Device for detecting material deposits in a fluid flow conduit - Patent application

Abstract

A sensor for detecting material deposits in a fluid flow conduit includes a body and an array of pairs of temperature sensors disposed within the body, each pair of temperature sensors spaced apart along a primary flow direction of the fluid flow conduit.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority to and the benefit of U.S. Provisional Application No. 63 / 080,233, filed September 18, 2020, the disclosure of which is incorporated herein by reference. [Technical Field]

[0002] SUMMARY The present disclosure relates to a device for detecting materials deposited within a fluid flow conduit. [Background technology]

[0003] The statements in this section merely provide relevant background information and may not constitute prior art.

[0004] Semiconductor processing systems typically include a process chamber and multiple fluid flow conduits through which process gases are supplied and removed from the process chamber. Over time, deposits can accumulate within the fluid flow conduits. Excessive buildup of deposits can impede fluid flow and cause blockages and / or system problems. To monitor deposits within the fluid flow conduits, one or more scopes or cameras can be inserted into the fluid flow conduits. However, the geometry of the fluid flow conduits and / or the geometry of the deposits can prevent the one or more scopes / cameras from accurately detecting the deposit buildup.

[0005] These problems associated with monitoring deposit buildup within fluid flow conduits are addressed by the present disclosure. Summary of the Invention

[0006] This section provides a general overview of the disclosure and is not an exhaustive disclosure of its entire scope or all of its features.

[0007] The present disclosure provides a sensor for detecting material deposits in a fluid flow conduit, the sensor including a body and an array of pairs of temperature sensors disposed within the body, wherein each pair of temperature sensors is spaced apart along a primary flow direction of the fluid flow conduit.

[0008] In some embodiments, the sensor further includes a heater secured to an exterior portion of the body.

[0009] In some embodiments, the sensor further includes a temperature sensor operably engaged with the heater.

[0010] In some embodiments, the sensor further includes an insulating member disposed over the heater.

[0011] In some embodiments, the heater defines a geometry that matches the geometry of the exterior surface portion of the body.

[0012] In some embodiments, the body defines an interior portion having a geometric profile that matches the exterior geometry of the conduit.

[0013] In some embodiments, the body is a material selected from the group consisting of aluminum nitride (AlN) and boron nitride.

[0014] In some embodiments, the temperature sensor is selected from the group consisting of a thermocouple, an RTD, a thermistor, and an integrated circuit temperature transducer.

[0015] In some embodiments, the body defines a plurality of interior surface apertures, and each temperature sensor of the plurality of pairs of temperature sensors is disposed within one of the plurality of interior surface apertures.

[0016] In some forms, at least a portion of the plurality of interior surface apertures are disposed on an interior surface portion of the body.

[0017] In some configurations, the interior surface apertures extend longitudinally along the primary flow direction.

[0018] In some configurations, the interior surface apertures extend transversely, perpendicular to the primary flow direction.

[0019] In some embodiments, at least some of the plurality of temperature sensors are spring loaded within the interior surface aperture.

[0020] In some embodiments, the sensor further includes a heat sink secured to an exterior surface portion of the body.

[0021] In some embodiments, the body further includes an attachment device adapted to secure the body to the conduit.

[0022] In some forms, the mounting device is one of a bracket assembly and a band clamp assembly.

[0023] The present disclosure provides a method for detecting material deposits in a fluid flow conduit, the method including detecting temperature from an array of pairs of temperature sensors positioned proximate to the fluid flow conduit, monitoring a temperature difference between the array of pairs of temperature sensors over time, and determining the presence of material deposits based on the temperature difference.

[0024] In some embodiments, the method further includes actively applying heat proximate to the array of pairs of temperature sensors.

[0025] The present disclosure provides a method for detecting a material deposit in a fluid flow conduit. The method includes detecting a first temperature at a first location along the fluid flow conduit and detecting a second temperature at a second location along the fluid flow conduit, the second location being spaced apart from the first location. The method includes monitoring a temperature difference between the first temperature and the second temperature over time and determining the presence of the material deposit based on the temperature difference.

[0026] In some embodiments, the first temperature is sensed by a first two-wire heater and the second temperature is sensed by a second two-wire heater.

[0027] In some embodiments, the first temperature is detected with a first temperature sensor and the second temperature is detected with a second temperature sensor.

[0028] In some embodiments, the method further includes applying heat proximate to the first and second locations.

[0029] In some embodiments, the method further includes measuring additional temperatures along the conduit, monitoring a temperature difference between the additional temperatures, and determining the presence of a material deposit based on the additional temperature difference.

[0030] A system for detecting material deposits in a fluid flow conduit includes a sensor for detecting material deposits in the fluid flow conduit. The sensor includes a body and an array of multiple pairs of temperature sensors disposed within the body, where each pair of temperature sensors is spaced along a primary flow direction of the fluid flow conduit. The system includes means for attaching the sensor to the fluid flow conduit. The system is configured to determine temperatures from the array of multiple pairs of temperature sensors, monitor differences in thermal responses of the array of multiple pairs of temperature sensors over time, and determine the presence of material deposits based on the differences in thermal responses. The system includes clog indicating means.

[0031] In some embodiments, the method further includes a heater disposed proximate to the sensor and a controller in communication with the heater, wherein the controller activates the heater to generate supplemental heating for active detection of material deposits.

[0032] In some forms, the computing device is configured to provide pulsed power to an array of pairs of temperature sensors, thereby generating heat for active detection of deposits.

[0033] Further areas of applicability will become apparent from the description provided herein. It should be understood that the description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.

[0034] In order that the present disclosure may be fully understood, various forms thereof will now be described, given by way of example only, with reference to the accompanying drawings, in which: [Brief explanation of the drawings]

[0035] [Figure 1A] FIG. 1A is a schematic diagram of a fluid flow conducting system according to the present disclosure.

[0036] [Figure 1B] FIG. 1B is a cross-sectional view of a fluid flow conducting conduit according to the present disclosure.

[0037] [Figure 2A] FIG. 2A is a front view of a passive fluid flow conduction sensor assembly according to the present disclosure.

[0038] [Figure 2B] FIG. 2B is a side view of a passive fluid flow conduction sensor assembly according to the present disclosure.

[0039] [Figure 2C] FIG. 2C is a cross-sectional view of the passive fluid flow conduction sensor assembly of FIG. 2A according to the present disclosure.

[0040] [Figure 3A] FIG. 3A is a front view of an active fluid flow conduction sensor assembly according to the present disclosure.

[0041] [Figure 3B] FIG. 3B is a side view of the active fluid flow conduction sensor assembly of FIG. 3A according to the present disclosure.

[0042] [Figure 4A] FIG. 4A is a front view of another embodiment of a passive fluid flow conduction sensor assembly according to the present disclosure.

[0043] [Figure 4B] FIG. 4B is a cross-sectional view of the passive fluid flow conduction sensor assembly of FIG. 4A according to the present disclosure.

[0044] [Figure 5] FIG. 5 is a perspective view of a passive fluid flow conduction sensor assembly mounted around a conduit of a fluid flow conduction system according to the present disclosure.

[0045] [Figure 6] FIG. 6 is a perspective view of an active fluid flow conduction sensor assembly mounted around a conduit of a fluid flow conduction system according to the present disclosure.

[0046] [Figure 7A] FIG. 7A is a side view of another embodiment of an active fluid flow conduction sensor assembly mounted around a conduit of a fluid flow conduction system according to the disclosure.

[0047] [Figure 7B] FIG. 7B is a perspective view of a band clamp assembly according to the present disclosure.

[0048] [Figure 7C] FIG. 7C is a perspective view of another band clamp assembly according to the present disclosure.

[0049] [Figure 7D]FIG. 7D is a cross-sectional view of an active fluid flow conduction sensor assembly mounted around a conduit of a fluid flow conduction system according to the disclosure.

[0050] [Figure 8A] FIG. 8A is a perspective view of another embodiment of an active fluid flow conduction sensor assembly according to the present disclosure.

[0051] [Figure 8B] 8B is a front view of the active fluid flow conducting sensor assembly of FIG. 8A with the lower housing of the sensor assembly removed for clarity, in accordance with the present disclosure.

[0052] [Figure 8C] 8C is a rear view of the active fluid flow conducting sensor assembly of FIG. 8A with the lower housing of the sensor assembly removed for clarity, in accordance with the present disclosure.

[0053] [Figure 8D] FIG. 8D is a cross-sectional view of the active fluid flow conduction sensor assembly of FIG. 8A according to the present disclosure.

[0054] [Figure 9] FIG. 9 is a flowchart of a method according to the present disclosure for determining whether a conduit in a fluid flow system is clogged.

[0055] [Figure 10] FIG. 10 is a flowchart of another method according to the present disclosure for determining whether a conduit in a fluid flow system is clogged.

[0056] [Figure 11] FIG. 11 is a perspective view of an alternative band clamp assembly for attaching a sensor assembly to a conduit.

[0057] [Figure 12] FIG. 12 is an exploded view of the band clamp assembly of FIG.

[0058] [Figure 12a] 12a is a perspective view of the mounting member of the band clamp assembly of FIG.

[0059] [Figure 12b] 12b is a perspective view of one locking member of the band clamp assembly of FIG.

[0060] [Figure 13] 13 is a perspective view of the band clamp assembly of FIG. 11. FIG.

[0061] [Figure 14] FIG. 14 is a front view of the band clamp assembly of FIG.

[0062] The drawings described herein are for illustrative purposes only and are not intended to limit the scope of the present disclosure in any way. DETAILED DESCRIPTION OF THE INVENTION

[0063] The following description is merely exemplary in nature and is in no way intended to limit the present disclosure, application, or uses. It should be understood that throughout the drawings, corresponding reference numerals indicate like or corresponding parts and features.

[0064] The present disclosure relates to a sensor assembly, which may be either an active sensor assembly or a passive sensor assembly, configured to determine the amount and / or location of material deposits in one or more conduits of a fluid flow system based on sensor data acquired by the sensor assembly. By using the sensor assembly described herein to determine the amount and / or location of material deposits in one or more conduits, a fluid flow system can accurately monitor material deposits and determine whether one or more of its conduits have become clogged.

[0065] Referring to FIG. 1A, a thermal system 10 is shown. In one embodiment, the thermal system 10 includes a semiconductor processing system 100, which includes a heater 102, a processing chamber 104, fluid flow supply lines (FFSLs) 106, fluid flow exhaust lines (FFELs) 108, pump(s) 109, and a fluid flow sensor assembly 200. The thermal system also includes a controller 300. It should be understood that the thermal system 10 is not limited to the semiconductor processing system 100 described herein, but may be implemented in various other industrial and manufacturing processes / systems, such as mechanical processes, injection molding processes, flue gas systems, heating, ventilation, and air conditioning systems (HVAC systems), among others. As an example and in one variation, the thermal system 10 is used in a reduction system of the semiconductor processing system 100 to heat a liquid flow through a network of conduits (e.g., the FFSLs 106 and FFELs 108).

[0066] In some embodiments, the heater 102 is a pedestal heater configured to heat the wafer, however, it should be understood that the heater 102 is not limited to the examples provided herein and includes structures / configurations such as layered heaters, cartridge heaters, tubular heaters, polymer heaters, flexible heaters, and other heaters having at least one resistive heating element / trace, among others.

[0067] In one embodiment, the heater 102 is operable to generate heat and acts as a sensor to measure an operating characteristic of the heater 102. For example, the heater 102 includes one or more resistive heating elements that act as a sensor to measure the average temperature of the resistive heating element based on the resistance of the resistive heating element. More particularly, such two-wire heaters are disclosed in commonly owned U.S. Patent No. 7,196,295, the contents of which are incorporated herein by reference in their entirety. In a two-wire heater system, the thermal system 10 is an adaptive thermal system that combines heater design and control incorporating power, resistance, voltage, and current into a customizable feedback control system to limit one or more of these parameters (i.e., power, resistance, voltage, and current) while controlling another. In one embodiment, the controller 300 is configured to monitor at least one of the current, voltage, and power supplied to the resistive heating element to determine the resistance and therefore the temperature of the resistive heating element.

[0068] In one variation, the thermal system 10 includes multiple flexible heaters that encase the fluids within the FFSLs 106 and FFELs 108 to heat them. In yet another example, the thermal system 10 employs cartridge heaters to directly heat the fluids (e.g., gases and / or liquids) flowing through the FFSLs 106 and FFELs 108 or provided within the vessels.

[0069] In some embodiments, pump(s) 109 are positioned adjacent to the FFELs 108. The pump(s) 109 may be any component of a vacuum pumping system (RGA), such as a residual gas analyzer. Processing fluids are supplied into the processing chambers 104 through the FFELs 106 during various processing steps. After each processing step, the processing fluids are removed from the processing chambers 104 through the FFELs 108. Each of the FFELs 108 includes a bypass valve having two channels. The FFELs 108 are set to an open or choked state by activating the bypass valve to fluidly couple the FFELs 108 with one of the open and blocked channels. As used herein, the term fluid refers to a substance that flows through the thermal system 10 and is at least one of a gaseous state, a liquid state, and / or a plasma state.

[0070] 1B, a partial cross-sectional view of a conduit 110 (i.e., at least one of the FFSLs 106 and FFELs 108) having a cavity 112 therein is shown. Over time, material deposits 114 may form within the conduit 110. While material deposits 114 are illustrated having non-uniform shapes along the conduit 110, it should be understood that the material deposits 114 may have a variety of geometries in other forms. As described in more detail below, one or more fluid flow sensor assemblies are configured to detect the presence and extent of these material deposits 114.

[0071] 1A-1B, the fluid flow sensor assembly 220 generates data indicative of the amount of material deposit 114 within the conduit 110. In one form, the fluid flow sensor assembly 220 is disposed on the exterior surface 110A, or in another form, is disposed at least partially within the cavity 112. The fluid flow sensor assembly 220 may be implemented as a passive sensor assembly or an active sensor assembly, as described in more detail below.

[0072] Controller 300 includes a heater control module 302, a sensor data module 304, a buildup detection module 306, and an alarm module 308. To perform the functions described herein, controller 300 is implemented by a microcontroller that includes one or more processor circuits configured to execute machine-readable instructions stored on a non-transitory computer-readable medium. While heater control module 302, sensor data module 304, buildup detection module 306, and alarm module 308 are illustrated as part of controller 300, it should be understood that any one of these modules may be located in a separate controller(s) communicatively coupled to controller 300.

[0073] The heater control module 302 is configured to control the thermal profile of the heater 102 and / or the heater of the fluid flow sensor assembly 200, which may vary based on different controls. For example, the controls include, but are not limited to, monitoring power supplied to the heater 102 and / or the fluid flow sensor assembly 200, the operating mode of the thermal system 10 (e.g., a manual mode for controlling power to the heater 102 based on input from a user, a cold-start mode for gradually increasing the temperature of the heater 102, a steady-state mode for maintaining the heater 102 at a temperature setpoint, or other defined operating mode for controlling the heater 102, among others), and / or the operating status of different zones of the heater 102 when the heater 102 is a multi-zone heater, among others. Furthermore, the controls include, but are not limited to, the type of wafer being heated, the gas being introduced into the process chamber 104 containing the heater 102, and / or the pressure differential within the process chamber 104 for securing the wafer to the heater 102, among others.

[0074] The fluid flow sensor assembly 220 is configured to obtain sensor data, such as heat flux data and temperature difference data, from the fluid flow sensor assembly 220. As used herein, "heat flux data" refers to heat flux data generated by the fluid flow sensor assembly 220. As used herein, "temperature difference data" refers to the temperature difference between at least two spaced apart locations of each FFSLs 106 and / or FFEL 108 as indicated by the fluid flow sensor assembly 220, or the temperature difference at the same location of each FFSLs 106 and / or FFEL 108 obtained at different times.

[0075] The buildup detection module 306 of the controller 300 is configured to determine whether the FFSLs 106 and / or FFELs 108 are at least partially blocked by the material deposits 114, as described in more detail below with reference to Figures 8-9. The alarm module 308 is configured to generate an alarm in response to determining that the FFSLs 106 and / or FFELs 108 are blocked (e.g., an amount of material deposits 114 exceeding a threshold), as described in more detail below with reference to Figures 8-9.

[0076] 2A-2C, one form of a passive fluid flow sensor assembly according to the present disclosure is illustrated and generally designated by reference numeral 200-1. Passive fluid flow sensor assembly 200-1 includes a body 202, a plurality of thermocouples 204, one or more gussets 205, a gusset aperture 206, a heat sink 207, and an optional thermal interface material 208. As shown in FIG. 2C, body 202 of passive fluid flow sensor assembly 200-1 also includes an interior surface aperture 212.

[0077] In some embodiments, at least some of the components of the passive fluid flow sensor assembly 200-1 are bonded and / or fastened to one another using various processes and / or materials, such as a soldering process, a brazing process, an adhesive (e.g., silicone elastomer, room temperature vulcanizing silicone (RTV), epoxy, among others), or any other suitable process / material. As an example, the heat sink 207 is bonded to the top surface 202A of the body 202 using an adhesive. Similarly, the thermal interface material 208 is bonded to the bottom surface 202B of the body 202 using an adhesive, or in another embodiment, the thermal interface material 208 is itself bonded to the bottom surface 202B. In another embodiment, the heat sink 207 is fastened to the body 202 using bolts, rivets, and / or other similar fastening devices. Additionally, in one embodiment, the gussets 205 are bonded to the edge surfaces 202C, 202D of the body.

[0078] The passive liquid flow sensor assembly 200-1 is communicatively and electrically coupled to the controller 300. By way of example, the passive liquid flow sensor assembly 200-1 may be communicatively coupled to the controller 300 via a hardwire link (e.g., leads (not shown) to the plurality of thermocouples 204) or a wireless link such as a Bluetooth® link (e.g., a Bluetooth Low Energy link), a Wireless Fidelity (Wi-Fi) link, a Near Field Communication (NFC) link, among others.

[0079] The body 22 includes an upper surface 202A and a lower surface 202B. In one form, the upper surface 202A of the body 202 has a geometry that matches the geometry of the heat sink 207. In the illustrated example, the upper surface 202A is planar. However, it should be understood that the upper surface 202A may have a precise or any other suitable shape that corresponds to the geometry of the heat sink 207. Similarly, the lower surface 202B of the body 202 has a geometry that matches the geometry of the conduit 110. By way of example, the lower surface 202B of the body 202 has a curved surface that matches the curved surface of the conduit 110. In one form, the body 202 is made of a thermally conductive material such as copper, nickel, silver, aluminum, lithium, platinum, titanium, and alloys thereof, among others. In another form, the body 202 is made of a ceramic material such as aluminum nitride, boron nitride, glass-based ceramics (e.g., borosilicate glass), among others, by way of example.

[0080] In one form, the thermocouples 204 are surrounded by insulating material. The thermocouples 204 and insulating material extend through the gusset apertures 206 and into respective interior surface apertures of the body 202. The thermocouples 204 extend in a direction generally perpendicular to the direction in which the passive fluid flow sensor 200-1 acquires heat flux measurements (e.g., the ±Z direction). As shown, the thermocouples 204 are arranged in an array of pairs within the body 202. As used herein, the term “array” should be interpreted to mean an ordered series or arrangement of a plurality of discrete thermocouple locations, such as two rows of thermocouples 204 with seventeen (17) thermocouples 204 in the top row and sixteen (16) thermocouples 204 in the bottom row. However, multiple rows and columns or other geometric distributions of thermocouples 204 other than those illustrated herein may be employed while remaining within the scope of the present disclosure. Furthermore, in one form, multiple thermocouples 204 are electrically coupled in a series or array such that they form a co-located thermopile, or set of thermocouples, to measure heat flux as described herein.

[0081] 2C, the thermocouples 204 are separated by a distance (D) along the primary flow direction (e.g., ±Z direction). Two thermocouples 204 separated by a distance "D" define a "pair" of thermocouples. When the internal surface apertures 212 are blind, the internal surface apertures 212 are also spaced apart by approximately the distance (D). In another form, the internal surface apertures 212 extend through the entire length of the body 202. In one form, the interior surface apertures 212 extend longitudinally along the primary flow direction (i.e., ±Z direction) as shown. However, in other forms, the interior surface apertures 212 can extend transversely (i.e., ±Y direction) or normal to the primary flow direction, or can be oriented at any angle while remaining within the scope of this disclosure. In one variation, at least one of the plurality of interior surface apertures 212 is formed such that the interior surface aperture 212 is in communication with the thermal interface material 208. As such, at least one of the plurality of thermocouples 204 more directly contacts the conduit 110 when the passive fluid flow sensor assembly 220-1 is coupled to the conduit 110, as described in more detail below.

[0082] The plurality of thermocouples 204 are configured to measure heat flux at the junctions of the thermocouples 204. More specifically, the output from the junctions is a voltage signal having a magnitude directly proportional to the heat flux. As described in more detail below, the controller 300 determines the heat flux at the junctions by referencing a lookup table in the controller 300 that correlates the measured voltage with a particular heat flux value.

[0083] The gusset 205 is configured to provide additional structural support and also act as a strain relief for the plurality of thermocouples 204. The gusset 205 is made from a material configured to electrically insulate the plurality of thermocouples 204 from the body 202. However, the gusset 205 is optional, and the passive fluid flow sensor assembly 200-1 can operate without the gusset 205.

[0084] The heat sink 207 transfers heat generated by the passive fluid flow sensor assembly 200-1 and / or the conduit 110 to the external environment. Thus, heat generated by the passive fluid flow sensor assembly 200-1 and / or the conduit 110 is dissipated from the passive fluid flow sensor assembly 200-1. The optional thermal interface material 208 is generally any thermally conductive material such as copper, nickel, silver, aluminum, lithium, platinum, titanium, silicone, and combinations thereof, among others. In some forms, a mounting element is provided such that the passive fluid flow sensor assembly 200-1 is mounted to the conduit 110 using a mounting device, as described in more detail below with reference to FIGS. 7A-7D .

[0085] 3A-3B, front and side views of another form of passive fluid flow sensor assembly constructed in accordance with the present disclosure are illustrated and generally designated by reference numeral 200-2. Passive fluid flow sensor assembly 200-2 is similar to passive fluid flow sensor assembly 200-1 described with reference to FIGS. 2A-2C, however, in this variation, passive fluid flow sensor assembly 200-2 includes a temperature sensing device 216 instead of an array of thermocouples 204, and passive fluid flow sensor assembly 200-2 includes a single internal surface aperture 218 instead of multiple internal surface apertures 212 for mounting temperature sensing device 216. Temperature sensing device 216 is disposed within aperture 218 in body 202, and temperature sensing device 216 is disposed proximate and / or adjacent to conduit 110 or thermal interface material 208 (if this optional material is employed). In one form, the temperature sensing device 216 extends along the length of the body 202 and in a direction perpendicular to the direction in which the passive fluid flow sensor assembly 200-2 obtains temperature measurements. The temperature sensing device 216 is implemented by any device configured to obtain temperature measurements, such as a resistance temperature detector, a thermistor, a resistor, an integrated circuit temperature transducer, or a heat flux sensor, among others.

[0086] While the above embodiments illustrate the fluid flow sensor assembly 200 as a passive fluid flow sensor assembly 200-1, 200-2 (i.e., a fluid flow sensor assembly that does not include an integrated heater therein), in another embodiment, the fluid flow sensor assembly 200 is implemented as an active sensor assembly that has an integrated heater therein or cooperates with a sensing means. Thus, an "active" fluid flow sensor assembly is one in which heat is actively added to sense temperature differences in different volumes of the material deposit 114.

[0087] 4A-4B , one form of an active fluid flow sensor assembly according to the present disclosure is illustrated and designated by reference numeral 200-3. Active fluid flow sensor assembly 200-3 includes a body 202, multiple thermocouples 204, a gusset 205 with one or more optional gasket apertures 206, an optional thermal interface material 208, and an interior surface aperture 212. Additionally, active fluid flow sensor assembly 200-3 includes a heater 222, a mounting portion 224, copper wire 226 ( FIG. 4A ), and an insulating member 228. While active fluid flow sensor assembly 200-3 is illustrated as including multiple thermocouples 204, it should be understood that the multiple thermocouples 204 may be replaced or supplemented with a single / separate temperature sensing device 216, as described above, while remaining within the scope of the present disclosure.

[0088] In some forms, at least some of the components of the active fluid flow sensor assembly 200-3 are adhered or fastened to one another using various processes and / or materials, such as a soldering process, a brazing process, an adhesive (e.g., silicone elastomer, RTV silicone, epoxy, among others), or any other suitable process / material. As one example, the heater 222 is secured to the top surface 202A of the body 202 via the mounting portion 224 using bolts, rivets, and / or other similar fastening devices. As another example, the insulating member 228 is adhered to the body 202 using an adhesive.

[0089] The heater 222 is disposed on the top surface 222A of the body 202 and, as such, has a geometry that matches the geometry of the top surface 222A of the body 202. In one form, the heater 222 is a ceramic heater, but may be of any type of construction, including those described in connection with the heater 102 above. The heater 102 is thus selectively activated to radiate heat to obtain temperature and / or heat flux data, thereby enabling active sensing.

[0090] The insulating member 228 is any thermally insulating material configured to reduce heat loss from the heater 222 and direct heat radiated by the heater 222 toward the body 202 and the underlying conduit 110. By way of example, the insulating member 228 can be made of polyimide fiber, mineral fiber, foam (e.g., silicone rubber sponge), and aerogel, among others.

[0091] Referring to FIG. 5 , another form of passive fluid flow sensor assembly is illustrated and generally designated by the reference 200-4. In one form, the passive fluid flow sensor assembly 200-4 is disposed at least partially within the conduit 110, as shown. While the passive fluid flow sensor assembly 200-4 is illustrated as being disposed at least partially within the conduit 110, it should be understood that any one of the passive fluid flow sensor assemblies and / or any one of the active fluid flow sensor assemblies described herein may be disposed at least partially within the conduit 110. In one form, the passive fluid flow sensor assembly 200-4 includes a body 202, a plurality of thermocouples 204, a heat sink 207, a thermal interface material 208, a heat spreader 220, a protective sleeve 232, mounting wires / straps 234, and a mounting element 236. It should be understood that, although not shown in FIG. 5 , the passive fluid flow sensor assembly 200-4 also includes an interior surface aperture 212.

[0092] Protective sleeve 232 is made from a material configured to surround and mechanically protect, and thermally and / or electrically insulate body 202. In some forms, protective sleeve 232 can surround body 202 such that an air gap separates body 202 and insulating sleeve 232. In one variation, protective sleeve 232 is adhered to body 202 using an adhesive.

[0093] The passive fluid flow sensor assembly 200-4 is attached to the conduit 110 via an attachment wire 234 and an attachment element 236. In some embodiments, the attachment wire 234 is a steel wire or other similar type of wire that is embedded within the conduit 110 and wrapped around the attachment element 236. In some embodiments, the attachment element 236 is a pin having a collar portion 238 and an extension 240. In some embodiments, the attachment wire 234 is wrapped around the extension 240, and the attachment wire 234 is secured via the collar 238.

[0094] 6, one form of mounting device for either a passive or active fluid flow sensor assembly is a bracket assembly. While the active fluid flow sensor assembly 200-5 is illustrated as being secured to the conduit 110 via a bracket assembly 400, any one of the passive fluid flow sensor assemblies and / or any one of the active fluid flow sensor assemblies described herein may be secured to the conduit 110 via the bracket assembly 400.

[0095] The active fluid flow sensor assembly 200-5 is similar to the active fluid flow sensor assembly 200-3 described above, except that in this configuration, the active fluid flow sensor assembly 200-5 includes a slot 242 that extends along the length of the body 202 and communicates with the thermal interface material 208. Accordingly, multiple thermocouples 204 or temperature sensing devices 216 can be positioned within the slot 242 to obtain temperature data.

[0096] In one form, bracket assembly 400 includes upper and lower brackets 402A and 402B (collectively referred to as brackets 402), a fastening element 404, and a securing element 406. Each of the brackets 402 includes a fastening portion 408, an engagement aperture 409, a connecting portion 410, and an interface portion 412. In some forms, at least one of the brackets 402 includes an insulating element 414. Brackets 402 are implemented using at least one of a steel material, a composite material (e.g., carbon fiber reinforced polymer), and combinations thereof, among others.

[0097] In one form, the fastening element 404 is a bolt and the securing element 406 is a nut as shown. Thus, the nut is threadably coupled to the bolt, thereby compressively securing the bracket 402 to the active fluid flow sensor assembly 200-5 and the conduit 110. By securing the bracket 402 to the active fluid flow sensor assembly 200-5, the conduit 110 and the fluid flow sensor assembly 200-5 are thermally coupled.

[0098] The connecting portion 410 is disposed between the clamping portion 408 and the interface portion 412 and has a geometry that matches the geometry of the conduit 110. The interface portion 412 is configured to securely fasten the active fluid flow sensor assembly 200-5 and the conduit 110 to the bracket 402 when the clamping element 404 and the fixation element 406 are threadedly engaged. The insulating element 414, which includes an insulating plastic material, is configured to insulate the bracket 402B from the conduit 110.

[0099] 7A, a perspective view of active fluid flow sensor assembly 200-6 is shown secured to outer surface 110A of conduit 110 via band clamp assembly 500. Active fluid flow sensor assembly 200-6 is similar to active fluid flow sensor assemblies 200-3 and 200-5, except that active fluid flow sensor assembly 200-6 includes mounting element 258 and lower housing 260. While illustrated as fluid flow sensor assembly 220 secured to conduit 110 via band clamp assembly 500, it should be understood that any one of passive fluid flow sensor assemblies 200-1, 200-2, 200-4 and / or any one of active fluid flow sensor assemblies 200-3 and 200-5 described herein may be secured to conduit 110 via band clamp assembly 500.

[0100] 7D , the lower housing 260 includes one or more recesses 262 that accommodate the plurality of thermocouples 204. In one form, a reference thermocouple 266 is disposed within one of the plurality of interior surface apertures 212. The reference thermocouple 266 is positioned proximate and / or adjacent to the conduit 110 (e.g., proximate the underside 202B of the body 202 and / or the optional thermal interface material 208) as shown to obtain local temperature measurements at its individual locations relative to the conduit 110. These individual temperature measurements are compared to the temperature data / measurements from the array of thermocouples 204 as a reference / check on the fidelity / accuracy of the temperature data from the array of thermocouples 204. The individual temperature measurements from the reference thermocouple 266 can also be used for calibration purposes or as a backup if the array of thermocouples 204 is not functioning properly.

[0101] 7A-7D, band clamp assembly 500 includes a first flexible mounting element 502-1, a second flexible mounting element 502-2, and an interconnecting member 503 defining a partially enclosed opening through which conduit 110 extends. Each of mounting elements 502-1, 502-2 is disposed on opposite sides of conduit 110. Each of mounting elements 502-1, 502-2 includes opposing mounting ends 505 a, 505 b and a plurality of tabs 506 spaced apart from one another and extending between opposing mounting ends 505 a, 505 b. Each of mounting ends 505 a, 505 b includes an aperture 508 formed therein. When each of the mounting elements 502-1, 502-2 is positioned on opposite sides of the conduit 110, the fastening elements 510 extend through the respective apertures 508 in the mounting end 505a and at least partially through the interconnecting member 503, and the mounting elements 250 extend through each of the apertures 508 in the mounting end 505b and at least partially through the lower housing 260 of the sensor assembly 200-6. In this manner, the mounting elements 502-1, 502-2 are secured to the sensor assembly 200-6 and the interconnecting member 503, and the sensor assembly 200-6 is secured to the conduit 110.

[0102] A plurality of tabs 506, each having a width approximately equal to the width of the active fluid flow sensor assembly 200-6, are disposed on the outer surface 110A of the conduit 110. In some forms, apertures 512 (e.g., slots, perforations, among others) between the tabs 506 inhibit heat conduction to and from the active fluid flow sensor assembly 200-6. In one variation, the band clamp assembly 500 includes one or more insulating spacers disposed between the tabs 506 and the active fluid flow sensor assembly 200-6 to further inhibit heat conduction to and from the active fluid flow sensor assembly 200-6. The interconnecting member 503 has an upper surface that corresponds to the shape of the conduit 110. Biasing members 514 (e.g., compression springs) are disposed within respective grooves in the interconnecting member 503 and are configured to bias the conduit 110 toward the sensor assembly 200-6 when the sensor assembly 200-6 is secured to the conduit 110 and the band clamp assembly 500. In other words, when the conduit 110 is disposed within the partially enclosed opening defined by the first mounting element 502-1, the second mounting element 502-2, and the interconnecting member 503, the conduit 110 compresses the biasing members 514. As described above, once the sensor assembly 200-6 is secured to the band clamp assembly 500 and the conduit 110, the biasing members 514 bias the conduit 110 upward toward the sensor assembly 200-6.

[0103] 8A-8D, one embodiment of a band clamp assembly 500 and active fluid flow sensor assembly according to the present disclosure is illustrated, with the active fluid flow sensor assembly designated by reference numeral 200-7. The active fluid flow sensor assembly 200-7 includes a heater 222, a mounting portion 224, copper wire 226, an insulating member (not shown), an upper housing 520, and a clamping element 540. As illustrated in FIGS. 8B-8C, which illustrate an active fluid flow sensor assembly without a lower housing 260, the active fluid flow sensor assembly 200-7 includes a first thermocouple power lead 550-1 and a second thermocouple power lead 550-2 that collectively form a thermocouple power lead 550, and a first recess 560-1 and a second recess 560-2, both formed on opposite sides of the body 202.

[0104] The upper housing 520 and the lower housing 260 encase the body 202 and the heater 222. The upper housing 520, the lower housing 260, and the active fluid flow sensor assembly 200-7 are securely fastened together using fastening elements 540, which in this form are screws. In one form, thermocouple power leads communicatively couple the controller 300 to the plurality of thermocouples 204, thereby enabling the heat flux across the junctions 600 (shown in FIG. 8D) to be measured and corresponding heat flux values ​​to be determined.

[0105] In one embodiment, as shown in Figures 88B-8C, the thermocouples 204 are electrically connected in series. Furthermore, at least a portion of the thermocouples 204 are disposed within the recesses 560-1 and 560-2 to form an electrical series connection between the thermocouples 204 disposed on both edge surfaces 202C and 202D of the body 202. In one embodiment, the portions of the thermocouples 204 disposed within the recesses 560-1 and 560-2 are electrically insulated from the body 202 via electrically insulating material surrounding the corresponding portions of the thermocouples 204.

[0106] 9, a flowchart illustrating an example routine 900 for determining whether the thermal system 10 is clogged is shown. At 904, the controller 300 (e.g., heater control module 302) provides power to the active fluid flow sensor assembly 200-6 (i.e., one of the active fluid flow sensor assemblies 200-3, 200-5). At 908, the controller 300 (e.g., sensor data module 304) acquires temperature data from an array of pairs of sensors, such as multiple thermocouples 204 and / or temperature sensing devices 216. At 912, the controller 300 determines whether the monitored time exceeds a threshold value (e.g., a predefined time value, a dynamic time value adjusted based on various characteristics of the thermal system 10, among others). If so, the routine 900 proceeds to 916. Otherwise, the routine 900 proceeds to 908.

[0107] At 916, the controller 300 (e.g., the sensor data module 304) determines the temperature difference at corresponding locations of the conduit 110 as a function of time. At 920, the controller 300 (e.g., the buildup detection module 306) determines the amount of material buildup based on the temperature difference as a function of time. At 924, the controller 300 (e.g., the alarm module 308) determines whether the amount of material buildup is greater than a threshold material buildup value. If the amount of material buildup is greater than the threshold material buildup value, the routine 900 proceeds to 928, where the controller 300 generates an alarm indicating that the conduit 110 is clogged. The alarm can indicate that maintenance activity is needed at a particular location of the conduit 110 and / or that some type of maintenance activity is needed at a particular location of the conduit 110. The alarm can be communicated to a remote computing system, such as a display communicatively coupled to the controller 300, to notify a user of the maintenance activity, among other things. Otherwise, if the amount of material deposit is less than the threshold material deposit value at 924, the routine 900 ends.

[0108] 10 , a flowchart illustrating an example routine 900 for determining whether the thermal system 10 is clogged is shown. At 1004, the controller 300 (e.g., the sensor data module 304) acquires first temperature data from a first fluid flow sensor assembly 200 (e.g., the active fluid flow sensor assembly 200-3 including a two-wire heater) disposed at a first location along the conduit 110. At 1008, the controller 300 (e.g., the sensor data module 304) acquires second temperature data from a second fluid flow sensor assembly 200 (e.g., the active fluid flow sensor assembly 200-5 including a two-wire heater) disposed at a second location along the conduit 110, where the second location is disposed a predetermined distance longitudinally from the first location. In some embodiments, the fluid flow sensor assemblies 220 at the first and second locations include the same or different types of sensors (i.e., multiple thermocouples 204 and temperature sensing devices 216). In one variation, the routine 1000 can obtain temperature data from one or more fluid flow sensor assemblies in addition to temperature data from the first and second fluid sensor assemblies.

[0109] At 1012, the controller 300 determines whether the monitored time is greater than a threshold value (e.g., a predefined time value, a dynamic time value adjusted based on various characteristics of the thermal system 10, among others). If so, the routine 1000 proceeds to 1016. If not, the routine 1000 proceeds to 1004. At 1016, the controller 300 (e.g., the sensor data module 304) determines a temperature difference between the first and second locations based on the first temperature data and the second temperature data. At 1020, the controller 300 (e.g., the buildup detection module 306) determines an amount of material buildup based on the temperature difference between the first and second locations. At 1024, the controller 300 (e.g., the alarm module 308) determines whether the amount of material buildup is greater than a threshold material buildup value. If the amount of material buildup is greater than the threshold material buildup value, the routine 1000 proceeds to 1028, where the controller 300 generates an alarm indicating that the conduit 110 is clogged. The alarm may indicate that a maintenance action is needed at a particular location in the conduit 110 and / or that some type of maintenance action is needed at a particular location in the conduit 110. The alarm may be communicated to a remote computing system, particularly a display, communicatively coupled to the controller 300 to notify a user of the maintenance action. Otherwise, if the amount of material deposit is less than the threshold material deposit value at 1024, the routine 1000 ends.

[0110] 11-14, another band clamp assembly 1100 is illustrated. This version of the band clamp assembly 1100 may also be used to secure a sensor assembly 200-8 to a conduit 110. The sensor assembly 200-8 may be similar to or identical to the sensor assemblies 200-6 and 200-7 described above, and therefore will not be described in detail. The structure and function of the band clamp assembly 1100 is generally similar to or identical to the band clamp assembly 500 described above, except for the modifications described below.

[0111] The band clamp assembly 1100 includes a flexible mounting strap 1102, a mounting member 1104, a pair of locking members 1106, and a plurality of biasing members 1110. The flexible mounting strap 1102 includes opposing mounting ends 1103 and a plurality of bands 1112 spaced apart and extending between the opposing mounting ends 1103. The flexible mounting strap 1102 is configured to wrap around the conduit 110 such that each of the mounting ends 1103 is removably coupled to a connection 1136 of a respective locking member 1106. In one form, each of the mounting ends 1103 includes an aperture 1114 formed therein, one form of which is rectangular as shown. In another form, the aperture 1114 can be circular, oval, or any other shape suitable for securing the flexible mounting strap 1102 to the pair of locking members 1106 while remaining within the scope of the present disclosure.

[0112] 11 and 14, the mounting member 1104 is generally U-shaped and is configured to mount the sensor assembly 200-8. Referring to FIGS. 11, 12, 12a, and 13, the mounting member 1104 includes opposing side arms 1116 and a plurality of cross members 1120 extending between the upper ends of the side arms 1116. While the exemplary mounting member 1104 is illustrated as a unitized structure, in some forms, the mounting member 1104 may be a separate component connected to the side arms 1116 via fasteners or any other suitable attachment means. Each side arm 1116 includes a body 1121 and a pair of guides 1124 along which the side arms 1116 translate, as described in more detail below. The body 1121 defines a cutout 1125 and a pair of vertically oriented elongated slots 1122 formed at or near opposite ends thereof. The pair of protrusions 1127 are spaced apart and configured to hold the respective biasing members 1110 in an installed position. A pair of guides 1124 extend from each end of the body 1121 and cooperate with the body 1121 to define slots that receive and guide the respective locking members 1106 as they translate. The plurality of cross members 1120 have apertures 128 formed therein. A fastener 1130 ( FIG. 11 ), such as a bolt, screw, or the like, extends through the aperture 1128 and at least partially passes through the sensor assembly 200-8, thereby securing the mounting member 1104 and the sensor assembly 200-8 to one another.

[0113] Each locking member 1106 is generally L-shaped and is slidably received within a guide 1124 of the mounting member 1104. Each locking member 1106 is attached to a body 1121 of a respective side arm 1116 of the mounting member 1104 and is configured to be removably coupled to an attachment end 1103 of the flexible attachment strap 1102. Each locking member 1106 includes a body 1132, a pair of tabs 1134, and a connecting portion 1136. The body 1132 defines a cutout 1138 and a pair of openings 1140 formed at or near opposite ends thereof. The openings 1140 are aligned with the slots 1122 of the body 1121. In this manner, fasteners 1146 ( FIG. 11 ) extend through the openings 1140 and the slots 1122 to attach the locking member 1106 to the respective side arm 1116 of the mounting member 1104. When the locking members 1106 are attached to their respective side arms 1116 of the mounting member 1104, the elongated slots 1122 allow the locking members 1106 to slide up and down relative to the mounting member 1104. A pair of protrusions 1144 are spaced apart from one another and configured to further retain each biasing member 1110 in the installed position.

[0114] The pair of tabs 1134 are spaced apart from one another and extend inward from the top end of the body 1132 (i.e., the pair of tabs 1134 extend above the mounting member 1104). The pair of tabs 1134 are configured to contact the cross member 1120 of the mounting member 1104 to restrain further downward movement of the locking member 1106 relative to the mounting member 1104. In other words, the cross member 1120 acts as a stop for the locking member 1106 as it translates downward. The connecting portion 1136 extends from the lower end of the main body 1132 and cooperates with the main body 1132 to define a slot configured to receive each mounting end of the flexible mounting strap 1102 (i.e., the connecting portion 1136 extends through an aperture 1114 in the flexible mounting strap 1102 such that a portion of each mounting end 1103 is received in the slot). In this manner, the flexible mounting strap 1102 is secured to the locking member 1106.

[0115] Each biasing member 1110 is received within a respective cutout 1125, 1138 in each of the mounting and locking members 1104, 1106 and biases the respective locking member 1106 upward and away from the mounting member 1104. The biasing members 1110 are mounted between the protrusions 1127, 1144. In this manner, the biasing members 1110 are restrained from moving vertically or horizontally.

[0116] 11-14, the assembly of the sensor assembly 200-8 to the conduit 110 using the band assembly 1100 will be described in detail. First, the sensor assembly 200-8 is connected to the cross member 1120 of the mounting member 1104, as described above. Next, the sensor assembly 200-8 is placed on the conduit 110 so that the sensor assembly 200-8 engages the conduit 110. Next, as described above, the flexible mounting strap 1102 is wrapped around the conduit 110, and the locking member 1106 is pressed downward by the user so that the mounting end 1103 of the flexible mounting strap is secured to the locking member 1106. Once the mounting end 1103 is secured to the locking member 1106, the locking member 1106 is released so that the biasing member 1110 biases the locking member 1106 upward. In this manner, the flexible attachment strap 1102 is restrained from disengaging from the locking member 1106, thereby securing the sensor assembly 200-8 to the conduit 110. Removal of the sensor assembly 200-8 from the conduit 110 is accomplished by reversing the above steps.

[0117] In one variation of the band clamp assembly 1100, the sensor assembly 200-8 may snap into engagement with the mounting member 1104. That is, the rear end of the sensor assembly 200-8 includes a slot with an open end. The cross member 1120 closest to the rear of the mounting member 1104 may include a flexible tab that is received in the slot in the sensor assembly 200-8 until it snaps into engagement with the sensor assembly 200-8, thereby securing the sensor assembly 200-8 to the band assembly 1100. It should be understood that in such a configuration, the mounting member 1104 instead includes a single plate with a flexible tab, instead of multiple cross members 1120, with the cross member 1120 closest to the rear of the mounting member 1104 having a flexible tab.

[0118] Unless expressly indicated otherwise herein, all numerical values ​​expressing mechanical / thermal properties, composition percentages, dimensions and / or tolerances, or other characteristics should be understood as being modified by the words "about" or "approximately" when describing the scope of the invention. This variation may be desirable for a variety of reasons, including industry practices, materials, manufacturing, assembly tolerances, and testing capabilities.

[0119] Spatial and functional relationships between elements are described using various terms such as "connected," "engaged," "coupled," "adjacent," "next to," "on," "above," "below," and "disposed." Unless expressly stated as "direct," when a relationship between a first element and a second element is described in this disclosure, the relationship can be a direct relationship where there are no intervening elements between the first and second elements, or an indirect relationship where one or more intervening elements (spatial or functional) exist between the first and second elements. As used herein, the phrase "at least one of A, B, and C" should be interpreted as meaning a non-exclusive logical OR (A OR B OR C), and not as meaning "at least one A, at least one B, and at least one C."

[0120] In this application, the term "controller" may be replaced with the term "circuitry." The term "module" may refer to or include any of the following: an application-specific integrated circuit (ASIC); a digital, analog, or mixed analog / digital discrete circuit; a digital, analog, or mixed analog / digital integrated circuit; a combinational logic circuit; a field-programmable gate array (FPGA); a processor circuit (shared, dedicated, or group) that executes code; a memory circuit (shared, dedicated, or group) that stores code executed by the processor circuit; any other suitable hardware component that provides the described functionality; or a combination of any or all of the above, such as a system-on-chip.

[0121] The term code may include software, firmware, and / or microcode, and may refer to programs, routines, functions, classes, data structures, and / or objects. The term memory circuit is a subset of the term computer-readable medium. As used herein, the term computer-readable medium does not encompass transitory electrical or electromagnetic signals propagated through a medium (such as a carrier wave); thus, the term computer-readable medium may be considered tangible and non-transitory.

[0122] The description of the present disclosure is merely exemplary in nature and, thus, variations that do not depart from the content of the disclosure are intended to be within the scope of the disclosure. Such variations should not be considered a departure from the spirit and scope of the disclosure. The inventions described in the original claims of this application are set forth below. [Appendix 1] 1. A sensor for detecting material deposits in a fluid flow conduit, comprising: The main body, and an array of pairs of temperature sensors disposed within the body, each pair of temperature sensors being spaced apart along a primary flow direction of the fluid flow conduit; A sensor comprising: [Appendix 2] 10. The sensor according to claim 1, further comprising a heater secured to an outer surface portion of the body. [Appendix 3] 3. The sensor according to claim 2, further comprising a temperature sensor operably engaged with the heater. [Appendix 4] 3. The sensor according to claim 2, further comprising an insulating member disposed on the heater. [Appendix 5] 3. The sensor according to claim 2, wherein the heater defines a geometry that matches the geometry of the exterior surface portion of the body. [Appendix 6] 2. The sensor according to claim 1, wherein the body defines an inner surface portion having a geometric profile that matches an outer geometry of the conduit. [Appendix 7] 2. The sensor according to claim 1, wherein the body is a material selected from the group consisting of aluminum nitride (AlN) and boron nitride. [Appendix 8] 2. The sensor according to claim 1, wherein the temperature sensor is selected from the group consisting of a thermocouple, an RTD, a thermistor, and an integrated circuit temperature transducer. [Appendix 9] 2. The sensor according to claim 1, wherein the body defines a plurality of internal surface apertures, and each temperature sensor of the plurality of pairs of temperature sensors is disposed within one internal surface aperture of the plurality of internal surface apertures. [Appendix 10] 10. The sensor according to claim 9, wherein at least a portion of the plurality of inner surface apertures are disposed on an inner surface portion of the body. [Appendix 11] 10. The sensor according to claim 9, wherein the inner surface aperture extends longitudinally along the main flow direction. [Appendix 12] 10. The sensor according to claim 9, wherein the interior surface aperture extends in a lateral direction perpendicular to the main flow direction. [Appendix 13] 13. The sensor according to claim 12, wherein at least some of the temperature sensors are spring loaded within the interior aperture. [Appendix 14] 10. The sensor according to claim 1, further comprising a heat sink secured to an outer surface portion of the body. [Appendix 15] 10. The sensor according to claim 1, further comprising an attachment device adapted to secure the body to the conduit. [Appendix 16] 16. The sensor according to claim 15, wherein the mounting device is one of a bracket assembly and a band clamp assembly. [Appendix 17] 1. A system for detecting material deposits in a fluid flow conduit, comprising: the sensor according to claim 1, mounting means for securing said sensor to said fluid flow conduit; a computing device configured to determine a temperature from the array of pairs of temperature sensors, monitor a difference in thermal response of the array of pairs of temperature sensors over time, and determine the presence of a material deposit based on the difference in thermal response; and a jam indication means; A system comprising: [Appendix 18] a heater located proximate to the sensor; and further comprising a controller in communication with the heater; 18. The system according to claim 17, wherein the controller activates the heater to generate auxiliary heating for active detection of the material deposit. [Appendix 19] 18. The system according to claim 17, wherein the computing device is configured to provide pulsed power to the array of multiple pairs of temperature sensors, thereby generating heat for the active detection of material deposits. [Appendix 20] 1. A method for detecting material deposits in a fluid flow conduit, comprising: detecting a first temperature at a first location along the fluid flow conduit;

Claims

1. 1. A sensor for detecting material deposits in a fluid flow conduit, comprising: The main body, and an array of pairs of temperature sensors disposed within the body, each pair of temperature sensors being spaced apart along a primary flow direction of the fluid flow conduit; Equipped with The array of pairs of temperature sensors is arranged in a plurality of rows and columns, and the columns of the array of pairs of temperature sensors are stacked in a radial direction of the fluid flow conduit.

2. The sensor according to claim 1 , further comprising a heater secured to an exterior surface portion of said body.

3. The sensor according to claim 2 , further comprising an insulating member disposed on said heater.

4. The sensor according to claim 2 , wherein the heater defines a geometry that matches the geometry of the exterior surface portion of the body.

5. The sensor according to claim 1 , wherein the body defines an interior surface portion having a geometric profile that matches the exterior geometry of the conduit.

6. The sensor according to claim 1 , wherein the body is a material selected from the group consisting of aluminum nitride (AlN) and boron nitride.

7. The sensor according to claim 1 , wherein the temperature sensor is selected from the group consisting of a thermocouple, an RTD, a thermistor, and an integrated circuit temperature transducer.

8. The sensor according to claim 1 , wherein the body defines a plurality of interior surface apertures, and each temperature sensor of the plurality of pairs of temperature sensors is disposed within one of the plurality of interior surface apertures.

9. The sensor according to claim 8 , wherein at least a portion of the plurality of interior surface apertures are disposed on an interior surface portion of the body.

10. The sensor according to claim 8 , wherein the interior surface aperture extends longitudinally along the main flow direction.

11. The sensor according to claim 8 , wherein the interior surface aperture extends in a lateral direction perpendicular to the main flow direction.

12. The sensor according to claim 11 , wherein at least some of the temperature sensors are spring loaded within the interior surface aperture.

13. The sensor according to claim 1 , further comprising a heat sink secured to an exterior surface portion of said body.

14. The sensor according to claim 1 , further comprising a mounting device adapted to secure the body to the conduit.

15. The sensor according to claim 14 , wherein the mounting device is one of a bracket assembly and a band clamp assembly.

16. 1. A system for detecting material deposits in a fluid flow conduit, comprising: The sensor according to claim 1 , mounting means for securing said sensor to said fluid flow conduit; a computing device configured to determine a temperature from the array of pairs of temperature sensors, monitor a difference in thermal response of the array of pairs of temperature sensors over time, and determine the presence of a material deposit based on the difference in thermal response; and a jam indication means; A system comprising:

17. a heater located proximate to the sensor; and further comprising a controller in communication with the heater; The system according to claim 16 , wherein the controller activates the heater to generate supplemental heating for active detection of the material deposits.

18. The system according to claim 16 , wherein the computing device is configured to provide pulsed power to the array of pairs of temperature sensors, thereby generating heat for the active detection of material deposits.

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