Sensor module and vehicle

Abstract

A sensor module is provided with: a sensor; a semiconductor device including a drive unit configured to drive the sensor and a processing unit configured to process an output signal from the sensor; a switching unit configured to switch between cutting off / disabling, and not cutting off / disabling, supply of the output signal from the sensor to the processing unit; a storage unit configured to store temperature correction details in a non-volatile manner; and a control unit configured to perform temperature correction for the drive unit and the processing unit on the basis of the temperature correction details.

Description

[Technical Field]

[0001] The invention disclosed herein relates to a sensor module and a vehicle. [Background technology]

[0002] Conventionally, various sensor modules including a sensor and a semiconductor device have been developed (see, for example, Patent Document 1). The semiconductor device includes a driver that drives the sensor and a processor that processes the output of the sensor. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-192702 Summary of the Invention [Problem to be solved by the invention]

[0004] The sensor and the processing unit are often manufactured in separate processes and sealed in a single package. Because the sensor and the processing unit are manufactured in separate processes, their temperature dependencies differ, making it difficult to perform temperature compensation for the entire sensor module. [Means for solving the problem]

[0005] The sensor module disclosed in this specification comprises a semiconductor device including a sensor, a driving unit configured to drive the sensor and a processing unit configured to process an output signal of the sensor, a switching unit configured to switch whether to block or disable the supply of the output signal of the sensor to the processing unit, a memory unit configured to store the contents of temperature correction in a non-volatile manner, and a control unit configured to temperature correct the driving unit and the processing unit based on the contents of the temperature correction.

[0006] The vehicle disclosed in this specification includes the above sensor module. [Effects of the Invention]

[0007] The sensor module and vehicle disclosed herein allow for easy temperature compensation. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a diagram showing a schematic configuration of a sensor module according to an embodiment. [Figure 2] FIG. 2 is a diagram showing a first configuration example of a sensor module according to an embodiment. [Figure 3] FIG. 3 is a graph showing an example of the temperature correction for the output offset of the processing unit alone, the temperature correction for the output offset of the driving unit, and the temperature correction for the output offset of the sensor. [Figure 4] FIG. 4 is a graph showing another example of the temperature correction content for the output offset of the processing unit alone, the temperature correction content for the output offset of the driving unit, and the temperature correction content for the output offset of the sensor. [Figure 5] FIG. 5 is a diagram illustrating a second configuration example of the sensor module according to an embodiment. [Figure 6] FIG. 6 is a diagram illustrating a third configuration example of a sensor module according to an embodiment. [Figure 7] FIG. 7 is a diagram illustrating a fourth configuration example of the sensor module according to an embodiment. [Figure 8] FIG. 8 is an external view of a vehicle according to one embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Fig. 1 is a diagram showing a schematic configuration of a sensor module according to one embodiment. The sensor module 100 shown in Fig. 1 includes a semiconductor device 1, a sensor 2, and terminals T101 to T103.

[0010] The semiconductor device 1 is, for example, an LSI (Large Scale Integration). The semiconductor device 1 includes a digital circuit 11, a driver 12, a resistor 13, a processor 14, and terminals T11 to T17. That is, the sensor module 100 includes the driver 12 and the processor 14.

[0011] The sensor 2 collects information about a detection target, converts the collected information into an electrical signal, and outputs it. The sensor 2 has terminals T21 to T24. The detection target of the sensor 2 is not particularly limited as long as it is not temperature. The format of the output signal of the sensor 2 is not particularly limited, but in this embodiment, the sensor 2 outputs a differential voltage signal. The semiconductor device 1 and the sensor 2 are manufactured by different processes. For example, the semiconductor device 1 is manufactured by a silicon semiconductor process, and the sensor 2 is manufactured by a compound semiconductor process.

[0012] The terminal T101 is a terminal configured to receive the power supply voltage VDD, and is physically and electrically connected to the terminal T11 inside the sensor module 100.

[0013] The terminal T102 is configured to be connected to the ground potential, and is physically and electrically connected to the terminal T12 inside the sensor module 100.

[0014] The terminal T103 is configured to output an output signal of the processing unit 14 (described later) to the outside of the sensor module 100, and is physically and electrically connected to the terminal T17 inside the sensor module 100.

[0015] The terminals T13 to T16 are physically and electrically connected to the terminals T21 to T24 inside the sensor module 100, respectively.

[0016] Next, each part of the semiconductor device 1 will be described in detail.

[0017] The digital circuit 11 is a circuit that processes digital signals and controls the overall operation of the sensor module 100. The digital circuit 11 includes a storage unit 11A and a control unit 11B. That is, the sensor module 100 includes the storage unit 11A and the control unit 11B.

[0018] The storage unit 11A is configured to store the temperature correction content in a non-volatile manner. The control unit 11B is configured to perform temperature correction on the drive unit 12 and the processing unit 14 based on the temperature correction content stored in the storage unit 11A.

[0019] The driver 12 is configured to drive the sensor 2. A drive current output from the driver 12 is supplied to a terminal T21 of the sensor 2 via a terminal T13.

[0020] A first end of resistor 13 is physically and electrically connected to terminal T14 inside semiconductor device 1, and a second end of resistor 13 is physically and electrically connected to terminal T12 inside semiconductor device 1. Resistor 13 converts the drive current of sensor 2 into a voltage, and the voltage corresponding to the drive current of sensor 2 is fed back to driver 12. Driver 12 feedback-controls the drive current of sensor 2.

[0021] The processing unit 14 is configured to process the output signal of the sensor 2. The processing unit 14 includes a first processing unit 14A and a second processing unit 14B.

[0022] The first processing unit 14A is configured to receive and process the output signal of the sensor 2. Specifically, the output signal of the sensor 2 output from terminals T23 and T24 of the sensor 2 is supplied to the first processing unit 14A via terminals T15 and T16. Although the first processing unit 14A is a single amplifier, the first processing unit 14A is not limited to a single amplifier and may be configured, for example, with a plurality of amplifiers connected in series.

[0023] The second processing unit 14B is configured to receive and process the output signal of the first processing unit 14A. The output signal of the second processing unit 14B is supplied to a terminal T103 via a terminal T17. In FIG. 1, the second processing unit 14B is a single amplifier, but the second processing unit 14B is not limited to a single amplifier and may be configured, for example, with a plurality of amplifiers connected in series.

[0024] Furthermore, a switching unit SW1 is provided inside the first processing unit 14A. That is, the sensor module 100 includes the switching unit SW1. The switching unit SW1 is configured to switch whether to disable supply of the output signal of the sensor 2 to the processing unit 14. Specifically, the switching unit SW1 is configured to switch whether to short-circuit the terminals T23 and T24. The switching unit SW1 may also be configured to switch whether to cut off supply of the output signal of the sensor 2 to the processing unit 14. For example, the switching unit SW1 may be provided between the terminals T15 and T16 and the processing unit 14, rather than inside the first processing unit 14A, and the switching unit SW1 may turn on / off the electrical connection between the terminals T15 and T16 and the processing unit 14.

[0025] Next, the temperature correction of the sensor module 100 will be described.

[0026] First, the switching unit SW1 disables the supply of the output signal of the sensor 2 to the processing unit 14. This makes it possible to separate the temperature characteristics of the semiconductor device 1 from the temperature characteristics of the sensor 2. With the supply of the output signal of the sensor 2 to the processing unit 14 disabled, the output signal of the terminal T103 is input to an evaluation device, which is an external device of the sensor module 100, while changing the ambient temperature of the sensor module 100. When the output signal of the terminal T103 is input to the evaluation device, which is an external device of the sensor module 100, the terminal T103 of the sensor module 100 and the input terminal of the evaluation device are connected by a cable or the like. The evaluation device creates temperature correction details for the output offset of the processing unit 14 alone, based on the output signal of the terminal T103.

[0027] Next, the content of temperature correction related to the output offset of the processing unit 14 alone is stored in the memory unit 11A. The control unit 11B performs temperature correction on the second processing unit 14B based on the content of temperature correction related to the output offset of the processing unit 14 alone, and while the supply of the output signal of the sensor 2 to the processing unit 14 is not disabled, the output signal of the terminal T103 is input to the evaluation device while changing the ambient temperature of the sensor module 100. At this time, the sensor 2 may not be sensing the sensing target (including cases where sensing is performed so weakly that it can be considered not to be sensing), or may be sensing the sensing target such that the output signal of the sensor 2 is large enough to ignore the output offset of the sensor 2. The evaluation device creates the content of temperature correction related to the output offset of the driver unit 12 based on the output signal of the terminal T103.

[0028] Then, the contents of temperature correction for the output offset of the processing unit 14 alone and the contents of temperature correction for the output offset of the driving unit 12 are stored in the memory unit 11A. The control unit 11B performs temperature correction for the driving unit 12 and the second processing unit 14B based on the contents of temperature correction for the output offset of the processing unit 14 alone and the contents of temperature correction for the output offset of the driving unit 12. In addition, while the sensor 2 is not sensing the sensing target (including when it is performing weak sensing that can be considered not to be sensing) and the supply of the output signal of the sensor 2 to the processing unit 14 is not disabled, the output signal of the terminal T103 is input to the evaluation device while changing the ambient temperature of the sensor module 100. The evaluation device creates the contents of temperature correction for the output offset of the sensor 2 based on the output signal of the terminal T103.

[0029] The contents of the temperature correction for the output offset of sensor 2 are stored in memory unit 11A. This allows control unit 11B to perform temperature correction for drive unit 12, second processing unit 14B, and first processing unit 14A based on the contents of the temperature correction for the output offset of processing unit 14 alone, the contents of the temperature correction for the output offset of drive unit 12, and the contents of the temperature correction for the output offset of sensor 2.

[0030] The sensor module 100 includes a switching unit SW1, which allows the temperature characteristics of the semiconductor device 1 and the temperature characteristics of the sensor 2 to be separated from each other. This makes it easy for an evaluation device, which is an external device of the sensor module 100, to obtain the temperature correction details of the sensor module 100. As a result, the sensor module 100 can easily perform temperature correction. Note that the sensor module 100 may also be configured to include the functions of the evaluation device.

[0031] Furthermore, the temperature correction contents stored in the memory unit 11A include the temperature correction contents for the output offset of the processing unit 14 alone, the temperature correction contents for the output offset of the driving unit 12, and the temperature correction contents for the output offset of the sensor 2, so that temperature correction can be performed appropriately for each of the processing unit 14 alone, the driving unit 12, and the sensor 2.

[0032] Furthermore, the contents of the temperature correction relating to the output offset of the processing unit 14 alone, the contents of the temperature correction relating to the output offset of the driving unit 12, and the contents of the temperature correction relating to the output offset of the sensor 2 each correspond one-to-one to the driving unit 12, the second processing unit 14B, and the first processing unit 14A, which are the objects of temperature correction control, making it easy to control the temperature correction.

[0033] Fig. 2 is a diagram showing a first configuration example of the sensor module 100. The sensor module 100A shown in Fig. 2 includes a terminal T104. The semiconductor device 1 of the sensor module 100A also includes digital-to-analog converters (DACs) 15A to 15C, an analog-to-digital converter (ADC) 16, a temperature sensor 17, and a terminal T18. That is, the sensor module 100A includes the DACs 15A to 15C. In the sensor module 100A, the digital circuit 11 also includes a communication unit 11C.

[0034] The control unit 11B controls the second processing unit 14B via the DAC 15C to perform temperature correction for the output offset of the processing unit 14 alone. The control unit 11B controls the driving unit 12 via the DAC 15A to perform temperature correction for the output offset of the driving unit 12. The control unit 11B controls the first processing unit 14A via the DAC 15B to perform temperature correction for the output offset of the sensor 2. Because the sensor module 100A is equipped with DACs 15A to 15C, the control unit 11B can control the second processing unit 14B, the driving unit 12, and the first processing unit 14A with a simple configuration.

[0035] The communication unit 11C can acquire signals and information supplied to the terminal T104 via the terminal T18. For example, by connecting the output terminal of the evaluation device to the terminal T104 with a cable or the like, the communication unit 11C can acquire the details of temperature correction for the output offset of the processing unit 14 alone, the details of temperature correction for the output offset of the driving unit 12, and the details of temperature correction for the output offset of the sensor 2 from the evaluation device.

[0036] 3 is a graph showing an example of the temperature correction for the output offset of the processing unit 14 alone, the temperature correction for the output offset of the driving unit 12, and the temperature correction for the output offset of the sensor 2. The horizontal axis of each graph shown in FIG. temperature The vertical axis of the upper graph shown in FIG. 3 represents the digital value supplied by the control unit 11B to the DAC15C, the vertical axis of the central graph shown in FIG. 3 represents the digital value supplied by the control unit 11B to the DAC15A, and the vertical axis of the lower graph shown in FIG. 3 represents the digital value supplied by the control unit 11B to the DAC15B.

[0037] 3 is stored in the storage unit 11A as the temperature correction content for the output offset of the processing unit 14. The digital value between two black circles is, for example, linearly interpolated.

[0038] 3 is stored in the storage unit 11A as the contents of temperature correction for the output offset of the driving unit 12. The digital value between two black circles is, for example, linearly interpolated.

[0039] 3 is stored in the storage unit 11A as the contents of temperature correction for the output offset of the sensor 2. The digital value between two black circles is, for example, linearly interpolated.

[0040] 3, there are nine black circles in each graph, but the number may be any number other than nine. Also, the number of black circles in each graph may differ.

[0041] In each graph shown in FIG. 3, the first temperature data t1 has the same value, and the second temperature data t2 to the ninth temperature data t9 also have the same values.

[0042] Here, it is preferable that the temperature data can be set to different values ​​for the temperature correction content related to the output offset of the processing unit 14 alone, the temperature correction content related to the output offset of the driving unit 12, and the temperature correction content related to the output offset of the sensor 2. This makes it possible to concentrate the temperature data near the inflection points of the graph, for example, and improve the accuracy of the temperature correction near the inflection points of the graph.

[0043] The horizontal axis of each graph in Figure 4 is temperature The vertical axis of the upper graph shown in Fig. 4 represents the digital value supplied by the control unit 11B to the DAC 15C, the vertical axis of the central graph shown in Fig. 4 represents the digital value supplied by the control unit 11B to the DAC 15A, and the vertical axis of the lower graph shown in Fig. 4 represents the digital value supplied by the control unit 11B to the DAC 15B. In each graph shown in Fig. 4, for example, the value of the eighth temperature data t8 is set to a different value.

[0044] Instead of the data table, the storage unit 11A may store a function that indicates the relationship between the temperature and the digital value.

[0045] As described above, the semiconductor device 1 of the sensor module 100A includes the temperature sensor 17. That is, the sensor module 100A includes the temperature sensor 17. The output signal (temperature information) of the temperature sensor 17 is converted into a digital signal by the ADC 16 and supplied to the digital circuit 11. The digital circuit 11 performs temperature correction on the drive unit 12 and the processing unit 14 based on the temperature information and the temperature correction content stored in the memory unit 11A.

[0046] Since the sensor module 100A includes the temperature sensor 17, there is no need to provide an input terminal for inputting temperature information to the sensor module 100A, which allows the sensor module 100A to be made smaller and less expensive.

[0047] Fig. 5 is a diagram showing a second configuration example of the sensor module 100. The sensor module 100B shown in Fig. 5 differs from the sensor module 100A in that a temperature sensor is not provided inside the semiconductor device 1, but is otherwise basically similar to the sensor module 100A.

[0048] The sensor module 100B includes a sensor 3. The semiconductor device 1 of the sensor module 100B includes a terminal T19. An output signal (temperature information) of the sensor 3 is supplied to the ADC 16 via the terminal T19.

[0049] Fig. 6 is a diagram showing a third configuration example of the sensor module 100. The sensor module 100C shown in Fig. 6 differs from the sensor module 100A in that the semiconductor device 1 includes a constant voltage source 18 and a selector 19, but is otherwise basically similar to the sensor module 100A.

[0050] Constant voltage source 18 is configured to output a constant voltage. Here, a constant voltage means a voltage that is constant under ideal conditions, but in reality it is a voltage that may fluctuate slightly due to temperature changes, etc. Although there are no particular limitations on the specific circuit configuration of constant voltage source 18, in this configuration example, constant voltage source 18 is a bandgap constant voltage circuit.

[0051] Sensor 17 The output signal (temperature information) is supplied to a first input terminal of a selector 19. The constant voltage output from the constant voltage source 18 is supplied to a second input terminal of the selector 19.

[0052] Selector 19 is the sensor 17 The ADC 16 converts the output of the selector 19 into a digital signal and supplies it to the digital circuit 11. The control unit 11B controls the sensor based on the output of the ADC 16 when the selector 19 selects the constant voltage. 17 The selector 19 periodically selects a constant voltage for a very short period of time, and otherwise corrects the output signal (temperature information) of the sensor. 17 Select the output signal.

[0053] Sensor Module 10 0 In C, the accuracy of the temperature information is improved by correcting the temperature information, and therefore the accuracy of the temperature correction of the driving unit and the processing unit is also improved.

[0054] Fig. 7 is a diagram showing a fourth configuration example of the sensor module 100. The sensor module 100D shown in Fig. 7 differs from the sensor module 100C in that a temperature sensor is not provided inside the semiconductor device 1, but is otherwise basically similar to the sensor module 100C.

[0055] The sensor module 100D includes a sensor 3. The semiconductor device 1 of the sensor module 100D includes a terminal T19. An output signal (temperature information) of the sensor 3 is supplied to a first input terminal of a selector 19 via the terminal T19.

[0056] Although there is no limitation on the device or equipment to which the sensor module 100 described above can be mounted, it is particularly useful to mount the sensor module 100 in a device or equipment in which the temperature in the environment in which it is used changes significantly.

[0057] The sensor module 100 is mounted on, for example, a vehicle X shown in Fig. 8. That is, the vehicle X is equipped with the sensor module 100. When the vehicle X is equipped with the sensor module 100, for example, the sensor 2 provided in the sensor module 100 may be a magnetic sensor, and the rotor rotation position of a predetermined motor provided in the vehicle X may be detected based on a detection signal of the magnetic sensor.

[0058] In addition to the above-described embodiments, various modifications can be made to the configuration of the present invention without departing from the spirit of the invention. The above-described embodiments are illustrative in all respects and should be considered not to be limiting. The technical scope of the present invention is defined by the claims, not by the description of the above-described embodiments, and should be understood to include all modifications that fall within the meaning and scope of the claims.

[0059] For example, the above-described sensor modules 100A to 100D are configured to have a built-in temperature sensor, but temperature information detected by a temperature sensor provided outside the sensor module may be acquired by a control unit provided inside the sensor module.

[0060] The sensor modules (100A to 100D) described above are configured (first configuration) to include a semiconductor device (1) including a sensor (2), a driving unit (12) configured to drive the sensor, and a processing unit (14) configured to process an output signal from the sensor, a switching unit (SW1) configured to switch whether to block or disable the supply of the output signal from the sensor to the processing unit, a memory unit (11A) configured to store the contents of temperature correction in a non-volatile manner, and a control unit (11B) configured to temperature correct the driving unit and the processing unit based on the contents of the temperature correction.

[0061] The sensor module having the first configuration is configured so that the temperature characteristics of the semiconductor device and the temperature characteristics of the sensor can be separated, and therefore the sensor module can easily perform temperature correction.

[0062] In the sensor module of the first configuration described above, the temperature correction content may be a configuration (second configuration) that includes a first content related to the output offset of the processing unit alone, a second content related to the output offset of the driving unit, and a third content related to the output offset of the sensor.

[0063] The sensor module having the second configuration can appropriately perform temperature correction for each of the processing unit, the driving unit, and the sensor.

[0064] In the sensor module of the second configuration described above, the processing unit may include a first processing unit (14A) configured to receive and process the output signal of the sensor, and a second processing unit (14B) configured to receive and process the output signal of the first processing unit, and the control unit may be configured to temperature correct the second processing unit based on the first content, temperature correct the drive unit based on the second content, and temperature correct the first processing unit based on the third content (third configuration).

[0065] In the sensor module having the third configuration, the first to third contents correspond one-to-one to the respective objects to be controlled by the temperature correction, and therefore the temperature correction can be easily controlled.

[0066] The sensor module having the third configuration may have a configuration (fourth configuration) including first to third DACs (15A to 15C), and the control unit is configured to perform temperature compensation on the second processing unit via the first DAC, temperature compensation on the drive unit via the second DAC, and temperature compensation on the first processing unit via the third DAC.

[0067] The sensor module having the fourth configuration includes the first to third DACs, and therefore the control unit can control the second processing unit, the drive unit, and the first processing unit with a simple configuration.

[0068] In a sensor module having any of the second to fourth configurations described above, the first content, the second content, and the third content may each be a data table, and the temperature data in the data table may be set to different values ​​for the first content, the second content, and the third content (fifth configuration).

[0069] The sensor module having the fifth configuration can, for example, concentrate temperature data near the inflection points of a graph obtained by interpolating a data table, thereby improving the accuracy of temperature correction near the inflection points of the graph.

[0070] The sensor module having any of the first to fifth configurations may have a configuration (sixth configuration) in which it is provided with a temperature sensor (3, 17), and the control unit is configured to acquire temperature information detected by the temperature sensor and perform temperature correction on the drive unit and the processing unit based on the temperature information and the contents of the temperature correction.

[0071] The sensor module having the sixth configuration has a built-in temperature sensor, so it does not require an input terminal for inputting temperature information, which allows for a smaller and less expensive sensor module.

[0072] The sensor module of the sixth configuration may be configured (seventh configuration) to include a constant voltage source (18) configured to output a constant voltage, a selector (19) configured to select either the output of the temperature sensor or the constant voltage, and an ADC (16) configured to perform analog-to-digital conversion of the output of the selector, and the control unit is configured to correct the temperature information based on the output of the ADC when the selector selects the constant voltage.

[0073] In the sensor module having the seventh configuration, the accuracy of the temperature information is improved by correcting the temperature information, and therefore the accuracy of the temperature correction of the drive unit and the processing unit is also improved.

[0074] The vehicle (X) described above has a configuration (eighth configuration) including a sensor module having any one of the first to seventh configurations.

[0075] In the vehicle having the eighth configuration, the sensor module mounted thereon can easily perform temperature correction. [Explanation of symbols]

[0076] 1. Semiconductor device 11 Digital Circuits 11A Storage section 11B Control section 11C Communication Department 12 Drive unit 13 Resistance 14 Processing section 14A First processing section 14B Second Processing Section 15A~15C DAC 16 ADC 17 Temperature Sensor 18 Constant voltage source 19 Selectors 2 sensors 3 Temperature Sensor 100, 100A~100D sensor module SW1 Switching section T11~T19, T21~T24, T101~T104 terminals X vehicle

Claims

1. A sensor, a semiconductor device including a driving unit configured to drive the sensor and a processing unit configured to process an output signal of the sensor; a switching unit configured to switch whether to cut off or disable the supply of the output signal of the sensor to the processing unit; a storage unit configured to store the temperature correction content in a non-volatile manner; a control unit configured to perform temperature correction on the driving unit and the processing unit based on the content of the temperature correction; Equipped with The control unit is configured to acquire temperature information detected by an internal or external temperature sensor, and to perform temperature correction on the drive unit and the processing unit based on the temperature information and the contents of the temperature correction.

2. The temperature correction is as follows: A first content relating to an output offset of the processing unit alone; A second content relating to an output offset of the driver; a third content relating to an output offset of the sensor; The sensor module of claim 1 , comprising:

3. the processing unit comprises a first processing unit configured to receive and process an output signal of the sensor, and a second processing unit configured to receive and process an output signal of the first processing unit; The sensor module of claim 2, wherein the control unit is configured to perform temperature compensation of the second processing unit based on the first content, temperature compensation of the drive unit based on the second content, and temperature compensation of the first processing unit based on the third content.

4. First to third DACs are provided, 4. The sensor module according to claim 3, wherein the control unit is configured to perform temperature compensation for the second processing unit via the first DAC, temperature compensation for the drive unit via the second DAC, and temperature compensation for the first processing unit via the third DAC.

5. the first content, the second content, and the third content are each a data table; The sensor module according to claim 2 , wherein the temperature data in the data table can be set to different values ​​for the first content, the second content, and the third content.

6. a constant voltage source configured to output a constant voltage; a selector configured to select either the output of the temperature sensor or the constant voltage; an ADC configured to perform analog-to-digital conversion of the output of the selector; Equipped with The sensor module according to claim 1 , wherein the control unit is configured to correct the temperature information based on an output of the ADC when the selector selects the constant voltage.

7. A vehicle comprising the sensor module according to any one of claims 1 to 6.

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