Dividing device and method for manufacturing chips

Abstract

To provide a dividing device with which it is possible to reliably divide a wafer at scheduled dividing lines.SOLUTION: A second camera for forming a second image that is used in determining whether or not a wafer is divided at a first scheduled dividing line is provided in a dividing device. In other words, with this dividing device it is possible to confirm, on the basis of the second image, whether or not the wafer is divided at the first scheduled dividing line. For this reason, with this dividing device, even when a portion of the wafer remains at the first scheduled dividing line and the wafer is not divided, it is possible to re-actuate a dividing unit so as to divide the wafer at the first scheduled dividing line. As a result, with this dividing device it is possible to reliably divide the wafer at the first scheduled dividing line.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a dividing device that divides a wafer, in which dividing starting points are formed along a plurality of dividing lines set in a grid pattern and one of the first and second surfaces is attached to the central region of a support member having an annular frame attached to its outer peripheral region, along any of the plurality of dividing lines. [Background technology]

[0002] Chips for devices such as integrated circuits (ICs) are essential components in various electronic devices such as mobile phones and personal computers. Such chips are manufactured, for example, by dividing a wafer on which multiple devices are formed at the boundaries between the multiple devices.

[0003] In this wafer, the boundaries of the multiple devices are often set in a grid pattern, and each of the multiple straight lines included in the boundaries is also called a dividing line. The wafer is divided, for example, by forming a dividing start point on the wafer along each of the multiple dividing lines, and then applying force to the wafer to cause a crack to extend from the dividing start point along the thickness direction of the wafer.

[0004] Examples of such a dividing starting point include a modified portion formed inside the wafer by irradiating the wafer with a laser beam having a wavelength that transmits through the wafer, or a groove formed on the front or back surface of the wafer by removing part of the wafer.

[0005] Furthermore, as a method of applying force to a wafer on which division starting points are formed, a method of expanding a support member (heat-shrinkable adhesive tape) attached to the wafer along the diameter of the wafer is known (see, for example, Patent Document 1). However, in this method, because force is applied to the entire wafer, there is a risk that the wafer will not be divided along some of the multiple planned division lines.

[0006] In view of this, a method also known as two-point bending (see, for example, Patent Document 2) and a method also known as three-point bending (see, for example, Patent Document 3) have been proposed as methods for dividing a wafer by applying force locally to a specific intended dividing line. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-123658 [Patent Document 2] Japanese Patent Application Publication No. 2019-71390 [Patent Document 3] Japanese Patent Application Laid-Open No. 2013-38434 Summary of the Invention [Problem to be solved by the invention]

[0008] In short, two-point bending is a method of dividing a wafer by holding one of a pair of regions separated by a dividing line while pressing the other, while three-point bending is a method of supporting each of a pair of regions separated by a dividing line while pressing the region overlapping the dividing line.

[0009] When a wafer is divided by two-point bending or three-point bending, the wafer is bent along the division line. However, when the wafer is bent, cracks tend to propagate from the division starting point formed on the wafer toward the surface where tensile stress occurs, while cracks tend not to propagate toward the surface where compressive stress occurs.

[0010] Specifically, when two-point bending is performed on a wafer, cracks from the splitting origin formed on the wafer tend to propagate toward the pressed surface, while cracks from the splitting origin formed on the wafer tend not to propagate toward the opposite surface. On the other hand, when three-point bending is performed on a wafer, cracks from the splitting origin formed on the wafer tend not to propagate toward the pressed surface, while cracks from the splitting origin formed on the wafer tend to propagate toward the opposite surface.

[0011] Therefore, even if two-point bending or three-point bending is performed on the wafer, there is a risk that the crack will not propagate from the dividing starting point so as to penetrate the wafer, and the wafer will not be divided. In view of this, an object of the present invention is to provide a dividing device that can reliably divide the wafer along the planned dividing line. [Means for solving the problem]

[0012] The present invention One aspect of According to the present invention, the division starting points are formed along a plurality of division lines set in a grid pattern, and the first division starting point is formed in the central region of the support member having the annular frame attached to the outer peripheral region. The face a dividing device for dividing an attached wafer along any of the plurality of planned dividing lines, the dividing device comprising: a holding table for holding the frame on a holding surface having an opening formed in the center; and a first camera for forming a first image used to identify the positions of the plurality of planned dividing lines by capturing an image of the wafer from the first surface side while the frame is held on the holding surface; , applicable No. 2 Face side The present invention provides a dividing device comprising: a dividing unit having a pressing portion that divides the wafer at a first planned dividing line, which is one of the plurality of planned dividing lines, by pressing the vicinity of the first planned dividing line; and a second camera that forms a second image used to determine whether the wafer has been divided at the first planned dividing line by imaging the wafer from the second surface side while the frame is held on the holding surface. Preferably, the dividing device further includes a control unit that controls the first camera, the dividing unit, and the second camera, and the control unit has a judgment section that judges whether the wafer has been divided along the first planned dividing line based on the second image formed by imaging with the second camera after operating the dividing unit to divide the wafer along the first planned dividing line, and a drive section that operates the dividing unit again to divide the wafer along the first planned dividing line when the judgment section determines that the wafer has not been divided along the first planned dividing line. In addition, in this dividing apparatus, it is preferable that the dividing unit has a holding part that holds the wafer from both the first surface and the second surface, the holding part holds a held area that does not overlap the first dividing line and is located between the first dividing line and a second dividing line adjacent to the first dividing line, and the pressing part presses a pressed area that does not overlap the first dividing line and is located between the first dividing line and a third dividing line adjacent to the first dividing line on the opposite side of the first dividing line from the second dividing line. Alternatively, in this dividing apparatus, it is preferable that the pressing part presses the pressed area that overlaps the first dividing line. Furthermore, it is preferable that the dividing apparatus further includes a film positioning unit, and the film positioning unit has a supply part that supplies a film between the pressing part and the wafer, and a recovery part that recovers the film.

[0013] Book of the invention According to another aspect , a dividing device for dividing a wafer, along any of a plurality of planned dividing lines, the wafer having one of a first surface and a second surface affixed to a central region of a support member having a ring-shaped frame affixed to an outer peripheral region thereof, along the plurality of planned dividing lines, the dividing device comprising: a holding table for holding the frame on a holding surface having an opening formed in the center; a first camera for forming a first image used to identify the positions of the plurality of planned dividing lines by imaging the wafer from the first surface side with the frame held on the holding surface; a dividing unit having a pressing part for pressing a vicinity of a first planned dividing line, which is one of the plurality of planned dividing lines, from the other surface side of the first surface and the second surface, to divide the wafer along the first planned dividing line; and a second camera for forming a second image used to determine whether the wafer has been divided along the first planned dividing line by imaging the wafer from the second surface side with the frame held on the holding surface. a control unit for controlling the first camera, the split unit, and the second camera; and, The control unit has a determination section that determines whether or not the wafer has been divided along the first planned dividing line based on the second image formed by imaging with the second camera after operating the dividing unit to divide the wafer along the first planned dividing line, and a drive section that operates the dividing unit again to divide the wafer along the first planned dividing line when the determination section determines that the wafer has not been divided along the first planned dividing line. A dividing device is provided . In this dividing device, it is preferable that the dividing unit has a holding part that holds the wafer from both the first and second sides, the holding part holds a held area that does not overlap the first dividing line and is located between the first dividing line and a second dividing line adjacent to the first dividing line, and the pressing part presses a pressed area that does not overlap the first dividing line and is located between the first dividing line and a third dividing line adjacent to the first dividing line on the opposite side of the second dividing line as seen from the first dividing line. In this case, it is more preferable that the second side is attached to the support member, and the pressing part presses the pressed area from the first side of the wafer. Alternatively, in this dividing device, it is preferable that the pressing part presses the pressed area that overlaps the first dividing line. In this case, it is more preferable that the first surface is attached to the support member, and the pressing unit presses the pressed area from the second surface side of the wafer. Furthermore, it is preferable that the dividing device further includes a film positioning unit, and the film positioning unit has a supply unit that supplies a film between the pressing unit and the wafer, and a recovery unit that recovers the film.

[0015] Book of the invention According to yet another aspect , a dividing device for dividing a wafer, the wafer having one of a first surface and a second surface affixed to a central region of a support member having a ring-shaped frame affixed to an outer peripheral region thereof, along any of the plurality of planned dividing lines, the dividing device comprising: a holding table for holding the frame on a holding surface having an opening formed in the center; a first camera for forming a first image used to identify the positions of the plurality of planned dividing lines by imaging the wafer from the first surface side with the frame held on the holding surface; a dividing unit having a pressing part for pressing a vicinity of a first planned dividing line, which is one of the plurality of planned dividing lines, from the other surface side of the first surface and the second surface, to divide the wafer along the first planned dividing line; and a second camera for forming a second image used to determine whether the wafer has been divided along the first planned dividing line by imaging the wafer from the second surface side with the frame held on the holding surface, It is preferable that the pressing portion presses the pressing region that overlaps the first planned dividing line. In this case, the first surface is attached to the support member, and the pressing portion presses the pressing region from the second surface side of the wafer. A dividing device is provided . In this dividing device, it is more preferable that the first surface is attached to the support member, and the pressing unit presses the pressed area from the second surface side of the wafer. Furthermore, it is preferable that the dividing device further includes a film positioning unit, and the film positioning unit has a supply unit that supplies a film between the pressing unit and the wafer, and a recovery unit that recovers the film.

[0016] Book of the invention According to yet another aspect , A method for manufacturing chips by dividing a wafer, in which division starting points are formed along a plurality of planned dividing lines that are set in a grid pattern and one of a first surface and a second surface is attached to a central region of a support member having an annular frame attached to an outer peripheral region, along each of the plurality of planned dividing lines, the method comprising: holding the frame on a holding surface having an opening formed in the center; after holding the frame on the holding surface, taking an image of the wafer from the first surface side to form a first image used to identify the positions of the plurality of planned dividing lines; and, after forming the first image, bringing a film into contact with the other of the first surface and the second surface of the wafer. and after bringing the film into contact with the other surface, pressing a vicinity of a first planned division line, which is one of the plurality of planned division lines, through the film from the other surface side to extend a crack along the thickness direction of the wafer from a division starting point formed along the first planned division line; after the crack has extended, separating the film from the other surface; and after separating the film from the other surface, taking an image of the wafer from the second surface side while the frame is held on the holding surface, thereby forming a second image used to determine whether the wafer has been divided along the first planned division line. . [Effects of the Invention]

[0017] The dividing device of the present invention is provided with a second camera that forms a second image used to determine whether the wafer has been divided along the first planned dividing line. That is, in this dividing device, it is possible to confirm whether the wafer has been divided along the first planned dividing line based on the second image.

[0018] Therefore, in this dividing apparatus, even if a portion of the wafer remains on the first dividing line and the wafer is not divided, the dividing unit can be operated again to divide the wafer on the first dividing line. As a result, in this dividing apparatus, the wafer can be reliably divided on the first dividing line. [Brief explanation of the drawings]

[0019] [Figure 1] FIG. 1 is a perspective view schematically illustrating an example of a frame unit including a wafer. [Figure 2] FIG. 2 is a partial cross-sectional front view schematically showing an example of a dividing device that divides a wafer along any of a plurality of planned dividing lines. [Figure 3] FIG. 3 is a functional block diagram illustrating an example of a control unit built into the dividing device. [Figure 4] Each of Fig. 4(A) to Fig. 4(C) is a partial cross-sectional front view schematically showing how a wafer included in a frame unit is divided along first planned division lines in the dividing device. [Figure 5] FIG. 5 is a partial cross-sectional front view schematically showing another example of a dividing apparatus for dividing a wafer along any of a plurality of planned dividing lines. DETAILED DESCRIPTION OF THE INVENTION

[0020] An embodiment of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a perspective view showing a frame unit. The frame unit 11 shown in Fig. 1 includes a wafer 13. The wafer 13 is made of a single-crystal semiconductor material such as silicon (Si), silicon carbide (SiC), or gallium nitride (GaN).

[0021] In addition, a notch 15 is formed on the outer edge of the wafer 13 to indicate a specific crystal orientation of the single crystal semiconductor that constitutes the wafer 13. In addition, an impurity region doped with impurities is provided on a portion of the front surface (first surface) 13a side of the wafer 13.

[0022] Furthermore, the wafer 13 is divided into a plurality of regions by a plurality of planned dividing lines 17a each extending along the same direction and a plurality of planned dividing lines 17b each extending along a direction perpendicular to each of the plurality of planned dividing lines 17a.

[0023] A device 19 is formed in each of the plurality of regions. The device 19 includes a part of the front surface 13a of the wafer 13 (an intrinsic semiconductor region and an impurity region where no impurities exist) and a stack of various insulating films and conductive films formed on the front surface 13a of the wafer 13.

[0024] Note that a similar stack is not formed in regions of the surface 13a of the wafer 13 that overlap with the plurality of planned dividing lines 17a, 17b. Therefore, the surface 13a of the wafer 13 has an uneven shape. That is, in the wafer 13, the regions where the devices 19 are to be formed are convex portions, and the regions that overlap with the plurality of planned dividing lines 17a, 17b are concave portions.

[0025] Furthermore, there are no limitations on the material, shape, structure, size, etc. of the wafer 13. The wafer 13 may be made of materials such as ceramics, resin, and metal. Furthermore, the wafer 13 may not have an impurity region. Furthermore, the outer edge of the wafer 13 may be formed with a flat portion, a so-called orientation flat, to indicate a specific crystal orientation instead of a notch.

[0026] A central region of a disk-shaped support member 21 having a diameter greater than that of the wafer 13 is attached to the back surface (second surface) 13b of the wafer 13. The support member 21 has, for example, a flexible film-like base layer and an adhesive layer (glue layer) provided on one surface of the base layer (the surface facing the wafer 13). The base layer and the adhesive layer are each made of a material that transmits visible light.

[0027] Specifically, the base layer is made of polyolefin (PO), polypropylene (PP), polyethylene terephthalate (PET), polyvinyl chloride (PVC), polystyrene (PS), etc. The adhesive layer is made of ultraviolet-curing silicone rubber, acrylic material, epoxy material, etc.

[0028] Alternatively, the support member 21 may be configured only by the above-mentioned base layer. In this case, the back surface 13b of the wafer 13 is attached to the central region of the support member 21 (base layer) by, for example, thermocompression bonding.

[0029] Additionally, an annular frame 23 having a circular opening 23a with a diameter larger than that of the wafer 13 is attached to the outer periphery of the support member 21. The frame 23 is made of, for example, a ferromagnetic metal material.

[0030] 2 is a partial cross-sectional front view schematically showing an example of a dividing device that divides the wafer 13 included in the frame unit 11 along any one of a plurality of planned dividing lines 17a, 17b. In short, in FIG. 2, the structure of the components of the dividing device that are directly related to the frame unit 11 is shown schematically, and the other components of the dividing device are shown in blocks.

[0031] Note that the X-axis direction (front-back direction) and the Y-axis direction (left-right direction) shown in FIG. 2 are directions perpendicular to each other on a horizontal plane, and the Z-axis direction (up-down direction, height direction) is a direction (vertical direction) perpendicular to the X-axis and Y-axis directions.

[0032] 2 has a flat X-axis moving table 4. A cylindrical or prismatic opening 4a is formed in the center of this X-axis moving table 4. The opening 4a is longer than the diameter of the wafer 13 and shorter than the width of the frame 23. A holding table 6 is provided above the X-axis moving table 4, and has an opening 6a formed therein that is approximately the same size as the opening 4a.

[0033] The holding table 6 is connected to the X-axis moving table 4 in a manner that allows it to rotate around its circumference. A permanent magnet is built into the upper part of the holding table 6. Therefore, when the frame 23 of the frame unit 11 is placed on the upper surface (holding surface) of the holding table 6, the frame 23 is attracted to and held by the permanent magnet.

[0034] Furthermore, the X-axis moving table 4 is connected to an X-axis moving mechanism 8 that moves the X-axis moving table 4 and the holding table 6 along the X-axis direction. This X-axis moving mechanism 8 includes, for example, a ball screw.

[0035] The ball screw included in the X-axis movement mechanism 8 has, for example, a screw shaft extending along the X-axis direction, balls that roll on the surface of the screw shaft as the screw shaft rotates, and a nut that houses the balls and moves along the screw shaft as the balls circulate inside as the screw shaft rotates.

[0036] The X-axis movement mechanism 8 includes a motor connected to one end of the screw shaft and a pair of X-axis guide rails that sandwich the screw shaft and extend along the X-axis direction. The lower part of the X-axis movement table 4 is fixed to a nut and slidably connected to the upper part of the pair of X-axis guide rails.

[0037] Therefore, when the motor included in the X-axis movement mechanism 8 is operated to rotate the screw shaft, the holding table 6 moves along the pair of X-axis guide rails together with the X-axis movement table 4 fixed to the nut. In other words, when the motor included in the X-axis movement mechanism 8 is operated, the X-axis movement table 4 and holding table 6 move along the X-axis direction.

[0038] The holding table 6 is connected to a rotation mechanism 10 that rotates the holding table 6 around a rotation axis that passes through the center of the opening 6a and is aligned along the Z-axis direction. The rotation mechanism 10 includes, for example, a gear having teeth that mate with teeth formed on the outer surface of the holding table 6. Therefore, when the gear included in the rotation mechanism 10 is rotated, the holding table 6 rotates.

[0039] Furthermore, the dividing device 2 has a dividing unit that divides the wafer 13 included in the frame unit 11 in which the frame 23 is held on the holding surface of the holding table 6. This dividing unit includes a pressing unit 12 and an upper surface holding unit 14 that are arranged above the X-axis moving table 4 and the holding table 6, and a lower surface holding unit 16 that is arranged below them.

[0040] The pressing portion 12 is a structure that extends along the Y-axis direction and whose width (length along the X-axis direction) gradually narrows toward its tip (lower end). The upper surface side holding portion 14 is a rectangular parallelepiped structure that extends along the Y-axis direction and has a lower surface that is parallel to the X-axis and Y-axis directions.

[0041] Moreover, an air cylinder 18 having a piston rod movable along the Z-axis direction is provided above the upper surface side holding part 14, and the upper part of the upper surface side holding part 14 is fixed to the tip (lower end) of this piston rod. Therefore, when this air cylinder 18 is operated, the upper surface side holding part 14 moves up and down.

[0042] Furthermore, the pressing unit 12 is connected to an elevating mechanism 20 that includes, for example, a support plate having a surface parallel to the Z-axis direction and a ball screw arranged on the surface of this support plate. The ball screw included in this elevating mechanism 20 has, for example, a screw shaft extending along the Z-axis direction, balls that roll on the surface of the screw shaft as the screw shaft rotates, and a nut that houses the balls and moves along the screw shaft as the balls circulate inside as the screw shaft rotates.

[0043] The lifting mechanism 20 also includes a motor connected to one end of the screw shaft, a pair of Z-axis guide rails each extending along the Z-axis direction and fixed to the surface of the support plate so as to sandwich the screw shaft therebetween, and a Z-axis slider fixed to a nut and connected to the pair of Z-axis guide rails in a slidable manner.

[0044] The upper part of pressing unit 12 is fixed to the Z-axis slider of lifting mechanism 20. Therefore, when the motor included in lifting mechanism 20 is operated to rotate the screw shaft, pressing unit 12 moves along the pair of Z-axis guide rails together with the Z-axis slider fixed to the nut. In other words, when the motor included in lifting mechanism 20 is operated, pressing unit 12 moves up and down.

[0045] Incidentally, when the lifting mechanism 20 is configured to include a ball screw, a motor, etc., this is preferable compared to when the lifting mechanism 20 is configured to include an air cylinder, in that it allows for more accurate adjustment of the position (height) of the pressing part 12. Furthermore, the lifting mechanism 20 is connected to an X-axis moving mechanism 22 that includes, for example, a support plate having a lower surface parallel to the X-axis direction and the Y-axis direction, and a ball screw arranged on the lower surface of this support plate.

[0046] The ball screw included in this X-axis movement mechanism 22 has, for example, a screw shaft extending along the X-axis direction, balls that roll on the surface of the screw shaft as the screw shaft rotates, and a nut that houses the balls and moves along the screw shaft as the balls circulate inside as the screw shaft rotates.

[0047] The X-axis moving mechanism 22 also includes a motor connected to one end of the screw shaft, a pair of X-axis guide rails that sandwich the screw shaft and each extend along the X-axis direction, and an X-axis slider that is fixed to a nut and connected to the pair of X-axis guide rails in a slidable manner.

[0048] The upper part of the support plate of the lifting mechanism 20 is fixed to the X-axis slider of the X-axis moving mechanism 22. Therefore, when the motor included in the X-axis moving mechanism 22 is operated to rotate the screw shaft, the lifting mechanism 20 and the pressing part 12 move along the pair of X-axis guide rails together with the X-axis slider fixed to the nut.

[0049] That is, when the motor included in the X-axis movement mechanism 22 is operated, the distance between the pressing part 12 and the upper surface holding part 14 along the X-axis direction increases or decreases. In addition, the air cylinder 18 and the X-axis movement mechanism 22 are connected to an elevating mechanism 24 having a support plate, a ball screw, a motor, a pair of Z-axis guide rails, and a Z-axis slider. Note that the structure of the elevating mechanism 24 is the same as that of the elevating mechanism 20, and therefore a description of the structure of the elevating mechanism 24 will be omitted.

[0050] The upper part of the air cylinder 18 and the upper part of the support plate of the X-axis moving mechanism 22 are fixed to the Z-axis slider of the lifting mechanism 24. Therefore, when the motor included in the lifting mechanism 24 is operated, the pressing part 12, the upper surface holding part 14, the air cylinder 18, the lifting mechanism 20, and the X-axis moving mechanism 22 move up and down.

[0051] The lower surface holding unit 16 has a cylindrical rotor 26 extending along the Y-axis direction. A rectangular prism-shaped rotary table 28 extending along the Y-axis direction is fixed around the rotor 26. The rotary table 28 has four side surfaces that are parallel to the Y-axis direction. The base ends of rectangular parallelepiped abutment members 30a, 30b, 30c, and 30d with flat tip surfaces are fixed to each of the four side surfaces.

[0052] The four contact members 30a, 30b, 30c, and 30d extend along the Y-axis direction, but have different lengths along the Y-axis direction. When each of the four contact members 30a, 30b, 30c, and 30d is arranged facing upward, its tip surface is generally parallel to the X-axis and Y-axis directions. The tip surface of the contact member arranged facing upward (contact member 30a in FIG. 2) is located directly below the lower surface of the upper surface-side holder 14.

[0053] Furthermore, the rotating body 26 is connected to a rotation mechanism 32 having a motor or the like. When the rotation mechanism 32 operates, the rotating body 26, the turntable 28, and the contact members 30a, 30b, 30c, and 30d rotate around a straight line along the Y-axis direction as the rotation axis.

[0054] The lower holding portion 16 is connected to an elevating mechanism 34 having a support plate, a ball screw, a motor, a pair of Z-axis guide rails, and a Z-axis slider. The structure of the elevating mechanism 34 is similar to that of the elevating mechanisms 20 and 24, and therefore a description of the structure of the elevating mechanism 34 will be omitted.

[0055] The lifting mechanism 34 supports the lower holding part 16 via a support base that rotatably supports the rotor 26. The lower part of the support base is fixed to a Z-axis slider of the lifting mechanism 34. Therefore, when the motor included in the lifting mechanism 34 is operated, the lower holding part 16 moves up and down.

[0056] Furthermore, the dividing device 2 has a camera 36a arranged above the X-axis moving table 4 and the holding table 6, and a camera 36b arranged below them. Each of the cameras 36a and 36b includes, for example, a visible light source such as an LED (Light Emitting Diode), an objective lens, and an imaging element such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor.

[0057] Camera 36a forms an image by capturing an image of the upper surface of wafer 13 included in frame unit 11 in which frame 23 is held on the holding surface of holding table 6. Camera 36b forms an image by capturing an image of the lower surface of wafer 13. Camera 36a is connected to an elevation mechanism 38a that raises and lowers camera 36a and a Y-axis movement mechanism 40a that moves camera 36a along the Y-axis direction.

[0058] Similarly, camera 36b is connected to an elevator mechanism 38b that raises and lowers camera 36b, and a Y-axis movement mechanism 40b that moves camera 36b along the Y-axis direction. Each of elevator mechanisms 38a, 38b and Y-axis movement mechanisms 40a, 40b is, for example, a linear guide actuator that includes a ball screw and a motor that rotates the screw shaft included in the ball screw.

[0059] Furthermore, the dividing device 2 has a film arrangement unit that arranges a film 25 to prevent damage to devices formed on the wafer 13 when the wafer 13 is pressed by the pressing unit 12. The film 25 is made of polyolefin (PO), polypropylene (PP), polyethylene terephthalate (PET), polyvinyl chloride (PVC), polystyrene (PS), or the like.

[0060] The film positioning unit has a supply unit 42 and a recovery unit 44, which are arranged above the X-axis moving table 4 and the holding table 6. The supply unit 42 has, for example, a roller around which the film 25 is wound, and a motor that rotates the roller to unwind the film 25. The recovery unit 44 has, for example, a roller around which the film 25 is wound, and a motor that rotates the roller to take up the film 25.

[0061] Furthermore, the dividing device 2 has a built-in control unit that controls the above-mentioned components. Fig. 3 is a functional block diagram that schematically shows an example of the control unit of the dividing device 2. The control unit 46 shown in Fig. 3 has a processing unit 48 configured by a CPU (Central Processing Unit) or the like, and a storage unit 50 configured by a volatile memory such as a DRAM (Dynamic Random Access Memory) or an SRAM (Static Random Access Memory) and a non-volatile memory such as an SSD (Solid State Drive) (NAND flash memory) or an HDD (Hard Disk Drive) (magnetic storage device).

[0062] The storage unit 50 stores various information (data, programs, etc.) used in the processing unit 48. The processing unit 48 also reads and executes various programs stored in the storage unit 50, and generates signals for controlling the components of the splitting device 2.

[0063] For example, the processing unit 48 has a driving unit 52 that generates signals to control the movement or rotation of the components of the splitting device 2, an imaging unit 54 that generates signals to control imaging by the cameras 36a and 36b, and a judgment unit 56 that makes a judgment based on the images formed by imaging by the cameras 36a and 36b.

[0064] 4(A) to 4(C), an example of a method for dividing the wafer 13 included in the frame unit 11 in the dividing device 2 will be described below. Specifically, an example of a method for dividing the wafer 13 along the first planned dividing line 27, which is one of the multiple planned dividing lines 17a, 17b, by the pressing unit 12 pressing the vicinity of the first planned dividing line 27 will be described below.

[0065] In this specification, the vicinity of the first planned division line 27 means the area between a pair of planned division lines (the second planned division line 29 and the third planned division line 31) that sandwich the first planned division line 27 and extend parallel to the first planned division line 27.

[0066] In this method, first, the drive unit 52 operates the X-axis movement mechanism 8 to position the holding table 6 at a position where the frame unit 11 can be carried in. Next, the frame 23 is placed on the holding table 6 via the support members 21. As a result, the frame 23 is attracted to and held by the permanent magnets built into the upper part of the holding table 6 with the surface 13a of the wafer 13 facing upward.

[0067] Next, the driving unit 52 operates the X-axis moving mechanism 8, the lifting mechanism 38a, and / or the Y-axis moving mechanism 40a to position the area of ​​the front surface 13a of the wafer 13 that overlaps with the first planned dividing line 27 at a position where it can be imaged by the camera 36a. Next, the imaging unit 54 controls the camera 36a to image the area.

[0068] Next, based on the image formed by the camera 36a, the judgment unit 56 determines the direction and length of extension of the first planned division line 27 set on the wafer 13, as well as the distance between the second planned division line 29 and the third planned division line 31, which are adjacent planned division lines sandwiched between the first planned division line 27.

[0069] Next, the drive unit 52 operates the rotation mechanism 10 by referring to the direction in which the first planned division line 27 identified by the judgment unit 56 extends, and rotates the holding table 6 so that the first planned division line 27 is parallel to the Y-axis direction.

[0070] Next, the drive unit 52 operates the rotation mechanism 32 with reference to the length of the first planned division line 27 identified by the determination unit 56, and rotates the rotating body 26 so that the most suitable one of the four contact members 30a, 30b, 30c, and 30d faces upward. For example, the rotating body 26 is rotated so that the shortest one of the four contact members 30a, 30b, 30c, and 30d whose length along the Y-axis direction is longer than the first planned division line 27 faces upward.

[0071] Next, the drive unit 52 operates the X-axis movement mechanism 22 with reference to the distance between the second planned division line 29 and the third planned division line 31 identified by the determination unit 56, and adjusts the distance between the pressing unit 12 and the upper surface side holding unit 14. For example, the distance between the pressing unit 12 and the upper surface side holding unit 14 is adjusted so that the distance between the pressing unit 12 and the upper surface side holding unit 14 is shorter than the distance between the second planned division line 29 and the third planned division line 31.

[0072] Next, the drive unit 52 operates the X-axis movement mechanism 8 to position the first planned division line 27 midway between the pressing unit 12 and the upper surface side holding unit 14 in a plan view (see FIG. 4(A)). Next, the drive unit 52 operates the motor included in the supply unit 42 of the film positioning unit to bring the film 25 into contact with the wafer 13.

[0073] Next, the drive unit 52 operates the air cylinder 18 and the lifting mechanism 34, causing the lower holding unit 16 to push up the wafer 13, and also causing the upper holding unit 14 and the lower holding unit 16 to clamp the wafer 13 (see FIG. 4(B)). As a result, an area (held area) above the holding surface of the holding table 6 that does not overlap the first planned dividing lines 27 of the wafer 13 from both the front surface 13a side and the back surface 13b side, and that is located between the first planned dividing lines 27 and the second planned dividing lines 29, is held.

[0074] Next, the drive unit 52 operates the lifting mechanism 20, and the pressing unit 12 presses, via the film 25, an area (pressed area) of the wafer 13 that does not overlap the first planned dividing lines 27 and is located between the first planned dividing lines 27 and the third planned dividing lines 31 (see FIG. 4(C)). As a result, the wafer 13 is bent at the first planned dividing lines 27, and cracks extend from the dividing starting points formed along the first planned dividing lines 27 along the thickness direction of the wafer 13.

[0075] Next, the drive unit 52 activates the air cylinder 18 and the lifting mechanisms 20, 34 to separate the pressing unit 12, the upper holding unit 14, and the lower holding unit 16 from the wafer 13. Next, the drive unit 52 activates the motor included in the recovery unit 44 of the film positioning unit to separate the film 25 from the wafer 13.

[0076] Next, the driving unit 52 operates the X-axis moving mechanism 8, the lifting mechanism 38b, and / or the Y-axis moving mechanism 40b to position the area of ​​the back surface 13b of the wafer 13 that overlaps with the first planned dividing line 27 at a position where it can be imaged by the camera 36b. Next, the imaging unit 54 controls the camera 36b to image the area.

[0077] Next, based on the image formed by the camera 36b, the determination unit 56 determines whether or not the wafer 13 has been divided along the first planned dividing lines 27. For example, the determination unit 56 determines that the wafer 13 has been divided along the first planned dividing lines 27 when a crack exists along the first planned dividing lines 27 on the back surface 13b of the wafer 13.

[0078] When dividing the wafer 13 using the above-described method, also known as two-point bending, tensile stress occurs on the pressed surface (upper surface, front surface 13a) of the wafer 13, and compressive stress occurs on the opposite surface (lower surface, back surface 13b). In this case, a crack toward the front surface 13a of the wafer 13 tends to propagate, while a crack toward the back surface 13b tends to not. Therefore, if a crack exists along the first planned division line 27 on the back surface 13b of the wafer 13, it can be determined that the wafer 13 has been divided.

[0079] Then, when the determination unit 56 determines that the wafer 13 has been divided along the first planned dividing line 27, the operation for dividing the wafer 13 along the first planned dividing line 27 is completed. On the other hand, when the determination unit 56 determines that the wafer 13 has not been divided along the first planned dividing line 27, the above-described operation is repeated until the determination unit 56 determines that the wafer 13 has been divided along the first planned dividing line 27.

[0080] That is, in this case, holding of the wafer 13 by the upper surface side holding part 14 and the lower surface side holding part 16, pressing of the wafer 13 by the pressing part 12, and imaging of the back surface 13b of the wafer 13 by the camera 36b are repeated. Note that, in the operations performed from the second time onwards, the operating conditions of the components of the dividing device 2 may be changed so that the wafer 13 is more easily divided along the first planned dividing line 27.

[0081] For example, the drive unit 52 may operate the lifting mechanism 20 so that the position of the pressing unit 12 gradually decreases when the pressing unit 12 presses the wafer 13 via the film 25. Alternatively, the drive unit 52 may operate the lifting mechanism 34 so that the position of the lower holding unit 16 gradually increases when the wafer 13 is pushed up via the support member 21. In other words, the drive unit 52 may operate the air cylinder 18 and the lifting mechanism 34 so that one side of the wafer 13 sandwiched between the upper holding unit 14 and the lower holding unit 16 gradually increases.

[0082] The dividing device 2 described above is provided with a camera 36b that forms an image used to determine whether or not the wafer 13 has been divided along the first planned dividing lines 27. That is, in this dividing device 2, it is possible to confirm whether or not the wafer 13 has been divided along the first planned dividing lines 27 based on the image formed by the camera 36b.

[0083] Therefore, in this dividing device 2, even if a part of the wafer 13 remains on the first planned dividing line 27 and the wafer 13 is not divided, the dividing units (pressing part 12, upper surface side holding part 14, lower surface side holding part 16, etc.) can be operated again to divide the wafer 13 on the first planned dividing line 27. As a result, in this dividing device 2, the wafer 13 can be divided reliably on the first planned dividing line 27.

[0084] The above-described content is one embodiment of the present invention, and the content of the present invention is not limited to the above-described content. For example, in the dividing device 2, the wafer 13 having the surface 13a attached to the support member 21 may be divided along the first dividing line 27.

[0085] Furthermore, the device 19 formed on the wafer 13 may be a power device. In this case, a metal film for supplying a ground potential to the device 19 may be formed on the back surface 13b of the wafer 13. This metal film has a shape that covers, for example, the entire back surface 13b.

[0086] Here, if such a metal film is formed on the back surface 13b of the wafer 13, it becomes difficult to divide the wafer 13 by bending the wafer 13 along the first planned dividing lines 27. Specifically, when the wafer 13 is folded, the metal film is likely to undergo plastic deformation along the first planned dividing lines 27 but remain without being divided.

[0087] In contrast to this, as described above, the dividing apparatus 2 can reliably divide the wafer 13 along the first planned dividing lines 27. Therefore, the dividing apparatus 2 is suitable as an apparatus for dividing the wafer 13 having such a metal film formed thereon along the first planned dividing lines 27.

[0088] Furthermore, when the wafer 13 having such a metal film formed on the back surface 13b is divided in the dividing apparatus 2, it is preferable that the front surface 13a side of the wafer 13 is attached to the support member 21. In this case, the frame unit 11 is carried into the dividing apparatus 2 so that the frame 23 is held via the support member 21, that is, so that the back surface 13b of the wafer 13 faces upward.

[0089] In this case, when the wafer 13 is pressed by the pressing part 12 via the film 25, a strong tensile stress is generated in the metal film formed on the back surface 13b of the wafer 13. Therefore, in this case, it becomes easy to divide the wafer 13 along the first planned dividing lines 27.

[0090] In this case, the camera 36a located above the holding table 6 can capture an image of the back surface 13b of the wafer 13, and the camera 36b located below the holding table 6 can capture an image of the front surface 13a of the wafer 13.

[0091] Therefore, in this case, the image formed by the camera 36a is used to determine whether the wafer 13 has been divided at the first planned division line 27, and the image formed by the camera 36b is used to identify the position of the first planned division line 27.

[0092] The dividing device of the present invention may also be a device that divides the wafer 13 by bending it along the first dividing lines 27 using a method also known as three-point bending. Fig. 5 is a partial cross-sectional front view that schematically shows an example of such a dividing device.

[0093] 5 has the components of the dividing device 2 other than the upper surface side holding unit 14, the lower surface side holding unit 16, the air cylinder 18, the X-axis moving mechanism 22, the lifting mechanism 24, the rotation mechanism 32, and the lifting mechanism 34. In this dividing device 58, for example, a wafer 13 having a surface 13a attached to a support member 21 is divided along a first planned dividing line 27.

[0094] When dividing the wafer 13 along the first planned division line 27, first, the drive unit 52 operates the X-axis movement mechanism 8 to position the holding table 6 at a position where the frame unit including the wafer 13 can be carried in. Next, the frame 23 is placed on the holding table 6 via the support member 21. As a result, the frame 23 is attracted to and held by a permanent magnet built into the upper part of the holding table 6 with the back surface 13b of the wafer 13 facing upward.

[0095] Next, the driving unit 52 operates the X-axis moving mechanism 8, the lifting mechanism 38b, and / or the Y-axis moving mechanism 40b to position the area of ​​the front surface 13a of the wafer 13 that overlaps with the first planned dividing line 27 at a position where it can be imaged by the camera 36b. Next, the imaging unit 54 controls the camera 36b to image the area.

[0096] Next, based on the image formed by the camera 36b, the determination unit 56 identifies the direction in which the first planned dividing lines 27 set on the wafer 13 extend. Next, with reference to the direction in which the first planned dividing lines 27 identified by the determination unit 56 extend, the drive unit 52 operates the rotation mechanism 10 to rotate the holding table 6 so that the first planned dividing lines 27 are parallel to the Y-axis direction.

[0097] Next, the drive unit 52 activates the X-axis movement mechanism 8 to position the first planned division line 27 directly below the pressing unit 12 in a plan view. Next, the drive unit 52 activates the motor included in the supply unit 42 of the film positioning unit to bring the film 25 into contact with the wafer 13.

[0098] Next, the driving unit 52 operates the lifting mechanism 20, and the pressing unit 12 presses the area (pressed area) of the wafer 13 that overlaps with the first planned dividing lines 27 via the film 25. As a result, the wafer 13 is bent at the first planned dividing lines 27, and cracks extend from the dividing start points formed along the first planned dividing lines 27 along the thickness direction of the wafer 13.

[0099] Next, the drive unit 52 operates the lifting mechanism 20 to move the pressing unit 12 away from the wafer 13. Next, the drive unit 52 operates the motor included in the recovery unit 44 of the film positioning unit to move the film 25 away from the wafer 13.

[0100] Next, the driving unit 52 operates the X-axis moving mechanism 8, the lifting mechanism 38a, and / or the Y-axis moving mechanism 40a to position the area of ​​the back surface 13b of the wafer 13 that overlaps with the first planned dividing line 27 at a position where it can be imaged by the camera 36a. Next, the imaging unit 54 controls the camera 36a to image the area.

[0101] Next, based on the image formed by the camera 36a, the determination unit 56 determines whether or not the wafer 13 has been divided along the first planned dividing lines 27. For example, the determination unit 56 determines that the wafer 13 has been divided along the first planned dividing lines 27 when a crack exists along the first planned dividing lines 27 on the back surface 13b of the wafer 13.

[0102] When dividing the wafer 13 using the above-described method, also known as three-point bending, compressive stress occurs on the pressed surface (upper surface, back surface 13b) of the wafer 13, and tensile stress occurs on the opposite surface (lower surface, front surface 13a). In this case, a crack toward the front surface 13a of the wafer 13 tends to propagate, while a crack toward the back surface 13b tends to propagate less. Therefore, if a crack exists along the first planned division line 27 on the back surface 13b of the wafer 13, it can be determined that the wafer 13 has been divided.

[0103] Then, when the determination unit 56 determines that the wafer 13 has been divided along the first planned dividing line 27, the operation for dividing the wafer 13 along the first planned dividing line 27 is completed. On the other hand, when the determination unit 56 determines that the wafer 13 has not been divided along the first planned dividing line 27, the above-described operation is repeated until the determination unit 56 determines that the wafer 13 has been divided along the first planned dividing line 27.

[0104] That is, in this case, pressing of the wafer 13 by the pressing unit 12 and capturing of the image of the back surface 13b of the wafer 13 by the camera 36a are repeated. Note that, in the second and subsequent operations, the operating conditions of the components of the dividing device 2 may be changed so that the wafer 13 is more easily divided along the first planned dividing lines 27. For example, the driving unit 52 may operate the lifting mechanism 20 so that the position of the pressing unit 12 gradually decreases when the pressing unit 12 presses the wafer 13 via the film 25.

[0105] The dividing device 58 described above is provided with a camera 36a that forms an image used to determine whether or not the wafer 13 has been divided along the first planned dividing lines 27. That is, in this dividing device 2, it is possible to confirm whether or not the wafer 13 has been divided along the first planned dividing lines 27 based on the image formed by the camera 36a.

[0106] Therefore, in this dividing device 58, even if a part of the wafer 13 remains on the first planned dividing line 27 and the wafer 13 is not divided, the dividing unit (pressing part 12, etc.) can be operated again to divide the wafer 13 on the first planned dividing line 27. As a result, in this dividing device 58, the wafer 13 can be divided reliably on the first planned dividing line 27.

[0107] Furthermore, the dividing device 58 may be provided with a support base that is located at approximately the same height as the holding surface of the holding table 6 and has an upper surface with an opening formed in the center along the Y-axis direction. The width (length along the X-axis direction) of the opening of this support base is shorter than, for example, the distance between the second planned dividing line 29 and the third planned dividing line 31. Then, in the dividing device 58 including this support base, the wafer 13 is divided with the area of ​​the wafer 13 that overlaps with the first planned dividing line 27 positioned above the opening of the support base.

[0108] That is, in this dividing device 58, for example, a region of the wafer 13 overlapping with the first planned dividing lines 27 (pressed region) is pressed while a region of the wafer 13 overlapping with the second planned dividing lines 29 and a region of the wafer 13 overlapping with the third planned dividing lines 31 are supported on a support table. In this case, the wafer 13 is pressed while a portion close to the pressed region is supported on the support table, so that a force can be applied locally to the pressed region. Therefore, in this case, it is easy to divide the wafer 13 along the first planned dividing lines 27.

[0109] Furthermore, in the dividing device of the present invention, there are no limitations on the structure of the holding table 6 as long as it is capable of holding the frame 23. For example, instead of or in addition to the permanent magnets built into the upper part of the holding table 6, a clamp for gripping the frame 23 on the holding surface of the holding table 6 may be provided around the periphery of the holding table 6.

[0110] In addition, the structures and methods according to the above-described embodiments can be modified as appropriate without departing from the scope of the present invention. [Explanation of symbols]

[0111] 2:Dividing device 4: X-axis moving table (4a: opening) 6: Holding table (6a: opening) 8:X-axis movement mechanism 10: Rotation mechanism 11: Frame unit 12: Pressing part 13: Wafer (13a: front surface, 13b: back surface) 14:Top side holding part 15: Notch 16: Bottom side holding part 17a, 17b: Planned division line 18: Air cylinder 19: Device 20: Lifting mechanism 21: Support member 22:Y-axis movement mechanism 23: Frame 24: Lifting mechanism 25: Film 26: Rotating body 27: First division line 28: Rotating table 29: Second division line 30a, 30b, 30c, 30d: Contact member 31: Third division line 32: Rotation mechanism 34: Lifting mechanism 36a, 36b: Camera 38a, 38b: Lifting mechanism 40a,40b: Y-axis movement mechanism 42: Supply section 44: Recovery Department 46: Control unit 48: Processing section 50: Storage part 52: Drive unit 54: Imaging unit 56: Judgment section 58: Splitting device

Claims

1. A dividing device for dividing a wafer, the wafer having a first surface attached to a central region of a support member having an annular frame attached to an outer peripheral region thereof, along any one of a plurality of dividing lines, the dividing starting points being formed along the plurality of dividing lines, a holding table having a holding surface with an opening formed in the center thereof for holding the frame; a first camera that forms a first image used to identify positions of the plurality of planned dividing lines by capturing an image of the wafer from the first surface side while the frame is held on the holding surface; a dividing unit having a pressing part that presses a vicinity of a first dividing line, which is one of the plurality of dividing lines, from the second surface side to divide the wafer along the first dividing line; a second camera that forms a second image used to determine whether or not the wafer has been divided along the first planned dividing line by capturing an image of the wafer from the second surface side while the frame is held on the holding surface; and A dividing device comprising:

2. The camera further includes a control unit that controls the first camera, the split unit, and the second camera; The control unit a determination unit that determines whether the wafer has been divided along the first planned dividing line based on the second image formed by imaging with the second camera after the dividing unit is operated to divide the wafer along the first planned dividing line; 2. The dividing device according to claim 1, further comprising: a driving unit that, when the determining unit determines that the wafer has not been divided on the first planned dividing line, operates the dividing unit again to divide the wafer on the first planned dividing line.

3. A dividing device in which dividing starting points are formed along a plurality of planned dividing lines set in a grid pattern, and in which a wafer having one of its first and second surfaces attached to a central region of a support member having an annular frame attached to its outer peripheral region is divided along any of the plurality of planned dividing lines, a holding table having a holding surface with an opening formed in the center thereof for holding the frame; a first camera that forms a first image used to identify positions of the plurality of planned dividing lines by capturing an image of the wafer from the first surface side while the frame is held on the holding surface; a dividing unit having a pressing part that presses a vicinity of a first dividing line, which is one of the plurality of dividing lines, from the other of the first surface and the second surface, thereby dividing the wafer along the first dividing line; a second camera that forms a second image used to determine whether or not the wafer has been divided along the first planned dividing line by capturing an image of the wafer from the second surface side while the frame is held on the holding surface; and a control unit that controls the first camera, the split unit, and the second camera; The control unit a determination unit that determines whether the wafer has been divided along the first planned dividing line based on the second image formed by imaging with the second camera after the dividing unit is operated to divide the wafer along the first planned dividing line; a drive unit that, when the determination unit determines that the wafer has not been divided on the first planned dividing line, operates the dividing unit again to divide the wafer on the first planned dividing line.

4. the dividing unit has a holding portion that holds the wafer from both the first surface and the second surface, the holding section holds a held area that does not overlap the first planned division line and is located between the first planned division line and a second planned division line adjacent to the first planned division line, 4. The dividing device according to claim 1, wherein the pressing portion presses a pressing area that does not overlap with the first dividing line and is located between the first dividing line and a third dividing line that is adjacent to the first dividing line on the opposite side of the first dividing line from the second dividing line.

5. The dividing unit has a holding portion that holds the wafer from both sides of the first surface and the second surface, the holding section holds a held area that does not overlap the first planned division line and is located between the first planned division line and a second planned division line adjacent to the first planned division line, the pressing portion presses a pressed region that does not overlap the first planned division line and is located between the first planned division line and a third planned division line that is adjacent to the first planned division line on the opposite side of the first planned division line from the second planned division line, the second surface is attached to the support member; 4. The dividing device according to claim 3, wherein the pressing portion presses the pressed region from the first surface side of the wafer.

6. A dividing device as described in any one of claims 1 to 3, wherein the pressing portion presses a pressed area that overlaps with the first planned dividing line.

7. A dividing device in which dividing starting points are formed along a plurality of planned dividing lines set in a grid pattern, and in which a wafer having one of its first and second surfaces attached to a central region of a support member having an annular frame attached to its outer peripheral region is divided along any of the plurality of planned dividing lines, a holding table having a holding surface with an opening formed in the center thereof for holding the frame; a first camera that forms a first image used to identify positions of the plurality of planned dividing lines by capturing an image of the wafer from the first surface side while the frame is held on the holding surface; a dividing unit having a pressing part that presses a vicinity of a first dividing line, which is one of the plurality of dividing lines, from the other of the first surface and the second surface, thereby dividing the wafer along the first dividing line; a second camera that forms a second image used to determine whether or not the wafer has been divided along the first planned dividing line by capturing an image of the wafer from the second surface side while the frame is held on the holding surface, The pressing section presses a pressed region that overlaps with the first planned division line.

8. the first surface is attached to the support member; 8. The dividing device according to claim 6, wherein the pressing portion presses the pressed region from the second surface side of the wafer.

9. Further comprising a film placement unit; The film placement unit comprises: a supply unit that supplies a film between the pressing unit and the wafer; 9. The dividing device according to claim 1, further comprising a recovery section for recovering the film.

10. A method for manufacturing chips, in which division starting points are formed along a plurality of planned division lines set in a grid pattern, and chips are manufactured by dividing a wafer, one of the first and second surfaces of which is attached to a central region of a support member having an annular frame attached to its outer peripheral region, along each of the plurality of planned division lines, holding the frame on a holding surface having a central opening; forming a first image used to identify positions of the plurality of planned dividing lines by capturing an image of the wafer from the first surface side after holding the frame on the holding surface; after forming the first image, contacting a film with the other of the first side and the second side of the wafer; After bringing the film into contact with the other surface, pressing a vicinity of a first planned dividing line, which is one of the plurality of planned dividing lines, from the other surface side via the film, thereby extending a crack from a dividing starting point formed along the first planned dividing line along the thickness direction of the wafer; After the crack has propagated, separating the film from the other surface; After separating the film from the other surface, while the frame is held on the holding surface, an image of the wafer is taken from the second surface side, thereby forming a second image used to determine whether the wafer has been divided along the first planned division line; A method for manufacturing a chip comprising:

Images