Multilayer Devices

Abstract

To provide a multilayer device capable of forming a rejection band depending on a required specification.SOLUTION: A multilayer device 200A comprises: a dielectric body 210; a signal line 220 provided inside the dielectric body 210; a ground electrode 230 provided inside the dielectric body 210 or on an outer surface of the same; a plurality of plane electrodes 240 provided inside the dielectric body 210, arranged in parallel to the ground electrode 230 and directing in a first direction d1 from an input side of the signal line 220 toward an output side of the same; a plurality of connection electrodes 250 provided inside the dielectric body 210 so as to connect the plurality of plane electrodes 240 and the ground electrode 230; a plurality of signal terminals 260 provided on the outer surface of the dielectric body 210 and connected with the signal line 220; and a plurality of ground terminals 270 provided on the outer surface of the dielectric body 210 and connected with the ground electrode 230. The signal line 220 has at least partially a meander shape.SELECTED DRAWING: Figure 5A

Description

[Technical Field]

[0001] The present disclosure relates to multilayer devices. [Background technology]

[0002] Conventionally, functional substrates that control the passing characteristics of high-speed digital signals and high-frequency signals (hereinafter referred to as high-speed / high-frequency signals) have been known. As an example of this type of functional substrate, Patent Document 1 discloses a functional substrate that includes a mushroom structure composed of conductor elements (planar electrodes) and through vias (connection electrodes), and a conductor (ground electrode) that functions as ground. This functional substrate has a structure in which mushroom structures are periodically arranged, and can suppress the passing of high-speed / high-frequency signals of specific frequencies. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2011 / 111311 Summary of the Invention [Problem to be solved by the invention]

[0004] However, while conventional functional substrates can block the passage of specific high-speed and high-frequency signals, they may not be able to form a stopband that blocks the passage of high-speed and high-frequency signals depending on the required specifications of multilayer devices.

[0005] An object of the present disclosure is to provide a multilayer device that can form stop bands according to required specifications. [Means for solving the problem]

[0006] A multilayer device according to one embodiment of the present disclosure includes a dielectric, a signal line disposed inside the dielectric such that a portion of the signal line is exposed on an outer surface of the dielectric, a ground electrode disposed inside or on an outer surface of the dielectric such that at least a portion of the signal line is exposed on the outer surface of the dielectric, a plurality of planar electrodes disposed inside the dielectric, the planar electrodes being parallel to the ground electrode and arranged along a first direction from the input side to the output side of the signal line, a plurality of connection electrodes disposed inside the dielectric and connecting the plurality of planar electrodes and the ground electrode, a plurality of signal terminals disposed on the outer surface of the dielectric and connected to the signal line, and a plurality of ground terminals disposed on the outer surface of the dielectric and connected to the ground electrode, wherein the signal line has at least a meander shape.

[0007] A multilayer device according to one embodiment of the present disclosure includes a signal line for transmitting a signal, a ground electrode set to ground potential, a plurality of planar electrodes parallel to the ground electrode and arranged along a first direction from the input side to the output side of the signal line, a dielectric provided between each of the signal line, the plurality of planar electrodes, and the ground electrode, and a plurality of connection electrodes located between the plurality of planar electrodes and the ground electrode and connecting the plurality of planar electrodes and the ground electrode, wherein at least a portion of the signal line has a meander shape. [Effects of the Invention]

[0008] The multilayer device of the present disclosure allows for the formation of stop bands according to required specifications. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective view showing an example of a multilayer device. [Figure 2] FIG. 2 is a diagram showing an example of an equivalent circuit of the multilayer device shown in FIG. [Figure 3] 1 is an external view of a multilayer device according to a first embodiment. [Figure 4]2 is a diagram showing a signal line, a planar electrode, a ground electrode, and a connection electrode of the multilayer device according to the first embodiment. FIG. [Figure 5A] 1 is a plan view of the signal lines, planar electrodes, and the like of the multilayer device according to the first embodiment, as viewed from above. [Figure 5B] 5B is a cross-sectional view of the multilayer device according to the first embodiment taken along line VB-VB in FIG. 5A. FIG. [Figure 5C] FIG. 2 is a bottom view of the multilayer device according to the first embodiment. [Figure 6] 3A to 3C are diagrams illustrating an example of a manufacturing process for the multilayer device according to the first embodiment. [Figure 7] 10A and 10B are diagrams illustrating signal lines, planar electrodes, ground electrodes, and connection electrodes of a multilayer device according to a first modification of the first embodiment. [Figure 8] 10 is a plan view of a signal line, a planar electrode, and the like of a multilayer device according to a first modification of the first embodiment, as viewed from above. FIG. [Figure 9] 10 is a diagram illustrating a signal line, a planar electrode, a ground electrode, and a connection electrode of a multilayer device according to a second modification of the first embodiment. FIG. [Figure 10] 10 is a plan view of a signal line, a planar electrode, and the like of a multilayer device according to a second modification of the first embodiment, as viewed from above. FIG. [Figure 11] 10 is a diagram showing the transmission characteristics of the multilayer devices according to the first embodiment, the first modification, and the second modification. FIG. [Figure 12] FIG. 10 is an external view of a multilayer device according to a second embodiment. [Figure 13] 10 is a diagram showing a signal line, a planar electrode, a ground electrode, and a connection electrode of a multilayer device according to a second embodiment. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0010] (Background to this disclosure) The background to the present disclosure will be described with reference to FIGS. 1 and 2. FIG.

[0011] FIG. 1 is a perspective view showing an example of a multilayer device 1. As shown in FIG.

[0012] 1, the multilayer device 1 includes a signal line 20 that transmits high-speed, high-frequency signals, a ground electrode 30 set to ground potential, a plurality of planar electrodes 40 arranged along the signal line 20, and a plurality of connection electrodes 50 that connect the ground electrode 30 and the plurality of planar electrodes 40. The signal line 20, the ground electrode 30, the planar electrode 40, and the connection electrodes 50 are provided inside or on the surface of a dielectric (not shown). The connection electrodes 50 are an example of via electrodes.

[0013] This multilayer device 1 has a structure in which a plurality of mushroom structures, each consisting of a planar electrode 40 and a connection electrode 50, are arranged at intervals sufficiently small relative to the wavelength of electromagnetic waves. Such a structure in which a plurality of mushroom structures are arranged at intervals sufficiently small relative to the wavelength of electromagnetic waves is also called an EBG (Electromagnetic Band Gap) structure. In the multilayer device 1 having an EBG structure, it is possible to make the effective permittivity and permeability in the medium negative values.

[0014] FIG. 2 is a diagram showing an example of an equivalent circuit of the multilayer device 1 shown in FIG.

[0015] 2 is composed of an inductive component L20 of the signal line 20 and a parallel circuit (parallel resonant circuit) provided in the path connecting the signal line 20 and the ground electrode 30. The parallel circuit is composed of a capacitive component C40 based on the signal line 20 and the planar electrode 40, an inductive component L50 due to the connection electrode 50, and a capacitive component C20 based on the signal line 20 and the ground electrode 30.

[0016] In the multilayer device 1, by arranging multiple mushroom structures as shown in Fig. 1, it is possible to control the admittance of the parallel circuit shown in Fig. 2 and make the permittivity a negative value. In the band where the permittivity is negative, high-speed and high-frequency signals cannot propagate through the signal line, and the multilayer device 1 functions as a band-stop filter.

[0017] The multilayer device of this embodiment has the following configuration to enable the formation of a stop band that blocks the passage of high-speed, high-frequency signals according to required specifications.

[0018] Hereinafter, the embodiments will be described in more detail with reference to the drawings.

[0019] Note that the embodiments described below each illustrate a specific example of the present disclosure. The numerical values, shapes, materials, components, component placement positions, connection configurations, steps, and step sequences shown in the following embodiments are examples and are not intended to limit the present disclosure. Furthermore, among the components in the following embodiments, components that are not recited in independent claims are described as optional components.

[0020] Furthermore, in this specification, terms indicating the relationship between elements, such as parallelism, terms indicating the shape of elements, such as rectangular parallelepiped, and numerical ranges are not expressions that only express a strict meaning, but are expressions that also include a substantially equivalent range, for example, a difference of about a few percent.

[0021] In addition, each drawing is a schematic diagram in which emphasis, omission, or adjustment of proportions has been appropriately made to illustrate the present disclosure, and is not necessarily an exact illustration, and may differ from the actual shape, positional relationship, and proportion. In each drawing, substantially the same configuration is assigned the same reference numeral, and duplicated explanations may be omitted or simplified.

[0022] Furthermore, in this specification, the terms "top surface" and "bottom surface" in the configuration of a multilayer device do not refer to the top surface (the surface on the vertically upper side) and bottom surface (the surface on the vertically lower side) in absolute spatial recognition, but are used as terms defined by the relative positional relationship of the components of the multilayer device.

[0023] (Embodiment 1) [Multi-layer device configuration] The configuration of the multilayer device 200A according to the first embodiment will be described with reference to the drawings.

[0024] FIG. 3 is an external view of the multilayer device 200A according to the first embodiment. FIG. 4 is a diagram showing the signal line 220, planar electrodes 241, 242, and 243, the ground electrode 230, and connection electrodes 251, 252, and 253 of the multilayer device 200A. FIG. 5A is a plan view of the signal line 220 and planar electrodes 241, 242, and 243 of the multilayer device 200A, as viewed from above. FIG. 5B is a cross-sectional view of the multilayer device 200A taken along line VB-VB in FIG. 5A. FIG. 5C is a bottom view of the multilayer device 200A.

[0025] Fig. 4 shows the multilayer device 200A without the signal terminals 261 and 262, the ground terminals 271, 272, 273, and 274, and the dielectric 210. In Fig. 5A, the signal line 220 is shown by a solid line, and the signal line 220 and the planar electrodes 241, 242, and 243 are hatched. In Fig. 5C, the signal line, the planar electrodes, and the connecting electrodes are not shown.

[0026] 3, 4, and 5A to 5C includes a dielectric 210, a signal line 220, a ground electrode 230, a plurality of planar electrodes 241, 242, and 243, and a plurality of connection electrodes 251, 252, and 253. The multilayer device 200A also includes a plurality of signal terminals 261 and 262, and a plurality of ground terminals 271, 272, 273, and 274.

[0027] In the following, some or all of the plurality of planar electrodes 241-243 may be referred to as planar electrodes 240, and some or all of the plurality of connection electrodes 251-253 may be referred to as connection electrodes 250. Furthermore, some or all of the plurality of signal terminals 261, 262 may be referred to as signal terminals 260, and some or all of the plurality of ground terminals 271-274 may be referred to as ground terminals 270.

[0028] For example, the signal line 220, the ground electrode 230, the planar electrode 240, and the connection electrode 250 are made of a metal material such as silver or copper. The signal line 220, the ground electrode 230, the planar electrode 240, and the connection electrode 250 may be made of the same material or the same composition ratio, or may be made of different materials or different composition ratios.

[0029] The dielectric 210 is formed, for example, by stacking multiple dielectric layers. The dielectric 210 is formed, for example, from a dielectric material such as low-temperature co-fired ceramics (LTCC). In order to miniaturize the multilayer device 200A, it is desirable to use a material with a high relative dielectric constant for the dielectric 210. The dielectric 210 is provided between the signal line 220, the ground electrode 230, and the planar electrode 240. The dielectric 210 is also formed so as to cover the outer peripheral surface of the signal line 220 excluding both end faces, the outer peripheral surface of the ground electrode 230 excluding both end faces, and the electrode structure consisting of the planar electrode 240 and the connection electrode 250.

[0030] Dielectric 210 has a rectangular parallelepiped shape and has bottom surface 216, top surface 217 facing away from bottom surface 216, and multiple side surfaces 211, 212, 213, and 214 connecting bottom surface 216 and top surface 217. Multiple side surfaces 211 to 214 include side surfaces 211 and 212 facing away from each other, and side surfaces 213 and 214 perpendicular to both side surfaces 211 and 212. Bottom surface 216 and top surface 217 are parallel to each other, side surfaces 211 and 212 are parallel to each other, and side surfaces 213 and 214 are parallel to each other. Corners (ridges) where the surfaces of dielectric 210 intersect may be rounded.

[0031] Here, the direction in which side surface 211 and side surface 212 face each other is called the first direction d1, the direction in which side surface 213 and side surface 214 face each other is called the second direction d2, and the direction in which bottom surface 216 and top surface 217 face each other is called the third direction d3. In the following, the negative side of first direction d1 may be called one side, and the positive side opposite to the negative side may be called the other side.

[0032] The signal line 220 is provided inside the dielectric 210 so that both ends, which are part of the signal line 220, are exposed to the outer surfaces (side surfaces 211, 212) of the dielectric 210. The signal line 220 is disposed parallel to the planar electrode 240 and the ground electrode 230.

[0033] At least a portion of the signal line 220 of this embodiment has a meandering shape. The meandering shape is a serpentine shape. The signal line 220 shown in FIGS. 4 and 5A has a square-wave meandering shape. The meandering shape is not limited to a square wave, and may be a triangular wave, a sinusoidal wave, or an arc-shaped waveform. The meandering shape may also be a pulse wave shape that is convex or concave in the second direction d2.

[0034] The signal line 220 has meander line portions 221, 222, and 223, which are meander-shaped regions. The meander line portions 221, 222, and 223 are arranged in this order along a first direction d1 from the input side toward the output side of the signal line 220. The meander line portions 221, 222, and 223 are provided in one-to-one correspondence with the planar electrodes 241, 242, and 243. Specifically, the meander line portion 221 corresponds to the planar electrode 241, the meander line portion 222 corresponds to the planar electrode 242, and the meander line portion 223 corresponds to the planar electrode 243.

[0035] In other words, the meander line portions 221, 222, and 223 are provided at positions facing the planar electrodes 241, 242, and 243, respectively. That is, when viewed from a direction perpendicular to the planar electrode 240, i.e., the third direction d3, the meander line portion 221 overlaps the planar electrode 241, the meander line portion 222 overlaps the planar electrode 242, and the meander line portion 223 overlaps the planar electrode 243. In this example, the length in the second direction d2 of each of the meander line portions 221 to 223 is the same as the length in the second direction d2 of each of the planar electrodes 241 to 243. The length in the first direction d1 of each of the meander line portions 221 to 223 is shorter than the length in the first direction d1 of each of the planar electrodes 241 to 243. The capacitive component C40 (see FIG. 2) in the multilayer device 200A is generated in the areas where the meander line portions 221, 222, and 223 and the planar electrodes 241, 242, and 243 face each other.

[0036] The signal line 220 also has a plurality of linear coupling line portions 226, 227, 228, and 229. The coupling line portion 226 connects the signal terminal 261 and the meander line portion 221. The coupling line portion 227 connects the meander line portions 221 and 222 that are adjacent to each other in the first direction d1. The coupling line portion 228 connects the meander line portions 222 and 223 that are adjacent to each other in the first direction d1. The coupling line portion 229 connects the meander line portion 223 and the signal terminal 262. The meander line portions 221 to 223 are connected in series by the coupling line portions 226 to 229.

[0037] When the multilayer device 200A is mounted in an electronic device, high-speed, high-frequency signals are input to and output from the signal line 220 via the signal terminal 260.

[0038] Signal terminal 260 is provided on side surfaces 211 and 212, which are the outer surfaces of dielectric 210. Of two signal terminals 261 and 262, one signal terminal 261 is provided on side surface 211, and the other signal terminal 262 is provided on side surface 212. One end of signal line 220 is connected to one signal terminal 261, and the other end of signal line 220 is connected to the other signal terminal 262.

[0039] The ground electrode 230 is provided inside the dielectric 210 so that a portion of the ground electrode 230 is exposed on the outer surfaces (side surfaces 211 and 212) of the dielectric 210. The ground electrode 230 has rectangular cutouts 231 at both ends in the first direction d1 so as not to come into contact with the signal terminal 260, and is disposed at a predetermined distance from the signal terminal 260. The ground electrode 230 is also disposed at a predetermined distance from the side surfaces 213 and 214 so as not to be exposed on the side surfaces 213 and 214. The ground electrode 230 may be provided on the bottom surface 216 of the dielectric 210 instead of inside the dielectric 210. The ground electrode 230 may have a structure having an open pattern, such as a mesh structure, instead of a solid pattern. By providing the ground electrode 230 with a mesh structure, the dielectrics 210 can be joined together, thereby increasing the joining strength.

[0040] When the multilayer device 200A is mounted in an electronic device, the ground electrode 230 is set to the ground potential via the ground terminal 270.

[0041] The ground terminal 270 is provided on side surfaces 211 and 212, which are the outer surfaces of the dielectric 210. Of the four ground terminals 271 to 274, one ground terminal 271 and 273 are provided on the side surface 211, and the other ground terminals 272 and 274 are provided on the side surface 212. One end of the ground electrode 230 is connected to one ground terminal 271 and 273, and the other end of the ground electrode 230 is connected to the other ground terminals 272 and 274. One ground terminal 271 and 273 are arranged on both sides of one signal terminal 261 in the second direction d2. The other ground terminals 272 and 274 are arranged on both sides of the other signal terminal 262 in the second direction d2. In other words, one signal terminal 261 is disposed between two ground terminals 271 and 273 , and the other signal terminal 262 is disposed between two ground terminals 272 and 274 .

[0042] The number of ground terminals 270 is not limited to four and may be two. The ground terminals 270 may be provided on the side surfaces 211 and 212 or the side surfaces 213 and 214 of the dielectric 210, one each. For example, the ground terminals 270 may be provided on the side surfaces 211 and 212, one each. In this case, it is desirable to arrange the ground terminals 270 diagonally so that the mounting orientation does not need to be considered. The ground terminals 270 may also be provided on the side surfaces 213 and 214, in addition to the side surfaces 211 and 212. The ground terminals 270 may also be provided on only the side surfaces 213 and 214. In this case, a portion of the ground electrode 230 may be exposed on the side surfaces 213 and 214, and the ground terminals 270 may be connected to the exposed ground electrode 230.

[0043] The planar electrode 240 is disposed within the dielectric 210 so as to be located between the signal line 220 and the ground electrode 230 in the third direction d3. The planar electrode 240 is disposed parallel to the signal line 220 and the ground electrode 230. The gap between the planar electrode 240 and the signal line 220 is smaller than the gap between the ground electrode 230 and the signal line 220. In this embodiment, the gap between the planar electrode 240 and the signal line 220 is, for example, 0.1 to 0.5 times the gap between the ground electrode 230 and the signal line 220. The size of this gap is appropriately set depending on the stopband required for the multilayer device 200A, etc. The multiple planar electrodes 240 are planar electrodes having a rectangular shape. Note that the shape of the planar electrode 240 is not limited to a rectangular shape and may be a square, polygonal, circular, or elliptical shape. The multiple planar electrodes 241, 242, and 243 are disposed at equal intervals in this order along the first direction d1. The planar electrodes 241, 242, and 243 have the same shape and size, and the gap between each of the planar electrodes 241, 242, and 243 and the signal line 220 is the same.

[0044] The connection electrode 250 is a via conductor that connects the planar electrodes 240 and the ground electrode 230, and is provided inside the dielectric 210. The connection electrode 250 is formed so as to penetrate the dielectric 210 located between the planar electrodes 240 and the ground electrode 230. The connection electrode 250 is columnar, and the diameter of the connection electrode 250 is greater than the thickness of the planar electrode 240. The length of the connection electrode 250 is smaller than the gap between the ground electrode 230 and the signal line 220. Note that in this multilayer device 200A, changing the length of the connection electrode 250 changes the distance between the planar electrode 240 and the ground electrode 230, and also changes the gap between the planar electrode 240 and the signal line 220. In other words, changing the length of the connection electrode 250 to change the inductive component L50 also changes the capacitive component C40, which is affected by the gap between the planar electrode 240 and the signal line 220.

[0045] The connection electrodes 251, 252, and 253 are arranged in this order at equal intervals along the first direction d1. The connection electrodes 251, 252, and 253 have the same shape and size. The connection electrodes 251 to 253 are arranged along the first direction d1 in a one-to-one correspondence with the planar electrodes 241 to 243. Specifically, the connection electrode 251 connects the planar electrode 241 and the ground electrode 230, the connection electrode 252 connects the planar electrode 242 and the ground electrode 230, and the connection electrode 253 connects the planar electrode 243 and the ground electrode 230. The connection electrodes 251 to 253 are connected to the corners of the outer periphery of the planar electrodes 241 to 243. The connection electrodes 251 to 253 do not necessarily have to be connected to the corners of the outer periphery of the planar electrodes 241 to 243, but may be connected to the center of the planar electrodes 241 to 243.

[0046] In this embodiment, the signal line 220 of the multilayer device 200A has at least a portion having a meander shape. Therefore, the signal line 220 and the planar electrode 240 can generate a capacitive component C40 corresponding to the meander shape. For example, increasing the area formed by the meander shape can increase the opposing area between the signal line 220 and the planar electrode 240, and decreasing the area formed by the meander shape can decrease the opposing area between the signal line 220 and the planar electrode 240. Changing the opposing area can change the value of the capacitive component C40, thereby changing the frequency of the stop band of the multilayer device 200A. This makes it possible to form a stop band according to required specifications.

[0047] Although the above example shows the multilayer device 200A as a mount-type chip component mounted on a printed circuit board or the like, the present invention is not limited thereto. For example, the multilayer device 200A may be configured such that the signal terminal and the ground terminal are not provided, and the dielectric 210, the signal line 220, the ground electrode 230, the planar electrode 240, and the connection electrode 250 are provided inside the printed circuit board as part of the printed circuit board.

[0048] [Method of manufacturing multilayer devices] FIG. 6 is a diagram showing an example of a manufacturing process for the multilayer device 200A.

[0049] First, one or more green sheets without an electrode pattern are stacked to form a lower layer sheet. The green sheets are dielectric sheets that will become dielectric layers after sintering. Next, green sheets with ground electrode patterns are stacked on top of the lower layer sheets. The ground electrode patterns are printed patterns that will become ground electrodes 230 after sintering. Next, multiple green sheets with connection electrode patterns are stacked on top of the green sheets with the ground electrode patterns. The connection electrode patterns are printed patterns that will become connection electrodes 250 (see FIG. 6(a)) after sintering. Next, green sheets with connection electrode patterns and planar electrode patterns are stacked on top of the green sheets with the connection electrode patterns. The planar electrode patterns are printed patterns that will become planar electrodes 240 (see FIG. 6(b)) after sintering. Next, green sheets with signal line patterns are stacked on top of the green sheets with the connection electrode patterns and planar electrode patterns. The signal line patterns are printed patterns that will become signal lines 220 (see FIG. 6(c)) after sintering. Next, one or more green sheets without electrode patterns are laminated on the green sheet with the signal line pattern to form an upper layer sheet.

[0050] The stacked sheets are pressed to form a mother laminate. The mother laminate is then cut into individual pieces, and the individual pieces are sintered. Signal terminals 260 and ground terminals 270 are then formed on the side surfaces of the sintered laminate. This completes the multilayer device 200A.

[0051] [First Modification of First Embodiment] A description will be given of the configuration of a multilayer device 200B according to Modification 1 of Embodiment 1. In Modification 1, an example in which wide line portions 222p are provided instead of meander line portions 222 will be described.

[0052] 7 is a diagram showing a signal line 220, a planar electrode 240, a ground electrode 230, and a connection electrode 250 of a multilayer device 200B according to Modification 1. FIG. 8 is a plan view showing the signal line 220, the planar electrode 240, and the like of the multilayer device 200B according to Modification 1. In FIG. 8, the signal line 220 is shown by a solid line, and the signal line 220 and the planar electrode 240 are each hatched. The configurations of the planar electrode 240, the ground electrode 230, and the connection electrode 250 of the multilayer device 200B are the same as those in the first embodiment.

[0053] The signal line 220 of Modification 1 has at least a portion that is meander-shaped. The signal line 220 has meander line portions 221 and 223, which are meander-shaped regions, and a wide line portion 222p, which has a wide line width. The wide line portion 222p has a line width wider than the coupling line portions 226, 227, 228, and 229, which have normal line widths. The wide line portion 222p is a planar region and is provided in the central portion of the signal line 220. The meander line portions 221 and 223 are provided on both outside sides of the central portion of the signal line 220, i.e., on both outside sides of the wide line portion 222p. Of the meander line portions 221 and 223 located at both ends of the signal line 220, the meander line portion 221 is connected to the signal terminal 261, and the meander line portion 223 is connected to the signal terminal 262. That is, the meander line portion 221, the wide line portion 222p, and the meander line portion 223 are arranged in this order along the first direction d1. The meander line portion 221, the wide line portion 222p, and the meander line portion 223 are provided in one-to-one correspondence with the planar electrodes 241, 242, and 243. Specifically, the meander line portion 221 corresponds to the planar electrode 241, the wide line portion 222p corresponds to the planar electrode 242, and the meander line portion 223 corresponds to the planar electrode 243.

[0054] In other words, the meander line portion 221, the wide line portion 222p, and the meander line portion 223 are provided at positions facing the planar electrodes 241, 242, and 243, respectively. That is, when viewed from a direction perpendicular to the planar electrode 240, i.e., the third direction d3, the meander line portion 221 overlaps the planar electrode 241, the wide line portion 222p overlaps the planar electrode 242, and the meander line portion 223 overlaps the planar electrode 243. In this example, the lengths of the meander line portion 221, the wide line portion 222p, and the meander line portion 223 in the second direction d2 are the same as the lengths of the planar electrodes 241 to 243 in the second direction d2. The length in the first direction d1 of each of the meander line portions 221 and 223 is shorter than the length in the first direction d1 of each of the planar electrodes 241 and 243, and the length in the first direction d1 of the wide line portion 222p is the same as the length in the first direction d1 of the planar electrode 242. A capacitive component C40 (see FIG. 2) in the multilayer device 200B is generated in a region where the meander line portion 221, the wide line portion 222p, and the meander line portion 223 face the planar electrodes 241, 242, and 243. The capacitive component C40 of the multilayer device 200B of the first modification is larger than the capacitive component C40 of the multilayer device 200A of the first embodiment. The inductive component L20 of the multilayer device 200B of the first modification is smaller than the inductive component L20 of the multilayer device 200A of the first embodiment.

[0055] The signal line 220 also has a plurality of linear coupling line portions 226, 227, 228, and 229. The coupling line portion 226 connects the signal terminal 261 and the meander line portion 221. The coupling line portion 227 connects the meander line portion 221 and the wide line portion 222p that are adjacent to each other in the first direction d1. The coupling line portion 228 connects the wide line portion 222p and the meander line portion 223 that are adjacent to each other in the first direction d1. The coupling line portion 229 connects the meander line portion 223 and the signal terminal 262. The meander line portion 221, the wide line portion 222p, and the meander line portion 223 are connected in series by the coupling line portions 226 to 229.

[0056] When the multilayer device 200B is mounted in an electronic device, high-speed, high-frequency signals are input to and output from the signal line 220 via the signal terminal 260.

[0057] The signal line 220 of the multilayer device 200B according to the first modification also has at least a portion having a meander shape. Therefore, the signal line 220 and the planar electrode 240 can generate a capacitive component C40 according to the meander shape. For example, by changing the value of the capacitive component C40 according to the meander shape, the frequency of the stop band of the multilayer device 200B can be changed. This makes it possible to form a stop band according to the required specifications.

[0058] [Modification 2 of Embodiment 1] A description will be given of the configuration of a multilayer device 200C according to Modification 2 of Embodiment 1. In Modification 2, an example will be described in which wide line portions 221p and 223p are provided instead of meander line portions 221 and 223.

[0059] 9 is a diagram illustrating a signal line 220, a planar electrode 240, a ground electrode 230, and a connection electrode 250 of a multilayer device 200C according to Modification 2. FIG. 10 is a plan view of the signal line 220, the planar electrode 240, and the like of the multilayer device 200C according to Modification 2. In FIG. 10, the signal line 220 is indicated by a solid line, and the signal line 220 and the planar electrode 240 are each hatched. The configurations of the planar electrode 240, the ground electrode 230, and the connection electrode 250 of the multilayer device 200C are the same as those in the first embodiment.

[0060] The signal line 220 of Modification 2 has at least a portion that is meander-shaped. The signal line 220 has a meander line portion 222, which is a region having a meander shape, and wide line portions 221p and 223p, each having a wide line width. The meander line portion 222 is provided in the central portion of the signal line 220. The wide line portions 221p and 223p have a wider line width than the coupling line portions 226, 227, 228, and 229, which have a normal line width. The wide line portions 221p and 223p are planar regions and are provided on both outside sides of the central portion of the signal line 220, i.e., on both outside sides of the meander line portion 222. Of the wide line portions 221p and 223p located at both ends of the signal line 220, the wide line portion 221p is connected to the signal terminal 261, and the wide line portion 223p is connected to the signal terminal 262. That is, the wide line portion 221p, the meander line portion 222, and the wide line portion 223p are arranged in this order along the first direction d1. The wide line portion 221p, the meander line portion 222, and the wide line portion 223p are provided in one-to-one correspondence with the planar electrodes 241, 242, and 243. Specifically, the wide line portion 221p corresponds to the planar electrode 241, the meander line portion 222 corresponds to the planar electrode 242, and the wide line portion 223p corresponds to the planar electrode 243.

[0061] In other words, the wide line portion 221p, the meander line portion 222, and the wide line portion 223p are provided at positions facing the planar electrodes 241, 242, and 243, respectively. That is, when viewed from a direction perpendicular to the planar electrode 240, i.e., the third direction d3, the wide line portion 221p overlaps the planar electrode 241, the meander line portion 222 overlaps the planar electrode 242, and the wide line portion 223p overlaps the planar electrode 243. In this example, the lengths of the wide line portion 221p, the meander line portion 222, and the wide line portion 223p in the second direction d2 are the same as the lengths of the planar electrodes 241 to 243 in the second direction d2. The length in the first direction d1 of each of the wide line portions 221p, 223p is the same as the length in the first direction d1 of each of the planar electrodes 241, 243, and the length in the first direction d1 of the meander line portion 222 is shorter than the length in the first direction d1 of the planar electrode 242. A capacitive component C40 (see FIG. 2) in the multilayer device 200C is generated in a region where the wide line portion 221p, the meander line portion 222, and the wide line portion 223p face the planar electrodes 241, 242, and 243. The capacitive component C40 of the multilayer device 200C of the second modification is larger than the capacitive component C40 of the multilayer device 200A of the first embodiment. The inductive component L20 of the multilayer device 200C of the second modification is smaller than the inductive component L20 of the multilayer device 200A of the first embodiment.

[0062] The signal line 220 also has a plurality of linear coupling line portions 226, 227, 228, and 229. The coupling line portion 226 connects the signal terminal 261 and the wide line portion 221p. The coupling line portion 227 connects the wide line portion 221p and the meander line portion 222 that are adjacent to each other in the first direction d1. The coupling line portion 228 connects the meander line portion 222 and the wide line portion 223p that are adjacent to each other in the first direction d1. The coupling line portion 229 connects the wide line portion 223p and the signal terminal 262. The wide line portion 221p, the meander line portion 222, and the wide line portion 223p are connected in series by the coupling line portions 226 to 229.

[0063] When the multilayer device 200C is mounted in an electronic device, high-speed, high-frequency signals are input to and output from the signal line 220 via the signal terminal 260.

[0064] The signal line 220 of the multilayer device 200C according to the second modification also has at least a portion having a meander shape. Therefore, the signal line 220 and the planar electrode 240 can generate a capacitive component C40 according to the meander shape. For example, by changing the value of the capacitive component C40 according to the meander shape, the frequency of the stop band of the multilayer device 200C can be changed. This makes it possible to form a stop band according to the required specifications.

[0065] [Effects, etc.] The effects of the multilayer devices 200A, 200B, and 200C having the above configuration will be described with reference to FIG.

[0066] The design conditions for the multilayer devices 200A, 200B, and 200C are as follows:

[0067] The dimensions of the multilayer device are: length 0.8 mm, width 0.6 mm, height 0.45 mm Width of signal line 220: 0.05 mm Meander L / S: 0.025mm / 0.025mm Width of the planar electrode 240 (length in the second direction d2): 0.5 mm Length of the planar electrode 240 (length in the first direction d1): 0.2 mm Distance between adjacent planar electrodes 240 in the first direction d1: 0.05 mm Via diameter of connection electrode 250: 0.1 mm The thickness of each of the signal line 220, the ground electrode 230, and the planar electrode 240: 10 μm Thickness of the dielectric 210 below the ground electrode 230: 35 μm Length of connecting electrode 250: 320 μm Distance between the planar electrode 240 and the signal line 220: 25 μm Thickness of the dielectric 210 above the signal line 220: 70 μm Dielectric constant of dielectric 210: 4.1 Dielectric tangent of dielectric 210: 0.015 Length of each connecting line portion 226, 229: 0.0625 mm Length of each of the connecting line portions 227 and 228 of the multilayer device 200A: 0.1 mm Length of each of the connecting line portions 227 and 228 of the multilayer device 200B: 0.0625 mm Length of each of the connecting line portions 227 and 228 of the multilayer device 200C: 0.0875 mm

[0068] The transmission characteristics of the multilayer device under these design conditions will be explained.

[0069] 11 is a diagram showing the transmission characteristics of the multilayer devices according to the first embodiment, the first modification, and the second modification, in which the vertical axis represents the S parameter (S21).

[0070] As shown in FIG. 11 , the multilayer device 200A of the first embodiment has an attenuation pole near a frequency of 26.4 GHz, where the insertion loss is greatest. The multilayer device 200A is capable of blocking the passage of signals with a frequency of 26.4 GHz. The multilayer device 200B of the first modification has an attenuation pole near a frequency of 25.5 GHz, where the insertion loss is greatest. The multilayer device 200B is capable of blocking the passage of signals with a frequency of 25.5 GHz. The multilayer device 200C of the second modification has a smaller attenuation amount than the multilayer device of the first embodiment and the second modification, but is able to ensure a sufficient attenuation amount over a wide frequency band of 20 GHz or higher. The multilayer device 200C is capable of blocking the passage of signals over a wide band.

[0071] By changing the meander shape of the signal line 220 in these multilayer devices 200A, 200B, and 200C, the frequency of the stopband of the multilayer device can be changed, thereby enabling the stopband to be formed according to the required specifications.

[0072] (Embodiment 2) [Multi-layer device configuration] The configuration of a multilayer device 200D according to the second embodiment will be described with reference to Figures 12 and 13. In the second embodiment, an example in which the multilayer device 200D is a common mode filter will be described.

[0073] Fig. 12 is an external view of a multilayer device 200D according to Embodiment 2. Fig. 13 is a diagram showing a signal line 220, a planar electrode 240, a ground electrode 230, and a connection electrode 250 of the multilayer device 200D.

[0074] 12 and 13 includes a dielectric 210, a signal line 220, a ground electrode 230, a plurality of planar electrodes 241, 242, and 243, and a plurality of connection electrodes 251, 252, and 253. The multilayer device 200D also includes a plurality of signal terminals 261, 262, 263, and 264, and a plurality of ground terminals 271, 272, 273, and 274. The configurations of the dielectric 210, the ground electrode 230, the planar electrode 240, the connection electrode 250, and the ground terminals 271 to 274 of the multilayer device 200D are the same as those in the first embodiment.

[0075] The signal line 220 of the second embodiment is a differential line configured by two parallel signal lines 220a and 220b provided inside the dielectric 210. At least a portion of each of the signal lines 220a and 220b has a meander shape. Each of the signal lines 220a and 220b is disposed parallel to the planar electrode 240 and the ground electrode 230. When the multilayer device 200D is mounted in an electronic device, a differential signal is transmitted through the two signal lines 220a and 220b.

[0076] Four signal terminals 261 to 264 are provided on side surfaces 211 and 212 of dielectric 210. Of the four signal terminals 261 to 264, signal terminals 261 and 263 are provided on side surface 211, and signal terminals 262 and 264 are provided on side surface 212. One end of signal line 220a is connected to one signal terminal 261, and one end of signal line 220b is connected to one signal terminal 263. The other end of signal line 220a is connected to the other signal terminal 262, and the other end of signal line 220b is connected to the other signal terminal 264. One signal terminal 261 and 263 are disposed between two ground terminals 271 and 273, and the other signal terminals 262 and 264 are disposed between two ground terminals 272 and 274.

[0077] The signal lines 220a and 220b of the multilayer device 200D according to the second embodiment also have at least a portion having a meander shape. Therefore, the signal lines 220a and 220b and the planar electrode 240 can generate a capacitive component C40 corresponding to the meander shape. For example, by changing the value of the capacitive component C40 according to the meander shape, the frequency of the stop band of the multilayer device 200D can be changed. This makes it possible to form a stop band according to the required specifications.

[0078] (summary) A multilayer device 200A according to this embodiment includes a dielectric 210, a signal line 220 provided inside the dielectric 210 so as to be partially exposed on the outer surface of the dielectric 210, a ground electrode 230 provided inside or on the outer surface of the dielectric 210 so as to be at least partially exposed on the outer surface of the dielectric 210, a plurality of planar electrodes 240 provided inside the dielectric 210, parallel to the ground electrode 230, and arranged along a first direction d1 from the input side to the output side of the signal line 220, a plurality of connection electrodes 250 provided inside the dielectric 210 and connecting the plurality of planar electrodes 240 and the ground electrode 230, a plurality of signal terminals 260 provided on the outer surface of the dielectric 210 and connected to the signal line 220, and a plurality of ground terminals 270 provided on the outer surface of the dielectric 210 and connected to the ground electrode 230. At least a portion of the signal line 220 has a meander shape.

[0079] By providing the signal line 220 with a meander shape in this manner, a capacitive component C40 corresponding to the meander shape can be generated between the signal line 220 and the planar electrode 240. For example, increasing the area defined by the meander shape can increase the opposing area between the signal line 220 and the planar electrode 240, and decreasing the area defined by the meander shape can decrease the opposing area between the signal line 220 and the planar electrode 240. Changing the opposing area can change the value of the capacitive component C40, thereby changing the frequency of the stopband of the multilayer device 200A. This makes it possible to form a stopband according to the required specifications of the multilayer device 200A.

[0080] Furthermore, when an electrode structure consisting of the signal line 220, the ground electrode 230, the planar electrode 240, and the connection electrode 250 is formed inside a printed circuit board, the printed circuit board must have a multilayer structure. However, by using the multilayer device 200A including the electrode structure as an electronic component mounted on the printed circuit board, rather than forming the electrode structure inside the printed circuit board, the number of layers of the printed circuit board on which the multilayer device 200A is mounted can be reduced. This prevents the cost of the printed circuit board from increasing.

[0081] The signal line 220 may also include a meander line portion (for example, 221) having a meander shape, and the meander line portion may be provided at a position facing the planar electrode (for example, 241).

[0082] In this way, by providing the meander line portion (e.g., 221) at a position facing the planar electrode (e.g., 241), the meander line portion 221 and the planar electrode 241 can generate a capacitive component C40 according to the meander shape. For example, by changing the value of the capacitive component C40 according to the meander shape, the frequency of the stop band of the multilayer device 200A can be changed. This makes it possible to form a stop band according to the required specifications of the multilayer device 200A.

[0083] The signal line 220 may include a plurality of meander line portions 221, 222, and 223 having a meander shape, and the plurality of meander line portions 221, 222, and 223 may be provided in one-to-one correspondence with the plurality of planar electrodes 241, 242, and 243.

[0084] In this way, the meander line portions 221, 222, and 223 are provided in one-to-one correspondence with the planar electrodes 241, 242, and 243, so that the meander line portions 221-223 and the planar electrodes 241-243 can generate a capacitive component C40 according to the meander shape. For example, by changing the value of the capacitive component C40 according to the meander shape, the frequency of the stop band of the multilayer device 200A can be changed. This makes it possible to form a stop band according to the required specifications of the multilayer device 200A.

[0085] The meander line portions 221 and 223 may be provided at the ends of the signal line 220 and connected to the signal terminals 261 and 262 .

[0086] In this manner, by providing meander line portions 221 and 223 at the ends of signal line 220 and connecting them to signal terminals 261 and 262, the attenuation in the stop band of multilayer device 200A or 200B can be increased, thereby enabling the stop band to be formed in accordance with the required specifications of multilayer device 200A or 200B.

[0087] Alternatively, the signal line 220 may be configured by two parallel lines provided in the dielectric body 210.

[0088] This allows the multilayer device 200D to be used as a common mode filter.

[0089] The two parallel lines may also be differential lines through which differential signals are transmitted.

[0090] This makes it possible to provide a multilayer device 200D that functions as a common mode filter.

[0091] The multilayer device 200A according to this embodiment includes a signal line 220 that transmits a signal, a ground electrode 230 that is set to ground potential, a plurality of planar electrodes 240 that are parallel to the ground electrode 230 and arranged along a first direction d1 from the input side to the output side of the signal line 220, a dielectric 210 provided between the signal line 220, the plurality of planar electrodes 240, and the ground electrode 230, and a plurality of connection electrodes 250 that are located between the plurality of planar electrodes 240 and the ground electrode 230 and connect the plurality of planar electrodes 240 and the ground electrode 230. At least a portion of the signal line 220 may have a meander shape.

[0092] By providing the signal line 220 with a meander shape in this manner, a capacitive component C40 corresponding to the meander shape can be generated between the signal line 220 and the planar electrode 240. For example, increasing the area defined by the meander shape can increase the opposing area between the signal line 220 and the planar electrode 240, and decreasing the area defined by the meander shape can decrease the opposing area between the signal line 220 and the planar electrode 240. Changing the opposing area can change the value of the capacitive component C40, thereby changing the frequency of the stopband of the multilayer device 200A. This makes it possible to form a stopband according to the required specifications of the multilayer device 200A.

[0093] The signal line 220 may also include a meander line portion (for example, 221) having a meander shape, and the meander line portion may be provided at a position facing the planar electrode (for example, 241).

[0094] In this way, by providing the meander line portion (e.g., 221) at a position facing the planar electrode (e.g., 241), the meander line portion 221 and the planar electrode 241 can generate a capacitive component C40 according to the meander shape. For example, by changing the value of the capacitive component C40 according to the meander shape, the frequency of the stop band of the multilayer device 200A can be changed. This makes it possible to form a stop band according to the required specifications of the multilayer device 200A.

[0095] (Other embodiments, etc.) Although the multilayer devices and the like according to the embodiments and modifications of the present disclosure have been described above, the present disclosure is not limited to the above-described embodiments and modifications. As long as they do not deviate from the gist of the present disclosure, various modifications conceivable by those skilled in the art to the embodiments and modifications, as well as other forms constructed by combining some of the components of the embodiments and modifications, are also included within the scope of the present disclosure.

[0096] In the first embodiment, an example has been shown in which the three planar electrodes 241-243, the three connection electrodes 251-253, and the three meander line portions 221-223 are arranged along the first direction d1, but this is not limiting. The number of pairs of one planar electrode, one connection electrode, and one meander line portion may be two, four, or more. That is, the multilayer device may have a configuration in which four or more planar electrodes, four or more connection electrodes, and four or more meander line portions are arranged along the first direction d1.

[0097] In the first modification of the first embodiment, an example has been described in which the meander line portion 221, the wide line portion 222p, and the meander line portion 223 are arranged along the first direction d1, but this is not limiting. For example, as long as the meander line portion 221 located at one end of the signal line 220 is connected to the signal terminal 261 and the meander line portion 223 located at the other end is connected to the signal terminal 262, multiple wide line portions may be provided between the meander line portions 221 and 223. Furthermore, one or more wide line portions and one or more other meander line portions may be provided between the meander line portions 221 and 223. In these cases, it is sufficient that planar electrodes are provided corresponding to each of the meander line portions and wide line portions.

[0098] In the second modification of the first embodiment, an example was shown in which the wide line portion 221p, the meander line portion 222, and the wide line portion 223p were arranged along the first direction d1, but this is not limiting. For example, as long as the wide line portion 221p located at one end of the signal line 220 is connected to the signal terminal 261 and the wide line portion 223p located at the other end is connected to the signal terminal 262, multiple meander line portions may be provided between the wide line portions 221p and 223p. Furthermore, one or more other wide line portions and one or more meander line portions may be provided between the wide line portions 221p and 223p. In these cases, it is sufficient that planar electrodes are provided corresponding to each of the meander line portions and wide line portions.

[0099] In the first modification of the first embodiment, an example has been shown in which the wide line portion 222p is provided instead of the meander line portion 222, but this is not limiting. For example, a straight line portion (a line portion with a normal width) may be provided instead of the wide line portion 222p, and the meander line portions 221 and 223 may be connected via the straight line portion.

[0100] In the second modification of the first embodiment, an example has been shown in which the wide line portions 221p and 223p are provided instead of the meander line portions 221 and 223, but this is not limiting. For example, two straight line portions (line portions with normal width) may be provided instead of the wide line portions 221p and 223p, and the signal terminal 261 and the meander line portion 222 may be connected via the first line portion, and the meander line portion 222 and the signal terminal 262 may be connected via the second line portion.

[0101] In the first embodiment, the planar electrodes 241, 242, and 243 have the same shape and size, but the present invention is not limited to this and the size of each of the planar electrodes 241, 242, and 243 may be changed depending on the required specifications. For example, by changing the capacitive component C40 generated by the opposing area between the signal line 220 and the planar electrode 240, the stopband frequency can be broadened.

[0102] In the first embodiment, an example has been described in which the gaps between the planar electrodes 241, 242, 243 and the signal line 220 are the same, but this is not limiting, and the gaps between the planar electrodes 241, 242, 243 and the signal line 220 may be changed depending on required specifications. For example, by changing the gap between the planar electrode 241 and the meander line portion 221, the gap between the planar electrode 242 and the meander line portion 222, and the gap between the planar electrode 243 and the meander line portion 223 to change the capacitive component C40, the frequency of the stopband can be broadened.

[0103] In the first embodiment, an example has been shown in which the connection electrodes 251, 252, and 253 have the same shape and size, but this is not limiting, and the size of each of the connection electrodes 251, 252, and 253 may be changed depending on required specifications. For example, by changing the diameter or length of the connection electrodes 251, 252, and 253 to change the inductive component L50, the frequency of the stopband can be broadened. [Industrial Applicability]

[0104] The multilayer device according to the present disclosure is useful as a multilayer device for use in various electronic devices and communication systems. [Explanation of symbols]

[0105] 1, 200A, 200B, 200C, 200D multilayer devices 210 Dielectric 211, 212, 213, 214 Side 216 bottom 217 Top 220, 220a, 220b signal line 221, 222, 223 Meander Track Section 221p, 222p, 223p Wide track section 226, 227, 228, 229 Connecting track section 230 Ground electrode 231 Notch 240, 241, 242, 243 Planar electrode 250, 251, 252, 253 Connection electrodes 260, 261, 262, 263, 264 signal terminals 270, 271, 272, 273, 274 Ground terminals d1 1st direction d2 2nd direction d3 Third direction

Claims

1. a dielectric; a signal line provided inside the dielectric so that a portion of the signal line is exposed on an outer surface of the dielectric; a ground electrode provided inside or on an outer surface of the dielectric so that at least a portion of the ground electrode is exposed on the outer surface of the dielectric; a plurality of planar electrodes provided inside the dielectric, parallel to the ground electrode, and arranged along a first direction from the input side toward the output side of the signal line; a plurality of connection electrodes provided inside the dielectric body and connecting the plurality of planar electrodes and the ground electrode; a plurality of signal terminals provided on an outer surface of the dielectric body and connected to the signal line; a plurality of ground terminals provided on an outer surface of the dielectric body and connected to the ground electrode; Equipped with The signal line has at least a portion having a meander shape. Multilayer devices.

2. the signal line includes a meander line portion having the meander shape, The meander line portion is provided at a position facing the planar electrode. The multilayer device of claim 1 .

3. the signal line includes a plurality of meander line portions having the meander shape, The plurality of meander line portions are provided in one-to-one correspondence with the plurality of planar electrodes. The multilayer device of claim 1 .

4. The meander line portion is provided at an end of the signal line and is connected to the signal terminal. The multilayer device of claim 2 .

5. The signal line is composed of two parallel lines provided on the dielectric. The multilayer device according to any one of claims 1 to 4.

6. The two parallel lines are differential lines through which differential signals are transmitted. The multilayer device of claim 5 .

7. a signal line for transmitting a signal; a ground electrode set to a ground potential; a plurality of planar electrodes arranged parallel to the ground electrode and along a first direction from the input side toward the output side of the signal line; a dielectric provided between the signal line, the plurality of planar electrodes, and the ground electrode; a plurality of connection electrodes located between the plurality of planar electrodes and the ground electrode, the connection electrodes connecting the plurality of planar electrodes and the ground electrode; Equipped with The signal line has at least a portion having a meander shape. Multilayer devices.

8. the signal line includes a meander line portion having the meander shape, The meander line portion is provided at a position facing the planar electrode. The multilayer device of claim 7.

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