Image sensor substrate

Abstract

To provide an image sensor substrate having a new structure, and a camera module including the same.SOLUTION: A substrate for an image sensor includes a plate portion, an insulating layer disposed on the plate portion, and a conductive pattern portion disposed on the insulating layer. The plate portion has a first plate, a second plate spaced apart from the first plate with a first open region interposed between the plates, and a connecting plate disposed in the first open region and connecting the first plate and the second plate. The connecting plate has a bent portion extended in a horizontal direction different from each other in the first open region.SELECTED DRAWING: Figure 13

Description

[Technical Field]

[0001] Detailed Description of the Invention The embodiment relates to an image sensor substrate, and more particularly to an image sensor substrate that is relatively movable around a lens barrel, and a camera module including the same. [Background technology]

[0002] Camera devices are generally installed in electronic devices such as mobile communication terminals, MP3 players, automobiles, endoscopes, and CCTVs. These camera devices are gradually being developed with a focus on high pixel counts, while also becoming smaller and thinner. In addition, modern camera devices are being transformed to offer a variety of additional functions at low manufacturing costs.

[0003] The camera device includes a lens barrel that houses a lens, a lens holder coupled to the lens barrel, an image sensor disposed within the lens holder, and a driving board on which the image sensor is mounted. The lens transmits a video signal of a subject to the image sensor, which then converts the video signal into an electrical signal.

[0004] Here, the accuracy of the video signal in the camera device is determined according to the focal length, which is defined as the distance between the lens and the image sensor.

[0005] As a result, the camera device provided focus compensation and shake correction by moving the lens barrel relative to the image sensor. That is, the camera device moved the lens barrel housing the lens relative to the image sensor along the X, Y, and Z axes. In this case, the camera device required at least six elastic members, such as springs, to move the lens barrel relative to the image sensor. Each elastic member was connected to the lens barrel by bonding or other methods.

[0006] However, the camera device according to the above-mentioned conventional technology is composed of an upper spring plate arranged on the upper part of the lens barrel, a lower spring plate arranged on the lower part of the lens barrel, and structures such as an elastic wire for fixing the Z axis, as the lens barrel moves relative to the upper part, which poses a problem of a complex modular structure of the camera device.

[0007] Furthermore, the camera device according to the prior art requires a plurality of elastic members for moving the lens barrel, which increases the number of steps required to assemble the plurality of elastic members. Summary of the Invention [Problem to be solved by the invention]

[0008] In the embodiment, it is possible to provide an image sensor substrate having a new structure and a camera module including the same.

[0009] Furthermore, in the embodiment, it is possible to provide an image sensor substrate in which the image sensor is movable relative to the lens barrel, and a camera module including the same.

[0010] Furthermore, in the embodiment, it is possible to provide an image sensor substrate that is capable of not only movement in the X-axis, Y-axis, and Z-axis but also tilt correction, and a camera module including the same.

[0011] Furthermore, in the embodiment, it is possible to provide an image sensor substrate that can simplify the spring structure for providing an autofocus function and an image stabilization function, and a camera module that includes the same.

[0012] In the provided embodiments, the technical problems to be solved are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by a person having ordinary skill in the art to which the proposed embodiments pertain from the following description. [Means for solving the problem]

[0013] The image sensor substrate according to the embodiment has an insulating layer and a conductive pattern portion arranged on the insulating layer, the insulating layer having a first insulating portion and a second insulating portion arranged around the first insulating portion and separated from the first insulating portion by a first open area, the conductive pattern portion having a first conductive pattern portion arranged on the first insulating portion, a second conductive pattern portion arranged on the second insulating portion, and an extension pattern portion arranged on the first open area and connecting the first conductive pattern portion and the second conductive pattern portion to each other, the extension pattern portion having a bent portion arranged on a corner area of ​​the first open area.

[0014] In addition, the first conductive pattern portions are respectively positioned on multiple regions of the first insulating portion, the second conductive pattern portions are respectively positioned on multiple regions of the second insulating portion facing the multiple regions, and the extension pattern portions connect between the first conductive pattern portion arranged on the first region of the first insulating portion and the second conductive pattern portion arranged on the second region of the second insulating portion, and the first region and the second region do not face each other.

[0015] The length of the extension pattern portion is greater than the linear distance between the first and second conductive pattern portions arranged in the opposing regions.

[0016] The length of the extension pattern portion is in the range of 1.5 to 20 times the linear distance between the first conductive pattern portion and the second conductive pattern portion that are arranged in the opposing regions.

[0017] The extension pattern portion includes at least one metal material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn).

[0018] The insulating layer also has an extended insulating portion disposed on the first open area, the extended insulating portion overlapping the extended pattern portion in the vertical direction.

[0019] Additionally, the width of the extended insulating portion is greater than the width of the extended pattern portion.

[0020] The device also has a bonding sheet between the insulating layer and the conductive pattern portion, and the bonding sheet has a first bonding portion between the first insulating portion and the first conductive pattern portion, a second bonding portion between the second insulating portion and the second conductive pattern portion, and an extended bonding portion between the extended insulating portion and the extended pattern portion.

[0021] In addition, the extended pattern portion is disposed in a floating state above the first open area.

[0022] The extension pattern portion has a metal layer and a plating layer on the metal layer, and the plating layer is disposed so as to surround the side and bottom surfaces of the extension pattern portion disposed on the first open region.

[0023] The spring plate is also arranged below the insulating layer and has a second open area that overlaps with the first open area, and the spring plate has a first plate portion, a second plate portion that is separated from the first plate across the second open area, and an elastic member that is arranged on the second open area and connects the first plate portion and the second plate portion.

[0024] The first open area has a first open portion and a second open portion connected to the first open portion across a corner area, the extension pattern portion has a first portion arranged on the first open portion and connected to the first conductive pattern portion, and a second portion arranged on the second open portion and connected to the second conductive pattern portion, and the bent portion connects the first portion and the second portion on the corner area.

[0025] Meanwhile, the camera module includes a housing, a lens barrel disposed in the housing, a lens assembly disposed in the lens barrel, an image sensor substrate disposed in the housing, an image sensor disposed on the image sensor substrate, a first driving unit disposed on the underside of the image sensor substrate, and a second driving unit disposed in the housing, wherein the image sensor substrate includes an insulating layer and a conductive pattern portion disposed on the insulating layer, wherein the insulating layer includes a first insulating portion and a second insulating portion disposed around the periphery of the first insulating portion and spaced apart from the first insulating portion across a first open area, and the conductive pattern portion includes a first conductive pattern portion disposed on the first insulating portion, a second conductive pattern portion disposed on the second insulating portion, and an extension pattern portion disposed on the first open area and connecting the first conductive pattern portion and the second conductive pattern portion to each other, wherein the extension pattern portion has a bent portion disposed on a corner area of ​​the first open area.

[0026] In addition, the first conductive pattern portions are respectively positioned on multiple regions of the first insulating portion, the second conductive pattern portions are respectively positioned on multiple regions of the second insulating portion facing the multiple regions, and the extension pattern portions connect between the first conductive pattern portion arranged on the first region of the first insulating portion and the second conductive pattern portion arranged on the second region of the second insulating portion, and the first region and the second region do not face each other.

[0027] Meanwhile, a camera device according to an embodiment includes a housing, a lens barrel disposed within the housing, a lens assembly disposed within the lens barrel, an image sensor substrate disposed within the housing, an image sensor disposed on the image sensor substrate, a first connector portion disposed within the housing and electrically connected to the image sensor substrate, a second connector portion disposed outside the housing and electrically connected to an external device, and a flexible circuit board having a connecting portion connecting the first connector portion and the second connector portion, wherein the image sensor substrate includes an insulating layer and a conductive pattern portion disposed on the insulating layer, and the insulating layer is disposed around the first insulating portion and extends from the first insulating portion across a first open region. and a second insulating portion spaced apart from the first insulating portion, wherein the conductive pattern portion has a first conductive pattern portion arranged on the first insulating portion, a second conductive pattern portion arranged on the second insulating portion, and an extension pattern portion arranged on the first open area and connecting the first conductive pattern portion and the second conductive pattern portion to each other, wherein the first conductive pattern portions are respectively located on multiple areas of the first insulating portion, and the second conductive pattern portions are respectively located on multiple areas of the second insulating portion facing the multiple areas, and the extension pattern portion connects between the first conductive pattern portion arranged on the first area of ​​the first insulating portion and the second conductive pattern portion on a second area of ​​the second insulating portion not facing the first area, and the extension pattern portion has a bent portion arranged on a corner area of ​​the first open area. [Effects of the Invention]

[0028] According to the embodiment, to realize the OIS and AF functions of the camera module, instead of moving the lens barrel as in the conventional case, the image sensor is moved relative to the lens barrel in the X-axis, Y-axis, and Z-axis directions. As a result, the camera module according to the embodiment can eliminate the complex spring structure required to realize the OIS and AF functions, thereby simplifying the structure. Furthermore, by moving the image sensor according to the embodiment relative to the lens barrel, a more stable structure can be formed compared to the conventional case.

[0029] According to the embodiment, the extension pattern portion electrically connecting the image sensor and the flexible circuit board has a spring structure and is disposed floating on the insulating layer. In this case, the extension pattern portion serves as a circuit for transmitting signals between the image sensor and the flexible circuit board and as a spring for moving the image sensor in the X-axis, Y-axis, and Z-axis. As a result, the camera module according to the embodiment can eliminate structures such as spring plates required for moving the image sensor, thereby simplifying the manufacturing process by eliminating processes related to the spring plates.

[0030] In addition, according to the embodiment, the extension pattern portion that functions as a spring is arranged to connect the first lead pattern portion and the second lead pattern portion arranged in a region that intersects with the region where the first lead pattern portion is arranged, rather than between the first lead pattern portion and the second lead pattern portion arranged in a region facing the region where the first lead pattern portion is arranged. As a result, the extension pattern portion in the embodiment has a configuration in which it is rotated in the tilt direction of the image sensor. As a result, in the embodiment, the extension pattern portion can be used to stably perform the tilt operation of the image sensor.

[0031] In addition, in the embodiment, the extension pattern portion is disposed on an insulating layer, and the insulating layer is disposed with an extended insulating portion having a shape corresponding to the extension pattern portion in a region vertically overlapping the extension pattern portion, thereby enabling the camera module to more stably elastically support the image sensor and move the image sensor relative to the lens barrel.

[0032] In addition, the length of the extension pattern portion in the embodiment is at least 1.5 to 20 times the linear distance between the first lead pattern portion and the second lead pattern portion facing each other, thereby improving the mobility of the image sensor substrate and minimizing noise generation.

[0033] In addition, in the embodiment, the width of the extended insulating portion is made larger than the width of the extended pattern portion, so that the extended insulating portion can stably support the extended pattern portion, thereby improving the reliability of operation. [Brief explanation of the drawings]

[0034] [Figure 1] FIG. 10 is a diagram illustrating a camera module according to a comparative example. [Figure 2] FIG. 1 is a diagram illustrating a camera device according to a first embodiment. [Figure 3] FIG. 3 is a diagram showing an insulating layer shown in FIG. 2. [Figure 4] 1A and 1B are diagrams illustrating a conductive pattern part according to an embodiment. [Figure 5] 10A and 10B are diagrams illustrating a connection structure between a flexible circuit board and an image sensor board according to an embodiment. [Figure 6] 1A to 1C are diagrams specifically illustrating the layer structure of a conductive pattern portion according to an embodiment. [Figure 7] 5A and 5B are diagrams illustrating modified examples of the conductive pattern portion of FIG. [Figure 8] FIG. 10 is a diagram showing a camera device according to a second embodiment. [Figure 9] FIG. 9 is a plan view of the insulating layer of FIG. 8 as seen from above. [Figure 10] FIG. 10 is a plan view of the image sensor substrate of FIG. 9. [Figure 11] FIG. 10 is a diagram illustrating a camera device according to a third embodiment. [Figure 12] FIG. 12 is a diagram showing the second bonding sheet shown in FIG. [Figure 13] FIG. 10 is a diagram showing a camera device according to a fourth embodiment. [Figure 14] FIG. 14 shows the spring plate shown in FIG. 13. [Figure 15] 10A and 10B are diagrams illustrating an attachment structure of an image sensor on an image sensor substrate according to another embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0035] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0036] However, the technical concept of the present invention is not limited to the described embodiments, but may be realized in various different forms, and one or more of the components may be selectively combined or substituted between the embodiments within the scope of the technical concept of the present invention.

[0037] Furthermore, unless otherwise clearly defined and described, terms (including technical and scientific terms) used in the embodiments of the present invention are interpreted as meanings that can be commonly understood by a person having ordinary knowledge in the technical field to which the present invention belongs, and commonly used terms such as predefined terms can be interpreted in consideration of the contextual meaning of the related art. Furthermore, the terms used in the embodiments of the present invention are intended to explain the embodiments and are not intended to limit the present invention.

[0038] In this specification, unless otherwise specified, the singular form includes the plural form, and when it is stated as "at least one (or one or more) of A and (and) B, C (A, B, and C)," it can include one or more of all combinations of A, B, and C. Furthermore, in describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. can be used.

[0039] Such terms are used merely to distinguish a component from other components, and do not limit the essence, order, or procedure of the components. When a component is described as being "connected," "coupled," or "connected" to another component, it includes not only the case where the component is directly connected or connected to the other component, but also the case where the component is "connected," "coupled," or "connected" by yet another component between the component and the other component.

[0040] Furthermore, when it is described as being formed or disposed "above (upper) or below (lower)" each component, above (upper) or below (lower) includes not only the case where two components are in direct contact with each other, but also the case where one or more other components are formed or disposed between the two components. Furthermore, when it is expressed as "above (upper) or below (lower)," it can mean not only the upper direction but also the lower direction based on one component.

[0041] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0042] FIG. 1 is a diagram showing a camera module according to a comparative example.

[0043] A camera module equipped with an optical image stabilizer (OIS) function and an autofocus (AF) function requires at least two spring plates.

[0044] The camera module according to the comparative example may have two spring plates, whereas the camera module according to the comparative example requires at least six elastic members such as springs in the spring plate.

[0045] 1, the camera module according to the comparative example includes an optical system including a lens assembly, an infrared blocking filter unit, and a sensor unit. That is, the camera module according to the comparative example includes a lens barrel 10, a lens assembly 20, a first elastic member 31, a second elastic member 32, a first housing 41, a second housing 42, an infrared blocking filter unit 50, a sensor unit 60, a circuit board 80, and drivers 71, 72, 73, and 74.

[0046] At this time, the lens barrel 10 is connected to the first housing 41. That is, the lens barrel 10 is connected to the first housing 41 via the first elastic member 31. That is, the lens barrel 10 is connected to the first housing 41 so as to be movable by the first elastic member 31. At this time, the first elastic member 31 includes a plurality of springs (not shown). For example, the first elastic member 31 connects the lens barrel 10 and the first housing 41 at a plurality of points on the lens barrel 10.

[0047] The second elastic member 32 is connected to the first housing 41 and the second housing 42 that accommodates the first housing 41. The second elastic member 32 fixes the first housing 41 to the second housing 42 so that the first housing 41 can move freely. The second elastic member 32 includes a plurality of springs. More specifically, the second elastic member 32 includes a plate-shaped spring.

[0048] At this time, the first elastic member 31 supports the lens barrel 10 and moves the lens barrel 10 in the vertical direction (Z-axis direction) relative to the sensor unit 60. For this purpose, the first elastic member 31 includes at least four springs.

[0049] Additionally, the second elastic member 32 supports the lens barrel 10 and moves the lens barrel 10 in the horizontal direction (X-axis direction and Y-axis direction) relative to the sensor unit 60. For this purpose, the second elastic member 32 includes at least two springs.

[0050] As described above, in the camera module according to the comparative example, OIS and AF are performed by moving the lens barrel 10 in the X-axis, Y-axis, and Z-axis directions. To achieve this, the camera module according to the comparative example requires at least six elastic members, such as springs. The camera module according to the comparative example also requires two spring plates to support the elastic members. The camera module according to the comparative example also requires an additional member, such as an elastic wire, to fix the Z-axis of the lens barrel 10. Therefore, the camera module according to the comparative example has a complex spring structure for moving the lens barrel in the X-axis, Y-axis, and Z-axis directions.

[0051] Furthermore, the camera module according to the comparative example requires manual bonding of each elastic member to connect the elastic members to the lens barrel 10. As a result, the manufacturing process of the camera module according to the comparative example is complicated and takes a long time to manufacture.

[0052] Furthermore, although the camera module according to the comparative example provides a tilt function for lens barrel 10, it has a structure that makes it difficult to actually perform tilt correction on the image. That is, even if lens barrel 10 rotates relative to sensor unit 60, the image incident on sensor unit 60 does not change, making it difficult to perform tilt correction on the image, and furthermore, the tilt function itself is unnecessary.

[0053] An image sensor substrate, a camera module, and a camera device including these according to the embodiments will be described below.

[0054] FIG. 2 is a diagram showing a camera device according to a first embodiment.

[0055] Referring to FIG. 2, the camera device of the embodiment may include a lens barrel 100, a lens assembly 200, a housing 300, an infrared blocking filter unit 400, driving units 510, 520, 530, an image sensor board 600, an image sensor 700, and a flexible circuit board 800.

[0056] The lens barrel 100 houses a lens assembly 200 .

[0057] The lens barrel 100 may include a receiving groove for receiving the lens assembly 200. The receiving groove may have a shape corresponding to the lens assembly 200.

[0058] The lens barrel 100 may have a rectangular or cylindrical shape, that is, the outer shape of the lens barrel 100 may have a rectangular or cylindrical shape, but is not limited thereto.

[0059] The lens barrel 100 is coupled to the housing 300. The lens barrel 100 is housed within the housing 300. The lens barrel 100 can be coupled to the housing 300 by another coupling member (not shown).

[0060] The lens barrel 100 may include an open area at the top. Preferably, the lens barrel 100 may include a light entrance groove that is open to the object side. The light entrance groove may expose the lens assembly 200. An image may be incident on the lens assembly 200 through the light entrance groove.

[0061] The lens assembly 200 is disposed within the lens barrel 100. The lens assembly 200 is accommodated in a receiving groove provided in the lens barrel 100. The lens assembly 200 may be inserted into and fixed in the receiving groove of the lens barrel 100. The lens assembly 200 may have a circular outer shape. For example, the lens assembly 200 may have a circular shape when viewed from the top side, but is not limited thereto. That is, the lens assembly 200 may have a rectangular shape when viewed from the top side.

[0062] The lens assembly 200 includes a plurality of lenses. For example, the lens assembly 200 may include first to fourth lenses. The first to fourth lenses may be stacked in order. Spacers (not shown) may be interposed between the lenses. The spacers may maintain a constant distance between the lenses. Although the lens assembly 200 has been described as including four lenses, the present invention is not limited thereto. For example, the lens assembly 200 may include one to three lenses, or five or more lenses.

[0063] The housing 300 accommodates the lens barrel 100. The housing 300 fixes the position of the lens barrel 100 via a separate fixing member (not shown). That is, in the comparative example, the lens barrel is coupled to the housing so that it can move freely. In contrast, in the embodiment, the housing 300 firmly fixes the lens barrel 100 via a fixing member so that the lens barrel 100 does not move within the housing 300. As a result, the position of the lens barrel 100 within the housing 300 is always fixed. As a result, in the embodiment, the lens barrel 100 is always fixed in the same position, which solves the problem of misalignment of the optical axis caused by bending of the lens barrel, etc., and thereby improves reliability.

[0064] The housing 300 may be made of plastic or metal and may have a rectangular cylindrical shape.

[0065] The infrared blocking filter unit 400 may be disposed at the lower end of the lens barrel 100. The infrared blocking filter unit 400 may be fixedly disposed on a separate substrate (not shown) and thereby coupled to the lens barrel 100. The infrared blocking filter unit 400 may block excessive long wavelength light entering the image sensor 700.

[0066] The infrared blocking filter unit 400 may be formed by alternately depositing titanium oxide and silicon oxide on optical glass. In this case, the thicknesses of the titanium oxide and silicon oxide constituting the infrared blocking filter unit 400 may be appropriately adjusted to block infrared rays.

[0067] The driving units 510, 520, and 530 move the image sensor board 600 relative to the fixed lens barrel 100. The driving units 510, 520, and 530 move the image sensor board 600 relative to the fixed housing 300. The driving units 510, 520, and 530 move the image sensor board 600 relative to the fixed lens assembly 200.

[0068] For this, the driving units 510, 520, and 530 can move the image sensor substrate 600 against the magnetic force. The driving units 510, 520, and 530 may include a first driving unit 510, a second driving unit 520, and a third driving unit 530.

[0069] The first driving unit 510 is attached to the image sensor substrate 600. Preferably, the first driving unit 510 may be attached to the lower surface of the image sensor substrate 600. More preferably, the first driving unit 510 may be attached to the lower surface of the insulating layer 610 constituting the image sensor substrate 600. The first driving unit 510 may include a magnet. For example, the first driving unit 510 may include a permanent magnet. In this case, the magnet constituting the first driving unit 510 may have a plate shape. Thus, the first driving unit 510 may include an upper surface, a lower surface, and side surfaces.

[0070] The second driving unit 520 may be disposed on the bottom surface of the housing 300. Preferably, the second driving unit 520 may be disposed on the bottom surface of the housing 300 overlapping the image sensor substrate 600 in the vertical direction. The second driving unit 520 may include a coil. A driving signal may be applied to the second driving unit 520, and the second driving unit 520 may generate a magnetic field in response to the driving signal.

[0071] In this case, the first driver 510 and the second driver 520 may face each other. That is, the first driver 510 and the second driver 520 may be disposed so as to overlap each other in the vertical direction. The first driver 510 and the second driver 520 may be disposed side by side in the horizontal direction. That is, the lower surface of the first driver 510 and the upper surface of the second driver 520 may be disposed so as to face each other. The distance between the first driver 510 and the second driver 520 may be, but is not limited to, 50 μm to about 1000 μm.

[0072] A magnetic force may be generated between the first driver 510 and the second driver 520. As a result, the image sensor substrate 600 may move in the X-axis direction and the Y-axis direction due to the repulsive and attractive forces generated between the second driver 520 and the first driver 510. In addition, the image sensor substrate 600 may tilt (or rotate) according to the direction of the current applied to the second driver 520. To this end, the second driver 520 and the first driver 510 may each include a plurality of magnets and a plurality of coils.

[0073] The third driver 530 may be attached to the image sensor substrate 600. Preferably, the third driver 530 may be attached to a sidewall of the image sensor substrate 600. Specifically, the third driver 530 may be attached to a side surface of the support layer 650 of the image sensor substrate 600. In this case, the third driver 530 may be disposed to at least partially overlap the first driver 510 in the horizontal direction. The third driver 530 may be disposed perpendicular to the first driver 510. That is, the top surface of the third driver 530 may be disposed opposite the side surface of the first driver 510. As a result, the image sensor substrate 600 may move in the Z-axis direction due to the attractive and repulsive forces between the third driver 530 and the first driver 510.

[0074] The image sensor board 600 is a board on which the image sensor 700 is mounted. Specifically, the image sensor board 600 is driven by the drivers 510, 520, and 530 to move the image sensor 700 in the X-axis, Y-axis, and Z-axis directions. The image sensor board 600 is also driven by the drivers 510, 520, and 530 to tilt the image sensor 700.

[0075] The image sensor board 600 may be disposed at a predetermined distance from the bottom surface of the housing 300. The image sensor board 600 may move the mounted image sensor 700 relative to the housing 300.

[0076] To this end, the image sensor substrate 600 may include an insulating layer 610 , a first bonding sheet 620 , a conductive pattern part 640 and a support layer 650 .

[0077] The insulating layer 610 can move the image sensor 700 disposed on the image sensor substrate 600 in the X-axis, Y-axis, and Z-axis directions while supporting the conductive pattern unit 640. To this end, the insulating layer 610 may include an elastic region having a certain elastic force.

[0078] Specifically, the insulating layer 610 is a substrate for forming the conductive pattern portion 640, and may include all of the printed circuit boards, wiring boards, and insulating substrates made of insulating materials on which the conductive pattern portion 640 can be formed on the surface of the insulating layer.

[0079] The insulating layer 610 can be rigid or flexible. For example, the insulating layer 610 can include glass or plastic. Specifically, the insulating layer 610 can include chemically strengthened / semi-strengthened glass such as soda lime glass or aluminosilicate glass, or a reinforced or flexible plastic such as polyimide (PI), polyethylene terephthalate (PET), propylene glycol (PPG), or polycarbonate (PC), or can include sapphire.

[0080] The insulating layer 610 may include an optically isotropic film. For example, the insulating layer 610 may include a cyclic olefin copolymer (COC), a cyclic olefin polymer (COP), an optically isotropic polycarbonate (PC), or an optically isotropic polymethyl methacrylate (PMMA).

[0081] In this case, the insulating layer 610 may bend while partially having a curved surface. That is, the insulating layer 610 may bend while partially having a flat surface and partially having a curved surface. The insulating layer 610 may be a flexible substrate having flexibility. The insulating layer 610 may be a curved or bent substrate.

[0082] The conductive pattern unit 640 is disposed on the insulating layer 610. The conductive pattern unit 640 may include lead pattern units spaced apart from each other on the insulating layer 610. For example, the conductive pattern unit 640 may include a first lead pattern unit connected to the image sensor 700 and a second lead pattern unit connected to the flexible circuit board 800. The conductive pattern unit 640 may also include an extension pattern unit connecting the first lead pattern unit and the second lead pattern unit. The first lead pattern unit, the second lead pattern unit, and the extension pattern unit will be described in detail below.

[0083] The conductive pattern unit 640 is a wiring that transmits an electrical signal and may be formed of a metal material having high electrical conductivity. To this end, the conductive pattern unit 640 may be formed of at least one metal material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). In addition, the conductive pattern unit 640 may be formed of a paste or solder paste containing at least one metal material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn) that has excellent bonding strength.

[0084] Preferably, the conductive pattern unit 640 may be formed of a metal material having elasticity such that it can move in the X-axis, Y-axis, and Z-axis directions in response to forces applied from the actuators 510, 520, and 530 while serving as wiring for transmitting electrical signals. To this end, the conductive pattern unit 640 may be formed of a metal material having a tensile strength of 1000 MPa or more. For example, the conductive pattern unit 640 may be a binary or ternary alloy containing copper. For example, the conductive pattern unit 640 may be a copper (Cu)-nickel (Ni) binary alloy. For example, the conductive pattern unit 640 may be a copper (Cu)-tin (Sn) binary alloy. For example, the conductive pattern unit 640 may be a copper (Cu)-beryllium (Be) binary alloy. For example, the conductive pattern unit 640 may be a copper (Cu)-cobalt (Co) binary alloy. For example, the conductive pattern unit 640 may be a ternary alloy of copper (Cu), nickel (Ni), and tin (Sn). For example, the conductive pattern unit 640 may be a ternary alloy of copper (Cu), beryllium (Be), and cobalt (Co). In addition to the above metal materials, the conductive pattern unit 640 may be formed of an alloy of iron (Fe), nickel (Ni), zinc, or the like, which has elasticity capable of functioning as a spring and good electrical properties. In addition, the conductive pattern unit 640 may be surface-treated with a plating layer containing a metal material such as gold (Au), silver (Ag), or palladium (Pd), thereby improving electrical conductivity.

[0085] Meanwhile, the conductive pattern unit 640 can be formed using conventional printed circuit board manufacturing processes such as additive process, subtractive process, modified semi-additive process (MSAP), and semi-additive process (SAP), and detailed description thereof will be omitted here.

[0086] The support layer 650 may be a support substrate.

[0087] The support layer 650 may be disposed under the insulating layer 610 to support the insulating layer 610, the conductive pattern unit 640, and the image sensor 700. In this case, a first bonding sheet 620 may be disposed between the support layer 650 and the insulating layer 610.

[0088] The first bonding sheet 620 may be selectively disposed on the upper surface of the support layer 650 in a region that vertically overlaps the lower surface of the insulating layer 610 .

[0089] The third driving unit 530 may be mounted on the support layer 650, thereby applying an electrical signal to the third driving unit 530. The support layer 650 may support the insulating layer 610. Preferably, the support layer 650 may support the first bonding sheet 620, the insulating layer 610, the conductive pattern unit 640, and the image sensor 700 at a location suspended above the bottom surface of the housing 300.

[0090] The image sensor 700 is disposed on the image sensor substrate 600, and preferably, the image sensor 700 is disposed on the conductive pattern unit 640 of the image sensor substrate 600. The image sensor 700 may be mounted on a first lead pattern unit constituting the conductive pattern unit 640 of the image sensor substrate 600.

[0091] The image sensor 700 may be configured as a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS) sensor, and may be a device that converts an image of an object into an electrical signal using a photoelectric conversion element and a charge coupled device. The image sensor 700 is electrically connected to the conductive pattern unit 640 on the image sensor substrate 600 and can receive an image provided from the lens assembly 200. The image sensor 700 can also convert the received image into an electrical signal and output the electrical signal. At this time, the signal output via the image sensor 700 can be transmitted to the flexible circuit board 800 via the conductive pattern unit 640.

[0092] One end of the flexible circuit board 800 may be connected to the image sensor board 600. The flexible circuit board 800 may receive an electrical signal output from the image sensor 700. The flexible circuit board 800 may have a connector at the other end. A main board (not shown) may be connected to the connector.

[0093] That is, the flexible circuit board 800 can connect the camera module and the main board of the external device. Specifically, the flexible circuit board 800 can connect the conductive pattern unit 640 of the image sensor board 600 of the camera module and the main board of the mobile terminal.

[0094] For this purpose, one area of ​​the flexible circuit board 800 is disposed inside the housing 300 so as to be connected to the conductive pattern part 640 of the image sensor board 600 .

[0095] The image sensor substrate 600 according to the embodiment will be described in more detail below.

[0096] FIG. 3 is a diagram showing the insulating layer shown in FIG.

[0097] Referring to FIG. 3, the insulating layer 610 may support the conductive pattern unit 640 constituting the image sensor substrate 600 .

[0098] The insulating layer 610 may include a first insulating portion 611 and a second insulating portion 612 spaced apart from the first insulating portion 611 .

[0099] The insulating layer 610 may include an open region 613 between the first insulating portion 611 and the second insulating portion 612 .

[0100] The second insulating portion 612 is disposed at a position spaced apart from the first insulating portion 611 and surrounding the first insulating portion 611. At this time, the second insulating portion 612 does not directly contact the first insulating portion 611. Therefore, the first insulating portion 611 and the second insulating portion 612 can be separated from each other by the open region 613.

[0101] Meanwhile, the open region 613 of the insulating layer 610 may vertically overlap an extension pattern portion (described later) constituting the conductive pattern portion 640. Therefore, the extension pattern portion exposed through the open region 613 may float on the insulating layer 610.

[0102] The insulating layer 610 may have a thickness of 20 μm to 100 μm. For example, the insulating layer 610 may have a thickness of 25 μm to 50 μm. For example, the insulating layer 610 may have a thickness of 30 μm to 40 μm. If the thickness of the insulating layer 610 exceeds 100 μm, the overall thickness of the image sensor substrate 600 may increase. If the thickness of the insulating layer 610 is less than 20 μm, it may be difficult to arrange the image sensor 700. If the thickness of the insulating layer 610 is less than 20 μm, it may be vulnerable to heat / pressure during the process of mounting the image sensor, making it difficult to stably mount the image sensor 700.

[0103] Meanwhile, in the drawings, the first insulating portion 611 and the second insulating portion 612 of the edge layer 610 are shown as being physically separated from each other with the open region 613 sandwiched therebetween. However, depending on the embodiment, a connecting insulating portion (not shown) may be disposed in the open region 613. The connecting insulating portion is a portion of the open region 613 that is left unremoved when forming the open region 613, and may connect the first insulating portion 611 and the second insulating portion 612. For example, the connecting insulating portion may connect corner regions of the first insulating portion 611 and the second insulating portion 612 to each other. For example, the connecting insulating portion may connect a first corner region of the first insulating portion 611 to a second corner region of the second insulating portion 612 corresponding to the first corner region. The connecting insulating portion may also connect the remaining corner regions of the first insulating portion 611 to the corresponding remaining corner regions of the second insulating portion 612.

[0104] When the insulating layer 610 includes the connecting insulating part, the first insulating part 611, the second insulating part 612, and the connecting insulating part may be integrally formed, thereby utilizing the elastic force of the insulating layer 610 when the image sensor is tilted, and preventing the first insulating part 611, the connecting insulating part, and the second insulating part 612 from being detached from each other.

[0105] The insulating layer 610 may have the open region 613 by removing a region corresponding to the open region 613 on an insulating member by etching or physical punching.

[0106] Meanwhile, at least one slit (not shown) may be formed on the first insulating part 611 of the insulating layer 610. The slit may be formed to maintain the flatness of the insulating layer 610. That is, the conductive pattern part 640 and the image sensor 700 are disposed on the insulating layer 610. The first driving part 510 is disposed below the insulating layer 610. In this case, the flatness of the first driving part 510 and the image sensor 700 directly affects the reliability of the camera module, and poor flatness may result in a deterioration in image quality. Therefore, in an embodiment, by forming at least one slit on the insulating layer 610, the weight of the insulating layer 610 and the flatness of the insulating layer 610 can be reduced, and the overall reliability of the camera module can be improved by maintaining the flatness.

[0107] Meanwhile, a first bonding sheet 620 is disposed under the insulating layer 610. In this case, the first bonding sheet 620 may be disposed under the second insulating portion 612 of the insulating layer 610. As a result, the first bonding sheet 620 may have a planar shape corresponding to the planar shape of the second insulating portion 612 of the insulating layer 610.

[0108] In other words, the first bonding sheet 620 may be selectively formed only in the area of ​​the lower surface of the insulating layer 610 where the support layer 650 is disposed. Meanwhile, the support layer 650 and the insulating layer 610 may be formed integrally with each other. Thus, the first bonding sheet 620 may be selectively omitted.

[0109] That is, the support layer 650 can be formed by removing a portion of the lower surface of the insulating member that constitutes the insulating layer 610 and the support layer 650 to form a groove.

[0110] The first bonding sheet 620 may expose the open area 613 and the first insulating portion 611 of the insulating layer 610 .

[0111] The first bonding sheet 620 may be formed of a double-sided adhesive tape, an epoxy or acrylic adhesive, or a thermosetting adhesive film.

[0112] The first bonding sheet 620 may have a thickness of 25 μm.

[0113] FIG. 4 is a diagram illustrating a conductive pattern unit according to an embodiment.

[0114] 4 , the conductive pattern unit 640 may be arranged in a specific pattern on the insulating layer 610. The conductive pattern unit 640 may include first conductive pattern units 641, 642, 643, and 644 arranged on a first insulating unit 611 of the insulating layer 610, second conductive pattern units 645, 646, 647, and 648 arranged on a second insulating unit 612 of the insulating layer 610, and an extended pattern unit 649 arranged on an open area 613 of the insulating layer 610.

[0115] In this case, on the drawing, the upper region of the first insulating portion 611 of the insulating layer 610 is labeled "A", the upper region of the second insulating portion 612 of the insulating layer 610 is labeled "B", and the region vertically overlapping with the open region 613 of the insulating layer 610 is labeled "C".

[0116] The first conductive pattern units 641, 642, 643, and 644 may be disposed on a first insulating unit 611 of the insulating layer 610. Preferably, the first conductive pattern units 641, 642, 643, and 644 may be disposed in an edge region of the first insulating unit 611. In this case, a portion of the upper surface of the first insulating unit 611 may be used as a mounting region where the image sensor 700 is mounted, and thus the first conductive pattern units 641, 642, 643, and 644 may be disposed in an outer region of the upper surface of the first insulating unit 611, surrounding the periphery of the mounting region.

[0117] The first conductive pattern units 641, 642, 643, and 644 may be respectively arranged around four sides of the top surface of the first insulating unit 611. Thus, the first conductive pattern units 641, 642, 643, and 644 may include a 1-1 conductive pattern unit 641 arranged in a first side region of the first insulating unit 611, a 1-2 conductive pattern unit 642 arranged in a second side region facing the first side region, a 1-3 conductive pattern unit 643 arranged in a third side region between the first side region and the second side region, and a 1-4 conductive pattern unit 644 arranged in a fourth side region facing the third side region.

[0118] The second conductive pattern units 645, 646, 647, and 648 may be arranged around the four sides of the upper surface of the second insulating unit 612. In this case, the second conductive pattern units 645, 646, 647, and 648 may be arranged on the second insulating unit 612 facing the second conductive pattern units 645, 646, 647, and 648. The number of the second conductive pattern units 645, 646, 647, and 648 may be the same as the number of the first conductive pattern units 641, 642, 643, and 644. Therefore, the first conductive pattern units 641, 642, 643, and 644 may be connected to the second conductive pattern units 645, 646, 647, and 648 in a one-to-one relationship.

[0119] Preferably, the second conductive pattern portions 645, 646, 647, 648 may include a 2-1 conductive pattern portion 645 arranged in a first side region of the second insulating portion 612 facing the 1-1 conductive pattern portion 641, a 2-2 conductive pattern portion 646 arranged in a second side region of the second insulating portion 612 facing the 1-2 conductive pattern portion 642, a 2-3 conductive pattern portion 647 arranged in a third side region of the second insulating portion 612 facing the 1-3 conductive pattern portion 643, and a 2-4 conductive pattern portion 645 arranged in a fourth side region of the second insulating portion 612 facing the 1-4 conductive pattern portion 644.

[0120] Here, the first side region of the first insulating portion 611 and the second insulating portion 612 may be the left side region of the upper surface of the insulating layer 610. The second side region of the first insulating portion 611 and the second insulating portion 612 may be the right side region of the upper surface of the insulating layer 610. The third side region of the first insulating portion 611 and the second insulating portion 612 may be the upper side region of the upper surface of the insulating layer 610. The fourth side region of the first insulating portion 611 and the second insulating portion 612 may be the lower side region of the upper surface of the insulating layer 610.

[0121] As described above, the first conductive pattern portions 641, 642, 643, 644 and the second conductive pattern portions 645, 646, 647, 648 may be disposed on the first insulating portion 611 and the second insulating portion 612, respectively, on surfaces facing each other.

[0122] In addition, the first conductive pattern units 641, 642, 643, and 644 and the second conductive pattern units 645, 646, 647, and 648 are respectively disposed in different regions of the first insulating unit 611 and the second insulating unit 612, thereby increasing the elastic support force during movement of the image sensor substrate 600. That is, if the conductive pattern units 640 are concentrated in only a specific region, the reliability of the image sensor substrate 600 during movement in a specific direction may be reduced. For example, if the first conductive pattern unit 640 includes only the first and second conductive pattern units 641 and 643, the image sensor substrate 600 may move smoothly in the X-axis direction but may have poor stability during movement in the Y-axis direction. In such a case, a short circuit of the conductive pattern unit 640 may occur due to periodic movement of the image sensor substrate 600. Therefore, in this embodiment, the conductive pattern units 640 are distributed in four regions as described above, respectively, to allow the image sensor substrate 600 to stably move in the X-axis, Y-axis, and Z-axis. That is, the conductive pattern units may be formed symmetrically in the top / bottom / left / right directions on the insulating layer 610.

[0123] Meanwhile, the first conductive pattern units 641 , 642 , 643 , and 644 may be inner lead pattern units connected to the image sensor 700 , and the second conductive pattern units 645 , 646 , 647 , and 648 may be outer lead pattern units connected to the flexible circuit board 800 .

[0124] Meanwhile, the conductive pattern unit 640 may include an extension pattern unit 649 that connects the first conductive pattern units 641, 642, 643, and 644 and the second conductive pattern units 645, 646, 647, and 648 and is disposed floating on the open region 613 of the insulating layer 610. Here, being floating may mean that the extension pattern unit 649 is floating in the air without a support unit that supports the extension pattern unit 649 below.

[0125] In conclusion, the first conductive pattern units 641, 642, 643, and 644 and the second conductive pattern units 645, 646, 647, and 648 may be arranged to face each other on the insulating layer 610. The extension pattern unit 649 may connect the first conductive pattern units 641, 642, 643, and 644 and the second conductive pattern units 645, 646, 647, and 648 to each other.

[0126] In this case, one end of the extension pattern unit 649 may be connected to the first conductive pattern units 641, 642, 643, and 644, and the other end may be connected to the second conductive pattern units 645, 646, 647, and 648. Preferably, the extension pattern unit 649 may connect the first conductive pattern units and the second conductive pattern units that do not face each other, rather than connecting the first conductive pattern units and the second conductive pattern units that face each other.

[0127] For example, one end of the extension pattern unit 649 may be connected to the 1-1 conductive pattern unit 641, and the other end may be connected to the 2-3 conductive pattern unit 647, which is not the 2-1 conductive pattern unit 645 facing the 1-1 conductive pattern unit 641. That is, the extension pattern unit 649 may connect one of the first conductive pattern units 641, 642, 643, 644 and one of the second conductive pattern units 645, 646, 647, 648, which are arranged in directions intersecting each other, rather than connecting one of the first conductive pattern units 641, 642, 643, 644 and one of the second conductive pattern units 645, 646, 647, 648, which are arranged in parallel directions.

[0128] That is, when one end of the extension pattern unit 649 is connected to the 1-1 conductive pattern unit 641, the other end may be connected to the 2-3 pattern unit 647 or the 2-4 pattern unit 648, which is opposed to the 1-1 conductive pattern unit 641 in a direction intersecting the 1-1 conductive pattern unit 641.

[0129] Therefore, the extension pattern portion 649 can be arranged in a rotated manner along the corner area on the open area 613.

[0130] Additionally, the extension pattern portion 649 can be disposed on multiple side regions.

[0131] For example, when the extension pattern portion 649 connects between the first conductive pattern portion and the second conductive pattern portion facing each other, the extension pattern portion 649 may be disposed in only one of the facing side regions.

[0132] Alternatively, in this embodiment, the extension pattern 649 connects the first conductive pattern and the second conductive pattern that do not face each other, so that one end of the extension pattern 649 may be disposed on the side region where the connected first conductive pattern is disposed and the other end of the extension pattern 649 may be disposed on the side region where the second conductive pattern is disposed. That is, the extension pattern 649 may have a structure with multiple bends and may be disposed along one corner region of the open region 613.

[0133] The open region of the insulating layer 610 may include a first open portion to a fourth open portion. The first open portion may be located between a first outer side of the first insulating portion 611 and a first inner side of the second insulating portion 612. The second open portion may be located between a second outer side of the first insulating portion 611 and a second inner side of the second insulating portion 612. The third open portion may be located between a third outer side of the first insulating portion 611 and a third inner side of the second insulating portion 612. The fourth open portion may be located between a fourth outer side of the first insulating portion 611 and a fourth inner side of the second insulating portion 612. The first open portion and the second open portion may be located opposite each other. The third open portion may be located between one end of the first open portion and one end of the second open portion to connect them to each other. The fourth open portion may be located between the other end of the first open portion and the other end of the second open portion to connect them to each other.

[0134] The 1-1 conductive pattern unit 641 and the 2-1 conductive pattern unit 645 may be disposed opposite each other across the first open portion. The 1-2 conductive pattern unit 642 and the 2-2 conductive pattern unit 646 may be disposed opposite each other across the second open portion. The 1-3 conductive pattern unit 643 and the 2-3 conductive pattern unit 647 may be disposed opposite each other across the third open portion. The 1-4 conductive pattern unit 644 and the 2-4 conductive pattern unit 648 may be disposed opposite each other across the fourth open portion.

[0135] In addition, the extension pattern unit 619 may connect the first conductive pattern units 641, 642, 643, 644 and the second conductive pattern units 645, 646, 647, 648 arranged on different open portions to each other, rather than connecting the first conductive pattern units 641, 642, 643, 644 and the second conductive pattern units 645, 646, 647, 648 arranged on the same open portion to each other.

[0136] For example, the extended pattern portion 619 may connect the 1-1 conductive pattern portion 641 arranged on the 1st open portion to the 2-3 conductive pattern portion 647 arranged on the 3rd open portion. The extended pattern portion 619 may connect the 1-2 conductive pattern portion 642 arranged on the 2nd open portion to the 2-4 conductive pattern portion 648 arranged on the 4th open portion. The extended pattern portion 619 may connect the 1-3 conductive pattern portion 643 arranged on the 3rd open portion to the 2-2 conductive pattern portion 646 arranged on the 2nd open portion. The extended pattern portion 619 may connect the 1-4 conductive pattern portion 641 arranged on the 4th open portion to the 2-1 conductive pattern portion 645 arranged on the 1st open portion. Thus, the extended pattern portion 619 may be disposed on a corner region between the plurality of open portions. That is, the extension pattern portion 619 may include a bent portion disposed on a corner region connecting between an opening portion where the start end is disposed and an opening portion where the end end is disposed.

[0137] In conclusion, the extension pattern unit 649 may have a shape that rotates in a first direction and may include a plurality of extension pattern units that connect the first conductive pattern units 641, 642, 643, and 644 to the second conductive pattern units 645, 646, 647, and 648. The rotation directions of the plurality of extension pattern units may be the same. Furthermore, the lengths of the plurality of extension pattern units may be the same. As a result, in this embodiment, not only can the image sensor be stably moved, but also a stable tilt function can be achieved due to the rotational shape as described above.

[0138] Meanwhile, the length of the extension pattern portion 649 is greater than the linear distance between the first and second conductive pattern portions facing each other.

[0139] In this case, the extension pattern portion 649 may be formed by etching to have the above-described shape using an additive process, a subtractive process, a modified semi-additive process (MSAP), a semi-additive process (SAP), or the like. Preferably, the first conductive pattern portions 641, 642, 643, 644, the second conductive pattern portions 645, 646, 647, 648, and the extension pattern portion 649 may be formed simultaneously. More preferably, the extension pattern portion 649 may be formed integrally with the first conductive pattern portions 641, 642, 643, 644, and the second conductive pattern portions 645, 646, 647, 648.

[0140] Meanwhile, the thickness of the conductive pattern unit 640, including the first conductive pattern units 641, 642, 643, 644, the second conductive pattern units 645, 646, 647, 648, and the extension pattern unit 649, may be 10 μm to 50 μm. For example, the thickness of the conductive pattern unit 640 may be 30 μm to 40 μm. If the thickness of the conductive pattern unit 640 is less than 10 μm, the conductive pattern unit 640 may be torn when the image sensor substrate 600 is moved. If the thickness of the conductive pattern unit 640 is greater than 50 μm, the elasticity of the extension pattern unit 649 may be reduced, which may hinder the movement of the image sensor substrate 600. Therefore, in this embodiment, the thickness of the conductive pattern unit 640 is set to 35 μm ± 5 μm to ensure stable movement of the image sensor substrate 600.

[0141] The length of the extension pattern portion 649 is at least 1.5 times the linear distance between the first and second conductive patterns facing each other, and is 20 times or less the linear distance between the first and second conductive patterns facing each other.

[0142] In this case, the linear distance between the first conductive pattern units 641, 642, 643, and 644 and the second conductive pattern units 645, 646, 647, and 648 facing each other may be 1.5 mm.

[0143] If the length of the extended pattern portion 649 is less than 1.5 times the linear distance, the mobility of the image sensor substrate 600 may be reduced due to a decrease in the elasticity of the extended pattern portion 649. Also, if the length of the extended pattern portion 649 is more than 20 times the linear distance, the resistance increases due to an increase in the signal transmission distance through the extended pattern portion 649, which may result in noise being included in the signal transmitted through the extended pattern portion 649. Therefore, in order to minimize the generation of noise, the length of the extended pattern portion 649 may be set to 10 times or less the linear distance between the first lead pattern portion 645 and the second lead pattern portion 646.

[0144] Meanwhile, the conductive pattern unit 640 is a wiring that transmits electrical signals and may be formed of a metal material having high electrical conductivity. To this end, the conductive pattern unit 640 may be formed of at least one metal material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). In addition, the conductive pattern unit 640 may be formed of a paste or solder paste containing at least one metal material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn) that has excellent bonding strength.

[0145] Preferably, the conductive pattern unit 640 may be formed of a metal material having elasticity that allows it to move in the X-, Y-, and Z-axis directions in conjunction with the elastic member of the insulating layer 610 while serving as a wiring for transmitting electrical signals. For this purpose, the conductive pattern unit 640 may be formed of a metal material having a tensile strength of 1000 MPa or more. For example, the conductive pattern unit 640 may be a binary or ternary alloy containing copper. For example, the conductive pattern unit 640 may be a copper (Cu)-nickel (Ni) binary alloy. For example, the conductive pattern unit 640 may be a copper (Cu)-tin (Sn) binary alloy. For example, the conductive pattern unit 640 may be a copper (Cu)-beryllium (Be) binary alloy. For example, the conductive pattern unit 640 may be a copper (Cu)-cobalt (Co) binary alloy. For example, the conductive pattern unit 640 may be a ternary alloy of copper (Cu), nickel (Ni), and tin (Sn). For example, the conductive pattern unit 640 may be a ternary alloy of copper (Cu), beryllium (Be), and cobalt (Co). In addition to the above metal materials, the conductive pattern unit 640 may be formed of an alloy of iron (Fe), nickel (Ni), zinc, or the like, which has elasticity capable of functioning as a spring and good electrical properties. In addition, the conductive pattern unit 640 may be surface-treated with a plating layer containing a metal material such as gold (Au), silver (Ag), or palladium (Pd), thereby improving electrical conductivity.

[0146] FIG. 5 is a diagram illustrating a connection structure between a flexible circuit board and an image sensor board according to an embodiment.

[0147] Referring to FIG. 5, the flexible circuit board 800 electrically connects the image sensor board 600 to an external main board (not shown).

[0148] One end of the flexible circuit board 800 may be connected to the image sensor board 600. The flexible circuit board 800 may receive an electrical signal output from the image sensor 700. The flexible circuit board 800 may have a connector 810 at the other end. A main board (not shown) may be connected to the connector 810.

[0149] That is, the flexible circuit board 800 can connect the camera module and the main board of the external device. Specifically, the flexible circuit board 800 can connect the conductive pattern unit 640 of the image sensor board 600 of the camera module and the main board of the mobile terminal.

[0150] For this purpose, one area of ​​the flexible circuit board 800 is disposed inside the housing 300 so as to be connected to the conductive pattern part 640 of the image sensor board 600 .

[0151] That is, the flexible circuit board 800 may include a first connector portion 801 , a second connector portion 803 and a connecting portion 802 .

[0152] The first connector portion 801 may be disposed inside the housing 300. The first connector portion 801 may include a plurality of pads 804, 805, 806, and 807 connected to the conductive pattern portion 640.

[0153] The first connector portion 801 may be electrically connected to the second conductive pattern portions 645, 646, 647, and 648, i.e., the outer lead pattern portions, of the conductive pattern portion 640. That is, the pad portions 804, 805, 806, and 807 provided on the first connector portion 801 may be electrically connected to the second conductive pattern portions 645, 646, 647, and 648.

[0154] To this end, the first connector portion 801 may include a first pad portion 804 connected to the 2-1 conductive pattern portion 645. The first connector portion 801 may also include a second pad portion 805 connected to the 2-2 conductive pattern portion 646. The first connector portion 801 may also include a third pad portion 806 connected to the 2-3 conductive pattern portion 647. The first connector portion 801 may also include a fourth pad portion 807 connected to the 2-4 conductive pattern portion 648.

[0155] In this case, the first connector portion 801 has a shape corresponding to the second insulating portion 612 of the insulating layer 610, and can be arranged surrounding the upper region of the second conductive pattern portions 645, 646, 647, 648 of the conductive pattern portion 640, and the plurality of pad portions 804, 805, 806, 807 can be arranged on its lower surface.

[0156] The connecting portion 802 connects between the first connector portion 801 and the second connector portion 803. A portion of the connecting portion 802 may be disposed within the housing 300 and may extend therefrom to be exposed to the outside of the housing 300.

[0157] The second connector part 803 may have a connector 810 disposed therein, which is connected to a main board of the terminal.

[0158] Meanwhile, the image sensor 700 may be attached on the first insulating portion 611 of the insulating layer 610. At this time, the image sensor 700 may be attached on the first insulating portion 611 such that the electrodes 710 face upward.

[0159] A connecting member 720 such as a metal wire is formed between the electrode 710 of the image sensor 700 and the first conductive pattern units 641, 642, 643, and 644, thereby electrically connecting the electrode of the image sensor and the first conductive pattern units 641, 642, 643, and 644.

[0160] FIG. 6 is a diagram specifically illustrating the layer structure of the conductive pattern portion according to the embodiment.

[0161] 6, the conductive pattern unit 640 is disposed on an insulating layer 610. In this case, the conductive pattern unit 640 may include first conductive pattern units 641, 642, 643, and 644 disposed on a first insulating unit 611 of the insulating layer 610, second conductive pattern units 645, 646, 647, and 648 disposed on a second insulating unit 612, and an extension pattern unit 649 disposed on an open region 613.

[0162] In this case, each of the first conductive pattern units 641, 642, 643, and 644, the second conductive pattern units 645, 646, 647, and 648, and the extension pattern unit 649 may include a metal layer 640A and a plating layer 640B.

[0163] The metal layer 640A may be disposed on the insulating layer 610. That is, the metal layer 640A is disposed on the insulating layer 610 and constitutes first conductive pattern portions 641, 642, 643, and 644, second conductive pattern portions 645, 646, 647, and 648, and an extension pattern portion 649, respectively.

[0164] The plating layer 640B may be disposed on the metal layer 640A. Preferably, the plating layer 640B may be a surface treatment layer disposed on the metal layer 640A.

[0165] The plating layer 640B may include any one of Ni / Au alloy, gold (Au), electroless nickel immersion gold (ENIG), Ni / Pd alloy, and organic solderability preservative (OSP).

[0166] In this case, the plating layers 650B constituting the first conductive pattern units 641, 642, 643, and 644 and the second conductive pattern units 645, 646, 647, and 648 may correspond to each other. Alternatively, the plating layer 650B constituting the extension pattern unit 649 may have a different thickness from the plating layers 650B constituting the first conductive pattern units 641, 642, 643, and 644 and the second conductive pattern units 645, 646, 647, and 648.

[0167] That is, the plating layer 650B of the first conductive pattern units 641, 642, 643, 644 and the second conductive pattern units 645, 646, 647, 648 may be selectively formed only on the upper and side surfaces of the corresponding metal layer 650A. In contrast, the metal layer 650A constituting the extended pattern unit 649 is disposed in a floating state above the open region described above, and therefore the plating layer 650B of the extended pattern unit 649 may be formed to surround the entire surface of the corresponding metal layer 650A. That is, the plating layer 650B of the extended pattern unit 649 may be formed to surround the upper, side, and lower surfaces of the metal layer 650A of the extended pattern unit 649.

[0168] Therefore, the lower surfaces of the first conductive pattern portions 641, 642, 643, and 644 may be located substantially flush with the upper surface of the insulating layer 610. In contrast, the lower surface of the extension pattern portion 649 may be located lower than the upper surface of the insulating layer 610.

[0169] Meanwhile, the thickness of the plating layer 650B may be 0.3 μm to 1 μm. For example, the thickness of the plating layer 650B may be 0.3 μm to 0.7 μm. The thickness of the plating layer 650B may be 0.3 μm to 0.5 μm.

[0170] FIG. 7 shows a modification of the conductive pattern portion of FIG.

[0171] In FIG. 4, the extension pattern portion 649 constituting the conductive pattern portion 640 connects the first conductive pattern portion and the second conductive pattern portion that are arranged on opposite sides to each other, rather than connecting the first conductive pattern portion and the second conductive pattern portion that face each other.

[0172] Alternatively, referring to FIG. 7, the conductive pattern unit 640 may connect the first conductive pattern unit and the second conductive pattern unit, which are disposed on opposite sides of each other.

[0173] 7, the second conductive pattern units 645A, 646A, 647A, and 648A may not be disposed opposite the first conductive pattern units 641, 642, 643, and 644, but may be disposed offset in the bending direction of the extended pattern unit 649A. That is, the second conductive pattern units 645, 646, 647, and 648 may be disposed offset toward corner regions on the second insulating unit. Thus, the extended pattern unit 619 may include bent portions disposed in corner regions on the open region 613 to be connected to the second conductive pattern units 645, 646, 647, and 648 disposed offset toward the corner regions.

[0174] That is, as shown in FIG. 7, the extension pattern portion 649A may be bent to the right. As a result, the second conductive pattern portions 645, 646, 647, and 648 may be arranged biased to the right of the center in their respective arrangement regions. That is, the second conductive pattern portions 645, 646, 647, and 648 may be arranged biased to the region adjacent to the right corner region of the respective arrangement regions. In this case, the extension pattern portion 649A may be configured in a shape that rotates to the right, as shown in FIG. 4, and may have an overall pinwheel shape that rotates to the right.

[0175] As described above, when the extension pattern portion 649A is arranged biasedly in one corner area rather than in the center of the arrangement area, the mobility of the image sensor can be improved while maintaining the length of the extension pattern portion 649A optimally.

[0176] FIG. 8 is a diagram showing a camera device according to the second embodiment.

[0177] Referring to FIG. 8, the camera device of the embodiment may include a lens barrel 100, a lens assembly 200, a housing 300, an infrared blocking filter unit 400, driving units 510, 520, 530, an image sensor board 600, an image sensor 700, and a flexible circuit board 800.

[0178] In this case, the camera device according to the second embodiment differs from the camera device in FIG. 2 only in the structure of the image sensor substrate 600, and the other structures are the same. Therefore, hereinafter, only the image sensor substrate 600 in the second embodiment will be described.

[0179] The image sensor substrate 600 may include an insulating layer 610A, a first bonding sheet 620, a conductive pattern part 640, and a support layer 650.

[0180] At this time, the configuration of the image sensor substrate 600 other than the insulating layer 610A is substantially the same as the structure shown in FIGS.

[0181] Therefore, the following description will be directed to an insulating layer 610A having a structure different from that of FIGS.

[0182] The insulating layer 610A can move the image sensor 700 disposed on the image sensor substrate 600 in the X-axis, Y-axis, and Z-axis directions while supporting the conductive pattern unit 640. To this end, the insulating layer 610A may include an elastic region having a certain elastic force. Preferably, the insulating layer 610A may include a plurality of elastic regions. For example, the insulating layer 610A may include four elastic regions.

[0183] That is, the insulating layer 610A can have a certain elastic force in at least one region, thereby elastically supporting the image sensor substrate 600 and allowing the image sensor substrate 600 to move in the X-axis, Y-axis, and Z-axis directions.

[0184] In this case, the insulating layer 610A is a substrate on which the conductive pattern portion 640 is formed, and may include any printed circuit board, wiring board, or insulating substrate made of an insulating material on which the conductive pattern portion 640 can be formed on the surface of the insulating layer.

[0185] In this case, the insulating layer 610A may include a first insulating portion 611A in which the first conductive pattern portions 641, 642, 643, and 644 constituting the conductive pattern portion 640 are arranged, a second insulating portion 612A in which the second conductive pattern portions 645, 646, 647, and 648 are arranged, and an extended insulating portion in which the extended pattern portion 649 is arranged.

[0186] FIG. 9 is a plan view of the insulating layer of FIG. 8 as seen from above.

[0187] Referring to FIG. 9, the insulating layer 610A can elastically support the conductive pattern unit 640 constituting the image sensor substrate 600.

[0188] The insulating layer 610A may have an elastic region having a certain elastic force to move the image sensor 700 disposed on the image sensor substrate 600 in the X-axis, Y-axis, and Z-axis directions.

[0189] For this purpose, the elastic region may include an elastic extended insulating portion 614 of the insulating layer 610A. Specifically, the insulating layer 610A may have a first insulating portion 611A disposed in the center thereof. A second insulating portion 612A may be disposed around the first insulating portion 611A at a predetermined distance from the first insulating portion 611A.

[0190] The insulating layer 610A may include a first insulating portion 611A and a second insulating portion 612A, and an open region 613A may be formed between the first insulating portion 611A and the second insulating portion 612A. Preferably, the first insulating portion 611A and the second insulating portion 612A may be spaced apart from each other with the open region 613A interposed therebetween.

[0191] The extended insulating part 614 may have one end connected to the first insulating part 611A and the other end connected to the second insulating part 612A. For this purpose, the extended insulating part 614 may be configured in plurality. Preferably, the extended insulating part 614 may include first to fourth extended insulating parts 614.

[0192] The first insulating portion 611A may include a plurality of outer portions, preferably a left outer portion, a right outer portion, an upper outer portion, and a lower outer portion.

[0193] The second insulating portion 612A may include a plurality of inner portions, preferably a left inner portion, a right inner portion, an upper inner portion, and a lower inner portion.

[0194] In this case, the left outer portion of the first insulating portion 611A and the left inner portion of the second insulating portion 612A may be arranged facing each other. The right outer portion of the first insulating portion 611A and the right inner portion of the second insulating portion 612A may be arranged facing each other. The upper outer portion of the first insulating portion 611A and the upper inner portion of the second insulating portion 612A may be arranged facing each other. The lower outer portion of the first insulating portion 611A and the lower inner portion of the second insulating portion 612A may be arranged facing each other.

[0195] Here, the extended insulating portion 614 does not connect the outside of the first insulating portion and the inside of the second insulating portion that face each other, but rather allows the outside of the first insulating portion and the inside of the second insulating portion that do not face each other (or do not face each other, or are shifted or not aligned) to be connected to each other.

[0196] For example, the extended insulating part 614 may have one end connected to the left outer side of the first insulating part and the other end connected to the left inner side of the second insulating part facing the left outer side of the first insulating part, but may be connected to the upper inner side of the second insulating part. That is, the extended insulating part 614 may connect the outer side of the first insulating part and the inner side of the second insulating part that are arranged in intersecting directions, rather than connecting the outer side of the first insulating part and the inner side of the second insulating part that are arranged in parallel directions.

[0197] That is, when one end of the extended insulating part 614 is connected to the left outer part of the first insulating part, the other end can be connected to the upper inner part of the second insulating part arranged in a direction intersecting the left outer part of the first insulating part.

[0198] Therefore, the extended insulating portion 614 can be disposed in a rotated manner along the corner area on the open area 613A of the insulating layer 610A.

[0199] Additionally, the extended insulation 614 can be disposed on multiple side areas.

[0200] For example, when the extended insulating portion 614 connects between the outer portion of the first insulating portion and the inner portion of the second insulating portion facing each other, the extended insulating portion 614 may be disposed in only one of the facing side regions.

[0201] Alternatively, in this embodiment, the extended insulating part 614 connects the outer part of the first insulating part and the inner part of the second insulating part, which do not face each other, so that the extended insulating part 614 may be disposed on a side region connected to the first insulating part at one end and a side region connected to the second insulating part at the other end. That is, the extended insulating part 614 may have a structure with multiple bends and be disposed along one corner region of the open region 613A.

[0202] In conclusion, the extended insulating portion 614 may have the same shape as the extended pattern portion 649 constituting the conductive pattern portion 640 .

[0203] In other words, the first insulating portion 611A, the second insulating portion 612A, and the extended insulating portion 614 may each be formed as a separate structure. That is, the insulating layer 610A according to the embodiment may be formed by preparing the first insulating portion 611A and the second insulating portion 614 and additionally forming a structure corresponding to the extended insulating portion 614 between the first insulating portion 611A and the second insulating portion 612A.

[0204] The insulating layer 610A may have a thickness of 20 μm to 100 μm. For example, the insulating layer 610A may have a thickness of 25 μm to 50 μm. For example, the insulating layer 610A may have a thickness of 30 μm to 40 μm. If the thickness of the insulating layer 610A exceeds 100 μm, the overall thickness of the image sensor substrate 600 may increase. If the thickness of the insulating layer 610A is less than 20 μm, it may be difficult to arrange the image sensor 700. If the thickness of the insulating layer 610A is less than 20 μm, it may be vulnerable to heat / pressure during the process of mounting the image sensor, making it difficult to stably mount the image sensor 700.

[0205] Meanwhile, the length of the extended insulating portion 614 is set to be at least 1.5 times the linear distance between the first insulating portion 611A and the second insulating portion 612A. Also, the length of the extended insulating portion 614 is set to be 20 times or less the linear distance between the first insulating portion 611A and the second insulating portion 614. Preferably, the length of the extended insulating portion 614 is set to be 4 times or less the linear distance between the first insulating portion 611A and the second insulating portion 612A.

[0206] Here, the linear distance may refer to the distance between the outer and inner surfaces of the first insulating portion 611A and the second insulating portion 612A that face each other. Preferably, the linear distance may be the distance between the left outer surface of the first insulating portion 611A and the left inner surface of the second insulating portion 612A. Alternatively, the linear distance may be the distance between the right outer surface of the first insulating portion 611A and the right inner surface of the second insulating portion 612A. Alternatively, the linear distance may be the distance between the upper outer surface of the first insulating portion 611A and the upper inner surface of the second insulating portion 612A. Alternatively, the linear distance may be the distance between the lower outer surface of the first insulating portion 611A and the lower inner surface of the second insulating portion 612A.

[0207] Meanwhile, the linear distance between the first insulating portion 611A and the second insulating portion 612A may be 1.5 mm. If the length of the extended insulating portion 614 is less than 1.5 times the linear distance between the first insulating portion 611A and the second insulating portion 612A, the elasticity of the extended insulating portion 614 may be reduced, resulting in reduced mobility of the image sensor substrate 600. Furthermore, if the length of the extended insulating portion 614 is more than 20 times the linear distance between the first insulating portion 614 and the second insulating portion 612A, the image sensor 700 disposed on the insulating layer 610A may not be stably supported, resulting in problems with movement accuracy. Therefore, in this embodiment, to improve mobility, the length of the extended insulating portion 614 is set to be four times or less the linear distance between the first insulating portion 611A and the second insulating portion 612A.

[0208] Accordingly, the insulating extension 614 may be formed in the open region 613A in a spring shape with multiple bends.

[0209] Meanwhile, at least one slit (not shown) may be formed on the first insulating portion 611A of the insulating layer 610A. The slit may be formed to maintain the flatness of the insulating layer 610A. That is, the conductive pattern unit 640 and the image sensor 700 are disposed on the insulating layer 610A. The first driving unit is disposed below the insulating layer 610A. In this case, the flatness of the first driving unit and the image sensor 700 directly affects the reliability of the camera module, and as the flatness deteriorates, the image quality may deteriorate. Therefore, in this embodiment, by forming at least one slit on the insulating layer 610A, the weight of the insulating layer 610A is reduced and the flatness can be maintained, thereby improving the overall reliability of the camera module.

[0210] FIG. 10 is a plan view of the image sensor substrate of FIG.

[0211] 10, a conductive pattern unit 640 is disposed on an insulating layer 610A, and an open area is formed in the insulating layer 610A.

[0212] An elastic member having elastic force may be disposed in the open region of the insulating layer 610A. Here, the elastic member may refer to a part of the insulating layer 610A. That is, the elastic member may be formed as a part of the insulating layer 610A, that is, an extended insulating part 614 having a bent shape with multiple bends is disposed in the open region of the insulating layer 610A. The extended insulating part 614 may have a spring shape.

[0213] Meanwhile, the line width of the extended insulating portion 614 may be larger than the line width of the extended pattern portion 649. Thus, when the image sensor substrate is viewed from above, at least a portion of the extended insulating portion 614 located below the extended pattern portion 649 may be exposed.

[0214] In this case, the image sensor substrate 600 can move not only in the X-axis direction and the Y-axis direction, but also in the Z-axis direction. The elastic modulus of the extended insulating portion 614 is different from that of the extended pattern portion 649. Therefore, when the image sensor substrate 600 moves in the Z-axis direction, the movement distance of the extended insulating portion 614 may differ. This may cause the extended pattern portion 649 to come into contact with other metal components, resulting in electrical reliability problems (e.g., short circuits). Therefore, in this embodiment, the line width of the extended insulating portion 614 and the line width of the extended insulating portion 614 are made larger than the line width of the extended pattern portion 649, as described above, thereby solving the electrical reliability problem.

[0215] FIG. 11 is a diagram showing a camera device according to the third embodiment.

[0216] Referring to FIG. 11, the camera device according to the embodiment may include a lens barrel 100, a lens assembly 200, a housing 300, an infrared blocking filter unit 400, driving units 510, 520, 530, an image sensor board 600, an image sensor 700, and a flexible circuit board 800.

[0217] In this case, the camera device according to the second embodiment differs from the camera device in FIG. 2 only in the structure of the image sensor substrate 600, and the other structures are the same. Therefore, hereinafter, only the image sensor substrate 600 in the second embodiment will be described.

[0218] The image sensor substrate 600 may include an insulating layer 610A, a first bonding sheet 620, a second bonding sheet 630, a conductive pattern part 640, and a support layer 650.

[0219] At this time, the remaining configuration of the image sensor substrate 600, except for the insulating layer 610A, is substantially the same as the structure shown in FIG.

[0220] Therefore, the second bonding sheet 630 having a structure different from that of FIG. 9 will be described below.

[0221] The image sensor substrate 600 may further include a second bonding sheet 630. That is, the second bonding sheet 630 may be selectively disposed between the insulating layer 610A and the conductive pattern unit 640.

[0222] That is, a problem may occur in the adhesion between the insulating layer 610A and the conductive pattern unit 640 during movement of the image sensor 700, which may cause the conductive pattern unit 640 to be detached from the insulating layer 610A. Therefore, the second bonding sheet 630 may be further disposed between the insulating layer 610A and the conductive pattern unit 640.

[0223] Meanwhile, the second bonding sheet 630 may be disposed on the insulating layer 610 shown in Fig. 2, or alternatively, may be disposed on the insulating layer 610A shown in Fig. 9. Fig. 11 shows the shape of the second bonding sheet 630 disposed on the insulating layer 610A of Fig. 9. However, depending on the embodiment, the second bonding sheet 630 may also be disposed on the insulating layer 610 of Fig. 2. In this case, the second bonding sheet 630 may include an open area similar to the insulating layer 610, and may include a first bonding portion on a first insulating portion and a second bonding portion on a second insulating portion.

[0224] FIG. 12 is a diagram showing the second bonding sheet shown in FIG.

[0225] 12, a second bonding sheet 630 is disposed on an insulating layer 610A. At this time, the second bonding sheet 630 has a planar shape corresponding to the planar shape of the insulating layer 610A.

[0226] That is, the second bonding sheet 630 may include a first bonding portion 631 disposed on the first insulating portion 611 of the insulating layer and a second bonding portion 632 disposed on the second insulating portion 612 of the insulating layer 610A. In addition, the second bonding sheet 630 may include an open region 613 between the first bonding portion 631 and the second bonding portion 632.

[0227] The second bonding part 632 is disposed at a predetermined distance from the first bonding part 631 and surrounds the periphery of the first bonding part 631. At this time, the second bonding part 632 does not directly contact the first bonding part 631. Therefore, the first bonding part 631 and the second bonding part 632 may be separated from each other by the open region 613.

[0228] In addition, an extended bonding portion 634 connecting the first bonding portion 631 and the second bonding portion 632 is disposed on the open region 613. The extended bonding portion 634 has a shape corresponding to that of the extended insulating portion 614. The extended bonding portion 634 may be disposed in a region vertically overlapping the extended insulating portion 614. In this case, the extended bonding portion 634 may have a planar area corresponding to that of the extended insulating portion 614. Preferably, the planar area of ​​the extended bonding portion 634 may be 0.9 to 1.1 times that of the extended insulating portion 614. The extended bonding portion 634 of the second bonding sheet 630 may be formed through the same process as the extended insulating portion 614 of the insulating layer 610A. As a result, the extended bonding portion 634 may have the same shape and planar area as the extended insulating portion 614.

[0229] The second bonding sheet 630 may be formed of a double-sided adhesive film, such as an epoxy or acrylic adhesive, or a thermosetting adhesive film.

[0230] The second bonding sheet 630 may have a thickness of 25 μm.

[0231] FIG. 13 is a diagram showing a camera device according to the fourth embodiment.

[0232] Referring to FIG. 13, the camera device according to the embodiment may include a lens barrel 100, a lens assembly 200, a housing 300, an infrared blocking filter unit 400, driving units 510, 520, 530, an image sensor board 600, an image sensor 700, and a flexible circuit board 800.

[0233] In this case, the camera device according to the second embodiment differs from the camera device in FIG. 2 only in the structure of the image sensor substrate 600, and the other structures are the same. Therefore, hereinafter, only the image sensor substrate 600 in the second embodiment will be described.

[0234] The image sensor substrate 600 may include an insulating layer 610 , a first bonding sheet 620 , a conductive pattern part 640 and a support layer 650 .

[0235] In this case, the image sensor substrate 600 may further include a spring plate 660 between the insulating layer 610 and the support layer 650. Here, the remaining configurations except for the spring plate 660 have already been described in the previous embodiment, so detailed description thereof will be omitted.

[0236] The spring plate 660 supports the insulating layer 610 and the conductive pattern unit 640 constituting the image sensor substrate 600, and can move the image sensor 700 disposed on the image sensor substrate 600 in the X-axis, Y-axis, and Z-axis directions. To this end, the spring plate 660 may include at least one elastic member. Preferably, the spring plate 660 may include a plurality of elastic members. For example, the spring plate 660 may include four elastic members.

[0237] The spring plate 660 may be made of a metal material such as, but not limited to, stainless steel (STS) or invar. For example, the spring plate 660 may be made of other metal materials having elastic spring properties in addition to the above materials. That is, the spring plate 660 may have a certain elasticity, thereby elastically supporting the image sensor substrate 600 and allowing the image sensor substrate 600 to move in the X-axis, Y-axis, and Z-axis directions.

[0238] An insulating layer 610 is disposed on the spring plate 660. At this time, a first bonding sheet 620 may be disposed between the spring plate 660 and the insulating layer 610. The first bonding sheet 620 may be disposed between the spring plate 660 and the insulating layer 610 to provide adhesive force. That is, the first bonding sheet 620 may fix the insulating layer 610 on the spring plate 660. To this end, the first bonding sheet 620 may be formed of a double-sided adhesive film. The first bonding sheet 620 may be made of an epoxy or acrylic adhesive.

[0239] FIG. 14 is a view showing the spring plate shown in FIG.

[0240] Referring to FIG. 14, the spring plate 660 can elastically support the insulating layer 610 and the conductive pattern unit 640 that constitute the image sensor substrate 600 .

[0241] The spring plate 660 can move the image sensor 700 arranged on the image sensor substrate 600 in the X-axis, Y-axis and Z-axis directions.

[0242] For this purpose, the spring plate 660 may be made of a resilient material. Specifically, the spring plate 660 may include a plurality of resilient members. For example, the spring plate 660 may include four resilient members 664, 665, 666, and 667.

[0243] The spring plate 660 may be made of a metal material such as, but not limited to, stainless steel (STS) or invar. For example, the spring plate 660 may be made of other metal materials having elastic spring properties in addition to the above materials. That is, the spring plate 660 may have a certain elasticity, thereby elastically supporting the image sensor substrate 600 and allowing the image sensor substrate 600 to move in the X-axis, Y-axis, and Z-axis directions.

[0244] The spring plate 660 may include a first plate portion 661, a second plate portion 662 and elastic members 664, 665, 666, and 667.

[0245] Specifically, the spring plate 660 may have a first plate portion 661 disposed at the center thereof, and a second plate portion 662 disposed around the first plate portion 661 at a predetermined distance from the first plate portion 661.

[0246] That is, the spring plate 660 may include a first plate portion 661 and a second plate portion 662, and an open region 663 may be formed between the first plate portion 661 and the second plate portion 662. Preferably, the first plate portion 661 and the second plate portion 662 may be separated from each other.

[0247] The elastic members 664, 665, 666, and 667 may have one end connected to the first plate portion 661 and the other end connected to the second plate portion 662. To this end, the elastic members 664, 665, 666, and 667 may include a first elastic member 664, a second elastic member 665, a third elastic member 666, and a fourth elastic member 667.

[0248] The first elastic member 664 may connect a first corner region of the first plate portion 661 and a first corner region of the second plate portion 662. One end of the first elastic member 664 may be connected to the first corner region of the first plate portion 661, and the other end may be connected to the first corner region of the second plate portion 662, thereby elastically connecting them. The first corner region may be a corner portion located at the upper left end of each plate.

[0249] The second elastic member 665 may connect a second corner region of the first plate portion 661 and a second corner region of the second plate portion 662. One end of the second elastic member 665 may be connected to the second corner region of the first plate portion 661, and the other end may be connected to the second corner region of the second plate portion 662, thereby elastically connecting them. The second corner region may be a corner portion located at the upper right end of each plate.

[0250] The third elastic member 666 may connect a third corner region of the first plate portion 661 to a third corner region of the second plate portion 662. One end of the third elastic member 666 is connected to the third corner region of the first plate portion 661, and the other end is connected to the third corner region of the second plate portion 662, thereby elastically connecting them. The third corner region may be a corner portion located at the lower left end of each plate.

[0251] The fourth elastic member 667 may connect a fourth corner region of the first plate portion 661 to a fourth corner region of the second plate portion 662. One end of the fourth elastic member 667 may be connected to the fourth corner region of the first plate portion 661, and the other end may be connected to the fourth corner region of the second plate portion 662, thereby elastically connecting them. The fourth corner region may be a corner portion located at the lower right end of each plate.

[0252] Meanwhile, although the first plate portion 661, the second plate portion 662, and the elastic members 664, 665, 666, and 667 are shown as being separately configured, this is not limiting. That is, the first plate portion 661, the second plate portion 662, and the elastic members 664, 665, 666, and 667 may be integrally formed with one another. That is, the spring plate 660 may have an open region 663 formed in the remaining portion of the plate-shaped member excluding the portions corresponding to the elastic members 664, 665, 666, and 667.

[0253] Such spring plate 660 may have a thickness of 10 μm to 100 μm. For example, spring plate 660 may have a thickness of 20 μm to 70 μm. For example, spring plate 660 may have a thickness of 40 μm to 50 μm. If the thickness of spring plate 660 exceeds 100 μm, the thickness of image sensor substrate 600 may increase. Also, if the thickness of spring plate 660 is less than 10 μm, it may not be possible to sufficiently withstand the stress generated when image sensor substrate 600 moves. Preferably, spring plate 660 has a thickness of 50 μm±10 μm so as to be able to withstand a stress of 600 MPa or more.

[0254] In addition, the elastic members 664, 665, 666, and 667 have lengths greater than a certain level. If the elastic members 664, 665, 666, and 667 are too long, the volume of the spring plate 660 increases, while if the elastic members 664, 665, 666, and 667 are too short, they may not be able to stably and elastically support the image sensor substrate 600. Therefore, the elastic members 664, 665, 666, and 667 have lengths of 50 μm to 100 μm. In this case, the lengths of the elastic members 664, 665, 666, and 667 are greater than the width of the open region 663. That is, the elastic members 664, 665, 666, and 667 may be formed in the open region 663 in the shape of a spring with multiple bends.

[0255] In addition, a plurality of slits 668 are formed in the first plate portion 661. The slits 668 may be spaced apart from one another on the first plate portion 661. The slits 668 may be formed to reduce the weight of the spring plate 660. The slits 668 may also be formed to improve the flatness of the spring plate 660. That is, the insulating layer 610, the conductive pattern portion 640, and the image sensor 700 are disposed on the first plate portion 661. The first driving unit 660 is disposed below the first plate portion 661. The flatness of the first driving unit and the image sensor 700 directly affects the reliability of the camera module, and poor flatness can lead to poor image quality. Therefore, in this embodiment, the slits 668 are formed in the first plate portion 661 to not only reduce the weight of the spring plate 660 but also maintain its flatness, thereby improving the overall reliability of the camera module.

[0256] FIG. 15 shows an attachment structure of an image sensor on an image sensor substrate according to another embodiment.

[0257] Referring to FIG. 15, the image sensor may be attached to an image sensor substrate 600 by flip-chip bonding.

[0258] That is, in the previous embodiment, the image sensor is attached on the insulating layer 610, and then the first conductive pattern portions 641, 642, 643, and 644 are connected to the electrodes 710 of the image sensor 700 by wire bonding via a connecting member.

[0259] Alternatively, the image sensor may be mounted on a package substrate, and thus may be mounted on the image sensor substrate 600 on the insulating layer 610 by flip-chip bonding.

[0260] A package substrate 900 for this purpose may include an insulating layer 910 , a circuit pattern 920 , a via 930 , an image sensor 940 , a connecting member 950 , a protective member 960 and an adhesive member 970 .

[0261] The image sensor 940 may be electrically connected to the circuit patterns 920 disposed on the upper and lower surfaces of the insulating layer 910 via the connecting members 950. The vias 930 may electrically connect the circuit patterns 920 disposed on the upper and lower surfaces of the insulating layer 910 to each other.

[0262] The protective member 960 may be disposed on the lower surface of the insulating layer 910 to protect the lower surface of the insulating layer 910 while exposing at least a portion of the circuit pattern 920. An adhesive member 970 may be disposed on the circuit pattern exposed through the protective member 960. The adhesive member 970 may be a solder ball. The adhesive member 970 may include a material having a different component from the solder. The solder may be made of at least one of SnCu, SnPb, and SnAgCu. The material having a different component may include any one of Al, Sb, Bi, Cu, Ni, In, Pb, Ag, Sn, Zn, Ga, Cd, and Fe.

[0263] Meanwhile, when the package substrate 900 is manufactured as described above, the adhesive member 970 may be connected onto the first conductive pattern portions 641, 642, 643, and 644.

[0264] Meanwhile, the characteristics of the driving units 510, 520, and 530 for moving the image sensor substrate in this embodiment are as shown in Table 1 below.

[0265] [Table 1]

[0266] The force (mN) refers to the force of the actuators 510, 520, and 530. The force (mN) for driving the image sensor (substrate) is set to 10 mN or less, and the image sensor substrate can move in the X and Y axes even with a force of 10 mN or less. In other words, the image sensor substrate can be moved with even a small force, thereby improving the reaction speed (or response speed) of the image sensor substrate. The displacement (mm) refers to a value set when attempting to shift the image sensor substrate by approximately 100 μm. In other words, a force of 4.5 mm may be required in the X axis and 8.5 mm in the Y axis to provide a displacement of approximately 100 μm. Meanwhile, the spring constant of the spring structure formed by the extension pattern portion 649 in this embodiment indicates force / displacement, with the spring constant for the X axis being approximately 38.79 mN / mm and the spring constant for the Y axis being 85.85 mN / mm.

[0267] According to the embodiment, to realize the OIS and AF functions of the camera module, instead of moving the lens barrel as in the conventional case, the image sensor is moved relative to the lens barrel in the X-axis, Y-axis, and Z-axis directions. As a result, the camera module according to the embodiment can eliminate the complex spring structure required to realize the OIS and AF functions, thereby simplifying the structure. Furthermore, by moving the image sensor according to the embodiment relative to the lens barrel, a more stable structure can be formed compared to the conventional case.

[0268] In addition, according to the embodiment, the extension pattern portion electrically connecting the image sensor and the flexible circuit board has a spring structure and is disposed floating on the insulating layer. At this time, the extension pattern portion serves as a circuit for transmitting signals between the image sensor and the flexible circuit board and as a spring for moving the image sensor in the X-axis, Y-axis, and Z-axis. As a result, the camera module according to the embodiment can eliminate structures such as spring plates required for moving the image sensor, and can simplify the manufacturing process by eliminating processes related to the spring plates.

[0269] In addition, in the embodiment, the extension pattern portion that functions as a spring is arranged to connect the first lead pattern portion and the second lead pattern portion arranged in a region that intersects with the region where the first lead pattern portion is arranged, rather than connecting the first lead pattern portion and the second lead pattern portion arranged in a region facing the region where the first lead pattern portion is arranged. As a result, the extension pattern portion in the embodiment has a configuration in which it is rotated in the tilt direction of the image sensor. As a result, in the embodiment, the extension pattern portion can be used to stably perform the tilt operation of the image sensor.

[0270] In addition, in the embodiment, the extension pattern portion is disposed on an insulating layer, and the insulating layer is disposed with an extended insulating portion having a shape corresponding to the extension pattern portion in a region vertically overlapping the extension pattern portion, thereby enabling the camera module to more stably elastically support the image sensor and move the image sensor relative to the lens barrel.

[0271] In addition, the length of the extension pattern portion in the embodiment is at least 1.5 to 20 times the linear distance between the first lead pattern portion and the second lead pattern portion facing each other, thereby improving the mobility of the image sensor substrate and minimizing noise generation.

[0272] The features, structures, effects, etc. described in the above embodiments are included in at least one embodiment and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc. exemplified in each embodiment can be combined or modified in other embodiments by a person skilled in the art to which the embodiment belongs. Therefore, content related to such combinations and modifications should be interpreted as being included in the scope of the embodiments.

[0273] The above description focuses on the embodiments, but these are merely illustrative and do not limit the embodiments. Those skilled in the art will understand that various modifications and applications not exemplified above are possible within the scope of the essential characteristics of the embodiments. For example, each component specifically illustrated in the embodiments can be modified and implemented. Differences related to such modifications and applications should be construed as being included within the scope of the embodiments defined in the appended claims.

Claims

1. a plate having an elastic force; an insulating layer disposed on the plate; a conductive pattern portion disposed on the insulating layer, The insulating layer is a first insulating portion and a second insulating portion spaced apart from each other with a first open region therebetween; an extended insulating portion disposed in the first open area and connecting an outer surface of the first insulating portion and an inner surface of the second insulating portion, The plate is a first plate portion disposed below the first insulating portion; a second plate portion disposed below the second insulating portion and spaced apart from the first plate portion across a second open region; a connecting plate portion provided in the second open area and connecting the first plate portion and the second plate portion, The conductive pattern portion is a first conductive pattern portion disposed on the first insulating portion; a second conductive pattern portion disposed on the second insulating portion; an extended pattern portion disposed on the extended insulating portion, The extended insulating portion is an overlapping region overlapping the connecting plate portion of the plate along a thickness direction of the insulating layer; a non-overlapping region that does not overlap with the first plate portion, the second plate portion, and the connecting plate portion of the plate along the thickness direction.

2. The first open area and the second open area overlap each other along the thickness direction, The image sensor substrate according to claim 1 , wherein the non-overlapping region of the extended insulating portion does not overlap the connecting plate portion along the thickness direction.

3. An image sensor substrate as described in Claim 2, wherein at least a portion of the non-overlapping region of the extended insulating portion does not overlap with the extended pattern portion along the thickness direction.

4. The image sensor substrate according to claim 3 , wherein at least a portion of the overlapping region of the extended insulating portion overlaps with the extended pattern portion along the thickness direction.

5. 5. The image sensor substrate according to claim 3, wherein the width of the extended insulating portion is greater than the width of the connecting plate portion.

6. The image sensor substrate according to claim 3 , wherein the width of the extended insulating portion is greater than the width of the extended pattern portion.

7. The image sensor substrate according to claim 3 , wherein the connecting plate portion connects an outer surface of the first plate portion and an inner surface of the second plate portion that do not face each other within the second open area.

8. an image sensor disposed on the first insulating portion; The image sensor substrate according to claim 3 , wherein the thickness direction is a direction of an optical axis of the image sensor.

9. The image sensor substrate of claim 8 , wherein the first plate portion includes a through-hole that penetrates an upper surface of the first plate portion and a lower surface opposite the upper surface.

10. The image sensor substrate according to claim 9 , wherein the through-hole overlaps at least a portion of the image sensor along the thickness direction.

11. the second open region includes a plurality of corner regions adjacent to different corner regions of the first plate portion, The image sensor substrate of claim 3 , wherein the connecting plate portion includes a plurality of connecting plate portions each having a bent portion at a different corner area of ​​the second open area.

12. the second open area includes first to fourth corner areas, The connecting plate portion is a first connecting plate portion having a bent portion in the first corner region; a second connecting plate portion having a bent portion in the second corner region; a third connecting plate portion having a bent portion in the third corner region; The image sensor substrate according to claim 3 , further comprising: a fourth connecting plate portion having a bent portion in the fourth corner region.

13. one end of each of the first and second connecting plate portions is connected to a first outer surface of the first plate portion, the first outer surface being the same as the first outer surface of the first plate portion; the other end of the first connecting plate portion is connected to a first inner surface of the second plate portion that does not face the first outer surface, The image sensor substrate of claim 12 , wherein the other end of the second connecting plate portion does not face the first outer surface and is connected to a second inner surface of the second plate portion that is different from the first inner surface.

14. one end of each of the third and fourth connecting plate portions is connected to a second outer surface of the plurality of outer surfaces of the first plate portion, the second outer surface being different from the first outer surface; the other end of the third connecting plate portion is connected to the first inner surface of the second plate portion, The image sensor substrate of claim 13 , wherein the other end of the fourth connecting plate portion is connected to the second inner surface of the second plate portion.

15. The connecting plate portion and the extension pattern portion are each provided in a plurality of pieces spaced apart from each other in a horizontal direction, The image sensor substrate of claim 3 , wherein at least two of the plurality of extension pattern portions overlap a single connecting plate portion in the thickness direction.

16. The substrate for an image sensor according to claim 3 , wherein a thickness of the extension pattern portion is different from at least one of a thickness of the first conductive pattern portion and a thickness of the second conductive pattern portion.

17. The substrate for an image sensor of claim 3 , wherein a thickness of the extension pattern portion is greater than at least one of a thickness of the first conductive pattern portion and a thickness of the second conductive pattern portion.

18. The image sensor substrate according to claim 3 , wherein at least a portion of the extension pattern portion overlaps with the insulating layer along a horizontal direction perpendicular to the thickness direction.

19. a driving portion overlapping the plate along the thickness direction, The image sensor substrate according to claim 2 , wherein the driving section includes at least one of a coil and a magnet.

20. The image sensor substrate of claim 2 , wherein the first plate portion, the second plate portion, and the connecting plate portion include a metal material.

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