Method for producing polyimide powder and polyimide powder produced thereby

Abstract

The present invention provides a method for producing a polyimide powder having excellent intrinsic viscosity by controlling a polymerization reaction using a mixed solvent containing a polar organic solvent and a high-boiling aromatic hydrocarbon solvent to promote imidization, and a polyimide powder produced thereby.

Description

[Technical Field]

[0001] The present invention relates to a method for producing a polyimide powder and a polyimide powder produced thereby, and more particularly to a method for producing a polyimide powder using a mixed solvent containing a polar organic solvent and an aromatic hydrocarbon solvent with a high boiling point, and a polyimide powder produced thereby. [Background technology]

[0002] Highly heat-resistant polymeric materials such as polyimides are essential for miniaturizing, lightening, improving performance, and increasing reliability of products with the development of cutting-edge technologies. They are used in a wide range of industrial fields, including aerospace, aviation, electrical / electronics, automobiles, and precision instruments, in the form of films, molded products, fibers, paints, adhesives, and composites. Polyimides possess excellent mechanical strength, chemical resistance, weather resistance, and heat resistance due to the chemical stability of the imide ring. Furthermore, polyimides are easy to synthesize, can be produced as thin films, and do not require crosslinking groups for curing. Their excellent electrical properties have made them a popular high-performance polymeric material in fields ranging from microelectronics to optics. In recent years, there has been a growing emphasis on reducing the weight and size of products in the display field. However, the glass substrates currently in use have drawbacks, such as being heavy, easily broken, and difficult to process continuously. Therefore, polyimide substrates, which have the advantages of being lightweight, flexible, and suitable for continuous processing, have been produced as an alternative to glass substrates. These polyimide substrates can be used to form insulating films and protective coatings for semiconductor devices, surface protection materials and base resins for flexible circuit boards and integrated circuits, and even interlayer insulating films and protective films for fine circuits. In particular, when used as a coating material, protective materials in which molded articles such as polyimide films are bonded with adhesives, liquid polyimide resin solutions, etc., can be used.

[0003] The general method for synthesizing polyimide involves first synthesizing a precursor, polyamic acid, through the reaction of an acid dianhydride with a diamine, followed by imidization of the polyamic acid. The polyamic acid is synthesized by ring-opening and polyaddition of a diamine and an acid dianhydride dissolved in a solvent. Polar organic solvents are typically used as reaction solvents. The synthesized polyamic acid is imidized by dehydration and ring-closing using a chemical or thermal method to produce polyimide. The chemical imidization method is a method in which a chemical dehydrating agent, typically an acid anhydride such as acetic anhydride, and an imidization catalyst, typically a tertiary amine such as pyridine, are added to a polyamic acid solution, which is a precursor. In this case, when a dehydrating agent or a catalyst is further added to proceed with the imidization reaction, there are problems in that the productivity and process efficiency are low due to the cost of the catalyst and the need for an additional step of removing the catalyst. The thermal imidization method involves applying a polyamic acid solution, which is a precursor, to a substrate, evaporating the solvent, and then heating the substrate at 250 to 350°C without using a chemical dehydrating agent or catalyst to thermally imidize the polyamic acid. However, this method has the disadvantages of a high degree of crystallinity and, when an amide-based solvent is used, an amide exchange reaction occurs, causing the polymer to decompose. If the degree of imidization of the polyimide powder produced by this method is low, water, a by-product of the imidization reaction, is generated during processing, which can cause pore formation, resulting in reduced mechanical properties and a decrease in physical properties. Therefore, there is a need for research and development of a method for producing polyimide powder that can promote imidization in a simple and efficient process without adding a separate dehydrating agent or catalyst, and that can produce polyimide powder with excellent intrinsic viscosity and molded articles with excellent tensile strength and elongation. Summary of the Invention [Problem to be solved by the invention]

[0004] The present invention provides a method for producing a polyimide powder having excellent intrinsic viscosity by promoting imidization by carrying out a reaction using a mixed solvent containing a polar organic solvent and a high-boiling aromatic hydrocarbon solvent without adding a separate dehydrating agent or catalyst, and the polyimide powder produced thereby. The present invention also provides a method for producing a molded article containing the polyimide powder. The present invention also provides a molded article containing the polyimide powder. [Means for solving the problem]

[0005] Hereinafter, the embodiments of the present invention will be described in more detail in the order of "method for producing polyimide powder," "polyimide powder," "method for producing molded article containing polyimide powder," and "molded article containing polyimide powder."

[0006] Although the present invention can be modified in various ways and can have various embodiments, specific embodiments are illustrated in the drawings and described in detail, but it should be understood that this does not limit the present invention to the specific embodiments, and includes all modifications, equivalents, and alternatives within the spirit and technical scope of the present invention.

[0007] The terms used in this specification are merely used to describe specific embodiments and are not intended to limit the present invention. The singular expressions include the plural expressions unless the context clearly dictates otherwise. In the present specification, the terms "comprise" or "have" are intended to specify the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and should be understood not to preclude the presence or additional possibility of one or more other features, numbers, steps, operations, components, parts, or combinations thereof. Whenever an amount, concentration, or other value or parameter is given herein as a range, a preferred range, or a list of upper and lower preferred values, that should be understood to specifically disclose all ranges formed by any pair of any upper range limit or preferred value and any lower range limit or preferred value, regardless of whether ranges are otherwise disclosed. Where a range of numerical values ​​is recited herein, unless otherwise stated, it is intended that the endpoints of the range, and the scope of the invention within that range, are not limited to the specific values ​​recited in defining the range.

[0008] As used herein, "dianhydride" is intended to include precursors or derivatives thereof, but may also be referred to as "dianhydrides," "dianhydride acids," or "dianhydride acids," which may not technically be dianhydrides but may nevertheless react with diamines to form polyamic acids, which may then be converted back to polyimides. "Diamine" as used herein is intended to include precursors or derivatives thereof, which may not technically be diamines, but which nevertheless react with dianhydrides to form polyamic acids, which may then be converted back to polyimides.

[0009] Unless otherwise specified, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention belongs. Terms similar to those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning they have in the context of the relevant art, and should not be interpreted as ideal or overly formal unless clearly defined in this specification. Specific details for realizing the above invention are described below.

[0010] The present invention provides a method for producing a polyimide powder using a mixed solvent containing a polar organic solvent and a high-boiling aromatic hydrocarbon solvent having a boiling point of 155°C or higher. In one aspect, the method for producing a polyimide powder according to the present invention comprises the steps of: (a) preparing a polyamic acid composition by mixing an acid dianhydride compound and a diamine compound in a mixed solvent; and (b) subjecting the mixture to an imidization reaction at a high temperature to form a polyimide powder; The mixed solvent contains a polar organic solvent and a high-boiling aromatic hydrocarbon solvent having a boiling point of 155° C. or higher.

[0011] The boiling point of the polar organic solvent in the present invention may be 150°C or higher, preferably 160°C or higher, more preferably 170°C or higher, and even more preferably 200°C or higher. The upper limit is not particularly limited, but may be 250°C or lower. The polar organic solvent in the present invention may be N,N-dimethylformamide (DMF), N,N-dimethylacetamide (DMAC), N-methyl-2-pyrrolidone (NMP), dimethyl sulfoxide (DMSO), ethylene glycol, N-ethyl-2-pyrrolidone (NEP), dimethylolpropionic acid (DMPA), or a combination thereof, and preferably N-methyl-2-pyrrolidone (NMP). In the present invention, the high-boiling aromatic hydrocarbons may have a boiling point of 160° C. or higher, preferably 160° C. to 250° C. The lower limit of the boiling point may be, for example, 160° C. or higher, 161° C. or higher, 162° C. or higher, 163° C. or higher, 164° C. or higher, or 165° C. The upper limit of the boiling point of the high-boiling aromatic hydrocarbons may be, for example, 250° C. or lower, 245° C. or lower, 240° C. or lower, 235° C. or lower, 230° C. or lower, 225° C. or lower, 220° C. or lower, 215° C. or lower, 210° C. or lower, 205° C. or lower, 200° C. or lower, 198° C. or lower, 196° C. or lower, 194° C. or lower, 192° C. or lower, 190° C. or lower, 188° C. or lower, 186° C. or lower, 184° C. or lower, 182° C. or lower, or 180° C. or lower.

[0012] In the present invention, the high-boiling aromatic hydrocarbon may be mesitylene, 1,2,4-trimethylbenzene, 1,2,3-trimethylbenzene, propylbenzene, 1-ethyl-2-methylbenzene, etc., and preferably 1,2,4-trimethylbenzene, 1,2,3-trimethylbenzene, propylbenzene, 1-ethyl-2-methylbenzene, or a combination thereof. In the present invention, the mixed solvent may further include a hydrocarbon-based solvent. The hydrocarbon-based solvent may be hexane, cyclohexane, heptane, benzene, toluene, isopropylene, xylene, or a combination thereof, and preferably includes isopropylene or xylene. However, the scope of the hydrocarbon-based solvent in the present invention is not limited thereto.

[0013] In the present invention, the mixed solvent may contain 5 to 50 parts by weight of the high-boiling aromatic hydrocarbon solvent, specifically 10 to 45 parts by weight, more specifically 15 to 40 parts by weight, and even more specifically 20 to 35 parts by weight, based on 100 parts by weight of the mixed solvent, and the remainder may be the polar organic solvent or the hydrocarbon solvent. In the present invention, the mixed solvent may contain 50 to 95 parts by weight, preferably 55 to 90 parts by weight, more preferably 60 to 85 parts by weight, and even more preferably 65 to 80 parts by weight of a polar organic solvent based on 100 parts by weight of the mixed solvent, with the remainder being the aromatic hydrocarbon solvent or the hydrocarbon-based solvent. The mixed solvent in the present invention may contain 50 to 95 parts by weight of a polar organic solvent, 5 to 50 parts by weight of a high-boiling aromatic hydrocarbon solvent, and may further contain 1 to 5 parts by weight of a hydrocarbon solvent.

[0014] In the present invention, the polyimide powder may be a wholly aromatic polyimide, a partially alicyclic polyimide, or a wholly alicyclic polyimide. In one embodiment of the present invention, the acid dianhydride compound is pyromellitic dianhydride (PMDA), oxydiphthalic dianhydride (ODPA), 3,3',4,4'-biphenyltetracarboxylic dianhydride (sBPDA), 2,3,3',4'-biphenyltetracarboxylic dianhydride (a-BPDA), diphenylsulfone-3,4,3',4'-tetracarboxylic dianhydride (DSDA), bis(3,4-dicarboxyphenyl)sulfide dianhydride , 2,2-bis(3,4-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropane dianhydride, 2,3,3',4'-benzophenonetetracarboxylic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA), bis(3,4-dicarboxyphenyl)methane dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, p-phenylenebis(trimellitic acid monoester) hydrate), p-biphenylenebis(trimellitic acid monoester acid anhydride), m-terphenyl-3,4,3',4'-tetracarboxylic acid dianhydride, p-terphenyl-3,4,3',4'-tetracarboxylic acid dianhydride, 1,3-bis(3,4-dicarboxyphenoxy)benzene dianhydride, 1,4-bis(3,4-dicarboxyphenoxy)benzene dianhydride, 1,4-bis(3,4-dicarboxyphenoxy)biphenyl dianhydride, 2,2-bis( ... Examples of suitable dianhydrides include bis[(3,4-dicarboxyphenoxy)phenyl]propane dianhydride (BPADA), 2,3,6,7-naphthalenetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, and 4,4'-(2,2-hexafluoroisopropylidene)diphthalic dianhydride, and preferably pyromellitic dianhydride (PMDA), oxydiphthalic dianhydride (ODPA), or a combination thereof. The dianhydride compounds of the present invention are not limited to these examples, and a wide variety of dianhydrides used in the production of polyimides can be used.

[0015] The diamine compound may be paraphenylenediamine, metaphenylenediamine, 3,3'-dimethylbenzidine, 2,2'-dimethylbenzidine, 2,4-diaminotoluene, 2,6-diaminotoluene, 3,5-diaminobenzoic acid (DABA), 4,4'-diaminodiphenyl ether, 4,4'-oxydianiline (ODA), 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenylmethane (methylenediamine), 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 2 ,2'-Bis(trifluoromethyl)-4,4'-diaminobiphenyl, 3,3'-dimethyl-4,4'-diaminodiphenylmethane, 3,3'-dicarboxy-4,4'-diaminodiphenylmethane, 3,3',5,5'-tetramethyl-4,4'-diaminodiphenylmethane, bis(4-aminophenyl)sulfide, 4,4'-diaminobenzanilide, 3,3'-dimethoxybenzidine, 2,2'-dimethoxybenzidine, 3,3'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether , 3,3'-diaminodiphenyl sulfide, 3,4'-diaminodiphenyl sulfide, 4,4'-diaminodiphenyl sulfide, 3,3'-diaminodiphenyl sulfone, 3,4'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminobenzophenone, 4,4'-diaminobenzophenone, 3,3'-diamino-4,4'-dichlorobenzophenone, 3,3'-diamino-4,4'-dimethoxybenzophenone, 3,3'-diaminodiphenylmethane, 3,4'-diaminodiphenylmethane, 4,4'- Diaminodiphenylmethane, 2,2-bis(3-aminophenyl)propane, 2,2-bis(4-aminophenyl)propane, 2,2-bis(3-aminophenyl)-1,1,1,3,3,3-hexafluoropropane, 2,2-bis(4-aminophenyl)-1,1,1,3,3,3-hexafluoropropane, 3,3'-diaminodiphenyl sulfoxide, 3,4'-diaminodiphenyl sulfoxide, 4,4'-diaminodiphenyl sulfoxide, 1,3-bis(3-aminophenyl)benzene, 1,3-bis(4-aminophenyl)benzene, 1,4-bis(3-aminophenyl)benzene, 1,4-bis(4-aminophenyl)benzene, 1,3-bis(4-aminophenoxy)benzene (TPE-R), 1,4-bis(3-aminophenoxy)benzene (TPE-Q), 1,3-bis(3-aminophenoxy)-4-trifluoromethylbenzene, 3,3'-diamino-4-(4-phenyl)phenoxybenzophenone, 3,3'-diamino-4,4'-di(4-phenylphenoxy)benzophenone, 1,3-bis(3-aminophenylsulfide)benzene, 1,3-bis(4-aminophenylsulfide)benzene, 1,4-bis(4 -aminophenylsulfide)benzene, 1,3-bis(3-aminophenylsulfone)benzene, 1,3-bis(4-aminophenylsulfone)benzene, 1,4-bis(4-aminophenylsulfone)benzene, 1,3-bis[2-(4-aminophenyl)isopropyl]benzene, 1,4-bis[2-(3-aminophenyl)isopropyl]benzene, 1,4-bis[2-(4-aminophenyl)isopropyl]benzene, 3,3'-bis(3-aminophenoxy)biphenyl, 3,3'-bis(4-aminophenoxy)biphenyl, 4,4'-bis(3-aminophenoxy)biphenyl, 4,4'-bis(4-aminophenoxy)biphenyl, bis[3-(3-aminophenoxy)phenyl]ether, bis[3-(4-aminophenoxy)phenyl]ether, bis[4-(3-aminophenoxy)phenyl]ether, bis[4-(4-aminophenoxy)phenyl]ether, bis[3-(3-aminophenoxy)phenyl]ketone, bis[3-(4-aminophenoxy)phenyl]ketone, bis[4-(3-aminophenoxy)phenyl]ketone, bis[4-(4-aminophenoxy)phenyl]ketone phenyl] ketone, bis[3-(3-aminophenoxy)phenyl] sulfide, bis[3-(4-aminophenoxy)phenyl] sulfide, bis[4-(3-aminophenoxy)phenyl] sulfide, bis[4-(4-aminophenoxy)phenyl] sulfide, bis[3-(3-aminophenoxy)phenyl] sulfone, bis[3-(4-aminophenoxy)phenyl] sulfone, bis[4-(3-aminophenoxy)phenyl] sulfone, bis[4-(4-aminophenoxy)phenyl] sulfone, Bis[3-(3-aminophenoxy)phenyl]methane, bis[3-(4-aminophenoxy)phenyl]methane, bis[4-(3-aminophenoxy)phenyl]methane, bis[4-(4-aminophenoxy)phenyl]methane, 2,2-bis[3-(3-aminophenoxy)phenyl]propane, 2,2-bis[3-(4-aminophenoxy)phenyl]propane, 2,2-bis[4-(3-aminophenoxy)phenyl]propane, 2,2-bis[4-(4-aminophenoxy)phenyl]propane (BAPP), 2,2-bis[3-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, 2,2-bis[3-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, 2,2-bis[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, etc., are preferred.The diamine compound in the present invention is not limited to these examples, and a wide variety of diamine compounds used in the production of polyimides can be used.

[0016] In one embodiment, polyimide powder can be produced using pyromellitic dianhydride (PMDA) and oxydiphthalic dianhydride (ODPA) as the dianhydride compounds and 4,4'-oxydianiline (ODA) as the diamine compound. In one embodiment, the polyamic acid composition may contain two or more acid dianhydride compounds, including pyromellitic dianhydride (PMDA). Specifically, the pyromellitic dianhydride (PMDA) may account for 70 mol% or more of the total acid dianhydride components. The lower limit of this percentage may be, for example, 75 mol%, 78 mol%, 80 mol%, 82 mol%, 85 mol%, 87 mol%, 90 mol%, 92 mol%, 94 mol%, 95 mol%, 97 mol%, 99 mol%, or 100 mol% or more, and the upper limit may be, for example, 100 mol%, 99 mol%, 98 mol%, 97 mol%, 96 mol%, 95 mol%, 94 mol%, 93 mol%, 92 mol%, 91 mol%, or 90 mol% or less. In one embodiment, the polyamic acid composition may include two or more acid dianhydride compounds, including oxydiphthalic dianhydride (ODPA). Specifically, the oxydiphthalic dianhydride (ODPA) may be included in an amount of 30 mol% or less of the total acid dianhydride components. Preferably, the amount may be 20 mol% or less, 19 mol% or less, 18 mol% or less, 17 mol% or less, 16 mol% or less, 15 mol% or less, 14 mol% or less, 13 mol% or less, 12 mol% or less, 11 mol% or less, 10 mol% or less, 8 mol% or less, 6 mol% or less, 4 mol% or less, or 2 mol% or less, or even 0 mol%. In one embodiment, the polyamic acid composition may include one or more diamine compounds, preferably 4,4'-oxydianiline (ODA). Specifically, the 4,4'-oxydianiline (ODA) may be included in a proportion of 70 mol% or more of the total diamine monomer components. The lower limit of the ratio may be, for example, 70 mol% or more, 71 mol% or more, 72 mol% or more, 73 mol% or more, 74 mol% or more, 75 mol% or more, 76 mol% or more, 77 mol% or more, 78 mol% or more, 80 mol% or more, 82 mol% or more, 85 mol% or more, 87 mol% or more, 90 mol% or more, 92 mol% or more, 94 mol% or more, 95 mol% or more, 97 mol% or more, 99 mol% or more, or 100 mol%, and the upper limit may be, for example, 100 mol% or less, 99 mol% or less, 98 mol% or less, 97 mol% or less, 96 mol% or less, 95 mol% or less, 94 mol% or less, 93 mol% or less, 92 mol% or less, 91 mol% or less, or 90 mol% or less. In the present invention, in step (a), the molar ratio of the diamine compound to the acid dianhydride compound may be 0.5 to 2 equivalents. Specifically, the molar ratio may be 0.8 to 1.5 equivalents. If the molar ratio is less than 0.5 equivalents or more than 2 equivalents, the molecular weight of the polyimide finally formed will be too small, resulting in poor physical and chemical properties of the polyimide.

[0017] In step (a), the mixture may contain a polyamic acid formed by a polymerization reaction of an acid dianhydride compound and a diamine compound. Step (a) can be carried out in various ways, for example, by dispersing each compound in a solvent (or a mixed solvent) and then adding the resulting dispersion to a reaction vessel, or by preferentially adding the solvent (or mixed solvent) to a reaction vessel and then adding each compound, or by preferentially adding each compound to a reaction vessel and then adding the solvent (or mixed solvent), or by a combination of these methods. In the present invention, the mixed solvent may be used in an amount of 5 to 50 times, 7 to 40 times, or 10 to 30 times the weight of the acid dianhydride compound as the reactant, and the amount of the mixed solvent may be appropriately adjusted depending on the amounts of the acid dianhydride compound and the diamine compound used in the reaction.

[0018] Step (a) may be carried out at a temperature ranging from 10 to 95°C. If the temperature is lower than 10°C, the reaction may not proceed. If the temperature exceeds 95°C, a separate heat source supply device or a cooling condenser may be required, or an additional process may be required. Step (a) may be carried out for 5 minutes to 5 days, more specifically, for 1 hour to 2 days. If step (a) is carried out for less than 5 minutes, the reaction may not proceed sufficiently, whereas if it is carried out for more than 5 days, the cost of the process may increase excessively.

[0019] In the present invention, step (b) may be performed at a high temperature in the range of 150° C. to 450° C. Specifically, step (b) may be performed at a temperature in the range of 180° C. to 350° C. If step (b) is performed at a temperature below 150° C., imidization may not proceed, whereas if step (b) is performed at a temperature above 450° C., thermal decomposition of the monomer (or compound) or the polymer itself may occur. In the present invention, step (b) may be performed for 5 minutes to 5 days, specifically 10 minutes to 2 days, more specifically 30 minutes to 1 day, and even more specifically 1 hour to 5 hours. If step (b) is performed for less than 5 minutes, imidization may not occur, and if it is performed for more than 5 days, hydrolysis or thermal decomposition of the polymer may occur. In step (b), the heating may be performed by one or a combination of two or more methods selected from the group consisting of heat treatment, hot air treatment, corona treatment, high frequency treatment, ultraviolet treatment, infrared treatment, and laser treatment. In the step (b), the solid content of the polyimide powder is 1 to 25 wt %, specifically 1 to 20 wt %, more specifically 2 to 18 wt %, and even more specifically 3 to 15 wt %.

[0020] The method for producing a polyimide powder according to the present invention may further include (c) washing and filtering the polyimide powder, and then drying the polyimide powder. The filtration may be performed by one or a combination of two or more methods selected from the group consisting of gravity filtration, reduced pressure filtration, vacuum filtration, pressure filtration, compression filtration, centrifugal filtration, microfiltration, ultrafiltration, and reverse osmosis. In particular, reduced pressure filtration is preferably used. The drying may be carried out by one or a combination of two or more methods selected from the group consisting of natural drying, pressure drying, hot air drying, spray drying, film drying, vacuum drying, freeze drying, spray freeze drying, electromagnetic wave drying, and flash drying. In particular, drying at 50°C or higher under vacuum is preferred. In the present invention, the imidization reaction carried out in the step (b) has an imidization rate of 97 to 100%, preferably 98 to 100%, more preferably 99 to 100%, and most preferably 100%.

[0021] The method for producing polyimide powder according to the present invention involves carrying out an imidization reaction in a mixed solvent containing a polar organic solvent and a high-boiling aromatic hydrocarbon solvent having a boiling point of 155°C or higher. The high-boiling aromatic hydrocarbon solvent also functions as a dehydrating agent, facilitating the imidization of polyamic acid without the need for a separate catalyst or dehydrating agent. Furthermore, since the powder is precipitated by imidization at a temperature of approximately 150°C to 160°C, sufficient imidization is achieved, allowing excellent physical properties, such as improved intrinsic viscosity, to be maintained.

[0022] In another aspect, the present invention provides a polyimide powder produced by the method for producing a polyimide powder. The polyimide powder has a high intrinsic viscosity of 1.0 dL / g or more, which allows for easy post-processing such as molding while maintaining excellent mechanical properties. In one embodiment, the intrinsic viscosity of the polyimide powder of the present invention may be 1.0 to 1.5 dL / g, specifically 1.0 to 1.3 dL / g, more preferably 1.0 to 1.2 dL / g, and even more preferably 1.1 to 1.15 dL / g. If the intrinsic viscosity of the polyimide powder is less than 1.0 dL / g, the strength of the molded article (or molded body) formed from the polyimide powder may be weakened, making post-processing difficult.

[0023] In another aspect of the present invention, a method for producing a polyimide powder is provided, comprising: (1) molding a polyimide powder produced by the method for producing a polyimide powder according to the present invention; and (2) a step of sintering the polyimide. In the molding step of step (1), methods such as compression molding, injection molding, blow molding, rotational molding, extrusion molding, thermoforming, slush molding, and spinning can be applied.

[0024] In another aspect of the present invention, there is provided a polyimide molded article produced by the method for producing a polyimide molded article. In the present invention, the polyimide molded article may have a tensile strength of 85 MPa or more, preferably 90 MPa or more, more preferably 95 MPa or more, even more preferably 100 MPa or more, and still more preferably 110 MPa or more. There is no upper limit, but the upper limit may be 200 MPa or less. The polyimide molded article may have an elongation percentage of 7% or more, preferably 8% or more, more preferably 9% or more, and even more preferably 10% or more. The upper limit is not particularly limited, but may be 40% or less, 30% or less, or 20% or less. The polyimide molded article may have a modulus of 1.5 GPa or more, preferably 2.0 GPa or more, more preferably 2.5 GPa or more, and even more preferably 3.0 GPa or more. The polyimide molded article may have a flexural strength of 150 MPa or more, preferably 155 MPa or more, more preferably 160 MPa or more, and even more preferably 170 MPa or more. There is no upper limit, but the flexural strength may be 300 MPa or less.

[0025] In the present invention, the molded article may be referred to as a molding, and the manufactured molded article may be applied in various forms such as a film, adhesive, tape, fiber, multilayer film, etc. to a wide range of industrial fields such as aerospace, aviation, electrical / electronics, semiconductors, displays, liquid crystal alignment films, automobiles, precision instruments, packaging, medical materials, separators, fuel cells, and secondary batteries. The molded article manufactured from the polyimide powder of the present invention may be widely used in any product or field suitable for its physical properties and characteristics. Furthermore, molded articles containing polyimide powder produced by the method for producing polyimide powder according to the present invention have the advantage that tensile strength, elongation, modulus, and flexural strength are all improved simultaneously, and can be applied to various fields where such physical properties are required. [Effects of the Invention]

[0026] The method for producing a polyimide powder according to the present invention promotes imidization by reacting in a mixed solvent containing a polar organic solvent and a high-boiling aromatic hydrocarbon solvent without adding a separate dehydrating agent or catalyst. This allows the production of a polyimide powder having a high intrinsic viscosity and a high imidization rate through a simple and efficient process. Molded articles produced from the polyimide powder exhibit excellent tensile strength, elongation, modulus, and flexural strength. DETAILED DESCRIPTION OF THE INVENTION

[0027] Examples are presented to aid in understanding the present invention. The following examples are provided merely to facilitate understanding of the present invention, and are not intended to limit the scope of the present invention.

[0028] <Example> Example 1. Preparation of polyimide powder using a high-boiling aromatic hydrocarbon solvent Example 1-1. Preparation of polyimide powder (1) A polyamic acid composition was prepared by dispersing the dianhydride compounds pyromellitic dianhydride (PMDA) (80 mol%) and oxydiphthalic dianhydride (ODPA) (20 mol%) and the diamine compound 4,4'-oxydianiline (100 mol%) in a 70:30 (v / v%) mixed solvent of the polar solvent N-methylpyrrolidone and the high-boiling aromatic hydrocarbon solvent 1,2,3-trimethylbenzene (bp. 176°C). The mixture was transferred to a 500 mL reaction vessel equipped with a stirrer, a nitrogen injector, and a temperature controller. The air in the reaction vessel was then replaced with nitrogen gas, and the mixture was stirred in a high-temperature reactor at 180°C for 6 hours to form a polyimide powder. The polyimide powder suspension was washed with distilled water and filtered under reduced pressure, and the resulting undried polyimide powder was dried in a vacuum oven at 60° C. for 24 hours to obtain polyimide powder.

[0029] Example 1-2. Preparation of polyimide powder (2) The acid dianhydride compounds pyromellitic dianhydride (80 mol%) and oxydiphthalic dianhydride (ODPA) (20 mol%) and the diamine compound 4,4'-oxydianiline (100 mol%) were dispersed in a 70:30 (v / v%) mixed solvent of the polar solvent N-methylpyrrolidone and the high-boiling aromatic hydrocarbon solvent 1,2,4-trimethylbenzene (bp. 169°C) to prepare a mixture. The mixture was transferred to a 500 mL reaction vessel equipped with a stirrer, a nitrogen injector, and a temperature controller. The air in the reaction vessel was then replaced with nitrogen gas, and the mixture was stirred in a high-temperature reactor at 180°C for 6 hours to form a polyimide powder. The polyimide powder suspension was filtered under reduced pressure while being washed with distilled water, and the resulting undried polyimide powder was dried in a vacuum oven at 60° C. for 24 hours to obtain polyimide powder.

[0030] Example 2. Production of molded products from polyimide powder Examples 2-1 and 2-2. Production of polyimide molded products The polyimide powders produced in Examples 1-1 and 1-2 were weighed into molds for evaluating physical properties, and heated to 450° C. while applying a pressure of 10,000 psi or more using a hot press to produce molded articles.

[0031] Comparative Example 1. Production of polyimide powder using a low-boiling aromatic hydrocarbon solvent Comparative Example 1-1. Production of polyimide powder A polyimide powder was produced in the same manner as in Example 1, except that xylene (bp. 139°C), a low boiling point aromatic hydrocarbon solvent, was used instead of the high boiling point aromatic hydrocarbon solvent.

[0032] Comparative Example 1-2. Production of polyimide powder A polyimide powder was produced in the same manner as in Example 1, except that toluene (bp. 111° C.), a low boiling point aromatic hydrocarbon solvent, was used instead of the high boiling point aromatic hydrocarbon solvent.

[0033] Comparative Example 1-3. Production of polyimide powder A polyimide powder was produced in the same manner as in Example 1, except that the high-boiling aromatic hydrocarbon was omitted.

[0034] Comparative Example 2: Production of molded products using polyimide powder with a low-boiling aromatic hydrocarbon solvent Comparative Examples 2-1 to 2-3. Production of polyimide molded products The polyimide powders produced in Comparative Examples 1-1 to 1-3 were weighed into molds for evaluating physical properties, and heated to 450°C while applying a pressure of 10,000 Psi or more using a hot press, to produce polyimide molded products of Comparative Examples 2-1, 2-2, and 2-3, respectively.

[0035] The components and contents of the acid dianhydride compounds and diamine compounds used in producing the polyimide powders in Examples 1-1, 1-2, Comparative Examples 1-1, 1-2, and 1-3, as well as the components of the mixed solvents, are summarized in Table 1 below.

[0036] [Table 1]

[0037] <Experimental Example> Analysis of physicochemical properties of polyimide powder and molded products Experimental Example 1. Imidation rate The imidization rate was measured by pelletizing the polyimide powder and then measuring it using a Nicolet iZ20 FT IR (ATR) spectrometer manufactured by Thermo Scientific. -1 / 1490cm -1 The values ​​were calculated by comparing the imidization rate with a polyimide film in which imidization has progressed 100% as the standard.

[0038] Experimental Example 2: Intrinsic Viscosity 0.1 g of the polyimide powder prepared in the examples and comparative examples was dissolved in 20 ml of N,N'-dimethylacetamide, and the viscosities were measured using an Ubbelohde viscometer in a thermostatic bath maintained at 30°C.

[0039] The imidization rate and intrinsic viscosity of the polyimide powder analyzed in Experimental Examples 1 and 2 are shown in Table 2 below.

[0040] [Table 2]

[0041] Experimental Example 3: Tensile strength The tensile strength of the samples was measured using a universal testing machine (model name Instron 5564, Instron) according to the method set forth in ASTM D1708.

[0042] Experimental Example 4: Elongation The polyimide molded articles produced in the examples and comparative examples were cut into pieces with a width of 10 mm and a length of 40 mm, and then the elongation was measured using an Instron 5564 UTM device manufactured by Instron Corporation according to the ASTM D-882 method.

[0043] Experimental Example 5. Flexural strength The flexural strength was measured using the UTM according to ASTM D790 method.

[0044] The physical properties of the polyimide molded articles analyzed in Experimental Examples 3 to 5 are shown in Table 3 below.

[0045] [Table 3]

[0046] Experimental Example 6. Modulus (elastic coefficient) The modulus of the polyimide molded articles (width 15 mm) produced in the examples and comparative examples was measured according to the ASTM D-882 method using an Instron 5564 model (Grip Speed ​​= 200 mm / min). The moduli of the polyimide molded articles analyzed in Experimental Example 6 are shown in Table 4 below.

[0047] [Table 4]

[0048] In the examples of the present invention, in which the imidization reaction was carried out using a high-boiling aromatic hydrocarbon solvent with a boiling point of 155°C or higher, a high imidization rate of 100% was achieved and an excellent intrinsic viscosity of 1.0 dL / g or higher was observed. Furthermore, molded articles produced using the polyimide powder according to the present invention had tensile strengths of 110 MPa or higher, elongations of 10% or higher, and flexural strengths of 170 MPa or higher, which were significantly superior to those of the comparative examples. Furthermore, molded articles produced using the polyimide powder according to the present invention were shown to have excellent rigidity, with a modulus of 1.5 GPa or higher. Comparative Examples 1-1 and 1-2, in which the imidization reaction was carried out using an aromatic hydrocarbon solvent with a low boiling point of less than 155°C, and Comparative Example 1-3, in which no aromatic hydrocarbon solvent was used, showed lower imidization rates than those of the Examples. The molded articles of the polyimide powder produced in the Comparative Examples had significantly lower tensile strength, elongation, and flexural strength than those of the Examples, making them unsuitable for application to actual products.

[0049] The specification omits detailed descriptions of content that can be fully recognized and inferred by a person having ordinary skill in the art of the present invention, and various modifications are possible within the scope of the technical idea and essential components of the present invention other than the specific examples described in the specification. Therefore, the present invention may be implemented in ways different from those specifically explained and exemplified in the specification, and this is something that can be understood by a person having ordinary skill in the art of the present invention.

Claims

1. (a) dispersing an acid dianhydride compound and a diamine compound in a mixed solvent to prepare a polyamic acid composition; and (b) subjecting the mixture to an imidization reaction at a high temperature to form a polyimide powder; Including, The mixed solvent contains a polar organic solvent and a high-boiling aromatic hydrocarbon solvent having a boiling point of 155°C or higher, the high-boiling aromatic hydrocarbon solvent comprises 1,2,4-trimethylbenzene, 1,2,3-trimethylbenzene, or both; The polyimide powder has an intrinsic viscosity of 1.0 to 1.5 dL / g.

2. 2. The method for producing a polyimide powder according to claim 1, wherein the polar organic solvent has a boiling point of 150°C or higher.

3. 2. The method for producing a polyimide powder according to claim 1, wherein the polar organic solvent comprises at least one selected from the group consisting of N,N-dimethylformamide (DMF), N,N-dimethylacetamide (DMAC), N-methyl-2-pyrrolidone (NMP), dimethyl sulfoxide (DMSO), ethylene glycol, N-ethyl-2-pyrrolidone (NEP), and dimethylolpropionic acid (DMPA).

4. 2. The method for producing a polyimide powder according to claim 1, wherein the high-boiling aromatic hydrocarbon solvent further comprises at least one solvent selected from the group consisting of mesitylene, 1,2,4-trimethylbenzene, 1,2,3-trimethylbenzene, propylbenzene, and 1-ethyl-2-methylbenzene.

5. 2. The method for producing a polyimide powder according to claim 1, wherein the high-boiling aromatic hydrocarbon includes a high-boiling aromatic hydrocarbon solvent having a boiling point of 160°C or higher.

6. The method for producing a polyimide powder according to claim 1 , wherein the mixed solvent further contains a hydrocarbon solvent.

7. 7. The method for producing a polyimide powder according to claim 6, wherein the hydrocarbon solvent comprises at least one selected from the group consisting of hexane, cyclohexane, heptane, benzene, toluene, isopropylene, and xylene.

8. 2. The method for producing a polyimide powder according to claim 1, wherein the mixed solvent comprises 50 to 95 parts by weight of a polar organic solvent and 5 to 50 parts by weight of a high-boiling aromatic hydrocarbon solvent, based on 100 parts by weight of the mixed solvent.

9. 2. The method for producing a polyimide powder according to claim 1, wherein the polyimide powder is any one selected from the group consisting of wholly aromatic polyimides, partially alicyclic polyimides, and wholly alicyclic polyimides.

10. Examples of the acid dianhydride compound include pyromellitic dianhydride (PMDA), oxydiphthalic dianhydride (ODPA), 3,3',4,4'-biphenyltetracarboxylic dianhydride (sBPDA), 2,3,3',4'-biphenyltetracarboxylic dianhydride (a-BPDA), diphenylsulfone-3,4,3',4'-tetracarboxylic dianhydride (DSDA), bis(3,4-dicarboxyphenyl)sulfide dianhydride, 2,2-bis(3,4-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropane dianhydride, 2,3,3',4'-benzophenonetetracarboxylic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA), bis(3,4-dicarboxyphenyl)methane dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, p-phenylene and one or more selected from the group consisting of benzene bis(trimellitic acid monoester acid anhydride), p-biphenylene bis(trimellitic acid monoester acid anhydride), m-terphenyl-3,4,3',4'-tetracarboxylic dianhydride, p-terphenyl-3,4,3',4'-tetracarboxylic dianhydride, 1,3-bis(3,4-dicarboxyphenoxy)benzene dianhydride, 1,4-bis(3,4-dicarboxyphenoxy)benzene dianhydride, 1,4-bis(3,4-dicarboxyphenoxy)biphenyl dianhydride, 2,2-bis[(3,4-dicarboxyphenoxy)phenyl]propane dianhydride (BPADA), 2,3,6,7-naphthalenetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, and 4,4'-(2,2-hexafluoroisopropylidene)diphthalic dianhydride, The diamine compounds include paraphenylenediamine, metaphenylenediamine, 3,3'-dimethylbenzidine, 2,2'-dimethylbenzidine, 2,4-diaminotoluene, 2,6-diaminotoluene, 3,5-diaminobenzoic acid (DABA), 4,4'-oxydianiline (ODA), 4,4'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenylmethane (methylenediamine), 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 2,2 '-bis(trifluoromethyl)-4,4'-diaminobiphenyl, 3,3'-dimethyl-4,4'-diaminodiphenylmethane, 3,3'-dicarboxy-4,4'-diaminodiphenylmethane, 3,3',5,5'-tetramethyl-4,4'-diaminodiphenylmethane, bis(4-aminophenyl)sulfide, 4,4'-diaminobenzanilide, 3,3'-dimethoxybenzidine, 2,2'-dimethoxybenzidine, 3,3'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether, 3,3'-Diaminodiphenyl sulfide, 3,4'-diaminodiphenyl sulfide, 4,4'-diaminodiphenyl sulfide, 3,3'-diaminodiphenyl sulfone, 3,4'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminobenzophenone, 4,4'-diaminobenzophenone, 3,3'-diamino-4,4'-dichlorobenzophenone, 3,3'-diamino-4,4'-dimethoxybenzophenone, 3,3'-diaminodiphenylmethane, 3,4'-diaminodiphenylmethane, 4,4'-di Aminodiphenylmethane, 2,2-bis(3-aminophenyl)propane, 2,2-bis(4-aminophenyl)propane, 2,2-bis(3-aminophenyl)-1,1,1,3,3,3-hexafluoropropane, 2,2-bis(4-aminophenyl)-1,1,1,3,3,3-hexafluoropropane, 3,3'-diaminodiphenyl sulfoxide, 3,4'-diaminodiphenyl sulfoxide, 4,4'-diaminodiphenyl sulfoxide, 1,3-bis(3-aminophenyl)benzene, 1,3-bis(4-aminophenyl)benzene, 1,4-bis(3-aminophenyl)benzene, 1,4-bis(4-aminophenyl)benzene, 1,3-bis(4-aminophenoxy)benzene (TPE-R), 1,4-bis(3-aminophenoxy)benzene (TPE-Q), 1,3-bis(3-aminophenoxy)-4-trifluoromethylbenzene, 3,3'-diamino-4-(4-phenyl)phenoxybenzophenone, 3,3'-diamino-4,4'-di(4-phenylphenoxy)benzophenone, 1,3-bis(3-aminophenylsulfide)benzene, 1,3-bis(4-aminophenylsulfide)benzene, 1,4-bis(4 -aminophenylsulfide)benzene, 1,3-bis(3-aminophenylsulfone)benzene, 1,3-bis(4-aminophenylsulfone)benzene, 1,4-bis(4-aminophenylsulfone)benzene, 1,3-bis[2-(4-aminophenyl)isopropyl]benzene, 1,4-bis[2-(3-aminophenyl)isopropyl]benzene, 1,4-bis[2-(4-aminophenyl)isopropyl]benzene, 3,3'-bis(3-aminophenoxy)biphenyl, 3,3'-bis(4-aminophenoxy)biphenyl, 4,4'-bis(3-aminophenoxy)biphenyl, 4,4'-bis(4-aminophenoxy)biphenyl, bis[3-(3-aminophenoxy)phenyl]ether, bis[3-(4-aminophenoxy)phenyl]ether, bis[4-(3-aminophenoxy)phenyl]ether, bis[4-(4-aminophenoxy)phenyl]ether, bis[3-(3-aminophenoxy)phenyl]ketone, bis[3-(4-aminophenoxy)phenyl]ketone, bis[4-(3-aminophenoxy)phenyl]ketone, bis[4-(4-aminophenoxy)phenyl]ketone , bis[3-(3-aminophenoxy)phenyl]sulfide, bis[3-(4-aminophenoxy)phenyl]sulfide, bis[4-(3-aminophenoxy)phenyl]sulfide, bis[4-(4-aminophenoxy)phenyl]sulfide, bis[3-(3-aminophenoxy)phenyl]sulfone, bis[3-(4-aminophenoxy)phenyl]sulfone, bis[4-(3-aminophenoxy)phenyl]sulfone, bis[4-(4-aminophenoxy)phenyl]sulfone, bis[3-(3-aminophenoxy 2,2-bis[3-(4-aminophenoxy)phenyl]methane, bis[3-(4-aminophenoxy)phenyl]methane, bis[4-(3-aminophenoxy)phenyl]methane, bis[4-(4-aminophenoxy)phenyl]methane, 2,2-bis[3-(3-aminophenoxy)phenyl]propane, 2,2-bis[3-(4-aminophenoxy)phenyl]propane, 2,2-bis[4-(3-aminophenoxy)phenyl]propane, 2,2-bis[4-(4-aminophenoxy)phenyl]propane (BAPP), 2,2-bis[3-(3-aminophenoxy)phenyl]methane, bis[4-(4-aminophenoxy)phenyl]methane, bis[4-(4-aminophenoxy)phenyl]methane, 2,2-bis[3-(3-aminophenoxy)phenyl]propane The method for producing a polyimide decomposition product according to claim 1, wherein the hydroxyl group is one or more selected from the group consisting of 2,2-bis[3-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, and 2,2-bis[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane.

11. 2. The method for producing a polyimide powder according to claim 1, further comprising: (c) washing and filtering the polyimide powder, and then drying the polyimide powder.

12. 2. The method for producing a polyimide powder according to claim 1, wherein the imidization reaction results in an imidization rate of 97 to 100%.

13. A polyimide powder produced by the method for producing a polyimide powder according to any one of claims 1 to 12.

14. (1) A step of molding a polyimide powder produced by the method for producing a polyimide powder according to any one of claims 1 to 12; and (2) sintering, A method for manufacturing polyimide molded products.

15. A polyimide molded article produced by the method for producing a polyimide molded article according to claim 14.

16. The polyimide molded article is The tensile strength is 85 MPa or more, The elongation rate is 7% or more, The modulus is 1.5 GPa or more, 16. The polyimide molded article according to claim 15, having a flexural strength of 150 MPa or more.

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