxide, zinc oxide, zinc oxide doped with gallium, zinc oxide doped with aluminum etc. can be used.

[0654] The structure KB can be made of organic materials, inorganic materials, or composite materials of organic and inorganic materials. The structure KB functions as a spacer. Granular spacers may be used. The granular spacers may be made of silica, resin, or It is preferable to use a material with elasticity such as rubber. The granular spacers are crushed in the vertical direction. The shape may be different.

[0655] The alignment films AF1 and AF2 may be made of, for example, polyimide. It is preferable that the film is formed by using a rubbing treatment or a photo-alignment technique so as to be aligned in the direction of For example, a film containing a soluble polyimide can be used as the alignment film AF1 or AF2. can.

[0656] The functional film 670 may be a polarizing plate, a retardation plate, a diffusion film, an anti-reflection film, a light-collecting film, or the like. Alternatively, a polarizing plate containing a dichroic dye can be used for the functional film 670. It is also possible to use an anti-static film that prevents dust from adhering, a water-repellent film that makes it difficult for dirt to adhere, A hard coat film or the like that prevents scratches from occurring during use can be used for the functional film 670. .

[0657] The display device includes transistors of one or more types. At least one of the transistors having the configurations shown in 44(B) to (D) can be applied. .

[0658] The switch SW1 shown in FIG. 44(B) includes a conductive layer 604, an insulating layer 606, a semiconductor layer 608, The conductive layer 604 functions as a gate. One of the conductive layer 612a and the conductive layer 612b functions as a source, and the other functions as a drain. The insulating layer 606 functions as a gate insulating layer. The switch SW1 The configuration is not limited to that shown in FIG. 44(B), and may be one shown in FIGS. 44(C) or 44(D).

[0659] The transistor M and the transistor MD shown in FIG. 44C are formed by a conductive layer 604 and an insulating layer 60 6, a semiconductor layer 608, a conductive layer 612a, a conductive layer 612b, and a conductive layer 624. The conductive layer 604 functions as a gate. The insulating layer 606 is a gate insulating layer. The conductive layer 624 functions as a back gate. Between layers 608 is an insulating layer 616. Conductive layer 624 and conductive layer 604 are semiconductor The conductive layer 624 has a portion overlapping the insulating layer 616 and the insulating layer 618 through the insulating layer 616. The transistors M and MD may have the same configuration. For example, the transistors M and MD may be 44(A) can be configured as shown in any one of the configurations shown in Figs. In the transistor M, the width of the conductive layer 604 is narrower than the width of the conductive layer 624. In the transistor MD shown in FIG. 44(A), the width of the conductive layer 604 is It is wider than the width of layer 624, but is not limited to this.

[0660] The transistor shown in FIG. 44(D) includes a conductive layer 604, an insulating layer 606, a semiconductor layer 608, and a conductive The conductive layer 604 functions as a gate. The insulating layer 606 functions as a gate insulating layer.

[0661] The semiconductor layer 608 is divided into a first region 608a and a second region 608b that do not overlap with the conductive layer 604. The semiconductor layer 608 further includes a first region 608a and a second region 608b. The third region 608c overlaps the conductive layer 604.

[0662] The first region 608a and the second region 608b have a lower resistivity than the third region 608c. One of the first regions 6 functions as a source region and the other functions as a drain region. The second region 608a is electrically connected to the conductive layer 612a. b is electrically connected.

[0663] As described in Embodiment 1 and the like, an electronic device of one embodiment of the present invention includes a display panel and a power storage device. FIG. 45 shows an example of a cross-sectional view of a display panel and a thin secondary battery stacked together. The display panel shown in FIG. 45 has the same configuration as the display device 600 shown in FIG. 44(A). 45 is similar to the battery unit 500 shown in FIG. 14(A). It is a composition.

[0664] In FIG. 45, the substrate 610 of the display panel and the exterior body 509 of the battery unit are in contact with each other. However, one embodiment of the present invention is not limited to this. The display panel and the battery unit may be fixed to each other by adhesive or the like. It may also have a circuit board or the like.

[0665] This embodiment mode can be combined with other embodiment modes as appropriate. [Explanation of symbols]

[0666] AF1 alignment film AF2 alignment film C1 Capacitor element C2 Capacitor element G1 scan line G2 scan line S1 signal line S2 signal line SW1 switch SW2 switch VCOM1 wiring VCOM2 wiring 10 Display panel 11 Light-emitting element 12a terminal 12b terminal 13 Display element 15 Display section 15a Display section 15b Display section 15c Display section 20. Energy storage device 21a electrode 21b Electrode 30 circuits 31 Antenna 32 Controller 33a terminal 33b terminal 34 terminals 35 Electronic Components 40 Sealing body 41 Sealing area 41a Sealing area 41b Sealing area 42 Space 45 Wiring 50 circuits 51 Switch 52a terminal 52b terminal 53a Wiring 53b Wiring 55 Circuit Board 68 Antenna 70 areas 91 Fasteners 93 Aperture 95 Sealing part 97 bands 100 Electronic equipment 100a electronic equipment 100b electronic equipment 100c electronic equipment 100d electronic equipment 100e electronic equipment 101 Electronic equipment 101a Electronic equipment 101b Electronic equipment 101c Electronic equipment 101d Electronic equipment 101e Electronic equipment 150 elements 150a element 150b element 151 elements 151a element 151b element 151c element 155 bands 200 Secondary battery 203 Separator 203a area 203b area 207 Exterior body 211 Positive electrode 211a positive electrode 215 negative electrode 215a negative electrode 220 Sealing layer 221 Positive lead 225 Negative lead 230 Electrode assembly 231 Electrode assembly 250 Secondary battery 281 Tab Area 282 Tab Area 301 Display section 302 pixels 302B subpixel 302G subpixel 302R subpixel 302t transistor 303c capacity 303g(1) Scanning line driver circuit 303g(2) Imaging pixel drive circuit 303s(1) Image signal line driver circuit 303s(2) Image signal line driver circuit 303t transistor Gate 304 308 imaging pixels 308p photoelectric conversion element 308t transistor 309 FPC 311 Wiring 319 terminal 321 Insulating Layer 328 Bulkhead 329 Spacer 350R light emitting element 351R lower electrode 352 Upper electrode 353 EL layer 353a EL layer 353b EL layer 354 Middle Class 360 adhesive layer 367BM light shielding layer 367p anti-reflection layer 367R colored layer 380B Light Emitting Module 380G light emitting module 380R Light Emitting Module 390 Touch Panel 500 battery unit 501 Positive electrode current collector 502 Positive electrode active material layer 503 Positive electrode 504 Negative electrode current collector 505 Negative electrode active material layer 506 negative electrode 507 Separator 508 Electrolyte 509 Exterior body 510 Positive lead 511 Negative lead 521 Display section 525 touch panel 525B Touch Panel 529 FPC 589 Insulating Layer 590 Flexible substrate 591 Electrode 592 Electrode 593 Insulating Layer 594 Wiring 595 Touch Sensor 597 Adhesive layer 598 Wiring 599 Connection Layer 600 display device 602 pixels 604 Conductive layer 605 Adhesive layer 606 Insulation Layer 608 Semiconductor layer 608a area 608b area 608c area 610 PCB 611a Conductive layer 611b Conductive layer 612a conductive layer 612b Conductive layer 616 Insulating Layer 618 Insulating Layer 619a Conductive layer 619b Conductive layer 621 Insulating layer 624 Conductive Layer 630 pixel circuit 640 Second display element 641 Third Electrode 642 Fourth Electrode 643 Layer containing luminescent material 650 first display element 651 First electrode 651H opening 652 Second electrode 653 Layer containing liquid crystal material 660 Functional Layer 661 Insulating Layer 662 Connection 668 Insulating Layer 670 Functional Membranes 671 Insulating Layer 681 First Conductive Layer 682 Second Conductive Layer 690 PCB 691a area 691b area 691c area 695 Adhesive layer 701 Flexible substrate 703 Adhesive layer 703a adhesive layer 703b adhesive layer 705 Insulation Layer 711 Flexible substrate 713 Adhesive layer 715 Insulation Layer 723 Electrode 726 Insulation Layer 728 Insulation Layer 729 Insulation Layer 742 Semiconductor layer 743 Electrode 744a electrode 744b electrode 746 Electrode 747a aperture 747b aperture 747c aperture 747d aperture 771 Circuit Board 772 Insulation Layer 804 Light-emitting part 806 Drive circuit section 808 FPC 814 Conductive layer 815 Insulation layer 817 Insulation layer 817a Insulating layer 817b Insulating layer 820 transistors 821 Insulation layer 822 Adhesive layer 823 Spacer 824 transistors 825 Connector 830 Light-emitting element 831 Lower electrode 832 Optical adjustment layer 833 EL layer 835 Upper electrode 845 Colored layer 847 Light blocking layer 848 transistors 849 Overcoat 856 Conductive layer 857 Conductive layer 857a Conductive layer 857b Conductive layer

Claims

1. a display panel, a power storage device, a circuit, and a sealing body; the sealing body includes a first film and a second film, the display panel, the power storage device, and the circuit are sealed by the first film and the second film; the display panel has light-emitting elements, the light-emitting element has a function of being able to emit light using power supplied from the power storage device, the circuit has an antenna and a controller, the antenna has a function of receiving power from an external source, the controller has a function of converting the power received by the antenna and outputting the power to the power storage device, and the circuit has a function of charging the power storage device by the antenna and the controller, at least a part of the sealing body has a function of transmitting light emitted by the light-emitting element, the display panel has a display unit, the display unit has a curved surface, the display unit has a flexible portion, The seal is wearable on the arm, The electronic device comprises the power storage device, the antenna, and the display panel stacked in this order.

2. a display panel, a power storage device, a circuit, and a sealing body; the display panel, the power storage device, and the circuit are sealed by the sealing body; the display panel has light-emitting elements, the light-emitting element has a function of being able to emit light using power supplied from the power storage device, the circuit has an antenna and a controller, the antenna has a function of receiving power from an external source, the controller has a function of converting the power received by the antenna and outputting the power to the power storage device, and the circuit has a function of charging the power storage device by the antenna and the controller, at least a part of the sealing body has a function of transmitting light emitted by the light-emitting element, the display panel has a display unit, the display unit has a curved surface, the display unit has a flexible portion, The seal is wearable on the arm, The electronic device comprises the power storage device, the antenna, and the display panel stacked in this order.

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